JP2011169759A - Semiconductor device for inspection, and inspection method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem in that the cost increases in inspecting different types of semiconductor devices in a semiconductor device having a noncontact interface. <P>SOLUTION: The semiconductor device for inspection includes an LSI for inspection. The LSI for inspection includes a plurality of noncontact interfaces for communicating a signal by noncontact between it and a semiconductor device to be inspected, a communication section connected to the noncontact interfaces, and a communication control section for controlling the communication section. The communication control section controls the operating state of the communication section according to the constitution of the semiconductor device to be inspected. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a semiconductor device for inspection and a method for inspecting a semiconductor device, and more particularly, to a semiconductor device for inspection and a method for inspecting a semiconductor device capable of non-contact communication with a semiconductor device to be inspected.

  In the inspection of an LSI, which is one type of semiconductor device, power and signals are supplied from the tester device to the LSI to be inspected to inspect the internal operation of the LSI.

  In Patent Document 1, as a method of supplying power and signals to an LSI to be inspected in a wafer to be inspected, signals are transmitted in a non-contact manner by capacitive coupling between electrodes, and the power source inspects an inspection needle (needle). There has been disclosed a semiconductor device inspection apparatus using a method of supplying a power pad in contact with an LSI. A probe card provided in an inspection apparatus for a semiconductor device described in Patent Document 1 includes a substrate, an inspection LSI having the same size as the LSI to be inspected in the wafer, and an external signal electrode disposed in the inspection LSI. It consists of. The external signal electrode is also disposed on the LSI to be inspected. Then, the inspection LSI and the LSI to be inspected perform signal coupling in a non-contact manner by performing capacitive coupling by bringing these external signal electrodes close to each other.

  The semiconductor device inspection apparatus described in Patent Document 1 adopts a non-contact method using an external signal electrode as a non-contact interface instead of a contact method using a needle for signal transmission. Since the external signal electrodes can be arranged at a narrow pitch, it is possible to inspect a fine pitch LSI.

  On the other hand, Patent Document 2 discloses a semiconductor device inspection apparatus having a probe card having a large number of probe pins for transmitting signals and capable of switching the probe pins in contact with the LSI to be inspected for each product of the LSI to be inspected. It is disclosed. As a result, it is possible to share the probe card of each type, so that it is possible to reduce the type of probe card and to reduce its development cost.

International Publication No. 2007/029422 ([0093], FIG. 1) JP 2004-085281 A ([0033], [0036], FIG. 7)

  However, in the technique disclosed in Patent Document 1, since the position of the external signal electrode of the LSI to be inspected differs for each LSI to be inspected, it is necessary to make a probe card for each LSI to be inspected. Therefore, there is a problem that the production cost of the probe card becomes high.

  Further, the technique disclosed in Patent Document 2 has a problem that the probe pins cannot be highly integrated because the pitch of the probe pins is limited. Furthermore, there is a problem that a large amount of probe pins are required and the probe card is expensive.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device for inspection and a method for inspecting a semiconductor device, which solves the problem of increased costs in inspecting different types of semiconductor devices in the above-described semiconductor device inspection device using a non-contact method. Is to provide.

  The inspection semiconductor device of the present invention includes an inspection LSI, and the inspection LSI is connected to the non-contact interface and a plurality of non-contact interfaces for non-contact communication of signals with the semiconductor device to be inspected. A communication control unit that controls the communication unit, and the communication control unit controls an operation state of the communication unit according to the configuration of the semiconductor device to be inspected.

  Also, the semiconductor device inspection method of the present invention controls the use state of a plurality of non-contact interfaces provided in an inspection LSI arranged opposite to the inspection target semiconductor device according to the configuration of the inspection target semiconductor device. Inspect the semiconductor device to be inspected via the contact interface

  According to the semiconductor device for inspection of the present invention, an increase in cost required for inspection can be suppressed even when different types of semiconductor devices are inspected.

1 is a plan view of an inspection LSI constituting an inspection semiconductor device according to a first embodiment of the present invention. 1 is a plan view of an LSI to be inspected by an inspection semiconductor device according to a first embodiment of the present invention. FIG. 3 is a plan view of an inspection LSI constituting the inspection semiconductor device according to the first embodiment of the present invention, showing a non-contact interface in an operating state when inspecting the LSI to be inspected in FIG. 2; . It is a top view of another example of the test LSI constituting the test semiconductor device according to the first embodiment of the present invention. FIG. 6 is a plan view of another example of an LSI to be inspected by the inspection semiconductor device according to the first embodiment of the present invention. FIG. 6 is a plan view of another example of an inspection LSI constituting the inspection semiconductor device according to the first embodiment of the present invention, and shows a non-contact interface in an operating state when inspecting the LSI to be inspected in FIG. 5. FIG. FIG. 2 is a diagram illustrating a configuration of a non-contact interface and a peripheral portion thereof included in an inspection LSI constituting the inspection semiconductor device according to the first embodiment of the present invention. It is a figure which shows the structure of the non-contact interface with which another example of the test | inspection LSI which comprises the test | inspection semiconductor device which concerns on the 1st Embodiment of this invention is provided, and its peripheral part. FIG. 2 is a diagram illustrating in detail a configuration of a non-contact interface and a peripheral portion thereof included in the inspection LSI constituting the inspection semiconductor device according to the first embodiment of the present invention. It is sectional drawing of the semiconductor device for an inspection which concerns on the 2nd Embodiment of this invention, and a to-be-inspected wafer. It is sectional drawing of another example of the semiconductor device for a test | inspection which concerns on the 2nd Embodiment of this invention, and a to-be-inspected wafer. It is a top view of the semiconductor device for a test | inspection of FIG. It is a top view of the to-be-inspected wafer of FIG. FIG. 14 is a plan view of the inspection semiconductor device in FIG. 10, showing a non-contact interface of the inspection LSI in an operating state when inspecting the wafer to be inspected in FIG. 13. It is a top view of another example of the to-be-inspected wafer of FIG. FIG. 16 is a plan view of the inspection semiconductor device of FIG. 10, showing a non-contact interface of the inspection LSI in an operating state when inspecting the wafer to be inspected of FIG. 15. It is a top view of the semiconductor device for a test concerning a 3rd embodiment of the present invention. It is a top view of the example of the to-be-inspected wafer test | inspected with the semiconductor device for an inspection shown in FIG. FIG. 18 is a diagram illustrating a configuration of a non-contact interface and a peripheral portion thereof included in an inspection LSI according to the inspection semiconductor device illustrated in FIG. 17. FIG. 18 is a diagram illustrating a configuration of a non-contact interface and a peripheral portion thereof included in an inspection LSI according to the inspection semiconductor device illustrated in FIG. 17.

  The terms “inspection LSI”, “inspected LSI”, “inspected wafer”, “inspection target semiconductor device”, and “inspection semiconductor device” used in this specification are defined as follows. The inspection LSI is a semiconductor device used for inspection. The LSI to be inspected is a semiconductor device to be inspected. The wafer to be inspected does not mean a single semiconductor substrate such as a silicon substrate but a semiconductor substrate including a plurality of semiconductor devices (IC and LSI) formed thereon. The semiconductor device to be inspected is a semiconductor device to be inspected, and includes an LSI to be inspected and a wafer to be inspected. The semiconductor device for inspection is a device for use in inspection of a semiconductor device. The inspection semiconductor device may be, for example, a probe card or may be provided with other configurations. In addition, although described as “LSI”, it may be “IC” or may be a semiconductor device according to another classification.

  Embodiments of the present invention will be described below with reference to the drawings.

[First Embodiment]
FIG. 1 is a plan view of an inspection LSI 100 constituting the inspection semiconductor device according to the first embodiment of the present invention. The inspection LSI 100 includes a plurality of non-contact interfaces 101 for communicating signals with the LSI to be inspected in a non-contact manner. The inspection LSI 100 includes a communication unit connected to the non-contact interface 101 and a communication control unit that controls the communication unit. The communication control unit controls the operation state of the communication unit according to the configuration of the LSI to be inspected.

  The non-contact interface can communicate with the LSI to be inspected using non-contact coupling by inductive coupling or capacitive coupling, for example. Therefore, the non-contact interface can be configured using an inductor such as a coil or a capacitor such as a capacitor.

  Next, an example of the operation of the inspection LSI constituting the inspection semiconductor device according to the present embodiment will be described with reference to FIGS. For example, assume that the non-contact interface 151 of the LSI to be inspected 150 is in the position shown in FIG. In this case, as illustrated in FIG. 3, the communication control unit controls the communication unit to include the non-contact interface 105 that faces the non-contact interface 151 of the LSI to be inspected 150 among the non-contact interfaces of the LSI for inspection 100. Put the one represented by the operation state. That is, the use state of the non-contact interface 105 is set to the operation state. By this control, the non-contact interface 105 becomes capable of signal transmission with the non-contact interface 151 of the LSI 150 to be inspected. On the other hand, the communication control unit controls the communication unit to put the non-contact state including the non-contact interface 101 into a non-operating state.

  As described above, the inspection LSI constituting the inspection semiconductor device according to the present embodiment enables any non-contact interface to be in an operating state by the communication control unit controlling the non-contact interface individually by controlling the communication unit. Can be. Therefore, for example, based on the arrangement pattern of the non-contact interface of the LSI to be inspected, it is possible to switch whether or not each non-contact interface of the inspection LSI is in an operating state. As a result, the inspection LSI can be shared, and a plurality of types of LSIs to be inspected having different positions of the non-contact interface can be inspected using one type of inspection LSI. Therefore, an increase in cost required for inspecting a plurality of types of LSIs to be inspected can be suppressed.

  The non-contact interface may be arranged on the inspection LSI 100 with periodicity in one direction. For example, as shown in FIG. 1, the non-contact interface may be arranged at equal intervals in the vertical direction on the drawing.

  Further, the non-contact interface may be configured to be arranged two-dimensionally in the inspection LSI 100. As an example, as shown in FIG. 4, the inspection LSI 100 may be arranged in a lattice shape including rows and columns. When the LSI to be inspected 150 shown in FIG. 5 is inspected using the inspection LSI 100 shown in FIG. 4, as shown in FIG. 6, the one represented by the solid line including the non-contact interface 105 is put into an operating state. To do. Thereby, the non-contact interface 105 of the LSI for inspection 100 can perform signal transmission with the non-contact interface 151 of the LSI to be inspected 150.

  Next, the non-contact interface, the communication unit, and the communication control unit will be described in detail with reference to FIG. Here, it is assumed that the communication unit 111 includes a transmission circuit and a reception circuit. The communication control unit 110 controls the communication unit 111 to bring the predetermined communication unit 111 into an operating state. Specifically, the communication control unit 110 selects either the transmission circuit or the reception circuit, and switches between the operation state and the non-operation state of the selected transmission circuit or reception circuit. When the communication control unit 110 puts the transmission circuit into an operating state, the communication unit 111 acquires a signal from the signal wiring 120, processes the signal as necessary, and outputs it to the non-contact interface 101. The non-contact interface 101 sends a signal to the non-contact interface of the LSI to be inspected. When the communication control unit 110 puts the reception circuit into an operating state, the communication unit performs processing on the signal received by the non-contact interface 101 from the LSI to be inspected as necessary and outputs the signal to the signal wiring 120. As described above, the communication control unit 110 can control the communication between the inspection LSI 100 and the LSI to be inspected by switching the transmission operation and the reception operation of the non-contact interface 101 by controlling the communication unit 111.

  When the format of the signal used for communication using the non-contact interface is different from the format of the signal transmitted through the signal wiring, the communication unit may convert the format of the signal. For example, when the non-contact interface communicates using a magnetic field signal using a coil, the transmission circuit may convert an electric signal transmitted through the wiring into a magnetic field signal, and the receiving circuit may convert the magnetic field signal into an electric signal. .

  The communication unit described above includes both the transmission circuit and the reception circuit. However, the communication unit may include only one of the transmission circuit and the reception circuit.

  One or a plurality of communication units may be used. When there are a plurality of communication units, the communication units can be connected for each non-contact interface. When there is only one communication unit, all non-contact interfaces are connected to the communication unit.

  One or a plurality of communication control units may be provided. When there are a plurality of communication control units, a communication control unit can be connected to each communication unit. When there is only one communication control unit, all communication units are connected to the communication control unit.

  The place where the communication control unit and the communication unit are arranged is not limited. Therefore, as shown in FIG. 7, each of the communication units and each of the communication control units may be arranged in the inspection LSI 100 in proximity to each non-contact interface. Alternatively, a plurality of communication control units and a plurality of communication units may be gathered at a predetermined location, and these may be arranged apart from each non-contact interface.

  As shown in FIG. 7, the communication control unit 110 and the communication unit 111 are arranged close to each non-contact interface 101 in the inspection LSI 100, and the communication unit 111 is connected to each non-contact interface 101. It is desirable that the communication control unit 110 is connected to each communication unit 111. By arranging the communication unit 111 and the non-contact interface 101 close to each other, the wiring connecting them can be shortened. As a result, signal delay and increase in power consumption due to increases in wiring resistance and wiring capacitance can be prevented. In addition, since it is possible to prevent the characteristics of the non-contact interface 101 from being changed due to large parasitic resistance and parasitic capacitance added to the non-contact interface 101, high communication performance can be realized. Furthermore, by arranging the communication control unit 110 and the non-contact interface 101 close to each other, the wiring connecting them can be shortened. Accordingly, since the amount of wiring provided in the inspection LSI can be reduced, the design of the inspection LSI can be simplified.

  The communication control unit 110 has a function of switching between a transmission state and a reception state of the non-contact interface 101 in an operating state. Thereby, the non-contact interface 101 of the inspection LSI 100 can be in a transmission state or a reception state according to the state of the non-contact interface 151 of the LSI to be inspected 150. Then, these non-contact interfaces 101 and 151 can appropriately communicate to exchange signals.

  Next, a circuit for switching the operation state of the non-contact interface and controlling the signal selection will be described as an example of a specific configuration mounted on the inspection LSI with reference to FIG. The non-contact interface 101 is composed of a metal surface, and functions as an inductor for transmitting / receiving a signal to / from the LSI to be inspected or a capacitor for transmitting / receiving a signal in a pair with the LSI to be inspected. The communication unit 111 generates a signal transmission waveform and further converts the received signal into a digital signal. The communication control unit 110 switches the operation state of the communication unit 111 and further selects a signal wiring connected to the communication unit 111. The communication unit 111 operates according to control from the communication control unit 110.

  An example of a more specific configuration of each non-contact interface 101 and its peripheral part is shown in FIG. The communication unit 111 includes a transmission circuit 112 and a reception circuit 113. The communication control unit 110 can be configured with a shift register. The communication control unit 110 stores the control signal and controls the operation state of the communication unit using the control signal. The control signal is serially input from a tester device or a probe card. In accordance with a control signal from the communication control unit 110, the communication unit 111 is in an operation state in which only the transmission circuit 112 is activated, only the reception circuit 113 is activated, or both are inactivated. To do. Thereby, the use state of the non-contact interface 101 is controlled. When only the transmission circuit 112 is activated, the non-contact interface 101 transmits a signal to the LSI to be inspected. When only the receiving circuit 113 is activated, the non-contact interface 101 receives a signal from the LSI to be inspected. When both the transmission circuit 112 and the reception circuit 113 are inactive, the non-contact interface 101 is also inactive. The signal wirings 120 to 127 are wirings for transmitting data input from the tester device or the probe card or data output to the tester device or the probe card. The selector 114 selects a predetermined signal wiring from the signal wirings 120 to 127 according to the value of the control signal output from the communication control unit 110. Then, the selected signal wiring and the transmission circuit 112 are connected, and a signal acquired from the signal wiring is output to the transmission circuit 112. The switch 115 selects a predetermined signal wiring from the signal wirings 120 to 127 according to the value of the control signal output from the communication control unit 110. Then, the selected signal wiring and the receiving circuit 113 are connected, and a signal acquired from the receiving circuit is output to the signal wiring.

  Using the configuration shown in FIG. 9 as an example, the operation of each configuration will be described. The communication control unit 110 has 1 bit as a control signal for controlling the transmission circuit 112, 1 bit as a control signal for controlling the reception circuit 113, 8 bits as a control signal for controlling the selector 114, and 8 bits as a control signal for controlling the switch 115. A total of 18 bits of control signals are output. The selector 114 is configured by a switch circuit, and acquires an 8-bit control signal stored in a first shift register included in the communication control unit 110. Then, when the n-th of the 8-bit control signal acquired from the communication control unit 110 is “1”, the selector 114 is the n-th signal wiring of the eight signal wirings 120 to 127 connected to the selector 114. Are output to the transmission circuit 112. The switch 115 includes a switch circuit, and acquires an 8-bit control signal stored in the second shift register included in the communication control unit 110. Then, when the n-th of the 8-bit control signal acquired from the communication control unit 110 is “1”, the switch 115 sends the output of the reception circuit 112 to the n-th signal lines 120 to 127 connected to the switch 115. Pass to the second signal wiring. The transmission circuit 112 acquires a 1-bit control signal stored in a third shift register included in the communication control unit 110. The reception circuit 113 acquires a 1-bit control signal stored in a fourth shift register included in the control signal. The transmission circuit 112 and the reception circuit 113 include switches such as a power switch, and operate only when the control signal acquired from the communication control unit 110 is “1”.

  The operation when the data of the signal wiring 120 is transmitted using the non-contact interface 101 using the above-described configuration is as follows. The communication control unit 110 outputs a control signal “10000000” to the selector 114 and outputs a control signal “1” to the transmission circuit 112. Thereby, the data of the signal wiring 120 can be transmitted using the non-contact interface 101. At this time, it is desirable to output the control signal “00000000” to the switch 115 and the control signal “0” to the receiving circuit 113 in order to prevent the data of the signal wiring 120 from being mixed with the signal wirings 121 to 127. Thereby, the receiving circuit 113 can be brought into a non-operating state.

  When the non-contact interface is set to the non-operation state, all 18-bit control signals output from the communication control unit may be set to “0”. When such a control signal is acquired by the communication unit, the non-contact interface connected to the communication unit performs neither transmission operation nor reception operation.

  8 and 9, the communication control unit 110 can control the communication unit 111 to determine which signal wiring of the signal wirings 120 to 127 is connected for each non-contact interface 101. Further, the communication control unit 110 controls the communication unit 111 to determine whether the non-contact interface 101 transmits a signal to the LSI to be inspected, receives a signal from the LSI to be inspected, or enters an inoperative state. Can be determined. Therefore, by configuring the inspection LSI as described above, it is possible to switch the non-contact interface to be in the operating state and control the signal transmission / reception direction by the non-contact interface as shown in FIGS.

  The connection method between the communication unit 111 and the signal wirings 120 to 127 is not limited to this embodiment. For example, a dedicated signal wiring can be provided for each non-contact interface. On the other hand, the inspection LSI constituting the inspection semiconductor device according to the present embodiment has a plurality of signal lines connected to each communication unit 111 as shown in FIGS. The switch 115 has a configuration. With such a configuration, a single signal wiring can be shared by a plurality of non-contact interfaces, which makes it easier to design an inspection LSI, and further reduces power consumption when using the inspection LSI. Can do.

  The inspection LSI constituting the inspection semiconductor device according to the present embodiment can switch the operation at a higher speed than the one that is mechanically switched by electrically switching the operation of the non-contact interface.

  The non-contact interface can be arranged at a finer pitch than the needle. Therefore, the number of non-contact interfaces that can be arranged per unit area increases. In addition, the degree of freedom of arrangement of the non-contact interface is increased. As a result, it is possible to manufacture a test LSI with higher versatility.

  The inspection LSI that constitutes the inspection semiconductor device according to the present embodiment can be used for inspection of an LSI to be inspected of any size as long as there is no structural limitation.

  Non-contact interfaces are less expensive per needle than needles. Therefore, the inspection LSI constituting the inspection semiconductor device of this embodiment can be manufactured at a lower cost than that provided with the needle.

  According to this embodiment, it is possible to obtain an inspection LSI that can handle a wide variety of LSIs to be inspected at low cost.

[Second Embodiment]
The second embodiment will be described below with reference to the drawings.

  The inspection semiconductor device according to the present embodiment includes an inspection LSI and a probe card substrate. FIG. 10 shows a positional relationship between the inspection semiconductor device 205 including the inspection LSI 200 and the probe card substrate 202 and the wafer 252 to be inspected. The inspection LSI 200 is provided with a plurality of non-contact interfaces 201. The wafer to be inspected 252 includes a plurality of LSIs to be inspected, and the LSI to be inspected includes a plurality of non-contact interfaces 251. The power supply needle 203 is in contact with the power supply pad 253 disposed in the peripheral portion of the wafer 252 to be inspected, and supplies power to the wafer 252 to be inspected.

  In the inspection semiconductor device according to the present embodiment, a plurality of non-contact interfaces 251 provided on the wafer to be inspected 252 and a plurality of non-contact interfaces 201 provided on the inspection LSI 200 are arranged to face each other. It is possible to exchange signals between the non-contact interfaces 201 and 251.

  The inspection LSI and the wafer to be inspected need not have a one-to-one relationship, and the inspection LSI and the wafer to be inspected may have any one-to-many, many-to-one, or many-to-many relationship. For example, as shown in FIG. 11, one inspection wafer 352 can be inspected using two inspection LSIs 300. A plurality of wafers to be inspected may be inspected using a single inspection LSI.

  Note that the probe card substrate may have a configuration with a power needle as shown in FIG. 10 or a configuration without a power needle.

  A method for supplying power to the inspection LSI or the wafer to be inspected is not limited. The power supply to the inspection LSI or the wafer to be inspected can be performed, for example, by a power supply unit using a non-contact method or a contact method using a needle via a probe card substrate. The power supply unit using the non-contact method can use non-contact coupling by inductive coupling or capacitive coupling. On the other hand, as shown in FIGS. 10 and 11, the power supply unit using the contact method can include power needles 203, 303, and 304. In this case, power supply pads 253 and 353 with which the power supply needles 203, 303, and 304 come into contact are arranged at arbitrary positions inside and around the wafers 252 and 352 to be inspected.

  FIG. 12 is a plan view of the inspection semiconductor device 205 shown in FIG. The inspection LSI 200 includes a non-contact interface 201 arranged in a grid pattern. A control signal for controlling the operation state of each non-contact interface 201 is transmitted from a tester device on which the probe card board 202 is mounted. Each non-contact interface 201 operates based on the control signal.

  An operation example of the non-contact interface of the inspection LSI will be described with reference to FIGS. FIG. 13 is a plan view of the wafer 252 to be inspected shown in FIG. The wafer to be inspected 252 includes four LSIs to be inspected 250, and each LSI to be inspected 250 includes a plurality of non-contact interfaces 251. The non-contact interface 251 is arranged in a predetermined pattern. When the inspection semiconductor device according to the present embodiment inspects the wafer 252 to be inspected shown in FIG. 13, only the non-contact interface indicated by the solid line in FIG. . Then, other non-contact interfaces are set in a non-operating state, and signal transmission / reception is stopped.

  As described above, with the semiconductor device for inspection according to the present embodiment, each non-contact interface of the inspection LSI is brought into an operation state based on the arrangement pattern of the non-contact interfaces of the plurality of LSIs to be inspected provided on the wafer to be inspected. It is possible to switch whether to do or not. As a result, it is possible to share an inspection apparatus for a wide variety of LSIs to be inspected.

  In addition, with the semiconductor device for inspection according to the present embodiment, it is possible to simultaneously inspect a plurality of LSIs to be inspected included in a wafer to be inspected.

  In addition, with the semiconductor device for inspection according to this embodiment, it becomes possible to inspect a wafer to be inspected having LSIs having different sizes. For example, as shown in FIG. 15, it is assumed that there is a wafer to be inspected 252 provided with two types of LSIs to be inspected 250 having different sizes. When such a wafer 252 to be inspected is inspected, the non-contact interface 201 indicated by the solid line in FIG. 16 may be operated. In this way, the LSI to be inspected having different sizes of the LSI to be inspected or different arrangement patterns of the non-contact interface by the same inspection LSI without depending on the size of the LSI to be inspected and the arrangement pattern of the non-contact interface. Can be inspected.

  It is desirable that the test vector data used for the inspection and the arrangement pattern of the non-contact interface of the LSI to be inspected are input to the tester apparatus and stored before the inspection. As a result, the non-contact interface of the inspection LSI to be operated can be instantaneously determined at the time of inspection, and accurate inspection can be performed.

  The arrangement pattern of the non-contact interface of the LSI to be inspected may be determined when inspecting. For example, it is possible to set a state in which signals are always output from all the non-contact interfaces of the wafer to be inspected, and operate the non-contact interfaces of the inspection LSI that can receive the signals.

  The method for mounting the inspection LSI on the probe card substrate is not particularly limited. For example, a plurality of electrodes may be provided at predetermined locations on the lower surface of the probe card substrate, and these may be connected to through electrodes provided in the inspection LSI.

[Third Embodiment]
Next, a third embodiment will be described with reference to the drawings. The third embodiment is characterized in that the communication unit has one of a transmission circuit and a reception circuit, and the communication control unit controls switching between an operation state and a non-operation state of the communication unit. And among the plurality of non-contact interfaces, a non-contact interface arranged in a predetermined manner in the inspection LSI is connected to the communication unit having the transmission circuit, and among the plurality of non-contact interfaces, the inspection interface A contactless interface arranged in an area other than the predetermined area in the LSI is connected to the communication unit having the receiving circuit.
As an example of the present embodiment, FIG. 17 illustrates a first area in which contactless interfaces connected to a communication unit having a transmission circuit are arranged in a line, and a contactless connection connected to a communication unit having a reception circuit. The interface is arranged in a line. Note that the first and second regions are not limited to columns, and may be one or a plurality of rows, for example. Further, an arbitrary area in the inspection LSI 400 can be used as the first and second areas, even if it is not a row or a column.

  FIG. 17 is a plan view of the inspection LSI 400 constituting the inspection semiconductor device according to the present embodiment and the probe card substrate 402 on which the inspection LSI 400 is mounted. 18 is a plan view of an example of the LSI to be inspected 450 to be inspected by the inspection LSI 400 and the probe card substrate 402 shown in FIG. It is assumed that a predetermined column of the non-contact interface 401 arranged in a lattice pattern on the inspection LSI 400 is configured by a non-contact interface that functions as a transmitter 440 that performs only transmission. The communication unit connected to the transmitter 440 includes a transmission circuit and does not include a reception circuit. In addition, it is assumed that the predetermined column of the non-contact interface 401 includes a non-contact interface that functions as a receiver 441 that performs only reception. The communication unit connected to the receiver 441 includes a reception circuit and does not include a transmission circuit. As shown in FIG. 18, the LSI to be inspected 450 includes a receiver 491 at a position corresponding to the transmitter 440 of the inspecting LSI 400 when facing the inspecting LSI 400, and corresponds to the receiver 441 of the inspecting LSI 400. As long as the LSI to be inspected is provided with the transmitter 490 at the position, the same LSI for inspection can be used even for different types.

  More specific configurations of the non-contact interface functioning as a transmitter and the non-contact interface functioning as a receiver will be described with reference to FIGS. 19 and 20. As shown in FIG. 19, a transmission circuit 412 is connected to the non-contact interface 401 that functions as a transmitter. A signal of one of the signal wirings 420 to 427 selected by the selector 414 is output to the non-contact interface 401 via the transmission circuit 412. This signal is sent to the LSI under test by the non-contact interface 401. Switching of the operation state and non-operation state of the transmission circuit 412 and selection of the signal wirings 420 to 427 by the selector 414 are controlled by the communication control unit 410. On the other hand, as shown in FIG. 20, a reception circuit 413 is connected to the non-contact interface 401 functioning as a receiver. A signal received by the non-contact interface 401 is output to one of the signal wirings 420 to 427 selected by the switch 415 via the reception circuit 413. Switching of the operating state and non-operating state of the reception circuit 413 and selection of the signal wirings 420 to 427 by the switch 415 are controlled by the communication control unit 410.

  As described above, among the non-contact interfaces arranged in a grid pattern, the configuration of the circuit connected to the non-contact interface is simplified by dedicating the one arranged in a predetermined area to the transmission only and the other to the reception only. Can be Therefore, more circuits can be mounted on the inspection LSI as compared with the case where a circuit that performs both transmission and reception is configured. Furthermore, the power consumption of the entire inspection LSI can be reduced.

  In addition, by making a predetermined non-contact interface dedicated to transmission and the other dedicated to reception, it becomes easy to control the use state of the non-contact interface. When the non-contact interface can transmit and receive, the control of the use state of the non-contact interface selects not only the operation state or the non-operation state but also the transmission state or the reception state in the case of the operation state. On the other hand, when the non-contact interface is determined to be dedicated for transmission or reception, it is sufficient to control the use state of the non-contact interface only by selecting the operation state and the non-operation state.

  The present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the invention described in the claims, and it is also included within the scope of the present invention. Not too long.

100, 200, 300, 400 LSI for inspection
101, 105, 201, 301, 401 Non-contact interface 110, 210, 410 Communication control unit 111, 211 Communication unit 112, 412 Transmission circuit 113, 413 Reception circuit 114, 414 Selector 115, 415 Switch 120, 121, 122, 127 420, 421, 422, 427 Signal wiring 150, 250, 350, 450 LSI to be inspected
151, 251, 351, 451 Non-contact interface 202, 302, 402 Probe card substrate 203, 303, 304, 403 Power supply needle 205, 305 Inspection semiconductor device 252, 352 Inspected wafer 253, 353, 453 Power supply pad 440, 490 Transmitter 441, 491 Receiver

Claims (16)

An inspection semiconductor device comprising an inspection LSI,
The inspection LSI is
A plurality of non-contact interfaces for non-contact communication of signals with a semiconductor device to be inspected;
A communication unit connected to the contactless interface;
A communication control unit for controlling the communication unit,
The said communication control part is a semiconductor device for a test | inspection which controls the operation state of the said communication part according to the structure of the said test object semiconductor device. The inspection semiconductor device according to claim 1, wherein the non-contact interface is arranged with periodicity in one direction on the inspection LSI. The inspection semiconductor device according to claim 1, wherein the non-contact interface is arranged in a two-dimensional manner on the inspection LSI. The communication unit includes a transmission circuit and a reception circuit,
The said communication control part selects either the said transmission circuit or the said reception circuit, and controls switching of the operation state of the selected said transmission circuit or the said reception circuit, and a non-operation state. The semiconductor device for inspection as described in 2. The communication unit has one of a transmission circuit and a reception circuit,
4. The semiconductor device for inspection according to claim 1, wherein the communication control unit controls switching between an operation state and a non-operation state of the communication unit. 5. Of the plurality of non-contact interfaces, a non-contact interface arranged in a predetermined region in the inspection LSI is connected to the communication unit having the transmission circuit,
The inspection according to claim 5, wherein among the plurality of non-contact interfaces, a non-contact interface arranged in an area other than the predetermined area in the inspection LSI is connected to the communication unit including the receiving circuit. Semiconductor device. The inspection semiconductor device according to claim 6, wherein the non-contact interface arranged in the predetermined region and the non-contact interface arranged in a region other than the predetermined region are arranged in rows or columns. The inspection LSI includes a selector connected to the transmission circuit, and a plurality of signal wirings connected to the selector,
8. The selector according to claim 4, wherein the selector selects a predetermined signal wiring from a plurality of the signal wirings, and outputs a signal acquired from the selected signal wiring to the transmission circuit. 9. Inspection semiconductor device. The inspection LSI has a switch connected to the receiving circuit, and a plurality of signal wirings connected to the switch,
9. The switch according to claim 4, wherein the switch selects a predetermined signal wiring from a plurality of the signal wirings, and outputs a signal acquired from the reception circuit to the selected signal wiring. 10. Inspection semiconductor device. The semiconductor device for inspection according to any one of claims 1 to 9, wherein the non-contact interface uses non-contact coupling by inductive coupling or capacitive coupling. The communication unit is connected for each non-contact interface,
The communication control unit is connected to each communication unit,
The inspection semiconductor device according to claim 1, wherein the communication unit and the communication control unit are arranged close to each other for each non-contact interface. 12. The semiconductor device for inspection according to claim 1, further comprising a power supply unit that supplies power to the inspection LSI and the semiconductor device to be inspected. 13. The semiconductor device for inspection according to claim 12, wherein the power supply unit uses non-contact coupling by inductive coupling or capacitive coupling. The semiconductor device device for inspection according to claim 12, wherein the power supply unit is a needle. The use state of a plurality of non-contact interfaces provided in an inspection LSI arranged opposite to the inspection target semiconductor device is controlled according to the configuration of the inspection target semiconductor device, and the inspection target semiconductor device is connected via the non-contact interface. Semiconductor device inspection method for inspecting semiconductor devices. The semiconductor device inspection method according to claim 15, wherein the use state control of the non-contact interface selects one of an operation state and a non-operation state, or one of a transmission state and a reception state.

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