TW202147480A - Miniature robotic device and arrangement system for micro dies - Google Patents

Abstract

A miniature robotic device includes a control circuit layer formed on a substrate and having an array of control circuits, and an arm layer formed on the control circuit layer and having an array of arm modules that corresponds to the array of control circuits in position. Each arm module includes a resilient and dielectric driving arm and a coil set. For each arm module, the coil set has two first coils that are disposed respectively on opposite side arm bodies of the driving arm, and two second coils that are disposed on the control circuit layer and that are spaced apart from and aligned respectively with the first coils; and a respective control circuit controls, using electromagnetic effect produced by the coil set as a result of first to fourth control currents flowing respectively through the first coils and the second coils, the displacement of a main arm body of the driving arm at its top when the main arm body is bent due to the electromagnetic effect, thereby driving movement of a micro die placed above the arm module.

Description

Micro-robot device and micro-grain arrangement system

The present invention relates to the carrying and arrangement of micro-crystal grains, and in particular to a micro-robot device and a micro-crystal grain arrangement system.

At present, miniaturized micro light-emitting diodes (Micro-LEDs) are enjoying the advantages brought by the shrinking volume, but the miniaturized volume also faces new difficulties and challenges in manufacturing. In particular, mass transfer technology in the manufacturing process of Micro-LED displays has become a key technology for energy production or profitability. In other words, if the micro-LEDs of millions of microns cannot be effectively transferred from the epitaxial substrate to the display substrate within a reasonable time, the mass production cannot be achieved.

Therefore, how to precisely arrange a large number of micro-LEDs to be transferred into a desired shape or pattern before the mass transfer process to facilitate the subsequent transfer operation is one of the current important research and development issues, and it has also become an urgent need for improvement in the current related fields. Target.

Therefore, an object of the present invention is to provide a micro-robot device that can overcome at least one disadvantage of the prior art.

Therefore, a micro-robot device provided by the present invention is used for carrying micro-chips, and includes a substrate, a control circuit layer, and an arm layer.

The control circuit layer is formed on the substrate and includes a plurality of control circuits arranged in an array. Each control circuit is configured to generate and output the first to fourth control currents in response to a corresponding control signal from the outside.

The arm layer is formed on the control circuit layer and includes a plurality of arm modules spaced apart from each other and arranged in an array. Each arm module corresponds to and is controlled by one of the corresponding control circuits in position, and includes an insulated driving arm and a coil set. For each arm module, the insulated driving arm includes a main arm body that is elastic and extends upright from the control circuit layer, and two side arm bodies that are radially opposite to each other and extend outward from the main arm body , the length of the drive arm in the radial direction is smaller than the length and width of the micro-die to be carried; and the coil group is electrically connected to the corresponding control circuit, and has two first a coil, and two second coils, respectively longitudinally spaced apart from the first coils and disposed on the control circuit layer, the first coils and the second coils respectively allowing access from the corresponding control circuit The outputted first to fourth control currents pass through.

The extending direction of the side arm bodies of the driving arm of each arm module is perpendicular to the extending direction of the side arm bodies of the driving arm of any adjacent arm module.

For each arm module, the corresponding control circuit controls the main arm body through the electromagnetic effect generated by the coil set through the first to fourth control currents flowing through the first coils and the second coils respectively. Displacement at its tip due to bending due to this electromagnetic effect.

When a micro-die is placed on the arm layer, the micro-die can be moved by displacement generated by one or more arm modules located below it.

Therefore, another object of the present invention is to provide a micro-grain arrangement system, which can overcome at least one disadvantage of the prior art.

Therefore, a microchip arrangement system provided by the present invention is suitable for arranging N (N≧2) microchips into a predetermined pattern, and includes the above-mentioned micro-robot assembly, an image capturing module, and an image recognition module, and a movement control module.

The micro-robot device is used for driving the N micro-dies carried on the arm layer.

The image capturing module is disposed above the micro-robot device, and is configured to continuously capture images of the arm layer carrying the N microchips at a predetermined frequency.

The image recognition module is electrically connected to the image capture module to receive each image captured by the image capture module, and for each image, recognizes the N microchips and obtains, according to the recognition result, that the arm layers carry the N microchips respectively. There are regional location data for the N operating regions of the N micro-die.

The movement control module is electrically connected to the control circuit layer of the micro-robot device and the image recognition module, and when receiving the region position data corresponding to each image from the image recognition module, a predetermined control Periodically execute a control process, wherein the movement control module uses a movement estimation algorithm to generate a position data corresponding to the N target areas according to the area position data and the reference area position data of the N target areas associated with the predetermined arrangement pattern. control output related to the movement of the micro-die, and transmit the control output to the control circuit layer of the micro-robot device.

The control output generated by the movement control module in the control process includes a plurality of output signals provided to a plurality of arm modules in the control circuit layer corresponding to the N operation regions of the arm layer in position respectively. control signals for each of the circuit modules, such that each of the circuit modules generates first to fourth control currents associated with electromagnetic effects according to one of the received control signals corresponding to the control signal, and causes The driving arms of the arm modules are bent by the electromagnetic effect, so as to jointly drive each of the N microchips to move a predetermined distance toward a corresponding one of the N target regions.

The movement control module repeatedly executes the control process until the N microchips are arranged in the predetermined pattern.

The effect of the present invention is that the micro-robot device can efficiently and rapidly move the micro-chips carried by the micro-robot device at the operating frequency of the order of MHz to GHz under the appropriate electromagnetic effect control, so as to arrange the micro-chips in a predetermined pattern, thereby It is beneficial to carry out subsequent high-efficiency mass transfer processing for the arranged microcrystals.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are designated by the same reference numerals.

Referring to FIG. 1 , the micro-die arranging system 100 of the illustrated embodiment of the present invention is suitable for arranging N (N≧2) micro-dies (not shown) into a predetermined pattern, and includes a micro-robot device 10 , An image capturing module 20 , an image recognition module 30 , and a movement control module 40 . In this embodiment, the micro-die to be arranged may be a die smaller than 1×1 mm, for example, Mini-LED, Micro-LED or semiconductor wafer.

Referring to FIGS. 2 to 4 , the micro-robot device 10 is used for carrying the N microchips (not shown), and includes a substrate 1 , a control circuit layer 2 formed on the substrate 1 , and a Arm layer 3 on the control circuit layer 2. It should be noted that, in this embodiment, the micro-robot device 10 can be fabricated by known semiconductor process technology.

The substrate 1 can be implemented as a substrate such as a wafer (Wafer), but is not limited to this example.

The control circuit layer 2 includes a plurality of control circuits 21 arranged in an array, as shown in FIG. 3 . It should be noted that, in practice, since each control circuit 21 is designed to have a very small circuit area, for example, about 200×200 nm ² , these control circuits 21 have been enlarged or shown exaggerated for the sake of clarity in Figures 3 and 4. Each control circuit 21 is configured to generate and output the first to fourth control currents I1 - I4 in response to a corresponding control signal. For example, the first to fourth currents I1 to I4 generated by each control circuit 21 are designed according to the corresponding control signal such that the first current I1 and the second current I2 have the same magnitude but are opposite to each other and the third current I3 and the fourth current I4 are the same as each other, that is, I3=I4, but not limited to this example, however, in other implementations, the The first to fourth currents I1 ˜ I4 can also be designed as I1=I2 and I3=−I4. More specifically, each control circuit 21 can be implemented by, for example, a CMOS logic circuit or a TTL (Transistor-Transistor Logic) circuit.

The arm layer 3 includes a plurality of arm modules 4 spaced apart from each other and arranged in an array, wherein each of the fore arm modules 4 corresponds to and is controlled by a corresponding control circuit 21 in position, as shown in FIG. 3 .

Referring to FIGS. 2 , 4 and 5 again, each arm module 4 includes an insulated driving arm 41 and a coil set 42 . Details about each arm module 4 will be described in further detail below.

The driving arm 41 includes an elastic main arm body 411 extending upright from the control circuit layer 2 , and two side arm bodies 412 extending outward from the main arm body 411 opposite to each other in the radial direction. It is worth noting that the length of the drive arm 411 in the radial direction (ie, the distance between the free ends of the two sidewall bodies 412 ) is smaller than the length and width of each micro-die to be carried. For example, if the size of the microchip to be carried is 10um×10um, the length of the driving arm 411 can be designed to be about 200nm. It should be noted that the extension direction of the side arm bodies 412 of the driving arm 41 of each arm module 4 is perpendicular to the extension of the side arm bodies 412 of the driving arm 41 of any adjacent arm module 4 direction (see Figure 3).

The coil set 42 is electrically connected to the corresponding control circuit 21 (see FIG. 2 ), and has two first coils 421 , 422 respectively disposed on the bottom side of the side walls 412 , and two first coils 421 and 422 respectively connected to the first coils 421, 422 are longitudinally spaced apart and are provided on the control circuit layer 2 (the corresponding control circuit 21 of the second coils 423, 424). The first coils 421 , 422 and the second coils 423 , 424 respectively allow the first to fourth control currents I1 ˜ I4 output from the corresponding control circuit 21 to pass therethrough (see FIG. 2 ).

In operation, for each arm module 4 , the corresponding control circuit 21 is controlled by the first to fourth control currents I1 ˜ I4 flowing through the first coils 421 , 422 and the second coils 423 , 424 . The electromagnetic effect generated by the coil set 42 controls the displacement of the top of the main wall 411 caused by the bending of the main wall 411 due to the electromagnetic effect. For example, as shown in FIG. 6 , if the first current I1, the third current I3 and the fourth current I4 have the same current direction, such as a counterclockwise direction, and the second current has a clockwise direction, for example In the case of the current direction, the direction of the induced magnetic field generated by the first coil 421 when the first current I1 flows is the same as the direction of the induced magnetic field generated by the third coil 423 when the third current I3 flows, Therefore, the first coil 421 and the third coil 423 are close to each other due to the attraction of the induced magnetic field; at the same time, the direction of the induced magnetic field generated by the second coil 422 when the second current I2 flows is opposite to that of the fourth coil 424 is the direction of the induced magnetic field generated when the fourth current I4 flows, so the second coil 422 and the fourth coil 424 move away from each other due to the repulsive magnetic force of the induced magnetic field, causing the neck section of the main arm body 411 The 4111 is bent toward the first coil 421 and the third coil 423 which are close to each other, so that the top end of the main arm body 411 is displaced toward the left side of the drawing. Or, as shown in FIG. 7 , if the second current I2, the third current I3 and the fourth current I4 all have anti-clockwise current directions and the first current I1 has a clockwise current direction The direction of the induced magnetic field generated by the first coil 421 when the first current I1 flows is opposite to the direction of the induced magnetic field generated by the third coil 423 when the third current I3 flows. The third coils 423 are separated from each other due to the repulsive magnetic force of the induced magnetic field; at the same time, the direction of the induced magnetic field generated by the second coil 422 when the second current I2 flows is the same as the direction of the induced magnetic field generated by the fourth coil 424 when the fourth current I4 flows The direction of the induced magnetic field is outdated, so the second coil 422 and the fourth coil 424 are close to each other due to the attraction of the induced magnetic field, so that the neck section 4111 of the main arm body 411 faces the second coil that is close to each other. The coil 422 and the fourth coil 424 are bent, so that the top end of the main arm body 411 is displaced toward the right side of the drawing. In this way, by designing the first current I1 and the second current I2 to be opposite to each other, the top end of the main arm body 411 can be controlled to move back and forth in the extending direction of the side wall bodies 412 . In practical application, if the arm module 4 is designed to have a size of about 200nm×200nm×200nm (ie, the height of the main arm body 411 is 200nm), the displacement can be designed to be in the range of 2nm˜5nm very small distances within.

In use, when a micro-die (not shown) is placed on the arm layer 3, the micro-die can be moved by the displacement generated by one or more arm modules 4 located below it.

The image capturing module 20 is disposed above the micro-robot device 10 and is configured to continuously capture images of the arm layer 3 carrying the N microchips at a predetermined frequency.

The image recognition module 30 is electrically connected to the image capture module 20 to receive each image captured by the image capture module 20 , and for each image, recognizes the N microchips and obtains the arm layer according to the recognition result 3 respectively carry the area position data of the N operation areas of the N micro-chips.

The movement control module 40 is electrically connected to the control circuit layer 2 of the micro-robot device 10 and the image recognition module 30, and when connected to the region position data corresponding to each image from the image recognition module 30 , in a predetermined control period, a control process is performed, wherein the movement control module 40 uses a movement estimation algorithm according to the region position data and the reference region position data of the N target regions associated with the predetermined arrangement pattern method to generate a control output related to the movement of the N micro-chips, and transmit the control output to the control circuit layer 2 of the micro-robot device 10 .

In this embodiment, the control output generated by the movement control module 40 in each control process includes a plurality of the N operations provided to the control circuit layer 2 corresponding to the arm layer 3 in position respectively The control signals of the plurality of circuit modules 21 of the plurality of arm modules 4 in the area, so that each of the circuit modules 21 generates and electromagnetic effect according to one of the received control signals corresponding to the control signal The associated first to fourth control currents cause the driving arms of the arm modules to be bent by an electromagnetic effect, so as to jointly drive each of the N microchips toward one of the N target areas. the user moves a predetermined distance. It should be noted that the predetermined distance is, for example, an integer multiple of the displacement of the main arm body 411 of each arm module 4 caused by a single bending.

The movement control module 40 repeatedly executes the above control process until the N microchips are arranged in the predetermined pattern.

8 to 10 for further detailed description, for example, for 9 (N=9) rectangular microchips (respectively represented by D1 to D9 for the convenience of description), the movement control module 40 How to control the movement of the microchips D1 to D9 in one control process. When the region position data obtained by the image recognition module 30 indicates 9 operation regions, such as the rectangular regions represented by solid lines in FIG. The movement control module 40 uses the region position data and the reference region position data (which indicate 9 target regions associated with the predetermined arrangement pattern, such as the rectangular regions depicted by imaginary lines in FIG. 9 ), using The movement estimation algorithm generates an estimation result indicating the direction in which each of the micro-dies D1-D9 is to be moved. More specifically, the estimation result, as shown in FIG. 9 , indicates that the micro-die D1 and D3 are to move to the right, the micro-die D2 is to move downward, and the Dies D4, D5, D8, D9 are to be moved up, and the micro-die D6 is to be moved to the left. In this case, the control output includes, for example, a first control signal related to upward movement control, a second control signal related to downward movement control, a third control signal related to leftward movement control, and a A fourth control signal related to right movement control. The movement control module 40 also transmits the first control signal to the arm module located under the micro-die D4, D5, D8, D9 and corresponding to the longitudinally extending sidewall body according to the location data of the region at the same time The control circuit 21 of 4, simultaneously transmits the second control signal to the control circuit 21 of the arm module 4 located under the micro-die D2 and corresponding to the arm module 4 having the longitudinally extending sidewall body 412, and simultaneously transmits the third control signal It is transmitted to the control circuit 21 of the arm module 4 located under the micro-die D6 and corresponding to the arm module 4 having the laterally extending sidewall body 412, and the fourth control signal is simultaneously transmitted to the micro-die D1, D3 The lower part corresponds to the control circuit 21 of the arm module 4 with laterally extending side walls. Therefore, the control circuits 21 receiving the first/2/3/4 control signals generate the first to fourth currents I1 ˜ I4 corresponding to the first/2/3/4 control signals, and then pass the corresponding The electromagnetic effects generated by the arm modules 4 drive the microchips D1 to D9 to move the predetermined distance in the estimated direction. For example, when the first to fourth currents I1 - I4 are periodic signals (such as pulse signals), if the displacement caused by the single bending of the main arm body 411 is, for example, 5 nm, the predetermined distance It can be, for example, a length in the range of 5 nm to 50 nm and an integral multiple of 5 nm, but not limited to this example. Afterwards, the movement control module 40 can arrange the microchips D1 to D9 in the predetermined arrangement pattern after continuously performing the above-mentioned control processing for several times, as shown in FIG. 10 .

It should be noted that, in practical application, the size of the micro-robot device 10, especially the arm module 4 can be designed according to the size of the micro-chips to be carried, and the movement control module 40 can be used as described above. control method, or other known control methods, and control the movement of a large number of micro-crystal grains at the same time.

To sum up, the control output generated by the movement control module 40 through the control process enables the micro-robot device 10 to move effectively and quickly at an operating frequency such as MHz to GHz under appropriate electromagnetic effect control. The supported micro-crystal grains are arranged in a predetermined pattern, thereby facilitating subsequent high-efficiency mass transfer processing for the arranged micro-crystal grains. Therefore, the object of the present invention can indeed be achieved.

However, the above are only examples of the present invention, and should not limit the scope of the present invention. Any simple equivalent changes and modifications made according to the scope of the application for patent of the present invention and the content of the patent specification are still within the scope of the present invention. within the scope of the invention patent.

100: Micrograin Alignment System 10: Micro-robot device 1: Substrate 2: Control circuit layer 21: Control circuit 3: arm layer 4: Arm module 41: Drive arm 411: main arm body 4111: Neck 412: Side wall body 42: Coil set 421: First Coil 422: First Coil 423: Second Coil 424: Second Coil I1: the first current I2: second current I3: The third current I4: Fourth current D1~D9: Micro-grain

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: FIG. 1 is a block diagram exemplarily illustrating the structure of a micro-die alignment system according to an embodiment of the present invention; FIG. 2 is a block diagram illustrating the electrical configuration of a micro-robot device of this embodiment; FIG. 3 is a partial perspective view showing the structure of the micro-robot device; 4 is a schematic side view of a part of the micro-robot device; FIG. 5 is a schematic diagram illustrating the structure of an arm module of the micro-robot device; Fig. 6 is a schematic diagram exemplarily illustrating a situation in which the arm module generates an electromagnetic effect; Fig. 7 is a schematic diagram exemplarily illustrating another situation in which the arm module produces an electromagnetic effect; FIG. 8 is a top view exemplarily illustrating the situation in which the micro-robotic device is loaded with 9 micro-dies; Figure 9 is a schematic top view illustrating how the micro-robot device moves the micro-dies; and FIG. 10 is a schematic top view illustrating that the micro-chips have been arranged in a predetermined arrangement pattern by the micro-robot device.

10: Micro-robot device

1: Substrate

2: Control circuit layer

21: Control circuit

3: arm layer

4: Arm module

41: Drive arm

42: Coil set

421: First Coil

422: First Coil

423: Second Coil

424: Second Coil

Claims (4)

A micro-robotic device for carrying micro-die comprising: a substrate; A control circuit layer is formed on the substrate and includes a plurality of control circuits arranged in an array. Each control circuit is configured to generate and output first to fourth control currents in response to a corresponding control signal from the outside. ;and an arm layer, formed on the control circuit layer, and including a plurality of arm modules spaced apart from each other and arranged in an array, each arm module is corresponding to and controlled by a corresponding one of the control circuits in position control circuit and includes An insulated driving arm, comprising an elastic main arm body extending upright from the control circuit layer, and two side arm bodies extending outward from the main arm body opposite to each other in the radial direction, the driving arm in the radial direction is less than the length and width of the micro-die to be carried, and A coil set is electrically connected to the corresponding control circuit, and has two first coils respectively disposed on the bottom side of the side arm bodies, and two respectively aligned with the first coils at intervals in the longitudinal direction and disposed in the the second coils on the control circuit layer, the first coils and the second coils respectively allow the first to fourth control currents output from the corresponding control circuits to pass through; Wherein, the extension direction of the side arm bodies of the driving arm of each arm module is perpendicular to the extension direction of the side arm bodies of the driving arm of any adjacent arm module; Wherein, for each arm module, the corresponding control circuit controls the main body through the electromagnetic effect generated by the coil set through the first to fourth control currents flowing through the first coils and the second coils respectively. the displacement at the tip of the arm caused by the bending of the arm by the electromagnetic effect; and Wherein, when a micro-die is placed on the arm layer, the micro-die can be moved by the displacement generated by one or more arm modules located below it. The micro-robot device as claimed in claim 1, wherein, for each arm module, the main arm body of the driving arm has a relatively thin neck section. A micro-crystal grain arrangement system, suitable for arranging N (N≧2) micro-crystal grains into a predetermined pattern, comprising: The micro-robot device of claim 1 for driving the micro-chips carried on the arm layer; an image capturing module disposed above the micro-robot device and configured to continuously capture images of the arm layer carrying the N microchips at a predetermined frequency; an image recognition module, electrically connected to the image capture module to receive each image captured by the image capture module, and for each image, recognizes the N micro-chips and obtains respectively the N number of microchips according to the recognition result area location data for the N operating areas carrying the N micro-dies; and A movement control module is electrically connected to the control circuit layer of the micro-robot device and the image recognition module, and when receiving the region position data corresponding to each image from the image recognition module, in a predetermined The control cycle executes a control process, wherein the movement control module uses a movement estimation algorithm to generate a position data corresponding to the N target regions according to the region position data and the reference region position data of the N target regions associated with the predetermined arrangement pattern. a control output related to the movement of a micro-die, and transmit the control output to the control circuit layer of the micro-robot device; Wherein, the control output generated by the movement control module in the control process includes a plurality of arm modules provided to the control circuit layer in the N operation regions corresponding to the arm layer in position respectively control signals of a plurality of circuit modules, so that each of the circuit modules generates first to fourth control currents associated with electromagnetic effects according to one of the received control signals corresponding to the control signal, and causing the driving arms of the arm modules to be bent by the electromagnetic effect, so as to jointly drive each of the N microchips to move a predetermined distance toward a corresponding one of the N target areas; Wherein, the movement control module repeatedly executes the control process until the N microchips are arranged in the predetermined pattern. The microchip arrangement system according to claim 3, wherein the predetermined distance is an integer multiple of the displacement of the main arm body of each arm module caused by a single bending.

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