TWI734797B - 導電性糊及導電性圖案的形成方法 - Google Patents

導電性糊及導電性圖案的形成方法 Download PDF

Info

Publication number
TWI734797B
TWI734797B TW106120276A TW106120276A TWI734797B TW I734797 B TWI734797 B TW I734797B TW 106120276 A TW106120276 A TW 106120276A TW 106120276 A TW106120276 A TW 106120276A TW I734797 B TWI734797 B TW I734797B
Authority
TW
Taiwan
Prior art keywords
conductive paste
silver
organic solvent
conductive
conductive pattern
Prior art date
Application number
TW106120276A
Other languages
English (en)
Chinese (zh)
Other versions
TW201809158A (zh
Inventor
新谷祐樹
外村卓也
Original Assignee
日商阪東化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商阪東化學股份有限公司 filed Critical 日商阪東化學股份有限公司
Publication of TW201809158A publication Critical patent/TW201809158A/zh
Application granted granted Critical
Publication of TWI734797B publication Critical patent/TWI734797B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
TW106120276A 2016-07-04 2017-06-19 導電性糊及導電性圖案的形成方法 TWI734797B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016132669 2016-07-04
JP2016-132669 2016-07-04

Publications (2)

Publication Number Publication Date
TW201809158A TW201809158A (zh) 2018-03-16
TWI734797B true TWI734797B (zh) 2021-08-01

Family

ID=60912462

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106120276A TWI734797B (zh) 2016-07-04 2017-06-19 導電性糊及導電性圖案的形成方法

Country Status (4)

Country Link
JP (2) JP6329703B1 (ja)
CN (1) CN109416955B (ja)
TW (1) TWI734797B (ja)
WO (1) WO2018008270A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6546309B1 (ja) * 2018-03-19 2019-07-17 株式会社ノリタケカンパニーリミテド 経時粘度が安定な導電性ペースト
CN112189039A (zh) * 2018-05-23 2021-01-05 株式会社大赛璐 导电性油墨
JP7157597B2 (ja) * 2018-08-31 2022-10-20 花王株式会社 水系金属微粒子分散体
JPWO2022195734A1 (ja) * 2021-03-16 2022-09-22
WO2023224555A2 (en) * 2022-05-17 2023-11-23 National University Of Singapore A composition and a composite material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161063A (ja) * 2008-12-09 2010-07-22 Mitsubishi Materials Corp 導電性ペースト組成物及び該組成物を用いた電極の製造方法
TW201615766A (zh) * 2014-10-02 2016-05-01 Daicel Corp 銀粒子塗料組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002133944A (ja) * 2000-10-27 2002-05-10 Sumitomo Rubber Ind Ltd 導電性インキ組成物とそれを用いた微細パターンの印刷方法および透光性電磁波シールド部材の製造方法
JP5332625B2 (ja) * 2008-01-22 2013-11-06 三菱マテリアル株式会社 金属ナノ粒子分散液及びその製造方法
JP5453813B2 (ja) * 2008-01-22 2014-03-26 三菱マテリアル株式会社 金属ナノ粒子分散液及びその製造方法
JP2011037999A (ja) * 2009-08-12 2011-02-24 Dic Corp 導電性インキ及び導電性パターン形成方法
JP2013077515A (ja) * 2011-09-30 2013-04-25 Sekisui Chem Co Ltd 導電ペースト及び太陽電池素子
TWI666656B (zh) * 2012-10-29 2019-07-21 阿爾發裝配解決方案公司 燒結粉末
JP6372689B2 (ja) * 2014-07-28 2018-08-15 Dic株式会社 導電性ペースト及び導電性パターンの形成方法
JP6101403B2 (ja) * 2014-11-25 2017-03-22 バンドー化学株式会社 導電性インク

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161063A (ja) * 2008-12-09 2010-07-22 Mitsubishi Materials Corp 導電性ペースト組成物及び該組成物を用いた電極の製造方法
TW201615766A (zh) * 2014-10-02 2016-05-01 Daicel Corp 銀粒子塗料組成物

Also Published As

Publication number Publication date
TW201809158A (zh) 2018-03-16
JPWO2018008270A1 (ja) 2018-07-05
JP6329703B1 (ja) 2018-05-23
CN109416955B (zh) 2020-12-29
WO2018008270A1 (ja) 2018-01-11
JP2018129310A (ja) 2018-08-16
CN109416955A (zh) 2019-03-01

Similar Documents

Publication Publication Date Title
TWI734797B (zh) 導電性糊及導電性圖案的形成方法
JP6220920B2 (ja) 銀微粒子分散体、銀微粒子及びその製造方法
JP6349310B2 (ja) 金属接合用組成物
TWI689466B (zh) 銀微粒子組成物
WO2014030310A1 (ja) 導電性ペースト
WO2014057633A1 (ja) 接合用組成物
TW201542731A (zh) 接合用組成物及使用該組成物之金屬接合體
TWI744372B (zh) 接合用組成物及其製造方法、接合體以及被覆銀奈米粒子
JP2017155166A (ja) 接合用組成物
JP6348241B1 (ja) グラビアオフセット印刷用導電性ペースト、導電性パターンの形成方法、及び、導電性基板の製造方法
TWI686447B (zh) 轉印印刷用導電性墨水
WO2016067599A1 (ja) 接合用組成物
TWI744314B (zh) 導電性墨水
TWI754708B (zh) 凹版轉印用導電性糊劑、導電性圖案的形成方法以及導電性基板的製造方法
JP6267835B1 (ja) 接合用組成物及びその製造方法
TWI757412B (zh) 銀奈米粒子的製造方法
JP2013167002A (ja) 金属微粒子分散液およびその製造方法
JP6290402B2 (ja) 無機粒子分散体
JP2020070489A (ja) 導電性微粒子分散体、導電性パターンの形成方法及び導電性基板の製造方法