TWI724144B - 用於極化晶圓檢查之方法及裝置 - Google Patents

用於極化晶圓檢查之方法及裝置 Download PDF

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Publication number
TWI724144B
TWI724144B TW106110263A TW106110263A TWI724144B TW I724144 B TWI724144 B TW I724144B TW 106110263 A TW106110263 A TW 106110263A TW 106110263 A TW106110263 A TW 106110263A TW I724144 B TWI724144 B TW I724144B
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Taiwan
Prior art keywords
defect
polarization
wave plate
scattering
map
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TW106110263A
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English (en)
Chinese (zh)
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TW201801217A (zh
Inventor
劉晟
國衡 趙
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美商克萊譚克公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8848—Polarisation of light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/068—Optics, miscellaneous
    • G01N2201/0683—Brewster plate; polarisation controlling elements

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
TW106110263A 2016-03-28 2017-03-28 用於極化晶圓檢查之方法及裝置 TWI724144B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201662314362P 2016-03-28 2016-03-28
US62/314,362 2016-03-28
US15/468,608 US9874526B2 (en) 2016-03-28 2017-03-24 Methods and apparatus for polarized wafer inspection
US15/468,608 2017-03-24

Publications (2)

Publication Number Publication Date
TW201801217A TW201801217A (zh) 2018-01-01
TWI724144B true TWI724144B (zh) 2021-04-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106110263A TWI724144B (zh) 2016-03-28 2017-03-28 用於極化晶圓檢查之方法及裝置

Country Status (7)

Country Link
US (2) US9874526B2 (https=)
JP (1) JP6755323B2 (https=)
KR (1) KR102182566B1 (https=)
CN (1) CN109075091B (https=)
IL (1) IL261450B (https=)
TW (1) TWI724144B (https=)
WO (1) WO2017172624A1 (https=)

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WO2022002939A1 (en) * 2020-06-30 2022-01-06 Universiteit Gent A method to produce a matched pair of polarizing filters and a method and apparatus to determine the concentration of birefringent particles using a pair of polarizing filters
CN111929310B (zh) * 2020-09-25 2021-02-05 歌尔股份有限公司 表面缺陷检测方法、装置、设备及存储介质
CN112347527B (zh) * 2020-11-09 2022-06-03 武汉科技大学 一种用于暗场缺陷检测的光罩掩模板图形设计方法
CN112464829B (zh) * 2020-12-01 2024-04-09 中航航空电子有限公司 一种瞳孔定位方法、设备、存储介质及视线追踪系统
US11879853B2 (en) * 2021-02-19 2024-01-23 Kla Corporation Continuous degenerate elliptical retarder for sensitive particle detection
US11546508B1 (en) * 2021-07-21 2023-01-03 Black Sesame Technologies Inc. Polarization imaging system with super resolution fusion
CN113916798B (zh) * 2021-10-11 2023-06-06 北京航空航天大学 一种适用于典型偏振多谱段探测系统的信噪比估算方法
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CN116482123A (zh) * 2023-06-20 2023-07-25 泉州装备制造研究所 一种光学元件表面微观缺陷检测方法、系统、设备及介质
CN117269193B (zh) * 2023-09-26 2024-06-25 迈沐智能科技(南京)有限公司 合成革表观质量智能化检测方法
WO2025080598A1 (en) * 2023-10-09 2025-04-17 Arizona Board Of Regents On Behalf Of The University Of Arizona Metrology system based on polarization imaging
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Also Published As

Publication number Publication date
JP6755323B2 (ja) 2020-09-16
US9874526B2 (en) 2018-01-23
KR20180121667A (ko) 2018-11-07
US20170276613A1 (en) 2017-09-28
IL261450A (en) 2018-10-31
CN109075091A (zh) 2018-12-21
US10228331B2 (en) 2019-03-12
KR102182566B1 (ko) 2020-11-24
US20180364177A1 (en) 2018-12-20
CN109075091B (zh) 2020-03-24
TW201801217A (zh) 2018-01-01
JP2019516065A (ja) 2019-06-13
IL261450B (en) 2021-06-30
WO2017172624A1 (en) 2017-10-05

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