TWI691025B - Electronic package and manufacturing method thereof and carrier structure - Google Patents

Abstract

This invention provides an electronic package comprising a carrier having at least a through hole; an electronic component disposed on and electrically connected to the carrier; and a reinforcing body disposed in the through hole and protrudes from the carrier, wherein the reinforcing body is not electrically connected to the carrier and the electronic component to effectively disperse thermal stress by the reinforcing body, thereby avoiding separation of the electronic component and the carrier.

Description

Electronic package and its manufacturing method and bearing structure

The invention relates to a packaging structure, in particular to an electronic packaging and its manufacturing method and bearing structure.

With the increasing demand for functions and processing speed of electronic products, semiconductor chips as the core components of electronic products need to have higher density of electronic components (Electronic Components) and electronic circuits (Electronic Circuits). A larger amount of heat energy is generated, and the encapsulant system covering the semiconductor chip is a poor heat transfer material with a thermal conductivity of only 0.8Wm-1k-1 (that is, the heat dissipation efficiency is not good), so if it cannot be effectively escaped The generated heat will cause damage to the semiconductor chip or product reliability issues.

Therefore, in order to quickly dissipate heat energy into the atmosphere, the industry usually configures a heat sink (Heat Sink or Heat Spreader) in the semiconductor package structure. The heat sink is generally made of heat dissipation adhesive, such as thermal interface material (Thermal Interface Material, abbreviation) TIM), which is bonded to the back of the semiconductor chip to dissipate the heat generated by the semiconductor chip through the heat dissipation adhesive and the heat sink. In addition, it is usually better to expose the top surface of the heat sink to the packaging gel or directly to the atmosphere. Get better heat dissipation effect.

The conventional TIM layer is a low-temperature melting heat conductive material (such as solder material), which is disposed between the back surface of the semiconductor wafer and the heat sink.

As shown in FIG. 1, the conventional manufacturing method of the semiconductor package 1 is to first place a semiconductor chip 11 on the package substrate 10 by using flip chip bonding (ie, through the conductive bump 110 and the primer 111) through its active surface 11a Then, a heat sink 13 with its top sheet 130 is reflow bonded to the non-active surface 11b of the semiconductor chip 11 through the TIM layer 12 (which includes the solder layer and flux), and the support legs of the heat sink 13 131 is erected on the packaging substrate 10 through the adhesive layer 14. Next, an encapsulation stamping operation is performed for the encapsulant (not shown) to cover the semiconductor chip 11 and the heat dissipation element 13, and the top sheet 130 of the heat dissipation element 13 is exposed to the encapsulant and directly exposed to the atmosphere. After that, the semiconductor package 1 and its package substrate 10 are mounted on a circuit board 9 through a plurality of solder balls 15.

During operation, the thermal energy generated by the semiconductor chip 11 is conducted to the top sheet 130 of the heat dissipation member 13 through the non-active surface 11 b and the TIM layer 12 to dissipate the heat to the outside of the semiconductor package 1.

However, in the conventional semiconductor package 1, the solder balls 15 are located in the wiring area of the package substrate 10, so during a thermal cycle, stress will be concentrated in the non-wiring area of the package substrate 10, making the The package substrate 10 is warped, resulting in the separation of the semiconductor chip 11 from the package substrate 10, that is, a delaminating problem, which prevents the semiconductor chip 11 from being effectively electrically connected to the circuit board 9 or the semiconductor package 1 Passing the reliability test results in poor product yield.

Furthermore, when the size of the semiconductor package 1 increases, the weight also increases. Therefore, when the solder balls 15 are reflowed to make the solder balls 15 in a molten state, the solder balls 15 cannot bear their The weight of the upper member will be crushed and deformed (as indicated by the dotted line in FIG. 1), which causes the adjacent solder balls 15 to be prone to the phenomenon of a bridge (Ball bridge) and an electrical short circuit.

Therefore, how to overcome the problems of the above-mentioned conventional technologies has become a problem that the industry urgently needs to overcome.

In view of the above-mentioned defects of the prior art, the present invention provides an electronic package including: a carrier having at least one perforation; an electronic component provided on the carrier and electrically connected to the carrier; and a reinforcement body , Which is arranged in the through hole and protrudes from the carrier, wherein the reinforcing body is not electrically connected to the carrier and the electronic component.

The invention also provides a method for manufacturing an electronic package, comprising: providing a carrier with at least one perforation; and disposing the electronic component on the carrier, and electrically connecting the electronic component to the carrier and forming a reinforcement The reinforced body protrudes from the carrier in the through hole, wherein the reinforced body is not electrically connected to the carrier and the electronic component.

In the aforementioned electronic package and its manufacturing method, the carrier has a first surface and a second surface opposite to each other, so that the electronic component is disposed on the first surface of the carrier, and the reinforcement body protrudes from the carrier First surface. For example, the method includes disposing a block body on the second surface of the carrier, and the block body is connected to the reinforcement body but not electrically connected to the carrier and the electronic component.

In the aforementioned electronic package and its manufacturing method, the carrier has a first surface and a second surface opposite to each other, so that the electronic component is disposed on the first surface of the carrier, and the reinforcement body protrudes from the carrier Second surface. For example, the method includes placing a block body on the first surface of the carrier, and the block body is connected to the reinforcing body but not electrically connected to the carrier and the electronic component.

In the aforementioned electronic package and its manufacturing method, the surface of the carrier defines a wiring area and an empty area adjacent to the wiring area, so that the electronic component is arranged in the wiring area, and the reinforcement system is arranged in the empty area.

In the aforementioned electronic package and its manufacturing method, the perforation is located at the edge of one of the surfaces of the carrier without connecting the edge.

In the aforementioned electronic package and its manufacturing method, the through hole is a notch formed on the side of the carrier.

In the aforementioned electronic package and its manufacturing method, it includes forming an insulator on the carrier to cover the portion of the reinforcement protruding from the carrier.

In the aforementioned electronic package and its manufacturing method, it further includes disposing a heat sink on the carrier.

In the foregoing electronic package and its manufacturing method, the method includes forming a plurality of conductive elements on the carrier that are electrically connected to the carrier.

The invention also provides a bearing structure, which includes: a bearing member having at least one perforation; and a reinforcement body disposed in the perforation and protruding from the bearing member, wherein the reinforcement body is not electrically connected to the bearing member.

In the aforementioned load-bearing structure, it further includes a block body provided on the load-bearing member, which is connected to the reinforcement body, and the block body is not electrically connected to the load-bearing member.

In the aforementioned load-bearing structure, the perforation is located at the edge of one of the surfaces of the load-bearing member without connecting the edge.

In the aforementioned bearing structure, the perforation is a notch formed on the side of the bearing.

In the aforementioned load-bearing structure, it includes an insulator formed on the load-bearing member to cover the portion of the reinforcement body that protrudes from the load-bearing member.

In the aforementioned supporting structure, the plurality includes a plurality of conductive elements formed on the supporting member to electrically connect the supporting member.

It can be seen from the above that in the electronic package of the present invention and its manufacturing method and supporting structure, the design of the reinforcement body passing through the supporting member is used to effectively disperse the thermal stress, so compared with the conventional technology, the present invention can avoid The electronic component is separated from the carrier, so the electronic component can be effectively electrically connected to the circuit board or the electronic package can pass the reliability test.

Furthermore, as the size of the electronic package increases, the weight also increases, so when the conductive element is in a molten state, the conductive element is pressed by the reinforcement or the block body to support the pressure After a certain degree, it can assume a predetermined shape, so that adjacent conductive elements will not bridge, so that the problem of electrical short circuit can be avoided.

1‧‧‧Semiconductor package

10‧‧‧Package substrate

11‧‧‧Semiconductor chip

11a, 21a‧‧‧action surface

11b, 21b‧‧‧non-acting surface

110,210‧‧‧ conductive bump

111,22‧‧‧ Primer

12‧‧‧TIM layer

13,2a,4a‧‧‧Cooling parts

130‧‧‧Top film

131,27,47‧‧‧support feet

14‧‧‧ Adhesive layer

15‧‧‧solder ball

2,3,4‧‧‧Electronic package

20‧‧‧Carrier

20a‧‧‧First surface

20b‧‧‧Second surface

20c‧‧‧Side

200,300‧‧‧Perforation

201,202‧‧‧ line layer

21‧‧‧Electronic components

23,33,43‧‧‧Reinforcement

23a, 33b ‧‧‧ end

24,34,44 ‧‧‧ plate

25‧‧‧Insulator

26‧‧‧Combination layer

28,48‧‧‧heat radiator

280‧‧‧thermal interface layer

29,29’‧‧‧conductive element

4b‧‧‧Integrated forming structure

9‧‧‧ circuit board

A‧‧‧Wiring area

B‧‧‧ open area

L‧‧‧Length

H‧‧‧ Height

FIG. 1 is a schematic cross-sectional view of a conventional semiconductor package.

2A to 2D are schematic cross-sectional views of the first embodiment of the manufacturing method of the electronic package of the present invention.

Figure 2A' is a schematic partial top view of Figure 2A.

3A to 3C are schematic cross-sectional views of a second embodiment of the method for manufacturing an electronic package of the present invention.

Figure 3A' is a schematic partial top view of Figure 3A.

Fig. 3A" is a schematic cross-sectional view of Fig. 3A' taken along section line P-P.

Figure 3B' is a schematic partial top view of Figure 3B.

Fig. 3B" is a schematic cross-sectional view of Fig. 3B' taken along section line P-P.

Fig. 3C' is a schematic cross-sectional view of Fig. 3C from another perspective.

FIG. 4A is a partially enlarged schematic cross-sectional view of another embodiment of FIG. 3C.

FIG. 4B is a schematic cross-sectional view of another embodiment of the manufacturing method of the electronic package of the present invention.

The following describes the implementation of the present invention by specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structure, ratio, size, etc. shown in the drawings of this specification are only used to match the content disclosed in the specification, for those who are familiar with this skill to understand and read, not to limit the implementation of the present invention The limited conditions do not have technical significance. Any modification of structure, change of proportional relationship or adjustment of size should still fall within the scope of the invention without affecting the efficacy and the purpose of the invention. The technical content disclosed by the invention can be covered. At the same time, the terms such as "upper", "first", "second" and "one" cited in this specification are only for the convenience of description, not to limit the scope of the invention, Changes or adjustments in the relative relationship are considered to be within the scope of the invention without substantial changes in the technical content.

2A to 2D are schematic cross-sectional views of the first embodiment of the manufacturing method of the electronic package of the present invention.

As shown in FIGS. 2A and 2A′, a carrier 20 provided with at least one electronic component 21 is provided, and the carrier 20 has a first surface 20a and a second surface 20b opposite to each other, and forms a plurality to communicate with the first Perforations 200 with the second surfaces 20a, 20b.

In this embodiment, the carrier 20 is, for example, a package substrate with a core layer and a circuit structure or a circuit structure without a core layer. The circuit layer 201, 202 is formed on the dielectric material, such as fan-out (fan out) type redistribution layer (RDL), to define a wiring area A on its first surface 20a (or second surface 20b) (in this embodiment, the first surface 20a is used as For illustration, the area where the circuit layer 201 is laid, such as the I/O contact) and the open area B (such as around the I/O contact). It should be understood that the carrier 20 may also be other carrier structures for supporting electronic components such as chips, such as silicon interposer, wafer, or other carriers with metal routing The board and the like are not limited to the above.

Furthermore, the electronic device 21 is an active device, a passive device, or a combination of the two. The active device is, for example, a semiconductor chip, and the passive device is, for example, a resistor, a capacitor, and an inductor. For example, in this embodiment, the electronic component 21 is a semiconductor chip, which has an opposing active surface 21a and a non-active surface 21b, and the active surface 21a is provided on the wiring by flip-chip (through the conductive bump 210) The area is electrically connected to the circuit layer 201, and the conductive bumps 210 are covered with a primer 22; or, the electronic component 21 can also be electrically connected to the circuit layer by wire bonding through a plurality of bonding wires (not shown) 201; or, the electronic component 21 may directly contact the circuit layer 201. However, the manner in which the electronic component 21 is electrically connected to the circuit layer 201 is not limited to the above.

Moreover, the perforation 200 is located at the edge of one of the surfaces of the carrier 20 (such as the first surface 20a or the second surface 20b) without connecting the edge, that is, the carrier 20 is more likely to generate stress concentration during the manufacturing process Area (such as open area B).

As shown in FIG. 2B, a plurality of reinforcing bodies 23 are inserted into the through hole 200 and protrude from the first surface 20 a of the carrier 20.

In this embodiment, the reinforcing body 23 is a column, and its end 23a protrudes from the first surface 20a of the carrier 20. For example, the reinforcing body 23 is first formed on a block body 24 to form A frame structure is formed, and then the plate body 24 is bonded to the second surface 20b of the carrier 20, so as to insert the reinforcing body 23 through the perforation 200. For example, the reinforcing body 23 and the plate body 24 are made of a metal material such as copper, and the two can be integrally formed or assembled by joining, so that the plate body 24 can be used for heat dissipation, and the reinforcing body 23 As a cooling foot.

Furthermore, the reinforcing body 23 is not electrically connected to the carrier 20 and the electronic component 21, and the block body 24 is also not electrically connected to the carrier 20 and the electronic component 21.

As shown in FIG. 2C, an insulator 25 is formed on the first surface 20b of the carrier 20 to cover the reinforcing body 23 and protrude from the end 23a of the carrier 20.

In this embodiment, the insulator 25 is a glue material to fix the reinforcement body 23 and the block body 24 on the carrier 20 and protect the end 23a of the reinforcement body 23 to avoid the manufacturing process Touch other conductors.

Furthermore, a bonding layer 26 such as glue can be formed on the first surface 20 b of the carrier 20, and a thermally conductive interface layer 280 can be formed on the non-active surface 21 b of the electronic component 21. For example, the thermal interface layer 280 is a TIM, such as a low temperature melting heat conductive material, which can be formed of solid metal or liquid metal (such as solder material).

As shown in FIG. 2D, a heat dissipating element 2a including a supporting leg 27 and a heat dissipating body 28 is coupled to the first surface 20a of the carrier 24 by the supporting leg 27 through the coupling layer 26, and the heat is dissipated The heat sink 28 of the component 2a is coupled to the electronic component 21 via the thermal interface layer 280.

In this embodiment, the plurality of support legs 27 are integrally formed on the heat sink 28; or, the plurality of support legs 27 can also be provided on the heat sink 28 in a joint manner.

Furthermore, a plurality of conductive elements 29 can be formed on the circuit layer 202 of the second surface 20b of the carrier 20 to produce the electronic package 2 of the present invention, and the conductive elements 29 can be reflowed in subsequent processes Set the electronic device as the circuit board 9. Specifically, the conductive element 29 is a metal block such as a copper block, a solder bump, or a tin ball with a copper core. For example, part of this conductive element The piece 29' may contact the block body 24 as needed for heat dissipation, rather than as a circuit. It should be understood that there are many types of the conductive element, which are not limited to the above.

In addition, the thermally conductive interface layer 280 may be formed on the heat dissipation body 28 first, and then the heat dissipation body 28 is bonded to the non-active surface 21b of the electronic component 21 with the thermally conductive interface layer 280. Similarly, the bonding layer 26 may be formed on the support leg 27 first, and then the support leg 27 is bonded to the first surface 20a of the carrier 24 through the bonding layer 26.

In addition, in order to improve the bonding strength between the TIM and the electronic component 21, the surface of the electronic component 21 may be coated with gold (so-called Coating Gold On Chip Back). Specifically, a gold layer is formed on the non-active surface 21b of the electronic component 21 and the surface of the heat sink 28, and further flux is added to facilitate the thermal interface layer 280 to adhere to the gold layer.

Therefore, the electronic package 2 formed by the manufacturing method of the present invention is mainly disposed in the open area B of the carrier 20 through the reinforcement body 23 to disperse the stress during the thermal cycle so that the stress will not be concentrated In the open area B of the carrier 20, compared with the conventional technology, the manufacturing method of the present invention can avoid the separation of the electronic component 21 and the carrier 20, that is, to avoid the problem of delamination, so the electronic component 21 It can be effectively electrically connected to the circuit board 9 or the electronic package 2 can pass the reliability test to improve the yield of the product.

Furthermore, as the size of the electronic package 2 increases, the weight also increases, so when the conductive element 29 is reflowed to make the conductive element 29 in a molten state, the plate body 24 supports the downward pressure After the conductive elements 29 are pressed to a certain degree (that is, when the block body 24 abuts the circuit board 9), they can assume a predetermined shape, so that the adjacent conductive elements 29 will not cause a bridge (Ball bridge) phenomenon, Therefore, the problem of electrical short circuit can be avoided.

3A to 3C are schematic cross-sectional views of the second embodiment of the method for manufacturing the electronic package 3 of the present invention. The difference between this embodiment and the first embodiment lies in the configuration of the reinforcement body and the block body. The other processes are approximately the same, so the following will not repeat the similarities.

As shown in FIGS. 3A and 3A, a carrier 20 provided with at least one electronic component 21 is provided, and the carrier 20 has a first surface 20a and a second surface 20b opposite to each other, and forms a plurality to communicate with the first Perforations 300 with the second surfaces 20a, 20b.

In this embodiment, as shown in FIG. 3A', the perforation 300 is located on the side 20c of the carrier 20 (where stress concentration is more likely to occur) to form a notch.

Furthermore, the angle of view of FIG. 3A is viewed from the side 20c direction of the carrier 20 of FIG. 3A' (as indicated by the direction of the arrow shown in FIG. 3A', that is, left or right). It is a schematic cross-sectional view taken along section line PP of FIG. 3A′.

As shown in FIGS. 3B, 3B′ and 3B”, a plurality of metal reinforcements 33 are inserted into the through holes 300, and the end 33b of the reinforcement 33 protrudes from the second surface 20b of the carrier 20, and the The block body 34 is bonded to the first surface 20 a of the carrier 20 to cover the through hole 300.

In this embodiment, the viewing angle of FIG. 3B is viewed from the side 20c direction of the carrier 20 of FIG. 3B' (as shown by the arrow direction in FIG. 3B', that is, left or right), 3B The figure is a schematic cross-sectional view of the 3B' figure along the section line PP.

As shown in FIG. 3C, a heat dissipating element 2a with its supporting legs 27 is bonded to the block body 34 through the bonding layer 26, and the heat dissipating element 28 of the heat dissipating element 2a is bonded to the electronic component through the thermal interface layer 280 twenty one.

In this embodiment, a plurality of conductive elements 29 may be formed on the second surface 20b of the carrier 20 to reflow the conductive elements 29 in the subsequent manufacturing process to connect an electronic device such as the circuit board 9. For example, the end 33b of the reinforcing body 33 protruding from the carrier 20 is located between the conductive elements 29, so that the reinforcing body 33 does not contact the conductive elements 29. Further, as shown in FIG. 4, the reinforcing member 33 projecting length of the end portion 33b of the L-line of the carrier for the conductive element 20 of height H _{^{2/3 (L = 2/3 H}} ) 29 of.

Furthermore, it should be understood that an insulator 25 may be formed to cover the reinforcement 33 to protrude from the end 33b of the carrier 20.

Therefore, the electronic package 3 formed by the manufacturing method of the present invention is mainly disposed in the open area B of the carrier 20 through the reinforcement body 33 to disperse the stress during the thermal cycle so that the stress will not be concentrated In the open area B of the carrier 20, compared with the conventional technology, the manufacturing method of the present invention can avoid the separation of the electronic component 21 from the carrier 20, that is, to avoid the problem of delamination, so the electronic component 21 It can be effectively electrically connected to the circuit board 9 or the electronic package 3 can pass the reliability test to improve the yield of the product.

Furthermore, when the size of the electronic package 3 increases, the weight also increases. Therefore, when the conductive element 29 is reflowed to make the conductive element 29 in a molten state, the end 33b of the reinforcing body 33 After supporting the pressure, the conductive elements 29 can be compressed to a certain degree (that is, when the end 33b of the reinforcing body 33 abuts against the circuit board 9) can assume a predetermined shape, so that adjacent conductive elements 29 will not A bridge phenomenon occurs, so that the problem of electrical short circuit can be avoided.

Furthermore, as in the electronic package 4 shown in FIG. 4B, the heat sink 4a, the metal reinforcement 33 and the block body 34 can be integrally formed. For example, the support leg 47, the heat sink 48, the metal reinforcement 43 and the block body 44 are an integrally formed structure 4b, which is inserted into the through hole 300 by the metal reinforcement 43 to position the integrally formed structure 4b Therefore, it not only simplifies the manufacturing process (no need to arrange the metal reinforcement 33 and the plate body 34 and the heat sink 4a in sequence), but also omits the use of the bonding layer 26 to reduce the manufacturing cost.

The present invention further provides an electronic package 2, 3, 4, which includes: a carrier 20 having at least one perforation 200, 300, and at least one mounted on the carrier 20 and electrically connected to the carrier The electronic component 21 of the component 20 and at least one reinforcing body 23, 33, 43 disposed in the through hole 200, 300 and protruding from the carrier 20.

The reinforced bodies 23, 33, 43 are not electrically connected to the carrier 20 and the electronic component 21.

In an embodiment, the carrier 20 has a first surface 20a and a second surface 20b opposite to each other, so that the electronic component 21 is disposed on the first surface 20a of the carrier 20, and the reinforcing body 23 protrudes from the The first surface 20a of the carrier 20 is flush with (or not protruding) the second surface 20b. It further includes at least one plate body 24 disposed on the second surface 20b of the carrier 20, which is connected to the reinforcing body 23 but is not electrically connected to the carrier 20 and the electronic component 21.

In one embodiment, the carrier 20 has a first surface 20a and a second surface 20b opposite to each other, so that the electronic component 21 is disposed on the first surface 20a of the carrier 20, and the reinforcing bodies 33, 43 are convex The second surface 20b of the carrier 20 is flush with (or not protruding) the first surface 20a. It further includes at least one plate body 34, 44 disposed on the first surface 20a of the carrier 20, which is connected to the reinforcing bodies 33, 44 without electrically connecting the carrier 20 and the electronic component 21.

In an embodiment, the first surface 20a of the carrier 20 defines a wiring area A and an open area B adjacent to the wiring area A, so that the electronic component 21 is disposed in the wiring area A, and the reinforcement 23 The 33 series is arranged in the open area B.

In one embodiment, the through hole 300 is a gap formed on the side 20c of the carrier 20.

In one embodiment, the electronic package 2 includes at least one insulator 25 formed on the carrier 20 to cover the reinforcement 23, 33 and protrude from the carrier 20 (such as the ends 23a, 33b) ).

In one embodiment, the electronic packages 2, 3, and 4 include heat dissipation elements 2a, 4a provided on the carrier 20.

In one embodiment, the electronic packages 2, 3, and 4 include a plurality of conductive elements 29 formed on the carrier 20 to electrically connect the carrier 20.

The present invention also provides a bearing structure including: a bearing member 20 having at least one perforation 200,300, and at least one reinforcement 23,33,43 disposed in the perforation 200,300 and protruding from the bearing member 20, wherein the The reinforcing bodies 23, 33, 43 are not electrically connected to the carrier 20.

In one embodiment, the load-bearing structure includes at least one plate body 24,34,44 provided on the carrier 20, which is connected to the reinforcement body 23,33,44, and the plate body 24,34,44 is not Electrically connected to the carrier 20.

In one embodiment, the through hole 300 is a gap formed on the side 20c of the carrier 20.

In one embodiment, the carrying structure further includes at least one insulator 25 formed on the carrying member 20 to cover the portion of the reinforcing body 23, 33, 43 that protrudes from the carrying member 20 (such as the end 23a).

In one embodiment, the carrier structure includes a plurality of conductive elements 29 formed on the carrier 20 to electrically connect the carrier 20.

In summary, the electronic package of the present invention, its manufacturing method and the supporting structure are designed to disperse the stress by the design of the reinforcement body, so the present invention can avoid the separation of the electronic component and the supporting component, so the electronic component can The electrical connection to the circuit board or the electronic package can pass the reliability test.

Furthermore, as the size of the electronic package increases, the weight also increases, so when the conductive element is in a molten state, the conductive element is pressed by the reinforcement or the block body to support the pressure After a certain degree, it can assume a predetermined shape, so that adjacent conductive elements will not be bridged, so that the problem of electrical short circuit can be avoided.

The above embodiments are used to exemplify the principles and effects of the present invention, rather than to limit the present invention. Anyone who is familiar with this skill can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be as listed in the scope of patent application mentioned later.

2‧‧‧Electronic package

2a‧‧‧Cooling parts

20‧‧‧Carrier

20a‧‧‧First surface

20b‧‧‧Second surface

200‧‧‧Perforation

202‧‧‧ Line layer

21‧‧‧Electronic components

23‧‧‧Reinforcement

24‧‧‧Plate

25‧‧‧Insulator

26‧‧‧Combination layer

27‧‧‧Support feet

28‧‧‧heat radiator

280‧‧‧thermal interface layer

29,29’‧‧‧conductive element

9‧‧‧ circuit board

Claims (22)

An electronic package includes: a carrier, which has opposite first and second surfaces, and at least one perforation; an electronic component, which is provided on the first surface of the carrier and electrically connected to the carrier ; The plate body is coupled to the second surface of the carrier, wherein the plate body is used for heat dissipation; and the reinforcement is provided in the through hole and protrudes the first surface of the carrier, and the reinforcement The block body is connected, wherein the reinforcement body is not electrically connected to the carrier and the electronic component, and the reinforcement body serves as a heat dissipation foot. The electronic package as described in item 1 of the patent application scope, wherein the board body is not electrically connected to the carrier and the electronic component. The electronic package as described in item 1 of the patent application scope, wherein the surface of the carrier defines a wiring area and an open area adjacent to the wiring area, so that the electronic component is arranged in the wiring area, and the reinforcement Configured in this open area. The electronic package as described in item 1 of the patent application range, wherein the perforation is located at an edge of one of the surfaces of the carrier without connecting the edge. The electronic package as described in item 1 of the patent application range, wherein the perforation is a notch formed on the side of the carrier. The electronic package described in item 1 of the scope of the patent application includes an insulator formed on the carrier to cover the portion of the reinforcement that protrudes from the carrier. The electronic package described in item 1 of the scope of patent application includes a heat sink provided on the carrier. The electronic package described in item 1 of the patent application scope includes a plurality of conductive elements formed on the carrier to electrically connect the carrier. A method for manufacturing an electronic package includes: providing a carrier having opposite first and second surfaces and having at least one perforation; placing at least one electronic component on the first surface of the carrier and electrically connecting The carrier; bonding the block body to the second surface of the carrier, wherein the block body is not electrically connected to the carrier and the electronic component, and the block body is used for heat dissipation; and forming a reinforcement body at the perforation The reinforcement body protrudes from the first surface of the carrier, and the reinforcement body is connected to the block body, wherein the reinforcement body is not electrically connected to the carrier and the electronic component, and the reinforcement body serves as a heat dissipation foot . The method for manufacturing an electronic package as described in item 9 of the patent application scope, wherein the board body is not electrically connected to the carrier and the electronic component. The method of manufacturing an electronic package as described in item 9 of the patent application scope, wherein the surface of the carrier defines a wiring area and an open area adjacent to the wiring area, so that the electronic component is arranged in the wiring area, and the The reinforcement is arranged in the open area. The method for manufacturing an electronic package as described in item 9 of the patent application scope, wherein the perforation is located at an edge of one surface of the carrier without connecting the edge. The method for manufacturing an electronic package as described in item 9 of the patent scope, wherein the perforation is a notch formed on the side of the carrier. The method for manufacturing an electronic package as described in item 9 of the patent application scope includes forming an insulator on the carrier to cover the portion of the reinforcement that protrudes from the carrier. The method of manufacturing an electronic package as described in item 9 of the scope of patent application includes the provision of a heat sink on the carrier. According to the method of manufacturing an electronic package described in item 9 of the patent application scope, the method includes forming a plurality of conductive elements on the carrier to electrically connect the carrier. A bearing structure includes: a bearing member having at least one perforation; and a plate body coupled to the surface of the bearing member, wherein the plate body is used for heat dissipation; a reinforcement body is provided in the perforation and is convex The carrier is provided, and the reinforced body is connected to the block body, wherein the reinforced body is not electrically connected to the carrier, and the reinforced body serves as a heat dissipation foot. The load-bearing structure as described in item 17 of the patent application scope, wherein the plate body is not electrically connected to the load-bearing member. The load-bearing structure as recited in item 17 of the patent application range, wherein the perforation is located at an edge of one of the surfaces of the carrier without connecting the edge. The load-bearing structure as described in item 17 of the patent application range, wherein the perforation is a notch formed on the side of the carrier. The load-bearing structure as described in item 17 of the scope of the patent application includes an insulator formed on the load-bearing member to cover the portion of the reinforcement body that protrudes from the load-bearing member. As described in Item 17 of the patent application scope, the bearing structure includes a plurality of conductive elements formed on the bearing member to electrically connect the bearing member.

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