TWI737941B - Wafer laminator, film stretching device and wafer laminating method - Google Patents

Abstract

A wafer laminator includes a film transporting device, a film laminating device and a film stretching device. The film transporting device includes two transporting rollers defining a film laminating region therebetween. The film transporting device is configured to transport a film from one transporting roller to the other transporting roller in a film transporting direction. The film laminating device is disposed in the film laminating region, and the film laminating device is configured to laminate the film onto a wafer. The film stretching device is disposed in the film laminating region, and the film stretching device is configured to stretch the film in a film stretching direction. The film stretching direction is substantially orthogonal to the film transporting direction.

Description

Wafer sticking machine, film pulling device and wafer sticking method

The invention relates to a wafer sticking machine, especially a wafer sticking machine that can stretch thin films. The invention also relates to a film pulling device of a wafer film attaching machine and a wafer film attaching method.

In the manufacturing process of semiconductor integrated circuits and various micro-electromechanical devices, one of the steps is to stick a thin film on the surface or back of the wafer for subsequent related wafer manufacturing processes. Films used for attaching to wafers include, but are not limited to, cutting blue film, cutting white film, thinning protective film, UV film, and DAF (Die Attach Film) conductive film. Attaching the film to the wafer can adhere the process particles on the surface or back of the wafer, and the film is removed to bring the process particles away from the surface or back of the wafer.

Generally speaking, after the transfer wheel of the wafer laminating machine transports the film to a predetermined working area, the steps of attaching the film and cutting the film are then carried out. However, after the film on the conveyor wheel is cut, it will be wrinkled or collapsed due to uneven tension distribution. As a result, when the film is subsequently attached, the film cannot be smoothly attached to the surface or back of the wafer, and there will be air. Remains between the film and the wafer surface. The air remaining between the film and the wafer surface will generate many bubbles, so that the entire wafer surface is not fully adhered by the film, so there may be a problem that the process particles cannot be removed cleanly during the subsequent tearing of the film.

In view of the above problems, the present invention discloses a wafer attaching machine, a film pulling device, and a wafer attaching method, which helps to solve the problem of wrinkles or collapse of the film after being cut, which causes the subsequent film to be unable to be attached to the wafer smoothly. The problem.

The wafer attaching machine disclosed in the present invention includes a film conveying device, a film attaching device, and a film pulling device. The film conveying device includes two film conveying wheels. There is a film sticking work area between the two film conveying wheels, and the film conveying device is used for moving a film in the film sticking work zone from one film conveying wheel to the other film conveying wheel along a conveying direction. The film attaching device is arranged in the film attaching work area, and the film attaching device is used for attaching the film to the wafer. The film pulling device is arranged in the film sticking work area. The film drawing device can pull the film along a film drawing direction, and the film drawing direction is substantially orthogonal to the conveying direction.

The present invention further discloses a film pulling device for pulling a film suitable for attaching to a wafer, which includes a base, at least one film pulling mechanism, and at least one clamping mechanism. The film pulling mechanism is arranged on the base. The clamping mechanism is arranged on the film pulling mechanism. The clamping mechanism can move relative to the film pulling mechanism along a clamping direction to clamp the film. The film-drawing mechanism can drive the clamping mechanism to move relative to the base along the film-drawing direction, and the clamping direction is substantially orthogonal to the film-drawing direction.

The present invention also discloses a wafer thin film method for attaching a thin film to a wafer, wherein the thin film has an adjacent attaching area and a next attaching area. The wafer film method includes: performing a film attaching process to attach the attaching area of the film to a wafer; performing a cutting process to cut the attaching area of the film, and forming a hollow hole in the film, wherein the hollow The hole has a first end and a second end opposite to each other, and the second end is closer to the next attachment area than the first end; and a film pulling procedure is performed to tie the first end and the next attachment area of the hollow hole Pull the film between.

According to the wafer sticking machine and the film stretching device disclosed in the present invention, the film stretching device is arranged in the film sticking work area and can pull the film along a film stretching direction, wherein the film stretching direction is substantially orthogonal to the transport direction of the film. Furthermore, the film stretching device includes a clamping mechanism and a film stretching mechanism. The clamping mechanism can move in the clamping direction to clamp the film, and the film stretching mechanism can drive the clamping mechanism to pull the film in the film stretching direction. The holding direction is substantially orthogonal to the film pulling direction. In addition, the wafer attaching method disclosed in the present invention includes performing a film pulling process to pull the film between the hollow hole formed after the film is cut and the next attaching area. In this way, the film pulling device pulls the film erected on the film conveying device to eliminate curling or wrinkles caused by uneven tension distribution near the hollow hole after cutting, so that the collapsed part of the hollow hole disappears, thereby ensuring the next piece The film can be smoothly attached to the surface or back of the wafer when the wafer is placed in the mold process.

The above description of the disclosure and the following description of the embodiments are used to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

The detailed features and advantages of the present invention will be described in detail in the following embodiments. The content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings. Anyone who is familiar with relevant skills can easily understand the purpose and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

Please refer to Figure 1 to Figure 2 at the same time. FIG. 1 is a schematic side view of a wafer mounter according to a first embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of a part of the film pulling device of the wafer mounter of FIG. 1. In this embodiment, the wafer bonding machine 1 includes a film conveying device 10, a film bonding device 20, a film cutting device 30 and a film pulling device 40.

The film conveying device 10 includes a first film conveying wheel 110, a second film conveying wheel 120, a plurality of film rack wheels 130, a waste film recovery wheel 140 and a jumping rod 150. There is a film sticking work area R between the first film conveying wheel 110 and the second film conveying wheel 120. The film frame wheel 130 is disposed on one side of the film sticking work area R, and is used to carry the film (not shown) wound into a cylindrical shape. The waste film recovery wheel 140 is arranged on the other side of the film sticking work area R, and is used to recover the excess waste film remaining after the film is cut. The jumping rod 150 is disposed between the film frame wheel 130 and the first film conveying wheel 110, and is used to adjust the tension of the film to maintain the film to be flat before the film is applied. The first film conveying wheel 110 can change the moving direction of the film to move the film toward the second film conveying wheel 120. Thereby, the film conveying device 10 can move the film in the film attaching work area R from the first film conveying wheel 110 to the second film conveying wheel 120 along a conveying direction D1.

The film sticking device 20 is disposed in the sticking work area R and includes a hot pressing wheel 210 and a moving stage 220. The hot pressing wheel 210 is used to attach the film to the wafer (not shown), and the movable stage 220 is used to carry the wafer. The heat pressing wheel 210 can move to approach or move away from the moving stage 220.

The film cutting device 30 includes a driving motor 310 and a film cutter 320. The driving motor 310 is arranged above the film sticking work area R, and the film cutting knife 320 is connected to the driving motor 310. The driving motor 310 can drive the film cutter 320 to rotate relative to the moving stage 220 of the film attaching device 20 in the film attaching work area R, so that the film cutter 320 cuts the film attached to the wafer.

The film stretching device 40 includes a base 410, two film stretching mechanisms 420, two clamping mechanisms 430, and a suction mechanism 440. The base 410 is disposed in the filming work area R, and is, for example, but not limited to, a supporting frame including a servo motor, a linear slide rail, and a sliding block. The film pulling mechanism 420, the clamping mechanism 430 and the suction mechanism 440 can all move relative to the first film conveying wheel 110 and the second film conveying wheel 120 of the film conveying device 10.

The film pulling mechanism 420 is disposed on the base 410 and includes a transmission gear, a transmission belt, and a slider. Driven by a cylinder or a motor (not shown), one of the film pulling mechanisms 420 can move relative to the base 410 along a film pulling direction D21, and the other film pulling mechanism 420 can move in a film pulling direction opposite to the film pulling direction D21 D22 moves relative to the base 410. The base 410 can drive the film pulling mechanism 420 to a first working position (please refer to FIGS. 7 and 8 first) close to the first film conveying wheel 110 and a second position close to the second film conveying wheel 120 in the film sticking work area R. Move back and forth between working positions (please refer to Figure 4 to Figure 6).

The two clamping mechanisms 430 are respectively disposed on the two film pulling mechanisms 420, and the two clamping mechanisms 430 each include a linear slide rail and a clamping jaw. Driven by a cylinder or a motor, the clamping jaws of the two clamping mechanisms 430 can move relative to the film pulling mechanism 420 in the clamping direction D3, so that the clamping mechanism 430 clamps the film. Since the clamping mechanism 430 is disposed in the film pulling mechanism 420, one of the film pulling mechanisms 420 can drive the corresponding clamping mechanism 430 to move along the film pulling direction D21 relative to the base 410. Another film pulling mechanism 420 can drive the corresponding clamping mechanism 430 to move relative to the base 410 along the film pulling direction D22.

In this embodiment, the film pulling directions D21, D22 are substantially orthogonal to the conveying direction D1, and the clamping direction D3 is substantially orthogonal to the film stretching directions D21, D22; in other words, the film stretching directions D21, D22 are The holding direction D3 is substantially orthogonal to the conveying direction D1, but the invention is not limited to this. In other embodiments, the film drawing directions D21 and D22 are also orthogonal to the conveying direction D1, but the film drawing directions D21 and D22 and the clamping direction D3 have an angle. In addition, the number of the film pulling mechanism and the clamping mechanism in this embodiment is two, but the number of the film pulling mechanism and the clamping mechanism is not used to limit the present invention.

The suction mechanism 440 is disposed in the film sticking work area R, and has a plurality of suction holes (not shown). The suction mechanism 440 can move in the film attaching work area R to suck the film through the suction holes, and the film stretching mechanism 420 and the clamping mechanism 430 of the film stretching device 40 can move relative to the suction mechanism 440.

In this embodiment, the one direction is "substantially" orthogonal to the other direction, which means that the two directions are theoretically orthogonal to each other, but the two directions may be caused by assembly tolerance, manufacturing tolerance, or wear and tear. In fact, there is an included angle, but this included angle is very close to 90 degrees without affecting or detracting from the function of the component.

The wafer sticking machine 1 is used for sticking the thin film on the surface of the wafer. This embodiment further discloses a method for attaching a film on a wafer. Please refer to Figure 3 and Figure 4. FIG. 3 is a schematic flow chart of the wafer attaching method according to the first embodiment of the present invention. FIG. 4 is a schematic side view of the wafer placement machine of FIG. 1 performing the placement process. In this embodiment, the wafer attaching method includes steps S11 to S17.

As shown in FIG. 4, before attaching the film to the wafer surface, a film 2 is first erected on the film conveying device 10, wherein the film 2 has an adjacent attaching area 21 and a next attaching area 22. In addition, a wafer 3 is placed on the moving stage 220 of the film sticking device 20.

Step S11 is to execute a film attaching process, which is to attach the attaching area 21 of the film 2 to the wafer 3. As shown in FIG. 4, the first film conveying wheel 110 of the film conveying device 10 adjusts the moving direction of the film 2 so that the film 2 located in the film sticking work area R moves toward the second film conveying wheel 120 along the conveying direction D1. At the same time, the moving stage 220 of the film sticking device 20 moves along the conveying direction D1, and the heat pressing wheel 210 descends to approach the moving stage 220. When the moving stage 220 passes under the hot pressing wheel 210, the hot pressing wheel 210 attaches the attaching area 21 of the film 2 to the wafer 3.

Step S12 is to perform a cutting process, which is to cut the attaching area 21 of the film 2 to form a hollow hole 23 on the film 2. Please refer to Figure 5 and Figure 6 together. FIG. 5 is a schematic side view of the wafer placement machine of FIG. 4 performing a cutting process. 6 is a schematic top view of the wafer mounter of FIG. 5 after the cutting process is completed. The moving stage 220 of the film attaching device 20 transports the wafer 3 on which the film 2 has been attached to the attaching area 21 to below the film cutting device 30. The driving motor 310 of the film cutting device 30 drives the film cutter 320 to descend close to the wafer 3 so that the film cutter 320 cuts the attaching area 21 of the film 2.

After the step S12 is completed, the attachment area 21 of the film 2 remains on the surface of the wafer 3. The film 2 remaining on the film conveying device 10 forms a hollow hole 23 at the position of the original attaching area 21. The hollow hole 23 has a first end 231 and a second end 232 opposite to each other, and the second end 232 is closer to the next attaching area 22 of the film 2 than the first end 231. In addition, the driving motor 310 of the film cutting device 30 drives the film cutter 320 to rise away from the wafer 3, so that the distance between the film cutter 320 of the film cutting device 30 and the film 2 is greater than the height of the film pulling mechanism 420 of the film stretching device 40 . Due to the uneven tension distribution of the film 2 around the hollow hole 23, curling occurs, causing the second end 232 of the hollow hole 23 to sag or produce wrinkles, thereby forming a collapsed portion 233 shown in FIG. 6.

In steps S11 and S12, the film stretching device 40 is located at the second working position close to the second film conveying wheel 120, and the clamping mechanism 430 does not clamp the film 2 and is in a released state. In other words, when the clamping mechanism 430 is in the released state, the film pulling device 40 does not apply force to pull the film 2.

Step S13 is to perform a film pulling procedure, which is to pull the film between the first end 231 of the hollow hole 23 and the next attaching area 22. Please refer to Figure 7 and Figure 8 together. FIG. 7 is a schematic side view of the wafer placement machine of FIG. 6 performing a film pulling process. FIG. 8 is a schematic top view of the wafer film attaching machine of FIG. 7 performing a film pulling process. As shown in Figures 2 and 7, the film stretching mechanism 420 of the film stretching device 40 moves in the opposite direction of the conveying direction D1, so that the film stretching device 40 moves from the second working position to the first film conveying wheel 110. In the working position, the clamping mechanism 430 is still in the released state at this time. When the film stretching device 40 is in the first working position, the film stretching mechanism 420 and the clamping mechanism 430 are located at a central position C between the first end 231 and the second end 232 of the hollow hole 23 of the film 2 and the next sticker Between the attached area 22. After the film pulling device 40 moves to the first working position, the clamping mechanism 430 moves along the clamping direction D3 to clamp the film 2. Next, the two film pulling mechanisms 420 move along the film pulling directions D21 and D22 to move the two clamping mechanisms 430 away from each other. The film pulling mechanism 420 pulls the film 2 erected on the film conveying device 10 to eliminate the aforementioned curling, so that the collapsed portion 233 of the hollow hole 23 disappears.

In step S13, the clamping mechanism 430 of the film stretching device 40 clamps the film 2 and is in a clamping state. In other words, when the clamping mechanism 430 is in a clamping state, the film pulling device 40 applies force to pull the film 2. In addition, the film pulling mechanism 420 in step S13 pulls the film 2 between the center position C of the hollow hole 23 and the next attaching area 22, but the present invention is not limited to this. In other embodiments, depending on the difference in the material of the film and the size of the hollow hole, the film stretching mechanism of the film stretching device can pull the film between the second end of the hollow hole and the next attachment area, or in the hollow hole. Pull the film between the first end and the second end.

Step S14 is to execute a new film sticking procedure. Please also refer to FIG. 9, which is a schematic side view of the wafer placement machine in FIG. 8 performing a new placement process. In step S12, the wafer 3 that has been pasted is removed, and a new wafer 3 that has not yet been pasted is placed on the moving stage 220 of the pasting device 20. The moving stage 220 of the film sticking device 20 moves along the conveying direction D1 under the heat pressing wheel 210 so that the heat pressing wheel 210 sticks the next sticking area 22 of the film 2 to the wafer 3. The detailed operation of step S14 is similar to that of step S11, so it will not be repeated here.

As shown in Figures 2 and 9, in step S14, the film stretching mechanism 420 of the film stretching device 40 moves along the conveying direction D1, so that the film stretching device 40 moves from the first working position to a position close to the second film conveying wheel 120 The second working position. At this time, the clamping mechanism 430 of the film stretching device 40 is still in a clamping state, that is, the clamping mechanism 430 continues to pull the film 2.

Step S15 is to perform an adsorption process to adsorb the film 2. Please also refer to FIG. 10, which is a schematic side view of the wafer mounter in FIG. 9 performing the adsorption process. The adsorption mechanism 440 descends to adsorb the film 2. At this time, the clamping mechanism 430 of the film stretching device 40 is still in a clamping state and continues to pull the film 2.

Step S16 is to execute a new cutting process. The moving stage 220 of the film attaching device 20 transports the wafer 3 on the attaching area 22 under the film 2 to the bottom of the film cutting device 30. The driving motor 310 of the film cutting device 30 drives the film cutter 320 to descend close to the wafer 3 so that the film cutter 320 cuts the next attaching area 22 of the film 2. After the step S16 is completed, an attachment area 22 under the film 2 remains on the surface of the wafer 3. The film 2 remaining on the film conveying device 10 forms a new hollow hole at the original position of the next attaching area 22. At this time, the clamping mechanism 430 of the film stretching device 40 is still in a clamping state and continues to pull the film 2. The detailed operation of step S16 is similar to that of step S12, so it will not be repeated here.

Step S17 is to execute a new film pulling procedure. The clamping mechanism 430 of the film stretching device 40 releases the film 2 and is in a released state. Next, the film stretching mechanism 420 of the film stretching device 40 moves from the second working position to the first working position again along the direction opposite to the conveying direction D1. After the film pulling device 40 moves to the first working position, the clamping mechanism 430 moves along the clamping direction D3 to clamp the film 2. Then, the two film pulling mechanisms 420 move along the film pulling directions D21 and D22 to move the two clamping mechanisms 430 away from each other, and then pull the film 2. The detailed action of step S17 is similar to that of step S13, so it will not be repeated here. After step S17 is completed, the suction mechanism 440 stops sucking the film 2.

The two hollow holes produced in step S12 and step S16 significantly reduce the structural strength of the film 2, resulting in that the curling and wrinkles of the film 2 will be more obvious after the next attachment area 22 is cut off. In this embodiment, the suction mechanism 440 executes the suction procedure of step S15 and then executes the cutting procedure of step S16 and the film pulling procedure of step S17. Thereby, the suction mechanism 440 and the suction procedure help to slow down the curling and wrinkles of the film 2 when the clamping mechanism 430 of the film stretching device 40 releases the film 2, and prevent the film 2 from being pulled by the film stretching mechanism 420 to prevent the hollow cavity from collapsing. The problem of the disappearance of the Ministry.

In this embodiment, steps S14 to S17 can be executed cyclically, and the multiple attachment areas of the film 2 are attached to the multiple wafers 3 respectively.

In the first embodiment, the film conveying device includes a first film conveying wheel, a second film conveying wheel for adjusting the film conveying direction, and a film racking wheel for film erection, but the present invention is not limited to this. FIG. 11 is a schematic side view of a wafer mounter according to a second embodiment of the present invention. Since the second embodiment is similar to the first embodiment, only the differences will be described below.

In this embodiment, the wafer sticking machine 1a includes a film conveying device 10a, a film sticking device 20, a film cutting device 30, and a film pulling device 40. The film conveying device 10 a includes a frame film wheel 130 and a waste film recovery wheel 140. There is a film sticking work area R between the film rack wheel 130 and the waste film recycling wheel 140. The film frame wheel 130 is used to carry the film 2 wound into a cylindrical shape, and the waste film recovery wheel 140 is used to recover the excess waste film remaining after the film 2 is cut. In short, in this embodiment, the connecting line between the film frame wheel 130 and the waste film recovery wheel 140 is parallel to the conveying direction D1, so the film frame wheel 130 and the waste film recovery wheel 140 can be used as film conveying wheels. .

In summary, in the wafer laminating machine and the film stretching device disclosed in the present invention, the film stretching device is arranged in the film bonding work area and can pull the film along a film drawing direction, wherein the film drawing direction is substantially orthogonal to the transport direction of the film . Furthermore, the film stretching device includes a clamping mechanism and a film stretching mechanism. The clamping mechanism can move in the clamping direction to clamp the film, and the film stretching mechanism can drive the clamping mechanism to pull the film in the film stretching direction. The holding direction is substantially orthogonal to the film pulling direction. In addition, the wafer attaching method disclosed in the present invention includes performing a film pulling process to pull the film between the hollow hole formed after the film is cut and the next attaching area. In this way, the film pulling device pulls the film erected on the film conveying device to eliminate curling or wrinkles caused by uneven tension distribution near the hollow hole after cutting, so that the collapsed part of the hollow hole disappears, thereby ensuring the next piece The film can be smoothly attached to the surface or back of the wafer when the wafer is placed in the mold process.

Although the present invention is disclosed above with the foregoing embodiments, these embodiments are not intended to limit the present invention. All changes and modifications made without departing from the spirit and scope of the present invention fall within the scope of the patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached scope of patent application.

1. 1a: Wafer mounter 2: Thin film 21: Attaching area 22: Next attaching area 23: Hollow 231: First end 232: Second end 233: Collapse part 3: Wafer 10, 10a: Film Conveying device 110: first film conveying wheel 120: second film conveying wheel 130: film racking wheel 140: waste film recycling wheel 150: jumping rod 20: filming device 210: hot pressing wheel 220: moving stage 30: film cutting device 310: Drive motor 320: Film cutter 40: Film pulling device 410: Base 420: Film pulling mechanism 430: Clamping mechanism 440: Adsorption mechanism C: Center position D1: Conveying direction D21, D22: Film pulling direction D3: Clamp Holding direction R: filming work area S11, S12, S13, S14, S15, S16, S17: steps

FIG. 1 is a schematic side view of a wafer mounter according to a first embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of a part of the film pulling device of the wafer mounter of FIG. 1. FIG. 3 is a schematic flow chart of the wafer attaching method according to the first embodiment of the present invention. FIG. 4 is a schematic side view of the wafer placement machine of FIG. 1 performing the placement process. FIG. 5 is a schematic side view of the wafer placement machine of FIG. 4 performing a cutting process. 6 is a schematic top view of the wafer mounter of FIG. 5 after the cutting process is completed. FIG. 7 is a schematic side view of the wafer placement machine of FIG. 6 performing a film pulling process. FIG. 8 is a schematic top view of the wafer film attaching machine of FIG. 7 performing a film pulling process. 9 is a schematic side view of the wafer placement machine of FIG. 8 executing a new placement process. FIG. 10 is a schematic side view of the wafer mounter of FIG. 9 performing a suction process. FIG. 11 is a schematic side view of a wafer mounter according to a second embodiment of the present invention.

1: Wafer mounter

10: Film conveying device

110: The first film conveying wheel

120: The second film conveying wheel

130: Frame film wheel

140: Waste film recycling wheel

150: Jumping bar

20: Film sticking device

210: Hot pressing wheel

220: mobile stage

30: Film cutting device

310: drive motor

320: film cutter

40: Film drawing device

410: Pedestal

420: Film pulling mechanism

430: clamping mechanism

440: Adsorption Mechanism

D1: Conveying direction

D21, D22: film drawing direction

D3: Clamping direction

R: Filming work area

Claims (12)

A wafer sticking machine includes: a film conveying device, including two film conveying wheels, a film sticking work area is arranged between the two film conveying wheels, and the film conveying device is used for conveying a film along the film sticking work area The direction moves from one of the film conveying wheels to the other of the film conveying wheels; a film sticking device is arranged in the sticking work area, and the sticking device is used to stick the film to the wafer; and a film pulling device is arranged In the film sticking work area, the film stretching device can pull the film along a film stretching direction, and the film stretching direction is substantially orthogonal to the conveying direction; wherein, the film stretching device includes a base, a film stretching mechanism, and A clamping mechanism, the film pulling mechanism is disposed on the base, the clamping mechanism is disposed on the film stretching mechanism, the clamping mechanism can move in a clamping direction relative to the film stretching mechanism to clamp the film, the stretching The film mechanism can drive the clamping mechanism to move relative to the base along the film pulling direction, and the clamping direction is substantially orthogonal to the film pulling direction. As for the wafer mounter described in claim 1, wherein the clamping direction and the film pulling direction are substantially orthogonal to the conveying direction. As for the wafer mounter described in the first item of the patent application, the film pulling device further includes a suction mechanism for sucking the film, and the film pulling mechanism and the clamping mechanism can move relative to the suction mechanism. As for the wafer mounter described in claim 1, wherein the clamping mechanism has a clamping state for clamping the film and a releasing state for not clamping the film. When the clamping mechanism is in the clamping In the state, the film pulling device is relative to the film conveying device from the film sticking work area A first working position close to one of the film conveying wheels moves to a second working position close to the other film conveying wheel. When the clamping mechanism is in the released state, the film stretching device starts from the second working position. The position is returned to the first working position. A film pulling device for pulling a film suitable for being attached to a wafer. The film pulling device comprises: a base; at least one film pulling mechanism arranged on the base; and at least one clamping mechanism arranged on the base; The at least one film pulling mechanism, the at least one clamping mechanism can move in a clamping direction relative to the at least one film stretching mechanism to clamp the film, and the at least one film stretching mechanism can drive the at least one clamping mechanism along the pulling The film direction moves relative to the base, and the clamping direction is substantially orthogonal to the film pulling direction. For the film stretching device described in item 5 of the scope of patent application, wherein the number of the at least one film stretching mechanism and the at least one clamping mechanism is two, the clamping directions of the two clamping mechanisms are the same, and the two stretching mechanisms The film pulling direction of the film mechanism is opposite. The film stretching device described in item 5 of the scope of the patent application further includes an adsorption mechanism for adsorbing the film, and the film stretching mechanism and the clamping mechanism can move relative to the adsorption mechanism. A method for attaching a film to a wafer for attaching a thin film to a wafer. The film has an adjacent attaching area and a next attaching area. The wafer attaching method includes: performing a film attaching procedure to attach the The area is attached to a wafer; Perform a cutting process to cut the attaching area of the film to form a hollow hole on the film. The hollow hole has a first end and a second end opposite to each other, and the second end is larger than the first end. The end is close to the next attaching area; and a film pulling procedure is performed to pull the film between the first end of the hollow hole and the next attaching area. According to the method for attaching a film on a wafer as described in item 8 of the scope of patent application, the film is pulled between the second end of the hollow hole and the next attaching area when the film drawing process is performed. As for the wafer attaching method described in claim 8, wherein the hollow hole of the film further has a center position between the first end and the second end, and when the film pulling process is performed, Pull the film between the center position of the hollow hole and the next attachment area. The wafer attaching method described in item 8 of the scope of the patent application further includes: performing an adsorption process to adsorb the film. In the wafer attaching method described in claim 11, the cutting process and the film pulling process are executed after the adsorption process is executed.

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