TWI706604B - 多饋入超高頻rfid標籤天線 - Google Patents

多饋入超高頻rfid標籤天線 Download PDF

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TWI706604B
TWI706604B TW106107230A TW106107230A TWI706604B TW I706604 B TWI706604 B TW I706604B TW 106107230 A TW106107230 A TW 106107230A TW 106107230 A TW106107230 A TW 106107230A TW I706604 B TWI706604 B TW I706604B
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tag
antenna
chips
rfid tag
uhf rfid
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TW106107230A
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TW201743502A (zh
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曹渝鋐
謝阜諺
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鴻海精密工業股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0724—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being a circuit for communicating at a plurality of frequencies, e.g. for managing time multiplexed communication over at least two antennas of different types
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
  • Waveguide Aerials (AREA)

Abstract

一種多饋入超高頻RFID標籤天線，該標籤天線包括一天線組件、一基板及一接地面，該基板位於該接地面的上方，該天線組件與該接地面連通，該天線組件包括一輻射單元、多條微帶線及多個標籤晶片，其中，每兩條微帶線之間連接一標籤晶片，從而形成一微帶饋電回路。

Description

多饋入超高頻RFID標籤天線
本發明涉及天線領域，尤其涉及一種多饋入超高頻RFID標籤天線。
RFID(Radio Frequency Identification，射頻識別)是一種通過無線射頻方式進行非接觸式的雙向資料通訊，從而對目標進行識別的技術。RFID系統通常由讀寫器和電子標籤組成。電子標籤包括天線及標籤晶片，通過天線發射或接收電磁波與讀寫器進行資料交換，從而實現電子標籤的識別。現有的超高頻RFID天線通常都只包括一個饋入點，當標籤晶片故障時，單饋入RFID天線無法正常工作；或當標籤天線需要支援多種標準的頻段時，單饋入RFID天線無法滿足使用者的需求。
有鑒於此，有必要提供一種多饋入超高頻RFID標籤天線，以解決上述技術問題。
一種多饋入超高頻RFID標籤天線，該標籤天線包括一天線組件、一基板及一接地面，該基板位於該接地面的上方，該天線組件與該接地面 連通，該天線組件包括一輻射單元、多條微帶線及多個標籤晶片，其中，每兩條微帶線之間連接一標籤晶片，從而形成一微帶饋電回路。
上述多饋入超高頻RFID標籤天線包括多個標籤晶片，當標籤晶片相同，其中一個標籤晶片故障時，該RFID標籤天線仍能夠正常工作，保證應用該標籤天線的標籤能正常進行識別。當標籤天線具有不同的工作頻段時，應用該標籤天線的標籤可在不同國家或地區進行識別。
1:標籤天線
10:天線組件
101:輻射單元
102:第一微帶線
103:第二微帶線
104:第三微帶線
105:第四微帶線
106:第一標籤晶片
107:第二標籤晶片
108:第一導柱
109:第二導柱
110:第三導柱
111:第四導柱
20:基板
30:接地面
圖1為本發明第一實施方式中的多饋入超高頻RFID標籤天線的結構示意圖。
圖2為圖1的側視圖。
圖3為本發明第二實施方式中的多饋入超高頻RFID標籤天線的結構示意圖。
圖4為本發明第三實施方式中的多饋入超高頻RFID標籤天線的結構示意圖。
請參考圖1，其示出了本發明第一實施方式中的多饋入超高頻RFID標籤天線1。請一併參考圖2，該標籤天線1包括一天線組件10、一基板20及一接地面30。在本實施方式中，該天線組件10位於該基板20的上方，該基板20位於該接地面30的上方，該天線組件10還與該接地面30連通。
如圖1及圖2所示，該天線組件10包括輻射單元101、第一微帶線102、第二微帶線103、第三微帶線104、第四微帶線105、第一標籤晶片106及第二標籤晶片107。其中，該第一標籤晶片106連接於該第一微帶線102及該第二微帶線103之間，該第二標籤晶片107連接於該第三微帶線104及該第四微帶線105之間，從而形成兩條微帶饋電回路。
在本實施方式中，該第一微帶線102通過一第一導柱108與該接地面30連通，該第二微帶線103通過一第二導柱109與該接地面30連通，該第三微帶線104通過一第三導柱110與該接地面30連通，該第四微帶線105通過一第四導柱111與該接地面30連通，從而使得該天線組件10與該接地面30連通。其中，該第一導柱108、第二導柱109、第三導柱110及第四導柱111可開路或短路。
在本實施方式中，該輻射單元101為一矩形的輻射面，該第一微帶線102、第二微帶線103及該第一標籤晶片106位於該輻射單元101的側邊L1附近，該第三微帶線104、第四微帶線105及該第二標籤晶片107位於該輻射單元101的與該側邊L1相鄰的側邊L2附近。該第一微帶線102、第二微帶線103及該第一標籤晶片106形成的微帶饋電回路與該第三微帶線104、第四微帶線105及該第二標籤晶片107形成的微帶饋電回路分別設置於該輻射單元101相鄰的兩條側邊附近可提高該標籤天線1的隔離度。
請參考圖3，在一第二實施方式中，該第一微帶線102、第二微帶線103及該第一標籤晶片106位於該輻射單元101的側邊L1附近，該第三微帶線104、第四微帶線105及該第二標籤晶片107也可位於該輻射單元101的與該側邊L1相對的側邊L3附近。此時，該第一微帶線102、第二微帶線103及該第一標籤晶片106形成的微帶饋電回路與該第三微帶線104、第四微帶線105及該第二標籤晶片107形成的微帶饋電回路分別設置於該輻射單元101相對的兩條側邊附近。
可選地，在上述的兩個實施方式中，該第一標籤晶片106及第二標籤晶片107為相同的兩個標籤晶片，當其中一個標籤晶片故障時，應用該標籤天線1的標籤仍然可以通過另一標籤晶片進行識別。
可選地，在上述的兩個實施方式中，該第一標籤晶片106及第二標籤晶片107具有不同的工作頻段，從而符合不同國家或地區的RFID設備的頻段標準，使得應用該標籤天線1的標籤可在不同國家或地區進行識別。
請參考圖4，在一第三實施方式中，該輻射單元101也為一矩形的輻射面，該天線組件10包括輻射單元101、兩條第一微帶線102、兩條第二微帶線103、兩條第三微帶線104、兩條第四微帶線105、兩個第一標籤晶片106及兩個第二標籤晶片107。其中，該兩個第一標籤晶片106分別連接於一第一微帶線102及一第二微帶線103之間，該兩個第二標籤晶片107分別連接於一第三微帶線104及一第四微帶線105之間，從而形成四條微帶饋電回路。
在本實施方式中，每一標籤晶片位於該輻射單元101的一條側邊附近。其中，該兩個第一標籤晶片106設置於該輻射單元101相對的兩個側邊附近，該兩個第二標籤晶片107設置於該輻射單元101的另兩個相對的側邊附近，該第一標籤晶片106及該第二標籤晶片107具有不同的工作頻段。
在本實施方式中，由於設置有兩個相同的第一標籤晶片106及兩個相同的第二標籤晶片107，當其中一第一標籤晶片106或第二標籤晶片107故障時，應用該標籤天線1的標籤可通過相同的另一標籤晶片進行識別。由於該第一標籤晶片106及第二標籤晶片107具有不同的工作頻段，從而符合不同國家或地區的RFID設備的頻段標準，使得應用該標籤天線1的標籤還可在不同國家或地區進行識別。
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，舉凡熟悉本案技藝之人士，於爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。
1:標籤天線
10:天線組件
101:輻射單元
102:第一微帶線
103:第二微帶線
104:第三微帶線
105:第四微帶線
106:第一標籤晶片
107:第二標籤晶片
108:第一導柱
109:第二導柱
110:第三導柱
111:第四導柱
30:接地面

Claims (8)

  1. 一種多饋入超高頻RFID標籤天線，該標籤天線包括一天線組件、一基板及一接地面，該基板位於該接地面的上方，該天線組件與該接地面連通，該天線組件包括一輻射單元、多條微帶線及多個標籤晶片，其中，每兩條微帶線之間連接一標籤晶片，從而形成一微帶饋電回路，每一條微帶線通過一導柱與該接地面連通，該導柱可開路或短路。
  2. 如請求項1所述之多饋入超高頻RFID標籤天線，其中，該輻射單元為一矩形的輻射面。
  3. 如請求項2所述之多饋入超高頻RFID標籤天線，其中，該天線組件包括四條微帶線及兩個標籤晶片，該兩個標籤晶片分別位於該輻射單元的兩條相鄰的側邊附近。
  4. 如請求項2所述之多饋入超高頻RFID標籤天線，其中，該天線組件包括四條微帶線及兩個標籤晶片，該兩個標籤晶片分別位於該輻射單元的兩條相對的側邊附近。
  5. 如請求項3或4所述之多饋入超高頻RFID標籤天線，其中，該兩個標籤晶片是相同的晶片。
  6. 如請求項3或4所述之多饋入超高頻RFID標籤天線，其中，該兩個標籤晶片是具有不同的工作頻段的晶片。
  7. 如請求項2所述之多饋入超高頻RFID標籤天線，其中，該天線組件包括八條微帶線及四個標籤晶片，每一標籤晶片位於該輻射單元的一條側邊附近。
  8. 如請求項7所述之多饋入超高頻RFID標籤天線，其中，位於該輻射單元相對的兩個側邊附近的標籤晶片相同，位於該輻射單元相鄰的兩個側邊附近的標籤晶片具有不同的工作頻段。
TW106107230A 2016-05-28 2017-03-06 多饋入超高頻rfid標籤天線 TWI706604B (zh)

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CN201610363930.2A CN107437648B (zh) 2016-05-28 2016-05-28 多馈入超高频rfid标签天线
CN201610363930.2 2016-05-28

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TWI706604B true TWI706604B (zh) 2020-10-01

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CN115511034A (zh) * 2022-09-09 2022-12-23 深圳市建和智能卡技术有限公司 一种双芯片超高频rfid电子标签生产方法

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