TWI722206B - 支撐體分離裝置、及支撐體分離方法 - Google Patents
支撐體分離裝置、及支撐體分離方法 Download PDFInfo
- Publication number
- TWI722206B TWI722206B TW106119482A TW106119482A TWI722206B TW I722206 B TWI722206 B TW I722206B TW 106119482 A TW106119482 A TW 106119482A TW 106119482 A TW106119482 A TW 106119482A TW I722206 B TWI722206 B TW I722206B
- Authority
- TW
- Taiwan
- Prior art keywords
- support
- holding
- laminated body
- substrate
- laminate
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016129425A JP6670190B2 (ja) | 2016-06-29 | 2016-06-29 | 支持体分離装置、および支持体分離方法 |
JP2016-129425 | 2016-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201804541A TW201804541A (zh) | 2018-02-01 |
TWI722206B true TWI722206B (zh) | 2021-03-21 |
Family
ID=60945040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106119482A TWI722206B (zh) | 2016-06-29 | 2017-06-12 | 支撐體分離裝置、及支撐體分離方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6670190B2 (ko) |
KR (1) | KR20180002498A (ko) |
TW (1) | TWI722206B (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102242409B1 (ko) * | 2019-09-19 | 2021-04-20 | 한국원자력연구원 | 핵연료 판 회수 장치 및 이를 이용한 핵연료 판 회수 방법 |
KR102271085B1 (ko) * | 2019-10-01 | 2021-06-29 | 유상원 | 블라인드 가동줄용 안전 손잡이 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284434A (ja) * | 2000-03-29 | 2001-10-12 | Lintec Corp | 半導体ウェハの移載装置 |
US20060231202A1 (en) * | 2005-04-18 | 2006-10-19 | Nitto Denko Corporation | Support board separating apparatus, and support board separating method using the same |
US20120139192A1 (en) * | 2010-12-02 | 2012-06-07 | Fuji Electric Co., Ltd. | Chucking device and chucking method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002236292A (ja) * | 2001-02-09 | 2002-08-23 | Matsushita Electric Ind Co Ltd | 液晶パネルの製造方法および基板貼り合わせ装置 |
-
2016
- 2016-06-29 JP JP2016129425A patent/JP6670190B2/ja active Active
-
2017
- 2017-06-02 KR KR1020170069121A patent/KR20180002498A/ko unknown
- 2017-06-12 TW TW106119482A patent/TWI722206B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284434A (ja) * | 2000-03-29 | 2001-10-12 | Lintec Corp | 半導体ウェハの移載装置 |
US20060231202A1 (en) * | 2005-04-18 | 2006-10-19 | Nitto Denko Corporation | Support board separating apparatus, and support board separating method using the same |
US20120139192A1 (en) * | 2010-12-02 | 2012-06-07 | Fuji Electric Co., Ltd. | Chucking device and chucking method |
Also Published As
Publication number | Publication date |
---|---|
TW201804541A (zh) | 2018-02-01 |
JP2018006486A (ja) | 2018-01-11 |
KR20180002498A (ko) | 2018-01-08 |
JP6670190B2 (ja) | 2020-03-18 |
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