TWI713269B - Power module - Google Patents

Abstract

Disclosed is a power module which comprises a circuit board, an upper covering member and a lower covering member. The upper covering member is a rectangular body and is recessed from a lower surface thereof. The two inner sidewall surfaces of the upper covering member face each other and each of them has a buckling portion. The bucking portion protrudes in a tapered way from the inner sidewall surface of the upper covering member so as to form an inclined plane thereon. The lower covering member is manufactured by aluminum extrusion. The lower covering member has a rectangular base plate and two buckling plates. Two buckling plates extend side by side from the rectangular base plate. An outer surface of the buckling plate has a corresponding buckling portion which is a groove formed by being recessed inwardly from the outer surface of the buckling plate. The upper covering member is assembled with the lower covering member by buckling the buckling portion to the corresponding buckling portion, wherein the circuit board is disposed in the space between the upper covering member and the lower covering member.

Description

Power module

The present invention relates to a power converter, and particularly relates to a power module.

The power converter is an electronic device with the function of raising and lowering voltage, which can convert unstable input DC power into a rated output power to supply electrical energy to electronic products.

The structure of the power converter usually includes an upper cover, a lower cover, a circuit board, and other electronic components. After the upper cover and the lower cover are combined, the circuit board and other electronic components are assembled between the upper cover and the lower cover. Between the space.

However, after the conventional power converter is assembled, the upper cover body and the lower cover body are not firmly combined, so that the lower cover body is easily loosened from the upper cover body. Therefore, it is necessary to improve the combination structure of the upper cover and the lower cover of the conventional power converter.

Therefore, the purpose of the present invention is to provide a power module that can increase the stability of the combination between the upper cover and the lower cover to avoid loosening.

The technical means adopted by the present invention to solve the problems of the conventional technology is to provide a power module, including: a circuit board; an upper cover, which is a rectangular body, the upper cover is recessed upward from the lower surface, and the upper cover It has a first inner side wall surface, a second inner side wall surface, a third inner side wall surface, and a fourth inner side wall surface. The first inner side wall surface and the third inner side wall surface face each other correspondingly, the first inner side wall surface and the third inner side The wall surfaces each have a buckle portion, and the buckle portion protrudes from the first inner side wall surface and the third inner side wall surface in a changing manner in which the upper side is wide and the lower is narrow, so that the buckle has an inclined surface; and a lower cover, A structure formed by an aluminum extrusion method. The lower cover has a rectangular bottom plate and two buckle plates. The two buckle plates extend side by side from the rectangular bottom plate at intervals, and each buckle plate has An inner surface of a gusset plate and an outer surface of a gusset plate. The inner surfaces of the gusset plate of the two gusset plates face each other correspondingly. Each of the gusset plate outer plates has a buckle part, each The buckle part is a groove formed by recessing inward from the outer surface of the buckle plate, wherein the upper cover member is assembled with the lower cover member by buckling the buckle part to the buckle part, An assembling space is formed between the upper cover and the lower cover, and the circuit board is arranged in the assembling space.

In one embodiment of the present invention, a power module is provided, wherein the upper cover has a pair of long side walls and a pair of short side walls, the inner side wall surface of one of the long side walls of the pair of long side walls is the first inner side wall surface, and The inner side wall surface of one long side wall is the third inner side wall surface, the inner side wall surface of one of the short side walls of the pair of short side walls is the second inner side wall surface, and the inner side wall surface of the other short side wall is the fourth inner side wall surface.

In an embodiment of the present invention, a power module is provided, wherein the buckle portion is recessed inward from the outer side wall surface of the upper cover, and the buckle portion protrudes inward from the inner side wall surface of the upper cover member.

In an embodiment of the present invention, a power module is provided, wherein the buckle portion is recessed inward from the outer surface of the buckle plate to form a groove with a cross-sectional shape.

In an embodiment of the present invention, a power module is provided, wherein the buckle portion is recessed from the outer surface of the buckle plate to form a groove with a semicircular cross-sectional shape.

In an embodiment of the present invention, a power supply module is provided, wherein the buckle portion is recessed from the outer surface of the buckle plate to form a groove with a triangular cross-sectional shape.

In an embodiment of the present invention, a power supply module is provided, wherein the buckle portion is plural.

In one embodiment of the present invention, a power supply module is provided, wherein the rectangular bottom plate has a recess, a pair of long side walls and a pair of short side walls, and the recesses are respectively recessed inward from the outer wall surface of each of the long side walls.

In an embodiment of the present invention, a power supply module is provided, wherein the concave portion is plural.

The power supply module of the present invention has the following effects: by buckling the buckle portion with the buckle portion, the upper cover member and the lower cover member can be more closely combined to avoid the lower cover The piece comes loose from the upper cover piece. In addition, when the upper cover member and the lower cover member are combined, since the buckle portion of the upper cover member has a slope structure, the buckle plate of the lower cover member will be slightly squeezed when being combined, so that the The buckle portion of the buckle plate is easily buckled with the buckle portion of the upper cover member, so that the upper cover member and the lower cover member are smoothly combined. Therefore, the present invention can improve the assembly quality of the power module. In addition, the lower cover is formed by aluminum extrusion to form all the structures (including the rectangular bottom plate, the buckle plate and the buckle part). In other words, the lower cover does not need to be processed to make a specific The structure can simplify the manufacturing process and reduce the production cost.

Hereinafter, the embodiments of the present invention will be described based on Figs. 1 to 7. This description is not intended to limit the implementation of the present invention, but is a kind of embodiment of the present invention.

As shown in FIGS. 1 to 4, a power module 100 according to an embodiment of the present invention includes: a circuit board 1; an upper cover 2 is a rectangular body, and the upper cover 2 extends from the bottom surface Recessed upward, the upper cover 2 has a first inner side wall surface 221, a second inner side wall surface 231, a third inner side wall surface 222, and a fourth inner side wall surface 232, the first inner side wall surface 221 and the third inner side wall surface 222 Facing each other, the first inner side wall surface 221 and the third inner side wall surface 222 each have a buckle portion 24, the buckle portion 24 is from the first inner side wall surface 221 and the third inner side wall surface 222 wide and narrow at the bottom The buckle portion 24 is protruding in a variable manner so that the buckle portion 24 has an inclined surface; and the lower cover 3 is a structure formed by aluminum extrusion. The lower cover 3 has a rectangular bottom plate 31 and two buckles The two receiving plates 32, 33 extend side by side from the rectangular bottom plate 31 at an interval. The receiving plate 32 has an outer surface 321 of the receiving plate and an inner surface 322 of the receiving plate. The buckle plate 33 has an outer plate surface 331 of the buckle plate and an inner plate surface 332 of the buckle plate. The inner plate surface 322 of the buckle plate and the inner plate surface 332 of the buckle plate face each other. The plate surfaces 321 and 331 each have a buckle portion 34, and each of the buckle portions 34 is a groove recessed inwardly from the outer plate surface 321, 331 of the buckle plate, wherein the upper cover 2 The buckle portion 24 is buckled to the buckle portion 34 to be assembled with the lower cover 3, and an assembly space is formed between the upper cover 2 and the lower cover 3, and the circuit board 1 is disposed on the Assembly space.

As shown in Figure 2, according to the power module 100 of the embodiment of the present invention, the circuit board 1 is a rectangular body, and the basic composition of the circuit board 1 includes a substrate, a circuit (not shown), and a via ( Not shown), pins and various electronic components (for example: capacitors or resistors), etc. Common raw materials for circuit board substrates include bakelite, fiberglass board and various plastic boards. The circuits and pins of the circuit board are used to electrically connect and conduct various electronic components with each other. The through holes of the circuit board are used to conduct more than two levels of lines.

As shown in FIGS. 1 to 3, according to the power module 100 of this embodiment of the present invention, the upper cover 2 is composed of a rectangular top plate 21 and two pairs of side plates 22 and 23. The rectangular top plate 21 has two pairs of sides, the pair of side plates 22 respectively extend downward from a pair of sides of the rectangular top plate 21, and the pair of side plates 23 respectively extend downward from the other pair of sides of the rectangular top plate 21. The inner plate surfaces of the pair of side plates 22 are the first inner wall surface 221 and the third inner wall surface 222 respectively. The inner surfaces of the pair of side plates 23 are the second inner wall surface 231 and the fourth inner wall surface 232 respectively. In addition, the rectangular top plate 21 has a plurality of holes 211 for the pins of the circuit board 1 to pass through.

As shown in Figures 1 and 2, according to the power module 100 of this embodiment of the present invention, in this embodiment, the length of the pair of side plates 22 is greater than the length of the pair of side plates 23, and the width of the pair of side plates 22 It is equal to the width of the pair of side plates 23. The first inner wall surface 221 and the third inner wall surface 222 face and correspond to each other, and the second inner wall surface 231 and the fourth inner wall surface 232 face and correspond to each other.

As shown in Figure 3, according to the power module 100 of the embodiment of the present invention, in this embodiment, the buckle portion 24 is recessed inward from the outer surface of the pair of side plates 22, so that the buckle The portions 24 respectively protrude inward from the inner plate surfaces of the pair of side plates 22 (that is, the first inner wall surface 221 and the third inner wall surface 222). Of course, the present invention is not limited to this. The buckle portion 24 can also be recessed inward from the outer surface of the pair of side plates 23, so that the buckle portion 24 is respectively formed from the inner surface of the pair of side plates 23 (also That is, the second inner wall surface 231 and the fourth inner wall surface 232) protrude inward. In addition, in this embodiment, the number of the locking portions 24 is four, that is, the first inner wall surface 221 and the third inner wall surface 222 each protrude two of the locking portions 24. Of course, the number of the buckle portions 24 protruding from the first inner wall surface 221 and the third inner wall surface 222 can also be one or more than two.

As shown in FIGS. 2 and 4, according to the power module 100 of this embodiment of the present invention, the lower cover 3 is a structure formed by extrusion. Specifically, Extrusion is a material manufacturing method, and the cross-sectional shapes of objects manufactured by the material through the extrusion method are consistent. In the prior art, the lower cover 3 is not manufactured by extrusion, and the specific structure of the lower cover 3 (for example, the buckle portion 34) needs to be processed to be formed. In the present invention, the advantage of the lower cover 3 made by extrusion is that all the structures of the lower cover 3 (including: the rectangular bottom plate 31, the buckle plates 32, 33 and the buckle portion 34) can be Once formed, no processing is required. Therefore, compared with the prior art, the present invention uses an extrusion method to manufacture the lower cover 3, which can reduce the production cost. In addition, in this embodiment, the material of the lower cover 3 is aluminum. Of course, the material of the lower cover 3 can also be other metal materials.

As shown in Figures 2 and 4, according to the power module 100 of the embodiment of the present invention, the rectangular bottom plate 31 extends along a horizontal direction, and the two buckle plates 32 and 33 also extend along the horizontal direction. The rectangular bottom plate 31 has the same cross-sectional shape as the two buckle receiving plates 32 and 33. In this embodiment, the rectangular bottom plate 31 has a recess 311, a pair of long side walls, and a pair of short side walls. Each of the long side walls has three recesses 311, and the recesses 311 are recessed inward from the outer wall surface of the long side wall. . The recess 311 is used for fixing the rectangular bottom plate 31 to the base frame of an electronic device. In addition, in this embodiment, the length and width of the two buckle plates 32 and 33 are the same.

As shown in FIGS. 2 and 4, according to the power module 100 of the embodiment of the present invention, the buckle portion 34 is recessed inward from the outer plate surfaces 321, 331 of the buckle plate and extends along the horizontal The direction of the groove formed. Specifically, the buckle receiving portion 34 is disposed on the lower side of the buckle receiving plates 32 and 33 and has a distance from the upper surface of the rectangular bottom plate 31. In this embodiment, the cross-sectional shape of the buckle portion 34 is a square shape. Of course, the present invention is not limited to this, and the cross-sectional shape of the buckle portion 34 can also be other shapes.

As shown in FIGS. 2 to 4, according to the power module 100 of the embodiment of the present invention, the protrusion height of the buckle portion 24 changes from the bottom of the pair of side plates 22 toward the The top of the opposite side plate 22 protrudes inwardly, so that each of the buckling portions 24 has a slope, and the cross-sectional shape of the buckling portion 24 is an inverted right triangle. When the upper cover 2 and the lower cover 3 are combined, the buckle plates 32, 33 slide along the inclined surface of the buckle portion 24 so that the buckle portion 34 is easily buckled with the buckle portion 24, The upper cover 2 and the lower cover 3 are smoothly combined.

As shown in Figure 5, a power module according to the second embodiment of the present invention differs from the first embodiment in that the buckle portion 34A is recessed inward from the outer plate surfaces 321A, 331A of the buckle plate A groove with a semicircular cross-sectional shape is formed.

As shown in Figure 6, a power module according to the third embodiment of the present invention differs from the first embodiment in that the buckle portion 34B is recessed inward from the outer plate surfaces 321B, 331B of the buckle plate Into it, a right-angled triangle groove with an inverted cross-sectional shape is formed.

As shown in Figure 7, a power module according to the fourth embodiment of the present invention differs from the first embodiment in that the buckle portion 34C is recessed inward from the outer plate surfaces 321C, 331C of the buckle plate Into and form a cross-sectional shape of a groove.

With the above structure, the power supply module 100 of the present invention slides the buckle plates 32, 33 along the slope of the buckle portion 24 so that the buckle portion 24 is easily buckled with the buckle portion 34, so that the The upper cover 2 and the lower cover 3 can be combined smoothly, and the combination between the upper cover 2 and the lower cover 3 is relatively stable and tight. Therefore, the present invention can improve the assembly quality of the power module 100. In addition, the lower cover 3 is manufactured in an extrusion manner, which has the advantage that the lower cover 3 does not need to be processed to form a specific structure after being formed, so the manufacturing process can be simplified and the production cost can be reduced.

The above descriptions and descriptions are only descriptions of the preferred embodiments of the present invention. Those with general knowledge of this technology should make other modifications based on the scope of patent application defined below and the above descriptions, but these modifications should still be made. It is the spirit of the invention and falls within the scope of the rights of the invention.

100: Power module 1: circuit board 2: Upper cover 21: Rectangular top plate 211: Hole 22: Opposite side panel 221: first inner wall surface 222: third inner wall surface 23: Opposite side panel 231: second inner wall surface 232: fourth inner wall surface 24: buckle 3: Lower cover 31: Rectangular bottom plate 311: recess 32: gusset plate 321: Outer surface of gusset plate 321A: Outer surface of gusset plate 321B: Outer surface of gusset plate 321C: Outer surface of gusset plate 322: inner surface of gusset plate 33: gusset plate 331: Outer surface of gusset plate 331A: Outer surface of gusset plate 331B: Outer surface of gusset plate 331C: Outer surface of gusset plate 332: inner surface of gusset plate 34: Detained part 34A: Deducted part 34B: Deducted part 34C: Deducted part

Figure 1 is a schematic diagram showing a power module according to an embodiment of the present invention; Figure 2 is a perspective exploded schematic diagram showing a power module according to an embodiment of the present invention; Figure 3 is a schematic diagram showing the upper cover of the power module according to the embodiment of the present invention; Figure 4 is a side view showing the lower cover of the power module according to the embodiment of the present invention; Figure 5 is a side view showing the lower cover of the power module according to another embodiment of the present invention; Figure 6 is a side view showing the lower cover of a power module according to another embodiment of the present invention; and FIG. 7 is a side view showing the lower cover of the power module according to another embodiment of the present invention.

100: Power module

2: Upper cover

21: Rectangular top plate

211: Hole

22: Opposite side panel

23: Opposite side panel

3: Lower cover

311: recess

Claims (9)

A power supply module includes: a circuit board; an upper cover, which is a rectangular body, the upper cover is recessed upward from the lower surface, the upper cover has a first inner side wall surface, a second inner side wall surface, and a third The inner side wall surface and a fourth inner side wall surface, the first inner side wall surface and the third inner side wall surface face and correspond to each other, the first inner side wall surface and the third inner side wall surface each have a plurality of buckle parts, and each buckle part is from The first inner side wall surface and the third inner side wall surface protrude from the upper width and lower width to make the buckle part have a slope; and the lower cover is a structure formed by aluminum extrusion. The lower cover has a rectangular bottom plate and two buckle plates, the two buckle plates extend side by side from the rectangular bottom plate at intervals, and each buckle plate has an inner plate surface of the buckle plate and an outer plate of the buckle plate The inner plates of the two receiving plates face and correspond to each other, and one of the outer walls of the rectangular bottom plate protrudes laterally beyond the outer surface of the corresponding receiving plate, Each of the buckle plate outer panels has a buckle part, and each buckle part is a groove formed by recessing from the buckle plate outer plate surface, wherein the height of two buckle plates is less than The height of the first inner wall surface, the second inner wall surface, the third inner wall surface, and the fourth inner wall surface, the upper cover is relatively up and down along the inclined surface of the buckle portion by the buckle portion and the buckle plate The first inner side wall surface and the third inner side wall surface of the upper cover member respectively face from the outside to the inside and cover the corresponding buckle plate As a whole, the outer plate surface of the buckle plate and the outer wall surface of the rectangular bottom plate respectively protrude laterally beyond the upper cover member, and an assembly space is formed between the upper cover member and the lower cover member. The circuit board Set in the assembly space. The power module according to claim 1, wherein the upper cover has a pair of long side walls and a pair of short side walls, the inner side wall surface of one of the long side walls of the pair of long side walls is the first inner side wall surface, and the other long side wall The inner wall surface is the third inner wall surface, the inner wall surface of one of the short side walls of the pair of short side walls is the second inner wall surface, and the inner wall surface of the other short side wall is the fourth inner wall surface. The power module according to claim 1, wherein the buckle portion is recessed inward from the outer side wall surface of the upper cover member, and the buckle portion is protruded inward from the inner side wall surface of the upper cover member. The power module according to claim 1, wherein the buckle portion is recessed inward from the outer surface of the buckle plate to form a groove with a cross-sectional shape. The power module according to claim 1, wherein the buckle portion is recessed inward from the outer surface of the buckle plate to form a groove with a semicircular cross-sectional shape. The power module according to claim 1, wherein the buckle portion is recessed inward from the outer surface of the buckle plate to form a groove with a triangular cross-sectional shape. The power module according to claim 1, wherein the buckle portion is plural. The power module according to claim 1, wherein the rectangular bottom plate has a recess, a pair of long side walls and a pair of short side walls, and the recesses are respectively recessed inward from the outer wall surface of each of the long side walls. The power supply module according to claim 8, wherein the concave portion is plural.

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