TWI735822B - Holding device and installation device - Google Patents

Abstract

The present invention provides a holding device and a mounting device for suppressing electronic parts that generate electronic parts from rebounding from a substrate. The gripping device includes: a gripping mechanism that grips electronic parts; and a pressing part, which is provided on the gripping mechanism, when the electronic parts held by the gripping mechanism are mounted on the substrate and the grip of the electronic parts is released to prevent the electronic parts from moving The electronic component is pressed by moving in the direction away from the substrate.

Description

Holding device and installation device

The invention relates to a holding device for holding electronic parts and a mounting device for mounting the held electronic parts on a substrate.

Previously, a technology was proposed to use a robot to hold electronic parts and insert the leads of the electronic parts into the through holes of the substrate. Such a mounting device is disclosed in Patent Document 1. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 5-55784

[The problem to be solved by the invention]

However, when using the electronic component mounting device disclosed in Patent Document 1, in order to mount a large number of electronic components in a short period of time, the robot moves at high speed and is mounted on the substrate. When the electronic components are mounted on the substrate, there is Possibility of springback of electronic parts. Specifically, when the robot is moved at a high speed to arrange electronic components on the substrate, the substrate is deflected due to a large force acting on the substrate, and the electronic components may spring back due to the restoring force of the substrate at this time. When the electronic component bounces back and rises, there is a possibility that the floating electronic component may fall off from the via hole of the substrate.

Therefore, in view of the above-mentioned circumstances, the present invention aims to provide a gripping device and a mounting device for electronic components that suppress the generation of electronic components springing back from the substrate. [Means to Solve the Problem]

The gripping device of the present invention is characterized by comprising: a gripping portion that grips an electronic component; and a pressing portion provided on the gripping portion for mounting the electronic component held by the gripping portion on a substrate to release the gripping portion When the electronic component is held, the electronic component is pressed to prevent the electronic component from moving in the direction of separation from the substrate.

In the holding device of the above-mentioned structure, the pressing part provided on the holding part presses the electronic part in such a way as to prevent the electronic part from moving in the direction of separation from the substrate when the holding of the electronic part is released. Bounce back and float. Therefore, when the electronic component is mounted on the substrate, it is possible to prevent the electronic component from falling off the substrate.

In addition, the pressing portion is provided at an opposing position in the holding portion facing the electronic component, and the front end of the pressing portion on the side close to the electronic component may also be based on the opposing position in the holding portion The distance between the electronic component and the above-mentioned electronic component is displaced in the direction of approaching and separating from the above-mentioned electronic component.

Since the front end of the electronic part side of the pressing part can be displaced in the direction of approaching and separating from the electronic part according to the distance between the opposing position of the holding part and the electronic part and the electronic part, the holding part When the grip is released and detached from the electronic component, the pressing part can also follow the electronic component and continue to abut to prevent the electronic component from floating. Therefore, when the grip is released from the grip, it is possible to more reliably prevent the electronic component from falling off the substrate.

In addition, the above-mentioned pressing portion may be an elastic body.

Since the pressing part is an elastic body, a simple structure can be used to suppress the floating of the electronic component due to spring back from the substrate.

In addition, in the holding portion, a passage is provided along a direction of approaching and separating from the electronic component, and the pressing portion can move inside the passage along the extending direction of the passage.

Since the pressing part can move inside the passage along the extending direction of the passage, a simple structure can be used to prevent the electronic components from floating due to springback from the substrate.

In addition, the mounting device of the present invention is characterized by including: a gripping portion that grips an electronic component; a pressing portion provided on the gripping portion for mounting the electronic component held by the gripping portion on a substrate to release the gripping portion When gripping the electronic component, pressing the electronic component in a manner that prevents the electronic component from moving in the direction of separation from the substrate; and a control unit that controls the gripping of the electronic component by the gripping unit, Releasing the grip of the part and the movement of the above-mentioned grip.

The mounting device with the above-mentioned configuration is controlled by the control unit to perform the gripping of the electronic component by the gripping section, the release of the gripping for the electronic component, and the movement of the gripping section. Therefore, the electronic component can be mounted on the substrate. It can prevent the electronic components from falling off the board, and can accurately and accurately perform the installation of the electronic components.

In addition, the above-mentioned grip may be configured as a hand of a robot.

Since the grip is constructed as the hand of the robot, it is possible to mount electronic components with high precision and high speed using the mounting device. [Effects of Invention]

According to the present invention, when the electronic component is mounted on the substrate, the rebound of the electronic component from the substrate can be suppressed, so that the electronic component can be reliably mounted on the substrate. Therefore, the electronic components can be installed more efficiently.

Hereinafter, the electronic component mounting device of the embodiment of the present invention will be described with reference to the accompanying drawings.

(Installation device 100) Fig. 1 is a diagram showing a schematic configuration of a mounting device 100 according to an embodiment of the present invention. As shown in FIG. 1, the mounting device 100 of this embodiment is configured to include a robot 11.

The robot 11 used in the installation device 100 includes: a base 12 fixed on the trolley, a pair of robotic arms 13a, 13b (first robotic arm 13a and second robotic arm 13b) supported on the base 12, and stored in The control unit 14 in the base 12. The robot 11 may be installed in a limited space (for example, 610 mm×620 mm) equivalent to a person.

Hereinafter, the direction in which the pair of robot arms extend is called the left-right direction, the direction parallel to the axis of the base shaft is called the up-down direction, and the direction orthogonal to the left-right direction and the up-down direction is called the front-rear direction. The robot 11 of this embodiment is applied to the installation site of a wiring board, and performs work of mounting electronic components with leads on the wiring board.

(A pair of robotic arms 13a, 13b) The first robotic arm 13a (the robotic arm on the right in the figure) and the second robotic arm 13b (the robotic arm on the left in the figure) are respectively configured as horizontal multi-joint robotic arms that can move relative to the base 12. The first robot arm 13a includes an arm 15, a wrist 17, and a first end effector 18a. The second robot arm 13b includes an arm portion 15, a wrist portion 17, and a second end effector 18b. In addition, the pair of robot arms 13a, 13b can operate independently, or can operate in association with each other.

In this embodiment, the arm part 15 is comprised by the 1st link 15a and the 2nd link 15b. The first link 15a is rotatably connected to the base shaft 16 fixed on the upper surface of the base 12 through a rotary joint J1, and can rotate around a rotation axis L1 passing through the axis of the base shaft 16. The second link 15b is rotatably connected to the front end of the first link 15a by a rotary joint J2, and can rotate around a rotation axis L2 defined at the front end of the first link 15a.

A wrist 17 is attached to the front end of the second link 15b. The front end of the second link 15b and the wrist 17 are connected via a linear motion joint J3 and a rotary joint J4. The wrist 17 can move up and down with respect to the second link 15b by the linear motion joint J3. The wrist 17 can rotate around a rotation axis L3 perpendicular to the second link 15b by the rotation joint J4. The wrist 17 has a mechanical interface 19 for mounting the first end effector 18a or the second end effector 18b.

The first end effector 18a is connected to the mechanical interface 19 of the wrist 17 on the right. That is, the first end effector 18a is provided at the front end of the first robot arm 13a. Similarly, the second end effector 18b is connected to the mechanical interface 19 of the wrist 17 on the left. In this embodiment, the second end effector 18b is not used, and nothing is connected to the mechanical interface 19 of the wrist 17 on the left.

The pair of robot arms 13a and 13b, which are one of the aforementioned configurations, respectively have joints J1 to J4. In addition, a pair of robot arms 13a, 13b are respectively provided with a driving servo motor (not shown) and an encoder (not shown) for detecting the rotation angle of the servo motor in a manner corresponding to the joints J1 to J4. Icon) and so on. In addition, the rotation axis L1 of the first link 15a of the first robotic arm 13a and the rotation axis L1 of the first link 15a of the second robotic arm 13b are on the same straight line, and the first link 15a of the first robotic arm 13a The first link 15a of the second robot arm 13b is arranged with a height difference up and down.

(The first end effector 18a) 2, the first end effector 18a will be described. FIG. 2 shows a state in which the robot 11 used in the mounting device 100 of the present embodiment is holding a plurality of electronic components E on a holding device 60 provided as an end effector.

The first end effector 18a includes a gripping device 60 that is rotatably disposed at its base and used to grip the electronic component E; and a connecting portion 70 that connects the gripping device 60 to the wrist 17. The connecting portion 70 extends from the arm portion 17 downward in the vertical direction.

The gripping device 60 includes a plurality of gripping mechanisms 1 (gripping parts) 64. In this embodiment, the gripping device 60 includes eight gripping mechanisms 64. The gripping mechanism 64 is configured to be able to grip one electronic component E respectively. In the gripping device 60, eight gripping mechanisms 64 are arranged radially at intervals along the circumferential direction.

In addition, the holding device 60 includes a circular plate member 62. The circular plate member 62 is installed on the connecting portion 70 in such a manner that the center portion is located near the lower end of the connecting portion 70. The circular plate member 62 is set to be rotatable. In this embodiment, the disc member 62 is installed so as to be rotatable about the rotating shaft 1 extending in the horizontal direction. Therefore, the circular plate member 62 is installed so as to be rotatable in a plane perpendicular to the horizontal plane.

The gripping mechanism 64 has a clamp part 80 at the tip part, respectively.

Each of the eight gripping mechanisms 64 grips one electronic component E to mount the electronic component E on the substrate. Each of the eight gripping mechanisms 64 includes a diametrically extending portion 66 extending along the diameter direction of the disc member 62 and a clamp portion 80 provided at the front end of the diametrically extending portion 66. The clamp part 80 of this embodiment restrains the electronic component E so that it clamps from the outer side of the electronic component E, and grips the electronic component E. As shown in FIG.

(Controlling Agency 64) In FIG. 3, an enlarged perspective view of one of the eight gripping mechanisms 64 is shown. The gripping mechanism 64 includes a plurality of clamp parts 80. In this embodiment, the gripping mechanism 64 includes three clamp portions 80a, 80b, and 80c.

The three clamp parts 80a, 80b, and 80c are configured to be movable in the directions of approaching and separating from each other. The structure is as follows: in a state where the plurality of clamp parts 80 are separated from each other, the electronic component is sandwiched between them, and the plurality of clamp parts 80 are moved in the direction of approaching each other, so that the gripping mechanism 64 can hold the electronic component E . In addition, the gripping mechanism 64 can release the grip of the electronic component E by moving the plurality of gripper sections 80 in a direction separating each other from the state in which the electronic component E is held between the plurality of gripper sections 80.

In this embodiment, when the gripping mechanism 64 grips the electronic component E, the electronic component E is arranged in a state where the three clamp portions 80a, 80b, and 80c are separated from each other, respectively. In the state where the electronic component E is arranged between the three clamp portions 80a, 80b, and 80c, the three clamp portions 80a, 80b, and 80c are moved in the direction of approaching each other to clamp the electronic component E, thereby holding The mechanism 64 holds the electronic component E. In addition, by moving the three clamp parts 80a, 80b, and 80c in the direction to separate from each other from the state in which the three clamp parts 80a, 80b, and 80c are held by the holding mechanism 64, the holding by the holding mechanism 64 is released.

In addition, although the embodiment in which the gripping mechanism 64 includes the three clamp portions 80a, 80b, and 80c has been described in this embodiment, the present invention is not limited to the above-mentioned embodiment. The gripping mechanism 64 may also have a form having two clamp parts. In this case, the electronic component E may be clamped and held by two clamp parts from both sides. In addition, the gripping mechanism can also be equipped with 4 or more clamp parts. It may also have a configuration in which the four or more clamp parts move in the direction of approaching each other to clamp the electronic component located inside, thereby gripping the electronic component.

In this embodiment, a pressing part 81 is attached to the clamp part 80a among the three clamp parts 80. As shown in FIG. The pressing portion 81 is installed at a position (opposing position) facing the electronic component E in the clamp portion 80 a of the holding mechanism 64. In this embodiment, the pressing part 81 is attached to the front end of the clamp part 80a. The pressing portion 81 is formed of an elastic body. In this embodiment, the pressing portion 81 is formed of a spring.

(Control composition) Next, the control structure of the mounting device 100 will be described. In FIG. 4, a block diagram of the control structure in the installation device 100 is shown.

As shown in FIG. 4, the control unit 14 in the mounting device 100 includes a computing unit 14a, a storage unit 14b, and a servo control unit 14c.

The control unit 14 is a robot controller equipped with a computer, such as a microcontroller. In addition, the control section 14 may be composed of a single control section 14 for centralized control, or may be composed of a plurality of control sections 14 that cooperate with each other and perform distributed control.

The storage unit 14b stores basic programs as a robot controller, various fixed data, and other information. The computing unit 14a controls various operations of the installation device 100 by reading and executing software such as basic programs stored in the storage unit 14b. That is, the computing unit 14a generates a control command for the mounting device 100 and outputs it to the servo control unit 14c. For example, the arithmetic unit 14a is constituted by a processor unit.

The servo control unit 14c is configured to control the driving of the servo motors corresponding to the respective joints of the robot arms 13a and 13b in the mounting device 100 based on the control instructions generated by the computing unit 14a.

(Installation of electronic component E) Next, the mounting of the electronic component E on the substrate S using the mounting device 100 will be described. In FIGS. 5( a) to (d ), regarding each step when mounting the electronic component E on the substrate S, a configuration diagram showing the configuration of the gripping mechanism 64 and the electronic component E is shown.

In FIG. 5(a), the holding mechanism 64 and the electronic component E are shown in the state which moved the holding mechanism 64 holding the electronic component E toward the via holes 90 and 91 in the board|substrate S for mounting. As shown in FIG. 5( a ), the gripping mechanism 64 grips the electronic component E by gripping with the gripper 80 in the gripping mechanism 64. The gripping mechanism 64 moves to the via hole to be the mounting target of the substrate S while holding the electronic component E.

When the leads 68, 69 extending from the electronic component E reach the positions corresponding to the via holes 90, 91 of the substrate S that are to be mounted, the gripping mechanism 64 moves downward from there, and the electronic component E approaches the substrate S. The lead wires 68 and 69 are inserted into the through holes 90 and 91. FIG. 5(b) shows the structure of the holding mechanism 64 and the electronic component E in a state where the leads 68, 69 extending from the electronic component E are inserted into the through holes 90, 91. In this state, the electronic component E is held by the clamp part 80.

If the leads 68, 69 of the electronic component E are inserted into the through holes 90, 91 in the substrate S, the clamp portion 80 in the holding mechanism 64 moves in a direction to separate from each other. FIG. 5(c) shows a configuration diagram of the gripping mechanism 64 and the electronic component E in a state where the gripper portion 80 of the gripping mechanism 64 is moved in a mutually separated direction. When the gripper portion 80 in the gripping mechanism 64 moves in a mutually separated direction, the gripping of the electronic component E by the gripping mechanism 64 is released.

At this time, the pressing portion 81 presses the electronic component E in a direction toward the substrate S from above. Therefore, the pressing portion 81 presses the electronic component E in a direction that prevents the electronic component E from moving upward.

When the gripping mechanism 64 releases the grip of the electronic component E, the gripping mechanism 64 moves in the direction of separation from the electronic component E. FIG. 5(d) shows a configuration diagram showing a state in which the gripping mechanism 64 moves in a direction separating from the electronic component E. If the holding mechanism 64 is separated from the electronic component E, and the front end 81a of the pressing portion 81 on the electronic component E side is separated from the electronic component E, the mounting of the electronic component E on the substrate S is completed.

In this embodiment, the robot 11 of the mounting device 100 includes a gripping device 60 as the first end effector 18a. That is, the gripping device 60 functions as a hand of the robot 11 in the mounting device 100. At this time, by following the control of the control unit 14 of the robot 11, the gripping device 60 is moved, and the gripping mechanism 64 is moved. Therefore, when the control unit 14 of the robot 11 moves the gripping device 60, the gripping mechanism 64 moves while holding the electronic component E, and inserts the leads 68 and 69 of the electronic component E into the through holes 90 and 91 of the substrate S middle. In addition, the control unit 14 of the robot 11 controls the gripping of the electronic component E by the gripping device 60 and the release of gripping. Therefore, under the control of the control unit 14 of the robot 11, the grip of the electronic component E is released, and the gripping mechanism 64 moves in the direction of separating from the electronic component E.

Then, the gripping device 60 rotates and moves the disc member 62 so that the next gripping mechanism 64 is arranged at a position facing the through hole of the substrate S that is the mounting target. With this, the next holding mechanism 64 starts to mount the electronic component E in the next via hole.

As the mounting device 100 of the electronic component E, in order to increase the processing amount during mounting, there are cases where the holding mechanism 64 is moved at a high speed to mount the electronic component E at a high speed. When the electronic component E is mounted at a high speed, the speed when the leads 68 and 69 of the electronic component E are inserted into the through holes 90 and 91 and moved downward is high. In this case, it is considered that when the electronic component E is mounted on the substrate S, the bottom surface of the electronic component E abuts on the substrate S, and a relatively large force F1 acts on the bottom surface of the electronic component E to push the substrate S downward. direction.

As shown in FIG. 5(b), if the force F1 acts on the direction in which the substrate S is pushed downward, the substrate S is slightly bent so as to bulge downward. Once the substrate S flexes in a downwardly convex manner, thereafter, due to the restoring force of the substrate S, the substrate S flexes in a upwardly convex direction. With the restoring force of the substrate S at this time, the force F2 acts on the electronic component E in the upward direction.

Suppose that when the pressing portion 81 does not exist, the electronic component E may float due to the upward force F2 of the electronic component E. When the force F2 is large at this time, the lead wires 68 and 69 of the electronic component E move above the through holes 90 and 91, and there is a possibility that the electronic component E may fall off from the through holes 90 and 91.

In this embodiment, a pressing portion 81 is arranged at a position facing the electronic component E in the clamp portion 80a. Therefore, when the gripper 80 moves in a direction to separate from each other and the gripping mechanism 64 releases the grip of the electronic component E, the electronic component E can be pressed downward. Therefore, after the grip of the grip mechanism 64 is released, the electronic component E can be restrained from moving upward.

Since the upward movement of the electronic component E is suppressed, it is possible to prevent the electronic component E from accidentally falling out of the via holes 90 and 91 of the substrate S. Therefore, when the electronic component E is mounted on the substrate S, the leads 68 and 69 of the electronic component E will not fall off from the via holes 90 and 91, and the electronic component E can be reliably mounted on the substrate S. Since the mounting of the electronic component E is performed reliably, the mounting of the electronic component E can be performed more efficiently. Therefore, when the electronic component E is installed, the running cost can be reduced.

In addition, even if the holding mechanism 64 is moved at a high speed and the electronic component E is mounted at a high speed, the electronic component E can be mounted reliably. Therefore, the number of electronic components E that can be installed per unit time can be increased, and the processing capacity of the installation of electronic components E can be increased.

In addition, in the present embodiment, the pressing portion 81 is formed of a spring, so it is configured such that the front end 81a on the side close to the electronic component E can be displaced in the direction of approaching and separating from the electronic component E. Therefore, as shown in FIG. 5( c ), when the gripping mechanism 64 releases the grip of the electronic component E and the gripping mechanism 64 moves in the direction of separation from the electronic component E, the pressing portion 81 may continue to abut the electronic component E.

In this embodiment, as shown in FIG. 5( b ), in a state where the pressing portion 81 is compressed, the electronic component E is gripped by the gripping mechanism 64. Therefore, the pressing portion 81 is attached to the front end of the holding mechanism 64 while urging in the direction toward the electronic component E. Even if the gripping mechanism 64 moves and the gripper portion 80 of the gripping mechanism 64 is detached from the electronic component E, the front end 81a of the electronic component E in the pressing portion 81 is also based on the distance between the gripper portion 80 of the gripping mechanism 64 and the electronic component E And it is displaced in the direction toward the electronic component E. Therefore, the pressing portion 81 can continue to contact the electronic component E continuously. In this way, the front end 81a of the pressing portion 81 on the electronic component E side is configured to be displaced according to the distance between the position facing the electronic component E in the holding mechanism 64 and the electronic component E. Therefore, when the grip of the electronic component E by the gripping mechanism 64 is released, the grip of the electronic component E by the gripping mechanism 64 is released in a state where the pressing portion 81 and the electronic component E are already in contact. In this way, when the grip of the electronic component E by the gripping mechanism 64 is released, the pressing portion 81 is already in contact with the electronic component E, and the electronic component E is prevented from moving upward.

When the grip of the gripping mechanism 64 is released, the gripping mechanism 64 moves in the direction of separation from the electronic component E when the front end 81a of the pressing portion 81 is in contact with the electronic component E, so that the electronic components can be gradually reduced. The pressing force of the part E releases the grip of the gripping mechanism 64. When the grip of the electronic component E by the gripping mechanism 64 is released, the grip is released while the pressing force in the direction toward the substrate S is gradually reduced, so that the pressing force on the electronic component E can be suppressed from being suddenly released.

Suppose that if the pressing force of the holding mechanism 64 is released rapidly, the elastic energy caused by the downward displacement of the substrate S is released rapidly, and there is a sudden upward displacement of the electronic component E, causing the leads 68, 69 to fall off from the via holes 90, 91 The possibility.

In contrast to this, in this embodiment, even if the grip of the gripping mechanism 64 is released, the pressing portion 81 continues to press the electronic component E in the direction toward the substrate S, and gradually reduces the pressing force in the direction toward the substrate S. The holding mechanism 64 is separated from the electronic component E. Therefore, when the gripping mechanism 64 releases the grip, it is possible to suppress the rapid release of elastic energy from the substrate S due to the displacement of the substrate S. Thereby, the electronic component E can be prevented from springing back and floating, and the leads 68 and 69 of the electronic component E can be prevented from falling off from the via holes 90 and 91 of the substrate S.

In addition, in this embodiment, since the gripping mechanism 64 is configured as a hand of a robot, it is possible to mount the electronic component E of the mounting device 100 with high accuracy and high speed. In addition, in this embodiment, the gripping mechanism 64 controls the electronic component E, the gripping mechanism 64 releases the electronic component E, and the gripping mechanism 64 moves. Perform these actions accurately and with high precision.

(Second Embodiment) Next, the test device of the second embodiment of the present invention will be described. In addition, for the parts configured in the same manner as the first embodiment described above, the same reference numerals are attached to the drawings, and the description is omitted, and only the different parts will be described.

In the first embodiment described above, the pressing portion 81 is formed of an elastic body. In contrast, the second embodiment differs from the first embodiment in that the pressing portion is composed of a columnar body that can move inside the passage.

FIG. 6(a) shows a configuration diagram of the gripping mechanism 64a and the electronic component E in a state where the gripping mechanism 64a of the second embodiment grips the electronic component E. 6(b) shows a configuration diagram of the gripping mechanism 64a and the electronic component E in a state where the gripping of the electronic component E by the gripping mechanism 64a of the second embodiment is released.

In the gripping mechanism 64a of the second embodiment, a passage 83 is provided in the clamp portion 80a. In this embodiment, the passage 83 is provided so as to penetrate the clamp portion 80a in the vertical direction. A pressing portion 82 is provided in the passage 83 in the clamp portion 80a. The pressing portion 82 is configured to be movable inside the passage 83. In this embodiment, the pressing portion 82 is a columnar body that can move inside the passage 83 along the extending direction of the passage 83. In this embodiment, the pressing portion 82 is formed in a cylindrical shape so that the cross section along the horizontal plane becomes a circular shape.

In addition, in the end portion of the pressing portion 82 on the side opposite to the electronic component E, a flange portion 82a having a larger diameter than the cylindrical portion is formed. At the end 82b of the flange portion 82a that faces the electronic component E, a pressing portion 82 is formed so as to abut the electronic component E. In addition, a flange portion 82c having a larger diameter than the cylindrical portion is formed at the end portion of the pressing portion 82 on the opposite side to the side opposite to the electronic component E.

As shown in FIG. 6(a), in the state where the holding mechanism 64a of this embodiment holds the electronic component E, the electronic component E is clamped and held by the clamp parts 80a, 80b, and 80c.

As shown in Figure 6(b), if the leads 68, 69 of the electronic component E are inserted into the through holes 90, 91 in the substrate S, the clamp portions 80a, 80b, and 80c of the holding mechanism 64a move in the direction of separation from each other, respectively , The grip of the electronic component E clamped by the clamp parts 80a, 80b, 80c is released.

At this time, the pressing portion 82 presses the electronic component E in the direction toward the substrate S.

In this embodiment, a passage 83 is provided in the clamp portion 80a, and in the passage 83, the pressing portion 82 is arranged to be movable inside the passage 83. Therefore, when the gripper portions 80a, 80b, and 80c of the gripping mechanism 64a release the grip of the electronic component E, the pressing portion 82 can press the electronic component E downward. In this way, the pressing part 82 has already pressed the electronic part E when the clamp parts 80a, 80b, and 80c of the holding mechanism 64a release the grip of the electronic component E. In this embodiment, the pressing part 82 presses the electronic component E downward by its own weight. Therefore, after the gripping of the gripper portions 80a, 80b, and 80c of the gripping mechanism 64a is released, the electronic component E can be suppressed from moving upward. Thereby, when the electronic component E is mounted on the substrate S, the leads 68 and 69 of the electronic component E will not fall off from the through holes 90 and 91, and the electronic component E can be reliably mounted on the substrate S. Since the mounting of the electronic component E is performed reliably, the mounting of the electronic component E can be performed more efficiently. Therefore, when the electronic component E is installed, the running cost can be reduced.

In addition, even if the holding mechanism 64a is moved at a high speed and the electronic component E is mounted at a high speed, the electronic component E can be mounted reliably. Therefore, the number of electronic components E that can be installed per unit time can be increased, and the processing capacity of the installation of electronic components E can be increased.

In addition, in the present embodiment, the pressing portion 82 is configured such that the front end portion 82b on the side close to the electronic component E can be displaced in the direction of approaching and separating from the electronic component E. Since the pressing portion 82 is configured to be freely movable inside the passage 83, even if the gripping mechanism 64a moves in the direction separating from the electronic component E, the pressing portion 82 follows the electronic component E and moves in the direction toward the electronic component E. That is, even if the clamp portion 80 of the holding mechanism 64a is detached from the electronic component E, the front end 82b on the electronic component E side in the pressing portion 82 is determined by the position of the holding mechanism 64a facing the electronic component E and the electronic component E The distance between the two is displaced in the direction toward the electronic component E. Therefore, the pressing portion 82 can continue to contact the electronic component E continuously.

In this way, it is configured that the front end 82b of the pressing portion 82 on the electronic component E side can be displaced according to the distance between the clamp portion 80 of the gripping mechanism 64 and the electronic component E. Therefore, when the grip of the electronic component E by the gripping mechanism 64 is released, the grip of the electronic component E by the gripping mechanism 64a is released in a state where the pressing portion 82 is in contact with the electronic component E. In this way, at the time when the grip of the electronic component E by the gripping mechanism 64a is released, the pressing portion 82 is already in contact with the electronic component E, and the electronic component E is prevented from moving upward. Therefore, as shown in FIG. 6(b), when the gripping mechanism 64a releases the grip of the electronic component E and the gripping mechanism 64a moves in the direction of separating from the electronic component E, the pressing portion 82 can also continue to abut against the electronic component E. Press the electronic part E.

If the state of holding the electronic component E from the holding mechanism 64a as shown in Figure 6(a) becomes as shown in Figure 6(b), the holding mechanism 64a releases the holding state of the electronic part E, then the electronic part E becomes a state in which only the pressing of the pressing portion 82 by its own weight exerts an effect.

A flange portion 82c is provided at the end of the pressing portion 82 on the opposite side to the side facing the electronic component E. If the gripping mechanism 64a is further separated from the electronic component E from the state shown in FIG. 6(b), the flange portion 82c abuts the clamp portion 80a, and the pressing portion 82 is in a state where the electronic component E cannot be further pressed. If the gripping mechanism 64a further moves in the direction of separation from the electronic component E, the pressing portion 82 will be separated from the electronic component E.

In this embodiment, when the gripping mechanism 64a releases the grip of the electronic component E, the pressing force changes from the pressing of the gripping mechanism 64a to the pressing by the weight of the pressing portion 82, and thereafter, the pressing force to the electronic component E disappears. At this time, the pressing force by the weight of the pressing portion 82 is smaller than the pressing force of the gripping mechanism 64a.

In this embodiment, when the grip of the electronic component E by the gripping mechanism 64a is released, the pressing force acting on the electronic component E is changed in the following manner: from the pressing of the gripping mechanism 64a, temporarily passing through the pressing by the weight of the pressing portion 82 It becomes a state where the pressing force no longer works. Therefore, when the grip of the electronic component E by the gripping mechanism 64a is released, the pressing force on the electronic component E is changed in a stepwise manner, so that the grip of the electronic component E by the gripping mechanism 64a is released.

When the holding by the holding mechanism 64 is released, the pressing force in the direction toward the substrate S is gradually reduced, and the holding is released at the same time. Therefore, the pressing force on the electronic component E is suppressed from being released suddenly. In this embodiment, even if the grip of the gripping mechanism 64a is released, the pressing portion 82 continues to press the electronic component E toward the substrate S, and the pressing force toward the substrate S is gradually reduced. At the same time, the gripping mechanism 64a Separate from electronic part E. Therefore, when the gripping mechanism 64a releases the grip, it is possible to suppress the rapid release of elastic energy from the substrate S due to the displacement of the substrate S. Thereby, it is possible to prevent the electronic component E from floating and causing the leads 68 and 69 of the electronic component E to fall off from the via holes 90 and 91 of the substrate S.

In addition, although in the above-mentioned embodiment, the elastic body and the columnar body which can move inside the passage in the clamp part are used as the structure of a pressing part have been demonstrated, this invention is not limited to the above-mentioned embodiment. If it is a structure that can press the electronic component when the grip of the electronic component is released by the gripping mechanism and restrain the electronic component from springing back from the substrate, other structures of the pressing portion can also be applied to the present invention.

60‧‧‧Holding device 64‧‧‧Controlling Organization 68、69‧‧‧Lead 80a, 80b‧‧‧Fixture Department 81、82‧‧‧Pressing part 81a‧‧‧Front end 90、91‧‧‧Through hole 100‧‧‧Installation device S‧‧‧Substrate E‧‧‧Electronic parts F1, F2‧‧‧force

Fig. 1 is a front view showing a schematic configuration of the mounting device of the first embodiment of the present invention. Fig. 2 is an enlarged side view showing the holding device in the installation device of Fig. 1; Fig. 3 is an enlarged perspective view showing the holding mechanism in the holding device of Fig. 2; FIG. 4 is a block diagram showing the structure of the control system of the installation device of FIG. 1. FIG. Figures 5 (a) to (d) are structural diagrams showing the steps of mounting electronic components on a substrate using the mounting device of Figure 1; Fig. 6 (a) and (b) are structural diagrams showing each step of mounting an electronic component on a substrate using the mounting device of the second embodiment of the present invention.

64‧‧‧Controlling Organization

68、69‧‧‧Lead

80a, 80b‧‧‧Fixture Department

81‧‧‧Pressing part

81a‧‧‧Front end

90、91‧‧‧Through hole

S‧‧‧Substrate

E‧‧‧Electronic parts

F1, F2‧‧‧force

Claims (6)

A gripping device, characterized by comprising: a gripping portion that grips an electronic component; and a pressing portion provided on the gripping portion for mounting the electronic component held by the gripping portion on a substrate to release the gripping portion against the When the electronic component is held, the electronic component is pressed in a manner that prevents the electronic component from moving in the direction of separation from the substrate; the holding portion releases the electronic component from the mounting position where the electronic component is mounted on the substrate. After the gripping portion releases the grip of the electronic component, the front end portion of the electronic component side of the pressing portion moves from the state of contacting the electronic component to the release position when the electronic component is released from the state, and moving from the electronic component The component is separated from the electronic component by moving a predetermined distance from the depressing release position and then in the detaching direction from the electronic component; After the component continues to abut, and the grip portion releases the grip of the electronic component, it continues to abut the electronic component even when the grip portion moves to the predetermined distance until the pressing release position is moved. The gripping device according to claim 1, wherein the pressing portion is provided at a position facing the electronic component in the gripping portion, and the front end of the pressing portion on the side close to the electronic component may be based on the above The distance between the opposing position in the grip and the electronic component is displaced in the direction of approaching and separating from the electronic component. The holding device according to claim 1 or 2, wherein the pressing portion is an elastic body. The holding device as described in claim 2, wherein In the holding portion, a passage is provided along a direction of approaching and separating from the electronic component, and the pressing portion can move inside the passage along the extending direction of the passage. A mounting device, characterized by comprising: a holding portion for holding an electronic component; a pressing portion provided on the holding portion for mounting the electronic component held by the holding portion on a substrate to release the holding portion from the electronic component When holding the part, press the electronic part in a manner that prevents the electronic part from moving in the direction of separation from the substrate; and a control unit that controls the holding of the electronic part by the holding part and the holding of the electronic part by the holding part The release of the holding part and the movement of the holding part; the holding part releases the holding of the electronic part when the electronic part is mounted on the mounting position of the substrate. After the holding part releases the holding of the electronic part, the electronic part in the holding part The front end of the component side moves a predetermined distance in the direction from which the electronic component is separated from the state in contact with the electronic component to the release position when it is released from the electronic component, and moves from the release position to the release The electronic component moves in the direction in which it is detached, thereby separating it from the electronic component; the pressing portion continuously abuts the electronic component when the gripping portion grips the electronic component, and after the gripping portion releases the grip of the electronic component, Even during the period during which the grip portion moves to the predetermined distance until the pressing release position is moved, it continues to abut the electronic component. The mounting device according to claim 5, wherein the grip portion is configured as a hand of a robot.

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