TW202040760A - Electronic package and manufacturing method thereof and carrier structure - Google Patents

Abstract

This invention provides an electronic package comprising a carrier having at least a through hole; an electronic component disposed on and electrically connected to the carrier; and a reinforcing body disposed in the through hole and protrudes from the carrier, wherein the reinforcing body is not electrically connected to the carrier and the electronic component to effectively disperse thermal stress by the reinforcing body, thereby avoiding separation of the electronic component and the carrier.

Description

Electronic package and its manufacturing method and carrying structure

The invention relates to a packaging structure, in particular to an electronic packaging component and its manufacturing method and carrying structure.

With the increase in the function and processing speed of electronic products, the semiconductor chip as the core component of the electronic product needs to have higher density of electronic components (Electronic Components) and electronic circuits (Electronic Circuits), so the semiconductor chip will A larger amount of heat energy is generated accordingly, and the encapsulant system covering the semiconductor chip is a poor heat transfer material with a thermal conductivity of only 0.8Wm-1k-1 (that is, the heat dissipation efficiency is not good), so if it cannot effectively escape The heat generated by the dissipation will cause damage to the semiconductor chip or product reliability problems.

Therefore, in order to quickly dissipate heat into the atmosphere, the industry usually configures a heat sink (Heat Sink or Heat Spreader) in the semiconductor package structure. The heat sink is generally made of heat-dissipating glue, such as a thermal interface material (Thermal Interface Material, for short). TIM), bonded to the back of the semiconductor chip to dissipate the heat generated by the semiconductor chip through the heat sink and the heat sink. Furthermore, it is usually better to expose the top surface of the heat sink to the packaging compound or directly exposed to the atmosphere. Achieve better heat dissipation effect.

The conventional TIM layer is a low-temperature melting heat conductive material (such as solder material), which is provided between the backside of the semiconductor chip and the heat sink.

As shown in Figure 1, the conventional method for manufacturing a semiconductor package 1 is to first place a semiconductor chip 11 with its active surface 11a on a package substrate 10 by flip chip bonding (ie through conductive bumps 110 and primer 111). Then, a heat sink 13 is reflow-bonded to the non-acting surface 11b of the semiconductor chip 11 with its top sheet 130 through the TIM layer 12 (which includes a solder layer and flux), and the supporting legs of the heat sink 13 131 is mounted on the packaging substrate 10 via the adhesive layer 14. Then, a packaging press molding operation is performed to provide a packaging compound (not shown in the figure) to cover the semiconductor chip 11 and the heat sink 13, and to expose the packaging compound to the top plate 130 of the heat sink 13 to directly contact the atmosphere. After that, the semiconductor package 1 and its package substrate 10 are connected to a circuit board 9 through a plurality of solder balls 15.

During operation, the heat generated by the semiconductor chip 11 is conducted to the top sheet 130 of the heat sink 13 via the inactive surface 11b and the TIM layer 12 to dissipate heat to the outside of the semiconductor package 1.

However, in the conventional semiconductor package 1, the solder balls 15 are located in the wiring area of the package substrate 10. Therefore, during a thermal cycle, stress will be concentrated on the non-wiring area of the package substrate 10, causing the The package substrate 10 is warped, which causes the semiconductor chip 11 to separate from the package substrate 10, that is, a delamination problem occurs, and the semiconductor chip 11 cannot be effectively electrically connected to the circuit board 9 or the semiconductor package 1 cannot be electrically connected. Passing the reliability test resulted in poor product yield.

Moreover, when the size of the semiconductor package 1 increases, the weight also increases. Therefore, when the solder balls 15 are reflowed to make the solder balls 15 in a molten state, the solder balls 15 cannot bear the weight. The weight of the upper component will be squashed and deformed (as shown by the dashed line in Figure 1), causing the adjacent solder balls 15 to easily undergo a ball bridge phenomenon and cause electrical short circuits.

Therefore, how to overcome the above-mentioned problems of the conventional technology has actually become a problem that the industry urgently needs to overcome.

In view of the various deficiencies of the aforementioned conventional technologies, the present invention provides an electronic package, which includes: a carrier having at least one through hole; an electronic component disposed on the carrier and electrically connected to the carrier; and a reinforcement body , Which is arranged in the through hole and protrudes from the carrier, wherein the reinforcing body is not electrically connected to the carrier and the electronic component.

The present invention also provides a method for manufacturing an electronic package, which includes: providing a carrier with at least one perforation; and arranging an electronic component on the carrier, and electrically connecting the electronic component to the carrier, and forming a strengthening body In the perforation, the reinforcement body is made to protrude from the carrier, wherein the reinforcement body is not electrically connected to the carrier and the electronic element.

In the aforementioned electronic package and its manufacturing method, the carrier has a first surface and a second surface opposite to each other, so that the electronic component is arranged on the first surface of the carrier, and the reinforcement protrudes from the carrier The first surface. For example, the compound includes arranging a plate body on the second surface of the carrier, and the plate body is connected to the reinforcing body but not electrically connected to the carrier and the electronic component.

In the aforementioned electronic package and its manufacturing method, the carrier has a first surface and a second surface opposite to each other, so that the electronic component is arranged on the first surface of the carrier, and the reinforcement protrudes from the carrier The second surface. For example, the compound includes arranging a plate body on the first surface of the carrier, and the plate body is connected to the reinforcing body but not electrically connected to the carrier and the electronic component.

In the aforementioned electronic package and its manufacturing method, the surface of the carrier is defined with a wiring area and an open area adjacent to the wiring area, so that the electronic component is arranged in the wiring area and the reinforcement system is arranged in the open area.

In the aforementioned electronic package and its manufacturing method, the perforation is located at the edge of one of the surfaces of the carrier without connecting the edge.

In the aforementioned electronic package and its manufacturing method, the perforation is a notch formed on the side of the carrier.

The aforementioned electronic package and its manufacturing method further include forming an insulator on the carrier to cover the part of the reinforcing body protruding from the carrier.

In the aforementioned electronic package and its manufacturing method, it further includes disposing a heat sink on the carrier.

In the aforementioned electronic package and the manufacturing method thereof, a plurality of conductive elements are formed on the carrier and electrically connected to the carrier.

The present invention also provides a bearing structure, which includes: a bearing member having at least one through hole; and a reinforcement body disposed in the through hole and protruding from the bearing member, wherein the reinforcement body is not electrically connected to the bearing member.

The aforementioned bearing structure further includes a plate body provided on the bearing member, which is connected to the reinforcing body, and the plate body is not electrically connected to the bearing member.

In the aforementioned bearing structure, the perforation is located at the edge of one of the surfaces of the bearing member and is not connected to the edge.

In the aforementioned bearing structure, the perforation is a notch formed on the side of the bearing member.

The aforementioned bearing structure further includes an insulator formed on the bearing member to cover the part of the reinforcing body protruding from the bearing member.

The aforementioned supporting structure further includes a plurality of conductive elements formed on the supporting member to electrically connect the supporting member.

It can be seen from the above that, in the electronic package and its manufacturing method and bearing structure of the present invention, the strengthening body is designed to pass through the bearing member to effectively disperse thermal stress. Therefore, compared with the conventional technology, the present invention can avoid The electronic component is separated from the carrier, so the electronic component can be effectively and electrically connected to the circuit board or the electronic package can pass the reliability test.

Furthermore, when the size of the electronic package increases, the weight also increases. Therefore, when the conductive element is in a molten state, the reinforcing body or the plate body supports the downward pressure to make the conductive elements under pressure. To a certain extent, it can assume a predetermined shape, so that adjacent conductive elements will not be bridged, and thus the problem of electrical short circuit can be avoided.

1‧‧‧Semiconductor package

10‧‧‧Packaging substrate

11‧‧‧Semiconductor chip

11a,21a‧‧‧action surface

11b,21b‧‧‧Non-acting surface

110,210‧‧‧Conductive bump

111,22‧‧‧ Primer

12‧‧‧TIM layer

13,2a,4a‧‧‧heat sink

130‧‧‧Top Film

131,27,47‧‧‧Supporting feet

14‧‧‧Adhesive layer

15‧‧‧Solder ball

2,3,4‧‧‧Electronic package

20‧‧‧Carrier

20a‧‧‧First surface

20b‧‧‧Second surface

20c‧‧‧ side

200,300‧‧‧Perforation

201,202‧‧‧Line layer

21‧‧‧Electronic components

23,33,43‧‧‧Strengthening body

23a, 33b‧‧‧end

24,34,44‧‧‧plate body

25‧‧‧Insulator

26‧‧‧Combination layer

28,48‧‧‧Radiator

280‧‧‧ Thermal Interface Layer

29,29’‧‧‧Conductive element

4b‧‧‧One piece structure

9‧‧‧Circuit board

A‧‧‧Wiring area

B‧‧‧Open area

L‧‧‧length

H‧‧‧Height

Figure 1 is a schematic cross-sectional view of a conventional semiconductor package.

2A to 2D are schematic cross-sectional views of the first embodiment of the manufacturing method of the electronic package of the present invention.

Figure 2A' is a schematic partial top view of Figure 2A.

3A to 3C are schematic cross-sectional views of the second embodiment of the manufacturing method of the electronic package of the present invention.

Figure 3A' is a schematic partial top view of Figure 3A.

Figure 3A" is a schematic cross-sectional view of Figure 3A' along the section line P-P.

Figure 3B' is a schematic partial top view of Figure 3B.

Figure 3B" is a schematic cross-sectional view of Figure 3B' along the section line P-P.

Figure 3C' is a schematic cross-sectional view of Figure 3C from another perspective.

Fig. 4A is a schematic partial enlarged cross-sectional view of another embodiment of Fig. 3C.

4B is a schematic cross-sectional view of other embodiments of the manufacturing method of the electronic package of the present invention.

The following specific examples illustrate the implementation of the present invention. Those familiar with the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this manual are only used to match the contents disclosed in the manual for the understanding and reading of those familiar with the art, and are not intended to limit the implementation of the present invention Therefore, it does not have any technical significance. Any structural modification, proportional relationship change, or size adjustment should still fall within the scope of the present invention without affecting the effects and objectives that can be achieved. The technical content disclosed by the invention can be covered. At the same time, the terms "on", "first", "second" and "one" cited in this specification are only for ease of description and are not used to limit the scope of the present invention. The change or adjustment of the relative relationship shall be regarded as the scope of the implementation of the present invention without substantial change in the technical content.

2A to 2D are schematic cross-sectional views of the first embodiment of the manufacturing method of the electronic package of the present invention.

As shown in Figures 2A and 2A', there is provided a carrier 20 on which at least one electronic component 21 is arranged, and the carrier 20 has a first surface 20a and a second surface 20b opposite to each other, and forms a plurality of connections to the first And the second surface 20a, 20b of the perforation 200.

In this embodiment, the carrier 20 is, for example, a package substrate with a core layer and a circuit structure or a coreless circuit structure, which forms circuit layers 201, 202 on a dielectric material, such as fan-out A (fan out) type redistribution layer (RDL) is used to define a wiring area A on its first surface 20a (or second surface 20b) (in this embodiment, the first surface 20a is used as For illustration, the area of the circuit layer 201, such as the I/O contact point, and the open area B (such as around the I/O contact point) are arranged. It should be understood that the carrier 20 can also be other carrier structures capable of carrying electronic components such as chips, such as silicon interposers, wafers, or other carriers with metal routing. The board etc. are not limited to the above.

Furthermore, the electronic component 21 is an active component, a passive component, or a combination of the two, etc., wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor. For example, in this embodiment, the electronic component 21 is a semiconductor chip, which has an active surface 21a and a non-active surface 21b opposite to each other, and the active surface 21a is provided on the wiring by flip chip method (through conductive bumps 210). The area is electrically connected to the circuit layer 201, and the conductive bumps 210 are covered with the primer 22; alternatively, the electronic component 21 can also be electrically connected to the circuit layer by wire bonding by a plurality of bonding wires (not shown) 201; Or, the electronic component 21 can directly contact the circuit layer 201. However, the manner in which the electronic component 21 is electrically connected to the circuit layer 201 is not limited to the above.

In addition, the perforation 200 is located at the edge of one of the surfaces of the carrier 20 (such as the first surface 20a or the second surface 20b) without connecting to the edge, that is, it is located on the carrier 20 which is more likely to cause stress concentration during the manufacturing process. Area (such as open area B).

As shown in FIG. 2B, a plurality of reinforcing bodies 23 are inserted into the through hole 200 and protrude from the first surface 20 a of the carrier 20.

In this embodiment, the reinforcing body 23 is a column, and its end 23a protrudes from the first surface 20a of the carrier 20. For example, first form the reinforcing body 23 on a block body 24 to shape After forming a frame structure, the block body 24 is bonded to the second surface 20b of the supporting member 20, so that the reinforcing body 23 is inserted through the through hole 200 according to the situation. For example, the reinforcing body 23 and the plate body 24 are made of a metal material such as copper, and the two can be integrally formed or assembled in a joint manner, so that the plate body 24 can be used for heat dissipation, and the reinforcing body 23 As a heat sink.

Furthermore, the reinforcing body 23 is not electrically connected to the carrier 20 and the electronic component 21, and the plate body 24 is also not electrically connected to the carrier 20 and the electronic component 21.

As shown in FIG. 2C, an insulator 25 is formed on the first surface 20b of the supporting member 20 to cover the reinforcing body 23 to protrude from the end 23a of the supporting member 20.

In this embodiment, the insulator 25 is made of glue, so that the reinforcement body 23 and the plate body 24 are fixed on the carrier 20, and the end 23a of the reinforcement body 23 can be protected to avoid being in the manufacturing process. Touch other conductors.

Furthermore, a bonding layer 26 such as glue can be formed on the first surface 20b of the carrier 20, and a thermally conductive interface layer 280 can be formed on the non-acting surface 21b of the electronic component 21. For example, the thermally conductive interface layer 280 is a TIM, such as a low-temperature melting heat conductive material, which can be formed of solid metal or liquid metal (such as solder material).

As shown in FIG. 2D, a heat sink 2a including a supporting leg 27 and a heat sink 28 is bonded to the first surface 20a of the carrier 24 with its supporting leg 27 through the bonding layer 26, and the heat dissipation The heat sink 28 of the component 2a is combined with the electronic component 21 through the thermal interface layer 280.

In this embodiment, the plurality of supporting legs 27 are integrally formed on the heat sink 28; alternatively, the plurality of supporting legs 27 can also be arranged on the heat sink 28 in a joint manner.

Furthermore, a plurality of conductive elements 29 can be formed on the circuit layer 202 of the second surface 20b of the carrier 20 to produce the electronic package 2 of the present invention, and the conductive elements 29 can be reflowed and connected in the subsequent process. Set an electronic device like a circuit board 9. Specifically, the conductive element 29 is a metal block such as a copper block, a solder bump, or a tin ball with a copper core. For example, part of the conductive element The component 29' can contact the plate body 24 as required for heat dissipation, rather than as a circuit. It should be understood that there are many types of the conductive elements, which are not limited to the above.

In addition, the thermally conductive interface layer 280 can also be formed on the heat sink 28 first, and then the thermally conductive interface layer 280 is used to bond the heat sink 28 to the non-active surface 21b of the electronic component 21. Similarly, the bonding layer 26 can also be formed on the supporting leg 27 first, and then the supporting leg 27 is bonded to the first surface 20 a of the carrier 24 through the bonding layer 26.

In addition, in order to improve the bonding strength between the TIM and the electronic component 21, gold can be coated on the surface of the electronic component 21 (the so-called Coating Gold On Chip Back). Specifically, a gold layer is formed on the non-acting surface 21b of the electronic component 21 and the surface of the heat sink 28, and flux is further added to facilitate the thermal interface layer 280 to adhere to the gold layer.

Therefore, in the electronic package 2 formed by the manufacturing method of the present invention, the reinforcing body 23 is mainly arranged in the open area B of the carrier 20 to disperse the stress during the thermal cycle, so that the stress will not be concentrated. In the open area B of the carrier 20, compared with the prior art, the manufacturing method of the present invention can prevent the electronic component 21 from being separated from the carrier 20, that is, avoid the problem of delaminating, so the electronic component 21 It can be effectively and electrically connected to the circuit board 9 or the electronic package 2 can pass the reliability test to improve the yield of the product.

Furthermore, when the size of the electronic package 2 increases, the weight also increases. Therefore, when the conductive element 29 is reflowed to make the conductive element 29 in a molten state, the plate body 24 supports the downward pressure After the conductive elements 29 are pressed to a certain degree (that is, when the plate body 24 abuts against the circuit board 9), they can assume a predetermined shape, so that the adjacent conductive elements 29 will not be bridged. Therefore, the problem of electrical short circuit can be avoided.

3A to 3C are schematic cross-sectional views of the second embodiment of the manufacturing method of the electronic package 3 of the present invention. The difference between this embodiment and the first embodiment lies in the configuration of the reinforcement body and the plate body, and the other manufacturing processes are substantially the same, so the same points will not be repeated in the following.

As shown in Figures 3A and 3A", a carrier 20 is provided with at least one electronic component 21, and the carrier 20 has a first surface 20a and a second surface 20b opposite to each other, and forms a plurality of connections to the first And the second surface 20a, 20b of the through hole 300.

In this embodiment, as shown in FIG. 3A', the through hole 300 is located on the side surface 20c of the carrier 20 (where stress concentration is likely to occur) to form a notch.

Furthermore, the angle of view in Figure 3A is viewed from the side 20c of the carrier 20 in Figure 3A' (as shown in the arrow direction in Figure 3A', that is, left or right), and Figure 3A" is It is a schematic cross-sectional view of Fig. 3A' along the section line PP.

As shown in Figures 3B, 3B' and 3B", a plurality of metal reinforcements 33 are inserted into the through holes 300, and the end 33b of the reinforcement 33 protrudes from the second surface 20b of the carrier 20, and the The plate body 34 is coupled to the first surface 20 a of the carrier 20 to cover the through hole 300.

In this embodiment, the angle of view in Figure 3B is viewed from the side 20c of the carrier 20 in Figure 3B' (as shown in the arrow direction in Figure 3B', that is, left or right). "Figure is a schematic cross-sectional view of Figure 3B' along section line PP.

As shown in FIG. 3C, a heat sink 2a with its supporting legs 27 is joined to the plate body 34 through a bonding layer 26, and the heat sink 28 of the heat sink 2a is combined with the electronic component through a thermal interface layer 280 twenty one.

In this embodiment, a plurality of conductive elements 29 may be formed on the second surface 20b of the carrier 20, so that the conductive elements 29 can be re-soldered in the subsequent process to connect to an electronic device such as the circuit board 9. For example, the end 33b of the reinforcing body 33 protruding from the carrier 20 is located between the conductive elements 29 so that the reinforcing body 33 will not contact the conductive elements 29. Further, as shown in FIG. 4, the reinforcing member 33 projecting length of the end portion 33b of the L-line of the carrier for the conductive element 20 of height H _{^{2/3 (L = 2/3 H}} ) 29 of.

Furthermore, it should be understood that an insulator 25 can also be formed to cover the reinforcing body 33 to protrude from the end 33b of the carrier 20.

Therefore, in the electronic package 3 formed by the manufacturing method of the present invention, the reinforcing body 33 is mainly arranged in the open area B of the carrier 20 to disperse the stress during the thermal cycle so that the stress will not be concentrated In the open area B of the carrier 20, compared with the prior art, the manufacturing method of the present invention can prevent the electronic component 21 from being separated from the carrier 20, that is, avoid the problem of delaminating, so the electronic component 21 It can be effectively and electrically connected to the circuit board 9 or the electronic package 3 can pass the reliability test to improve the yield of the product.

Furthermore, when the size of the electronic package 3 increases, the weight also increases. Therefore, when the conductive element 29 is reflowed to make the conductive element 29 in a molten state, the end 33b of the reinforcing body 33 Supporting the pressure, so that the conductive elements 29 are pressed to a certain extent (that is, when the end 33b of the reinforcing body 33 abuts the circuit board 9), they can assume a predetermined shape, so that the adjacent conductive elements 29 will not A ball bridge phenomenon occurs, so the problem of electrical short circuit can be avoided.

Moreover, as for the electronic package 4 shown in FIG. 4B, the heat sink 4a, the metal reinforcement 33 and the block body 34 can be integrally formed. For example, the supporting legs 47, the heat sink 48, the metal reinforcement 43, and the slab body 44 are formed as an integral structure 4b, and the metal reinforcement 43 is inserted into the perforation 300 to position the integral structure 4b. Therefore, not only can the manufacturing process be simplified (the metal reinforcement 33, the plate body 34 and the heat sink 4a need not be arranged in sequence), but the use of the bonding layer 26 can be omitted to reduce the manufacturing cost.

The present invention further provides an electronic package 2, 3, 4, which includes: a carrier 20 with at least one through hole 200, 300, at least one disposed on the carrier 20 and electrically connected to the carrier The electronic component 21 of the component 20 and at least one reinforcement body 23, 33, 43 disposed in the through hole 200, 300 and protruding from the carrier 20.

The reinforcing bodies 23, 33, and 43 are not electrically connected to the carrier 20 and the electronic component 21.

In one embodiment, the carrier 20 has a first surface 20a and a second surface 20b opposite to each other, so that the electronic component 21 is disposed on the first surface 20a of the carrier 20, and the reinforcing body 23 protrudes from the The first surface 20a of the supporting member 20 is flush with (or not protruding) the second surface 20b. It also includes at least one plate body 24 arranged on the second surface 20 b of the carrier 20, which is connected to the reinforcing body 23 without being electrically connected to the carrier 20 and the electronic component 21.

In one embodiment, the carrier 20 has a first surface 20a and a second surface 20b opposite to each other, so that the electronic component 21 is disposed on the first surface 20a of the carrier 20, and the reinforcing bodies 33, 43 are convex The second surface 20b of the carrier 20 is flush with (or not protruding) the first surface 20a. It also includes at least one plate body 34, 44 disposed on the first surface 20a of the carrier 20, which is connected to the reinforcing body 33, 44 without electrically connecting the carrier 20 and the electronic component 21.

In one embodiment, the first surface 20a of the carrier 20 defines a wiring area A and an open area B adjacent to the wiring area A, so that the electronic component 21 is disposed in the wiring area A, and the reinforcing body 23 , 33 series are arranged in the open area B.

In one embodiment, the through hole 300 is a notch formed on the side surface 20 c of the carrier 20.

In one embodiment, the electronic package 2 further includes at least one insulator 25 formed on the carrier 20 to cover a portion of the reinforcing body 23, 33 protruding from the carrier 20 (such as end portions 23a, 33b) ).

In one embodiment, the electronic package 2, 3, and 4 include heat sinks 2 a and 4 a on the carrier 20.

In one embodiment, the electronic package 2, 3, and 4 include a plurality of conductive elements 29 formed on the carrier 20 to electrically connect the carrier 20.

The present invention also provides a bearing structure, comprising: a bearing member 20 having at least one perforation 200, 300, and at least one reinforcement body 23, 33, 43 disposed in the perforation 200, 300 and protruding from the bearing member 20, wherein the The reinforcing bodies 23, 33, 43 are not electrically connected to the carrier 20.

In one embodiment, the load-bearing structure further includes at least one plate body 24, 34, 44 provided on the load-bearing member 20, which is connected to the reinforcing body 23, 33, 44, and the plate body 24, 34, 44 is not The carrier 20 is electrically connected.

In one embodiment, the through hole 300 is a notch formed on the side surface 20 c of the carrier 20.

In one embodiment, the supporting structure further includes at least one insulator 25 formed on the supporting member 20 to cover a portion of the reinforcing body 23, 33, 43 protruding from the supporting member 20 (such as an end 23a).

In one embodiment, the supporting structure further includes a plurality of conductive elements 29 formed on the supporting member 20 to be electrically connected to the supporting member 20.

In summary, the electronic package and its manufacturing method and carrying structure of the present invention are designed to disperse stress through the design of the reinforcing body. Therefore, the present invention can prevent the electronic component from being separated from the carrier, so that the electronic component can The effective electrical connection to the circuit board or the electronic package can pass the reliability test.

Furthermore, when the size of the electronic package increases, the weight also increases. Therefore, when the conductive element is in a molten state, the reinforcing body or the plate body supports the downward pressure to make the conductive elements under pressure. To a certain extent, it can assume a predetermined shape, so that adjacent conductive elements will not be bridged, and thus the problem of electrical short circuit can be avoided.

The above-mentioned embodiments are used to exemplify the principles and effects of the present invention, but not to limit the present invention. Anyone who is familiar with the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

2‧‧‧Electronic package

2a‧‧‧Radiator

20‧‧‧Carrier

20a‧‧‧First surface

20b‧‧‧Second surface

200‧‧‧Perforation

202‧‧‧Line layer

21‧‧‧Electronic components

23‧‧‧Strengthening body

24‧‧‧Slab body

25‧‧‧Insulator

26‧‧‧Combination layer

27‧‧‧Support feet

28‧‧‧Radiator

280‧‧‧ Thermal Interface Layer

29,29’‧‧‧Conductive element

9‧‧‧Circuit board

Claims (28)

An electronic package includes: a carrier having at least one through hole; an electronic element arranged on the carrier and electrically connected to the carrier; and a reinforcement body arranged in the through hole and protruding from the carrier Wherein the reinforcing body is not electrically connected to the carrier and the electronic element. The electronic package described in claim 1, wherein the carrier has a first surface and a second surface opposite to each other, the electronic component is arranged on the first surface of the carrier, and the reinforcing body is convex Out of the first surface of the carrier. The electronic package described in item 2 of the scope of patent application includes a plate body provided on the second surface of the carrier, which is connected to the reinforcing body but not electrically connected to the carrier and the electronic component. The electronic package described in claim 1, wherein the carrier has a first surface and a second surface opposite to each other, the electronic component is arranged on the first surface of the carrier, and the reinforcing body is convex Out of the second surface of the carrier. The electronic package described in item 4 of the scope of patent application includes a plate body provided on the first surface of the carrier, which is connected to the reinforcement body but not electrically connected to the carrier and the electronic component. The electronic package described in item 1 of the scope of patent application, wherein the surface of the carrier is defined with a wiring area and an open area adjacent to the wiring area, so that the electronic component is arranged in the wiring area, and the reinforcing body Configured in the open area. According to the electronic package described in item 1 of the scope of patent application, the perforation is located at the edge of one of the surfaces of the carrier without connecting the edge. The electronic package described in item 1 of the scope of patent application, wherein the perforation is a notch formed on the side of the carrier. The electronic package described in item 1 of the scope of the patent application includes an insulator formed on the carrier to cover the part of the reinforcing body protruding from the carrier. The electronic package described in item 1 of the scope of the patent application includes a heat sink provided on the carrier. The electronic package described in item 1 of the scope of patent application includes a plurality of conductive elements formed on the carrier to electrically connect the carrier. A manufacturing method of an electronic package includes: providing a carrier with at least one perforation; arranging at least one electronic component on the carrier and electrically connecting the carrier; and forming a reinforcing body in the perforation and making The reinforcing body protrudes from the supporting member, wherein the reinforcing body is not electrically connected to the supporting member and the electronic element. The method for manufacturing an electronic package as described in claim 12, wherein the carrier has a first surface and a second surface opposite to each other, the electronic component is arranged on the first surface of the carrier, and the reinforcement The body protrudes from the first surface of the carrier. For example, the manufacturing method of the electronic package described in item 13 of the scope of patent application includes arranging a plate body on the second surface of the carrier, and the plate body is connected to the reinforcing body but not electrically connected to the carrier and the electronic element. The method for manufacturing an electronic package as described in claim 12, wherein the carrier has a first surface and a second surface opposite to each other, the electronic component is arranged on the first surface of the carrier, and the reinforcement The body protrudes from the second surface of the carrier. For example, the method for manufacturing the electronic package described in item 15 of the scope of patent application includes arranging a plate body on the first surface of the carrier, and the plate body is connected to the reinforcing body but not electrically connected to the carrier and the electronic element. For example, the method for manufacturing an electronic package described in item 12 of the scope of patent application, wherein the surface of the carrier is defined with a wiring area and an open area adjacent to the wiring area, so that the electronic component is arranged in the wiring area, and the The reinforcement is arranged in the open area. According to the manufacturing method of the electronic package described in item 12 of the scope of patent application, the perforation is located at the edge of one of the surfaces of the carrier without connecting the edge. According to the manufacturing method of the electronic package described in item 12 of the scope of patent application, the perforation is a notch formed on the side of the carrier. The manufacturing method of the electronic package as described in item 12 of the scope of patent application includes forming an insulator on the carrier to cover the part of the reinforcing body protruding from the carrier. For example, the manufacturing method of the electronic package described in item 12 of the scope of patent application includes arranging a heat sink on the carrier. As described in item 12 of the scope of patent application, the manufacturing method of the electronic package includes forming a plurality of conductive elements on the carrier to electrically connect the carrier. A load-bearing structure includes: a load-bearing member having at least one perforation; and a reinforcing body arranged in the perforation and protruding from the load-bearing member, wherein the reinforcing body is not electrically connected to the load-bearing member. For example, the supporting structure described in item 23 of the scope of patent application includes a plate body provided on the supporting member, which is connected to the reinforcing body but not electrically connected to the supporting member. According to the supporting structure described in item 23 of the scope of patent application, the perforation is located at the edge of one of the surfaces of the supporting member and is not connected to the edge. According to the supporting structure described in item 23 of the scope of patent application, the perforation is a notch formed on the side of the supporting member. The load-bearing structure described in item 23 of the scope of patent application includes an insulator formed on the load-bearing member to cover the part of the reinforcing body protruding from the load-bearing member. The supporting structure described in item 23 of the scope of the patent application includes a plurality of conductive elements formed on the supporting member to electrically connect the supporting member.

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