TWI697069B - Electronic component conveying method and device - Google Patents
Electronic component conveying method and device Download PDFInfo
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- TWI697069B TWI697069B TW107147133A TW107147133A TWI697069B TW I697069 B TWI697069 B TW I697069B TW 107147133 A TW107147133 A TW 107147133A TW 107147133 A TW107147133 A TW 107147133A TW I697069 B TWI697069 B TW I697069B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/26—Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/88—Separating or stopping elements, e.g. fingers
- B65G47/8807—Separating or stopping elements, e.g. fingers with one stop
- B65G47/8815—Reciprocating stop, moving up or down in the path of the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/042—Sensors
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Specific Conveyance Elements (AREA)
Abstract
本發明提供一種電子元件輸送方法及裝置,包括:一預備步驟,使複數個電子元件在一導引道內朝一測盤之一容槽方向移動,並以該測盤外側之一分離針阻擋該導引道內之第一個電子元件,且使該導引道下方之一氣口產生負壓吸引力,吸附排列在該第一個電子元件後側之一第二個電子元件;一入料步驟,使該容槽之一測盤氣溝產生負壓吸引力,當該分離針離開該導引道時,使該第二個電子元件繼續被該氣口吸附而不移動,使該第一個電子元件受該測盤氣溝之負壓吸引力拉引與該第二個電子元件分離並被吸入該容槽內。 The invention provides a method and device for conveying electronic components, comprising: a preliminary step of moving a plurality of electronic components in a guide channel toward a receiving groove of a measuring disc, and a separation pin outside the measuring disc blocks the The first electronic component in the guide channel, and a negative pressure attraction is generated at an air port under the guide channel, and a second electronic component arranged on the rear side of the first electronic component is adsorbed; a feeding step So that a negative pressure attractive force is generated in the measuring plate air groove of one of the holding grooves, when the separation needle leaves the guide channel, the second electronic component continues to be adsorbed by the air port without moving, so that the first electron The component is pulled away from the second electronic component by the negative pressure attractive force of the air groove of the measuring disc and is sucked into the container.
Description
本發明係有關於一種輸送方法及裝置,尤指一種使電子元件由整料機構經入料機構送入測盤之容槽內之電子元件輸送方法及裝置。 The invention relates to a conveying method and device, in particular to an electronic component conveying method and device which enables electronic components to be fed into the measuring groove of the measuring plate through the feeding mechanism through the feeding mechanism.
習知電子元件如發光二極體(LED)或被動元件等,在產出後通常會進行物理特性之量測,以進行電子元件之分類或包裝;在進行量測時,常以一測盤作為搬運機構,並使待測電子元件大量投置於一震動送料機構中,使其被整列依序輸送至該測盤周緣所環列佈設之容槽中,受間歇性旋轉之搬送流路作位移搬送,而分別間歇性停留於搬送流路上之各工作站中被進行極性量測、極性轉向、電性量測、包裝、分類…等作業;其中,在該容槽之一側設有一可分別吹送正壓與負壓之氣孔,當第一個電子元件靠近該容槽時,該容槽之負壓吸力將使第一個電子元件快速與第二個電子元件分離,並使第一個電子元件被吸入該容槽內;且在第一個電子元件被負壓吸入該容槽時,該容槽外側會有一分離針升起,確保第一個電子元件不會脫離該容槽且同時阻隔第二個電子元件,以防止該測盤因電子元件之阻礙而無法進行旋轉。 Conventional electronic components, such as light-emitting diodes (LEDs) or passive components, are usually measured for physical characteristics after production to classify or package the electronic components. As a transport mechanism, a large number of electronic components to be tested are placed in a vibrating feed mechanism, so that they are transported in sequence to the receiving grooves arranged around the circumference of the measuring disc, and the transport flow path is intermittently rotated. Displacement transportation, while intermittently staying in each workstation on the transportation flow path to perform polarity measurement, polarity steering, electrical measurement, packaging, sorting, etc.; wherein, there is a separate Blow the positive pressure and negative pressure air holes. When the first electronic component is close to the container, the negative pressure of the container will quickly separate the first electronic component from the second electronic component and make the first electronic component The component is sucked into the container; and when the first electronic component is sucked into the container by negative pressure, a separation pin will rise outside the container to ensure that the first electronic component will not leave the container and block at the same time The second electronic component prevents the measuring disc from being unable to rotate due to the obstruction of the electronic component.
然而,隨著電子元件逐漸地微型化,在第一個電子元件被負壓吸入容槽之同時,第二個電子元件亦容易受負壓吸力之帶動朝容槽方向移動,導致兩個電子元件無法分離,在此情形下,分離針在升起時會抵頂到第二個電子元件而無法完全順利升起,導致異常訊號之產生,如發生此 異常訊號,系統會先將分離針下降收離送料軌道,再由容槽之氣孔吹送正壓,將所有電子元件一併吹送至分離針遠離測盤之一側,再重新進行前述輸送程序,但重新輸送進來的電子元件可能還是保持著前述無法分離之情形,進而再一次的發生異常訊號,最後導致需先暫停製程以人工手動排除,如此不期望事件之發生,使作業效率大打折扣。 However, with the gradual miniaturization of electronic components, while the first electronic component is sucked into the container by negative pressure, the second electronic component is also easily moved toward the container by the negative pressure suction, resulting in two electronic components Unable to separate. In this case, when the separation pin is raised, it will hit the second electronic component and cannot be raised completely, resulting in the generation of abnormal signals. Abnormal signal, the system will first lower the separation needle away from the feed rail, then blow positive pressure from the air hole of the container, and blow all the electronic components to the side of the separation needle away from the measuring plate, and then re-execute the above-mentioned transportation procedure, but The re-transported electronic components may still maintain the aforementioned inseparable situation, and then an abnormal signal occurs again, which eventually leads to the need to suspend the process first and manually eliminate it manually. This undesirable event occurs, which greatly reduces the efficiency of the operation.
爰是,本發明的目的,在於提供一種可確實分離相鄰之電子元件的電子元件輸送方法。 It is the object of the present invention to provide an electronic component conveying method that can reliably separate adjacent electronic components.
本發明的另一目的,在於提供一種可確實分離相鄰之電子元件的電子元件輸送裝置。 Another object of the present invention is to provide an electronic component conveying device capable of reliably separating adjacent electronic components.
依據本發明目的之電子元件輸送方法,包括:一預備步驟,使複數個電子元件在一導引道內朝一測盤之一容槽方向移動,並以該測盤外側之一分離針阻擋該導引道內之第一個電子元件,且使該導引道下方之一氣口產生負壓吸引力,吸附排列在該第一個電子元件後側之一第二個電子元件;一入料步驟,使該容槽之一測盤氣溝產生負壓吸引力,當該分離針離開該導引道時,使該第二個電子元件繼續被該氣口吸附而不移動,使該第一個電子元件受該測盤氣溝之負壓吸引力拉引與該第二個電子元件分離並被吸入該容槽內。 The electronic component conveying method according to the purpose of the present invention includes: a preliminary step of moving a plurality of electronic components in a guide channel toward a receiving groove of a test disc, and blocking the guide by a separation pin outside the test disc The first electronic component in the guide channel, and a negative pressure attraction is generated at an air port below the guide channel, and the second electronic component arranged on the rear side of the first electronic component is adsorbed; a feeding step, A negative pressure attractive force is generated in one of the measuring grooves of the holding groove, and when the separation needle leaves the guide channel, the second electronic component continues to be adsorbed by the air port without moving, so that the first electronic component The negative pressure attractive force of the air groove of the measuring disc is pulled away from the second electronic component and sucked into the container.
依據本發明另一目的之電子元件輸送裝置,包括:用以執行如所述電子元件輸送方法的裝置,該裝置包括:一測盤與一導引道。 An electronic component conveying device according to another object of the present invention includes: a device for performing the electronic component conveying method as described above. The device includes: a measuring disk and a guide channel.
本發明實施例之電子元件輸送方法及裝置,在該第一個電子元件受負壓吸引力拉引被吸入該容槽內時,因第二個電子元件尚被該氣口所吸附,故該第一個電子元件可確實地與該第二個電子元件分離,使該分離針在上升伸入該導引道內時,不易因抵頂到第二個電子元件而導致異常訊號之產生,可降低不期望事件之發生機率,提升作業效率。 In the method and device for conveying electronic components according to an embodiment of the present invention, when the first electronic component is drawn into the tank by the suction force of negative pressure, the second electronic component is still absorbed by the air port, so the first An electronic component can be reliably separated from the second electronic component, so that when the separation needle rises into the guide channel, it is not easy to cause abnormal signals due to the second electronic component, which can be reduced Do not expect the probability of an incident to increase the efficiency of operations.
A:輸送機構 A: Conveying mechanism
A1:軌道 A1: Orbit
B:入料機構 B: Feeding mechanism
B1:導引道 B1: Guiding way
B2:入料座 B2: Feeding seat
B21:氣口 B21: Air port
B211:第一氣路 B211: The first gas path
B22:第一開口 B22: the first opening
B23:第二開口 B23: Second opening
B24:入料氣溝 B24: Inlet gas ditch
B241:第二氣路 B241: Second gas path
B25:第一氣道 B25: The first airway
B26:第二氣道 B26: Second airway
B3:導引件 B3: Guide
B4:分離針 B4: Separation needle
B5:發射器 B5: Launcher
C:測盤 C: Test plate
C1:容槽 C1: container
C11:測盤氣溝 C11: Measuring plate air groove
D1:工作站 D1: Workstation
D2:工作站 D2: Workstation
D3:工作站 D3: Workstation
E:壓塊 E: briquetting
E1:感應器 E1: Sensor
L:輸送方向 L: conveying direction
P1:第一氣壓源 P1: the first air pressure source
P2:第二氣壓源 P2: Second air pressure source
P3:動力源 P3: Power source
T:機台台面 T: machine table
W:電子元件 W: Electronic components
W1:第一個電子元件 W1: The first electronic component
W2:第二個電子元件 W2: The second electronic component
圖1A係本發明實施例中對電子元件進行輸送並進行量測之裝置的機構配置示意圖。 FIG. 1A is a schematic diagram of a mechanism configuration of an apparatus for conveying and measuring electronic components in an embodiment of the present invention.
圖1B係本發明實施例中電子元件在軌道上被輸送之示意圖。 FIG. 1B is a schematic diagram of electronic components being transported on rails in an embodiment of the present invention.
圖1C係本發明實施例中測盤之容槽的示意圖。 FIG. 1C is a schematic diagram of the measuring groove of the measuring disk in the embodiment of the present invention.
圖2係本發明實施例中入料機構之示意圖。 FIG. 2 is a schematic diagram of the feeding mechanism in the embodiment of the present invention.
圖3係本發明實施例中電子元件由輸送機構經入料機構至測盤之示意圖。 FIG. 3 is a schematic diagram of an electronic component from a conveying mechanism to a measuring plate through a feeding mechanism in an embodiment of the present invention.
圖4係本發明實施例中預備步驟之部件作動示意圖。 FIG. 4 is a schematic diagram of component movement in a preliminary step in an embodiment of the present invention.
圖5係本發明實施例中入料步驟之部件作動示意圖。 FIG. 5 is a schematic diagram of component movement in the feeding step in the embodiment of the present invention.
圖6係本發明實施例中偵測步驟之部件作動示意圖。 FIG. 6 is a schematic diagram of component movement in the detection step in the embodiment of the present invention.
請參閱圖1A、1B、1C,本發明實施例之電子元件輸送方法可使用如圖所示之對發光二極體(LED)進行輸送與量測之裝置來作說明,該裝置設有包括:一輸送機構A,使複數個電子元件W在一線性之軌道A1上被整列依序朝一輸送方向L移動;一入料機構B,設於該輸送機構A之一端,以一導引道B1接續該軌道A1所移送來之電子元件W;一測盤C,設於一機台台面T上並罩覆部分之入料機構B,該測盤C周緣等距環列佈設有複數個容槽C1,可接收經該導引道B1所移送來之電子元件W,並以間歇旋轉方式搬送電子元件W至複數個工作站D1、D2、D3進行量測、轉向、包裝、分類…等作業; 一壓塊E,設於該入料機構B與測盤C之上方,可選擇性的遮蔽該導引道B1與該對應該導引道B1之容槽C1上方鏤空處,防止電子元件W在通過該導引道B1進入該容槽C1之過程中由上方脫出。 Please refer to FIGS. 1A, 1B, and 1C. The electronic component conveying method according to the embodiment of the present invention can be illustrated by using a device for conveying and measuring light emitting diodes (LEDs) as shown in the figure. The device includes: A conveying mechanism A, which causes a plurality of electronic components W to be sequentially moved in a conveying direction L on a linear track A1; a feeding mechanism B is provided at one end of the conveying mechanism A and is connected by a guide path B1 The electronic component W transferred from the track A1; a measuring plate C, which is arranged on a machine table T and covers part of the feeding mechanism B, and a plurality of holding slots C1 are arranged on the periphery of the measuring plate C at equal intervals , Can receive the electronic component W transferred through the guide path B1, and transfer the electronic component W to a plurality of workstations D1, D2, D3 in intermittent rotation for measurement, steering, packaging, classification, etc.; A pressing block E is arranged above the feeding mechanism B and the measuring disc C, and can selectively cover the hollows above the guide channel B1 and the corresponding groove C1 corresponding to the guide channel B1 to prevent the electronic component W from During the process of entering the holding tank C1 through the guide channel B1, it comes out from above.
請參閱圖2、3,該入料機構B設有一入料座B2,其上方設有兩片狀之導引件B3,該導引道B1形成於該兩導引件B3之間;該入料座B2在該輸送方向L向依序開設有一氣口B21、一第一開口B22、一第二開口B23與一入料氣溝B24,該氣口B21與第一開口B22設於該導引道B1之下方,該第二開口B23與該入料氣溝B24設於該對應該導引道B1之容槽C1的下方;該氣口B21藉由一垂直設置之第一氣路B211與一水平方向之第一氣道B25相連通,該第一氣道B25連結一第一氣壓源P1,使該氣口B21可產生負壓吸引力,可吸附位於該氣口B21處之電子元件W;該入料氣溝B24藉由一傾斜設置之第二氣路B241與一垂直設置之第二氣道B26相連通,該第二氣道B26連結一第二氣壓源P2,使該入料氣溝B24可產生負壓吸引力;該容槽C1後側底部開設有一測盤氣溝C11與該容槽C1相連通,且該測盤氣溝C11與該入料氣溝B24對應並相連通,當該入料氣溝B24產生負壓吸引力時,與該入料氣溝B24連通之該測盤氣溝C11亦會產生負壓吸引力,使該導引道B1內之電子元件W受吸引移出該導引道B1至該容槽C1內;該入料機構B設有一分離針B4,其上端可穿經該第一開口B22至該導引道B1內阻擋於該氣口B21與該容槽C1之間,且該分離針B4靠近該氣口B21之一側與該氣口B21靠近該分離針B4之一側間之距離,大於一個電子元件W在輸送方向L上之長度;該分離針B4之周緣緊靠該測盤C之周緣,該分離針B4由一例如電磁鐵之動力源P3所驅動以進行上升/下降之作動,可依電子元件W所在位置之不同而進行升降,選擇性的阻擋電子元件W進入或脫離該容槽C1; 該壓塊E內設有一光學之感應器E1於該容槽C1上方處,其與該容槽C1下方處之一上端穿經該第二開口B23之光學的發射器B5相對應;在電子元件W進入該容槽C1內時,會遮斷該光學之感應器E1之接收,藉由該感應器E1之接收與否來判斷電子元件W是否到達預設位置。 Please refer to FIGS. 2 and 3, the feeding mechanism B is provided with a feeding seat B2, and two pieces of guide members B3 are arranged above the guide channel B1 is formed between the two guide members B3; The material seat B2 is provided with an air port B21, a first opening B22, a second opening B23 and a feed gas groove B24 in the conveying direction L in order, the air port B21 and the first opening B22 are provided in the guide channel B1 Below, the second opening B23 and the feed gas groove B24 are provided below the receiving groove C1 corresponding to the guide channel B1; the gas port B21 is formed by a vertically arranged first gas path B211 and a horizontal direction The first air passage B25 communicates with each other. The first air passage B25 is connected to a first air pressure source P1, so that the air port B21 can generate a negative pressure attraction, and can attract the electronic component W located at the air port B21. The feed gas groove B24 is A second air path B241 arranged obliquely communicates with a second air path B26 arranged vertically, the second air path B26 is connected to a second air pressure source P2, so that the feed gas groove B24 can generate negative pressure attraction; At the bottom of the rear side of the tank C1, a measuring disc air groove C11 is connected to the containing tank C1, and the measuring disc air groove C11 corresponds to and communicates with the feed air groove B24. When the feed air groove B24 generates a negative pressure At the time of attraction, the measuring plate gas channel C11 communicating with the feed gas channel B24 will also generate a negative pressure attractive force, so that the electronic component W in the guide channel B1 is attracted and moved out of the guide channel B1 to the tank C1; the feeding mechanism B is provided with a separating needle B4, the upper end of which can pass through the first opening B22 to the guiding channel B1 to block the air port B21 and the container C1, and the separating needle B4 is close to The distance between the side of the air port B21 and the side of the air port B21 close to the separating needle B4 is greater than the length of an electronic component W in the conveying direction L; the peripheral edge of the separating needle B4 is close to the peripheral edge of the measuring disc C The separating pin B4 is driven by a power source P3 such as an electromagnet to move up/down, and can be raised and lowered according to the position of the electronic component W, selectively blocking the electronic component W from entering or leaving the container C1 ; An optical sensor E1 is provided in the pressing block E above the container C1, which corresponds to an optical transmitter B5 whose upper end under the container C1 passes through the second opening B23; When W enters the container C1, it will block the reception of the optical sensor E1, and determine whether the electronic component W reaches the preset position according to the reception of the sensor E1.
本發明實施例在實施上,包括以下步驟:一預備步驟,請參閱圖4,使複數個電子元件W在該導引道B1內朝該測盤C之容槽C1方向移動,並以該測盤C外側之該分離針B4上升阻擋該導引道B1內之第一個電子元件W1,且使該導引道B1下方之氣口B21產生負壓吸引力,吸附排列在該第一個電子元件W1後側之第二個電子元件W2;一入料步驟,請參閱圖5,使該容槽C1之測盤氣溝C11產生負壓吸引力,當該分離針B4下降離開該導引道B1時,使該第二個電子元件W2繼續被該氣口B21吸附而不移動,該第一個電子元件W1將受該測盤氣溝C11之負壓吸引力拉引與該第二個電子元件W2分離並被吸入該容槽C1內;一偵測步驟,請參閱圖6,當該第一個電子元件W1進入該容槽C1內時,使該感應器E1偵測到該第一個電子元件W1到達預設位置後,再將該分離針B4上升伸入該導引道B1內,並解除該氣口B21之負壓吸引力;在該偵測步驟之後,使該測盤C間歇旋轉至另一空置之容槽C1對應該導引道B1,接著再重複該預備步驟與該入料步驟。 The implementation of the embodiment of the present invention includes the following steps: As a preliminary step, please refer to FIG. 4, a plurality of electronic components W are moved in the direction of the guide channel B1 toward the receiving slot C1 of the test plate C, and The separation pin B4 outside the disc C rises to block the first electronic component W1 in the guide channel B1, and causes the air port B21 under the guide channel B1 to generate a negative pressure attraction, and is arranged on the first electronic component. The second electronic component W2 on the back side of W1; a feeding step, please refer to FIG. 5 to make the measuring plate air groove C11 of the container C1 generate a negative pressure attraction, when the separation needle B4 descends away from the guide channel B1 At this time, the second electronic component W2 continues to be attracted by the air port B21 without moving, and the first electronic component W1 will be attracted to the second electronic component W2 by the negative pressure attraction of the test disc air groove C11 Separated and sucked into the container C1; a detection step, please refer to FIG. 6, when the first electronic component W1 enters the container C1, the sensor E1 detects the first electronic component After W1 reaches the preset position, the separation needle B4 is raised into the guide channel B1, and the negative pressure attraction of the air port B21 is released; after the detection step, the disc C is rotated intermittently to another An empty container C1 corresponds to the guide channel B1, and then the preparatory step and the feeding step are repeated.
本發明實施例之電子元件輸送方法及裝置,在該第一個電子元件W1受負壓吸引力拉引被吸入該容槽C1內時,因第二個電子元件W2尚被該氣口B21所吸附,故該第一個電子元件W1可確實地與該第二個電子元件W2分離,使該分離針B4在上升伸入該導引道B1內時,不易因抵頂 到第二個電子元件W2而導致異常訊號之產生,可降低不期望事件之發生機率,提升作業效率。 The electronic component conveying method and device of the embodiment of the present invention, when the first electronic component W1 is drawn into the tank C1 by the negative pressure attraction, the second electronic component W2 is still attracted by the air port B21. Therefore, the first electronic component W1 can be reliably separated from the second electronic component W2, so that when the separation needle B4 rises into the guide channel B1, it is not easy to resist The occurrence of abnormal signals by the second electronic component W2 can reduce the probability of occurrence of undesirable events and improve the operating efficiency.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above are only the preferred embodiments of the present invention, which should not be used to limit the scope of the implementation of the present invention, that is, simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the description of the invention, All of them are still covered by the patent of the present invention.
B1:氣口 B1: Air port
B211:第一氣路 B211: The first gas path
B241:第二氣路 B241: Second gas path
B25:第一氣道 B25: The first airway
B26:第二氣道 B26: Second airway
B4:分離針 B4: Separation needle
B5:發射器 B5: Launcher
C:測盤 C: Test plate
C1:容槽 C1: container
C11:測盤氣溝 C11: Measuring plate air groove
E1:感應器 E1: Sensor
L:輸送方向 L: conveying direction
P1:第一氣壓源 P1: the first air pressure source
P2:第二氣壓源 P2: Second air pressure source
P3:動力源 P3: Power source
W:電子元件 W: Electronic components
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TW201441127A (en) * | 2013-04-16 | 2014-11-01 | All Ring Tech Co Ltd | Electronic element diversion method and apparatus |
TW201518193A (en) * | 2013-11-13 | 2015-05-16 | All Ring Tech Co Ltd | Electronic parts direction-change device and method for preventing shearing of parts caused thereby |
TW201543046A (en) * | 2014-05-15 | 2015-11-16 | All Ring Tech Co Ltd | Conveying, sorting method and apparatus of electronic component |
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TW201441127A (en) * | 2013-04-16 | 2014-11-01 | All Ring Tech Co Ltd | Electronic element diversion method and apparatus |
TW201518193A (en) * | 2013-11-13 | 2015-05-16 | All Ring Tech Co Ltd | Electronic parts direction-change device and method for preventing shearing of parts caused thereby |
TW201543046A (en) * | 2014-05-15 | 2015-11-16 | All Ring Tech Co Ltd | Conveying, sorting method and apparatus of electronic component |
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