CN113448128B - Array substrate, display panel and display device - Google Patents
Array substrate, display panel and display device Download PDFInfo
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- CN113448128B CN113448128B CN202110707250.9A CN202110707250A CN113448128B CN 113448128 B CN113448128 B CN 113448128B CN 202110707250 A CN202110707250 A CN 202110707250A CN 113448128 B CN113448128 B CN 113448128B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses an array substrate, a display panel and a display device, wherein the array substrate comprises a display part and a fan-out structure, the fan-out structure comprises a fan-out part and a binding part which are connected, the fan-out part comprises a plurality of fan-out leads which are arranged at intervals side by side, the binding part comprises a plurality of binding leads, and the length of the fan-out leads is in an increasing trend in the direction from the middle part of the fan-out part to two sides; each binding lead comprises a metal layer, an insulating layer arranged on the metal layer and a conductive layer arranged on the insulating layer, wherein the insulating layer is provided with a via hole, the conductive layer passes through the via hole to be connected with the metal layer, and one end of the metal layer of each binding lead is correspondingly connected with one end of a fan-out lead; the area of the through holes of the plurality of binding leads is increased from the middle part of the binding part to the two sides. The fan-out structure of the array substrate can solve the technical problem of signal transmission resistance-capacitance hysteresis.
Description
Technical Field
The invention relates to the technical field of display, in particular to an array substrate, a display panel and a display device.
Background
With the development of display technology, in order to improve visual experience, the narrower the border of a display product on the market is, so that the binding area (binding) of the array substrate is reduced, and the space for fan-out (fanout) routing is also limited. When the space of the fan-out wiring is smaller, the length difference of the outermost wiring and the middle wiring of the fan-out wiring can be increased, the resistance of the outermost wiring is larger, the resistance of the innermost wiring is smaller, the resistance difference of the outermost wiring and the middle wiring is increased, and equal impedance cannot be realized. Meanwhile, parasitic capacitance above the outermost one of the fanout wires and the middle one of the fanout wires also has a difference.
The difference between the capacitance and the resistance can cause resistance-capacitance hysteresis (RC delay) of signals transmitted to the data line through the two wirings, so that dark spots (fanout mura) and the like can be generated, and when the display panel is lightened, the difference of uneven regional display can be generated, so that the user experience on the product is affected.
Disclosure of Invention
The invention mainly aims to provide an array substrate, which aims to solve the problem of uneven regional display caused by unequal resistance values of fan-out structures of the array substrate.
In order to achieve the above object, the array substrate provided by the invention comprises a display part and a fan-out structure positioned at one side or two sides of the display part, wherein the fan-out structure is used for electrically connecting a signal transmission interface of a driving circuit and a signal receiving interface of a display panel, the fan-out structure comprises a fan-out part and a binding part which are connected, the fan-out part comprises a plurality of fan-out leads arranged at intervals side by side, the binding part comprises a plurality of binding leads,
the lengths of the fan-out leads tend to increase from the middle part of the fan-out part to the directions of two sides; each binding lead comprises a metal layer, an insulating layer arranged on the metal layer and a conductive layer arranged on the insulating layer, wherein the insulating layer is provided with a via hole, the conductive layer passes through the via hole and is connected with the metal layer, and one end of the metal layer of each binding lead is correspondingly connected with one end of one fan-out lead;
the area of the through holes of the plurality of binding leads is increased from the middle part of the binding part to the two sides.
In an optional embodiment, a plurality of through holes are formed in each bonding wire, the areas of the through holes are the same, and the number of the through holes of the bonding wires is increased from the middle of the bonding part to the directions of two sides.
In an alternative embodiment, the lengths and widths of the plurality of binding wires are the same, and the via interval of each binding wire is uniformly located in the middle of the insulating layer in the length direction.
In an alternative embodiment, the widths of the binding wires are the same, and the lengths of the binding wires are in an increasing trend in the direction from the middle part of the binding part to the two sides.
In an alternative embodiment, the number of the through holes of the plurality of bonding wires is axisymmetrically arranged with a central line in the width direction of the bonding part as an axis.
In an optional embodiment, a plurality of through holes are formed in each bonding wire, the number of the through holes of the bonding wires is the same, and the opening area of the through holes of the bonding wires is increased from the middle part of the bonding part to the directions of two sides.
In an alternative embodiment, the lengths of the binding wires are the same, and the widths of the binding wires are in an increasing trend in the direction from the middle part of the binding part to the two sides.
The invention also provides a display panel which comprises an array substrate, a color film substrate and a liquid crystal layer, wherein the array substrate and the color film substrate are oppositely arranged, the liquid crystal layer is clamped between the array substrate and the color film substrate, and the array substrate is any one of the array substrates.
In an alternative embodiment, the display panel further includes a driving portion, where the driving portion includes a plurality of driving leads, each of the driving leads is electrically connected to each of the binding leads of the fan-out structure, and lengths of the plurality of driving leads are gradually increased from a middle portion of the driving portion to directions of two sides.
The invention also provides a display device, which comprises a backlight module and a display panel, wherein the display panel comprises the array substrate; or alternatively, the first and second heat exchangers may be,
the display panel is any one of the display panels described above.
According to the technical scheme, the array substrate comprises a display part and a fan-out structure, wherein the display part comprises two opposite first sides and two opposite second sides, the fan-out structure is arranged on one first side and/or one second side, the fan-out structure comprises a fan-out part and a binding part, the fan-out part comprises a plurality of fan-out leads arranged at intervals side by side, the binding part comprises a metal layer, an insulating layer and a conducting layer which are sequentially stacked, due to the convergence characteristic of the fan-out structure, the side by side width of one end of the fan-out leads is larger than the side by side width of the other end, the length of the fan-out leads is in an increasing trend from the middle of the fan-out part to the directions of two sides, and the resistance value of the fan-out leads is also in an increasing trend from the middle of the fan-out part to the directions of two sides. At this time, the conducting layer connected with the external driving circuit is electrically connected with the metal layer through the via hole, the opening area of the via hole of the plurality of binding leads is set to be in an increasing trend from the middle part of the binding part to the directions of two sides, so that the contact impedance between the metal layer at the middle part of the binding part and the conducting layer is larger, the contact impedance between the metal layers at the two sides and the conducting layer is smaller, and the resistance value of the fan-out leads is complementary, so that the resistance value of the fan-out structure in the direction from the middle part to the two sides is equal, the time of the signals transmitted to the data lines by external signals is ensured to be the same, the phenomenon of resistance-capacitance hysteresis is avoided, and the regional display uniformity of the array substrate is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an embodiment of an array substrate according to the present invention;
fig. 2 is a schematic structural diagram of a first embodiment of a binding portion in the fan-out structure of the array substrate shown in fig. 1
FIG. 3 is a cross-sectional view taken along line A-A of the binding portion of FIG. 2;
FIG. 4 is a schematic diagram illustrating a second embodiment of a binding portion in the fan-out structure of the display panel shown in FIG. 1;
FIG. 5 is a schematic diagram illustrating a third embodiment of a binding portion in the fan-out structure of the display panel shown in FIG. 1;
FIG. 6 is a schematic diagram of a display panel according to an embodiment of the invention;
fig. 7 is a schematic diagram illustrating a connection structure between the fan-out structure and the driving wires in the display panel shown in fig. 6.
Reference numerals illustrate:
the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The present invention provides an array substrate 100.
Referring to fig. 1 to 3, in the technical solution of the present invention, the array substrate 100 includes a display portion 10 and a fan-out structure 30, the display portion 10 has two opposite first sides 11 and two opposite second sides 13, the fan-out structure 30 is disposed on one of the first sides 11 and/or one of the second sides 13, and is used for electrically connecting a signal transmission interface of a driving circuit and a signal receiving interface of the display panel 100, the fan-out structure 30 includes a fan-out portion 31 and a binding portion 33, the fan-out portion 31 includes a plurality of fan-out wires 311 disposed side by side at intervals, the binding portion 33 includes a plurality of binding wires 331,
the length of the fan-out lead 311 tends to increase from the middle of the fan-out part 31 to the two sides; each bonding wire 331 includes a metal layer 3311, an insulating layer 3313 disposed on the metal layer 3311, and a conductive layer 3317 disposed on the insulating layer 3313, wherein a via 331a is formed in the insulating layer 3313, the conductive layer 3317 passes through the via 331a and is connected to the metal layer 3311, and one end of the metal layer 3311 of each bonding wire 331 is correspondingly connected to one end of the fan-out wire 311;
the area of the via holes 331a of the plurality of bonding wires 331 tends to increase from the middle of the bonding portion 33 to the two sides.
In this embodiment, based on the fact that the array substrate 100 is perpendicular to the surface of the array substrate 100, the array substrate 100 includes a display portion 10 and a fan-out structure 30, wherein the display portion 10 refers to a region of the middle portion of the array substrate 100 capable of displaying images by light, which is generally rectangular, and thus has two opposite first sides 11 and two opposite second sides 13; the fan-out structure 30 is a region located at the peripheral side of the display part 10 for connecting the driving assembly, thereby providing the display part 10 with required picture signals and power. Here, the first side 11 is the scanning line side (Gate side), and the second side 13 is the Data line 20 side (Data side).
When the fan-out structure 30 is located on the first side 11, the plurality of fan-out wires 311 of the fan-out portion 31 are gathered together to bind with the flip-chip film 51 through the plurality of binding wires 331 of the binding portion 33. When the fan-out structure 30 is located on the second side 13, the plurality of fan-out wires 311 of the fan-out portion 31 concentrate the plurality of data lines 20 together, and are bonded with the flip-chip film 51 through the plurality of bonding wires 331 of the bonding portion 33. Of course, the first side 11 and the second side 13 of the display portion 10 may simultaneously distribute the fan-out structures 30, and the number of the fan-out structures 30 located on the first side 11 and the second side 13 may be plural, so that plural flip-chip film pieces 51 are correspondingly connected.
Of course, when the fan-out structure 30 is located on the second side 13, the first side 11 may also be provided with a Gate driving region, and the normal display screen is used by connecting the Gate driving circuits (GDLs), so that the use of a plurality of flip chip films can be omitted, and the cost is effectively reduced.
The fan-out structure 30 includes a binding portion 33 and a fan-out portion 31, where the binding portion 33 is a flip Chip film binding region, and includes a plurality of binding leads 331 arranged in parallel and at intervals, and used for connecting a flip Chip film 51 (COF) and capable of receiving signals from a driving circuit; the fan-out part 31 includes a plurality of fan-out leads 311 arranged at intervals side by side for connecting the data line 20 and the bonding lead 331, or connecting the scan line and the bonding lead 331, so as to transmit signals to the data line 20 or the scan line, thereby realizing driving of liquid crystal and displaying an effective picture.
It will be appreciated that, to facilitate the integration of a plurality of data lines 20 or scan lines arranged in parallel, the flip chip film 51 is conveniently connected, and the number of flip chip film 51 is reduced, each fan-out lead 311 comprises two segments. Here, taking connection with the data line 20 as an example, one end of the fan-out lead 311 is disposed at an obtuse angle with the data line 20, and the other end of the fan-out lead is disposed parallel to the data line 20, so that the side-by-side width of one end of the fan-out lead 311 connected with the data line 20 is greater than the side-by-side width of the other end, and the length of the fan-out lead 311 is increased from the middle of the fan-out portion 31 to the directions of two sides. The increasing trend may be gradually increasing or may be stepwise increasing, and is not limited herein. Here, the direction of the middle of the fan-out 31 to both sides means a direction extending perpendicular to the length of the fan-out lead 311. In order to ensure the stability of transmission, the plurality of binding leads 331 are also arranged as a plurality of line segments parallel to each other, and the binding leads 331 are connected to one end of the fan-out lead 311 in parallel arrangement.
The bonding wire 331 is composed of a multi-layer structure, and includes a glass substrate 3315, a metal layer 3311, an insulating layer 3313, and a conductive layer 3317, wherein the metal layer 3311 may be silver, the insulating layer 3313 may be an insulating material such as silicon dioxide or silicon oxynitride, the conductive layer 3317 may be ITO (indium tin oxide), the conductive layer 3317 is directly connected to the driving circuit, and after receiving a signal, the signal is transferred to the metal layer 3311 through a via 331a, and the metal layer 3311 is connected to the fan-out wire 311, thereby transferring the signal to the fan-out wire 311. The contact resistance of the bonding wire 331 can be determined by the direct contact area of the metal layer 3311 and the conductive layer 3317, i.e., the opening area of the via 331a, and when the flip-chip film sheet 51 is connected to the bonding wire 331 through the conductive layer 3317, the contact resistance with the bonding wire 331 is also determined by the opening area of the via 331 a. The smaller the opening area of the via 331a, the greater the contact resistance between the two. The opening shape of the via 331a may be rectangular, square, circular, or the like, and is not limited herein.
According to the technical scheme of the invention, the fan-out structure 30 comprises a fan-out part 31 and a binding part 33, wherein the fan-out part 31 comprises a plurality of fan-out leads 311 which are arranged side by side at intervals, the binding part 33 comprises a metal layer 3311, an insulating layer 3313 and a conductive layer 3317 which are sequentially stacked, and the resistance of the fan-out leads 311 also tends to increase from the middle part of the fan-out part 31 to the directions of two sides due to the convergence characteristic of the fan-out structure 30. At this time, the conductive layer 3317 connected to the external driving circuit is electrically connected to the metal layer 3311 through the via hole 331a, and the opening area of the via hole 331a of the plurality of bonding wires 331 is set to be increased from the middle of the bonding portion 33 to the directions of two sides, so that the contact resistance between the metal layer 3311 in the middle of the bonding portion 33 and the conductive layer 3317 is relatively large, the contact resistance between the metal layer 3311 on two sides and the conductive layer 3317 is relatively small, and the contact resistance is complementary with the resistance of the fan-out wire 311, so that the resistance of the fan-out structure 30 in the direction from the middle to the two sides is equal, the time of the signals transmitted from the external signal to the data line 20 is ensured to be the same, the phenomenon of resistance-capacitance hysteresis is avoided, and the uniformity of regional display of the display panel 100 is effectively improved.
Referring to fig. 2 and 4, in the concept of the above technical solution, optionally, a plurality of through holes 331a are provided in each of the bonding wires 331, the areas of the plurality of through holes 331a are the same, and the number of through holes 331a in the plurality of bonding wires 331 is increased from the middle of the bonding portion 33 to the two sides.
In this embodiment, in order to ensure connection stability, a plurality of through holes 331a of each bonding wire 331 are provided, that is, a plurality of through holes 331a are provided in the insulating layer 3313, and the plurality of through holes 331a are arranged at intervals along the length direction of the insulating layer 3313, that is, the length direction of the bonding wire 331. The conductive layer 3317 is connected with the metal layer 3311 through a plurality of through holes 331a, so that the contact area is increased, and the overall structural stability of the binding lead 331 is ensured; meanwhile, the contact resistance between the bonding wire 331 and the flip chip film 51 can be changed, so that the resistance becomes smaller. Here, the opening area of the via hole 331a of each bonding wire 331 is set to be the same, and the contact resistance value of the plurality of bonding wires 331 is changed by changing the number of the via holes 331 a. When the number of the through holes 331a of the plurality of binding leads 331 is increased from the middle of the binding portion 33 to two sides, the contact resistance of the binding leads 331 in the middle of the binding portion 33 is larger, and the contact resistance of the binding leads 331 on two sides of the binding portion 33 is smaller, so that the contact resistance is complementary to the resistance of the fan-out leads 311, so that the resistance of the fan-out structure 30 in the direction from the middle to the two sides is equal, the time of the signals transmitted to the data line 20 by external signals is ensured to be the same, and the phenomenon of resistance-capacitance hysteresis is avoided. Meanwhile, the binding lead 331 of the structure is convenient for processing the photomask plate, so that the area of each opening of the photomask plate is equal, and different numbers of through holes 331a can be formed by covering the openings at the corresponding positions.
Referring to fig. 2, a plurality of through holes 331a are formed in each bonding wire 331, the areas of the plurality of through holes 331a are the same, the number of through holes 331a of the plurality of bonding wires 331 is increased from the middle portion of the bonding portion 33 to the two sides, and in the first embodiment of the invention, the lengths and the widths of the plurality of bonding wires 331 are the same, and the intervals of the through holes 331a of each bonding wire 331 are uniformly located at the middle portion of the insulating layer 3313 in the length direction.
In the plurality of bonding wires 331, the areas of the plurality of vias 331a of each bonding wire 331 are the same, and when the number of vias 331a of the plurality of bonding wires 331 is different, the lengths and the widths of the bonding wires 331 may be the same, that is, the extension lengths and the widths of the metal layer 3311, the insulating layer 3313 and the conductive layer 3317 are the same, and when the multi-layer laying is performed, the same photomask may be used to form, so that the processing procedure is simplified, and the processing is convenient. Here, the via holes 331a of each bonding wire 331 are uniformly spaced at the middle of the insulating layer 3313 in the length direction, that is, a relatively regular concentrated via hole 331a structure is formed, so that signal transmission is facilitated.
Of course, in other embodiments, the plurality of vias 331a may be arranged in other forms, for example, uniformly distributed on each bonding wire 331, or distributed at two ends of the bonding wire 331 along the length direction.
Referring to fig. 4, a plurality of through holes 331a are formed in each bonding wire 331, the areas of the plurality of through holes 331a are the same, the number of through holes 331a of the plurality of bonding wires 331 is increased in the direction from the middle portion of the bonding portion 33 to the two sides, and in the second embodiment of the present invention, the widths of the plurality of bonding wires 331 are the same, and the lengths of the plurality of bonding wires 331 are increased in the direction from the middle portion of the bonding portion 33 to the two sides.
In the plurality of bonding wires 331, the areas of the plurality of vias 331a of each bonding wire 331 are the same, and when the number of the vias 331a of the plurality of bonding wires 331 is different, the widths of the bonding wires 331 can be set to be the same, the lengths are different, and according to the number of the vias 331a, the lengths of the bonding wires 331 are correspondingly set, that is, the number of the vias 331a of the bonding wires 331 in the middle of the bonding part 33 is smaller, the corresponding length of the bonding wires 331 at the position is shorter, so that the material of the bonding wires 331 can be saved, and the processing cost is reduced. Here, too, the arrangement of the via holes 331a is not limited, and may be set as needed.
Of course, in other embodiments, when the opening area of the via 331a is smaller than the width of the bonding wire 331, the widths of the plurality of bonding wires 331 may be set to be different, so long as the opening area of the via 331a is not affected.
The number of the through holes 331a of the plurality of bonding wires 331 is axisymmetrically arranged with respect to the center line in the width direction of the bonding portion 33 on the basis of the first and second embodiments.
In general, since the fan-out leads 311 are arranged to be short in the middle of the fan-out portion 31 and the fan-out leads 311 on both sides are long, and the fan-out portion 31 is axially symmetrically arranged with the perpendicular bisectors in the width direction thereof, in this embodiment, the number of the through holes 331a of the plurality of bonding leads 331 is also set to be axially symmetrically arranged with the center line in the width direction of the bonding portion 33 as an axis, so that the resistance of the bonding leads 331 is axially symmetrically arranged with the center line in the width direction of the bonding portion 33 as an axis, and the resistance of the fan-out leads 311 are mutually complemented, thereby further ensuring the equivalent resistance of the fan-out structure 30 and improving the consistency of signal transmission.
Referring to fig. 5, in the technical concept of the present invention, alternatively, a plurality of through holes 331a of each bonding wire 331 are provided, the number of through holes 331a of the plurality of bonding wires 331 is the same, and the opening area of the through holes 331a of the plurality of bonding wires 331 is increased in a direction from the middle of the bonding portion 33 to both sides.
In this embodiment, in order to make the opening areas of the vias 331a of the bonding wires 331 different, the number of the vias 331a of each bonding wire 331 is set to be the same, for example, N, and the contact resistance of the bonding wires 331 is changed by changing the opening area of the via 331 a. The opening area of the via hole 331a of the binding lead 331 at the middle part of the binding part 33 is smaller, and the opening area of the via hole 331a of the binding lead 331 at the two sides of the binding part 33 is larger, so that the contact resistance of the binding lead 331 at the middle part is larger, the contact resistance of the binding leads 331 at the two sides is smaller, the contact resistance of the binding leads 331 at the two sides and the resistance of the fan-out lead 311 of the fan-out part 31 are mutually complemented, the consistency of signal transmission is ensured, the phenomenon of resistance-capacitance hysteresis is avoided, and the regional display uniformity of the display panel 100 is effectively improved.
Here, the opening areas of the plurality of vias 331a on each bonding wire 331 may be the same, so that the opening area of the single via 331a of the bonding wire 331 close to both sides is only required to be ensured to be larger than the opening area of the single via 331a of the bonding wire 331 on the inner side, which is convenient for processing.
Of course, in other embodiments, the opening areas of the plurality of vias 331a on the same bonding wire 331 may be different, and it is only necessary to ensure that the sum of the opening areas of the plurality of vias 331a of the bonding wire 331 in the middle of the bonding portion 33 is smaller than the sum of the opening areas of the plurality of vias 331a of the bonding wire 331 located at the outer side.
Referring to fig. 5, a plurality of through holes 331a of each bonding wire 331 are provided, the number of through holes 331a of each bonding wire 331 is the same, and when the opening area of the through holes 331a of each bonding wire 331 is in a trend of increasing from the middle of the bonding portion 33 to the two sides, in the third embodiment of the invention, the lengths of the bonding wires 331 are the same, and the widths of the bonding wires 331 are in a trend of increasing from the middle of the bonding portion 33 to the two sides.
In this embodiment, when the number of the through holes 331a of each bonding wire 331 is N, the lengths of the plurality of bonding wires 331 may be set to be the same, so as to ensure the interval setting of the through holes 331a and improve the structural stability. At the same time, the width of the bonding wire 331 may be changed, thereby changing the size of the via 331a in the width direction of the bonding wire 331. Taking the opening shape of the via 331a as a rectangle as an example, when the width of the bonding wire 331 in the middle of the bonding portion 33 is smaller, the width of the via 331a formed on the insulating layer 3313 is also smaller, and the width of the bonding wire 331 on both sides of the bonding portion 33 is larger, and the corresponding width of the via 331a is also larger, so that, in the case that the opening area of the via 331a of each bonding wire 331 is the same or different, the opening area of the via 331a of the plurality of bonding wires 331 is increased from the middle of the bonding portion 33 to the directions of both sides, so that the mutual compensation of the resistances with the fan-out portion 31 is ensured, and the signal transmission consistency is improved.
Referring to fig. 1 and 6, the present invention further provides a display panel 300, wherein the display panel 300 includes an array substrate 100 and a color film substrate (not shown) disposed opposite to each other, and a liquid crystal layer (not shown) interposed between the array substrate and the color film substrate, and the array substrate 100 is any one of the array substrates 100 described above. Since the array substrate 100 is the structure of the array substrate in any of the above embodiments, the following description is omitted.
It can be understood that, structurally, in a direction perpendicular to the surface of the display panel 100, the display panel 100 includes an array substrate, a color film substrate, and a liquid crystal layer sandwiched therebetween, and the common electrode of the color film substrate and the pixel electrode of the array substrate form parallel capacitors when the circuits are turned on, so as to drive the liquid crystal molecules together, thereby allowing light to pass therethrough to display a desired image.
Here, since the array substrate and the color film substrate both include the base, the fan-out lead 311 and the binding lead 331 are formed on the base by etching through a photomask, so that the assembly process can be reduced, and the processing efficiency can be improved. Alternatively, the fan-out structure 30 may be provided with a glass substrate 3315 alone, and the glass substrate 3315 is fixedly connected to the substrate of the array substrate.
Referring to fig. 6 and fig. 7 in combination, in an alternative embodiment, the display panel 300 further includes a driving portion 200, where the driving portion 200 includes a plurality of driving wires 203, each driving wire 203 is electrically connected to each bonding wire 331 of the fan-out structure 30, and lengths of the plurality of driving wires 203 are gradually increased from a middle portion of the driving portion 200 to two sides.
In this embodiment, the display panel 300 further includes a driving portion 200, where the driving portion 200 includes a flip chip film 201, i.e. a COF chip and a plurality of driving leads 203 electrically connected to the COF chip, and each driving lead 203 is electrically connected to each bonding lead 331 of the fan-out structure 30, so as to provide necessary driving power and driving signals for the display panel 100, thereby achieving the display of the display portion 10 of the display panel 100. Here, the driving lead 203 and the binding lead 331 are connected through anisotropic conductive adhesive, so that stability of the structure can be ensured, and transmission of an electrical signal can be realized.
Unlike the first, second and third embodiments, when the contact resistance of the bonding wire 331 tends to increase from the middle of the bonding portion 33 to the two sides, the length of the driving wire 203 may be combined, and the contact resistance between the bonding portion 33 and the driving portion 200 may be adjusted by the length of the driving wire 203, and the contact resistance and the fan-out portion 31 may be mutually complemented integrally, so as to achieve uniformity of signal transmission. Here, the length of the driving lead 203 is gradually increased from the middle of the driving portion 200 to the directions of two sides, and the gradually increased trend of the binding lead 331 may be the same or different, so that the sum of the increase of the two and the difference of the resistance value of the fan-out lead 311 are ensured to be mutually complemented, the time of the signal transmitted from the external signal to the data line 20 is ensured to be the same, the phenomenon of resistance-capacitance hysteresis is avoided, and the uniformity of regional display of the display panel 300 is effectively improved.
The present invention also provides a display device (not shown), where the display device includes a display panel 300 and a backlight module, the display panel 300 includes the array substrate 100 according to any one of the embodiments, or the specific structure of the display panel 300 refers to the structure of the display panel 300 according to any one of the embodiments, and since the structure of the display panel 300 of the display device includes the structure of any one of the array substrates 100 or the structure of any one of the display panels 300, the following description will not be repeated.
The backlight module comprises a backlight source, a light guide plate, a light enhancement sheet or a diffusion sheet, wherein the light guide plate can convert a point light source into a uniform surface light source for emitting, the light enhancement sheet can increase the brightness of emitted light, and the diffusion sheet can increase the emitting angle of the emitted light, so that a uniform and stable light source is provided for the display panel 300. The display panel 300 is disposed directly above the backlight module, so as to better receive the outgoing light of the backlight module.
Of course, the display device further includes a frame and other supporting members for fixing the backlight module and the display panel 300, thereby providing a stable supporting base for the display device.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (6)
1. The display panel is characterized by comprising an array substrate and a color film substrate which are oppositely arranged, and a liquid crystal layer which is clamped between the array substrate and the color film substrate, wherein the array substrate comprises a display part, the display part is provided with a first side which is oppositely arranged and a second side which is oppositely arranged, one first side and/or one second side is provided with a fan-out structure which is used for electrically connecting a signal transmission interface of a driving circuit and a signal receiving interface of the array substrate, the fan-out structure comprises a fan-out part and a binding part which are connected, the fan-out part comprises a plurality of fan-out leads which are arranged side by side at intervals, the binding part comprises a plurality of binding leads,
the lengths of the fan-out leads tend to increase from the middle part of the fan-out part to the directions of two sides; each binding lead comprises a metal layer, an insulating layer arranged on the metal layer and a conductive layer arranged on the insulating layer, wherein the insulating layer is provided with a via hole, the conductive layer passes through the via hole and is connected with the metal layer, and one end of the metal layer of each binding lead is correspondingly connected with one end of one fan-out lead;
the opening areas of the through holes of the plurality of binding leads are in an increasing trend in the direction from the middle part of the binding part to the two sides;
the widths of the binding leads are the same, and the lengths of the binding leads are in an increasing trend in the direction from the middle part of the binding part to the two sides;
or the lengths of the binding leads are the same, and the widths of the binding leads are in an increasing trend in the direction from the middle part of the binding part to the two sides;
the display panel further comprises a driving part, wherein the driving part comprises a plurality of driving leads, each driving lead is electrically connected with each binding lead of the fan-out structure, and the lengths of the driving leads gradually increase from the middle part of the driving part to the directions of two sides; the sum of the increasing trend and the increasing trend of the binding wire is complementary to the difference of the resistance values of the fan-out wires, so that the time of the signal transmitted to the data line by the external signal is the same.
2. The display panel of claim 1, wherein a plurality of through holes are formed in each of the bonding wires, the plurality of through holes have the same area, and the number of through holes of the plurality of bonding wires increases from the middle of the bonding portion to the two sides.
3. The display panel of claim 2, wherein the plurality of bonding wires have the same length and width, and the via interval of each bonding wire is uniformly located at the middle of the insulating layer in the length direction.
4. A display panel according to any one of claims 2 to 3, wherein the number of the through holes of the plurality of bonding wires is axisymmetrically arranged with respect to a center line in the width direction of the bonding portion.
5. The display panel of claim 1, wherein a plurality of through holes are formed in each of the bonding wires, the plurality of through holes are the same in number, and opening areas of the plurality of through holes of the bonding wires are increased in a direction from a middle portion of the bonding portion to both sides.
6. A display device comprising a backlight module and a display panel, wherein the display panel is the display panel according to any one of claims 1 to 5.
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| CN100412658C (en) * | 2005-09-07 | 2008-08-20 | 中华映管股份有限公司 | Display and crystal coated glass package structure |
| CN104142588B (en) * | 2014-07-30 | 2017-01-25 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and liquid crystal display |
| CN208077535U (en) * | 2018-04-28 | 2018-11-09 | 京东方科技集团股份有限公司 | A kind of flexible display panels and flexible display apparatus |
| CN209471322U (en) * | 2018-12-12 | 2019-10-08 | 惠科股份有限公司 | A kind of display panel and display device |
| CN110333633B (en) * | 2019-05-29 | 2022-01-25 | 重庆惠科金渝光电科技有限公司 | Array substrate and display panel |
| CN210323694U (en) * | 2019-06-11 | 2020-04-14 | 重庆惠科金渝光电科技有限公司 | Display panel's drive module and display device |
| CN210323695U (en) * | 2019-06-11 | 2020-04-14 | 滁州惠科光电科技有限公司 | Display panel and display device |
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