TWI722206B - 支撐體分離裝置、及支撐體分離方法 - Google Patents

支撐體分離裝置、及支撐體分離方法 Download PDF

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Publication number
TWI722206B
TWI722206B TW106119482A TW106119482A TWI722206B TW I722206 B TWI722206 B TW I722206B TW 106119482 A TW106119482 A TW 106119482A TW 106119482 A TW106119482 A TW 106119482A TW I722206 B TWI722206 B TW I722206B
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TW
Taiwan
Prior art keywords
support
holding
laminated body
substrate
laminate
Prior art date
Application number
TW106119482A
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English (en)
Chinese (zh)
Other versions
TW201804541A (zh
Inventor
石田信悟
Original Assignee
日商東京應化工業股份有限公司
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Publication date
Application filed by 日商東京應化工業股份有限公司 filed Critical 日商東京應化工業股份有限公司
Publication of TW201804541A publication Critical patent/TW201804541A/zh
Application granted granted Critical
Publication of TWI722206B publication Critical patent/TWI722206B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106119482A 2016-06-29 2017-06-12 支撐體分離裝置、及支撐體分離方法 TWI722206B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-129425 2016-06-29
JP2016129425A JP6670190B2 (ja) 2016-06-29 2016-06-29 支持体分離装置、および支持体分離方法

Publications (2)

Publication Number Publication Date
TW201804541A TW201804541A (zh) 2018-02-01
TWI722206B true TWI722206B (zh) 2021-03-21

Family

ID=60945040

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106119482A TWI722206B (zh) 2016-06-29 2017-06-12 支撐體分離裝置、及支撐體分離方法

Country Status (3)

Country Link
JP (1) JP6670190B2 (ko)
KR (1) KR20180002498A (ko)
TW (1) TWI722206B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102242409B1 (ko) * 2019-09-19 2021-04-20 한국원자력연구원 핵연료 판 회수 장치 및 이를 이용한 핵연료 판 회수 방법
KR102271085B1 (ko) * 2019-10-01 2021-06-29 유상원 블라인드 가동줄용 안전 손잡이

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284434A (ja) * 2000-03-29 2001-10-12 Lintec Corp 半導体ウェハの移載装置
US20060231202A1 (en) * 2005-04-18 2006-10-19 Nitto Denko Corporation Support board separating apparatus, and support board separating method using the same
US20120139192A1 (en) * 2010-12-02 2012-06-07 Fuji Electric Co., Ltd. Chucking device and chucking method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002236292A (ja) * 2001-02-09 2002-08-23 Matsushita Electric Ind Co Ltd 液晶パネルの製造方法および基板貼り合わせ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284434A (ja) * 2000-03-29 2001-10-12 Lintec Corp 半導体ウェハの移載装置
US20060231202A1 (en) * 2005-04-18 2006-10-19 Nitto Denko Corporation Support board separating apparatus, and support board separating method using the same
US20120139192A1 (en) * 2010-12-02 2012-06-07 Fuji Electric Co., Ltd. Chucking device and chucking method

Also Published As

Publication number Publication date
JP2018006486A (ja) 2018-01-11
TW201804541A (zh) 2018-02-01
KR20180002498A (ko) 2018-01-08
JP6670190B2 (ja) 2020-03-18

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