TWI721836B - Display device and mosaic display module - Google Patents

Abstract

A display device includes a display member, a circuit board, a plurality of conductive probes, and a plurality of conductive pastes. The display unit includes a substrate. The front surface of the substrate includes a display area and a circuit area. The circuit area is located on the periphery of the substrate, and the circuit area has a plurality of connection pads. The circuit board is located on the back side of the substrate, and a connection area of the circuit substrate does not overlap with the substrate. Each of conductive probes is disposed on the connection area of the circuit substrate, contacts a side edge of the substrate and extends beyond the top of the substrate, wherein each of the conductive probes corresponds to one of the connection pads. The conductive pastes are used to connect the conductive probes and the corresponding connection pads. Through conductive probes and conductive pastes with conductive particles that are three-dimensionally distributed, the width of the peripheral area of the display device can be reduced, and the proportion of the display area can be enlarged in the same substrate size.

Description

Display device and splicing display module

The present invention relates to the field of displays, in particular to display devices and splicing display modules.

In the production of displays, the pursuit of the largest display area ratio of the display substrate is the goal. However, the current display device is to connect the circuit area of the display substrate and the circuit board under the display substrate by bending the flexible circuit board. Sexual connection. Since a certain amount of space is reserved for bending the flexible circuit board, the width of the peripheral area of the current upper display, that is, the circuit area of the display substrate in the frame of the display area, the area where the driving circuit board and the circuit area of the display substrate do not overlap, and The total width of the bending and protruding area of the flexible circuit board is about 1.8 to 8mm, depending on the actual panel size and settings.

In addition, since the circuit board and the circuit area of the display substrate are connected through the flexible circuit board, in order to avoid the problem of electrical short circuit, the contact area between the flexible circuit board and the circuit board, as well as the flexible circuit board and the display substrate, needs to be designed Conduction in a specific direction is currently achieved by using anisotropic conductive film (ACF). However, due to the characteristics of the ACF, the conductive particles in the ACF are arranged in a two-dimensional manner. In order to maintain the quality of the signal, the contact area needs to maintain a sufficient contact area, which is also the main reason why the width of the peripheral area cannot be reduced.

In addition to the width of the peripheral area affecting the usability of the substrate, in many current large-scale occasions, such as concerts, multiple displays are spliced to form a large display screen. When the width of the peripheral area is too large, visually, the image will be discontinuous and the resolution will be low.

In order to solve the problems faced by the prior art, a display device is provided here. The display device includes a display unit, a circuit board, a plurality of conductive probes, and a plurality of conductive glues. The display unit includes a display substrate. The front of the display substrate includes a display area and a circuit area. The circuit area is located on the periphery of the display substrate, and the circuit area has a plurality of connection pads. The circuit board is located on the back of the display substrate, and the connection area of the circuit board does not overlap with the display substrate. Each conductive probe is arranged on the connection area of the circuit board, contacts the side edge of the display substrate, and extends beyond the top of the display substrate, wherein each conductive probe corresponds to one of the connection pads. The conductive glue connects the conductive probe and the corresponding connection pad.

In some embodiments, the display substrate includes a rigid substrate. In more detail, in some embodiments, the hard substrate includes glass or acrylic.

In some embodiments, the side edge of the display substrate includes a plurality of grooves, and each conductive probe is respectively accommodated in a corresponding groove.

In some embodiments, the width from the edge of the display area to the edge of the non-overlapping area between the circuit board and the display unit is 0.4 to 1.6 mm.

In some embodiments, the circuit board is a rigid circuit board.

A spliced display module is also provided. The spliced display module includes a first display unit, a first circuit board, a second display unit, a second circuit board, a plurality of conductive probes, and a plurality of conductive glues. The first display unit includes a first display substrate. The front of the first display substrate includes a first display area and a first circuit area. The first circuit area is located on the periphery of the first display substrate, and the first circuit area has a plurality of first connection pads. . The first circuit board is located on the back of the first display substrate, and the first connection area of the first circuit board does not overlap with the first display substrate.

The second display unit is adjacent to the first display unit, the second display unit includes a second display substrate, the front of the second display substrate includes a second display area and a second circuit area, the second circuit area is located at the periphery of the second display substrate, and The second circuit area has a plurality of second connection pads. The second circuit board is located on the back of the second display substrate, and the second connection area of the second circuit board does not overlap the second display substrate. A part of the conductive probe is electrically connected to the first circuit board, is in contact with the first side edge of the first display substrate, extends beyond the top of the first display substrate, and respectively corresponds to the first connection pad, a part of the conductive probe The second circuit board is electrically connected, is in contact with the second side edge of the second display substrate, extends beyond the top of the second display substrate, and respectively corresponds to the second connection pads. The conductive glue connects the conductive probe and the corresponding first connection pad or second connection pad.

In some embodiments, the first circuit board and the second circuit board are connected, the first side edge faces the second side edge, and a part of the conductive probe is electrically connected to the first circuit board and the second circuit board at the same time, and is electrically conductive. A part of the probe corresponds to one of the first connection pads and one of the second connection pads at the same time.

In some embodiments, the first side edge of the first display substrate includes a plurality of first grooves, and each conductive probe is respectively accommodated in a corresponding first groove.

In more detail, in some embodiments, the second side edge of the second display substrate includes a plurality of second grooves, and each conductive probe is respectively accommodated in the corresponding first groove and the second groove.

In some embodiments, the distance between the first side edge and the second side edge is between 0.4 and 1.6 mm.

As described in the foregoing embodiment, the display device can reduce the width of the peripheral area of the display through the assembling method of the conductive probes and the conductive particles in the three-dimensionally distributed conductive glue, and can enlarge the proportion of the display area in the same display substrate size. In addition, for spliced display modules, due to The width of the side area is reduced, which can reduce the influence of the peripheral area on the visual discontinuity when splicing.

1: display device

3: Spliced display module

10: Display unit

11: Display substrate

111: display area

113: Route area

115: connection pad

117: Side Edge

119: Groove

13: The first display unit

15: The first display substrate

151: The first display area

153: First Route Area

155: The first connection pad

155A: The first connection pad

157: first side edge

159: first groove

17: The second display unit

19: Second display substrate

191: Second display area

193: Second Route Area

195: second connection pad

195B: Second connection pad

197: second side edge

199: second groove

20: circuit board

211: Connection Zone

23: The first circuit board

231: First Connection Zone

27: The second circuit board

271: Second Connection Area

30: Conductive probe

30A: Conductive probe

30B: Conductive probe

40: conductive adhesive

P: Surrounding area

T1: thin film transistor

T2: Thin film transistor

Fig. 1 is a cross-sectional view of the first embodiment of the display device.

Fig. 2 is a partial perspective view of the first embodiment of the display device.

Fig. 3 is a partial perspective view of the second embodiment of the display device.

Fig. 4 is a top view of the first embodiment of the spliced display module.

FIG. 5 is a schematic top view of the second embodiment of the spliced display module.

FIG. 6 is a schematic diagram of the control circuit of the second embodiment of the spliced display module.

FIG. 7 is a partial exploded view of the third embodiment of the spliced display module.

FIG. 8 is a partial exploded view of the fourth embodiment of the spliced display module.

It should be understood that when an element is referred to as being "connected" or "disposed" to another element, it can mean that the element is directly on the other element, or there may also be an intermediate element through which the element and another element are connected. On the contrary, when an element is referred to as being “directly on another element” or “directly connected to another element”, it can be understood that at this time, it is clearly defined that there is no intermediate element.

In addition, the terms "first", "second", and "third" are only used to distinguish one element, component, region, or section from another element, component, region, layer or section, rather than indicating Its inevitable sequence. In addition, relative terms such as "under" and "upper" can be used herein to describe the relationship between one element and another element. It should be understood that relative terms are intended to include differences in devices other than the orientation shown in the figure. position. For example, if one If the device in the two figures is turned over, the elements described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. This only represents a relative azimuth relationship, not an absolute azimuth relationship.

Fig. 1 is a cross-sectional view of the first embodiment of the display device. Fig. 2 is a partial perspective view of the first embodiment of the display device. As shown in FIG. 1, the display device 1 includes a display unit 10, a circuit board 20, a plurality of conductive probes 30, and a plurality of conductive adhesives 40. The display unit 10 includes a display substrate 11. The front of the display substrate 11 includes a display area 111 and a circuit area 113. The circuit area 113 is located on the periphery of the display substrate 11, and the display area 111 and the circuit area 113 are not overlapped. The circuit board 20 is located on the back of the display substrate 11, and the connection area 211 of the circuit board 20 does not overlap the display substrate 11. Each conductive probe 30 is disposed on the connection area 211 of the circuit board 20 and is in contact with the side edge 117 of the display substrate 11. As shown in FIG. 2, the circuit board 20 is omitted here, the circuit area 113 has a plurality of connection pads 115, each conductive probe 30 extends beyond the top of the display substrate 11, and each conductive probe 30 corresponds to one of the connection pads 115. The conductive glue 40 connects the conductive probe 30 and the corresponding connection pad 115.

Here, the conductive adhesive 40 is not an anisotropic conductive film (ACF), but can be selected from colloids with highly conductive particles such as silver glue, aluminum glue, graphite glue, etc., which can be used through Surface Mount Technology (Surface Mount Technology, SMT), etc., connect the conductive probe 30 and the corresponding connection pad 115 in a block-like manner. Since there is no need to consider specific directions, the conductive particles in the conductive adhesive 40 can be distributed in three dimensions, so that the conductive probe 30 and the corresponding connection pad 115 can be connected three-dimensionally, thereby reducing the edge of the display area 111 to the connection area of the circuit board 20 The width of the edge of 211 is the width of the peripheral area P of the display device 1.

In actual use, the display substrate 11 includes a hard base material, which can better support the conductive probe 30 and avoid warping which may cause inaccurate electrical connections. Preferably, the rigid substrate comprises Glass or acrylic. In addition, the circuit board 20 may be a rigid circuit board. However, this is only an example, not a limitation.

Fig. 3 is a partial perspective view of the second embodiment of the display device. As shown in Fig. 3 and referring to Fig. 2 at the same time, Fig. 3 also omits the circuit board 20. The second embodiment has substantially the same components as the first embodiment, but the side edge 117 of the display substrate 11 includes a plurality of grooves 119, each The conductive probes 30 are respectively accommodated in the corresponding grooves 119. By accommodating the conductive probe 30 through the space of the groove 119, the width from the edge of the display area 111 to the edge of the connection area 211 of the circuit board 20, that is, the width of the peripheral area P of the display device 1 is further reduced.

In the first and second embodiments, the width from the edge of the display area 111 on the display substrate 11 to the edge of the connection area 211 of the circuit board 20, that is, the width of the peripheral area P of the display device 1 is 0.4 to 1.6 mm Preferably, it is between 0.6 and 1 mm. By effectively reducing the width of the peripheral area P, the ratio of the display area 111 is greatly increased.

Fig. 4 is a top view of the first embodiment of the spliced display module. As shown in FIG. 4 and referring to FIG. 1, the spliced display module 3 includes a first display unit 13, a first circuit board 23, a second display unit 17, a second circuit board 27, a plurality of conductive probes 30, and A plurality of conductive adhesives 40. The first display unit 13 includes a first display substrate 15. The front of the first display substrate 15 includes a first display area 151 and a first circuit area 153, and the first display area 151 and the first circuit area 153 are not overlapped. The wiring area 153 is located on the periphery of the first display substrate 15, and the first wiring area 153 has a plurality of first connection pads 155. The first circuit board 23 is located on the back of the first display substrate 15, and the first connection area 231 of the first circuit board 23 does not overlap with the first display substrate 15. The second display unit 17 is adjacent to the first display unit 13, the second display unit 17 includes a second display substrate 19, the front of the second display substrate 19 includes a second display area 191 and a second circuit area 193, and the second display area 191 And The two circuit regions 193 are not overlapped, the second circuit region 193 is located on the periphery of the second display substrate 19, and the second circuit region 193 has a plurality of second connection pads 195. The second circuit board 27 is located on the back of the second display substrate 19, and the second connection area 271 of the second circuit board 27 does not overlap the second display substrate 19.

A part of the conductive probe 30 is electrically connected to the first circuit board 23, is in contact with the first side edge 157 of the first display substrate 15, and extends beyond the top of the first display substrate 15 and corresponds to the first connection pad 155, respectively , The other part of the conductive probe 30 is electrically connected to the second circuit board 27, is in contact with the second side edge 197 of the second display substrate 19, and extends beyond the top end of the second display substrate 19, and respectively corresponds to the second connection Pad 195. The conductive glue 40 connects the conductive probe 30 and the corresponding first connection pad 155 or second connection pad 195. Similarly, the first circuit board 23 and the second circuit board 27 may also be rigid circuit boards.

1 and 2 at the same time, the first embodiment of the spliced display module 3 is to arrange the conductive probe 30 on the first circuit board 23 and the second circuit board 27, that is, the two first display devices 1. Splicing improves the visual discontinuity problem by reducing the width of the peripheral area P of the display device 1. In this embodiment, the first side edge 157 and the second side edge 197 are located on the same side. However, this is only an example and not for limitation. The first side edge 157 and the second side edge 197 may also be located on opposite sides. , Or located on the same side of the first display substrate 15 and the second display substrate 19.

FIG. 5 is a schematic top view of the second embodiment of the spliced display module. As shown in Figure 5, refer to Figure 4 at the same time. The second embodiment of the spliced display module 3 connects the first circuit board 23 and the second circuit board 27, that is, the electrical functions of the two can be replaced by the circuit board 20. At the same time, the first side edge 157 faces the second side edge 197, a part of the conductive probe 30 is electrically connected to the first circuit board 23 and the second circuit board 27 at the same time, and a part of the conductive probe 30 also corresponds to the first connection One of the pads 155 and one of the second connection pads 195. In other words, the spliced display module of the second embodiment In group 3, a group of conductive probes 30 can be arranged between the first circuit board 23 and the second circuit board 27, the first display unit 13 and the second display unit 17 share a group of conductive probes 30, the conductive probes 30 It can be used for the transmission of actuation signals, control signals, and data signals. Here, through the pin headers of general circuit boards, the effects of easy installation and simple packaging can be achieved. In this way, through the sharing method, two display units can share a peripheral area P, so that the width of the peripheral area P is further reduced, and the vision is more optimized. In more detail, the distance between the first side edge 157 and the second side edge 197 is between 0.4 and 1.6 mm.

FIG. 6 is a schematic diagram of the control circuit of the second embodiment of the spliced display module. As shown in FIG. 6 and referring to FIG. 5 at the same time, the circuit diagram of the second embodiment is used to explain the operation mode of the first display unit 13 and the second display unit 17 sharing a set of conductive probes 30. The conductive probes 30A and 30B at both ends of the conductive probe 30 are only connected to the leftmost first connection pad 155A and the rightmost second connection pad 195B, and the remaining conductive probes 30 are connected to the first connection pad 155 and the second connection pad at the same time. Connecting pad 195. In addition, the remaining first connection pads 155 are provided with first thin film transistors T1, and these thin film transistors T1 are electrically connected to the conductive probe 30A, and the remaining second connection pads 195 are also provided with thin film transistors T2. , The thin film transistors T2 are electrically connected to the conductive probe 30B. The circuit board 20 first transmits the first actuation signal through the conductive probe 30A and the conductive probe 30B to turn on the thin film transistor T1 and at the same time to turn off the thin film transistor T2, and then transmits control signals and data signals through the conductive probe 30A and the first connection The pad 155 drives the first display unit 13, and then transmits a second actuation signal through the conductive probe 30A and the conductive probe 30B to turn on the thin film transistor T2 and simultaneously turn off the thin film transistor T1, and then transmits control signals and data signals through the conductive probe 30A and 30B. The probe 30B and the second connection pad 155 drive the second display unit 17.

Further, although the figure is only for illustration, it is understandable that in more display units When the components are spliced, the circuit board 20, the conductive probe 30, and the conductive glue 40 can be arranged between the display units. Each display unit can be divided into an upper half and a lower half. For example, in FIG. 5, the lower half of the first display unit 13 and the upper half of the second display unit 17 can be set. The circuit board 20 between the display units 17 is driven.

FIG. 7 is a partial exploded view of the third embodiment of the spliced display module. As shown in FIG. 7 and referring to FIG. 5 at the same time, the circuit board 20 and the conductive adhesive 40 are omitted in FIG. 7 and only the differences are emphasized. The third embodiment is based on the second embodiment, and further shows in the first display The first side edge 157 of the substrate 15 forms a plurality of first grooves 159, and each conductive probe 30 is respectively accommodated in the corresponding first groove 159. In this way, the distance between the first side edge 157 and the second side edge 197 can be further reduced.

FIG. 8 is a partial exploded view of the fourth embodiment of the spliced display module. As shown in FIG. 8 and referring to FIG. 7 at the same time, here, the circuit board 20 and the conductive adhesive 40 are omitted in FIG. 8 and only the differences are emphasized. The third embodiment is based on the second embodiment and further displays in the second embodiment. The second side edge 197 of the substrate 19 also forms a plurality of second grooves 199, and each conductive probe 30 is respectively accommodated in the corresponding first groove 159 and the second groove 199. In this way, the distance between the first side edge 157 and the second side edge 197 can be further reduced.

In summary, the display device 1 replaces the flexible circuit board with the conductive probe 30 and the conductive glue 40 in which the conductive particles are three-dimensionally distributed, which can reduce the width of the peripheral area P of the display and enlarge the display area in the same size of the display substrate 11 111 ratio. In addition, for the spliced display module 3, since the width of the peripheral area P or adjacent areas can be reduced during splicing, the influence of the peripheral area P on the visual discontinuity is reduced.

Although the technical content of the present invention has been disclosed in the preferred embodiment as above, it does not It is not intended to limit the present invention. Anyone who is familiar with this technique and makes slight changes and modifications without departing from the spirit of the present invention shall be covered by the scope of the present invention. Therefore, the scope of protection of the present invention shall be regarded as the attached patent application. Those defined by the scope shall prevail.

1: display device

10: Display unit

11: Display substrate

111: display area

113: Route area

115: connection pad

117: Side Edge

20: circuit board

211: Connection Zone

30: Conductive probe

40: conductive adhesive

P: Surrounding area

Claims (12)

A display device includes: a display unit including a display substrate, the front of the display substrate includes a display area and a circuit area, and the display area and the circuit area are not overlapped, and the circuit area is located on a circumference of the display substrate The circuit area has a plurality of connection pads; a circuit board is located on the back of the display substrate, and a connection area of the circuit board does not overlap the display substrate; a plurality of conductive probes, each of the conductive probes is arranged on the On the connection area of the circuit board and in contact with one side edge of the display substrate, and extend beyond the top of the display substrate, wherein each of the conductive probes corresponds to one of the connection pads of the circuit area; and a plurality of Conductive glue connects the conductive probes and the corresponding connection pads. The display device according to claim 1, wherein the display substrate comprises a rigid substrate. The display device according to claim 2, wherein the hard substrate comprises a glass or an acrylic. The display device according to claim 1, wherein the side edge of the display substrate includes a plurality of grooves, and each of the conductive probes is respectively accommodated in the corresponding groove. The display device according to claim 1, wherein a width from an edge of the display area to an edge of the connection area is between 0.4 and 1.6 mm. The display device according to claim 1, wherein the circuit board is a rigid circuit board. A spliced display module, including: A first display unit includes a first display substrate. The front surface of the first display substrate includes a first display area and a first circuit area. The first display area and the first circuit area are not overlapped. A circuit area is located on the periphery of the first display substrate, and the first circuit area has a plurality of first connection pads; a first circuit board is located on the back of the first display substrate, and a first connection of the first circuit board The area does not overlap with the first display substrate; a second display unit, adjacent to the first display unit, includes a second display substrate, and the front side of the second display substrate includes a second display area and a second circuit area, The second display area and the second circuit area are not overlapped, the second circuit area is located on the periphery of the second display substrate, and the second circuit area has a plurality of second connection pads; a second circuit board, Located on the back of the second display substrate, a second connection area of the second circuit board does not overlap the second display substrate; a plurality of conductive probes, a part of the conductive probes is electrically connected to the first circuit board, And contact with a first side edge of the first display substrate, extend beyond the top of the first display substrate, and respectively correspond to one of the first connection pads of the first circuit area, the conductive probes A part of is electrically connected to the second circuit board, is in contact with a second side edge of the second display substrate, extends beyond the top of the second display substrate, and respectively corresponds to the first circuit boards of the second circuit area One of the two connecting pads; and a plurality of conductive glues, connecting the conductive probes and the corresponding first connecting pad or the second connecting pad. The spliced display module according to claim 7, wherein the first circuit board and the second circuit board are connected, the first side edge faces the second side edge, and a part of the conductive probes The first circuit board and the second circuit board are electrically connected at the same time, and a part of the conductive probes corresponds to one of the first connection pads and one of the second connection pads at the same time. The spliced display module according to claim 7 or claim 8, wherein the first side edge of the first display substrate includes a plurality of first grooves, and each of the conductive probes is respectively accommodated in the corresponding first groove In a groove. The spliced display module according to claim 9, wherein the second side edge of the second display substrate includes a plurality of second grooves, and each of the conductive probes is respectively accommodated in the corresponding first groove and The second groove. The spliced display module according to claim 8, wherein the distance between the first side edge and the second side edge is between 0.4 and 1.6 mm. The spliced display module according to claim 7, wherein the first circuit board and the second circuit board are a rigid circuit board.

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