JP5318909B2 - Laser dicing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser dicing method that controls generation of a crack and achieves an excellent tearing property. <P>SOLUTION: With a laser dicing method, a pulse laser beam PL4 synchronized with a clock signal S1 is emitted. A substrate W to be processed and the pulse laser beam PL4 are relatively moved by moving a stage 20 in synchronization with the clock signal S1. Irradiation and non- irradiation of the pulse laser beam PL4 onto the substrate W to be processed are switched by optical pulse by controlling passing and breaking of the pulse laser beam PL4 in synchronization with the clock signal S1 to form a crack reaching the surface of the substrate in the substrate W to be processed. The crack is formed on the surface of the substrate to be processed so as to be almost linearly continuous by controlling the irradiation energy of the pulse laser beam PL4, a processing point depth, and the interval of irradiation and non- irradiation under synchronization of the position of the substrate W to be processed with that of operation start of a pulse picker 14. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a laser dicing method using a pulsed laser beam.

  A method of using a pulsed laser beam for dicing a semiconductor substrate is disclosed in Patent Document 1. In the method of Patent Document 1, a crack region is formed inside a workpiece due to optical damage caused by a pulse laser beam. Then, the workpiece is cut starting from this crack region.

  In the conventional technique, the formation of a crack region is controlled using parameters such as the energy of the pulse laser beam, the spot diameter, the relative moving speed of the pulse laser beam and the workpiece.

Japanese Patent No. 3867107

  However, the conventional method has a problem that the occurrence of cracks cannot be sufficiently controlled, for example, cracks occur in unexpected places. For example, in order to facilitate dicing of a hard substrate such as sapphire, it is desirable to provide continuous cracks on the surface of the substrate to be processed. However, with the conventional method, it is difficult to stably provide continuous cracks on the surface of the substrate to be processed.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a laser dicing method that controls the generation of cracks by optimizing the irradiation conditions of a pulsed laser beam and realizes excellent cleaving characteristics. And

  In the laser dicing method of one embodiment of the present invention, a workpiece substrate is placed on a stage, a clock signal is generated, a pulse laser beam synchronized with the clock signal is emitted, and the stage is synchronized with the clock signal. By moving, the substrate to be processed and the pulse laser beam are moved relatively, and the pulse picker is moved in synchronization with the clock signal to irradiate and non-irradiate the pulsed laser beam to the substrate to be processed. A laser dicing method for forming a crack reaching the substrate surface in the substrate to be processed by controlling the passage and blocking of the pulse laser beam using the optical pulse unit, the position of the substrate to be processed and the The operation start position of the pulse picker is synchronized, the irradiation energy of the pulse laser beam, the processing point of the pulse laser beam Is, and, by controlling the length of the irradiated region and non-irradiated regions of the pulsed laser beam, the cracks and forming to substantially linearly continuous in the processed substrate surface.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the laser dicing method which controls the generation | occurrence | production of a crack by optimizing the irradiation conditions of a pulse laser beam, and implement | achieves the outstanding cleaving characteristic.

It is a schematic block diagram which shows an example of the laser dicing apparatus used with the laser dicing method of embodiment. It is a figure explaining timing control of the laser dicing method of an embodiment. It is a figure which shows the timing of the pulse picker operation | movement of the laser dicing method of embodiment, and a modulation | alteration pulse laser beam. It is explanatory drawing of the irradiation pattern of the laser dicing method of embodiment. It is a top view which shows the irradiation pattern irradiated on a sapphire substrate. It is AA sectional drawing of FIG. It is a figure explaining the relationship between a stage movement and a dicing process. It is a figure which shows the irradiation pattern of Example 1. FIG. It is a figure which shows the result of the laser dicing of Examples 1-4 and the comparative example 1. FIG. It is sectional drawing which shows the result of the laser dicing of Example 1. FIG. It is a figure which shows the result of the laser dicing of Examples 5-10. It is a figure which shows the result of the laser dicing of Examples 11-15. It is a figure which shows the result of the laser dicing of Examples 16-21. It is explanatory drawing in the case of forming a crack by scanning the same scanning line of a board | substrate several times with the pulse laser beam of a different process point depth. It is an optical photograph of the cut section at the time of cutting on the conditions of FIG. It is a figure which shows the result of the laser dicing of Examples 22-24. It is explanatory drawing of an effect | action of embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification, the processing point is a point in the vicinity of the focused position (focal position) of the pulse laser beam in the substrate to be processed, and the degree of modification of the substrate to be processed is maximized in the depth direction. Means a point. The processing point depth means the depth of the processing point of the pulse laser beam from the substrate surface to be processed.

  In the laser dicing method of this embodiment, a substrate to be processed is placed on a stage, a clock signal is generated, a pulsed laser beam synchronized with the clock signal is emitted, and the substrate to be processed and the pulsed laser beam are relative to each other. The laser beam irradiation and non-irradiation on the substrate to be processed are switched in units of optical pulses by controlling the passage and blocking of the pulse laser beam in synchronization with the clock signal, and the substrate surface is transferred to the substrate to be processed. This is a laser dicing method for forming a crack reaching the thickness. Then, by controlling the irradiation energy of the pulse laser beam, the processing point depth of the pulse laser beam, and the interval of non-irradiation of the pulse laser beam, the cracks are formed to be substantially linear on the surface of the substrate to be processed. To do.

  With the above configuration, it is possible to provide a laser dicing method that realizes excellent cleaving characteristics. Here, the excellent cleaving characteristics are (1) the cleaved portion is cleaved with good linearity, (2) the cleaved portion can be cleaved with a small cleaving force so as to improve the yield of the diced element, and (3) crack formation. The deterioration of an element provided on the substrate, for example, an LED element formed by an epitaxial layer on the substrate, is not caused by the influence of the laser irradiated at that time.

  Then, by forming continuous cracks on the surface of the substrate to be processed, dicing of a hard substrate such as a sapphire substrate is facilitated. Further, dicing with a narrow dicing width is realized.

  The laser dicing apparatus according to the present embodiment for realizing the laser dicing method includes a stage on which a substrate to be processed can be placed, a reference clock oscillation circuit for generating a clock signal, a laser oscillator for emitting a pulse laser beam, and a pulse A laser oscillator controller that synchronizes the laser beam with the clock signal, a pulse picker that is provided in the optical path between the laser oscillator and the stage and switches between irradiation and non-irradiation of the laser beam to the workpiece, and synchronization with the clock signal And a pulse picker control unit for controlling passage and blocking of the pulse laser beam in the pulse picker in units of optical pulses.

  FIG. 1 is a schematic configuration diagram showing an example of a laser dicing apparatus according to the present embodiment. As shown in FIG. 1, a laser dicing apparatus 10 according to the present embodiment includes, as main components, a laser oscillator 12, a pulse picker 14, a beam shaper 16, a condensing lens 18, an XYZ stage unit 20, and a laser oscillator control. Unit 22, pulse picker control unit 24, and machining control unit 26. The processing control unit 26 includes a reference clock oscillation circuit 28 that generates a desired clock signal S1 and a processing table unit 30.

  The laser oscillator 12 is configured to emit a pulsed laser beam PL1 having a period Tc synchronized with the clock signal S1 generated by the reference clock oscillation circuit 28. The intensity of the irradiation pulse light shows a Gaussian distribution. The clock signal S1 is a processing control clock signal used for controlling laser dicing processing.

Here, the wavelength of the laser emitted from the laser oscillator 12 is a wavelength that is transmissive to the substrate to be processed. As the laser, an Nd: YAG laser, an Nd: YVO ₄ laser, an Nd: YLF laser, or the like can be used. For example, when the substrate to be processed is a sapphire substrate, it is desirable to use an Nd: YVO ₄ laser having a wavelength of 532 nm.

  The pulse picker 14 is provided in the optical path between the laser oscillator 12 and the condenser lens 18. Then, by switching between passing and blocking (on / off) of the pulse laser beam PL1 in synchronization with the clock signal S1, the irradiation and non-irradiation of the pulse laser beam PL1 on the substrate to be processed are switched in units of the number of light pulses. Has been. In this manner, the pulse laser beam PL1 is turned on / off for the processing of the substrate to be processed by the operation of the pulse picker 14, and becomes a modulated modulated pulse laser beam PL2.

  The pulse picker 14 is preferably composed of, for example, an acousto-optic element (AOM). Further, for example, a Raman diffraction type electro-optic element (EOM) may be used.

  The beam shaper 16 converts the incident pulse laser beam PL2 into a pulse laser beam PL3 shaped into a desired shape. For example, a beam expander that expands the beam diameter at a constant magnification. Further, for example, an optical element such as a homogenizer for making the light intensity distribution in the beam cross section uniform may be provided. Further, for example, an element that makes the beam cross section circular or an optical element that makes the beam circularly polarized light may be provided.

  The condensing lens 18 condenses the pulsed laser beam PL3 shaped by the beam shaper 16, and pulses the processed substrate W placed on the XYZ stage unit 20, for example, a sapphire substrate on which LEDs are formed on the lower surface. It is configured to irradiate laser beam PL4.

  The XYZ stage unit 20 is an XYZ stage (hereinafter simply referred to as a stage) on which a workpiece substrate W can be placed and can move freely in the XYZ directions, a drive mechanism unit thereof, and a laser interferometer that measures the position of the stage, for example. A position sensor or the like is provided. Here, the XYZ stage is configured such that its positioning accuracy and movement error are high in the submicron range. Then, by moving in the Z direction, the focal position of the pulse laser beam can be adjusted with respect to the substrate W to be processed, and the processing point depth can be controlled.

  The processing control unit 26 controls the processing by the laser dicing apparatus 10 as a whole. The reference clock oscillation circuit 28 generates a desired clock signal S1. The processing table unit 30 stores a processing table in which dicing processing data is described by the number of optical pulses of the pulse laser beam.

  Next, a laser dicing method using the laser dicing apparatus 10 will be described with reference to FIGS.

  First, the substrate W to be processed, for example, a sapphire substrate is placed on the XYZ stage unit 20. The sapphire substrate is, for example, a wafer having a GaN layer epitaxially grown on the lower surface and a plurality of LEDs patterned on the GaN layer. The wafer is aligned with respect to the XYZ stage based on a notch or orientation flat formed on the wafer.

FIG. 2 is a diagram for explaining timing control of the laser dicing method of the present embodiment. In the reference clock oscillation circuit 28 in the processing control unit 26, a clock signal S1 having a cycle Tc is generated. The laser oscillator control unit 22 controls the laser oscillator 12 to emit a pulsed laser beam PL1 having a cycle Tc synchronized with the clock signal S1. At this time, the rise of the rise and the pulse laser beam of the clock signal S1, is generated the delay time t _1.

  Laser light having a wavelength that is transparent to the substrate to be processed is used. Here, it is preferable to use a laser beam in which the photon energy hv of the irradiated laser beam is larger than the absorption band gap Eg of the substrate material to be processed. When the energy hν is much larger than the band gap Eg, laser light absorption occurs. This is called multiphoton absorption. When the pulse width of the laser beam is made extremely short and multiphoton absorption occurs inside the substrate to be processed, the energy of the multiphoton absorption is not converted into thermal energy, and the ionic valence. Permanent structural changes such as change, crystallization, amorphization, polarization orientation or microcrack formation are induced to form a color center.

  The irradiation energy (irradiation power) of this laser beam (pulse laser beam) is selected under the optimum conditions for forming continuous cracks on the surface of the substrate to be processed.

  If a wavelength having transparency is used for the substrate material to be processed, the laser light can be guided and condensed near the focal point inside the substrate. Therefore, it is possible to make a color center locally. This color center is hereinafter referred to as a modified region.

  The pulse picker control unit 24 refers to the machining pattern signal S2 output from the machining control unit 26, and generates a pulse picker driving signal S3 synchronized with the clock signal S1. The machining pattern signal S2 is stored in the machining table unit 30, and is generated with reference to a machining table that describes irradiation pattern information in units of light pulses by the number of light pulses. The pulse picker 14 performs an operation of switching between passing and blocking (ON / OFF) of the pulse laser beam PL1 in synchronization with the clock signal S1 based on the pulse picker driving signal S3.

By the operation of the pulse picker 14, a modulated pulse laser beam PL2 is generated. Note that delay times t ₂ and t ₃ occur at the rise of the clock signal S1 and the rise and fall of the pulse laser beam. Also, delay times t ₄ and t ₅ occur in the rise and fall of the pulse laser beam and the pulse picker operation.

When processing the substrate to be processed, the generation timing of the pulse picker drive signal S3 and the like and the relative movement timing of the substrate to be processed and the pulse laser beam are determined in consideration of the delay times t _{1 to} t ₅ .

  FIG. 3 is a diagram showing the pulse picker operation and the timing of the modulated pulse laser beam PL2 in the laser dicing method of the present embodiment. The pulse picker operation is switched in units of optical pulses in synchronization with the clock signal S1. Thus, by synchronizing the oscillation of the pulse laser beam and the operation of the pulse picker with the same clock signal S1, an irradiation pattern in units of light pulses can be realized.

  Specifically, irradiation and non-irradiation of a pulsed laser beam are performed based on a predetermined condition defined by the number of light pulses. That is, the pulse picker operation is executed based on the number of irradiation light pulses (P1) and the number of non-irradiation light pulses (P2), and the irradiation and non-irradiation of the substrate to be processed are switched. The P1 value and the P2 value that define the irradiation pattern of the pulse laser beam are defined, for example, as irradiation region register settings and non-irradiation region register settings in the processing table. The P1 value and the P2 value are set to predetermined conditions that optimize crack formation during dicing, depending on the material of the substrate to be processed, laser beam conditions, and the like.

  The modulated pulsed laser beam PL2 is a pulsed laser beam PL3 shaped into a desired shape by the beam shaper 16. Further, the shaped pulse laser beam PL3 is condensed by the condensing lens 18 to become a pulse laser beam PL4 having a desired beam diameter, and is irradiated onto a wafer which is a substrate to be processed.

  When dicing the wafer in the X-axis direction and the Y-axis direction, first, for example, the XYZ stage is moved at a constant speed in the X-axis direction, and the pulse laser beam PL4 is scanned. Then, after the desired dicing in the X-axis direction is completed, the XYZ stage is moved at a constant speed in the Y-axis direction to scan with the pulse laser beam PL4. Thereby, dicing in the Y-axis direction is performed.

  The irradiation non-irradiation interval of the pulse laser beam is controlled by the number of irradiation light pulses (P1), the number of non-irradiation light pulses (P2), and the stage speed.

  Regarding the Z-axis direction (height direction), adjustment is performed so that the condensing position (focal position) of the condensing lens is positioned at a predetermined depth in the wafer. This predetermined depth is set so that cracks are formed in a desired shape on the surface of the substrate to be processed during dicing.

At this time,
Deflection ratio of substrate to be processed: n
Processing position from the substrate surface to be processed: L
Z-axis travel distance: Lz
Then,
Lz = L / n
It becomes. That is, when the condensing position by the condensing lens is set to the position of the depth “L” from the surface of the substrate when the surface of the substrate to be processed is the Z-axis initial position, the Z axis may be moved “Lz”. .

  FIG. 4 is an explanatory diagram of an irradiation pattern of the laser dicing method of the present embodiment. As shown in the figure, the pulsed laser beam PL1 is generated in synchronization with the clock signal S1. The modulated pulse laser beam PL2 is generated by controlling the passage and blocking of the pulse laser beam in synchronization with the clock signal S1.

  Then, by moving the stage in the horizontal direction (X-axis direction or Y-axis direction), an irradiation light pulse of the modulated pulse laser beam PL2 is formed as an irradiation spot on the wafer. In this way, by generating the modulated pulse laser beam PL2, the irradiation spot is controlled and irradiated intermittently on the wafer in units of light pulses. In the case of FIG. 4, the number of irradiation light pulses (P1) = 2, the number of non-irradiation light pulses (P2) = 1, and the irradiation light pulse (Gaussian light) is set to repeat irradiation and non-irradiation at a spot diameter pitch. Has been.

here,
Beam spot diameter: D (μm)
Repetition frequency: F (KHz)
If processing is performed under the conditions, the stage moving speed V (m / sec) for repeating irradiation and non-irradiation of the irradiation light pulse at the spot diameter pitch is:
V = D × 10 ⁻⁶ × F × 10 ³
It becomes.

For example,
Beam spot diameter: D = 2 μm
Repetition frequency: F = 50KHz
If the processing conditions are
Stage moving speed: V = 100mm / sec
It becomes.

  If the power of the irradiation light is P (watts), the wafer is irradiated with a light pulse of irradiation pulse energy P / F per pulse.

  Cracks are continuously formed on the surface of the substrate to be processed by the parameters of the irradiation energy (irradiation light power) of the pulse laser beam, the processing point depth of the pulse laser beam, and the non-irradiation interval of the pulse laser beam. Determined to be.

  FIG. 5 is a top view showing an irradiation pattern irradiated on the sapphire substrate. When viewed from the irradiation surface, irradiation spots are formed at a pitch of the irradiation spot diameter with the number of irradiation light pulses (P1) = 2 and the number of non-irradiation light pulses (P2) = 1. 6 is a cross-sectional view taken along the line AA in FIG. As shown in the figure, a modified region is formed inside the sapphire substrate. Then, cracks (or grooves) reaching the substrate surface along the scanning line of the light pulse are formed from the modified region. And this crack is continuously formed in the to-be-processed substrate surface. In the present embodiment, the crack is formed so as to be exposed only on the front surface side of the substrate and does not reach the back surface side of the substrate.

  FIG. 17 is an explanatory diagram of the operation of the present embodiment. For example, a pulse irradiable position in the case of irradiating a pulse laser at a laser frequency of the maximum pulse laser beam that can be set and at the highest stage speed that can be set is indicated by a dotted circle in FIG. FIG. 17B shows an irradiation pattern when irradiation / non-irradiation = 1/2. A solid line circle is an irradiation position, and a dotted line circle is a non-irradiation position.

  Here, it is assumed that the shorter the interval between the irradiation spots (the length of the non-irradiation region), the better the cleaving property. In this case, as shown in FIG. 17 (c), it is possible to cope by setting irradiation / non-irradiation = 1/1 without changing the stage speed. If the pulse picker is not used as in the present embodiment, it is necessary to reduce the stage speed in order to bring out the same condition, resulting in a problem that the throughput of dicing processing is reduced.

  Here, it is assumed that the cleaving property is better when the irradiation spot is made continuous to make the length of the irradiation region longer. In this case, as shown in FIG. 17 (d), it is possible to cope by setting irradiation / non-irradiation = 2/1 without changing the stage speed. If the pulse picker is not used as in the present embodiment, it is necessary to lower the stage speed and change the stage speed in order to achieve the same conditions, and the dicing processing throughput is reduced. In addition, there arises a problem that control becomes extremely difficult.

  Alternatively, when a pulse picker is not used, it is conceivable that the irradiation energy is increased with the irradiation pattern of FIG. 17B to achieve a condition close to that of FIG. There is a concern that the power will increase and the crack width will increase and the linearity of the crack will deteriorate. Further, when processing a substrate to be processed in which an LED element is formed on a sapphire substrate, the amount of laser that reaches the LED region on the side opposite to the crack increases, and the LED element may be deteriorated. There is also.

  As described above, according to the present embodiment, for example, various cleaving conditions can be realized without changing the conditions of the pulse laser beam and the stage speed condition, and the productivity and device characteristics are deteriorated. It is possible to find the optimum cleaving condition without any problem.

  In this specification, “the length of the irradiation region” and “the length of the non-irradiation region” are the lengths shown in FIG.

  FIG. 7 is a diagram illustrating the relationship between stage movement and dicing. The XYZ stage is provided with a position sensor that detects the movement position in the X-axis and Y-axis directions. For example, after the stage starts moving in the X-axis or Y-axis direction, a position where the stage speed enters the speed stable region is set in advance as a synchronization position. When the synchronization position is detected by the position sensor, for example, the movement position detection signal S4 (FIG. 1) is sent to the pulse picker control unit 24 to allow the pulse picker operation, and the pulse picker driving signal S3 is used to activate the pulse picker. Make it work. For example, the synchronization position may be set as an end surface of the substrate to be processed, and the end surface may be detected by a position sensor.

in this way,
S _L : Distance from synchronization position to substrate W _L : Processing length W ₁ : Distance from substrate edge to irradiation start position W ₂ : Processing range W ₃ : Distance from irradiation end position to substrate edge is managed.

  In this manner, the position of the stage and the position of the workpiece substrate placed thereon are synchronized with the operation start position of the pulse picker. That is, the irradiation and non-irradiation of the pulse laser beam are synchronized with the position of the stage. Therefore, it is ensured that the stage moves at a constant speed (in a stable speed range) during irradiation and non-irradiation of the pulse laser beam. Therefore, the regularity of the irradiation spot position is ensured, and stable crack formation is realized.

  Here, when processing a thick substrate, it is possible to improve the cleaving characteristics by forming a crack by scanning the same scanning line of the substrate multiple times (multiple layers) with a pulse laser beam having different processing point depths. Conceivable. In such a case, the stage position and the operation start position of the pulse picker are synchronized, so that the relationship between the pulse irradiation positions can be controlled arbitrarily and accurately in scanning at different depths, and the dicing conditions can be optimized. It becomes possible.

  FIG. 14 is an explanatory diagram in the case where cracks are formed by scanning a pulse laser beam having different processing point depths on the same scanning line of the substrate a plurality of times. It is a schematic diagram of the irradiation pattern in a board | substrate cross section. ON (colored) is irradiation and OFF (white) is a non-irradiation region. FIG. 14A shows the case where the first layer and the second layer of the scanning of irradiation are in phase, that is, the upper and lower relationships of the irradiation pulse positions are the same in the first layer and the second layer. FIG. 14B shows a case where the first and second layers of irradiation scanning are out of phase, that is, when the vertical relationship of the irradiation pulse position is shifted between the first and second layers.

  FIG. 15 is an optical photograph of a fractured surface when cleaved under the conditions of FIG. FIG. 15A shows the case of the same phase and FIG. 15B shows the case of the different phase. The upper photo is a low magnification and the lower photo is a high magnification. In this way, by synchronizing the stage position and the operation start position of the pulse picker, it becomes possible to accurately control the relationship between the first layer and the second layer of irradiation scanning.

  Note that the substrate to be processed shown in FIGS. 15A and 15B is a sapphire substrate having a thickness of 150 μm. In this case, the cleaving force required for cleaving was 0.31 N for the in-phase and 0.38 N for the different phase, and the in-phase was superior in cleaving characteristics.

  Here, the case where the number of irradiation / non-irradiation pulses is the same for the first layer and the second layer is shown as an example, but the optimum number of irradiation / non-irradiation pulses for the first layer and the second layer is different. It is also possible to find new conditions.

  For example, it is desirable to synchronize the movement of the stage with the clock signal in order to further improve the accuracy of the irradiation spot position. This can be realized, for example, by synchronizing the stage movement signal S5 (FIG. 1) sent from the machining control unit 26 to the XYZ stage unit 20 with the clock signal S1.

  Like the laser dicing method of the present embodiment, the subsequent cracking of the substrate is facilitated by forming cracks that reach the surface of the substrate and are continuous on the surface of the substrate to be processed. For example, even a hard substrate such as a sapphire substrate can be easily cleaved by applying a force artificially with the crack reaching the substrate surface as the starting point for cleaving or cutting, and has excellent cleaving characteristics. It can be realized. Accordingly, dicing productivity is improved.

  In the conventional method of continuously irradiating the substrate with a pulsed laser beam, even if the stage moving speed, the numerical aperture of the condenser lens, the irradiation light power, etc. are optimized, it is continuously formed on the substrate surface. It was difficult to control the cracks to be in a desired shape. As in the present embodiment, the generation of cracks reaching the substrate surface is controlled by switching the irradiation and non-irradiation of the pulse laser beam intermittently in units of light pulses and optimizing the irradiation pattern. A laser dicing method having characteristics is realized.

  That is, for example, it is possible to form a substantially linear and continuous narrow crack along the laser scanning line on the substrate surface. By forming such substantially linear continuous cracks, it is possible to minimize the influence of cracks on devices such as LEDs formed on the substrate during dicing. Further, for example, since a linear crack can be formed, the width of the region where the crack is formed on the substrate surface can be reduced. For this reason, it is possible to narrow the design dicing width. Therefore, it is possible to increase the number of chips of devices formed on the same substrate or wafer, which contributes to a reduction in device manufacturing costs.

  The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. In the embodiment, the description of the laser dicing method, the laser dicing apparatus, etc. that is not directly necessary for the description of the present invention is omitted, but the elements related to the required laser dicing method, the laser dicing apparatus, etc. are omitted. It can be appropriately selected and used.

  In addition, all laser dicing methods that include elements of the present invention and can be appropriately modified by those skilled in the art are included in the scope of the present invention. The scope of the present invention is defined by the appended claims and equivalents thereof.

  For example, in the embodiment, the sapphire substrate on which the LED is formed is described as an example of the substrate to be processed. The present invention is useful for a hard substrate such as a sapphire substrate that is hard to cleave and difficult to cleave, but the substrate to be processed is a semiconductor material substrate such as a SiC (silicon carbide) substrate, a piezoelectric material substrate, or a glass substrate. And so on.

  In the embodiment, the case where the substrate to be processed and the pulse laser beam are relatively moved by moving the stage has been described as an example. However, for example, a method of relatively moving the substrate to be processed and the pulsed laser beam by scanning the pulsed laser beam by using a laser beam scanner or the like may be used.

  Further, in the embodiment, the case where the number of irradiation light pulses (P1) = 2 and the number of non-irradiation light pulses (P2) = 1 is described as an example. However, the values of P1 and P2 are optimum conditions. It is possible to take any value. In the embodiment, the case where the irradiation light pulse repeats irradiation and non-irradiation at a pitch of the spot diameter has been described as an example. However, the pitch of irradiation and non-irradiation can be changed by changing the pulse frequency or the stage moving speed. It is also possible to find the optimum condition. For example, the pitch between irradiation and non-irradiation can be 1 / n or n times the spot diameter.

  In particular, when the substrate to be processed is a sapphire substrate, the irradiation energy is 30 mW or more and 150 mW or less, the passage of the pulse laser beam is 1 to 4 light pulses, and the interruption is 1 to 4 light pulses. By setting the thickness to 1 to 6 μm, it is possible to form a crack having good continuity and linearity on the surface of the substrate to be processed.

  For dicing patterns, for example, multiple irradiation area registers and non-irradiation area registers may be provided, or the irradiation area register and non-irradiation area register values may be changed to desired values at desired timing in real time. This makes it possible to handle various dicing patterns.

  Further, as an example of the laser dicing apparatus, an apparatus including a machining table unit that stores a machining table in which dicing data is described by the number of optical pulses of a pulse laser beam has been described. However, an apparatus having a configuration for controlling the passage and blocking of the pulse laser beam in the pulse picker in units of optical pulses may be used without necessarily providing such a processing table unit.

  In order to further improve the cleaving characteristics, after forming continuous cracks on the substrate surface, for example, it is also possible to add a melt processing or ablation processing to the surface by irradiating a laser, for example. is there.

  Examples of the present invention will be described below.

Example 1
Laser dicing was performed under the following conditions by the method described in the embodiment.
Substrate to be processed: sapphire substrate, substrate thickness 100 μm
Laser light source: Nd: YVO ₄ laser Wavelength: 532 nm
Irradiation energy: 50mW
Laser frequency: 20KHz
Number of irradiation light pulses (P1): 1
Non-irradiation light pulse number (P2): 2
Stage speed: 25mm / sec
Processing point depth: approx. 25.2 μm from the surface of the substrate to be processed

  FIG. 8 is a diagram illustrating an irradiation pattern of the first embodiment. As shown in the figure, after one light pulse is irradiated, two pulses are not irradiated in units of light pulses. This condition will be described in the form of irradiation / non-irradiation = 1/2. Here, the pitch of irradiation / non-irradiation is equal to the spot diameter.

  In the case of Example 1, the spot diameter was about 1.2 μm. Therefore, the irradiation interval was about 3.6 μm.

  The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side. The upper optical photograph is taken focusing on the modified region inside the substrate. The lower optical photograph is taken focusing on cracks on the substrate surface. FIG. 10 is a cross-sectional SEM photograph of the substrate perpendicular to the crack direction.

  The substrate to be processed had a strip shape with a width of about 5 mm, and a pulse laser beam was irradiated perpendicularly to the extending direction of the strip to form a crack. After forming the crack, the breaking force required for breaking was evaluated using a breaker.

(Example 2)
Laser dicing was performed in the same manner as in Example 1 except that irradiation / non-irradiation = 1/1. The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

(Example 3)
Laser dicing was performed in the same manner as in Example 1 except that irradiation / non-irradiation = 2/2. The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

Example 4
Laser dicing was performed in the same manner as in Example 1 except that irradiation / non-irradiation = 2/3. The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

(Comparative Example 1)
Laser dicing was performed in the same manner as in Example 1 except that irradiation / non-irradiation = 1/3. The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

  In Examples 1 to 4, by setting the irradiation energy of the pulse laser beam, the processing point depth, and the irradiation non-irradiation interval as described above, as shown in FIG. 9 and FIG. A continuous crack could be formed on the surface.

  In particular, under the conditions of Example 1, extremely linear cracks were formed on the surface of the substrate to be processed. For this reason, the linearity of the cleaved part after cleaving was also excellent. And it was possible to cleave the substrate with the smallest cleaving force under the conditions of Example 1. Therefore, when the substrate to be processed is a sapphire substrate, considering the controllability of each condition, the irradiation energy is set to 50 ± 5 mW, the processing point depth is set to 25.0 ± 2.5 μm, and the pulse laser beam passes. It is desirable to set the irradiation interval to 3.6 ± 0.4 μm by setting 1 to 1 light pulse unit and blocking to 2 light pulse units.

  On the other hand, as in Example 3, when the modified regions approach and cracks are formed inside the substrate between the modified regions, the cracks on the surface meander, and the width of the region where the cracks occur tends to increase. It was. This is presumably because the power of the laser beam concentrated in a narrow region is too large.

  In Comparative Example 1, the conditions were not optimized, and continuous cracks were not formed on the substrate surface. Therefore, it was impossible to evaluate the cleaving power.

(Example 5)
Laser dicing was performed under the following conditions by the method described in the embodiment.
Substrate to be processed: sapphire substrate, substrate thickness 100 μm
Laser light source: Nd: YVO ₄ laser Wavelength: 532 nm
Irradiation energy: 90mW
Laser frequency: 20KHz
Number of irradiation light pulses (P1): 1
Non-irradiation light pulse number (P2): 1
Stage speed: 25mm / sec

  The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side. The upper optical photograph is taken focusing on the modified region inside the substrate. The lower optical photograph is taken focusing on cracks on the substrate surface.

(Example 6)
Laser dicing was performed in the same manner as in Example 5 except that irradiation / non-irradiation = 1/2. The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

(Example 7)
Laser dicing was performed in the same manner as in Example 5 except that irradiation / non-irradiation = 2/2. The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

(Example 8)
Laser dicing was performed in the same manner as in Example 5 except that irradiation / non-irradiation = 1/3. The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

Example 9
Laser dicing was performed in the same manner as in Example 5 except that irradiation / non-irradiation = 2/3. The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

(Example 10)
Laser dicing was performed in the same manner as in Example 5 except that irradiation / non-irradiation = 2/3. The result of laser dicing is shown in FIG. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

  In Examples 5 to 10, by setting the irradiation energy of the pulse laser beam, the processing point depth, and the irradiation non-irradiation interval as described above, as shown in FIG. The crack which can be formed was able to be formed.

  In particular, under the conditions of Example 8, relatively linear cracks were formed on the surface of the substrate to be processed. Moreover, the conditions of Example 8 also had a small cleaving force. But compared with the case where the irradiation energy of Examples 1-4 was 50 mW, the crack of the surface meandered and the tendency for the width | variety of the area | region where a crack generate | occur | produces to be expanded was seen. For this reason, the linearity of the cleaved portion was also superior in the case of 50 mW. This is considered to be because the power of the laser beam concentrated in a narrow area is too large in the case of 90 mW compared to 50 mW.

(Example 11)
Laser dicing was performed under the following conditions by the method described in the embodiment.
Substrate to be processed: sapphire substrate, substrate thickness 100 μm
Laser light source: Nd: YVO ₄ laser Wavelength: 532 nm
Irradiation energy: 50mW
Laser frequency: 20KHz
Number of irradiation light pulses (P1): 1
Non-irradiation light pulse number (P2): 2
Stage speed: 25mm / sec
Processing point depth: Approximately 15.2 μm from the surface of the substrate to be processed

  Dicing was performed under conditions where the processing point depth was 10 μm shallower than that of Example 1, that is, under the condition where the focused position of the pulse laser beam was closer to the substrate surface to be processed than in Example 1.

  The result of laser dicing is shown in FIG. The photo is taken focusing on the modified region inside the substrate. In the photograph, the right line (+10 μm) is the condition of Example 11. For comparison, the condition (0) of Example 1 that differs only in the processing point depth is shown on the left side.

(Example 12)
Laser dicing was performed in the same manner as in Example 11 except that irradiation / non-irradiation = 1/1. The result of laser dicing is shown in FIG.

(Example 13)
Laser dicing was performed in the same manner as in Example 11 except that irradiation / non-irradiation = 2/2. The result of laser dicing is shown in FIG.

(Example 14)
Laser dicing was performed in the same manner as in Example 11 except that irradiation / non-irradiation = 1/3. The result of laser dicing is shown in FIG.

(Example 15)
Laser dicing was performed in the same manner as in Example 11 except that irradiation / non-irradiation = 2/3. The result of laser dicing is shown in FIG.

  In Examples 11 to 15, by setting the irradiation energy of the pulse laser beam, the processing point depth, and the irradiation non-irradiation interval as described above, as shown in FIG. The crack which can be formed was able to be formed.

  But compared with the case of Examples 1-4, the big crack of the modification area | region was exposed on the surface. And the crack of the surface meandered and the tendency for the width | variety of the area | region where a crack generate | occur | produces to be expanded was seen.

(Example 16)
Laser dicing was performed under the following conditions by the method described in the embodiment.
Substrate to be processed: Sapphire substrate Laser light source: Nd: YVO ₄ laser Wavelength: 532 nm
Irradiation energy: 90mW
Laser frequency: 20KHz
Number of irradiation light pulses (P1): 1
Non-irradiation light pulse number (P2): 1
Stage speed: 25mm / sec

  Dicing was performed under conditions where the processing point depth was 10 μm shallower than that of Example 5, that is, under the condition where the focused position of the pulse laser beam was closer to the substrate surface to be processed than in Example 5.

  The result of laser dicing is shown in FIG. The photo is taken focusing on the modified region inside the substrate. In the photograph, the right line (+10 μm) is the condition of Example 16. For comparison, the condition (0) of Example 5 that differs only in the processing point depth is shown on the left side.

(Example 17)
Laser dicing was performed in the same manner as in Example 16 except that irradiation / non-irradiation = 1/2. The result of laser dicing is shown in FIG.

(Example 18)
Laser dicing was performed in the same manner as in Example 16 except that irradiation / non-irradiation = 2/2. The result of laser dicing is shown in FIG.

(Example 19)
Laser dicing was performed in the same manner as in Example 16 except that irradiation / non-irradiation = 1/3. The result of laser dicing is shown in FIG.

(Example 20)
Laser dicing was performed in the same manner as in Example 16 except that irradiation / non-irradiation = 2/3. The result of laser dicing is shown in FIG.

(Example 21)
Laser dicing was performed in the same manner as in Example 16 except that irradiation / non-irradiation = 1/4. The result of laser dicing is shown in FIG.

  In Examples 16 to 21, by setting the irradiation energy of the pulse laser beam, the processing point depth, and the non-irradiation interval as described above, as shown in FIG. The crack which can be formed was able to be formed.

  But compared with the case of Examples 5-10, the big crack of the modification area | region was exposed on the surface. And the crack of the surface meandered and the tendency for the width | variety of the area | region where a crack generate | occur | produces to be expanded was seen. Therefore, meandering was also observed in the cleaved portion after cleaving.

As described above, from the evaluations of Examples 1 to 21 and Comparative Example 1, when the thickness of the substrate to be processed is 100 μm, the linearity of the crack is excellent and the linearity of the cleaving portion is excellent, and the cleaving force is small. It became clear that the conditions were optimal.
(Example 22)
Laser dicing was performed under the following conditions by the method described in the embodiment.
Substrate to be processed: Sapphire substrate, substrate thickness 150 μm
Laser light source: Nd: YVO ₄ laser Wavelength: 532 nm
Irradiation energy: 200mW
Laser frequency: 200KHz
Number of irradiation light pulses (P1): 1
Non-irradiation light pulse number (P2): 2
Stage speed: 5mm / sec
Processing point depth: Approximately 23.4 μm from the surface of the substrate to be processed

  While Examples 1 to 21 were sapphire substrates with a processed substrate thickness of 100 μm, this example was a sapphire substrate with a processed substrate thickness of 150 μm. The result of laser dicing is shown in FIG. The upper side is an optical photograph of a cut section of the substrate, and the lower side is a schematic diagram of an irradiation pattern in the section of the substrate. ON (colored) is irradiation and OFF (white) is a non-irradiation region.

  The substrate to be processed had a strip shape with a width of about 5 mm, and a pulse laser beam was irradiated perpendicularly to the extending direction of the strip to form a crack. After forming the crack, the breaking force required for breaking was evaluated using a breaker.

(Example 23)
Laser dicing was performed in the same manner as in Example 22 except that irradiation / non-irradiation = 2/4. The result of laser dicing is shown in FIG.

(Example 24)
Laser dicing was performed in the same manner as in Example 22 except that irradiation / non-irradiation = 3/5. The result of laser dicing is shown in FIG.

  The linearity of the crack was the same as in Examples 22 to 23, and the linearity of the cleaved portion after cleaving was also the same. The cleaving force required for cleaving in Example 22 was 2.39 N to 2.51 N, Example 23 was 2.13 N to 2.80 N, and Example 24 was 1.09 N to 1.51 N. As a result, it was found that the cleaving force required for cleaving was the smallest in Example 24 where irradiation / non-irradiation = 3/5. Therefore, it was found that the conditions of Example 24 are optimal when the thickness of the substrate to be processed is 150 μm.

  As described above, even when the thickness of the substrate to be processed is changed, the pulse laser beam irradiation and non-irradiation can be performed in addition to the irradiation energy of the pulse laser beam, the processing point depth of the pulse laser beam, etc. It is clear that the optimal cleaving characteristics can be realized by controlling in synchronization with the same processing control clock signal and switching in units of optical pulses.

  In the embodiment, the case where the substrates to be processed are 100 μm and 150 μm is exemplified, but the optimum cleaving characteristics can be realized even with the substrate having a thickness of 200 μm or 250 μm.

DESCRIPTION OF SYMBOLS 10 Pulse laser processing apparatus 12 Laser oscillator 14 Pulse picker 16 Beam shaper 18 Condensing lens 20 XYZ stage part 22 Laser oscillator control part 24 Pulse picker control part 26 Processing control part 28 Reference clock oscillation circuit 30 Processing table part

Claims (1)

Place the substrate to be processed on the stage,
Generate a clock signal,
A pulse laser beam synchronized with the clock signal is emitted,
By moving the stage in synchronization with the clock signal, the substrate to be processed and the pulsed laser beam are moved relatively,
The irradiation and non-irradiation of the pulsed laser beam on the substrate to be processed are switched in units of light pulses by controlling the passage and blocking of the pulsed laser beam using a pulse picker in synchronization with the clock signal,
A laser dicing method for forming a crack reaching the substrate surface in the workpiece substrate,
The position of the workpiece substrate and the operation start position of the pulse picker are synchronized,
By controlling the irradiation energy of the pulse laser beam, the processing point depth of the pulse laser beam, and the length of the irradiation region and non-irradiation region of the pulse laser beam, the crack is substantially reduced on the surface of the substrate to be processed. A laser dicing method, wherein the laser dicing method is formed so as to be linearly continuous.