TW202003261A - Laminating device and component laminating method using same - Google Patents

Abstract

A laminating device is provided. The laminating device includes an upper cover, an upper pressure head, a lower platform, a lower pressure head and an inner platform. The upper pressure head is movably disposed in the upper cover for fixing a first to-be-bonded component. The lower platform is configured to cooperate with the upper pressure head to form a first holding chamber. The lower pressure head is disposed on the lower platform and located in the first holding chamber when the lower platform and the upper pressure head cooperate to form the first holding chamber. The lower pressure head cooperates with the lower platform to form a second holding chamber. The lower pressure head comprises a lower platform deck that is disposed opposite to the upper pressure head. The lower platform deck is configured to carry a second to-be-bonded component. The lower platform deck is provided with a plurality of vacuum holes passing through the lower platform deck. The inner platform is movably disposed in the second holding chamber. The inner platform is provided with a plurality of sealing columns. The plurality of sealing columns are used in the first holding chamber and the second holding chamber when the vacuum condition of the first holding chamber is same to the vacuum condition of the second holding chamber. The present invention also provides a component attaching method using the laminating device.

Description

Laminating device and component laminating method using the laminating device

The invention relates to a bonding device and a method for bonding components using the bonding device.

In recent years, with the advancement of technology, the use of touch screens has become wider and wider, from common cash dispensers, smart phones, tablet computers, to industrial touch computers and so on. The widely used touch screens often need to be bonded in a vacuum environment. However, the traditional bonding process has obvious and difficult to overcome defects.

In the traditional structure, the lamination of the touch film needs to be completed using a vacuum laminating machine. The touch film placed on the stage of the vacuum laminating machine is absorbed by the negative pressure generated by the vacuum hole, and the touch film is flexible Material, the vacuum negative pressure generated at the vacuum hole is very easy to cause the touch film to produce a "water ripple"-like deformation. This deformation is difficult to be eliminated after the bonding is completed. The deformation of the touch film will make the visual effect uneven. The display has a greater impact.

The invention provides a laminating device, including:

The upper cover; the upper pressure head is movably arranged in the upper cover for fixing a first component to be attached; the lower platform is used for forming a first accommodating cavity with the upper cover; the lower pressure head is arranged in the The lower platform is located in the first receiving cavity when the lower platform and the upper cover cooperate to form the first receiving cavity. The lower pressing head cooperates with the lower platform to form a second receiving cavity. The lower pressing head includes a A download station opposite to the upper pressure head, the download station is used to carry a second component to be attached, and the download station is provided with a vacuum hole penetrating the download station; the inner loading station is movably arranged on the second In the accommodating cavity, a sealing post is provided on the inner stage, and the sealing post is used to block the vacuum hole when the vacuum states of the first accommodating cavity and the second accommodating cavity are the same.

Also provided is a method for bonding components using the bonding apparatus of the present invention, including the following steps:

Providing a first to-be-laminated element and a second to-be-laminated element, respectively fixing the first to-be-laminated element and the second to-be-laminated element on the upper pressing head and the downloading station, The first to-be-laminated element and the second to-be-laminated element are placed relative to each other, wherein the second to-be-laminated element is fixed on the downloading table by a vacuum suction method, and the second accommodating cavity Maintain a first vacuum state; buckle the upper cover and the lower platform to form the first accommodating cavity, and make the first to-be-laminated element and the second to-be-laminated element face and spaced Set; evacuate the first accommodating cavity to make the internal pressure of the first accommodating cavity and the second accommodating cavity tend to be the same. Before the pressure of the first accommodating cavity and the second accommodating cavity are the same, make the sealing column Block all vacuum holes, continue to evacuate the first containing chamber and the second containing chamber to achieve the second vacuum state together with the process of sealing the vacuum holes by the sealing column; move upload The station and/or the downloading station bond the first component to be bonded and the second component to be bonded together.

The above laminating device includes the inner stage. When the laminating device is used for laminating components, by controlling the movement of the inner stage, the sealing column on the inner stage can be embedded in the vacuum hole at an appropriate time, which can be effective Eliminate the "water ripple" deformation problem.

In order to make the technical content disclosed in this application more detailed and complete, reference may be made to the drawings and the following various specific embodiments of the present invention. The same symbols in the drawings represent the same or similar elements. However, those of ordinary skill in the art should understand that the embodiments provided below are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only, and are not drawn to scale according to their actual dimensions.

The specific embodiments of the present invention will be further described in detail below with reference to the drawings.

As shown in FIG. 1, it is a three-dimensional exploded schematic view of a laminating device 10 according to an embodiment of the present invention. The laminating device 10 includes an upper cover 11, an upper pressure head 12, a lower pressure head 15, a lower platform 16 and an inner stage 18. The upper cover 11 includes an opening 111 and an accommodating portion 113; the upper head 12 includes a telescopic portion 121 and an upper stage 122; the lower head 15 includes a downloading stage 151, a side wall 156, a vacuum hole 152, and a second accommodating chamber 150; The inner stage 18 includes a plate portion 183, a plurality of sealing columns 184, and a telescopic shaft 185. The first to-be-laminated element 13 and the second to-be-laminated element 14 are bonded by the bonding device 10.

As shown in FIG. 2, it is a schematic perspective view of a bonding apparatus 10 according to an embodiment of the invention. The upper cover 11 is disposed opposite to the lower platform 16. The opening 111 of the upper cover 11 is disposed on a surface of the upper cover 11. The opening 111 is disposed relative to the lower platform 16 and penetrates the receiving portion 113. The upper head 12 is movably disposed in the accommodating portion 113, one end of the telescopic portion 121 is connected to the upper cover 11, and the other end of the telescopic portion 121 is connected to the upper stage 122 to control the movement of the upper stage 122, and the upper stage 122 corresponds to the opening 111 Settings. The lower platform 16 is used to cooperate with the upper cover 11 to form a first accommodating cavity 110 (see FIG. 4 ). The lower pressure head 15 is disposed on a surface of the lower platform 16 and the upper cover 11 opposite to each other, and is formed on the lower platform 16 and the upper cover 11. The first accommodating cavity 110 is located in the first accommodating cavity 110. The lower head 15 and the lower platform 16 cooperate with each other to form a second accommodating cavity 150, wherein the downloading table 151 and the upper loading table 122 are oppositely arranged, the side wall 156 is arranged around the downloading table 151, and the downloading table 151, the side wall 156 and the lower platform 16 constitute a first On the outer wall of the two accommodating chambers 150, the vacuum holes 152 penetrate through the downloading table 151. The inner stage 18 is movably disposed inside the second accommodating cavity 150, the size of the plate portion 183 is slightly smaller than the size of the downloading platform 151, and a plurality of sealing posts 184 are provided on one side surface of the plate portion 183 and faced by the plate portion 183 The downloading table 151 protrudes, and the sealing post 184 is provided corresponding to the vacuum hole 152. The shape, number, and size of the sealing post 184 match the shape, number, and size of the vacuum hole 152, respectively, and the telescopic shaft 185 is provided on the plate portion 183 away from the sealing post 184 On one side, the length of the telescopic shaft 185 can be changed, and it can be telescopic within a certain limit. The telescopic shaft 185 is used to drive the plate portion 183 to move in the second accommodating cavity 150.

In one embodiment, the upper cover 11 is a rectangular frame with one end open. In other embodiments, the upper cover 11 may be a cylindrical structure with one end open and hollow. The upper pressure head 12 is disposed in the accommodating portion 113, and can extend out of the upper cover 11 through the opening 111, or the lower pressure head 15 on the lower platform 16 can enter the inside of the upper cover 11 through the opening 111. The telescopic portion 121 of the upper stage 122 is a column-shaped structure, and vacuum pipes connected to each other can be disposed in the upper stage 122 and the telescopic portion 121, so that the first stage 122 to be bonded on the surface of the upper stage 122 can be vacuum-adsorbed. The length of the expansion and contraction part 121 can be changed, and it can expand and contract within a certain limit.

In an embodiment, the lower pressure head 15 is a hollow rectangular frame, and the vacuum holes 152 and the second accommodating cavity 150 penetrate to form a vacuum channel. The number of the vacuum holes 152 is not particularly limited, and it may be one or There are a plurality of vacuum holes 152 in this embodiment. When the second accommodating cavity 150 is evacuated, the external pressure of the lower pressure head 15 is stronger than the internal pressure of the second accommodating cavity 150, and the vacuum hole 152 corresponding to the opening outside the lower pressure head 15 will generate negative pressure and generate suction, so that The downloading table 151 can vacuum suction the second to-be-laminated component 14 placed on its surface.

The following describes the movement mode of using the bonding device 10 during the bonding process of components with reference to FIGS. 3 to 6.

As shown in FIG. 3, it is a schematic diagram of the first state of the bonding apparatus 10 of the embodiment of the present invention when bonding components. The first state is the initial state, the upper cover 11 is not in contact with the lower platform 16, the lower pressure head 15 is located outside the accommodation portion 113, the upper pressure head 12 is located inside the accommodation portion 113, the uploading platform 122 is not in contact with the downloading platform 151, the vacuum The holes 152 are not filled by the sealing post 184, the first to-be-laminated element 13 and the second to-be-laminated element 14 are respectively placed on the uploading table 122 and the downloading table 151, and the first to-be-laminated element 13 and the second to-be-laminated element The components 14 are placed relatively.

As shown in FIG. 4, it is a schematic diagram of the second state when the bonding device 10 of the embodiment of the present invention performs component bonding. The second state is the alignment state of the to-be-adhered patch. The upper cover 11 and the lower platform 16 are engaged to form a first accommodating cavity 110, the lower pressure head 15 is located inside the first accommodating cavity 110, and the uploading platform 122 and the downloading platform 151 are aligned. Paired, and there is a predetermined distance between the first to-be-laminated element 13 and the second to-be-laminated element 14.

As shown in FIG. 5, it is a schematic diagram of the third state of the bonding apparatus 10 according to the embodiment of the present invention when bonding components. The third state is the vacuum bonding state. When the telescopic shaft 185 pushes the plate portion 183 to move toward the download platform 151 for a distance, the plurality of sealing columns 184 are respectively located in the plurality of vacuum holes 152 and completely seal the vacuum holes 152.

As shown in FIG. 6, it is a partial cross-sectional schematic diagram of the first to-be-laminated element 13 and the second to-be-laminated element 14 being bonded together when the bonding device 10 of the embodiment of the present invention is bonding a workpiece. When the telescopic shaft 185 pushes the plate portion 183 toward the downloading table 151, each sealing post 184 can just correspond to a vacuum hole 152, so that the vacuum hole 152 is blocked by the sealing post 184. When the upper cover 11 cooperates with the lower platform 16 to form the first accommodating cavity 110, the first accommodating cavity 110 may be evacuated to form a vacuum state. The second accommodating cavity 150 may also form a vacuum state. The sealing column 184 is used to block the vacuum hole 152 when the vacuum state of the first accommodating chamber 110 and the second accommodating chamber 150 are the same, so as to prevent the surface of the second to-be-laminated element 14 from forming a partially water-recessed “water ripple” shape Folds. The sealing post 184 may be made of an elastic material. In an embodiment, the sealing post 184 is made of silicone. The size of the sealing post 184 may also be slightly larger than the size of the vacuum hole 152. The sealing post 184 is a flexible material, and the sealing post 184 and the vacuum hole 152 achieve an interference fit.

As shown in FIG. 7, the component bonding method using the bonding apparatus 10 in this embodiment includes the following steps:

In step S1, the first to-be-laminated component 13 and the second to-be-laminated component 14 are provided, and the first to-be-laminated component 13 and the second to-be-laminated component 14 are placed on the uploading platform 122 and the downloading platform 151, respectively, so that A to-be-laminated component 13 and a second to-be-laminated component 14 are placed oppositely, wherein the second to-be-laminated component 14 is fixed on the downloading table 151 by vacuum suction, and the second accommodating cavity 150 maintains the first vacuum state.

The first component 13 to be bonded is disposed on the surface of the upper stage 122 and fixed by vacuum suction. The second to-be-laminated component 14 is disposed on the surface of the downloading table 151 and is fixed by vacuum suction. During this process, the second accommodating cavity 150 continues to be evacuated, but it will not reach the vacuum threshold and maintain the second accommodating position. The cavity 150 is in a first vacuum state with a pressure less than atmospheric pressure. In one embodiment, the first component to be bonded 13 is a glass cover plate, and the second component to be bonded 14 is a touch film coated with optical glue on one side, and a touch sensing film is formed on the touch film When the electrode is adsorbed on the download stage 151, the optical glue is located on the side of the touch film facing the upload stage 122. In other embodiments, the second component 14 to be bonded may also be a workpiece of other flexible materials.

In step S2, the upper cover 11 and the lower platform 16 are snapped together to form a first accommodating cavity 110, and the first to-be-laminated element 13 and the second to-be-laminated element 14 are directly and spaced apart.

Move at least one of the upper cover 11 and the lower platform 16 so that the opening 111 of the upper cover 11 is closed by the lower platform 16 to form the first accommodating cavity 110, at this time the lower head 15 is located inside the first accommodating cavity 110; adjust the upload The positions of the platform 122 and the downloading platform 151 are such that they are directly opposed to each other, while maintaining a predetermined distance between the first component 13 to be bonded and the second component 14 to be bonded. In this embodiment, the predetermined distance is 150 μm.

Step S3: Vacuum the first accommodating chamber 110 so that the internal pressure of the first accommodating chamber 110 and the second accommodating chamber 150 tend to be the same, before the pressure of the first accommodating chamber 110 and the second accommodating chamber 150 are the same , The sealing column 184 blocks all the vacuum holes 152, and continues to evacuate the first accommodating chamber 110 and the second accommodating chamber 150 so that the two can reach the second vacuum state together with the sealing column 184 sealing the vacuum holes 152 The process is completed synchronously.

The first accommodating cavity 110 is evacuated so that the pressure inside the first accommodating cavity 110 drops rapidly. Before the pressure of the first accommodating cavity 110 and the second accommodating cavity 150 are the same, the plate portion 183 is pushed by the telescopic shaft 185 Ascending, the sealing column 184 enters the vacuum hole 152 and completely seals the vacuum hole 152, and at the same time, continuously evacuates the first accommodating chamber 110 and the second accommodating chamber 150 so that the two together reach the second vacuum The process of the state is completed in synchronization with the process of sealing the vacuum hole 152 by the sealing column 184.

The pressure corresponding to the second vacuum state is less than the pressure corresponding to the first vacuum state. In this embodiment, the second vacuum state refers to a vacuum state recognized and achievable in current industry standards (not specifically referring to absolute vacuum). Vacuum state can try to avoid bubbles during the bonding process.

In step S4, the uploading platform 122 and/or the downloading platform 151 move the first component 13 to be bonded and the second component 14 to be bonded together.

Step S5, the vacuum states of the first accommodating cavity 110 and the second accommodating cavity 150 are released at the same time, the upper cover 11 and the lower platform 16 are separated, and the first to-be-laminated element 13 and the second to-be-laminated which are bonded together are taken out Element 14.

In the above method, when the pressure in the first accommodating chamber 110 excluding the second accommodating chamber 150 is about to be the same as the pressure inside the second accommodating chamber 150, the sealing column 184 enters the vacuum hole 152 and The vacuum hole 152 is blocked. During the process of the sealing column 184 entering the vacuum hole 152, the second component 14 to be bonded does not complete the bonding with the first component 13 to be bonded, and the vacuum hole 152 is blocked so that the second component to be bonded The side of the closing element 14 close to the downloading table 151 loses its suction force, and the negative pressure on the other side (the side close to the second element 14 to be attached) is relatively large in a short time, making the "water of the second element 14 to be attached" "Ripple" is repaired under this negative pressure.

In the foregoing, specific embodiments of the present invention have been described with reference to the accompanying drawings. Of course, those of ordinary skill in the art can understand that various changes and replacements can be made to the specific embodiments of the present invention without departing from the spirit and scope of the present invention. These changes and replacements all fall within the scope defined by the patent application scope of the present invention.

10‧‧‧ Laminating device 11‧‧‧Cover 111‧‧‧ opening 110‧‧‧ First receiving cavity 113‧‧‧Accommodation Department 12‧‧‧Upper indenter 121‧‧‧Telescopic Department 122‧‧‧Uploading station 15‧‧‧ Lower pressure head 151‧‧‧ download station 152‧‧‧vacuum hole 156‧‧‧Sidewall 150‧‧‧Second accommodating cavity 16‧‧‧ Lower platform 18‧‧‧Inner stage 183‧‧‧ Board Department 184‧‧‧Seal column 185‧‧‧telescopic shaft 13‧‧‧The first component to be bonded 14‧‧‧The second component to be bonded S1~S5‧‧‧‧Laying procedure

FIG. 1 is a three-dimensional exploded schematic view of a bonding device according to an embodiment of the invention.

FIG. 2 is a schematic perspective view of a bonding device according to an embodiment of the invention.

FIG. 3 is a schematic diagram of a first state of the bonding apparatus according to an embodiment of the present invention when bonding components.

FIG. 4 is a schematic diagram of a second state when the bonding device of the embodiment of the present invention performs component bonding.

FIG. 5 is a schematic diagram of a third state of the bonding apparatus according to an embodiment of the present invention when bonding components.

6 is a partial cross-sectional schematic diagram of the first to-be-laminated component and the second to-be-laminated component being bonded together when the bonding device of the embodiment of the present invention is bonding a workpiece.

7 is a schematic flowchart of a method for bonding components using the bonding apparatus according to an embodiment of the present invention.

10‧‧‧ Laminating device

11‧‧‧Cover

111‧‧‧ opening

113‧‧‧Accommodation Department

12‧‧‧Upper indenter

121‧‧‧Telescopic Department

122‧‧‧Uploading station

15‧‧‧ Lower pressure head

151‧‧‧ download station

152‧‧‧vacuum hole

156‧‧‧Sidewall

150‧‧‧Second accommodating cavity

16‧‧‧ Lower platform

18‧‧‧Inner stage

183‧‧‧ Board Department

184‧‧‧Seal column

185‧‧‧telescopic shaft

13‧‧‧The first component to be bonded

14‧‧‧The second component to be bonded

Claims (10)

A fitting device, the improvement of which includes: an upper cover; an upper head, which is movably arranged in the upper cover; a lower platform, which cooperates with the upper cover to form a first accommodating cavity; a lower head, provided Located on the lower platform and when the lower platform and the upper cover cooperate to form the first accommodating cavity, the lower pressure head cooperates with the lower platform to form a first Two accommodating chambers, the lower pressure head includes a downloading table opposite to the upper pressure head, and a vacuum hole penetrating the downloading table is opened on the downloading table; and an internal loading table is movably set at In the second accommodating cavity, a sealing post is provided on the inner stage, and the sealing post is used to block off the first accommodating cavity and the second accommodating cavity in the same vacuum state. Said the vacuum hole. The laminating device according to claim 1, wherein: the inner stage further includes a plate portion and a telescopic shaft connected to the plate portion, the sealing column is formed on the plate portion and is formed by the The plate portion protrudes toward the download platform, and the telescopic shaft is used to drive the plate portion and the sealing column to move in the second accommodating cavity. The laminating device according to claim 1, wherein the vacuum hole has the same shape and size as the sealing column. The laminating device according to claim 1, wherein the size of the sealing column is larger than the size of the vacuum hole, and the sealing column is a flexible material. The laminating device according to claim 1, wherein the vacuum hole communicates with the second accommodating cavity to form a vacuum channel. The bonding device according to claim 1, wherein the upper pressing head is used to fix a first component to be bonded, and the downloading station is used to carry a second component to be bonded. The laminating device according to claim 6, wherein: the upper cover includes an accommodating portion, the upper indenter includes a telescopic portion and an uploading table connected to the telescopic portion, the uploading table is used for The first to-be-laminated element is fixed, and the telescopic part is used to drive the loading table to move in the accommodating part. The component bonding method using the bonding device according to any one of claims 1-7 includes the following steps: providing a first component to be bonded and a second component to be bonded, and placing the first component to be bonded The joining element and the second to-be-attached element are respectively fixed on the upper indenter and the downloading platform, so that the first to-be-attached element and the second to-be-attached element are placed relatively, wherein the The second to-be-laminated component is fixed on the download platform by vacuum suction, and the second accommodating cavity maintains a first vacuum state; the upper cover and the lower platform are snapped together to form the first container Place a cavity and make the first to-be-laminated element and the second to-be-laminated element face and spaced apart; evacuate the first containing cavity to make the first containing cavity and the The internal pressure of the second accommodating cavity tends to be the same. Before the pressure of the first accommodating cavity and the second accommodating cavity are the same, the sealing column blocks each of the vacuum holes and continues to The process of evacuating a containing cavity and the second containing cavity to achieve a second vacuum state together with the process of sealing the vacuum hole by the sealing column is completed synchronously; and moving the upload stage and/or Or the downloading station bonds the first component to be bonded and the second component to be bonded together. The component bonding method of the bonding apparatus according to claim 8, wherein: the pressure corresponding to the second vacuum state is smaller than the pressure corresponding to the first vacuum state. The component bonding method of the bonding apparatus according to claim 8, further comprising the steps of: simultaneously releasing the vacuum state of the first accommodating cavity and the second accommodating cavity, so that the upper cover and the lower Platform separation.

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