JP6852818B2 - Manufacturing method of light emitting device - Google Patents

Description

The present invention relates to a method for manufacturing a light emitting device.

Instead of providing a housing for accommodating the light emitting element, a light emitting device in which the side surface of the light emitting element is covered with a reflective member is known (for example, Patent Documents 1 to 4).

Japanese Unexamined Patent Publication No. 2010-219324 Japanese Unexamined Patent Publication No. 2012-227470 Japanese Unexamined Patent Publication No. 2013-012545 Japanese Unexamined Patent Publication No. 2014-112669

In recent years, there has been a demand for a light emitting device that is compact and has good close-out property.

Embodiments of the present invention include the following configurations.
The process of preparing a light emitting element whose upper surface is a light extraction surface, and
The process of preparing a support with an upper surface and
The process of preparing a frame having an opening penetrating from the upper surface to the lower surface, and
A step of placing the frame on the upper surface of the support with the lower surface of the frame facing each other.
The step of placing the light emitting element on the upper surface of the support in the opening of the frame, and
A step of injecting resin from an injection port provided so as to penetrate from the outer side surface to the inner side surface of the frame body, and forming a covering member so that at least a part of the upper surface of the light emitting element is exposed.
A step of providing a translucent member on the light emitting element and the covering member, and
A method for manufacturing a light emitting device including.

According to the embodiment of the present invention, it is possible to obtain a light emitting device that is small in size and has good close-out property.

FIG. 1A is a schematic perspective view of the light emitting device according to the first embodiment from the upper oblique direction. FIG. 1B is a schematic perspective view from the lower oblique direction of the light emitting device according to the first embodiment. FIG. 1C is a schematic cross-sectional view of the A1-A1 cross section of FIG. 1A. FIG. 1D is a schematic cross-sectional view of the A2-A2 cross section of FIG. 1A. FIG. 2A is a schematic cross-sectional view of a light emitting element used in the light emitting device according to the embodiment. FIG. 2B is a schematic view illustrating a method of manufacturing the light emitting device according to the first embodiment. FIG. 2C is a schematic view illustrating a method of manufacturing the light emitting device according to the first embodiment. FIG. 2D is a schematic view illustrating a method of manufacturing the light emitting device according to the first embodiment. FIG. 2E is a schematic view illustrating a method of manufacturing the light emitting device according to the first embodiment. FIG. 2F is a schematic view illustrating a method of manufacturing the light emitting device according to the first embodiment. FIG. 2G is a schematic view illustrating a method of manufacturing the light emitting device according to the first embodiment. FIG. 3A is a schematic cross-sectional view of the light emitting device according to the second embodiment. FIG. 3B is a schematic cross-sectional view of the light emitting device according to the second embodiment. FIG. 4 is a schematic view illustrating a method of manufacturing the light emitting device according to the second embodiment. FIG. 5A is a schematic view illustrating a method of manufacturing the light emitting device according to the third embodiment. FIG. 5B is a schematic view illustrating a method of manufacturing the light emitting device according to the third embodiment. FIG. 6A is a schematic view illustrating a method of manufacturing the light emitting device according to the fourth embodiment. FIG. 6B is a schematic view illustrating a method of manufacturing the light emitting device according to the fourth embodiment. FIG. 7A is a schematic perspective view of the light emitting device according to the fourth embodiment from the upper oblique direction. FIG. 7B is a schematic perspective view from the lower oblique direction of the light emitting device according to the fourth embodiment. FIG. 8A is a schematic cross-sectional view of the light emitting device according to the fifth embodiment. FIG. 8B is a schematic cross-sectional view of the light emitting device according to the fifth embodiment. FIG. 9 is a schematic cross-sectional view of the light emitting device according to the fifth embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction or position (for example, "top", "bottom", "right", "left", and other terms including those terms) are used as necessary. .. The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the invention. Further, the parts having the same reference numerals appearing in a plurality of drawings indicate the same parts or members.

The "frame body" can also be rephrased as a "side wall" provided so as to form one opening. When one frame has a plurality of openings, a side wall is provided for each opening. That is, not only the portion that becomes the outermost wall when viewed as the whole frame, but also the portion that becomes the partition wall that partitions each opening is referred to as a frame or a side wall. Further, one frame (side wall) constituting one opening, the side surface on the side on which the light emitting element is placed is also referred to as an inner side surface, and the side surface on the side facing the inner side surface is also referred to as an outer surface. When the two openings on which the light emitting elements are placed are provided with one frame as a shared side wall, the inner side surface of one opening becomes the outer surface of the other opening, and so on. The side surface may be used as both the inner side surface and the outer side surface. In such a case, for convenience, the inner side surface and the outer side surface will be specified and described with reference to either opening.

<Embodiment 1>
The light emitting device according to the first embodiment is shown in FIGS. 1A to 1D. 1A is a perspective view of the light emitting device 1 from the upper oblique direction, FIG. 1B is a perspective view of the light emitting device 1 from the lower oblique direction, FIG. 1C is a sectional view taken along line A1-A1 of FIG. The cross-sectional view in the A2-A2 cross section is shown.

The light emitting device 1 includes a light emitting element 10, a covering member 20 that covers the side surface 10e of the light emitting element, a translucent member 30 that covers the upper surface 10c of the light emitting element and the upper surface of the covering member 20, and a side surface of the translucent member 30. A frame body 40 surrounding the cover member 20 and the side surface of the covering member 20 is provided. The manufacturing method of the light emitting device according to the first embodiment will be described with reference to FIGS. 2A to 2G.

(Process of preparing light emitting element)
As a light emitting element, a semiconductor light emitting element such as a light emitting diode is prepared. The light emitting element 10 includes a laminated structure (translucent substrate and semiconductor layer) 10a and electrodes 10b. The laminated structure 10a includes a light emitting layer 10aa in the semiconductor layer. A surface opposite to the lower surface (electrode forming surface 10d) on which the electrode 10b is formed is used as a light extraction surface, and this light extraction surface is provided as the upper surface 10c.

(Process to prepare the support)
A support 100 having an upper surface 100a is prepared. The support may be a support provided with a joining member for joining the frame body described later, or may be a support not provided with the joining member.

(Process to prepare the frame)
A frame body 40 having an upper surface 40a and a lower surface 40b and having an opening 40c penetrating from the upper surface to the lower surface is prepared. The height of the frame 40 (the length from the upper surface to the lower surface) is higher than the height of the light emitting element used in the steps described later. The frame body 40 is provided with a through hole 40d penetrating from the outer surface to the inner side surface in the frame body (side wall) constituting one opening. The through hole 40d serves as an injection port 40d for injecting resin into the opening. The upper end of the injection port 40d is located at a position away from the upper surface 40a of the frame body. The lower end of the injection port 40d coincides with the lower surface of the frame (the lower surface joined to the support). That is, the through hole 40d can be said to have a shape in which the lower surface of the frame is cut out, or a recess on the lower surface.

(Step of placing the frame on the support)
The lower surface 40b of the frame is placed on the upper surface 100a of the support so as to face each other. It is preferable that a joining member is provided on the upper surface 100a of the support and / or the lower surface 40b of the frame, and the support and the frame are joined via the joining member. By joining the support 100 and the frame 40 in this way, a recess is formed at a position corresponding to the opening 40c of the frame. In other words, a recess is formed in which the upper surface 100a of the support is the bottom surface and the frame body 40 is the side wall.

The through hole 40d of the frame body serves as an injection port for injecting the resin as described above, and a part of the injection port is formed by the upper surface 100a of the support.

(Process for mounting the light emitting element)
The light emitting element 10 is placed on the upper surface 100a of the support in the opening 40c of the frame. A die bond member is provided on the upper surface 100a of the support and / or the lower surface of the light emitting element 10 (the lower surface of the electrode 10b when the lower surface is an electrode forming surface), and the support 100 and the light emitting element 10 are provided via the die bond member. To join. The frame body 40 and the light emitting element 10 may be placed on the upper surface 100a of the support in the order in which the frame body 40 is placed first and then the light emitting element 10 is placed, or the light emitting element 10 is placed. The frame body 40 may be placed after the placement. Preferably, the frame body 40 is first placed on the upper surface 100a of the support. Further, it is preferable that the side surface 10e of the light emitting element is placed so as to be separated from the inner side surface of the frame body 40. In particular, it is preferable to place the surfaces so that they are separated by the same distance. In other words, it is preferable to place the light emitting element 10 so that the center of the light emitting element 10 is substantially aligned with the center of the opening 40c of the frame body.

(Step of forming a covering member)
Next, the resin is injected from the outside of the opening 40c into the inside of the opening 40c through the injection port 40d provided in the frame (side wall) 40 to form the covering member 20 material. In other words, the covering member 20 is formed by filling resin so as to fill the space between the side surface 10e of the light emitting element and the frame body 40 (inner side surface). When there is a gap between the light emitting element 10 and the upper surface 100a of the support, the gap is also filled with resin to form the covering member 20.

The covering member 20 is provided so that at least one portion of the upper surface 10c of the light emitting element mounted in the opening 40c is exposed. Preferably, it is provided so that the entire upper surface 10c of the light emitting element is exposed. Further, the covering member 20 may cover the entire surface of the side surface 10e of the light emitting element, may be provided so as to cover at least the light emitting layer 10aa, or may cover the side surface below the light emitting layer. Further, the covering member 20 may cover only the lower surface of the light emitting element. Preferably, it is provided so as to cover the entire surface of the side surface 10e of the light emitting element. The upper surface of the covering member 20 provided between the inner side surface of the frame body 40 and the side surface 10e of the light emitting element may be a flat surface or a curved surface. In that case, the upper surface may be inclined so that the side surface 10e side of the light emitting element is low and the inner side surface side of the frame body 40 is high. The inclination angle of the upper surface of the covering member 20 is preferably, for example, about 20 to 80 degrees, and more preferably about 40 to 50 degrees with respect to the upper surface of the support.

The covering member 20 is formed of a resin injected from an injection port 40d provided in the frame body. That is, it is formed of the resin injected from the lateral direction of the opening 40c of the frame on which the light emitting element is placed, not from the upper direction. That is, since the resin is injected from below the upper surface (light extraction surface) 10c of the light emitting element, it is possible to make it difficult for the resin to cover the upper surface of the light emitting element.

The opening provided in the frame body 40 may include an opening 40c for mounting an element on which a light emitting element is mounted, and an opening 40e for supplying a resin provided adjacent thereto. The resin injection port is provided so as to penetrate the frame (side wall) 40 provided between the opening 40c for mounting the element and the opening 40e for supplying the resin. Then, resin is supplied from above the resin supply opening 40e to the resin supply opening 40e using, for example, a nozzle, and the element mounting opening 40c is supplied from the injection port 40d provided in the frame. Inject the resin inside. The resin is a fluid liquid at the time of injection, and the heights of the liquid surfaces (upper surface of the resin) are substantially the same in the two openings through the through holes (injection ports). Therefore, the amount of resin injected into the opening for mounting the element can be easily visually recognized from the opening. As a result, it is possible to suppress the excessive filling of the resin and to fill an appropriate amount of the resin so that the upper surface of the light emitting element is exposed. Further, since the opening for mounting the element is filled with resin from the bottom surface to the top, bubbles (cavities) are formed under the light emitting element or below the frame (corner portion). It can be suppressed.

(Step of forming a translucent member)
Next, the translucent member 30 is provided on the light emitting element 10 and the covering member 20. The translucent member 30 can be formed from above the opening of the frame body 40 by, for example, potting. When a frame body provided with an opening for supplying a resin for supplying a covering member is used, it is not necessary to provide a translucent member in the opening for supplying the resin. The translucent member may have one layer or a plurality of layers.

(Process for removing the support, individualization)
Then, the support 100 is removed. After that, by cutting the frame body 40 (for example, cutting at the position of the broken line in FIG. 2G), the light emitting device 1 shown in FIG. 1A can be obtained. A dicer, a blade, a laser or the like can be used for cutting the frame.

In the light emitting device 1 thus obtained, for example, as shown in FIGS. 1A to 1D, the upper surface of the light emitting device 1 is composed of a translucent member and a frame (upper surface) surrounding the light emitting device 1. By using a frame body formed in advance and surrounding the light emitting surface with the frame body, it is possible to make a light emitting device that is small in size and has good parting ability.

The side surface of the obtained light emitting device 1 is composed of a frame body 40 and a covering member 20. The frame body 40 and the covering member 20 form side surfaces that are on the same surface. Further, the covering member 20 continuously constitutes the outer surface of the light emitting device 1 from the side surface to the lower surface. On the lower surface of the light emitting device 1, the electrode 10b of the light emitting element is exposed, and the periphery thereof is surrounded by the covering member 20. And the frame surrounds the outside.

<Embodiment 2>
The light emitting device according to the second embodiment is shown in FIGS. 3A and 3B. The light emitting device 2 includes a light emitting element 10, a covering member 20 that covers the side surface 10e of the light emitting element, a translucent member 30 that covers the upper surface 10c of the light emitting element and the upper surface of the covering member 20, and a side surface of the translucent member 30. A frame body 40 that surrounds the cover member 20 and the side surface of the covering member 20 is provided. The second embodiment is the same as the first embodiment except that the through hole (injection port) provided in the frame body is formed at a position separated from the lower surface of the frame body. Therefore, the different points will be described.

As shown in FIG. 4, the frame body 40 includes a through hole (injection port) penetrating from the outer surface to the inner surface. The upper end of the injection port is located away from the upper surface of the frame, and the lower end of the injection port is located away from the lower surface of the frame. The light emitting device obtained by using the frame body provided with the injection port at such a position is provided so that the covering member constituting the outer surface is separated from the lower surface of the light emitting device. For example, the lower end of the through hole is preferably located below the light emitting layer of the light emitting element. Further, the upper end of the through hole is preferably located below the upper surface of the light emitting element.

<Embodiment 3>
The light emitting device according to the third embodiment is formed by using the frame body 40 and the support body 100 shown in FIGS. 5A and 5B. The appearance of the obtained light emitting device is the same as that in FIG. The third embodiment is the same as the first embodiment in that the through hole 40d provided in the frame body 40 is a notch (recessed portion on the lower surface of the frame body) reaching the lower surface of the frame body. In the third embodiment, the groove portion 100b is provided on the upper surface 100a of the support body, and the injection port is formed by the through hole 40d of the frame body and the groove portion 100b of the support body. The groove portion 100b is provided on the upper surface of the support below the through hole 40d of the frame body. The width of the through hole 40d of the frame body and the width of the groove portion 100b of the support can be substantially the same width or different widths.

<Embodiment 4>
The light emitting device according to the fourth embodiment is formed by using the frame body 40 and the support body 100 shown in FIGS. 6A and 6B. Specifically, a step of preparing a frame body 40 having an opening 40c penetrating from the upper surface to the lower surface, and a support 100 having a groove portion 100b on the upper surface 100a having a groove portion 100b longer than the length from the outer surface to the inner side surface of the frame body. And a step of placing the lower surface 40b of the frame body facing each other above the groove portion 100b of the support to form an injection port composed of the groove portion and the lower surface of the frame body, and the frame body. This includes a step of placing a light emitting element on the upper surface of the support in the opening of the above, and a step of injecting resin from the injection port and forming a covering member between the frame and the light emitting element. That is, there are no through holes in the frame body, and the lower surface of the frame body is flush with each other. The lower surface of the frame, the groove 100b on the upper surface of the support, and the lower surface 40b of the frame form the injection port 40d.

As shown in FIGS. 7A and 7B, the light emitting device 3 obtained by using such a frame and the support through the same steps as in the first embodiment has the outer surface of the light emitting device composed of only the frame. To. A covering member is exposed on the lower surface of the light emitting device.

<Embodiment 5>
The light emitting device 4 according to the fifth embodiment shows a light emitting device formed by using the frame body and the support used in the fourth embodiment. In the fifth embodiment, for example, as shown in FIGS. 8A and 8B, the covering member 20 is provided so as not to cover the side surface of the light emitting element or the light emitting layer. The translucent member covering the upper surface of the covering member and the upper surface of the light emitting element has two layers. That is, it includes a first translucent member 31 that covers the side surface and the upper surface of the light emitting element 10, and a second translucent member 32 that covers the first translucent member 31. The second translucent member is provided so as not to come into contact with the light emitting element. In the case of such a two-layer structure, the first translucent member may be a member that does not contain a phosphor (for example, a transparent member), and the second translucent member may be a layer that contains a phosphor. it can. By doing so, the light emitted to the outside through the phosphor layer can be made into light with less color unevenness. The first translucent member 31 may be provided so as to be in contact with the upper surface of the light emitting element.

Further, as shown in FIG. 9, the light emitting device 5 may have an inclined upper surface of the covering member 20. It is preferable that the covering member 20 has a high inner side surface side of the frame body 40 and a low side surface side of the light emitting element. The inclination angle of the upper surface of the covering member 20 is preferably, for example, about 20 to 80 degrees, and more preferably about 40 to 50 degrees with respect to the upper surface of the support. Then, the first translucent member 31 can be provided between the upper surface (inclined surface) of the covering member 20 inclined in this way and the side surface of the light emitting element 10. Then, the second translucent member 32 can be provided so as to cover the first translucent member 31. By making the first translucent member a member that does not contain a phosphor (for example, a transparent member), the light emitted from the side surface of the light emitting element irradiates the upper surface (inclined surface) of the covering member 20. Then, since the covering member 20 is efficiently reflected in the upper surface direction of the light emitting device, the light extraction efficiency can be improved. When the upper surface of the covering member 20 is an inclined surface, it can be adjusted according to the surface state, angle, injection amount, etc. of the inner surface of the frame and the side surface of the light emitting element. Further, the inclined surface may be a flat surface in a cross-sectional view, or may be a curved surface such as a convex curved surface or a concave curved surface.

The components used in each embodiment will be described in detail below.

(Support)
The support has an upper surface on which the frame is placed, and examples thereof include a flat plate-shaped support. The upper surface of the support and the frame form a recess on which the light emitting element is placed, and the upper surface of the support forms the bottom surface of the recess. The support is a base that supports each member in the process. For example, these members are integrally supported in a step of mounting a light emitting element, a step of mounting a frame, a step of forming a covering member, a step of forming a translucent member, and the like. Therefore, a member having a certain level of strength is preferable.

Further, the support is a member that is separated from the frame before being individualized as a light emitting device. Separation from the frame body can be carried out by a method such as peeling off the adhesive or the like or cutting. As described above, the support itself is not included in the light emitting device. The support and the frame are joined by a joining member, and it is preferable that the support and the frame are joined with a strength that does not peel off in each step. However, since it is finally separated from the frame, it is preferable to use a joining member that can be separated from the frame by a simple method.

As the support, either a conductive support or an insulating support can be used. For example, metal plates such as Cu, stainless steel, resin, and glass can be mentioned. Further, examples of the joining member for joining the support and the frame include silicone resin and the like.

(Frame body)
The frame includes an opening having an area larger than the upper surface of the light emitting element. The frame preferably includes a plurality of openings. Further, it is preferable that the opening is provided with an opening for mounting the element on which the light emitting element is mounted and an opening for supplying the resin. A plurality of openings for the light emitting element can be provided in one frame. One frame (side wall) can be shared with the adjacent openings. The opening for supplying the resin is provided adjacent to the opening for the light emitting element, and the frame (side wall) between these two openings is provided with a through hole.

The frame is cut at a position surrounding the opening in which the light emitting element is placed. At this time, by cutting so that the frame body remains in each light emitting device, it is possible to obtain a frame body that further covers the outer covering member of the light emitting element. That is, the frame constitutes the outer surface of the individualized light emitting device.
In the case of a frame having a plurality of openings, for example, by cutting the frame between two openings arranged side by side at the center thereof, the outside of both the light emitting device on the right side and the light emitting device on the left side can be cut. Can be a side.

The upper surface of the frame constitutes a part of the upper surface of the light emitting device. The upper surface of the frame can be a flat surface or a curved surface. Further, the upper surface of the frame may be a rough surface. The lower surface of the frame constitutes a part of the lower surface of the light emitting device. Since the lower surface of the frame is placed on the upper surface of the support, it is preferably flat.

The through hole or notch (recess provided on the lower surface) provided in the frame body serves as an injection port for injecting the resin into the opening. One or two or more through holes may be provided for one opening of the frame body. It can also be a continuous through hole or notch in the two openings. The through hole or notch may be provided so that the upper end of the through hole or notch is located below the light emitting layer of the light emitting element placed in the opening in the vertical direction of the frame.

The opening shape of the through hole or the notch may be a polygon such as a quadrangle or a triangle, a circle, an ellipse, or a combination thereof. Further, the opening shape on the inner side surface side and the opening shape on the outer side surface side may be the same or different. Also, their sizes may be the same or different. For example, the opening diameter on the outer side surface side may be larger or smaller than the opening diameter on the inner side surface side.

Further, the inner wall of the through hole extending from the inner side surface to the outer side surface may be a flat surface or a curved surface. Further, there may be irregularities or steps. Further, it may be a through hole that branches inside the frame (inside the side wall), such as having one opening on the outer surface and two openings on the inner surface.

The frame can be formed by injection molding, compression molding, transfer molding, printing, spraying, or the like.

The frame is preferably a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin. It may be the same material as the covering member described later, or it may be a different material.

The frame can be formed of a translucent resin or a light-reflecting resin. As the light-reflecting resin, a resin material having a reflectance of 70% or more with respect to light from a light emitting element can be used. Alternatively, the frame may be a light absorbing resin.

As the light-reflecting resin, for example, a light-transmitting resin in which a light-reflecting substance is dispersed can be used. As the light-reflecting substance, for example, titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite and the like are suitable. As the light-reflecting substance, granular, fibrous, thin plate pieces and the like can be used, but the fibrous material is particularly preferable because it can be expected to have an effect of reducing the coefficient of thermal expansion of the covering member.

(Light emitting element)
As the light emitting element, for example, a semiconductor light emitting element such as a light emitting diode can be used, and a light emitting element capable of emitting visible light such as blue, green, and red can be used. The semiconductor light emitting device includes a laminated structure including a light emitting layer and electrodes. The laminated structure includes a surface on the side where the electrodes are formed (electrode forming surface) and a surface on the opposite side to the light extraction surface.

The laminated structure includes a semiconductor layer including a light emitting layer. Further, a translucent substrate such as sapphire may be provided. As an example of the semiconductor laminate, three semiconductor layers of a first conductive type semiconductor layer (for example, n-type semiconductor layer), a light emitting layer (active layer), and a second conductive type semiconductor layer (for example, p-type semiconductor layer) are included. Can be done. The semiconductor layer capable of emitting visible light from ultraviolet light or blue light to green light can be formed from, for example, a semiconductor material such as a group III-V compound semiconductor or a group II-VI compound semiconductor. Specifically, _{nitride-based semiconductor materials such as In X} Al _Y Ga _1-XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) (for example, InN, AlN, GaN, InGaN, AlGaN, InGaAlN). Etc.) can be used. As the semiconductor laminate capable of emitting red light, GaAs, GaAlAs, GaP, InGaAs, InGaAsP and the like can be used.

The light emitting element includes a pair of electrodes and is arranged on the same surface side (electrode forming surface) of the laminated structure. These pair of electrodes may have a single-layer structure or a laminated structure as long as they are ohmic-connected to the laminated structure so that the current-voltage characteristics are straight or substantially straight. Such electrodes can be formed of any thickness using materials and configurations known in the art. For example, the thickness of the electrode is preferably a dozen μm to 300 μm. Further, as the electrode, a good electric conductor can be used, and for example, a metal such as Cu is suitable.

(Coating member)
The coating member is preferably a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin.

The covering member can be formed of a light-reflecting resin. The light-reflecting resin means a resin material having a reflectance of 70% or more with respect to light from a light emitting element. For example, a white resin or the like is preferable. The light that reaches the covering member is reflected and directed toward the light emitting surface of the light emitting device, so that the light extraction efficiency of the light emitting device can be improved.

As the light-reflecting resin, for example, a light-transmitting resin in which a light-reflecting substance is dispersed can be used. As the light-reflecting substance, for example, titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite and the like are suitable. As the light-reflecting substance, granular, fibrous, thin plate pieces and the like can be used, but the fibrous material is particularly preferable because it can be expected to have an effect of reducing the coefficient of thermal expansion of the covering member.

(Translucent member)
As the translucent member, a translucent resin, glass, or the like can be used as the translucent material. In particular, a translucent resin is preferable, and a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, and a phenol resin, and a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, and a polynorbornene resin can be used. it can. In particular, a silicone resin having excellent light resistance and heat resistance is preferable.

The translucent member may contain a phosphor in addition to the translucent material described above. As the phosphor, a phosphor that can be excited by light emission from the light emitting element is used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, an yttrium aluminum garnet type phosphor (Ce: YAG) activated by cerium; a lutetium aluminum garnet type phosphor activated by cerium is used. (Ce: LAG); nitrogen-containing calcium aluminosilicate-based phosphor activated with europium and / or chromium (CaO-Al ₂ O _3- SiO ₂ ); silicate-based phosphor activated with europium ((Sr, Ba)) ₂ SiO _{4); β-sialon} phosphor, CASN phosphor, nitride-based phosphor such as SCASN phosphor; KSF phosphor _{(K 2 SiF 6: Mn)} ; sulphide phosphor, a quantum dot phosphor And so on. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, a light emitting device of various colors (for example, a white light emitting device) can be manufactured.
Further, the translucent member may contain various fillers and the like for the purpose of adjusting the viscosity and the like.

When the first translucent member containing no phosphor and the second translucent member containing a phosphor are provided as the translucent member, the translucent material mentioned above includes the translucent member described above. Materials can be used. The translucent material used for the first translucent member and the translucent material used for the second translucent member may be the same material or different materials. Further, as the phosphor contained in the second translucent member, the phosphors listed above can be used.

Although some embodiments of the present invention have been illustrated above, it goes without saying that the present invention is not limited to the above-described embodiments and can be arbitrary as long as it does not deviate from the gist of the present invention. ..

1, 2, 3, 4, 5 ... Light emitting device 10 ... Light emitting element 10a ... Laminated structure
10aa ... Light emitting layer 10b ... Electrode 10c ... Upper surface of light emitting element (light extraction surface)
10d ... Lower surface of light emitting element (electrode forming surface)
10e ... Side surface of light emitting element 20 ... Covering member 30 ... Translucent member 31 ... First translucent member 32 ... Second translucent member 40 ... Frame (side wall)
40a ... Upper surface of the frame body 40b ... Lower surface of the frame body 40c ... Opening (opening for mounting an element)
40d ... Inlet port of frame (through hole, notch)
40e ... Opening (opening for resin supply)
100 ... Support 100a ... Upper surface of support 100b ... Support injection port (groove)
200 ... Nozzle

Claims (10)

The process of preparing a frame having an opening penetrating from the upper surface to the lower surface, and
A step of preparing a support having a groove portion longer than the length from the outer surface to the inner surface of the frame on the upper surface, and
A step of placing the lower surface of the frame body facing each other above the groove portion of the support to form an injection port composed of the groove portion and the lower surface of the frame body.
A step of placing a light emitting element on the upper surface of the support in the opening of the frame, and
A step of injecting resin from the injection port and forming a covering member having an inclined upper surface between the frame and the light emitting element.
A method for manufacturing a light emitting device including. The method for manufacturing a light emitting device according to claim 1, wherein the covering member has a high inner side surface side of the frame body and a low side surface side of the light emitting element. The method for manufacturing a light emitting device according to claim 2, wherein the angle of the inclined surface is 20 to 80 degrees. The method for manufacturing a light emitting device according to claim 2, wherein the angle of the inclined surface is 40 to 50 degrees. The method for manufacturing a light emitting device according to any one of claims 1 to 4, wherein the inclined surface is a curved surface in a cross-sectional view. The method for manufacturing a light emitting device according to any one of claims 1 to 5, wherein the covering member is made of a light-reflecting resin. The method for manufacturing a light emitting device according to any one of claims 1 to 6, wherein the frame is made of a light-reflecting resin. The method for manufacturing a light emitting device according to any one of claims 1 to 6, wherein the frame is made of a translucent resin. The method for manufacturing a light emitting device according to any one of claims 1 to 6, wherein the frame is made of a light absorbing resin. The method for manufacturing a light emitting device according to any one of claims 1 to 9, further comprising a step of providing a second translucent member on the light emitting element and the covering member.

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