TWI693761B - Laser amplifying apparatus - Google Patents
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- TWI693761B TWI693761B TW107113099A TW107113099A TWI693761B TW I693761 B TWI693761 B TW I693761B TW 107113099 A TW107113099 A TW 107113099A TW 107113099 A TW107113099 A TW 107113099A TW I693761 B TWI693761 B TW I693761B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08013—Resonator comprising a fibre, e.g. for modifying dispersion or repetition rate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/094084—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light with pump light recycling, i.e. with reinjection of the unused pump light, e.g. by reflectors or circulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/10007—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08054—Passive cavity elements acting on the polarization, e.g. a polarizer for branching or walk-off compensation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/10061—Polarization control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2308—Amplifier arrangements, e.g. MOPA
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Abstract
Description
本發明是有關於一種雷射放大裝置,有關於一種利用固體放大器放大光纖種子雷射的雷射放大裝置。 The invention relates to a laser amplifying device, and relates to a laser amplifying device using a solid-state amplifier to amplify an optical fiber seed laser.
於半導體製程中,雷射應用技術的使用逐漸擴大,因此於需要對如半導體、顯示器、印刷電路板(Printed Circuit Board,PCB)、智慧型手機等的微電子產業製品與零件進行精密微細加工的領域中,投入改善生產效率與生產性的新穎的雷射製程備受關注。 In the semiconductor manufacturing process, the use of laser application technology is gradually expanding. Therefore, precision microfabrication of microelectronics industrial products and parts such as semiconductors, displays, printed circuit boards (PCBs), and smartphones is required. In the field, new laser processes invested in improving production efficiency and productivity have attracted much attention.
於雷射切晶(dicing)製程中,在應用至奈米尺寸以下的製程的情形時,因配線間隔變窄而產生電容增加、時間延遲、消耗電力增加、相互干擾噪聲等問題。為了解決上述問題,於半導體晶片表面導入層間絕緣膜,於該情形時,在以先前的鋁輪方法切割晶圓時具有層間絕緣膜物質黏附至金剛石輪表面的缺點。因此,較佳為利用雷射設備於半導體晶片表面刻槽,藉由先前方法切割其餘部分。 In the laser dicing process, when it is applied to a process with a nanometer size or less, problems such as an increase in capacitance, a time delay, an increase in power consumption, and mutual interference noise occur due to narrow wiring intervals. In order to solve the above problem, an interlayer insulating film is introduced on the surface of the semiconductor wafer. In this case, when the wafer is cut by the previous aluminum wheel method, the interlayer insulating film substance adheres to the surface of the diamond wheel. Therefore, it is preferable to use a laser device to engrave grooves on the surface of the semiconductor wafer, and cut the remaining part by the previous method.
另外,於PCB製程中,亦推進用以改善生產效率及生產性的製程開發。為了可於一個設備中實現紫外線鑽孔、切割等兩 種以上的製程而需要具有短脈衝與長脈衝的兩種以上的雷射光源。最近,更需要一種可實現脈寬調變的雷射光源。 In addition, in the PCB manufacturing process, it also promotes process development to improve production efficiency and productivity. In order to realize two kinds of ultraviolet drilling and cutting in one device For more than one process, two or more laser light sources with short pulses and long pulses are required. Recently, there is a need for a laser light source that can realize pulse width modulation.
使用目前正在商用化的釔鋁石榴石(YAG)或釩酸釔(YVO4)結晶的紫外線固體雷射的脈寬發生範圍大部分限制為數十奈秒(ns)左右。因此,需要一種可應用至雷射刻槽製程及PCB製程等各種製程的具有數百奈秒以上的長脈衝的雷射光源。 The pulse width generation range of ultraviolet solid lasers crystallized using yttrium aluminum garnet (YAG) or yttrium vanadate (YVO 4 ), which is currently commercialized, is mostly limited to tens of nanoseconds (ns). Therefore, there is a need for a laser light source with long pulses over hundreds of nanoseconds that can be applied to various processes such as laser grooving processes and PCB processes.
根據本發明的例示性的實施例,提供一種雷射放大裝置,其釋出如下雷射:具有數奈秒(ns)至數百奈秒(ns)的脈寬,能夠以數百kHz的重複率進行動作,可實現數瓦特(watt)至數十瓦特(watt)的輸出。 According to an exemplary embodiment of the present invention, there is provided a laser amplifying device which emits a laser having a pulse width of several nanoseconds (ns) to hundreds of nanoseconds (ns), which can be repeated at hundreds of kHz It can operate at a rate of several watts to tens of watts.
本發明的一實施例的雷射放大裝置包括:種子光束光源,供給種子光束;及固體放大器,放大上述種子光束的輸出;且上述固體放大器包括:雷射介質;抽運光束光源,供給激發上述雷射介質的抽運光束;抽運光束鏡,使通過上述雷射介質的上述抽運光束再次向上述雷射介質反射;多個雙向色(dichroic)鏡,以上述種子光束沿與上述抽運光束的抽運路徑相同的路徑通過上述雷射介質的方式反射上述種子光束;及多個鏡,配置至上述種子光束的光路徑上。 A laser amplifying device according to an embodiment of the present invention includes: a seed beam light source that supplies a seed beam; and a solid-state amplifier that amplifies the output of the seed beam; and the solid-state amplifier includes: a laser medium; a pump beam light source that supplies the excitation Pumping beam of laser medium; pumping beam mirror to make the pumping beam passing through the laser medium reflect again to the laser medium; a plurality of bidirectional color (dichroic) mirrors, along with the pumping of the seed beam The same pumping path of the light beam reflects the seed beam through the laser medium; and a plurality of mirrors are arranged on the light path of the seed beam.
上述多個雙向色鏡可反射上述種子光束,且使抽運光束透射。 The plurality of bidirectional color mirrors can reflect the seed beam and transmit the pump beam.
上述雙向色鏡可包括第一雙向色鏡及第二雙向色鏡,上述雷射介質可配置至上述第一雙向色鏡與上述第二雙向色鏡之 間。 The bidirectional color mirror may include a first bidirectional color mirror and a second bidirectional color mirror, and the laser medium may be configured between the first bidirectional color mirror and the second bidirectional color mirror between.
上述種子光束光源可為光纖種子雷射光源。 The above-mentioned seed beam light source may be an optical fiber seed laser light source.
上述雷射放大裝置可更包括調節自上述種子光束光源釋出的種子光束的特性的種子光束調節裝置。 The laser amplifying device may further include a seed beam adjusting device that adjusts the characteristics of the seed beam emitted from the seed beam light source.
上述種子光束調節裝置可包括半波板。 The aforementioned seed beam adjusting device may include a half-wave plate.
上述種子光束調節裝置可包括第一透鏡及第二透鏡,於上述種子光束的行進方向上彼此隔開地設置,隨著其等之間的間隔發生變化而調節上述種子光束的光束直徑。 The seed beam adjusting device may include a first lens and a second lens, which are spaced apart from each other in the traveling direction of the seed beam, and adjust the beam diameter of the seed beam as the interval between them changes.
上述第一透鏡及第二透鏡能夠以通過上述第二透鏡的上述種子光束成為平行光的方式構成。 The first lens and the second lens can be configured such that the seed light beam passing through the second lens becomes parallel light.
上述雷射介質可將上述種子光束放大為訊號光束。 The laser medium can amplify the seed beam into a signal beam.
自上述種子光束光源釋出的上述種子光束可為偏振的雷射光束。 The seed beam emitted from the seed beam light source may be a polarized laser beam.
例示性的實施例的雷射放大裝置利用光纖種子雷射,藉此可容易地調節脈寬及重複率,可利用固體放大器釋出具有數十瓦特(watt)至數百瓦特(watt)的輸出的雷射。 The laser amplifying device of the exemplary embodiment utilizes an optical fiber seed laser, whereby the pulse width and repetition rate can be easily adjusted, and a solid-state amplifier can be used to output an output with a power of tens of watts to hundreds of watts. Laser.
另外,藉此可提高雷射應用設備、特別是PCB設備及刻槽(grooving)設備的加工品質與生產性。 In addition, it can improve the processing quality and productivity of laser application equipment, especially PCB equipment and grooving equipment.
另外,可利用一個雷射放大裝置實現脈寬調變及輸出放大,因此亦可於設備小型化、設備製造成本降低及維護方面產生有利的效果。 In addition, a laser amplifying device can be used to achieve pulse width modulation and output amplification, so it can also produce advantageous effects in terms of miniaturization of equipment, reduction in equipment manufacturing costs, and maintenance.
100:雷射放大裝置 100: laser amplifying device
110:種子光束光源 110: Seed beam light source
120:種子光束調節裝置 120: Seed beam adjustment device
121:半波板 121: Half wave plate
123:第一透鏡 123: the first lens
125:第二透鏡 125: second lens
140:固體放大器 140: solid state amplifier
141:抽運光束光源 141: Pumping beam light source
145:雷射介質 145: Laser medium
147:抽運光束鏡 147: Pumping beam mirror
d:距離 d: distance
DM1:第一雙向色鏡 DM1: the first two-way color mirror
DM2:第二雙向色鏡 DM2: second bi-directional color mirror
M1、M2、M3:鏡 M1, M2, M3: mirror
L:種子光束 L: seed beam
P:抽運光束 P: Pumping beam
W1、W2:光束直徑 W1, W2: beam diameter
圖1是概略性地表示本發明的一實施例的雷射放大裝置 的圖。 FIG. 1 is a laser amplifying device schematically showing an embodiment of the present invention Figure.
圖2a是概略性地表示本發明的一實施例的雷射放大裝置中的種子光束調節裝置的圖。 2a is a diagram schematically showing a seed beam adjusting device in a laser amplifying device according to an embodiment of the present invention.
圖2b是放大表示種子光束調節裝置中的第一透鏡及第二透鏡的圖。 FIG. 2b is an enlarged view of the first lens and the second lens in the seed beam adjusting device.
圖3是概略性地表示本發明的一實施例的雷射放大裝置中的固體放大器的圖。 3 is a diagram schematically showing a solid-state amplifier in a laser amplifying device according to an embodiment of the present invention.
以下,參照隨附圖式,詳細地對本發明的實施例進行說明,以便在本發明所屬的技術領域內具有常識者可容易地實施本發明。然而,本發明能夠以各種不同的形態實現,並不限定於此處所說明的實施例。並且,為了明確地說明本發明,於圖中省略與說明無關的部分,於整篇說明書中,對相似的部分標註相似的符號。 Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those with common knowledge in the technical field to which the present invention belongs can easily implement the present invention. However, the present invention can be implemented in various forms, and is not limited to the embodiments described here. In addition, in order to clearly explain the present invention, parts irrelevant to the description are omitted in the drawings, and similar parts are marked with similar symbols throughout the specification.
於整篇本說明書中,在記載為某個部分「連接」於另一部分時,不僅包括「直接連接」的情形,而且亦包括「於其等中間隔有其他元件」而「電性連接」的情形。另外,於整篇說明書中,在記載為某個部分「包括」某個構成要素時,只要無特別相反的記載,則意味著可更包括其他構成要素,而並非是指排除其他構成要素。 Throughout this specification, when it is stated that a part is "connected" to another part, it includes not only the case of "direct connection", but also "electrically connected" with "there are other elements spaced in between" situation. In addition, in the entire specification, when it is described that a certain part "includes" a certain constituent element, as long as there is no particular contrary description, it means that other constituent elements may be included, rather than excluding other constituent elements.
圖1是例示性地表示本發明的一實施例的雷射放大裝置100的圖。
FIG. 1 is a diagram exemplarily showing a laser amplifying
參照圖1,雷射放大裝置100包括種子光束光源110、
種子光束調節裝置120及固體放大器140。
1, the laser amplifying
種子光束光源110釋出種子光束L,例如可為半導體雷射二極體、或皮秒或飛秒鎖模光纖種子雷射光源。種子光束光源110可釋出偏振的雷射光,作為一列,可釋出水平偏振的種子光束。於使用光纖種子雷射光源作為種子光束光源110的情形時,可藉由脈寬調變而釋出具有數奈秒至數百奈秒的脈寬的種子光束。另外,種子光束光源110能夠以具有數十kHz至數百kHz的重複率的方式調節種子光束。
The seed
種子光束調節裝置120可調節自種子光束光源釋出的種子光束L的特性。之後對種子光束調節裝置120的構成進行敍述。
The seed
固體放大器140可放大自種子光束光源110釋出的種子光束L的輸出。固體放大器140可包括雷射介質145、抽運光束光源141、抽運光束鏡147、多個雙向色鏡DM1、DM2及多個鏡M1、M2、M3。之後於圖3中對固體放大器140的詳細構成進行敍述。
The solid-
圖2a是概略性地表示本發明的一實施例的雷射放大裝置中的種子光束調節裝置120的圖,圖2b是放大表示種子光束調節裝置中的第一透鏡及第二透鏡的圖。
2a is a diagram schematically showing the seed
參照圖2a,種子光束調節裝置120可包括半波板121、第一透鏡及第二透鏡123、125。
Referring to FIG. 2a, the seed
半波板121作為使相對於快軸(fast axis)而沿慢軸行進的偏振方向的光產生半波長程度的差異的波板,可將45度線偏振光轉換成水平偏振光,且將水平偏振光轉換成45度線偏振光。
The half-
參照圖2b,第一透鏡及第二透鏡123、125可於種子光
束L的行進方向上彼此隔開地設置,隨著上述第一透鏡與第二透鏡之間的間隔發生變化而調節上述種子光束L的光束直徑。第一透鏡123可呈接近凸透鏡的形態。因此,第一透鏡123可使入射的種子光束L的光束直徑變小。如圖2b所示,自第二透鏡出射的種子光束L的光束直徑W2可小於入射至第一透鏡123的種子光束L的光束直徑W1。
2b, the first lens and the
另外,第二透鏡125可呈接近凹透鏡的形態。因此,可使入射至第二透鏡125的種子光束L接近平行光。並且,雖未圖示,但種子光束調節裝置120可包括調節第一透鏡123與第二透鏡125之間的距離d的透鏡調節部。可藉由機械驅動方式或手動方式控制透鏡調節部,可縮小或擴大第一透鏡123與第二透鏡125之間的距離d。藉由透鏡調節部而調節第一透鏡123與第二透鏡125之間的距離d,藉此可適當地改變種子光束L的光束直徑。若第一透鏡123與第二透鏡125之間的距離d變大,則藉由第二透鏡125出射的種子光束L的光束直徑變小,若第一透鏡123與第二透鏡125之間的距離d變小,則藉由第二透鏡125出射的種子光束L的光束直徑會變大。
In addition, the
例如,入射至第一透鏡123的種子光束L的光束直徑W1可為2nm至3nm,藉由第二透鏡出射的種子光束L的光束直徑W2可為1nm以下。
For example, the beam diameter W1 of the seed beam L incident on the
種子光束調節裝置120中可一面保持平行光,一面調節光束直徑的範圍會有限。為了擴大利用種子光束調節裝置120的光束直徑的調節範圍,第一透鏡及第二透鏡123、125可根據種子光束光源110的輸出特性(種子光束直徑、發散角)及種子光束
調節裝置120與固體放大器140的距離而構成為最佳的透鏡組合。另外,種子光束調節裝置120亦可根據情形而包括3個以上的透鏡。
In the seed
圖3是概略性地表示本發明的一實施例的雷射放大裝置中的固體放大器140的圖。
FIG. 3 is a diagram schematically showing a solid-
參照圖3,固體放大器140可放大自種子光束光源110釋出的種子光束L的輸出。固體放大器140可包括雷射介質145、抽運光束光源141、抽運光束鏡147、第一雙向色鏡DM1、第二雙向色鏡DM2及多個鏡M1、M2、M3。
Referring to FIG. 3, the solid-
雷射介質145藉由自抽運光束光源141釋出的抽運光束P而激發介質中的離子,藉此可發揮放大種子光束L的作用。
The
抽運光束光源141可釋出激發雷射介質145的抽運光束P。抽運光束光源141能夠以抽運光束P入射至雷射介質145的方式配置。
The pump beam
抽運光束鏡147能夠以雷射介質145位於抽運光束光源141與抽運光束鏡147之間的方式配置。自抽運光束光源141釋出的抽運光束P會無法由雷射介質145全部吸收,抽運光束P中的未藉由雷射介質145吸收的抽運光束P的一部分可由雷射介質145反射而再次入射至雷射介質145。因此,抽運光束鏡147可發揮提高由雷射介質145吸收自抽運光束光源141釋出的抽運光束P的比率的作用。
The
第一雙向色鏡DM1及第二雙向色鏡DM2可反射種子光束L,能夠以種子光束L沿與抽運光束P的行進路徑相同的路徑通過雷射介質145的方式配置。
The first bidirectional color mirror DM1 and the second bidirectional color mirror DM2 can reflect the seed beam L, and can be arranged in such a manner that the seed beam L passes through the
第一雙向色鏡DM1及第二雙向色鏡DM2可反射種子光束L,且使抽運光束P透射。因此,自抽運光束光源141釋出的抽運光束P可於透射第一雙向色鏡DM1後由雷射介質145吸收。未由雷射介質145吸收的抽運光束P的一部分可於通過第二雙向色鏡DM2後由抽運光束鏡147反射,再次通過第二雙向色鏡DM2而由雷射介質145吸收。
The first bidirectional color mirror DM1 and the second bidirectional color mirror DM2 can reflect the seed beam L and transmit the pump beam P. Therefore, the pump beam P released from the
入射於固體放大器140的種子光束L於在第一鏡M1及第二鏡M2反射後,可入射至第一雙向色鏡DM1。入射於第一雙向色鏡DM1的種子光束L可由第一雙向色鏡DM1反射而通過雷射介質145,通過雷射介質145的種子光束L與抽運光束P可具有相同的光路徑。入射於雷射介質145的種子光束L於通過藉由抽運光束P激發的雷射介質145後,可表現出放大的輸出。例如,種子光束L於通過雷射介質145前,可表現出數瓦特的(watt)輸出,於通過雷射介質145後,可表現出數十瓦特至數百瓦特(watt)的輸出。另外,種子光束L藉由雷射介質145放大而可發揮訊號光束的作用。
The seed beam L incident on the solid-
藉由雷射介質145放大的訊號光束於第二雙向色鏡DM2反射後,可入射至第三鏡M3。第三鏡M3反射訊號光束,藉此可將訊號光束釋出至固體放大器140的外部。
The signal beam amplified by the
例示性的實施例的雷射放大裝置100利用光纖種子雷射,藉此可容易地調節脈寬及重複率。另外,可利用固體放大器140釋出具有數十瓦特(watt)至數百瓦特(watt)的輸出的雷射。
The
本發明的上述說明為示例,於本發明所屬的技術領域內具有常識者應可理解,可不變更本發明的技術思想或必要特徵而 容易地變形為其他具體形態。因此,以上所記述的實施例應理解為於所有方面均為示例,並不具有限定性。例如,說明為單一型的各構成要素亦可分散實施,與此相同,說明為分散型的構成要素亦能夠以結合的形態實施。 The above description of the present invention is an example, and those of ordinary knowledge in the technical field to which the present invention belongs should understand that the technical idea or essential features of the present invention may not be changed Easily transformed into other specific forms. Therefore, it should be understood that the embodiments described above are examples in all aspects and are not limiting. For example, each component described as a single type may be implemented in a distributed manner, and similarly, a component described as a distributed type may also be implemented in a combined form.
本發明的範圍由下文敍述的發明申請專利範圍界定,而並非上述詳細說明,根據發明申請專利範圍的含義、範圍及其等同概念導出的所有變更或變形應解釋為包括於本發明的範圍內。 The scope of the present invention is defined by the scope of the patent application for invention described below, rather than the above detailed description, and all changes or modifications derived from the meaning, scope and equivalent concepts of the patent application scope of the invention should be interpreted as being included in the scope of the present invention.
100:雷射放大裝置 100: laser amplifying device
110:種子光束光源 110: Seed beam light source
120:種子光束調節裝置 120: Seed beam adjustment device
140:固體放大器 140: solid state amplifier
L:種子光束 L: seed beam
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