TWI705515B - Method for removing fugitive and volatilized gas by transferring carrier board to a multi-piece carrier board - Google Patents

Abstract

A method for transferring a carrier board to a multi-piece carrier board to remove fugitive and volatilized gas, the steps include: a) providing a heating chamber, including a plane turntable with several supporting areas and several heating lamp modules B) The conveying device sends the first carrier board into the first supporting area; c) Rotating the plane turntable makes the first supporting area reach the first heating lamp module to heat the first carrier board; d) The conveying device transfers the second carrier The board is sent to the second support area, and the plane turntable is rotated to make the second support area under the first heating lamp module; the first support area is rotated to the second heating lamp module to heat the first carrier; e) the plane turntable The first supporting area is rotated back to the transfer position, and then the first carrier board is taken out from the heating chamber by the conveying device; and f) the carrier board to be processed is sent into the first supporting area by the conveying device.

Description

Method for removing fugitive and volatilized gas by transferring carrier board to a multi-piece carrier board

The present invention relates to a method for transferring a carrier board, in particular to a method for sequentially transferring the carrier board to a flat turntable in a heating chamber, so that the heating tool module in the heating chamber heats the carrier on the flat turntable.

Before carrying out the physical vapor deposition process on the carrier (the carrier referred to in this article refers to a wafer or glass carrier of the same shape, silicon carrier, ceramic carrier, etc.) It is first heated to a set temperature (for example, 130° C.), so that the volatile gas and moisture compounded on the surface of the carrier can escape from the surface of the carrier.

The traditional equipment for removing gases (including volatile gases and moisture) uses equipment similar to a furnace tube oven to heat the multiple contained carrier plates as a whole. Although it is possible to bake multiple carrier plates at the same time, it is impossible to uniformly heat and control the temperature of the surface of each carrier plate, which affects the efficiency of gas and moisture escape. Therefore, when the baking temperature or time needs to be increased to ensure the removal of gas and moisture, the efficiency of the device for removing volatile gas is also reduced, or the carrier board is damaged due to the high temperature of the oven (near the heater). In addition, when the heating temperature of the current and later two batches of carrier plates needs to be adjusted, it is necessary to wait for the overall oven to be raised or lowered to the set temperature, which will also reduce the processing efficiency of the volatile gas removal equipment. also, In order to achieve smooth heat conduction in vacuum, it is necessary to pass in a proper amount of argon for heat conduction work, thus reducing the efficiency and cost of removing volatile gases.

Therefore, the inventor of the present case provides a device for placing multiple carrier boards in a horizontal position and heating them so that each carrier board can be heated independently, and further provides a method that can transfer multiple carrier boards to one or more Chip carrier is a device for removing fugitive and volatilized gases.

The present invention provides a method for transferring a carrier board to a multi-piece carrier board for removing fugitive and volatilized gas. The steps include: a) providing a heating chamber, which includes a plane with a plurality of supporting areas Turntable and several heating lamp modules; b) Send a first carrier plate into a first supporting area by a conveying device, wherein the first supporting area is located at a conveying position; c) Rotate the flat turntable so that the first A supporting area reaches under the first heating lamp module, causing the first heating lamp module to heat the first carrier, and another second supporting area is also rotated to the transfer position; d) by The conveying device sends a second carrier board into the second support area, and rotates the plane turntable to make the second support area reach under the first heating lamp module; at the same time, the first support area is also rotated to a second support area. Under the two heating lamp modules, causing the second heating lamp module to heat the first carrier plate; and e) when the planar turntable rotates the first support area back to the conveying position, above the conveying position A conveying position of the heating lamp module heats the first carrier board, and then the first carrier board is taken out from the heating chamber by the conveying device.

As in the aforementioned method, wherein step d) further includes rotating a third supporting area to the transfer position, sending a third carrier plate into the third supporting area by the conveying device, and rotating the flat turntable to make the third supporting area Under the first heating lamp module, another fourth support area is also rotated to the transmission Position, a fourth carrier board is sent into the fourth support area by the conveying device, and the plane turntable is rotated to make the fourth support area reach under the first heating lamp module.

As in the aforementioned method, wherein each of the plurality of heating lamp modules uses halogen lamps capable of emitting light of different wavelength ranges, and the light of different wavelength ranges is respectively applied to the first carrier board and the second carrier board. heating.

As in the aforementioned method, the heating chamber further includes a shading plate, and the shading plate is provided with a plurality of light-transmitting holes.

As in the aforementioned method, the number of the light-transmitting holes corresponds to the number of the heating lamp modules.

As in the aforementioned method, a bottom surface of the heating chamber is provided with a first through hole, and a first suction pump group is connected to the first through hole and is in fluid communication with the heating chamber.

As in the aforementioned method, wherein the bottom surface is provided with a second through hole, and a second suction pump set is connected to the second through hole and is in fluid communication with the heating chamber.

As in the aforementioned method, in step b) to step e), the first air extraction pump group keeps operating, so that the heating chamber is kept in vacuum.

As in the aforementioned method, in step b) to step e), the first air extraction pump set and the second air extraction pump set are kept operating, so that the heating chamber maintains a vacuum.

As in the aforementioned method, the first suction pump group includes a cryogenic condensate pump and a vacuum turbo pump, wherein the cryogenic condensate pump is connected in series with the vacuum turbo pump and the cryogenic condensate pump is connected to the first through hole.

As in the aforementioned method, the second suction pump group includes a cryogenic condensate pump and a vacuum turbo pump, wherein the cryogenic condensate pump is connected in series with the vacuum turbo pump and the cryogenic condensate pump is connected to the second through hole.

As in the aforementioned method, wherein the first air extraction pump set includes a vacuum turbo pump, and the vacuum turbo pump is coupled to the first through hole; the second air extraction pump set includes a cryogenic condensate pump, and the cryogenic condensate pump is coupled to the first Two perforations.

10‧‧‧Heating chamber

11‧‧‧Plane turntable

111‧‧‧Support Area

1111‧‧‧First Support Area

1112‧‧‧Second Support Area

1113‧‧‧ Third Support Area

1114‧‧‧Fourth Support Area

12‧‧‧Heating lamp module

121‧‧‧The first heating lamp module

122‧‧‧The second heating lamp module

123‧‧‧The third heating lamp module

13‧‧‧First Piercing

14‧‧‧Shading plate

141‧‧‧Light hole

15‧‧‧Second Piercing

20‧‧‧The first suction pump group

21‧‧‧Cryogenic Condensate Pump

22‧‧‧Vacuum Turbo Pump

30‧‧‧Second Air Pump Set

31‧‧‧Cryogenic Condensate Pump

32‧‧‧Vacuum Turbo Pump

33‧‧‧Cryogenic Condensate Pump

9‧‧‧Transport Device

B‧‧‧Bottom surface

O‧‧‧Gate

P‧‧‧Transfer location

PH‧‧‧Transfer position heating lamp module

T‧‧‧Top surface

W1‧‧‧First carrier board

W2‧‧‧Second Carrier Board

W3‧‧‧Third Carrier Board

W4‧‧‧Fourth Carrier Board

Figure 1 is a three-dimensional view of the equipment corresponding to the method of the present invention; Figure 2 is a cross-sectional view of the equipment corresponding to the method of the present invention; Figure 3 is a schematic top view of the equipment corresponding to the method of the present invention, which shows the transfer device The carrier board is fed into the heating chamber for heating; Figure 4 is a schematic top view of the equipment corresponding to the method of the present invention, which shows that the plane turntable rotates and the carrier board is heated under different heating lamp modules; Figure 5 is the present invention The top view schematic diagram of the equipment corresponding to the method, which shows that the plane turntable rotates and the carrier is heated under different heating lamp modules; Figure 6 is a schematic top view of the equipment corresponding to the method of the present invention, which shows the plane turntable Rotate and heat the carrier plate under different heating lamp modules; Figure 7 is a schematic top view of the equipment corresponding to the method of the present invention, which shows that the plane turntable rotates and the carrier plate is placed between different heating lamp modules Lower heating; Figure 8 is a schematic top view of the equipment corresponding to the method of the present invention, which shows that the plane turntable rotates and the carrier is heated under different heating lamp modules; 9 is a cross-sectional view of another embodiment of the device corresponding to the method of the present invention; FIG. 10 is a cross-sectional view of another embodiment of the device corresponding to the method of the present invention.

The method for removing fugitive and volatilized gases from a multi-piece carrier board of the present invention can be applied to the degassing of a device for removing fugitive and volatilized gases from a multi-piece carrier board. The device and the equipment. As shown in Figure 1, the deaeration device is provided with a first air extraction pump set 20 under a heating chamber 10. The first air extraction pump set 20 is in fluid communication with the heating chamber 10, wherein the first air extraction pump set 20 includes a The cryogenic condensate pump 21 and a vacuum turbo pump 22, wherein the cryogenic condensate pump 21 is connected in series with the vacuum turbo pump 22, and the vacuum turbo pump 22 is below the cryogenic condensate pump 21. As shown in the figure, the first air extraction pump group 20 can be regarded as straight down Style setting.

Please continue to refer to FIG. 2, which is a cross-sectional view of another embodiment of the degassing device. It is explained in more detail that the degassing device is used to remove gas when heating the multi-plate carrier, and includes: a heating chamber 10, which Including: a plane turntable 11 including a plurality of supporting areas 111; a plurality of heating lamp modules 12 arranged on a top surface T of the heating chamber 10; a first perforation 13 arranged on a bottom surface of the heating chamber 10 B; and a first air extraction pump set 20 connected to the first through hole 13 and fluidly connected with the heating chamber 10; wherein the first air extraction pump set 20 is vertically arranged below the heating chamber 10. In addition, each heating module 12 includes a heating lamp.

Please continue to refer to FIG. 3, the present invention provides a method for removing fugitive and volatilized gas from a multi-chip carrier for transferring a carrier plate. The steps include: a) providing a heating chamber 10, which includes a Planar turntable 11 with several support areas 111 and several heating lamp modules 12; b) by a conveying device 9 (the conveying device 9 is represented by a robotic arm in the drawing of this case, but not limited to this) Will be the first time The board W1 is fed into a first supporting area 1111, wherein the first supporting area 1111 is located at a conveying position P (in the present invention, the supporting area is at the conveying position P to allow the conveying device 9 to convey the carrier board to the supporting area); c) Please 4, rotating the plane turntable 11 makes the first supporting area 1111 reach below a first heating lamp module 121, causing the first heating lamp module 121 to heat the first carrier W1, and a second supporting area 1112 It is also rotated to the transfer position P; d) A second carrier W2 is sent into the second support area 1112 by the transfer device 9, and the plane turntable 11 is rotated to make the second support area 1112 reach under the first heating lamp module 121 (Please refer to Fig. 5); At the same time, the first support area 1111 is also rotated under a second heating lamp module 122, causing the second heating lamp module 122 to heat the first carrier W1; e) Please refer to the figure 6. When the plane turntable 11 rotates the first supporting area 1111 back to the transfer position P, a transfer position heating lamp module PH above the transfer position P heats the first carrier W1, and then the transfer device 9 The first carrier W1 is taken out from the heating chamber 10 (the schematic diagram of taking out the first carrier W1 is not shown in the drawings of the present invention); and f) another carrier to be processed is sent into the first carrier by the conveyor 9 Support area 1111 (explanation only in words, not shown in figures).

The number of carrier plates that can be placed on the flat turntable 11 in the heating chamber 10 is preferably 4 to 6. The following is the procedure for conveying the carrier plate of the heating chamber 10 that can place four carrier plates, and is familiar with this technology The person should be able to understand that the same or similar steps can also be applied to a heating chamber with a flat turntable with more than 4 carrier plates, and this case is not limited by the example of this embodiment. Please continue to refer to FIG. 3, the method of the present invention for transferring a carrier board to a multi-piece carrier board to remove escaping and volatilized gas includes the following steps: a) providing a heating chamber 10 as described above; b) by A conveying device 9 sends a first carrier board W1 into a first support in a plurality of support areas 111 through a gate O (the opening, closing and sealing of the gate O can be a mechanism of conventional technology, so it will not be repeated) Area 1111 (It should be noted that the number of the support areas 111 in the heating chamber 10 is preferably 4 to 6. To simplify the description, the present invention uses 4 support areas 111 as an illustration, but not This is a limitation), where the first support area 1111 is located at a transfer position P; c) Please refer to Figure 4, rotate the plane turntable 11 so The first support area 1111 reaches below a first heating lamp module 121 of the heating lamp modules 12 (it should be noted that the number of the heating lamp modules 12 in the heating chamber 10 corresponds to The number of support areas 111, therefore, as mentioned above, the present invention uses four heating lamp modules 12 as an example, but not limited to this), so that the first heating lamp module 121 heats the first carrier W1 ( In the present invention, heating the carrier board refers to the heating lamp module facing the carrier board, so that the temperature of the carrier board rises to 130 degrees C), and the second supporting area 1112 is also rotated to the transfer position P; d) A second carrier W2 is sent into the second supporting area 1112 by the conveying device 9 (the schematic diagram of conveying the subsequent carrier is not shown again), please refer to FIG. 5, rotating the plane turntable 11 to make the second supporting area 1112 Reach below the first heating lamp module 121; at the same time, the first support area 1111 is also rotated under a second heating lamp module 122, causing the second heating lamp module 122 to heat the first carrier W1, and A third support area 1113 is also rotated to the transfer position P; a third carrier W3 is sent to the third support area 1113 by the transfer device 9, and the plane turntable 11 is rotated to make the third support area 1113 reach the first heating lamp mold Under the group 121, another fourth support area 1114 is also rotated to the transfer position P; referring to FIG. 7, a fourth carrier W4 is sent into the fourth support area 1114 by the transfer device 9, and the plane turntable 11 is rotated to make The fourth supporting area 1114 reaches below the first heating lamp module 121; e) Please refer to FIG. 8, when the plane turntable 11 rotates the first supporting area 1111 back to the transmission position P, a transmission position above the transmission position P is heated The lamp module PH heats the first carrier W1, and then the first carrier W1 is taken out from the heating chamber 10 by the conveying device 9; and f) a carrier to be processed is sent into by the conveying device 9 The first support area 1111.

It can be explained that the present invention uses several support areas 111 on the flat turntable 11 to place the carrier board, which means the aforementioned first carrier board W1, second carrier board W2, third carrier board W3, and fourth carrier board. The W4 system is placed horizontally in the first support area 1111, the second support area 1112, the third support area 1113, and the fourth support area 1114 by the conveying device 9.

It is further explained that each of the heating lamp modules 12 uses halogen lamps that can emit light in different wavelength ranges. The light in different wavelength ranges affects the first carrier W1, the second carrier W2, and the third carrier. The carrier board W3 and the fourth carrier board W4 are heated separately. For example, the first heating lamp module 121 emits near infrared rays; the second heating lamp module 122 emits far infrared rays, but not limited to this.

Please refer to FIG. 2 again. The heating chamber 10 further includes a shading plate 14. The shading plate 14 is provided with a plurality of light-transmitting holes 141. The number of the light-transmitting holes 141 corresponds to the number of the heating lamp modules 12. Each of the heating lamp modules 12 can be directly heated to the carrier board located under the heating lamp module 12 through the light-transmitting holes 141 of the shading plate 14. That is, in the present invention, each carrier board is heated independently.

Furthermore, in step b) to step e), the first suction pump group 20 keeps operating, so that the heating chamber 10 is kept in vacuum.

Please refer to FIG. 9 again, which shows another embodiment. The bottom surface B of the heating chamber 10 is provided with a second perforation 15, and a second suction pump set 30 is joined to the second perforation 15 and is in fluid communication with the heating chamber 10 . The second suction pump group 30 includes a cryogenic condensate pump 31 and a vacuum turbo pump 32, wherein the cryogenic condensate pump 31 is connected in series with the vacuum turbo pump 32 and the cryogenic condensate pump 31 is connected to the second through hole 15.

In addition, another embodiment is shown in FIG. 10, the bottom surface B of the heating chamber 10 is provided with a first perforation 13 and a second perforation 15, and the first suction pump group 20 is joined to the first perforation 13, the second suction pump group 30 Join the second through hole 15. The first suction pump group 20 includes a vacuum turbo pump 22, and the vacuum turbo pump 22 is connected to the first perforation 13; the second suction pump group 30 includes a cryogenic condensate pump 33, and the cryogenic condensate pump 33 is connected to the second perforation 15. In this embodiment, the vacuum turbo pump 22 and the cryogenic condensate pump 33 operate in parallel.

Furthermore, in step b) to step e), the first air extraction pump set 20 and the second air extraction pump set 30 are kept operating, so that the heating chamber 10 is maintained in vacuum.

In addition, the method of the present invention performs all steps in a vacuum environment.

The flat turntable 11 is connected with a related driving device, but its device and structure are not the important technical features of the present invention, so I will not repeat it in this article.

There is also a temperature measuring instrument under each support area to detect the temperature of the carrier board, but the related device of the temperature measuring instrument is not an important technical feature of the present invention, and will not be repeated in this article.

The technical content and technical features of the present invention have been disclosed above, but those familiar with the technology may still make various substitutions and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to those disclosed in the embodiments, but should include various substitutions and modifications that do not deviate from the present invention, and are covered by the following patent applications.

10‧‧‧Heating chamber

11‧‧‧Plane turntable

111‧‧‧Support Area

1111‧‧‧First Support Area

9‧‧‧Transport Device

O‧‧‧Gate

P‧‧‧Transfer location

W1‧‧‧First carrier board

Claims (11)

A method for transferring a carrier board to a multi-piece carrier board for removing fugitive and volatilized gases. The steps include: a) providing a heating chamber, which includes a flat turntable with several supporting areas and several Heating the lamp module; b) Send a first carrier board to a first support area by a conveying device, wherein the first support area is located at a conveying position; c) Rotate the plane turntable so that the first support area reaches Under the first heating lamp module, the first heating lamp module is caused to heat the first carrier, and the second supporting area is also rotated to the conveying position; d) the conveying device A second carrier board is fed into the second supporting area, and the plane turntable is rotated to make the second supporting area reach under the first heating lamp module; at the same time, the first supporting area is also rotated to a second heating lamp module Under the group, causing the second heating lamp module to heat the first carrier; and e) when the planar turntable rotates the first support area back to the transfer position, a transfer position above the transfer position The heating lamp module heats the first carrier board, and then the first carrier board is taken out from the heating chamber by the conveying device; wherein each of the heating lamp modules uses energy For halogen lamps emitting light of different wavelength ranges, the light of different wavelength ranges heats the first carrier board and the second carrier board respectively. The method according to claim 1, wherein step d) further comprises rotating a third supporting area to a transfer position, sending a third carrier plate into the third supporting area by a transfer device, and rotating the planar turntable to make the The third support area reaches below the first heating lamp module, and the fourth support area is also rotated to In the transfer position, a fourth carrier board is sent into the fourth support area by the transfer device, and the plane turntable is rotated to make the fourth support area reach below the first heating lamp module. The method according to claim 1, wherein the heating chamber further includes a shading plate, and the shading plate is provided with a plurality of light-transmitting holes. The method according to claim 3, wherein the number of the light transmission holes corresponds to the number of the heating lamp modules. The method according to claim 1 or 2, wherein a bottom surface of the heating chamber is provided with a first through hole, and a first suction pump group is connected to the first through hole and is in fluid communication with the heating chamber. The method according to claim 5, wherein the bottom surface is provided with a second through hole, and a second suction pump group is connected to the second through hole and is in fluid communication with the heating chamber. The method according to claim 5, wherein in step b) to step e), the first suction pump group keeps operating, so that the heating chamber maintains a vacuum. The method according to claim 6, wherein in step b) to step e), the first air extraction pump set and the second air extraction pump set are kept in operation, so that the heating chamber maintains a vacuum. The method according to claim 5, wherein the first air extraction pump group includes a cryogenic condensate pump and a vacuum turbo pump, wherein the cryogenic condensate pump is connected in series with the vacuum turbo pump and the cryogenic condensate pump is connected to the first through hole. The method according to claim 6, wherein the second suction pump group includes a cryogenic condensate pump and a vacuum turbo pump, wherein the cryogenic condensate pump is connected in series with the vacuum turbo pump and the cryogenic condensate pump is connected to the second through hole. The method of claim 6, wherein the first air extraction pump set includes a vacuum turbo pump, and the vacuum turbo pump engages the first perforation; the second air extraction pump set includes a cryogenic condensate pump, and the cryogenic condensate pump Join to the second through hole.

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