TWI722887B - Ingot workpiece board, ingot slicing device and ingot slicing method - Google Patents

Abstract

The present invention provides an ingot workpiece board, an ingot slicing device and an ingot slicing method. The ingot workpiece board comprises a fixed plate and an adjustment plate. The fixed plate is configured to place an ingot, and the adjustment plate is located on the surface of the fixed plate away from the ingot. The adjustment plate is provided with a center hole and a plurality of waist-shaped through holes, the center hole is located in the middle of the adjustment plate, and the pluralities of waist-shaped through holes are located on the periphery of the center hole. The fixed plate and the adjustment plate are connected by bolts located in the center hole and the pluralities of waist-shaped through holes, and the bolts in the waist-shaped through holes can be moved in the waist-shaped through holes to adjust the relative positions of the fixed plate and the adjustment plate, so as to achieve the adjustment of the crystal orientation angle of the ingot.

Description

Crystal rod workpiece plate, crystal rod cutting device and cutting method

The invention relates to the field of silicon wafer manufacturing, in particular to an ingot workpiece plate, an ingot cutting device and a cutting method.

Wafer is one of the most basic and important raw materials in the semiconductor wafer manufacturing process. The manufacturing process usually includes the crystal pulling step of using CZ (Czochralski, Czochralski, Czochralski) method to draw high-quality single crystal silicon rods. , Divide the single crystal silicon rod into multiple single crystal silicon rods, simultaneously carry out the grinding of the outer diameter of the single crystal silicon rod and the barrel grinding segmentation step of processing the north groove, and the cutting step of dividing the single crystal silicon rod into silicon wafers. And the steps to improve the surface quality of silicon wafers by grinding. Among them, there is a very important step of dipping the rod before cutting. The specific process is to use X-Ray (diffractometer) to find the off-orientation (deflection angle) to correct the deflection angle. After that, it is glued to the workpiece board. The sticking process in the prior art is as follows: manually apply glue, use a pressing device to hold the crystal stick, let the crystal stick, the resin strip and the workpiece plate be glued together, and finally cure the glue for a certain period of time. Perform X-ray reexamination of crystal orientation. However, the existing equipment and manufacturing process cannot be re-inspected immediately after bonding the ingot, the resin strip and the workpiece plate. If the re-inspection fails, it will take a lot of time and the degumming process will also take a lot of time. Risk of damage to the crystal bar.

In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an ingot workpiece plate, an ingot cutting device, and a cutting method, which are used to solve the problem of the need for degumming when the crystal orientation of the ingot in the prior art fails to be rechecked. Then re-gluing, and the degumming process is not only time-consuming and laborious, but also easy to cause problems such as damage to the ingot.

In order to achieve the above object, the present invention provides an ingot workpiece plate, including: a fixed plate and an adjustment plate, the fixed plate is used to place the ingot; the adjustment plate is located on the surface of the fixed plate away from the ingot, so The adjustment plate is provided with a center hole and a plurality of waist-shaped through holes, the center hole is located in the middle of the adjustment plate, and the plurality of waist-shaped through holes are located on the periphery of the center hole; The adjusting plate is connected by bolts located in the center hole and the plurality of waist-shaped through holes, and the bolts located in the waist-shaped through holes can move in the waist-shaped through holes to adjust the fixing plate And the relative position of the adjustment plate, so as to realize the adjustment of the deflection angle of the crystal orientation of the crystal rod.

Optionally, there are four waist-shaped through holes, and the four waist-shaped through holes are evenly spaced along a circumferential direction centered on the center hole.

Optionally, the waist-shaped through hole is an arc-shaped waist-shaped through hole.

Optionally, the central angle corresponding to the arc length of the waist-shaped through hole is 15-60°.

Optionally, the crystal rod workpiece plate further includes a resin frame located on the surface of the fixing plate, and the crystal rod is located in the resin frame.

Optionally, the adjustment plate includes a plane portion and a boss portion, the plane portion is in contact with the fixing plate, and the boss portion is located on a surface of the plane portion away from the fixing plate, wherein the The center hole is located on the boss portion, and the waist-shaped through hole is located on the plane portion.

Optionally, the plane portion and the boss portion are an integrally formed structure.

Optionally, the boss portion has a rectangular column shape, and the length of the boss portion is the same as the length of the plane portion.

The present invention also provides a crystal rod cutting device, which includes: The ingot workpiece plate as described in any of the foregoing solutions; A carrying table, the ingot to be cut is placed on the carrying table by using the ingot workpiece plate; A cutting unit, the cutting unit is located above the crystal rod during non-cutting operation; The detection unit is located above the crystal rod and is used for detecting the crystal orientation deflection angle of the crystal rod.

The present invention also provides an ingot cutting method. The ingot cutting method is performed by the ingot cutting device as described in the foregoing solution, and the ingot cutting method includes detecting the ingot before cutting by using the detection unit. When it is detected that the deflection angle of the crystal orientation of the crystal rod exceeds the expected range, the step of adjusting the adjustment plate to adjust the deflection angle of the crystal orientation of the crystal rod to the expected range is used.

As mentioned above, the ingot workpiece plate, the ingot cutting device and the cutting method of the present invention have the following beneficial effects: the present invention uses the structural design of the fixed plate and the adjusting plate to cooperate, and adjusts the position of the adjusting plate relative to the fixed plate to achieve Adjust the position of the ingot to adjust the crystal orientation deflection angle of the ingot to the expected range to ensure that the final cut wafer meets the requirements. The device is simple in structure and convenient to use, not only can effectively reduce labor costs, but also does not need to undergo a degumming step in the process of adjusting the deflection angle, and can effectively avoid damage to the ingot. By adopting the crystal rod cutting device and the cutting method of the present invention, the crystal orientation deflection angle of the crystal rod is adjusted before cutting, which can improve the quality of the cut wafer and can effectively improve the production efficiency.

The following specific examples illustrate the implementation of the present invention. Those familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the accompanying drawings in this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not intended to limit the implementation of the present invention. Limited conditions, so it has no technical significance. Any structural modification, proportional relationship change or size adjustment should still fall under the present invention without affecting the effects and objectives that can be achieved by the present invention. The disclosed technical content must be within the scope of coverage. At the same time, the terms such as "upper", "lower", "left", "right", "middle", etc., cited in this specification are only for ease of description and clarity, and are not used to limit the implementation of the present invention. The scope, the change or adjustment of the relative relationship, without any substantial change to the technical content, shall also be regarded as the scope within which the present invention can be implemented.

Example one

As shown in Figures 1 to 4, the present invention provides an ingot workpiece plate, including: a fixed plate 11 and an adjustment plate 12, the fixed plate 11 is used to place the ingot; the adjustment plate 12 is located on the fixed plate 11 Away from the surface of the crystal rod, the adjustment plate 12 is provided with a center hole 121 and a plurality of waist-shaped through holes 122, the center hole 121 is located in the middle of the adjustment plate 12, and the plurality of waist-shaped through holes 122 is located on the periphery of the center hole 121; the fixing plate 11 and the adjustment plate 12 are connected by bolts located in the center hole 121 and the plurality of waist-shaped through holes 122, and are located in the waist-shaped through hole. The bolt in the hole 122 can move in the waist-shaped through hole 122 to adjust the relative position of the fixing plate 11 and the adjusting plate 12, so as to realize the adjustment of the crystal orientation deflection angle of the crystal rod. The present invention utilizes the structural design of the matching of the fixed plate 11 and the adjusting plate 12, and adjusts the position of the adjusting plate 12 relative to the fixed plate 11 to adjust the position of the crystal rod, so as to adjust the crystal orientation deflection angle of the crystal rod to the expected range. Ensure that the final cut wafer meets the requirements. The device is simple in structure and convenient to use, not only can effectively reduce labor costs, but also does not need to undergo a degumming step in the process of adjusting the deflection angle, and can effectively avoid damage to the ingot. FIG. 1 is a schematic diagram of the overall structure of the ingot workpiece plate of this embodiment, FIG. 2 is a schematic diagram of the structure of the fixing plate 11, and FIG. 3 is a schematic diagram of the structure of the adjusting plate 12.

The crystal orientation of a silicon wafer is an important indicator for controlling semiconductor performance. Generally, it is required that the angle between the physical crystal orientation of the silicon wafer and the geometric center axis of the silicon wafer (ie, the deflection angle of the crystal orientation) be controlled within ±0.5°. This control standard is higher, usually within ±0.1°. The smaller the deviation of the crystal orientation deflection angle control means the greater the difficulty of adjustment, and it is usually difficult to achieve the desired effect with one adjustment but multiple adjustments. Under the existing device and method, after each adjustment, the inspection (ie re-inspection) is required. If the re-inspection result still does not meet the requirements, it is necessary to repeat the manual gluing process. The device is pressed to hold the crystal rod and let The crystal rod, the resin strip and the workpiece board are glued together, and finally the glue is cured for a certain period of time, and then the X-ray crystal orientation re-inspection is a complicated process, which not only consumes time and labor, but also makes production efficiency. Decrease, the production cost rises, and it is easy to cause damage to the crystal rods during repeated degumming and viscose processes. The inventor of the present application has designed the ingot workpiece plate structure of the present application after a large number of experiments in response to the deficiencies of the existing devices and methods. By using the ingot workpiece plate of the present invention, the ingot can be easily achieved. Adjustment of crystal orientation deflection angle.

As an example, there are 4 waist-shaped through holes 122, 4 waist-shaped through holes 122 are evenly spaced along the circumferential direction centered on the center hole 121, and there are 4 waist-shaped through holes 122. , Which is beneficial to the fastening of the fixing plate 11 and the adjusting plate 12, and at the same time, the adjustment process is not too complicated when the adjustment operation is required. The structure of the waist-shaped through hole 122 is designed, and in a further preferred example, the waist-shaped through hole 122 is an arc-shaped waist-shaped through hole, which can make the bolt have a larger adjustment range and make adjustment easier. Of course, the fixing plate 11 is provided with corresponding screw holes (not labeled), so as to realize the fixing with the adjusting plate 12 by bolts.

When the waist-shaped through hole 122 is an arc-shaped waist-shaped through hole, as an example, the arc length of the waist-shaped through hole 122 corresponds to a center angle of 15-60°. If the angle is too small, the adjustment will be more difficult, and the angle is too large. Not only is it unnecessary (generally speaking, the deflection angle of the crystal rod is not particularly large), but it is also easy to cause the bolt to loosen. The inventor found through repeated experiments that the adjustment effect is better when the angle is between 15 and 60°.

The material of the fixing plate 11 can be set as required, such as graphite, silicon carbide, stainless steel, etc., and its surface shape is preferably rectangular. Theoretically, the ingot can be directly fixed on the fixing plate 11. For example, a groove can be provided on the fixing plate 11 and the ingot can be placed in the groove, but in order to avoid the ingot and the fixing plate 11 The friction between the ingots causes damage to the ingot. The ingot workpiece plate further includes a resin frame 13 on the fixed plate 11, and the ingot is located in the resin frame 13. When the crystal rod is placed in the resin frame 13, it is usually necessary to use glue to make the crystal rod, the resin frame 13 and the fixed plate 11 and the adjustment plate 12 firmly combined, and the glue is cured before using the conveying device Transfer to the cutting platform for deflection detection, deflection correction and cutting steps.

As an example, the adjusting plate 12 includes a flat portion 12a and a boss portion 12b, the flat portion 12a is in contact with the fixing plate 11, and the boss portion 12b is located on the flat portion 12a away from the fixing plate 11. Wherein, the center hole 121 is located on the boss portion 12b, and the waist-shaped through hole 122 is located on the flat portion 12a. The provision of the boss portion 12b can make the adjustment process easier, such as When adjusting the deflection angle of the crystal orientation, first loosen all the bolts, and then apply force on the boss portion 12b to make the adjustment plate 12 rotate around the center hole 121. At this time, the bolts are in the corresponding position. Move inside the waist-shaped through hole 122, and when the crystal orientation deflection angle is adjusted to the expected range, all bolts are tightened.

As an example, the flat portion 12a and the boss portion 12b are integrally formed.

As an example, the boss portion 12b has a rectangular column shape, and the length of the boss portion 12b is the same as the length of the plane portion 12a, so as to maintain the balance of the crystal rod during the movement. Of course, in other examples, depending on the structure of the carrier on which the ingot workpiece plate is placed, the boss portion 12b may also have other structures or other sizes.

As shown in FIG. 4, when the ingot workpiece plate of this embodiment is used, the ingot is fixed to the ingot workpiece plate by the resin frame 13 and through the glue and curing process. In the initial state, the ingot and the fixed plate 11 The positions of the three positions corresponding to the adjustment plate 12 are completely corresponding. The axis of the crystal rod (the axis along the length direction of the crystal rod) and the center line of the fixed plate 11 and the adjustment plate 12 in the longitudinal direction are in the longitudinal direction. Corresponding (located on the same cross-section), then the ingot and the ingot workpiece plate are transferred to the stage of the cutting platform by a conveying mechanism, and at this time the axis of the ingot and the cutting direction of the cutting device are perpendicular to each other , And then check the crystal orientation deflection angle of the crystal rod. If the crystal orientation deflection angle is within the expected range, then cut directly. If the crystal orientation deflection angle exceeds the expected range, loosen all the bolts, and then make the adjustment plate 12 surround the The center hole 121 rotates, and the angle of rotation is the angle that needs to be corrected. Since the positions of the carrier and the cutting device are fixed, after the relative positions of the fixed plate 11 and the adjustment plate 12 are adjusted, the adjustment plate 12 is still placed on the stage in its original position, so the position of the crystal rod relative to the cutting device has been adjusted, thereby realizing the adjustment of the crystal orientation deflection angle of the crystal rod. When the crystal orientation deflection angle is adjusted to the expected When it is within the range (for example, ±0.1°), then tighten all bolts. The whole process is very simple, can greatly reduce labor costs, and can effectively avoid damage to the ingot, and ensure the quality of the cut wafer.

Example two

As shown in Figure 5, the present invention also provides an ingot cutting device, including: The ingot workpiece plate as described in the first embodiment; The carrying table 3, the ingot 2 to be cut is placed on the carrying table 3 by using the ingot workpiece plate; The cutting unit 4, during non-cutting operation, the cutting unit 4 is located above the crystal rod 2; The detection unit 5 is located above the crystal rod 2 and is used to detect the crystal orientation deflection angle of the crystal rod 2.

Please refer to the first embodiment for the introduction of the ingot workpiece plate, and it will not be repeated for the sake of brevity.

The specific structure of the carrying platform 3 can be adjusted according to the specific structure of the adjusting plate 12. For example, in this embodiment, the carrying platform 3 may be provided with a concave portion corresponding to the boss portion 12b of the adjusting plate 12. A groove (not shown) is used to embed the boss portion 12b in the groove, so that the ingot workpiece plate can be better fixed on the carrying platform.

The cutting unit 4 is preferably a wire cutting unit, which usually includes a number of rollers and steel wires wound on the rollers, as well as a drive unit and a lifting unit. When the cutting operation starts, the rollers drop to the surface of the crystal rod, and the drive unit Driven by the drive to rotate, the steel wire is driven to rotate to cut the ingot along the radial direction of the ingot, and gradually descend as the cutting progresses until a complete wafer is cut. It should be particularly noted that FIG. 4 only illustrates the relative positions of the various structures and is not a state display during the actual cutting operation.

The detection unit 5 may be an X-ray diffractometer, which may specifically include an X-ray generator for emitting X-rays, an X-ray diffraction receiving device, and a goniometer circle. The X-rays are projected on the crystal rod and used for X-ray diffraction. The receiving device performs receiving diffraction to obtain the crystal orientation of the crystal rod, and then uses the goniometer circle to obtain the crystal orientation deflection angle of the crystal rod. The data information of the crystal orientation deflection angle can be displayed or transmitted to other equipment.

The other structure of the crystal rod cutting device is the same as that of the cutting device in the prior art. Since this part of the content is well known to those skilled in the art, it will not be expanded for the purpose of brevity.

The crystal rod cutting device of this embodiment can conveniently adjust the crystal orientation deflection angle of the crystal rod to the expected range, can improve the quality of the cut wafer, and can effectively improve the production efficiency.

The present invention also provides an ingot cutting method. The ingot cutting method is performed by the ingot cutting device as described in the second embodiment. The focus of the ingot cutting method is to use the detection unit to detect the ingot before cutting. For the deflection angle of the crystal orientation of the crystal rod, when it is detected that the deflection angle of the crystal orientation of the crystal rod exceeds the expected range, the adjustment plate is used to adjust the deflection angle of the crystal orientation of the crystal rod to the expected range. In addition, the crystal rod cutting method of the present invention is the same as the cutting method in the prior art. Since this part of the content is well known to those skilled in the art, it will not be expanded for the sake of brevity.

As described above, the present invention provides an ingot workpiece plate, an ingot cutting device and a cutting method. The ingot workpiece plate includes: a fixed plate and an adjustment plate, the fixed plate is used to place the ingot; the adjustment plate is located on the surface of the fixed plate away from the ingot, and the adjustment plate is provided with a center hole and several A waist-shaped through hole, the center hole is located in the middle of the adjustment plate, the plurality of waist-shaped through holes are located at the periphery of the center hole; the fixing plate and the adjustment plate use the center hole and The bolts in the several waist-shaped through holes are connected, and the bolts located in the waist-shaped through holes can move in the waist-shaped through holes to adjust the relative positions of the fixing plate and the adjusting plate, thereby The adjustment of the deflection angle of the crystal orientation of the crystal rod is realized. The invention utilizes the structural design of the matching of the fixed plate and the adjusting plate, and the position of the adjusting plate relative to the fixed plate is used to adjust the position of the crystal rod, so as to adjust the crystal orientation deflection angle of the crystal rod to the expected range, and ensure that the final cut is The wafers meet the requirements. The device is simple in structure and convenient to use, not only can effectively reduce labor costs, but also does not need to undergo a degumming step in the process of adjusting the deflection angle, and can effectively avoid damage to the ingot. By adopting the crystal rod cutting device and the cutting method of the present invention, the crystal orientation deflection angle of the crystal rod is adjusted before cutting, which can improve the quality of the cut wafer and can effectively improve the production efficiency. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial value.

The above-mentioned embodiments only exemplarily illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by persons with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present invention should still be covered by the scope of the invention patent application of the present invention.

11: fixed plate

12: adjustment board

12a: Plane

12b: Boss

121: Center Hole

122: Waist-shaped through hole

13: Resin frame

2: crystal rod

3: Bearing platform

4: Cutting unit

5: Detection unit

The following drawings of the present invention are used here as a part of the present invention for understanding the present invention. The drawings show the embodiments of the present invention and the description thereof to explain the principle of the present invention.

In the attached picture: [Fig. 1] is a schematic diagram showing the structure of the ingot workpiece plate in the first embodiment of the present invention. [Fig. 2] Shows as a schematic diagram of the structure of the fixing plate in Fig. 1. [Fig. 3] Shows as a schematic diagram of the structure of the adjustment plate in Fig. 1. [Figure 4] shows a schematic diagram of the structure of the ingot ingot placed on the ingot workpiece plate of the first embodiment. [Figure 5] shows a schematic diagram of the structure of the ingot cutting device according to the second embodiment of the present invention.

no

11: fixed plate

12: adjustment board

Claims (9)

An ingot workpiece plate, comprising: a fixed plate for placing the ingot; an adjustment plate located on the surface of the fixed plate away from the ingot; the adjustment plate is provided with a center hole and a plurality of waists The central hole is located in the middle of the adjusting plate, and the several waist-shaped through holes are located at the periphery of the central hole; the fixing plate and the adjusting plate use the central hole and the The bolts in a plurality of waist-shaped through holes are connected, and the bolts located in the waist-shaped through holes can move in the waist-shaped through holes to adjust the relative positions of the fixing plate and the adjusting plate, thereby realizing alignment. In the adjustment of the deflection angle of the crystal orientation of the crystal rod, the waist-shaped through hole is an arc waist-shaped through hole. The ingot workpiece plate according to claim 1, wherein the number of the waist-shaped through holes is four, and the four waist-shaped through holes are evenly spaced along the circumferential direction with the center hole as the center. The ingot workpiece plate according to claim 1, wherein the central angle corresponding to the arc length of the waist-shaped through hole is 15-60°. The ingot workpiece plate according to claim 1, wherein the ingot workpiece plate further includes a resin frame located on the fixed plate, and the ingot is located in the resin frame. The ingot workpiece plate according to any one of claims 1 to 4, wherein the adjustment plate includes a plane portion and a boss portion, the plane portion is in contact with the fixed plate, and the boss portion is located at the The flat portion is away from the surface of the fixing plate, wherein the center hole is located on the boss portion, and the waist-shaped through hole is located on the flat portion. The ingot workpiece plate according to claim 5, wherein the plane portion and the boss portion are an integrally formed structure. The ingot workpiece plate according to claim 5, wherein the boss portion is in a rectangular column shape, and the length of the boss portion is the same as the length of the plane portion. An ingot cutting device, comprising: the ingot workpiece plate according to claim 1; a bearing table, where the ingot to be cut is placed on the bearing table by using the ingot workpiece plate; a cutting unit, during non-cutting operation, The cutting unit is located above the crystal rod; the detection unit is located above the crystal rod and is used to detect the crystal orientation deflection angle of the crystal rod. An ingot cutting method, which is carried out by using the ingot cutting device as described in claim 8. The ingot cutting method includes before cutting, the detection unit is used to detect the crystal orientation deflection angle of the ingot, and after detecting When the crystal orientation deflection angle of the crystal rod exceeds the expected range, the step of adjusting the adjustment plate to adjust the crystal orientation deflection angle of the crystal rod to the expected range is used.

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