TWI714876B - 基板處理裝置、基板處理方法及基板處理裝置之控制方法 - Google Patents

基板處理裝置、基板處理方法及基板處理裝置之控制方法 Download PDF

Info

Publication number
TWI714876B
TWI714876B TW107129640A TW107129640A TWI714876B TW I714876 B TWI714876 B TW I714876B TW 107129640 A TW107129640 A TW 107129640A TW 107129640 A TW107129640 A TW 107129640A TW I714876 B TWI714876 B TW I714876B
Authority
TW
Taiwan
Prior art keywords
valve
chamber
liquid
pipe
pressure
Prior art date
Application number
TW107129640A
Other languages
English (en)
Chinese (zh)
Other versions
TW201921553A (zh
Inventor
基村雅洋
山口侑二
上廣泰克
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201921553A publication Critical patent/TW201921553A/zh
Application granted granted Critical
Publication of TWI714876B publication Critical patent/TWI714876B/zh

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
TW107129640A 2017-09-15 2018-08-24 基板處理裝置、基板處理方法及基板處理裝置之控制方法 TWI714876B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-177717 2017-09-15
JP2017177717A JP7040849B2 (ja) 2017-09-15 2017-09-15 基板処理装置、基板処理方法及び基板処理装置の制御方法

Publications (2)

Publication Number Publication Date
TW201921553A TW201921553A (zh) 2019-06-01
TWI714876B true TWI714876B (zh) 2021-01-01

Family

ID=65723941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107129640A TWI714876B (zh) 2017-09-15 2018-08-24 基板處理裝置、基板處理方法及基板處理裝置之控制方法

Country Status (3)

Country Link
JP (1) JP7040849B2 (ja)
TW (1) TWI714876B (ja)
WO (1) WO2019054083A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7349876B2 (ja) * 2019-10-17 2023-09-25 東京エレクトロン株式会社 基板処理装置および装置洗浄方法
CN110953847B (zh) * 2019-12-10 2020-12-08 中国矿业大学(北京) 样品预处理装置及其方法
KR102585284B1 (ko) 2020-12-28 2023-10-05 세메스 주식회사 액 공급 유닛 및 액 공급 방법
JP2023122952A (ja) * 2022-02-24 2023-09-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163508A (ja) * 1992-11-27 1994-06-10 Fuji Electric Co Ltd 基板の乾燥方法および装置
JPH1126423A (ja) * 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
JP6163508B2 (ja) 2015-03-10 2017-07-12 株式会社アールシーコア ログハウス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3625017B2 (ja) * 1997-11-04 2005-03-02 大日本スクリーン製造株式会社 基板処理装置
JP4688741B2 (ja) * 2006-06-26 2011-05-25 大日本スクリーン製造株式会社 基板処理装置
JP2012222306A (ja) * 2011-04-13 2012-11-12 Tokyo Electron Ltd 基板処理方法及び基板処理装置
JP2013111546A (ja) * 2011-11-30 2013-06-10 Meidensha Corp 除湿装置
JP2013149666A (ja) * 2012-01-17 2013-08-01 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163508A (ja) * 1992-11-27 1994-06-10 Fuji Electric Co Ltd 基板の乾燥方法および装置
JPH1126423A (ja) * 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
JP6163508B2 (ja) 2015-03-10 2017-07-12 株式会社アールシーコア ログハウス

Also Published As

Publication number Publication date
JP7040849B2 (ja) 2022-03-23
WO2019054083A1 (ja) 2019-03-21
TW201921553A (zh) 2019-06-01
JP2019054124A (ja) 2019-04-04

Similar Documents

Publication Publication Date Title
TWI714876B (zh) 基板處理裝置、基板處理方法及基板處理裝置之控制方法
JP5293459B2 (ja) 基板処理装置
TWI754525B (zh) 基板處理裝置
KR20220093063A (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP7362300B2 (ja) 基板処理装置及びその制御方法
KR102420740B1 (ko) 기판 처리 방법, 기판 처리 장치 및 기록 매체
CN109390254B (zh) 基片处理方法、存储介质和基片处理系统
WO2006137330A1 (ja) 基板処理装置および基板処理方法
US7506457B2 (en) Substrate treating apparatus
US20090084405A1 (en) Substrate treating apparatus and substrate treating method
JP7109989B2 (ja) 基板処理方法、記憶媒体及び基板処理システム
JP4584783B2 (ja) 基板処理装置および基板処理方法、ならびにコンピュータ読取可能な記憶媒体
JP5122371B2 (ja) 基板処理装置、基板処理方法、プログラムならびに記憶媒体
JP6456792B2 (ja) 基板液処理装置、基板液処理方法及び記憶媒体
JP4498986B2 (ja) 基板処理装置および基板処理方法ならびにコンピュータ読取可能な記憶媒体
KR20180105089A (ko) 기판 처리 장치 및 기판 처리 방법
JP2010086981A (ja) 基板乾燥装置及び基板乾燥方法
JP2002066475A (ja) 基板洗浄装置
TWI796479B (zh) 基板處理方法、基板處理裝置及基板處理系統
KR102599614B1 (ko) 기판 이송 장치
JP6926303B2 (ja) 基板処理方法、基板処理装置及び記録媒体
JP2013149666A (ja) 基板処理装置及び基板処理方法
US20230290632A1 (en) Substrate processing method and substrate processing system
KR20190043181A (ko) 기판 처리 장치 및 기판 처리 방법
JP2023133102A (ja) 基板処理方法および基板処理装置