TWI714839B - Optical component detection system and method for detecting optical component - Google Patents

Abstract

An optical element detection system for detecting the surface of the element. The accommodating device is suitable for positioning the component in front of the camera device so that the camera device can detect the first surface of the component. The camera device includes an image sensor, and the image sensor is adapted to receive light reflected on the first surface of the element. The optical element detection system further includes a first optical effective element, which is arranged in the light path of the reflected light toward the image sensor; and an adjustment device for the first optical effective element. The adjusting device includes a bracket, which is fixed on the inner side of the hollow cylindrical mirror tube, and the longitudinal center line of the mirror tube is coaxial with the optical axis of the first optical effective element. The bracket has elastic flexibility at least in the longitudinal direction of the lens tube. The adjusting device further includes a first adjusting drive device for adjusting the relative distance between the optical effective element and the image sensor.

Description

Optical element detection system and method for detecting optical element

The invention relates to an optical element detection system and a method for detecting optical elements.

Semiconductor components are used in many technical fields, such as semiconductor electronics, photovoltaics, manufacturing optical detectors, and radiation sources (such as light-emitting diodes). Due to the wide application of semiconductor components, the requirements for semiconductor component manufacturers, especially in terms of quality, are increasing. Defects or malfunctions in or on the semiconductor element are harmful because they may affect the functionality of the semiconductor element. Therefore, semiconductor components are inspected for defects and failures during the manufacturing process. One solution for inspecting semiconductor components is to use micron-level optical systems to image semiconductor components.

But the traditional structure of the optical system has a small depth of field. If the imaging surface of the semiconductor device to be inspected is inclined relative to the image sensor surface of the image sensor of the optical system, the semiconductor device cannot be completely and clearly imaged in an image. In addition, the optical components installed in the optical system usually have a relatively large mass. Therefore, the adjustment operation is relatively slow, or when the focus is changed through the adjustment element, the optical system may vibrate, which significantly deteriorates the image quality. In this way, we must wait for the vibration Only when the movement is weakened can the camera be taken. In the process of continuous manufacturing/inspection of semiconductor components, this extended imaging time reduces the yield of semiconductor components.

German patent DE 10 2008 018 586 A1 relates to an optical detection device for detecting at least one surface of a component. The component is aligned with the camera device by the holding component, and the light source illuminates the first surface of the component with the first light beam in the shortwave range. The detection device further includes a second light source, which emits a second light beam in the long-wave range to the second surface of the element, wherein the second surface of the element is disposed opposite to the first surface. The light beam reflected on these surfaces is received by the camera device.

Japanese Patent JP 2016 128 781 discloses a device for inspecting electronic components. This type of device includes first and second imaging elements that capture images of different areas of the electronic element, where these areas are two different areas of a rectangular parallelepiped.

The object of the present invention is to provide an efficient optical element detection system for detecting elements.

The present invention provides an optical element detection system for detecting at least one surface of at least one element. The accommodating device is adapted to position the component in front of the camera device, so that the camera device can detect the first surface of the component. The camera device includes an image sensor, and the image sensor is adapted to receive light reflected on the first surface of the element. The optical element detection system further includes a first optical effective element, which is arranged in the light path of the reflected light toward the image sensor; and an adjusting device for the first optical effective element. The adjusting device includes a holder for the first optically effective element. The bracket is fixed on the inner side of the hollow cylindrical mirror tube, and the longitudinal centerline of the mirror tube It is coaxial with the optical axis of the first effective optical element. The bracket has elastic flexibility at least in the longitudinal direction of the lens tube. The adjusting device also includes a first adjusting and driving device for adjusting the relative distance between the effective optical element and the image sensor, so as to move the effective optical element relative to the image sensor along the optical axis.

Through the elastic and flexible support, the first optically effective element can be held without the corresponding thread or the longitudinally adjustable bracket of the optically effective element. When the optically effective element is an achromatic lens group, the lens pair of the achromatic lens group (for example, composed of a crown glass lens and a flint glass lens) is held by the bracket. In this way, there is no need to provide a holder for the lens pair, thereby reducing the moving quality of the optical effective element and the total mass of the optical element detection system. After the mass of the optically effective element with the bracket is reduced, the position of the optically effective element can be adjusted by applying a relatively small force. The smaller mass also contributes to the low inertia control of the optically effective components; thereby improving the subsequent adjustment speed of the clarity plane of the components.

The elastic and flexible support has a rubber-containing material or a spiral spring or is constructed as a bellows. Alternatively, the bracket may be constructed as a disc spring, wherein the disc spring has an opening in its vertical axis for accommodating the first optically effective element.

In this way, external interference (such as vibration) imposed on the optically effective element can be greatly reduced or even prevented. Thereby improving the anti-interference performance of the measurement implemented by the optical element detection system.

In addition, the elastic and flexible support can be stretched or compressed steplessly through its elastic characteristics, so that the position of the first optically effective element can be precisely adjusted.

In an actual production environment, it may not be possible to accurately align the components to the optical device. In such situations, the element cannot be imaged completely and clearly with sufficient depth of field. Using the optical component detection system proposed in this article can quickly implement a series of Camera.

The optical component detection system has good and rapid adjustability, so that the speed and accuracy of component measurement can be improved, thereby increasing the yield.

The image sensor can be a CCD chip. In other solutions, the image sensor can be a CMOS chip or an image sensor that is more sensitive to certain wavelength ranges, such as a microbolometer array or a thermoelectric array.

The mirror tube has a smaller magnetic permeability. In another solution, the mirror tube has a paramagnetic material. The mirror tube can also have at least aluminum or plastic.

The coil can be placed against the mirror tube or spaced apart from it. The position of the coil can be offset on the optical axis depending on the position of the bracket.

The bracket has a first end region, in which the bracket is fixed on the mirror tube. The bracket also has a second end region, and the first optically effective element is held on the second end region. In the static state, the position of the first end region of the bracket can be consistent with the position of an end of the coil with respect to the optical axis. In another solution, the position of the first end region of the bracket may be located inside or outside the coil with respect to the optical axis. As an alternative or supplementary solution, the second end region of the bracket is located inside or outside the coil with respect to the optical axis.

The support of the first adjustment drive can be at least partially surrounded by the coil. The control device is adapted to control the current input to the coil for generating the magnetic field. The bracket also has a yoke containing soft iron or permanent magnet as an element containing soft iron or permanent magnet, and the yoke is adapted to move the bracket along the longitudinal centerline of the mirror tube according to the current input to the coil.

Through the above structure, the wear or loss of the components used to adjust the relative distance can be reduced. In addition, the relative distance can be accurately adjusted through the force generated by the magnetic field. from.

In a case where a stent having a yoke containing soft iron is arranged on one end of the coil, the force acts on the stent toward the center of the coil. If the magnetic field is weakened and disconnected, no more force will act on the bracket. In this case, the bracket is in the initial position again.

If the stent has a permanent magnet yoke, the stent can be stretched in two directions according to the direction of current flowing through the coil and the orientation of the north and south poles of the permanent magnet element. In this way, permanent magnet elements can be used to adjust the relative distance in two directions.

The accommodating device is adapted to position the component in front of the camera device, so that the definition plane of the component is at least partially projected onto the image sensor surface of the image sensor.

The optical element detection system may also include a second adjustment driving device for adjusting the image sensor controlled by the control device, so as to move the image sensor relative to the first effective optical element along the optical axis.

The second adjusting and driving device may include a piezoelectric actuator or a micro-motion linear working shaft system. The micro-motion linear working axis system can refer to a system composed of several push rods.

The second adjusting and driving device can move the image sensor on the optical axis, and project the definition plane to the image sensor surface of the image sensor. Therefore, the optical device can be adjusted quickly for the components.

In this way, when the device is first captured by the image sensor, a predetermined part of the device can be clearly imaged in the image.

The optical element detection system also includes a light source, which is suitable for emitting light to the The surface of the component. The light source is suitable for emitting light of a predetermined wavelength or a predetermined wavelength range to the surface of the element. The light emitted by the light source may be visible light, infrared light and/or polarized light with a wavelength of about 380 to 780 nm. The image sensor can also have sensitivity in the infrared range or for polarized light.

As an option, the control device may be adapted to adjust the relative distance between the first optically effective element and the image sensor by controlling the first and/or the second adjustment driving device, so that the clarity of the reflected light The plane is projected to the surface of the image sensor facing the reflected light.

By controlling the first and/or the second adjusting and driving device, the relative distance between the first optically effective element and the image sensor can be adjusted quickly and accurately, so that the definition plane is projected to the image sensor The image sensor surface of the camera.

The image processing device of the optical element detection system can be adapted to capture the first image of the element by the image sensor. The image sensor provides the first image to the image processing device. Based on the generated first image, the image processing device determines whether the sharpness plane of the reflected light is substantially completely projected to the image sensor surface of the image sensor. If the clarity plane of the reflected light is not substantially completely projected onto the image sensor surface of the image sensor, the image processing device is adapted to determine a first image area of the first image An image area, in the first image area, the first partition of the clarity plane of the reflected light is projected onto the image sensor surface of the image sensor.

The image processing device is also suitable for determining a second image area among the plurality of first image areas of the first image. In the second image area, the second partition of the clarity plane of the reflected light is not It is projected to the image sensor surface of the image sensor. The image processing device is also suitable for providing a control signal to the control device Set. The control device is adapted to control the first and/or the second adjustment driving device based on the control signal, so as to adjust the relative distance between the optically effective element and the image sensor. In this process, the second subarea of the clarity plane of the reflected light is adjusted so that the clarity plane of the reflected light is projected onto the image sensor surface of the image sensor.

The image processing device is also suitable for capturing a second image of the device by the image sensor. In the second image, the image processing device determines a third image area among a plurality of second image areas of the second image, and in the third image area, the first partition of the clarity plane of the reflected light It is not projected onto the image sensor surface of the image sensor. The image processing device also determines a fourth image area among the plurality of second image areas of the second image. In the fourth image area, the second partition of the clarity plane of the reflected light is projected to the The image sensor surface of the image sensor.

In the case that the element cannot be clearly imaged in the image, at least two shots of the element can be produced through the foregoing operations, and an image area respectively has an image area that clearly images a part of the element. In addition, the identified unclear image area is clearly imaged in the next image, thereby realizing the inspection of the entire component.

In a first alternative, the image processing device may be adapted to capture a first image by the image sensor, and the image sensor provides the first image to the image processing device. The image processing device is also suitable for providing a control command to the control device to control the first and/or the second adjustment driving device so as to adjust the first optically effective element and the image sensor with a preset stroke The relative distance between. The image processing device is also suitable for capturing a second image by the image sensor, wherein the image sensor provides the second image to the image processing device.

After a predetermined period of time after the first image is captured, the image processing device may provide the control command to the first and/or the second adjustment driving device.

The predetermined stroke may be related to the optical characteristics of the first and/or the second optically effective element and/or the size of the surface of the element. Preferably, the preset stroke can be preset according to the depth of field, so that the preset stroke is less than, equal to, or greater than the depth of field.

When the preset stroke is less than or equal to the depth of field, the individual clearly imaged image area of the photographed image can be used to check whether there are defects on the surface of the component as a whole. If the preset stroke is greater than the depth of field, the preset surface area of the component can be checked for defects. Therefore, other surface areas are not checked for defects. In this way, the surface area can be inspected for defects with less calculation cost and/or in a shorter time.

In a second alternative, the image processing device may be adapted to capture the first image by the image sensor, and the image sensor provides the first image to the image processing device. The image processing device is also adapted to provide a control command to the control device to control the first and/or the second adjustment driving device, so as to adjust the first optical effect at a predetermined speed during the shooting of the first image The relative distance between the component and the image sensor. The image processing device is also suitable for capturing a second image by the image sensor, and the image sensor provides the second image to the image processing device. After the first image or after a predetermined period of time after the first image is captured, and during the adjustment of the relative distance between the first optical effective element and the image sensor, the second image is captured. In another alternative solution, after the relative distance between the image sensor and the first effective optical element changes by a predetermined length, the second image is captured.

After capturing the second image, the image processing device may be adapted to provide another control command to the first and/or the second adjustment driving device to stop the image Adjustment of the relative distance between the sensor and the first effective optical element.

The preset speed may be related to the optical characteristics of the first and/or the second optically effective element, the size of the surface of the element, the first and/or the second optically effective element and/or the image sensor The quality, and/or is related to the response characteristics of the above-mentioned components through the first and/or the second adjustment drive device.

The preset speed can be selected in such a way that during the filming of an image, the relative distance between the image sensor and the first effective optical element is no longer adjusted as the depth of field. In this way, while adjusting the relative distance between the image sensor and the first effective optical element, an image can be captured clearly enough. By continuously adjusting the relative distance between the image sensor and the first effective optical element, it is not necessary to stop and accelerate the image sensor and/or the first effective optical element again. Therefore, it is beneficial to prevent the vibration caused by the acceleration and stop of the image sensor and/or the first effective optical element. Another advantage is that the time for inspecting the components for defects can be shortened to a minimum, because only the image sensor and/or the first optically effective component need to be accelerated and stopped at one time.

The image processing device of the first and second alternatives may be adapted to determine a first image area among the first image areas of the first image after the first image is captured or the second image is captured . In the first image area, the first subarea of the sharpness plane of the reflected light is projected onto the image sensor surface of the image sensor. As an additional or supplementary solution, the image processing device determines a second image area among the plurality of first image areas of the first image, and in the second image area, the second image area of the clarity plane of the reflected light The partition is not projected onto the image sensor surface of the image sensor.

As a supplement or alternative, the image processing device can also record the After the two images, a third image area among the second image areas of the second image is determined. In the third image area, the first partition of the clarity plane of the reflected light is not projected onto the image sensor surface of the image sensor. As a supplement or alternative, the image processing device further determines a fourth image area among the plurality of second image areas of the second image, and in the fourth image area, the second image area of the clarity plane of the reflected light The two partitions are projected onto the image sensor surface of the image sensor.

The image processing device may also be adapted to provide a control command to the control device to control the first and/or the second adjustment driving device after the second image is captured, so that the image is captured after the second image is captured. The relative distance between the sensor and the first effective optical element is adjusted to its initial length.

The first and second image areas of the first image respectively image a part of the element, and the part substantially corresponds to the part of the element in the third and fourth image areas of the second image. The first and second image areas of the first image completely image the element.

The plurality of first image areas of the first image may correspond to the plurality of second image areas of the second image.

The first and second image areas of the first image and/or the third and fourth image areas of the second image may be connected image areas. Alternatively, the first and second image areas of the first image and/or the third and fourth image areas of the second image may also at least partially overlap.

The first partition of the definition plane in the first image and the second partition of the definition plane in the second image are projected onto the image sensor surface of the image sensor within a predetermined depth of field. In this case, the second partition of the definition plane in the first image and the first partition of the definition plane in the second image It is projected onto the image sensor surface of the image sensor outside the preset depth of field.

The image processing device may be adapted to cut out the first image area from the first image and cut out the fourth image area from the second image. The image processing device is also suitable for joining the cut-out first and fourth image regions together to generate a third image.

By generating the third image, when checking whether the component has a fault or defect, only one image instead of two images needs to be checked by the image processing device, thereby reducing the time and calculation cost of checking the component.

The image processing device may also be adapted to determine whether the component has at least one fault based on the first image area of the first image and/or the fourth image area of the second image and/or the third image. If the image processing device determines at least one failure, the image processing device is adapted to provide failure information about the component.

The optical element detection system may include a position detection sensor adapted to determine the position of the first optically effective element and/or the image sensor surface of the image sensor and/or position. The position detection sensor is also suitable for providing the control device with information about the position and/or orientation of the optically effective element and/or the image sensor surface of the image sensor, and the control device is based on all The information provided is used to control the first and/or the second adjusting drive device. The position detection sensor can be an optical or motor position detection sensor.

The position detection sensor can be installed on the inner side of the mirror tube. In another solution, the position detection sensor can be integrated in the image sensor. The bracket has a pattern on the surface area facing the image sensor. The image sensor is adapted to recognize the pattern on the surface area and determine the position and/or orientation of the optically effective element based on the recognized surface area.

Through the information provided, the control device can accurately position the first optically effective element and/or the image sensor, so that the clear plane of the reflected light is projected to the image sensor of the image sensor surface.

The camera device may include a second optically effective element in the optical path between the first optically effective element and the image sensor. The optical axis of the second effective optical element is coaxial with the optical axis of the first effective optical element.

The first optically effective element may be an achromatic lens group or an apochromatic lens group and/or the second optically effective element may be a condenser lens.

The refractive index of light gradually increases from red to blue, so the focal length of the lens decreases. Use this achromatic lens group to compensate or correct this kind of imaging error.

The present invention also provides an optical element detection system for detecting at least one surface of at least one element. The accommodating device is adapted to position the component in front of the camera device, so that the camera device can detect the first surface of the component. The camera device includes an image sensor, and the image sensor is adapted to receive light reflected on the first surface of the element. The optical element detection system further includes a first optical effective element, which is arranged in the light path of the reflected light toward the image sensor; and an adjusting device for the first optical effective element. The adjusting device includes a holder for the first optically effective element. The bracket is fixed on the inner side of the hollow cylindrical mirror tube by a linear guiding device, and the longitudinal center line of the mirror tube is coaxial with the optical axis of the first optical effective element. The linear guiding device is suitable for guiding the bracket parallel to the optical axis. The adjusting device further includes a first adjusting and driving device for adjusting the relative distance between the image sensor and the first effective optical element, so as to move the first effective optical element relative to the image sensor.

In addition, an adjustment device for optically effective elements is proposed. The device includes a holder for the first optically effective element. The bracket is fixed on the inner side of the hollow cylindrical mirror tube, and the longitudinal center line of the mirror tube is coaxial with the optical axis of the first effective optical element. The bracket has elastic flexibility at least in the longitudinal direction of the lens tube. The adjusting device also includes a first adjusting and driving device for adjusting the bracket so as to move the first effective optical element relative to the mirror tube along the optical axis.

In addition, an adjustment device for an optically effective element is also proposed, which includes a holder for the first optically effective element. The bracket is fixed on the inner side of the hollow cylindrical mirror tube by a linear guiding device, and the longitudinal center line of the mirror tube is coaxial with the optical axis of the first optical effective element. The linear guiding device is suitable for guiding the bracket parallel to the optical axis. The adjusting device also includes a first adjusting and driving device for adjusting the bracket so as to move the first effective optical element relative to the mirror tube along the optical axis.

The present invention also provides a method for detecting at least one surface of at least one component, which includes the following steps: aligning the component with a camera device; detecting the first surface of the component by the camera device; and using the image of the camera device The sensor receives the light reflected on the first surface of the element; the first optically effective element is held in the optical path of the reflected light by the elastic and flexible support along the longitudinal direction, wherein the longitudinal direction is parallel to the optically effective The optical axis of the element; adjust the relative distance between the image sensor and the first effective optical element, so as to move the first effective optical element relative to the image sensor along the optical axis.

The method may also include the following steps: adjusting the relative distance between the image sensor and the first effective optical element so as to move the image sensor relative to the first effective optical element along the optical axis; and, as an option, The relative distance between the image sensor and the first effective optical element is adjusted so that the clarity plane of the reflected light is projected onto the surface of the image sensor facing the reflected light.

The method may also include the step of irradiating the first surface of the element with light. The light can be light of a predetermined wavelength or a predetermined wavelength range.

The method may also include the following steps: filming a first image; determining whether the sharpness plane of the reflected light is substantially completely projected to the image sensor surface of the image sensor based on the first image; and if the reflection The clarity plane of the light is not substantially completely projected onto the image sensor surface of the image sensor, then it is determined that a first image area among the first image areas of the first image is in the first image In the area, the first partition of the clarity plane of the reflected light is projected onto the image sensor surface of the image sensor; a second image area among the first image areas of the first image is determined In the second image area, the second subarea of the clarity plane of the reflected light is not projected to the image sensor surface of the image sensor; adjusting the gap between the image sensor and the first optical effective element To project the second subarea of the sharpness plane of the reflected light onto the image sensor surface of the image sensor; shoot the second image; determine the second image area of the second image A third image area in which the first partition of the clarity plane of the reflected light is not projected onto the image sensor surface of the image sensor; determining the number of the second image A fourth image area in the second image area, in the fourth image area, the second partition of the sharpness plane of the reflected light is projected onto the image sensor surface of the image sensor.

In the first alternative, the method may include the following steps: shooting a first image; adjusting the relative distance between the image sensor and the first effective optical element with a preset stroke; shooting a second image.

In a second alternative, the method may include the following steps: shooting a first image; adjusting the image sensor and the image sensor at a predetermined speed during the shooting of the first image The relative distance between the first optically effective element; after the first image is taken or after a predetermined period of time after the first image is taken, and after adjusting the image sensor and the first optically effective element During the relative distance of, the second image was taken.

The method according to the first and second alternatives may also include the following steps: determining a first image area among a plurality of first image areas of the first image, in the first image area, the reflected light The first partition of the definition plane is projected onto the image sensor surface of the image sensor; a second image area among the plurality of image areas of the first image is determined, in the second image area, The second partition of the clarity plane of the reflected light is not projected onto the surface of the image sensor; In the region, the first subarea of the clarity plane of the reflected light is not projected to the image sensor surface of the image sensor; and/or one of the second image regions for determining the second image The fourth image area, in the fourth image area, the second subarea of the sharpness plane of the reflected light is projected onto the image sensor surface of the image sensor.

The method may also include the following steps: cutting out the first image area from the first image and cutting out the fourth image area from the second image; joining the cut out first and fourth image areas Together to produce a third image.

The method may also include the following steps: determining whether the component has at least one fault based on the first image area of the first image and/or the fourth image area of the second image and/or the third image: and if the If the component has at least one failure, the failure information about the component is provided.

The aspects described above for the method can also be applied to the device. Likewise, the aspects described above for the device can also be applied to the method.

100: adjusting device

110: mirror tube

120: Adjust the drive device

121: Coil

130: Achromatic lens group, first optical effective element

130A: Crown glass lens

130B: flint glass lens

140: bracket

141: Magnetic Yoke

142: Yoke

143: Bracket

144: Bracket

145: Ring bracket

146: Magnetic Yoke

150: containment device

160: Condenser lens, second optical effective element

200: Optical component detection system

220: Camera device

230: CCD chip, image sensor

231: Image sensor surface

240: second adjusting drive device

250: Position detection sensor

310: Step

311: Step

312: Step

320: step

330: Step

331: Step

332: Step

340: Step

350: step

351: step

352: step

353: step

360: steps

410: Step

430: step

450: step

460: step

B: Semiconductor wafers, semiconductor components

B1: The first image area

B2: Second image area

B3: Third image area

B4: The fourth image area

BA: First image

BB: Second image

BC: Third image

BV: image processing device

ECU: Control device

L: reflected light

O: surface

OA: Optical axis

SE: plane of definition

ST: depth of field

t0: point in time

alpha: angle

v: speed

t, t1, t2, t3, t-1: time

v1: preset speed

s: focal length

For more objectives, features, advantages and uses, please refer to the following description of non-limiting embodiments in conjunction with the accompanying drawings. All individual features or combinations of features described or illustrated, regardless of how they are summarized or retrospectively cited within the scope of the patent application, are the subject of invention. The dimensions and ratios of the components shown in the drawings are not always in actual proportions; they may be different from the drawings in the embodiment to be implemented.

1 is a schematic side plan view of an adjusting device for an optically effective element; FIGS. 2 and 3 are schematic plan views of an embodiment of a bracket of the adjusting device; FIG. 4 is used to detect at least one of at least one element A schematic side plan view of the optical element detection system on the surface; Figures 5 and 6 are schematic diagrams of different imaging of image areas with different definitions; Figure 7 is a schematic diagram of a camera composed of the aforementioned image areas 8 to 10 are relative to the image sensor of the optical element detection system, a schematic side view of the sharpness plane of the imaging element; Figure 11 is a time-speed graph, which is used to change the optical The relative distance between the effective element and the image sensor of the optical element detection system; Fig. 12 is a time-focus curve, which is used to illustrate the embodiment used to capture element images; Fig. 13 is another time- The focal length curve graph is used to illustrate another embodiment for capturing component images.

The device solutions described herein and their functions and working modes are only used to better understand their structure, working methods and characteristics; for example, these device solutions do not limit the disclosure content in the embodiments. The parts of the drawings are schematic, and the main features and effects are enlarged to illustrate the functions, principles, technical solutions and features. Wherein, each working mode, each principle, each technical solution and each feature illustrated in the drawings or disclosed in the specification can be combined with each feature, each feature in the scope of patent application, specification and other drawings. The other working methods, principles, technical solutions, and features contained in or given by the present disclosure can be freely and arbitrarily combined, so that the device described herein has all possible combinations. Among them, the combination of all embodiments in the specification (ie each paragraph of the specification) is also included in the scope of patent application, and the combination of different solutions in the specification is also included in the scope of patent application and drawings, and can become other The subject of the scope of the patent application. The scope of patent application does not limit the disclosure content and the combination possibilities of all the mentioned features. All disclosed features, no matter it is a single feature or a combination of features, are all disclosed in this case.

Elements with the same or similar functions in the drawings are represented by the same symbol. The device and method of the present invention will now be described in conjunction with embodiments.

FIG. 1 shows an adjusting device 100 for the achromatic lens group 130 as the first optically effective element. The achromatic lens group 130 is composed of a flint glass lens 130B and a crown glass lens 130A. The adjusting device 100 includes a bracket 140 for the achromatic lens group 130. The bracket 140 is fixed on the inner side of the hollow cylindrical mirror tube 110, and the longitudinal center line of the mirror tube 110 is coaxial with the optical axis OA of the achromatic lens group 130. In this embodiment, the bracket 140 has a ring shape. The bracket 140 accommodates the achromatic lens group 130 in the opening of the bracket 140 so that the optical axis OA of the achromatic lens group is aligned with the longitudinal centerline of the mirror tube 110 Coaxial. The mirror tube 110 has a small magnetic permeability (permeability μ>1) and a paramagnetic material. The paramagnetic material is aluminum. In another solution, the mirror tube 110 has plastic as a material.

The bracket 140 has elastic flexibility at least in the longitudinal direction of the lens tube. To this end, the bracket 140 has an elastically deformable material containing rubber. In another solution, the bracket 140 is constructed as a bellows or a coil spring. In another solution, the bracket 140 is constructed as a disc spring, which holds the achromatic lens group 130 so that its optical axis OA is coaxial with the longitudinal center line of the mirror tube 110.

As shown in FIG. 1, the bracket 140 is fixed on the mirror tube 110 with a first end area. Along the optical axis OA, the wall thickness of the bracket 140 gradually becomes smaller toward the second end region of the bracket 140 where the achromatic lens group 130 is held. The second end area of the bracket 140 is not fixed on the mirror tube 110 and is spaced apart from the mirror tube 110 in a direction perpendicular to the optical axis OA. To this end, the bracket 140 has at least one recess, which serves as a holder for the achromatic lens group 130. The achromatic lens group 130 is accommodated and held in the recess.

The adjusting device 100 further includes a first adjusting and driving device 120 for adjusting the bracket 140 to move the achromatic lens group 130 relative to the mirror tube 110 along the optical axis OA. To this end, the first adjustment drive 120 has a coil 121 in FIG. 1, which at least partially surrounds the support 140.

The coil 121 abuts on the mirror tube 110 in FIG. 1. In another solution, the coil 121 and the mirror tube 110 are spaced apart.

In FIG. 1, the first end area of the bracket 140 is disposed outside the coil 121 with respect to the optical axis OA. The second end area of the bracket 140 is located outside the coil 121 with respect to the optical axis OA.

In another solution, the position of the first end region of the bracket 140 is consistent with an end of the coil 121 relative to the optical axis OA. In yet another solution, the first of the bracket 140 The position of the end region is located inside or outside the coil 121 with respect to the optical axis. In another solution, the second end area of the bracket 140 is located inside or outside the coil 121 with respect to the optical axis OA.

On the second end area of the bracket 140, the bracket 140 has yokes 141, 142 containing soft iron. In another solution, the bracket 140 has permanent magnet yokes 141 and 142. In FIG. 1, the bracket 140 has yokes 141 and 142 on the second end region of the bracket 140. The yokes 141 and 142 are arranged opposite to the bracket of the bracket 140. In another solution, the yokes 141 and 142 are located between the achromatic lens group 130 and the bracket 140.

When current flows through the coil 121, a magnetic field is generated in the coil. When the coil 121 is energized, the magnetic field exerts a force on the yokes 141 and 142 containing soft iron, and the force pulls the yokes 141 and 142 containing soft iron toward the center of the coil 121. The soft iron-containing yokes 141 and 142 are non-alloyed iron with a higher purity value. Thus the bracket 140 is stretched and compressed (specifically depending on where the coil 121 is arranged along the optical axis OA relative to the soft iron-containing yokes 141, 142), because the bracket 140 is tightly fixed on the mirror tube 110 on the one hand On the inside. On the other hand, the yokes 141 and 142 containing soft iron of the bracket 140 are pulled toward the center of the coil 121 by the magnetic field. The bracket 140 is stretched and compressed through the applied magnetic field, so that the bracket 140 is used to move the position of the achromatic lens group 130 along the optical axis OA. During this process, the orientation of the achromatic lens group 130 is not changed, and therefore, through the displacement of the achromatic lens group 130, only the focus of the achromatic lens group 130 is moved along the optical axis OA.

In another solution, the bracket 140 has permanent magnet yokes 141 and 142. The permanent magnet yokes 141, 142 extend in the longitudinal direction parallel to the optical axis OA. The north and south poles of the permanent magnet yokes 141 and 142 are oriented such that the north and south poles are oriented in opposite directions along the optical axis OA. In this case, the bracket 140 is based on the current in the coil 121 The direction of the current is deformed. In this way, the bracket 140 is deformed in both the first direction and the second direction, wherein the second direction is opposite to the first direction.

The bracket 140 is elastic and flexible, so it has a deformation resistance that reacts to deformation. When the bracket 140 deforms, the force generated by the deformation resistance increases or decreases according to the deformation amplitude of the bracket 140. That is, if a magnetic field is generated and the bracket 140 is deformed with the force generated by the magnetic field, the force generated by the deformation resistance and the force generated by the magnetic field form a force balance. If the magnetic field is weakened and finally disconnected, the bracket 140 will be in the initial position again due to its elasticity and flexibility. Correspondingly, the position of the bracket 140 can be set along the optical axis OA through targeted control of the current intensity of the current.

In this way, a lightweight structure for optically effective elements is realized through the structure shown in FIG. 1. In addition, the vibration of the achromatic lens group 130 is greatly reduced by the bracket 140 because the bracket 140 suppresses the vibration from the outside. When the focus of the achromatic lens group 130 needs to be adjusted, the bracket 140 is deformed through the corresponding magnetic field. During this process, only the smaller masses move, thereby minimizing the vibration of the adjusting drive device 120.

In another embodiment, the adjusting device 100 has a linear guiding device (not shown) instead of the coil 121. The linear guiding device is suitable for guiding the bracket 140 parallel to the optical axis OA. In this way, the positions of the bracket 140 and the achromatic lens group 130 can be adjusted along the optical axis OA. The adjusting device 100 includes a driving device (not shown), which is adapted to move the support 140 along the linear guide device.

Possible embodiments of the bracket 140 are shown in FIGS. 2 and 3. 2 and 3 are top views of the bracket 140, the yokes 141, 142, and the achromatic lens group 130.

In FIG. 2, the bracket 140 is used to hold at least the achromatic lens group 130 Two bracket members 143, 144 are formed. In one solution, the achromatic lens group 130 is disposed between the two bracket members 143 and 144 so that the two bracket members 143 and 144 are arranged oppositely. In another solution, the bracket has at least four bracket members (not shown), which are arranged staggered around the optical axis OA by 90° and hold the achromatic lens group 130.

In the solution shown in FIG. 3 of the bracket 140, the bracket 140 has a yoke 141, 142 on each of the two bracket members 143, 144. In the solution using four bracket members, the bracket 140 has a yoke on each of at least two bracket members, or a yoke in each of all four regions.

FIG. 3 shows another solution of the bracket 140. In this solution, the bracket 140 is constructed as an annular bracket 145 in order to hold the achromatic lens group 130.

According to the solution shown in FIG. 4, the yoke 146 has a ring shape. In the toroidal yoke 146, the induced current generated by the magnetic field is blocked by a plurality of gaps in the toroidal yoke 146. Through the annular yoke 146, the force generated by the magnetic field uniformly acts on the bracket 140 and deforms it uniformly. Alternatively, the yoke may adopt the construction scheme described with respect to FIG. 3.

FIG. 4 shows an optical element detection system 200 for detecting at least one surface O of a semiconductor chip B as an element. The optical element detection system 200 includes a receiving device 150. The accommodating device 150 is adapted to position the semiconductor chip B in front of the camera device 220 so that the camera device 220 can detect the first surface O of the semiconductor chip B. The first surface in FIG. 4 refers to a side surface of the semiconductor wafer B. However, the accommodating device 150 is not limited to aligning the surface O of the semiconductor wafer B with the camera device 220. The accommodating device 150 is suitable for aligning the semiconductor wafer B with the other surface of the semiconductor wafer B to the camera device 220 so as to inspect the other surface of the semiconductor wafer B. The optical element detection system 200 also includes a light source (not shown), which is suitable for directing light toward The first surface O of the semiconductor wafer B emits or illuminates the semiconductor wafer B. The light source is suitable for illuminating the semiconductor chip B with light of a predetermined wavelength or a predetermined wavelength range. In one solution, the light emitted by the light source is visible light with a wavelength of about 380 to 790 nm. In other schemes, infrared light or polarized light is used.

The camera device 220 includes a CCD chip 230 as an image sensor, which is adapted to receive light reflected on the first surface O of the semiconductor chip B. In other solutions, the image sensor can be a CMOS chip or an image sensor that is more sensitive to certain wavelength ranges, such as a microbolometer array or a thermoelectric array. The CCD chip-according to the wavelength range of the light used-has a corresponding sensitivity for the light range or polarized light. In the optical path of the reflected light L, the adjusting device 100 shown in FIG. 1 is configured together with the achromatic lens group 130 as the first optically effective element. In addition, in the optical path between the achromatic lens group 130 and the CCD chip 230, a condenser lens 160 as a second optically effective element is also provided. The optical axis of the condenser lens 160 is coaxial with the optical axis OA of the achromatic lens group 130.

In the optical element detection system 200 shown in FIG. 4, the adjustment device 100 has a coil 121 as the first adjustment drive device 120. In this embodiment, the bracket 140 has elastic flexibility along the longitudinal direction of the lens tube 110.

Alternatively, the optical element detection system 200 has a linear guiding device instead of the coil 121. The bracket 140 is fixed on the inner side of the mirror tube 110 through the linear guide device. In addition, the linear guiding device is suitable for guiding the bracket 140 parallel to the optical axis OA. The linear guide device is constructed as a track parallel to the optical axis OA. In another solution, the linear guide device is constructed as two tracks. In this case, the two tracks are arranged symmetrically relative to the optical axis OA.

In FIG. 4, the first surface O of the semiconductor chip B is not parallel to the image sensor surface 231 of the CCD chip 230, but is relative to the optical axis OA at an angle alpha tilt. In Figure 4, the angle alpha is greater or less than 90°.

In FIG. 4, the optical element detection system 200 further includes a control device ECU, which is suitable for controlling the first adjustment driving device 120. Therefore, the control device ECU is suitable for controlling the current of the input coil 121 to adjust the relative distance between the achromatic lens group 130 and the CCD chip 230 (or the image sensor surface 231 of the CCD chip 230). When the optical element detection system 200 includes a linear guide device instead of the coil 121, the control device ECU is adapted to control a motor that moves the bracket 140 along the linear guide device.

In FIG. 4, the control device ECU includes an image processing device BV. In another solution, the control device ECU and the image processing device BV can be two independent units suitable for mutual communication.

In addition, the optical element detection system 200 also has a second adjusting drive device 240 controlled by the control device ECU in FIG. 4. The second adjusting and driving device 240 is adapted to adjust the CCD wafer 230 so as to move the CCD wafer 230 relative to the achromatic lens group 130 along the optical axis OA.

The optical element detection system 200 further includes a position detection sensor 250, which is suitable for determining the position and/or orientation of the achromatic mirror group 130 and/or the image sensor surface 231 of the CCD chip 230. In FIG. 1, the position detection sensor 250 is arranged and fixed on the inner side of the mirror tube 110 and arranged opposite to the yoke 142. In another solution, the position detection sensor 250 can be configured and fixed on the inner side of the mirror tube 110 and disposed opposite to the yoke 141.

In another solution, the position detection sensor 250 is integrated in the CCD chip 230. In this case, the bracket 140 has a mark on at least one surface area facing the CCD wafer 230. The CCD chip 230 is suitable for detecting the mark and performing The position and/or orientation of the achromatic lens group 130 is determined.

The position detection sensor 250 provides information about the position and/or orientation of the achromatic mirror group 130 and/or the image sensor surface 231 of the CCD chip 230 to the control device ECU, which is based on the provided information Control the first and/or second adjustment drive device 120, 240. The position detection sensor 250 is an optical position detection sensor. In another solution, it can also be a motor position detection sensor.

In FIG. 4, the control device ECU is adapted to adjust the relative distance between the achromatic mirror group 130 and the CCD chip 230 by controlling the first and/or second adjustment drive devices 120, 240, so as to flatten the clarity of the reflected light L The SE is projected onto the image sensor surface 231 of the CCD chip 230 facing the reflected light L.

Under certain circumstances, the surface O of the semiconductor chip B is substantially parallel to the image sensor surface 231 of the CCD chip 230. The control device ECU controls the first and/or second adjustment driving devices 120 and 240 in such a way that the definition plane SE is projected onto the image sensor surface 231 of the CCD chip 230.

At this time, if the CCD chip 230 captures an image of the semiconductor wafer B, the semiconductor wafer B is clearly imaged in the image, so as to check possible defects or failures in the semiconductor wafer B. If the defect or failure is determined by the image processing device BV, the image processing device BV provides failure information about the semiconductor chip B.

The first and/or second adjusting and driving devices 120 and 240 are adapted to increase or decrease the relative distance between the achromatic mirror group 130 and the CCD chip 230 by 100 μm within a few milliseconds. Specifically, the first and/or second adjusting and driving device 120, 240 is suitable for changing the relative distance within 2 to 10 ms, preferably within about 5 ms, by an amplitude of 100 μm. In this way, the relative distance between the achromatic lens group 130 and the CCD chip 230 is increased or decreased, so that the achromatic lens group 130 and/or the achromatic lens group 130 and/or will not be generated or generated especially in the direction of movement. Excessive vibration of the CCD chip 230.

The semiconductor chip B is inclined relative to the image sensor surface 231 of the CCD chip 230 in FIG. 4, therefore, the control device ECU cannot adjust the relative distance between the achromatic mirror group 130 and the image sensor surface 231 of the CCD chip 230 , To project the sharpness plane SE of the reflected light L to the image sensor surface 231 of the CCD chip 230 substantially completely.

The image processing device BV is adapted to capture the first image BA through the CCD chip 230. Based on the first image BA captured through the CCD chip 230, the image processing device BV determines whether the sharpness plane SE of the reflected light L is substantially completely projected onto the image sensor surface 231 of the CCD chip 230. If the image processing device BV determines that the definition plane SE is not substantially projected onto the image sensor surface 231 of the CCD chip 230, the image processing device BV determines that one of the first image regions B1, B2 of the first image BA A first image area B1. In the first image area B1, the first subarea of the sharpness plane SE of the reflected light L is projected to the image sensor surface 231 of the CCD chip 230.

FIG. 5 schematically shows the first image BA shot, in which an image area with a solid black line is a clearly imaged image area. In other words, the image areas with black solid lines are certain image areas in which a section of the clarity plane SE of the reflected light L is projected onto the image sensor surface 231 of the CCD chip 230. The image areas with black dashed lines are certain image areas that are not clear or within the image areas, a section of the definition plane SE is not projected onto the image sensor surface 231 of the CCD chip 230.

The image processing device BV determines a second image area B2 among the plurality of first image areas B1, B2 based on the first image BA. , The second subarea of the definition plane SE of the reflected light L is not projected to the image sensor surface 231 of the CCD chip 230.

Subsequently, the image processing device BV provides a control signal to the control device ECU. The control device ECU controls the first and/or second adjustment driving devices 120 and 240 based on the control signal, so as to adjust the relative distance between the achromatic mirror group 130 and the CCD chip 230. In this process, the second part of the sharpness plane SE of the reflected light L is projected onto the image sensor surface 231 of the CCD chip 230. In this case, the second subarea of the definition plane SE of the reflected light L is projected to the image sensor surface 231 of the CCD chip 230. The first subarea of the definition plane SE of the reflected light L is no longer projected to the image sensor surface 231 of the CCD chip 230. Subsequently, the image processing device BV sends a signal to the CCD chip 230 to receive the second image BB.

As shown in FIG. 6, the image processing device BV determines a third image area B3 among the second image areas B3 and B4 of the second image BB based on the second image BB. In the third image area B3, the first section of the sharpness plane SE of the reflected light L is not projected onto the image sensor surface 231 of the CCD chip 230. Subsequently, the image processing device BV determines a fourth image area B4 among the second image areas B3 and B4 of the second image BB. In the fourth image area B4, the second subarea of the definition plane SE of the reflected light L is projected to the image sensor surface 231 of the CCD chip 230. Therefore, in the second image BB, the fourth image area B4 clearly images a segment of the semiconductor chip B. The plurality of first and second image regions is not limited to two in number.

In a preferred embodiment, the first and second image areas B1 and B2 of the first image BA respectively image a part of the semiconductor chip B, which substantially corresponds to the third and fourth images of the second image BB Semiconducting in area B3 and B4 Part of the bulk wafer B. This ensures that the same part of the semiconductor wafer B is imaged in the image areas B1, B2, B3, and B4 of the first and second images BA, BB.

In FIGS. 5 to 7, the first and second image areas B1 and B2 of the first image BA and the third and fourth image areas B3 and B4 of the second image BB are displayed as connected image areas. Alternatively, the first and second image areas B1 and B2 of the first image BA and the third and fourth image areas B3 and B4 of the second image BB may also at least partially overlap.

The image processing device BV is adapted to cut out the first image area B1 from the first image BA and cut out the fourth image area B4 from the second image BB. Based on the clipped image areas B1 and B4, the image processing device BV generates a third image BC. The third image BC is a full clear image of the semiconductor chip B, because the semiconductor chip B is clearly imaged in the first image area B1 of the first image BA and the fourth image area B4 of the second image BB.

The image processing device BV is also suitable for determining whether the semiconductor chip B has at least one defect or not based on the first image area B1 of the first image BA and/or the fourth image area B4 of the second image BB and/or the third image BC malfunction. If the semiconductor chip B has a defect or failure, the image processing device BV provides failure information.

8 to 10 show the sharpness plane SE with a corresponding depth of field ST. In order to photograph the semiconductor chip B clearly, the definition plane SE must be substantially projected onto the image sensor surface 231 of the CCD chip 230. The sharpness plane SE has a certain depth of field ST, so that the semiconductor wafer B is sharply imaged even when the sharpness plane SE is not completely parallel to the image sensor surface 231 of the CCD chip 230. Similarly, when the definition plane SE is located in front of or behind the image sensor surface 231 of the CCD chip 230 at a certain distance, the semiconductor chip B is also clearly imaged. In this situation Below, the depth of field ST describes the distance used to image the object (here, the semiconductor wafer B) sufficiently clearly.

As shown in FIG. 8, the definition plane SE is parallel to the image sensor surface 231 of the CCD chip 230 and is spaced apart from the image sensor surface 231 along the optical axis OA. The depth ST of the sharpness plane SE is sufficiently large in FIG. 8, and therefore, the image captured by the sharpness plane SE projected in this way by the reflected light L is relatively clear.

9 and 10 schematically show the state of the semiconductor wafer B after tilting. The surface O of the semiconductor chip B is inclined relative to the image sensor surface 231 of the CCD chip 230. Therefore, the definition plane SE of the reflected light L is also inclined relative to the image sensor surface 231 of the CCD chip 230.

In FIG. 9, the first subarea of the definition plane SE is projected onto the image sensor surface 231 of the CCD chip 230, so in the captured first image BA, the first image area B1 gives a clear image of the semiconductor chip B . Although the definition plane SE only partially intersects the image sensor surface 231 of the CCD chip 230, the first image area B1 of the first image BA is clearly imaged by the depth of field ST. In the second image area B2, the second subarea of the definition plane SE with the depth of field ST is no longer projected onto the image sensor surface 231 of the CCD chip 230. Therefore, the second image area B2 of the first image BA gives Unclear image of semiconductor wafer B.

According to the control instruction of the image processing device BV, the control device ECU controls the first and/or second adjustment driving devices 120 and 240 to adjust the relative distance between the achromatic mirror group 130 and the CCD chip 230. In this process, the definition plane SE is adjusted relative to the image sensor surface 231 of the CCD chip 230, so that the second sub-region of the definition plane SE is projected onto the image sensor surface 231 of the CCD chip 230.

As shown in FIG. 10, in the fourth image area B4 of the captured second image BB , The second subarea of the sharpness plane SE with the depth ST of the reflected light L is projected onto the image sensor surface 231 of the CCD chip 230. In the second image BB, the definition plane SE also only partially intersects with the image sensor surface 231 of the CCD chip 230. Therefore, with the depth of field ST, the fourth image area B4 of the second image BB clearly shows the semiconductor chip Part of B. In the third image area B3 of the second image BB, the first subarea of the definition plane SE with the depth of field ST is no longer projected onto the image sensor surface 231 of the CCD chip 230. Correspondingly, the third image area B3 of the second image BB does not clearly show a part of the semiconductor chip B.

Corresponding to the previous description of the optical element detection system 200, the method for detecting the surface of at least one semiconductor chip B will now be described.

In the first step, the semiconductor wafer B is aligned with the camera device 220. In the next step, the camera device 220 is used to detect the first surface O of the semiconductor chip B.

In the next step, the CCD chip 230 receives the light reflected on the surface O of the semiconductor chip B. In the next step, the achromatic lens group 130 is held in the optical path of the reflected light L by the support 140 having elastic flexibility in the longitudinal direction. The longitudinal direction is parallel to the optical axis OA of the achromatic lens group 130. In the next step, the relative distance between the CCD wafer 230 and the achromatic lens group 130 is adjusted to move the achromatic lens group 130 relative to the CCD wafer 230 along the optical axis OA.

Figure 11 is a time-velocity (t, v) graph. With such a graph, the control device ECU is suitable for adjusting the relative distance between the achromatic lens group 130 and the CCD chip 230.

At the time t0, the relative distance between the achromatic lens group 130 and the CCD chip 230 is adjusted through the first and/or second adjusting and driving devices 120 and 240. In the Within half of a period of time (t0-t1), the achromatic lens group 130 and/or the CCD chip 230 are accelerated to the predetermined speed v1 through the first and/or second adjusting and driving devices 120, 240. After half of the time period (t0-t1) is over, the achromatic mirror group 130 and/or the CCD chip 230 are braked through the first and/or second adjusting and driving devices 120, 240.

After the achromatic mirror group 130 and/or the image sensor 230 are adjusted, as shown in FIG. 9, the definition plane SE is projected onto the image sensor surface 231 of the CCD chip 230. After the achromatic lens group 130 and/or the CCD chip 230 are stopped, the first image BA is captured in the second time period (t1-t2).

Subsequently, the image processing device BV determines the first and second image regions B1 and B2 based on the first image BA. In the first image area B1 of the first image BA, the first partition of the definition plane SE is projected onto the image sensor surface 231 of the CCD chip 230. In the second image area B2, the second part of the definition plane SE is not projected onto the image sensor surface 231 of the CCD chip 230. In order to capture and read the image, the CCD chip 230 needs 6 to 12ms (such as about 8 to 10ms), depending on the lighting conditions and the size of the chip during the shooting, and the reading speed (pixels/second) that affects the reading time .

Then at the beginning of the third time period (t2-t3), the control device ECU controls the first and/or second adjustment drive devices 120, 240 according to the control instructions of the image processing device BV, so as to adjust the achromatic mirror group 130 and the CCD The relative distance between the wafers 230. In this process, the relative distance is adjusted in such a way that the second partition of the definition plane SE is projected onto the image sensor surface 231 of the image sensor 230.

Correspondingly, until half of the third time period (t2-t3), the achromatic mirror group 130 and/or the CCD chip 230 are accelerated to the predetermined speed. After half of the third time period (t2-t3) is over, the achromatic lens group 130 and/or the CCD chip 230 are manufactured move. Once the achromatic lens group 130 and/or the CCD chip 230 stop, the second image BB is captured through the CCD chip 230. The relative distance between the achromatic lens group 130 and the CCD chip 230 is reduced or increased, and the stroke is 70 to 150 μm, preferably 100 μm. In a time period of 2 to 10 ms, the above stroke is preferably moved in the range of 10 ms. The stroke of the relative distance between the achromatic lens group 130 and the CCD chip 230 is related to the first and/or second optically effective elements 130 and 160 used and their optical characteristics.

The image processing device BV is also suitable for providing another control command to the first and/or second adjusting and driving devices 120, 240, so that the image sensor 230 and the achromatic mirror group 130 are separated after the second image BB is captured. Adjust the relative distance to the initial length.

In another solution, the CCD chip 230 is used to capture three images each with three image areas. In one of the three image areas, a subarea with a sharpness plane SE is projected onto the image sensor surface 231 of the CCD chip 230, while in the other two image areas, the sharpness plane SE is not projected To the image sensor surface 231 of the CCD chip 230. The process of these three cameras is the same as the process of the two cameras in terms of working methods, and also only uses three images with three image areas each. In order to capture the three images and adjust the relative distance between the achromatic lens group 130 and the CCD chip 230 accordingly, the optical element detection system requires 80 to 120 ms, preferably 100 ms.

In the first solution, the accommodating device 150 is adapted to position the semiconductor chip B in front of the camera device 220 so that the definition plane SE is at least partially projected onto the image sensor surface 231 of the CCD chip 230. Correspondingly, the image processing device BV first captures the first image BA through the CCD chip 230. Subsequently, the image processing device BV determines the first and second image areas B1 and B2 and sends a control command to the control device ECU before or at the time t0. The control device ECU is based on the control instructions The first and/or second adjusting and driving devices 120, 240 are controlled to accelerate the achromatic mirror group 130 and/or the CCD chip 230 to the preset speed v1 within half of the first time period (t0-t1). After half of the first time period (t0-t1) is over, the achromatic mirror group 130 and/or the CCD chip 230 are braked. If the achromatic lens group 130 and/or the CCD chip 230 are stopped, the second image BB is captured through the CCD chip 230.

12 and 13 respectively show a time-focus curve diagram, in which different steps 310 to 360 and 410 to 460 are executed at different times, and the same steps are represented by the same component symbols. In addition, three images of the semiconductor wafer B are taken in FIGS. 12 and 13. Each image is divided into three image areas, and only one image area has a clear image of a partition of the semiconductor chip B. Therefore, only one image area is within the depth of field. But the number of images taken is not limited to the above number. In another solution, there may be multiple image areas that are completely or at least partially within the depth of field and/or intersect.

In FIG. 12, the semiconductor wafer B is positioned in front of the camera device 220 by the housing device 150 before the time point t0. After the time t0, in step 310, the CCD chip 230 captures the first image of the semiconductor device B. Immediately after step 310, in step 311, the image processing device BV determines a first image area among the plurality of first image areas in the first image. In the first image area, the clarity plane SE of the reflected light L The first partition is projected onto the image sensor surface 231 of the CCD chip 230. In step 311, the image processing device BV further determines the second and third image regions of the first image, wherein the second and third subregions of the clarity plane SE of the reflected light L are not projected to the image of the CCD chip 230 The sensor surface 231.

After a predetermined period of time after the first image is captured in step 310, the image processing device BV provides a control command to the first and/or second adjustment drive device 120, 240. In step 320, the first and/or second adjustment driving device 120, 240 adjusts the relative distance between the CCD chip 230 and the achromatic mirror group 130 with a predetermined stroke. Correspondingly, during the determination of the first, second, and third image regions, the image processing device BV adjusts the relative distance between the CCD chip 230 and the achromatic mirror group 130.

The preset stroke is related to the optical characteristics of the achromatic lens group 130 and the lens 160 and/or the size of the surface O of the element B. Preferably, the preset stroke is preset according to the depth of field ST, so that the preset stroke is less than, equal to, or greater than the depth of field ST. As shown in Figure 12, the speed when passing the preset stroke first slowly increases, and then greatly increases. After a predetermined partial stroke, the speed is first greatly reduced, and then slightly reduced. In this way, the achromatic lens group 130 and/or the CCD chip 230 are prevented from suddenly moving and stopping due to the first and/or second adjusting and driving devices 120, 240, thereby preventing excessive vibration along the moving direction.

After adjusting the relative distance in step 320, in step 330, the second image is captured by the CCD chip 230. In step 331 following step 330, the image processing device BV determines a fourth and a sixth image area among the plurality of second image areas in the second image, wherein the first image area of the clarity plane SE of the reflected light L And the third partition is not projected onto the image sensor surface 231 of the CCD chip 230. In step 331, the image processing device BV further determines the fifth image area of the second image, wherein the second subarea of the clarity plane SE of the reflected light L is projected onto the image sensor surface 231 of the CCD chip 230.

After the second image is successfully captured in step 330, the image processing device again provides a control command to the first and/or second adjustment driving device 120, 240. In step 340, the first and/or second adjusting drive device 120, 240 performs a preset stroke The relative distance between the CCD chip 230 and the achromatic lens group 130 is adjusted. In another solution, in step 340, the relative distance between the CCD chip 230 and the achromatic lens group 130 can be adjusted by a second preset stroke greater or less than the preset stroke in step 320. Correspondingly, during the determination of the fourth, fifth, and sixth image regions, the image processing device BV adjusts the relative distance between the CCD chip 230 and the achromatic lens group 130.

After adjusting the relative distance in step 340, in step 350, a third image is captured by the CCD chip 230. Immediately after successfully shooting the third image in step 351, the image processing device BV determines the seventh and eighth image regions of the third image in the second image, wherein the first and the second image regions of the clarity plane SE of the reflected light L The two partitions are not projected onto the image sensor surface 231 of the CCD chip 230. In step 351, the image processing device BV further determines the ninth image area of the third image, in which the third subarea of the clarity plane SE of the reflected light L is projected onto the image sensor surface 231 of the CCD chip 230.

After the third image is captured in step 350, the image processing device BV provides another control command to the first and/or second adjustment driving device 120, 240. In step 360, the first and/or second adjusting drive device 120, 240 adjusts the relative distance between the CCD chip 230 and the achromatic lens group 130 to the initial length. Correspondingly, during the determination of the seventh, eighth and ninth image regions, the image processing device BV adjusts the relative distance between the CCD chip 230 and the achromatic mirror group 130. The relative distance between the CCD chip 230 and the achromatic lens group 130 is adjusted to the initial length in the same manner as the adjustment of the relative distance in steps 320 and 340, but in the opposite direction.

After step 360 is completed, the image processing device BV checks whether the semiconductor chip B has defects based on the corresponding determined image regions of the first, second, and third images in successive steps 312, 332, and 352.

In another solution, the image processing device BV may generate a fourth image in step 353 after one of steps 360, 312, 332, and 352 is completed. The specific method is that the fourth image combines the first and second images. The first, fifth, and ninth image regions of the third image and the third image are cut out and joined together.

In another solution, the image processing device BV executes step 311 after one of steps 330, 331, 340, 350, 351, and 360 is completed. The image processing device BV may also perform step 331 after one of steps 340, 350, 351, and 360 is completed and/or perform step 351 after one of steps 312 and 332 is completed.

In this way, the image processing and the inspection of the semiconductor chip B's image can be separated from the imaging process. By separating the imaging of semiconductor chip B from image processing and image inspection, the imaging process can be reduced to several steps. This shortens the imaging time of each component, and can achieve a larger number of components and corresponding imaging in the same time.

In FIG. 13, the semiconductor wafer B is positioned in front of the camera device 220 before the time point t0. After time t0, in step 410, a first image is captured by the CCD chip and provided to the image processing device BV. During step 410, the image processing device BV provides a control command to the first and/or second adjusting and driving devices 120, 240 to adjust the relative distance between the CCD chip 230 and the achromatic mirror group 130 at a predetermined speed. During the shooting of the first image, the first and/or second adjusting and driving devices 120 and 240 adjust the relative distance between the CCD chip 230 and the achromatic lens group 130.

The time point at which the relative distance between the CCD chip 230 and the achromatic lens group 130 is adjusted at the preset speed, and the preset speed depends on the following factors: the optical characteristics of the achromatic lens group 130, the lens 160, and the depth of field ST; semiconductor wafer Surface O of B The size of the achromatic lens group 130 and/or the lens 160 and/or the image sensor 230; and the response characteristics of the above-mentioned components through the first and/or second adjusting and driving devices 120, 240. For example, if the depth of field is 70 μm, the sharpness plane SE is allowed to move at most 70 μm during the shooting of the first image. This ensures that a section of the semiconductor chip B is clearly imaged on an image area of the photographed image.

In Figure 13, the preset speed remains unchanged along the movement path used to generate the image. In another solution, in order to adjust the relative distance between the CCD chip 230 and the achromatic lens group, the speed can be changed within a preset speed range or between at least two different speeds.

After the definition plane SE is adjusted with a preset stroke and/or within a preset time, the second image is captured by the CCD chip 230 in step 430. The relative distance between the CCD chip 230 and the achromatic lens group 130 is continuously adjusted at the preset speed in a manner independent of the shooting of the second image. In another solution, the second image is shot when a predetermined definition plane position is reached.

After the definition plane SE continues to be adjusted with a preset stroke and/or within a preset time, a third image is captured by the CCD chip 230 in step 450. As in the case of shooting the second image, during the shooting of the third image, the relative distance between the CCD chip 230 and the achromatic lens group 130 is also adjusted at the preset speed. In another solution, during the shooting of the third image, the preset speed is reduced until the relative distance between the CCD chip 230 and the achromatic lens group 130 is no longer adjusted at the end.

Steps 311, 312, 331, 332, 351, 352, 353, 360 can be performed in the manner described in FIG. 12.

As shown in FIG. 13, during the shooting of the first, second, and third images, the achromatic lens group 130 and/or the image sensor 230 are only accelerated and stopped at one time. Such as This prevents each stop and re-acceleration, thereby further shortening the imaging time of each element. Likewise, by accelerating and stopping again, the vibration of the optical element detection system 200 is prevented.

100‧‧‧Adjusting device

110‧‧‧Mirror tube

121‧‧‧Coil

130‧‧‧Achromatic lens group, first optical effective element

130A‧‧‧Crown glass lens

130B‧‧‧Flint glass lens

140‧‧‧Support

141‧‧‧Yoke

142‧‧‧Yoke

ECU‧‧‧Control device

OA‧‧‧Optical axis

Claims (21)

An optical element detection system (200) for detecting at least one surface of at least one element (B), wherein the accommodating device (150) is adapted to position the element (B) in front of the camera device (220) so that The camera device (220) is used to detect the first surface (O) of the component (B), wherein the camera device (220) includes an image sensor (230), and the image sensor is adapted to be received on the component ( B) the reflected light (L) on the first surface (O); wherein the optical element detection system (200) includes a first optically effective element (130), which is arranged when the reflected light (L) faces the image In the optical path of the sensor (230), and an adjusting device (100) for the first optically effective element (130), the adjusting device (100) includes: a bracket for the first optically effective element (130) (140), wherein the bracket (140) is fixed on the inner side of the hollow cylindrical mirror tube (110), and the longitudinal centerline of the mirror tube (110) is in line with the optical axis (OA) of the first effective optical element (130) ) Coaxial, wherein the bracket (140) has elastic flexibility at least in the longitudinal direction of the lens tube; and a first adjustment for adjusting the relative distance between the first optically effective element (130) and the image sensor (230) The driving device (120) is used to move the first optically effective element (130) relative to the image sensor (230) along the optical axis (OA), wherein an image processing device (BV) is provided for: by the image sensor The detector (230) shoots a first image (BA), and provides the first image to the image processing device (BV); provides control instructions to the control device (ECU) to control the first adjustment drive device (120) ), so as to adjust the relative distance between the first effective optical element (130) and the image sensor (230) with a preset stroke; The second image (BB) is captured by the image sensor (230), and the second image is provided to the image processing device (BV). The optical element detection system (200) described in the first item of the scope of patent application, wherein the first adjustment drive device (120) includes a coil (121) at least partially surrounding the bracket (140); wherein the control device (ECU ) Is suitable for controlling the current input to the coil (121) for generating a magnetic field; wherein the bracket (140) has elements (141, 142) containing soft iron or permanent magnets, suitable for inputting the coil (121) The current to move the bracket (140) along the longitudinal centerline of the mirror tube (110). The optical element detection system (200) as described in item 2 or 3 of the aforementioned patent application scope, further includes: a second adjustment drive for adjusting the image sensor (230) controlled by the control device (ECU) A device (240) for moving the image sensor (230) along the optical axis (OA) relative to the first optically effective element (130); and/or at least one light source adapted to emit light to the element ( B) the first surface (O); wherein the control device (ECU) is adapted to adjust the first optically effective element (130) by controlling the first and/or the second adjustment drive device (120, 240) The relative distance between the image sensor (230) and the image sensor (230), so that the sharpness plane (SE) of the reflected light (L) is projected to the image sensor (230) facing the reflected light (L) Sensor surface (231). Optical element detection system as described in item 2 of the scope of patent application (200), wherein an image processing device (BV) is set to be adapted to: use the image sensor (230) to shoot a first image (BA), and provide the first image to the image processing device (BV); The first image (BA) determines whether the definition plane (SE) of the reflected light (L) is substantially completely projected onto the image sensor surface (231) of the image sensor (230); and if the The definition plane (SE) of the reflected light (L) is not substantially completely projected onto the image sensor surface (231) of the image sensor (230), and the first image (BA) is determined A first image area (B1) in one image area (B1, B2), in which the first section of the clarity plane (SE) of the reflected light (L) is projected onto the image The image sensor surface (231) of the sensor (230); determine a second image area (B2) in the first plurality of image areas (B1, B2) of the first image (BA), in the first image (BA) In the second image area, the second subarea of the sharpness plane (SE) of the reflected light (L) is not projected to the image sensor surface (231) of the image sensor (230); the control signal is provided to the A control device (ECU) controls the first and/or the second adjustment drive device (120, 240) to adjust the relative distance between the first optically effective element (130) and the image sensor (230) and Projecting the second subarea of the definition plane (SE) of the reflected light (L) to the image sensor surface (231) of the image sensor (230); filming by the image sensor (230) A second image (BB), providing the second image to the image processing device (BV); determining which of the second plurality of image regions (B3, B4) of the second image (BB) A third image area (B3) in which the first subarea of the definition plane (SE) of the reflected light (L) is not projected to the image sensor of the image sensor (230) A fourth image area (B4) in the second plurality of image areas (B3, B4) of the second image (BB), and in the fourth image area, the reflected light The second division of the definition plane (SE) of (L) is projected onto the image sensor surface (231) of the image sensor (230). The optical element detection system (200) described in item 2 of the scope of patent application, wherein the image processing device (BV) is provided to be adapted to: provide control instructions to the control device (ECU) to control the second adjustment drive device ( 240), so as to adjust the relative distance between the first effective optical element (130) and the image sensor (230) with a preset stroke. The optical element detection system (200) described in the second item of the scope of patent application, wherein the image processing device (BV) is adapted to: use the image sensor (230) to shoot the first image (BA), and The first image is provided to the image processing device (BV); the control instruction is provided to the control device (ECU) to control the first and/or the second adjustment drive device (120, 240), so as to film the second During an image (BA) period, the relative distance between the first effective optical element (130) and the image sensor (230) is adjusted at a preset speed; after the first image (BA) is shot or after the first image is shot After a preset period of time after the image (BA), and during the adjustment of the relative distance between the first effective optical element (130) and the image sensor (230), the image sensor (230) Take a second image (BB) and provide the second image to the image processing device (BV). The optical element detection system (200) described in item 5 or 6 of the scope of patent application, wherein the image processing device (BV) is suitable for shooting the first image (BA) or shooting the second image (BB) After: Determine a first image area (B1) in the first plurality of image areas (B1, B2) of the first image (BA), in the first image area, the clarity of the reflected light (L) The first partition of the plane (SE) is projected onto the image sensor surface (231) of the image sensor (230); and/or the first plurality of image areas (B1) of the first image (BA) are determined , B2) in a second image area (B2), in the second image area, the second partition of the definition plane (SE) of the reflected light (L) is not projected to the image sensor (230 ) The image sensor surface (231); and/or determine a third image area (B3) in the second plurality of image areas (B3, B4) of the second image (BB), in the third image In the area, the first section of the definition plane (SE) of the reflected light (L) is not projected to the image sensor surface (231) of the image sensor (230); and/or the second image is determined A fourth image area (B4) in the second plurality of image areas (B3, B4) of (BB), in the fourth image area, the second image area (SE) of the reflected light (L) The two partitions are projected onto the image sensor surface (231) of the image sensor (230). The optical element detection system (200) described in item 4 of the scope of patent application, wherein the first and second image areas (B1, B2) of the first image (BA) are respectively performed on a part of the element (B) Imaging, this part substantially corresponds to the first The part of the element (B) in the third and fourth image regions (B3, B4) of the second image (BB); and/or the second image (BA) in the definition plane (SE) of the first image (BA) A subarea and the second subarea of the definition plane (SE) in the second image (BB) are projected onto the image sensor surface of the image sensor (230) within a preset depth of field (ST) ( 231); and wherein the second partition of the definition plane (SE) in the first image (BA) and the first partition of the definition plane (SE) in the second image (BB) are in the preset The outside depth of field (ST) is projected onto the image sensor surface (231) of the image sensor (230). Such as the optical element detection system (200) described in item 4 or 8 of the scope of patent application, wherein the image processing device (BV) is also adapted to: the first image area (B1) from the first image (BA) Cut out and cut out the fourth image area (B4) from the second image (BB), and join the cut out first and fourth image areas (B1, B4) together to produce a third Image (BC); and/or the first image area (B1) and/or the fourth image area (B4) of the second image (BB) and/or the third image based on the first image (BA) (BC) to determine whether the component (B) has at least one fault; and if the image processing device (BV) determines at least one fault, providing fault information about the component (B). The optical element detection system (200) described in item 2, 4, 5, 6 or 8 of the scope of patent application also includes: a position detection sensor (250), which is suitable for determining the first optically effective element (130) and/or the position and/or orientation of the image sensor surface (231) of the image sensor (230), and will be related to the first optically effective element (130) and/or the image sensor The position and/or orientation information of the image sensor surface (231) of (230) is provided to the control device (ECU), and the control device controls the first and/or the second based on the information provided Adjust the driving device (120, 240), wherein the position detection sensor is an optical or motor position detection sensor. According to the optical element detection system (200) described in items 1, 2, 4, 5, 6 or 8 of the scope of patent application, the camera device (220) is connected between the first optical effective element (130) and the image sensor The optical path between the detectors (230) includes a second optically effective element (160), the optical axis of the second optically effective element (160) is coaxial with the optical axis of the first optically effective element (130); and/or therein The first effective optical element (130) is an achromatic lens group; and/or the second effective optical element (160) is a condenser lens. An optical element detection system (200) for detecting at least one surface of at least one element (B), wherein the accommodating device (150) is adapted to position the element (B) in front of the camera device (220) so that The camera device (220) is used to detect the first surface (O) of the component (B), wherein the camera device (220) includes an image sensor (230), and the image sensor is adapted to be received on the component ( B) the reflected light (L) on the first surface (O); wherein the optical element detection system (200) includes a first optically effective element (130), which is arranged when the reflected light (L) faces the image In the optical path of the sensor (230), and an adjusting device (100) for the first optically effective element (130), the adjusting device (100) includes: A bracket (140) for the first optically effective element (130), wherein the bracket (140) is fixed on the inner side of the hollow cylindrical mirror tube (110) by a linear guide device, and the mirror tube (110) The longitudinal centerline of is coaxial with the optical axis (OA) of the first optically effective element (130), and the linear guiding device is adapted to guide the bracket (140) parallel to the optical axis (OA) for A first adjusting and driving device (120) for adjusting the relative distance between the image sensor (230) and the first effective optical element (130), so as to move the first effective optical element relative to the image sensor (230) (130), wherein an image processing device (BV) is provided which is adapted to: use the image sensor (230) to shoot a first image (BA), and provide the first image to the image processing device (BV); Control instructions are provided to the control device (ECU) to control the first adjustment drive device (120) to adjust the relative distance between the first optically effective element (130) and the image sensor (230) with a preset stroke The second image (BB) is captured by the image sensor (230), and the second image is provided to the image processing device (BV). A method for detecting at least one surface of at least one component (B), including the following steps: aligning the component (B) with a camera device (220); detecting the component (B) by the camera device (220) The first surface (O); the image sensor (230) of the camera device (220) receives the reflected light (L) on the first surface (O) of the element (B); A support (140) with elastic flexibility in the longitudinal direction holds the first optically effective element (130) in the optical path of the reflected light (L), wherein the longitudinal direction is parallel to the Optical axis (OA) of the first effective optical element (130); shoot a first image (BA); adjust the relative distance between the image sensor (230) and the first effective optical element (130) with a preset stroke , So as to move the first optically effective element (130) relative to the image sensor (230) along the optical axis; to shoot a second image (BB). The method described in item 13 of the scope of patent application includes the following steps: adjusting the relative distance between the image sensor (230) and the first effective optical element (130) so as to be relative to the optical axis (OA) along the optical axis (OA). The first effective optical element (130) moves the image sensor (230); and adjusting the relative distance between the image sensor (230) and the first effective optical element (130) so that the reflected light ( The definition plane (SE) of L) is projected onto the image sensor surface (231) of the image sensor (230) facing the reflected light (L). The method described in item 13 of the scope of patent application includes the following steps: filming a first image (BA); determining whether the sharpness plane (SE) of the reflected light (L) is substantially based on the first image (BA) Is completely projected to the image sensor surface (231) of the image sensor (230); and if the definition plane (SE) of the reflected light (L) is not substantially completely projected to the image sensor ( 230) of the image sensor surface (231), it is determined that a first image area (B1) of the first plurality of image areas (B1, B2) of the first image (BA) is in the first image area , The first subarea of the definition plane (SE) of the reflected light (L) is projected onto the image sensor surface (231) of the image sensor (230); Determine a second image area (B2) in the first plurality of image areas (B1, B2) of the first image (BA), and in the second image area, the definition plane of the reflected light (L) The second partition of (SE) is not projected to the image sensor surface (231) of the image sensor (230); adjust the gap between the image sensor (230) and the first optical effective element (130) Relative distance, so as to project the second subarea of the sharpness plane (SE) of the reflected light (L) to the image sensor surface (231) of the image sensor (230); to shoot the second image (BB); Determine a third image area (B3) in the second plurality of image areas (B3, B4) of the second image (BB), in the third image area, the definition plane (L) of the reflected light (L) The first partition of SE) is not projected onto the image sensor surface (231) of the image sensor (230); determine that the second image (BB) is in the second plurality of image regions (B3, B4) A fourth image area (B4) in the fourth image area, in which the second section of the definition plane (SE) of the reflected light (L) is projected to the image sensor of the image sensor (230)器surface (231). The method described in item 13 of the scope of patent application includes the following steps: filming a first image (BA); adjusting the image sensor (230) and the image sensor (230) at a predetermined speed during the filming of the first image (BA) The relative distance between the first optically effective elements (130); after the first image (BA) is captured or after a preset period of time after the first image (BA) is captured, and the image sensor ( 230) During the relative distance between the first effective optical element (130) and the second image (BB). The method described in item 13 or 16 of the scope of the patent application includes the following Step: Determine a first image area (B1) in the first plurality of image areas (B1, B2) of the first image (BA), in the first image area, the clarity of the reflected light (L) The first partition of the plane (SE) is projected onto the image sensor surface (231) of the image sensor (230); and/or the first plurality of image areas (B1) of the first image (BA) are determined , B2) in a second image area (B2), in the second image area, the second partition of the definition plane (SE) of the reflected light (L) is not projected to the image sensor (230 ) The image sensor surface (231); and/or determine a third image area (B3) in the second plurality of image areas (B3, B4) of the second image (BB), in the third image In the area, the first section of the definition plane (SE) of the reflected light (L) is not projected to the image sensor surface (231) of the image sensor (230); and/or the second image is determined A fourth image area (B4) in the second plurality of image areas (B3, B4) of (BB), in the fourth image area, the second image area (SE) of the reflected light (L) The two partitions are projected onto the image sensor surface (231) of the image sensor (230). The method described in item 15 of the scope of patent application, wherein the first and second image areas (B1, B2) of the first image (BA) respectively image a part of the element (B), and this part substantially corresponds to The part of the element (B) in the third and fourth image regions (B3, B4) of the second image (BB); and/or the definition plane (SE) in the first image (BA) The first partition of the second image (BB) and the second partition of the definition plane (SE) in a The image sensor surface (231) projected to the image sensor (230) within a preset depth of field (ST); and the second partition of the definition plane (SE) in the first image (BA) And the first partition of the definition plane (SE) in the second image (BB) is projected to the image sensor surface (231) of the image sensor (230) outside the preset depth of field (ST) . The method described in item 15 of the scope of patent application includes the following steps: cutting out the first image area (B1) from the first image (BA) and the fourth image area (B4) from the second image (BB) Cut out, and join the cut out first and fourth image areas (B1, B4) together to generate a third image (BC); and/or based on the first image (BA) The first image area (B1) and/or the fourth image area (B4) of the second image (BB) and/or the third image (BC) to determine whether the component (B) has at least one fault; and If the component (B) has at least one fault, provide fault information about the component (B). The method according to any one of items 13 to 16, 18, and 19 of the scope of patent application, wherein if the stent (140) has an element containing soft iron, the stent (140) is made to be made by the generated magnetic field Deformed relative to the image sensor (230) along the optical axis (OA) toward the first direction. Such as the method described in any one of items 13 to 16, 18 and 19 in the scope of the patent application, wherein if the stent (140) has a permanent magnet element, the coil is The direction of the current in (121), through the generated magnetic field, causes the bracket (140) to deform relative to the image sensor (230) in the first direction or in a second direction, wherein the second direction is reversed In the first direction.

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