TWI738401B - Method for processing carrier board into ultra-high vacuum heating chamber and ultra-low temperature magnetron ion reactive etching cavity - Google Patents

Abstract

A method for feeding a carrier board into an ultra-high vacuum heating chamber and an ultra-low temperature magnetron ion reactive etching cavity for processing. The steps include: a) providing an ultra-high vacuum heating chamber; b) feeding the first carrier board Several supporting areas; c) heating the first carrier board by the first heating lamp module; d) feeding the second carrier board into the second supporting area, and the second heating lamp module heating the first carrier board; e) Take out the first carrier board from the ultra-high vacuum heating chamber; f) Provide an ultra-low temperature magnetron ion reactive etching chamber, and send the first carrier board into the carrier mechanism; g) Lower the support rod to make the fingers of the pressure ring abut Rely on the first carrier plate; h) provide a hollow ring-shaped shield in the housing; i) connect the suction pump to the suction channel; Take it out of the ion-controlled reactive etching cavity.

Description

Send the carrier plate into the ultra-high vacuum heating chamber and ultra-low temperature magnetron ion Method for processing in reactive etching cavity

The invention relates to a method for processing a carrier board, especially a method of sending the carrier board out of an ultra-high vacuum heating chamber for processing, and then sending the carrier board into an ultra-low temperature magnetron ion reactive etching cavity for processing.

Before carrying out the physical vapor deposition process on the carrier (the carrier referred to in this article can refer to a wafer or glass carrier of the same shape, silicon carrier, ceramic carrier, etc.), It should be heated to a set temperature (for example, 130° C.), so that the volatile gas and moisture compounded on the surface of the carrier board can escape from the surface of the carrier board.

In the prior art, the equipment for removing gases (including volatile gases and moisture) uses a furnace-tube oven-like equipment to heat the multiple contained carrier plates as a whole. Although this method can bake multiple carrier boards at the same time, it cannot heat and control the temperature uniformly on the surface of each carrier board, which affects the efficiency of gas and moisture escape. Therefore, when it is necessary to increase the baking temperature or time to ensure that the gas and moisture are removed, the performance of the equipment for removing volatile gases is therefore reduced, or the carrier board is damaged due to the high temperature of the oven (near the heater) . In addition, when the heating temperature of the current and later two batches of carrier plates needs to be adjusted, it is necessary to wait for the overall oven to be raised or lowered to the set temperature, which will also reduce the processing efficiency of the volatile gas removal equipment. Also, in order to achieve smoothness in a vacuum Heat conduction requires a proper amount of argon gas for heat conduction work, thus reducing the efficiency and cost of removing volatile gases.

In addition, in the subsequent packaging process, insulating materials between multilayer metal wiring are used. As the size of IC packaging decreases and the density increases, the performance of insulating materials has become one of the factors that affect IC functions. When processing highly volatile insulating materials, it is often accompanied by the generation of pollutant particles and increases the contact resistance Rc (Contact Resistance).

In the conventional ultra-low temperature magnetron ion reactive etching chamber equipment used in the back-end packaging process, an electronic chuck (e-chuck) is used to adsorb the carrier plate on the carrier plate, but for the warped carrier plate, its The electronic chuck cannot be smoothly absorbed on the carrier plate, so that the polluting particles generated by the uneven temperature during the etching and cleaning process are not easily removed and adhere to the cavity.

Furthermore, generally when the carrier board is moved in the ultra-low temperature magnetron ion reactive etching chamber equipment, the lifting of the cylinder is used as the driving method of the carrier board. However, the cylinder is prone to jitter and skew during the lifting operation process, and thus It is easy to cause damage to the carrier board, and also cause the friction of the machine parts to produce pollution particles.

In addition, when the carrier mechanism that can lift the carrier plate is installed in the ultra-low temperature magnetron ion reactive etching chamber equipment, it will occupy the center of the ultra-low temperature magnetron ion reactive cavity, so the suction pump can only be installed in The off-center position makes the air flow of the air pump when pumping air is not even enough, and therefore cannot smoothly remove the polluting particles generated during etching, thereby accumulating more polluting particles in the ultra-low temperature magnetron ion reactive etching chamber In the device.

The foregoing several shortcomings all make pollutant particles adhere to the ultra-low temperature magnetron ion reactive etching chamber equipment and are difficult to remove, thereby reducing the mean time between clean (MTBC) and failing to increase the utilization rate.

The present invention provides a method for processing a carrier board into an ultra-high vacuum heating chamber and an ultra-low temperature magnetron ion reactive etching cavity. The steps include:

a) Provide an ultra-high vacuum heating chamber, which includes a flat turntable with several supporting areas and several heating lamp modules; b) A first carrier board is sent into the several supporting areas by a conveying device A first support area, wherein the first support area is located at a transfer position; c) Rotate the plane turntable so that the first support area reaches under one of the heating lamp modules, causing the first heating lamp module The lamp module heats the first carrier, and the second one of the several supporting areas is also rotated to the conveying position; d) A second carrier is sent to the second supporting area by the conveying device and rotated The plane turntable makes the second supporting area reach below the first heating lamp module; at the same time, the first supporting area is also rotated to one of the several heating lamp modules under the second heating lamp module, causing the second heating lamp module to Group to heat the first carrier; e) when the plane turntable rotates the first support area back to the conveying position, one of the several heating lamp modules above the conveying position is heated by the lamp module to the first carrier After heating, the first carrier board is taken out from the ultra-high vacuum heating chamber by the conveying device; f) an ultra-low temperature magnetron ion reactive etching chamber is provided, and the first carrier is removed by the conveying device in a high vacuum environment. The carrier board is fed into a bearing mechanism in a shell of the ultra-low temperature magnetron ion reactive etching chamber; g) lowering the plurality of support rods of the bearing mechanism, so that the first carrier board is placed on a bearing plate and a pressing ring The plurality of fingers also abut the first carrier plate, wherein the pressure ring includes a ring portion and the plurality of fingers protrude from the inner side of the ring portion to the center; h) a hollow ring-shaped shield member is provided on In the housing, the housing includes: a hollow ring-shaped shield member, which is placed in the housing, and the hollow ring-shaped shield member includes an outer wall with And an elongated opening on the outer wall; and an air extraction channel, which is arranged at a bottom of the housing and adjacent to the elongated opening; i) an air extraction pump connected to the air extraction channel is provided to make the magnetron ion reaction at ultra-low temperature The pollutant particles generated during the etching of the first carrier board in the etching chamber enter the air suction channel through the elongated opening and are taken away by the suction pump; After leaving the carrier plate, the first carrier plate is taken out from the ultra-low temperature magnetron ion reactive etching cavity by means of a conveying device.

According to another embodiment of the present invention, wherein step d) further includes rotating a third supporting area to the transfer position, and sending a third carrier plate into the third supporting area by the transfer device, and rotating the flat turntable to make the third support When the zone reaches below the first heating lamp module, another fourth support zone is also rotated to the conveying position. A fourth carrier board is sent to the fourth support zone by the conveying device, and the plane turntable is rotated to make the fourth support zone reach Below the first heating lamp module.

According to another embodiment of the present invention, each of the plurality of heating lamp modules uses halogen lamps capable of emitting light of different wavelength ranges, and the light of different wavelength ranges respectively affect the first carrier board and the second carrier board. heating.

According to another embodiment of the present invention, the ultra-high vacuum heating chamber further includes a light-shielding plate, and the light-shielding plate is provided with a plurality of light-transmitting holes.

According to another embodiment of the present invention, the number of the light-transmitting holes corresponds to the number of the heating lamp modules.

According to another embodiment of the present invention, a bottom surface of the ultra-high vacuum heating chamber is provided with a first through hole, and a first suction pump group is connected to the first through hole and is in fluid communication with the ultra-high vacuum heating chamber.

According to another embodiment of the present invention, a second perforation is provided on the bottom surface, and a second suction pump group is connected to the second perforation and is in fluid communication with the ultra-high vacuum heating chamber.

According to another embodiment of the present invention, in step b) to step e), the first suction pump group keeps operating, so that the ultra-high vacuum heating chamber maintains a vacuum.

According to another embodiment of the present invention, in steps b) to e), the first air extraction pump set and the second air extraction pump set are kept operating, so that the ultra-high vacuum heating chamber maintains a vacuum.

According to another embodiment of the present invention, the first suction pump group includes a cryogenic condensate pump and a vacuum turbo pump, wherein the cryogenic condensate pump is connected in series with the vacuum turbo pump and the cryogenic condensate pump is connected to the first through hole.

According to another embodiment of the present invention, the second suction pump group includes a cryogenic condensate pump and a vacuum turbo pump, wherein the cryogenic condensate pump is connected in series with the vacuum turbo pump and the cryogenic condensate pump is connected to the second through hole.

According to another embodiment of the present invention, the first air extraction pump group includes a vacuum turbo pump, and the vacuum turbo pump is connected to the first perforation; the second air extraction pump group includes a cryogenic condensate pump, and the cryogenic condensate pump is connected to the second perforation.

According to another embodiment of the present invention, the ultra-low temperature magnetron ion reactive etching chamber further includes an upper cover, which includes a gas distribution assembly plate provided with a plurality of vent holes, wherein the housing is pivotally connected to the upper cover, and the upper cover covers the housing Physically.

According to another embodiment of the present invention, the upper cover includes a magnetron disk, which is mounted on the gas distribution group disk, wherein the magnetron disk includes a plurality of magnet holes.

According to another embodiment of the present invention, a plurality of magnets are arranged in the plurality of magnet holes.

According to another embodiment of the present invention, there is a gap between the hollow annular shield member and the housing.

According to another embodiment of the present invention, there are 3 to 12 fingers in total.

According to another embodiment of the present invention, there are 8 fingers in total.

According to another embodiment of the present invention, the material of the pressure ring is quartz.

According to another embodiment of the present invention, the material of the pressure ring is ceramic.

According to another embodiment of the present invention, the bearing mechanism includes: a bearing plate, which includes a plurality of support rod perforations; a bracket set, which includes: a base plate; a plurality of support rods arranged on the base plate, and a plurality of support rods Pass through a plurality of support rods respectively; a plurality of first positioning rods are arranged on the periphery of the base plate; and a plurality of second positioning rods are surrounded and fixed on the periphery of the carrier plate; a plurality of stepping motors respectively drive a plurality of The supporting rods and the plurality of first positioning rods are raised and lowered relative to the supporting plate; wherein the first supporting plate is sandwiched between the pressure ring and the supporting plate, the supporting rods are raised to abut against the first supporting plate, and the first positioning rods are raised Start the pressure ring away from the first carrier plate.

According to another embodiment of the present invention, a plurality of positioning holes are provided around a bottom surface of the pressure ring, and the positions of the plurality of positioning holes correspond to the plurality of second positioning rods.

According to another embodiment of the present invention, a plurality of stepping motors are respectively connected to the bracket group through a plurality of bellows.

According to another embodiment of the present invention, the carrier plate includes a plate body, a plurality of gas grooves provided on a surface of the plate body, and an air inlet passage that penetrates the plate body and communicates with the plurality of gas grooves.

According to another embodiment of the present invention, the carrier plate includes a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are both provided on the other surface of the carrier plate opposite to the gas groove.

According to another embodiment of the present invention, the carrier plate includes a liquid flow channel, and the liquid flow channel is connected to the liquid inlet and the liquid outlet.

According to another embodiment of the present invention, a cooling liquid passes through the liquid inlet, the liquid outlet, and the liquid flow channel.

According to another embodiment of the present invention, the hollow annular shield member further includes a bottom periphery on the outer wall, an inner bottom peripheral channel extending inward from the bottom periphery, and a plurality of through-holes communicating with the inner bottom peripheral channel. Through holes and a plurality of outer wall penetration holes arranged on the outer wall.

100: Ultra-high vacuum heating chamber

101: flat turntable

1011: Support Zone

10111: The first support area

10112: Second Support Area

10113: Third Support Zone

10114: Fourth Support Zone

102: Heating lamp module

1021: The first heating lamp module

1022: The second heating lamp module

1023: The third heating lamp module

103: first perforation

104: shading board

1041: light hole

105: second perforation

120: The first suction pump group

1201: Low temperature condensate pump

1202: Vacuum turbo pump

130: The second suction pump group

1301: Low temperature condensate pump

1302: Vacuum turbo pump

190: Conveyor

200: Ultra-low temperature magnetron ion reaction chamber

210: upper cover

211: Gas distribution panel

212: Vent

213: Magnetron Disk

2131: Magnet hole

2132: Magnet

214: Sprayer

220: shell

221: Exhaust Channel

222: bottom

230: Hollow ring mask

231: Outer Wall

232: Peripheral

233: Perimeter channel at the inner bottom

234: penetration hole

235: Long opening

236: Outer wall penetration hole

240: Carrier plate

241: Perforation

242: Disc body

243: Surface

244: Gas Groove

245: Intake Approach

246: Liquid inlet

247: Liquid outlet

248: Surface

249: Liquid flow path

250: pressure ring

2501: Ring

2502: finger

2503: Around the bottom

2504: positioning hole

260: Air pump

270: Carrier Mechanism

271: Bracket Group

2711: Base plate

2712: support rod

2713: The first positioning rod

2714: second positioning rod

272: stepping motor

2721: Bellows

B: bottom surface

O: Gate

P: Transmission location

PH: heating lamp module in transmission position

S1, S2, S3, S4, S5, S6, S7, S8, S9, S10: steps

T: top surface

W: carrier board

W1: The first carrier board

W2: second carrier board

W3: third carrier board

W4: Fourth Carrier Board

Figure 1 is a flowchart of the method provided by the present invention;

Figure 2 is a perspective view of the ultra-high vacuum heating chamber corresponding to the method of the present invention;

Figure 3 is a cross-sectional view of the ultra-high vacuum heating chamber corresponding to the method of the present invention;

4 is a schematic top view of the ultra-high vacuum heating chamber corresponding to the method of the present invention, which shows that the carrier board is sent into the ultra-high vacuum heating chamber for heating by a conveyor;

Figure 5 is a schematic top view of the ultra-high vacuum heating chamber corresponding to the method of the present invention, which shows that the plane turntable rotates and the carrier plate is heated under different heating lamp modules;

6 is a schematic top view of the ultra-high vacuum heating chamber corresponding to the method of the present invention, which shows that the plane turntable rotates and the carrier plate is heated under different heating lamp modules;

Figure 7 is a schematic top view of the ultra-high vacuum heating chamber corresponding to the method of the present invention, which shows that the plane turntable rotates and the carrier plate is heated under different heating lamp modules;

8 is a schematic top view of the ultra-high vacuum heating chamber corresponding to the method of the present invention, which shows that the plane turntable rotates and the carrier plate is heated under different heating lamp modules;

Figure 9 is a schematic top view of the ultra-high vacuum heating chamber corresponding to the method of the present invention, which shows that the plane turntable rotates and the carrier plate is heated under different heating lamp modules;

10 is a cross-sectional view of another embodiment of the ultra-high vacuum heating chamber corresponding to the method of the present invention;

11 is a cross-sectional view of another embodiment of the ultra-high vacuum heating chamber corresponding to the method of the present invention;

12 is a perspective view of the ultra-low temperature magnetron ion reactive etching cavity provided by the method of the present invention;

13 is a partial cross-sectional view of the ultra-low temperature magnetron ion reactive etching cavity provided by the method of the present invention;

Fig. 14 is a perspective view (reverse side) of the gas distribution plate of the upper cover provided by the method of the present invention;

Figure 15 is a perspective view (front side) of the gas distribution plate of the upper cover provided by the method of the present invention;

Figure 16 is a perspective view of a hollow annular shield provided by the method of the present invention;

Figure 17 is a perspective view (front side) of the pressure ring provided by the method of the present invention;

Figure 18 is a perspective view (reverse side) of the pressure ring provided by the method of the present invention;

Figure 19 is a three-dimensional schematic diagram of the carrying mechanism provided by the method of the present invention;

Figure 20 is a partial cross-sectional view of the carrying mechanism provided by the method of the present invention;

Figure 21 is a partial cross-sectional view of the carrying mechanism provided by the method of the present invention;

Figure 22 is a three-dimensional view (front) of the carrier plate provided by the method of the present invention;

Fig. 23 is a perspective view (reverse side) of the carrier plate provided by the method of the present invention.

The method for feeding the carrier board into the ultra-high vacuum heating chamber and the ultra-low temperature magnetron ion reactive etching cavity of the present invention is first applied to a device for removing fugitive and volatilized gases for a multi-piece carrier board The degassing device and the equipment are then used in an ultra-low temperature magnetron ion reactive etching chamber. As shown in the flowchart of Figure 1, the steps of the present invention include: a) providing an ultra-high vacuum heating chamber, which includes a planar turntable with a plurality of supporting areas and a plurality of heating lamp modules S1; b) by A conveying device sends a first carrier board into a first support area of a plurality of support areas, wherein the first support area is located at a conveying position S2; c) rotate the plane turntable so that the first support area reaches the plurality of heating lamp molds One of the first heating lamp modules in the group is under the first heating lamp module, causing the first heating lamp module to heat the first carrier, and the second one of the several supporting areas is also rotated to the transfer position S3; d) A second carrier board is sent to the second supporting area by the conveying device, and the plane turntable is rotated to make the second supporting area reach under the first heating lamp module; at the same time, the first supporting area is also rotated to several heating lamp modules Under one of the second heating lamp modules, causing the second heating lamp module to heat the first carrier S4; e) When the plane turntable rotates the first support area back to the transfer position, the number above the transfer position One of the heating lamp modules is transferred at one of the heating lamp modules to heat the first carrier board, and then the first carrier board is taken out from the ultra-high vacuum heating chamber by the conveying device S5; f) providing an ultra-low temperature magnetic Control the ion reactive etching chamber, and send the first carrier board to a bearing mechanism in a shell of the ultra-low temperature magnetron ion reactive etching chamber in a high vacuum environment by a conveyor S6; g) Lower the bearing mechanism A plurality of supporting rods make the first carrier board to be placed on a carrier plate, and at the same time, the plurality of fingers of a pressure ring also abut the first carrier board, wherein the pressure ring includes a ring portion and a plurality of finger portions. S7 protrudes from the inner side of the ring to the center; h) Provide a hollow ring-shaped shield member in the housing, the housing includes: a hollow ring-shaped shield member, which is placed in the housing In the body, the hollow annular shielding member includes an outer wall and an elongated opening provided on the outer wall; and a suction channel, arranged on a bottom of the housing and adjacent to the elongated opening S8; i) providing a connection to the suction The air pump of the channel makes the pollutant particles generated during the etching of the first carrier board in the ultra-low temperature magnetron ion reactive etching chamber enter the air extraction channel through the elongated opening and are taken away by the air pump S9; and j) rise The plurality of supporting rods of the supporting mechanism make the first carrier plate leave the carrier plate, and then the first carrier plate is taken out from the ultra-low temperature magnetron ion reactive etching chamber by the conveying device S10.

Next, we will first explain an example of processing the carrier board into the ultra-high vacuum heating chamber in the foregoing steps a) to e). As shown in FIG. 2, an ultra-high vacuum heating chamber 100 is provided, and in There is a first air extraction pump set 120 underneath it. The first air extraction pump set 120 is in fluid communication with the ultra-high vacuum heating chamber 100. The first air extraction pump set 120 includes a cryogenic condensate pump 1201 and a vacuum turbo pump 1202. The condensate pump 1201 is a series-connected vacuum turbo pump 1202, and the vacuum turbo pump 1202 is under the cryogenic condensate pump 1201, and the first air extraction pump group 120 can be regarded as a direct installation.

Please continue to refer to FIG. 3, which is a cross-sectional view of an embodiment of the ultra-high vacuum heating chamber 100. The ultra-high vacuum heating chamber 100 includes: a planar turntable 101 including a plurality of supporting areas 1011; and a plurality of heating lamp modules 102 , Arranged on a top surface T of the ultra-high vacuum heating chamber 100; a first perforation 103, arranged on a bottom surface B of the ultra-high vacuum heating chamber 100; and a first suction pump set 120, joined to the first The perforation 103 is in fluid communication with the ultra-high vacuum heating chamber 100; wherein, the first suction pump group 120 is vertically arranged below the ultra-high vacuum heating chamber 100. In addition, each heating lamp module 102 includes a heating lamp.

Please continue to refer to FIG. 4 together. The present invention provides a method for transferring a carrier plate to an ultra-high vacuum heating chamber 100 for processing. The steps include: providing an ultra-high vacuum heating chamber 100, which includes A flat turntable 101 with several support areas 1011 and several heating lamp modules 102; by means of a conveyor 190 (the conveyor 190 is represented by a robotic arm in the drawing in this case, but is not limited to this) A first carrier W1 is fed into a first supporting area 10111, wherein the first supporting area 10111 is located at a conveying position P (in the present invention, the supporting area is at the conveying position P to allow the conveying device 190 to convey the carrier to the supporting area) 5, rotating the plane turntable 101 makes the first support area 10111 reach a first heating lamp module 1021, causing the first heating lamp module 1021 to heat the first carrier W1, and another second support The area 10112 is also rotated to the transfer position P; a second carrier W2 is sent into the second support area 10112 by the transfer device 190, and the plane turntable 101 is rotated to make the second support area 10112 reach under the first heating lamp module 1021 (Please refer to Figure 6); At the same time, the first support area 10111 is also rotated under a second heating lamp module 1022, causing the second heating lamp module 1022 to heat the first carrier W1; please refer to Figure 7, When the plane turntable 101 rotates the first supporting area 10111 back to the conveying position P, a conveying position heating lamp module PH above the conveying position P heats the first carrier W1, and then the first carrier W1 is heated by the conveying device 190 The carrier W1 is taken out from the ultra-high vacuum heating chamber 100 (the schematic diagram of taking out the first carrier W1 is not shown in the drawings of the present invention); Area 10111 (explanatory text only, not shown in figures).

The number of carrier plates that can be placed on the flat turntable 101 in the ultra-high vacuum heating chamber 100 of the present invention is preferably 4 to 6. Those who are familiar with this technology should understand that the same or similar steps can also be applied to the ultra-high vacuum heating chamber with a flat turntable with more than 4 carrier plates. This case is not limited by the example of this embodiment. . Please continue to refer to FIG. 4, the method of the present invention for providing a transfer carrier to the ultra-high vacuum heating chamber 100 for processing is performed in the following manner: Empty heating chamber 100; by a conveyor 190 through a gate O (the opening, closing and sealing of the gate O can adopt the mechanism of conventional technology, so it will not be repeated) to send a first carrier board W1 into several supports A first support area 10111 in the area 1011 (it should be noted that the number of the support areas 1011 in the ultra-high vacuum heating chamber 100 is preferably 4 to 6. In order to simplify the description, the present invention uses 4 The supporting areas 1011 are for illustration, but not limited to this), where the first supporting area 10111 is located at a transfer position P; please refer to FIG. Under a first heating lamp module 1021 of 102, it should be noted that the number of the heating lamp modules 102 in the ultra-high vacuum heating chamber 100 corresponds to the number of the support area 1011, so as described above As mentioned, the present invention uses four heating lamp modules 102 as an example, but not limited to this. The first heating lamp module 1021 further heats the first carrier W1 (the heating of the carrier plate described in the present invention Refers to the heating lamp module facing the carrier board, so that the temperature of the carrier board rises to 130 degrees C), another second support area 10112 is also rotated to the transfer position P; a second carrier board is transferred by the transfer device 190 W2 is sent into the second supporting area 10112 (the schematic diagram of transferring the subsequent carrier board is not shown in the figure), please refer to Fig. 6, rotate the plane turntable 101 to make the second supporting area 10112 reach under the first heating lamp module 1021; A supporting area 10111 is also rotated under a second heating lamp module 1022, so that the second heating lamp module 1022 heats the first carrier W1, and another third supporting area 10113 is also rotated to the transfer position P A third carrier W3 is sent into the third supporting area 10113 by the conveying device 190, and the plane turntable 101 is rotated to make the third supporting area 10113 reach under the first heating lamp module 1021, and another fourth supporting area 10114 is also Is rotated to the transmission position P (as shown in FIG. 8). At this time, the first carrier W1 is positioned under a third heating lamp module 1023; please refer to FIG. The carrier W4 is fed into the fourth support area 10114, and then the plane turntable 101 is rotated to make the fourth support area 10114 reach under the first heating lamp module 1021; please refer to the figure 9. When the plane turntable 101 rotates the first support area 10111 back to the conveying position P, a conveying position heating lamp module PH above the conveying position P heats the first carrier W1, and then the conveying device 190 The first carrier W1 is taken out from the ultra-high vacuum heating chamber 100; and a carrier to be processed is sent to the first supporting area 10111 by the conveying device 190.

It can be explained that the present invention uses several support areas 1011 on the flat turntable 101 to place the carrier board, which means the aforementioned first carrier board W1, second carrier board W2, third carrier board W3, and fourth carrier board. The W4 system is placed horizontally in the first support area 10111, the second support area 10112, the third support area 10113, and the fourth support area 10114 by the conveying device 190.

It is further explained that each of the several heating lamp modules 102 uses halogen lamps that can emit light in different wavelength ranges. The light in different wavelength ranges affects the first carrier W1, the second carrier W2, and the third carrier. The carrier board W3 and the fourth carrier board W4 are heated separately. For example, the first heating lamp module 1021 emits near infrared rays; the second heating lamp module 1022 emits far infrared rays, but not limited to this.

Please refer to FIG. 3 again. The ultra-high vacuum heating chamber 100 further includes a light-shielding plate 104. The light-shielding plate 104 is provided with a plurality of light-transmitting holes 1041. The number of the light-transmitting holes 1041 corresponds to the number of the heating lamp modules 102. Each of the heating lamp modules 102 can be directly heated to the carrier plate under the heating lamp module 102 through the light-transmitting holes 1041 of the shading plate 104. That is, in the present invention, each carrier board is heated independently.

Please refer to FIG. 10 again, which shows another embodiment. The bottom surface B of the ultra-high vacuum heating chamber 100 is provided with a second through hole 105, and a second suction pump group 130 is connected to the second through hole 105 and is connected to the ultra-high vacuum heating chamber. The heating chamber 100 is in fluid communication. The second suction pump group 130 includes a low A warm condensate pump 1301 and a vacuum turbo pump 1302, wherein the low temperature condensate pump 1301 is connected in series with the vacuum turbo pump 1302 and the low temperature condensate pump 1301 is connected to the second through hole 105.

In addition, another embodiment is shown in FIG. 11, the bottom surface B of the ultra-high vacuum heating chamber 100 is provided with a first perforation 103 and a second perforation 105, and the first suction pump set 120 is connected to the first perforation 103 and the second The air pump unit 130 engages the second through hole 105. The first air extraction pump group 120 includes a vacuum turbo pump 1202, and the vacuum turbo pump 1202 is connected to the first perforation 103; the second air extraction pump group 130 includes a cryogenic condensate pump 1303, and the cryogenic condensate pump 1303 is connected to the second perforation 105. In this embodiment, the vacuum turbo pump 1202 and the cryogenic condensate pump 1303 operate in parallel.

In addition, the above method is to perform all steps in a vacuum environment, that is, to maintain the vacuum of the ultra-high vacuum heating chamber 100, for example, the first exhaust pump set 120 and/or the second exhaust pump set 130 are maintained in operation.

The flat turntable 101 is connected with a related driving device, but its device and structure are not important technical features of the present invention, so it will not be repeated in this article.

Furthermore, there is a temperature measuring instrument under each support area to detect the temperature of the carrier board, but the related device of the temperature measuring instrument is not an important technical feature of the present invention, and will not be repeated in this article.

What will be explained later is the method of feeding the carrier board into the ultra-low temperature magnetron ion reactive etching chamber, that is, the process from step f) to step j).

In order to fully reduce the adhesion of pollutant particles to the ultra-low temperature magnetron ion reactive etching cavity in the subsequent packaging process, please refer to FIG. 12, the present invention provides an ultra-low temperature magnetron ion reactive etching cavity 200, which is used for Carry out etching processing on the carrier board placed in it. However, the focus of the present invention is not on how to etch the carrier, but on how to etch The pollutant particles generated during the process should not adhere to the interior of the ultra-low temperature magnetron ion reactive cavity 200 as much as possible. Therefore, this article does not emphasize the related technical features of etching, and the inventor would like to declare first.

Please refer to FIGS. 13-17 together. It is continued that the ultra-low temperature magnetron ion reaction chamber 200 of the present invention includes: an upper cover 210, a housing 220, a hollow annular shield member 230, and a carrier plate 240 , A pressure ring 250 and an air pump 260, the upper cover 210 includes a gas distribution plate 211, which is provided with a plurality of vent holes 212. The upper cover 210 is pivotally connected to the housing 220 and covers the housing 220. The housing 220 includes: a hollow annular shield 230, an outer wall 231, a bottom periphery 232, an inner bottom periphery channel 233, a plurality of penetration holes 234, a long opening 235, and a plurality of outer wall penetration holes 236 And a suction channel 221. The hollow annular shield member 230 is placed in the housing 220, and includes an outer wall 231, a bottom periphery 232 located on the outer wall 231 and away from the upper cover 210, extending inward from the bottom periphery 232 to form an inner bottom peripheral channel 233, and an inner bottom A plurality of penetrating holes 234 communicated with the peripheral channel 233, an elongated opening 235 provided on the outer wall 231, and a plurality of outer wall penetrating holes 236 provided on the outer wall 231. The suction channel 221 is disposed at the bottom 222 of the housing 220 and is adjacent to the elongated opening 235. The carrier plate 240 is disposed in the hollow annular shield member 230. The pressure ring 250 is placed on the carrier plate 240. The pressure ring 250 includes a ring portion 2501 and a plurality of finger portions 2502 protruding from the inner side of the ring portion 2501 toward the center. The suction pump 260 is connected to the suction passage 221.

The upper cover 210 includes a magnetron disc 213 installed on the gas distribution group disc 211, wherein the magnetron disc 213 includes a plurality of magnet holes 2131, and a plurality of magnets 2132 are arranged in the plurality of magnet holes 2131.

There is a gap G between the hollow annular shield member 230 and the housing 220.

There are a total of 3 to 12 fingers 2502 on the pressing ring 250, preferably 8 fingers 2502 as shown in FIG. 17. The material of the pressure ring 250 can be quartz or ceramic. This material characteristic makes it difficult for pollutant particles to adhere to the pressure ring 250.

Please continue to refer to FIGS. 19-21, the present invention also provides a supporting mechanism 270 for fixing the carrier W. It is also explained here that the carrier W transported to the ultra-low temperature magnetron ion reactive etching chamber 200 is the first carrier W1 and the second carrier W2 that have been processed in the aforementioned ultra-high vacuum heating chamber 100. The third carrier board W3, the fourth carrier board W4 and other carrier boards, in order to facilitate understanding of the technical content and not cause confusion, in this article, the carrier board processed in the ultra-low temperature magnetron ion reactive etching chamber 200 uses only components The symbol "W" means. Although the term "first carrier" is used in the scope of patent application, those with ordinary knowledge in the technical field of the present invention should be able to infer that after "first carrier", "second carrier" and "third carrier" Carriers such as "carrier board" are also sent into the ultra-low temperature magnetron ion reactive etching chamber 200 for processing, so the term "carrier board W" is still used in the subsequent description. The supporting mechanism 270 includes: a supporting plate 240 including a plurality of perforations 241, a pressing ring 250, a bracket group 271, and a plurality of stepping motors 272 (see also FIGS. 19-21). The bracket set 271 includes a base plate 2711, a plurality of support rods 2712 arranged on the base plate 2711, a plurality of first positioning rods 2713 and a plurality of second positioning rods 2714 arranged on the periphery of the base plate 2711. The plurality of support rods 2712 respectively pass through the plurality of perforations 241. A plurality of second positioning rods 2714 are surrounded and fixed on the periphery of the carrier plate 240. A plurality of stepping motors 272 can respectively drive a plurality of support rods 2712 and a plurality of first positioning rods 2713 to move up and down relative to the carrier plate 240, wherein the carrier plate W is sandwiched between the pressure ring 250 and the carrier plate 240, and the supporting rod 2712 is raised Rises to abut the carrier W, and the first positioning rod 2713 is raised to make the pressure ring 250 leave the carrier W.

Also referring to FIG. 18, a bottom surface periphery 2503 of the pressure ring 250 is provided with a plurality of positioning holes 2504, and the positions of the plurality of positioning holes 2504 correspond to the plurality of second positioning rods 2714.

The plurality of stepping motors 272 are respectively connected to the bracket group 271 through a plurality of bellows 2721 (there should be two bellows 2721 in FIG. 19, but one of them is blocked by the carrier plate 240).

As shown in FIGS. 22 and 23, the carrier plate 240 includes a plate body 242, a plurality of gas grooves 244 provided on a surface 243 of the plate body 242, and a penetrating plate body 242 connected to a plurality of gas grooves. 244's intake approach 245.

The carrier plate 240 includes a liquid inlet 246 and a liquid outlet 247. The liquid inlet 246 and the liquid outlet 247 are both disposed on the other surface 248 of the carrier plate 240 opposite to the gas groove 244.

The carrier plate 240 includes a liquid flow channel 249, and the liquid flow channel 249 is connected to the liquid inlet 246 and the liquid outlet 247.

A cooling liquid (not shown in the figure) passes through the liquid inlet 246, the liquid outlet 247, and the liquid flow channel 249.

The inventor will continue to describe the overall operation of the ultra-low temperature magnetron ion reactive etching chamber 200 of the present invention as follows. Please refer to Figure 13, Figure 20, Figure 21, in order to perform the etching process, the carrier W is fed into the ultra-low temperature magnetron ion reactive etching chamber 200 from the input port I through a robotic arm (not shown), and placed horizontally As for the supporting rod 2712, the process of transporting the carrier W is not the main technical feature of the present invention, so it will not be repeated in this article. Then, the stepping motor 272 is precisely controlled by the software to synchronously descend, so that the bracket group 271 descends at the same time, so that the pressure ring 250 originally carried by the plurality of first positioning rods 2713 of the bracket group 271 also descends. At the same time, Support rod 2712 also descends with the carrier plate W until the plurality of positioning holes 2504 on the back of the pressure ring 250 are engaged with the plurality of second positioning rods 2714 of the carrier plate 240 and the carrier plate W is placed on the carrier plate 240, stepping The motor 272 no longer drives the bracket group 271 down. At this time, the plurality of fingers 2502 on the pressing ring 250 are pressed against or lightly pressed on the carrier board W, so that the carrier board W is placed on the carrier plate 240 evenly.

A gas supply system and a cooling liquid system continuously supply cooling gas and cooling liquid to the carrier plate 240. It should be noted that the gas supply system and the cooling liquid system are not the main technical features of the present invention, so they are not here. Repeatedly described in Figure 22 and Figure 23 can still be understood, the gas supply system continuously supplies cooling gas such as argon or helium, and blows the cooling gas to the carrier plate through the inlet duct 245 240. The cooling gas is input from the gas groove 244 of the carrier plate 240 toward the carrier plate W placed on the carrier plate 240 through the air inlet guide 245, thereby cooling the carrier plate W. In addition, the cooling liquid system also supplies cooling liquid such as refrigerant so that the cooling liquid enters the liquid flow channel 249 in the carrier plate 240 from the liquid inlet 246, and then leaves the carrier plate 240 from the liquid outlet 247, so as to continuously circulate for heat exchange. . The temperature in the entire ultra-low temperature magnetron ion reactive etching chamber 200 is below -20°C.

Furthermore, as shown in FIGS. 13-16, when the carrier W is etched in the ultra-low temperature magnetron ion reactive etching chamber 200, the sprayer 214 on the gas distribution plate group 211 in the upper cover 210 will release The reactive gas enters the housing 220 through the vent holes 212 in the gas distribution disk group 211, and the plasma is restricted by the plurality of magnets 2132 arranged on the magnetron disk 213. The aforementioned technical content in this paragraph is well-known to those skilled in the art, and is not the key technical content of the present invention, so it will not be repeated here. Please continue to refer to the foregoing drawings. Since the carrying mechanism 270 has been installed in the middle of the housing 220, the exhaust pump 260 can only be installed at a position deviated from the middle, and the hollow ring provided by the present invention The mask 230 can be drawn The air flow taken by the air pump 260 can be evenly and smoothly discharged from the air suction channel 221, as the technical content will be described later. First, after the reaction gas is blown into the housing 220, it will be exhausted from the suction channel 221. However, due to the arrangement of the hollow annular shield 230, the reaction gas in the housing 220 will converge through a plurality of penetration holes 234. Follow the inner bottom peripheral channel 233 to the elongated opening 235, the reaction gas in the gap G is gathered by the plurality of outer wall penetration holes 236 and flows along the inner bottom peripheral channel 233 to the elongated opening 235, and then Then, the suction channel 221 located beside the elongated opening 235 is sucked away by the suction pump 260 and discharged out of the housing 220. The fluidity of the reactant gas flow is smooth, and the pollution particles generated in the etching process can be removed more smoothly than the conventional technology, and the degree of adhesion of the pollution particles in the casing 220 can be reduced.

After the carrier board W is processed, the software controls the stepping motor 272 to operate, so that it pushes the bracket group 271, moves the plurality of support rods 2712 upwards and lifts the carrier board W, and allows the plurality of first positioning The rod 2713 moves upwards and lifts the pressing ring 250 until the carrier W reaches the height of the input port I, and then the carrier W is taken out from the housing 220 by a mechanical arm.

The inventor further explained that the operation of the stepping motor 272 is stable, so that the entire bracket assembly 271 is smoothly moved up and down, and prevents the pressure ring 250 from being skewed when contacting the carrier W, causing the carrier W to be damaged and polluting particles.

The technical content and technical features of the present invention have been disclosed above, but those familiar with the technology may still make various substitutions and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to those disclosed in the embodiments, but should include various substitutions and modifications that do not deviate from the present invention, and are covered by the following patent applications.

S1, S2, S3, S4, S5, S6, S7, S8, S9, S10: steps

Claims (28)

A method for sending a carrier board into an ultra-high vacuum heating chamber and an ultra-low temperature magnetron ion reactive etching chamber for processing. The steps include: a) providing an ultra-high vacuum heating chamber, which includes a plurality of support areas The plane turntable and several heating lamp modules; b) A first carrier board is sent to one of the several support areas by a conveying device, wherein the first support area is located at a conveying position; c) Rotate the plane turntable so that the first support area reaches below the first heating lamp module of one of the several heating lamp modules, so that the first heating lamp module heats the first carrier, and The second supporting area of one of the plurality of supporting areas is also rotated to the transfer position; d) A second carrier board is sent into the second supporting area by the conveying device, and the plane turntable is rotated to make the second supporting Area reaches below the first heating lamp module; at the same time, the first support area is also rotated to one of the plurality of heating lamp modules under the second heating lamp module, so that the second heating lamp module pair The first carrier board is heated; e) when the planar turntable rotates the first support area back to the transfer position, one of the heating lamp modules above the transfer position heats the lamp module pair at the transfer position The first carrier plate is heated, and then the first carrier plate is taken out of the ultra-high vacuum heating chamber by the conveying device; f) providing an ultra-low temperature magnetron ion reactive etching chamber, and using the The conveying device sends the first carrier board to a carrying mechanism in a shell of the ultra-low temperature magnetron ion reactive etching chamber in a high vacuum environment; g) Lower the plurality of support rods of the supporting mechanism, so that the first carrier plate is placed on a carrier plate, and at the same time, the plurality of fingers of a pressure ring also abut the first carrier plate, wherein the pressure ring includes a The annular portion and the plurality of fingers protrude from the inner side of the annular portion toward the center; h) a hollow annular shield member is provided in the housing, and the housing includes: the hollow annular shield member, It is placed in the casing, and the hollow annular shielding member includes an outer wall and an elongated opening provided on the outer wall; and a suction channel provided on a bottom of the casing and adjacent to the elongated opening I) providing an exhaust pump connected to the exhaust passage, so that the pollutant particles generated during the etching of the first carrier in the ultra-low temperature magnetron ion reactive etching chamber enter the exhaust through the elongated opening Channel and taken away by the suction pump; and j) raising the plurality of support rods of the supporting mechanism so that the first carrier plate leaves the carrier plate, and then the first carrier plate is removed from the ultra-low temperature magnetic field by the conveying device Take it out of the ion-controlled reactive etching cavity. The method according to claim 1, wherein step d) further comprises rotating a third support area to the transfer position, and a third carrier board is sent into the third support area by the transfer device, and the plane turntable is rotated Make the third support area reach below the first heating lamp module, and another fourth support area is also rotated to the conveying position, and a fourth carrier board is sent into the fourth support area by the conveying device, Rotate the plane turntable to make the fourth support area reach below the first heating lamp module. The method according to claim 1, wherein each of the plurality of heating lamp modules uses a halogen lamp capable of emitting light in a different wavelength range, and the light in the different wavelength range applies to the first carrier board and the second The two carrier boards are heated separately. The method according to claim 1, wherein the ultra-high vacuum heating chamber further includes a light-shielding plate, and the light-shielding plate is provided with a plurality of light-transmitting holes. The method according to claim 4, wherein the number of the plurality of light-transmitting holes corresponds to the number of the heating lamp modules. The method according to claim 1, wherein a first perforation is provided on a bottom surface of the ultra-high vacuum heating chamber, and a first suction pump group is connected to the first perforation and interacts with the ultra-high vacuum heating chamber. Connected. The method according to claim 6, wherein the bottom surface is provided with a second perforation, and a second suction pump group is connected to the second perforation and is in fluid communication with the ultra-high vacuum heating chamber. The method according to claim 6, wherein in step b) to step e), the first air extraction pump group keeps operating, so that the ultra-high vacuum heating chamber maintains a vacuum. The method according to claim 7, wherein in step b) to step e), the first air extraction pump set and the second air extraction pump set keep operating, so that the ultra-high vacuum heating chamber maintains a vacuum. The method according to claim 6, wherein the first suction pump group includes a cryogenic condensate pump and a vacuum turbo pump, wherein the cryogenic condensate pump is connected in series with the vacuum turbo pump and the cryogenic condensate pump is connected to the first through hole. The method according to claim 7, wherein the second suction pump group includes a cryogenic condensate pump and a vacuum turbo pump, wherein the cryogenic condensate pump is connected in series with the vacuum turbo pump and the cryogenic condensate pump is connected to the second through hole. The method of claim 7, wherein the first air extraction pump set includes a vacuum turbo pump, and the vacuum turbo pump engages the first perforation; the second air extraction pump set includes a cryogenic condensate pump, and the cryogenic condensate pump Join to the second through hole. The method according to claim 1, wherein the ultra-low temperature magnetron ion reactive etching chamber further comprises an upper cover, which comprises a gas distribution plate provided with a plurality of vent holes, wherein the housing is pivotally connected to the upper cover, The upper cover covers the shell. The method according to claim 13, wherein the upper cover includes a magnetron disk mounted on the gas distribution group disk, wherein the magnetron disk includes a plurality of magnet holes. The method according to claim 14, wherein a plurality of magnets are arranged in the plurality of magnet holes. The method according to claim 1, wherein there is a gap between the hollow annular shield member and the housing. The method according to claim 1, wherein there are 3 to 12 fingers in total. The method according to claim 17, wherein there are 8 fingers in total. The method according to claim 1, wherein the material of the pressure ring is quartz. The method according to claim 1, wherein the material of the pressure ring is ceramic. The method according to claim 1, wherein the bearing mechanism comprises: the bearing plate, which comprises a plurality of support rod perforations; and a bracket set, which comprises: a base plate; A plurality of support rods are provided on the base plate, the plurality of support rods respectively pass through the plurality of support rod perforations; a plurality of first positioning rods are provided on the periphery of the base plate; and a plurality of second positioning rods, Surrounded and fixed on the periphery of the carrier plate; a plurality of stepping motors respectively drive the plurality of support rods and the plurality of first positioning rods to move up and down relative to the carrier plate; wherein the first carrier plate is sandwiched between the pressure ring and Between the supporting plates, the plurality of support rods are raised to abut against the first carrier board, and the plurality of first positioning rods are raised to make the pressure ring leave the first carrier board. The method according to claim 21, wherein a plurality of positioning holes are provided around a bottom surface of the pressure ring, and the positions of the plurality of positioning holes correspond to the plurality of second positioning rods. The method according to claim 21, wherein the plurality of stepping motors are respectively connected to the bracket group through a plurality of bellows. The method according to claim 1, wherein the carrier plate includes a plate body, a plurality of gas grooves provided on a surface of the plate body, and a gas groove penetrating the plate body and communicating with the plurality of gas grooves Intake approach. The method according to claim 24, wherein the carrier plate includes a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are both provided on the other surface of the carrier plate relative to the plurality of gas grooves. The method according to claim 25, wherein the carrier plate includes a liquid flow path, and the liquid flow path is connected to the liquid inlet and the liquid outlet. The method according to claim 26, wherein a cooling liquid passes through the liquid inlet, the liquid outlet, and the liquid flow channel. The method according to claim 1, wherein the hollow annular shield member further includes a bottom periphery on the outer wall, an inner bottom peripheral channel extending inward from the bottom periphery, and the inner bottom peripheral channel A plurality of connected through holes and a plurality of outer wall through holes provided on the outer wall.

Images