TWI710867B - 判定一處理裝置對一基板參數之貢獻度之方法 - Google Patents

判定一處理裝置對一基板參數之貢獻度之方法 Download PDF

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Publication number
TWI710867B
TWI710867B TW108137372A TW108137372A TWI710867B TW I710867 B TWI710867 B TW I710867B TW 108137372 A TW108137372 A TW 108137372A TW 108137372 A TW108137372 A TW 108137372A TW I710867 B TWI710867 B TW I710867B
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TW
Taiwan
Prior art keywords
substrate
dose
image
feature
difference
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TW108137372A
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English (en)
Chinese (zh)
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TW202024806A (zh
Inventor
羅伊 亞蘭希亞多
Original Assignee
荷蘭商Ａｓｍｌ荷蘭公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
TW108137372A 2018-11-12 2019-10-17 判定一處理裝置對一基板參數之貢獻度之方法 TWI710867B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18205693.7 2018-11-12
EP18205693.7A EP3650941A1 (en) 2018-11-12 2018-11-12 Method of determining the contribution of a processing apparatus to a substrate parameter

Publications (2)

Publication Number Publication Date
TW202024806A TW202024806A (zh) 2020-07-01
TWI710867B true TWI710867B (zh) 2020-11-21

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Family Applications (1)

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TW108137372A TWI710867B (zh) 2018-11-12 2019-10-17 判定一處理裝置對一基板參數之貢獻度之方法

Country Status (6)

Country Link
US (1) US11579535B2 (ko)
EP (1) EP3650941A1 (ko)
KR (1) KR102583757B1 (ko)
CN (1) CN113168106A (ko)
TW (1) TWI710867B (ko)
WO (1) WO2020099010A1 (ko)

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TW201633005A (zh) * 2014-12-17 2016-09-16 Ａｓｍｌ荷蘭公司 使用圖案化裝置形貌誘導相位之方法及設備

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TWI232357B (en) 2002-11-12 2005-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7791727B2 (en) 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7791724B2 (en) 2006-06-13 2010-09-07 Asml Netherlands B.V. Characterization of transmission losses in an optical system
US7701577B2 (en) 2007-02-21 2010-04-20 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
SG152187A1 (en) 2007-10-25 2009-05-29 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
NL1036123A1 (nl) 2007-11-13 2009-05-14 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method.
NL1036245A1 (nl) 2007-12-17 2009-06-18 Asml Netherlands Bv Diffraction based overlay metrology tool and method of diffraction based overlay metrology.
NL1036684A1 (nl) 2008-03-20 2009-09-22 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method.
NL1036685A1 (nl) 2008-03-24 2009-09-25 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method.
NL1036734A1 (nl) 2008-04-09 2009-10-12 Asml Netherlands Bv A method of assessing a model, an inspection apparatus and a lithographic apparatus.
NL1036857A1 (nl) 2008-04-21 2009-10-22 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method.
NL2002883A1 (nl) 2008-06-26 2009-12-29 Asml Netherlands Bv Overlay measurement apparatus, lithographic apparatus, and device manufacturing method using such overlay measurement apparatus.
US8891061B2 (en) 2008-10-06 2014-11-18 Asml Netherlands B.V. Lithographic focus and dose measurement using a 2-D target
KR101429629B1 (ko) 2009-07-31 2014-08-12 에이에스엠엘 네델란즈 비.브이. 계측 방법 및 장치, 리소그래피 시스템, 및 리소그래피 처리 셀
NL2006229A (en) 2010-03-18 2011-09-20 Asml Netherlands Bv Inspection method and apparatus, and associated computer readable product.
WO2012022584A1 (en) 2010-08-18 2012-02-23 Asml Netherlands B.V. Substrate for use in metrology, metrology method and device manufacturing method
NL2009004A (en) 2011-07-20 2013-01-22 Asml Netherlands Bv Inspection method and apparatus, and lithographic apparatus.
NL2010717A (en) 2012-05-21 2013-11-25 Asml Netherlands Bv Determining a structural parameter and correcting an asymmetry property.
NL2011816A (en) * 2012-11-30 2014-06-04 Asml Netherlands Bv Method of determining dose and focus, inspection apparatus, patterning device, substrate and device manufacturing method.
CN107111250B (zh) 2014-11-26 2019-10-11 Asml荷兰有限公司 度量方法、计算机产品和系统
KR102162234B1 (ko) 2015-06-17 2020-10-07 에이에스엠엘 네델란즈 비.브이. 레시피간 일치도에 기초한 레시피 선택
NL2017123A (en) * 2015-07-24 2017-01-24 Asml Netherlands Bv Inspection apparatus, inspection method, lithographic apparatus and manufacturing method
CN110383177B (zh) * 2017-02-22 2021-10-29 Asml荷兰有限公司 计算量测法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6961453B2 (en) * 2001-08-31 2005-11-01 Secugen Corporation Method for extracting fingerprint feature data using ridge orientation model
TW201633005A (zh) * 2014-12-17 2016-09-16 Ａｓｍｌ荷蘭公司 使用圖案化裝置形貌誘導相位之方法及設備

Also Published As

Publication number Publication date
WO2020099010A1 (en) 2020-05-22
TW202024806A (zh) 2020-07-01
US20210382400A1 (en) 2021-12-09
CN113168106A (zh) 2021-07-23
US11579535B2 (en) 2023-02-14
KR20210068568A (ko) 2021-06-09
KR102583757B1 (ko) 2023-09-26
EP3650941A1 (en) 2020-05-13

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