JP2020518832A - Optical component detection system and method for detecting at least one component - Google Patents

Abstract

An optical component detection system for detecting at least one surface of at least one component is disclosed, wherein a housing detects the first surface of the component by the camera device. It is arranged to be positioned in front of. The camera device has an image sensor, which is arranged to receive the light reflected at the surface of the component. The optical component detection system further includes a first optically effective member and an operating device for the first optically effective member disposed in an optical path of light reflected with respect to the image sensor. And have. The operating device has a holder for the first optically effective member. The holder is fixed inside the hollow cylindrical lens barrel, and the longitudinal center axis of the lens barrel is oriented coaxially with the optical axis of the first optically effective member. The holder can elastically bend at least in the longitudinal direction of the lens barrel. The actuating device further comprises a first for adjusting a relative distance between the optically effective member and the image sensor to displace the optically effective member with respect to the image sensor along the optical axis. Has an operation drive.

Description

Semiconductor components find application in many technological areas, such as semiconductor electronics, photovoltaics, optical detectors and the formation of beam sources (eg light emitting diodes). Due to the diverse use of semiconductor components, the demands placed on semiconductor component manufacturers, especially with regard to quality, are increasing. Defects or points of failure within or on a semiconductor component are undesirable. Because they will bring less than perfect functionality to semiconductor components. Therefore, semiconductor components are already inspected for defects and faults when they are formed. One possibility of inspecting semiconductor components is to reproduce them in the micrometer range by means of optical systems.

However, conventional constructions of optical systems have a small depth of field. If the surface to be copied of the semiconductor component to be inspected is tilted with respect to the image sensor surface of the image sensor of the optical system, the semiconductor component cannot be perfectly sharply imaged in the image. Moreover, the optical components incorporated within the optical system have a large mass. Therefore, the adjustment process is slow, or the optical system vibrates when the focus changes due to component displacement, which significantly degrades the image quality. Therefore, in order to record an image, it is necessary to wait until the vibration is stopped. When the semiconductor component is continuously formed/inspected, if the image recording time becomes long as described above, the passing amount of the semiconductor component becomes small.

DE 102008018586 relates to an optical detection device for detecting at least one surface of a component. The component is directed by the fixing member toward the camera device and the first surface of the component is illuminated by a light source having a first light beam in the shortwave region. Furthermore, the detection device has a second light source, which directs a second light beam in the long-wave region onto the second surface of the component, where the second surface of the component is the first surface. Opposite the surface. The light beam reflected by the surface is received by the camera device.

JP 2016-128781 teaches a device for investigating electronic components. The device comprises first and second image recording means, which record images of different areas of the electronic component, where these areas are two different areas of a rectangular parallelepiped. is there.

German Patent Application Publication No. 102008018586 JP, 2016-128781, A

The problem of the present application is to provide an efficient optical component detection system for detecting components.

Proposed Solution An optical component detection system for detecting at least one surface of at least one component is proposed. The receptacle is arranged to position the component in front of the camera device for detecting the first surface of the component by the camera device. The camera device has an image sensor, which is arranged to receive the light reflected at the surface of the component. The optical component detection system further includes a first optically effective member disposed in an optical path of light reflected with respect to the image sensor, and an operation for the first optically effective member. And a device. The operating device has a holder for the first optically effective member. The holder is fixed inside the hollow cylindrical lens barrel, and the longitudinal center axis of the lens barrel is oriented coaxially with the optical axis of the first optically effective member. The holder can elastically bend at least in the longitudinal direction of the lens barrel. Further, the operating device includes a first operation for adjusting a relative distance between the optically effective member and the image sensor in order to displace the optically effective member with respect to the image sensor along the optical axis. Have a drive.

Due to the elastically deflectable holder, it is possible to hold only the first optically effective member, without an appropriate screw or longitudinally displaceable frame of the optically effective member. .. When the optically effective member is an achromat, the achromat lens pair (for example, a crown glass lens and a flint glass lens) can be held by the holder. Therefore, the frame of the lens pair is not needed, and the mass to be moved of the optically effective member and the overall mass of the optical component detection system are reduced. Due to the smaller mass of the optically effective member with the holder, the position of the optically effective member can be displaced by applying a relatively small force. The smaller mass allows less inertial drive of the optically effective member. Therefore, the focal plane of the component is quickly readjusted.

The elastically flexible holder can comprise a material including rubber or a coil spring, or can be formed as a bellows. Alternatively, the holder can be formed as a disc spring, in which case the disc spring has an opening in its core axis in which the first optically effective member is housed. ing.

That is, disturbances such as vibrations from external sources into the optically effective element can be significantly dampened or even avoided. Therefore, the measurements performed by the optical component detection system are less sensitive to disturbances.

Furthermore, the elastically flexible holder is infinitely expandable or contractible due to its elastic properties, which allows an accurate adjustment of the position of the first optically effective member.

The components may not be able to be precisely matched to the optics in the actual manufacturing environment. In such cases, it is not possible to image the component perfectly sharp with sufficient depth of field. The optical component detection system introduced here allows rapid execution of a series of multiple image recordings.

Due to the good and quick adjustability of the optical component detection system, the measurement of the component can be carried out more quickly and more accurately, so that a higher throughput is obtained.

Modifications and morphology The image sensor can be a CCD chip. In other variants, the image sensor can be an image sensor sensitive for a given wavelength range, such as a CMOS chip or a microbolometer array or a pyroelectric array.

The lens barrel has a small transparency. In a variant, the lens barrel comprises a permanent magnet material. Further, the lens barrel can comprise at least aluminum or plastic.

The coil may be placed abutting the lens barrel or spaced therefrom. The position of the coil can be displaced with respect to the position of the holder on the optical axis.

The holder has a first end region, the first end region of the holder being fixed to the lens barrel. The holder further has a second end region in which the first optically effective member is held. In the inoperative state, the position of the first end region of the holder can coincide with the position of the end of the coil with respect to the optical axis. In another variation, the position of the first end region of the holder can be located inside or outside the coil with respect to the optical axis. Alternatively or additionally, the second end region of the holder can be located inside or outside the coil with respect to the optical axis.

The holder of the first operating drive can be surrounded at least in sections by a coil. The controller is arranged to control the current supplied to the coil to generate the magnetic field. The holder further comprises a soft iron-containing or permanent magnet yoke, as a component of the permanent magnet, or a yoke of the permanent magnet, which yoke follows the central longitudinal axis of the lens barrel according to the current supplied to the coil. Are arranged so that the holder can be displaced.

This structure reduces wear or abrasion of the means for adjusting the relative spacing. In addition, the force exerted on the holder by the magnetic field allows precise adjustment of the relative spacing.

When a holder having a yoke containing soft iron is arranged at one end of the coil, a force acts on the coil in the direction of the coil center. If the magnetic field is reduced and then turned off, no more force will act on the holder. In that case the holder again occupies its initial position.

When the holder has a permanent magnet yoke, the holder can extend in two directions depending on the direction of current flow through the coil and the orientation of the north and south poles of the permanent magnets of the components of the permanent magnet. Thus, the components of the permanent magnet allow the relative spacing to be displaced in both directions as desired.

The housing can be arranged to position the component in front of the camera device such that the focal plane of the component is at least partially projected onto the image sensor surface of the image sensor.

The optical component detection system further comprises a second controller controlled by the controller for displacing the image sensor to displace the image sensor relative to the first optical member along the optical axis. You can have an operating drive.

The second operating drive can have at least one piezo actuator or a finely running, linearly actuated shaft system. The finely running, linearly actuated shaft system can be a system of connecting rods.

By means of the second operating drive, it is possible to displace the image sensor on the optical axis and to project the focal plane onto the image sensor surface of the image sensor. Therefore, it is possible to quickly focus the optical system on the component.

Therefore, in the first recording of the component by means of the image sensor, a predetermined part of the component is clearly imaged in the image.

Further, the optical component detection system can have a light source, the light source being arranged to deliver light to the surface of the component. The light source is arranged to deliver light having a predetermined wavelength or light in a predetermined wavelength range to the surface of the component. The light emitted from the light source can be visible light, infrared light and/or polarized light having a wavelength in the range of about 380 nm to 780 nm. Additionally, the image sensor can be sensitive to light in the infrared light or polarized light.

As an option, the controller may control the first and/or second operating drive to control the first plane of the reflected light to project the focal plane of the reflected light onto the image sensor surface facing the reflected light of the image sensor. Can be arranged to adjust the relative spacing between the optically effective member and the image sensor.

By controlling the first and/or the second actuating drive, a quick and precise adjustment of the relative distance between the first optically effective member and the image sensor can be made so that the focal plane is The image of the sensor is projected onto the sensor surface.

The image processing of the optical component detection system is arranged to record a first image of the component by the image sensor. The image sensor provides the first image for image processing. Based on the first image formed, image processing determines whether the focal plane of the reflected light is substantially completely projected onto the image sensor surface of the image sensor. If the focal plane of the reflected light is not substantially completely projected onto the image sensor surface of the image sensor, then image processing is performed on the reflected image of the first multiple image areas of the first image. The first partial area of the focal plane of the light is arranged to define a first image area, which is projected onto the image sensor surface of the image sensor.

Furthermore, the image processing is performed on the second image in which the second partial region of the focal plane of the reflected light of the first multiple image region of the first image is not projected on the image sensor surface of the image sensor. It is arranged to define the area. The image processing is further arranged to provide control commands to the controller. The control device is arranged to control the first and/or the second operating drive to adjust the relative distance between the optically effective member and the image sensor based on the control command. .. The second partial area of the focal plane of the reflected light is then adjusted such that the focal plane of the reflected light is projected onto the image sensor area of the image sensor.

The image processing is further arranged to record a second image of the component by the image sensor. In the second image, the image processing is such that the first sub-region of the focal plane of the reflected light of the second multiple image region of the second image is not projected on the image sensor surface of the image sensor. , Define a third image area. The image processing further comprises a fourth image, wherein a second partial region of the focal plane of the reflected light of the second multiple image region of the second image is projected onto the image sensor surface of the image sensor. Define the area.

If the component cannot be sharply imaged in the image, the process described above makes it possible to form at least two recordings of the component, each of which the image area sharply reproduces a part of the component. ing. Furthermore, the perceived non-sharp image areas are sharply copied in the next image, allowing inspection of the complete component.

In a first alternative, the image processing can be arranged to record the first image by the image sensor, which image sensor provides the first image to the image processing. The image processing further controls the first and/or the second operating drive to adjust the relative distance between the first optically effective member and the image sensor by a predetermined distance length. Is arranged to provide control commands to the controller. Furthermore, the image processing is arranged by the image sensor to record a second image, in which case the image sensor provides the second image to the image processing.

The image processing may provide a control command to the first and/or second operating drive after a predetermined period of time after recording the first image.

The predetermined distance length can depend on the optical properties of the first and/or second optically effective members and/or the dimensions of the surface of the component. Preferably, the predetermined distance length can depend on the depth of field, so that the predetermined distance length is less than, equal to or greater than the depth of field.

Examine component surfaces thoroughly for defects by individual sharp-copying image areas of the recorded image at predetermined distance lengths less than, equal to, or greater than the depth of field. be able to. If the predetermined distance length is greater than the depth of field, then the predetermined surface area of the component can be investigated for defects. Similarly, other surface areas are also investigated for defects. Therefore, inspecting the surface area for defects can be performed with less computational effort and/or in a shorter time.

In a second alternative, the image processing is arranged to record a first image by an image sensor, which image sensor provides the first image to the image processing. The image processing further comprises first and/or first to adjust the relative spacing between the first optically effective member and the image sensor at a predetermined rate during recording of the first image. It is arranged to provide the control device with control instructions for controlling the two operating drives. Further, the image processing is arranged by the image sensor to record a second image, which image sensor provides the second image to the image processing. The second image is adjusted after the first image, or after a predetermined period after the first image was recorded, and the relative distance between the first optically effective member and the image sensor is adjusted. While being played, it is recorded. In another alternative, the second image is recorded after a predetermined length change in the relative spacing between the image sensor and the first optically effective member.

The image processing may be performed by the first and/or the second operating drive to stop adjusting the relative distance between the image sensor and the first optically effective member after recording the second image. Can be arranged to provide control commands for the.

The predetermined speed is determined by the optical properties of the first and/or second optically effective member, the dimensions of the surface of the component, the first and/or second optically effective member and/or the image. It may depend on the mass of the sensor and these response characteristics due to the first and/or the second operating drive.

The predetermined velocity can be selected such that the relative distance between the image sensor and the first optically effective member is not displaced further than the depth of field while the image is recorded. .. Thus, the recorded image is recorded sufficiently sharply, despite the fact that at the same time the relative distance between the image sensor and the first optically effective member is adjusted. By continuously adjusting the relative distance between the image sensor and the first optically effective member, the image sensor and/or the first optically effective member is stopped and then again No need to be accelerated. This has the advantage that vibrations caused by acceleration and deactivation of the image sensor and/or the first optically effective element are avoided. Another advantage is that the time to inspect the component for defects is minimized. This is because the image sensor and/or the first optically effective element need only be accelerated and stopped once.

The first and second alternative image processings define a first image area of the first multiple image areas of the first image after recording the first image or after recording the second image. It can be arranged. In the first image area, a first partial area of the focal plane of the reflected light is projected onto the image sensor surface of the image sensor. Additionally or alternatively, the image processing defines a second image area of the first plurality of image areas of the first image, where a second sub-area of the focal plane of the reflected light is No projection on the image sensor surface of the image sensor.

Furthermore, the image processing can additionally or alternatively define a third image area of the second number of image areas of the second image after the recording of the second image. In the third image area, the first partial area of the focal plane of the reflected light is not projected on the image sensor surface of the image sensor. Additionally or alternatively, the image processing further defines a fourth image area of the second plurality of image areas of the second image, wherein the second sub-area of the focal plane of the reflected light is It is projected onto the image sensor surface of the image sensor.

The image processing further comprises, after recording the second image, recording the second image to adjust the relative distance between the image sensor and the first optically effective member to its initial length. It can be arranged to provide control commands to the control device for controlling the first and/or the second operating drive.

The first and second image areas of the first image may each duplicate a portion of the component, which portion is substantially of the component in the third and fourth partial areas of the second image. It can correspond to the portion. The first and second image areas of the first image perfectly duplicate the component.

The first plurality of image areas of the first image can correspond to the second plurality of image areas of the second image.

The first and second image areas of the first image and/or the third and fourth image areas of the second image may be consecutive image areas. Alternatively, the first and second image areas of the first image and the third and fourth image areas of the second image may at least partially intersect.

A first partial area of the focal plane in the first image and a second partial area of the focal plane in the second image are on the image sensor surface of the image sensor within a predetermined depth of field. Can be projected on. In that case, the second partial area of the focal plane in the first image and the first partial area of the focal plane in the second image are on the image sensor surface of the image sensor outside a predetermined depth of field. Projected on.

The image processing can be arranged to cut out a first image area from the first image and a fourth image area from the second image. Further, the image processing is arranged so that the cut-out first and fourth image regions are joined together to form a third image.

By inspecting the image by forming a third image, when inspecting the component for faults or defects, only one image need be inspected by image processing and not two images. It reduces the time length and calculation time.

The image processing further comprises the component having at least one fault location based on the first image area of the first image and/or the fourth image area of the second image and/or the third image. It can be arranged to determine whether or not. The image processing is arranged to provide failure point information for the component if the image processing defines at least one failure point.

The optical component detection system may include a position detection sensor, the position detection sensor determining the position and/or orientation of the image sensor surface of the first optically effective member and/or the image sensor. It is arranged. The position detection sensor is further arranged to provide the controller with information regarding the position and/or orientation of the image sensor surface of the optically effective member and/or the image sensor, which controller is provided. The first and/or second operation drive is controlled based on the information obtained. The position detection sensor can be an optical or (electro-)mechanical position detection sensor.

The position detection sensor can be mounted inside the lens barrel. In other variants, the position detection sensor can be integrated in the image sensor. The holder has a pattern on the surface area, the pattern being directed towards the image sensor. The image sensor is arranged to recognize a pattern on the surface area and determine the position and/or orientation of the optically effective member based on the recognized surface area.

With the information provided, the controller accurately positions the first optically effective member and/or the image sensor to project the focal plane of the reflected light onto the image sensor surface of the component. Is possible.

The camera device may have a second optically effective member in the optical path between the first optically effective member and the image sensor. The optical axis of the second optically effective member is oriented coaxially with the optical axis of the first optically effective member.

The first optically effective member can be an achromat, or the achromat and/or the second optically effective member can be a condenser lens.

The refractive index of light increases continuously from red to blue, thus reducing the focal length of the lens. An achromat is used to compensate or correct this imaging error.

Furthermore, an optical component detection system is proposed for detecting at least one surface of at least one component. The receptacle is arranged to position the component in front of the camera device for detecting the first surface of the component by the camera device. The camera device has an image sensor, which is arranged to receive the light reflected at the first surface of the component. The optical component detection system further includes a first optically effective member disposed in the optical path of the light reflected with respect to the image sensor, and an operating device for the first optical member. Have The operating device has a holder for the first optical element. The holder is fixed inside the hollow cylindrical lens barrel by a linear guide, and the longitudinal center axis of the lens barrel is oriented coaxially with the optical axis of the first optically effective member. .. The linear guides are arranged to guide the holder parallel to the optical axis. The actuating device further comprises a first for adjusting the relative distance between the image sensor and the first optically effective member for displacing the first optically effective member with respect to the image sensor. Has an operation drive.

Furthermore, a manipulating device for the optically effective member is proposed, which has a holder for the first optically effective member. The holder is fixed inside the hollow cylindrical lens barrel, and the longitudinal center axis of the lens barrel is oriented coaxially with the optical axis of the first optically effective member. The holder can elastically bend at least in the longitudinal direction of the lens barrel. The operating device further comprises a first operating drive for displacing the holder for displacing the first optically effective member with respect to the image sensor along the optical axis.

Furthermore, a manipulating device for the optically effective member is proposed, which has a holder for the first optically effective member. The holder is fixed by a linear guide inside the hollow cylindrical lens barrel, and the central longitudinal axis of the lens barrel is oriented coaxially with the optical axis of the first optically effective member. .. The linear guide is arranged to guide the holder parallel to the optical axis. The operating device further comprises a first operating drive for displacing the holder for displacing the first optically effective member with respect to the lens barrel along the optical axis.

A method for additionally detecting at least one surface of at least one component is proposed, the method comprising the steps of: aligning the component with a camera device; Detected by the device; the light reflected at the first surface of the component is received by the image sensor of the camera device; by the holder that is elastically deflected in the longitudinal direction, in the optical path of the reflected light. Holding the optically effective member; wherein the longitudinal direction is oriented parallel to the optical axis of the optically effective member; along the optical axis the first optically effective member. Adjusting the relative spacing between the image sensor and the first optically effective member to displace the member relative to the image sensor.

The method may further comprise the steps of: an image sensor and a first optically effective member for displacing the image sensor with respect to the first optically effective member along an optical axis. Adjusting the relative spacing between the image sensor and the first to selectively project the focal plane of the reflected light onto the image sensor surface of the image sensor facing the reflected light. To adjust the relative spacing between the optically effective member and.

In addition, the method can include the following steps: exposing the first surface of the component with light. The light may be light having a predetermined wavelength or a predetermined wavelength range.

The method may further comprise the steps of recording a first image; based on the first image, a focal plane of the reflected light is substantially completely on the image sensor surface of the image sensor. Is projected; if the focal plane of the reflected light is not substantially completely projected onto the image sensor surface of the image sensor, then the first multiple image areas of the first image A first image area is defined, in which a first partial area of the focal plane of the reflected light is projected onto the image sensor surface of the image sensor; a second of the multiple image areas of the first image. The second partial area of the focal plane of the reflected light is not projected onto the image sensor surface of the image sensor; and the second partial area of the focal plane of the reflected light is Adjusting the relative spacing between the image sensor and the first optical member for projecting onto the image sensor surface of the image sensor; recording a second image; A third image area of the image area of the first image area, wherein the first partial area of the focal plane of the reflected light is not projected on the image sensor surface of the image sensor; A fourth image region of the multiple image regions of the image sensor, wherein a second partial region of the focal plane of the reflected light is projected onto the image sensor surface of the image sensor.

In a first alternative, the method can have the following steps: recording a first image; a relative distance between the image sensor and the first optically effective member is predetermined. Adjust the distance length; record the second image.

In a second alternative, the method can have the following steps: recording a first image; during recording of the first image, the image sensor and the first optically effective member. Adjusting the relative spacing between them at a predetermined rate; after the first image has been recorded, or after a predetermined period after the first image has been recorded, and with the image sensor and the first optical element. A second image is recorded during the adjustment of the relative spacing between the optically effective members.

The method according to the first and second alternatives can further comprise the following steps: defining a first image area of a first multiple image area of the first image, in which the reflected image area is reflected. A first sub-region of the focal plane of the light is projected onto the image sensor surface of the image sensor; and/or defines a second image region of the multiple image regions of the first image, where it is reflected The second partial region of the focal plane of the reflected light is not projected onto the image sensor surface; and/or defines a third image region of the second multiple image region of the second image, in which A first sub-region of the focal plane of the reflected light is not projected onto the image sensor surface of the image sensor; and/or a fourth sub-region of the second multiple sub-region of the second image. Where a second partial region of the focal plane of the reflected light is projected onto the image sensor surface of the image sensor.

The method may further comprise the steps of cropping a first image region from the first image and a fourth image region from the second image; and forming a third image, The cut out first and fourth image areas are joined together.

The method may further comprise the following steps: based on the first image region of the first image and/or the fourth image region of the second image and/or the third image, the component is at least Determining if it has one failure point; and providing failure point information for the component if the component has at least one failure point.

Even though some of the viewpoints described above are described in terms of methods, these viewpoints are also true of the device. Exactly the same considerations apply to the device as to the method described above.

Other objects, features, advantages and applicability will be apparent from the following description of non-limiting examples with reference to the accompanying drawings. In that case, all illustrated and/or graphically represented features, by themselves or in any combination, refer to the subject matter disclosed herein, regardless of the claim or its grouping in the attribution. There is. In that case, the dimensions and locations of the components shown in the figures are not necessarily to scale; they may differ from those shown here in the embodiment to be implemented.

FIG. 4 is a side elevational top view schematically showing an operating device for an optically effective member. It is a top view which shows the holder of an operating device diagrammatically. It is a top view which shows the holder of an operating device diagrammatically. FIG. 3 is a side top view diagrammatically showing an optical component detection system for detecting at least one surface of at least one component. Figure 3 schematically shows an image record with image areas of different sharpness. Figure 3 schematically shows an image record with image areas of different sharpness. Figure 6 schematically shows an image record consisting of an image area of a preceding image record. FIG. 3 is a side top view diagrammatically showing the focal plane of the component to be imaged with respect to the surface of the image sensor of the optical component detection system. FIG. 3 is a side top view diagrammatically showing the focal plane of the component to be imaged with respect to the surface of the image sensor of the optical component detection system. FIG. 3 is a side top view diagrammatically showing the focal plane of the component to be imaged with respect to the surface of the image sensor of the optical component detection system. Figure 4 shows a time-velocity diagram, which changes the relative spacing between the optically effective member and the image sensor of the optical component detection system. FIG. 6 shows a time-focus distance diagram, by which an example for recording an image of a component will be described. FIG. 6 shows another time-focus distance diagram, which is intended to describe another embodiment for recording an image of a component.

The device variants and their functional and driving points of view described here are only used for a better understanding of their structure, function method and characteristics. They are not intended to limit the disclosure to the examples, for example. The drawings are partly schematic, in which case the essential characteristics and effects are shown in part in greatly enlarged form in order to clarify their function, principle of operation, technical form and characteristics. .. In that case, each functional method, each principle, each technical form, and each feature disclosed in the drawings or the sentence are included in all claims, each feature in the sentence and other drawings, and this disclosure, Alternatively, any conceivable combination can be associated with the described device, as it can be freely and arbitrarily combined with other functional methods, principles, technical forms and features that emerge from it. In that case also included are combinations between all individual forms in the claims, in the text, ie in each section of the specification, and combinations between the various variants in the text, the claims and the figures. And can be the subject of other claims. The claims also do not limit the disclosure and the possibilities with which all the features indicated are combined with each other. All disclosed features, alone or in combination with all other features, are explicitly disclosed herein.

Within the detailed illustration , corresponding or functionally similar components are provided with corresponding reference numerals. The apparatus and method will be described using several embodiments.

FIG. 1 shows an operating device 100 for an achromat 130 as a first optically acting member. The achromat 130 includes a flint glass 130B and a crown glass 130A. The operating device 100 has a holder 140 for the achromat 130. The holder 140 is fixed inside the hollow cylindrical lens barrel 110, and the longitudinal center axis of the lens barrel 110 is oriented coaxially with the optical axis OA of the achromat 130. In this embodiment, the holder 140 has a ring shape. The holder 140 accommodates the achromat 130 through the opening of the holder 140 such that the optical axis OA of the achromat is coaxial with the longitudinal center axis of the lens barrel 110. The lens barrel 110 has a low transparency (transmittance μ>1) and a paramagnetic material. The paramagnetic material is aluminum. In another variation, the lens barrel 110 has plastic as the material.

The holder 140 can elastically bend at least in the longitudinal direction of the lens barrel. Therefore, the holder 140 has a material containing rubber, and the material is elastically deformable. In another variant, the holder 140 is formed as a bellows or a coil spring. In another variant, the holder 140 is formed as a disc spring, which holds the achromat 130 such that its optical axis OA is coaxial with the central longitudinal axis of the lens barrel 110.

As shown in FIG. 1, the holder 140 is fixed to the lens barrel 110 in the first end region. The material thickness of the holder 140 decreases toward the second end region of the holder 140 along the optical axis OA, and the achromat 130 is held in the second end region. In that case, the second end region of the holder 140 is not fixed to the lens barrel 110, but is separated from the lens barrel 110 in the direction orthogonal to the optical axis OA. To that end, the holder 140 has at least one recess, which is used as a frame for the achromat 130. The achromat 130 is housed and held in the recess.

The operating device 100 further comprises a first operating drive 120 for displacing the holder 140 in order to displace the achromat 130 with respect to the lens barrel 110 along the optical axis OA. To that end, the first operating drive 120 has a coil 121 in FIG. 1, which surrounds the holder 140 at least in sections.

In FIG. 1, the coil 121 is attached to the lens barrel 110. In another modification, the coil 121 is arranged apart from the lens barrel 110.

In FIG. 1, the first end region of the holder 140 is arranged outside the coil 121 with respect to the optical axis OA. In contrast, the second end region of the holder 140 is arranged inside the coil 121 with respect to the optical axis OA.

In another variation, the position of the first end region of the holder 140 coincides with the end of the coil 121 with respect to the optical axis OA. In another variation, the position of the first end of the holder 140 is located inside or outside the coil 121 with respect to the optical axis. In another variation, the second end of the holder 140 is located inside or outside the coil 121 with respect to the optical axis OA.

The holder 140 has yokes 141 and 142 containing soft iron in the second end region of the holder 140. In another variation, the holder 140 has permanent magnet yokes 141, 142. In FIG. 1, the holder 140 has yokes 141 and 142 in the second end region of the holder 140. The yokes 141 and 142 are arranged so as to face the frame of the holder 140. In another modification, the yokes 141 and 142 are arranged between the achromat 130 and the holder 140.

When a current is passed through the coil 121, a magnetic field is formed inside the coil 121. When the coil 121 is energized, the magnetic field exerts a force on the yokes 141 and 142 containing soft iron to attract the yokes 141 and 142 containing soft iron to the center of the coil 121. The yokes 141, 142 containing soft iron are non-alloyed iron with high purity. The holder 140 is thereby stretched or compressed (depending on where the coil 120 is located along the optical axis OA with respect to the yokes 141, 142 containing soft iron). This is because the holder, on the other hand, is firmly fixed inside the lens barrel 110. On the other hand, the yokes 141, 142 of the holder 140 containing soft iron are drawn into the center of the coil 121 by the magnetic field. The applied magnetic field causes the holder 140 to be stretched or compressed so that the position of the achromat 130 is displaced by the holder 140 along the optical axis OA. In that case, since the orientation of the achromat 130 is not changed, only the focus of the achromat 130 along the optical axis OA is displaced by the displacement of the achromat 130.

In another variant, the holder 140 comprises permanent magnet yokes 141, 142. The permanent magnet yokes 141 and 142 extend in the longitudinal direction parallel to the optical axis OA. The north pole and the south pole of the permanent magnet yokes 141 and 142 are oriented so that the north pole and the south pole are oriented in directions opposite to each other along the optical axis OA. In this case, the holder 140 is deformed according to the direction of current flow in the coil 121. Therefore, the holder 140 is deformed both in the first direction and in the second direction, in which case the second direction is opposite to the first direction.

Since the holder 140 is elastically flexible, it has a deformation resistance against deformation. When the holder 140 is deformed, the force generated by the deformation resistance increases or decreases according to the degree of deformation of the holder 140. Therefore, when a magnetic field is generated and the holder 140 is deformed by the force generated by the magnetic field, the force generated by the deformation resistance and the force generated by the magnetic field form a force balance. When the magnetic field is reduced and eventually turned off, the holder 140 reoccupies its initial position due to its elastically deflecting properties. Therefore, by controlling the current intensity of the current as desired, the position of the holder 140 along the optical axis OA is adjusted.

Therefore, the structure shown in FIG. 1 provides a lightweight structure for optically effective members. Further, the achromat 130 is much less susceptible to vibrations due to the holder 140. This is because the vibration that is originally external is damped by the holder 140. If the focus of the achromat 130 has to be displaced, the holder 140 is deformed by a suitable magnetic field. In that case, only small masses are moved, so that vibrations of the operating drive 120 are minimized.

In another embodiment, the operating device 100 has a linear guide (not shown) instead of the coil 121. The linear guides are arranged to guide the holder 140 parallel to the optical axis OA. Therefore, the position of the holder 140 and the position of the achromat 130 can also be displaced along the optical axis OA. The operating device 100 has a drive device (not shown), and the drive device is arranged so as to cause the holder 140 to travel along the linear guide.

2 and 3 a possible embodiment of the holder 140 is shown. 2 and 3 show the holder 140, the yokes 141, 142 and the achromat 130 from above.

In FIG. 2, the holder 140 consists of at least two holder pieces 143, 144, which together hold the achromat 130. In the modification, since the achromat 130 is arranged between the two holder pieces 143 and 144, the two holder pieces 143 and 144 face each other. In another variant, the holder consists of at least four holder pieces (not shown), which are arranged respectively displaced by 90° about the optical axis OA and hold the achromat 130.

According to a modified example of the holder 140 shown in FIG. 3, the holder 140 has yokes 141 and 142 in two holder pieces 143 and 144, respectively. In a variant with four holder pieces, the holder 140 has a yoke in at least two holder pieces, or a yoke in all four areas.

FIG. 3 shows another variant of the holder 140, in which the holder 140 is formed as a ring holder 145 for holding the achromat 130.

According to the modification shown in FIG. 4, the yoke 146 is formed in a ring shape. The induced current generated by the magnetic field inside the ring-shaped yoke 146 is interrupted by the plurality of slits inside the link-shaped yoke 146. The ring-shaped yoke 146 uniformly applies the force generated by the magnetic field to the holder 140, so that the holder is uniformly deformed. Alternatively, the yoke can be formed as described for FIG.

FIG. 4 shows an optical component detection system 200 for detecting at least one surface O of the semiconductor chip B as a component. The optical component detection system 200 has a housing 150. The housing 150 is arranged so as to position the semiconductor chip B in front of the camera device 220 so that the first surface O of the semiconductor chip B can be detected by the camera device 220. The first surface is the side surface of the semiconductor chip B in FIG. However, the housing 150 is not limited to orienting this surface O of the semiconductor chip B with respect to the camera device 220. The housing portion 150 is arranged so that the other surface of the semiconductor chip B is also directed toward the camera device 220, so that the other surface of the semiconductor chip B is also inspected. Further, the optical component detection system 200 has a light source (not shown), which sends light to the first surface O of the semiconductor chip B or illuminates the semiconductor chip B, It is arranged. The light emitted from the light source is, in a variant, visible light having a wavelength in the region of about 380 to 790 nm. In other variants, infrared light or polarized light is used.

The camera device 220 has a CCD chip 230 as an image sensor, and the CCD chip is arranged so as to receive the light reflected by the first surface O of the semiconductor chip B. In other variants, the image sensor can be a CMOS chip or an image sensor sensitive to a given wavelength range, such as a microbolometer array or a pyroelectric array. The CCD chip has a sensitivity which—according to the wavelength range used—for each wavelength range or even for polarized light. Further, in the optical path of the reflected light L, an operating device 100 as shown in FIG. 1 is arranged together with an achromat 130 as a first optically effective member. In addition, a condenser lens 160 as a second optical member is arranged in the optical path between the achromat 130 and the CCD chip 230. The optical axis of the condenser lens 160 is oriented coaxially with the optical axis OA of the achromat 130.

The operating device 100 has a coil 121 as a first operating drive 120 in the optical component detection system 200 shown in FIG. In this embodiment, the holder 140 can elastically bend in the longitudinal direction of the lens barrel 110.

Alternatively, the optical component detection system 200 has a linear guide instead of the coil 121. The holder 140 is fixed inside the lens barrel 110 via a linear guide. Furthermore, the linear guides are arranged so as to guide the holder 140 parallel to the optical axis OA. The linear guide is formed as one rail, which rail extends parallel to the optical axis OA. In another variant, the linear guide is formed as two rails. In that case, the two rails are symmetrically opposed to the axis OA.

The first surface O of the semiconductor chip B is not arranged parallel to the image sensor surface 231 of the CCD chip 230 in FIG. 4 and is inclined by the angle alpha with respect to the optical axis OA. The angle alpha is larger or smaller than 90° in FIG.

The optical component detection system 200 in FIG. 4 further comprises a control unit ECU, which is arranged to control the first operating drive 120. Therefore, the control unit ECU controls the current supplied to the coil 121, and accordingly changes the relative distance between the achromat 130 and the CCD chip 230 (or the image sensor surface 231 of the CCD chip 230). It is arranged. If the optical component detection system 200 has a linear guide instead of the coil 121, the control unit ECU is arranged to control the motor that drives the holder 140 along the linear guide. ..

In FIG. 4, the control unit ECU has an image processing BV. In another variant, the control unit ECU and the image processing BV can be two separate units, which are arranged to communicate with each other.

In addition, in FIG. 4, the optical image detection system 200 comprises a second operating drive 240 controlled by the control unit ECU. The second operating drive 240 is arranged to displace the CCD chip 230 in order to move the CCD chip 230 with respect to the achromat 130 along the optical axis OA.

The optical component detection system 200 further includes a position detection sensor 250, which is arranged to determine the position and/or orientation of the image sensor surface 231 of the achromat 130 and/or CCD chip 230. There is. The position detection sensor 250 is arranged and fixed to the inside of the lens barrel 110 in FIG. 1 and to the yoke 142. In another modification, the position detection sensor 250 can be arranged and fixed inside the lens barrel 110 and with respect to the yoke 141.

In other variations, the position detection sensor 250 can be integrated within the CCD chip 230. The holder 140 then has markings on at least one surface area facing the CCD chip 230. The CCD chip 230 is arranged to detect this marking and determine the position and/or orientation of the achromat 130 based on the detected marking.

The position detection sensor 250 provides the control unit ECU with information regarding the position and/or orientation of the image sensor surface 231 of the achromat 130 and/or the CCD chip 230, and the control unit first and/or based on the provided information. The second operation drive 120, 240 is controlled. The position detection sensor 250 is an optical position detection sensor, but in other variants it can be an (electro-)mechanical position detection sensor.

In FIG. 4, the control unit ECU controls the first and/or the second operating drive to project the focal plane SE of the reflected light onto the image sensor surface 231 of the CCD chip 230 which faces the reflected light. It is arranged so as to displace the relative distance between the achromat 130 and the CCD chip 230 by controlling 120 and 240.

In one possible case, the surface O of the semiconductor chip B is substantially parallel to the image sensor surface 231 of the CCD chip 230. The control unit ECU controls the first and/or the second operating drive 120, 240 such that the focal plane SE is projected onto the image sensor surface 231 of the CCD chip 230.

When the CCD chip 230 subsequently records an image of the semiconductor chip B, the semiconductor chip B is sharply imaged in the image and the semiconductor chip B is inspected for possible defects or faults. When a defect or a fault location is obtained by the image processing BV, the image acquisition processing BV provides fault location information regarding the semiconductor chip B.

The first and/or second manipulating drives 120, 240 are arranged to increase or decrease the relative spacing between the achromat 130 and the CCD chip 230 by 100 μm within a few milliseconds. More precisely, the first and/or the second operating drive 120, 240 are arranged to change the relative spacing by 100 μm within 2 to 10 ms, preferably within about 5 ms. The relative spacing between the achromat 130 and the CCD chip 230 is enlarged or reduced so that overshoot of the achromat 130 and/or CCD chip 230 does not occur or does not occur, especially along the direction of movement.

Since the semiconductor chip B in FIG. 4 is tilted with respect to the image sensor surface 231 of the CCD chip 230, the control unit ECU needs to adjust the relative distance between the achromat 130 and the image sensor surface 231 of the CCD chip 230. It is not possible to project the focal plane SE of the reflected light L onto the image sensor surface 231 of the CCD chip 230 substantially completely.

The image processing BV is arranged so as to record the first image BA by the CCD chip 230. Based on the first image BA recorded by the CCD chip 230, the image processing BV indicates that the focal plane SE of the reflected light L is substantially completely projected onto the image sensor surface 231 of the CCD chip 230. To determine. If the image processing BV determines that the focal plane SE is not substantially completely projected onto the image sensor surface 231 of the CCD chip 230, then the image processing BV is the first image of the first image BA. A first image area B1 of the plurality of image areas B1 and B2 is defined. In the first image area B1, the first partial area of the focal plane SE of the reflected light L is projected onto the image sensor surface 231 of the CCD chip 230.

The recorded first image BA is shown diagrammatically in FIG. 5, in which case the image area with a solid line is the sharply imaged image area. In other words, the image area having a solid line is an image area in which a partial area of the focal plane SE of the reflected light L is projected on the image sensor surface 231 of the CCD chip 230. The image area having a broken line is an image area that is not clear or an image area in which a partial area of the focal plane SE is not projected on the image sensor surface 231 of the CCD chip 230.

The image processing BV defines a second image area B2 of the first plurality of image areas B1, B2 on the basis of the first image BA, in which the second part of the focal plane SE of the reflected light L is The area is not projected onto the image sensor surface 231 of the CCD chip 230.

The image processing BV then provides a control signal to the control unit ECU. The control unit ECU controls the first and/or the second operating drive 120, 240 based on the control signal in order to adjust the relative distance between the achromat 130 and the CCD chip 230. In that case, the second part of the focal plane SE of the reflected light L is projected onto the image sensor surface 231 of the CCD chip 230. In that case, the second partial region of the focal plane SE of the reflected light L is projected onto the image sensor surface 231 of the CCD chip 230. The first partial region of the focal plane SE of the reflected light L, on the other hand, is no longer projected on the image sensor surface 231 of the CCD chip 230. The image processing BV then sends a signal to the CCD chip 230 to record the second image BB.

As shown diagrammatically in FIG. 6, the image processing BV defines a second image region B3 of the second image BB, a third image region B3 of the second plurality of image regions B3, based on the second image BB. In the third image area B3, the first partial area of the focal plane SE of the reflected light L is not projected onto the image sensor surface 231 of the CCD chip 230. The image processing BV then defines a fourth image area B4 of the second plurality of image areas B3, B4 of the second image BB. In the fourth image area B4, the second partial area of the focal plane SE of the reflected light L is projected onto the image sensor surface 231 of the CCD chip 230. Therefore, in the second image BB, the fourth image area B4 clearly copies one section of the semiconductor chip B. The first and second majority of image areas are not limited to two numbers.

In the preferred form, the first and second image areas B1, B2 of the first image BA respectively copy a part of the semiconductor chip B, which part is the third and fourth image of the second image BB. It substantially corresponds to the portion of the semiconductor chip B in the regions B3 and B4. Therefore, it is guaranteed that the same part of the semiconductor chip B is copied in the image areas B1, B2, B3, B4 of the first and second images BA, BB.

The first and second image areas B1, B2 of the first image BA and the third and fourth image areas B3, B4 of the second image BB are shown as consecutive image areas in FIGS. 5 to 7. ing. Alternatively, the first and second image areas B1, B2 of the first image BA and the third and fourth image areas B3, B4 of the second image BB can at least partially intersect. ..

The image processing BV is arranged so as to cut out the first image area B1 from the first image BA and the fourth image area B4 from the second image BB. The image processing BV forms the third image BC based on the cut-out image regions B1 and B4. The third image BC is a perfectly sharp copy of the semiconductor chip B. This is because the semiconductor chip B is clearly copied in the first image area B1 of the first image BA and the fourth image area B4 of the second image BB.

The image processing BV further includes the semiconductor chip B based on the first image region B1 of the first image B2 and/or the fourth image region B4 and/or the third image BC of the second image BB. It is arranged to determine if it has at least one defect or fault. When the semiconductor chip B has a defect or a defective portion, the image processing BV provides the defective portion information.

8 to 10 a focal plane SE with an attached depth of field ST is shown. In order to clearly record the semiconductor chip B, the focal plane SE must be substantially projected onto the image sensor surface 231 of the CCD chip 230. Since the focal plane SE has a predetermined depth of field ST, the semiconductor chip B is sharply imaged even when the focal plane SE is not perfectly parallel to the image sensor surface 231 of the CCD chip 230. .. Similarly, even when the focal plane SE is projected within a predetermined distance in front of or behind the image sensor surface 231 of the CCD chip 230, the semiconductor chip B is sharply imaged. In that case, the depth of field ST describes the interval within which the object, here the semiconductor chip B, is imaged sufficiently sharply.

As shown in FIG. 8, the focal plane SE is projected parallel to the image sensor surface 231 of the CCD chip 230 and spaced from the image sensor surface 231 along the optical axis OA. The depth of field ST of the focal plane SE is sufficiently large in FIG. 8 that the recorded image of the thus projected focal plane SE of the reflected light L is sharp.

The case of a tilted semiconductor chip B is shown diagrammatically in FIGS. 9 and 10. Since the surface O of the semiconductor chip B is tilted with respect to the image sensor surface 231 of the CCD chip 230, the focal plane SE of the reflected light L is also tilted with respect to the image sensor surface 231 of the CCD chip 230.

In FIG. 9, the first partial area of the focal plane SE is projected onto the image sensor surface 231 of the CCD chip 230, so that in the first recorded image BA, the first image area B1 is the semiconductor chip. A clear image of B is shown. The focal plane SE only partially intersects the image sensor surface 231 of the CCD chip 230, but the first image area B1 of the first image BA is sharply imaged due to the depth of field ST. .. In the second image area B2, the second partial area of the focal plane SE with the depth of field ST is no longer projected on the image sensor surface 231 of the CCD chip 230, so that the first image BA of the first image BA is The second image area B2 represents a blurred image of the semiconductor chip B.

In response to the control command of the image processing BV, the control unit ECU controls the first and/or second operation drive 120, 240 to adjust the relative distance between the achromat 130 and the CCD chip 230. In that case, the focal plane SE is displaced with respect to the image sensor surface 231 of the CCD chip 230, so that the second partial area of the focal plane SE is projected onto the image sensor surface 231 of the CCD chip 230.

As schematically shown in FIG. 10, in the second recorded image BB, in the fourth image area B4, the second part of the focal plane SE having the depth of field ST of the reflected light L. The area is projected onto the image sensor surface 231 of the CCD chip 230. In the second image BB as well, the focal plane SE only partially intersects the image sensor surface 231 of the CCD chip 230, so that the fourth image area B4 of the second image BC is reduced by the depth of field ST. One part of the semiconductor chip B is clearly reproduced. On the other hand, in the third image area B3 of the second image BC, the first partial area of the focal plane SE with the depth of field ST is no longer projected on the image sensor surface 231 of the CCD chip 230. Absent. Therefore, the third image area B3 of the second image BB reproduces a part of the semiconductor chip B indistinctly.

Corresponding to the preceding description of the optical component detection system 200, a method for detecting the surface of at least one semiconductor chip B will be described.

In one step, the semiconductor chip B is oriented with respect to the camera device 200. In the next step, the camera device 220 detects the first surface O of the semiconductor chip B.

In the next step, the light L reflected by the surface O of the semiconductor chip B is received by the CCD chip 230. In another step, the achromat 130 is held in the optical path of the reflected light L by the holder 140 that elastically bends in the longitudinal direction. The longitudinal direction is oriented parallel to the optical axis OA of the achromat 130. In the next step, the relative spacing between the CCD chip 230 and the achromat 130 is adjusted to displace the achromat 130 with respect to the CCD chip 230 along the optical axis OA.

A time-velocity (t,v) diagram is shown in FIG. Using this kind of diagram, the control unit ECU is arranged to adjust the relative distance between the achromat 130 and the CCD chip 230.

At time t0, the relative distance between the achromat 130 and the CCD chip 230 is adjusted by the first and/or second operating drive 120, 240. In that case the achromat 130 and/or the CCD chip 230 are accelerated by the first and/or the second operating drive 120, 240 to a predetermined speed v1 within half of the first period (t0-t1). .. After half the period (t0-t1), the achromat 130 and/or the CCD chip 230 are braked by the first and/or the second operating drive 120,240.

After displacement of the achromat 130 and/or the CCD chip 230, the focal plane SE is projected onto the image sensor surface 231 of the CCD chip 230, as shown in FIG. After the achromat 130 and/or the CCD chip 230 are stopped, the first image BA is recorded within the second period (t1-t2).

After that, the first and second image areas B1 and B2 are defined by the image processing BV based on the first image BA. In the case of the first image BA, the first partial region of the focal plane SE in the first image region B1 is projected onto the image sensor surface 231 of the CCD chip 230. On the other hand, in the second image area B2, the second part of the focal plane SE is not projected onto the image sensor surface 231 of the CCD chip 230. The CCD chip 230 records 6 to 12 ms (for example, 8 to 10 ms) in order to record and read an image according to the light condition and the chip size at the time of recording and the reading speed (pixel/s) for adjusting the reading period. Need time.

The control unit ECU, following the start of the third period (t2-t3) in response to the control command of the image processing BV, adjusts the relative distance between the achromat 130 and the CCD chip 230 to the first and/or Alternatively, the second operation drive 120, 240 is controlled. The relative spacing is then adjusted such that the second partial region of the focal plane SE is projected onto the image sensor surface 231 of the image sensor 230.

Therefore, the achromat 130 and/or the CCD chip 230 are accelerated to a predetermined speed by half of the third period (t2-t3). After half of the third period (t2-t3), the achromat 130 and/or the CCD chip 230 is braked. The second image BB is recorded by the CCD chip 230 as soon as the achromat 130 and/or the CCD chip 230 is stationary. The distance section in which the relative distance between the achromat 130 and the CCD chip 230 is reduced or increased lies in the region of 70 to 150 μm, preferably 100 μm. This distance section is moved within a period of 2 ms to 10 ms, preferably within 10 ms. The distance interval in which the relative distance movement between the achromat 130 and the CCD chip 230 takes place depends on the first and/or second optically active member 130, 160 used and its optical properties. ..

The image processing BV further issues another operation command to the first and/or second operation in order to displace the relative distance between the image sensor 230 and the achromat 130 to the initial length after recording the second image BB. It is arranged to serve the drives 120, 240.

In another variation, the CCD chip 230 records three images, each having three image areas. In one of the three image areas, a partial area of the focal plane SE is projected onto the image sensor surface 231 of the CCD chip 230, and in the other two image areas the focal plane SE is the image sensor surface of the CCD chip 230. 231 is not projected. The sequence of three image recordings works in the same way as the sequence of two image recordings, but with three images each having three image areas. In order to record the three images and adjust the relative spacing between the achromat 130 and the CCD chip 230 accordingly, the optical component detection system requires a time of 80 to 120 ms, preferably 100 ms.

In the first variant, the receiving part 150 allows the semiconductor chip B to be projected in front of the camera device 220 as follows, that is to say the focal plane SE is at least partially projected onto the image sensor surface 231 of the CCD chip 230. , Arranged to be positioned. Therefore, the image processing BV records the first first image BA by the CCD chip 230. Next, the image processing BV defines the first and second image regions B1 and B2, and transmits a control command to the control unit ECU before or at time t0. Based on the control command, the control unit ECU uses the first and/or the second operating drive to accelerate the achromat 130 and/or the CCD chip 230 to the speed v1 within half of the first period (t0-t1). Control 120 and 240. After half of the first period (t0-t1), the achromat 130 and/or the CCD chip 230 are braked. The second image BB is recorded by the CCD chip 230 when the achromat 130 and/or the CCD chip 230 is stationary.

12 and 13 respectively show a time-focus distance diagram in which different steps 310 to 360 and 410 to 460 are carried out at different times, the steps corresponding to one another being identical. Reference numeral is provided. Further, in FIGS. 12 and 13, three images of the semiconductor chip B are recorded. One image is divided into three image areas, in which case only one image area has a sharp image of the partial area of the semiconductor chip B, respectively. Therefore, only one image area each is within the depth of field area. However, the number of images recorded is not limited to this number. In yet other variations, more image areas may be wholly, or at least partially, within the depth of field and/or intersect with it.

In FIG. 12, the semiconductor chip B is positioned in front of the camera device 220 by the housing 150 before time t0. After the time point t0, in step 310, the CCD 230 records the first image of the semiconductor chip B. Following step 310, in step 311, the image processing BV defines a first image area of a first plurality of image areas in the first image, in which a first portion of a focal plane SE of light reflected. The area is projected onto the image sensor surface 231 of the CCD sensor 230. Furthermore, the image processing BV defines in step 311 the second and third image areas of the first image, in which the second and third partial areas of the focal plane SE of the light L reflected respectively are the CCD sensor. It is not projected onto the image sensor surface 231 of 230.

After a predetermined period of time after recording the first image in step 310, the image processing BV provides the operation command to the first and/or second operation drive 120, 240. In step 320, the first and/or second operating drive 120, 240 adjusts the relative distance between the CCD chip 230 and the achromat 130 by a predetermined distance length. Therefore, the relative distance between the CCD chip 230 and the achromat 130 is adjusted while defining the first, second and third image areas by the image processing BV.

The predetermined distance length depends on the optical properties of the achromat 130, the lens 160 and/or the dimensions of the surface O of the component B. Preferably, the predetermined distance length is predetermined by the depth of field ST, so that the predetermined distance length is smaller than, equal to or larger than the depth of field ST. As shown in FIG. 12, the speed of moving in the predetermined distance section is initially low, and then significantly increases. After a given subdistance section has been moved, the speed is reduced significantly first and then lighter. Therefore, abrupt movement and stop of the achromat 130 and/or the CCD chip 230 by the first and/or second operation drive 120, 240 and accompanying overshoot along the movement direction are avoided.

After the adjustment of the relative spacing in step 320 is completed, the second image is recorded by the CCD chip 230 in step 330. Following step 330, in step 331 the image processing BV defines in the second image the fourth and sixth image areas of the second plurality of image areas, in which the focal plane SE of the light L reflected. The first and third partial areas are not projected on the image sensor surface 231 of the CCD chip 230. Furthermore, in step 331 the image processing BV defines a fifth image area of the second image, the second partial area of the focal plane SE of the light L reflected therein being on the image sensor surface 231 of the CCD chip 230. It is projected.

After the recording of the second image in step 330, the image processing again provides control instructions to the first and/or second operating drives 120, 240. In step 340, the first and/or second operating drive 120, 240 adjusts the relative distance between the CCD chip 230 and the achromat 130 by a predetermined distance length. In another variation, the relative distance between the CCD chip 230 and the achromat 130 in step 340 is greater than or less than the predetermined distance length in step 320 by a second predetermined distance length. Can only be adjusted. Similarly, the image processing BV adjusts the relative spacing between the CCD chip 230 and the achromat 130 while defining the fourth, fifth and sixth image areas.

After the adjustment of the relative distance is completed in step 340, the third image is recorded by the CCD chip 230 in step 350. Following the successful recording of the third image, in step 351 the image processing BV defines the seventh and eighth image areas of the third image, in which the first and the first of the focal plane SE of the light L reflected. The second partial area is not projected on the image sensor surface 231 of the CCD chip 230. Furthermore, the image processing BV defines in step 351 a ninth image area of the third image, in which the third partial area of the focal plane SE of the light L reflected on the image sensor surface 231 of the CCD chip 230. It is projected.

After the third image is recorded in step 350, the image processing BV provides another control command to the first and/or second operating drive 120, 240. The first and/or second operating drive 120, 240 adjusts the relative spacing between the CCD chip 230 and the achromat 130 to its initial length in step 360. Similarly, the relative distance between the CCD chip 230 and the achromat 130 is adjusted while the image processing BV defines the seventh, eighth, and ninth image areas. Adjusting the relative distance between the CCD chip 230 and the achromat 130 to its initial length is, of course, performed in the opposite direction, as is the adjustment of the relative distance in steps 320 and 340.

After step 360, the image processing BV inspects whether the semiconductor chip B has a defect based on the respective predetermined image areas of the first, second and third images in consecutive steps 312, 332 and 352. To do.

In another variation, the image processing BV can form a fourth image in step 353 after steps 360, 312, 332, 352, where the first of the first, second and third images. , The fifth and ninth image areas are cropped and spliced together.

In another modification, the image processing BV performs step 311 after steps 330, 331, 340, 350, 351, 360. Further, the image processing BV may perform step 331 after steps 340, 350, 351, 360 and/or perform step 351 after any of steps 312, 332.

Therefore, it is possible to separate the image processing and the inspection of the image of the semiconductor chip B from the image recording process. Since the image recording of the semiconductor chip B is independent of the image processing and the image inspection, the image recording process can be reduced to a smaller number of steps. Therefore, the period of image recording gain per component is reduced, and a larger number of components and corresponding image recording can be achieved in the same time.

In FIG. 13, the semiconductor chip B is positioned in front of the camera device 220 before time t0. After time t0, the first image is recorded by the CCD chip in step 410 and provided to the image processing BV. During step 410, the image processing BV provides a control command to the first and/or second operating drive 120, 240 to adjust the relative distance between the CCD chip 230 and the achromat 130 at a predetermined speed. To do. The first and/or the second operating drive 120, 240 already adjust the relative distance between the CCD chip 230 and the achromat 130 while the first image recording is still being performed.

The time when the relative distance between the CCD chip 230 and the achromat 130 is adjusted at a predetermined speed, and the predetermined speed depends on the optical characteristics of the achromat 130, the lens 160, the depth of field ST, and the surface of the component B. The dimensions of O, the mass of the achromat 130 and/or the lens 160 and/or the image sensor 230, and their responsive behavior by the first and/or second manipulating drive 120, 240 are adapted. The focal plane SE can be moved by a maximum of 70 μm during the recording of the first image, if the depth of field is for example of the order of 70 μm. Therefore, a clear image formation of the partial area of the semiconductor chip B is guaranteed on the image area of the recorded image.

In FIG. 13, a predetermined speed along the traveling distance on which an image is formed is kept constant. In other variations, the rate of adjusting the relative spacing between the CCD chip 230 and the achromat 130 can be varied within a predetermined velocity range, or between at least two different rates.

After the focal plane SE has been displaced by a predetermined distance length and/or for a predetermined time, a second image is recorded by the CCD chip 230 in step 430. Regardless of the recording of the second image, the relative spacing between the CCD chip 230 and the achromat 130 is adjusted at a predetermined rate. In another variant, the second image is recorded when a predetermined focal plane position is reached.

A third image is recorded by the CCD chip 230 in step 450 after the focal plane SE is further displaced by a predetermined distance length and/or for a predetermined time. Similar to the case of recording the second image, the relative distance between the CCD chip 230 and the achromat 130 is adjusted at a predetermined speed during the recording of the third image. In another variant, the predetermined speed is reduced during the recording of the third image and finally the relative distance between the CCD chip 230 and the achromat 130 is no longer adjusted.

Steps 311, 312, 331, 332, 351, 352, 353, 360 can be performed as already described for FIG.

According to FIG. 13, the achromat 130 and/or the image sensor 230 are accelerated and stopped only once during the recording of the first, second and third images. Since each stop and new acceleration is avoided, the period for image recording per component is further reduced. Similarly, vibrations of the optical component detection system due to new accelerations and stops are avoided.

JP 2016-128781 teaches a device for investigating electronic components. The device comprises first and second image recording means, which record images of different areas of the electronic component, where these areas are two different areas of a rectangular parallelepiped. is there.
From DE 10 210 108 9055 A1 is known a device with a shaft in which one end of the shaft is provided with an image recording device and a lens which is linearly displaceable by an operating drive. The lens is fixed to the runner, and the runner is displaceable along the displacement direction in the cylindrical slide pipe. The operating drive has two coils, which are arranged around the slide pipe. The operating drive is simply constructed and easy to install. Furthermore, it is easily sterilized, for example using an autoclave.
From U.S. Pat. App. Pub. No. 2015/0168679, a camera module having an image sensor and a lens group is known. The lens group is displaced with respect to the image sensor by the operating device. The operating device then has a holder for the lens group, which holder is then connected via a spring to the image sensor. Due to this configuration, this camera module is particularly insensitive to vibrations. To that extent, comparable devices are known from U.S. Pat. App. Pub. No. 2014/0368724.
From U.S. Pat. Appl. Pub. No. 2011/0176046 there is known a lens displacement device which can be used, for example, for a camera module of a mobile phone. The device has an image sensor and a lens, which can be displaced with respect to the image sensor via a displacement unit. The lens group is then coupled to the image sensor via a spring. This device is particularly compact.

Claims (24)

An optical component detection system (200) for detecting at least one surface of at least one component (B), wherein a housing (150) comprises a first surface () of the component (B). Is arranged to position the component (B) in front of the camera device (220) for detecting O) by the camera device (220),
In that case, the camera device (220) has an image sensor (230) arranged to receive the light (L) reflected at the first surface (O) of the component (B). Has been
An optical component detection system (200) is then disposed in the optical path of the reflected light (L) to the image sensor (230) and a first optically effective member (130). 1 has an operating device (100) for the optically effective member (130), in which case the operating device (100)
A holder (140) for the first optically effective member (130), in which case the holder (140) is fixed inside the hollow cylindrical lens barrel (110) and The longitudinal center axis of the barrel (110) is oriented coaxially with the optical axis (OA) of the first optically effective member (130), and in that case the holder (140) is at least the lens barrel. Optically effective member for elastically deflecting in the longitudinal direction and for displacing the optically effective member (130) with respect to the image sensor (230) along the optical axis (OA). A first operating drive (120) for adjusting the relative spacing between (130) and the image sensor (230),
Optical component detection system. In that case, the first operating drive (120) has a coil (121) at least sectionally surrounding the holder (140),
The control unit (ECU) is then arranged to control the current supplied to the coil (121) in order to generate the magnetic field,
In that case, the holder (140) comprises soft iron-containing or permanent magnet components (141, 142), which carry the holder (140) to the lens barrel (110) according to the current supplied to the coil (121). ) Is arranged to be displaced along the longitudinal central axis of
An optical component detection system (200) according to claim 1. further,
An image sensor (230) controlled by a control unit (ECU) for displacing the image sensor (230) with respect to the first optically effective member (130) along the optical axis (OA). Having a second operating drive (240) for displacing and/or having at least one light source, said light source delivering light to the first surface (O) of the component (B). Is arranged like
In that case, optionally, the control unit (ECU)
In order to project the focal plane (SE) of the reflected light (L) onto the image sensor surface (231) of the image sensor (230) facing the reflected light (L), a first optically Arranged to adjust the relative spacing between the active component (130) and the image sensor (230) by the control of the first and/or second operating drive (120, 240),
An optical component detection system (200) according to claim 1 or 2. In that case the image processing (BV) is as follows:-recording a first image (BA) by the image sensor (230), said first image being provided to the image processing (BV),
The focal plane (SE) of the reflected light (L) is projected substantially completely onto the image sensor surface (231) of the image sensor (230) based on the first image (BA), And the focal plane (SE) of the reflected light (L) is not substantially completely projected onto the image sensor surface (231) of the image sensor (230):
Defining a first image area (B1) of the first multiple image areas (B1, B2) of the first image (BA), in which the first of the focal planes (SE) of the light (L) reflected. 1 partial area is projected on the image sensor surface (231) of the image sensor (230),
Defining a second image area (B2) of the first multiple image areas (B1, B2) of the first image (BA), in which the second of the focal planes (SE) of the light (L) reflected. 2 is not projected onto the image sensor surface (231) of the image sensor (230),
Adjusting the relative spacing between the first optically effective member (130) and the image sensor (230) and imaging the second partial area of the focal plane (SE) of the reflected light (L). Providing a control command to a controller (ECU) for controlling the first and/or second operational drive (120, 240) for projection onto the image sensor surface (231) of the sensor (230),
Recording a second image (BB) by means of the image sensor (230), said second image being provided to the image processing (BV),
Defining a third image area (B3) of the second multiple image areas (B3, B4) of the second image (BB), in which the focal plane (SE) of the reflected light (L) is located; 1 partial area is not projected on the image sensor surface (231) of the image sensor (230);
Defining a fourth image area (B4) of the second multiple image areas (B3, B4) of the second image (BB), in which the focal plane (SE) of the reflected light (L) is located; 2 partial areas are projected onto the image sensor surface (231) of the image sensor (230),
An optical component detection system (200) according to any one of claims 1 to 3, arranged as follows. In that case, the image processing (BV) is as follows.
Recording a first image (BA) by means of an image sensor (230), said first image being provided to an image processing (BV),
A first and/or a second operating drive (120) for adjusting the relative distance between the first optically effective member (130) and the image sensor (230) by a predetermined distance length. , 240) to provide a control command to a control unit (ECU),
Recording a second image (BB) by the image sensor (230) and providing said second image to the image processing (BV),
An optical component detection system (200) according to any one of claims 1 to 3, arranged as follows. In that case, the image processing (BV) is as follows.
Recording a first image (BA) by means of an image sensor (230), said first image being provided to an image processing (BV),
A first to adjust the relative distance between the first optically effective member (130) and the image sensor (230) at a predetermined speed during the recording of the first image (BA). Providing a control command for controlling the first and/or second operation drive (120, 240) to a control unit (ECU),
The first optically effective member (130) and the image sensor (after the first image (BA) has been recorded, or after a predetermined period of time after the first image (BA) has been recorded. A second image (BB) is recorded by the image sensor (230) while the relative distance between 230) is displaced, and the second image is provided to the image processing (BV).
An optical component detection system (200) according to any one of claims 1 to 3, arranged as follows. In that case, the image processing (BV) is performed after recording the first image (BA) or after recording the second image (BB) as follows.
Defining a first image area (B1) of the first multiple image areas (B1, B2) of the first image (BA), in which the focal plane (SE) of the reflected light (L) is The first partial region is projected onto the image sensor surface (231) of the image sensor (230) and/or
Defining a second image area (B2) of the first multiple image areas (B1, B2) of the first image (BA), in which the focal plane (SE) of the reflected light (L) is The second partial area is not projected onto the image sensor surface (231) of the image sensor (230) and/or
Defining a third image area (B3) of the second multiple image areas (B3, B4) of the second image (BB), in which the focal plane (SE) of the reflected light (L) is The first partial region is not projected onto the image sensor plane (231) of the image sensor (230) and/or
Defining a fourth image area (B4) of a second multiple image area (B3, B4) of the second image (BB), in which the focal plane (SE) of the reflected light (L) is A second partial region is projected onto the image sensor surface (231) of the image sensor (230),
An optical component detection system (200) according to claim 5 or claim 6, which is arranged to: In that case, the first and second image areas (B1, B2) of the first image (BA) respectively copy a part of the component (B), said part being the third of the second image (BB). A first part of the focal plane (SE) substantially corresponding to said part of the component (B) in the fourth image area (B3, B4) and/or in that case in the first image (BA). The region, and in the second image (BB), the second partial region of the focal plane (SE), is within the predetermined depth of field (ST), the image sensor surface (230) of the image sensor (230). 231), and in that case the second partial area of the focal plane (SE) in the first image (BA) and of the focal plane (SE) in the second image (BB). A first partial region is projected onto the image sensor surface (231) of the image sensor (230) outside of a predetermined depth of field (ST),
An optical component detection system (200) according to claim 4 or 7. In that case, the image processing (BV) is as follows.
Cutting out the first image area (B1) from the first image (BA) and the fourth image area (B4) from the second image (BB), and-forming the third image (BC) In order to do so, the clipped first and fourth image areas (B1, B4) are stitched together and/or-the first image area (B1) and/or the second image of the first image (BA) Determines whether the component (B) has at least one obstruction based on the fourth image area (B4) and/or the third image (BC) of (BB), and the image processing (BV) If you have defined at least one point of failure,
-Providing fault location information about component (B),
An optical component detection system (200) according to any one of claims 4 or 7 and/or 8, arranged as: further,
A position detection sensor (250), said position detection sensor being as follows: the position of the image sensor surface (231) of the first optically effective member (130) and/or the image sensor (230) And/or orientation to provide information to the control unit (ECU) regarding the position and/or orientation of the optically effective member (130) and/or the image sensor surface (231) of the image sensor (230). The control device controls the first and/or second operating drive (120, 240) based on the information provided.
In that case, the position detection sensor is optionally an optical or (electro-mechanical) position detection sensor,
An optical component detection system (200) according to any one of claims 1-9. In that case, the camera device (220) has a second optically effective member (160) in the optical path between the first optically effective member (130) and the image sensor (230). , In which case the optical axis of the second optically effective member (160) is oriented coaxially to the optical axis of the first optically effective member (130), and/or In that case, the first optically effective member (130) is an achromat and/or in that case the second optically effective member (160) is a condenser lens.
An optical component detection system (200) according to any one of claims 1 to 10. An optical component detection system (200) for detecting at least one surface of at least one component (B), wherein the receptacle (150) comprises a first surface () of the component (B). O) is detected by the camera device (220), arranged to position the component (B) in front of the camera device (220),
In that case, the camera device (220) has an image sensor (230) arranged to receive the light (L) reflected at the first surface (O) of the component (B). Has been
An optical component detection system (200) is then provided with a first optically effective member (130) arranged in the optical path of the light (L) reflected to the image sensor (230). An operating device (100) for the first optically effective member (130), the operating device (100) comprising:
A holder (140) for the first optically effective member (130), wherein the holder (140) is fixed inside the hollow cylindrical lens barrel (110) by a linear guide. And the longitudinal center axis of the lens barrel (110) is oriented coaxially with the optical axis (OA) of the first optically effective member (130), and in that case the linear guide is a holder. Arranged to guide (140) parallel to the optical axis (OA),
The operating device
To displace the first optically effective member (130) with respect to the image sensor (230), the relative spacing between the image sensor (230) and the first optically effective member (130) is set. Has a first operating drive (120) for adjusting,
Optical component detection system (200). An operating device (100) for an optically effective member (130), comprising:
A holder (140) for the first optically effective member (130), in which case the holder (140) is fixed inside the hollow cylindrical lens barrel (110) and The longitudinal center axis of the barrel (110) is oriented coaxially with the optical axis (OA) of the first optically effective member (130), and in that case the holder (140) is at least the lens barrel. A holder (140) for elastically deflecting in the longitudinal direction and for displacing the first optically effective member (130) with respect to the lens barrel (110) along an optical axis (OA). ) Has a first operating drive (120) for displacing
Operating device (100). An operating device (100) for an optically effective member (130), comprising:
A holder (140) for the first optically effective member (130), wherein the holder (140) is fixed inside the hollow cylindrical lens barrel (110) by a linear guide. And the longitudinal center axis of the lens barrel (110) is oriented coaxially with the optical axis (OA) of the first optically effective member (130), in which case the linear guide is The lens barrel (110) is arranged so as to guide 140) parallel to the optical axis (OA) and has a first optically effective member (130) along the optical axis (OA). A first operating drive (120) for displacing the holder (140) for displacing with respect to
Operating device (100). A method of detecting at least one surface of at least one component (B), comprising the steps of:
Aligning the component (B) with the camera device (220),
Detecting the first surface (O) of the component (B) by the camera device (220),
Receiving the light (L) reflected at the first surface (O) of the component (B) by the image sensor (230) of the camera device (220),
A holder (140) which is elastically deflectable in the longitudinal direction holds a first optically effective member (130) in the optical path of the reflected light (L), in which case said longitudinal The direction is oriented parallel to the optical axis (OA) of the optically effective member (130),
An image sensor (230) and a first optically effective member (130) for displacing the first optically effective member (130) with respect to the image sensor (230) along an optical axis. Adjust the relative distance between,
Method. It has the following steps:
An image sensor (230) and an optically effective member (130) for displacing the image sensor (230) with respect to the first optically effective member (130) along an optical axis (OA). An image sensor surface of the image sensor (230), which directs the focal plane (SE) of the reflected light (L) to the reflected light (L). 231) adjusts the relative spacing between the image sensor (230) and the first optically effective member (130) for projection onto,
The method according to claim 15. It has the following steps:
-Record the first image (BA),
-The focal plane (SE) of the reflected light (L) is projected substantially completely onto the image sensor surface (231) of the image sensor (230), based on the first image (BA); And the focal plane (SE) of the reflected light (L) is not substantially completely projected onto the image sensor surface (231) of the image sensor (230):
Defining a first image area (B1) of the first multiple image areas (B1, B2) of the first image (BA), in which the focal plane (SE) of the reflected light (L) is A first partial region is projected onto the image sensor surface (231) of the image sensor (230),
Defining a second image area (B2) of the multiple image areas (B1, B2) of the first image (BA), in which the second of the focal plane (SE) of the reflected light (L) is The partial area is not projected onto the image sensor surface (231) of the image sensor (230),
An image sensor (230) and a first optic for projecting a second sub-region of the focal plane (SE) of the reflected light (L) onto the image sensor surface (231) of the image sensor (230). The relative distance between the effective member (130) and
-Define the second image (BB),
Defining a third image area (B3) of the second multiple image areas (B3, B4) of the second image (BB), in which the focal plane (SE) of the reflected light (L) is The first partial region is not projected onto the image sensor surface (231) of the image sensor (230),
Defining a fourth image area (B4) of a second multiple image area (B3, B4) of the second image (BB), in which the focal plane (SE) of the reflected light (L) is A second partial region is projected onto the image sensor surface (231) of the image sensor (230),
The method according to claim 15 or 16. It has the following steps:
-Record the first image (BA),
Adjusting the relative distance between the image sensor (230) and the first optically effective member (130) by a predetermined distance length,
-Record the second image (BB),
The method according to claim 15 or 16. It has the following steps:
-Record the first image (BA),
Adjusting the relative distance between the image sensor (230) and the first optically effective member (130) at a predetermined speed while recording the first image (BA),
-After the first image (BA) has been recorded, or after a predetermined time period after the first image (BA) has been recorded, and with the image sensor (230) and the first optically active Recording a second image (BB) while the relative spacing between the different members (130) is adjusted,
The method according to claim 15 or 16. It has the following steps:
Defining a first image area (B1) of the first multiple image areas (B1, B2) of the first image (BA), in which the first of the focal plane (SE) of the (light L) reflected. A partial area of one is projected onto the image sensor surface (231) of the image sensor (230), and/or a second image of multiple image areas (B1, B2) of the first image (BA). Defining a region (B2) in which the second sub-region of the focal plane (SE) of the reflected light (L) has not been projected onto the image sensor surface (231) of the image sensor (230), And/or-defining a third image area (B3) of the second multiple image areas (B3, B4) of the second image (BB), in which the focal plane (SE) of the reflected light (L) (SE). ) Is not projected onto the image sensor surface (231) of the image sensor (230) and/or-the second multiple image areas (B3, B3) of the second image (BB). B4) defining a fourth image area (B4) in which the second partial area of the focal plane (SE) of the reflected light (L) is on the image sensor surface (231) of the image sensor (230). Is projected on
20. A method according to any one of claims 18 or 19. In that case, the first and second image regions (B1, B2) of the first image (BA) each copy one part of the component (B), said part being the second part of the second image (BB). 3 and 4 corresponds substantially to said part of the component (B) in the image area (B3, B4) and/or in that case the first of the focal planes (SE) in the first image (BA). , And in the second image (BB), the second partial area of the focal plane (SE) is the image sensor plane of the image sensor (230) within a predetermined depth of field (ST). Is projected onto (231),
In that case, a partial area of the focal plane (SE) in the first image (BA) and a first partial area of the focal plane (SE) in the second image (BB) are determined by a predetermined object. Projected onto the image sensor surface (231) of the image sensor (230) outside the depth of field (ST),
21. A method according to any one of claims 17 or 20. It has the following steps:
-Cut out a first image area (B1) from the first image (BA), a fourth image area (B4) from the second image (BB), and-form a third image (BC) In order to stitch the cut-out first and fourth images (B1, B4), and/or-the first image area (B1) and/or the second image (BB) of the first image (BA). ) The fourth image area (B4) and/or the third image (BC) of the component (B) has at least one obstruction, and the component (B) has at least one If you have an obstacle,
-Provides fault information about component (B),
22. A method according to any one of claims 17 or 20 and/or 21. In that case, when the holder (140) has a component containing soft iron, the holder (140) deforms in a first direction along the optical axis (OA) with respect to the image sensor (230) by the magnetic field generated. 23. A method according to any one of claims 15 to 22 which is performed. When the holder (140) has a component of a permanent magnet, the magnetic field generated by the holder (140) is either first or second with respect to the image sensor (230) according to the flow direction of the current flowing in the coil (121). 23. The method according to any one of claims 15 to 22, wherein the method is deformed in two directions, wherein the second direction is opposite to the first direction.

Images