TWI692003B - Heat treatment device and its maintenance and repair method - Google Patents

Abstract

In the heat treatment apparatus of the present invention, the exhaust port 23 and the substrate inlet and outlet are separately provided on the side wall of the chamber 2, and the exhaust port 23 is connected to a gas recovery part 51 that exhausts the gas in the chamber 2. The gas recovery part 51 is detached from the chamber 2 by a snap lock 63 or installed in the chamber 2. When the gas recovery part 51 is removed from the chamber 2, the exhaust port 23 is opened. The exhaust port 23 is an opening for maintenance. Thereby, without increasing the number of openings, it is possible to perform maintenance and repair in the chamber 2 by using the opening of the chamber 2 separately provided from the entrance and exit of the substrate.

Description

Heat treatment device and its maintenance and repair method

The present invention relates to a heat treatment device and its maintenance method for heat treatment of substrates such as semiconductor substrate, glass substrate for liquid crystal display, glass substrate for photomask, substrate for optical disc and the like.

The heat treatment device includes a chamber and a heat treatment plate. The heat treatment plate is arranged inside the chamber. The heat-treated plate heat-treats the substrate placed in a horizontal posture, but this heat treatment has the following problems. That is, the coating liquid is applied on the substrate. When the substrate is heated by the heat treatment plate, a sublimate is generated from the coating liquid. Furthermore, if the sublimate is cooled, the sublimate crystallizes and attaches and accumulates on the inner wall of the chamber. In response to this problem, the heat treatment device is configured to exhaust the gas in the chamber, and the sublimation substance is removed by the trap (for example, refer to Patent Documents 1 to 3).

In addition, Patent Documents 2 and 3 disclose a heat treatment apparatus including a lid-shaped chamber that moves up and down relative to a heat treatment plate. When the lid-shaped chamber is raised, the side of the heat treatment plate is opened for the entire circumference. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 06-084782 [Patent Document 2] Japanese Patent No. 4467266 [Patent Document 3] Japanese Patent No. 4290579

[Problems to be solved by the invention]

The heat treatment devices of the above-mentioned Patent Documents 2 and 3 are configured such that when the substrate is taken out, the lid-shaped chamber rises and the side of the heat treatment plate is opened over the entire circumference. However, when airtightness is required in order to adjust the internal pressure and gas concentration, it is desirable to adopt a structure that provides a substrate inlet and outlet that allows the substrate to enter and exit from one direction with respect to the heat treatment plate, but this will additionally require chamber maintenance that is different from the substrate inlet and outlet Openings for maintenance, and the fewer the number of openings, the better.

The present invention has been completed in view of such a situation, and its object is to provide a maintenance chamber in a chamber that can be separately provided with a chamber opening different from the substrate entrance without increasing the number of openings Heat treatment device and its maintenance and repair method. [Technical means to solve the problem]

In order to achieve such an object, the present invention adopts the following configuration. That is, the heat treatment apparatus of the present invention is characterized by including: a chamber that houses the substrate; a heat treatment plate that is disposed below the chamber to perform heat treatment on the substrate; and a substrate entrance and exit that is disposed on the side wall of the chamber; row An air port, which is separately provided on the side wall of the chamber, different from the substrate inlet and outlet; an exhaust duct part, which is connected to the exhaust port to exhaust the gas in the chamber; and a disassembly part, which is used to separate the exhaust port The air duct portion is removed from the chamber, and the exhaust duct portion is installed in the chamber.

According to the heat treatment device of the present invention, the exhaust port and the substrate inlet and outlet are separately provided on the side wall of the chamber, and the exhaust port is connected to an exhaust duct portion that exhausts the gas in the chamber. The exhaust pipe part is removed from the chamber by the disassembly part or installed in the chamber. If the exhaust duct part is removed from the chamber, the exhaust port is opened. The exhaust port is an opening for maintenance. Thereby, without increasing the number of openings, maintenance and repair in the chamber can be performed by using the opening of the chamber separately provided from the entrance and exit of the substrate.

Furthermore, in the above heat treatment apparatus, the detachable portion is a fixing member, preferably, the fixing member includes: a receiving member provided in one of the chamber and the exhaust duct portion; and a movable hook Part, which is provided in the other of the chamber and the exhaust duct part, and has a hook hooked on the bearing member and a lever operating the hook; and by the lever operation, the hook is hooked on one side On the receiving member, the exhaust duct portion is pressed against the chamber, and the hook and press state is maintained, and the held hook and press state is released by the lever operation.

The tightness of the chamber is important. Therefore, in order to cover the exhaust port, it is required to keep the joint surface of the chamber provided with the exhaust port and the exhaust duct sealed tightly. However, when heat treatment is performed at a high temperature, fusion damage occurs on the junction surface of the chamber and the exhaust duct portion. In addition, when the exhaust duct part is installed in the chamber by the bolt, fusion damage may also occur in the threaded portion of the bolt. Therefore, the bolts are less likely to come off and work efficiency is reduced. Also, the head of the bolt may break due to the force when removing the bolt. If the head of the bolt is broken, subsequent correspondence becomes difficult. According to the fixing member of the present invention, even when a melt injury due to heat treatment occurs, the exhaust duct portion can be removed from the chamber by lever operation. Therefore, it is easy to remove the exhaust duct portion. In addition, since the operation of the lever can be used to install and remove the exhaust duct portion, no tools are required. This also makes it easy to install and remove the exhaust duct.

Furthermore, in the above heat treatment apparatus, it is preferable that the heat treatment plate performs heat treatment in a state where the substrate is placed in a horizontal posture, the exhaust port is flat in the horizontal direction, and has a substrate for making the heat treatment plate The width of the opening projected horizontally on the side wall of the chamber provided with the exhaust port is greater than the projection length in the horizontal direction. With this, the substrate can be taken out/in through the exhaust port used as the opening for maintenance.

Moreover, the maintenance and repair method of the heat treatment apparatus of the present invention is a maintenance and repair method of the heat treatment apparatus provided with the following: a chamber, which houses a substrate; and a heat treatment plate, which is provided under the chamber and heat-treats the substrate ; And the substrate entrance and exit, which is provided on the side wall of the chamber; the maintenance and repair method is characterized by having: through the disassembly part, will be connected to the substrate entrance and exit different from the exhaust port of the chamber side wall The process of removing the exhaust duct part of the gas in the chamber from the chamber, and the process of attaching the exhaust duct part to the chamber by the dismounting part.

According to the maintenance method of the heat treatment device of the present invention, the exhaust port is separately provided on the side wall of the chamber differently from the substrate inlet and outlet, and the exhaust port is connected to an exhaust duct portion that exhausts the gas in the chamber. The exhaust pipe part is removed from the chamber by the disassembly part or installed in the chamber. If the exhaust duct part is removed from the chamber, the exhaust port is opened. The exhaust port forms an opening for maintenance. Thereby, without increasing the number of openings, maintenance and repair in the chamber can be performed by using the opening of the chamber separately provided from the entrance and exit of the substrate.

In addition, in the maintenance method of the heat treatment device described above, it is preferable to further include: after removing the exhaust duct portion from the chamber, a temperature sense connected to a signal line for extending outside the chamber The step of carrying the temperature measurement substrate of the instrument into the chamber through the exhaust port; and the step of measuring the temperature using the temperature measurement substrate after the temperature measurement substrate is carried in.

The wireless temperature measurement substrate may damage the wireless circuit due to heating of the heat treatment plate. Therefore, a wired substrate for temperature measurement is used, but it is difficult to feed the wired substrate for temperature measurement by the substrate transfer robot through the substrate entrance. Therefore, after removing the exhaust duct portion from the chamber, the wired temperature measurement substrate can be easily transferred to the heat treatment plate through the exhaust port.

In addition, in the maintenance method of the heat treatment apparatus described above, it is preferable to further include a step of passing the passage provided in the cover portion different from the exhaust duct portion after the temperature measurement substrate is carried in, On the one hand, the signal line extending from the temperature sensor is led out of the chamber, and on the other hand, the cover part is installed in the chamber so as to cover the exhaust port. If the cover portion is attached to the chamber instead of the exhaust duct portion, the exhaust port is covered by the cover portion. Therefore, it is possible to suppress the entry and exit of gas through the exhaust port, and it is possible to perform temperature measurement under the influence of interference suppression.

In addition, in the above-mentioned maintenance method of the heat treatment apparatus, it is preferable that the step of attaching the cover uses the receiving member provided in one of the chamber and the cover, and the chamber and the The other of the cover parts has a hook that is hooked on the receiving member and a movable part of the hook movable part that operates the lever of the hook, and is operated by the lever to hook the hook to the bearing member The lid portion is pressed against the chamber, and the hook and the pressed state are maintained, and the lid portion is attached to the chamber so as to cover the exhaust port. With such a fixing member, the hook is hooked to the receiving member, and the lid is pressed to the chamber while maintaining the hook and the pressed state, so that the chamber provided with the exhaust port can be closed to the lid With. Therefore, the entry and exit of gas through the exhaust port can be suppressed. [Effect of invention]

According to the heat treatment device and its maintenance and repair method of the present invention, when the exhaust duct part is removed from the chamber, the exhaust port is opened. The exhaust port forms an opening for maintenance. Thereby, without increasing the number of openings, maintenance and repair in the chamber can be performed by using the opening of the chamber separately provided from the entrance and exit of the substrate.

[Example]

Hereinafter, the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic configuration diagram of a heat treatment apparatus of an embodiment.

<Configuration of Heat Treatment Device 1> The heat treatment device 1 is a person who performs heat treatment on the substrate W. The heat treatment apparatus 1 includes a chamber 2, a heat treatment plate 3, a support pin lifting section 4, a gas supply buffer section 5, an inert gas supply section 7, a shutter section 9, an exhaust duct section 11, a control section 13 and a setting section 15.

In addition, the heat treatment apparatus 1 of this embodiment does not have a structure in which a lid-shaped chamber as described in Patent Documents 2 and 3 moves up and down with respect to the heat treatment plate. That is, the heat treatment apparatus 1 of the present embodiment is configured to obtain airtightness in order to adjust the internal pressure and gas concentration.

The chamber 2 accommodates the substrate W. The chamber 2 includes a substrate entrance 21, an exhaust port 23, and an upper opening 25. The substrate inlet/outlet 21 is provided on the side wall of the chamber 2 and is an opening for carrying out and carrying in the substrate W in the chamber 2. The exhaust port 23 is an opening for exhausting the gas in the chamber 2. The exhaust port 23 and the like will be described later.

The heat treatment plate 3 is a heat treatment in a state where the substrate W is placed in a horizontal posture. The heat treatment plate 3 is provided in the lower part of the chamber 2. The heat treatment plate 3 is mounted on the base plate 27 and is arranged by inserting another opening provided at the bottom of the chamber 2. The base plate 27 is attached to the chamber 2 via an O-ring RG. In order to prevent the deterioration of the O-ring RG, a cooling pipe 28 for circulating cooling water is provided near the O-ring RG.

The heat treatment plate 3 includes a heater 29. The heater 29 adjusts the temperature of the heat treatment plate 3, for example, in the range of 300°C to 400°C. In addition, a proximity ball (not shown) is embedded in the heat treatment plate 3. Thereby, a specific gap (for example, 0.1 mm) is formed between the lower surface of the substrate W and the surface of the heat treatment plate 3.

The support pin lifting section 4 includes: three support pins 31 (only two are shown due to the relationship in the figure in FIG. 1), a lifting member 33, and an actuator 35. The three support pins 31 are arranged substantially positively in plan view Triangle shape. The support pin 31 is provided so as to penetrate the heat treatment plate 3. The support pin 31 is supported by the elevating member 33, and the actuator 35 elevates the support pin 31 via the elevating member 33.

The gas supply buffer 5 is attached to the chamber 2 via the O-ring RG so as to cover the upper opening 25. The gas supply buffer 5 is configured to be detachable from the chamber 2. When the gas supply buffer 5 is removed from the chamber 2, the upper opening 25 forms an opening for maintenance and repair of the chamber 2. The gas supply buffer 5 includes, for example, a diffusion plate 37 made of a punched metal plate. The diffusion plate 37 diffuses the nitrogen (N ₂ ) gas supplied by the inert gas supply part 7 toward the heat treatment space HS through the through-hole 37A of the diffusion plate 37. In addition, the heat treatment space HS is formed into a substantially rectangular parallelepiped.

The inert gas supply unit 7 supplies nitrogen gas as an inert gas to the chamber 2 (gas supply buffer unit 5). The inert gas supply unit 7 includes, for example, two fluid control valves and the like, and is configured to switch the flow rate of nitrogen in two stages.

The shutter 9 is provided on the front surface of the substrate entrance 21. The shutter portion 9 includes a shutter body 39 and an actuator 41. The actuator 41 moves the shutter body 39 in the vertical direction. As a result, the shutter body 39 is moved to the position of the solid line or the broken line, and the substrate entrance 21 is opened and closed. In addition, an O-ring RG is provided on the shutter body 39, and the O-ring RG is disposed between the shutter body 39 and the chamber 2 when the shutter body 39 closes the substrate entrance 21.

The control unit 13 includes a central processing unit (CPU), a memory, and a timer. The control unit 13 controls each structure of the heat treatment apparatus 1 such as the heat treatment plate 3, the support pin lifting section 4, the inert gas supply section 7, the shutter section 9, the exhaust duct section 11, and the like. In the memory, there are a plurality of process conditions that stipulate the heat treatment process or other operation programs required by the heat treatment device 1. The setting unit 15 is operated by an operator, or selects one of a plurality of process conditions, or edits the process conditions, or indicates the start of processing, or indicates the operation when an alarm occurs. In addition to the display unit such as a liquid crystal monitor, the setting unit 15 includes an input unit such as a mouse, keyboard, and various switches.

<Configuration of the exhaust port 23 etc. of the chamber 2 and the exhaust duct 11> Next, the exhaust port 23 etc. of the chamber 2 and the exhaust duct 11 will be described. 2(a) is a plan view of the chamber 2 etc.; FIG. 2(b) is a diagram showing the exhaust port 23 and the flange 2B of the chamber 2 when the chamber 2 is viewed from the front (AA view).

The exhaust port 23 is provided on the side wall of the chamber 2 differently from the substrate entrance 21. In this embodiment, the exhaust port 23 is provided on the side wall of the chamber 2 facing the substrate entrance 21. In addition, if necessary, the exhaust port 23 may not be arranged to face the substrate entrance 21. The exhaust port 23 is flat in the horizontal direction. The exhaust port 23 has an opening approximately the same size as the substrate entrance 21. Specifically, the exhaust port 23 has an opening width HA1 that is substantially the same as the width HA2 inside the chamber 2. That is, the opening width HA1 of the exhaust port 23 and the width HA2 between the left inner side wall 2L and the right inner side wall 2R of the chamber 2 are substantially the same. Therefore, when the exhaust duct 23 is not connected to the exhaust port 23, the substrate W may be taken out/into the exhaust port 23.

In addition, as shown in FIG. 2(b) and FIG. 5(a) described later, the exhaust port 23 has an opening height TA1 that is substantially the same as the height TA2 inside the chamber 2. That is, as shown in FIG. 5(a), the opening height TA1 of the exhaust port 23 and the height TA2 between the top surface 2U inside the chamber 2 and the substrate mounting surface 3A are substantially the same.

In addition, in FIG. 2(a), the symbol 2A is a flange where the substrate entrance 21 is formed, and the symbol 2C is a flange where the upper opening 25 is formed. In addition, the upper opening 25 has an opening having a larger diameter than that of the substrate W.

The heat treatment apparatus 1 is generally mounted on a substrate processing apparatus including a plurality of processing units. Therefore, a substrate transport mechanism TR (refer to FIG. 1) that transports the substrate W is disposed on the substrate entrance 21 side. That is, the substrate entrance 21 is arranged facing the inside of the substrate processing apparatus. In addition, other processing units are arranged in the left-right direction of FIG. 2(a) and the direction orthogonal to the paper surface. Furthermore, a cover of the substrate processing apparatus is arranged on the side of the exhaust port 23. That is, the exhaust port 23 faces the outside of the substrate processing apparatus. Therefore, when the cover of the substrate processing apparatus is removed, the exhaust port 23 is configured to appear outward.

Return to Figure 1. The exhaust duct portion 11 is a mechanism for exhausting gas in the chamber 2. The exhaust duct section 11 includes a gas recovery section 51, a collection section 53, an exhaust pipe 55, an on-off valve 57, an aspirator 59, and an air supply section 61. The aspirator 59 functions as a pump, and generates an attractive force for discharging the gas inside the chamber 2 through the gas recovery part 51 or the like. The air supply unit 61 supplies air for operating the aspirator 59. The air supply unit 61 includes an air pipe 61A, two on-off valves 61B and 61C, and two flow rate adjustment valves 61D and 61E. As shown in FIG. 1, the air supply unit 61 is configured to switch the flow rate of air in two stages.

FIG. 3 is a perspective view showing the gas recovery part 51 and the collection part 53. FIG. 4 is a schematic configuration diagram of these.

The gas recovery part 51 shown in FIG. 2(a), FIG. 3, FIG. 4 etc. recovers the gas in the chamber 2 for exhaust. The gas recovery portion 51 has an opening portion 51A having substantially the same size (width HA1 and height TA1) as the exhaust port 23 shown in FIGS. 2(a) and 2(b). Moreover, the gas recovery part 51 is connected to the chamber 2 by connecting the opening portion 51A at one end to the exhaust port 23. That is, the gas recovery part 51 is attached to the chamber 2 so that the position of the opening 51A and the exhaust port 23 coincide.

As shown in FIG. 4, the collection part 53 is connected to the opening 51B at the other end of the gas recovery part 51. The trap unit 53 crystallizes the sublimate in the gas recovered by the gas recovery unit 51 and removes the crystallized sublimate. The sublimation substance is generated from the coating liquid on the substrate W as described above. As shown in FIG. 4, the collection unit 53 includes a collection channel 53A, an inlet 53B, an outlet-side channel 53D, an outlet 53E, a cooling tube 53F as a gas cooling unit, and a sublimate collection unit 53G.

The collection channel 53A is formed inside a tubular (hollow cylindrical) member, and the lower end 53H is closed. The collection channel 53A is for passing the gas recovered by the gas recovery unit 51. As shown in FIG. 4, the inflow port 53B is connected to the opening 51B at the other end of the gas recovery part 51. The gas flowing in through the inflow port 53B passes through the collection flow path 53A and the outflow side flow path 53D in order, and then flows out from the outflow port 53E. The outflow-side flow path 53D is a flow path connecting the collection flow path 53A and the outflow port 53E.

The cooling pipe 53F is provided on the outer periphery of the collection channel 53A between the inlet 53B of the collection channel 53A and the outlet-side channel 53D. The cooling pipe 53F is formed in such a way that cooling water circulates, and crystallizes (solidifies) the sublimation in the gas. The outlet-side flow channel 53D is connected to the collection channel 53A at a position higher than the lower end 53H of the collection channel 53A. As a result, a sublimate collection part 53G that collects the sublimate crystallized in the cooling pipe 53F is formed between the outlet-side flow path 53D and the lower end 53H. Therefore, the crystallized sublimate can be collected in the sublimate collection part 53G, and the gas after the sublimation is removed can be sequentially fed to the downstream of the trap part 53 through the outlet-side flow path 53D and the outlet 53E Exhaust pipe 55 etc.

FIG. 5(a) is an enlarged longitudinal cross-sectional view of the connecting portion between the chamber 2 and the gas recovery part 51. FIG. 5(b) is a longitudinal cross-sectional view showing a state where the gas recovery part 51 is detached from the chamber 2. FIG.

The gas recovery unit 51 is configured to be detachable from the chamber 2. That is, the heat treatment apparatus 1 includes the snap lock 63 for removing the gas recovery part 51 from the chamber 2 and attaching the gas recovery part 51 to the chamber 2. The chamber 2 and the gas recovery part 51 are made of stainless steel, for example. Moreover, the snap lock 63 corresponds to the detachable part and the fixing member of the present invention.

The snap lock 63 includes a receiving member 64 and a hook movable portion 65. The receiving member 64 is provided on the flange 2B of the chamber 2. On the other hand, the hook movable portion 65 (base 65F described later) is provided on the flange 51C of the gas recovery portion 51. In addition, the hook movable portion 65 includes a hook 65A, a lever 65B, an arm 65C, a first shaft 65D, a second shaft 65E, and a base 65F. The hook 65A is hooked on the receiving member 64. The lever 65B is an operation hook 65A. The lever 65B is rotatably connected to the base 65F about the first axis 65D. A hook 65A is provided at one end of the arm 65C, and a second shaft 65E is provided at the other end of the arm 65C. The arm 65C is rotatably connected to the rod 65B about the second axis 65E.

The buckle lock 63 uses the operation of the lever 65B to hook the hook 65A to the receiving member 64 while pressing the gas recovery portion 51 against the chamber 2 while maintaining the hook and pressing state. In addition, the snap lock 63 releases the held hook and pressed state by operating the hook 65A by the operation of the lever 65B. Moreover, the buckle lock 63 is formed using the principle of lever, the first shaft 65D forms a fulcrum, and the second shaft 65E forms an action point, sandwiching the position of the lever 65B on the opposite side of the first shaft 65D of the second shaft 65E (e.g. arrow Peripheral) to form force points.

As shown in FIG. 3, the buckle lock 63 is provided in four places. In addition, two L-shaped members 66 are provided on the upper surface of the flange 51C of the gas recovery part 51. The L-shaped member 66 is used to hook into the chamber 2. The L-shaped member 66 is a unit for temporarily attaching (temporarily fixing) the gas recovery part 51 with a weight to the chamber 2. Therefore, even if the hook 65A of the snap lock 63 is disengaged from the receiving member 64, the gas recovery portion 51 is held at the installed position. FIG. 6(a) is a longitudinal cross-sectional view showing a state where the gas recovery part 51 is hooked to the chamber 2 by the L-shaped member 66. FIG. 6(b) is a longitudinal cross-sectional view showing a state where the gas recovery part 51 is detached from the chamber 2. FIG.

In addition, in FIG. 5( a ), the hook movable portion 65 and the receiving member 64 may be provided oppositely. That is, the hook movable part 65 may be provided in the chamber 2 and the receiving member 64 may be provided in the gas recovery part 51. The receiving member 64 is provided in one of the chamber 2 and the gas recovery part 51, and the hook movable part 65 is provided in the other of the chamber 2 and the gas recovery part 51. In FIG. 3, the number of the buckle locks 63 is not limited to four, and the number of L-shaped members 66 is not limited to two. As shown by the broken line BL in FIG. 6(a), the L-shaped member 66 may also be provided on the lower surface of the flange 2B of the chamber 2 so as to mount the gas recovery part 51.

In addition, an O-ring RG1 is provided on the flange 2B of the chamber 2. The O-ring RG1 is arranged between the flange 2B and the flange 51C of the gas recovery part 51. In addition, in the flange 2B, a cooling channel 28A for circulating cooling water is provided near the O-ring RG1. The cooling of the cooling flow path 28A can prevent the deterioration of the O-ring RG1.

<Operation of Heat Treatment Device 1> Next, the operation of the heat treatment device 1 will be described. Refer to Figure 1. The actuator 41 of the shutter portion 9 lowers the shutter body 39 and opens the substrate entrance 21. Then, the actuator 35 of the support pin lifting section 4 raises the support pin 31. The substrate transfer mechanism TR transfers the substrate W to the support pin 31 in the chamber 2. After the substrate transport mechanism TR is retracted outside the chamber 2, the shutter body 39 is raised to close the substrate entrance 21. The support pin 31 remains ascending.

Thereafter, the gas in the chamber 2 is replaced. That is, the inert gas supply unit 7 supplies nitrogen gas to the chamber 2. At this time, the exhaust duct portion 11 supplies air to the inhaler 59 by the air supply portion 61, and opens the on-off valve 57. With this, the exhaust duct portion 11 exhausts the gas in the chamber 2 through the exhaust port 23. In addition, the supply of nitrogen gas to the chamber 2 and the discharge of the gas in the chamber 2 are adjusted according to preset process conditions.

Thereafter, based on the process conditions, when the oxygen concentration becomes a certain value or less, the support pin 31 is lowered, and the substrate W is placed on the heat treatment plate 3. With this, heat treatment is started. When the heat treatment is completed, the support pin 31 is raised to cool the substrate W. After cooling, the supply and exhaust of nitrogen gas are stopped (the on-off valve 57 and the like are closed). Then, after the substrate entrance 21 is opened, the substrate transfer mechanism TR transfers the heat-treated substrate W.

Next, the operations of the gas recovery unit 51 and the collection unit 53 will be described. The substrate W is coated with a coating solution containing a block copolymer in a DSA (Directed Self-Assembly) process, or a coating solution for forming an anti-reflection film. In addition, the coating liquid is not limited to these liquids. When the substrate W is placed on the heat treatment plate 3 and the substrate W becomes high temperature, a sublimation substance is generated from the coating liquid. In detail, components other than the solvent are dissolved in the solvent of the coating liquid, and the components other than the dissolved solvent are evaporated together with the solvent. As a result, sublimates are produced. The generated sublimate contains (mixes) the gas in the chamber 2.

The gas containing sublimate is discharged through the exhaust port 23. As shown in FIG. 2( a ), the exhaust port 23 has a width HA1 that is substantially the same as the width HA2 inside the chamber 2. In addition, the gas recovery part 51 has an opening 51A having substantially the same size as the exhaust port 23 at one end, and the opening 51A at one end thereof is connected to the exhaust port 23 to be installed in the chamber 2. Therefore, the gas can be recovered from the chamber 2 without keeping the gas under the four corners indicated by the symbol YS in FIG. 2(a). The gas recovered by the gas recovery part 51 is fed to the trap part 53 through the opening 51B at the other end. In the collection part 53, the cooling pipe 53F cools the gas supplied, and crystallizes the sublimation substance in the gas. The crystallized sublimate is collected in the sublimate collection part 53G, and the gas after the sublimation is removed is sent to the exhaust pipe 55 and discharged.

<Maintenance and Repair Method of Heat Treatment Device 1> Next, the maintenance and repair method of the heat treatment device 1 will be described. Furthermore, in this embodiment, the maintenance and repair method will be described as an example of the operation of placing the temperature measurement substrate 81 on the heat treatment plate 3 and performing temperature measurement.

[Step S01] Removal of the gas recovery part 51 In FIG. 7(a), the lock of the snap lock 63 is released by the operation of the lever 65B, and the gas recovery part 51 is removed from the chamber 2. That is, when the gas recovery part 51 is installed in the chamber 2, the snap lock 63 keeps the state where the gas recovery part 51 is pressed against the chamber 2 while hooking the hook 65A to the receiving member 64. The held hook and pressed state are released by lever 65B operation. As a result, the gas recovery unit 51 is removed from the chamber 2. In addition, the gas recovery unit 51 is hooked into the chamber 2 by the L-shaped member 66 shown in FIG. 6 to be temporarily installed.

The gas recovery part 51 can not only attach and detach the chamber 2 but also attach and detach the collection part 53 (collection lower part 68). In FIG. 7( a ), the coupling member 69 is removed, and the integrated gas recovery part 51 and the collection upper part 67 are separated from the collection lower part 68 including the cooling tube 53F. Thereby, it is not necessary to remove the collection lower part 68 from the frame 71, or remove the piping connected to the cooling pipe 53F, and the like. Therefore, the gas recovery unit 51 can be easily removed. FIG. 7(b) shows the state where the hook of the L-shaped member 66 is also released, and the gas recovery part 51 and the like are removed.

[Step S02] Manual loading of the substrate In FIG. 7(b), the substrate 81 for temperature measurement is carried in through the exhaust port 23. The substrate 81 for temperature measurement is of a wire type as shown in FIG. 7(c). If it is a wireless type, the wireless circuit may be damaged due to high measurement temperature. The substrate 81 for temperature measurement includes 17 temperature sensors 83 in order to measure the temperature in the substrate surface at 17 locations. The temperature sensor 83 is composed of a thermocouple, a temperature measuring resistor, a thermistor, or the like. A signal line (wiring) 84 for extending outside the chamber 2 is connected to the temperature sensors 83, respectively. The signal line 84 transmits temperature information and the like to the thermometer body (not shown). In FIG. 7( c ), for the convenience of illustration, the temperature measurement substrate 81 includes one temperature sensor 83.

In addition, the number of temperature sensors 83 is not limited to 17. For example, the temperature sensor 83 may be one, five, nine, or other numbers. That is, the temperature measurement substrate 81 includes at least one temperature sensor 83.

The temperature measurement substrate 81 is carried in using the transfer jig 86 of FIG. 8. In FIG. 8, the transfer jig 86 includes a handle 87, an interference avoidance groove 88, and a substrate placing portion 89. The handle 87 is a part for maintenance personnel to grab. The interference avoidance groove 88 is provided so as not to interfere with the support pin 31 of the heat treatment apparatus 1. The substrate mounting portion 89 is a portion that mounts the substrate W such as the substrate 81 for temperature measurement.

In FIG. 7( b ), the actuator 35 (see FIG. 1) raises the support pin 31 via the lifting member 33. After the ascent, the maintenance personnel place the temperature measurement substrate 81 on the transfer jig 86. After that, the maintenance personnel pass the support pin 31 through the exhaust port 23 through the interference avoidance groove 88, and the transport jig 86 enters the chamber 2. Thereafter, the maintenance personnel place the temperature measurement substrate 81 on the support pin 31 in the chamber 2. After being placed, the maintenance personnel make the transport jig 86 retreat out of the chamber 2. FIG. 7(c) is a diagram showing a state where the temperature measuring substrate 81 has been carried in. FIG.

[Step S03] Mounting of the lid portion for temperature measurement In FIG. 7(c), after the substrate 81 for temperature measurement is carried in, the lid portion 90 for temperature measurement is attached to the chamber 2 so as to cover the exhaust port 23 . First, the temperature measurement cover 90 shown in FIG. 7(d) is temporarily attached to the chamber 2. As shown in FIG. 7( d ), two L-shaped members 66, notch portions 91, and four snap locks 63 are provided in the cover 90 for temperature measurement. The L-shaped member 66 provided in the lid portion 90 for temperature measurement is hooked to the flange 2B of the chamber 2 (refer to FIG. 6( a )) and temporarily attached. As a result, the temperature measurement cover 90 is attached to the chamber 2 so as to cover the exhaust port 23. At this time, as shown in FIG. 7(d), the signal lines 84 extending from each of the 17 temperature sensors 83 are led out to the chamber 2 through the notch 91 provided in the temperature measurement cover 90 outer.

After the temperature measurement cover 90 is temporarily attached to the chamber 2, the temperature measurement cover 90 is attached to the chamber 2 using the snap lock 63 (formal installation). As described above, the buckle lock 63 is configured to press the hook 65A to the receiving member 64 while being operated by the lever 65B, and press the lid portion 90 for temperature measurement to the chamber 2 while maintaining the hook and the pressed state. In addition, the snap lock 63 is configured to release the held hook and press state by the operation of the lever 65B.

The buckle lock 63 hooks the hook 65A to the receiving member 64 while pressing the lid portion 90 for temperature measurement to the chamber 2 while maintaining the hook and pressing state. Thereby, the chamber 2 provided with the exhaust port 23 and the lid portion 90 for temperature measurement can be brought into close contact. In addition, compared with the temporary attachment of the temperature measurement cover 90 to the chamber 2 by the L-shaped member 66, gas in and out through the exhaust port 23 can be suppressed.

In addition, the temperature measurement cover 90 corresponds to the cover of the present invention. The notch 91 corresponds to the passage of the present invention. The passage of the present invention may be a tubular passage. If necessary, any one of the snap lock 63 and the L-shaped member 66 for attaching the temperature measurement cover 90 to the chamber 2 may not be provided.

[Step S04] Temperature measurement After that, the support pin 31 is lowered, and the temperature measurement substrate 81 is placed on the heat treatment plate 3. The temperature is measured using the substrate 81 for temperature measurement. The temperature measurement is performed in the state where the chamber 2 is at atmospheric pressure.

In the maintenance method of this embodiment, after the gas recovery unit 51 is removed from the chamber 2, the temperature measurement substrate 81 having the temperature sensor 83 is carried into the chamber 2 through the exhaust port 23. The wireless temperature measurement substrate may damage the wireless circuit due to heating of the heat treatment plate 3. Therefore, the wired (signal line 84) temperature measurement substrate 81 is used, but it is difficult to feed the wired temperature measurement substrate 81 through the substrate entrance/exit 21 by the substrate transfer mechanism TR (robot). Therefore, after the gas recovery part 51 is removed from the chamber 2, the wired temperature measurement substrate 81 can be easily carried into the chamber 2 through the exhaust port 23.

In addition, in the maintenance method of the present embodiment, after the temperature measurement substrate 81 is carried in, the self-temperature sensor is placed on the notch 91 provided in the temperature measurement cover 90 different from the gas recovery part 51 The signal line 84 extending from 83 is led out of the chamber 2, and the cover 90 for temperature measurement is attached (temporarily attached) to the chamber 2 so as to cover the exhaust port 23. When it is installed in the chamber 2 instead of the gas recovery part 51, the exhaust port 23 is covered by the temperature measurement cover 90. Therefore, it is possible to suppress the entry and exit of gas through the exhaust port 23, and it is possible to perform temperature measurement under the influence of interference suppression.

[Step S05] Removal of the lid portion for temperature measurement After the temperature measurement is completed, the support pin 31 is raised to move the substrate 81 for temperature measurement away from the heat treatment plate 3. The temperature measurement cover 90 is removed from the chamber 2. That is, the held hook and the pressed state are released by the snap lock 63 (unlocking). At this time, the temperature measurement cover 90 is temporarily attached to the chamber 2 by the L-shaped member 66. The hook state formed by the L-shaped member 66 is released, and the temperature measurement cover 90 is completely detached from the chamber 2. At this time, the exhaust port 23 appears as shown in FIG. 7(c).

[Step S06] Manual removal of the substrate In FIG. 7(c), the maintenance personnel pass the support pin 31 through the interference avoidance groove 88 through the exhaust port 23, and at the same time, the transfer jig 86 enters the chamber 2. Thereafter, the substrate 81 for temperature measurement on the support pin 31 is placed on the transfer jig 86. Then, the transfer jig 86 is retracted, and the temperature measurement substrate 81 is carried out of the chamber 2.

[Step S07] Installation of the gas recovery part 51 In FIG. 7(b), the support pin 31 is lowered. Thereafter, as shown in FIG. 6, the L-shaped member 66 of the gas recovery part 51 temporarily attaches the gas recovery part 51 to the chamber 2. Thereafter, the integrated gas recovery part 51 and the collection upper part 67 and the collection lower part 68 including the cooling pipe 53F are connected by the connection member 69. Thereafter, by operating the lever 65B of the snap lock 63, the hook 65A is hooked to the receiving member 64 while pressing the gas recovery portion 51 against the chamber 2, and the hook and the pressed state are maintained (locked). As a result, the gas recovery unit 51 is installed in the chamber 2. Return to the state shown in Fig. 7(a).

According to the present embodiment, the exhaust port 23 is separately provided on the side wall of the chamber 2 differently from the substrate entrance 21, and the exhaust port 23 is connected to the gas recovery part 51 that exhausts the gas in the chamber 2. The gas recovery unit 51 is detached from the chamber 2 using the snap lock 63 and is installed in the chamber 2. When the gas recovery part 51 is removed from the chamber 2, the exhaust port 23 is opened. The exhaust port 23 forms an opening for maintenance. Thereby, there is no need to increase the number of openings, and the maintenance and repair in the chamber 2 can be performed by using the opening of the chamber 2 which is provided separately from the substrate entrance 21.

Moreover, the buckle lock 63 is provided with the receiving member 64 provided in the chamber 2, and the hook movable part 65 provided in the gas recovery part 51, and having the hook 65A hooked to the receiving member 64 and the lever which operates the hook 65A 65B. The buckle lock 63 uses the operation of the lever 65B to hook the hook 65A to the receiving member 64 while pressing the gas recovery portion 51 against the chamber 2 while maintaining the hook and pressing state. Moreover, the snap lock 63 is operated by the lever 65B to release the held hook and pressed state.

The sealing in the chamber 2 is important. Therefore, in order to cover the exhaust port 23, it is required to keep the joint surface of the chamber 2 provided with the exhaust port 23 and the gas recovery part 51 tightly closed. However, when the heat treatment is performed at a high temperature, fusion damage occurs on the junction surface of the chamber 2 and the gas recovery portion 51. In addition, when the gas recovery part 51 is attached to the chamber 2 by the bolt, the threaded portion of the bolt also causes melt damage. Therefore, the bolts are less likely to come off and work efficiency is reduced. Also, the head of the bolt may break due to the force when removing the bolt. If the head of the bolt is broken, subsequent correspondence becomes difficult. According to the fixing device of the present invention, even when a burn injury due to heat treatment occurs, the gas recovery part 51 can be removed from the chamber 2 by the operation of the rod 65B, and therefore, the gas recovery part 51 can be easily removed. In addition, since the gas recovery unit 51 can be attached and detached by lever 65B operation, no tools are required. In this way, the installation and removal of the gas recovery part 51 are also easy.

The present invention is not limited to the above-mentioned embodiment, and may be modified as follows.

(1) In the above embodiment, the gas recovery part 51 is attached to the chamber 2 by the snap lock 63. The fixing member 93 shown in FIG. 9 can also be used for the installation of the gas recovery part 51 with respect to the chamber 2. The fixture 93 includes a receiving member 94 and a hook movable portion 95. The receiving member 94 is fixed to the flange 2B. The receiving member 94 includes an inclined portion 94A and a holding portion 94B. The inclined portion 94A is a person who presses the gas recovery portion 51 stepwise with respect to the chamber 2. There is a step difference between the inclined portion 94A and the holding portion 94B. With this step, the hook 95A is held by the holding portion 94B.

On the other hand, the hook movable portion 95 includes a hook 95A, a lever 95B, a rotating shaft 95D, and a base 95F. The base 95F is provided on the flange 51C of the gas recovery part 51. The rod 95B is rotatable about a rotation axis 95D relative to the base 95F. A rotation shaft 95D is provided at one end of the rod 95B, and a hook 95A is provided at the other end of the rod 95B.

That is, the fixing member 93 is configured to operate the lever 95B while hooking the hook 95A to the receiving member 94 while pressing the gas recovery portion 51 against the chamber 2 while maintaining the hook and pressing state, and the lever 95B to operate Release the held hook and pressed state.

(2) In the above embodiment, the gas recovery part 51 is attached to the chamber 2 by the snap lock 63. In FIG. 5(a), the flange 2B of the chamber 2 is provided with a receiving member 64 as a separate member. At this point, as shown in FIG. 10, the receiving member 64 is integrally formed on the flange 2B.

(3) In the above-mentioned embodiment, the installation of the gas recovery part 51 to the chamber 2 is performed by the cooperation of the two snap locks 63 on one side. That is, in FIG. 5(a), it is performed by two snap locks 63 up and down. However, any one of the two upper and lower snap locks 63 may be replaced with a contact portion 97 composed of two members as shown in FIG. 11.

(4) In the above-described embodiments and various modifications, the L-shaped member 66 is provided for temporary installation, but the L-shaped member 66 may not be provided as necessary. In addition, as long as it is a temporary mounting member that can be temporarily mounted, it is not L-shaped.

(5) In the above-described embodiments and various modifications, the exhaust port 23 has an opening width HA1 that is substantially the same as the width HA2 inside the chamber. At this point, as shown in FIGS. 2( a) and 2 (b ), the opening width HA1 of the exhaust port 23 does not reach the width HA2 of the interior of the chamber 2. That is, the exhaust port 23 may have an opening width HA1 of a horizontal projection length HA3 or more when the substrate W on the heat treatment plate 3 is horizontally projected on the side wall of the chamber 2 provided with the exhaust port 23. With this, it is possible to suppress the stagnation of the gas containing the sublimate at least above the substrate W and recover it through the exhaust port 23. In addition, the substrate mounting surface 3A of the heat treatment plate 3 and the substrate W are circular, but they may be rectangular.

1‧‧‧heat treatment device 2‧‧‧chamber 2A‧‧‧flange 2B‧‧‧flange 2C‧‧‧flange 2L‧‧‧left inner side wall 2R‧‧‧right inner side wall 2U‧‧‧top surface 3‧‧‧Heat treatment board 3A‧‧‧Substrate mounting surface 4‧‧‧Support pin lifting section 5‧‧‧Gas supply buffer section 7‧‧‧Inert gas supply section 9‧‧‧Block section 11‧‧‧ Row Air duct part 13‧‧‧Control part 15‧‧‧Setting part 21‧‧‧Substrate inlet and outlet 23‧‧‧Exhaust port 25‧‧‧Upper opening 27‧‧‧Base plate 28‧‧‧Cooling tube 28A‧ ‧‧Cooling channel 29‧‧‧ Heater 31‧‧‧ Support pin 33‧‧‧Elevating member 35‧‧‧Actuator 37‧‧‧Diffusion plate 37A‧‧‧Through port 39‧‧‧Door body 41 ‧‧‧Actuator 51‧‧‧Gas recovery part 51A‧‧‧ opening 51B‧‧‧ opening 51C‧‧‧flange 53‧‧‧trap 53A‧‧‧trap flow channel 53B‧‧‧flow Inlet 53D‧‧‧Outlet side flow path 53E‧‧‧Outlet 53F‧‧‧Cooling pipe 53G‧‧‧Sublimate collection part 53H‧‧‧Lower end 55‧‧‧Exhaust pipe 57‧‧‧Open and close valve 59‧ ‧‧Aspirator 61‧‧‧Air supply part 61A‧‧‧Air piping 61B‧‧‧Open and close valve 61C‧‧‧Open and close valve 61D‧‧‧Flow adjustment valve 61E‧‧‧Flow adjustment valve 63‧‧‧ Lock 64‧‧‧Bearing member 65‧‧‧Hook movable part 65A‧‧‧Hook 65B‧‧‧ Rod 65C‧‧‧arm 65D‧‧‧1st axis 65E‧‧‧2nd axis 65F‧‧‧Abutment 66 ‧‧‧L-shaped member 67‧‧‧Capture upper part 68‧‧‧Capture lower part 69‧‧‧Coupling member 71‧‧‧Frame 81‧‧‧Temperature measurement substrate 83‧‧‧Temperature sensor 84‧‧ ‧Signal line (wiring)86‧‧‧‧Conveyor fixture 87‧‧‧Handle 88‧‧‧Interference avoidance slot 89‧‧‧Board mounting part 90‧‧‧Temperature measuring cover 91‧‧‧Notch 93 ‧‧‧Fixing member 94‧‧‧bearing member 94A‧‧‧inclined part 94B‧‧‧holding part 95‧‧‧hook movable part 95A‧‧‧hook 95B‧‧‧bar 95D‧‧‧rotating shaft 95F‧‧‧ Abutment 97‧‧‧ contact part AA‧‧‧angle of view BL‧‧‧ dotted line HA1‧‧‧ opening width/width HA2‧‧‧ width HA3‧‧‧projection length HS‧‧‧heat treatment space RG‧‧‧O-ring RG1‧‧‧O-ring TA1‧‧‧ opening height/height TA2‧‧‧height TR‧‧‧substrate transfer mechanism (robot) W‧‧‧substrate YS‧‧‧corner corner

FIG. 1 is a schematic configuration diagram of a heat treatment apparatus of an embodiment. Fig. 2 (a) is a plan view of the chamber and the like, and (b) is a view showing the exhaust port and the flange of the chamber when the chamber is viewed from the front. Fig. 3 is a perspective view showing a gas recovery part and a collection part. FIG. 4 is a schematic configuration diagram showing a gas recovery part and a collection part. Fig. 5 (a) is an enlarged longitudinal cross-sectional view of the connecting portion between the chamber and the gas recovery part, and (b) is a longitudinal cross-sectional view showing a state where the gas recovery part is removed from the chamber. 6(a) is a longitudinal cross-sectional view showing a state in which a gas recovery part is hooked to a chamber by an L-shaped member, and (b) is a longitudinal cross-sectional view showing a state in which the gas recovery part is detached from the chamber. Figure 7 (a) is a diagram showing the state where the gas recovery part is installed in the chamber and the lower part of the collection; (b) is a diagram showing the state where the gas recovery part is removed from the chamber and the lower part of the collection; (c) It is a figure which shows the state which carried the substrate for temperature measurement into a chamber; (d) is a figure which shows the state which attached the cover part for temperature measurement to a chamber. FIG. 8 is a diagram for explaining the transport jig. Fig. 9 (a) is a plan view showing a variation of the fixing member; (b) is a right side view of the fixing member and the like of (a) viewed from the right. Fig. 10 is a diagram showing a variation of the fixing member. Fig. 11 is a diagram showing a variation of the fixing member.

2‧‧‧ chamber

2B‧‧‧Flange

2C‧‧‧Flange

2U‧‧‧Top

3‧‧‧heat treatment board

3A‧‧‧Substrate mounting surface

5‧‧‧Gas supply buffer

23‧‧‧Exhaust

28‧‧‧cooling tube

28A‧‧‧cooling flow path

37‧‧‧Diffusion plate

51‧‧‧Gas Recovery Department

51A‧‧‧Opening

51C‧‧‧Flange

63‧‧‧Snap lock

64‧‧‧ Bearing member

65‧‧‧Moveable part

65A‧‧‧Hook

65B‧‧‧rod

65C‧‧‧arm

65D‧‧‧1st axis

65E‧‧‧ 2nd axis

65F‧‧‧Abutment

RG‧‧‧O-ring

RG1‧‧‧O-ring

TA1‧‧‧Opening height/height

TA2‧‧‧Altitude

Claims (5)

A heat treatment apparatus is characterized by comprising: a chamber which houses a substrate; a heat treatment plate which is provided under the chamber to heat-treat the substrate; a substrate entrance and exit which is provided on the side wall of the chamber; an exhaust port which Different from the substrate entrance and exit, it is additionally provided on the side wall of the chamber; the exhaust duct portion has an opening of the same size as the exhaust port, and the opening is butted to the exhaust port to discharge the chamber Gas; and a fixture for removing the exhaust duct portion from the chamber and mounting the exhaust duct portion in the chamber; wherein the fixture includes: a bearing member provided in the chamber And one of the exhaust duct parts; and a movable part of the hook, which is provided in the other of the chamber and the exhaust duct part, has a hook hooked on the receiving member and a lever operating the hook; By the operation of the lever, the hook is hooked to the receiving member, and the chamber is pressed to the exhaust duct portion while maintaining the hook and the pressed state, and by the lever operation, the release is held The aforementioned hook and press state. The heat treatment apparatus according to claim 1, wherein the heat treatment plate performs heat treatment in a state where the substrate is placed in a horizontal posture, and the exhaust port is flat in the horizontal direction, and has a horizontal projection of the substrate on the heat treatment plate on the installation The horizontal projection length of the side wall of the aforementioned chamber with the aforementioned exhaust port is The width of the opening on the top. A maintenance and repair method of a heat treatment device, which is a maintenance and repair method of a heat treatment device equipped with the following: a chamber, which houses a substrate; a heat treatment plate, which is provided below the chamber and heat-treats the substrate; and A substrate entrance and exit, which is provided on the side wall of the chamber; and the maintenance and repair method is characterized by having: an attachment and detachment section that connects to an exhaust port separately provided on the side wall of the chamber and different from the substrate entrance and exit The process of removing the exhaust duct portion that exhausts the gas in the chamber from the chamber, after removing the exhaust duct portion from the chamber, will have a sense of temperature connected to the signal line for extending outside the chamber The step of carrying the temperature measuring substrate of the instrument into the chamber through the exhaust port, the step of measuring the temperature using the temperature measuring substrate after the temperature measuring substrate is carried in, and the step of removing the The process of installing the exhaust duct part in the aforementioned chamber. The maintenance method of the heat treatment device according to claim 3 further includes the following step: after the substrate for temperature measurement is carried in, the passage from the exhaust pipe part, which is different from the exhaust pipe part, provided in the cover part The signal line extending from the sensor is led out of the chamber, and the cover portion is installed in the chamber in such a manner as to cover the exhaust port. For the maintenance method of the heat treatment device of claim 4, wherein the process of installing the cover part mentioned above utilizes a fixing member having the following, namely: A receiving member, which is provided in one of the chamber and the cover, and a hook movable part, which is provided in the other of the chamber and the cover, and has a hook hooked on the receiving member and The lever of the hook is operated, and by the operation of the lever, the hook is hooked to the receiving member, and the lid is pressed against the chamber while maintaining the hook and pressed state to cover the row The cover part is attached to the chamber by means of a gas port.

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