CN111450690A

CN111450690A - Gas treatment device

Info

Publication number: CN111450690A
Application number: CN202010306941.3A
Authority: CN
Inventors: 闵峰; 王明石; 李富昌; 厉干年
Original assignee: Suzhou C e New Material Technology Co ltd
Current assignee: Suzhou C e New Material Technology Co ltd
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2020-07-28

Abstract

The present application relates to a gas processing apparatus. The gas treatment device comprises a shell, a defogging layer, an electrode assembly and a power supply, wherein a gas outlet and a liquid inlet are formed in the upper portion of the shell, a gas inlet and a liquid outlet are formed in the lower portion of the shell, the defogging layer is arranged inside the shell, the electrode assembly is connected with the liquid inlet and the liquid outlet respectively and used for generating oxidizing substances, the power supply is arranged on the gas treatment device and used for supplying power to the gas treatment device, the electrode assembly comprises an electrode plate and a connecting piece, the electrode plate comprises a cathode plate and an anode plate with a catalyst film layer, and the connecting piece is used for connecting the cathode plate and the anode plate with the. When the gas treatment device is used for treating gas, the absorption liquid can be directly electrolyzed to generate oxidizing substances through a catalytic electrolytic oxidation technology, and the oxidizing substances can decompose pollutants in the gas and can more effectively remove the pollutants in the gas.

Description

Gas treatment device

Technical Field

The application relates to the field of gas treatment, in particular to a gas treatment device.

Background

The gas processing plant currently on the market is an absorption tower. The absorption towers are divided into three types according to the gas-liquid phase contact state, wherein the first type is a plate tower, a bubbling absorption tower and a stirring bubbling absorption tower, wherein gas is dispersed in a liquid phase in a bubble state; the second type is an ejector, a venturi, a spray tower in which liquid is dispersed in a gas phase in the form of droplets; the third type is a packed absorption column and a falling film absorption column in which liquid contacts with a gas phase in a film-like motion. The gas-liquid two-phase flow mode in the tower can be countercurrent or cocurrent. Usually, a countercurrent operation is adopted, the absorbent flows from top to bottom in the tower top, and contacts with the gas flowing from bottom to top, the liquid absorbed with the absorbent is discharged from the bottom of the tower, and the purified gas is discharged from the top of the tower.

The absorption liquid used by the absorption tower is different according to the gases of different pollutants. For example, tap water can be used as a spray liquid for water-soluble gaseous substances to achieve the effect of purifying gas. However, in essence, the absorption tower transfers contaminants into the liquid, which requires, firstly, the absorption liquid to be continuously replaced, and, secondly, the contaminated absorption liquid to be disposed of or used for other purposes.

Disclosure of Invention

The purpose of the present application is to provide a gas processing device.

The application provides a gas treatment device, which comprises a shell, a defogging layer, an electrode assembly and a power supply, wherein a gas outlet and a liquid inlet are arranged above the shell, a gas inlet and a liquid outlet are arranged below the shell, the defogging layer is arranged in the shell, a power supply is arranged below the gas outlet,

the electrode assembly is connected to the liquid inlet and the liquid outlet, respectively, for generating an oxidizing substance,

the power supply is arranged on the gas processing device and used for supplying power to the gas processing device,

the electrode assembly comprises an electrode plate and a connecting piece, wherein the electrode plate comprises a cathode plate and an anode plate with a catalyst film layer, and the connecting piece is used for connecting the cathode plate and the anode plate with the catalyst film layer, and the catalyst of the catalyst film layer is prepared by the following steps:

in SnC₂O₄Adding deionized water into the materials, and uniformly stirring to obtain a first slurry;

adding Sb into the first slurry₂O₃Heating and uniformly stirring to obtain a second slurry;

heating the second slurry, and adding Ni (CH) into the second slurry₃COO)₂·4H₂O and/or Co (CH)₃COO)₂·4H₂O and/or Cu (CH)₃COO)₂·H₂O and/or Fe (CH)₃COO)₂Uniformly stirring to obtain a third slurry;

and heating the third slurry to 50-90 ℃, adding hydrogen peroxide, continuously stirring until the reaction is finished, stopping heating, and taking the upper suspension after the materials in the reaction kettle are completely precipitated to obtain the catalyst.

Optionally, the gas processing apparatus according to the above, wherein,

the electrode plates are provided with diversion holes;

the electrode assembly is coupled to the case.

Optionally, the gas processing apparatus according to the above, wherein,

the electrode assembly comprises at least one cathode plate and at least one anode plate with a catalyst membrane layer;

the connecting piece is used for connecting a plurality of electrode plates.

Optionally, the gas treatment device according to the above, wherein the connector is selected from one or more of an anode plate conductive connector, a cathode and anode plate insulating spacer and a bracket;

the anode plate conductive connecting piece is respectively connected with the anode plate with the catalyst film layer and the power supply unit;

the negative plate conductive connecting piece is respectively connected with the negative plate and the power supply unit;

the cathode plate and the anode plate are respectively connected with the cathode plate and the anode plate with the catalyst film layer;

the support supports the electrode plate, a polar plate positioning groove is formed in the support and used for fixing the electrode plate.

Optionally, the gas processing apparatus further comprises a control unit connected to the electrode assembly, wherein the control unit is used for controlling the generation rate and amount of the oxidizing substance in an analog and/or digital analog manner.

Optionally, the gas processing apparatus further comprises a tray disposed inside the housing between the liquid inlet and the gas inlet.

Optionally, the gas processing apparatus further comprises:

the liquid distributor is arranged inside the shell and is connected with the liquid inlet of the shell;

a packing layer disposed inside the housing between the liquid distributor and the gas inlet;

the liquid distributor is in a shower type, a bent pipe type, a porous pipe type, a notch type or a sieve mesh type.

Optionally, the gas processing apparatus as above, wherein the SnC₂O₄Adding deionized water into the materials, and uniformly stirring to obtain a first slurry, which comprises:

400-1500 parts by weight of SnC₂O₄Adding 400-1600 parts by weight of deionized water, and uniformly stirring to obtain the first slurry.

Optionally, the gas treatment device according to the above, wherein said adding Sb into said first slurry₂O₃Heating and stirring to obtain the secondA slurry, comprising:

adding 20-100 parts by weight of Sb into the first slurry₂O₃And heating to 40-50 ℃, and uniformly stirring to obtain the second slurry.

Optionally, the gas treatment device according to the above, wherein the oxidizing substance comprises: o is₃OH and H₂O₂。

When the gas treatment device is used for treating gas, the absorption liquid can be directly electrolyzed to generate oxidizing substances through a catalytic electrolytic oxidation technology, and the oxidizing substances can decompose pollutants in the gas and can more effectively remove the pollutants in the gas. Even if part of pollutants are dissolved in the absorption liquid, the oxidizing substances in the absorption liquid can decompose the pollutants, so that the absorption liquid is kept clean and can be recycled. Besides, the device can simultaneously generate two contact modes of liquid-gas and gas-gas, so that the treatment efficiency of the gas is higher.

Drawings

FIG. 1 is a gas treatment apparatus according to an embodiment of the present application;

FIG. 2 is a process for preparing a catalyst provided herein; and

FIG. 3 shows a gas treatment apparatus according to an embodiment of the present application.

Detailed Description

The following detailed description of the present application, taken in conjunction with the accompanying drawings and examples, is provided to enable the aspects of the present application and its advantages to be better understood. However, the specific embodiments and examples described below are for illustrative purposes only and are not limiting of the present application.

The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.

The execution sequence of each step in the method mentioned in this application is not limited to the sequence presented in the text unless otherwise specified, that is, the execution sequence of each step may be changed, and other steps may be inserted between two steps as required.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection, either mechanically, electrically, or in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Fig. 1A shows a gas processing apparatus according to an embodiment of the present application.

Referring to fig. 1A, the gas treatment device of the present application illustratively includes a case 1, a defogging layer 2, an electrode assembly 3, and a power source (not shown in the figure).

The housing 1 is provided with a gas outlet 11, a liquid inlet 12, a gas inlet 13 and a liquid outlet 14. A gas outlet 11 and a liquid inlet 12 are provided at the upper end of the housing and a gas inlet 13 and a liquid outlet 14 are provided at the lower end of the housing. The demisting layer 2 is arranged inside the housing below the gas outlet 11 for removing liquid droplets from the gas. The electrode assembly 3 is connected to a liquid inlet 12 and a liquid outlet 14, respectively, for performing catalytic electrolysis of the absorption liquid to generate an oxidizing substance. The generated oxidizing substance is dissolved in the absorbing liquid, and the partial oxidizing substance may be present in a gaseous form. The power supply is arranged on the gas processing device and used for supplying power to the gas processing device. The power supply may be one or more of constant voltage, constant current and constant power.

When the gas treatment device treats gas, the gas to be treated enters the shell 1 through the gas inlet 13, and absorption liquid which is catalyzed and electrolyzed by the electrode assembly 3 enters the shell 1 through the liquid inlet 12. Inside the housing 1, the gas to be treated comes into contact with the absorption liquid, and the pollutants in the gas and the oxidizing substances in the absorption liquid undergo oxidation-reduction reaction to decompose the pollutants to treat the gas. The treated gas passes through the demisting layer 2 and is discharged from the gas treatment apparatus through the gas outlet 11. The absorption liquid after contacting with the gas enters the electrode assembly 3 through the liquid outlet 14, and is catalyzed and electrolyzed again through the electrode assembly 3 to keep the absorption liquid to be recycled.

According to some embodiments, the gas treatment device further comprises a control unit connected to the electrode assembly, the control unit being adapted to control the rate and amount of the oxidizing species generated in an analog and/or digital analog manner.

The gas to be treated can be, for example, odorous gas, gas containing VOCs, and the like (such as odorous gas in garbage stations, waste gas in printing and spraying industries, waste gas in petrochemical industries, and the like).

The absorption liquid may be, for example, tap water, reclaimed water, river water, lake water (natural water, etc.), or the like.

When the gas treatment device is used for treating gas, the absorption liquid can be directly electrolyzed to generate oxidizing substances through a catalytic electrolytic oxidation technology, the oxidizing substances can decompose pollutants in the gas instead of simply absorb the pollutants, and even if part of the pollutants are dissolved into the absorption liquid, the oxidizing substances contained in the pollutants can decompose the pollutants, so that the absorption liquid can be recycled.

According to some embodiments, an electrode assembly includes electrode plates including a cathode plate and an anode plate with a catalyst membrane layer, and a connection member for connecting the cathode plate and the anode plate with the catalyst membrane layer.

For example, the base layer of the anode plate is a high-temperature-resistant and corrosion-resistant conductive material, such as titanium metal, ceramic, etc., and the surface of the base layer is coated with a catalyst, and then pyrolysis is performed, and the coating and pyrolysis are repeated to obtain a catalyst film layer. And sintering the catalyst film layer to obtain the anode plate.

Pyrolysis and sintering may be performed in a muffle furnace. Optionally, the pyrolysis temperature is 300-500 ℃, and the pyrolysis time is 1-4 h. Optionally, the sintering temperature is 600-700 ℃, and the sintering time is 60-120 min. Optionally, the coating-pyrolysis is repeated 6-12 times.

For example, the cathode plate is made of a corrosion-resistant conductive material.

Optionally, an anode plate and two cathode plates are taken, the anode plate and the cathode plate are separated by adopting an insulating material, and the cathode plate is obtained after assembly. Of course, the electrode assembly of the present application may have other forms as long as it includes the above three components, and the present application is not particularly limited.

Optionally, the electrode plates are distributed with flow guiding holes, for example, in an electrode plate with a specification of 50 × 5mm, the number of flow guiding holes is 50, the flow guiding holes are uniformly distributed in an equidistant manner, the diameter of each hole is 0.5mm, and the hole pitch is 1 mm. The effect of water conservancy diversion hole lies in even rivers and rocks in order to prevent that rivers from causing the plate electrode unusually, and then makes electrode job stabilization.

Optionally, the electrode assembly is connected to the housing.

Optionally, the connector is selected from one or more of an anode plate conductive connector, a cathode and anode plate insulating spacer and a bracket. The anode plate conductive connecting piece is respectively connected with the anode plate with the catalyst film layer and the power supply unit. The negative plate conductive connecting piece is respectively connected with the negative plate and the power supply unit. The cathode plate and the anode plate are respectively connected with the cathode plate and the anode plate with the catalyst film layer for preventing the cathode plate and the anode plate from short circuit and protecting the normal operation of the device. The support supports the electrode plate, a polar plate positioning groove is formed in the support and used for fixing the electrode plate.

Fig. 1B is a front view of a structural schematic diagram of an electrode assembly 3 according to an embodiment of the present application, and fig. 1C is a plan view of the structural schematic diagram of the electrode assembly 3.

As shown in fig. 1B and 1C, the electrode assembly 3 includes a cathode plate 31, an anode plate 33 with a catalyst film layer, a support 36, a cathode conductive connection member 32, an anode conductive connection member 34, and a cathode and anode plate insulating spacer 35. The support 36 is provided with a plate positioning slot 360. The cathode plate and the anode plate of the distribution diversion hole 310 are arranged at intervals and fixed in the polar plate positioning groove 360 on the bracket 36. The anode plate 33 is connected to the power supply unit by an anode conductive connection 34. The cathode plate 31 is connected to the power supply unit through a cathode conductive connector 32. The cathode and anode plate insulating spacers 35 are connected to the cathode plate 31 and the anode plate 33, respectively.

The application also provides a method for processing gas by adopting the gas processing device, which comprises the following steps:

a, under the action of a cathode plate and an anode plate coated with a catalyst, carrying out catalytic electrolysis on the absorption solution to generate an oxidizing substance. For example, the catalytic electrolysis is two-phase electrocatalytic microbubble oxidation, wherein two phases refer to gas-liquid two-phase substances, electrocatalysis refers to the catalytic electrolysis technology at the core of the application, and microbubbles refer to microbubbles generated by an electrode. Compared with the existing electrolytic oxidation, the catalyst material in the application has lower cost and the content of the oxidant product in the electrode is higher.

b contacting the oxidizing substance with the gas to be treated. For example, the direction of flow of the oxidizing substance and the gas to be treated are reversed, and the oxidizing substance and the gas to be treated are in reverse contact.

c, under the action of the cathode plate and the anode plate coated with the catalyst, carrying out catalytic electrolysis on the absorption liquid after the absorption liquid is contacted with the gas to be treated. Even if partial pollutant in the gas is dissolved into the absorption liquid, the oxidizing substance generated in the step can keep the absorption liquid to be recycled.

The gas treatment method can directly electrolyze the absorption liquid to generate oxidizing substances (O) by a catalytic electrolysis technology₃OH and H₂O₂) The oxidizing substance can decompose pollutants in the gas to be treated. The method not only depends on gas-liquid absorption reaction, but also decomposes pollutants in the gas, so that the absorption liquid can be recycled, and the comprehensive cost is reduced.

The oxidizing substance formed in step a is O₃OH and H₂O₂. The oxidizing substance can be dissolved in the absorbing liquid, wherein O₃It may also be present in gaseous form.

When the oxidizing substance is dissolved in the absorbing liquid, step b may be to contact the absorbing liquid containing the oxidizing substance with the gas to be treated. The gas is treated by liquid-gas contact.

When the oxidizing substance is present in gaseous form, step b is to contact the oxidizing substance gas with the gas to be treated. The gas is treated by a gas-gas contact mode, which has the advantage of high mass transfer efficiency.

According to some embodiments, the oxidizing substance is partially dissolved in the absorption liquid, and partially exists in the form of gas, and then in step b, the gas to be treated is contacted with the absorption liquid and simultaneously contacted with the oxidizing substance gas, so as to realize gas-gas and/or liquid-gas contact type removal of organic pollutants and particulate matters in the gas to be treated. When the oxidizing substance is present as a gas, a portion of the gas may contact the gas to be treated with the absorbing liquid, and another portion of the gas may contact the gas to be treated by escaping from the liquid surface of the absorbing liquid.

Therefore, the method can simultaneously comprise one or two contact modes of gas-gas contact and liquid-gas contact when treating the gas. The two contact modes can occur simultaneously, so the treatment effect is better.

According to some embodiments, the absorbing liquid is a conductive liquid. For example, the absorption liquid is selected from one or more of tap water, normal water, natural water bodies such as river water, lake water and the like.

According to some embodiments, the gas treatment method further comprises: d pretreating the gas to be treated, for example, dedusting, burning and absorbing by using a deduster. May also include: e, carrying out post-treatment on the gas after contacting with the oxidizing substance, such as adsorption treatment, treatment by using a tail gas destructor, and removing liquid drops in the gas by using a demisting layer.

Unless otherwise specified, the present application does not limit the order of the steps in the method, and for example, step d may be performed first and then step b may be performed. Step b may be performed first and then step e may be performed.

According to some embodiments, in step a, 80 to 120 sets of the cathode plates and the catalyst-coated anode plates are used, the size of the cathode plates and the anode plates being 100 x 5mm,carrying out catalytic electrolysis on the absorption liquid to generate an oxidizing substance at 480-720A of current and 5-24V of voltage; in step b, the gas to be treated is supplied at 3000m³The flow rate is contacted with the oxidizing substance generated in the step a, and the content of non-methane total hydrocarbon (NMHC) in the gas to be treated is 30-40 mg/m³The treatment time was 5S. The NMHC content of the gas after the contact treatment can be reduced to less than 5mg/m³. According to some embodiments, the absorption liquid is subjected to catalytic electrolysis in step a using a gas treatment device comprising a power supply and an electrode assembly connected, the power supply being configured to supply power to the gas treatment device.

The scale of the gas treatment device is determined by the flow rate of the gas to be treated and the concentration of pollutants in the gas to be treated, and comprises the size of a space for accommodating the gas to be treated in the gas treatment device, the number of the electrode assemblies and the operating conditions of the electrode assemblies. For example, the amount of gas to be treated is 4000 to 5000m³The concentration of non-methane total hydrocarbon (NMHC) is 40-50 mg/m³And requires that the NMHC value after gas treatment is reduced to 10mg/m³Hereinafter, the treatment time was 3S. The calculation results show that the space for accommodating the gas in the gas processing device is cylindrical, the diameter of the space is 900-1000 mm, and the height of the space is 5800-6200 mm. 100-140 groups of built-in electrode assemblies, wherein the size of each assembly is 100 × 5mm, the current is 500-700A, the voltage is 10-12V, and the generation rate of oxidizing substances is 100-150 g/h.

Catalytic electrolysis plays a major role in the present application, and the oxidizing substances generated by catalytic electrolysis can decompose pollutants in the gas, and even if part of the pollutants is dissolved in the absorption liquid, the oxidizing substances contained in the absorption liquid can be recycled.

According to an exemplary embodiment, the catalytic electrolysis reaction of the present application is mainly:

and (3) anode reaction:

H₂O－e^－＝·OH+H⁺

3·OH－3e^－＝O₃+3H⁺

and (3) cathode reaction:

O₂+2H⁺+2e^-＝H₂O₂

in the reaction process, oxygen required by the cathode reaction comes from oxygen which is continuously dissolved in the absorption liquid. H required for the cathodic reaction⁺H generated by the reaction of the absorption liquid and the anode⁺. Under the catalysis of the catalyst, no harmful gas is generated in the electrolysis process. It can be seen that the oxidizing substances OH and O can be generated under the action of the catalyst₃And H₂O₂。

The oxidizing substance generated by the reaction can not only decompose various aromatic hydrocarbons and unsaturated chain hydrocarbons such as polychlorobiphenyl, phenol, naphthalene and the like which are not easy to degrade, but also can quickly kill microorganisms such as algae, viruses, bacteria and the like.

Fig. 2 illustrates a method of making a catalyst provided herein.

Referring to fig. 2, according to an exemplary embodiment, the catalyst is prepared by:

s201: go SnC₂O₄Adding deionized water, and stirring uniformly to obtain a first slurry.

For example, 400 to 1500 parts by weight of SnC₂O₄Adding 400-1600 parts by weight of deionized water, and stirring for 5-10 min to be uniform to obtain the first slurry.

Alternatively, other Sn-containing divalent compounds can be used instead of SnC₂O₄。

S202: adding Sb into the first slurry₂O₃And heating and uniformly stirring to obtain a second slurry.

For example, 20 to 100 parts by weight of Sb may be added to the first slurry₂O₃And heating to 40-50 ℃, and stirring for 5-10 min to be uniform to obtain the second slurry.

Alternatively, it is also possible to select other Sb-containing orthotrivalent compounds instead of Sb₂O₃。

S203: heating the second slurry, and adding Ni (CH) into the second slurry₃COO)₂·4H₂O, stirring uniformly to obtainAnd obtaining third slurry.

For example, the second slurry may be heated to 40 to 50 ℃, and then 1 to 3 parts by weight of Ni (CH) may be added₃COO)₂·4H₂And O, uniformly stirring to obtain a third slurry. At this temperature, Ni (CH)₃COO)₂·4H₂O can be better dissolved in the system.

Alternatively, other Ni-containing divalent compounds can also be selected instead of Ni (CH)₃COO)₂·4H₂O, or other acetoxy compounds may be selected, for example: co (CH)₃COO)₂·4H₂O and/or Cu (CH)₃COO)₂·H₂O and/or Fe (CH)₃COO)₂。

Alternatively, S203 may be:

heating the second slurry to 40-50 ℃, and then adding 1-3 parts by weight of Ni (CH)₃COO)₂·4H₂O, and continuing heating;

adding 1-3 parts by weight of Co (CH) when the temperature reaches 50-60 DEG C₃COO)₂·4H₂O or Cu (CH)₃COO)₂·H₂And O, uniformly stirring to obtain a third slurry. At this temperature, a third slurry with a more uniform distribution and smaller particles is obtained.

Or, alternatively, S203 may be:

heating the second slurry to 50-60 ℃, and then adding 1-3 parts by weight of Cu (CH)₃COO)₂·H₂And O, uniformly stirring to obtain a third slurry.

Or, alternatively, S203 may be:

adding 3-5 parts by weight of Fe (CH) when the temperature reaches 50-60 DEG C₃COO)₂And uniformly stirring to obtain the third slurry.

S204: and heating the third slurry to 50-90 ℃, adding hydrogen peroxide, continuously stirring until the reaction is finished, stopping heating, and taking the upper suspension after the materials in the reaction kettle are completely precipitated to obtain the catalyst.

For example, the third slurry can be heated to 50 ℃ to 90 ℃, then 5 to 70 parts by weight of hydrogen peroxide is added, the heating is stopped after the stirring is continued for 1h to 3h, and the upper suspension is taken after the materials in the reaction kettle are completely precipitated, so as to obtain the catalyst.

Optionally, the concentration of the hydrogen peroxide is 3-70%. At this concentration, the material can be oxidized to a certain extent and the obtained catalyst is optimal in effect.

The electrode assembly is low in manufacturing cost, and expensive materials such as platinum (Pt) and a conductive diamond film do not need to be used; simple structure, and flexible and convenient production and use.

According to some embodiments, the electrode assembly 3 further comprises a liquid lead-out connected to the liquid inlet of the case and a gas lead-out communicating with the interior of the case. The generated oxidizing substance gas enters the interior of the housing through the gas outlet. The oxidizing substance dissolved in the absorbing liquid passes through the liquid outlet member and enters the interior of the housing through the liquid inlet.

According to some embodiments, the gas treatment device is a tray column, then the gas treatment device further comprises a tray disposed inside the housing, the tray being located between the liquid inlet and the gas inlet. The absorption liquid and the gas to be treated are contacted on the tray. The absorption liquid flows from the downcomer of the upper tower plate to the liquid receiving tray of the lower tower plate by the action of gravity, then flows transversely through the tower plates, and flows from the downcomer on the other side to the next tower plate. The overflow weir on the tower plate can keep a liquid layer with a certain thickness on the tower plate. The gas to be treated is driven by pressure difference to pass through the gas passages (such as bubble caps, sieve holes or floating valves) of the tower plates from bottom to top, is dispersed into small gas flows, and is bubbled through the liquid layers of the tower plates. On the trays, the gas and liquid phases are intimately contacted, producing a reaction to treat the gas. In the plate tower, gas phase and liquid phase contact step by step, the composition of the two phases changes in a step shape along the height of the tower, and under normal operation, the liquid phase is a continuous phase and the gas phase is a dispersed phase.

According to some embodiments, the gas treatment device is a packed tower, and the gas treatment device further comprises a liquid distributor and a packing layer. The liquid distributor is arranged in the shell and is connected with the liquid inlet of the shell. A packing layer is also disposed within the shell between the liquid distributor and the gas inlet. The liquid distributor is used for uniformly distributing the absorption liquid on the surface of the filler layer. For example, the liquid distributor may be a shower, elbow, perforated pipe, notched, or mesh. The gas to be treated is fed from the bottom of the tower through a gas inlet and continuously passes through the gaps of the packing layer in a countercurrent mode with the absorption liquid. On the surface of the filler layer, the gas phase and the liquid phase are in intimate contact, and a reaction is generated to treat the gas. The packed tower belongs to continuous contact type gas-liquid mass transfer equipment, the composition of two phases continuously changes along the height of the tower, and under the normal operation state, a gas phase is a continuous phase, and a liquid phase is a dispersed phase.

According to some embodiments, the gas treatment device further comprises a gas distributor disposed at the gas inlet of the housing to enable uniform distribution of the gas to be treated.

Fig. 3 shows a gas processing apparatus according to an embodiment of the present application.

Referring to fig. 3, the gas treatment device illustratively includes a housing 1, a demister layer 2, an electrode assembly 3, a liquid distributor 4, a packing layer 5, and a pump 6.

The housing 1 is provided with a gas outlet 11, a liquid inlet 12, a gas inlet 13 and a liquid outlet (not shown in the figure). A gas outlet 11 and a liquid inlet 12 are provided at the upper end of the housing and a gas inlet 13 and a liquid outlet are provided at the lower end of the housing.

The shell 1 is internally provided with a demisting layer 2, a liquid distributor 4 and a filler layer 5 from top to bottom in sequence. The liquid distributor 4 is connected to a liquid inlet 12. The electrode assembly 3 is disposed inside and below the case 1 and is connected to the liquid inlet 12 via the pump 6. The electrode assembly 3 is also connected to a liquid outlet.

The work flow of the gas processing apparatus illustratively includes the following steps.

The electrode assembly 3 catalytically electrolyzes an absorption liquid (e.g., tap water) to generate an oxidizing substance, which is dissolved in the absorption liquid. The absorption liquid with the dissolved oxidizing substance is distributed on the surface of the filler layer 5 through the liquid inlet 12 and the liquid distributor 4 under the action of the pump 6.

The gas to be treated enters the shell 1 through a gas inlet 11 below the shell 1, and continuously passes through the gap of the packing layer 5 in a countercurrent manner with the absorption liquid, and gas-liquid two phases are closely contacted on the surface of the packing to generate reaction so as to treat the gas.

The treated gas passes through the defogging layer 2 and is discharged from the device through the gas outlet 11.

The absorption liquid contacted with the gas to be treated enters the electrode assembly 3 through the liquid outlet and can be recycled through the re-catalytic electrolysis of the electrode assembly 3.

According to some embodiments, when the electrode assembly catalytically electrolyzes the absorption liquid to generate the oxidizing substance, a portion of the oxidizing substance may also be present in a gaseous form.

Optionally, the oxidizing gas enters the interior of the shell from the liquid inlet along with the absorption liquid, the gas to be treated enters the interior of the shell through the gas inlet below the shell, and contacts with the absorption liquid and the oxidizing gas along with the absorption liquid, and the oxidizing gas can also escape from the liquid level of the absorption liquid at the electrode assembly to contact with the gas to be treated, so that organic pollutants and particulate matters in the gas to be treated are removed in a gas-gas and/or liquid-gas contact mode.

Alternatively, the oxidizing gas is introduced into the interior of the housing from below the housing, and the gas to be treated is introduced into the interior of the housing through a gas inlet below the housing, and the two gases are brought into gas-gas contact and discharged from a gas outlet above the housing. The gas-gas contact reaction has the advantage of high mass transfer efficiency.

Therefore, the gas treatment device can simultaneously comprise one or two contact modes of gas-gas contact and liquid-gas contact when treating the gas. The two contact modes can occur simultaneously, so the treatment effect is better.

The rate of generation of oxidizing substances in the gas treatment device is related to the magnitude of the current, the number of electrode assemblies, and the like. For example, when 80 electrode assemblies were counted, the electrode assembly size was 100 × 5mm, the voltage was 24V, and the current was 400A, the oxidizing substance generation rate was 450 g/h.

According to some embodiments, the flow of the gas to be treated is 10000m³H, the mass ratio of the gas to the absorption liquid is 0.8L/m³And the contact time of the gas and the absorption liquid is 2S. Under such conditions, the gas to be treated can be effectively treated.

Example 1

In this example, the treatment apparatus shown in FIG. 3 was used to treat a gas (waste gas from a flavor plant, waste gas amount 625 m)³H) treatment.

The absorption liquid is local municipal tap water, the dosage is 120L/h, the number of electrode assemblies is 40, the size of the electrode assembly is 100 × 5mm, the voltage is 24V, the current is 200A, and the generation rate of the oxidizing substance is 225 g/h.

The preparation method of the anode plate of the electrode assembly comprises the following steps:

preparing raw material SnC₂O₄900 parts by weight of Sb₂O₃50 parts by weight of Ni (CH)₃COO)₂·4H₂O1 weight portions, and hydrogen peroxide solution with the concentration of 45 percent 10 weight portions.

Firstly, weighed SnC₂O₄Added to a reaction tank, 900 parts by weight of deionized water was added thereto and stirred for 5 minutes to obtain a first slurry. The weighed Sb₂O₃Adding into the reaction kettle, stirring for 8 minutes, and heating to 40 ℃ to uniformly mix to obtain a second slurry. The second slurry was heated to 50 degrees and weighed Ni (CH) was added₃COO)₂·4H₂And O, uniformly stirring to obtain a third slurry. And (4) continuously heating, adding the weighed hydrogen peroxide when the temperature of the third slurry reaches 90 ℃, and continuously stirring. Stopping heating after 2 hours, naturally cooling the materials in the reaction kettle, and taking the upper suspension after the materials in the reaction kettle are completely precipitated to obtain the required catalyst.

Coating the catalyst on a titanium plate, pyrolyzing at 500 ℃, repeating the coating-pyrolysis process for 8 times, sintering the titanium plate with the catalyst film layer attached, and sintering at 600 ℃ for 80min to obtain a uniform catalyst film layer on the titanium plate.

And observing the sintered titanium plate, and correspondingly detecting, wherein the color of the titanium plate is gray black, and the thickness of the film is 30 mu m.

The titanium plate coated with the catalyst film layer is used as an anode, and the stainless steel plate is used as a cathode.

The electrode assembly is constructed in a structure having at least one anode and at least one cathode.

The gas treatment results are shown in table 1.

Table 1 example 1 gas treatment results

	Raw gas (before treatment)	Example 1 (after treatment)
			Phenyl acetate (mg/m3)	0.46	0.06
Epoxy benzaldehyde (mg/m3)	0.03	0.02
			Diisobutylamine (mg/m3)	0.05	0.01
Phthalic acid ethyl ester (mg/m3)	5.71	0.17

Example 2

In this example, the treatment apparatus shown in FIG. 3 was used to treat gas (fresh air, 150m in volume)³H) treatment. The electrode assembly preparation and structure were the same as in example 1.

The absorption liquid is local municipal tap water, the dosage is 10L/h, the number of electrode assemblies is 4, the size of the electrode assemblies is 100 × 5mm, the voltage is 24V, the current is 20A, and the generation rate of the oxidizing substances is 25 g/h.

See table 2 for specific data on gas treatment.

Comparative example 1

The gas to be treated was the same as in example 2, using a common spray tower of an exhaust gas treatment apparatus as a comparison. See table 2 for gas treatment specific data.

The conventional spray tower needs to select specific spray liquid according to pollutant components of waste gas, the spray liquid can not be recycled generally, and the pollutant in the waste gas is transferred into the spray liquid, so the spray liquid also needs to be treated. Only one mode of liquid-gas contact occurs in conventional spray towers.

The device in this application can use other liquid such as running water, normal water and river, lake water (natural water etc.), under the effect of electrode subassembly, and the pollutant in the absorption liquid after the use is also decomposed, consequently, the circulated use of absorption liquid, reduce cost. Besides, the device can simultaneously realize two contact modes of liquid-gas and gas-gas, so that the treatment efficiency is higher.

Table 2 gas treatment results of example 2 and comparative example 1

	Raw gas	Example 2	Comparative example 1
				Formaldehyde (mg/m3)	0.31	0.05	0.09
Benzene (mg/m3)	0.12	Not detected out	0.03
				Toluene (mg/m3)	0.11	Not detected out	0.05
Xylene (mg/m3)	0.21	Not detected out	0.19

Example 3

In this example, the treatment apparatus shown in FIG. 3 was used to treat gas (foreign odor gas in a refuse dump, exhaust gas amount 180 m)³H) treatment. The electrode assembly preparation and structure were the same as in example 1.

The absorption liquid is local municipal tap water, the dosage is 150L/h, the number of electrode assemblies is 4, the size of the electrode assemblies is 100 × 5mm, the voltage is 24V, the current is 20A, and the generation rate of the oxidizing substances is 25 g/h.

Table 3 example 3 gas treatment results

	Raw gas (before treatment)	Example 3 (after treatment)
			Dibutylamine (mg/m3)	0.11	0.05
Diisopropylamine (mg/m3)	0.06	Not detected out
			Dimethylamine (mg/m3)	0.06	Not detected out
Indole (mg/m3)	0.21	0.03

Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present application and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of this invention may be made without departing from the spirit or scope of the invention.

Claims

1. A gas treatment device is characterized by comprising a shell, a defogging layer, an electrode assembly and a power supply, wherein the shell is provided with a gas outlet and a liquid inlet at the upper part and a gas inlet and a liquid outlet at the lower part, the defogging layer is arranged in the shell and is arranged below the gas outlet,

2. The gas processing apparatus according to claim 1,

the electrode plates are provided with diversion holes;

the electrode assembly is coupled to the case.

3. The gas processing apparatus according to claim 1,

the connecting piece is used for connecting a plurality of electrode plates.

4. The gas treatment device of claim 1, wherein the connector is selected from one or more of an anode plate conductive connector, a cathode and anode plate insulating spacer, and a bracket;

5. The gas treatment device according to claim 1, further comprising a control unit connected to the electrode assembly, the control unit being configured to control the rate and amount of the oxidizing species generated in an analog and/or digital analog manner.

6. The gas processing device of claim 1, further comprising a tray disposed inside the housing between the liquid inlet and the gas inlet.

7. The gas processing device according to claim 1, further comprising:

8. The gas processing apparatus of claim 1, wherein the SnC is a linear actuator₂O₄Adding deionized water into the materials, and uniformly stirring to obtain a first slurry, which comprises:

9. The gas treatment device according to claim 1, wherein the addition of Sb to the first slurry₂O₃And heating and uniformly stirring to obtain a second slurry, which comprises the following steps:

10. The gas treatment apparatus of claim 1, wherein the oxidizing species comprises: o is₃OH and H₂O₂。