JP5425381B2 - Light emitting module and manufacturing process thereof - Google Patents

Light emitting module and manufacturing process thereof Download PDF

Info

Publication number
JP5425381B2
JP5425381B2 JP2007209716A JP2007209716A JP5425381B2 JP 5425381 B2 JP5425381 B2 JP 5425381B2 JP 2007209716 A JP2007209716 A JP 2007209716A JP 2007209716 A JP2007209716 A JP 2007209716A JP 5425381 B2 JP5425381 B2 JP 5425381B2
Authority
JP
Japan
Prior art keywords
light emitting
mounting base
metal plate
hole
emitting module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007209716A
Other languages
Japanese (ja)
Other versions
JP2008047908A (en
Inventor
建中 陳
Original Assignee
建中 陳
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US11/503,216 priority Critical patent/US7494250B2/en
Priority to US11/503,216 priority
Application filed by 建中 陳 filed Critical 建中 陳
Publication of JP2008047908A publication Critical patent/JP2008047908A/en
Application granted granted Critical
Publication of JP5425381B2 publication Critical patent/JP5425381B2/en
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Description

  The present invention relates to a light emitting module and a manufacturing process thereof, and in particular, a light emitting module using a light emitting diode as a light emitting source and a manufacturing process thereof.

  In recent years, due to the rapid development of light-emitting diodes, and compared to traditional incandescent bulbs, high-power light-emitting diodes (HP LEDs) have low power consumption, long service life, and durability. In addition, the light-emitting diodes are widely applied due to their energy-saving characteristics in both general-purpose lighting market, public construction and automotive fields, and the market is brighter. There is also an increasing need for light emitting diodes with higher power and longer service life.

  However, the biggest problem facing high-intensity and high-power light-emitting diodes at present is how to overcome the problem of shortening the life and reducing the effect due to the temperature being too high. FIG. 1 is a cross-sectional view showing the structure of one of the prior art light emitting modules. As can be seen from FIG. 1, the printed circuit board 3 has a metal substrate through an insulating colloid 30 to prevent circuit shots. 1, the metal substrate 1 itself can directly form a concave groove for mounting the light emitting diode 2. The light emitting diode 2 conducts heat by being connected to the metal substrate 1 via the silver paste 20 and finally electrically connects the light emitting diode 2 and the printed circuit board 3 via the conductive wire 4. (Similarly, there also exists a thing like patent document 1.)

  FIG. 2 is a cross-sectional view showing another structure of a light emitting module according to the prior art. Referring to the drawing, the light emitting module is a lead frame type light emitting diode. The support base 5 on which the light emitting diode 2 is mounted is installed in the insulating case 70, the light emitting diode 2 is connected to the support base 5 through the silver paste 20, and the light emitting diode 2 is connected to the first lead by the conductive wire 4. Electrically connected to the frame 61 and the second lead frame 62, respectively. Further, the first lead frame 61 and the second lead frame 62 prevent electrical connection by the insulating case 70.

  However, all of the conventional light emitting modules use the silver paste 20 as a heat conducting medium, but the heat conducting effect of the silver paste 20 on the high power light emitting diode 2 is not sufficient in the heat dissipation direction. The heat dissipation is relatively slow. Even if a heat dissipating medium (for example, a heat dissipating sink) is mounted under the metal substrate 1 or the support base 5, the actual heat capacity cannot be effectively transferred to the heat dissipating medium, so that the heat dissipating action cannot be exhibited. For this reason, it is considered that the temperature of the entire light emitting module is not always high, and in fact, the thermal power is effectively conducted and not diffused.

In order to improve the heat dissipation effect, a highly heat conductive silver paste is produced accordingly, but the value of the highly heat conductive silver paste is too high, so it is not relatively suitable for production costs and is similar to the general silver paste 20 When it is applied to a light emitting diode module having a high storage capacity and is hard to be stored, it cannot achieve a function of conducting heat efficiently and quickly.
JP 2004-200207 A

  In view of the above, an object of the present invention is to provide a light-emitting module that reduces the temperature of a light-emitting diode chip by effectively and quickly conducting heat through an intermediate and manufacturing process that not only can generate electricity but also has a good heat conduction coefficient. And providing a manufacturing process thereof.

  In order to solve the above problem, one solution according to the present invention provides a light emitting module including a metal substrate, a mounting base, at least one light emitting diode, a printed circuit board, and at least one conductive wire. The metal substrate has a first through hole, the mounting base is disposed in the first through hole of the metal substrate, and the light-emitting diode is mounted on the mounting base by a eutectic welding method through a metal alloy. Die bonded on top. The printed circuit board has a second through hole exposing the light emitting diode on the mounting base, and is attached to the metal substrate. The conductive wire electrically connects the light emitting diode and the printed circuit board.

  In order to solve the above-mentioned problem, another method according to the present invention provides a metal substrate having a first through hole, disposes a mounting base in the first through hole of the metal substrate, and further includes at least one light emitting diode. Is die-bonded on the mounting base by eutectic welding in a high temperature state, and then a printed circuit board having a second through hole is further attached to the metal substrate, and the second through hole is bonded. Is for exposing the light emitting diodes on the mounting base, and finally, a manufacturing process of the light emitting module including electrically connecting the light emitting diodes to the printed circuit board by at least one conductive wire. provide.

  The above brief description and the following detailed description and the accompanying drawings are both used to more specifically describe the technique, means, and effects adopted by the present invention to achieve a predetermined object. Other objects and advantages of the present invention will be described in the subsequent description and drawings.

  FIG. 3 is a sectional view showing the structure of a preferred embodiment of the light emitting module according to the present invention. As shown in the figure, the present invention includes a metal substrate 1, at least one light emitting diode 2, and a printed circuit board 3. A light emitting module including at least one conductive wire 4 and a mounting base 5 is provided. The mounting base 5 is disposed on the metal substrate 1, and the printed circuit board 3 is attached to the metal substrate 1 through an insulating colloid 30. The light emitting diode 2 is die-bonded on the mounting base 5 through a metal alloy 21 by a eutectic welding method, and the light emitting diode and the printed circuit board are electrically connected by a conductive wire 4. The metal alloy 21 is made of gold and tin or silver and tin, and is a material having a high heat conduction coefficient, and therefore conducts and dissipates heat generated by the light emitting diode 2.

  4 and 5 are a diagram and an exploded view showing a preferred embodiment of a light emitting module according to the present invention, as shown in the figure, the light emitting module includes a metal substrate 1, at least one light emitting diode 2, and a printing. A circuit board 3, at least one conductive wire 4, and a mounting base 5 are included. The metal substrate 1 has a first through hole 101, and the material of the metal substrate 1 is, for example, copper or aluminum, and the mounting base 5 is a first through hole 101 of the metal substrate 1. The size of the first through hole 101 may correspond to the size of the mounting base 5, and the mounting base 5 is made of, for example, a copper metal material and is gold or silver The outer layer is plated (not shown).

  The light emitting diode 2 is die-bonded on the mounting base 5 by a eutectic welding method through a metal alloy 21 (as shown in FIG. 3), and the metal alloy 21 is made of gold and tin or silver and tin. In addition to the fact that gold or silver is plated on the outer layer of the mounting base 5 and the reflectance is increased, the connection effect when eutectic welding with the metal alloy 21 can be further improved. The printed circuit board 3 has a second through hole 301, and the printed circuit board 3 exposes the light emitting diode 2 on the mounting base 5 through the second through hole 301, and is further attached to the metal substrate 1. The printed circuit board 3 is attached to the metal substrate 1 via, for example, an insulating colloid 30 (as shown in FIG. 3) that is a resin, and the printed circuit board 3 emits light from the light emitting diode 2. An electric circuit (not shown) for controlling Subsequently, the conductive wire 4 electrically connects the light emitting diode 2 and the printed circuit board 3 so that the printed circuit board 3 can control the light emitting diode 2.

  FIG. 6 is a flowchart showing a preferred embodiment of a manufacturing process of a light emitting module according to the present invention. As shown in the figure, the manufacturing process includes the following steps. First, the metal substrate 1 having the first through hole 101 is prepared (step S601). The material of the metal substrate 1 is, for example, copper or aluminum, and subsequently mounted via the first through hole 101. The base 5 is placed on the metal substrate 1 (step S603). The mounting base 5 is made of, for example, a copper metal material and has a gold or silver plating outer layer. Further, the light emitting diode 2 is die-bonded on the mounting base 5 through the metal alloy 21 (as shown in FIG. 3) by a eutectic welding method (step S605). The metal alloy 21 is made of gold and tin or silver and tin, and the outer layer of the mounting base 5 is plated with gold or silver, thereby improving the connection effect in eutectic welding with the metal alloy 21 and more. Large reflectance is increased. Further, the printed circuit board 3 having the second through hole 301 is attached to the metal substrate 1 with an insulating colloid 30 (as shown in FIG. 3) such as a resin (step S607). The light emitting diode 2 on the mounting base 5 is exposed to the printed circuit board 3, and the printed circuit board 3 includes an electric circuit (not shown) that controls light emission of the light emitting diode 2. Finally, the light emitting diode 2 is electrically connected to the printed circuit board 3 by the conductive wire 4 (step S609).

  Since the eutectic welding temperature is about 280 ° C., the processes performed up to step (S605) and the materials used must both withstand high temperature conditions. The process order that uses the material that is not used or the material used for it is adjusted after the eutectic welding process.

  Both of the embodiments described below describe the arrangement of the mounting base 5 and the metal substrate 1 in the present invention.

  FIG. 7 is a view showing a first embodiment of the mounting base and the metal substrate according to the present invention. As shown in the figure, the mounting base 5 and the metal substrate 1 are integrally formed, and the metal substrate 1 is directly milled. At this time, it is formed on the mounting base 5, and thereafter, an outer layer of silver or gold is further plated on the mounting base 5 (not shown).

  FIG. 8 is an exploded view showing a second embodiment of the mounting base and the metal substrate according to the present invention. As shown in the figure, the mounting base 5 is caulked to the metal substrate 1 via the first through hole 101. The

  FIG. 9 is an exploded view showing a third embodiment of the mounting base and the metal substrate according to the present invention. As shown in the figure, the mounting base 5 is further provided with a bolt 501 and the mounting base 5 is the first base. It is caulked to the metal substrate 1 through the through hole 101, and the bolt 501 is exposed to the other side of the metal substrate 1, and can be tightened to a lamp structure or a heat dissipating device (not shown) in the subsequent stage. Increase the effect.

  FIG. 10 is an exploded view showing a fourth embodiment of the mounting base and the metal substrate according to the present invention. As shown in the figure, the mounting base 5 itself has a screw form, and the first through hole 101 is interposed therebetween. And fasten to the metal substrate 1.

  As described above, by the above technical means, the present invention has the purpose of performing eutectic welding with the metal alloy 21 to conduct heat effectively and rapidly to the outside heat dissipation medium and to reduce the temperature of the light emitting diode 2 itself. Not only what can be achieved, but also luminous efficiency and life extension can be improved.

  However, what has been described above is merely a detailed description of the preferred specific embodiments and drawings of the present invention, and is not intended to limit the scope of the claims of the present invention. Any expert who has ordinary knowledge in the field, who should be based on the following claims, can appropriately make changes and modifications within the field of the present invention. Needless to say, it should be delivered within the scope of the claim.

FIG. 1 is a cross-sectional view illustrating one structure of a conventional light emitting module. FIG. 2 is a cross-sectional view showing another structure of the light emitting module of the prior art. FIG. 3 is a sectional view showing the structure of a preferred embodiment of the light emitting module according to the present invention. FIG. 4 is a view showing a preferred embodiment of a light emitting module according to the present invention. FIG. 5 is an exploded view showing a preferred embodiment of the light emitting module according to the present invention. FIG. 6 is a flowchart showing a preferred embodiment of the manufacturing process of the light emitting module according to the present invention. FIG. 7 is a view showing a first embodiment of the mounting base and the metal substrate according to the present invention. FIG. 8 is an exploded view showing a second embodiment of the mounting base and the metal substrate according to the present invention. FIG. 9 is an exploded view showing a third embodiment of the mounting base and the metal substrate according to the present invention. FIG. 10 is an exploded view showing a fourth embodiment of the mounting base and the metal substrate according to the present invention.

Explanation of symbols

Prior art 1 Metal substrate 2 Light emitting diode 20 Silver paste 3 Printed circuit board 30 Insulating colloid 4 Conductive wire 5 Support base 61 First lead frame 62 Second lead frame 70 Insulating case The present invention 1 Metal substrate 101 First through hole 2 Light emitting diode 21 Metal alloy 3 Printed circuit board 30 Insulating colloid 301 Second through hole 4 Conductive wire 5 Mounted base 501 volts

Claims (9)

  1. And have a first through hole, the metal plate body fabricated of copper material or an aluminum material,
    A mounting base disposed in the first through hole of the metal plate ,
    At least one light-emitting diode die-bonded on the mounting base disposed on the metal plate through a metal alloy in a eutectic welding method;
    A second through hole for exposing the light emitting diode on the mounting base; and an electric circuit for controlling light emission of the at least one light emitting diode, and is attached to the metal plate through an insulating colloid. Printed circuit board,
    A light emitting module comprising: the light emitting diode and at least one conductive wire that electrically connects the electric circuit of the printed circuit board.
  2. The size of the first through hole corresponds to the size of the mounting base, and the mounting base is made of a copper metal material and has a silver or gold plating outer layer . Light emitting module.
  3. When the metal plate is made of copper, the mounting base is integrated with the metal plate by being formed in the first through hole of the metal plate, or
    The mounting base is caulked in the first through hole of the metal plate, or
    The mounting base includes a threaded portion that is screwed into the first through hole of the metal plate;
    The light emitting module according to claim 1, characterized in that.
  4. Claims wherein the mounting base, when it is caulked to the first through hole of the metal plate member, characterized in that the further projectingly provided a bolt to tighten the heat dissipation apparatus on the other side of the metal plate body Item 4. A light emitting module according to item 3.
  5. The light emitting module of claim 1, wherein said metal alloy, characterized in that made of gold and tin or silver and tin.
  6. The light emitting module according to claim 1, wherein a main component of the insulating colloid is a resin .
  7. Providing a metal plate body having a first through hole and made of copper or aluminum;
    Disposing a mounting base on the metal plate through the first through hole;
    Die-bonding at least one light emitting diode on the mounting base disposed in the first through hole of the metal plate by eutectic welding;
    A printed circuit board having a second through hole for exposing the light emitting diode on the mounting base and an electric circuit for controlling the light emission of the at least one light emitting diode is formed on the metal plate via an insulating colloid. A step to paste on the body,
    Electrically connecting the light emitting diodes to the electrical circuit of the printed circuit board via at least one conductive wire, respectively.
    Manufacturing process of light emitting module including
  8. In the eutectic welding method, a metal alloy composed of gold and tin or silver and tin is soldered as a material.
    The manufacturing process of the light emitting module according to claim 7 .
  9. The process for producing a light emitting module according to claim 7, wherein a main component of the insulating colloid is a resin .
JP2007209716A 2006-01-26 2007-08-10 Light emitting module and manufacturing process thereof Expired - Fee Related JP5425381B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11/503,216 US7494250B2 (en) 2006-01-26 2006-08-14 Light emitting module and process thereof
US11/503,216 2006-08-14

Publications (2)

Publication Number Publication Date
JP2008047908A JP2008047908A (en) 2008-02-28
JP5425381B2 true JP5425381B2 (en) 2014-02-26

Family

ID=39181285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007209716A Expired - Fee Related JP5425381B2 (en) 2006-01-26 2007-08-10 Light emitting module and manufacturing process thereof

Country Status (1)

Country Link
JP (1) JP5425381B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101075612B1 (en) 2009-10-29 2011-10-21 삼성전기주식회사 LED package and the method of manufacturing thereof
KR101163645B1 (en) 2009-12-11 2012-07-09 순천대학교 산학협력단 High power led module and method for manufacturing the same
WO2011123985A1 (en) * 2010-04-08 2011-10-13 盈胜科技股份有限公司 Method for fabricating multilayer light emitting diode array
CN102214587B (en) * 2010-04-08 2012-10-17 盈胜科技股份有限公司 Method for manufacturing multi-layer array type light emitting diode
CN102214645B (en) * 2010-04-08 2013-01-09 盈胜科技股份有限公司 Multi-layer array type light emitting diode
JP6477734B2 (en) * 2016-06-30 2019-03-06 日亜化学工業株式会社 Light emitting device and manufacturing method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63311747A (en) * 1987-06-15 1988-12-20 Mitsubishi Gas Chem Co Inc Manufacture of ic chip-mounting printed circuit board
JPH041738Y2 (en) * 1987-07-20 1992-01-21
JP3783572B2 (en) * 2001-03-05 2006-06-07 日亜化学工業株式会社 Light emitting device
JP4045781B2 (en) * 2001-08-28 2008-02-13 松下電工株式会社 Light emitting device
JP2005513815A (en) * 2001-12-29 2005-05-12 杭州富陽新穎電子有限公司 Light-emitting diodes and light-emitting diode lamp
MXPA05001029A (en) * 2002-07-25 2005-09-12 Jonathan S Dahm Method and apparatus for using light emitting diodes for curing.
JP2004200207A (en) * 2002-12-16 2004-07-15 Matsushita Electric Works Ltd Light emitting device
JP2004342870A (en) * 2003-05-16 2004-12-02 Stanley Electric Co Ltd Light emitting diode to be driven with large current
JP2005064047A (en) * 2003-08-13 2005-03-10 Citizen Electronics Co Ltd Light emitting diode
JP2005136224A (en) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd Light-emitting diode illumination module
JP2005252168A (en) * 2004-03-08 2005-09-15 Nichia Chem Ind Ltd Surface mount light emitting device
JP2005267927A (en) * 2004-03-17 2005-09-29 Nichia Chem Ind Ltd Light emitting device

Also Published As

Publication number Publication date
JP2008047908A (en) 2008-02-28

Similar Documents

Publication Publication Date Title
CN100530727C (en) Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
JP3850665B2 (en) Semiconductor light emitting emitter package
JP4360858B2 (en) Surface mount type LED and light emitting device using the same
JP5101578B2 (en) Light emitting diode lighting device
US20030058650A1 (en) Light emitting diode with integrated heat dissipater
US7572033B2 (en) Light source module with high heat-dissipation efficiency
JP2009135440A (en) Light-emitting device having heat dissipating function, and process for manufacturing such device
US20060092640A1 (en) Light enhanced and heat dissipating bulb
TWI295860B (en)
US6848819B1 (en) Light-emitting diode arrangement
US7192163B2 (en) Light-emitting unit with enhanced thermal dissipation and method for fabricating the same
JP5359734B2 (en) Light emitting device and manufacturing method thereof
CA2342267C (en) Led integrated heat sink
US6966674B2 (en) Backlight module and heat dissipation structure thereof
JP4241658B2 (en) Light emitting diode light source unit and light emitting diode light source formed using the same
US7919789B2 (en) Lateral light-emitting diode backlight module
JP2009522804A (en) Light emitting diode package, method for manufacturing the same, and backlight unit including the same
US20040264195A1 (en) Led light source having a heat sink
US7642704B2 (en) Light-emitting diode with a base
JP2008293966A (en) Light-emitting diode lamp
CN2644878Y (en) Light emitting diode
US7676915B2 (en) Process for manufacturing an LED lamp with integrated heat sink
JP2004172170A (en) High luminance light emitting device and method of manufacturing the same
JP4711715B2 (en) Semiconductor light emitting device and semiconductor light emitting unit
KR20080020668A (en) A semiconductor light-emitting apparatus provided with a heat conducting/dissipating module

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100803

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120522

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120523

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120821

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120824

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120827

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120918

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121217

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130507

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130905

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20130905

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20130930

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131105

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131127

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees