TWI713593B - 使用脈衝雷射於玻璃基板形成孔之方法、及製造具有孔之玻璃基板之方法 - Google Patents

使用脈衝雷射於玻璃基板形成孔之方法、及製造具有孔之玻璃基板之方法 Download PDF

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Publication number
TWI713593B
TWI713593B TW105131221A TW105131221A TWI713593B TW I713593 B TWI713593 B TW I713593B TW 105131221 A TW105131221 A TW 105131221A TW 105131221 A TW105131221 A TW 105131221A TW I713593 B TWI713593 B TW I713593B
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TW
Taiwan
Prior art keywords
glass substrate
pulse laser
diameter
hole
pulse
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TW105131221A
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English (en)
Chinese (zh)
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TW201720768A (zh
Inventor
堀內浩平
小野元司
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日商Ａｇｃ股份有限公司
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Publication of TW201720768A publication Critical patent/TW201720768A/zh
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW105131221A 2015-10-01 2016-09-29 使用脈衝雷射於玻璃基板形成孔之方法、及製造具有孔之玻璃基板之方法 TWI713593B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP??2015-196264 2015-10-01
JP2015196264 2015-10-01

Publications (2)

Publication Number Publication Date
TW201720768A TW201720768A (zh) 2017-06-16
TWI713593B true TWI713593B (zh) 2020-12-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW105131221A TWI713593B (zh) 2015-10-01 2016-09-29 使用脈衝雷射於玻璃基板形成孔之方法、及製造具有孔之玻璃基板之方法

Country Status (3)

Country Link
US (2) US10442720B2 (enExample)
JP (2) JP6274284B2 (enExample)
TW (1) TWI713593B (enExample)

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JP7195261B2 (ja) 2017-10-04 2022-12-23 ギガフォトン株式会社 レーザ加工方法
WO2019189225A1 (ja) * 2018-03-26 2019-10-03 Ａｇｃ株式会社 拡散素子、照明モジュールおよび非球面レンズの加工方法
US10470300B1 (en) * 2018-07-24 2019-11-05 AGC Inc. Glass panel for wiring board and method of manufacturing wiring board
JP7139886B2 (ja) 2018-10-30 2022-09-21 Ａｇｃ株式会社 孔を有するガラス基板の製造方法、およびアニール用ガラス積層体
EP4021678A1 (en) * 2019-08-30 2022-07-06 Corning Incorporated Method and apparatus for forming holes in brittle materials assisted by stress reduction through heating
WO2024034035A1 (ja) * 2022-08-09 2024-02-15 ギガフォトン株式会社 レーザ加工方法、レーザ加工装置、及び電子デバイスの製造方法

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TW201527024A (zh) * 2013-12-17 2015-07-16 康寧公司 可離子交換玻璃基板之雷射切割

Also Published As

Publication number Publication date
US20170096361A1 (en) 2017-04-06
US10442720B2 (en) 2019-10-15
TW201720768A (zh) 2017-06-16
JP2017066027A (ja) 2017-04-06
US20190359515A1 (en) 2019-11-28
JP6274284B2 (ja) 2018-02-07
JP2018035067A (ja) 2018-03-08

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