TWI709476B - Thermoforming apparatus and thermoforming method - Google Patents
Thermoforming apparatus and thermoforming method Download PDFInfo
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- TWI709476B TWI709476B TW105112295A TW105112295A TWI709476B TW I709476 B TWI709476 B TW I709476B TW 105112295 A TW105112295 A TW 105112295A TW 105112295 A TW105112295 A TW 105112295A TW I709476 B TWI709476 B TW I709476B
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- 238000003856 thermoforming Methods 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims description 37
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 230000002093 peripheral effect Effects 0.000 claims abstract description 67
- 238000010438 heat treatment Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims description 100
- 238000007789 sealing Methods 0.000 claims description 33
- 230000000630 rising effect Effects 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000011162 core material Substances 0.000 description 8
- 239000012535 impurity Substances 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 7
- 230000003028 elevating effect Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/12—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor of articles having inserts or reinforcements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Abstract
Description
本發明是有關於一種熱成形裝置及熱成形方法。 The invention relates to a thermoforming device and a thermoforming method.
一般,作為將表皮片材(以下稱為片材)接著於成形基材(以下稱為基材)的外表面的裝置,已知有於上下腔室內進行輻射加熱的真空壓製積層成形裝置、及進行熱板加熱的熱成形裝置等。 Generally, as a device for adhering a skin sheet (hereinafter referred to as a sheet) to the outer surface of a forming substrate (hereinafter referred to as a substrate), there are known vacuum press laminated forming devices that perform radiation heating in upper and lower chambers, and Thermoforming equipment for hot plate heating, etc.
例如,日本國專利第3937231號公報(以下稱為專利文獻1)已揭示了一種具備可減壓的室箱的被覆裝置。並構成為對該室箱內供給芯材(基材)並減壓,且朝向芯材使已加熱、軟化的表皮材(片材)下降變位,將室箱內加壓而使表皮材按壓並被覆於下方位置的芯材。在室箱內加壓時,由於將已下降變位了的表皮材對位在下方位置的芯材按壓並被覆,所以芯材在下方位置受到壓力。因此,不需要比以往的成形裝置或被覆裝置大的耐壓強度。 For example, Japanese Patent No. 3937231 (hereinafter referred to as Patent Document 1) discloses a covering device provided with a chamber box capable of reducing pressure. It is configured to supply the core material (base material) to the chamber box and reduce pressure, and the heated and softened skin material (sheet) is lowered and displaced toward the core material, and the chamber box is pressurized to press the skin material And cover the core material at the lower position. When the chamber is pressurized, the lowered and displaced skin material is pressed against and covered with the core material at the lower position, so the core material receives pressure at the lower position. Therefore, it is not necessary to have a higher compressive strength than the conventional forming device or coating device.
然而,在專利文獻1之被覆裝置中,使室箱內成
為真空,且在將表皮材被覆於芯材後僅進行加壓。因此,而有著捲入部分之芯材和表皮材的密著性降低之虞。
However, in the coating device of
本發明是鑒於上述情事而完成者,提供一種提高捲入部分之基材和片材之密著性的熱成形裝置及熱成形方法。 The present invention has been completed in view of the above circumstances, and provides a thermoforming device and a thermoforming method that improve the adhesion between the substrate and the sheet in the winding part.
本發明之第一態樣的熱成形裝置,是對基材將片材進行模具賦形,或將前述片材接著於前述基材的熱成形裝置,包含:下框,具有框周壁部及形成有真空通氣孔之框底部,形成收容前述基材之空間;熱板,具有加熱面,構成為對前述框周壁部之上緣部密接前述加熱面;基台,具有可保持前述基材之基材保持部;密閉框,從前述框底部之基台設置面突出而設置,且於平面視是包圍前述基材保持部的全周;及片材固持部,可在藉由前述熱板加熱前述片材之上升位置、和密接於前述密閉框之上端的下降位置之間上下移動地,設於前述下框內,橫跨全周無間隙地固持前述片材之外周端,前述片材固持部在密接於前述密閉框之上端時,形成以前述片材及前述密閉框所圍的密閉空間,前述真空通氣孔是構成為連通於前述下框內之空間,且在前述密閉框之內側至少貫通前述框底部並朝密閉框內上表面開口,在形成了前述密閉空間的狀態下通過前述真空通氣孔進行吸引。 The thermoforming device of the first aspect of the present invention is a thermoforming device for forming a sheet on a substrate or adhering the sheet to the substrate. The thermoforming device includes: a lower frame having a frame peripheral wall portion and a forming device The bottom of the frame with vacuum vents forms a space for accommodating the substrate; the hot plate has a heating surface configured to closely contact the heating surface to the upper edge of the peripheral wall of the frame; the base has a base that can hold the substrate The material holding part; the airtight frame, which protrudes from the base installation surface at the bottom of the frame and is installed, and in a plan view, surrounds the entire circumference of the substrate holding part; and the sheet holding part, which can be heated by the hot plate The sheet is moved up and down between the rising position of the sheet and the lowering position close to the upper end of the airtight frame, and is provided in the lower frame to hold the outer peripheral end of the sheet without any gap across the entire circumference, and the sheet holding portion When tightly attached to the upper end of the sealed frame, a sealed space surrounded by the sheet and the sealed frame is formed, and the vacuum vent is configured to communicate with the space in the lower frame and penetrate at least inside the sealed frame The bottom of the frame is opened toward the inner upper surface of the enclosed frame, and is sucked through the vacuum vent in the state where the enclosed space is formed.
依據上述第一態樣之熱成形裝置,利用從真空通 氣孔吸引,且在氣密的空間內,使片材固持部從上升位置朝基材下降,而使片材接著於基材之表面。片材固持部到達下降位置時,形成以基台之側面、密閉框內上表面、密閉框之內側的側面、及片材所圍的密閉空間。通過真空通氣孔對密閉空間內進行吸引時,更提高密閉空間內的真空度。因此,片材從基材的下端通過基材和基台之基材保持部的邊界,而吸附於密閉框內上表面及朝密閉框之內側的側面連續並擴大的吸附面。藉由該吸附,不會使空氣或不純物侵入到基材和片材之間,片材到前述邊界及基材之底面(背面)側為止密著於基材。因此,在預定的位置到片材切離為止,或是基材從基台脫出而成為成形品為止,不會有捲入部分之表皮材和芯材之密著性降低之虞。藉此,防止氣泡或不純物朝基材和片材之間侵入,且使氣泡或不純物充分地被除去。 According to the above-mentioned first aspect of the thermoforming device, the The pores attract, and in the airtight space, the sheet holding portion is lowered from the rising position toward the substrate, so that the sheet is adhered to the surface of the substrate. When the sheet holding portion reaches the lowered position, a closed space surrounded by the side surface of the base, the inner upper surface of the closed frame, the inner side surface of the closed frame, and the sheet is formed. When the airtight space is sucked through the vacuum vent, the vacuum in the airtight space is further improved. Therefore, the sheet passes through the boundary between the substrate and the substrate holding portion of the base from the lower end of the substrate, and is adsorbed on the upper surface of the airtight frame and the continuous and enlarged suction surface toward the inner side of the airtight frame. This adsorption prevents air or impurities from entering between the base material and the sheet material, and the sheet material adheres to the base material up to the aforementioned boundary and the bottom surface (back surface) of the base material. Therefore, at a predetermined position until the sheet material is cut off, or the base material is released from the base and becomes a molded product, there is no possibility that the adhesion between the skin material and the core material of the entangled part will decrease. In this way, bubbles or impurities are prevented from entering between the substrate and the sheet, and bubbles or impurities are sufficiently removed.
上述第一態樣中,也可以是在前述密閉框之上端設有密封構件。 In the above-mentioned first aspect, a sealing member may be provided at the upper end of the sealing frame.
依據上述第一態樣之熱成形裝置,利用設有密封構件,使密閉框具有對移動到下降位置之片材固持部的緩衝機能,且片材固持部和密閉框透過片材構件密著,提高密閉空間之氣密性。 According to the thermoforming device of the first aspect described above, the sealing member is provided so that the sealing frame has a cushioning function for the sheet holding portion moved to the lowered position, and the sheet holding portion and the sealing frame are sealed through the sheet member, Improve the air tightness of confined spaces.
上述第一態樣中,也可以是前述密閉框內上表面形成於前述基材保持部和前述密閉框之間,且設於比前述基材保持部之外周上緣部及前述密閉框之上端還低的位置。 In the above-mentioned first aspect, the inner upper surface of the sealing frame may be formed between the substrate holding portion and the sealing frame, and provided on the outer peripheral upper edge portion of the substrate holding portion and the upper end of the sealing frame Still low location.
依據上述第一態樣之熱成形裝置,通過真空通氣孔對密閉空間內進行了吸引之際,片材被覆基材的表面,且保持朝基材保持部的外周上緣部下降的方向性,並且從基材保持部之外周上緣部連續於密閉框內上表面並抵接。藉此,片材接觸於基材之基材保持部的外周上緣部的位置,亦即到基材的底面(背面)惻外緣為止無間隙地被捲入。其結果,捲入部分之片材和基材的密著性變得更高。 According to the thermoforming apparatus of the first aspect described above, when the enclosed space is sucked by the vacuum vent, the sheet covers the surface of the substrate and maintains the directionality of descending toward the upper edge of the outer periphery of the substrate holding portion, In addition, the outer peripheral upper edge portion of the base material holding portion is continuous to the inner upper surface of the airtight frame and abuts. Thereby, the sheet is wound without a gap at the position where the outer peripheral upper edge portion of the substrate holding portion of the substrate is in contact, that is, to the bottom surface (back surface) of the substrate and the outer edge. As a result, the adhesion between the sheet material and the substrate in the entangled part becomes higher.
上述第一態樣中,也可以是前述基台朝前述基材保持部之外周側延伸,前述密閉框內上表面構成形成在前述基材保持部之外周側的凹部的上表面。 In the first aspect, the base may extend toward the outer peripheral side of the base material holding portion, and the inner upper surface of the airtight frame constitutes the upper surface of the recess formed on the outer peripheral side of the base material holding portion.
依據上述第一形態之熱成形裝置,凹部的上表面形成密閉框內上表面。因此,密閉空間成為以基台之側面、凹部的上表面、密閉框之內側的側面、及片材所圍的空間。由於凹部的上表面比框底部的上表面高,所以比起密閉框上表面作為框底部之上表面的情況,謀求了密閉空間的縮小化。因此,縮短了用以提高密閉空間內之真空度的所需時間。 According to the thermoforming apparatus of the first aspect described above, the upper surface of the recessed portion forms the inner upper surface of the closed frame. Therefore, the sealed space becomes a space surrounded by the side surface of the base, the upper surface of the recess, the side surface inside the sealed frame, and the sheet. Since the upper surface of the recess is higher than the upper surface of the bottom of the frame, compared to the case where the upper surface of the closed frame is the upper surface of the bottom of the frame, the enclosed space is reduced. Therefore, the time required to increase the degree of vacuum in the enclosed space is shortened.
本發明之第二態樣的熱成形方法,是使用熱成形裝置的熱成形方法,該熱成形裝置包含有:下框,具有框周壁部及形成有真空通氣孔之框底部,形成收容基材之空間;基台,具有可保持前述基材之基材保持部;密閉框,從前述框底部之基台設置面突出而設置,且於平面視是包圍前述基材保持部之全周;及片材固持部,可在藉由熱板加熱前述片材之上升位置、和密接於前述密閉框之上端的 下降位置之間上下移動地,設於前述下框內,橫跨全周無間隙地固持前述片材之外周端,該熱成形方法是:將前述基材保持於前述基材保持部,於前述密閉框的內側收容前述基材,利用前述片材固持部橫跨全周無間隙地固持前述片材的外周端,使前述熱板密接於前述框周壁部之上緣部,使前述片材固持部移動到前述上升位置,且藉由前述熱板將前述片材加熱,利用前述真空通氣孔進行真空吸引,以對前述下框內之空間減壓,且使前述片材固持部移動到前述下降位置為止,對前述片材固持部密接於前述密閉框之上端時所形成之前述片材及前述密閉框所圍的密閉空間,更透過前述真空通氣孔進行吸引。 The thermoforming method of the second aspect of the present invention is a thermoforming method using a thermoforming device. The thermoforming device includes a lower frame, a frame peripheral wall portion and a frame bottom formed with a vacuum vent to form a receiving substrate The space; the base has a substrate holding part that can hold the aforementioned substrate; a closed frame, which protrudes from the base installation surface at the bottom of the frame, and is installed, and in a plan view, surrounds the entire circumference of the aforementioned substrate holding part; and The sheet holding part can be heated by the hot plate at the rising position of the sheet, and close to the upper end of the sealed frame It is provided in the lower frame to move up and down between the lowered positions, and the outer peripheral end of the sheet is held across the entire circumference without gaps. The thermoforming method is: the substrate is held in the substrate holding portion, and the The inner side of the airtight frame accommodates the base material, and the sheet material holding portion is used to hold the outer peripheral end of the sheet material across the entire circumference without gaps, and the hot plate is closely attached to the upper edge of the frame peripheral wall portion to hold the sheet material The part moves to the rising position, and the sheet is heated by the hot plate, and the vacuum vent is used for vacuum suction to reduce the pressure in the space in the lower frame, and the sheet holding part is moved to the lowering Up to the position, the sheet formed when the sheet holding portion is in close contact with the upper end of the sealed frame and the sealed space surrounded by the sealed frame are further sucked through the vacuum vent.
依據上述第二態樣之熱成形方法,在對片材固持部密接於框周壁部之上端時所形成之密閉空間更以真通通氣孔進行吸引的製程中,更提高密閉空間內的真空度,並使片材吸附於前述吸附面。藉此,捲入部分之片材和基材的密著性變高。又,到成形品完成為止,阻止空氣或不純物朝基材和片材之間侵入。 According to the above-mentioned second aspect of the thermoforming method, the closed space formed when the sheet holding portion is closely attached to the upper end of the frame peripheral wall is sucked by the real vents, and the degree of vacuum in the closed space is further improved. And the sheet is adsorbed on the aforementioned adsorption surface. Thereby, the adhesion between the sheet material and the base material in the wound portion becomes high. In addition, until the molded product is completed, air or impurities are prevented from entering between the substrate and the sheet.
上述第二態樣中,也可以是在通過前述真空通氣孔吸引前述密閉空間之際,對前述片材和前述熱板之間的空間進行加壓。 In the above-mentioned second aspect, when the closed space is sucked through the vacuum vent, the space between the sheet and the hot plate may be pressurized.
依據上述第二態樣之熱成形方法,伴隨著加壓,片材從熱板側推壓到基材的表面,使片材和基材之密著性更進一層提高。 According to the above-mentioned second aspect of the thermoforming method, with pressure, the sheet is pressed from the hot plate side to the surface of the substrate, so that the adhesion between the sheet and the substrate is further improved.
依據本發明之上述各態樣之熱成形裝置及熱成 形方法,可提高捲入部分之片材和基材的密著性。其結果,可謀求成形品之品質提升。 According to the above-mentioned various aspects of the thermal forming apparatus and thermal forming of the present invention The forming method can improve the adhesion between the rolled part of the sheet and the substrate. As a result, the quality of molded products can be improved.
1‧‧‧熱成形裝置 1‧‧‧Thermoforming device
2‧‧‧下框 2‧‧‧Bottom frame
4‧‧‧熱板 4‧‧‧Hot plate
4a‧‧‧上表面 4a‧‧‧Upper surface
4p‧‧‧加熱面 4p‧‧‧Heating surface
6‧‧‧基台 6‧‧‧Abutment
6c‧‧‧側面 6c‧‧‧Side
8‧‧‧片材固持部 8‧‧‧Sheet holding part
8A‧‧‧框上部 8A‧‧‧Upper part of frame
8B‧‧‧框下部 8B‧‧‧The lower part of the frame
10‧‧‧密閉框 10‧‧‧Closed frame
10a‧‧‧上端面(上端) 10a‧‧‧Upper end surface (upper end)
12‧‧‧框底部 12‧‧‧Bottom of frame
12a‧‧‧板面 12a‧‧‧Plate
14‧‧‧框周壁部 14‧‧‧Frame wall
14a‧‧‧上端面 14a‧‧‧Upper face
16‧‧‧基材保持部 16‧‧‧Base material holding part
16c‧‧‧側面 16c‧‧‧ side
18‧‧‧外周壁部 18‧‧‧peripheral wall
18d‧‧‧側面 18d‧‧‧ side
20‧‧‧基台設置面 20‧‧‧Abutment setting surface
21‧‧‧凹部 21‧‧‧Concave
22‧‧‧升降機構 22‧‧‧Lifting mechanism
24‧‧‧支持台 24‧‧‧Support Desk
25‧‧‧軸部 25‧‧‧Shaft
26‧‧‧移動部 26‧‧‧Mobile Department
27‧‧‧支持部 27‧‧‧Support Department
31‧‧‧加熱器 31‧‧‧Heater
33‧‧‧通氣孔 33‧‧‧Vent
36‧‧‧真空通氣孔 36‧‧‧Vacuum vent
38‧‧‧密封構件 38‧‧‧Sealing components
39‧‧‧密封構件 39‧‧‧Sealing components
40a‧‧‧密閉框內上表面 40a‧‧‧Inner and upper surface of closed frame
42‧‧‧吸附面 42‧‧‧Adsorption surface
B‧‧‧基材 B‧‧‧Substrate
D1‧‧‧箭頭 D1‧‧‧Arrow
D2‧‧‧箭頭 D2‧‧‧Arrow
H‧‧‧片材 H‧‧‧sheet
P1‧‧‧上升位置 P1‧‧‧Up position
P2‧‧‧下降位置 P2‧‧‧Down position
R‧‧‧表面 R‧‧‧surface
S2‧‧‧空間 S2‧‧‧Space
W‧‧‧密閉空間 W‧‧‧Confined space
x‧‧‧邊界 x‧‧‧Border
圖1是顯示本發明一實施形態之熱成形裝置中,使片材下降之前的狀態的斷面圖。 Fig. 1 is a cross-sectional view showing a state before lowering a sheet in a thermoforming apparatus according to an embodiment of the present invention.
圖2是顯示本發明一實施形態之熱成形裝置中,使片材下降之前的狀態的平面圖。 Fig. 2 is a plan view showing a state before the sheet is lowered in the thermoforming apparatus according to an embodiment of the present invention.
圖3是顯示本發明一實施形態之熱成形裝置中,使熱板抵接於片材的狀態的斷面圖。 Fig. 3 is a cross-sectional view showing a state in which a hot plate is brought into contact with a sheet in the thermoforming apparatus according to an embodiment of the present invention.
圖4是顯示本發明一實施形態之熱成形裝置中,就在使片材固持部下降到下降位置後的狀態的斷面圖。 Fig. 4 is a cross-sectional view showing the state after the sheet holding portion is lowered to the lowered position in the thermoforming apparatus according to the embodiment of the present invention.
圖5是顯示本發明一實施形態之熱成形裝置中,使片材固持部下降到下降位置後已對密閉空間內進行吸引了的狀態的斷面圖。 Fig. 5 is a cross-sectional view showing a state in which the sheet holding portion has been lowered to a lowered position in the thermoforming apparatus according to an embodiment of the present invention, and the enclosed space has been sucked.
1...熱成形裝置 1...Thermoforming device
2...下框 2... lower box
4...熱板 4...Hot plate
4p...加熱面 4p...heated surface
6...基台 6... Abutment
8...片材固持部 8...Sheet holding part
10...密閉框 10...Closed frame
10a...上端面(上端) 10a...Upper end surface (upper end)
12...框底部 12... bottom of box
14...框周壁部 14...Frame peripheral wall
16...基材保持部 16...Base material holding part
20...基台設置面 20...Abutment setting surface
21...凹部 21...recess
36...真空通氣孔 36...Vacuum vent
38...密封構件 38...Sealing components
40a...密閉框內上表面 40a...The upper surface of the airtight frame
B...基材 B... base material
H...片材 H...sheet
P1...上升位置 P1...up position
P2...下降位置 P2...Lower position
以下,就有關本發明一實施形態之熱成形裝置及熱成形方法,參照圖面予以說明。而且,在以下的說明所使用的圖面是示意圖,長度、寬度及厚度的比率等不限於與實際的物品相同,可適宜地進行變更。 Hereinafter, a thermoforming apparatus and a thermoforming method related to an embodiment of the present invention will be described with reference to the drawings. In addition, the drawings used in the following description are schematic diagrams, and the ratios of length, width, and thickness are not limited to the same as the actual article, and can be changed as appropriate.
(熱成形裝置) (Thermoforming device)
圖1及圖2是本實施形態之熱成形裝置1的斷面圖及平面圖,顯示使片材下降之前的狀態。
1 and 2 are a cross-sectional view and a plan view of the
如圖1所示,熱成形裝置1具備有下框2、熱板4、基台6、片材固持部8、及密閉框10。
As shown in FIG. 1, the
下框2是熱成形裝置1的筐體,具備有框底部12、及框周壁部14。
The
框底部12是考慮熱成形裝置1的使用用途等而固定於預定的位置。又,也可以是具備有用以設置於預定位置的固定具等,也可以是用以接著於前述預定位置的接著部等。
The frame
下框2具有框底部12及框周壁部14所圍的空間S2。
The
框周壁部14是於接近框底部12之外周的位置,豎立設置於框底部12之其中一方的板面12a。框周壁部14之上端面14a設有密封構件39。密封構件39是在接下來說明之熱板4抵接於框周壁部14之上端面14a時,用以使熱板4之底面密接於框周壁部14的構件。作為密封構件38的材質,可舉例如苯乙烯-丁二烯橡膠等合成橡膠,然而並不特別限定。
The frame
熱板4是具有平滑的加熱面4p的平板形狀,且在平面視下形成比下框2還大的形狀。且,熱板4藉由不圖示的升降裝置朝著對配置於下方之下框2接近遠離的方向設成可升降。熱板4之加熱面4p於完成了朝下方移動的狀態,密接於下框2之框周壁部14的上端面14a而配置。
The
熱板4之上表面4a隔著預定的間隔設有複數個加熱器31、...、31。又,於熱板4隔著預定的間隔形成有朝加熱面4p開口之複數個通氣孔33、...、33。各個通氣孔33連接於具有真空吸引加熱面4p側之真空泵的真空槽(圖示
省略)、及儲存壓縮機所產生之壓縮空氣的加壓槽(圖示省略)。
The
熱形成裝置1是對收容於空間S2的基材B,將藉由熱板4進行加熱而軟化的片材H進行模具賦形,或是接著於基板B之表面R的裝置。
The thermal forming
基材B是由例如聚丙烯系樹脂、成形品之聚乙烯系樹脂等之熱可塑性樹脂形成之本體。基材B的形狀雖無特別限制,然而基材B的高度尺寸是比框周壁部14的高度尺寸小。
The base material B is a body formed of thermoplastic resin such as polypropylene resin, polyethylene resin of molded product, and the like. Although the shape of the base material B is not particularly limited, the height dimension of the base material B is smaller than the height dimension of the frame
片材H是具有例如印刷層、設於印引刷層之表面的保護膜或是載體膜、及設於印刷層之背面的接著層之公知的多層片材。前述膜或層的材質只要是藉由抵接於熱板4之加熱面4p而被加熱,且具有可撓性及黏著性,並且於已被冷卻之際可被覆於基材B之表面R者,無特別限制。
The sheet H is a well-known multilayer sheet having, for example, a printing layer, a protective film or a carrier film provided on the surface of the printing layer, and an adhesive layer provided on the back of the printing layer. The material of the aforementioned film or layer only needs to be heated by abutting on the
基台6是用以將基材B保持於空間S2內之構件,且是抵接於框底部12之板面12a的預定位置而設。亦即,框底部12的板面12a是基台設置面20。如圖2所示,以平面視觀之,於基台6的大略中央設有可保持基材B的基材保持部16。基材保持部16設置有基材B。基材保持部16之以平面視之的形狀是和基材B的底面之以平面視之的形狀相同。除此之外,以平面視觀之時,基材保持部16是形成比基材B的底面尺寸還小。藉此,片材H被覆在基材B的表面R時,可使片材H易於朝基材B的底面(背面)捲入。
The
在本實施形態中,基台6朝基材保持部16的外周側延伸,基台6的延伸部分之從框底部12的板面12a起算的高度尺寸比基材保持部16小。又,從基材保持部16延伸的部分,即外周壁部18,是設置成對框底部12的板面12a豎起。藉由如此之構成,於基材保持部16的外周側設置凹部21。
In this embodiment, the
片材固持部8是由框上部8A和框下部8B構成。框上部8A和框下部8B於平面視中,是以片材H的外周緣可配置於該等框之寬度方向的大略中央的方式,形成與片材H的形狀一致。也就是,以使片材H的外周緣位於框上部8A及框下部8B之框的外周緣與內周緣的中間的方式,形成框上部8A及框下部8B。藉此如圖1所示,使不鬆弛而伸張了的狀態之片材H的外周端橫跨全周無間隙地,夾持在框上部8A和框下部8B之間。
The
片材固持部8藉由片材固持部升降機構(以下作為「升降機構」)22,而支持成可從利用熱板4加熱片材H之上升位置P1下降。升降機構22具備有支持台24、軸部25、移動台26及支持部27。支持台24抵接於基台6之側面6c,於平面視是以包圍基台6的方式,設於空間S2內之框底部12的板面12a上。軸部25是沿著片材H的升降方向豎立設置於支持台24的上表面。又,軸部25貫通移動部26。移動部26是作成可藉由未圖示之驅動部而沿著軸部25之軸線方向升降的環狀構件。支持部27與移動部26連續設置,且從移動部26沿著與框底部12之板面12a平行的方向朝空間S2內
突出而設置。支持部27之突出端部於平面視,是與抵接於基台6之支持台24的端部重疊。
The
在支持部27的上表面連續設置有片材固持部8的框下部8B。
The
密閉框10是從框底部12的板面12a(亦即,基台設置面20)突出而設置。在本實施形態中,密閉框10是以從支持台24之上表面突出的方式,設在與升降機構22之支持台24的基台6相接的端部。因此,在平面觀視下,密閉框10之上端面10a與支持部27的突出端部重疊。從框底部12的板面12a起算之密閉框10的高度尺寸是和從板面12a起算之基台6之外周壁部18的高度尺寸同等。而且,從框底部12的板面12a起算之外周壁部18及密閉框10的高度尺寸,是比從板面12a起算之基台6的基材保持部16之上表面的高度尺寸大。
The
但是,使基材保持部16之側面16c的高度尺寸確保某一程度是重要的。是故,也可以是從框底部12之板面12a起算之外周壁部18及密閉框10的高度尺寸,比從同面起算之基台6之基材保持部16的上表面的高度尺寸小,也可以是同等。而且,基材保持部16和密閉框10之間的密閉框內上表面40a是設置在比基材保持部16之外周上緣部(相當於圖4及圖5所示之邊界x)及前述密閉框之上端低的位置。
However, it is important to ensure the height dimension of the
於如上述之構成中,支持片材固持部8之支持部27透過移動部26而沿著軸部25之軸線方向下降時,會在密
閉框10之上端面10a卡止。亦即,片材固持部8在藉由熱板4加熱片材H之上升位置P1和密接於密閉框10之上端面(上端)10a之下降位置P2之間設成可上下移動。
In the above-mentioned configuration, when the supporting
密閉框10之上端面10a設有密封構件38。密封構件38是用以使藉由升降機構22而下降到密閉框10之上端面10a的支持部27的底面密接於密閉框10的構件,且是考量支持部27的材質等而以適切的材質形成。作為密封構件38的材質例如可舉苯乙烯-丁二烯橡膠等合成橡膠,然而並未特別限定。
A sealing
熱成形裝置1中,形成有連通於下框2內之空間S2且在密閉框10之內側至少貫通框底部12的真空通氣孔36。真空通氣孔36之與朝空間S2開口之端部為相反側的端部,連接有未圖示之真空泵等。
In the
可以是真空通氣孔36至少形成一個,然而真空通氣孔36的數量未被限制。
At least one
作為密封構件38、39以外之熱成形裝置1的構成要素的材質,例如可舉不銹鋼(SUS)等,然而並未特別限定。
As a material of the component of the
(熱成形方法) (Hot forming method)
接著,就有關使用熱成形裝置1之熱成形方法進行說明。本實施形態之熱成形方法是對基材B將利用加熱而軟化了的片材H進行模具賦形或接著於基材B的方法。
Next, the thermoforming method using the
詳細來說,本實施形態之熱成形方法至少具備有以下說明之第一製程到第五製程。 In detail, the thermoforming method of this embodiment includes at least the first process to the fifth process described below.
[第一製程] [First Process]
在本製程中,將基材B保持於基台6之基材保持部16,且將基材B收容於密閉框10的內側。
In this process, the base material B is held in the base
詳細來說是如圖1所示,使熱板4相對於框周壁部14朝上方分離。又,將固持片材H之前的片材固持部8配置於比上升位置P1還下方。然後,將如此之狀態作為初期狀態。
Specifically, as shown in FIG. 1, the
接著,將基材B設置於基材保持部16。此時,為了將基材B更安定地保持,也可以是從基材保持部16的上表面吸引基材B。
Next, the substrate B is set on the
[第二製程] [Second Process]
在本製程中,以片材固持部8橫跨全周無間隙地固持片材H的外周端。
In this process, the outer peripheral end of the sheet H is held by the
亦即,在平面觀視下,片材H之外周緣配置於框下部8B之框的寬度方向內。也就是,將片材H配置在框下部8B上,以使片材H的外周緣位在框下部8B之外周緣與內周緣之間。然後,從片材H的上表面使框上部8A與框下部8B的位置一致而配置,藉由框上部8A與框下部8B將片材H夾入。藉此,如圖1所示,在使片材H不鬆弛地拉伸的狀態下夾持於框上部8A與框下部8B之間。
That is, in a plan view, the outer periphery of the sheet H is arranged in the width direction of the frame of the frame
[第三製程] [The third process]
在本製程中,使熱板4密接於框周壁部14之上端面(框上緣部)14a,使片材固持部8移動至上升位置P1,並藉由熱板4加熱片材H。
In this process, the
圖3是本實施形態中之熱成形裝置1的斷面圖,顯示使熱板4密接於片材H的狀態。
3 is a cross-sectional view of the
詳細來說,使熱板4從圖1所示的位置朝下方(亦即,朝圖3所示之箭頭D2方向)移動,如圖3所示,使加熱面4p的外周部抵接於框周壁部14的上端面14a。此時,片材H的上表面沿著熱板4之加熱面4p配置成大略接觸了的狀態。在此階段,空間S2藉由下框2之框底部12及框周壁部14、熱板4而被密閉。
In detail, the
接著,對熱板4和片材H之間進行減壓,使片材H吸附於加熱面4p並進行加熱。具體來說,藉由加熱器31加熱熱板4且使圖示省略之真空槽開放,透過通氣孔33將片材H朝向熱板4之加熱面4p移動的方向進行真空吸引。藉此,使片材H吸附於熱板4之加熱面4p,並對吸附了的片材H加熱。
Next, the pressure is reduced between the
而且,於本製程中,宜以使連接於真空通氣孔36之真空槽作動,讓空間S2內事先開始進行真空吸引以成為預定之真空度。
Moreover, in this manufacturing process, it is advisable to operate the vacuum groove connected to the
[第四製程] [The fourth process]
在本製程中,利用真空通氣孔36進行吸引以使下框2內之空間S2減壓,且使片材固持部8移動到下降位置P2為止。
In this process, the
詳細來說,首先使連接於真空通氣孔36之真空槽作動,透過真空通氣孔36,朝著使片材H向下方移動的方向進行真空吸引。藉此,片材H之下方的空間S2的空氣
被朝圖1所示之箭頭D1方向吸引,空間S2被減壓而成為高真空狀態。
In detail, first, the vacuum groove connected to the
在此狀態下,藉由未圖示之驅動部使升降機構22的移動部26朝下方移動,以適切的速度使片材固持部8從上升位置P1移動到下降位置P2為止。於高真空狀態之空間S2,於片材H藉由來自熱板4之加熱而發現可撓性及黏著性,所以伴隨片材固持部8的下降,片材H從上表面朝下表面被覆於基材B的表面R。
In this state, the moving
[第五製程] [Fifth Process]
在本製程中,片材固持部8密接於密閉框10之上端面10a時,將藉由片材H及密閉框10所圍的密閉空間W以真空通氣孔36進一步進行吸引。
In this process, when the
圖4是本實施形態之熱成形裝置1的斷面圖,且顯示就在剛將片材固持部8下降到下降位置P2後的狀態。
Fig. 4 is a cross-sectional view of the
片材固持部8到達下降位置P2時,如圖4所示,形成以基台6之基材保持部16的側面16c、密閉框內上表面40a、外周壁部18之內側的側面18d、及片材H的底面所圍的密閉空間W。換言之,密閉空間W被凹部21的內壁面和片材H的底面圍繞而形成。
When the
接著,藉由真空通氣孔36吸引密閉空間W內,而更提高密閉空間W內的真空度。
Next, the enclosed space W is sucked by the
圖5是本實施形態之熱成形裝置1的斷面圖,且顯示使片材固持部8下降到下降位置P2後吸引了密閉空間W內的狀態。
5 is a cross-sectional view of the
密閉空間W內藉由真空通氣孔36吸引時,如圖5所示,片材H被朝下方吸引,而吸附於吸附面42。吸附面42是形成為從基材B的下端,通過基材B和基台6之基材保持部16的邊界x,朝密閉框內上表面40a及外周壁部18之內側的側面18d連續而擴大。
When the enclosed space W is sucked by the
在本製程中,也可以是對片材H和熱板4之加熱面4p之間的密閉空間S2進行加壓。
In this process, the enclosed space S2 between the sheet H and the
藉此,片材H更強力地密著於吸附面42。
Thereby, the sheet material H adheres to the
進行了從上述說明之第一製程到第五製程後,以圖未示之切斷裝置等於邊界x將片材H切斷。 After performing the first process to the fifth process described above, the sheet material H is cut with a cutting device not shown equal to the boundary x.
接著,使熱板4朝上方移動,並進而朝橫向方向移動。然後,使被覆及接著片材H的基材B,亦即使成形品從基台6之基材保持部16卸除,並從空間S2取出。
Next, the
藉由以上的作業,完成成形品,並完成一連串的熱成形動作。 Through the above operations, the molded product is completed and a series of thermoforming operations are completed.
(熱成形裝置1及熱成形方法的作用效果)
(Effects of
如上述說明般,依據本實施形態之熱成形裝置1,從真空通氣孔36進行真空吸引,在氣密的空間S2內,於片材固持部8到達下降位置P2時,便形成密閉空間W。透過真空通氣孔36對密閉空間W內進行吸引時,密閉空間W內的真空度便更為提高,使片材H吸附於吸附面42。藉由片材H之朝吸附面42的吸附,可提高捲入部分之基材B和片材H的密著性。因此,不會使空氣或不純物侵入到基材B和片材H之間,而可提高成形品之氣泡或不純物的除
去效果。
As described above, according to the
又,依據本實施形態之熱成形裝置1,可藉由密封構件38,使密閉框10具有對移動到下降位置P2之片材固持部8的緩衝機能,且可使片材固持部8和密閉框10密著,而提高密閉空間W的氣密性。
Furthermore, according to the
又,依據本實施形態之成形裝置1,密閉框內上表面40a設於比基材保持部16之外周上緣部及密閉框10之上端面10a還低的位置。因此,可使片材H被覆到邊界x及基材B的底面(背面)外緣部並捲入。
Furthermore, according to the
藉此,可防止成形後之片材H剝落,並更提高成形品之氣泡或不純物之除去效果。 Thereby, the sheet material H after forming can be prevented from peeling off, and the effect of removing bubbles or impurities of the formed product can be improved.
再者,在本實施形態之熱成形裝置1中,基台6朝基材保持部16之外周側延伸,且於基材保持部16之外周形成凹部21。又,凹部21之外周壁部18設於密閉框10之內側。因此,比起框底部12的板面12a,凹部21的底面較高的情況,又,外周壁部18之內側的側面18d相較密閉框10之內側的側面位在內側的情況,可使密閉空間W縮小,而縮短用以提高密閉空間W內之真空度的所需時間。
Furthermore, in the
又,依據本實施形態之熱成形方法,於第五製程中,更提高密閉空間W內的真空度,使片材H吸附於吸附面42。藉此,提高基材B和片材H的密著性,到成形品完成為止,可確實地防止空氣或不純物朝基材B和片材H之間侵入。
In addition, according to the thermoforming method of this embodiment, in the fifth process, the degree of vacuum in the enclosed space W is further increased, so that the sheet H is adsorbed on the
又,依據本實施形態之熱成形方法,於第五製
程中,利用對片材H和熱板4之加熱面4p之間的密閉空間S2進行加壓,可更一層地提高基材B和片材H的密著性。
Also, according to the hot forming method of this embodiment, the fifth system
During the process, the sealed space S2 between the sheet material H and the
以上,雖就有關本發明之較佳實施形態進行詳述,然而本發明並未限定於特定的實施形態,在申請專利範圍內所記載之本發明的要旨的範圍內,可進行種種的變更。 Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to specific embodiments, and various changes can be made within the scope of the gist of the present invention described in the scope of the patent application.
例如,也可以是基台6之外周壁部18的上端面設置密封構件38,外周壁部18兼作密閉框10。
For example, a sealing
又,也可以是基台6不朝基材保持部16的外周側延伸,基台6由基材保持部16構成。於此情況,在框底部12之板面12a上從基材保持部16離開而設置密閉框10。進而,密閉框內上表面40a是藉由基材保持部16的側面16c、夾在基材保持部16和密閉框10之間的框底部12的板面12a、及密閉框10之內側的側面構成。
In addition, the
又,升降機構22的構成並不限於上述說明之構成。亦即,升降機構22也可以是由移動部26和支持部27構成,移動部26連接於框周壁部14,並作成可沿框周壁部14升降,也可作成再另外的形態。
In addition, the structure of the
1‧‧‧熱成形裝置 1‧‧‧Thermoforming device
2‧‧‧下框 2‧‧‧Bottom frame
4‧‧‧熱板 4‧‧‧Hot plate
4a‧‧‧上表面 4a‧‧‧Upper surface
4p‧‧‧加熱面 4p‧‧‧Heating surface
6‧‧‧基台 6‧‧‧Abutment
6c‧‧‧側面 6c‧‧‧Side
8‧‧‧片材固持部 8‧‧‧Sheet holding part
8A‧‧‧框上部 8A‧‧‧Upper part of frame
8B‧‧‧框下部 8B‧‧‧The lower part of the frame
10‧‧‧密閉框 10‧‧‧Closed frame
10a‧‧‧上端面(上端) 10a‧‧‧Upper end surface (upper end)
12‧‧‧框底部 12‧‧‧Bottom of frame
12a‧‧‧板面 12a‧‧‧Plate
14‧‧‧框周壁部 14‧‧‧Frame wall
14a‧‧‧上端面 14a‧‧‧Upper face
16‧‧‧基材保持部 16‧‧‧Base material holding part
16c‧‧‧側面 16c‧‧‧ side
18‧‧‧外周壁部 18‧‧‧peripheral wall
18d‧‧‧側面 18d‧‧‧ side
20‧‧‧基台設置面 20‧‧‧Abutment setting surface
21‧‧‧凹部 21‧‧‧Concave
22‧‧‧升降機構 22‧‧‧Lifting mechanism
25‧‧‧軸部 25‧‧‧Shaft
26‧‧‧移動部 26‧‧‧Mobile Department
27‧‧‧支持部 27‧‧‧Support Department
31‧‧‧加熱器 31‧‧‧Heater
33‧‧‧通氣孔 33‧‧‧Vent
36‧‧‧真空通氣孔 36‧‧‧Vacuum vent
38‧‧‧密封構件 38‧‧‧Sealing components
39‧‧‧密封構件 39‧‧‧Sealing components
40a‧‧‧密閉框內上表面 40a‧‧‧Inner and upper surface of closed frame
42‧‧‧吸附面 42‧‧‧Adsorption surface
B‧‧‧基材 B‧‧‧Substrate
H‧‧‧片材 H‧‧‧sheet
P1‧‧‧上升位置 P1‧‧‧Up position
P2‧‧‧下降位置 P2‧‧‧Down position
R‧‧‧表面 R‧‧‧surface
S2‧‧‧空間 S2‧‧‧Space
W‧‧‧密閉空間 W‧‧‧Confined space
x‧‧‧邊界 x‧‧‧Border
Claims (6)
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JP2015086724A JP5791842B1 (en) | 2015-04-21 | 2015-04-21 | Thermoforming apparatus and thermoforming method |
JP2015-086724 | 2015-04-21 |
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TW201703978A TW201703978A (en) | 2017-02-01 |
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TW (1) | TWI709476B (en) |
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JP7268855B2 (en) * | 2019-07-04 | 2023-05-08 | 株式会社浅野研究所 | thermoforming method |
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Citations (3)
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JPH0516218A (en) * | 1991-07-15 | 1993-01-26 | Hitachi Chem Co Ltd | Vacuum mold for formed article with skin |
JP2005262502A (en) * | 2004-03-16 | 2005-09-29 | Fuse Shinku Kk | Method and apparatus for vacuum coating of core material |
CN101466528A (en) * | 2006-06-13 | 2009-06-24 | 依视路国际有限公司 | Method of bonding a film to a curved substrate |
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EP0251546B1 (en) * | 1986-07-02 | 1992-03-11 | General Motors Corporation | Making automobile body panels having applied painted carrier films |
JP3253654B2 (en) * | 1991-11-14 | 2002-02-04 | 大日本印刷株式会社 | Vacuum press lamination molding method |
JPH0811200A (en) * | 1994-06-30 | 1996-01-16 | Dainippon Printing Co Ltd | Vacuum press laminate molding method and apparatus |
JP2012096416A (en) * | 2010-10-31 | 2012-05-24 | Fuse Shinku Kk | Vacuum molding machine, substrate for vacuum molding machine, and vacuum molding method |
-
2015
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2016
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0516218A (en) * | 1991-07-15 | 1993-01-26 | Hitachi Chem Co Ltd | Vacuum mold for formed article with skin |
JP2005262502A (en) * | 2004-03-16 | 2005-09-29 | Fuse Shinku Kk | Method and apparatus for vacuum coating of core material |
CN101466528A (en) * | 2006-06-13 | 2009-06-24 | 依视路国际有限公司 | Method of bonding a film to a curved substrate |
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TW201703978A (en) | 2017-02-01 |
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