TWI694927B - Laminating device and component laminating method using same - Google Patents
Laminating device and component laminating method using same Download PDFInfo
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- TWI694927B TWI694927B TW107121614A TW107121614A TWI694927B TW I694927 B TWI694927 B TW I694927B TW 107121614 A TW107121614 A TW 107121614A TW 107121614 A TW107121614 A TW 107121614A TW I694927 B TWI694927 B TW I694927B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
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Abstract
Description
本發明涉及一種貼合裝置及使用該貼合裝置進行元件貼合的方法。 The invention relates to a bonding device and a method for bonding components using the bonding device.
近年來,隨著技術的進步,觸控螢幕的用途已越來越廣,從常見的提款機、智慧型手機、平板電腦、到工業用的觸控電腦等等。被廣泛應用的觸控螢幕往往需要在真空環境下進行貼合,然而傳統的貼合工藝存在明顯且難以克服的缺陷。 In recent years, with the advancement of technology, the use of touch screens has become wider and wider, from common cash dispensers, smart phones, tablet computers, to industrial touch computers and so on. The widely used touch screens often need to be bonded in a vacuum environment. However, the traditional bonding process has obvious and difficult to overcome defects.
傳統結構中,觸控薄膜的貼合需要使用真空貼合機台完成,放置於真空貼合機台的載台上的觸控薄膜藉由真空孔產生的負壓被吸附,觸控薄膜為柔性材料,真空孔處產生的真空負壓極易使觸控薄膜產生一種類似“水波紋”的形變,這種形變在貼合完成之後難以被消除觸控薄膜的形變會使得視覺效果不均勻,對顯示造成較大影響。 In the traditional structure, the lamination of the touch film needs to be completed using a vacuum laminating machine. The touch film placed on the stage of the vacuum laminating machine is absorbed by the negative pressure generated by the vacuum hole, and the touch film is flexible Material, the vacuum negative pressure generated at the vacuum hole is very easy to cause the touch film to produce a deformation similar to "water ripple". This deformation is difficult to be eliminated after the bonding is completed. The deformation of the touch film will make the visual effect uneven. The display has a greater impact.
本發明提供一種貼合裝置,包括:上蓋;上壓頭,可活動地設置於該上蓋內,用於固定一第一待貼合元件;下平台,用於與該上蓋配合形成一第一容置腔;下壓頭,設置於該下平台上並在下平台與上蓋配合形成該第一容置腔時位於該第一容置腔內,該下 壓頭與該下平台配合形成一第二容置腔,該下壓頭包括一與該上壓頭相對設置的下載台,該下載台用於承載一第二待貼合元件,該下載台上開設有貫通該下載台的真空孔;內載台,可活動地設置於該第二容置腔內,該內載台上設置有密封柱,所述密封柱用於在所述第一容置腔與所述第二容置腔的真空狀態相同時封堵所述真空孔。 The invention provides a laminating device, which comprises: an upper cover; an upper pressing head, which is movably arranged in the upper cover for fixing a first component to be laminated; and a lower platform for cooperating with the upper cover to form a first container Cavity; the lower pressure head is set on the lower platform and is located in the first receiving cavity when the lower platform and the upper cover cooperate to form the first receiving cavity, the lower The indenter cooperates with the lower platform to form a second accommodating cavity. The lower indenter includes a downloading station opposite to the upper indenter. The downloading station is used to carry a second component to be attached. A vacuum hole penetrating the downloading table is opened; an inner loading table is movably arranged in the second accommodating cavity, and a sealing column is arranged on the inner loading table, and the sealing column is used for the first accommodation When the vacuum state of the cavity and the second accommodating cavity is the same, the vacuum hole is blocked.
還提供一種使用本發明的貼合裝置的元件貼合的方法,包括如下步驟:提供一第一待貼合元件和一第二待貼合元件,將所述第一待貼合元件和所述第二待貼合元件分別固定於所述上壓頭及所述下載台上,使所述第一待貼合元件和所述第二待貼合元件相對放置,其中所述第二待貼合元件藉由真空吸附方式固定於所述下載台上,所述第二容置腔保持一第一真空狀態;使所述上蓋及所述下平台扣合形成所述第一容置腔,並使所述第一待貼合元件及所述第二待貼合元件正對且間隔設置;對第一容置腔抽真空,使第一容置腔與第二容置腔內部壓強趨於相同,在第一容置腔與第二容置腔壓強相同之前,使所述密封柱封堵所有真空孔,持續對第一容置腔及第二容置腔抽真空使二者共同達到第二真空狀態的過程與所述密封柱封堵所述真空孔的過程同步完成;移動上載台和/或下載台使第一待貼合元件與第二待貼合元件貼合在一起。 Also provided is a method for bonding components using the bonding device of the present invention, comprising the steps of: providing a first component to be bonded and a second component to be bonded, and combining the first component to be bonded and the The second to-be-laminated elements are respectively fixed on the upper indenter and the download table, so that the first to-be-laminated element and the second to-be-laminated element are relatively placed, wherein the second to-be-laminated element The element is fixed on the download platform by vacuum suction, and the second accommodating cavity maintains a first vacuum state; the upper cover and the lower platform are snapped together to form the first accommodating cavity, and The first to-be-laminated element and the second to-be-laminated element are facing and spaced apart; the first accommodating cavity is evacuated so that the internal pressure of the first accommodating cavity and the second accommodating cavity tend to be the same, Before the pressures of the first accommodating cavity and the second accommodating cavity are the same, all the vacuum holes are blocked by the sealing column, and the first accommodating cavity and the second accommodating cavity are continuously evacuated to achieve the second vacuum together. The process in the state is completed synchronously with the process of sealing the vacuum hole by the sealing column; moving the uploading table and/or the downloading table to make the first component to be bonded and the second component to be bonded together.
上述貼合裝置包括該內載台,使用該貼合裝置進行元件貼合時,藉由控制內載台的移動,使得位於內載台上的密封柱在合適的時間嵌入真空孔中,可以有效消除“水波紋”形變問題。 The above laminating device includes the inner stage. When the laminating device is used for laminating components, by controlling the movement of the inner stage, the sealing column on the inner stage can be embedded in the vacuum hole at an appropriate time, which can be effective Eliminate the "water ripple" deformation problem.
10:貼合裝置 10: Laminating device
11:上蓋 11: upper cover
111:開口 111: opening
110:第一容置腔 110: the first accommodating cavity
113:容置部 113: Accommodation Department
12:上壓頭 12: Upper indenter
121:伸縮部 121: Telescopic Department
122:上載台 122: Upload table
15:下壓頭 15: Lower head
151:下載台 151: download station
152:真空孔 152: vacuum hole
156:側壁 156: Side wall
150:第二容置腔 150: second accommodating cavity
16:下平台 16: next platform
18:內載台 18: Inner stage
183:板部 183: Board Department
184:密封柱 184: Sealed column
185:伸縮軸 185: Telescopic shaft
13:第一待貼合元件 13: The first component to be bonded
14:第二待貼合元件 14: The second component to be bonded
S1~S5:貼合步驟 S1~S5: Laminating steps
圖1為本發明實施例的貼合裝置的立體分解示意圖。 FIG. 1 is a three-dimensional exploded schematic view of a bonding device according to an embodiment of the invention.
圖2為本發明實施例的貼合裝置的立體示意圖。 FIG. 2 is a schematic perspective view of a bonding device according to an embodiment of the invention.
圖3為本發明實施例的貼合裝置的進行元件貼合時的第一狀態示意圖。 FIG. 3 is a schematic diagram of a first state of the bonding apparatus according to an embodiment of the present invention when bonding components.
圖4為本發明實施例的貼合裝置的進行元件貼合時的第二狀態示意圖。 FIG. 4 is a schematic diagram of a second state when the bonding device of the embodiment of the present invention performs component bonding.
圖5為本發明實施例的貼合裝置的進行元件貼合時的第三狀態示意圖。 FIG. 5 is a schematic diagram of a third state of the bonding apparatus according to an embodiment of the present invention when bonding components.
圖6為本發明實施例的貼合裝置貼合工件時第一待貼合元件與第二待貼合元件貼合在一起的局部截面示意圖。 6 is a partial cross-sectional schematic diagram of the first to-be-laminated component and the second to-be-laminated component being bonded together when the bonding device of the embodiment of the present invention is bonding a workpiece.
圖7為使用本發明實施例的貼合裝置進行元件貼合的方法的流程示意圖。 7 is a schematic flowchart of a method for bonding components using the bonding apparatus according to an embodiment of the present invention.
為了使本申請所揭示的技術內容更加詳盡與完備,可參照附圖以及本發明之下述各種具體實施例,附圖中相同的標記代表相同或相似的元件。然而,本領域的普通技術人員應當理解,下文中所提供的實施例並非用來限制本發明所覆蓋的範圍。此外,附圖僅僅用於示意性地加以說明,並未依照其實際尺寸按比例進行繪製。 In order to make the technical content disclosed in this application more detailed and complete, reference may be made to the drawings and the following various specific embodiments of the present invention. The same symbols in the drawings represent the same or similar elements. However, those of ordinary skill in the art should understand that the embodiments provided below are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only, and are not drawn to scale according to their actual dimensions.
下面參照附圖,對本發明之具體實施方式作進一步的詳細描述。 The specific embodiments of the present invention will be further described in detail below with reference to the drawings.
如圖1所示,為本發明實施例的貼合裝置10的立體分解示意圖,貼合裝置10包括上蓋11、上壓頭12、下壓頭15、下平台16以及內載台18。上蓋11包括一開口111及容置部113;上壓頭12包括一伸縮部121和一上載台122;下壓頭15包括下載台151、側壁156、真空孔152以及第二容置腔150;內載台18包括板部183、多個密封柱184以及伸縮軸185。第一待貼合元件13及第二待貼合元件14藉由貼合裝置10進行貼合。
As shown in FIG. 1, it is a three-dimensional exploded schematic view of a
如圖2所示,為本發明實施例的貼合裝置10的立體示意圖。上蓋11與下平台16相對設置,上蓋11的開口111設置於上蓋11一表面,開口111相對於下平台16設置且與容置部113貫通。上壓頭12可活動地設置於容置部113內,伸縮部121的一端與上蓋11連接,伸縮部121的另一端與上載台122連接以控制上載台122的運動,上載台122對應開口111設置。下平台16用於與該上蓋11配合形成一第一容置腔110(參圖4),下壓頭15設置於下平台16與上蓋11相對設置的表面,並在下平台16與上蓋11配合形成該第一容置腔110時位於該第一容置腔110內。下壓頭15與下平台16相互配合形成一第二容置腔150,其中下載台151與上載台122相對設置,側壁156圍繞下載台151設置,下載台151、側壁156以及下平台16構成第二容置腔150的外壁,真空孔152貫穿設置於下載台151上。內載台18可活動地設置於該第二容置腔150內部,板部183的尺寸略小於下載台151的尺寸,多個密封柱184設置於板部183一側表面並由板部183朝向下載台151凸伸,密封柱184對應真空孔152設置,密封柱184的形狀、數量、尺寸分別與真空孔152的形狀、數量、尺寸相匹配,伸縮軸185設置於板部183遠離密封柱184一側,伸縮軸185的長度可變化,其可以在一定限度內進行伸縮,伸縮軸185用於帶動板部183在第二容置腔150內移動。
As shown in FIG. 2, it is a schematic perspective view of a
於一實施例中,上蓋11大致為一端開口的矩形框體。在其他實施例中,上蓋11可以為一端開口且中空的柱狀結構。上壓頭12設置於容置部113內,可藉由該開口111向上蓋11外延伸,或者位於下平台16上的下壓頭15可藉由該開口111進入上蓋11內部。上載台122的伸縮部121為一柱狀結構,上載台122及伸縮部121內可佈設有相互連接的真空管道,使得上載台122可真空吸附放置於其表面的第一待貼合元件13。伸縮部121的長度可變化,其可以在一定限度內進行伸縮。
In one embodiment, the
於一實施例中,下壓頭15為一中空的矩形框體,真空孔152與第二容置腔150貫通形成真空通道,所述真空孔152的數量不做特別限制,其可以為一個或者多個,本實施例中所述真空孔152為多個。當第二容置腔150進行抽真空時,下壓頭15外部壓強大於第二容置腔150內部的壓強,真空孔152對應下壓頭15外部的開口處將產生負壓並產生吸力,使得下載台151可真空吸附放置於其表面的第二待貼合元件14。
In an embodiment, the
下面結合圖3至圖6對使用該貼合裝置10在元件貼合過程中的運動方式進行描述。
The following describes the movement mode of using the
如圖3所示,為本發明實施例的貼合裝置10的進行元件貼合時的第一狀態示意圖。第一狀態為初始狀狀態,上蓋11與下平台16不接觸,下壓頭15位於容置部113外部,上壓頭12位於容置部113內部,上載台122與下載台151不接觸,真空孔152均未被密封柱184填充,第一待貼合元件13和第二待貼合元件14分別置於上載台122及下載台151上,第一待貼合元件13和第二待貼合元件14相對放置。
As shown in FIG. 3, it is a schematic diagram of the first state of the
如圖4所示,為本發明實施例的貼合裝置10的進行元件貼合時的第二狀態示意圖。第二狀態為待貼合物對位元狀態,上蓋11與下平台16扣合形成第一容置腔110,下壓頭15位於第一容置腔110內部,上載台122及下載台151正對設置,且第一待貼合元件13與第二待貼合元件14之間存在一預定距離。
As shown in FIG. 4, it is a schematic diagram of the second state when the
如圖5所示,為本發明實施例的貼合裝置10的進行元件貼合時的第三狀態示意圖。第三狀態為真空貼合狀態,當伸縮軸185推動板部183向下載台151運動一段距離後,多個密封柱184分別位於多個真空孔152中並將真空孔152完全封堵。
As shown in FIG. 5, it is a schematic diagram of the third state of the
如圖6所示,為本發明實施例的貼合裝置10貼合工件時第一待貼合元件13與第二待貼合元件14貼合在一起的局部截面示意圖。當伸縮軸185推動板
部183向下載台151運動時,每一個密封柱184恰好可以對應進入一個真空孔152中,使得真空孔152被密封柱184封堵。當上蓋11與下平台16配合形成第一容置腔110時,可對第一容置腔110抽真空使其形成真空狀態。第二容置腔150也可形成真空狀態。密封柱184用於在第一容置腔110與第二容置腔150的真空狀態相同時封堵真空孔152,以防止第二待貼合元件14表面形成部分區域凹陷的“水波紋”狀褶皺。密封柱184可由彈性材料製成,於一實施例中,密封柱184由矽膠製成。密封柱184的尺寸也可略大於真空孔152的尺寸,密封柱184為柔性材料,密封柱184與真空孔152實現過盈配合。
As shown in FIG. 6, it is a partial cross-sectional schematic diagram of the first to-
如圖7所示,本實施例使用該貼合裝置10的元件貼合方法包括如下步驟:
As shown in FIG. 7, the component bonding method using the
步驟S1,提供第一待貼合元件13和第二待貼合元件14,將第一待貼合元件13和第二待貼合元件14分別置於上載台122及下載台151上,使第一待貼合元件13和第二待貼合元件14相對放置,其中第二待貼合元件14藉由真空吸附方式固定於下載台151上,第二容置腔150保持第一真空狀態。
In step S1, the first to-
第一待貼合元件13設置於上載台122表面並藉由真空吸附方式固定。第二待貼合元件14設置於下載台151表面並藉由真空吸附方式固定,該過程中,第二容置腔150內持續抽真空,但並不會到達真空臨界值,保持第二容置腔150處於壓強為小於大氣壓強的第一真空狀態。在一實施例中,第一待貼合元件13為一玻璃蓋板,第二待貼合元件14為一側塗布有光學膠的觸控薄膜,觸控薄膜上形成有用於觸控感測的電極,吸附於該下載台151上時該光學膠位於觸控薄膜朝向該上載台122的一側。在其他實施例中,第二待貼合元件14也可為其他柔性材料的工件。
The
步驟S2,使上蓋11與下平台16扣合形成第一容置腔110,並使第一待貼合元件13與第二待貼合元件14正對且間隔設置。
In step S2, the
移動上蓋11及下平台16中的至少其中之一使得上蓋11的開口111被下平台16閉合以形成第一容置腔110,此時下壓頭15位於第一容置腔110內部;調整上載台122及下載台151的位置使得二者正對設置,同時保持第一待貼合元件13與第二待貼合元件14之間存在一預定距離,本實施例中,該預定距離為150μm。
Move at least one of the
步驟S3,對第一容置腔110抽真空,使第一容置腔110與第二容置腔150內部壓強趨於相同,在第一容置腔110與第二容置腔150壓強相同之前,使密封柱184封堵所有真空孔152,並持續對第一容置腔110及第二容置腔150抽真空使二者共同達到第二真空狀態的過程與密封柱184封堵真空孔152的過程同步完成。
Step S3: Vacuum the first
對第一容置腔110抽真空,使第一容置腔110內部壓強快速下降,當在第一容置腔110與第二容置腔150壓強相同之前,藉由伸縮軸185推動板部183上升,使得密封柱184進入真空孔152中並將真空孔152完全封堵,且,與此同時持續對第一容置腔110及第二容置腔150抽真空使二者共同達到第二真空狀態的過程與密封柱184封堵所述真空孔152的過程同步完成。
The first
第二真空狀態對應的壓強小於該第一真空狀態對應的壓強,本實施例中,該第二真空狀態係指目前工業標準中認可的且可以達到的真空狀態(並非特指絕對真空),該真空狀態可以儘量避免貼合過程中產生氣泡。 The pressure corresponding to the second vacuum state is less than the pressure corresponding to the first vacuum state. In this embodiment, the second vacuum state refers to a vacuum state that is recognized and achievable in current industry standards (not specifically absolute vacuum). Vacuum state can try to avoid bubbles during the bonding process.
步驟S4,移動上載台122和/或下載台151使第一待貼合元件13與第二待貼合元件14貼合在一起。
In step S4, the
步驟S5,同時解除第一容置腔110及第二容置腔150的真空狀態,使上蓋11與下平台16分離,取出貼合在一起的第一待貼合元件13與第二待貼合元件14。
Step S5, the vacuum states of the first
上述方法中,當第一容置腔110內除第二容置腔150之外的區域的壓強與第二容置腔150內部的壓強即將相同時,使得密封柱184進入真空孔152中並將真空孔152封堵,在密封柱184進入真空孔152的過程中,第二待貼合元件14並未與第一待貼合元件13完成貼合,真空孔152被封堵使得第二待貼合元件14靠近下載台151一側失去吸附力,另一側(靠近第二待貼合元件14的一側)的負壓壓強在短時間較大,使得第二待貼合元件14的“水波紋”在該負壓的作用下得以修復。
In the above method, when the pressure in the first
上文中,參照附圖描述了本發明之具體實施方式。然,本領域中的普通技術人員能夠理解,在不偏離本發明之精神和範圍的情況下,亦可對本發明之具體實施方式作各種變更和替換。該些變更和替換都落在本發明申請專利範圍所限定的範圍內。 In the foregoing, specific embodiments of the present invention have been described with reference to the accompanying drawings. Of course, those of ordinary skill in the art can understand that various changes and replacements can be made to the specific embodiments of the present invention without departing from the spirit and scope of the present invention. These changes and replacements all fall within the scope defined by the patent application scope of the present invention.
10:貼合裝置 10: Laminating device
11:上蓋 11: upper cover
111:開口 111: opening
113:容置部 113: Accommodation Department
12:上壓頭 12: Upper indenter
121:伸縮部 121: Telescopic Department
122:上載台 122: Upload table
15:下壓頭 15: Lower head
151:下載台 151: download station
152:真空孔 152: vacuum hole
156:側壁 156: Side wall
150:第二容置腔 150: second accommodating cavity
16:下平台 16: next platform
18:內載台 18: Inner stage
183:板部 183: Board Department
184:密封柱 184: Sealed column
185:伸縮軸 185: Telescopic shaft
13:第一待貼合元件 13: The first component to be bonded
14:第二待貼合元件 14: The second component to be bonded
Claims (10)
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CN201810563924.0A CN108724692B (en) | 2018-06-04 | 2018-06-04 | Bonding apparatus and element bonding method using the same |
CN201810563924.0 | 2018-06-04 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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TWM375607U (en) * | 2009-10-07 | 2010-03-11 | Chin Ying Machinery Co Ltd | Vacuum laminating machine |
TW201119863A (en) * | 2009-12-07 | 2011-06-16 | Chin Ying Machinery Co Ltd | Adhesion positioning rod and vacuum bonding device using the adhesive positioning rod. |
CN103507382A (en) * | 2012-06-20 | 2014-01-15 | 苏州工业园区赫光科技有限公司 | High vacuum laminating machine |
CN204526351U (en) * | 2015-01-21 | 2015-08-05 | 苏州天立达胶粘制品有限公司 | A kind of vacuum forming apparatus |
CN205553491U (en) * | 2016-02-25 | 2016-09-07 | 深圳市恒久瑞电子科技有限公司 | Film structure 3D display screen lamination jig |
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- 2018-06-04 CN CN201810563924.0A patent/CN108724692B/en active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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TWM375607U (en) * | 2009-10-07 | 2010-03-11 | Chin Ying Machinery Co Ltd | Vacuum laminating machine |
TW201119863A (en) * | 2009-12-07 | 2011-06-16 | Chin Ying Machinery Co Ltd | Adhesion positioning rod and vacuum bonding device using the adhesive positioning rod. |
CN103507382A (en) * | 2012-06-20 | 2014-01-15 | 苏州工业园区赫光科技有限公司 | High vacuum laminating machine |
CN204526351U (en) * | 2015-01-21 | 2015-08-05 | 苏州天立达胶粘制品有限公司 | A kind of vacuum forming apparatus |
CN205553491U (en) * | 2016-02-25 | 2016-09-07 | 深圳市恒久瑞电子科技有限公司 | Film structure 3D display screen lamination jig |
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TW202003261A (en) | 2020-01-16 |
CN108724692A (en) | 2018-11-02 |
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