TWI720356B - 電磁波屏蔽膜及屏蔽印刷配線板 - Google Patents

電磁波屏蔽膜及屏蔽印刷配線板 Download PDF

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Publication number
TWI720356B
TWI720356B TW107137515A TW107137515A TWI720356B TW I720356 B TWI720356 B TW I720356B TW 107137515 A TW107137515 A TW 107137515A TW 107137515 A TW107137515 A TW 107137515A TW I720356 B TWI720356 B TW I720356B
Authority
TW
Taiwan
Prior art keywords
electromagnetic wave
wave shielding
shielding film
adhesive layer
film
Prior art date
Application number
TW107137515A
Other languages
English (en)
Chinese (zh)
Other versions
TW201940021A (zh
Inventor
高見晃司
渡邊正博
上農憲治
Original Assignee
日商拓自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW201940021A publication Critical patent/TW201940021A/zh
Application granted granted Critical
Publication of TWI720356B publication Critical patent/TWI720356B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
TW107137515A 2018-03-15 2018-10-24 電磁波屏蔽膜及屏蔽印刷配線板 TWI720356B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-048087 2018-03-15
JP2018048087A JP6714631B2 (ja) 2018-03-15 2018-03-15 電磁波シールドフィルム及びシールドプリント配線板

Publications (2)

Publication Number Publication Date
TW201940021A TW201940021A (zh) 2019-10-01
TWI720356B true TWI720356B (zh) 2021-03-01

Family

ID=67959016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107137515A TWI720356B (zh) 2018-03-15 2018-10-24 電磁波屏蔽膜及屏蔽印刷配線板

Country Status (4)

Country Link
JP (1) JP6714631B2 (ja)
KR (1) KR102423541B1 (ja)
CN (1) CN110278701A (ja)
TW (1) TWI720356B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI815049B (zh) * 2019-12-03 2023-09-11 日商拓自達電線股份有限公司 電磁波屏蔽膜
TWI829973B (zh) * 2020-02-25 2024-01-21 日商拓自達電線股份有限公司 電磁波屏蔽膜

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4201548B2 (ja) * 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2013193253A (ja) * 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
JP2013195997A (ja) * 2012-03-23 2013-09-30 Fujifilm Corp 複層フィルム及び光学シート
TW201518471A (zh) * 2013-11-07 2015-05-16 Toyo Ink Sc Holdings Co Ltd 導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法
TW201805389A (zh) * 2016-05-23 2018-02-16 拓自達電線股份有限公司 導電性接著劑組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223045A (ja) * 1998-11-27 2000-08-11 Matsushita Electronics Industry Corp 陰極線管内蔵抵抗体および陰極線管
JP2001031943A (ja) * 1999-07-26 2001-02-06 Tomoegawa Paper Co Ltd 半導体用接着剤及び半導体用接着テープ
JPWO2008133293A1 (ja) * 2007-04-25 2010-07-29 日立化成工業株式会社 接着シート
JP2013145790A (ja) * 2012-01-13 2013-07-25 Hitachi Chemical Co Ltd 屈曲配線板、部品実装屈曲配線板及びそれに用いる金属層付絶縁層
JP6061470B2 (ja) * 2012-01-20 2017-01-18 旭化成株式会社 フレキシブル配線板
JP2017024246A (ja) * 2015-07-21 2017-02-02 武藤工業株式会社 複合樹脂材料
JP6694763B2 (ja) * 2016-06-08 2020-05-20 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4201548B2 (ja) * 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2013193253A (ja) * 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
JP2013195997A (ja) * 2012-03-23 2013-09-30 Fujifilm Corp 複層フィルム及び光学シート
TW201518471A (zh) * 2013-11-07 2015-05-16 Toyo Ink Sc Holdings Co Ltd 導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法
TW201805389A (zh) * 2016-05-23 2018-02-16 拓自達電線股份有限公司 導電性接著劑組成物

Also Published As

Publication number Publication date
KR20190109302A (ko) 2019-09-25
JP6714631B2 (ja) 2020-06-24
JP2019161101A (ja) 2019-09-19
CN110278701A (zh) 2019-09-24
KR102423541B1 (ko) 2022-07-20
TW201940021A (zh) 2019-10-01

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