TW201834974A - Apparatus and method for wastewater treatment capable of reducing the consumption of catalyst and preventing scaling deposits on the surface of catalyst - Google Patents

Apparatus and method for wastewater treatment capable of reducing the consumption of catalyst and preventing scaling deposits on the surface of catalyst Download PDF

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TW201834974A
TW201834974A TW107108506A TW107108506A TW201834974A TW 201834974 A TW201834974 A TW 201834974A TW 107108506 A TW107108506 A TW 107108506A TW 107108506 A TW107108506 A TW 107108506A TW 201834974 A TW201834974 A TW 201834974A
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wastewater
layer
catalyst
gas
dispersion plate
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TW107108506A
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TWI738985B (en
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熊涼慈
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日商日本觸媒股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/72Treatment of water, waste water, or sewage by oxidation
    • C02F1/725Treatment of water, waste water, or sewage by oxidation by catalytic oxidation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/50Fuel cells

Abstract

The present invention provides a wastewater treatment apparatus which can keep scaling deposits from a catalyst surface, thereby highly maintaining the processing performance of the catalyst. The wastewater treatment device of the present invention has a dispersion plate 2, a dispersion plate 1, a filling layer and a catalyst layer disposed in this order from the wastewater supply side. When the distance between the dispersion plate 2 and the dispersion plate 1 is H1, the distance between the dispersion plate 1 and the interface on the wastewater supply side of the aforementioned filling layer is H2, the layer length of the filling layer is H3, and when the total of H2 and H3 is H6, then the H6 exceeds 100mm, and the ratio of H6 with respect to the above H1(H6/H1) is 0.1 or more (including 0.1) and 100 or less (including 100).

Description

廢水處理裝置及廢水處理方法Wastewater treatment device and method

本發明係有關一種廢水處理裝置及廢水處理方法。The invention relates to a wastewater treatment device and a wastewater treatment method.

化學工廠、食品加工設備、金屬加工設備、金屬鍍敷設備、印刷製版設備、照相處理設備等之各種產業工廠所排出的廢水,可藉由濕式氧化法、濕式分解法、臭氧氧化法,過氧化氫氧化法等之各種方法進行淨化處理。Wastewater discharged from various industrial plants such as chemical plants, food processing equipment, metal processing equipment, metal plating equipment, printing platemaking equipment, and photographic processing equipment can be processed by wet oxidation, wet decomposition, and ozone oxidation. Purification treatment is performed by various methods such as a hydrogen peroxide method.

例如,在固體觸媒充填至反應塔之濕式氧化法時,通常主要係從固體觸媒充填層(觸媒層)的下部導入廢水及含氧氣體而將廢水進行淨化處理者。因此,藉由所導入之廢水及含氧氣體的作用,而容易引起在觸媒層內的固體觸媒之移動、振動等之運動,藉由固體觸媒之損耗、或廢水中所含水垢成分(銅、鐵等之重金屬類及鈣、鋁等)在觸媒表面析出,因而無法避免引發觸媒的處理性能降低等之問題。For example, in the wet oxidation method in which a solid catalyst is charged into a reaction tower, usually, a wastewater is mainly introduced from a lower portion of a solid catalyst filling layer (catalyst layer) to purify the wastewater. Therefore, by the action of the introduced wastewater and oxygen-containing gas, it is easy to cause the movement and vibration of the solid catalyst in the catalyst layer, the loss of the solid catalyst, or the scale components in the wastewater. (Heavy metals such as copper, iron, and calcium, aluminum, etc.) are precipitated on the surface of the catalyst, so problems such as a decrease in the processing performance of the catalyst cannot be avoided.

專利文獻1中揭示一種廢水處理裝置,其係關於由從反應塔之下部導入之廢水等所引起的固體觸媒之損耗,通過在觸媒層之下設置金屬等充填物之層(下部充填物層),除了可防止固體觸媒之損耗,亦可將廢水等均勻地供給至觸媒層,故可抑制觸媒的處理效率之降低。   專利文獻2中揭示通過將無觸媒濕式氧化反應層設置在固體觸媒層之前而提高在固體觸媒層之處理效率。而且,專利文獻3中揭示藉由在固體觸媒層之上部設置氣液分散構件而改善處理效率。 (先前技術文獻) (專利文獻)Patent Document 1 discloses a waste water treatment device for the loss of solid catalyst caused by waste water or the like introduced from the lower part of a reaction tower. A layer of filler such as metal (lower filler) is provided below the catalyst layer. Layer), in addition to preventing the loss of solid catalyst, waste water and the like can also be uniformly supplied to the catalyst layer, so that the reduction in catalyst treatment efficiency can be suppressed. Patent Document 2 discloses that a catalyst-free wet oxidation reaction layer is provided in front of a solid catalyst layer to improve the processing efficiency in the solid catalyst layer. Furthermore, Patent Document 3 discloses that a gas-liquid dispersion member is provided on the upper portion of the solid catalyst layer to improve the processing efficiency. (Prior Art Literature) (Patent Literature)

[專利文獻1]日本特許第5330751號公報   [專利文獻2]日本特開2001-276855號公報   [專利文獻3]日本特開2004-098023號公報[Patent Document 1] Japanese Patent No. 5330751 [Patent Document 2] Japanese Patent Laid-Open No. 2001-276855 [Patent Document 3] Japanese Patent Laid-Open No. 2004-098023

(發明所欲解決之課題)(Problems to be solved by the invention)

的確,在專利文獻1中表明,通過設置下部充填物層,可防止觸媒之損耗而可抑制觸媒之處理效率的降低。Indeed, Patent Document 1 shows that by providing a lower filler layer, the catalyst can be prevented from being consumed and the reduction in the efficiency of the catalyst can be suppressed.

然而,在專利文獻1所揭示之廢水處理裝置,廢水中包含水垢成分(銅、鐵等之重金屬類及鈣、鋁等)時,水垢成分會以離子狀態到達觸媒層而在觸媒表面析出,會有阻礙觸媒活性之問題。   另一方面,專利文獻2中,盡管通過無觸媒濕式氧化反應層的設置而提高固體觸媒層之耐久性,惟在廢水處理能力方面並不足而需要第1處理步驟及第2處理步驟之反應塔,且該等需要進一步控制,故不利於成本。   另一方面,專利文獻3中,盡管通過氣液分散構件的設置而改善固體觸媒層之處理效率,然卻與專利文獻1所記載之發明相同,會因水垢成分而有耐久性的不足。However, in the wastewater treatment device disclosed in Patent Document 1, when scale components (heavy metals such as copper, iron, and calcium, aluminum, etc.) are contained in the wastewater, the scale components reach the catalyst layer in an ionic state and precipitate on the catalyst surface. , There will be problems hindering catalyst activity. On the other hand, in Patent Document 2, although the durability of the solid catalyst layer is improved by the installation of a catalyst-free wet oxidation reaction layer, the first treatment step and the second treatment step are not sufficient in terms of wastewater treatment capacity. Reaction tower, and these need further control, which is not conducive to cost. On the other hand, in Patent Document 3, although the treatment efficiency of the solid catalyst layer is improved by the installation of a gas-liquid dispersion member, it is the same as the invention described in Patent Document 1, and it has a lack of durability due to scale components.

因此,本發明之目的係提供一種可防止水垢成分以離子狀態到達觸媒層者,亦即,可防止水垢成分在觸媒表面的析出而可高度維持觸媒的處理性能,然後能以簡便構造提供成本低的廢水處理裝置以及廢水處理方法。 (用以解決課題之手段)Therefore, an object of the present invention is to provide a person who can prevent scale components from reaching the catalyst layer in an ionic state, that is, can prevent the precipitation of scale components on the catalyst surface and can maintain the catalyst processing performance to a high degree, and then can be structured in a simple manner. Provide a low-cost wastewater treatment device and a wastewater treatment method. (Means to solve problems)

本發明者為了解決上述問題而專心致志進行檢討。首先,對於專利文獻1所揭示之技術與專利文獻2所揭示之技術組合的型態,具體而言,專利文獻1之反應塔下部與專利文獻2之無觸媒濕式氧化反應層結合之型態進行檢討,然並無法得到充分的效果。因此,考慮到是否氣液分散性較差,參照專利文獻3,在無觸媒濕式氧化反應層中設置分散板,但仍無法得到充分的效果。更且,對於分散板之配置反覆進行各種檢討之結果,發現具有至少2片分散板,並將該配置設在特定範圍即可解決上述問題,遂而完成本發明。   亦即,本發明之第1型態係有關一種處理裝置,係由廢水供給側依序具有分散板2、分散板1、充填物層及觸媒層之廢水處理裝置,當上述分散板2與上述分散板1之距離為H1、上述分散板1與上述充填物層之廢水供給側的交界面之距離為H2、上述充填物層之層長為H3,以及上述H2與上述H3之合計為H6時,上述H6超出100mm,且上述H6與上述H1之比(H6/H1)為0.1以上(包含0.1)100以下(包含100)。   本發明之第2型態係有關一種處理方法,其係使用由廢水供給側依序至少具有氣體-液體擴散部1、氣體-液體擴散部2、氣體-液體擴散部3以及觸媒層之裝置的廢水處理方法, 上述廢水中係有氣體分散,且滿足下述(1)~(3): (1) 上述氣體-液體擴散部1~3中之上述廢水留置時間均為0.5秒以上(包含0.5秒); (2) 上述氣體-液體擴散部3與上述氣體-液體擴散部2中之廢水留置時間的合計為5秒以上(包含5秒);以及 (3) 相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計為0.1~100倍。 (發明之效果)In order to solve the above problems, the present inventors devoted themselves to conducting a review. First, regarding the type of combination of the technology disclosed in Patent Document 1 and the technology disclosed in Patent Document 2, specifically, the type in which the lower part of the reaction tower of Patent Document 1 is combined with the catalyst-free wet oxidation reaction layer of Patent Document 2 Review of the state, but it is not sufficient. Therefore, considering whether the gas-liquid dispersibility is poor, referring to Patent Document 3, a dispersing plate is provided in the catalyst-free wet oxidation reaction layer, but a sufficient effect cannot be obtained. Furthermore, as a result of various reviews of the configuration of the dispersion plate, it was found that the above problem can be solved by having at least two dispersion plates and setting the configuration in a specific range, and the present invention was completed. That is, the first aspect of the present invention relates to a treatment device, which is a wastewater treatment device having a dispersing plate 2, a dispersing plate 1, a filling layer, and a catalyst layer in this order from a wastewater supply side. The distance between the dispersion plate 1 is H1, the distance between the interface between the dispersion plate 1 and the waste water supply side of the filling layer is H2, the layer length of the filling layer is H3, and the total of the H2 and the H3 is H6 At this time, the H6 exceeds 100 mm, and the ratio (H6 / H1) of the H6 to the H1 is 0.1 or more (including 0.1) and 100 or less (including 100). The second aspect of the present invention relates to a treatment method using a device having at least a gas-liquid diffusion portion 1, a gas-liquid diffusion portion 2, a gas-liquid diffusion portion 3, and a catalyst layer in order from a wastewater supply side. The method for treating wastewater includes gas dispersion in the wastewater and satisfies the following (1) to (3): (1) The wastewater indwell time in the gas-liquid diffusion sections 1 to 3 are all 0.5 seconds or more (including 0.5 seconds); (2) the total of the waste water retention time in the gas-liquid diffusion section 3 and the gas-liquid diffusion section 2 is 5 seconds or more (inclusive); and (3) relative to the gas-liquid diffusion The wastewater indwelling time in Part 1 is 0.1 to 100 times the total of the wastewater indwelling time in (2) above. (Effect of the invention)

根據本發明,可防止水垢成分在觸媒表面析出,故可高度維持觸媒的處理性能,然後能以簡便構造提供成本低的廢水處理裝置以及廢水處理方法。According to the present invention, scale components can be prevented from precipitating on the surface of the catalyst, so that the catalyst's treatment performance can be maintained at a high level, and a low-cost wastewater treatment device and a wastewater treatment method can be provided with a simple structure.

(發明之最佳實施形態)(Best embodiment of the invention)

以下,對於用以實施本發明之具體型態進行詳細說明,惟本發明之技術範圍應基於對專利請求項之範圍的記載而決定,且不僅限於下述型態。Hereinafter, specific forms for implementing the present invention will be described in detail, but the technical scope of the present invention should be determined based on the description of the scope of the patent claims, and is not limited to the following forms.

<第1型態:廢水處理裝置>   根據本發明之一型態,提供一種處理裝置,係由廢水供給側依序具有分散板2、分散板1、充填物層及觸媒層之廢水處理裝置,當上述分散板2與上述分散板1之距離為H1、上述分散板1與上述充填物層之廢水供給側的交界面之距離為H2、上述充填物層之層長為H3,以及上述H2與上述H3之合計為H6時,上述H6超出100mm,且上述H6與上述H1之比(H6/H1)為0.1以上(包含0.1)100以下(包含100)。<1st form: waste water treatment device> According to one aspect of the present invention, a treatment device is provided, which is a waste water treatment device having a dispersing plate 2, a dispersing plate 1, a filling layer and a catalyst layer in order from a waste water supply side When the distance between the dispersion plate 2 and the dispersion plate 1 is H1, the distance between the interface between the dispersion plate 1 and the waste water supply side of the filling layer is H2, the layer length of the filling layer is H3, and the H2 When the total with H3 is H6, the H6 exceeds 100 mm, and the ratio of the H6 to the H1 (H6 / H1) is 0.1 or more (including 0.1) and 100 or less (including 100).

本發明之廢水處理裝置中,分散板2與分散板1之距離為H1、分散板1與充填物層之廢水供給側的交界面之距離為H2、充填物層之層長為H3,以及觸媒層之層長為H4(單位:mm)。觸媒層之廢水排出側亦配置充填物層時,該充填物層之層長為H5。而且,H2與H3之和為H6。In the wastewater treatment device of the present invention, the distance between the dispersion plate 2 and the dispersion plate 1 is H1, the distance between the interface between the dispersion plate 1 and the waste water supply side of the filling layer is H2, the layer length of the filling layer is H3, and The layer length of the media layer is H4 (unit: mm). When a filler layer is also arranged on the waste water discharge side of the catalyst layer, the layer length of the filler layer is H5. The sum of H2 and H3 is H6.

分散板2與分散板1之距離(H1)係由分散板2之廢水排出側之面至分散板1之廢水供給側之面的距離。The distance (H1) between the dispersion plate 2 and the dispersion plate 1 is the distance from the surface on the waste water discharge side of the dispersion plate 2 to the surface on the waste water supply side of the dispersion plate 1.

分散板中,廢水供給側及排出側之面係定義如下。廢水處理裝置設置與地面垂直,由廢水處理裝置之下部供給廢水,並由廢水處理裝置之上部排出廢水時,分散板之廢水排出側之面(上表面)及廢水供給側之面(下表面),係在各面中,以最高部位與最低部位之中間位置為基準之面。此係,即使分散板之表面不平時或呈傾斜時亦為相同。惟如第2圖中之分散板15-2具有碰撞板時,以碰撞板以外的最高部位與最低部位之中間位置為基準。通常,廢水排出側之面及廢水供給側之面,與垂直於廢水供給方向之面(地面)平行。此時,廢水供給側及廢水排出側之面為平行。In the dispersion plate, the surfaces of the wastewater supply side and the discharge side are defined as follows. The waste water treatment device is installed perpendicular to the ground, and when waste water is supplied from the lower part of the waste water treatment device, and the waste water is discharged from the upper part of the waste water treatment device, the waste water discharge side surface (upper surface) and the waste water supply side surface (lower surface) , It is the surface in which the middle position between the highest part and the lowest part is used as a reference. This system is the same even when the surface of the dispersion plate is uneven or inclined. However, when the dispersion plate 15-2 in FIG. 2 has a collision plate, the intermediate position between the highest portion and the lowest portion other than the collision plate is used as a reference. Generally, the surface on the waste water discharge side and the surface on the waste water supply side are parallel to the surface (ground) perpendicular to the direction of the waste water supply. At this time, the surfaces of the wastewater supply side and the wastewater discharge side are parallel.

分散板1與充填物層之廢水供給側的交界面之距離(H2),係由分散板1之廢水排出側之面至充填物層之廢水供給側的交界面之距離。The distance (H2) of the interface between the dispersion plate 1 and the waste water supply side of the filling layer is the distance from the interface of the waste water discharge side of the dispersion plate 1 to the waste water supply side of the filler layer.

充填物層之廢水供給側及排出側之交界面係定義如下。由於充填物層中充填著充填物,故露出廢水供給側及排出側之面會有不完全平坦之情形。廢水處理裝置設置與地面垂直,由廢水處理裝置的下部供給廢水,並由廢水處理裝置的上部排出廢水時,廢水供給側之交界面(上表面)及排出側之交界面(下表面),係在充填物層之上表面或下表面中露出的充填物中之最低的部位與最高的部位之中間位置為基準之面。此係,即使充填物層露出之面呈傾斜時亦為相同。通常,廢水排出側之交界面及廢水供給側之交界面,與垂直於廢水供給方向之面(地面)平行。此時,廢水排出側之交界面及廢水供給側之交界面為平行。The interface between the waste water supply side and the discharge side of the filling layer is defined as follows. Since the filler is filled in the filler layer, the surfaces exposed on the waste water supply side and the discharge side may not be completely flat. The waste water treatment device is installed perpendicular to the ground. When the waste water is supplied from the lower part of the waste water treatment device and the waste water is discharged from the upper part of the waste water treatment device, the interface (upper surface) of the waste water supply side and the interface (lower surface) on the discharge side are The middle position between the lowest part and the highest part of the filler exposed on the upper or lower surface of the filler layer is the reference surface. This system is the same even when the exposed surface of the filler layer is inclined. Generally, the interface between the wastewater discharge side and the wastewater supply side is parallel to the surface (ground) perpendicular to the direction of wastewater supply. At this time, the interface on the wastewater discharge side and the interface on the wastewater supply side are parallel.

充填物層之層長(H3)係由充填物層之廢水供給側的交界面至廢水排出側之交界面的距離。觸媒層之廢水排出側配置充填物層時,該充填物層之層長(H5)亦與H3相同。The layer length (H3) of the filling layer is the distance from the interface on the wastewater supply side to the interface on the wastewater discharge side. When a filler layer is arranged on the waste water discharge side of the catalyst layer, the layer length (H5) of the filler layer is also the same as H3.

觸媒層之層長(H4)係由觸媒層之廢水供給側的交界面至廢水排出側之交界面的距離。The layer length (H4) of the catalyst layer is the distance from the interface of the wastewater supply side to the interface of the wastewater discharge side of the catalyst layer.

觸媒層中,充填著觸媒(例如:固體觸媒)之充填物,關於觸媒層之廢水供給側的交界面至廢水排出側之交界面的定義係與充填物層相同。The catalyst layer is filled with a catalyst (for example, a solid catalyst). The definition of the interface between the wastewater supply side interface and the wastewater discharge side of the catalyst layer is the same as that of the filler layer.

本發明之廢水處理裝置,藉由具有如上述之構成,可防止水垢成分在觸媒表面析出。從而可高度維持觸媒之處理性能。The wastewater treatment device of the present invention has the structure described above, and can prevent the scale component from being deposited on the catalyst surface. Thereby, the processing performance of the catalyst can be highly maintained.

歷來,已知配置複數個分散板可有效地提高氣液混合效率。然而,在含有水垢成分(銅、鐵等之重金屬以及鈣、鋁等)的廢水之情況下,進一步要求高度的分散技術。作為水垢成分的特徵係可列舉如:藉由濕式氧化處理處理廢水時,在加熱前,以離子形式溶解的水垢成分,在氧的存在下經由加溫加壓,部分析出氧化物或氫氧化物等之固體。因此,根據條件,溶解在廢水中的水垢成分會以離子狀態到達觸媒層,並在觸媒表面析出而有阻礙觸媒活性之虞。因此,本發明中,通過將H 6與H 1之比(H6/H1)設定在適當的範圍內,並將H6設定為100mm以上(包含100mm),能夠在到達觸媒層之前使析出固體之水垢成分,可預先防止水垢成分在觸媒表面的析出。Historically, it has been known that disposing a plurality of dispersion plates can effectively improve gas-liquid mixing efficiency. However, in the case of wastewater containing scale components (heavy metals such as copper, iron, and calcium, aluminum, and the like), a high degree of dispersion technology is further required. The characteristic system of the scale component includes, for example, when the wastewater is treated by wet oxidation treatment, the scale component dissolved in ionic form before heating is heated and pressurized in the presence of oxygen, and the oxide or hydrogen is partially analyzed. Solids such as oxides. Therefore, depending on the conditions, the scale component dissolved in the wastewater may reach the catalyst layer in an ionic state and precipitate on the catalyst surface, which may hinder the catalyst activity. Therefore, in the present invention, by setting the ratio of H 6 to H 1 (H6 / H1) within an appropriate range and setting H6 to 100 mm or more (including 100 mm), it is possible to make the solids precipitate before reaching the catalyst layer. Scale components can prevent precipitation of scale components on the catalyst surface in advance.

而且,為了防止水垢成分直接在觸媒層上蓄積,充填物層亦需要作為分散緩和層。藉由下側充填物層的存在,加速水垢成分在填充物層內的析出,即可預先防止在觸媒表面的析出。同時,與以往相比,分散效果提高,可防止水垢成分局部性析出及堆積,並可使觸媒長期發揮高的處理性能。In addition, in order to prevent scale components from directly accumulating on the catalyst layer, the filler layer also needs to be a dispersion and relaxation layer. The presence of the lower filler layer accelerates the precipitation of scale components in the filler layer, so that the precipitation on the catalyst surface can be prevented in advance. At the same time, compared with the past, the dispersion effect is improved, which can prevent local precipitation and accumulation of scale components, and enable the catalyst to exhibit high processing performance for a long time.

本發明之廢水處理裝置中,H6係超出100mm。H6在100mm以下(包含100mm)時,水垢成分不會均勻分散,且水垢成分會以離子狀態到達觸媒層,因而擔心觸媒層表面會被水垢成分所毒害。從可進一步抑制水垢成分在觸媒的析出之觀點,H6係以超出150mm為佳,以超出250mm更佳。H6之上限並無特別限制,例如未達2000mm。H6未達2000mm時,可抑制經由分散板混合而使微細化的氣泡再度凝聚所導致的氣液接觸效率的降低。In the wastewater treatment apparatus of the present invention, the H6 series exceeds 100 mm. When H6 is less than 100mm (including 100mm), the scale components will not be uniformly dispersed, and the scale components will reach the catalyst layer in an ionic state. Therefore, the surface of the catalyst layer may be poisoned by the scale components. From the viewpoint of further suppressing the precipitation of scale components in the catalyst, the H6 series is preferably more than 150 mm, and more preferably more than 250 mm. The upper limit of H6 is not particularly limited, for example, it is less than 2000 mm. When H6 is less than 2000 mm, the decrease in gas-liquid contact efficiency caused by the re-aggregation of the finer bubbles through the dispersion plate mixing can be suppressed.

本發明之廢水處理裝置中,H6與H1之比(H6/H1)為0.1以上(包含0.1)100以下(包含100)。H6/H1未達0.1或超出100時,在分散板2及分散板1之間,會因氣液之混合效果不足而產生水垢成分之不平衡流動,使得水垢成分局部堆積而降低處理效率。H6/H1係以0.2以上(包含0.2)為佳,以0.3以上(包含0.3)更佳。H6/H1係以80以下(包含80)為佳,以50以下(包含50)更佳。如在該等範圍,可進一步發揮上述效果。In the wastewater treatment apparatus of the present invention, the ratio of H6 to H1 (H6 / H1) is 0.1 or more (including 0.1) and 100 or less (including 100). When H6 / H1 is less than 0.1 or more than 100, an unbalanced flow of scale components will occur between the dispersion plate 2 and the dispersion plate 1 due to insufficient gas-liquid mixing effect, which will cause local accumulation of scale components and reduce processing efficiency. H6 / H1 is preferably 0.2 or more (including 0.2), and more preferably 0.3 or more (including 0.3). H6 / H1 is preferably 80 or less (including 80), and more preferably 50 or less (including 50). If it is in these ranges, the above effects can be further exerted.

只要H1滿足上述比(H6/H1)則無特別限制,例如為10mm以上(包含10mm),以20mm以上(包含20mm)為佳,以30mm以上(包含30mm)更佳。而且,H1為1000mm以下(包含1000mm),以900mm以下(包含900mm)為佳,以750mm以下(包含750mm)更佳。由於H1在10mm以上(包含10mm)1000mm以下(包含1000mm)會使氣液之分散混合充分地進行,故可抑制觸媒處理效率的降低,並可抑制水垢成分以離子狀態直接到達觸媒層。There is no particular limitation as long as H1 satisfies the above-mentioned ratio (H6 / H1), and is, for example, 10 mm or more (including 10 mm), preferably 20 mm or more (including 20 mm), and more preferably 30 mm or more (including 30 mm). In addition, H1 is preferably 1,000 mm or less (including 1000 mm), more preferably 900 mm or less (including 900 mm), and even more preferably 750 mm or less (including 750 mm). Since H1 is more than 10mm (including 10mm) and less than 1000mm (including 1000mm), the gas-liquid dispersion and mixing can be sufficiently performed, so that the reduction in catalyst treatment efficiency can be suppressed, and scale components can be prevented from directly reaching the catalyst layer in an ionic state.

本發明之廢水處理裝置的大小,如滿足上述H6及H6/H1者即無特別限制,可為廢水處理中一般所使用之反應塔或反應容器的大小。本發明之廢水處理裝置的形狀亦無特別限制,可為廢水處理中一般所使用之反應塔或反應容器的形狀。反應塔或反應容器方面,可使用直徑200~3000mm及長度1000~20000mm之圓柱狀者。The size of the wastewater treatment device of the present invention is not particularly limited as long as it meets the above-mentioned H6 and H6 / H1, and may be the size of a reaction tower or a reaction container generally used in wastewater treatment. The shape of the wastewater treatment device of the present invention is also not particularly limited, and may be the shape of a reaction tower or a reaction container generally used in wastewater treatment. As for the reaction tower or the reaction vessel, a cylindrical shape having a diameter of 200 to 3000 mm and a length of 1,000 to 20,000 mm can be used.

本發明之廢水處理裝置係可施用廢水處理的各種方法。廢水的處理方法方面,可列舉如:濕式氧化法、濕式分解法、臭氧氧化法、過氧化氫氧化法等。廢水的處理方法方面,可得到高等級的處理水質,由具有優異經濟性之觀點上,以濕式氧化法為佳。因此,本發明之一實施型態係提供一種藉由濕式氧化法之廢水處理中使用的廢水處理裝置。The wastewater treatment apparatus of the present invention is applicable to various methods for wastewater treatment. Examples of the method for treating wastewater include wet oxidation, wet decomposition, ozone oxidation, and hydrogen peroxide oxidation. In terms of wastewater treatment methods, high-grade treated water quality can be obtained. From the viewpoint of excellent economical efficiency, a wet oxidation method is preferred. Therefore, one embodiment of the present invention provides a wastewater treatment device for wastewater treatment by a wet oxidation method.

[廢水]   對於經由本發明的廢水處理裝置所處理的廢水種類並無特別限制。如為本發明的廢水處理裝置,可有效地處理含有有機化合物、氮化合物及硫化合物之任1種以上的廢水。   上述有機化合物方面,可例示:環氧乙烷及環氧丙烷等之環氧化合物;甲醇及乙醇、乙二醇等之醇化合物; 丙烯酸及甲基丙烯酸、對苯二甲酸等,以及該等之酯等的羧酸及/或其衍生物等。上述氮化合物方面,可例示:胺及亞胺等之有機氮化合物;氨及聯胺等之具有氮-氫鍵的無機氮化合物等。上述硫化合物方面,可例示:硫化氫、硫化鈉、硫化鉀、硫氫化鈉、硫代硫酸鹽、亞硫酸鹽等之無機硫化合物及硫醇類、磺酸類等之有機硫化合物。而且,並不限於僅含有上述化合物之廢水,可含有二噁烷、戴奧辛類及氟氯烷、鄰苯二甲酸二乙基己酯、壬基酚等之有機鹵素化合物及環境賀爾蒙化合物等的有害物質。   含有如此之化合物的廢水方面,可例示:化學工廠、電子零件製造設備、食品加工設備、金屬加工設備、金屬電鍍設備、印刷製版設備、照相設備等之各種產業工廠所排出之廢水;及火力發電及原子力發電等之發電設備等所排出之廢水等。   工業用廢水之具體例方面,係例示:除了EOG製造設備、醇製造設備、脂肪族羧酸及其酯製造設備、芳香族羧酸或芳香族羧酸酯製造設備以外,由紙/紙漿、纖維、鋼鐵、乙烯/BXT、煤氣化、食用肉處理、藥品處理等之各式各樣產業領域之工廠所排出之廢水。   而且,並不僅限於工業廢水,亦例示下水道污水及屎尿等之家庭廢水。[Wastewater] There is no particular limitation on the kind of wastewater treated by the wastewater treatment apparatus of the present invention. According to the wastewater treatment device of the present invention, wastewater containing any one or more of organic compounds, nitrogen compounds, and sulfur compounds can be effectively treated. Examples of the above organic compounds include epoxy compounds such as ethylene oxide and propylene oxide; alcohol compounds such as methanol, ethanol, and ethylene glycol; acrylic acid and methacrylic acid, terephthalic acid, and the like; Carboxylic acids such as esters and / or derivatives thereof. Examples of the nitrogen compound include organic nitrogen compounds such as amines and imines, and inorganic nitrogen compounds having nitrogen-hydrogen bonds such as ammonia and hydrazine. Examples of the sulfur compounds include inorganic sulfur compounds such as hydrogen sulfide, sodium sulfide, potassium sulfide, sodium sulfide, thiosulfate, and sulfite, and organic sulfur compounds such as thiols and sulfonic acids. Moreover, it is not limited to wastewater containing only the above compounds, and may include organic halogen compounds such as dioxane, dioxin and chlorochloroethane, diethylhexyl phthalate, nonylphenol, and environmental hormone compounds. Of harmful substances. Examples of wastewater containing such compounds include wastewater discharged from various industrial plants such as chemical plants, electronic component manufacturing equipment, food processing equipment, metal processing equipment, metal plating equipment, printing platemaking equipment, and photographic equipment; and thermal power generation. And waste water discharged from power generation equipment such as atomic power generation. Specific examples of industrial wastewater include: EOG production equipment, alcohol production equipment, aliphatic carboxylic acid and ester production equipment, aromatic carboxylic acid or aromatic carboxylic acid ester production equipment, and paper / pulp, fiber , Steel, ethylene / BXT, coal gasification, edible meat processing, pharmaceutical processing, etc. Furthermore, it is not limited to industrial wastewater, but also exemplifies domestic wastewater such as sewage and feces.

亦即,本發明之「廢水」並不限於如上所述從產業工廠所排出的所謂工業廢水,總之包含有機化合物,氮化合物及硫化合物中的任1種以上(包含1種)之任何液體,並且如此液體的供給源(產生源)並無特別限定。That is, the "wastewater" of the present invention is not limited to the so-called industrial wastewater discharged from the industrial plant as described above, but any liquid containing any one or more (including one) of organic compounds, nitrogen compounds, and sulfur compounds, The supply source (generation source) of such a liquid is not particularly limited.

(水垢成分)   更且,本發明之廢水處理裝置適於含有水垢成分之廢水處理。如上所述,專利文獻1所揭示之廢水處理裝置中,廢水(銅、鐵等之重金屬類及鈣、鋁等)中含有水垢成分時,水垢成分會以離子狀態到達觸媒層,並析出觸媒表面,會有阻礙觸媒活性之情形。另一方面,本發明之廢水處理裝置中,可抑制水垢成分在觸媒表面的析出,可高度維持觸媒之處理效率。(Scale component) Further, the wastewater treatment device of the present invention is suitable for wastewater treatment containing scale components. As described above, in the wastewater treatment device disclosed in Patent Document 1, when scale components are contained in waste water (heavy metals such as copper and iron, and calcium, aluminum, etc.), the scale components reach the catalyst layer in an ionic state and precipitate the catalyst. The surface of the catalyst may hinder the catalyst activity. On the other hand, in the wastewater treatment device of the present invention, the precipitation of scale components on the surface of the catalyst can be suppressed, and the treatment efficiency of the catalyst can be highly maintained.

水垢成分係選自重金屬類、鋁、磷、矽、鈣及鎂所成群組中之至少1種元素。重金屬類並無特別限定,可列舉例如:鎘(Cd)、鎳(Ni)、鈷(Co)、錳(Mn)、銅(Cu)、鋅(Zn)、銀(Ag)、鐵(Fe)、錫(Sn)、銻(Sb)、鉛(Pb)、鉈(Tl)、汞(Hg)、砷(As)、鉻(Cr)、鉍(Bi)等。The scale component is at least one element selected from the group consisting of heavy metals, aluminum, phosphorus, silicon, calcium, and magnesium. The heavy metals are not particularly limited, and examples thereof include cadmium (Cd), nickel (Ni), cobalt (Co), manganese (Mn), copper (Cu), zinc (Zn), silver (Ag), and iron (Fe). , Tin (Sn), antimony (Sb), lead (Pb), thorium (Tl), mercury (Hg), arsenic (As), chromium (Cr), bismuth (Bi), and the like.

對於廢水中所含的水垢成分之濃度並無特別限定。本發明之廢水處理裝置係與以往者不同,在包含0.1mg/L以上(包含0.1mg/L)之水垢成分的廢水處理中,可發揮效果。水垢成分之濃度可為0.5mg/L以上(包含0.5mg/L)。水垢成分之濃度如為1g/L以下(包含1g/L),可充分發揮本發明之效果。There is no particular limitation on the concentration of scale components contained in the wastewater. The wastewater treatment device of the present invention is different from the conventional one, and can exhibit an effect in wastewater treatment containing scale components of 0.1 mg / L or more (including 0.1 mg / L). The concentration of scale components can be 0.5 mg / L or more (including 0.5 mg / L). If the concentration of the scale component is 1 g / L or less (including 1 g / L), the effects of the present invention can be fully exerted.

[分散板]   本發明之廢水處理裝置從廢水之供給側依序具有分散板2、分散板1、充填物層及觸媒層。亦即,本發明之廢水處理裝置至少具有2片分散板。分散板方面,可使用如第5圖所例示之單孔板、附碰撞板之單孔板、多孔板或附碰撞板之多孔板。分散板方面,可配置相同種類之分散板,亦可配置不同之分散板。本發明之廢水處理裝置中,分散板2及分散板1以預定距離(H1)配置時,即可顯現本發明。而且,亦可因應必要,將追加的分散板配置在比分散板2更靠近廢水供給側(上游側)。另外,分散板可由1片板構成,惟從安裝及拆卸之作業性的觀點上,以可分割為2片以上(包含2片)之形狀所構成者為佳。[Dispersion plate] The wastewater treatment device of the present invention has a dispersion plate 2, a dispersion plate 1, a filling layer, and a catalyst layer in this order from the supply side of the wastewater. That is, the wastewater treatment apparatus of the present invention has at least two dispersion plates. As for the dispersion plate, a single-well plate, a single-well plate with a collision plate, a perforated plate, or a perforated plate with a collision plate as shown in FIG. 5 can be used. As for the dispersing plate, the same type of dispersing plate can be arranged, and different dispersing plates can also be arranged. In the wastewater treatment apparatus of the present invention, the present invention can be manifested when the dispersion plate 2 and the dispersion plate 1 are arranged at a predetermined distance (H1). Further, if necessary, an additional dispersion plate may be disposed closer to the wastewater supply side (upstream side) than the dispersion plate 2. In addition, the dispersion plate may be constituted by one sheet, but it is preferable that it is constituted by a shape that can be divided into two or more pieces (including two pieces) from the viewpoint of workability of installation and removal.

單孔板及多孔板的開孔率(包含附碰撞板者),一般為0.005%以上(包含0.005%)30%以下(包含30%)。上述開孔率係以0.05%以上(包含0.05%)為佳,以0.1%以上(包含0.1%)更佳,以0.5%以上(包含0.5%)又更佳,以1%以上(包含1%)為特佳。而且,上述開孔率係以10%以下(包含10%)為佳,以5%以下(包含5%)更佳。藉由在如此之範圍內,即可防止因攪拌效果而引起的不平衡流動,可使廢水中所含的氣體均勻地分佈。因此,氣液提高而可提高觸媒的處理性能。The aperture ratio of single-well plates and multi-well plates (including those with collision plates) is generally 0.005% or more (including 0.005%) and 30% or less (including 30%). The above porosity is preferably 0.05% or more (including 0.05%), more preferably 0.1% or more (including 0.1%), more preferably 0.5% or more (including 0.5%) and even more preferably, 1% or more (including 1%) ) Is particularly good. The above-mentioned porosity is preferably 10% or less (including 10%), and more preferably 5% or less (including 5%). By being in such a range, an unbalanced flow caused by the stirring effect can be prevented, and the gas contained in the wastewater can be evenly distributed. Therefore, the improvement of the gas-liquid can improve the processing performance of the catalyst.

分散板之開孔率係以下述式求算。The porosity of the dispersion plate is calculated by the following formula.

開孔率[%]=孔全體之截面積/分散板全體之截面積×100Opening rate [%] = cross-sectional area of the entire hole / cross-sectional area of the entire dispersion plate × 100

對於多孔板(包含附碰撞板者)之孔數,一般係每1m2 為5個以上(包含5個)200個以下(包含200個)。從可得到充分之分散效果的觀點,孔數係以每1m2 為10個以上(包含10個)為佳,以每1m2 為25個以上(包含25個)更佳。而且,從可維持多孔板之強度的觀點,孔數係以每1m2 為150個以下(包含150個)為佳,以每1m2 為120個以下(包含120個)更佳。The number of holes in perforated plates (including those with collision plates) is generally 5 or more (including 5) and 200 or less (including 200) per 1 m 2 . Effect can be obtained sufficiently from the viewpoint of the dispersion, based in the number of holes per 1m 2 of 10 or more (including 10) preferably, less than 1m 2 per 25 (including 25) better. Further, the strength of the porous plate can be maintained in view of the number of holes per 1m 2 in a line of 150 or less (including 150) preferably, per 1m 2 of 120 or less (including 120) the better.

對於孔之形狀並無特別限定,惟圓柱型或圓錐型者,因製作上容易,因而為佳。而且,對於孔的配置,並無特別限定,如為單孔板時,以配置在中心者為佳,如為多孔板時,以儘可能地全體均一配置者為佳。The shape of the hole is not particularly limited, but a cylindrical or conical shape is preferable because it is easy to manufacture. In addition, the arrangement of the holes is not particularly limited. In the case of a single-well plate, it is preferable to arrange it in the center. In the case of a multi-well plate, it is preferable to arrange it uniformly as much as possible.

本發明之較佳實施型態中,分散板1及分散板2之至少一者為多孔板,上述多孔板之孔數係以每1m2 為5個以上(包含5個)200個以下(包含200個)。藉由如此之構成,可進一步抑制水垢成分在觸媒上的析出,從而可進一步高度維持觸媒的處理性能。In a preferred embodiment of the present invention, at least one of the dispersing plate 1 and the dispersing plate 2 is a porous plate, and the number of holes of the porous plate is 5 or more (including 5) per 1 m 2 and 200 or less (including 200). With such a configuration, the precipitation of scale components on the catalyst can be further suppressed, and the processing performance of the catalyst can be further maintained.

分散板1與充填物層之廢水供給側的交界面之距離H2,如H2與下述充填物層之層長H3之和(H6)超出100mm時,並無特別限制,惟由廢水之分散效果的觀點,係以10mm以上(包含10mm)為佳。The distance H2 between the interface between the dispersing plate 1 and the waste water supply side of the filling layer, such as the sum of H2 and the layer length H3 (H6) of the filling layer described below exceeds 100mm, there is no particular limitation, but the dispersion effect of the wastewater From the viewpoint, it is preferably 10 mm or more (including 10 mm).

設置在附碰撞板之單孔板以及附碰撞板之多孔板的碰撞板之直徑,孔徑係以0.5~10.0倍為佳,以1.0~5.0倍更佳,以1.5~3.0倍又更佳。而且,碰撞板與單孔板或多孔板之間隔,孔徑係以0.05~5.0倍為佳,以0.1~3.0倍更佳,以0.2~1.0倍又更佳。藉由設在如此之範圍,廢水及氣體在碰撞板可有效地碰撞,可均勻地分散在碰撞板之周方向。The diameter of the collision plate provided in the single-well plate with collision plate and the porous plate with collision plate is preferably 0.5 to 10.0 times, more preferably 1.0 to 5.0 times, and even more preferably 1.5 to 3.0 times. Moreover, the distance between the collision plate and the single-well plate or perforated plate is preferably 0.05 to 5.0 times, more preferably 0.1 to 3.0 times, and even more preferably 0.2 to 1.0 times. By setting in such a range, the waste water and gas can effectively collide on the collision plate, and can be evenly dispersed in the circumferential direction of the collision plate.

[充填物層]   本發明之廢水處理裝置係在分散板1之廢水排出側具有充填物層。藉由如此之構成,可防止觸媒之損耗,且廢水不會不平衡流動,儘可能地可在觸媒層均勻地流動。更且,可防止水垢成分在觸媒表面析出。[Filling material layer] (1) The waste water treatment device of the present invention has a filling material layer on the waste water discharge side of the dispersion plate 1. With this structure, the catalyst can be prevented from being consumed, and the wastewater does not flow unbalanced, and can flow as evenly as possible in the catalyst layer. Furthermore, it is possible to prevent scale components from precipitating on the catalyst surface.

充填物層中,充填有金屬製或陶瓷製之充填物。充填物係包含選自鐵、銅、不鏽鋼(SUS)、赫史特合金、英高鎳、鈦、鋯、氧化鈦、氧化鋯、氮化矽或氮化碳所成群組中之至少1種。充填物可為單獨1種,亦可為2種以上(包含2種)或合金。藉由濕式氧化法處理廢水時,充填物方面,從耐磨損性、耐腐蝕性及強度之觀點,係以不鏽鋼(SUS)、鋯、赫史特合金、英高鎳或鈦為佳,以不鏽鋼(SUS)或氧化鋯更佳。The filler layer is filled with a metal or ceramic filler. The filler system contains at least one member selected from the group consisting of iron, copper, stainless steel (SUS), Herstoy, Inconel, titanium, zirconium, titanium oxide, zirconia, silicon nitride, or carbon nitride. . The filler may be a single kind, or two or more kinds (including two kinds) or an alloy. When the wastewater is treated by wet oxidation, the filler is preferably stainless steel (SUS), zirconium, Herst alloy, Inconel or titanium from the viewpoint of wear resistance, corrosion resistance and strength. It is better to use stainless steel (SUS) or zirconia.

充填物之形狀方面,並無特別限制,可列舉如:丸狀、球狀、塊狀、環狀、鞍狀、多面體狀等的粒狀;纖維狀、鏈狀、串珠狀等連續體的形狀等。從可容易在反應塔充填之觀點上,充填物之形狀係以粒狀為佳,以丸狀、球狀或環狀更佳。The shape of the filler is not particularly limited, and examples thereof include pellets such as pellets, spheres, blocks, rings, saddles, and polyhedrons; shapes of fibrous, chain, and bead-like continuum Wait. From the viewpoint that the reaction tower can be easily filled, the shape of the filling is preferably granular, and more preferably pellets, spheres, or rings.

充填物之大小,如可得到上述效果,則無特別限制。例如為粒狀之充填物時,平均粒徑為3mm以上(包含3mm),以4mm以上(包含4mm)為佳,以5mm以上(包含5mm)更佳。而且,平均粒徑為30mm以下(包含30mm),以20mm以下(包含20mm)為佳,以15mm以下(包含15mm)更佳。The size of the filler is not particularly limited as long as the above-mentioned effects can be obtained. For example, when it is a granular filling, the average particle diameter is 3 mm or more (including 3 mm), preferably 4 mm or more (including 4 mm), and more preferably 5 mm or more (including 5 mm). The average particle diameter is 30 mm or less (including 30 mm), preferably 20 mm or less (including 20 mm), and more preferably 15 mm or less (including 15 mm).

而且,本說明書中,粒狀之充填物以及後述固體觸媒之平均粒徑係粒徑之算數平均值。而且,粒徑係指充填物或固體觸媒之最大徑。例如:球狀之充填物或固體觸媒之粒徑為直徑,丸狀之充填物或固體觸媒的粒徑係指其對角線的長度。In addition, in this specification, the average particle diameter of a granular filler and the solid catalyst mentioned later are the arithmetic mean of a particle diameter. The particle diameter refers to the maximum diameter of the filler or solid catalyst. For example, the particle diameter of a spherical filler or solid catalyst is the diameter, and the particle diameter of a pellet-shaped filler or solid catalyst refers to the length of its diagonal.

充填物之平均粒徑d1、與下述觸媒層所含的觸媒之平均粒徑d0,從廢水之分散效果的觀點上,以d1>d2者為佳。The average particle diameter d1 of the filler and the average particle diameter d0 of the catalyst contained in the catalyst layer described below are preferably d1> d2 from the viewpoint of the dispersion effect of the wastewater.

充填物之比重(意指真比重,與一般使用之體積比重、充填比重、表觀比重不同)並無特別限制,可適當地選擇。比重方面, 一般為2.5以上(包含2.5),以4~12為佳。The specific gravity of the filling material (meaning the true specific gravity, which is different from the volume specific gravity, filling specific gravity, and apparent specific gravity generally used) is not particularly limited, and may be appropriately selected. The specific gravity is generally 2.5 or more (including 2.5), and preferably 4 to 12.

充填物層之孔隙率並無特別限制,一般為20~90容量%(充填物層之總體積基準),以30~70容量%為佳,以35~60容量%更佳,以35~55容量%又更佳。The porosity of the filling layer is not particularly limited, and is generally 20 to 90% by volume (based on the total volume of the filling layer), preferably 30 to 70% by volume, more preferably 35 to 60% by volume, and 35 to 55 Capacity% is even better.

充填物層所充填之充填物無須具有相同的材質、形狀、大小、比重等,如可呈現本發明之效果,可使用2種以上(包含2種)之充填物。而且,根據使用型態及使用狀況,可適當地選擇合適之充填物。The filling material to be filled by the filling material layer does not need to have the same material, shape, size, specific gravity, etc. If the effects of the present invention can be exhibited, two or more types (including two types) of filling materials can be used. In addition, a suitable filler can be appropriately selected according to a use type and a use situation.

充填物一般係採用將金屬網,格柵等單獨或組合而成之支撐座設置在反應塔中並在其上充填之方法。The filling is generally a method in which a support base made of a metal net, a grille, etc., alone or in combination, is set in a reaction tower and filled thereon.

充填物層之層長(H3),如與上述H2之和(H6)超出100mm時,並無特別限制,一般為10mm以上(包含10mm),從防止水垢成分直接蓄積在觸媒層之觀點上,以50mm以上(包含50mm)為佳,以80mm以上(包含80mm)更佳,以100mm以上(包含100mm)又更佳。H3之上限並無特別限制,為300mm以下(包含300mm),從成本之觀點上,以250mm以下(包含250mm)為佳。The layer length (H3) of the filling layer is not particularly limited if the sum of the H2 (H6) and the above H2 exceeds 100mm, and is generally 10mm or more (including 10mm). From the viewpoint of preventing scale components from directly accumulating in the catalyst layer It is more preferably 50mm or more (including 50mm), more preferably 80mm or more (including 80mm), and even more preferably 100mm or more (including 100mm). The upper limit of H3 is not particularly limited, and is 300 mm or less (including 300 mm), and from the viewpoint of cost, it is preferably 250 mm or less (including 250 mm).

本發明之較佳實施型態中,從進一步提高廢水之分散效果之觀點上,充填物層為2層構造。亦即,本發明之廢水處理裝置以在充填物層與觸媒層之間進一步具有充填物層者為佳。由於充填物層為2層構造,因此可進一步高度維持觸媒之處理性能。In a preferred embodiment of the present invention, the filler layer has a two-layer structure from the viewpoint of further improving the dispersion effect of wastewater. That is, the wastewater treatment device of the present invention preferably has a filler layer between the filler layer and the catalyst layer. Since the filler layer has a two-layer structure, it is possible to further maintain the catalyst processing performance to a high degree.

廢水之供給側的充填物層為充填物層1、觸媒層側之充填物層為充填物層2時,充填物層1所含的充填物之平均粒徑d1與充填物層2所含的充填物之平均粒徑d2之關係可為d1>d2,亦可為d1<d2。d1及d2,從廢水之分散效果的觀點上,係以d1>d2者為佳。如為d1>d2時,d2與d1之比(d2/d1)係以0.2以上(包含0.2)為佳,以0.3以上(包含0.3)更佳,以0.4以上(包含0.4)又更佳。而且,d2/d1以未達1.00為佳,以未達0.95更佳。When the filler layer on the supply side of the waste water is the filler layer 1, and the filler layer on the catalyst layer side is the filler layer 2, the average particle diameter d1 of the filler contained in the filler layer 1 and the filler particle layer 2 are included. The relationship between the average particle diameter d2 of the filler can be d1> d2, or d1 <d2. d1 and d2 are preferably d1> d2 from the viewpoint of the dispersion effect of the wastewater. When d1> d2, the ratio of d2 to d1 (d2 / d1) is preferably 0.2 or more (including 0.2), more preferably 0.3 or more (including 0.3), and even more preferably 0.4 or more (including 0.4). The d2 / d1 is preferably less than 1.00, and more preferably less than 0.95.

本發明之較佳實施型態中,充填物層1所含的充填物1之平均粒徑d1與充填物層2所含的充填物2之平均粒徑d2以及下述觸媒層所含的觸媒之平均粒徑d2係滿足d1>d2>d0之關係。由廢水之供給側至充填物層1、充填物層2及觸媒層,逐漸減少充填物或觸媒的平均粒徑,藉此即可進一步提高廢水之分散效果。d2與d1之比(d2/d1)係如上述。而且,d0與d2之比(d0/d2)係以0.2以上(包含0.2)為佳,以0.3以上(包含0.3)更佳,以0.4以上(包含0.4)又更佳。而且,d0/d2係以未達1.00為佳,以未達0.95更佳。In a preferred embodiment of the present invention, the average particle diameter d1 of the filler 1 contained in the filler layer 1 and the average particle diameter d2 of the filler 2 contained in the filler layer 2 and the following catalyst layer The average particle diameter d2 of the catalyst satisfies the relationship of d1> d2> d0. From the supply side of the wastewater to the filler layer 1, the filler layer 2 and the catalyst layer, the average particle diameter of the filler or catalyst is gradually reduced, thereby further improving the dispersion effect of the wastewater. The ratio of d2 to d1 (d2 / d1) is as described above. The ratio of d0 to d2 (d0 / d2) is preferably 0.2 or more (including 0.2), more preferably 0.3 or more (including 0.3), and even more preferably 0.4 or more (including 0.4). In addition, d0 / d2 is preferably less than 1.00, and more preferably less than 0.95.

充填物層1及充填物層2所含的充填物之材質、形狀及比重可為相同或不同。The material, shape, and specific gravity of the fillers contained in the filler layer 1 and the filler layer 2 may be the same or different.

充填物層之層長係,將充填物層1之層長設為H3、充填物層2之層長設為H7。層長之定義係如上述。而且,H6係H2、H3及H7之和。充填物層可為2層構造,上述H6之較佳範圍相同。The layer length of the filler layer is set as the layer length of the filler layer 1 as H3 and the layer length of the filler layer 2 as H7. The definition of the layer length is as described above. Moreover, H6 is the sum of H2, H3, and H7. The filling layer may have a two-layer structure, and the preferred range of the above H6 is the same.

從廢水之分散效果之觀點上,充填物層2之層長(H7)係以30mm以上(包含30mm)為佳,以50mm以上(包含50mm)更佳,以100mm以上(包含100mm)又更佳。而且,H7係以500mm以下(包含500mm)為佳,以400mm以下(包含400mm)更佳,以300mm以下(包含300mm)又更佳。惟H7係以H6及H6/H1不偏離上述範圍之下而設定。From the viewpoint of the dispersion effect of the wastewater, the layer length (H7) of the filling layer 2 is preferably 30mm or more (including 30mm), more preferably 50mm or more (including 50mm), and more preferably 100mm or more (including 100mm). . The H7 series is preferably 500 mm or less (including 500 mm), more preferably 400 mm or less (including 400 mm), and even more preferably 300 mm or less (including 300 mm). However, H7 is set so that H6 and H6 / H1 do not deviate from the above range.

因此,本發明之較佳型態中,上述充填物層2之層長為30mm以上(包含30mm)500mm以下(包含500mm)。Therefore, in a preferred form of the present invention, the layer length of the filler layer 2 is 30 mm or more (including 30 mm) and 500 mm or less (including 500 mm).

本發明之廢水處理裝置可在觸媒層之廢水排出側進一步具有充填物層。The wastewater treatment device of the present invention may further have a filling layer on the wastewater discharge side of the catalyst layer.

例如:如第2圖所示,廢水處理裝置為向上流動之圓柱形裝置時,為了從上施加負荷來按壓觸媒,因而在觸媒層之廢水排出側進一步設置充填物層(上部充填物層)。上部充填物層的設定可抑制觸媒的損耗。上部充填物層之層長(H5)並無特別限制,可自30~1000mm之範圍適當地選擇。而且,上部充填物層所含的充填物方面,可使用上述的充填物。惟上部充填物層所含的充填物之大小,為了防止充填物進入觸媒層,以使用大於觸媒大小者為佳。For example: As shown in Figure 2, when the wastewater treatment device is a cylindrical device that flows upward, in order to apply a load from above to press the catalyst, a filler layer (the upper filler layer) is further provided on the wastewater discharge side of the catalyst layer. ). The setting of the upper filling layer can suppress catalyst loss. The layer length (H5) of the upper filling layer is not particularly limited, and can be appropriately selected from a range of 30 to 1000 mm. As for the filler contained in the upper filler layer, the above-mentioned filler can be used. However, the size of the filler contained in the upper filler layer is preferably larger than the size of the catalyst in order to prevent the filler from entering the catalyst layer.

[觸媒層]   本發明之觸媒處理裝置,從廢水之排出側依序具有分散板2、分散板1、充填物層及觸媒層。觸媒層所含的觸媒為一般的固體觸媒。固體觸媒如為一般廢水處理中使用者,則無特別限制均可使用。固體觸媒方面,可列舉如:選自鈦、鐵、鋁、矽、鋯以及鈰中的至少1種金屬;氧化物或該等之複合氧化物,或者含有活性碳等之觸媒。該等之中,以氧化鈦、氧化鋯、氧化鐵、鈦-鋯複合氧化物、鈦-鐵複合氧化物等之氧化物為適用。[Catalyst layer] 之 The catalyst treatment device of the present invention has a dispersion plate 2, a dispersion plate 1, a filler layer, and a catalyst layer in this order from the discharge side of the wastewater. The catalyst contained in the catalyst layer is a general solid catalyst. If the solid catalyst is a user in general wastewater treatment, it can be used without special restrictions. In terms of solid catalysts, at least one metal selected from the group consisting of titanium, iron, aluminum, silicon, zirconium, and cerium; oxides or composite oxides thereof; or catalysts containing activated carbon or the like. Among these, oxides such as titanium oxide, zirconia, iron oxide, titanium-zirconium composite oxide, and titanium-iron composite oxide are applicable.

固體觸媒係除了上述成分(第1成分)以外,亦可含有其它成分(第2成分)。含有2種成分之固體觸媒方面,可列舉如:含有選自鐵、鈦、矽、鋁、鋯以及鈰中的至少1種金屬;氧化物或該等之複合氧化物、或者活性碳(第1成分),與選自錳、鈷、鎳、鎢、銅、銀、鉑、鈀、銠、金、銦、釕中的至少1種金屬;或該等之金屬化合物(第2成分)之觸媒。固體觸媒之較佳者係,第1成分為氧化鈦、氧化鋯、氧化鐵、鈦-鋯複合氧化物,或鈦-鐵複合氧化物;第2成分為鉑。在含有2種成分之固體觸媒中,係以包含75~99.95重量%之第1成分與0.05~25重量%之第2成分者為佳。而且,第1成分及第2成分之合計係以100重量%為佳。惟可適當地含有無觸媒活性之載體、無機觸媒、黏合劑成分等之第3成分,此時之第1成分及第2成分之重量比係由第1成分的重量與第2成分的重量決定而不考慮第3成分。The solid catalyst system may contain other components (second component) in addition to the above-mentioned component (first component). For solid catalysts containing two types of components, examples include: at least one metal selected from the group consisting of iron, titanium, silicon, aluminum, zirconium, and cerium; oxides or composite oxides thereof; or activated carbon (No. 1 component), contact with at least one metal selected from the group consisting of manganese, cobalt, nickel, tungsten, copper, silver, platinum, palladium, rhodium, gold, indium, and ruthenium; or a metal compound (second component) of these Media. The preferred solid catalyst is that the first component is titanium oxide, zirconia, iron oxide, titanium-zirconium composite oxide, or titanium-iron composite oxide; and the second component is platinum. Among solid catalysts containing two types of components, it is preferable that the first component contains 75 to 99.95% by weight and the second component contains 0.05 to 25% by weight. The total of the first component and the second component is preferably 100% by weight. However, the third component, such as a catalyst-free carrier, an inorganic catalyst, and an adhesive component, may be appropriately contained. In this case, the weight ratio of the first component and the second component is determined by the weight of the first component and the weight of the second component. Weight is determined without considering the third component.

上述固體觸媒在使用濕式氧化法之氧化處理中係為適用。從高等級之處理水質及經濟性的觀點上,本發明之廢水處理裝置在使用濕式氧化法之廢水處理中為適用。因此,本發明之較佳實施型態中,觸媒層中所含的觸媒為濕式氧化觸媒。The solid catalyst is suitable for an oxidation treatment using a wet oxidation method. From the viewpoint of high-grade treated water quality and economy, the wastewater treatment apparatus of the present invention is applicable to wastewater treatment using a wet oxidation method. Therefore, in a preferred embodiment of the present invention, the catalyst contained in the catalyst layer is a wet oxidation catalyst.

固體觸媒之形狀如為廢水處理中一般使用之形狀,則無特別限制,固體觸媒之形狀方面,可列舉如:丸狀、球狀、環狀等之粒狀;蜂巢狀等。The shape of the solid catalyst is not particularly limited as long as it is generally used in wastewater treatment. Examples of the shape of the solid catalyst include pellets, pellets, rings, and the like; honeycomb shapes, and the like.

固體觸媒之大小,如可得到上述效果則無特別限制。例如:如為粒狀之固體觸媒時,平均粒徑例如為1~30mm,以1.5~20mm為佳,以2~15mm更佳。而且,從廢水之分散效果的觀點,固體觸媒之平均粒徑係以比觸媒層更靠近廢水供給側之充填物層中所含的充填物之平均粒徑較小者為佳。The size of the solid catalyst is not particularly limited as long as the above effects can be obtained. For example, when it is a granular solid catalyst, the average particle diameter is, for example, 1 to 30 mm, preferably 1.5 to 20 mm, and more preferably 2 to 15 mm. Furthermore, from the viewpoint of the dispersion effect of the wastewater, the average particle diameter of the solid catalyst is preferably the smaller the average particle diameter of the filler contained in the filler layer closer to the wastewater supply side than the catalyst layer.

固體觸媒係可單獨使用1種,亦可組合2種以上(包含2種)使用。The solid catalyst system may be used singly or in combination of two or more kinds (including two types).

觸媒層之層長H4係依觸媒之充填量決定。觸媒之充填量並無特別限定,可依目的而適當地決定。一般係建議調整觸媒的充填量,使觸媒層的空間速度成為0.1 hr-1 ~10 hr-1 ,以0.2hr-1 ~5hr-1 為佳,以0.3hr-1 ~3hr-1 更佳。空間速度在0.1 hr-1 以上(包含0.1 hr-1 )時,可確保觸媒的處理量,可避免擴大設備。而且,空間速度在10 hr-1 以下(包含10 hr-1 )時,可充分地進行反應塔內之廢水的氧化/分解處理。The layer length H4 of the catalyst layer is determined by the filling amount of the catalyst. The filling amount of the catalyst is not particularly limited, and can be appropriately determined according to the purpose. Generally, it is recommended to adjust the filling amount of the catalyst so that the space velocity of the catalyst layer becomes 0.1 hr -1 to 10 hr -1 , preferably 0.2hr -1 to 5hr -1 , and more preferably 0.3hr -1 to 3hr -1 good. When the space velocity is 0.1 hr -1 or more (including 0.1 hr -1 ), the processing capacity of the catalyst can be ensured, and the expansion of the equipment can be avoided. In addition, when the space velocity is 10 hr -1 or less (including 10 hr -1 ), the oxidation / decomposition treatment of the wastewater in the reaction tower can be sufficiently performed.

<第2型態:廢水的處理方法>   依據本發明之其它型態,提供一種廢水之處理方法,其係使用從廢水之供給側依序具有至少氣體-液體擴散部1、氣體-液體擴散部2、氣體-液體擴散部3以及觸媒層之裝置的廢水處理方法,   上述廢水中係有氣體分散,且滿足以下之(1)~(3): (1) 上述氣體-液體擴散部1~3中之上述廢水留置時間均為0.5秒以上(包含0.5秒); (2) 上述氣體-液體擴散部3與上述氣體-液體擴散部2中之廢水留置時間的合計為5秒以上(包含5秒);以及 (3) 相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計為0.1~100倍。   本型態之裝置中,觸媒層係與上述廢水處理裝置(第1型態)之觸媒層相同,因而省略說明。   本型態之裝置係具有作為將水垢成分與氣體(尤其是氧氣)均勻地分散之手段的氣體-液體擴散部1~3。   氣體-液體擴散部1(本說明書中,亦稱為「擴散部1」)係從廢水之供給側,氣體-液體分散部與氣體-液體分散部之間的空間、或分散板與充填物層之廢水供給側之面之間的空間;或者充填物層。擴散部1例如相當於第2圖中之H1所示之範圍。   氣體-液體擴散部2(本說明書中,亦稱為「擴散部2」) 係從廢水之供給側,氣體-液體分散部與氣體-液體分散部之間的空間、或分散板與充填物層之廢水供給側面之間的空間或者充填物層之廢水排出側之面與充填物層之廢水供給側之面之間的空間;或者充填物層。擴散部2例如相當於第2圖中之H2所示之範圍。   氣體-液體擴散部3(本說明書中,亦稱為「擴散部3」) 係從廢水之供給側,氣體-液體分散部與觸媒層之廢水供給側之面之間的空間或充填物層之廢水排出側之面與觸媒層之廢水供給側之面之間的空間;或者充填物層。擴散部3例如相當於第2圖中之H3所示之範圍。充填物層為2層構造時,2層之合計對應於擴散部3,例如相當於第4圖中之H3+H7所示之範圍。   本型態之處理方法中,氣體-液體分散部1~3之至少一者為充填物層。充填物層可為1層亦可為2層以上(包含2層)。而且,本型態之裝置的充填物層係與上述廢水處理裝置(第1型態)所具有之充填物層相同,因而省略說明。   氣體-液體分散部係可藉由攪拌效果防止不平衡流動而可將廢水中所含的氣體均勻地分佈之構件,可列舉分散板之例。本型態之裝置的分散板係與上述廢水處理裝置(第1型態)之分散板相同,故省略說明。   本型態之處理方法中,廢水中分散著氣體。本型態之裝置係藉由具有至少3個氣體-液體擴散部而提高氣液接觸,可提高觸媒之處理性能。   本型態之處理方法中,氣體-液體擴散部中之廢水留置時間係滿足上述(1)~(3)之條件。   以下,對於(1)~(3)進行說明。 (1)氣體-液體擴散部1~3中之廢水留置時間均為0.5秒以上(包含0.5秒)。該廢水留置時間未達0.5秒時,氣液之混合效果不足,無法呈現本發明之效果。廢水留置時間係以2~300秒為佳。 (2)氣體-液體擴散部3與氣體-液體擴散部2中之廢水留置時間的合計為5秒以上(包含5秒)。該廢水留置時間的合計未達5秒時,水垢成分不均勻分散,且水垢成分會以離子狀態到達觸媒層,因而擔心觸媒層表面會被水垢成分所毒害。上述廢水留置時間的合計之下限係以10秒以上(包含10秒)為佳,以35秒以上(包含35秒)更佳,以60秒以上(包含60秒)又更佳。上述廢水留置時間的合計之上限並無特別限制,惟擴散部2與擴散部3中之廢水留置時間之合計係以2500秒以下(包含2500秒)為佳,以1500秒以下(包含1500秒)更佳,以750以下(包750秒)又更佳,以300秒以下(包含300秒)為特佳。 (3)相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計為0.1~100倍。相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計未達0.1倍或超出100倍時,氣液之混合效果不足,容易產生水垢成分的不平衡流動,故會局部性堆積水垢成分,使處理效率降低。相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計係以0.2倍以上(包含0.2倍)為佳,以0.3倍以上(包含0.3倍)更佳,以80倍以下(包含80倍)為佳,以50倍以下(包含50倍)更佳。   氣體-液體擴散部為充填物層時,廢水留置時間為0.5秒以上(包含0.5秒)時,不必要考慮充填物層之孔隙率。充填物層之孔隙率一般為20~90容量%(以充填物層之總體積為基準),以30~70容量%為佳,以35~60容量%更佳。孔隙率降低時,由於填充物層中的湍流程度增加,可獲得與延長廢水留置時間相同的效果。而且,氣體-液體擴散部即使以2層以上(包含2層)之充填物層所構成,氣體-液體擴散部中之廢水留置時間係滿足上述(1)~(3)之條件。   氣體-液體擴散部中之廢水留置時間係可藉由所供給之廢水流速及裝置大小而適當地控制。而且,廢水留置時間可藉由實施例所記載之方法求算出。   較佳之實施型態中,上述擴散部3係孔隙率20~90容量%(以充填物層之總體積為基準)之充填物層。上述孔隙率係以30~70容量%為佳,以35~60容量%更佳,以35~55容量%為特佳。而且,上述擴散部3為充填物層時,上述擴散部2及上述擴散部1之更佳者係非為充填物層之型態。   較佳之實施型態中,上述擴散部3為2層構造之充填物層。由於充填物層為2層構造,故可高度地維持觸媒之處理性能。   上述擴散部3中之廢水留置時間為0.5秒以上(包含0.5秒),以5秒以上(包含5秒)為佳,以8秒以上(包含8秒)更佳,以10秒以上(包含10秒)為特佳。未達0.5秒時,無法充分得到本發明之效果。廢水留置時間之上限並無特別限制,惟留置時間過長時,由於到達觸媒層之廢水的氣體與液體之分散性降低,而且,擴散部3為充填物層時,壓力損失增加且發生能量損失,其效果並未提高。因此,擴散部3中之廢水留置時間係以1800秒以下(包含1800秒)為佳,以500秒以下(包含500秒)更佳,以100秒以下(包含100秒)又更佳,以50秒以下(包含50秒)為特佳。   上述擴散部2中之廢水留置時間為0.5秒以上(包含0.5秒),擴散部2與擴散部3中之廢水留置時間的合計為5秒以上(包含5秒)。擴散部2中之廢水留置時間的上限並無特別限制,惟廢水留置時間過長時,會有供給到擴散部3的廢水中之氣體與液體的分散性降低的情形,而且,該設備相對於待處理的廢水量而言過大,在經濟上亦為不利。因此,擴散部2中之廢水留置時間係以700秒以下(包含700秒)為佳。   上述擴散部1中之廢水留置時間為0.5秒以上(包含0.5秒),以1秒以上(包含1秒)為佳,以2秒以上(包含2秒)更佳。廢水留置時間之上限並無特別限制,留置時間過長時,會有供給到上述擴散部2的廢水中之氣體與液體的分散性降低的情形,而且,該設備相對於待處理的廢水量而言過大,在經濟上亦為不利。因此,擴散部1中之廢水留置時間的上限係以2500秒以下(包含2500秒)為佳,以1000秒以下(包含1000秒)更佳,以600秒以下(包含600秒)又更佳,以300秒以下(包含300秒)為特佳。   一實施型態中,本型態之處理方法係,上述氣體-液體擴散部1在廢水供給側之交界面具有分散板1,上述氣體-液體擴散部2在與上述氣體-液體擴散部1之交界面具有分散板2,此時,上述分散板1及上述分散板2各自具有1個以上(包含1個)之孔,上述分散板1及上述分散板2之至少一者具有開孔率0.005%~30%之多孔板構造。   上述多孔板構造之開孔率係以0.05%以上(包含0.05%)為佳,以0.1%以上(包含0.1%)更佳,以0.5%以上(包含0.5%)又更佳,以1%以上(包含1%)為特佳。而且,上述開孔率係以10%以下(包含10%)為佳,以5%以下(包含5%)更佳。在如此範圍內,可防止因攪拌效果引起的不平衡流動且使廢水中所含的氣體分佈均勻。因此,可改善氣液接觸而提高觸媒的處理性能。   分散板之開孔率的求算方法、多孔板之孔數以及孔的形狀係與上述廢水處理裝置(第1型態)中之分散板相同,故省略說明。   本發明之其它反應條件係可列舉以下之(i)~(iv)。   本發明之處理方法的較佳者係以進一步滿足以下之(i)~(iv):   (i)上述觸媒層中之LHSV為0.1 hr-1 ~10 hr-1 ;   (ii)上述觸媒層中之廢水溫度為80℃~370℃;   (iii)上述觸媒層中之壓力係保持至少一部分的廢水為液相之壓力;以及   (v)上述氣體中所含的氧量為廢水中之被氧化物的理論需氧量的0.5倍~5.0倍。   以下,對於(i)~(iv)進行說明。   (i)觸媒層中之LHSV(液體空間速度:Liquid Hourly Space Velocity)   LHSV為0.1 hr-1 ~10 hr-1 ,以0.2 hr-1 ~5 hr-1 為佳,以0.3 hr-1 ~3 hr-1 更佳。LHSV為0.1 hr-1 以上(包含0.1 hr-1 )時,可用經濟高效的設備實施。而且,LHSV為10 hr-1 以下(包含10 hr-1 )時,可充分地進行反應塔內之廢水的氧化/分解處理。   (ii)觸媒層中之廢水溫度   觸媒層中之廢水溫度為80℃~370℃,以100℃~270℃為佳,以110℃~270℃更佳,以200℃~270℃為特佳。廢水溫度超出370℃時,為了保持廢水之液相狀態而不得不施加高壓,在此情況下,設備會有變大的情形,而有增加運行成本的情形。廢水溫度未達80℃時,廢水中之被氧化物的氧化/分解處理會有難以有效地進行之情形。   (iii)觸媒層中之壓力   本型態之裝置中,觸媒層中之壓力係廢水之至少一部分保持液相之壓力。由於至少一部分的廢水保持液相,故以因應廢水的處理溫度適當地調整壓力為佳。   具體上係如以下之例示。   •當處理溫度為80℃以上(包含80℃)且未達95℃時   如為大氣壓力以上(包含大氣壓力)即可,從經濟性之觀點上,可為大氣壓力,然為了提高處理效率,以加壓為佳。   •當處理溫度為95℃以上(包含95℃)且未達170℃時   則為0.2~1MPa(Gauge)左右之壓力   •當處理溫度為170℃以上(包含170℃)且未達230℃時   為1~5MPa(Gauge)左右之壓力   •當處理溫度為230℃以上(包含230℃)時   則為超出5MPa(Gauge)左右之壓力   另外,上述處理溫度之範圍中之壓力上限僅為粗略的標準,可通過處理效率及裝置的耐壓性之間的平衡決定。具體之上限值為21MPa以下(包含21MPa),以10MPa以下(包含10MPa)為佳,以8MPa以下(包含8MPa)為特佳。而且,壓力之上限係在觸媒層中之廢水溫度的飽和蒸氣壓的2倍以下(包含2倍),以1.5倍以下(包含1.5倍)為佳。   (iv)氣體中所含之氧量   根據後述「理論需氧量」的定義,氣體中所含之氧量為廢水中的被氧化物之理論需氧量的0.5〜5.0倍。該氧量係以廢水中的被氧化物之理論需氧量的0.7倍以上(包含0.7倍)為佳,並以5.0倍以下(包含5.0倍)為佳,以3.0倍以下(包含3.0倍)更佳。   本型態之處理方法中,廢水處理裝置係以使用上述第1型態之處理裝置為佳。   <本發明之具體態樣之說明>   以下,對於使用本發明之第1型態的廢水處理裝置(本說明書,亦稱為「本發明之廢水處理裝置」)之廢水處理方法進行具體說明。第1圖係呈示採用作為氧化處理步驟之一的濕式氧化處理時之廢水處理方法的一個實施態樣之概略圖,惟本發明之一個型態的廢水處理裝置所使用之處理方法並不限定於此。<Second aspect: Treatment method of waste water> According to another aspect of the present invention, there is provided a treatment method of waste water, which uses at least a gas-liquid diffusion section 1 and a gas-liquid diffusion section in order from a supply side of the wastewater. 2. Wastewater treatment method for the gas-liquid diffusion section 3 and the device of the catalyst layer, the above-mentioned wastewater has a gas dispersion and satisfies the following (1) to (3): (1) the above-mentioned gas-liquid diffusion section 1 to The above-mentioned wastewater indwelling time in 3 are all 0.5 seconds or more (including 0.5 seconds); (2) The total indwelling time of the wastewater in the gas-liquid diffusion unit 3 and the gas-liquid diffusion unit 2 is 5 seconds or more (including 5 Seconds); and (3) The total of the wastewater indwelling time in (2) above is 0.1 to 100 times the wastewater indwelling time in the gas-liquid diffusion section 1 described above. In the device of this type, the catalyst layer is the same as the catalyst layer of the above-mentioned wastewater treatment device (the first type), so the description is omitted. This type of device has gas-liquid diffusion sections 1 to 3 as a means for uniformly dispersing scale components and a gas (especially oxygen). The gas-liquid diffusion unit 1 (also referred to as "diffusion unit 1" in this specification) refers to the space between the gas-liquid dispersion unit and the gas-liquid dispersion unit from the supply side of the wastewater, or the dispersion plate and the filling layer. The space between the surfaces of the wastewater supply side; or the filling layer. The diffusion portion 1 corresponds to, for example, a range indicated by H1 in the second figure. The gas-liquid diffusion section 2 (also referred to as "diffusion section 2" in this specification) refers to the space between the gas-liquid dispersion section and the gas-liquid dispersion section from the supply side of the wastewater, or the dispersion plate and the filling layer. The space between the waste water supply side or the space between the waste water discharge side of the filling layer and the waste water supply side of the filling layer; or the filling layer. The diffusion portion 2 corresponds to, for example, a range indicated by H2 in the second figure. The gas-liquid diffusion portion 3 (also referred to as "diffusion portion 3" in this specification) refers to the space or filling layer between the gas-liquid dispersion portion and the surface of the catalyst layer on the wastewater supply side from the wastewater supply side. The space between the surface on the waste water discharge side and the surface on the waste water supply side of the catalyst layer; or a filling layer. The diffusion portion 3 corresponds to, for example, a range indicated by H3 in the second figure. When the filler layer has a two-layer structure, the total of the two layers corresponds to the diffusion portion 3, for example, it corresponds to the range shown by H3 + H7 in FIG. 4. In this type of processing method, at least one of the gas-liquid dispersion sections 1 to 3 is a filling layer. The filling layer may be one layer or two or more layers (including two layers). In addition, the filling layer of the device of this type is the same as the filling layer of the above-mentioned waste water treatment device (the first type), so the description is omitted. The gas-liquid dispersion unit is a member that can prevent the unbalanced flow by the stirring effect and can evenly distribute the gas contained in the waste water, and examples include a dispersion plate. The dispersion plate of the device of this type is the same as the dispersion plate of the above-mentioned wastewater treatment device (the first type), so the description is omitted. In this type of treatment method, gas is dispersed in the wastewater. This type of device improves gas-liquid contact by having at least three gas-liquid diffusion sections, which can improve the processing performance of the catalyst. In the treatment method of this type, the wastewater indwelling time in the gas-liquid diffusion section satisfies the conditions (1) to (3) above. Hereinafter, (1) to (3) will be described. (1) The wastewater indwell time in the gas-liquid diffusion sections 1 to 3 are all 0.5 seconds or more (including 0.5 seconds). When the wastewater indwelling time is less than 0.5 seconds, the gas-liquid mixing effect is insufficient, and the effects of the present invention cannot be exhibited. The wastewater indwelling time is preferably 2 to 300 seconds. (2) The total of the wastewater indwell time in the gas-liquid diffusion section 3 and the gas-liquid diffusion section 2 is 5 seconds or more (including 5 seconds). When the total indwelling time of the wastewater is less than 5 seconds, the scale components are unevenly distributed, and the scale components may reach the catalyst layer in an ionic state. Therefore, the surface of the catalyst layer may be poisoned by the scale components. The lower limit of the total waste water retention time is preferably 10 seconds or more (including 10 seconds), more preferably 35 seconds or more (including 35 seconds), and even more preferably 60 seconds or more (including 60 seconds). There is no particular limitation on the total upper limit of the waste water retention time, but the total waste water retention time in the diffusion unit 2 and the diffusion unit 3 is preferably 2500 seconds or less (including 2500 seconds), and 1500 seconds or less (including 1500 seconds). More preferably, it is more preferably 750 or less (including 750 seconds), and particularly preferably 300 or less (including 300 seconds). (3) The total of the wastewater indwelling time in (2) above is 0.1 to 100 times the wastewater indwelling time in the gas-liquid diffusion section 1 described above. Compared with the waste water retention time in the gas-liquid diffusion unit 1, when the total waste water retention time in (2) is less than 0.1 times or exceeds 100 times, the gas-liquid mixing effect is insufficient, and an unbalanced flow of scale components is likely to occur. Therefore, scale components will be locally accumulated, which will reduce the processing efficiency. Compared to the wastewater indwelling time in the gas-liquid diffusion section 1 described above, the total of the wastewater indwelling time in (2) above is preferably 0.2 times or more (including 0.2 times), more preferably 0.3 times or more (including 0.3 times), It is preferably 80 times or less (including 80 times), and more preferably 50 times or less (including 50 times). When the gas-liquid diffusion part is a filling layer, when the waste water retention time is 0.5 seconds or more (including 0.5 seconds), it is not necessary to consider the porosity of the filling layer. The porosity of the filling layer is generally 20 to 90% by volume (based on the total volume of the filling layer), preferably 30 to 70% by volume, and more preferably 35 to 60% by volume. When the porosity decreases, the degree of turbulence in the filling layer increases, and the same effect as that of extending the residence time of the wastewater can be obtained. In addition, even if the gas-liquid diffusion section is composed of two or more (including two) filling layers, the wastewater indwelling time in the gas-liquid diffusion section satisfies the conditions (1) to (3) described above. The residence time of the waste water in the gas-liquid diffusion section can be appropriately controlled by the supplied waste water flow rate and the size of the device. The wastewater indwelling time can be calculated by the method described in the examples. In a preferred embodiment, the diffusion portion 3 is a filling layer having a porosity of 20 to 90% by volume (based on the total volume of the filling layer). The porosity is preferably 30 to 70% by volume, more preferably 35 to 60% by volume, and particularly preferably 35 to 55% by volume. In addition, when the diffusion portion 3 is a filler layer, the more preferable one of the diffusion portion 2 and the diffusion portion 1 is not a type of a filler layer. In a preferred embodiment, the diffusion portion 3 is a two-layered filling layer. Since the filler layer has a two-layer structure, the catalyst processing performance can be maintained to a high degree. The wastewater indwelling time in the diffusion part 3 is 0.5 seconds or more (including 0.5 seconds), preferably 5 seconds or more (including 5 seconds), more preferably 8 seconds or more (including 8 seconds), and 10 seconds or more (including 10 seconds). Seconds) is particularly good. When it is less than 0.5 second, the effect of the present invention cannot be sufficiently obtained. The upper limit of the wastewater indwelling time is not particularly limited, but when the indwelling time is too long, the dispersion of the gas and the liquid in the wastewater reaching the catalyst layer decreases, and when the diffusion portion 3 is a filling layer, the pressure loss increases and energy is generated Loss, its effect has not improved. Therefore, the wastewater indwelling time in the diffusion section 3 is preferably 1800 seconds or less (including 1800 seconds), more preferably 500 seconds or less (including 500 seconds), and even more preferably 100 seconds or less (including 100 seconds), and more preferably 50 seconds. It is particularly good if it is less than or equal to 50 seconds. The wastewater indwelling time in the diffusion unit 2 is 0.5 seconds or more (inclusive), and the total wastewater indwelling time in the diffusion unit 2 and the diffusion unit 3 is 5 seconds or more (inclusive). The upper limit of the wastewater indwelling time in the diffusion section 2 is not particularly limited, but when the wastewater indwelling time is too long, the dispersibility of the gas and liquid in the wastewater supplied to the diffusion section 3 may decrease, and the equipment is relatively The amount of wastewater to be treated is too large and it is also economically disadvantageous. Therefore, the wastewater indwelling time in the diffusion section 2 is preferably 700 seconds or less (including 700 seconds). The wastewater indwelling time in the diffusion unit 1 is 0.5 seconds or more (including 0.5 seconds), preferably 1 second or more (including 1 second), and more preferably 2 seconds or more (including 2 seconds). The upper limit of the wastewater indwelling time is not particularly limited. When the indwelling time is too long, the dispersibility of the gas and liquid in the wastewater supplied to the diffusion section 2 may be reduced. In addition, the equipment is relatively small relative to the amount of wastewater to be treated. Excessive words are also economically disadvantageous. Therefore, the upper limit of the wastewater indwelling time in the diffusion section 1 is preferably 2500 seconds or less (including 2500 seconds), more preferably 1000 seconds or less (including 1000 seconds), and even more preferably 600 seconds or less (including 600 seconds), Particularly preferred is 300 seconds or less. In an implementation form, the processing method of this form is such that the gas-liquid diffusion part 1 has a dispersion plate 1 at the interface of the wastewater supply side, and the gas-liquid diffusion part 2 is disposed between the gas-liquid diffusion part 2 and the gas-liquid diffusion part 1. The interface has a dispersion plate 2. At this time, each of the dispersion plate 1 and the dispersion plate 2 has one or more holes, and at least one of the dispersion plate 1 and the dispersion plate 2 has an opening ratio of 0.005. % ~ 30% porous plate structure. The porosity of the above porous plate structure is preferably 0.05% or more (including 0.05%), more preferably 0.1% or more (including 0.1%), more preferably 0.5% or more (including 0.5%) and even more preferably, 1% or more (Including 1%) is particularly good. The above-mentioned porosity is preferably 10% or less (including 10%), and more preferably 5% or less (including 5%). Within such a range, an unbalanced flow due to the stirring effect can be prevented and the gas distribution in the wastewater can be made uniform. Therefore, the gas-liquid contact can be improved to improve the processing performance of the catalyst. The method for calculating the open porosity of the dispersion plate, the number of holes in the porous plate, and the shape of the holes are the same as those of the dispersion plate in the above-mentioned waste water treatment apparatus (the first type), so descriptions are omitted. Other reaction conditions of the present invention include the following (i) to (iv). The treatment method of the present invention is preferably to further satisfy the following (i) to (iv): (i) the LHSV in the catalyst layer is 0.1 hr -1 to 10 hr -1 ; (ii) the catalyst The temperature of the wastewater in the layer is 80 ° C to 370 ° C; (iii) the pressure in the catalyst layer is the pressure to maintain at least a part of the wastewater in the liquid phase; and (v) the amount of oxygen contained in the gas is The theoretical oxygen demand of the oxide is 0.5 to 5.0 times. Hereinafter, (i) to (iv) will be described. (i) The LHSV (Liquid Hourly Space Velocity) in the catalyst layer is 0.1 hr -1 to 10 hr -1 , preferably 0.2 hr -1 to 5 hr -1 , and 0.3 hr -1 to 3 hr -1 is better. When LHSV is 0.1 hr -1 or more (including 0.1 hr -1 ), it can be implemented with cost-effective equipment. When the LHSV is 10 hr -1 or less (including 10 hr -1 ), the oxidation / decomposition treatment of the wastewater in the reaction tower can be sufficiently performed. (ii) Temperature of wastewater in the catalyst layer The temperature of the wastewater in the catalyst layer is 80 ° C to 370 ° C, preferably 100 ° C to 270 ° C, more preferably 110 ° C to 270 ° C, and 200 ° C to 270 ° C. good. When the temperature of the wastewater exceeds 370 ° C, high pressure has to be applied in order to maintain the liquid phase state of the wastewater. In this case, the equipment may become larger and the operating cost may increase. When the temperature of the wastewater is less than 80 ° C, it may be difficult to effectively perform oxidation / decomposition treatment of oxides in the wastewater. (iii) Pressure in the catalyst layer In this type of device, the pressure in the catalyst layer is the pressure at which at least a part of the wastewater is maintained in the liquid phase. Since at least a part of the wastewater remains in the liquid phase, it is preferable to appropriately adjust the pressure in accordance with the temperature of the wastewater treatment. Specific examples are as follows. • When the processing temperature is 80 ° C or higher (including 80 ° C) and less than 95 ° C, it is sufficient to be atmospheric pressure or higher (including atmospheric pressure). From the economic point of view, it can be atmospheric pressure. However, in order to improve the processing efficiency, It is better to pressurize. • When the processing temperature is above 95 ° C (including 95 ° C) and below 170 ° C, the pressure is about 0.2 to 1 MPa (Gauge). • When the processing temperature is above 170 ° C (including 170 ° C) and below 230 ° C: A pressure of about 1 to 5 MPa (Gauge) • A pressure exceeding 5 MPa (Gauge) when the processing temperature is above 230 ° C (inclusive). In addition, the upper limit of the pressure in the above processing temperature range is only a rough standard. It can be determined by the balance between the processing efficiency and the pressure resistance of the device. The specific upper limit is 21 MPa or less (including 21 MPa), preferably 10 MPa or less (including 10 MPa), and particularly preferably 8 MPa or less (including 8 MPa). In addition, the upper limit of the pressure is preferably 2 times or less (including 2 times) the saturated vapor pressure of the temperature of the wastewater in the catalyst layer, and preferably 1.5 times or less (including 1.5 times). (iv) According to the definition of "theoretical oxygen demand" described later, the oxygen content in the gas is 0.5 to 5.0 times the theoretical oxygen demand of the oxide in the wastewater. The oxygen amount is preferably 0.7 times or more (including 0.7 times) the theoretical oxygen demand of the oxides in the wastewater, and preferably 5.0 times or less (including 5.0 times), and 3.0 times or less (including 3.0 times). Better. In this type of treatment method, the waste water treatment device is preferably a treatment device of the first type described above. <Description of Specific Aspects of the Present Invention> Hereinafter, a waste water treatment method using a waste water treatment apparatus of the first type of the present invention (this specification, also referred to as "a waste water treatment apparatus of the present invention") will be specifically described. FIG. 1 is a schematic diagram showing an embodiment of a wastewater treatment method when a wet oxidation treatment is used as one of the oxidation treatment steps, but the treatment method used by a type of wastewater treatment device of the present invention is not limited herein.

從廢水供給源所供給之廢水係通過廢水供給管線10供給至廢水供給泵3,進而送至熱交換器2。此時之空間速度並無特別限定,可依觸媒之處理能力而適當地決定。The waste water supplied from the waste water supply source is supplied to the waste water supply pump 3 through the waste water supply line 10, and is further sent to the heat exchanger 2. The space velocity at this time is not particularly limited, and can be appropriately determined depending on the processing capacity of the catalyst.

本發明之廢水處理裝置中,濕式氧化處理可在含氧氣體之存在或不存在的任一條件下進行,然增加廢水中之氧濃度可提高廢水中所含被氧化物的氧化/分解效率,因此以將含氧氣體混入廢水中為佳。In the wastewater treatment device of the present invention, the wet oxidation treatment can be carried out in the presence or absence of oxygen-containing gas, but increasing the oxygen concentration in the wastewater can improve the oxidation / decomposition efficiency of the oxides contained in the wastewater. Therefore, it is better to mix the oxygen-containing gas into the wastewater.

在含氧氣體之存在下進行濕式氧化處理時,例如將含氧氣體自含氧氣體供給管線11導入,以壓縮機4升壓後,廢水供給至熱交換器2之前混入廢水中為佳。本發明中,「含氧氣體」係含有分子狀氧及/或臭氧之氣體,如為此氣體時,可為純氧、富氧氣體、空氣、過氧化氫水溶液及其它之工廠產生的含氧氣體等,含氧氣體之種類並無特別限定,從經濟性之觀點上,該等之中,建議使用空氣。When performing wet oxidation treatment in the presence of an oxygen-containing gas, for example, it is preferable to introduce the oxygen-containing gas from the oxygen-containing gas supply line 11 and pressurize it with the compressor 4 before mixing the waste water into the waste water before supplying it to the heat exchanger 2. In the present invention, the "oxygen-containing gas" refers to a gas containing molecular oxygen and / or ozone. If this gas is used, it may be pure oxygen, an oxygen-enriched gas, air, an aqueous hydrogen peroxide solution, and other oxygen-containing gases produced in factories. There is no particular limitation on the type of the gas such as the oxygen-containing gas, and from the viewpoint of economy, it is recommended to use air.

含氧氣體供給至廢水時之供給量並無特別限定,只要供給可提高廢水中之被氧化物的氧化/分解能力之有效量即可。含氧氣體之供給量係例如藉由在含氧氣體供給管線11上設置含氧氣體流量調節閥(未圖示)等而可適當地調整對廢水的供給量。較佳之含氧氣體的供給量係推薦廢水中之被氧化物的理論需氧量之0.5倍以上(包含0.5倍),以0.7倍以上(包含0.7倍)更佳,以5.0倍以下(包含5.0倍)為佳,以3.0倍以下(包含3.0倍)更佳。The supply amount of the oxygen-containing gas when it is supplied to the wastewater is not particularly limited as long as it is supplied in an effective amount that can increase the oxidation / decomposition ability of the oxide in the wastewater. The supply amount of the oxygen-containing gas is, for example, an oxygen-containing gas flow regulating valve (not shown) provided in the oxygen-containing gas supply line 11 to appropriately adjust the supply amount of wastewater. The preferred supply of oxygen-containing gas is 0.5 times or more (including 0.5 times) the theoretical oxygen demand of the oxides in the recommended wastewater, more preferably 0.7 times or more (including 0.7 times), and 5.0 times or less (including 5.0 times). Times), more preferably 3.0 times or less (including 3.0 times).

另外,本發明中,「理論需氧量」係指將廢水中的有機化合物及氮化合物等之被氧化物氧化及/或分解成氮氣、二氧化碳、水及灰分所需的氧量,在本發明中,理論需氧量係由化學需氧量(COD(Cr))表示。In addition, in the present invention, "theoretical oxygen demand" means the amount of oxygen required to oxidize and / or decompose organic compounds and nitrogen compounds in wastewater into nitrogen, carbon dioxide, water, and ash in the present invention. In theory, the theoretical oxygen demand is expressed by chemical oxygen demand (COD (Cr)).

送至熱交換器2之廢水被預熱。然而,在熱交換器2內部有1/2以上的廢水蒸發的條件下,廢水中的有機物及水垢成分堆積在熱交換器2內,導致熱交換效率降低、管道堵塞、因體積的急遽膨脹而導致出口側排管部的負荷、由於在反應塔的液化導致的氣槌現象等之問題。因此,以可耐受對應於加熱溫度的壓力之構造為佳。   在熱交換器2中被預熱的廢水係供給至具備加熱手段8(加熱器或熱介質)的反應塔1(本發明之廢水處理裝置)。加熱手段8係反應塔內之廢水溫度以具有可加熱至上述「(ii)觸媒層之廢水溫度」中記載之範圍的能力者為佳。 而且,熱交換器2及反應塔1係以可耐受上述「(iii)觸媒層中之壓力」中記載之壓力的構造為佳。The waste water sent to the heat exchanger 2 is preheated. However, under the condition that more than 1/2 of the waste water in the heat exchanger 2 is evaporated, the organic matter and scale components in the waste water are accumulated in the heat exchanger 2, which results in a decrease in heat exchange efficiency, clogging of pipes, and rapid expansion of volume. This causes problems such as the load on the outlet side pipe section, the gas hammer phenomenon caused by the liquefaction in the reaction tower, and the like. Therefore, a structure capable of withstanding the pressure corresponding to the heating temperature is preferred.预 The waste water preheated in the heat exchanger 2 is supplied to a reaction tower 1 (a waste water treatment device of the present invention) provided with a heating means 8 (a heater or a heat medium). It is preferable that the temperature of the waste water in the heating means 8 system reaction tower is capable of heating to the range described in "(ii) Wastewater temperature of the catalyst layer" described above. The heat exchanger 2 and the reaction tower 1 preferably have a structure capable of withstanding the pressure described in the "(iii) Pressure in the catalyst layer" described above.

而且,廢水之加熱順序並無特別限定,如上所述,可在反應塔外部預熱後在反應塔內進一步加熱,亦可僅在反應塔內加熱。而且,對於廢水之加熱方法亦無特別限定,可使用加熱器、熱交換器,而且亦可在反應塔內設置加熱器將廢水加熱。亦可進一步在廢水中供給蒸氣等之熱源。In addition, the heating sequence of the waste water is not particularly limited. As described above, it may be further heated in the reaction tower after being preheated outside the reaction tower, or may be heated only in the reaction tower. In addition, there is no particular limitation on the method of heating wastewater. A heater or heat exchanger can be used, and a heater can be installed in the reaction tower to heat the wastewater. A heat source such as steam may be further supplied to the wastewater.

加壓下進行處理時,可在反應塔之下游裝設壓力調整機構。例如第1圖所示,可藉由在氣液分離器的排氣出口側裝設壓力控制閥7等之習知手段控制。只要控制壓力的控制範圍以可維持反應塔中上述「(iii)觸媒層中的壓力」所記載之條件即可。When processing under pressure, a pressure adjustment mechanism can be installed downstream of the reaction tower. For example, as shown in FIG. 1, it can be controlled by conventional means such as installing a pressure control valve 7 on the exhaust outlet side of the gas-liquid separator. What is necessary is just to control the control range of the pressure so that the conditions described in the "(iii) pressure in a catalyst layer" in the reaction tower can be maintained.

而且,本發明中使用之濕式氧化處理中,反應塔之數量、種類及形狀等並無特別限定,可使用單數或組合複數種之反應塔。反應塔可為單管式亦可為多管式。設置複數個反應塔時,可根據目的而任意配置直列或並列之反應塔等。Further, in the wet oxidation treatment used in the present invention, the number, type, shape, and the like of the reaction towers are not particularly limited, and a single or plural reaction towers may be used. The reaction tower may be a single-tube type or a multi-tube type. When a plurality of reaction towers are installed, in-line or side-by-side reaction towers can be arbitrarily arranged according to the purpose.

對反應塔供給廢水之方法方面,可使用氣液向上並流,氣液向下並流,氣液對流等各種型態,而且,在設置複數個反應塔時,可組合2種以上(包含2種)之該等供給方法。As for the method of supplying wastewater to the reaction tower, various types of gas-liquid co-current, gas-liquid co-current, and gas-liquid convection can be used. In addition, when multiple reaction towers are installed, two or more types can be combined (including 2 Types) of these supply methods.

反應塔中,在使用上述濕式氧化觸媒時,除了提高廢水中所含之有機化合物、氮化合物以及硫化合物之任1種以上(包含1種)等之被氧化物的氧化/分解處理效率,同時維持長期間優異之觸媒活性、觸媒耐久性,並可得到廢水經高等級淨化之處理水。When using the above-mentioned wet oxidation catalyst in a reaction tower, in addition to improving the oxidation / decomposition treatment efficiency of any one or more (including one) organic compounds, nitrogen compounds, and sulfur compounds contained in the wastewater At the same time, it maintains excellent catalyst activity and catalyst durability for a long period of time, and can obtain treated water with high-level purification of wastewater.

在使用複數個反應塔時,可分別使用不同的觸媒。而且,亦可組合充填觸媒之反應塔(本發明之廢水處理裝置)與不使用觸媒之反應塔。When using a plurality of reaction towers, different catalysts can be used respectively. Moreover, a catalyst-filled reaction tower (the wastewater treatment apparatus of the present invention) and a reaction tower not using a catalyst may be combined.

廢水中之被氧化物在反應塔內經氧化/分解處理,惟本發明中之「氧化/分解處理」係例示如:將乙酸轉化為二氧化碳與水之氧化分解處理;將乙酸轉化為二氧化碳與甲烷之去羧分解處理;將硫化物、氫硫化物、亞硫酸鹽,硫代硫酸鹽轉化為硫酸鹽之氧化處理;將二甲基亞碸轉化為二氧化碳、水、硫酸根離子等之灰分的氧化及氧化分解處理;將尿素轉化為氨與二氧化碳之水解處理;將氨或肼轉化為氮氣與水的氧化分解處理;將二甲基亞碸轉化為二甲基碸或甲磺酸之氧化處理等,意即,係包含將易分解性的被氧化物分解成氮氣、二氧化碳、水及灰分等為止之分解處理、將難分解性之有機化合物及氮化合物的分子量降低之分解處理,或進行氧化之氧化處理等各種的氧化及/或分解之意。The oxides in the wastewater are subjected to oxidation / decomposition treatment in the reaction tower, but the "oxidation / decomposition treatment" in the present invention is exemplified as: oxidative decomposition treatment for converting acetic acid into carbon dioxide and water; Decarboxylation decomposition treatment; oxidation treatment to convert sulfide, hydrosulfide, sulfite, thiosulfate to sulfate; oxidation of ash to convert dimethylsulfine to carbon dioxide, water, sulfate ion, etc. Oxidative decomposition treatment; hydrolysis treatment that converts urea to ammonia and carbon dioxide; oxidative decomposition treatment that converts ammonia or hydrazine to nitrogen and water; oxidative treatment that converts dimethylsulfine to dimethylphosphonium or methanesulfonic acid, etc. In other words, the decomposition treatment includes decomposition treatment until the easily decomposable oxide is decomposed into nitrogen, carbon dioxide, water, ash, etc., decomposition treatment for reducing the molecular weight of the hardly decomposable organic compound and nitrogen compound, or oxidation oxidation. Various treatments such as oxidation and / or decomposition.

而且,在通過不使用觸媒之濕式氧化處理而得的處理液中,被氧化物中之難分解性的有機化合物多殘存低分子量,低分子量之有機化合物方面,多殘留低分子量之有機酸,尤其是乙酸。然而,在使用如本發明之觸媒的方法中,藉由提高反應溫度、增加觸媒量而可降低該等之殘留量。In addition, in the treatment liquid obtained by wet oxidation treatment without using a catalyst, low-molecular-weight, low-molecular-weight organic compounds are often left in organic compounds that are difficult to decompose in the oxide, and low-molecular-weight organic acids are left in , Especially acetic acid. However, in the method using the catalyst of the present invention, the residual amount of these can be reduced by increasing the reaction temperature and increasing the amount of the catalyst.

第1圖係具體地呈示其處理例,廢水係在反應塔1經氧化/分解處理之後,從處理液管線12取出處理液,根據需要在冷卻器9適當冷卻後,通過氣液分離器5分離成氣體與液體。此時,使用液位控制器LC檢測液位狀態,以藉由液位控制閥6使氣液分離器內之液位控制為恆定者為佳。而且,使用壓力控制器PC檢測壓力狀態,並且通過壓力控制閥7將氣液分離器內之壓力控制為恆定者為佳。FIG. 1 shows a specific example of the treatment. The wastewater is taken out from the treatment liquid line 12 after the reaction tower 1 is subjected to oxidation / decomposition treatment. If necessary, it is cooled by the cooler 9 and then separated by the gas-liquid separator 5. Into gas and liquid. At this time, it is better to use the liquid level controller LC to detect the liquid level state, and to control the liquid level in the gas-liquid separator to be constant by the liquid level control valve 6. Furthermore, it is preferable to use a pressure controller PC to detect the pressure state, and control the pressure in the gas-liquid separator to be constant through the pressure control valve 7.

壓力控制閥之位置係只要可維持/控制氣液分離器之前設置等的反應塔內的處理條件之範圍,可適當地變更。The position of the pressure control valve can be appropriately changed as long as it can maintain / control the processing conditions in the reaction tower installed before the gas-liquid separator.

此處,氣液分離器內之溫度並無特別限定,惟在反應塔將廢水進行氧化/分解處理而得的處理液中因含有二氧化碳,故以例如藉由提高氣液分離器內之溫度使釋出廢水中之二氧化碳,或經氣液分離器分離後之液體以空氣等之氣體進行起泡處理而釋出液體中之二氧化碳者為佳。Here, the temperature in the gas-liquid separator is not particularly limited. However, since the treatment liquid obtained by subjecting the wastewater to oxidation / decomposition treatment contains carbon dioxide, the temperature in the gas-liquid separator may be increased by, for example, increasing the temperature in the gas-liquid separator. Carbon dioxide in the wastewater is released, or the liquid separated by the gas-liquid separator is bubbled with air and other gas to release carbon dioxide in the liquid.

處理液之溫度控制中,可將處理液供給至氣液分離器5之前經由熱交換器2、冷卻器9等之冷卻手段冷卻、亦可在氣液分離之後裝設熱交換器(無圖示)或冷卻器(無圖示)等之冷卻手段將處理液進行冷卻。In the temperature control of the processing liquid, the processing liquid can be cooled by cooling means such as the heat exchanger 2 and the cooler 9 before being supplied to the gas-liquid separator 5, or a heat exchanger (not shown) can be installed after the gas-liquid separation. ) Or a cooling means (not shown) to cool the processing liquid.

在氣液分離器5分離而得之液體(處理液)係由處理液排出管線14排出。經排出之液體可進一步經生物處理或膜分離處理等之各種習知步驟進一步施行淨化處理。更且,經濕式氧化處理而得之處理液的一部分在進行濕式氧化處理之前直接返回到廢水中、或者從廢水供給管線之任意位置供給至廢水中、或進行濕式氧化處理。例如亦可將經濕式氧化處理而得之處理液作為廢水之稀釋水使用而降低廢水之TOD濃度或COD濃度。而且,在氣液分離器5分離而得之氣體係由氣體排出管線13排出外界。另外,排出的廢氣可進一步進行其它步驟。而且,在進行本發明中使用之濕式氧化處理時,熱交換器亦可用於加熱器及冷卻器,並且該等熱交換器可適當組合使用。 實施例The liquid (treatment liquid) separated in the gas-liquid separator 5 is discharged from the treatment liquid discharge line 14. The discharged liquid can be further purified by various conventional steps such as biological treatment or membrane separation treatment. Furthermore, a part of the treatment liquid obtained by the wet oxidation treatment is directly returned to the wastewater before being subjected to the wet oxidation treatment, or is supplied to the wastewater from an arbitrary position of the wastewater supply line, or the wet oxidation treatment is performed. For example, the treatment liquid obtained by the wet oxidation treatment can also be used as dilution water of wastewater to reduce the TOD concentration or COD concentration of wastewater. Moreover, the gas system separated in the gas-liquid separator 5 is discharged to the outside through the gas discharge line 13. In addition, the exhaust gas can be further subjected to other steps. In addition, when performing the wet oxidation treatment used in the present invention, a heat exchanger may be used for a heater and a cooler, and these heat exchangers may be used in appropriate combinations. Examples

以下,參照實施例及比較例以更詳細地說明本發明,惟本發明並不限定於此。Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited thereto.

[實施例1]   實施例1之反應塔的細節呈示於第2圖。設置在直徑600mm、長度9000mm之圓柱狀的反應塔1之由網格及金屬網而成的支撐座上,將直徑600mm、長度5~8mm(平均長度6.5mm)之圓柱狀的SUS製丸狀物(平均粒徑8.5mm)在高度方向上充填100mm(H3)(下部充填物層16;擴散部3)。該丸狀物之比重約為7.9,孔隙率為43%。[Example 1] The details of the reaction tower of Example 1 are shown in FIG. 2. It is installed on a support base made of a grid and a metal net of a cylindrical reaction tower 1 with a diameter of 600 mm and a length of 9000 mm, and a cylindrical SUS pellet shape with a diameter of 600 mm and a length of 5 to 8 mm (average length 6.5 mm). An object (average particle diameter: 8.5 mm) was filled with 100 mm (H3) in the height direction (lower filler layer 16; diffusion portion 3). The pellet had a specific gravity of about 7.9 and a porosity of 43%.

接著,下部充填物層16之上在高度方向7074mm(H4)充填固體觸媒2000L(觸媒層17)。使用之固體觸媒係以氧化鈦與鉑作為主成分所構成之觸媒,各自的重量比以TiO2 :Pt換算為99.0:1.0。而且,該固體觸媒之形狀係直徑4mmφ×長度6mm之丸狀物(平均粒徑7.2mm)。然後,該觸媒層17之上,與上述相同,在高度方向300mm(H5)充填SUS製丸狀物(上部充填物層18)。Next, a solid catalyst 2000L (catalyst layer 17) was filled on the lower filler layer 16 in a height direction of 7074 mm (H4). The solid catalyst used was a catalyst composed of titanium oxide and platinum as main components, and the weight ratio of each was 99.0: 1.0 in terms of TiO 2 : Pt. The shape of the solid catalyst is a pellet (diameter: 7.2 mm) with a diameter of 4 mmφ and a length of 6 mm. Then, similar to the above, the catalyst layer 17 is filled with SUS pellets (upper filling layer 18) in a height direction of 300 mm (H5).

下部充填物層16之下側(上游側)配置有多孔板15-1(氣體-液體分散部)以及附碰撞板之單孔板15-2(氣體-液體分散部),該等分散板之間的空間(擴散部1)之距離為950mm(H1),附碰撞板之單孔板15-2與下部充填物層16的廢水供給側之面之間的空間(擴散部2)之距離為10mm(H2),從多孔板15-1至觸媒層17入口(交界面)之距離為110mm(H6)。多孔板之開孔率係2.2%,多孔板中每1m2 均一配置53個之孔。A lower plate (upstream side) of the lower filling layer 16 is provided with a porous plate 15-1 (gas-liquid dispersion portion) and a single-well plate 15-2 (gas-liquid dispersion portion) with a collision plate. The distance between the spaces (diffusion section 1) is 950 mm (H1), and the distance between the single-hole plate 15-2 with collision plate and the surface on the waste water supply side of the lower filling layer 16 (diffusion section 2) is 10 mm (H2), and the distance from the perforated plate 15-1 to the entrance (interface) of the catalyst layer 17 is 110 mm (H6). The opening ratio of the perforated plate 2.2% based porous plate 2 uniformly arranged holes 53 of each of 1m.

(廢水物理試驗)   第1圖所示之廢水處理方法中,反應塔1係使用實施例1之反應塔,在下列條件下進行合計1000小時的廢水處理。從廢水供給管線10輸送之廢水通過廢水供給泵3以4m3 / hr的流量加壓、進料後,使反應塔之最高溫度成為250℃之方式以熱交換器2及電熱器(加熱手段8)進行調節,由反應塔1之底部供給。而且,由含氧氣體供給管線11供給空氣,以壓縮機4升壓後,以O2 /COD(Cr)(空氣中之氧量/化學需氧量)=1.5之比例的方式從熱交換器2的前部供給,混入該廢水。觸媒層中之LHSV為2.0hr-1 。將濕式氧化處理後之處理液經處理液管線12在冷卻器9冷卻後,經由氣液分離器5進行氣液分離處理。氣液分離器5中,由液位控制器(LC)檢測液位,並使液位控制閥6運作以保持恆定液面,同時通過壓力控制器(PC)檢測壓力,並使壓力控制閥7運作以保持7MPaG之壓力而操作。然後,經如此操作處理之處理液從處理液排出管線14排出。處理開始時之反應塔入口壓力(PI)為7.2MPaG。(Wastewater physical test) In the waste water treatment method shown in FIG. 1, the reaction tower 1 uses the reaction tower of Example 1 and performs a total of 1,000 hours of waste water treatment under the following conditions. The waste water delivered from the waste water supply line 10 is pressurized and fed at a flow rate of 4 m 3 / hr by the waste water supply pump 3, and the heat exchanger 2 and electric heater (heating means 8) are used so that the maximum temperature of the reaction tower becomes 250 ° C. ) Is adjusted and supplied from the bottom of the reaction tower 1. In addition, air is supplied from the oxygen-containing gas supply line 11 and is boosted by the compressor 4 from the heat exchanger such that O 2 / COD (Cr) (the amount of oxygen in the air / chemical oxygen demand) = 1.5. The front part of 2 is supplied, and this waste water is mixed. The LHSV in the catalyst layer was 2.0hr -1 . The treatment liquid after the wet oxidation treatment is cooled by the treatment liquid line 12 in the cooler 9, and then subjected to a gas-liquid separation treatment through a gas-liquid separator 5. In the gas-liquid separator 5, the liquid level is detected by a liquid level controller (LC), and the liquid level control valve 6 is operated to maintain a constant liquid level, while the pressure is detected by a pressure controller (PC), and the pressure control valve 7 Operate to maintain a pressure of 7 MPaG. Then, the processing liquid processed in this way is discharged from the processing liquid discharge line 14. The inlet pressure (PI) of the reaction tower at the beginning of the treatment was 7.2 MPaG.

用於處理之廢水係COD(Cr)=43g/L、pH=11,水垢成分係含有25mg/L之鈣、1 mg/L之鐵。The wastewater used for treatment is COD (Cr) = 43g / L, pH = 11, and the scale component contains 25mg / L of calcium and 1 mg / L of iron.

(COD(Cr)處理率)   1000小時反應後之COD(Cr)處理率為85%。COD(Cr)處理率係使用下述式求算。(COD (Cr) treatment rate) The COD (Cr) treatment rate after 8 hours of reaction is 85%. The COD (Cr) treatment rate is calculated using the following formula.

COD(Cr)處理率[%]=[廢水之COD(Cr)-處理液之COD(Cr)]/廢水之COD(Cr)×100COD (Cr) treatment rate [%] = [COD (Cr) of wastewater-COD (Cr) of treatment liquid] / COD (Cr) of wastewater × 100

(水垢成分之附著)   取出觸媒並以肉眼確認水垢成分之附著狀態,依照以下基準評定為B。(Adhesion of scale components) Remove the catalyst and confirm the adhesion state of scale components with the naked eye, and evaluate it as B according to the following criteria.

A:幾乎看不到任何附著。   B:看到些許附著。   C:看到明顯附著(褐色)。   (廢水之留置時間)   擴散部1~3中之廢水留置時間係使用以下之式求算出。擴散部1~3中之廢水留置時間呈示於表1-2。   廢水留置時間(秒)=擴散部之層長(mm)÷廢水流速(mm/秒)A: Hardly any adhesion was seen. B: I saw a little adhesion. C: Obvious adhesion (brown) was seen. (Wastewater indwelling time) Wastewater indwelling time in diffusion unit 1 to 3 is calculated using the following formula. The wastewater indwelling time in the diffusion sections 1 to 3 is shown in Table 1-2. Wastewater indwelling time (seconds) = layer length of the diffuser (mm) ÷ wastewater flow rate (mm / second)

[實施例2~7]   在實施例2~7,於實施例1之反應塔中,使用多孔板15-1與附碰撞板之單孔板15-2之間的距離H1以及自多孔板15-1至下部充填物層16入口之距離H2之值變更為表1-1所示之值的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表1,而且,廢水留置時間呈示於表1-2。[Examples 2 to 7] In Examples 2 to 7, in the reaction tower of Example 1, the distance H1 between the perforated plate 15-1 and the single-well plate 15-2 with the collision plate and the self-perforated plate 15 were used. -1 The reaction tower whose distance H2 from the inlet of the lower filling layer 16 was changed to the value shown in Table 1-1 was subjected to the above-mentioned wastewater treatment test. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 1, and the wastewater indwelling time is shown in Table 1-2.

[實施例8~9]   在實施例8~9,於實施例4之反應塔中,使用H1之值變更為表2-1所示之值的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表2-1,以及廢水留置時間呈示於表2-2。[Examples 8 to 9] In Examples 8 to 9, in the reaction tower of Example 4, a reaction tower whose value of H1 was changed to a value shown in Table 2-1 was used to perform the above-mentioned wastewater treatment test. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 2-1, and the wastewater indwelling time is shown in Table 2-2.

[比較例1]   比較例1中,於實施例1之反應塔中,使用H1之值變更為1200mm的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表3-1,以及廢水留置時間呈示於表3-2。[Comparative Example 1] In Comparative Example 1, in the reaction tower of Example 1, the above-mentioned wastewater treatment test was performed using a reaction tower whose value of H1 was changed to 1200 mm. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 3-1, and the wastewater indwelling time is shown in Table 3-2.

[比較例2]   比較例2中,於實施例1之反應塔中,使用H1及H2之值變更為表3-1所示之值的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表3-1,以及廢水留置時間呈示於表3-2。[Comparative Example 2] In Comparative Example 2, in the reaction tower of Example 1, the above-mentioned wastewater treatment test was performed using a reaction tower whose values of H1 and H2 were changed to the values shown in Table 3-1. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 3-1, and the wastewater indwelling time is shown in Table 3-2.

[比較例3]   比較例3中,於實施例1之反應塔中,使用H1及H2之值變更為表3-1所示之值且未充填下部充填物層16的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表3-1,以及廢水留置時間呈示於表3-2。[Comparative Example 3] In Comparative Example 3, in the reaction tower of Example 1, the above-mentioned wastewater was carried out by using a reaction tower in which the values of H1 and H2 were changed to the values shown in Table 3-1 without filling the lower filling layer 16 Processing test. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 3-1, and the wastewater indwelling time is shown in Table 3-2.

[表1-1] ※1000小時後的COD(Cr)處理率 [表1-2] [Table 1-1] ※ COD (Cr) treatment rate after 1000 hours [Table 1-2]

[表2-1] ※1000小時後的COD(Cr)處理率 [表2-2] [table 2-1] ※ COD (Cr) treatment rate after 1000 hours [Table 2-2]

[表3-1] ※1000小時後的COD(Cr)處理率 [表3-2] [Table 3-1] ※ COD (Cr) treatment rate after 1000 hours [Table 3-2]

如表1-1及2-1所示,可知在實施例1~9中,通過將H6及H6/H1設定在預定範圍內,可抑制觸媒中的水垢成分析出,從而可高度維持觸媒之處理性能。另一方面,如表3-1所示,可知在比較例1~3中,H6/H1或H6之值均不在本發明之範圍內,水垢成分明顯附著在觸媒上,且觸媒性能降低。   而且,如表1-2及2-2所示,可知在實施例1~9中,(1)擴散部1~3中之廢水留置時間、(1)擴散部3與擴散部2中之廢水留置時間的合計,以及(3)相對於擴散部1中之廢水留置時間的上述(2)廢水留置時間之合計在預定的範圍內,可抑制觸媒中的水垢成分析出,從而可高度維持觸媒之處理性能。另一方面,如表3-2所示,可知在比較例1~3中,均未滿足上述(1)~(3)之任一者,水垢成分明顯附著在觸媒上,且觸媒性能降低。As shown in Tables 1-1 and 2-1, it can be seen that in Examples 1 to 9, by setting H6 and H6 / H1 within a predetermined range, scale formation in the catalyst can be suppressed, and the contact can be highly maintained. Media processing performance. On the other hand, as shown in Table 3-1, in Comparative Examples 1 to 3, it can be seen that the values of H6 / H1 or H6 are not within the scope of the present invention, scale components are significantly attached to the catalyst, and the catalyst performance is reduced. . In addition, as shown in Tables 1-2 and 2-2, it can be seen that in Examples 1 to 9, (1) the wastewater indwelling time in the diffusion sections 1 to 3, (1) the wastewater in the diffusion sections 3 and 2, and The total indwell time and (3) the total of the above (2) the total indwelling time of waste water with respect to the indwelling time of waste water in the diffusion section 1 are within a predetermined range, which can inhibit the scale formation in the catalyst from being analyzed, and can be highly maintained Catalyst processing performance. On the other hand, as shown in Table 3-2, in Comparative Examples 1 to 3, none of the above (1) to (3) was satisfied, scale components were obviously attached to the catalyst, and the catalyst performance reduce.

[實施例10-14]   在實施例10-14,於實施例4之反應塔中,使用設置作為分散板15-1之多孔板的開孔率以及每1m2 之多孔板的孔數變更為表4所示之值的反應塔,進行上述廢水處理試驗。[Example 10-14] In Example 10-14, in the reaction tower of Example 4, the aperture ratio of the porous plate provided as the dispersion plate 15-1 and the number of holes per 1 m 2 of the porous plate were changed to The reaction tower having the values shown in Table 4 was subjected to the above-mentioned wastewater treatment test.

多孔板之開孔率係由以下之式求算之值。The porosity of the perforated plate is a value calculated from the following formula.

開孔率[%]=孔全體之截面積/分散板全體之截面積×100Opening rate [%] = cross-sectional area of the entire hole / cross-sectional area of the entire dispersion plate × 100

將結果呈示於表4。The results are shown in Table 4.

[表4] ※1000小時後的COD(Cr)處理率[Table 4] ※ COD (Cr) treatment rate after 1000 hours

如表4所示,可知觸媒之處理性能及水垢成分在觸媒的析出係可藉由多孔板之開孔率及每1m2 之孔數控制。As shown in Table 4, it can be seen that the processing performance of the catalyst and the precipitation of scale components in the catalyst can be controlled by the opening rate of the porous plate and the number of holes per 1 m 2 .

[實施例15-1~15-4]   將實施例15-1~15-4之反應塔的細節呈示於第3-1~3-4圖。H1~H6之值係如表5-1所示,與實施例4之反應塔為相同之值。對於分散板15-1~15-4,使用變更如以下之反應塔,進行上述廢水處理試驗。將結果呈示於表5-1及5-2。[Examples 15-1 to 15-4] The details of the reaction towers of Examples 15-1 to 15-4 are shown in Figs. 3-1 to 3-4. The values of H1 to H6 are shown in Table 5-1, and are the same values as the reaction tower of Example 4. For the dispersion plates 15-1 to 15-4, the above-mentioned wastewater treatment test was performed using a reaction tower modified as described below. The results are shown in Tables 5-1 and 5-2.

第3-1圖(實施例15-1):分散板15-1配置成為附碰撞板之單孔板、分散板15-2配置成為多孔板之裝置   第3-2圖(實施例15-2):分散板15-1及15-2作成多孔板之裝置   第3-3圖(實施例15-3):分散板15-1及15-2作成附碰撞板之單孔板的裝置   第3-4圖(實施例15-4):將附碰撞板之單孔板(15-4)與多孔板(15-3)再另外配置1片之的裝置。分散板15-3與分散板15-4之間隔設為150mm、分散板15-2與分散板15-3之間隔設為300mm。Figure 3-1 (Example 15-1): Dispersion plate 15-1 is configured as a single-well plate with collision plate, and dispersion plate 15-2 is configured as a perforated plate Figure 3-2 (Example 15-2) ): Device for making perforated plates 15-1 and 15-2 into a perforated plate Fig. 3-3 (Example 15-3): Device for making perforated plates with a collision plate for a diffuser 15-1 and 15-2. Figure -4 (Example 15-4): A device in which a single-well plate (15-4) with a collision plate and a porous plate (15-3) are additionally arranged. The distance between the dispersion plate 15-3 and the dispersion plate 15-4 is 150 mm, and the distance between the dispersion plate 15-2 and the dispersion plate 15-3 is 300 mm.

[比較例4]   比較例4之反應,如第3-5圖所示,係僅配置1片多孔板作為分散板之裝置。H2~H6之值係如表5-1所示,與實施例4之反應塔為相同之值。使用該反應塔,進行上述廢水處理試驗。將結果呈示於表5-1及5-2。[Comparative Example 4] 反应 The reaction of Comparative Example 4 is an apparatus in which only one perforated plate is arranged as a dispersion plate, as shown in Figs. 3-5. The values of H2 to H6 are shown in Table 5-1, and are the same values as the reaction tower of Example 4. Using this reaction tower, the above-mentioned wastewater treatment test was performed. The results are shown in Tables 5-1 and 5-2.

[表5-1] ※1000小時後的COD(Cr)處理率   [表5-2] [Table 5-1] ※ COD (Cr) treatment rate after 1000 hours [Table 5-2]

如表5-1及5-2所示,相對於下部充填物層之廢水的流動,藉由在上游側(廢水供給側)設置2片分散板,可抑制觸媒中的水垢成分析出,從而可高度維持觸媒之處理性能。而且,在實施例4,藉由設置多孔板(分散板15-2)作為分散板2、設置附碰撞板之單孔板(分散板15-1)作為分散板1,相較於實施例15-1~15-3,可抑制觸媒中的水垢成分析出,從而可高度維持觸媒之處理性能。更且,將實施例4與實施例15-4進行比較時,可知通過分散板的增設,可提高本發明的效果。As shown in Tables 5-1 and 5-2, with respect to the flow of wastewater in the lower filling layer, by setting two dispersion plates on the upstream side (wastewater supply side), the scale formation in the catalyst can be suppressed. Thereby, the processing performance of the catalyst can be highly maintained. Furthermore, in Example 4, a perforated plate (dispersion plate 15-2) was provided as the dispersion plate 2, and a single-well plate (dispersion plate 15-1) with a collision plate was provided as the dispersion plate 1, compared with Example 15 -1 ~ 15-3, can inhibit the formation of scale in the catalyst, so that the catalyst's processing performance can be highly maintained. Furthermore, when Example 4 is compared with Example 15-4, it can be seen that the effect of the present invention can be improved by adding the dispersion plate.

[實施例16]   在實施例16,於實施例4之反應塔中,使用H3之值變更為200mm之反應塔,進行上述廢水處理試驗。將結果呈示於表6-1及6-2。[Example 16] 16 In Example 16, in the reaction tower of Example 4, a reaction tower whose value of H3 was changed to 200 mm was used to perform the above-mentioned wastewater treatment test. The results are shown in Tables 6-1 and 6-2.

[實施例17]   將實施例17之反應塔的細節呈示於第4圖。在下部充填物層16(H3:170mm;充填物層1)之上,將直徑8.0mm之球狀的SUS球在高度方向上充填30mm(H7)作為第2充填物層19(充填物層2)。該SUS球之比重約為8.2,第2充填物層19之孔隙率為41%。使用該反應塔,進行上述廢水處理試驗。將結果呈示於表6-1及6-2。[Example 17] The details of the reaction tower of Example 17 are shown in FIG. 4. On the lower filling layer 16 (H3: 170mm; filling layer 1), a spherical SUS ball with a diameter of 8.0mm is filled with 30mm (H7) in the height direction as a second filling layer 19 (filling layer 2 ). The SUS ball had a specific gravity of about 8.2, and the porosity of the second filler layer 19 was 41%. Using this reaction tower, the above-mentioned wastewater treatment test was performed. The results are shown in Tables 6-1 and 6-2.

[實施例18~20]   在實施例18~20,於實施例17之反應塔中,使用將H7之值變更為表6-1所示之值的反應塔,進行上述廢水處理試驗。將結果呈示於表6-1及6-2。[Examples 18 to 20] In Examples 18 to 20, in the reaction tower of Example 17, a reaction tower in which the value of H7 was changed to a value shown in Table 6-1 was used to perform the above-mentioned wastewater treatment test. The results are shown in Tables 6-1 and 6-2.

[實施例21]   在實施例21,於實施例18之反應塔的第2充填物層19(充填物層2)中,使用直徑7.5mm之球狀的鋯球在高度方向上充填100mm(H7)以取代SUS球之反應塔,進行上述廢水處理試驗。鋯球之比重約為5.3、第2充填物層19(充填物層2)之孔隙率為41%。將結果呈示於表6-1及6-2。[Example 21] (1) In Example 21, in the second filling layer 19 (filling layer 2) of the reaction tower of Example 18, a zirconium ball with a diameter of 7.5 mm was used to fill 100 mm (H7) in the height direction. ) To replace the SUS ball reaction tower, the above wastewater treatment test was performed. The specific gravity of the zirconium ball was about 5.3, and the porosity of the second filler layer 19 (filler layer 2) was 41%. The results are shown in Tables 6-1 and 6-2.

[表6-1] ※1000小時後的COD(Cr)處理率   [表6-2] [Table 6-1] ※ COD (Cr) treatment rate after 1000 hours [Table 6-2]

如表6-1及6-2所示,可知藉由將下部充填物層(擴散部3)作成2層構造,可更高度地維持觸媒之處理性能。而且,在實施例21,相較於實施例18,藉由將陶瓷填料使用於第2填充物層19,認為可更高度維持觸媒之處理性能,從而可進一步抑制水垢成分在觸媒的析出。As shown in Tables 6-1 and 6-2, it can be seen that the two-layer structure of the lower filler layer (diffusion section 3) can maintain the catalyst processing performance to a higher degree. Furthermore, in Example 21, compared to Example 18, by using a ceramic filler in the second filler layer 19, it is considered that the catalyst processing performance can be maintained more highly, and the precipitation of scale components in the catalyst can be further suppressed. .

1‧‧‧反應塔1‧‧‧ reaction tower

2‧‧‧熱交換器2‧‧‧ heat exchanger

3‧‧‧廢水供給泵3‧‧‧ wastewater supply pump

4‧‧‧壓縮機4‧‧‧compressor

5‧‧‧氣液分離器5‧‧‧Gas-liquid separator

6‧‧‧液位控制閥6‧‧‧ level control valve

7‧‧‧壓力控制閥7‧‧‧Pressure Control Valve

8‧‧‧加熱手段(加熱器或熱介質)8‧‧‧ heating means (heater or heat medium)

9‧‧‧冷卻器9‧‧‧ cooler

10‧‧‧廢水供給管線10‧‧‧ wastewater supply pipeline

11‧‧‧含氧氣體供給管線11‧‧‧Oxygen-containing gas supply line

12‧‧‧處理液管線12‧‧‧ treatment liquid pipeline

13‧‧‧氣體排出管線13‧‧‧Gas exhaust line

14‧‧‧處理液排出管線14‧‧‧ treatment liquid discharge line

15‧‧‧分散板15‧‧‧dispersion plate

16‧‧‧下部充填物層16‧‧‧ lower filling layer

17‧‧‧觸媒層17‧‧‧ catalyst layer

18‧‧‧上部充填物層18‧‧‧ Upper filling layer

19‧‧‧第2充填物層19‧‧‧ 2nd filling layer

第1圖係呈示本發明之一實施型態中的廢水處理方法之概略圖。   第2圖係呈示實施例及比較例中使用之廢水處理裝置的概略圖。   第3-1圖係呈示實施例中使用之廢水處理裝置的概略圖。   第3-2圖係呈示實施例中使用之廢水處理裝置的概略圖。   第3-3圖係呈示實施例中使用之廢水處理裝置的概略圖。   第3-4圖係呈示實施例中使用之廢水處理裝置的概略圖。   第3-5圖係呈示比較例中使用之廢水處理裝置的概略圖。   第4圖係呈示實施例中使用之廢水處理裝置的概略圖。   第5圖係呈示本發明之分散板之一例的概略圖。FIG. 1 is a schematic diagram showing a wastewater treatment method according to an embodiment of the present invention. (2) FIG. 2 is a schematic diagram showing a wastewater treatment device used in Examples and Comparative Examples. FIG. 3-1 is a schematic diagram showing a wastewater treatment apparatus used in the embodiment. Figure 3-2 is a schematic view showing a wastewater treatment device used in the embodiment. Figures 3-3 are schematic views showing a wastewater treatment device used in the examples. Figures 3-4 are schematic views showing a wastewater treatment device used in the embodiment. Figures 3-5 are schematic diagrams showing a wastewater treatment apparatus used in a comparative example. FIG. 4 is a schematic diagram showing a wastewater treatment device used in the embodiment. Fig. 5 is a schematic diagram showing an example of the dispersion plate of the present invention.

Claims (11)

一種處理裝置,其由廢水供給側依序具有分散板2、分散板1、充填物層及觸媒層之廢水處理裝置,當上述分散板2與上述分散板1之距離為H1、上述分散板1與上述充填物層之廢水供給側的交界面之距離為H2、上述充填物層之層長為H3,以及上述H2與上述H3之合計為H6時,上述H6超出100mm,且上述H6與上述H1之比(H6/H1)為0.1以上(包含0.1)100以下(包含100)。A treatment device is a wastewater treatment device having a dispersion plate 2, a dispersion plate 1, a filling layer, and a catalyst layer in this order from a wastewater supply side. When the distance between the dispersion plate 2 and the dispersion plate 1 is H1, the dispersion plate 1 When the distance between the interface with the waste water supply side of the filling layer is H2, when the layer length of the filling layer is H3, and when the total of the H2 and the H3 is H6, the H6 exceeds 100 mm, and the H6 and the above The H1 ratio (H6 / H1) is 0.1 or more (inclusive) and 100 or less (inclusive). 如請求項1之處理裝置,其中上述H1係10mm以上(包含10mm)1000mm以下(包含1000mm)。For example, the processing device of claim 1, wherein the H1 is more than 10mm (including 10mm) and less than 1000mm (including 1000mm). 如請求項1或2之處理裝置,其中上述分散板1及上述分散板2之至少一者為多孔板,上述多孔板之孔數係每1m2 為5個以上(包含5個)200個以下(包含200個)。The processing apparatus 1 or 2 of the requested item, wherein said dispersion plate 1 and said dispersion plate 2 is at least one of a perforated plate, holes of the porous plate of the coefficient 2 per 1m 5 or more (including 5) below 200 (Including 200). 如請求項1至3中任一項之處理裝置,其中上述充填物層為2層構造。The processing device according to any one of claims 1 to 3, wherein the filler layer has a two-layer structure. 如請求項4之處理裝置,其中上述2層構造的充填物層中,當廢水供給側之充填物層為充填物層1,以及觸媒層側之充填物層為充填物層2時,上述充填物層2之層長為30mm以上(包含30mm)500mm以下(包含500mm)。For example, in the processing device of claim 4, in the above-mentioned two-layered filling layer, when the filling layer on the wastewater supply side is the filling layer 1 and the filling layer on the catalyst layer side is the filling layer 2, The layer length of the filler layer 2 is 30 mm or more (including 30 mm) and 500 mm or less (including 500 mm). 如請求項4或5之處理裝置,其中上述2層構造的充填物層中,當廢水供給側之充填物層為充填物層1,以及觸媒層側之充填物層為充填物層2時,上述充填物層1所含的充填物1之平均粒徑d1、上述充填物層2所含的充填物2之平均粒徑d2以及上述觸媒層所含的觸媒之平均粒徑d0滿足d1>d2>d0之關係。For example, the processing device of claim 4 or 5, wherein among the filling layers of the two-layer structure described above, when the filling layer on the wastewater supply side is filling layer 1 and the filling layer on the catalyst layer side is filling layer 2 The average particle diameter d1 of the filler 1 contained in the filler layer 1 and the average particle diameter d2 of the filler 2 contained in the filler layer 2 and the average particle diameter d0 of the catalyst contained in the catalyst layer satisfy The relationship of d1> d2> d0. 如請求項1~6中任一項之處理裝置,其中上述觸媒層所含的觸媒為濕式氧化觸媒。The processing device according to any one of claims 1 to 6, wherein the catalyst contained in the catalyst layer is a wet oxidation catalyst. 一種廢水處理方法,其係使用由廢水供給側依序至少具有氣體-液體擴散部1、氣體-液體擴散部2、氣體-液體擴散部3以及觸媒層之裝置的廢水處理方法, 上述廢水中係有氣體分散,且滿足下述(1)~(3):   (1)上述氣體-液體擴散部1~3中之上述廢水留置時間均為0.5秒以上(包含0.5秒);   (2)上述氣體-液體擴散部3與上述氣體-液體擴散部2中之廢水留置時間的合計為5秒以上(包含5秒);以及   (3)相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計為0.1~100倍。A wastewater treatment method is a wastewater treatment method using a device having at least a gas-liquid diffusion portion 1, a gas-liquid diffusion portion 2, a gas-liquid diffusion portion 3, and a catalyst layer in order from a wastewater supply side. It has a gas dispersion and satisfies the following (1) to (3):) (1) The above-mentioned wastewater indwell time in the gas-liquid diffusion sections 1 to 3 are all 0.5 seconds or more (including 0.5 seconds); (2) the above The total waste water indwell time in the gas-liquid diffusion unit 3 and the gas-liquid diffusion unit 2 is 5 seconds or more (inclusive); and (3) compared to the waste water indwell time in the gas-liquid diffusion unit 1, The total waste water indwelling time of (2) above is 0.1 to 100 times. 如請求項8之處理方法,其中上述氣體-液體擴散部係孔隙率20~90容量%之充填物層。The processing method according to claim 8, wherein the gas-liquid diffusion part is a filling layer having a porosity of 20 to 90% by volume. 如請求項8或9之處理方法,其中上述氣體-液體擴散部1在廢水供給側的交界面具有分散板1、上述氣體-液體擴散部2在與上述氣體-液體擴散部1的交界面具有分散板2,此時,上述分散板1及上述分散板2分別具有1個以上(包含1個)的孔,上述分散板1及上述分散板2的至少一方具有開孔率0.005%~30%之多孔板構造。The processing method according to claim 8 or 9, wherein the gas-liquid diffusion unit 1 has a dispersion plate 1 at the interface of the wastewater supply side, and the gas-liquid diffusion unit 2 has the interface with the gas-liquid diffusion unit 1 In the dispersion plate 2, the dispersion plate 1 and the dispersion plate 2 each have one or more (including one) holes, and at least one of the dispersion plate 1 and the dispersion plate 2 has an opening ratio of 0.005% to 30%. The perforated plate structure. 如請求項8~10中任一項之處理方法,其中進一步滿足以下之(i)~(iv): (i) 上述觸媒層中之LHSV為0.1hr-1 ~10hr-1 ; (ii) 上述觸媒層中之廢水溫度為80℃~370℃; (iii) 上述觸媒層中之壓力為廢水之至少一部分保持液相的壓力;以及 (iv) 上述氣體所含的氧量係廢水中之被氧化物的理論需氧量之0.5倍~5.0倍。The processing method of any one of claims 8 to 10, further satisfying the following (i) to (iv): (i) the LHSV in the catalyst layer is 0.1hr -1 to 10hr -1 ; (ii) The temperature of the wastewater in the catalyst layer is 80 ° C to 370 ° C; (iii) the pressure in the catalyst layer is the pressure at which at least a part of the wastewater maintains the liquid phase; and (iv) the amount of oxygen contained in the gas is in the wastewater The theoretical oxygen demand of the oxide is 0.5 to 5.0 times.
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