TWI726876B - Surface protective film - Google Patents

Surface protective film Download PDF

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Publication number
TWI726876B
TWI726876B TW105111661A TW105111661A TWI726876B TW I726876 B TWI726876 B TW I726876B TW 105111661 A TW105111661 A TW 105111661A TW 105111661 A TW105111661 A TW 105111661A TW I726876 B TWI726876 B TW I726876B
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adhesive
area
protection film
weak
adhesion
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TW105111661A
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TW201702337A (en
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坂東沙也香
前田淳
堀米克彦
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日商琳得科股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

本發明的表面保護膜(10),係貼附選自光學零件(20)或電子零件中所選擇的被貼附體,用以保護其表面的表面保護膜,係具備:基材(11)、及設置於前述基材(11)的一方之面的黏著劑層(12);表面保護膜的黏著劑層側之面(黏著面(15)),至少在圍繞中央部分(17)的環狀區域(16)中,一部分為強黏著部,而其他部分為黏著力比前述強黏著部的黏著力還低的弱黏著部與非黏著部的至少一者。 The surface protective film (10) of the present invention is a surface protective film for protecting the surface of an adherend selected from optical parts (20) or electronic parts, and is provided with: a substrate (11) , And the adhesive layer (12) provided on one side of the aforementioned substrate (11); the adhesive layer side surface (adhesive surface (15)) of the surface protective film, at least in the ring surrounding the central part (17) In the shaped area (16), a part is a strong adhesive part, and the other part is at least one of a weak adhesive part and a non-adhesive part whose adhesive force is lower than that of the aforementioned strong adhesive part.

Description

表面保護膜 Surface protective film

本發係有關一種貼附於各種光學零件或電子零件的表面,用來保護該表面的表面保護膜。 This invention relates to a surface protective film attached to the surface of various optical parts or electronic parts to protect the surface.

從前,當組裝電子機器等的時侯,預先將各種電子元件、光學元件單元化,並實裝於基板等的方法廣為人知。做為這種單元化的光學零件及電子零件,廣為人知的有:攝像模組、攝影機的透鏡單元、通信單元、感測單元、具有振動器等的馬達單元等。在進行該等光學零件及電子零件的加工、組裝、檢查、運送等等動作時,為了防止表面的損傷及附著灰塵,會貼附表面保護膜。 In the past, when assembling electronic equipment and the like, it is widely known that various electronic components and optical components are unitized in advance and mounted on a board or the like. As such unitized optical parts and electronic parts, widely known are: camera modules, camera lens units, communication units, sensing units, motor units with vibrators, etc. When processing, assembling, inspecting, and transporting optical components and electronic components, a surface protective film is attached to prevent surface damage and dust adhesion.

表面保護膜一般是在基材的一方之面設置黏著劑層而形成,藉由黏著劑層貼附表面保護膜於光學零件及電子零件等被貼附體的表面,同時保護被貼附體的表面;當不需要保護表面時,將表面保護膜從被貼附體剝離。 The surface protection film is generally formed by providing an adhesive layer on one side of the substrate. The surface protection film is attached to the surface of the attached body such as optical parts and electronic parts by the adhesive layer, and at the same time protects the attached body Surface: When it is not necessary to protect the surface, peel off the surface protection film from the adherend.

此外,影像感測器模組等光學零件一般具有由透鏡等所構成的受光部。因此,為了使受光部不產生黏膠殘留, 於是在表面保護膜安裝受光部的部分,形成不塗佈黏著劑的未塗佈部分(例如,參照專利文獻1)。 In addition, optical components such as an image sensor module generally have a light-receiving portion composed of a lens or the like. Therefore, in order to prevent adhesive residue from the light-receiving part, Then, the part where the light-receiving part is attached to the surface protective film forms an uncoated part where no adhesive is applied (for example, refer to Patent Document 1).

此外,已知光學零件具備透鏡、及為了支持透鏡的透鏡支持零件,透鏡支持零件具有圍繞透鏡的環狀部。表面保護膜對於這種光學零件,用以貼附環狀部的表面,藉此,保護透鏡及透鏡支持零件。 In addition, it is known that an optical component includes a lens and a lens support component for supporting the lens, and the lens support component has an annular portion surrounding the lens. The surface protection film is used to attach the surface of the ring portion to such an optical component, thereby protecting the lens and the lens supporting component.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]JP 4116607 B [Patent Document 1] JP 4116607 B

不過,近年來隨著光學零件的小型化及高精密化的進展,不只是透鏡,也要求防止透鏡支持零件產生黏膠殘留,但是習知的黏著片無法充分地防止透鏡支持零件的黏膠殘留。 However, in recent years, with the progress of miniaturization and high-precision of optical parts, not only lenses, but also lens support parts are required to prevent adhesive residues. However, conventional adhesive sheets cannot sufficiently prevent the adhesive residues of lens support parts. .

特別是,一般表面保護膜以比環狀部還大一圈的方式形成,覆蓋透鏡支持零件的環狀部全體。因此,通常,表面保護膜以突出環狀部的外圍部外側的方式,貼附於透鏡支持零件。不過,若表面保護膜以突出透鏡支持部材的外圍部的方式貼附的話,將表面保護膜從光學零件剝離時,該外圍部會因黏著劑的拉扯而產生黏膠殘留。此外,透鏡支持零件的內周部也一樣會產生黏膠殘留。 In particular, the surface protection film is generally formed so as to be one circle larger than the ring portion, and covers the entire ring portion of the lens supporting part. Therefore, in general, the surface protection film is attached to the lens supporting part so as to protrude outside the outer peripheral portion of the annular portion. However, if the surface protective film is attached so as to protrude from the peripheral part of the lens support member, when the surface protective film is peeled off from the optical component, the peripheral part will have adhesive residue due to the pull of the adhesive. In addition, the inner periphery of the lens support parts will also have adhesive residue.

此外,透鏡支持零件的表面雖然形成有各種覆蓋膜,但設於透鏡支持零件的可能是脆弱的覆蓋膜。因此,若表面保護膜的黏著力過高,剝離表面保護膜時,可能會連覆蓋膜也一起剝落。再來,將表面保護膜從透鏡支持零件剝離時,也會產生剝離不良。 In addition, although various cover films are formed on the surface of the lens supporting part, the fragile cover film may be provided on the lens supporting part. Therefore, if the adhesive force of the surface protection film is too high, when the surface protection film is peeled off, even the cover film may peel off. Furthermore, when the surface protective film is peeled off from the lens supporting part, peeling failure may also occur.

有鑑於以上問題點,本發明提供一種表面保護膜,其能防止由光學零件或電子零件所構成的被貼附體的表面產生黏膠殘留,也不易產生剝離不良,並能適切地將表面保護薄膜從被貼附體剝離。 In view of the above problems, the present invention provides a surface protection film, which can prevent adhesive residue on the surface of an adherend composed of optical parts or electronic parts, is not easy to produce peeling defects, and can appropriately protect the surface The film peels off from the adherend.

本發明者們討論之後的結果發現,圍繞表面保護膜的黏著面的中央部分的環狀區域中,一部分為強黏著部,而其他部分為黏著力比強黏著部的黏著力還低的弱黏著部或非黏著部的至少一者,可以解決上述問題,因而完成以下的發明。也就是說,本發明提供以下的[1]~[12]。 After discussion by the inventors, it was found that in the annular area surrounding the central part of the adhesive surface of the surface protective film, one part is a strong adhesive part, and the other part is a weak adhesive whose adhesive force is lower than that of the strong adhesive part. At least one of the part or the non-adhesive part can solve the above-mentioned problem, and thus the following invention is completed. That is, the present invention provides the following [1] to [12].

[1]一種貼附於光學零件或電子零件,用以保護其表面的表面保護膜,係具備:基材、及設置於前述基材的一方之面的黏著劑層;前述表面保護膜的黏著劑層側之面,至少在圍繞中央部分的環狀區域中,一部分為強黏著部,而其他部分為黏著力比前述強黏著部的黏著力還低的弱黏著部與非黏著部的至少一者。 [1] A surface protective film attached to an optical component or electronic component to protect the surface thereof, comprising: a substrate, and an adhesive layer provided on one surface of the substrate; adhesion of the surface protective film On the side surface of the agent layer, at least in the annular area surrounding the central part, one part is a strong adhesive part, and the other part is at least one of a weak adhesive part and a non-adhesive part whose adhesive force is lower than that of the aforementioned strong adhesive part. By.

[2]如上述[1]所記載的表面保護膜,其中,前述黏著劑層以能量線硬化性黏著劑形成,且前述弱黏著部及非黏著部的至少一者係由經能量線照射而硬化的部分所構成。 [2] The surface protection film as described in [1] above, wherein the adhesive layer is formed of an energy-ray curable adhesive, and at least one of the weakly adhesive portion and the non-adhesive portion is irradiated with energy rays. Consists of hardened parts.

[3]如上述[1]或[2]所記載的表面保護膜,其中,前述黏著劑層之一部分設置於前述基材的一方之面,不設置前述黏著劑層的部分成為前述非黏著部。 [3] The surface protection film according to [1] or [2] above, wherein a part of the adhesive layer is provided on one surface of the base material, and the part where the adhesive layer is not provided becomes the non-adhesive portion .

[4]如上述[1]~[3]中任1項所記載的表面保護膜,其中,前述表面保護膜的黏著劑層側之面,至少在前述環狀區域,具有由前述弱黏著部及非黏著部的至少一者與前述強黏著部交互設置而成的圖案形狀。 [4] The surface protective film as described in any one of [1] to [3] above, wherein the surface of the surface protective film on the side of the adhesive layer has at least the annular region formed by the weakly adhesive portion And at least one of the non-adhesive part and the aforementioned strong adhesion part are alternately arranged in a pattern shape.

[5]如上述[1]~[4]中任1項所記載的表面保護膜,其中,前述表面保護膜的黏著劑層側之面,至少在前述環狀區域中,具有前述弱黏著部及非黏著部的至少一者與前述強黏著部以選自:條紋形狀、格子形狀、點狀、由複數波線並排排列而成的形狀、格子花紋、及由複數種圖案並排排列而成的形狀之任意的圖案配置。 [5] The surface protective film according to any one of [1] to [4] above, wherein the surface of the surface protective film on the side of the adhesive layer has the weakly adhesive portion at least in the annular region At least one of the non-adhesive part and the aforementioned strong adhesive part are selected from: stripe shape, lattice shape, dot shape, shape formed by multiple wave lines arranged side by side, lattice pattern, and shape formed by side-by-side multiple patterns Arbitrary pattern configuration.

[6]如上述[1]~[5]中任1項所記載的表面保護膜,其中,於前述環狀區域的外側部分及內側部分的兩方,在設置前述弱黏著部及非黏著部的至少一者形成弱黏著區域或非黏著區域的同時,在前述外側部分及內側部分之間的中間部分設置前述強黏著部成為強黏著區域。 [6] The surface protection film described in any one of [1] to [5] above, wherein the weakly adhesive part and the non-adhesive part are provided on both the outer part and the inner part of the annular region At least one of the two forms a weak adhesion area or a non-adhesive area, and at the same time the strong adhesion part is provided in the middle part between the outer part and the inner part to become a strong adhesion area.

[7]如上述[1]~[5]中任1項所記載的表面保護膜,其中,在前述環狀區域中的外側部分及內側部分中的其中一方,在設置前述強黏著部形成強黏著區域的同時,於另一 方,設置前述弱黏著部及前述非黏著部的至少一者,形成弱黏著區域或非黏著區域。 [7] The surface protection film as described in any one of [1] to [5] above, wherein one of the outer portion and the inner portion of the annular region is provided with a strong adhesion portion. While sticking to the area, at the same time Alternatively, at least one of the weakly adhered portion and the non-adhesive portion is provided to form a weakly adhered area or a non-adhesive area.

[8]如上述[6]或[7]所記載的表面保護膜,其中,前述弱黏著區域,具有由前述弱黏著部及非黏著部的至少一者與強黏著部交互設置而成的圖案形狀。 [8] The surface protection film as described in [6] or [7] above, wherein the weakly adhesive area has a pattern in which at least one of the weakly adhesive portion and the non-adhesive portion and the strong adhesive portion are alternately arranged shape.

[9]如上述[6]或[7]所記載的表面保護膜,其中,前述強黏著區域,具有由前述弱黏著部及非黏著部的至少一者與強黏著部交互設置而成的圖案形狀。 [9] The surface protection film as described in [6] or [7] above, wherein the strong adhesion area has a pattern in which at least one of the weak adhesion portion and the non-adhesive portion and the strong adhesion portion are alternately arranged shape.

[10]如上述[1]~[9]中任1項所記載的表面保護膜,其中,前述光學零件或電子零件具有環狀部;前述表面保護膜的前述環狀區域黏接於前述環狀部。 [10] The surface protection film according to any one of [1] to [9] above, wherein the optical component or electronic component has an annular portion; and the annular region of the surface protection film is adhered to the ring状部。 The state.

[11]一種附表面保護膜的零件,具備:選自光學零件與電子零件的其中一零件,及貼付在該零件表面之如前述[1]~[10]中任一項所記載的表面保護膜。 [11] A part with a surface protective film, comprising: one part selected from optical parts and electronic parts, and a surface as described in any one of [1] to [10] attached to the surface of the part Protective film.

[12]一種表面保護方法,係將如前述[1]~[10]中任1項所記載的表面保護膜貼附於光學零件或電子零件的表面,並保護該表面。 [12] A surface protection method, which is to attach the surface protection film described in any one of [1] to [10] to the surface of an optical component or an electronic component, and to protect the surface.

本發明提供一種表面保護膜,其能防止由光學零件及電子零件所構成的被貼附體的表面產生黏膠殘留,也不易產生剝離不良,並能適切地將表面保護薄膜從被貼附體剝離。 The present invention provides a surface protective film, which can prevent adhesive residue on the surface of an adhered body composed of optical parts and electronic parts, is not easy to produce peeling defects, and can appropriately remove the surface protective film from the adhered body Peel off.

10‧‧‧表面保護膜 10‧‧‧Surface protective film

11‧‧‧基材 11‧‧‧Substrate

12‧‧‧黏著劑層 12‧‧‧Adhesive layer

15‧‧‧黏著面(黏著劑層側的面) 15‧‧‧Adhesive surface (the surface on the side of the adhesive layer)

16‧‧‧環狀區域 16‧‧‧Annular area

16A、16X‧‧‧外側部分 16A、16X‧‧‧Outer part

16B、16Y‧‧‧內側部分 16B, 16Y‧‧‧Inner part

16C‧‧‧中間部分 16C‧‧‧Middle part

17‧‧‧中央部分 17‧‧‧Central part

20‧‧‧光學零件 20‧‧‧Optical parts

21‧‧‧透鏡 21‧‧‧Lens

22‧‧‧透鏡支持零件 22‧‧‧Lens support parts

23‧‧‧環狀部 23‧‧‧Annular part

[圖1]表示有關第1實施形態的表面保護膜的黏著劑層側的面的模式平面圖。 [Fig. 1] A schematic plan view showing the surface of the surface protective film on the adhesive layer side of the first embodiment.

[圖2]表示第1實施形態中,貼附於被貼附體的表面保護膜的斷面圖。 [Fig. 2] A cross-sectional view showing the surface protection film attached to the adherend in the first embodiment.

[圖3]表示有關第2及第3實施形態的表面保護膜的黏著劑層側的面的模式平面圖。 [Fig. 3] A schematic plan view showing the surface of the surface protection film related to the second and third embodiments on the adhesive layer side.

[圖4]表示第2及第3實施形態中,貼附於被貼附體的表面保護膜的斷面圖。 [Fig. 4] A cross-sectional view showing the surface protection film attached to the adherend in the second and third embodiments.

[圖5]表示有關第4實施形態的表面保護膜的黏著劑層側的面的模式平面圖。 [Fig. 5] A schematic plan view showing the surface of the surface protection film on the adhesive layer side of the fourth embodiment.

[圖6]表示第4實施形態中,貼附於被貼附體的表面保護膜的斷面圖。 [Fig. 6] A cross-sectional view showing the surface protection film attached to the adherend in the fourth embodiment.

[圖7]表示第4實施形態中,弱黏著部與強黏著部的配置圖案為格子形狀之例的平面圖。 [Fig. 7] Fig. 7 is a plan view showing an example in which the arrangement pattern of the weak adhesion portion and the strong adhesion portion is a lattice shape in the fourth embodiment.

[圖8]表示第4實施形態中,弱黏著部與強黏著部的配置圖案為點形狀之例的平面圖。 [Fig. 8] Fig. 8 is a plan view showing an example in which the arrangement pattern of the weak adhesion portion and the strong adhesion portion is a dot shape in the fourth embodiment.

[圖9]表示第4實施形態中,弱黏著部與強黏著部的配置圖案為由複數波線並排排列而成的形狀之例的平面圖。 [Fig. 9] Fig. 9 is a plan view showing an example in which the arrangement pattern of the weak adhesion portion and the strong adhesion portion is a shape in which a plurality of wave lines are arranged side by side in the fourth embodiment.

[圖10]表示第4實施形態中,弱黏著部與強黏著部的配置圖案為格子花紋之例的平面圖。 [Fig. 10] A plan view showing an example in which the arrangement pattern of the weak adhesion portion and the strong adhesion portion is a checkered pattern in the fourth embodiment.

[圖11]表示有關第5實施形態的表面保護膜的黏著 劑層側的面的模式平面圖。 [Figure 11] shows the adhesion of the surface protective film of the fifth embodiment A schematic plan view of the surface on the side of the agent layer.

[圖12]表示有關第6實施形態的表面保護膜的黏著劑層側的面的模式平面圖。 [Fig. 12] A schematic plan view showing the surface of the surface protection film on the adhesive layer side of the sixth embodiment.

[圖13]表示有關第7實施形態的表面保護膜的黏著劑層側的面的模式平面圖。 [Fig. 13] A schematic plan view showing the surface of the surface protection film on the adhesive layer side of the seventh embodiment.

[圖14]表示有關第5實施形態的變形例的表面保護膜的黏著劑層側的面的模式平面圖。 Fig. 14 is a schematic plan view showing the surface of the surface protection film on the adhesive layer side of a modification of the fifth embodiment.

[表面保護膜] [Surface protection film]

本發明的表面保護薄膜係貼附於選自光學零件或電子零件的被貼附體,用以保護該表面。以下,係有關本發明的表面保護膜,利用第1~第7實施形態來做詳細的說明。 The surface protection film of the present invention is attached to an attached body selected from optical components or electronic components to protect the surface. Hereinafter, the surface protective film of the present invention will be described in detail using the first to seventh embodiments.

(第1實施形態) (First Embodiment)

首先,利用圖1、2說明有關本發明的第1實施形態之表面保護膜。如圖1、2所示,表面保護膜10具備:基材11、設置於基材11的一方之面的黏著劑層12。 First, the surface protective film according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. As shown in FIGS. 1 and 2, the surface protection film 10 includes a base material 11 and an adhesive layer 12 provided on one surface of the base material 11.

(基材) (Substrate)

雖不特別限定基材11的材料,但例如可以由樹脂薄膜所形成。做為樹脂薄膜,可以使用習知的材料,但也可 以使用:聚乙烯薄膜、聚丙烯薄膜、聚丁烯薄膜、聚丁二烯薄膜、聚甲基戊烯薄膜、聚氯乙烯薄膜、氯乙烯共聚物薄膜、聚乙烯對苯二甲酸酯薄膜、聚丁烯對苯二甲酸酯薄膜、聚胺甲酸酯薄膜、乙烯乙酸乙烯酯薄膜、離子聚合物樹脂膜、乙烯.(甲基)丙烯酸共聚物薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜、氟樹脂薄膜、聚酰亞胺、聚乙烯萘二甲酸等的薄膜。此外,該等交聯薄膜也可以使用層積2層以上薄膜的層積薄膜。 Although the material of the base material 11 is not particularly limited, it may be formed of, for example, a resin film. As a resin film, conventional materials can be used, but it can also be For use: polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, Polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionic polymer resin film, ethylene. (Meth) acrylic copolymer film, polystyrene film, polycarbonate film, fluororesin film, polyimide, polyethylene naphthalene dicarboxylic acid and other films. In addition, as these crosslinked films, a laminated film in which two or more films are laminated can also be used.

在本實施形態中,黏著劑層12的一部分如同後述,在照射能量線使之硬化時,基材11使用對能量線的波長具有透過性的材料較佳。例如,使用紫外線做為能量線時,基材11使用紫外線透過性薄膜較佳。但是,當能量線照射在基材11的反對側進行時,以及黏著劑層12不會因照射能量線而硬化時,基材11對能量線不需要有透過性。 In the present embodiment, a part of the adhesive layer 12 is as described later. When the energy ray is irradiated to harden it, it is preferable to use a material that is transparent to the wavelength of the energy ray as the base material 11. For example, when ultraviolet rays are used as the energy rays, it is preferable to use an ultraviolet-transmitting film for the substrate 11. However, when the energy ray is irradiated on the opposite side of the base material 11 and the adhesive layer 12 is not cured by the energy ray, the base material 11 does not need to be transparent to the energy ray.

再來,在作業工程上,為了能夠簡單判別表面保護膜10的貼附的有無,可在基材11或後述的黏著劑層12的一方或兩方著色。 Furthermore, in the work process, in order to be able to easily determine the presence or absence of adhesion of the surface protective film 10, one or both of the base material 11 or the adhesive layer 12 described later may be colored.

基材11的厚度可對應表面保護膜10所要求的性能做調整,較佳為10~300μm,更佳為30~150μm。 The thickness of the substrate 11 can be adjusted corresponding to the performance required of the surface protective film 10, preferably 10 to 300 μm, more preferably 30 to 150 μm.

(黏著劑層) (Adhesive layer)

黏著劑層12由能量線硬化型黏著劑或非能量線硬化型黏著劑所形成。黏著劑層12例如是由能量線硬化性黏 著劑所形成,且,黏著劑層12的一部分因能量線的照射而硬化,對被貼附體的黏著力下降。在這種情況下,表面保護膜10的黏著劑層12側的面(稱為“黏著面15”)具備:不被能量線所照射,維持高黏著力狀態的強黏著部、及經能量線照射而硬化,黏著力比強黏著部低的弱黏著部。 The adhesive layer 12 is formed of an energy ray hardening adhesive or a non-energy ray hardening adhesive. The adhesive layer 12 is, for example, hardened by energy rays. The adhesive is formed, and a part of the adhesive layer 12 is hardened by the irradiation of energy rays, and the adhesive force to the adherend decreases. In this case, the surface of the surface protective film 10 on the side of the adhesive layer 12 (referred to as the "adhesive surface 15") is provided with a strong adhesive portion that is not irradiated by energy rays and maintains a high adhesive force state, and warp energy rays The weak adhesive part that hardens by irradiation and has a lower adhesive force than the strong adhesive part.

此外,黏著面15的一部分不設置黏著劑層12,因為與黏接於被貼附體的黏著劑之間的接觸面積較小,可能使黏著力降低。在這種情況下,黏著面15具備:設置黏著劑的強黏著部、及無黏著劑的非黏著部。當黏著面15的一部分沒設置黏著劑層12時,黏著劑層12通常由非能量線硬化型黏著劑所形成,但由能量線硬化型黏著劑形成也可以。 In addition, the adhesive layer 12 is not provided on a part of the adhesive surface 15 because the contact area with the adhesive adhered to the adherend is small, which may reduce the adhesive force. In this case, the adhesive surface 15 is provided with a strong adhesive part provided with an adhesive, and a non-adhesive part without an adhesive. When the adhesive layer 12 is not provided on a part of the adhesive surface 15, the adhesive layer 12 is usually formed of a non-energy ray hardening type adhesive, but it may be formed of an energy ray hardening type adhesive.

能量線硬化性黏著劑,係指如上述照射能量線後,會硬化且降低剝離力。做為能量線,具體來說可以使用紫外線,電子線等,但較佳為使用紫外線。 Energy-ray curable adhesive means that after the above-mentioned energy ray is irradiated, it will harden and reduce the peeling force. As the energy rays, specifically, ultraviolet rays, electron rays, etc. can be used, but it is preferable to use ultraviolet rays.

雖並不特別限定做為能量線硬化型黏著劑使用的黏著劑,但可以使用:丙烯酸系黏著劑、橡膠系黏著劑、有機矽系黏著劑、聚酯纖維系黏著劑、聚氨酯系黏著劑、聚烯烴系黏著劑等,但不限定於此,可以適當地從任意的材料中挑選。此外,其中較佳為丙烯酸系黏著劑。 Although the adhesive used as an energy ray hardening adhesive is not particularly limited, it can be used: acrylic adhesive, rubber adhesive, silicone adhesive, polyester fiber adhesive, polyurethane adhesive, Polyolefin-based adhesives, etc., but are not limited to these, and can be appropriately selected from arbitrary materials. In addition, among them, acrylic adhesives are preferred.

此外,黏著劑通常為:加入丙烯酸系樹脂、橡膠系樹脂、矽氧烷系樹脂、聚酯系樹脂、聚氨酯系樹脂、聚烯烴系樹脂等的黏著性成份(主聚合物),視其必要含有交聯 劑、黏著提供劑、抗氧化劑、可塑劑、無機填料、有機填料等的充填劑、抗靜電劑、阻燃劑、著色劑、紫外線吸收劑、紅外線吸收劑等的添加劑的黏著劑組成物所組成之物。上述填料不問修飾基的有無,也不限定尺寸。考慮向黏著劑的分散性的話,粒徑較佳為3μm以下,添加量對黏著劑為70質量%以下較佳。此外,黏著性成份所廣泛包含的概念是:黏著性成份自體實質上不具有黏著性,但經由可塑化成份的添加等,而發現黏著性的聚合物等。 In addition, the adhesive is usually: acrylic resin, rubber resin, silicone resin, polyester resin, polyurethane resin, polyolefin resin and other adhesive components (main polymer) are added, as necessary. Cross-linked It is composed of adhesive composition of additives such as fillers, adhesive agents, antioxidants, plasticizers, inorganic fillers, organic fillers, antistatic agents, flame retardants, colorants, ultraviolet absorbers, infrared absorbers, etc. Things. The above-mentioned filler does not matter whether there is a modifier or not, and the size is not limited. In consideration of dispersibility to the adhesive, the particle size is preferably 3 μm or less, and the addition amount is preferably 70% by mass or less with respect to the adhesive. In addition, the concept widely included in the adhesive component is that the adhesive component itself is not substantially adhesive, but through the addition of plasticizing components, adhesive polymers and the like are discovered.

能量線硬化型黏著劑一般含有光聚合性不飽和基的成份。做為能量線硬化型黏著劑雖不特別限定,但例如使用X型之物。所謂的X型能量線硬化型黏著劑,係指於黏著劑的主聚合物(例如,丙烯酸系聚合體)自體(例如,於主聚合物的側鎖)導入光聚合性不飽和基。 Energy-ray curable adhesives generally contain photopolymerizable unsaturated group components. Although it is not particularly limited as an energy ray curable adhesive, for example, an X-type adhesive is used. The so-called X-type energy-ray curable adhesive refers to the introduction of photopolymerizable unsaturated groups into the main polymer (for example, acrylic polymer) of the adhesive (for example, the side lock of the main polymer).

此外,能量線硬化型黏著劑,也可以為Y型的能量線硬化型黏著劑。所謂的Y型能量線硬化型黏著劑,與主聚合物(例如,丙烯酸系聚合體)不同,係指配合具有光聚合性不飽和基的能量線聚合性化合物之物。再來,做為能量線硬化型黏著劑,也可以併用X型及Y型。也就是說,能量線硬化型黏著劑為,配合能量線聚合性化合物,而且也可以在主聚合物的至少一部分導入光聚合性不飽和基。 In addition, the energy ray hardening adhesive may also be a Y-type energy ray hardening adhesive. The so-called Y-type energy-ray curable adhesive, unlike the main polymer (for example, acrylic polymer), refers to a compound having an energy-ray polymerizable compound having a photopolymerizable unsaturated group. Furthermore, as an energy-ray hardening adhesive, X-type and Y-type can also be used together. In other words, the energy-ray curable adhesive contains an energy-ray polymerizable compound, and a photopolymerizable unsaturated group may be introduced into at least a part of the main polymer.

此外,光聚合性不飽和基通常是具有雙鍵的基,較佳為(甲基)丙烯酰基。 In addition, the photopolymerizable unsaturated group is usually a group having a double bond, and a (meth)acryloyl group is preferred.

此外,能量線硬化型黏著劑較佳為含有光聚 合性引發劑。做為光聚合性引發劑,例如是:安息香化合物、苯乙酮化合物、醯基膦氧化物化合物、二茂鈦化合物、噻吨酮化合物、過氧化物化合物等的光聚合性引發劑、胺和醌等的光增感劑;更具體來說,例如是:1-羥苯基丁酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮、安息香、安息香甲基醚、安息香乙醚、安息香異丙醚、2,2-二甲氧基-1,2-二苯-1-酮、聯苯(2,4,6-三甲基苯甲酰)氧化膦等。也可以組合1種或2種以上的該等光聚合性引發劑來使用。 In addition, the energy-ray curable adhesive preferably contains photopolymerization Synthetic initiator. As photopolymerizable initiators, for example, photopolymerizable initiators such as benzoin compounds, acetophenone compounds, phosphine oxide compounds, titanocene compounds, thioxanthone compounds, peroxide compounds, etc., amines and Light sensitizers such as quinone; more specifically, for example: 1-hydroxyphenyl butanone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, benzoin, benzoin methyl ether , Benzoin ethyl ether, Benzoin isopropyl ether, 2,2-Dimethoxy-1,2-benzophen-1-one, biphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, etc. One or more of these photopolymerizable initiators can also be used in combination.

另一方面,非能量線硬化型黏著劑係不包含光聚合性不飽和基成份,再者因為通常不含有光聚合性引發劑,故為經照射能量線也不會降低黏著力。非能量線硬化型黏著劑含有上述的黏著性成份,且視其必要也含有上述的各種添加劑。 On the other hand, non-energy-ray-curable adhesives do not contain photopolymerizable unsaturated group components, and because they usually do not contain photopolymerizable initiators, they do not decrease the adhesive force even after energy rays are irradiated. The non-energy-ray hardening adhesive contains the above-mentioned adhesive components and, if necessary, the above-mentioned various additives.

黏著劑層12的厚度並不特別限定,較佳為3~50μm,更佳為5~30μm。因為黏著劑層的厚度在上述範圍內,可輕易提高對被貼附體的密著性。 The thickness of the adhesive layer 12 is not particularly limited, but is preferably 3-50 μm, more preferably 5-30 μm. Because the thickness of the adhesive layer is within the above range, the adhesion to the adherend can be easily improved.

黏著面15至少在環狀區域16中,一部分為強黏著部,其他部分為弱黏著部或非黏著部。此外,環狀區域16指的是黏著面15的中央部分17以外的區域,意即圍繞中央部分的區域。在此,中央部分17在圖1中為點線的假想線所圍繞的區域。 The adhesive surface 15 is at least in the annular region 16, a part of which is a strong adhesive part, and the other part is a weak adhesive part or a non-adhesive part. In addition, the annular area 16 refers to an area other than the central portion 17 of the adhesive surface 15, that is, an area surrounding the central portion. Here, the central portion 17 is an area surrounded by a dotted imaginary line in FIG. 1.

此外,在本說明書中,強黏著部係意味著黏著力比弱黏著部或非黏著部高的部分,但並不表示絕對黏著力值很 高。 In addition, in this specification, the strong adhesion part means the part with higher adhesion than the weak adhesion part or the non-adhesive part, but it does not mean that the absolute adhesion value is very high. high.

以下,更詳細說明本實施形態。在以下實施形態的說明中,黏著劑層12做為例示,由能量線硬化型黏著劑所形成,藉由能量線硬化而設置弱黏著部,但不限定於此例,在黏著面15的一部分不設置黏著劑層12,而設置非黏著部的態樣也可以。接著,在以下的記載中,能量線硬化型黏著劑可以適當地以非能量線硬化型黏著劑來代替,弱黏著部也可以適當地以非黏著部來代替。 Hereinafter, this embodiment will be described in more detail. In the description of the following embodiments, the adhesive layer 12 is taken as an example and is formed of an energy-ray curable adhesive, and a weak adhesive portion is provided by energy-ray curing. However, it is not limited to this example, and is formed on a part of the adhesive surface 15 The adhesive layer 12 is not provided, and a non-adhesive part may be provided. Next, in the following description, the energy-beam-curable adhesive can be appropriately replaced by a non-energy-beam-curable adhesive, and the weakly-adhesive part can also be appropriately replaced by a non-adhesive part.

弱黏著部設置於環狀區域16中的外側部分16A及內側部分16B的兩方。另一方面,強黏著部設置於該等外側部分16A及內側部分16B之間的中間部分16C。因此,外側部分16A及內側部分16B,在做為區域的黏著力比中間部分16C低的弱黏著區域,中間部分16C做為區域的黏著力高的強黏著區域。 The weak adhesion portion is provided on both the outer portion 16A and the inner portion 16B in the annular region 16. On the other hand, the strong adhesion part is provided in the middle part 16C between the outer part 16A and the inner part 16B. Therefore, the outer portion 16A and the inner portion 16B are used as weak adhesion areas where the adhesion force of the area is lower than that of the middle portion 16C, and the middle portion 16C is used as the strong adhesion area where the adhesion force of the area is higher.

再更詳細說明的話,外側部分16A為,構成黏著面15的外周緣15A,且呈環狀的區域,該區域的黏著劑層12被硬化,由弱黏著部所形成。此外,中間部分16C為,連接外側部分16A內周的環狀區域,黏著劑層12不會藉由能量線所硬化,由強黏著部所形成。再來,內側部分16B為,連接中間部分16C內周的區域,和外側部分16A同樣的,黏著劑層12被硬化,由弱黏著部所構成。 In more detail, the outer portion 16A is a ring-shaped area that constitutes the outer peripheral edge 15A of the adhesive surface 15. The adhesive layer 12 in this area is hardened and is formed by a weak adhesive portion. In addition, the middle portion 16C is a ring-shaped area connected to the inner periphery of the outer portion 16A, and the adhesive layer 12 is not hardened by energy rays, and is formed by a strong adhesive portion. Furthermore, the inner part 16B is a region connecting the inner periphery of the middle part 16C. Like the outer part 16A, the adhesive layer 12 is hardened and constituted by a weak adhesive part.

此外,本實施形態中,中央部分17和內側部分16B一樣,由弱黏著部所形成。因此,中間部分16C的內側區 域(也就是,中央部分17及內側部分16B),全部由弱黏著部所構成。不過,中央部分17不由弱黏著部所構成,也可以由強黏著部所構成。 In addition, in this embodiment, the central portion 17 is formed by a weak adhesive portion like the inner portion 16B. Therefore, the inner area of the middle portion 16C The domains (that is, the central part 17 and the inner part 16B) are all composed of weak adhesion parts. However, the central portion 17 is not composed of a weak adhesive part, but may be composed of a strong adhesive part.

此外,本說明書中,所謂的中央部分17為,平面視黏著面15時,包含幾何重心之具有任意廣度的假想區域,例如定義成,以重心為中心時,未滿(a×r)的範圍內的任意區域。而且,所謂的r意味著,平面視時從黏著面15的重心至黏著面15的外周緣15A的各點之距離,當黏著面15為圓的時侯就是半徑。a是從比0還大但未滿1的數值中所選出的正數。a較佳為定義成0.05~0.65,更佳為0.1~0.6。 In addition, in this specification, the so-called central portion 17 is an imaginary area with arbitrary width that includes the geometric center of gravity when the adhesive surface 15 is viewed in plan. For example, it is defined as a range that is less than (a×r) when the center of gravity is centered. Any area within. Moreover, the so-called r means the distance from the center of gravity of the adhesive surface 15 to the outer peripheral edge 15A of the adhesive surface 15 in a plan view, and when the adhesive surface 15 is round, it is the radius. a is a positive number selected from a number greater than 0 but less than 1. a is preferably defined as 0.05 to 0.65, more preferably 0.1 to 0.6.

環狀區域16如同後述,通常是黏接至光學零件或電子零件的被貼附體之黏接面所形成的區域,但因為a定義在上述的各上限值以下,故環狀區域16,也就是黏接面可確保一定程度的面積。因此,表面保護膜的貼附性變得良好。 As described later, the ring-shaped area 16 is usually the area formed by the bonding surface of the adherend of the optical component or the electronic component. However, because a is defined below each upper limit, the ring-shaped area 16 is That is, the bonding surface can ensure a certain degree of area. Therefore, the adhesion of the surface protection film becomes good.

本實施形態中,從環狀的中間部分16C的外圍至重心的距離W1(也就是中間部分16C的外徑/2)為,對上述距離r的比(W1/r),較佳為0.4~0.95,更佳為0.5~0.8。因為使對距離W1的比在上述上限值以下,可容易使環狀區域16(也就是黏接面)中的弱黏著部(特別是外側部分16A)的面積具有一定程度的大小,可容易防止發生剝離不良、或產生黏膠殘留。此外,藉由設定在上述下限值以下上,弱黏著部的面積較不容易大於必 要以上的大小,可防止產生黏接不足。 In this embodiment, the distance W1 from the periphery of the annular middle portion 16C to the center of gravity (that is, the outer diameter of the middle portion 16C/2) is the ratio (W1/r) to the above-mentioned distance r, preferably 0.4~ 0.95, more preferably 0.5 to 0.8. Because the ratio to the distance W1 is less than the above upper limit, it is easy to make the area of the weakly adhesive part (especially the outer part 16A) in the annular region 16 (that is, the adhesive surface) a certain size, which can easily Prevent the occurrence of poor peeling or adhesive residue. In addition, by setting it below the above lower limit, the area of the weakly adhesive part is less likely to be larger than necessary. The above size can prevent insufficient bonding.

此外,從內側部分16B的外圍至重心的距離W2(也就是內側部分16B的外徑/2)為,對上述距離r的比(W2/r),較佳為0.1~0.7,更佳為0.15~0.65。 In addition, the distance W2 from the outer periphery of the inner portion 16B to the center of gravity (that is, the outer diameter of the inner portion 16B/2) is the ratio (W2/r) to the aforementioned distance r, preferably 0.1 to 0.7, more preferably 0.15 ~0.65.

因為使對距離W2的比在上述上限值以下,因強黏接力可容易確保黏接被貼附體的面積具有一定程度的大小,可容易防止發生黏接不足。另一方面,藉由設定在上述下限值以上,因強黏接力可防止黏接被貼附體的面積大於必要以上的大小,可容易防止發生剝離不良或黏膠殘留。 Since the ratio to the distance W2 is less than the above upper limit value, the strong adhesive force can easily ensure that the area where the adherend is attached has a certain size, and can easily prevent insufficient adhesion. On the other hand, by setting it above the above lower limit, due to the strong adhesive force, the area to be attached to the adherend can be prevented from being larger than necessary, and the occurrence of peeling failure or adhesive residue can be easily prevented.

黏著劑層12在能量線硬化前的黏著力(也就是強黏著部的黏著力)較佳為800~16000mN/25mm,更佳為1000~10000mN/25m,再更佳為1000~5000mN/25mm。因強黏著部的黏著力為800mN/25mm以上,對表面保護膜10的光學零件或電子零件的黏接力提高,使該保護性能變得良好。此外,因黏著力為16000mN/25mm以下,能輕易調整能量線硬化後的黏著力(也就是弱黏著部的黏著力)至所期望的大小。能量線硬化前的黏著力,可以因應黏著性成份的種類、黏著性成份所具有的官能基種類及量、交聯劑的使用量等做調整。 The adhesive force of the adhesive layer 12 before hardening of the energy rays (that is, the adhesive force of the strong adhesive part) is preferably 800-16000 mN/25mm, more preferably 1000-10000 mN/25m, and still more preferably 1000-5000 mN/25mm. Since the adhesive force of the strong adhesive part is 800 mN/25 mm or more, the adhesive force to the optical components or electronic components of the surface protective film 10 is improved, and the protective performance becomes good. In addition, because the adhesive force is 16000mN/25mm or less, the adhesive force (that is, the adhesive force of the weak adhesive part) after hardening of the energy line can be easily adjusted to the desired size. The adhesive force before the energy ray is cured can be adjusted according to the type of adhesive component, the type and amount of functional groups of the adhesive component, and the amount of crosslinking agent used.

此外,黏著劑層12在能量線硬化後的黏著力(也就是弱黏著部的黏著力)為50~800mN/25mm較佳,100~700mN/25mm更佳,100~300mN/25mm再更佳。因能量線硬化後的黏著力在此範圍中,可防止環狀區域16的黏著力變高,防止黏膠殘留的發生。此外,也可以將表面 保護膜10以比較小的力從被貼附體剝離。因此,在使剝離性能良好的同時,也可防止剝離表面保護膜時,設於光學零件或電子零件的表面覆蓋膜被剝離。 In addition, the adhesive force of the adhesive layer 12 after the energy line is hardened (that is, the adhesive force of the weakly adhesive part) is preferably 50-800 mN/25mm, more preferably 100-700 mN/25mm, and even more preferably 100-300 mN/25mm. Since the adhesive force after hardening of the energy rays is in this range, the adhesive force of the annular region 16 can be prevented from increasing, and the occurrence of adhesive residue can be prevented. In addition, the surface can also be The protective film 10 is peeled from the adherend with a relatively small force. Therefore, while improving the peeling performance, it is also possible to prevent peeling of the surface covering film provided on the optical component or the electronic component when the surface protective film is peeled off.

能量線硬化後的黏著力,可藉由能量線聚合性化合物的種類或量、導入黏著性成份的不飽和基的量來控制。 The adhesive force after energy ray hardening can be controlled by the type or amount of the energy ray polymerizable compound, and the amount of unsaturated groups introduced into the adhesive component.

以上測定剝離力的方法,具體由以下的方法來進行。 The above method of measuring the peeling force is specifically carried out by the following method.

能量線硬化前的黏著力(也就是強黏著部的黏著力)以與表面保護膜10相同的材料及加工方法所製作,將具備基材及黏著劑層的黏著片以寬25mm×長250mm做裁斷,做為樣本,在23℃、50%相對溼度的環境下,以2kg滾輪貼附於被貼附體之聚碳酸酯板的表面。在23℃、50%相對溼度的環境下靜置20分鐘後,以拉伸速度300mm/分、剝離角度180°,測定黏著片從被貼附體剝離時的剝離力,做為能量線硬化前的黏著力。 The adhesive force before energy ray hardening (that is, the adhesive force of the strong adhesive part) is made with the same material and processing method as the surface protective film 10, and the adhesive sheet with the base material and the adhesive layer is made with a width of 25mm × a length of 250mm Cut it out as a sample, and stick it on the surface of the polycarbonate board with a 2kg roller at 23°C and 50% relative humidity. After standing for 20 minutes in an environment of 23°C and 50% relative humidity, at a tensile speed of 300mm/min and a peeling angle of 180°, the peeling force when the adhesive sheet is peeled from the adherend is measured, which is used as the energy line before curing Of adhesion.

此外,能量硬化後的黏著力(也就是弱黏著部的黏著力)在貼附樣本於被貼附體並靜置20分鐘後,於上述黏著片,以形成弱黏著部時同樣的照射條件,將能量線從基材側照射黏著劑層全體,之後,使用與能量線硬化前的黏著力測定一樣的方法做測定,做為能量線硬化後的黏著力。 In addition, the adhesive force after energy hardening (that is, the adhesive force of the weakly adhered part) is the same irradiation conditions when the sample is attached to the adherend and left for 20 minutes to form the weakly adhered part on the above-mentioned adhesive sheet. The energy ray is irradiated to the entire adhesive layer from the side of the base material, and then the measurement is performed using the same method as the adhesive force measurement before the energy ray hardening, as the adhesive force after the energy ray hardening.

此外,本說明書中“做為區域的黏著力”意味著該區域全體的黏著力。因此,成為該對象的區域,如第5~第7的實施形態的弱黏著區域,當弱黏著部和強黏著部 混合的情形,該區域(例如,弱黏著區域)的“做為區域的黏著力”為:利用與表面保護膜同樣的材料及加工方法製作,且對於和該區域(例如,弱黏著區域)一樣的圖案,及相同的方法所形成的強黏著部與弱黏著部的樣本(黏著片),所測定出來的黏著力。測定黏著力的方法,具體由以下的方法進行。 In addition, in this specification, the "adhesive force as an area" means the adhesive force of the entire area. Therefore, the target area, such as the weak adhesion area of the fifth to seventh embodiments, is the weak adhesion portion and the strong adhesion portion In the case of mixing, the "adhesive force as the area" of the area (for example, the weak adhesion area) is: made with the same material and processing method as the surface protection film, and the same as the area (for example, the weak adhesion area) The pattern, and the sample (adhesive sheet) of the strong adhesion part and the weak adhesion part formed by the same method, and the adhesive force measured. The method of measuring the adhesive force is specifically carried out by the following method.

在表面保護膜上,利用能量線照射形成所期望的圖案形狀,不希望能量線硬化的部分利用遮罩遮住,越過遮罩進行能量線照射。藉此,遮罩所遮住的部分不會受到能量線的照射,而不遮光的部分則照射能量線製作樣本。也就是說,該樣本有些部分具有強黏著部,有些部分具有弱黏著部。將該樣本裁斷成上述黏著力測定用樣本的尺寸,進行與能量線硬化前的黏著力測定方法相同的黏著力測定。 On the surface protection film, energy ray irradiation is used to form the desired pattern shape, the part that is not desired to be hardened by the energy ray is masked by a mask, and the energy ray irradiation is performed across the mask. Thereby, the part covered by the mask will not be irradiated by the energy ray, and the unshielded part will be irradiated with the energy ray to make a sample. In other words, some parts of the sample have strong adhesion parts and some parts have weak adhesion parts. This sample was cut into the size of the sample for adhesive force measurement described above, and the adhesive force measurement was performed in the same way as the adhesive force measurement method before energy ray hardening.

另一方面,成為對象的區域,由強黏著部或弱黏著部的單體形成強黏著區域或弱黏著區域的情形時,強黏著部或弱黏著部的黏著力成為“做為區域的黏著力”。 On the other hand, when the target area is a strong adhesion area or a weak adhesion area formed by a single unit of a strong adhesion portion or a weak adhesion portion, the adhesion force of the strong adhesion portion or the weak adhesion portion becomes the "adhesion force of the area" ".

此外,如同後述混合弱黏著部和強黏著部的情形時,弱黏著區域的做為區域的黏著力較佳為500~15000mN/25mm,更佳為700~9000mN/25mm,再更佳為750~4500mN/25mm。 In addition, as in the case of mixing the weak adhesion part and the strong adhesion part described later, the adhesion force of the weak adhesion area as the area is preferably 500~15000mN/25mm, more preferably 700~9000mN/25mm, and still more preferably 750~ 4500mN/25mm.

(剝離片) (Peeling piece)

此外,在表面保護膜10的第1黏著層12的表面,貼附有剝離片(圖未示),也可以藉由剝離片來做保護。做 為剝離片,可以將聚對苯二甲酸、聚乙烯萘二甲酸、聚丙烯、聚乙烯等的樹脂薄膜及紙基材的一面,使用有機矽系剝離劑、氟系剝離劑、醇酸系剝離劑、聚烯烴系剝離劑、橡膠系剝離劑等的剝離劑做剝離處理,但並不以此為限。此外,也可以設置複數個表面保護膜10在比表面保護膜10具有足夠大的尺寸之1枚剝離片上。使用表面保護薄膜10時,係從剝離片剝離,並貼附於被貼附體。 In addition, a release sheet (not shown in the figure) is attached to the surface of the first adhesive layer 12 of the surface protection film 10, and it can also be protected by a release sheet. do As a release sheet, one side of a resin film such as polyterephthalic acid, polyethylene naphthalic acid, polypropylene, polyethylene, and paper substrate can be peeled off using a silicone-based release agent, a fluorine-based release agent, or an alkyd-based release. Releasing agent, polyolefin-based release agent, rubber-based release agent and other release agents are used for release treatment, but it is not limited to this. In addition, a plurality of surface protection films 10 may be provided on one release sheet having a sufficiently larger size than the surface protection film 10. When the surface protective film 10 is used, it is peeled from the release sheet and attached to the adherend.

(表面保護膜) (Surface protection film)

將表面保護膜10如上述的方式貼附於光學零件或電子零件做使用,但此時,在黏著面15中,環狀區域16的至少一部分,成為黏接光學零件或電子零件的黏接面。藉此,黏接表面保護膜10的被貼附體的黏接面可能兼具有弱黏著部及強黏著部。 The surface protection film 10 is attached to an optical component or an electronic component for use as described above, but at this time, in the adhesive surface 15, at least a part of the annular area 16 becomes the adhesive surface for bonding the optical component or the electronic component . Thereby, the adhesive surface of the adherend of the adhesive surface protective film 10 may have both a weak adhesive part and a strong adhesive part.

因此,可以藉由高黏著力,因為可使黏接被貼附體的黏接面之面積(強黏著部的面積)減少,可以抑制對表面保護膜10全體的被貼附體之黏著力的上升,也可以抑制黏膠殘留。 Therefore, the high adhesive force can reduce the area of the adhesive surface (the area of the strong adhesion portion) of the adherend to which the adherend is adhered, and can suppress the adhesion to the adherend of the entire surface protective film 10 The rise can also suppress the adhesive residue.

使用表面保護膜10時,可將環狀區域16黏接至被貼附體,也可以將中央部分17黏接至被貼附體,不黏接至被貼附體也可以。不過,對應中央部分17的被貼附體的部位為保護對象,也就是光學零件或電子零件的中心位置,常設置透鏡或各種精密零件等。因透鏡或各種精密零件接觸黏著劑,黏著劑會發生轉黏,容易產生不良 狀態或使性能降低。因此,若中央部分17不接觸被貼附體的話,容易在光學零件或電子零件產生不良狀態。 When using the surface protection film 10, the annular region 16 can be bonded to the adherend, or the central part 17 can be adhered to the adhered object, or not to the adhered object. However, the part of the attached body corresponding to the central part 17 is the object of protection, that is, the center position of the optical parts or electronic parts, and lenses or various precision parts are often provided. Because the lens or various precision parts contact the adhesive, the adhesive will turn to stick, which is easy to produce defects State or degrade performance. Therefore, if the central part 17 does not contact the adherend, it is easy to produce a defective state in the optical component or the electronic component.

因此,表面保護膜10例如圖2所示,中央部分17在黏著面15側的反對側突出也可以。這樣的話,若中央部17突出,可以防止對各種透鏡或精密零件的黏著劑轉黏。 Therefore, for the surface protection film 10, as shown in, for example, FIG. 2, the central portion 17 may protrude on the side opposite to the adhesive surface 15 side. In this case, if the central portion 17 protrudes, it is possible to prevent the adhesives to various lenses or precision parts from turning over.

不過,表面保護膜10也可以形成平面狀。即使形成平面狀,若中央部分17和內側部分16B一樣藉由弱黏著部所構成的話,中央部分17的黏著劑不容易轉黏至被貼附體,即使接觸透鏡或精密零件等的被貼附體,也不容易產生不良狀態。此外,將對應中央部分17的位置所設置的被貼附體的零件,設置於比後述的環狀部等的被附著面還低的位置時,即便是平面狀也可以防止表面保護膜10接觸被貼附體。 However, the surface protection film 10 may be formed in a flat shape. Even if it is formed into a flat shape, if the central part 17 and the inner part 16B are formed by a weak adhesive part, the adhesive in the central part 17 is not easy to transfer to the adherend, even if the contact lens or precision parts are adhered Body, it is not easy to produce bad conditions. In addition, when the parts of the adherend set corresponding to the position of the central portion 17 are provided at a position lower than the adhered surface such as the ring portion described later, the surface protective film 10 can be prevented from contacting even if it is flat. Attached body.

表面保護膜10為了能夠做為小型化的電子零件及光學零件的保護薄膜使用,使用小尺寸較佳。具體而言,表面保護膜10的薄膜面積,較佳為20cm2以下。另一方面,雖不特別限定薄膜面積的下限,但從其實用性、加工性的觀點來看,較佳為0.05cm2以上。此外,薄膜面積,更佳為0.1~10cm2,10~80mm2又更佳。 In order for the surface protective film 10 to be used as a protective film for miniaturized electronic parts and optical parts, it is better to use a small size. Specifically, the film area of the surface protection film 10 is preferably 20 cm 2 or less. On the other hand, although the lower limit of the film area is not particularly limited, it is preferably 0.05 cm 2 or more from the viewpoint of practicality and processability. In addition, the area of the film is more preferably 0.1 to 10 cm 2 , and even more preferably 10 to 80 mm 2.

此外,薄膜面積意味著基材11的面積,但當表面保護膜10的一部分如圖2所示具有凹凸時,則為平面視時所觀察到的基材11的面積。 In addition, the film area means the area of the base material 11, but when a part of the surface protection film 10 has irregularities as shown in FIG. 2, it is the area of the base material 11 viewed in a plan view.

雖不特別限定表面保護膜10的形狀,但平面視時可 以是圓形、楕圓形、正方形、矩形等的四角形、四角形以外的多角形等。 Although the shape of the surface protection film 10 is not particularly limited, it can be viewed in a plan view. Therefore, it is a quadrangle such as a circle, an ellipse circle, a square, a rectangle, and a polygon other than a quadrangle.

(表面保護膜的製造方法) (Method of manufacturing surface protective film)

雖不特別限定本實施形態的表面保護膜10的製造方法,但例如可以由以下的方法製造。 Although the manufacturing method of the surface protection film 10 of this embodiment is not specifically limited, it can manufacture by the following method, for example.

首先,在基材11上形成黏著劑層12。具體來說,視其必要可以將經適當的溶劑稀釋過的能量線硬化型黏著劑,以預定的乾燥膜厚塗佈於剝離片上,之後將其乾燥並形成黏著劑層後,貼合該黏著劑層於基材。此外,視其必要可以將經適當的溶劑稀釋過的能量線硬化型黏著劑,直接塗佈於基材,之後將其乾燥並形成黏著劑層。 First, the adhesive layer 12 is formed on the substrate 11. Specifically, if necessary, an energy-ray curable adhesive diluted with a suitable solvent can be coated on the release sheet with a predetermined dry film thickness, and then dried to form an adhesive layer, and then the adhesive is attached The agent layer is on the substrate. In addition, if necessary, the energy-ray curable adhesive diluted with an appropriate solvent can be directly applied to the substrate, and then dried to form an adhesive layer.

之後,在黏著劑層12形成弱黏著部。雖不特別限定弱黏著部的形成,但例如可隔著在弱黏著部具有一致形狀的開口部之遮罩,或在強黏著部具有一致形狀的遮光部之遮光部材,從習知的照射裝置照射能量線至黏著劑層12。能量線可以從基材11側隔著基材11,照射黏著劑層12,也可以從基材11的反對側照射。從基材11的反對側照射,且,黏著劑層12由剝離片所保護時,能量線隔著剝離片照射黏著劑層。 After that, a weak adhesive portion is formed in the adhesive layer 12. Although the formation of the weak adhesion part is not particularly limited, for example, a mask with a uniformly shaped opening in the weak adhesion part or a shading member with a uniformly shaped shading part in the strong adhesion part can be used from a conventional irradiation device Irradiate energy rays to the adhesive layer 12. The energy ray may irradiate the adhesive layer 12 from the side of the substrate 11 with the substrate 11 interposed therebetween, or may be irradiated from the side opposite to the substrate 11. When irradiating from the opposite side of the base material 11 and the adhesive layer 12 is protected by a release sheet, the energy ray irradiates the adhesive layer through the release sheet.

此外,作成部分塗佈黏著劑的表面保護膜,可以藉由絲網印刷或噴墨印刷,在形成強黏著部的同時形成非黏著部。 In addition, a surface protective film partially coated with an adhesive can be formed by screen printing or inkjet printing to form a non-adhesive part while forming a strong adhesive part.

此外,在弱黏著部的形成前或形成後,可以進行沖 孔。沖孔例如是可以對在剝離片上所設置的基材11及黏著劑層12的層積體進行,藉由該沖孔,使表面保護膜10的形狀成為上述的圓形等。此外,在任意的時機藉由型壓等,也可以在表面保護膜10形成適宜的凹凸。 In addition, before or after the formation of the weak adhesion part, punching can be carried out. hole. Punching can be performed, for example, on a laminate of the base material 11 and the adhesive layer 12 provided on the release sheet, and the shape of the surface protection film 10 can be made the above-mentioned circular shape by the punching. In addition, it is also possible to form suitable irregularities on the surface protective film 10 by molding press or the like at any timing.

(光學零件或電子零件) (Optical parts or electronic parts)

做為藉由表面保護膜10所保護的光學零件或電子零件,可以是:收納1個或2個以上的透鏡與CCD、CMOS等攝像感測器於框體或封裝內部的攝像模組(例如,攝影機模組);將複數的透鏡支持於透鏡鏡筒等透鏡支持零件的透鏡單元;具有LED等發光元件的發光元件單元;振動器等的馬達單元;通信模組、感測器模組等。 As an optical component or electronic component protected by the surface protective film 10, it can be: a camera module (such as a camera module (e.g., , Camera module); lens unit that supports multiple lenses on lens support parts such as lens barrels; light-emitting element units with light-emitting elements such as LEDs; motor units such as vibrators; communication modules, sensor modules, etc. .

此外,所謂的光學零件指是具備受光、發光、或傳遞光功能的光學元件,做為光學零件的具體例有上述的攝像模組、透鏡單元、發光元件單元、傳送或接收光訊號的通信模組、光感測器模組等。此外,所謂的電子零件通常所指的是構成電路的至少一部,進行電訊號的傳送或接收之電子元件、處理電訊號的電子元件、由電訊號或電力作動的電子元件等;做為電子零件的具體例有上述的攝像模組、發光元件單元、振動器等的馬達單元、傳送或接收光訊號的通信模組、各種感測器模組等。此外,進行光訊號的傳送或接收的通信模組及光感測器模組、攝像模組及發光元件單元等,通常,屬於電子零件也屬於光學零件。 In addition, the so-called optical components refer to optical components that have the function of receiving light, emitting light, or transmitting light. Specific examples of optical components include the above-mentioned camera module, lens unit, light-emitting element unit, and communication module that transmits or receives optical signals. Group, light sensor module, etc. In addition, the so-called electronic components usually refer to at least one part of a circuit, electronic components that transmit or receive electrical signals, electronic components that process electrical signals, electronic components that are actuated by electrical signals or electricity, etc.; as electronics Specific examples of parts include the aforementioned camera modules, light-emitting element units, motor units such as vibrators, communication modules that transmit or receive optical signals, and various sensor modules. In addition, communication modules, light sensor modules, camera modules, and light-emitting element units that transmit or receive optical signals generally belong to electronic parts as well as optical parts.

此外,光學零件或電子零件,較佳為例如將上述電子元件或光學元件收納於封包或框體內部,或為由支撐零件所支撐。此外,電子元件或光學元件的一部分露出表面較佳,表面保護膜例如為了保護該露出的零件而使用。 In addition, the optical component or the electronic component is preferably, for example, the above-mentioned electronic component or optical component is contained in a package or a frame, or is supported by a supporting component. In addition, it is preferable that a part of an electronic element or an optical element is exposed on the surface, and a surface protection film is used, for example, to protect the exposed parts.

具體來說,表面保護膜10所貼附的光學零件或電子零件(也稱為“附表面保護膜的零件”)在進行被加工、安裝於其他零件上、檢查、或搬送等等工程時,表面保護膜10在該等工程中保護由光學零件或電子零件所構成的被貼附體的表面。此外,當表面保護膜10在該等被貼附體不需要被保護時,可從被貼附體上剝離去除。 Specifically, the optical parts or electronic parts (also referred to as "parts with surface protection film") attached to the surface protection film 10 are processed, installed on other parts, inspected, or transported. The surface protection film 10 protects the surface of the adherend composed of optical parts or electronic parts in these processes. In addition, when the surface protection film 10 does not need to be protected on the attached bodies, it can be peeled and removed from the attached bodies.

以下,說明本實施形態的表面保護膜10貼附於如圖2所示的光學零件20使用的表面保護膜10的使用方法之一例。 Hereinafter, an example of the usage method of the surface protection film 10 used for attaching the surface protection film 10 of this embodiment to the optical component 20 shown in FIG. 2 is demonstrated.

在此,光學零件20為透鏡單元或攝像模組等,至少具備構成受光部的透鏡21、及支持透鏡21的透鏡支持零件22。透鏡支持零件22具有圍繞透鏡設置的環狀部23。雖不特別限定透鏡支持零件22及環狀部23的材質,但為了滿足近年來機器的小型化、輕量化的要求,使用輕量且高強度的材料較佳。再來,為達到光學零件具有隱蔽性、光吸收性、光反射性等各種性能要求,在透鏡支持零件22的表面,例如環狀部23的前面,也可以設置塗層或覆蓋膜等。 Here, the optical component 20 is a lens unit, a camera module, or the like, and includes at least a lens 21 that constitutes a light-receiving unit and a lens support component 22 that supports the lens 21. The lens supporting part 22 has an annular portion 23 provided around the lens. Although the materials of the lens support part 22 and the ring portion 23 are not particularly limited, in order to meet the recent requirements for the miniaturization and weight reduction of equipment, it is preferable to use a lightweight and high-strength material. Furthermore, in order to achieve various performance requirements such as concealment, light absorption, and light reflectivity of the optical component, a coating or covering film may also be provided on the surface of the lens supporting component 22, such as the front surface of the ring portion 23.

環狀部23在圖2中為圓環狀,但不限定為圓環狀,也可以是楕圓環狀、方形、矩形等的四角形、四角形以外 的多角形、或其他的環狀之形狀。此外,環狀部23為具有一定高度的零件,該外圍部23A及內周部23B各自構成透鏡支持零件22的外圍面及內周面。 The ring portion 23 is annular in FIG. 2, but it is not limited to an annular shape, and it may also be a quadrangular shape such as an elliptical ring, a square, a rectangle, etc., or other than a quadrangular shape. The polygonal shape, or other circular shapes. In addition, the annular portion 23 is a component having a certain height, and the outer peripheral portion 23A and the inner peripheral portion 23B each constitute the outer peripheral surface and the inner peripheral surface of the lens supporting component 22.

表面保護膜10中的環狀區域16以黏接環狀部23的前面23F的方式,貼附於光學零件20。經這種被貼附的表面保護膜10,保護配置於環狀部23、及環狀部23的內側的透鏡21。 The ring-shaped area 16 in the surface protection film 10 is attached to the optical component 20 by bonding the front surface 23F of the ring-shaped portion 23. The surface protection film 10 pasted in this manner protects the ring portion 23 and the lens 21 arranged inside the ring portion 23.

此外,設置於環狀部23的前面23F的表面覆蓋膜24,雖然通常覆蓋膜強度比較低且脆弱,但黏接環狀部23的環狀區域16具有強黏著部及弱黏著部,因高黏著力而使黏接被貼附體的面積變小。因此,即使設置脆弱的表面覆蓋膜24,也可防止剝離表面保護膜10時的剝落等。 In addition, the surface covering film 24 provided on the front face 23F of the annular portion 23, although the covering film is generally low in strength and fragile, the annular area 16 where the annular portion 23 is bonded has a strong adhesion portion and a weak adhesion portion, which is high Adhesive force reduces the area where the adherend is adhered. Therefore, even if the fragile surface cover film 24 is provided, peeling or the like when the surface protection film 10 is peeled off can be prevented.

表面保護膜10較佳為具有對應所貼附之被貼附體的形狀。也就是說,表面保護膜10所貼附的被貼附體,若如圖2所示,具有圓環狀的環狀部23的話,表面保護膜也呈圓形較佳。此外,若環狀部23為四角形的環狀的話,表面保護膜10也呈四角形較佳。 The surface protection film 10 preferably has a shape corresponding to the attached body to be attached. In other words, if the adherend to which the surface protective film 10 is adhered has an annular ring portion 23 as shown in FIG. 2, the surface protective film is also preferably circular. In addition, if the ring portion 23 has a quadrangular ring shape, the surface protection film 10 preferably has a quadrangular shape.

所以,因為表面保護膜10具有對應被貼附體的形狀,光學零件20藉由表面保護膜10可以更有效率地受到保護。 Therefore, because the surface protective film 10 has a shape corresponding to the attached body, the optical component 20 can be protected more efficiently by the surface protective film 10.

此外,表面保護膜10為了可以使被附著面之環狀部23的前面23F(被附著面)完全由表面保護膜10所覆蓋,表面保護膜10比環狀部23的前面23F的外圍還大一圈較佳。若使用具有這種尺寸的表面保護膜10的 話,當貼附表面保護膜10於被貼附體時,即使有多少的位置偏差,也可以藉由表面保護膜10來保護整個環狀部23的前面23F。 In addition, in order for the surface protective film 10 to make the front surface 23F (attachment surface) of the annular portion 23 of the adhered surface completely covered by the surface protective film 10, the surface protective film 10 is larger than the periphery of the front surface 23F of the annular portion 23 One lap is better. If you use a surface protective film 10 of this size In other words, when the surface protection film 10 is attached to the adherend, even if there is some positional deviation, the surface protection film 10 can protect the entire front surface 23F of the ring portion 23.

此外,表面保護膜10如圖2所示,在配置由弱黏著部所構成的外側部分16A於環狀部23的外圍部23A上的同時,將由弱黏著部所構成的內側部分16B以配置於環狀部23的內周部16B上的方式,貼附於光學零件20較佳。 In addition, as shown in FIG. 2, the surface protection film 10 has an outer portion 16A composed of a weak adhesive portion on the outer peripheral portion 23A of the ring portion 23, and an inner portion 16B composed of a weak adhesive portion is placed on The method of attaching to the inner peripheral portion 16B of the ring portion 23 is preferably attached to the optical component 20.

表面保護膜10從光學零件20剝離時,雖然黏著劑層12可能會接扯環狀部23的外圍部23A或內周部23B,但因為外側部分16A及內側部分16B是藉由能量線所硬化的弱黏著部所構成,就算黏著劑層12拉扯也難以產生黏膠殘留。另一方面,因為由強黏著部所構成的中間部分16C黏接環狀部23的前面23F,可以提升對表面保護膜10的環狀部23的黏接性。 When the surface protection film 10 is peeled off from the optical component 20, although the adhesive layer 12 may touch the outer peripheral portion 23A or the inner peripheral portion 23B of the ring portion 23, the outer portion 16A and the inner portion 16B are hardened by energy rays It is formed by the weakly adhesive part of, even if the adhesive layer 12 is pulled, it is difficult to produce adhesive residue. On the other hand, since the middle portion 16C composed of the strong adhesive portion adheres to the front surface 23F of the ring portion 23, the adhesiveness to the ring portion 23 of the surface protection film 10 can be improved.

此外,圖2雖例示表面保護膜10所貼附的被貼附體為具有透鏡21的光學零件20,但其他形態的光學零件也可以,電子零件也可以。不過,如同上述,被貼附體具備以圍繞透鏡等保護對象之零件設置的環狀部較佳。若是這種構成的話,可以適切地保護環狀部及保護對象之零件。 In addition, although FIG. 2 illustrates that the adherend to which the surface protective film 10 is adhered is an optical component 20 having a lens 21, other forms of optical components and electronic components may also be used. However, as described above, it is preferable that the body to be adhered has an annular portion provided to surround a part to be protected such as a lens. With this structure, the ring and the parts to be protected can be appropriately protected.

根據以上所說明的第1實施形態的表面保護膜10,可防止被貼附體之光學零件或電子零件的表面產生黏膠殘留。此外,不會使被貼附體表面的覆蓋膜24剝 落,也不會產生剝離不良,可以適切地將表面保護膜10從被貼附體剝離。 According to the surface protection film 10 of the first embodiment described above, it is possible to prevent the adhesive residue from being generated on the surface of the optical component or the electronic component of the adherend. In addition, the cover film 24 on the surface of the adherend will not be peeled off The surface protection film 10 can be appropriately peeled off from the adherend without causing peeling failure.

(第2實施形態) (Second Embodiment)

圖3、4表示有關本發明的第2實施形態的表面保護膜。以下,說明有關第2實施形態的表面保護膜與第1實施形態的相異點。此外,在第2實施形態中所省略的各零件的詳細說明,與第1實施形態一樣。此外,以下所說明的各實施形態,附加相同的符號說明所對應的零件。 Figures 3 and 4 show a surface protective film according to a second embodiment of the present invention. Hereinafter, the difference between the surface protection film of the second embodiment and the first embodiment will be described. In addition, the detailed description of each component omitted in the second embodiment is the same as that of the first embodiment. In addition, in each embodiment described below, the same reference numerals are used to describe corresponding parts.

第1實施形態中,黏著面15的環狀區域16包含:由弱黏著部所構成的外側部分、由強黏著部所構成的中間部分、及由弱黏著部所構成的內側部分,但本實施形態中,環狀區域16的外側部分16X成為設置弱黏著部的弱黏著區域,且內側部分16Y成為設置強黏著部的強黏著區域,環狀區域16由這2個區域所形成。 In the first embodiment, the annular region 16 of the adhesive surface 15 includes: the outer part formed by the weak adhesive part, the middle part formed by the strong adhesive part, and the inner part formed by the weak adhesive part, but this embodiment In the form, the outer portion 16X of the ring-shaped area 16 becomes a weak adhesion area where a weak adhesion portion is provided, and the inner portion 16Y becomes a strong adhesion area where a strong adhesion portion is provided, and the ring area 16 is formed by these two areas.

再更詳細說明的話,環狀區域16的外側部分16X係構成黏著面15的外周緣15A且呈環狀的區域,因為該區域的黏著劑層12被硬化,由弱黏著部所形成。內側部分16Y為連接外側部分16X內周的區域,該區域的黏著劑層12不被硬化,由強黏著部所形成。 In more detail, the outer portion 16X of the ring-shaped area 16 constitutes the outer peripheral edge 15A of the adhesive surface 15 and is a ring-shaped area, because the adhesive layer 12 in this area is hardened and formed by a weak adhesive portion. The inner portion 16Y is an area connecting the inner circumference of the outer portion 16X, and the adhesive layer 12 in this area is not hardened and is formed by a strong adhesion portion.

本實施形態的中央部分17和內側部分16Y一樣,由強黏著部所形成。因此,黏著面15的外側部分16X以外的區域(也就是說,中央部分17及內側部分16Y),全部由強黏著部所構成。不過,中央部分17可以不由強黏 著部所構成,而可由弱黏著部所構成,也可以由混合弱黏著部與強黏著部所構成。 The central part 17 of this embodiment is formed by a strong adhesion part like the inner part 16Y. Therefore, the areas other than the outer portion 16X of the adhesive surface 15 (that is, the central portion 17 and the inner portion 16Y) are all constituted by strong adhesive portions. However, the central part 17 can not help but be strong It can be composed of a weak adhesion portion, or a mixture of a weak adhesion portion and a strong adhesion portion.

從內側部分16Y的外圍至重心的距離W3(也就是內側部分16Y的外徑),對上述距離r的比(W3/r),較佳為0.1~0.7,更佳為0.15~0.65。因為使對距離W3的比在上述上限值以下,可容易使於黏接面的弱黏著部的面積具有一定程度的大小,可容易防止發生剝離不良,或產生黏膠殘留。此外,藉由設定距離W3在上述下限值以上,弱黏著部的面積大於必要以上的面積,可防止產生黏接不足。 The ratio of the distance W3 from the periphery of the inner portion 16Y to the center of gravity (that is, the outer diameter of the inner portion 16Y) to the aforementioned distance r (W3/r) is preferably 0.1 to 0.7, more preferably 0.15 to 0.65. Since the ratio to the distance W3 is less than the above upper limit, it is easy to make the area of the weakly-adhesive part on the adhesion surface a certain size, and it is easy to prevent the occurrence of peeling failure or the occurrence of adhesive residue. In addition, by setting the distance W3 to be more than the above lower limit, the area of the weakly-adhesive portion is larger than necessary, and insufficient adhesion can be prevented.

有關本實施形態的表面保護膜10,與第1實施形態一樣,例如,環狀區域16係黏接環狀部23並貼附於光學零件20,但如圖4所示,在配置由弱黏著部所構成的外側部分16X於環狀部23的外圍部23A上的同時,將環狀區域16以配置於由強黏著部所構成的內側部分16Y於環狀部23的內周部23B上的方式,貼附於環狀部23較佳。本實施形態以這種方式,藉由使配置在外圍部23A上的外側部分16X由弱黏著部所形成,可以更有效地防止因黏著劑層12拉扯外圍部23A而產生的黏膠殘留。 Regarding the surface protection film 10 of this embodiment, as in the first embodiment, for example, the ring-shaped area 16 is bonded to the ring-shaped portion 23 and attached to the optical component 20. However, as shown in FIG. While the outer portion 16X formed by the portion is placed on the outer peripheral portion 23A of the ring portion 23, the ring-shaped area 16 is arranged on the inner portion 16Y formed by the strong adhesion portion on the inner peripheral portion 23B of the ring portion 23 In this way, it is better to stick to the ring portion 23. In this way, in the present embodiment, by forming the outer portion 16X disposed on the peripheral portion 23A with a weak adhesive portion, it is possible to more effectively prevent the adhesive residue caused by the adhesive layer 12 pulling the peripheral portion 23A.

(第3實施形態) (Third Embodiment)

接著,說明有關第3實施形態的表面保護膜與第2實施形態的相異點。此外,在本實施形態中所省略的各零件的詳細說明,與第2實施形態一樣。 Next, the difference between the surface protection film of the third embodiment and the second embodiment will be described. In addition, the detailed description of each part omitted in this embodiment is the same as in the second embodiment.

第2實施形態中,環狀區域16的外側部分16X成為由弱黏著部所構成的弱黏著區域,且內側部分16Y成為由強黏著部所構成的強黏著區域,但本實施形態中,外側部分16X成為由強黏著部所構成強黏著區域,且內側部分16Y成為設置弱黏著部的弱黏著區域。 In the second embodiment, the outer portion 16X of the ring-shaped area 16 becomes a weak adhesion area constituted by a weak adhesion portion, and the inner portion 16Y becomes a strong adhesion area constituted by a strong adhesion portion, but in this embodiment, the outer portion 16X becomes a strong adhesion area constituted by a strong adhesion part, and the inner part 16Y becomes a weak adhesion area where a weak adhesion part is provided.

這樣的話,本實施形態中,成為強黏著區域及弱黏著區域的部分與第2實施形態相反,但本實施形態中表面保護膜10的環狀區域16也同時具有弱黏著部及強黏著部。環狀區域16通常如同上述,為黏接被貼附體的黏接面。因此,即便使用本實施形態的表面保護膜10時,在可抑制被貼附體的黏膠殘留的同時,剝離性能也可以提升。 In this case, in this embodiment, the portions that become the strong adhesion area and the weak adhesion area are opposite to the second embodiment, but the annular area 16 of the surface protection film 10 in this embodiment also has both weak adhesion portions and strong adhesion portions. The ring-shaped area 16 is generally the same as described above, and is the bonding surface for bonding the adherend. Therefore, even when the surface protective film 10 of this embodiment is used, the peeling performance can be improved while the adhesive residue of the adherend can be suppressed.

因此,在本實施形態的環狀區域16中,在配置由強黏著部所構成的外側部分16X於環狀部23的外圍部23A上的同時,將由弱黏著部所構成的內側部分16Y以配置於環狀部23的內周部23B上的方式,貼附於環狀部23較佳。本實施形態以這種方式,藉由使配置在內周部23B上的內側部分16Y由弱黏著部所形成,可以更有效地防止因黏著劑層12拉扯內周部23B所產生的黏膠殘留。也就是說,如同以上第1~第3的實施形態,藉由使環狀區域16的內側部分或外側部分之至少一部分為弱黏著區域,可有效防止對環狀部的黏膠殘留。 Therefore, in the annular region 16 of this embodiment, the outer portion 16X composed of the strong adhesion portion is arranged on the peripheral portion 23A of the annular portion 23, and the inner portion 16Y composed of the weak adhesion portion is arranged as The method of attaching to the inner peripheral portion 23B of the ring portion 23 is preferably attached to the ring portion 23. In this way, in this embodiment, by making the inner portion 16Y disposed on the inner peripheral portion 23B formed of a weak adhesive portion, it is possible to more effectively prevent the adhesive residue caused by the adhesive layer 12 pulling the inner peripheral portion 23B. . That is, as in the first to third embodiments above, by making at least a part of the inner part or the outer part of the annular region 16 a weak adhesion region, it is possible to effectively prevent the adhesive residue on the annular part.

(第4實施形態) (Fourth Embodiment)

接著,利用圖5~10說明有關本發明的第4實施形態。此外,在第4實施形態中所省略的各零件的詳細說明,與第1~第3實施形態一樣。此外,圖5~10中塗黑的部分,表示經能量線照射而硬化的部分(也就是弱黏著部)。 Next, the fourth embodiment of the present invention will be described with reference to Figs. 5-10. In addition, the detailed description of each component omitted in the fourth embodiment is the same as in the first to third embodiments. In addition, the blacked-out parts in Figs. 5 to 10 indicate the parts hardened by the irradiation of energy rays (that is, the weakly adhered parts).

以上的第1~第3實施形態中,一定範圍的區域(例如,環狀區域16的外側部分16A等)的全體被硬化而形成弱黏著部,但本實施形態中,藉由微細的圖案形狀設置弱黏著部。 In the above first to third embodiments, the entire area of a certain range (for example, the outer portion 16A of the ring-shaped area 16, etc.) is hardened to form a weak adhesion portion, but in this embodiment, the fine pattern shape Set up a weak adhesion part.

具體來說,如圖5、6所示,黏著面15,具備:複數線狀強黏著部、複數線狀弱黏著部,交互設置該強黏著部及弱黏著部配置成條紋狀的圖案。 Specifically, as shown in FIGS. 5 and 6, the adhesive surface 15 includes a plurality of linear strong adhesive portions and a plurality of linear weak adhesive portions, and the strong adhesive portions and the weak adhesive portions are alternately arranged in a striped pattern.

條紋狀的圖案,在第4實施形態中,橫跨黏著面15的全體(也就是中央部分17及環狀區域16的兩者)配置,接著,環狀區域16也和上述各實施形態一樣,設置弱黏著部及強黏著部。環狀區域16通常如同上述,黏接被貼附體,而成為黏接面的區域。因此,本實施形態也可在防止黏膠殘留的同時,不產生被貼附體表面的覆蓋膜剝落、及剝離不良,可以適切地將表面保護膜從被貼附體剝離。 In the fourth embodiment, the striped pattern is arranged across the entire adhesive surface 15 (that is, both the central portion 17 and the ring-shaped area 16). Next, the ring-shaped area 16 is also the same as in the above-mentioned embodiments. Set weak adhesion part and strong adhesion part. The ring-shaped area 16 is usually the same as the above-mentioned, the adhered body is adhered, and becomes the area of the adhesion surface. Therefore, the present embodiment can also prevent adhesive residues, without causing peeling of the cover film on the surface of the adherend, and peeling defects, and can appropriately peel the surface protection film from the adherend.

此外,第4實施形態中的黏著面15,可以不需要將弱黏著部與強黏著部設置成條紋狀的圖案,也可配置成其他的圖案。例如,如圖7所示,也可以將黏著劑層中藉由能量線所硬化的弱黏著部配置成格子狀,並將該格 子之間的部分配置成強黏著部的格子形狀圖案。此外,格子形狀圖案在將強黏著部配置成格子狀的同時,也可以在該格子之間的部分形成弱黏著部。 In addition, the adhesive surface 15 in the fourth embodiment does not need to provide the weak adhesive portion and the strong adhesive portion in a striped pattern, and may be arranged in another pattern. For example, as shown in Figure 7, it is also possible to arrange the weakly adhesive parts hardened by energy rays in the adhesive layer into a grid, and to place the grid The part between the pins is arranged in a grid pattern of strong adhesion parts. In addition, in the lattice-shaped pattern, the strong adhesion portion may be arranged in a lattice shape, and the weak adhesion portion may be formed in the portion between the lattices.

此外,如圖8所示,也可將點狀的複數弱黏著部分散在黏著面15(中央部分17及環狀區域16)上,並在其他部分配置由強黏著部所構成的點狀圖案。不過,也可以使點狀圖案中的複數的點成為強黏著部,將其他的部分構成弱黏著部。此外,圖8中,點的形狀以圓形表示,但不特別限定為圓形,也可以是楕圓形、三角形、四角形、五角形等的各種多角形,再來其他的形狀也可以。 In addition, as shown in FIG. 8, it is also possible to disperse a plurality of dot-shaped weakly-adhesive parts on the adhesive surface 15 (the central part 17 and the annular area 16), and arrange a dot-shaped pattern composed of strong-adhesive parts in other parts. However, a plurality of dots in the dot pattern may be a strong adhesive part, and the other parts may be a weak adhesive part. In addition, in FIG. 8, the shape of the dot is shown as a circle, but it is not particularly limited to a circle, and various polygons such as an ellipse circle, a triangle, a square, a pentagon, etc. may be used, and other shapes may be used.

再來,強黏著部及弱黏著部也可以構成由複數波線並排排列而成的形狀的圖案。也就是說,如圖9所示,也可以並排排列複數由弱黏著部形成的波線,且使該之間的部分成為強黏著部,將強黏著部及弱黏著部配置於黏著面15上。或者,也可以並排排列複數由強黏著部形成的波線,且使該之間的部分成為弱黏著部,將強黏著部及弱黏著部配置於黏著面15上。此外,圖9中雖例示了波線為矩形波線之例,但不限定為矩形波,三角波,正弦曲線狀的波形等也可以。 Furthermore, the strong adhesion portion and the weak adhesion portion may also form a pattern of a shape formed by arranging a plurality of wave lines side by side. That is, as shown in FIG. 9, it is also possible to arrange a plurality of wave lines formed by weak adhesion parts side by side, and make the part between them become strong adhesion parts, and arrange the strong adhesion parts and the weak adhesion parts on the adhesion surface 15. Alternatively, a plurality of wave lines formed by strong adhesion portions may be arranged side by side, and the portions between the waves may be weak adhesion portions, and the strong adhesion portions and the weak adhesion portions may be arranged on the adhesion surface 15. In addition, although the example in which the wave line is a rectangular wave line is illustrated in FIG. 9, it is not limited to a rectangular wave, a triangular wave, a sinusoidal waveform, etc. may be sufficient.

再來,如圖10所示的,也可以將強黏著部及弱黏著部配置成格子花紋狀的圖案。 Furthermore, as shown in FIG. 10, the strong adhesion part and the weak adhesion part may be arrange|positioned in a checkered pattern.

再來,也可以並列複數花樣等各種幾何花紋的形狀。在這種情形時,由強黏著部構成各種花紋的同時,也可以由弱黏著部構成該其他部分,在由弱黏著部構成各種花紋的同時,也可以由強黏著部構成該其他部分。 Furthermore, various geometric patterns such as plural patterns can also be arranged in parallel. In this case, while various patterns are formed by the strong adhesive part, the other part may be formed by the weak adhesive part, and the other part may be formed by the strong adhesive part while the various patterns are formed by the weak adhesive part.

但是,黏著面15如圖5、圖7~10所示,具有交互設置強黏著部及弱黏著部的圖案形狀較佳。若交互設置強黏著部及弱黏著部的話,因為弱黏著部會被強黏著部所夾住,故不容易產生因弱黏著部所引起的黏接不良。此外,因為強黏著部被弱黏著部所夾住,故不容易產生因強黏著部所引起的剝離不良及剝離時所引起的表面覆蓋膜剝落。 However, as shown in FIGS. 5 and 7 to 10, the adhesive surface 15 preferably has a pattern shape with a strong adhesive portion and a weak adhesive portion alternately arranged. If the strong adhesion part and the weak adhesion part are alternately arranged, the weak adhesion part will be clamped by the strong adhesion part, so it is not easy to cause poor adhesion caused by the weak adhesion part. In addition, because the strong adhesive part is sandwiched by the weak adhesive part, it is not easy to cause peeling failure caused by the strong adhesive part and peeling of the surface coating film during peeling.

此外,第4實施形態中,形成強黏著部及弱黏著部所構成的圖案,和上述的第1實施形態的弱黏著部的形成方法一樣。也就是說,例如,在強黏著部隔著遮光部材(該遮光部材具有一致形狀的圖案所構成的遮光部),可從習知的照射裝置照射能量線至黏著劑層12來形成。 In addition, in the fourth embodiment, the pattern of the strong adhesion portion and the weak adhesion portion is formed in the same manner as the method of forming the weak adhesion portion in the first embodiment described above. That is, for example, the strong adhesion part can be formed by irradiating the adhesive layer 12 with energy rays from a conventional irradiation device through a light-shielding member (the light-shielding member has a light-shielding portion composed of a pattern having a uniform shape).

此外,作成部分塗佈黏著劑的表面保護膜,可以藉由絲網印刷或噴墨印刷,在形成強黏著部的同時形成非黏著部。藉由形成強黏著部與弱黏著部所構成的圖案,可以更佳抑制表面覆蓋膜剝落。 In addition, a surface protective film partially coated with an adhesive can be formed by screen printing or inkjet printing to form a non-adhesive part while forming a strong adhesive part. By forming a pattern composed of a strong adhesion portion and a weak adhesion portion, peeling of the surface covering film can be better suppressed.

(第5實施形態) (Fifth Embodiment)

以上的第4實施形態中,由強黏著部及弱黏著部所構成的圖案,橫跨黏著面15的全面(也就是中央部分17及環狀區域16的兩者)設置,但不需要設置於黏著面15的全面,設置於黏著面15的一部分也可以。 In the above fourth embodiment, the pattern composed of the strong adhesion portion and the weak adhesion portion is provided across the entire surface of the adhesive surface 15 (that is, both the central portion 17 and the annular area 16), but it does not need to be provided on The entire surface of the adhesive surface 15 may be provided on a part of the adhesive surface 15.

此外,利用圖11說明該一實施形態的第5實施形 態。 In addition, the fifth embodiment of this embodiment will be explained using FIG. 11 state.

第5實施形態如圖11所示,將由強黏著部及弱黏著部所構成的圖案,設置於環狀區域16的外側部分16A及內側部分16B。另一方面,該等外側部分16A及內側部分16B之間的中間部分16C,不藉由能量線硬化黏著劑層12而成為強黏著部。也就是說,因為外側部分16A及內側部分16B為混合強黏著部及弱黏著部的區域,故成為做為區域的黏著力比由強黏著部所形成的中間部分16C(強黏著區域)還要低的弱黏著區域。 In the fifth embodiment, as shown in FIG. 11, a pattern composed of a strong adhesion portion and a weak adhesion portion is provided in the outer portion 16A and the inner portion 16B of the annular region 16. On the other hand, the middle part 16C between the outer part 16A and the inner part 16B does not harden the adhesive layer 12 by energy rays and becomes a strong adhesive part. In other words, because the outer portion 16A and the inner portion 16B are areas where the strong adhesion portion and the weak adhesion portion are mixed, the adhesive force of the area becomes higher than that of the middle portion 16C (strong adhesion area) formed by the strong adhesion portion. Low weak adhesion area.

本實施形態中,環狀區域16與第1實施形態一樣,從外側依序設置:由呈環狀的弱黏著區域所形成的外側部分16A、由呈環狀的強黏著區域所形成的中間部分16C、由設置在中間部分16C的內側的弱黏著區域所形成的內側部分16B。 In this embodiment, the ring-shaped area 16 is the same as the first embodiment, and is arranged in order from the outside: the outer portion 16A formed by the ring-shaped weak adhesion area, and the middle portion formed by the ring-shaped strong adhesion area 16C. An inner portion 16B formed by a weak adhesion area provided on the inner side of the middle portion 16C.

因此,有關本實施形態的表面保護膜10也和第1實施形態一樣,在防止黏膠殘留的同時,不產生被貼附體表面的覆蓋膜剝落、及剝離不良,可以適切地將表面保護膜從被貼附體剝離。 Therefore, the surface protection film 10 of this embodiment is the same as the first embodiment. It prevents the adhesive residue from peeling off the coating film on the surface of the adherend and does not cause peeling defects. The surface protection film can be appropriately removed. Peel off from the attached body.

再來,本實施形態也和第1實施形態一樣,在貼附表面保護膜10於具有環狀部23(參照圖2)的被貼附體時,將外側部分16A配置於環狀部23的外圍部23A上的同時,因為配置內側部分16B在環狀部23的內周部23B上,和第1實施形態一樣,更可以有效地防止內周部23B及外圍部23B所產生的黏膠殘留。 Furthermore, in this embodiment, as in the first embodiment, when the surface protective film 10 is attached to the adherend having the annular portion 23 (see FIG. 2), the outer portion 16A is arranged on the outer portion of the annular portion 23. At the same time as the outer part 23A, because the inner part 16B is arranged on the inner peripheral part 23B of the annular part 23, like the first embodiment, it can effectively prevent the adhesive residue generated in the inner peripheral part 23B and the outer peripheral part 23B. .

此外,本實施形態中,中央部分17雖設置由強黏著部及弱黏著部所構成的圖案,但不一定要設置圖案,只設置強黏著部或弱黏著部的其中之一也可以。不過,藉由中央部分17與內側部分16B一同由圖案所構成,成為弱黏著區域,因此與第1實施形態一樣,可輕易防止對應中央部分17的位置所設的透鏡或精密零件之黏著劑的轉黏。 In addition, in this embodiment, although the central portion 17 is provided with a pattern composed of a strong adhesion portion and a weak adhesion portion, the pattern is not necessarily provided, and only one of the strong adhesion portion or the weak adhesion portion may be provided. However, since the central part 17 and the inner part 16B are composed of a pattern together, it becomes a weak adhesion area. Therefore, as in the first embodiment, it is possible to easily prevent the adhesion of the lens or precision parts corresponding to the position of the central part 17 Turn sticky.

此外,當設置由強黏著部或弱黏著部所構成的圖案於黏著面15的一部分時,該態樣並不限定於上述的第5實施形態,也可以是以下所說明的第6及第7的實施形態的態樣。 In addition, when a pattern composed of a strong adhesion portion or a weak adhesion portion is provided on a part of the adhesive surface 15, the aspect is not limited to the fifth embodiment described above, and may be the sixth and seventh described below. The state of the implementation form.

(第6實施形態) (Sixth Embodiment)

第6實施形態如圖12所示,將由強黏著部及弱黏著部所構成的圖案,設置於環狀區域16的外側部分16X。另一方面,於環狀區域16的內側部分16Y,不藉由能量線硬化黏著劑層12而由強黏著部所構成。也就是說,本實施形態中,環狀區域16與第2實施形態一樣,從外側部分依序設置:由呈環狀的弱黏著區域所形成的外側部分16X、由設置在外側部分的內側的強黏著區域所形成的內側部分16Y。 In the sixth embodiment, as shown in FIG. 12, a pattern composed of a strong adhesion portion and a weak adhesion portion is provided in the outer portion 16X of the annular region 16. On the other hand, the inner portion 16Y of the annular region 16 is not hardened by the energy ray of the adhesive layer 12 but is formed of a strong adhesive portion. That is to say, in this embodiment, the ring-shaped area 16 is arranged in order from the outer part as in the second embodiment: the outer part 16X formed by the ring-shaped weak adhesion area, and the outer part 16X formed by the inner part of the outer part. The inner part 16Y formed by the strong adhesion area.

因此,有關本實施形態的表面保護膜10也和第2實施形態一樣,在防止黏膠殘留的同時,不產生被貼附體表面的覆蓋膜剝落及剝離不良,可以適切地將表面保護膜從被貼附體剝離。 Therefore, the surface protection film 10 of this embodiment is the same as in the second embodiment. It prevents the adhesive residue and does not cause peeling and peeling defects of the coating film on the surface of the adherend. The surface protection film can be appropriately removed from The attached body is peeled off.

再來,本實施形態也和第2實施形態一樣,在貼附表面保護膜10於具有環狀部23的被貼附體時,因為將外側部分16X(弱黏著區域)配置於環狀部23的外圍部23A上,可以更有效地防止外周部23A所產生的黏膠殘留(參照圖4)。 Furthermore, this embodiment is also the same as the second embodiment. When the surface protective film 10 is attached to the adherend having the annular portion 23, the outer portion 16X (weak adhesion region) is arranged on the annular portion 23. On the outer peripheral portion 23A, the adhesive residue generated in the outer peripheral portion 23A can be more effectively prevented (refer to FIG. 4).

此外,本實施形態中,中央部分17雖由強黏著部所構成,但也不一定要由強黏著部所構成,由弱黏著部構成也可以,也可以設置由強黏著部與弱黏著部混合而構成的圖案。 In addition, in this embodiment, although the central portion 17 is composed of a strong adhesive part, it does not have to be composed of a strong adhesive part. It may be composed of a weak adhesive part, or a mixture of a strong adhesive part and a weak adhesive part may be provided. And constitute the pattern.

(第7實施形態) (Seventh embodiment)

第7實施形態如圖13所示,將由強黏著部及弱黏著部所構成的圖案,設置於環狀區域16中的內側部分16Y。另一方面,於環狀區域16的外側部分16X,不藉由能量線硬化黏著劑層12而由強黏著部所構成。也就是說,本實施形態中,環狀區域16與第3實施形態一樣,從外側部分依序設置:由呈環狀的強黏著區域所形成的外側部分16X、由設置在外側部分16X的內側的弱黏著區域所形成的內側區域16Y。 In the seventh embodiment, as shown in FIG. 13, a pattern composed of a strong adhesion portion and a weak adhesion portion is provided in the inner portion 16Y of the ring-shaped area 16. On the other hand, the outer portion 16X of the annular region 16 is not hardened by the energy ray to harden the adhesive layer 12 but is constituted by a strong adhesive portion. That is to say, in this embodiment, the ring-shaped area 16 is arranged in order from the outer part as in the third embodiment: the outer part 16X formed by the ring-shaped strong adhesion area, and the outer part 16X is formed on the inner side of the outer part 16X The inner area 16Y formed by the weak adhesion area.

因此,有關本實施形態的表面保護膜10,因為也在環狀區域16設置強黏著部及弱黏著部,在防止黏膠殘留的同時,不產生被貼附體表面的覆蓋膜剝落及剝離不良,可以適切地將表面保護膜10從被貼附體剝離。 Therefore, regarding the surface protection film 10 of the present embodiment, since the strong adhesion portion and the weak adhesion portion are also provided in the ring-shaped area 16, while preventing the adhesive residue, the coating film on the surface of the adherend does not peel off and the peeling failure will not occur. , The surface protective film 10 can be peeled off appropriately from the adherend.

再來,本實施形態也和第3實施形態一樣,在貼附表 面保護膜10於具有環狀部23的被貼附體時,因為將內側部分16Y(弱黏著區域)配置於環狀部23的內周部23B上,可以有效防止內周部23B所產生的黏膠殘留(參照圖4)。 Furthermore, this embodiment is also the same as the third embodiment. When the face protection film 10 is attached to the body having the annular portion 23, because the inner portion 16Y (weak adhesion area) is arranged on the inner peripheral portion 23B of the annular portion 23, the occurrence of the inner peripheral portion 23B can be effectively prevented. Adhesive residue (refer to Figure 4).

此外,本實施形態中,中央部分17和內側部分16Y一樣,雖設置由強黏著部及弱黏著部所構成的圖案,但不一定要由圖案所構成,由強黏著部或弱黏著部的單體構成也可以。 In addition, in this embodiment, the central portion 17 is the same as the inner portion 16Y. Although a pattern composed of a strong adhesion portion and a weak adhesion portion is provided, it does not necessarily have to be constituted by a pattern. It is composed of a single strong adhesion portion or a weak adhesion portion. Body composition is also possible.

以上的第5~第7的實施形態中,設置弱黏著區域及強黏著區域,雖然揭示弱黏著區域具有由弱黏著部及強黏著部所構成的圖案之態樣,但強黏著區域也可以具有由弱黏著部及強黏著部所構成的圖案。 In the above fifth to seventh embodiments, the weak adhesion area and the strong adhesion area are provided. Although it is revealed that the weak adhesion area has a pattern formed by the weak adhesion portion and the strong adhesion portion, the strong adhesion area may also have A pattern composed of a weak adhesion part and a strong adhesion part.

該情形中,如第5實施形態,形成弱黏著區域的外側部分16A及內側部分16B,再來,設置成為強黏著區域的中間部分16C的情形時,例如,如圖14所示,在由弱黏著部形成外側部分16A及內側部分16B的同時,中間部分16C由弱黏著部及強黏著部所構成的圖案來形成。 In this case, as in the fifth embodiment, the outer portion 16A and the inner portion 16B of the weak adhesion area are formed, and then, when the middle portion 16C of the strong adhesion area is provided, for example, as shown in FIG. While the adhesive part forms the outer part 16A and the inner part 16B, the middle part 16C is formed by a pattern composed of a weak adhesive part and a strong adhesive part.

此外,如第6實施形態,在環狀區域16設置外側部分16X及內側部分16Y(參照圖12),當外側部分16X為弱黏著區域,內側部分16Y為強黏著區域的情形時,例如,外側部分16X由弱黏著部所形成,內側部分16Y由弱黏著部及強黏著部所構成的圖案來形成。同樣地,如第7實施形態,在環狀區域16設置外側部分16X及內側部分16Y(參照圖13),當外側部分16X為強黏 著區域,內側部分16Y為弱黏著區域的情形時,例如,外側部分16X由弱黏著部及強黏著部所構成的圖案來形成,內側部分16Y由弱黏著部來形成。 In addition, as in the sixth embodiment, the outer portion 16X and the inner portion 16Y are provided in the annular region 16 (refer to FIG. 12). When the outer portion 16X is a weak adhesion area and the inner portion 16Y is a strong adhesion area, for example, the outer portion The portion 16X is formed by a weak adhesion portion, and the inner portion 16Y is formed by a pattern composed of a weak adhesion portion and a strong adhesion portion. Similarly, as in the seventh embodiment, the outer portion 16X and the inner portion 16Y are provided in the annular region 16 (refer to FIG. 13). When the outer portion 16X is strongly adhesive When the inner portion 16Y is a weak adhesion area, for example, the outer portion 16X is formed by a pattern composed of a weak adhesion portion and a strong adhesion portion, and the inner portion 16Y is formed by a weak adhesion portion.

此外,如圖11~14所示的第5~第7的實施形態,雖然揭示由弱黏著部及強黏著部構成的圖案,具有交互配置線狀弱黏著部及線狀強黏著部的條紋形狀的態樣,但圖案並不限於條紋形狀,可以有第4實施形態所示的任一種圖案形狀。 In addition, the fifth to seventh embodiments shown in Figs. 11 to 14 reveal a pattern composed of a weak adhesive part and a strong adhesive part, and have a stripe shape in which the linear weak adhesive part and the linear strong adhesive part are alternately arranged. However, the pattern is not limited to the stripe shape, and any pattern shape shown in the fourth embodiment may be used.

此外,上述第1~第7實施形態的具體說明中,雖然例示了使用能量線硬化型黏著劑,將能量線硬化型黏著劑部分硬化,設置弱黏著部及強黏著部的態樣,但並不限於該態樣。 In addition, in the specific description of the first to seventh embodiments, although the energy ray hardening adhesive is used to partially harden the energy ray hardening adhesive, the weak adhesive part and the strong adhesive part are provided. It is not limited to this aspect.

例如,黏著劑為非能量線硬化型黏著劑,在表面保護膜10部分設置黏著劑層12也可以。當然,黏著劑為能量線硬化型黏著劑,在表面保護膜10部分設置黏著劑層12也可以。 For example, the adhesive is a non-energy-ray-curable adhesive, and the adhesive layer 12 may be provided on the surface protective film 10 part. Of course, the adhesive is an energy ray-curable adhesive, and the adhesive layer 12 may be provided on the surface protective film 10 part.

當部分設置黏著劑層12時,在黏著面15設置非黏著部,但於上述所說明的各實施形態中,弱黏著部的部分為非黏著部。因此,上述各實施形態的弱黏著區域,在第1~第3實施形態中,不具有黏著力的區域成為非黏著區域,上述第5~第7實施形態中,藉由強黏著部及非黏著部所構成的圖案,成為弱黏著區域。 When the adhesive layer 12 is partially provided, a non-adhesive part is provided on the adhesive surface 15. However, in the above-described embodiments, the part of the weakly adhesive part is a non-adhesive part. Therefore, in the weak adhesion area of each of the above embodiments, in the first to third embodiments, the non-adhesive area becomes the non-adhesive area. In the fifth to seventh embodiments, the strong adhesion part and the non-adhesive area The pattern formed by the part becomes a weak adhesion area.

此外,以上的第4~第7實施形態所說明的各圖案中,圖案的間距(也就是鄰接的各強黏著部彼此之間 的間隔,或鄰接的各弱黏著部或各非黏著部彼此之間的間隔)較佳為10~500μm,更佳為10~300μm,再更佳為10~250μm。 In addition, in each of the patterns described in the fourth to seventh embodiments above, the pitch of the pattern (that is, the distance between adjacent strong adhesion portions The interval, or the interval between adjacent weak adhesion parts or non-adhesive parts, is preferably 10 to 500 μm, more preferably 10 to 300 μm, and still more preferably 10 to 250 μm.

也就是說,各條紋的寬度,各波線的寬度及波線與波線之間間隔,成為格子的各線的寬度,及構成格子的鄰接之線與線之間的間隔,點與點間的間隔及點的寬度及高度,或構成格子花紋的各四角形的高度及寬度,較佳為10~500μm,更佳為10~300μm,再更佳為10~250μm。 In other words, the width of each stripe, the width of each wave line and the interval between wave lines and wave lines become the width of each line of the grid, and the interval between adjacent lines that constitute the grid, the interval between points and the points The width and height of, or the height and width of each quadrangle forming the lattice pattern, are preferably 10 to 500 μm, more preferably 10 to 300 μm, and still more preferably 10 to 250 μm.

再來,如第4實施形態,當全體黏著面15有圖案時(參照圖5~10),對全體黏著面15的弱黏著部或非黏著部的佔有面積,較佳為3~70%,更佳為3~60%,再更佳為3~50%。 Furthermore, as in the fourth embodiment, when the entire adhesive surface 15 has a pattern (refer to FIGS. 5 to 10), the area occupied by the weakly adhesive or non-adhesive portion of the entire adhesive surface 15 is preferably 3 to 70%. It is more preferably 3~60%, and still more preferably 3~50%.

此外,如第5~第7實施形態,在黏著面15的一部分的區域(例如,弱黏著區域)設置圖案時(參照圖11~13),對該區域(弱黏著區域)的弱黏著部或非黏著部的佔有面積也一樣,較佳為3~70%,更佳為3~60%,再更佳為3~50%。同樣地,在強黏著區域設置圖案時(例如,參照圖14),對強黏著區域的弱黏著部或非黏著部的佔有面積也一樣,較佳為3~70%,更佳為3~60%,再更佳為3~50%。 In addition, as in the fifth to seventh embodiments, when a pattern is provided in a part of the area of the adhesive surface 15 (for example, the weakly adhesive area) (refer to FIGS. 11 to 13), the weakly adhesive portion of the area (weakly adhesive area) or The occupied area of the non-adhesive part is also the same, preferably 3 to 70%, more preferably 3 to 60%, and still more preferably 3 to 50%. Similarly, when the pattern is set in the strong adhesion area (for example, refer to Figure 14), the area occupied by the weak adhesion portion or the non-adhesion portion of the strong adhesion area is also the same, preferably 3~70%, more preferably 3~60 %, more preferably 3~50%.

再來,上述第1~第7實施形態中,在以能量線照射硬化形成弱黏著部的同時,雖例示未照射能量線的部分成為強黏著部,但經由別的方法,形成弱黏著部及強黏著部也可以。例如,在照射能量線硬化弱黏著部及強黏 著部的其中之一者的同時,藉由使對弱黏著部的能量線照射量比對強黏著部的能量線照射量還多,讓弱黏著部的硬化率比強黏著部還要高,形成強黏著部及弱黏著部也可以。 Furthermore, in the first to seventh embodiments described above, the weak adhesive part is formed by curing by energy ray irradiation, and although the part not irradiated with the energy ray becomes the strong adhesive part, the weak adhesive part and the weak adhesive part are formed by other methods. Strong adhesion part is also possible. For example, the weak adhesion part and the strong adhesion part are hardened by irradiation of energy rays. At the same time, by making the amount of energy ray irradiated to the weak adhesion part more than the energy ray irradiation amount to the strong adhesion part, the hardening rate of the weak adhesion part is higher than that of the strong adhesion part. It is also possible to form a strong adhesion part and a weak adhesion part.

再來,第1~第7實施形態中,經由能量線照射硬化的部分,雖然是對被貼附體能夠黏接的具有黏著力的弱黏著部,但也可以成為經由能量線硬化而完全失去黏著力的非黏著部。 Furthermore, in the first to seventh embodiments, although the part hardened by energy ray irradiation is a weak adhesive part that can be adhered to the adherend, it may be completely lost by energy ray hardening. The non-adhesive part of adhesion.

此外,上述各實施形態中,當黏著劑為能量線硬化型黏著劑時,在剝離時對表面保護膜再度進行能量線照射,因為使強黏著部的黏著劑硬化,因此可以更難以產生黏膠殘留。 In addition, in each of the above embodiments, when the adhesive is an energy-ray curable adhesive, the surface protective film is irradiated with energy ray again during peeling. This hardens the adhesive in the strong adhesion part, making it more difficult to produce adhesive. Residue.

此外,藉由使黏著劑的材料互相相異,形成強黏著部、弱黏著部或非黏著部也可以。再來,藉由所謂的糊殺(消除黏著力),來形成弱黏著部或非黏著部也可以。也就是說,於黏著劑層之更上方,部分塗佈剝離劑等的低黏著力材料或沒有黏著力的材料,使該部分成為弱黏著部或非黏著部,其餘部分形成強黏著部也可以。 In addition, it is also possible to form a strong adhesive part, a weak adhesive part or a non-adhesive part by making the materials of the adhesive different from each other. Furthermore, it is also possible to form a weak adhesive part or a non-adhesive part by so-called paste killing (elimination of adhesive force). That is to say, on the upper part of the adhesive layer, a part of the low-adhesive material such as release agent or non-adhesive material is applied to make this part a weak or non-adhesive part, and the remaining part can also form a strong adhesive part. .

再來,上述說明中,雖例示於表面保護膜形成弱黏著部或非黏著部之其中一者的態樣,但也可以混合設置弱黏著部及非黏著部的兩方。例如,將黏著劑部分塗佈於黏著面15,形成沒有設置黏著劑的部分(非黏著部),且藉由能量線僅硬化黏著劑層的一部分,形成弱黏著部也可以。在此情形,表面保護膜例如上述第1~第7 的實施形態所示的各態樣中,使弱黏著部的一部分成為非黏著部。 Furthermore, in the above description, although one of the weakly adhesive part and the non-adhesive part is formed in the surface protective film, it is also possible to mix and provide both the weakly adhesive part and the non-adhesive part. For example, the adhesive part may be applied to the adhesive surface 15 to form a part where no adhesive is provided (non-adhesive part), and only a part of the adhesive layer may be hardened by energy rays to form a weak adhesive part. In this case, the surface protection film, such as the first to seventh above In each of the aspects shown in the embodiment, a part of the weakly adhesive part is a non-adhesive part.

[實施例] [Example]

以下,基於實施例來更進一步說明本發明,但本發明並不僅限於該等例。 Hereinafter, the present invention will be further explained based on examples, but the present invention is not limited to these examples.

本實施例利用以下的方法來評價表面保護膜。 In this example, the following method was used to evaluate the surface protective film.

[黏膠殘留評價] [Evaluation of Adhesive Residue]

將表面保護膜的中心大致對齊外徑3.75mm,內徑2.37mm的圓環平板狀聚碳酸酯板的中心貼附後,以80℃加熱5小時。之後將樣本回復到常溫,以照度230mW/cm2,光量350mW/cm2的照射條件用紫外線照射表面保護膜,之後利用鑷子夾住薄膜端部,以剝離角度180°做剝離。利用光學顯微鏡(株式會社keyence製,商品名「VHX-200」)確認剝離後的被貼附體上的黏著劑殘留。 After aligning the center of the surface protection film approximately with the center of a circular flat polycarbonate plate with an outer diameter of 3.75 mm and an inner diameter of 2.37 mm, it was heated at 80°C for 5 hours. After that, the sample was returned to normal temperature, and the surface protective film was irradiated with ultraviolet rays under the irradiation conditions of 230 mW/cm 2 illuminance and 350 mW/cm 2 light intensity. Then, the end of the film was clamped with tweezers and peeled off at a peeling angle of 180°. Using an optical microscope (manufactured by Keyence Co., Ltd., trade name "VHX-200"), it was confirmed that the adhesive remained on the adherend after peeling.

A:被貼附體表面的面積中黏著劑的殘留面積未滿5%。 A: The remaining area of the adhesive in the surface area of the adherend is less than 5%.

B:被貼附體表面的面積中黏著劑的殘留面積在5%以上未滿15%。 B: The remaining area of the adhesive in the surface area of the adherend is 5% or more but less than 15%.

D:被貼附體表面的面積中黏著劑的殘留面積在15%以上。 D: The residual area of the adhesive in the surface area of the adherend is 15% or more.

[偏差評價] [Bias Evaluation]

使用2kg的橡膠滾輪,以1次的壓合數將寬25mm、長150mm的表面保護用薄膜,藉由面積25mm×25mm的黏著劑層貼附於試驗板(SUS304鋼板),以JIS Z0237:2000的支持力試驗做為準據評價。 Using a 2kg rubber roller, a surface protection film with a width of 25mm and a length of 150mm is attached to the test plate (SUS304 steel plate) with an area of 25mm×25mm with an adhesive layer of 25mm×25mm, in accordance with JIS Z0237: 2000. The supporting force test is used as the criterion for evaluation.

A:支持70000秒以上,且只產生未滿1mm的偏差。 A: It supports more than 70,000 seconds, and only produces a deviation of less than 1mm.

B:支持經過70000秒以上,但產生1mm以上的偏差。 B: Support more than 70,000 seconds, but produce a deviation of more than 1mm.

C:支持經過70000秒以上,但產生3mm以上的偏差。 C: Support more than 70,000 seconds, but produce a deviation of more than 3mm.

D:經過70000秒前,樣本掉落。 D: The sample dropped before 70,000 seconds.

[膜剝落評價] [Film peeling evaluation]

將具有外徑3.75mm、內徑2.37mm呈圓環平板狀,且表面塗膜氧化鈦的聚碳酸酯板做為被貼附體準備。將表面保護膜的中心大致對齊被貼附體表面的中心貼附後,以80℃加熱5小時。之後將樣本回復到常溫,以照度230mW/cm2,光量350mW/cm2的照射條件用紫外線照射表面保護膜,之後利用鑷子夾住薄膜端部,以剝離角度180°做剝離。利用光學顯微鏡(株式會社Keyence製,商品名「VHX-200」)確認剝離後的被貼附體薄膜之剝落,並利用以下的評價基準做評價。 A polycarbonate plate with an outer diameter of 3.75 mm and an inner diameter of 2.37 mm in the shape of a circular flat plate and a surface coated with titanium oxide was prepared as the adherend. After attaching the surface protection film to approximately the center of the surface of the adherend, heat it at 80°C for 5 hours. After that, the sample was returned to normal temperature, and the surface protective film was irradiated with ultraviolet rays under the irradiation conditions of 230 mW/cm 2 illuminance and 350 mW/cm 2 light intensity. Then, the end of the film was clamped with tweezers and peeled off at a peeling angle of 180°. The peeling of the adherend film after peeling was confirmed with an optical microscope (manufactured by Keyence Co., Ltd., trade name "VHX-200"), and the following evaluation criteria were used for evaluation.

1:被貼附體表面的面積中膜的剝落面積未滿5%。 1: The peeling area of the film in the surface area of the adherend is less than 5%.

2:被貼附體表面的面積中膜的剝落面積在5%以上未 滿10%。 2: The peeling area of the film in the surface area of the adherend is more than 5% Full 10%.

3:被貼附體表面的面積中膜的剝落面積在10%以上未滿25%。 3: The peeling area of the film in the surface area of the adherend is more than 10% but less than 25%.

4:被貼附體表面的面積中膜的剝落面積在25%以上未滿50%。 4: The peeling area of the film in the surface area of the adherend is more than 25% but less than 50%.

5:被貼附體表面的面積中膜的剝落面積在50%以上。 5: The peeling area of the film in the surface area of the adherend is more than 50%.

各實施例中的比較例,做為黏著劑使用由以下配合A、B所構成的黏著劑。 In the comparative example in each example, the adhesive composed of the following blends A and B was used as the adhesive.

Figure 105111661-A0202-12-0039-1
Figure 105111661-A0202-12-0039-1

[實施例1] [Example 1]

於厚度38μm的聚對苯二甲酸(PET)系剝離片(Lintec株式會社製,商品名「SP PET381031」)塗佈配 合A的黏著劑,以100℃乾燥1分鐘,形成厚度10μm的黏著劑層,接著,貼合由PET薄膜(厚度:50μm,東洋紡株式會社製,商品名「A4100」)所構成的基材至黏著劑層。之後,在23℃,50%RH的環境下靜置7日。接著,於所製作的薄片的基材側放置遮光濾光片,使用紫外線照射裝置(Lintec株式會社製,商品名「RAD-2000m/12」)以照度230mW/cm2、光量350mW/cm2的照射條件進行紫外線照射硬化黏著劑層,在之後,將所得到的薄片進行沖孔,得到直徑5mm的圓形表面保護膜,評價有關黏膠殘留、及膜剝落。 A 38μm thick polyethylene terephthalic acid (PET) release sheet (manufactured by Lintec Co., Ltd., trade name "SP PET381031") is coated with an adhesive compound A, and dried at 100°C for 1 minute to form an adhesive layer with a thickness of 10μm , Next, a substrate composed of a PET film (thickness: 50 μm, manufactured by Toyobo Co., Ltd., trade name "A4100") was bonded to the adhesive layer. After that, it was allowed to stand for 7 days in an environment of 23°C and 50% RH. Next, a light-shielding filter was placed on the substrate side of the produced sheet, and an ultraviolet irradiation device (manufactured by Lintec Co., Ltd., trade name "RAD-2000m/12") was used with an illuminance of 230mW/cm 2 and a light intensity of 350mW/cm 2 Irradiation conditions: UV irradiation was performed to harden the adhesive layer. After that, the obtained sheet was punched to obtain a circular surface protective film with a diameter of 5 mm, and the adhesive residue and film peeling were evaluated.

此外,遮光濾光片如圖3所示之表面保護膜的方式,以將外側部分16X不經能量線硬化形成強黏著部(強黏著區域),將內側部分16Y經能量線硬化成為弱黏著部(弱黏著區域)的方式遮光。內側部分16Y的外徑/2(W3)為1.42mm。 In addition, the light-shielding filter is a surface protection film as shown in FIG. 3, in which the outer part 16X is not cured by energy rays to form a strong adhesion part (strong adhesion area), and the inner part 16Y is cured by energy rays into a weak adhesion part (Weak adhesion area) shading. The outer diameter/2 (W3) of the inner portion 16Y is 1.42 mm.

此外,將所製作的薄片以寬25mm,長150mm的尺寸做裁斷,做為評價用樣本評價偏差。不過,偏差評價用樣本的與試驗板的貼附部分全體,以成為強黏著區域(也就是強黏著部(未硬化部分))的方式做準備。 In addition, the produced sheet was cut into a size of 25 mm in width and 150 mm in length, and used as an evaluation sample to evaluate deviations. However, the entire adhesion part of the sample for the deviation evaluation to the test plate is prepared so as to become a strong adhesion area (that is, a strong adhesion part (unhardened part)).

[實施例2] [Example 2]

變更遮光濾光片的遮光部分,如圖3所示的表面保護膜的方式,除了將外側部分16X經能量線硬化形成弱黏著部,且將內側部分16Y不經能量線硬化成為強黏著部的方 式以外,與實施例1一樣。內側部分16Y的外徑/2(W3)為1.42mm。 Change the light-shielding part of the light-shielding filter to the surface protection film as shown in Figure 3, except that the outer part 16X is cured by energy rays to form a weak adhesion part, and the inner part 16Y is not cured by energy rays to become a strong adhesion part square Except for the formula, the same as in Example 1. The outer diameter/2 (W3) of the inner portion 16Y is 1.42 mm.

[實施例3] [Example 3]

變更遮光濾光片的遮光部分,如圖1所示的表面保護膜,除了將外側部分16A、內側部分16B經能量線硬化形成弱黏著部,且將中間部分16C不經能量線硬化成為強黏著部的方式以外,與實施例1一樣。中間部分16C的外徑/2(W1)為1.65mm,內側部分16B的外徑/2(W2)為1.42mm。 Change the light-shielding part of the light-shielding filter, as shown in Fig. 1, except that the outer part 16A and the inner part 16B are hardened by energy rays to form a weak adhesion part, and the middle part 16C is not hardened by energy rays to become a strong adhesion. Except for the method of the part, the same as in Example 1. The outer diameter/2 (W1) of the middle portion 16C is 1.65 mm, and the outer diameter/2 (W2) of the inner portion 16B is 1.42 mm.

[實施例4] [Example 4]

所使用的黏著劑的配合除了變更為配合B以外,與實施例1相同做實施。 The compounding of the adhesive used was carried out in the same manner as in Example 1, except that it was changed to compound B.

[實施例5] [Example 5]

變更遮光濾光片的遮光部分,如圖14所示的表面保護膜的方式,除了將外側部分16A、內側部分16B全體經能量線硬化形成弱黏著部,將中間部分16C硬化成點狀(參照圖8)的圖案,成為圓形的點狀的弱黏著部(硬化部分),及強黏著部(點以外的未硬化部分)所形成的強黏著區域以外,與實施例1一樣。中間部分16C的外徑/2(W1)為1.65mm,內側部分16B的外徑/2(W2)為1.42mm。此外,使弱黏著部為強黏著區域全體的10%, 強黏著部為90%。 Change the light-shielding part of the light-shielding filter to a surface protection film as shown in Figure 14, except that the entire outer part 16A and inner part 16B are cured by energy rays to form a weak adhesive part, and the middle part 16C is cured into a dot shape (refer to The pattern of FIG. 8) is the same as in Example 1, except for the circular dot-shaped weak adhesion portion (hardened portion) and the strong adhesion area formed by the strong adhesion portion (unhardened portion other than the dot). The outer diameter/2 (W1) of the middle portion 16C is 1.65 mm, and the outer diameter/2 (W2) of the inner portion 16B is 1.42 mm. In addition, the weak adhesion area is 10% of the entire strong adhesion area, The strong adhesion part is 90%.

此外,偏差評價用樣本中,為了使與試驗板的貼附部分全體成為強黏著區域,也就是說,由圓形的點狀的弱黏著部(硬化部分)、及強黏著部(點以外的未硬化部分)形成的方式做準備。 In addition, in the sample for deviation evaluation, in order to make the entire adhesion part to the test board a strong adhesion area, that is, a circular dot-shaped weak adhesion portion (hardened portion) and a strong adhesion portion (other than the dots) The unhardened part) is formed.

[實施例6] [Example 6]

變更遮光濾光片的遮光部分,於強黏著區域中,除了使弱黏著部為強黏著區域全體的20%,強黏著部為80%以外,與實施例5做同樣的實施。 The light-shielding portion of the light-shielding filter was changed, and in the strong adhesion area, the weak adhesion portion was 20% of the entire strong adhesion area and the strong adhesion portion was 80%, and the same implementation was performed as in Example 5.

[實施例7] [Example 7]

變更遮光濾光片的遮光部分,於強黏著區域中,除了使弱黏著部為強黏著區域全體的50%,強黏著部為50%以外,與實施例5做同樣的實施。 The light-shielding portion of the light-shielding filter was changed, and in the strong adhesion area, the weak adhesion portion was 50% of the entire strong adhesion area and the strong adhesion portion was 50%, and the same implementation was performed as in Example 5.

[比較例1] [Comparative Example 1]

除了不將黏著劑層硬化的點以外,與實施例1做同樣的實施。 Except for the point where the adhesive layer was not hardened, the same operation as in Example 1 was performed.

Figure 105111661-A0202-12-0043-2
Figure 105111661-A0202-12-0043-2

從表2的結果可以發現,實施例1~7中,由於環狀區域的至少一部分做為強黏著部,其餘部分做為弱黏著部,可在維持良好的黏著劑層支持力的同時,也可防止剝離表面保護膜時的黏膠殘留及被貼附體的覆蓋膜剝落。再來,被貼附體的覆蓋膜剝落如實施例5~7的方式,使黏著面的一部分為由弱黏著部及強黏著部所構成的圖案,更能夠有效地防止。 It can be found from the results in Table 2 that in Examples 1-7, since at least a part of the annular region is used as a strong adhesive part and the rest is used as a weak adhesive part, it can maintain a good adhesive layer support while also It can prevent the adhesive residue when peeling off the surface protective film and the cover film of the adherend from peeling off. Furthermore, the peeling of the covering film of the adherend is the same as in Examples 5 to 7, and a part of the adhesive surface is a pattern composed of a weak adhesive portion and a strong adhesive portion, which can be more effectively prevented.

相對於此,比較例1中,因為環狀區域不設置強黏著部及弱黏著部,剝離表面保護膜時會發生黏膠殘留及膜剝落,無法滿足做為光學零件及電子零件保護薄膜的性能。 In contrast, in Comparative Example 1, because the ring-shaped area does not provide strong adhesion parts and weak adhesion parts, adhesive residue and film peeling will occur when the surface protection film is peeled off, which cannot meet the performance as a protection film for optical parts and electronic parts. .

10‧‧‧表面保護膜 10‧‧‧Surface protective film

11‧‧‧基材 11‧‧‧Substrate

12‧‧‧黏著劑層 12‧‧‧Adhesive layer

15‧‧‧黏著面(黏著劑層側的面) 15‧‧‧Adhesive surface (the surface on the side of the adhesive layer)

16‧‧‧環狀區域 16‧‧‧Annular area

16A‧‧‧外側部分 16A‧‧‧Outer part

16B‧‧‧內側部分 16B‧‧‧Inner part

16C‧‧‧中間部分 16C‧‧‧Middle part

17‧‧‧中央部分 17‧‧‧Central part

20‧‧‧光學零件 20‧‧‧Optical parts

21‧‧‧透鏡 21‧‧‧Lens

22‧‧‧透鏡支持零件 22‧‧‧Lens support parts

23‧‧‧環狀部 23‧‧‧Annular part

23A‧‧‧外圍部 23A‧‧‧Outer part

23B‧‧‧內周部 23B‧‧‧Inner periphery

23F‧‧‧前面 23F‧‧‧Front

24‧‧‧表面覆蓋膜 24‧‧‧Surface Cover Film

Claims (11)

一種貼附於光學零件用以保護其表面的表面保護膜,係具備:由樹脂薄膜形成的基材、及設置於前述基材的一方之面的丙烯酸系黏著劑層;前述表面保護膜的丙烯酸系黏著劑層側之面,至少在圍繞以重心為中心未滿(a×r)的範圍內的區域之中央部分的環狀區域中,一部分為強黏著部,而其他部分為黏著力比前述強黏著部的黏著力還低的弱黏著部與非黏著部的至少一者,其中,r意味著平面視時從黏著面的重心至黏著面的外周緣的各點之距離,a是從比0還大但未滿1的正數;前述環狀區域的外側部分及內側部分的兩方,在設置前述弱黏著部及非黏著部的至少一者形成弱黏著區域或非黏著區域的同時,在前述外側部分及內側部分之間的中間部分設置前述強黏著部形成強黏著區域。 A surface protection film attached to an optical component to protect the surface thereof, comprising: a substrate formed of a resin film, and an acrylic adhesive layer provided on one side of the substrate; and acrylic of the surface protection film The surface on the side of the adhesive layer, at least in the ring-shaped area surrounding the central part of the area centered on the center of gravity (a×r), one part is a strong adhesive part, and the other part has a stronger adhesive force than the aforementioned At least one of the weak-adhesive part and the non-adhesive part where the adhesive force of the strong adhesive part is low, where r means the distance from the center of gravity of the adhesive surface to the outer periphery of the adhesive surface in a plan view, and a is from 0 is larger but a positive number less than 1. At least one of the weak adhesion part and the non-adhesive part is provided on both the outer part and the inner part of the aforementioned annular area to form a weak adhesion area or a non-adhesive area. The middle part between the outer part and the inner part is provided with the strong adhesion part to form a strong adhesion area. 如請求項1所記載的表面保護膜,其中,前述丙烯酸系黏著劑層以能量線硬化性黏著劑形成,且前述弱黏著部及非黏著部的至少一者係由經能量線照射而硬化的部分所構成。 The surface protection film according to claim 1, wherein the acrylic adhesive layer is formed of an energy-ray curable adhesive, and at least one of the weakly adhesive portion and the non-adhesive portion is cured by irradiation with energy rays Partly constituted. 如請求項1或2所記載的表面保護膜,其中,前述丙烯酸系黏著劑層之一部分設置於前述基材的一方之面,不設置前述丙烯酸系黏著劑層的部分成為前述非黏著部。 The surface protection film according to claim 1 or 2, wherein a part of the acrylic adhesive layer is provided on one surface of the substrate, and a part where the acrylic adhesive layer is not provided becomes the non-adhesive part. 如請求項1或2所記載的表面保護膜,其中,前述 表面保護膜的丙烯酸系黏著劑層側之面,至少在前述環狀區域,具有由前述弱黏著部及非黏著部的至少一者與前述強黏著部交互設置而成的圖案形狀。 The surface protective film described in claim 1 or 2, wherein the aforementioned The surface of the surface protection film on the side of the acrylic adhesive layer has a pattern shape in which at least one of the weak adhesive portion and the non-adhesive portion and the strong adhesive portion are alternately arranged at least in the annular region. 如請求項1或2所記載的表面保護膜,其中,前述表面保護膜的丙烯酸系黏著劑層側之面,至少在前述環狀區域中,前述弱黏著部及非黏著部的至少一者與前述強黏著部以選自:條紋形狀、格子形狀、點狀、由複數波線並排排列而成的形狀、格子花紋、及由複數種圖案並排排列而成的形狀之任意的圖案配置。 The surface protection film according to claim 1 or 2, wherein the surface of the surface protection film on the side of the acrylic adhesive layer, at least in the annular region, at least one of the weak adhesive portion and the non-adhesive portion and The strong adhesion part is arranged in any pattern selected from: a stripe shape, a lattice shape, a dot shape, a shape formed by a plurality of wave lines arranged side by side, a lattice pattern, and a shape formed by a plurality of patterns side by side. 如請求項1或2所記載的表面保護膜,其中,前述弱黏著區域,具有由前述弱黏著部及非黏著部的至少一者與強黏著部交互設置而成的圖案形狀。 The surface protection film according to claim 1 or 2, wherein the weak adhesion area has a pattern shape in which at least one of the weak adhesion portion and the non-adhesive portion and the strong adhesion portion are alternately arranged. 如請求項1或2所記載的表面保護膜,其中,前述強黏著區域,具有由前述弱黏著部及非黏著部的至少一者與強黏著部交互設置而成的圖案形狀。 The surface protection film according to claim 1 or 2, wherein the strong adhesion area has a pattern shape formed by alternately setting at least one of the weak adhesion portion and the non-adhesive portion and the strong adhesion portion. 如請求項1或2所記載的表面保護膜,其中,前述光學零件具有環狀部;前述表面保護膜的前述環狀區域黏接於前述環狀部。 The surface protection film according to claim 1 or 2, wherein the optical component has an annular portion; and the annular region of the surface protection film is adhered to the annular portion. 如請求項1或2所記載的表面保護膜,其中,前述基材的厚度為10~150μm。 The surface protection film according to claim 1 or 2, wherein the thickness of the base material is 10 to 150 μm. 一種附表面保護膜的零件,具備:光學零件、及貼附在該零件表面之如請求項1~9中任1項所記載的表面保護膜。 A part with a surface protection film, comprising: an optical part and a surface protection film as described in any one of Claims 1 to 9 attached to the surface of the part. 一種表面保護方法,係將如請求項1~9中任1項所記載的表面保護膜貼附於光學零件的表面,並保護該表 面。 A surface protection method, which is to attach the surface protection film described in any one of Claims 1 to 9 to the surface of the optical component and protect the surface surface.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200536135A (en) * 2004-04-28 2005-11-01 Nitto Denko Corp Package method for image sensor and adhesive tape therefor

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JPH02308883A (en) * 1989-05-25 1990-12-21 Nippon Carbide Ind Co Inc Surface-protection tape
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JP5186146B2 (en) * 2007-07-26 2013-04-17 株式会社パール Lens protection tape
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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