TWI732576B - Miniature robotic device and arrangement system for micro dies - Google Patents

Abstract

A miniature robotic device includes a control circuit layer formed on a substrate and having an array of control circuits, and an arm layer formed on the control circuit layer and having an array of arm modules that corresponds to the array of control circuits in position. Each arm module includes a resilient and dielectric driving arm and a coil set. For each arm module, the coil set has two first coils that are disposed respectively on opposite side arm bodies of the driving arm, and two second coils that are disposed on the control circuit layer and that are spaced apart from and aligned respectively with the first coils; and a respective control circuit controls, using electromagnetic effect produced by the coil set as a result of first to fourth control currents flowing respectively through the first coils and the second coils, the displacement of a main arm body of the driving arm at its top when the main arm body is bent due to the electromagnetic effect, thereby driving movement of a micro die placed above the arm module.

Description

Micro robot device and micro crystal grain arrangement system

The present invention relates to the carrying and arrangement of micro-crystal grains, in particular to a micro-robot device and a micro-crystal grain arrangement system.

At present, miniaturized micro-LEDs are enjoying the advantages brought about by the reduction in size, but the miniaturized size is also facing new difficulties and challenges in manufacturing. In particular, the mass transfer technology in the manufacturing process of Micro-LED displays has become a key technology for energy production or profitability. In other words, if Micro-LEDs with millions of micrometers cannot be efficiently transferred from the epitaxial substrate to the display substrate within a reasonable time, the goal of mass production cannot be achieved.

Therefore, how to accurately arrange a large number of micro LEDs to be transferred into a desired shape or pattern to facilitate the subsequent transfer operation is one of the current important research and development topics, and it has also become a current related field that needs improvement. the goal.

Therefore, an object of the present invention is to provide a micro-robot device which can overcome at least one shortcoming of the prior art.

Therefore, a micro-robot device provided by the present invention is used to carry micro-die, and includes a substrate, a control circuit layer, and an arm layer.

The control circuit layer is formed on the substrate and includes a plurality of control circuits arranged in an array. Each control circuit is configured to generate and output first to fourth control currents in response to a corresponding control signal from the outside.

The arm layer is formed on the control circuit layer and includes a plurality of arm modules spaced apart and arranged in an array. Each arm module corresponds to and is controlled by a corresponding control circuit of one of the control circuits in position, and includes an insulated driving arm and a coil group. For each arm module, the insulated driving arm includes a main arm body that is elastic and extends upright from the control circuit layer, and two side arm bodies that extend outwardly from the main arm body opposite to each other in the radial direction , The length of the driving arm in the radial direction is less than the length and width of the microcrystalline grains to be carried; and the coil assembly is electrically connected to the corresponding control circuit, and has two first arms respectively arranged on the bottom side of the side arm bodies A coil, and two second coils respectively aligned with the first coils at intervals in the longitudinal direction and arranged on the control circuit layer, the first coils and the second coils are respectively allowed from the corresponding control circuit The outputted first to fourth control currents pass.

The extending direction of the side arm bodies of the driving arm of each arm module is perpendicular to the extending direction of the side arm bodies of the driving arm of any adjacent arm module.

For each arm module, the corresponding control circuit controls the main arm body through the electromagnetic effect generated by the coil group by the first to fourth control currents respectively flowing through the first coils and the second coils Displacement at the top end caused by bending due to the electromagnetic effect.

When a micro-crystal grain is placed on the arm layer, the micro-crystal grain can move through the displacement generated by one or more arm modules located below it.

Therefore, another objective of the present invention is to provide a microcrystalline grain arrangement system that can overcome at least one of the disadvantages of the prior art.

Therefore, the micro-crystal grain arranging system provided by the present invention is suitable for arranging N (N≧2) micro-crystal grains into a predetermined pattern, and includes the above-mentioned micro-robot assembly, an image capturing module, and an image recognition Module, and a mobile control module.

The micro robot device is used to drive the N micro crystal grains carried on the arm layer.

The image capturing module is arranged above the micro-robot device, and is configured to continuously capture images of the arm layer carrying the N microcrystalline grains at a predetermined frequency.

The image recognition module is electrically connected to the image capture module to receive each image captured by the image capture module, and for each image, recognize the N micro-crystal grains and obtain the respective bearing in the arm layer according to the recognition result There are regional position data of the N operating regions of the N microcrystalline grains.

The movement control module is electrically connected to the control circuit layer of the micro-robot device and the image recognition module, and when receiving the region position data from the image recognition module and corresponding to each image, performs a predetermined control A control process is periodically executed, wherein the movement control module uses a movement estimation algorithm to generate a movement estimation algorithm based on the area position data and the reference area position data of the N target areas associated with the predetermined arrangement pattern. The control output related to the movement of the micro-crystal grain is transmitted to the control circuit layer of the micro-robot device.

The control output generated by the movement control module in the control processing includes a plurality of arm modules provided to the control circuit layer in positions corresponding to the arm modules in the N operation regions of the arm layer. Control signals of each circuit module, so that each of the circuit modules generates the first to fourth control currents associated with the electromagnetic effect according to one of the received control signals corresponding to one of the control signals, and causes The driving arms of the arm modules are bent by electromagnetic effects, so as to jointly drive each of the N micro-crystal grains to move a predetermined distance toward one of the N target regions.

The movement control module repeatedly executes the control process until the N microcrystalline grains are arranged in the predetermined pattern.

The effect of the present invention is that the micro-robot device can effectively and quickly move the carried micro-crystal grains at an operating frequency of MHz to GHz level under proper electromagnetic effect control to arrange them in a predetermined pattern, thereby It is beneficial for the subsequent high-efficiency mass transfer treatment of the arranged microcrystalline grains.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

Referring to FIG. 1, the micro-crystal grain arrangement system 100 of the illustrated embodiment of the present invention is adapted to arrange N (N≧2) micro-crystal grains (not shown) into a predetermined pattern, and includes a micro-robot device 10, An image capturing module 20, an image recognition module 30, and a movement control module 40. In this embodiment, the micro-crystal grains to be arranged may be crystal grains smaller than 1×1 mm, for example, Mini-LED, Micro-LED or semiconductor wafer.

2 to 4, the micro-robot device 10 is used to carry the N micro-crystal grains (not shown), and includes a substrate 1, a control circuit layer 2 formed on the substrate 1, and a formation The arm layer 3 on the control circuit layer 2. It is worth noting that in this embodiment, the micro-robot device 10 can be manufactured by a known semiconductor process technology.

The substrate 1 can be implemented as a substrate such as a wafer, but it is not limited to this example.

The control circuit layer 2 includes a plurality of control circuits 21 arranged in an array, as shown in FIG. 3. It should be noted that, in fact, since each control circuit 21 is designed to have a very small circuit area, for example, about 200×200nm ² , for the sake of clarity, these control circuits 21 have been enlarged or exaggerated In Figure 3 and Figure 4. Each control circuit 21 is configured to generate and output first to fourth control currents I1 to I4 in response to a corresponding control signal. For example, the first to fourth currents I1 to I4 generated by each control circuit 21 are designed according to the corresponding control signal: the first current I1 and the second current I2 have the same magnitude but are opposite to each other I1=-I2; and the third current I3 and the fourth current I4 are the same as each other, that is, I3=I4, but not limited to this example. However, in other embodiments, the The first to fourth currents I1 to I4 can also be designed as I1=I2 and I3=-I4. More specifically, each control circuit 21 can be implemented, for example, by a CMOS logic circuit or a TTL (Transistor-Transistor Logic) circuit.

The arm layer 3 includes a plurality of arm modules 4 spaced apart and arranged in an array, wherein each of the forearm modules 4 corresponds to and is controlled by a corresponding control circuit 21 in position, as shown in FIG. 3.

Referring again to FIGS. 2, 4 and 5, each arm module 4 includes an insulated driving arm 41 and a coil assembly 42. The details of each arm module 4 will be described in further detail as follows.

The driving arm 41 includes an elastic main arm body 411 extending upright from the control circuit layer 2 and two side arm bodies 412 extending outward from the main arm body 411 opposite to each other in the radial direction. It is worth noting that the length of the driving arm 411 in the radial direction (that is, the distance between the free ends of the two side wall bodies 412) is smaller than the length and width of each microcrystalline grain to be carried. For example, if the size of the microcrystal grains to be carried is 10um×10um, the length of the driving arm 411 can be designed to be about 200 nm. It should be noted that the extension direction of the side arm bodies 412 of the driving arm 41 of each arm module 4 is perpendicular to the extension direction of the side arm bodies 412 of the driving arm 41 of any adjacent arm module 4 Direction (see Figure 3).

The coil assembly 42 is electrically connected to the corresponding control circuit 21 (see FIG. 2), and has two first coils 421, 422 respectively disposed on the bottom side of the side walls 412, and two first coils respectively connected to the first coils. The second coils 421, 422 are aligned at intervals in the longitudinal direction and are provided on the second coils 423, 424 of the control circuit layer 2 (corresponding to the control circuit 21). The first coils 421, 422 and the second coils 423, 424 respectively allow the first to fourth control currents I1 to I4 output from the corresponding control circuit 21 to pass (see FIG. 2).

In operation, for each arm module 4, the corresponding control circuit 21 passes through the first to fourth control currents I1 to I4 through the first coils 421, 422 and the second coils 423, 424 The electromagnetic effect generated by the coil assembly 42 controls the displacement of the main wall 411 at the top end caused by the bending of the main wall 411 due to the electromagnetic effect. For example, as shown in FIG. 6, if the first current I1, the third current I3 and the fourth current I4 have the same current direction, such as a counterclockwise direction, and the second current has a clockwise direction, for example In the case of the current direction, the direction of the induced magnetic field generated by the first coil 421 when the first current I1 flows is the same as the direction of the induced magnetic field generated by the third coil 423 when the third current I3 flows, Therefore, the first coil 421 and the third coil 423 are close to each other due to the magnetic force of the induced magnetic field; meanwhile, the direction of the induced magnetic field generated by the second coil 422 when the second current I2 flows is opposite to that of the fourth coil 424 is the direction of the induced magnetic field generated when the fourth current I4 flows, so the second coil 422 and the fourth coil 424 are far away from each other due to the mutually repulsive magnetic force of the induced magnetic field, causing the neck section of the main arm body 411 The 4111 bends toward the first coil 421 and the third coil 423 that are close to each other, so that the top end of the main arm body 411 is displaced toward the left side of the drawing. Or, as shown in FIG. 7, if the second current I2, the third current I3, and the fourth current I4 all have a counterclockwise current direction and the first current I1 has a clockwise current direction, the The direction of the induced magnetic field generated by the first coil 421 when the first current I1 flows is opposite to the direction of the induced magnetic field generated by the third coil 423 when the third current I3 flows, so the first coil 421 and the The third coil 423 is far away from each other due to the mutually repulsive magnetic force of the induced magnetic field; meanwhile, the direction of the induced magnetic field generated by the second coil 422 when the second current I2 flows is the same as that of the fourth coil 424 when the fourth current I4 flows. The direction of the induced magnetic field generated by the obsolescence, so the second coil 422 and the fourth coil 424 are close to each other due to the magnetic force of the induced magnetic field, causing the neck section 4111 of the main arm body 411 to face the second close to each other. The coil 422 and the fourth coil 424 are bent, so that the top end of the main arm body 411 is displaced toward the right side of the drawing. In this way, by designing the first current I1 and the second current I2 to be opposite to each other, the top end of the main arm body 411 can be controlled to move back and forth in the extending direction of the side wall bodies 412. In practical applications, if the arm module 4 is designed to have a size of about 200nm×200nm×200nm (that is, the height of the main arm body 411 is 200nm), the displacement can be designed to be in the range of 2nm~5nm The smallest distance within.

In use, when a microcrystalline grain (not shown in the figure) is placed on the arm layer 3, the microcrystalline grain can move through the displacement of one or more arm modules 4 located below it.

The image capturing module 20 is arranged above the micro-robot device 10, and is configured to continuously capture images of the arm layer 3 carrying the N microcrystalline grains at a predetermined frequency.

The image recognition module 30 is electrically connected to the image capture module 20 to receive each image captured by the image capture module 20, and for each image, recognize the N microcrystalline grains and obtain the arm layer according to the recognition result The area position data of the N operation areas of the N microcrystalline grains are respectively carried in 3.

The movement control module 40 is electrically connected to the control circuit layer 2 of the micro-robot device 10 and the image recognition module 30, and when receiving the region position data from the image recognition module 30 and corresponding to each image , In a predetermined control period, execute a control process, wherein the movement control module 40 uses a movement estimation algorithm according to the area position data and the reference area position data of the N target areas associated with the predetermined arrangement pattern In this way, a control output related to the movement of the N microcrystalline grains is generated, and the control output is transmitted to the control circuit layer 2 of the micro-robot device 10.

In this embodiment, the control output generated by the movement control module 40 in each control process includes a plurality of the N operations provided to the control circuit layer 2 corresponding to the arm layer 3 in position. The control signals of the plurality of circuit modules 21 of the plurality of arm modules 4 in the area, so that each of the circuit modules 21 generates an electromagnetic effect according to one of the received control signals corresponding to one of the control signals The first to fourth control currents are associated with each other, and the driving arms of the arm modules are bent by electromagnetic effects, so as to drive each of the N micro-crystal grains toward one of the N target regions. The person moves a predetermined distance. It should be noted that the predetermined distance is, for example, an integer multiple of the displacement caused by a single bending of the main arm body 411 of each arm module 4.

The movement control module 40 repeatedly executes the above-mentioned control processing until the N microcrystalline grains are arranged in the predetermined pattern.

The following will further illustrate in detail with reference to FIGS. 8-10. For example, for 9 (N=9) rectangular microcrystal grains (for convenience of explanation, they are represented by D1~D9 respectively), the movement control module 40 How to control the movement of the micro-crystal grains D1 to D9 in one control process. When the location data of the area obtained by the image recognition module 30 indicates 9 operation areas, such as the rectangular area represented by the solid line in FIG. 8 (that is, the area occupied by the micro-crystal grains D1 to D9), The movement control module 40 uses the location data of the area and the location data of the reference area (which indicates the 9 target areas associated with the predetermined arrangement pattern, such as the rectangular area drawn by imaginary lines in FIG. 9). The movement estimation algorithm generates an estimation result indicating the direction in which each of the micro-crystal grains D1 to D9 is to move. More specifically, the estimation result, as shown in FIG. 9, indicates that the micro-crystal grains D1 and D3 should move to the right, the micro-crystal grain D2 should move downwards, and the micro-crystal grains D2 should move downwards. The die D4, D5, D8, and D9 must move upward, and the micro die D6 must move to the left. In this case, the control output includes, for example, a first control signal related to upward movement control, a second control signal related to downward movement control, a third control signal related to leftward movement control, and a The fourth control signal related to the right movement control. The movement control module 40 also simultaneously transmits the first control signal to the arm module located under the micro-die D4, D5, D8, D9 and corresponding to the longitudinally extending side wall according to the location data of the area. The control circuit 21 of 4 simultaneously transmits the second control signal to the control circuit 21 of the arm module 4 located under the micro-die D2 and corresponding to the longitudinally extending side wall 412, and the third control signal is simultaneously It is transmitted to the control circuit 21 of the arm module 4 located under the micro-die D6 and corresponding to the laterally extending side wall 412, and the fourth control signal is simultaneously transmitted to the micro-die D1, D3. The lower part corresponds to the control circuit 21 of the arm module 4 with laterally extending side walls. Thus, the control circuits 21 that receive the first/second/three/four control signals generate first to fourth currents I1~I4 corresponding to the first/two/three/four control signals, and then pass the corresponding The electromagnetic effect generated by each arm module 4 drives each of the micro-die D1 to D9 to move the predetermined distance toward the estimated direction. For example, when the first to fourth currents I1 to I4 are periodic signals (such as pulse signals), if the displacement caused by a single bending of the main arm body 411 is, for example, 5 nm, the predetermined distance It can be, for example, a length ranging from 5 nm to 50 nm and an integer multiple of 5 nm, but is not limited to this example. After that, after the movement control module 40 type continuously executes the above-mentioned control processing several times, the micro-crystal grains D1 to D9 can be arranged into the predetermined arrangement pattern, as shown in FIG. 10.

It should be noted that in practical applications, the size of the micro-robot device 10, especially the arm module 4, can be designed according to the size of the micro-die to be carried, and the movement control module 40 can be used as described above The control method, or other known control methods, and the movement control of a large number of micro-crystal grains at the same time.

In summary, the control output generated by the movement control module 40 through the control processing enables the micro-robot device 10 to move efficiently and quickly at operating frequencies ranging from MHz to GHz under appropriate electromagnetic effect control. The carried micro-crystal grains are arranged in a predetermined pattern, thereby facilitating the subsequent high-efficiency mass transfer processing of the arranged micro-crystal grains. Therefore, it can indeed achieve the purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

100: Microcrystalline grain arrangement system 10: Micro robotic device 1: substrate 2: Control circuit layer 21: Control circuit 3: Arm layer 4: Arm module 41: Drive arm 411: main arm body 4111: neck 412: side wall body 42: coil group 421: first coil 422: first coil 423: second coil 424: second coil I1: first current I2: second current I3: third current I4: Fourth current D1~D9: Microcrystalline grains

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a block diagram exemplarily showing the structure of a micro-die arrangement system according to an embodiment of the present invention; 2 is a block diagram showing the electrical configuration of a micro-robot device of this embodiment; FIG. 3 is a partial three-dimensional schematic diagram showing the structure of the micro-robot device; Figure 4 is a schematic side view of a part of the micro-robot device; FIG. 5 is a schematic diagram exemplarily illustrating the structure of an arm module of the micro-robot device; Fig. 6 is a schematic diagram exemplarily illustrating a situation in which the arm module generates electromagnetic effects; Figure 7 is a schematic diagram exemplarily illustrating another situation in which the arm module generates electromagnetic effects; FIG. 8 is a top view, which exemplarily illustrates the case where the micro-robot device carries 9 micro-crystal grains; Figure 9 is a schematic top view illustrating how the micro-robot device moves the micro-crystal grains; and FIG. 10 is a schematic top view illustrating that the micro-crystal grains have been arranged in a predetermined arrangement pattern by the micro-robot device.

10: Micro robotic device

1: substrate

2: Control circuit layer

21: Control circuit

3: Arm layer

4: Arm module

41: Drive arm

42: coil group

421: first coil

422: first coil

423: second coil

424: second coil

Claims (4)

A micro-robot device used to carry micro-crystal grains and contains: A substrate; A control circuit layer is formed on the substrate and includes a plurality of control circuits arranged in an array. Each control circuit is configured to generate and output first to fourth control currents in response to a corresponding control signal from the outside. ;and An arm layer is formed on the control circuit layer and includes a plurality of arm modules spaced apart and arranged in an array. Each arm module corresponds in position to and is controlled by one of the control circuits. Control circuit and include An insulated drive arm includes a main arm body that is elastic and extends upright from the control circuit layer, and two side arm bodies that extend outwardly from the main arm body opposite to each other in the radial direction. The drive arm is in the radial direction. The length is less than the length and width of the microcrystal grains to be carried, and A coil group is electrically connected to the corresponding control circuit, and has two first coils respectively arranged on the bottom side of the side arm bodies, and two are respectively aligned with the first coils at intervals in the longitudinal direction and arranged in The second coil on the control circuit layer, the first coils and the second coils respectively allow the first to fourth control currents output from the corresponding control circuit to pass; Wherein, the extending direction of the side arm bodies of the driving arm of each arm module is perpendicular to the extending direction of the side arm bodies of the driving arm of any adjacent arm module; Wherein, for each arm module, the corresponding control circuit controls the main control circuit through the electromagnetic effects generated by the coil group through the first to fourth control currents flowing through the first coils and the second coils respectively. The arm body is bent at the top of the arm due to the electromagnetic effect; and Wherein, when a microcrystalline grain is placed on the arm layer, the microcrystalline grain can move through the displacement generated by one or more arm modules located below it. The micro-robot device according to claim 1, wherein, for each arm module, the main arm body of the driving arm has a thinner neck section. A microcrystalline grain arrangement system, suitable for arranging N (N≧2) microcrystalline grains into a predetermined pattern, and includes: Such as the micro-robot device of claim 1, which is used to drive the micro-crystal grains carried on the arm layer; An image capturing module, arranged above the micro-robot device, and configured to continuously capture images of the arm layer carrying the N microcrystalline grains at a predetermined frequency; An image recognition module, which is electrically connected to the image capture module to receive each image captured by the image capture module, and for each image, recognize the N microcrystalline grains and obtain the respective values in the arm layer according to the recognition results The area position data of the N operation areas carrying the N microcrystalline grains; and A movement control module is electrically connected to the control circuit layer of the micro-robot device and the image recognition module, and when receiving the region position data from the image recognition module and corresponding to each image, perform a predetermined The control cycle executes a control process, in which the movement control module uses a movement estimation algorithm to generate a movement estimation algorithm based on the area position data and the reference area position data of the N target areas associated with the predetermined arrangement pattern. A control output related to the movement of the micro-die, and transmitting the control output to the control circuit layer of the micro-robot device; Wherein, the control output generated by the movement control module in the control processing includes a plurality of arm modules provided to the control circuit layer in the N operation regions respectively corresponding to the arm layer in position The control signals of the plurality of circuit modules, so that each of the circuit modules generates the first to fourth control currents associated with the electromagnetic effect according to one of the received control signals corresponding to the control signal, And cause the driving arms of the arm modules to be bent by electromagnetic effects, so as to jointly drive each of the N microcrystalline grains to move a predetermined distance toward one of the N target regions; Wherein, the movement control module repeatedly executes the control process until the N microcrystalline grains are arranged in the predetermined pattern. The microcrystalline grain arrangement system according to claim 3, wherein the predetermined distance is an integer multiple of the displacement caused by a single bending of the main arm body of each arm module.

Images