TWI719221B - Light emitting device and method of manufacturing the light emitting device - Google Patents

Light emitting device and method of manufacturing the light emitting device Download PDF

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TWI719221B
TWI719221B TW106119759A TW106119759A TWI719221B TW I719221 B TWI719221 B TW I719221B TW 106119759 A TW106119759 A TW 106119759A TW 106119759 A TW106119759 A TW 106119759A TW I719221 B TWI719221 B TW I719221B
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light
emitting device
manufacturing
base material
emitting element
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TW201803082A (en
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高橋続
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日商日亞化學工業股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Abstract

A method of manufacturing a light emitting device includes: providing a substantially flat plate-shaped base member which in plan view includes at least one first portion having an upper surface, and a second portion surrounding the at least one first portion and having inner lateral surfaces; mounting at least one light emitting element on the at least one first portion; shifting a relative positional relationship between the at least one first portion and the second portion in an upper-lower direction to form at least one recess defined by an upper surface of the at least one first portion that serves as a bottom surface of the at least one recess and at least portions of the inner lateral surfaces of the second portion that serve as lateral surfaces of the at least one recess; and bonding the at least one first portion and the second portion with each other.

Description

發光裝置及其製造方法Light emitting device and manufacturing method thereof

本發明係關於一種發光裝置及其製造方法。The present invention relates to a light-emitting device and a manufacturing method thereof.

使用LED(Light Emitting Diode，發光二極體)等發光元件之發光裝置亦有可容易地獲得較高之發光效率之情況，於顯示器等之背光源以及照明裝置等諸多機器中使用。為了實現發光裝置之小型化，已知有於安裝發光元件後形成包圍發光元件之光反射性樹脂之發光裝置之製造方法。例如，提出有如下之發光二極體之製造方法，該製造方法包括：第1步驟，其利用透光性樹脂覆蓋基板上之LED元件；第2步驟，其於透光性樹脂硬化後將LED元件之中間部之透光性樹脂去除；第3步驟，其於藉由第2步驟形成之槽部填充光反射性樹脂；以及第4步驟，其於光反射性樹脂硬化後，以於LED元件之周圍保留光反射性樹脂之方式將基板切斷而分離成各發光二極體(參照專利文獻1)。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2002-368281號公報Light-emitting devices that use light-emitting elements such as LEDs (Light Emitting Diodes) can also easily obtain higher luminous efficiency, and are used in backlight sources such as displays and lighting devices. In order to realize the miniaturization of the light-emitting device, a method of manufacturing the light-emitting device in which a light reflective resin surrounding the light-emitting device is formed after mounting the light-emitting device is known. For example, the following method of manufacturing a light-emitting diode is proposed. The manufacturing method includes: a first step of covering the LED element on a substrate with a translucent resin; a second step of curing the LED after the translucent resin is hardened The light-transmitting resin in the middle part of the device is removed; the third step is to fill the groove formed by the second step with a light-reflective resin; and the fourth step is to apply the light-reflective resin to the LED device after the light-reflective resin is cured The substrate is cut and separated into light-emitting diodes by leaving the light-reflective resin around it (see Patent Document 1). [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2002-368281

[發明所欲解決之問題] 於上述製造方法中，於安裝發光元件後形成包圍發光元件之光反射性樹脂，但若光反射性樹脂之黏度變高，則為了使該樹脂遍佈槽部之各個角落而要花費時間，因此，有作業效率降低之虞。因此，本發明之目的在於提供一種可有效率地製造具有能夠小型化之構成之發光裝置之製造方法、以及能夠輕量化之發光裝置。 [解決問題之技術手段] 本發明之發光裝置之製造方法具有如下步驟：準備俯視時具有第1部以及包圍上述第1部之第2部的平板狀之母材；於上述第1部安裝發光元件；於安裝上述發光元件後，使上述第1部與上述第2部之上下方向上之相對位置關係偏移，而形成將上述第1部之上表面作為底面並將上述第2部之側面之至少一部分作為內側面之凹部；以及將上述第1部與上述第2部接合。 一種發光裝置，其具備：母材，其具有第1部以及具備供上述第1部嵌合之大小之貫通孔之第2部，且具有將上述第1部之上表面作為底面並將上述第2部之側面之至少一部分作為內側面之凹部；以及發光元件，其安裝於上述凹部之底面。 [發明之效果] 根據上述製造方法，可有效率地製造具有能夠小型化之構成之發光裝置。又，根據上述發光裝置，可實現發光裝置之輕量化。[Problem to be Solved by the Invention] In the above-mentioned manufacturing method, the light-reflective resin surrounding the light-emitting element is formed after mounting the light-emitting element. However, if the viscosity of the light-reflective resin becomes higher, it is necessary to spread the resin over each of the grooves. It takes time for corners, so there is a risk of reduced work efficiency. Therefore, an object of the present invention is to provide a method for efficiently manufacturing a light-emitting device having a structure capable of being miniaturized, and a light-emitting device that can be lightened in weight. [Technical Means for Solving the Problem] The method of manufacturing a light-emitting device of the present invention has the following steps: preparing a flat base material having a first part and a second part surrounding the first part when viewed from above; and mounting the light emitting on the first part Element; After mounting the light-emitting element, the relative positional relationship between the first part and the second part in the upper and lower directions is shifted to form the upper surface of the first part as the bottom surface and the side surface of the second part At least a part thereof is used as a recessed portion on the inner surface; and the first portion and the second portion are joined. A light-emitting device comprising: a base material having a first part and a second part having a through hole of a size for fitting the first part, and having an upper surface of the first part as a bottom surface and the first part At least a part of the side surfaces of the two parts serves as a concave part of the inner surface; and a light emitting element mounted on the bottom surface of the concave part. [Effects of the Invention] According to the above-mentioned manufacturing method, a light-emitting device having a structure capable of being miniaturized can be efficiently manufactured. Furthermore, according to the above-mentioned light-emitting device, the light-emitting device can be reduced in weight.

[實施形態1之發光裝置1之製造方法] 圖1A至圖1G係對實施形態1之發光裝置1之製造方法進行說明之模式圖。圖1A與圖1E係俯視圖，圖1B至圖1D、圖1F、以及圖1G係剖視圖。圖1C至圖1D、圖1F、以及圖1G中之觀察剖視圖之方向與圖1B中之觀察剖視圖之方向相同。如圖1A至圖1G所示，實施形態1之發光裝置1之製造方法具有如下步驟：準備俯視時具有第1部12以及包圍第1部12之第2部14的平板狀之母材10；於第1部12安裝發光元件30；於安裝發光元件30後，使第1部12與第2部14之上下方向上之相對位置關係偏移，而形成將第1部12之上表面作為底面Y1並將第2部14之側面之至少一部分作為內側面Y2之凹部Y；以及將第1部12與第2部14接合。以下，對各步驟進行說明。 (準備母材10之步驟) 首先，如圖1A與圖1B所示，準備平板狀之母材10。母材10具有第1部12與第2部14。第2部14具有貫通孔X。第1部12嵌合於貫通孔X，且於俯視時，第2部14設置為包圍第1部12。於圖1B中，示出僅於第2部14所具有之2個貫通孔X之一者嵌合有第1部12而於另一者未嵌合有第1部12的情況，但此係為了容易理解第2部14具有貫通孔X，實際上，於另一貫通孔X亦嵌合有第1部12。 對於本步驟，可包括準備將預先分離之第1部12與第2部14嵌合而成之平板狀之母材10之步驟，亦可代替該步驟，而包括準備第1部與第2部不分離之母材之步驟。於採用後者之步驟之情形時，例如，於本步驟與下述之安裝發光元件之步驟之間，即，於藉由本步驟準備母材之後且安裝發光元件之前，進行使第1部自母材分離之步驟、以及使第1部嵌合於藉由第1部之分離而產生之貫通孔之步驟即可。或者，如下述之實施形態2、3中說明般，於安裝發光元件之步驟與形成凹部之步驟之間，即，於安裝發光元件之後且形成凹部之前，進行使第1部自母材分離之步驟即可。使第1部自母材分離之步驟例如可藉由基於衝壓之沖裁、雷射加工、刀片加工等公知之方法而進行。 作為母材10之材料，可使用絕緣性材料。例如，可列舉陶瓷、樹脂、衍生物、紙漿、玻璃、或者複合材料等。作為樹脂，只要為該領域中使用之樹脂則可使用任意樹脂。具體而言，可列舉環氧樹脂、三嗪衍生物環氧樹脂、改性環氧樹脂、矽酮樹脂、改性矽酮樹脂、丙烯酸酯樹脂、聚胺酯樹脂等。作為陶瓷，可列舉包含氧化鋁、氮化鋁、氧化鋯、氧化鈦、氮化鈦或該等之混合物者。作為複合材料，可列舉複合樹脂、或者將上述陶瓷等材料與金屬或碳等複合而成者等。又，作為複合材料，亦可使用利用樹脂等絕緣物被覆金屬而成者。作為複合樹脂，可列舉玻璃環氧樹脂等。 母材10較佳為具有較高之光反射率。如下所述，發光元件30安裝於第1部12之上表面，且第2部14之側面之至少一部分配置為包圍發光元件30之內側面Y2。因此，若提高母材10之光反射率，則可容易地提高收容發光元件30之凹部Y之光反射率。作為母材10具有較高之光反射率之情形，除如使用陶瓷或樹脂等作為母材之情形般母材10之材料本身具有較高之光反射率之情形以外，還包括藉由使母材10之材料含有光反射性物質而使母材10具有較高之光反射性之情形。作為光反射性物質，例如可列舉氧化鈦、氧化矽、氧化鋯、鈦酸鉀、氧化鋁、氮化鋁、氮化硼、莫來石、玻璃填料等。 母材10通常於其表面具有與發光元件30電性連接之導體配線20。導體配線20例如可由銅、鋁、金、銀、鉑、鈦、鎢、鈀、鐵、鎳等金屬或者包含該等之合金等形成。導體配線20至少配置於母材10之表面即可，亦可經由母材內部之孔等而配置於母材之背面。 (安裝發光元件30之步驟) 繼而，如圖1C所示，於第1部12之上表面安裝發光元件30。具體而言，發光元件30安裝於配置於第1部12之導體配線20上。第1部12作為安裝發光元件30之元件安裝部而發揮功能。再者，1個第1部12上安裝之發光元件30之數量可如圖1C所示般為1個，亦可為複數個。於安裝發光元件30之步驟中，收容發光元件30之凹部Y尚未形成，而第1部12之上表面與第2部14之上表面之上下方向上之相對位置關係處於位於大致同一平面上、即母材10具有平面狀之形狀之位置關係。 發光元件30與導體配線20之電性連接例如可藉由覆晶方式或打線接合方式等而進行。此處，設為利用打線接合方式者。於利用打線接合之情形時，安裝發光元件30之步驟包括利用金屬線50將發光元件30與母材10連接之步驟。利用金屬線50將發光元件30與母材10連接係指使用金屬線50將設置於母材10之導體配線20與發光元件30之一對電極之至少一者相互電性連接。金屬線50只要為可將發光元件30之電極與母材10之導體配線20相互電性連接之構件即可，例如可列舉使用金、銀、銅、鉑、鋁等金屬、以及該等之合金者。 發光元件30可使用發光二極體等半導體發光元件。對於發光元件30，可根據目的適當選擇使用發光波長處於自紫外區域至紅外區域之間之任意區域之發光元件。可使用於藍寶石基板或GaN基板等成長用基板上藉由氮化物半導體(例：InN、AlN、GaN、InGaN、AlGaN、InGaAlN)、III-V族化合物半導體、II-VI族化合物半導體等各種半導體等而形成有包含發光層之積層構造者作為發光元件30。發光元件30例如可將正負一對電極設於同一面側，亦可將正負一對電極分別設於對向之面。此處，發光元件30將正負一對電極設於同一面側，且兩電極藉由金屬線50而接合於導體配線20。 (形成凹部Y之步驟) 繼而，如圖1D所示，使第1部12與第2部14之上下方向上之相對位置關係偏移，而形成將第1部12之上表面作為底面Y1並將第2部14之側面之至少一部分作為內側面Y2之凹部Y。即，於安裝發光元件30後形成凹部Y。藉此，第2部14之至少一部分配置為收容發光元件30之凹部Y之內側面Y2。使第1部12與第2部14之上下方向上之相對位置關係偏移係指第1部12與第2部14之上下方向上之相對位置關係自母材10具有平面狀之形狀之狀態、即自第1部12之上表面與第2部14之上表面位於大致同一平面上之狀態偏移後之狀態。此處，大致同一平面係指構成第1部12之上表面之平面與構成第2部14之上表面之平面之高低差為±100 μm以內之範圍。 第1部12與第2部14之上下方向上之相對位置關係可藉由使第1部12及/或第2部14於與第1部12及第2部14之上表面垂直之方向上移動而偏移。即，相對位置關係(1)可藉由在將第1部固定之狀態下使第2部相較第1部向上方向移動而偏移，(2)亦可藉由在將第2部固定之狀態下使第1部相較第2部向下方向移動而偏移，(3)還可藉由使第1部相較第2部向下方向移動且使第2部相較第1部向上方向移動而偏移。第1部及/或第2部之固定及移動可採用公知之方法。例如，可列舉使用治具或模具之固定及移動。 (將第1部12與第2部14接合之步驟) 繼而，如圖1E及圖1F所示，於第1部12與第2部14之上下方向上之相對位置關係偏移後之狀態下，將第1部12與第2部14接合。具體而言，例如，可藉由將密封構件40填充於凹部Y而將第1部12與第2部14接合。即，密封構件40係用於藉由覆蓋發光元件30及金屬線50而保護發光元件30及金屬線50不受塵埃、水分、外力等影響之構件，此處，密封構件40亦可用作用於將第1部12與第2部14接合之接合構件。 密封構件40較佳為使用使發光元件30之光透過之材料之構件。作為具體之材料，例如可列舉矽酮樹脂或環氧樹脂等樹脂材料。又，除此種材料以外，可根據要求含有著色材料或光擴散劑等填料。 密封構件40亦可含有螢光體，該螢光體吸收來自發光元件30之光之至少一部分並發出不同波長之光。作為螢光體之具體之材料，例如於使用藍色發光元件或者紫外線發光元件作為發光元件30之情形時，作為可利用該等發光元件激發之螢光體，可列舉由鈰活化之釔•鋁•石榴石系螢光體(YAG：Ce)、由鈰活化之鎦•鋁•石榴石系螢光體(LAG：Ce)、由銪及/或鉻活化之含氮鋁矽酸鈣系螢光體(CaO-Al2 O3 -SiO2 ：Eu)、由銪活化之矽酸鹽系螢光體((Sr, Ba)2 SiO4 ：Eu)、β賽隆螢光體、CASN系螢光體、SCASN系螢光體等氮化物系螢光體、KSF系螢光體(K2 SiF6 ：Mn)、硫化物系螢光體、量子點螢光體等。可藉由該等螢光體與藍色發光元件或紫外線發光元件之組合而獲得所期望之發光顏色之發光裝置(例如白色系之發光裝置)。 將第1部12與第2部14接合之步驟亦可包括如下步驟：於填充密封構件40前，利用填隙材或密封材填埋第1部12與第2部14之間之間隙。作為填隙材或密封材，可使用樹脂、玻璃、陶瓷、金屬等。藉由將第1部12與第2部14接合之步驟包括填埋第1部12與第2部14之間之間隙之步驟、以及於凹部Y填充密封構件40之步驟該2個步驟，而可進一步提高第1部12與第2部14之接合強度。又，可減少密封構件40自第1部12與第2部14之間之間隙洩漏之可能性。 (切斷之步驟) 亦可如圖1G所示，於將第1部12與第2部14接合後，以第2部14之至少一部分側面作為凹部Y之內側面Y2而保留之方式，將第2部14切斷。藉由進行此種切斷，可將1個發光裝置1之尺寸加工成所期望之尺寸。又，可將1個發光裝置1所具有之發光部(即凹部Y)之數量設為所期望之數量。切斷可使用刀片或雷射等。再者，1個發光裝置1所具有之凹部Y之數量可為1個，亦可為複數個。此處，設為凹部Y之數量為1個。再者，於1個發光裝置具有複數個凹部之情形時，本步驟之切斷並非必須進行。即，可進行切斷而將各發光裝置設為具備複數個發光部(凹部)者，亦可不進行切斷而以1個發光裝置具有母材所具有之複數個凹部之全部之狀態形成具有複數個發光部(凹部)之1個發光裝置。 如以上所說明般，根據本實施形態之發光裝置1之製造方法，於載置發光元件30之步驟後，進行形成收納發光元件30之凹部Y之步驟。即，於將發光元件30安裝於平板狀之母材10後，形成包圍發光元件30之內側面Y2。因此，與於預先形成有凹部之母材之底面配置發光元件之情形相比，可拉近發光元件30與凹部Y之內側面Y2之間之距離。即，通常於在凹部之底面安裝發光元件之情形時，即便欲將發光元件以接近凹部之內側面之方式安裝，亦有發光元件之安裝中使用之晶片夾等黏晶工具與凹部之內側面接觸之可能性，因此，必須於發光元件與凹部之內側面之間隔開固定之距離。然而，根據本實施形態之發光裝置1之製造方法，與於預先形成之凹部之底面配置發光元件之情形相比，可縮短發光元件30與凹部Y之內側面Y2之距離，因此，可有效率地製造具有能夠小型化之構成之發光裝置1。 [實施形態2之發光裝置2之製造方法] 圖2A至圖2G係對實施形態2之發光裝置2之製造方法進行說明之模式圖。圖2A係俯視圖，圖2B至圖2G係剖視圖。圖2C至圖2G中之觀察剖視圖之方向與圖2B中之觀察剖視圖之方向相同。實施形態2之發光裝置2之製造方法與實施形態1之發光裝置1之製造方法之不同之處在於，於載置發光元件30之步驟(參照圖2C)與形成凹部Y之步驟(參照圖2E)之間，具有使第1部12自母材10分離之步驟(參照圖2D)。第1部12自母材10之分離例如可藉由沿著第1部12之外周照射雷射，而以將第1部12自母材10中挖出之方式進行。雷射加工由於因切斷引起之應力之影響較小，故而適用於在第1部12安裝有發光元件30之狀態下的使第1部12自母材10分離之方法。其他方面具有與實施形態1之發光裝置1之製造方法相同之步驟。 根據實施形態2之發光裝置2之製造方法，亦與實施形態1之發光裝置1之製造方法同樣地，於將發光元件30安裝於平板狀之母材10後形成收容發光元件30之凹部Y，因此，可將發光元件30以接近凹部Y之內側面Y2之方式安裝。因此，根據實施形態2之發光裝置2之製造方法，亦可有效率地製造能夠小型化之發光裝置2。 [實施形態3之發光裝置3之製造方法] 圖3A至圖3G係對實施形態3之發光裝置3之製造方法進行說明之模式圖。圖3A係俯視圖，圖3B至圖3G係剖視圖。圖3C至圖3G中之觀察剖視圖之方向與圖3B中之觀察剖視圖之方向相同。如圖3A至圖3G所示，實施形態3之發光裝置3之製造方法與實施形態2之發光裝置2之製造方法之不同之處在於，凹部Y之內側面Y2係傾斜面。其他方面具有與實施形態2之發光裝置2之製造方法相同之步驟。 根據實施形態3之發光裝置3之製造方法，亦與實施形態1之發光裝置1之製造方法同樣地，於將發光元件30安裝於平板狀之母材10後形成收容發光元件30之凹部Y，因此，可將發光元件30以接近凹部Y之內側面Y2之方式安裝。因此，根據實施形態3之發光裝置3之製造方法，亦可有效率地製造能夠小型化之發光裝置3。 又，根據實施形態3之發光裝置3之製造方法，藉由調整第1部12與第2部14之間之寬度W以及內側面Y2之傾斜角度D，可於使第1部12與第2部14之上下方向上之相對位置關係偏移後之狀態下，使第1部12與第2部14之貫通孔X匹配，從而利用第2部14保持第1部12。因此，根據實施形態3之發光裝置3之製造方法，於形成凹部Y之步驟中可更容易地形成凹部Y。 藉由在第1部12保持於第2部14之貫通孔X之狀態下，進一步將例如第1部12向第2部14按壓等、對第1部12、第2部14、或者第1部12以及第2部14施加壓力或熱，而第1部12與第2部14更牢固地密接，可使第1部12與第2部14不經由密封構件40而接合。藉由不經由密封構件40而將第1部12與第2部14接合，而可不考慮密封構件40之劣化或洩漏。 [實施形態4之發光裝置4之製造方法] 圖4A至圖4H係對實施形態4之發光裝置4之製造方法進行說明之模式圖。圖4A與圖4F係俯視圖，圖4B至圖4E、圖4G、以及圖4H係剖視圖。圖4C至圖4E、圖4G、以及圖4H中之觀察剖視圖之方向與圖4B中之觀察剖視圖之方向相同。實施形態4之發光裝置4之製造方法與實施形態1之發光裝置1之製造方法之不同之處在於，作為將第1部12與第2部14接合之步驟，具有於填充密封構件40前配置光反射性構件60之步驟，該光反射性構件60被覆凹部Y之底面Y1以及內側面Y2各自之至少一部分(參照圖4E)。其他方面具有與實施形態1之發光裝置1之製造方法相同之步驟。 於本實施形態中，凹部Y之底面Y1以及內側面Y2各自之整面由光反射性構件60被覆，但如上所述，光反射性構件只要被覆凹部之底面以及內側面各自之至少一部分即可。再者，於凹部Y之底面Y1以及內側面Y2各自之整面由光反射性構件60被覆之情形時，密封構件40不與第1部12以及第2部14接觸。密封構件40並非必須與第1部12以及第2部14接觸，亦可經由如光反射性構件60般之其他構件而連接。 根據實施形態4之發光裝置4之製造方法，亦與實施形態1之發光裝置1之製造方法同樣地，於將發光元件30安裝於平板狀之母材10後形成收容發光元件30之凹部Y，因此，可將發光元件30以接近凹部Y之內側面Y2之方式安裝。進而，將第1部12與第2部14接合之步驟包括配置被覆凹部Y之底面Y1以及內側面Y2各自之至少一部分之光反射性構件60之步驟、以及於凹部Y填充密封構件40之步驟該2個步驟，藉此，可進一步提高第1部12與第2部14之接合強度。 又，根據實施形態4之發光裝置4之製造方法，凹部Y之內側面Y2之至少一部分由光反射性構件60被覆，因此自內側面Y2之漏光減少。因此，藉由使俯視時之第2部14之寬度變薄，而可製造能夠進一步小型化之發光裝置4。 又，根據實施形態4之發光裝置4之製造方法，於形成凹部Y後，於凹部Y之內側面Y2配置光反射性構件60，因此，可進一步提高發光元件30之周圍之反射率。因此，根據實施形態4之發光裝置4之製造方法，可獲得光提取效率更優異之發光裝置4。 光反射性構件60由能夠反射自發光元件30出射之光之材料形成。具體而言，光反射性構件60較佳為由含有光反射性物質之樹脂構件形成。其原因在於樹脂構件之處理以及加工較為容易。作為樹脂構件，例如可使用包含矽酮樹脂、改性矽酮樹脂、環氧樹脂、改性環氧樹脂、丙烯酸系樹脂中之1種以上之樹脂或者包含該等中之2種以上之混成樹脂等。作為光反射性物質，可列舉氧化鈦、氧化矽、氧化鋯、鈦酸鉀、氧化鋁、氮化鋁、氮化硼、莫來石、玻璃填料等。 光反射性構件60可於形成凹部Y後，藉由印刷、噴射、灌注等公知之方法而形成。其中，較佳為藉由灌注而形成。再者，如上所述，第1部12與第2部14之間之間隙可利用填隙材或密封材等填埋，藉由使該等構件含有光反射性物質，亦可將該等構件用作光反射性構件。當然，亦可如本實施形態般，除填隙材或密封材等以外另外設置光反射性構件60。 [實施形態1－4之發光裝置1－4] 其次，對實施形態1－4之發光裝置1－4進行說明。發光裝置1－4可利用實施形態1－4之發光裝置之製造方法有效率地製造，但亦可利用其他製造方法製造。 首先，對實施形態1、2之發光裝置1、2進行說明。如圖1G、圖2G所示，發光裝置1、2具有母材10與發光元件30。母材10具有第1部12以及具備供第1部12嵌合之大小之貫通孔X之第2部14。即，第2部14具有俯視時與第1部12相同之大小、或者比第1部12大一圈之區域之貫通孔X。第1部12呈大致柱體形狀，具有上表面、與上表面平行之下表面、以及與上表面和下表面相接之側面，且下表面與側面大致正交。於本實施形態中，第1部12之上表面以及下表面呈角部帶弧度之大致長方形狀，但亦可呈大致圓形、大致橢圓形、大致多邊形等。 母材10具有凹部Y，該凹部Y將第1部12之上表面作為底面並將第2部14之側面(具體而言為貫通孔X之側面)之至少一部分作為內側面。凹部Y具有與底面(即，第1部12之上表面)大致垂直之內側面(即，第2部14之側面)。發光元件30安裝於第1部12之上表面(即，凹部Y之底面)。發光裝置1、2具有能夠小型化之構成。因此，根據發光裝置1、2，可使發光裝置小型化而實現其輕量化。 其次，對實施形態3之發光裝置3進行說明。如圖3G所示，發光裝置3與實施形態1、2之發光裝置1、2之不同之處在於，凹部Y之內側面係傾斜面。於實施形態3之發光裝置3中，第1部12亦嵌合於第2部14之貫通孔X。第2部14具有比第1部12大一圈之貫通孔X。第1部12呈下表面之面積小於上表面之面積之大致錐台形狀。即，於俯視時，第1部12之上表面之外緣位於較第1部12之下表面之外緣靠外側。第1部12具有上表面、與上表面平行之下表面、以及與上表面和下表面相接之側面。於本實施形態中，第1部之上表面以及下表面呈角部帶弧度之大致長方形狀，但亦可呈大致圓形、大致橢圓形、大致多邊形等。 母材10具有凹部Y，該凹部Y將第1部12之上表面作為底面並將第2部14之側面(具體而言為貫通孔X之側面)之至少一部分作為內側面。凹部Y之內側面具有以自凹部Y之底面朝向開口部擴大之方式傾斜之傾斜面。 於本實施形態中，第1部12之上表面之形狀與第2部14之下表面側之貫通孔X之俯視形狀為大致相似形狀，第1部12之上表面之面積較第2部14之下表面側之貫通孔X之俯視形狀之面積大。即，即便不利用接著材料將第1部12與第2部14接合，第1部12亦不會自貫通孔X脫落。藉此，可提高第1部12與第2部14之接合強度，而可形成機械強度更優異之發光裝置3。 發光裝置3具有能夠小型化之構成。因此，根據發光裝置3，可使發光裝置小型化而其輕量化。又，根據發光裝置3，凹部Y之內側面具有朝向上方之傾斜面，藉此，使來自發光元件30之光反射而光提取效率提高。又，可形成具有較發光裝置之底面面積大之發光面積之發光裝置。 其次，對實施形態4之發光裝置4進行說明。如圖4G所示，發光裝置4與實施形態1、2之發光裝置1、2之不同之處在於，具備被覆凹部Y之內側面Y2之至少一部分之光反射性構件60。於本實施形態中，光反射性構件60兼作將第1部12與第2部14接合之接合構件。發光裝置4具有能夠小型化之構成。因此，根據發光裝置4，可使發光裝置小型化而實現其輕量化。又，光反射性構件60連續地被覆凹部Y之底面以及內側面，藉此，可提高第1部12與第2部14之接合強度，而可形成機械強度更優異之發光裝置4。 於實施形態1－4之發光裝置1－4之任一者中，均較佳為於凹部Y填充有覆蓋發光元件30之密封構件40。如此一來，可藉由密封構件40將第1部12與第2部14牢固地接合。又，母材10較佳為含有光反射性物質。藉此，可提高凹部Y內之光反射率，而可形成光提取效率更優異之發光裝置。又，發光裝置1－4亦可具備將發光元件30與母材10(更具體而言為母材10上之導體配線20)連接之金屬線50。 以上，對實施形態進行了說明，但該等說明並不對申請專利範圍所記載之構成進行任何限定。[Method of Manufacturing Light-emitting Device 1 of Embodiment 1] FIGS. 1A to 1G are schematic diagrams illustrating a method of manufacturing the light-emitting device 1 of Embodiment 1. FIG. FIGS. 1A and 1E are top views, and FIGS. 1B to 1D, 1F, and 1G are cross-sectional views. The directions of the observation cross-sectional views in FIGS. 1C to 1D, 1F, and 1G are the same as the direction of the observation cross-sectional views in FIG. 1B. As shown in FIGS. 1A to 1G, the method of manufacturing the light-emitting device 1 of the first embodiment has the following steps: preparing a flat base material 10 having a first part 12 and a second part 14 surrounding the first part 12 in a plan view; Mount the light-emitting element 30 on the first part 12; after mounting the light-emitting element 30, offset the relative positional relationship between the first part 12 and the second part 14 in the upper and lower directions, and form the upper surface of the first part 12 as the bottom surface Y1 makes at least a part of the side surface of the second part 14 the concave part Y of the inner surface Y2; and joins the first part 12 and the second part 14. Hereinafter, each step will be described. (Step of preparing base material 10) First, as shown in FIGS. 1A and 1B, a flat base material 10 is prepared. The base material 10 has a first part 12 and a second part 14. The second portion 14 has a through hole X. The first part 12 is fitted in the through hole X, and the second part 14 is provided so as to surround the first part 12 in a plan view. In FIG. 1B, it is shown that only one of the two through holes X of the second portion 14 is fitted with the first portion 12 and the other is not fitted with the first portion 12, but this is In order to make it easier to understand that the second part 14 has a through hole X, in fact, the first part 12 is also fitted into the other through hole X. This step may include the step of preparing a plate-shaped base material 10 formed by fitting the first part 12 and the second part 14 separated in advance, or instead of this step, it may include preparing the first part and the second part The step of non-separation of the base material. In the case of the latter step, for example, between this step and the following step of mounting light-emitting elements, that is, after preparing the base material by this step and before mounting the light-emitting element, make the first part from the base material The step of separating and the step of fitting the first part to the through hole generated by the separation of the first part may be sufficient. Or, as described in the following Embodiments 2 and 3, between the step of mounting the light-emitting element and the step of forming the recess, that is, after the light-emitting element is mounted and before the recess is formed, the first part is separated from the base material. Steps. The step of separating the first part from the base material can be performed by, for example, known methods such as punching by pressing, laser processing, and blade processing. As the material of the base material 10, an insulating material can be used. For example, ceramics, resins, derivatives, pulp, glass, or composite materials can be cited. As the resin, any resin can be used as long as it is a resin used in this field. Specifically, epoxy resins, triazine derivative epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, polyurethane resins, and the like can be cited. Examples of ceramics include those containing aluminum oxide, aluminum nitride, zirconium oxide, titanium oxide, titanium nitride, or a mixture of these. Examples of the composite material include composite resins, or composites of materials such as the above-mentioned ceramics, and metals, carbon, and the like. In addition, as a composite material, a metal coated with an insulator such as resin can also be used. As a composite resin, glass epoxy resin etc. are mentioned. The base material 10 preferably has a relatively high light reflectivity. As described below, the light-emitting element 30 is mounted on the upper surface of the first part 12, and at least a part of the side surface of the second part 14 is arranged to surround the inner side surface Y2 of the light-emitting element 30. Therefore, if the light reflectance of the base material 10 is increased, the light reflectance of the recessed portion Y accommodating the light-emitting element 30 can be easily increased. As the case where the base material 10 has a high light reflectivity, in addition to the case where the material of the base material 10 itself has a high light reflectance as in the case of using ceramics or resin as the base material, it also includes the case where the base material 10 is made of material The case where the base material 10 has high light reflectivity by containing a light-reflective substance. Examples of the light-reflective substance include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, glass fillers, and the like. The base material 10 usually has a conductor wiring 20 electrically connected to the light-emitting element 30 on its surface. The conductor wiring 20 may be formed of, for example, metals such as copper, aluminum, gold, silver, platinum, titanium, tungsten, palladium, iron, and nickel, or alloys containing these. The conductor wiring 20 may be arranged at least on the surface of the base material 10, and may be arranged on the back surface of the base material through holes or the like in the base material. (Step of mounting light-emitting element 30) Next, as shown in FIG. 1C, the light-emitting element 30 is mounted on the upper surface of the first portion 12. Specifically, the light-emitting element 30 is mounted on the conductor wiring 20 arranged in the first portion 12. The first part 12 functions as an element mounting part where the light-emitting element 30 is mounted. Furthermore, the number of light-emitting elements 30 mounted on one first part 12 may be one as shown in FIG. 1C, or may be plural. In the step of mounting the light-emitting element 30, the concave portion Y for accommodating the light-emitting element 30 has not yet been formed, and the relative positional relationship between the upper surface of the first portion 12 and the upper surface of the second portion 14 is on the same plane. That is, the base material 10 has a positional relationship in a planar shape. The electrical connection between the light-emitting element 30 and the conductor wiring 20 can be performed by, for example, a flip chip method or a wire bonding method. Here, it is assumed that the wire bonding method is used. In the case of wire bonding, the step of mounting the light-emitting element 30 includes a step of connecting the light-emitting element 30 and the base material 10 with a metal wire 50. Connecting the light-emitting element 30 and the base material 10 with the metal wire 50 refers to using the metal wire 50 to electrically connect at least one of the pair of electrodes of the conductor wiring 20 provided on the base material 10 and the light-emitting element 30 to each other. The metal wire 50 only needs to be a member that can electrically connect the electrode of the light-emitting element 30 and the conductor wiring 20 of the base material 10 to each other. For example, metals such as gold, silver, copper, platinum, aluminum, and alloys thereof can be used. By. As the light-emitting element 30, a semiconductor light-emitting element such as a light-emitting diode can be used. For the light-emitting element 30, a light-emitting element having a light-emitting wavelength in any region from the ultraviolet region to the infrared region can be appropriately selected and used according to the purpose. It can be used on growth substrates such as sapphire substrates or GaN substrates by nitride semiconductors (e.g. InN, AlN, GaN, InGaN, AlGaN, InGaAlN), III-V compound semiconductors, II-VI compound semiconductors and other semiconductors As the light-emitting element 30, a laminated structure including a light-emitting layer is formed. For the light emitting element 30, for example, a pair of positive and negative electrodes may be provided on the same surface side, or a pair of positive and negative electrodes may be respectively provided on opposite surfaces. Here, in the light emitting element 30, a pair of positive and negative electrodes are provided on the same surface side, and the two electrodes are joined to the conductor wiring 20 by a metal wire 50. (Step of forming recessed portion Y) Next, as shown in FIG. 1D, the relative positional relationship between the first portion 12 and the second portion 14 in the upper and lower directions is shifted, and the upper surface of the first portion 12 is formed as a bottom surface Y1. Let at least a part of the side surface of the second portion 14 be the concave portion Y of the inner surface Y2. That is, the recessed portion Y is formed after the light-emitting element 30 is mounted. Thereby, at least a part of the second portion 14 is arranged as the inner surface Y2 of the concave portion Y of the light-emitting element 30. Shifting the relative positional relationship between the first part 12 and the second part 14 in the upper and lower directions refers to the state where the relative positional relationship between the first part 12 and the second part 14 in the upper and lower directions has a planar shape from the base material 10 , That is, the state shifted from the state where the upper surface of the first portion 12 and the upper surface of the second portion 14 are located on substantially the same plane. Here, the substantially same plane refers to a range within which the height difference between the plane constituting the upper surface of the first portion 12 and the plane constituting the upper surface of the second portion 14 is within ±100 μm. The relative positional relationship between the first part 12 and the second part 14 in the upper and lower directions can be achieved by making the first part 12 and/or the second part 14 in a direction perpendicular to the upper surface of the first part 12 and the second part 14 Move and shift. That is, the relative positional relationship (1) can be shifted by moving the second part in the upward direction compared to the first part while the first part is fixed, and (2) can also be offset by fixing the second part. In the state, the first part is moved downward compared with the second part to be offset. (3) It is also possible to move the first part downward compared to the second part and make the second part upward compared to the first part. The direction moves and shifts. The fixing and moving of Part 1 and/or Part 2 can be carried out by known methods. For example, fixation and movement using jigs or molds can be cited. (Step of joining the first part 12 and the second part 14) Next, as shown in FIG. 1E and FIG. 1F, in a state where the relative positional relationship between the first part 12 and the second part 14 is shifted in the upper and lower directions , The first part 12 and the second part 14 are joined. Specifically, for example, the first portion 12 and the second portion 14 can be joined by filling the sealing member 40 in the recessed portion Y. That is, the sealing member 40 is a member for protecting the light-emitting element 30 and the metal wire 50 from dust, moisture, external force, etc. by covering the light-emitting element 30 and the metal wire 50. Here, the sealing member 40 can also be used for A joining member that joins the first part 12 and the second part 14. The sealing member 40 is preferably a member that uses a material that transmits light from the light-emitting element 30. As a specific material, for example, resin materials such as silicone resin or epoxy resin can be cited. Furthermore, in addition to such materials, fillers such as coloring materials or light diffusing agents may be contained as required. The sealing member 40 may also contain a phosphor, which absorbs at least a part of the light from the light-emitting element 30 and emits light of different wavelengths. As a specific material of the phosphor, for example, when a blue light-emitting element or an ultraviolet light-emitting element is used as the light-emitting element 30, the phosphor that can be excited by these light-emitting elements includes yttrium·aluminum activated by cerium •Garnet-based phosphor (YAG: Ce), cerium-activated lutetium•Aluminum•Garnet-based phosphor (LAG: Ce), nitrogen-containing calcium aluminosilicate-based phosphor activated by europium and/or chromium Phosphors (CaO-Al 2 O 3 -SiO 2 : Eu), silicate phosphors activated by europium ((Sr, Ba) 2 SiO 4 : Eu), β-sialon phosphors, CASN phosphors Nitride-based phosphors such as SCASN-based phosphors, KSF-based phosphors (K 2 SiF 6 : Mn), sulfide-based phosphors, quantum dot phosphors, etc. A light-emitting device (such as a white light-emitting device) of a desired color can be obtained by combining the phosphors and blue light-emitting elements or ultraviolet light-emitting elements. The step of joining the first part 12 and the second part 14 may also include the step of filling the gap between the first part 12 and the second part 14 with a caulking material or a sealing material before filling the sealing member 40. As a gap filler or a sealing material, resin, glass, ceramics, metal, etc. can be used. The step of joining the first portion 12 and the second portion 14 includes the step of filling the gap between the first portion 12 and the second portion 14, and the step of filling the sealing member 40 in the recess Y, and The bonding strength between the first part 12 and the second part 14 can be further improved. In addition, the possibility that the sealing member 40 leaks from the gap between the first part 12 and the second part 14 can be reduced. (Step of cutting) As shown in FIG. 1G, after joining the first portion 12 and the second portion 14, at least a part of the side surface of the second portion 14 is retained as the inner side surface Y2 of the recess Y, and the The second part 14 is cut off. By performing such cutting, the size of one light-emitting device 1 can be processed to a desired size. In addition, the number of light-emitting parts (that is, concave parts Y) included in one light-emitting device 1 can be set to a desired number. A blade or laser can be used for cutting. Furthermore, the number of recesses Y included in one light-emitting device 1 may be one or plural. Here, it is assumed that the number of recesses Y is one. Furthermore, when one light-emitting device has a plurality of recesses, the cutting in this step is not necessary. That is, it is possible to cut each light-emitting device to be provided with a plurality of light-emitting portions (concave portions), or without cutting, it is also possible to form a light-emitting device with all of the plurality of recesses of the base material. One light-emitting device with three light-emitting parts (recesses). As described above, according to the method of manufacturing the light-emitting device 1 of the present embodiment, after the step of mounting the light-emitting element 30, the step of forming the recess Y for housing the light-emitting element 30 is performed. That is, after the light-emitting element 30 is mounted on the flat base material 10, the inner surface Y2 surrounding the light-emitting element 30 is formed. Therefore, the distance between the light-emitting element 30 and the inner surface Y2 of the concave portion Y can be shortened compared with the case where the light-emitting element is arranged on the bottom surface of the base material with the concave portion formed in advance. That is, when the light-emitting element is usually mounted on the bottom surface of the recess, even if the light-emitting element is to be mounted close to the inner surface of the recess, there are also die bonding tools such as chip holders used in the installation of the light-emitting element and the inner surface of the recess. The possibility of contact, therefore, must be a fixed distance between the light-emitting element and the inner surface of the recess. However, according to the method of manufacturing the light-emitting device 1 of the present embodiment, the distance between the light-emitting element 30 and the inner surface Y2 of the recess Y can be shortened compared to the case where the light-emitting element is arranged on the bottom surface of the recessed portion formed in advance. The light-emitting device 1 having a structure capable of being miniaturized is manufactured. [Method of Manufacturing Light-emitting Device 2 of Embodiment 2] FIGS. 2A to 2G are schematic diagrams illustrating a method of manufacturing the light-emitting device 2 of Embodiment 2. Fig. 2A is a top view, and Figs. 2B to 2G are cross-sectional views. The direction of the observation cross-sectional view in FIGS. 2C to 2G is the same as the direction of the observation cross-sectional view in FIG. 2B. The difference between the manufacturing method of the light-emitting device 2 of the second embodiment and the manufacturing method of the light-emitting device 1 of the first embodiment lies in the step of placing the light-emitting element 30 (refer to FIG. 2C) and the step of forming the concave portion Y (refer to FIG. 2E). ), there is a step of separating the first part 12 from the base material 10 (refer to FIG. 2D). The separation of the first part 12 from the base material 10 can be performed by digging out the first part 12 from the base material 10 by irradiating a laser along the outer periphery of the first part 12, for example. Since the laser processing has a small effect of the stress caused by cutting, it is suitable for a method of separating the first part 12 from the base material 10 in a state where the light-emitting element 30 is mounted on the first part 12. Otherwise, it has the same steps as the manufacturing method of the light-emitting device 1 of the first embodiment. According to the manufacturing method of the light-emitting device 2 of the second embodiment, similarly to the manufacturing method of the light-emitting device 1 of the first embodiment, the recess Y for accommodating the light-emitting device 30 is formed after the light-emitting device 30 is mounted on the flat base material 10, Therefore, the light emitting element 30 can be mounted close to the inner surface Y2 of the recess Y. Therefore, according to the manufacturing method of the light-emitting device 2 of the second embodiment, the light-emitting device 2 that can be miniaturized can also be efficiently manufactured. [Method of Manufacturing Light-emitting Device 3 of Embodiment 3] FIGS. 3A to 3G are schematic diagrams for explaining a method of manufacturing the light-emitting device 3 of Embodiment 3. FIG. Fig. 3A is a top view, and Figs. 3B to 3G are cross-sectional views. The direction of the observation cross-sectional view in FIGS. 3C to 3G is the same as the direction of the observation cross-sectional view in FIG. 3B. As shown in FIGS. 3A to 3G, the manufacturing method of the light-emitting device 3 of the third embodiment is different from the manufacturing method of the light-emitting device 2 of the second embodiment in that the inner surface Y2 of the recess Y is an inclined surface. Otherwise, it has the same steps as the manufacturing method of the light-emitting device 2 of the second embodiment. According to the method of manufacturing the light-emitting device 3 of the third embodiment, similar to the method of manufacturing the light-emitting device 1 of the first embodiment, the recess Y for accommodating the light-emitting device 30 is formed after the light-emitting device 30 is mounted on the flat base material 10. Therefore, the light emitting element 30 can be mounted close to the inner surface Y2 of the recess Y. Therefore, according to the method of manufacturing the light-emitting device 3 of the third embodiment, the light-emitting device 3 that can be miniaturized can also be efficiently manufactured. Furthermore, according to the method of manufacturing the light-emitting device 3 of the third embodiment, by adjusting the width W between the first portion 12 and the second portion 14 and the inclination angle D of the inner surface Y2, the first portion 12 and the second portion In a state where the relative positional relationship of the upper and lower portions of the portion 14 is shifted, the first portion 12 and the through hole X of the second portion 14 are matched to hold the first portion 12 by the second portion 14. Therefore, according to the method of manufacturing the light-emitting device 3 of the third embodiment, the concave portion Y can be formed more easily in the step of forming the concave portion Y. By holding the first part 12 in the through hole X of the second part 14, for example, the first part 12 is pressed against the second part 14, and the first part 12, the second part 14, or the first part 14 is pressed. The portion 12 and the second portion 14 apply pressure or heat, and the first portion 12 and the second portion 14 are in close contact with each other more firmly, so that the first portion 12 and the second portion 14 can be joined without the sealing member 40. By joining the first portion 12 and the second portion 14 without passing through the sealing member 40, the deterioration or leakage of the sealing member 40 can be disregarded. [Method of Manufacturing Light-emitting Device 4 of Embodiment 4] FIGS. 4A to 4H are schematic diagrams for explaining a method of manufacturing the light-emitting device 4 of Embodiment 4. FIG. 4A and 4F are top views, and FIGS. 4B to 4E, 4G, and 4H are cross-sectional views. The directions of the observation cross-sectional views in FIGS. 4C to 4E, 4G, and 4H are the same as the direction of the observation cross-sectional views in FIG. 4B. The difference between the manufacturing method of the light-emitting device 4 of the fourth embodiment and the manufacturing method of the light-emitting device 1 of the first embodiment is that, as a step of joining the first portion 12 and the second portion 14, there is an arrangement before filling the sealing member 40 In the step of the light reflective member 60, the light reflective member 60 covers at least a part of each of the bottom surface Y1 and the inner side surface Y2 of the recess Y (refer to FIG. 4E). Otherwise, it has the same steps as the manufacturing method of the light-emitting device 1 of the first embodiment. In this embodiment, the entire bottom surface Y1 and the inner surface Y2 of the recess Y are covered by the light reflective member 60, but as described above, the light reflective member only needs to cover at least a part of each of the bottom surface and the inner surface of the recess Y . Furthermore, when the entire surfaces of the bottom surface Y1 and the inner surface Y2 of the recess Y are covered by the light reflective member 60, the sealing member 40 does not contact the first portion 12 and the second portion 14. The sealing member 40 does not necessarily need to be in contact with the first part 12 and the second part 14, and may be connected via another member such as the light reflective member 60. According to the manufacturing method of the light-emitting device 4 of the fourth embodiment, similar to the manufacturing method of the light-emitting device 1 of the first embodiment, the recess Y for accommodating the light-emitting device 30 is formed after the light-emitting device 30 is mounted on the flat base material 10, Therefore, the light emitting element 30 can be mounted close to the inner surface Y2 of the recess Y. Furthermore, the step of joining the first portion 12 and the second portion 14 includes a step of arranging the light reflective member 60 covering at least a part of each of the bottom surface Y1 and the inner side surface Y2 of the recessed portion Y, and the step of filling the sealing member 40 in the recessed portion Y With these two steps, the bonding strength between the first part 12 and the second part 14 can be further improved. In addition, according to the method of manufacturing the light-emitting device 4 of the fourth embodiment, at least a part of the inner surface Y2 of the concave portion Y is covered by the light reflective member 60, so the light leakage from the inner surface Y2 is reduced. Therefore, by reducing the width of the second portion 14 in a plan view, the light-emitting device 4 that can be further downsized can be manufactured. Furthermore, according to the method of manufacturing the light-emitting device 4 of the fourth embodiment, after the recess Y is formed, the light-reflective member 60 is disposed on the inner surface Y2 of the recess Y. Therefore, the reflectance around the light-emitting element 30 can be further improved. Therefore, according to the method of manufacturing the light-emitting device 4 of the fourth embodiment, a light-emitting device 4 with more excellent light extraction efficiency can be obtained. The light reflective member 60 is formed of a material capable of reflecting light emitted from the light emitting element 30. Specifically, the light reflective member 60 is preferably formed of a resin member containing a light reflective material. The reason is that the handling and processing of resin components is easier. As the resin member, for example, a resin containing one or more of silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, and acrylic resin, or a mixed resin containing two or more of these can be used Wait. Examples of the light reflective material include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, glass fillers, and the like. The light-reflective member 60 can be formed by a known method such as printing, spraying, and pouring after forming the concave portion Y. Among them, it is preferably formed by pouring. Furthermore, as described above, the gap between the first part 12 and the second part 14 can be filled with a caulking material, a sealing material, etc., and by making these members contain a light-reflective substance, they can also be Used as a light reflective member. Of course, as in this embodiment, the light reflective member 60 may be separately provided in addition to the caulking material, the sealing material, and the like. [Light-emitting device 1-4 of Embodiment 1-4] Next, the light-emitting device 1-4 of Embodiment 1-4 will be described. The light-emitting device 1-4 can be efficiently manufactured using the manufacturing method of the light-emitting device of Embodiment 1-4, but it can also be manufactured using other manufacturing methods. First, the light-emitting devices 1 and 2 of Embodiments 1 and 2 will be described. As shown in FIGS. 1G and 2G, the light-emitting devices 1 and 2 have a base material 10 and a light-emitting element 30. The base material 10 has a first part 12 and a second part 14 having a through hole X of a size in which the first part 12 is fitted. That is, the second portion 14 has a through hole X having the same size as the first portion 12 in a plan view, or an area that is slightly larger than the first portion 12. The first part 12 has a substantially cylindrical shape, and has an upper surface, a lower surface parallel to the upper surface, and side surfaces that are in contact with the upper surface and the lower surface, and the lower surface and the side surfaces are substantially orthogonal. In the present embodiment, the upper surface and the lower surface of the first portion 12 have a substantially rectangular shape with curved corners, but they may also have a substantially circular shape, a substantially elliptical shape, a substantially polygonal shape, or the like. The base material 10 has a recessed portion Y having the upper surface of the first portion 12 as a bottom surface and at least a part of the side surface of the second portion 14 (specifically, the side surface of the through hole X) as an inner surface. The recessed portion Y has an inner side surface (that is, the side surface of the second portion 14) that is substantially perpendicular to the bottom surface (that is, the upper surface of the first portion 12). The light emitting element 30 is mounted on the upper surface of the first portion 12 (that is, the bottom surface of the concave portion Y). The light-emitting devices 1 and 2 have a structure capable of being miniaturized. Therefore, according to the light-emitting devices 1 and 2, the light-emitting device can be reduced in size and its weight can be reduced. Next, the light-emitting device 3 of the third embodiment will be described. As shown in FIG. 3G, the light-emitting device 3 is different from the light-emitting devices 1 and 2 of the first and second embodiments in that the inner surface of the concave portion Y is an inclined surface. In the light-emitting device 3 of the third embodiment, the first part 12 is also fitted into the through hole X of the second part 14. The second part 14 has a through-hole X that is slightly larger than the first part 12. The first portion 12 has a substantially truncated cone shape in which the area of the lower surface is smaller than the area of the upper surface. That is, in a plan view, the outer edge of the upper surface of the first portion 12 is located outside of the outer edge of the lower surface of the first portion 12. The first part 12 has an upper surface, a lower surface parallel to the upper surface, and side surfaces in contact with the upper surface and the lower surface. In this embodiment, the upper surface and the lower surface of the first part are substantially rectangular shapes with corners curved, but they may also be substantially circular, substantially elliptical, substantially polygonal, or the like. The base material 10 has a recessed portion Y having the upper surface of the first portion 12 as a bottom surface and at least a part of the side surface of the second portion 14 (specifically, the side surface of the through hole X) as an inner surface. The inner surface of the recess Y has an inclined surface that is inclined so as to expand from the bottom surface of the recess Y toward the opening. In this embodiment, the shape of the upper surface of the first portion 12 and the plan view shape of the through hole X on the lower surface side of the second portion 14 are substantially similar, and the area of the upper surface of the first portion 12 is larger than that of the second portion 14. The through-hole X on the lower surface side has a large area in plan view. That is, even if the first part 12 and the second part 14 are not joined with the adhesive material, the first part 12 does not fall off from the through hole X. Thereby, the bonding strength between the first portion 12 and the second portion 14 can be increased, and the light-emitting device 3 with more excellent mechanical strength can be formed. The light-emitting device 3 has a structure capable of being miniaturized. Therefore, according to the light-emitting device 3, the light-emitting device can be miniaturized and reduced in weight. In addition, according to the light-emitting device 3, the inner surface of the recess Y has an upwardly inclined surface, whereby the light from the light-emitting element 30 is reflected and the light extraction efficiency is improved. In addition, a light-emitting device having a larger light-emitting area than the bottom surface area of the light-emitting device can be formed. Next, the light-emitting device 4 of the fourth embodiment will be described. As shown in FIG. 4G, the light-emitting device 4 is different from the light-emitting devices 1 and 2 of Embodiments 1 and 2 in that it includes a light reflective member 60 covering at least a part of the inner surface Y2 of the concave portion Y. In this embodiment, the light reflective member 60 also serves as a joining member that joins the first part 12 and the second part 14 together. The light emitting device 4 has a structure capable of being miniaturized. Therefore, according to the light-emitting device 4, the light-emitting device can be miniaturized and reduced in weight. In addition, the light reflective member 60 continuously covers the bottom surface and the inner side surface of the recessed portion Y, whereby the bonding strength between the first portion 12 and the second portion 14 can be increased, and the light emitting device 4 having more excellent mechanical strength can be formed. In any of the light-emitting devices 1-4 of Embodiment 1-4, it is preferable to fill the recessed part Y with the sealing member 40 which covers the light-emitting element 30. In this way, the first part 12 and the second part 14 can be firmly joined by the sealing member 40. In addition, the base material 10 preferably contains a light-reflective substance. Thereby, the light reflectivity in the concave portion Y can be increased, and a light emitting device with more excellent light extraction efficiency can be formed. In addition, the light-emitting devices 1-4 may include a metal wire 50 that connects the light-emitting element 30 and the base material 10 (more specifically, the conductor wiring 20 on the base material 10). The embodiments have been described above, but these descriptions do not limit the structure described in the scope of the patent application in any way.

1‧‧‧發光裝置2‧‧‧發光裝置3‧‧‧發光裝置4‧‧‧發光裝置10‧‧‧母材12‧‧‧第1部14‧‧‧第2部20‧‧‧導體配線30‧‧‧發光元件40‧‧‧密封構件50‧‧‧金屬線60‧‧‧光反射性構件D‧‧‧內側面之傾斜角度W‧‧‧第1部與第2部分離之寬度X‧‧‧貫通孔Y‧‧‧凹部Y1‧‧‧底面Y2‧‧‧內側面1‧‧‧Lighting device 2‧‧‧Lighting device 3‧‧‧Lighting device 4‧‧‧Lighting device 10‧‧‧Base material 12‧‧‧Part 1 14‧‧‧Part 2 20‧‧‧Conductor wiring 30‧‧‧Light-emitting element 40‧‧‧Sealing member 50‧‧‧Metal wire 60‧‧‧Light reflective member D‧‧‧The inclination angle of the inner surface W‧‧‧The width of the separation between the first part and the second part X ‧‧‧Through hole Y‧‧‧Concavity Y1‧‧‧Bottom surface Y2‧‧‧Inner surface

圖1A係對實施形態1之製造方法所具有之準備母材之步驟進行說明之模式性俯視圖。 圖1B係表示圖1A中之1B-1B剖面之圖。 圖1C係對實施形態1之製造方法所具有之安裝發光元件之步驟進行說明之模式性剖視圖。 圖1D係對實施形態1之製造方法所具有之形成凹部之步驟進行說明之模式性剖視圖。 圖1E係對實施形態1之製造方法所具有之將第1部與第2部接合之步驟進行說明之模式性俯視圖。 圖1F係表示圖1E中之1F-1F剖面之圖。 圖1G係對實施形態1之製造方法所具有之將第2部切斷之步驟進行說明之模式性剖視圖。 圖2A係對實施形態2之製造方法所具有之準備母材之步驟進行說明之模式性俯視圖。 圖2B係表示圖2A中之2B-2B剖面之圖。 圖2C係對實施形態2之製造方法所具有之安裝發光元件之步驟進行說明之模式性剖視圖。 圖2D係對實施形態2之製造方法所具有之使第1部自母材分離之步驟進行說明之模式性剖視圖。 圖2E係對實施形態2之製造方法所具有之形成凹部之步驟進行說明之模式性剖視圖。 圖2F係對實施形態2之製造方法所具有之將第1部與第2部接合之步驟進行說明之模式性剖視圖。 圖2G係對實施形態2之製造方法所具有之將第2部切斷之步驟進行說明之模式性剖視圖。 圖3A係對實施形態3之製造方法所具有之準備母材之步驟進行說明之模式性俯視圖。 圖3B係表示圖3A中之3B-3B剖面之圖。 圖3C係對實施形態3之製造方法所具有之安裝發光元件之步驟進行說明之模式性剖視圖。 圖3D係對實施形態3之製造方法所具有之使第1部自母材分離之步驟進行說明之模式性剖視圖。 圖3E係對實施形態3之製造方法所具有之形成凹部之步驟進行說明之模式性剖視圖。 圖3F係對實施形態3之製造方法所具有之將第1部與第2部接合之步驟進行說明之模式性剖視圖。 圖3G係對實施形態3之製造方法所具有之將第2部切斷之步驟進行說明之模式性剖視圖。 圖4A係對實施形態4之製造方法所具有之準備母材之步驟進行說明之模式性俯視圖。 圖4B係表示圖4A中之4B-4B剖面之圖。 圖4C係對實施形態4之製造方法所具有之安裝發光元件之步驟進行說明之模式性剖視圖。 圖4D係對實施形態4之製造方法所具有之形成凹部之步驟進行說明之模式性剖視圖。 圖4E係對實施形態4之製造方法所具有之將第1部與第2部接合之步驟中於凹部配置光反射性構件之步驟進行說明的模式性俯視圖。 圖4F係對實施形態4之製造方法所具有之將第1部與第2部接合之步驟進行說明之模式性俯視圖。 圖4G係表示圖4F中之4G-4G剖面之圖。 圖4H係對實施形態4之製造方法所具有之將第2部切斷之步驟進行說明之模式性剖視圖。FIG. 1A is a schematic plan view illustrating the step of preparing a base material included in the manufacturing method of Embodiment 1. FIG. Fig. 1B is a view showing the section 1B-1B in Fig. 1A. FIG. 1C is a schematic cross-sectional view illustrating the step of mounting a light-emitting element included in the manufacturing method of Embodiment 1. FIG. FIG. 1D is a schematic cross-sectional view explaining the step of forming a recess included in the manufacturing method of Embodiment 1. FIG. Fig. 1E is a schematic plan view illustrating the step of joining the first part and the second part included in the manufacturing method of the first embodiment. Fig. 1F is a diagram showing the section 1F-1F in Fig. 1E. Fig. 1G is a schematic cross-sectional view for explaining the step of cutting the second part included in the manufacturing method of the first embodiment. Fig. 2A is a schematic plan view illustrating the step of preparing a base material included in the manufacturing method of the second embodiment. Fig. 2B is a view showing the section 2B-2B in Fig. 2A. 2C is a schematic cross-sectional view for explaining the step of mounting the light-emitting element included in the manufacturing method of the second embodiment. 2D is a schematic cross-sectional view explaining the step of separating the first part from the base material included in the manufacturing method of the second embodiment. 2E is a schematic cross-sectional view explaining the step of forming a recess included in the manufacturing method of the second embodiment. 2F is a schematic cross-sectional view explaining the step of joining the first part and the second part included in the manufacturing method of the second embodiment. 2G is a schematic cross-sectional view explaining the step of cutting the second part included in the manufacturing method of the second embodiment. Fig. 3A is a schematic plan view illustrating the step of preparing a base material included in the manufacturing method of the third embodiment. Fig. 3B is a view showing the section 3B-3B in Fig. 3A. 3C is a schematic cross-sectional view for explaining the step of mounting a light-emitting element included in the manufacturing method of the third embodiment. 3D is a schematic cross-sectional view explaining the step of separating the first part from the base material included in the manufacturing method of the third embodiment. 3E is a schematic cross-sectional view explaining the step of forming a recess included in the manufacturing method of the third embodiment. 3F is a schematic cross-sectional view for explaining the step of joining the first part and the second part included in the manufacturing method of the third embodiment. 3G is a schematic cross-sectional view for explaining the step of cutting the second part included in the manufacturing method of the third embodiment. Fig. 4A is a schematic plan view illustrating the step of preparing a base material included in the manufacturing method of the fourth embodiment. Fig. 4B is a view showing the section 4B-4B in Fig. 4A. 4C is a schematic cross-sectional view for explaining the step of mounting a light-emitting element included in the manufacturing method of the fourth embodiment. 4D is a schematic cross-sectional view explaining the step of forming a recess included in the manufacturing method of the fourth embodiment. 4E is a schematic plan view for explaining a step of arranging a light-reflective member in a recessed portion in the step of joining the first portion and the second portion included in the manufacturing method of the fourth embodiment. 4F is a schematic plan view explaining the step of joining the first part and the second part included in the manufacturing method of the fourth embodiment. Fig. 4G is a diagram showing the 4G-4G section in Fig. 4F. 4H is a schematic cross-sectional view explaining the step of cutting the second part included in the manufacturing method of the fourth embodiment.

12‧‧‧第1部 12‧‧‧Part 1

14‧‧‧第2部 14‧‧‧Part 2

20‧‧‧導體配線 20‧‧‧Conductor wiring

30‧‧‧發光元件 30‧‧‧Light-emitting element

50‧‧‧金屬線 50‧‧‧Metal wire

Y‧‧‧凹部 Y‧‧‧Concave

Y1‧‧‧底面 Y1‧‧‧Bottom

Y2‧‧‧內側面 Y2‧‧‧Inside

Claims (17)

一種發光裝置之製造方法，其具有如下步驟：準備平板狀之母材，該平板狀之母材使用絕緣性材料，且於俯視時具有於上表面配置有導體配線之第1部、以及包圍上述第1部之第2部；於上述第1部所配置之上述導體配線安裝發光元件；於安裝上述發光元件後，使上述第1部與上述第2部之上下方向上之相對位置關係偏移，而形成將上述第1部之上述上表面作為底面並將上述第2部之側面之至少一部分作為內側面之凹部；以及將上述第1部與上述第2部接合；且於上述第1部配置有一對之上述導體配線；該一對之上述導體配線分別藉由金屬線與上述發光元件電性連接。 A method of manufacturing a light-emitting device, which has the following steps: preparing a flat base material, the flat base material uses an insulating material, and has a first part with conductor wiring arranged on the upper surface when viewed from above, and surrounds the above The second part of the first part; the light-emitting element is mounted on the conductor wiring arranged in the first part; after the light-emitting element is installed, the relative positional relationship between the first part and the second part is shifted in the upper and lower directions , And forming a concave portion having the upper surface of the first portion as a bottom surface and at least a part of the side surface of the second portion as an inner surface; and joining the first portion and the second portion; and in the first portion A pair of the above-mentioned conductor wiring is arranged; the pair of the above-mentioned conductor wiring is electrically connected to the light-emitting element by a metal wire, respectively. 如請求項1之發光裝置之製造方法，其中於準備上述母材之步驟中，準備如下母材，該母材具有：上述第1部；以及第2部，其具有供上述第1部嵌合之貫通孔。 The method of manufacturing a light-emitting device according to claim 1, wherein in the step of preparing the base material, the following base material is prepared, the base material having: the first part; The through hole. 如請求項1之發光裝置之製造方法，其中於準備上述母材之步驟與安裝上述發光元件之步驟之間具有如下步驟：使上述第1部自上述母材分離；以及使上述第1部嵌合於藉由上述第1部之分離而產生之貫通孔。 The method of manufacturing a light-emitting device according to claim 1, wherein between the step of preparing the base material and the step of mounting the light-emitting element, there are steps of: separating the first part from the base material; and embedding the first part Fits to the through hole created by the separation of the above-mentioned first part. 如請求項1之發光裝置之製造方法，其中於安裝上述發光元件之步驟與形成上述凹部之步驟之間具有使上述第1部自上述母材分離之步驟。 The method of manufacturing a light-emitting device according to claim 1, wherein between the step of mounting the light-emitting element and the step of forming the recess, there is a step of separating the first part from the base material. 如請求項1至4中任一項之發光裝置之製造方法，其中於將上述第1部與上述第2部接合之步驟中，將密封構件填充於上述凹部，利用上述密封構件覆蓋上述發光元件。 The method of manufacturing a light-emitting device according to any one of claims 1 to 4, wherein in the step of joining the first part and the second part, a sealing member is filled in the recess, and the light-emitting element is covered with the sealing member . 如請求項1至4中任一項之發光裝置之製造方法，其中於形成上述凹部之步驟之後，具有利用光反射性構件被覆上述凹部之內側面之至少一部分之步驟。 The method of manufacturing a light emitting device according to any one of claims 1 to 4, wherein after the step of forming the recess, there is a step of covering at least a part of the inner surface of the recess with a light reflective member. 如請求項1至4中任一項之發光裝置之製造方法，其中上述母材含有光反射性物質。 The method for manufacturing a light-emitting device according to any one of claims 1 to 4, wherein the base material contains a light-reflective substance. 如請求項1至4中任一項之發光裝置之製造方法，其中安裝上述發光元件之步驟包括利用金屬線將上述發光元件與上述母材連接之步驟。 The method for manufacturing a light-emitting device according to any one of claims 1 to 4, wherein the step of mounting the light-emitting element includes a step of connecting the light-emitting element and the base material with a metal wire. 如請求項1之發光裝置之製造方法，其具備將密封構件以上表面與上述第2部之上表面齊平的方式填充於上述凹部之步驟。 The method of manufacturing a light-emitting device according to claim 1, which includes a step of filling the concave portion with the upper surface of the sealing member flush with the upper surface of the second portion. 如請求項1之發光裝置之製造方法，其具備以使上述第2部之至少一部分之側面成為上述凹部之內側面而留存之方式，將上述第2部切斷之步 驟。 The method of manufacturing a light emitting device according to claim 1, which includes a step of cutting the second part such that at least a part of the side surface of the second part becomes the inner surface of the recess and remains Sudden. 一種發光裝置，其具備：母材，其使用絕緣性材料，具有於上表面配置有導體配線之第1部、以及具備供上述第1部嵌合之大小之貫通孔之第2部，且具有將上述第1部之上述上表面作為底面並將上述第2部之側面之至少一部分作為內側面之凹部；以及發光元件，其安裝於上述凹部之底面所配置之上述導體配線；於上述第1部配置有一對之上述導體配線；該一對之上述導體配線分別藉由金屬線與上述發光元件電性連接。 A light-emitting device comprising: a base material using an insulating material, having a first part on which conductor wiring is arranged on the upper surface, and a second part having a through hole of a size for fitting the first part, and having A concave portion having the upper surface of the first portion as a bottom surface and at least a part of the side surface of the second portion as an inner surface; and a light-emitting element mounted on the conductor wiring arranged on the bottom surface of the concave portion; A pair of the above-mentioned conductor wiring is arranged on the part; the pair of the above-mentioned conductor wiring is electrically connected to the light-emitting element by a metal wire, respectively. 如請求項11之發光裝置，其中上述凹部之內側面係傾斜面。 The light-emitting device of claim 11, wherein the inner surface of the concave portion is an inclined surface. 如請求項11或12之發光裝置，其具備被覆上述凹部之內側面之至少一部分之光反射性構件。 The light-emitting device of claim 11 or 12, which includes a light-reflective member that covers at least a part of the inner surface of the recess. 如請求項11或12之發光裝置，其中於上述凹部具備覆蓋上述發光元件之密封構件。 The light-emitting device according to claim 11 or 12, wherein the recess is provided with a sealing member covering the light-emitting element. 如請求項11或12之發光裝置，其中上述母材含有光反射性物質。 The light-emitting device of claim 11 or 12, wherein the base material contains a light-reflective substance. 如請求項11或12之發光裝置，其具備將上述發光元件與上述母材連接之金屬線。 The light-emitting device of claim 11 or 12, which includes a metal wire connecting the light-emitting element and the base material. 如請求項14之發光裝置，其中上述密封構件之上表面與上述第2部之上表面齊平。 The light emitting device of claim 14, wherein the upper surface of the sealing member is flush with the upper surface of the second part.
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