TWI690418B - Adhering device, adhering method, production device of optical display device, and production method thereof - Google Patents

Abstract

An adhering device of the present invention includes an adhering stage 171 on which an optical display component P is mounted, an adhesive head 120 which holds a sheet piece F1X on a curved holding surface 122a and adheres the sheet piece F1X to the optical display component P by rolling the adhesive head 120 along a curvature of the holding surface 122a while pressing the sheet piece F1X held on the holding surface 122a on the optical display component P which is mounted on the adhering stage 171, a first load control portion 139a which controls a load which is added to the sheet piece F1X on the optical display component P at a first edge portion in a head width direction perpendicular to a rolling direction of the adhering head 120, and a second load control portion 139b which controls a load which is added to the sheet piece F1X on the optical display component P at a second edge portion in the head width direction of the adhering head 120.

Description

Laminating device, laminating method, production system of optical display equipment and production method of optical display equipment

The invention relates to a bonding device, a bonding method, a production system of optical display equipment and a production method of optical display equipment.

The present invention claims priority based on Japanese Patent Application No. 2014-132579 filed on June 27, 2014 in Japan, and the contents thereof are cited.

Regarding a device for bonding a layer material to an object to be attached, a device described in Patent Document 1 is known.

The device of Patent Document 1 cuts a long layer of sheet material into a specific size and holds (fits) the head. And, move the head to the pedestal on which the attached object is placed, determine the position of the head and the attached object, and then press the head against the attached object to transfer the layer material to Attached objects.

[Patent Literature]

Patent Document 1: Japanese Patent No. 4482757.

In the device of Patent Document 1, when transferring the layer material to the object to be attached, the shape of the head is designed to have an arc shape so as not to cause bubbles or bonding defects. However, the tilt of the head or the pedestal will still produce bubbles or fit defects.

The object of the present invention is to provide a bonding device, a bonding method, a production system of an optical display device, and a production method of an optical display device that can suppress the generation of bubbles or bonding defects when transferring the layer sheet.

The laminating device of one aspect of the present invention is for laminating a layer to an optical display component, which comprises: a laminating stage, which is used to mount the optical display component; and a bonding head, which holds the layer in a curved shape A holding surface, pressing the layer held on the holding surface to the optical display assembly placed on the bonding table, and rotating along the bending of the holding surface, thereby bonding the layer to the optical display Assembly; a first load adjustment section, at the first end of the head width direction perpendicular to the rotation direction of the bonding head, adjusts the load applied to the layer on the optical display assembly; and a second load adjustment section At the second end of the bonding head in the width direction of the head, adjust the load applied to the layer on the optical display assembly.

According to one aspect of the present invention, the first load adjustment part is a first pneumatic cylinder, which is connected to the first end of the bonding head, and the bonding head is placed toward the bonding head The optical display component of the joint table is pressed against; and the second load adjustment part is a second pneumatic cylinder, which is connected to the second end of the bonding head, and the bonding head is placed toward the bonding toward the bonding The optical display assembly of the stage.

According to one aspect of the present invention, a bonding device is provided with a blocking plate adjacent to the optical display component on the bonding table; and the bonding head makes the holding surface abut the blocking block After the upper side of the board, it continuously rotates along the upper side of the blocking plate and the upper side of the optical display component, so as to attach the layer held on the holding surface to the optical display component.

A bonding apparatus according to one aspect of the present invention includes: a roll-out portion that rolls out the optical component layer and the separation layer sheet from a roll drum; a cutting section that leaves the optical layer as if the separation layer sheet remained The component layer is cut to form the ply; and the ply table supports the ply from the separated ply side; wherein the bonding head abuts the holding surface against the layer resting on the ply table Sheet, and rotate along the curvature of the holding surface, so that the ply is peeled off from the separation layer and held on the holding surface.

The laminating device according to one aspect of the present invention includes a take-up portion, and after the lamination head peels the ply from the separation ply, the separation ply left alone is wound up; and the roll The taking part will turn in the direction of unwinding the separated layer during the first period after the bonding head abuts the holding surface against the layer and starts to rotate; During the second period when the rotation is terminated, it turns toward the direction of winding up the separated layer.

The production system of the optical display device of the first aspect of the present invention is to bond the optical component to the optical display component to make the optical display device, which includes bonding the layer as the optical component to the optical display component A laminating device; wherein, the laminating device is the laminating device according to one aspect of the present invention.

The production system of the optical display device of the second aspect of the present invention is to bond the optical component to the optical display component to make the optical display device, which includes: a bonding device, which is a layer larger than the optical component It is attached to the optical display component; the detection device is used to photograph the optical display component to which the layer is attached, and the cutting line of the layer is detected based on its photographic data; and the cutting device is to follow the cutting The disconnection cuts the layer bonded to the optical display component, thereby cutting the optical component from the layer; wherein the bonding device is one of the above-mentioned bonding devices of the present invention.

The bonding method of one aspect of the present invention is to bond a layer to an optical display component, including: a placing step, which is to place the optical display component on a bonding table; and a bonding step, which is to apply the layer The sheet is held on the curved holding surface of the bonding head, the layer held on the holding surface is pressed against the optical display component placed on the bonding table, and the sticker is rotated along the bending of the holding surface Close the head to attach the layer to the optical display component; the first load adjustment step is to adjust and apply to the optical display component at the first end of the head width direction perpendicular to the rotation direction of the bonding head The charge on the layer And the second load adjustment step, at the second end of the head in the width direction of the bonding head, adjust the load applied to the layer on the optical display assembly.

According to one aspect of the present invention, the first load adjustment step is to place the bonding head in the direction of loading by the first pneumatic cylinder connected to the first end of the bonding head The optical display component of the bonding table is pressed against; and the second load adjustment step is to place the bonding head toward the mounting by the second pneumatic cylinder connected to the second end of the bonding head The optical display component of the bonding table is pressed against.

According to one aspect of the present invention, a bonding method is provided on the bonding table with a baffle plate adjacent to the optical display component; and in the bonding step, the holding surface of the bonding head is made After being attached to the upper side of the baffle plate, the bonding head is continuously rotated along the upper side of the baffle plate and the upper side of the optical display component, so as to bond the layer held on the holding surface To the optical display assembly.

The laminating method of one aspect of the present invention includes: a roll-out step of rolling out the optical component layer and the separation layer from the roll drum; a cutting step of leaving the separation layer like the optical The component layer is cut to form the ply; and the supporting step is to support the ply from the side of the separated ply by the ply stage; wherein, the bonding step abuts the holding surface of the bonding head at rest The ply on the ply table is configured to rotate the bonding head along the curvature of the holding surface, so that the ply is peeled from the separation layer and held on the holding surface.

The laminating method of one aspect of the present invention includes a winding step, after the laminating head peels the layer from the separation layer, the winding layer separates the separated layer. Sheet; and in the winding step, when the bonding head abuts the holding surface against the ply and starts to rotate for the first period, the winding part will rotate in the direction of unwinding the separated ply ; After the first period has elapsed until the end of the second period of rotation, the take-up part turns toward the direction of taking up the separation layer.

The production method of the optical display device of the first aspect of the present invention is to bond the optical component to the optical display component to make the optical display device, which comprises: bonding the layer as the optical component to the optical display component The laminating step; wherein, the laminating step implements the laminating method according to one aspect of the present invention.

The production method of the optical display device of the second aspect of the present invention is to bond the optical component to the optical display component to make the optical display device, which includes: a bonding step, which is a layer larger than the optical component It is attached to the optical display component; the detection step is to photograph the optical display component to which the layer is attached, and to detect the cutting line of the layer according to its photographic data; and the cutting step is to follow the cutting The disconnection cuts off the layer bonded to the optical display component, thereby cutting the optical component from the layer; wherein the bonding step implements the bonding method according to one aspect of the present invention described above.

In the production system and production method of the optical display device of the first aspect and the production system and production method of the optical display device of the second aspect, "optical component" refers to a size set according to the specifications of the optical display device Optical components. "The size set according to the specifications of the optical display device" refers to, for example, the size corresponding to the outer size of the optical display component, specifically, it means that when attached to the optical display component, it does not produce enough to cause actual use. The size of the rest of the problem.

For example, at the central portion of the optical display module, a display area for displaying a screen is designed, and at the end of the optical display module, an electronic component mounting portion is provided that is connected to a plurality of terminals such as semiconductor wafers or flexible printed circuit board wiring. At this time, "optical component" refers to, for example, the area above the size of the display area of the optical display component and below the size of the external shape of the optical display component (outline profile in plan view), and to avoid electronic components at the optical display component The area of functional parts such as the mounting part.

In the production system and production method of the optical display device of the second aspect, "larger layer than the optical component" means that the optical component is slightly larger than the target size (the size set according to the specifications of the optical display device) Of layers. The larger part of the layer than the optical component is the remaining part as the object of cutting. The remaining part is cut and separated from the ply to obtain an optical component of a desired size.

According to the present invention, it is possible to provide a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of an optical display device that can suppress bubbles or bonding defects when transferring a layer sheet.

According to the bonding device, bonding method, optical display device production system and optical display device production method of the present invention, it is possible to provide a bonding device, bonding method, optical device for suppressing bubbles or bonding defects when transferring layers Production system of display equipment and production method of optical display equipment.

100: Laminating device

110: Layer conveying device

111: Unwind

112: take-up department

113: nip roller section

113a: the first nip roller

113b: second nip roller

114: Layer table

115: Cut off section

120: fitting head

121: Fitting head body

122: Adhesive layer

122a: keep the surface

130: Fitting head drive device

131: Air cylinder body part

131a: First pneumatic cylinder body

131b: Second air cylinder body

132: Cylinder rod

135: bottom plate

136: Swing drive

136a: Rotary support shaft

137: Rod

138: Piston

139: Load adjustment section

139a: First load adjustment section

139b: Second load adjustment section

140: Fitting head lifting device

141: Lifting drive

142: Rod

150: Fitting head unit

160: mobile device with fitting head

161: Rail

162: Slider

170: Pedestal unit

171: Laminating table

172: pedestal drive

173: Stopper

181: The first photography device

182: Second photographic device

183: Photography device

184: Cutting device

185: Cut off the pedestal

189: Detection device

190: control device

1000: Production system of optical display equipment

1001, 2001: washing device

1002, 2002: the first laminating device

1003, 2004: Second laminating device

1004, 2006: Stripping device

1005, 2007: the third bonding device

1006, 2009: inspection device

2000: Production system of optical display equipment

2003: The first cutting device

2005: Second cutting device

2008: Third cutting device

AFD: direction of rotation

AFL: gas supply pipe

CL: Crosscut line

CP: Checkpoint

DP: Optical display device

EL: edge line

F1a: Optical component body

F1X, FXm: slice

F2a: Adhesive layer

F3a: Separate layers

F4a: Surface protective film

F5: Laminated layer

F6: Polarizing unit

F7: First film

F8: second film

FB: First area

FS: Second area

FO: Optical components

FX: optical component layer

RX: material roller

La: load on the first end side

Lb: load on the second end side

REG: Regulator

P: Optical display assembly

P4: display area

WCL: cutting line

θmax: maximum offset angle

θmin: minimum offset angle

θmid: average offset angle

Fig. 1 is a schematic diagram of a bonding apparatus according to a first embodiment of the present invention.

[Fig. 2] It is a schematic view of the bonding device viewed from the rotation direction of the bonding head.

[Fig. 3A] It is a schematic diagram of the process of adhering the laminate to the bonding head.

[Fig. 3B] It is a schematic diagram of the process of adhering the laminate to the bonding head.

[Fig. 3C] It is a schematic diagram of the process of adhering the laminate to the bonding head.

[FIG. 4A] It is a schematic diagram of the process of transferring the layer adhered to the bonding head to the optical display device.

[FIG. 4B] It is a schematic diagram of the process of transferring the layer adhered to the bonding head to the optical display device.

[FIG. 4C] It is a schematic diagram of the process of transferring the layer adhered to the bonding head to the optical display device.

[FIG. 5] A cross-sectional view of an optical component layer.

6 is a schematic diagram of a production system of an optical display device according to the first embodiment of the present invention.

7 is a schematic diagram of the cutting process of the layer at the bonding apparatus in the second embodiment of the present invention.

[FIG. 8A] A schematic diagram illustrating a method of determining the bonding position of an optical display element and a layer.

[FIG. 8B] A schematic diagram illustrating a method of determining the bonding position of the optical display element and the layer.

9 is a schematic diagram of a production system of an optical display device according to a second embodiment of the present invention.

[First Embodiment]

Hereinafter, the production system of the bonding apparatus and the optical display device according to the first embodiment of the present invention will be described using FIGS. 1 to 6.

FIG. 1 is a schematic diagram of a bonding apparatus 100 of this embodiment.

The bonding apparatus 100 of the present embodiment bonds a long-cut optical component layer FX to the one side of the optical display component P by half-cutting the layer sheet F1X.

For example, a panel-shaped optical display module such as a liquid crystal panel or an organic EL panel can be used as the optical display module P. For example, a polarizing film, a retardation film, a brightness increasing film, etc. can be used as the optical component layer FX. In this embodiment, for example, a polarizing film as shown in FIG. 5 is used as the optical component layer FX.

The optical component layer FX of FIG. 5 includes: a film-shaped optical component body F1a; an adhesive layer F2a provided on one side of the optical component body F1a (the upper side of FIG. 5); a layer that can be separated through the adhesive layer F2a A separation layer F3a deposited on one side of the optical element body F1a; and a surface protection film F4a laminated on the other side of the optical element body F1a (lower side in FIG. 5).

The optical element body F1a, for example, has the function of a polarizing plate and straddles the display area or the display area and its surrounding area attached to the optical display element P. The optical device body F1a is attached to the optical display device P via the adhesive layer F2a in a state where the adhesive layer F2a remains on one surface and is separated from the separation layer sheet F3a. Hereinafter, the portion where the separation layer sheet F3a is removed from the optical module layer FX is referred to as the bonding layer sheet F5. The layered sheet F1X is a layered sheet of the laminated layered sheet F5 obtained by cutting the long-shaped laminated layered sheet F5 into a specific size.

Before separation from the adhesive layer F2a, the separation layer sheet F3a can protect the adhesive layer F2a and the optical element body F1a. The surface protection film F4a is attached to the optical display device P together with the optical device body F1a. The surface protection film F4a is disposed on the opposite side of the optical display element P relative to the optical element body F1a to protect the optical element body F1a. In addition, the optical component layer FX can be The structure of the protective film F4a may also be a structure of the surface protective film F4a separated from the optical element body F1a.

The optical element body F1a has: a layered polarizing unit F6; a first film F7 bonded with an adhesive or the like on one side of the polarizing unit F6; and a bonding agent or the like on the other side of the polarizing unit F6的second film F8. The first film F7 and the second film F8 are protective films that protect, for example, the polarizing unit F6.

In addition, the optical component body F1a may be a single-layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are laminated on each other. In addition to the polarizing unit F6, the optical layer can also be a retardation film or a brightness increasing film. At least any one of the first film F7 and the second film F8 may also be subjected to surface treatment to obtain anti-glare effects including hard coat treatment to protect the outermost layer of the liquid crystal display unit or anti-glare treatment. The optical element body F1a may not include at least any one of the first film F7 and the second film F8. For example, when the first film F7 is omitted at the optical element body F1a, the separation layer sheet F3 may be bonded to the surface of the polarizing unit F6 via the adhesive layer F2.

As shown in FIG. 1, the bonding apparatus 100 of this embodiment includes, for example, a layer conveying apparatus 110, a bonding head unit 150, a bonding head moving device 160, a pedestal unit 170, and a control device 190.

The layer conveying device 110 includes, for example, a winding-out unit 111, a winding unit 112, a nip roller unit 113, a layer table 114, and a cutting unit 115.

The roll-out portion 111 holds the roll drum RX wound with the long-shaped optical component layer FX, and winds the optical component layer FX along its longitudinal direction. The optical module layer FX has a width equal to the length of the first side (for example, the short side) of the display area of the optical display module P in the horizontal direction (layer width direction) perpendicular to the conveying direction, for example.

Hereinafter, the direction in which the optical module layer FX (separation layer F3a) is wound out from the unwinding section 111 and transported is referred to as a layer transport direction, and the upstream side of the layer transport direction is referred to as a layer transport upstream side, and the layer transport direction The downstream side is called the layer transport downstream side.

The cutting part 115 cuts (half-cuts) the optical component layer FX wound out from the roll drum RX like a separation layer sheet F3a, leaving the thickness direction. The cutting part 115 is, for example, each time the optical component layer FX is rolled out to a length equal to the length of the second side (for example, the long side) of the display area of the optical display component P in the longitudinal direction perpendicular to the layer width direction, A part of the thickness direction of the optical component layer FX is cut across the entire width in the layer width direction.

The cutting part 115 transmits the tension in the conveyance of the optical component layer FX, and adjusts the front and back positions of the cutting blade without breaking the separation layer F3a (the separation layer F3a with a specific thickness remains). Half-cut, deep to the vicinity of the interface between the adhesive layer F2a and the separation layer sheet F3a. In addition, the cutting unit 115 may use a laser device instead of the cutting blade.

In the half-cut optical component layer FX, the optical component body F1a, the adhesive layer F2a, and the surface protection film F4a are cut according to the thickness direction to form a transverse line across the entire width of the layer width direction of the optical component layer FX. The optical component layer F is divided into partitions having a length corresponding to the second side of the display area in the long-side direction by the transverse line. The partitions are each a layer F1X in the bonding layer F5.

The cutting angle with respect to the layer conveying direction of the optical element layer FX is controlled by the control device 190. For example, a photographing device that shoots the edge frames of the FX of the optical component layer at a plurality of positions in the layer conveying direction is arranged, and based on the edge frames at the plurality of positions captured by the photographing devices, the control device 190 detects the plurality of frames The edge position of the position. Furthermore, based on the detected relative positional relationship of the edge at the plurality of positions, the control device 190 calculates the inclination angle with respect to the layer conveying direction of the edge at the cutting position of the optical component layer FX. Then, the cutting unit 115 cuts the optical module layer FX at the cutting angle controlled by the control device 190. With this, even if the optical component layer FX is meandering in the layer width direction, the optical component layer FX can be cut with good accuracy in the target direction.

The lamination stage 114 supports the lower side of the optical component layer FX rolled out from the roll drum RX (the surface on the side of the separation layer F3a shown in FIG. 5). The layer stage 114 is provided between a cutting position where the cutting unit 115 cuts the optical component layer FX in half, and a separation position where the layer F1X is separated from the separation layer F3a.

The nip roller portion 113 includes a first nip roller 113a and a second nip roller 113b that are arranged so that their rotation axis directions are parallel to each other. The first nip roller 113a and the second nip roller 113b rotate synchronously with each other, so that they can move from the upstream side of the layer transport toward the downstream side of the layer transport (in the winding direction toward the winding unit 112) and from the layer transport The downstream side conveys the separation layer F3a toward the upstream side of the layer transport (the unwinding direction from the winding unit 112).

The winding unit 112 is configured to peel off the separated layer sheet F3a left alone after the layer sheet F1X is peeled off from the separated layer sheet F3a by the bonding head 120. The winding unit 112 rotates in synchronization with the first nip roller 113a and the second nip roller 113b, thereby winding and unwinding the separated layer sheet F3a.

The bonding head unit 150 includes, for example, a bonding head 120, a bonding head driving device 130, and a bonding head lifting device 140.

The bonding head 120 includes, for example, a bonding head body 121 and an adhesive layer 122.

The upper side of the bonding head body 121 is a flat surface, and the lower side is convex downward, forming a curved surface that is curved in the direction of the optical component layer FX. The adhesive layer 122 is fixed on the lower side of the body 121 of the bonding head. For the adhesive layer 122, for example, adhesive silicone rubber is used. The surface of the adhesive layer 122 is a curved holding surface 122a that adheres and holds the layer F1X. The holding surface 122a has, for example, a weaker adhesive force than the bonding surface (adhesive layer F2a) of the layer sheet F1X, and can repeatedly adhere and peel off the surface protective film F4a of the layer sheet F1X.

The bonding head 120 abuts the curved holding surface 122a to the layer F1X supported on the layer table 114, and rotates along the bending of the holding surface 122a, thereby peeling and holding the layer F1X from the separation layer F3a Holding surface 122a. The bonding head 120 presses the layer F1X held on the holding surface 122a to the optical display component P placed on the bonding table 171, and rotates along the bending of the holding surface 122a, thereby bonding the layer F1X to the optical display component P .

FIG. 2 is a schematic view of the bonding apparatus 100 viewed from the rotation direction of the bonding head.

As shown in FIGS. 1 and 2, the bonding head driving device 130 includes, for example, a bottom plate 135, a rotation driving section 136, a rod section 137, a first load adjustment section 139 a, and a second load adjustment section 139 b.

The bonding head 120 is connected to the swing support shaft 136a of the swing drive part 136 through a rod portion 137 connected to the center of the upper side of the bonding head body 121. The swing support shaft 136a is fixed to the bottom plate 135. The bonding head 120 is rotatably suspended under the bottom plate 135 through the rod portion 137 and the rotation support shaft 136a. The holding surface 122a is, for example, an arc-shaped curved surface centered on the rotary support shaft 136a.

The bonding head 120 is rotated by a rotation driving unit 136 within a specific angle range around the rotation support shaft 136a. Thereby, adhesion of the layer sheet F1X from the separation layer sheet F3a toward the holding surface 122a and bonding (transfer) of the layer sheet F1X from the holding surface 122a toward the optical display module P are performed.

The first load adjusting portion 139a adjusts the load applied to the layer F1X on the optical display module P, for example, at the first end portion in the horizontal direction (head width direction) perpendicular to the rotation direction of the bonding head 120. The second load adjusting portion 139b adjusts the load applied to the layer F1X on the optical display module P, for example, at the second end in the width direction of the head of the bonding head 120. The first end and the second end of the bonding head 120 only need to be disposed on one side and the other side of the center of the bonding head 120, and the position is not particularly limited. The structure and arrangement of the first load adjustment unit 139a and the second load adjustment unit 139b are not limited. In this embodiment, the first load adjustment unit 139a and the second load adjustment unit 139b have the same structure, for example, the first load The adjusting portion 139a and the second load adjusting portion 139b are provided so as to be bilaterally symmetrical with respect to the center of the head in the width direction.

In the specification of the present invention, the first load adjustment unit 139a and the second load adjustment unit 139b are collectively referred to as "load adjustment unit 139". In the case of distinguishing between the first load adjustment unit 139a and the second load adjustment unit 139b, the load adjustment unit 139 and its constituent elements are given the characters "first" and "second", and the end of the symbol is given "a" and The letter "b".

Hereinafter, the structure of the load adjustment unit 139 will be described using FIGS. 1 and 2.

The load adjustment unit 139 is, for example, a pneumatic cylinder including a pneumatic cylinder body 131, a cylinder rod 132, a piston 138, and an adjuster REG. The first load adjusting portion 139a is connected to, for example, a first end portion in the width direction of the head of the bonding head 120, and urges the bonding head 120 from above to below. Second load adjustment section 139b is, for example, connected to the second end in the width direction of the head of the bonding head 120, and urges the bonding head 120 from above to below.

The first end of the cylinder rod 132 is connected to the piston 138 in the cylinder body 131. The second end portion of the cylinder rod 132 is connected to the central portion in the rotation direction of the upper side surface of the bonding head body portion 121.

The pneumatic cylinder body 131 is connected to the gas supply pipe AFL through the regulator REG. The load adjustment part 139 causes the piston 138 and the cylinder rod 132 in the pneumatic cylinder body 131 to move in the vertical direction by the gas pressure guided into the pneumatic cylinder body 131. The amount of gas supplied to the pneumatic cylinder body 131 is adjusted by the regulator REG, thereby adjusting the load applied to the layer F1X on the optical display module P.

The amount of gas supplied to the first pneumatic cylinder body 131 a and the amount of gas supplied to the second pneumatic cylinder body 131 b are independently controlled by the control device 190. Thereby, the load La on the first end side of the bonding head 120 and the load Lb on the second end side of the bonding head 120 are independently controlled.

In the case of performing the bonding process using the bonding apparatus 100, a pressure-sensitive paper or the like is used in advance to measure the load distribution in the width direction of the head. The user controls the amount of gas supplied to the first pneumatic cylinder body 131a and the amount of gas supplied to the second pneumatic cylinder body 131b based on the measurement result of the load distribution. As a result, the load applied to the layer F1X on the optical display device P in the width direction of the head can be made uniform.

When the bonding apparatus 100 is activated, the leveling of the bonding head 120 and the bonding table 171 is also performed in advance. However, when adjusting the performance of the mechanism according to the level, there may be cases where a sufficient level cannot be obtained. Even in this case, as long as the first load adjustment section 139a and the second load adjustment section 139b are used to adjust the load at both ends of the head width direction, the unevenness of the load can be suppressed. The generation of bubbles or defects.

Returning to FIG. 1, the bonding head lifting device 140 includes a lifting driving portion 141 and a lever portion 142. The first end of the rod 142 is fixed to the upper side of the bottom plate 135, and the second end of the rod 142 is connected To the lift drive 141. The up-and-down driving part 141 is, for example, a built-in servo motor, and the lever 142 is moved in the vertical direction by the driving force of the servo motor. As a result, the bonding head 120 moves in the vertical direction.

The head moving device 160 includes a guide rail 161 and a slider 162. The upper end of the lift driving portion 141 is fixed to the slider 162. In this way, the bonding head unit 150 can be vertically suspended at the slider 162. The guide rail 161 is provided across the layer conveying device 110 and the bonding table 171 in a straddling manner. The slider 162 moves back and forth along the guide rail 161. Thereby, the bonding head 120 moves between the peeling position where the layer F1X is peeled off from the separation layer F3a, and the bonding position where the layer F1X is bonded to the optical display module P.

The bonding head driving device 130, the bonding head lifting device 140, and the bonding head moving device 160 constitute a bonding head driving mechanism for rotating, lifting, and horizontally moving the bonding head 120. The bonding head 120 is rotated and moved horizontally by being driven by the bonding head driving device 130 and the bonding head moving device 160, and is placed on the lamination F1X supported by the lamination table 114 and placed on the lamination table 171 The optical display assembly P is rotated. Thereby, adhesion of the layer sheet F1X from the separation layer sheet F3a toward the holding surface 122a and bonding (transfer) of the layer sheet F1X from the holding surface 122a toward the optical display module P are performed.

The bonding head 120 can be rotated in the first rotation direction (for example, clockwise direction) by the bonding head driving device 130, and horizontally moved in the first movement direction (for example, right direction) by the bonding head moving device 160, The first direction (for example, the left end) of the holding surface 122a can be turned in the first direction toward the second end (for example, the right end). In addition, the bonding head 120 can be rotated in the second rotation direction (for example, counterclockwise direction) by the bonding head drive device 130, and horizontally in the second movement direction (for example, left direction) by the bonding head moving device 160 By moving, the second direction (for example, the right end) of the holding surface 122a can be rotated in the second direction toward the first end (for example, the left end).

The pedestal unit 170 includes: a bonding table 171, a pedestal driving device 172, and a stop plate 173.

The bonding table 171 includes a mounting surface 171a on which the optical display module P is mounted. The bonding table 171, for example, sucks the lower side surface of the optical display device P (the surface on the opposite side to the surface bonded to the layer F1X) to hold the optical display device P on the mounting surface 171a.

The blocking plate 173 is a plate-shaped or rod-shaped component disposed along one side of the optical display component P. The blocking plate 173 is fixed on the mounting surface 171a. The height of the blocking plate 173 is roughly the same as the height of the optical display device P. Compared to the position where the optical display module P is placed, the stopper plate 173 is arranged on the upstream side of the rotation direction AFD.

The optical display component P is arranged adjacent to the blocking plate 173. The optical display module P is fixed to the mounting surface 171a in a state where the end portion contacts the side surface of the stopper plate 173. Thereby, the upper side of the optical display module P and the upper side of the blocking plate 173 form a continuous plane.

The blocking plate 173 can be fixedly arranged on at least two positions (a first position and a second position) on the bonding table 171. The first position corresponds to the position on the bonding table 171 when the rotation direction AFD is the first direction (for example, the left position of the optical display unit P); the second position corresponds to the rotation direction AFD as the second direction The case corresponds to the position on the bonding table 171 (for example, the right position of the optical display unit P).

The bonding head 120 makes the holding surface 122a on the upstream side of the bonding direction ADF compared to the layer F1X abut against the upper side of the blocking plate 173, the bonding head 120 moves along the upper side of the blocking plate 173 and the optical display assembly The upper side of P continuously rotates, thereby bonding the layer F1X held on the holding surface 122a to one side of the optical display device P. Before the layer F1X comes into contact with the optical display module P, the bonding head 120 will start to rotate along the outside of the optical display module P, which can make the bonding conditions such as the load and speed of the layer F1X as a whole uniform.

The pedestal driving device 172 moves the bonding table 171 in a direction perpendicular to the rotation direction AFD of the bonding head 120 and the rotation direction AFD of the bonding head 120. In addition, the pedestal drive device 172 rotates the bonding table 171 on a horizontal plane. The pedestal driving device 172 drives the bonding table 171 to adjust the relative bonding position of the optical display element P held on the bonding table 171 and the layer F1X held on the bonding head 120. Thereby, the position alignment of the optical display module P and the layer F1X is performed.

The configuration of the control device 190 includes a computer system. The computer system includes: an arithmetic processing unit such as a CPU, and a memory unit such as a memory or a hard disk. The control device 190 includes The interface through which the devices communicate, and overall control of the operations of the various devices constituting the bonding device 100 and the various devices external to the bonding device 100.

Hereinafter, the process of adhering the layer F1X to the bonding head 120 will be described using FIGS. 3A to 3C.

As shown in FIG. 3A, the bonding head 120 is disposed above the layer table 114 in a state inclined to the layer table 114. The transport of the layer F1X is stopped, and the layer F1X is allowed to stand still on the layer stage 114. The lamination stage 114 supports the lamination F1X from the separation lamination F3a side. Furthermore, the position of the lamination F1X on the lamination head 120 and the lamination stage 114 is determined. The bonding head 120 is inclined, and the upstream side in the rotation direction is located below the downstream side in the rotation direction. In the case of this embodiment, the end portion on the downstream side of the layer transport is inclined below the end on the upstream side of the layer transport.

The position between the bonding head 120 and the layer F1X is determined, and then the bonding head 120 is lowered to a height that can contact the layer F1X by the bonding head lifting device 140. Thereby, the end of the lamination transport downstream side of the bonding head 120 abuts on the end of the lamination transport downstream side of the layer F1X.

Next, as shown in FIG. 3B, by synchronously driving the rotation driving unit 136 and the bonding head moving device 160, the bonding head 120 is rotated (rotation and horizontal movement) from the layer conveying downstream side toward the layer conveying upstream side. As a result, the layer sheet F1X gradually abuts against the holding surface 122a from the layer sheet transport downstream side to the layer sheet transport upstream side.

When the bonding head 120 abuts the holding surface 122a against the layer sheet F1X and starts to rotate, the winding unit 112 and the nip roller unit 113 simultaneously drive the rotary drive unit 136 and the bonding head moving device 160 toward the separation The unwinding direction (reverse direction) of the layer F3a rotates. As a result, the separation layer F3a on the upstream side of the nip roller portion 113 becomes slack, and the layer F1X and the separation layer F3a on the downstream side of the layer transport are along the holding surface 122a compared to the portion subjected to the load applied by the bonding head 120 It bends and arches above the layer table 114.

Since the separation layer F3a is in a slack state, the force at which the layer F1X peels off from the holding surface 122a is hardly generated at the end of the layer F1X on the layer transport downstream side. Therefore, the adhesion between the layer sheet F1X and the holding surface 122a is improved, and the adhesion of the layer sheet F1X toward the holding surface 122a can be reliably performed. In addition, because the separation layer F3a becomes slack, when the layer F1X is peeled from the separation layer F3a, it can Avoid instantaneously applying a large peeling force to the separation layer sheet F3a. Therefore, the breakage of the separation layer sheet F3a can be suppressed.

As shown in FIG. 3C, after the first period passes until the second period in which the rotation of the bonding head 120 ends, the take-up portion 112 and the nip roller portion 113 rotate toward the direction (forward) in which the separation layer sheet F3a is taken up. Thereby, while removing the slack of the separation layer sheet F3a, the layer sheet F1X is urged to peel from the separation layer sheet F3a. The point in time when the rotation directions of the winding section 112 and the nip roll section 113 are switched from reverse to forward is, for example, adhesion of the layer F1X to the holding surface 122a is 5% to 70%, preferably 10% to 50% Time.

During the unwinding and winding of the separated layer sheet F3a by the winding unit 112 and the nip roller unit 113, the bonding head 120 is constantly maintained in the same direction by the rotation driving unit 136 and the bonding head moving device 160 Turn. The bonding head 120 abuts the holding surface 122a against the layer sheet F1X, and rotates along the bending of the holding surface 122a, thereby peeling the layer sheet F1X from the separation layer sheet F3a and holding it on the holding surface 122a.

According to the above, the surface protective film F4a of the layer sheet F1X is adhered to the holding surface 122a of the bonding head 120 in order. The layer F1X adhered to the holding surface 122a is peeled off from the separation layer F3a to expose the adhesion layer F2a (the bonding surface with the optical display device P). The bonding head 120 holding the layer F1X is transferred to the bonding table 171 on which the optical display unit P is mounted by the bonding head moving device 160.

FIGS. 3A to 3C exemplify the process of maintaining a good-quality layer F1X without defects in the layer surface on the bonding head 120, but maintaining a defective layer F1X with defects in the layer surface on the bonding head 120. The situation is the same. The bonding head 120 holding the defective product sheet F1X is transferred to a discarding position (discarding position) disposed at a position different from the bonding table 171 (not shown) by the bonding head driving device 160. Then, the defective product layer sheet F1X is covered and bonded to the discarded layer sheet provided at the discarding position.

The defect of the layer F1X means, for example, inside the layer F1X, there is a foreign body part composed of at least one of solid, liquid and gas, the part where the surface of the layer F1X has irregularities or scratches, and the layer F1X Bright spots caused by skew or material deviation.

Next, the process of attaching (re-attaching) the layer F1X adhered (held) to the bonding head 120 to the optical display device P will be described using FIGS. 4A-4B.

As shown in FIG. 4A, the bonding head 120 holding the layer F1X is raised by the bonding head lifting device 140 to a height that does not interfere with the layer conveying device 110 with the adhesive layer F2a facing downward. Then, the bonding head 120 is transferred to the position above the bonding table 171 on which the optical display unit P is mounted by the bonding head moving device 160.

When the bonding head 120 moves from the position above the lamination stage 114 to the position above the lamination stage 171, for example, two corners of the layer F1X held on the holding surface 122a are photographed by the first imaging device 181. The slice F1X frame captured by the first photographing device 181 is screen-analyzed by the first picture processing device omitted in the illustration to detect the two corner positions of the slice F1X. The relevant data of the corner position of the slice F1X detected by the first picture processing device is sent to the control device 190. The control device 190 confirms the arrangement position of the layer F1X relative to the bonding head 120 based on the data detected by the first image processing device.

The first imaging device 181 captures, for example, two corners of the rear end side of the slice F1X. The number and position of the slice F1X captured by the first imaging device 181 are not particularly limited. For example, as long as the arrangement position of the layer F1X relative to the bonding head 120 can be confirmed, the number of the layer F1X photographed by the first camera 181 can be freely selected within a range of one to four, and the position of the corner taken Can be set freely.

The optical display unit P held on the bonding table 171 is captured by the second camera 182, for example. The second photographing device 182 captures, for example, a position calibration mark or a black matrix provided on the optical display unit P as a position calibration reference. The picture of the optical display unit P captured by the second photographing device 182 is analyzed by the second picture processing device omitted in the figure to detect the position of the position calibration reference. The data related to the position calibration reference position of the optical display assembly P detected by the second picture processing device is sent to the control device 190. The control device 190 confirms the arrangement position of the optical display unit P relative to the bonding table 171 based on the data detected by the second image processing device.

The control device 190 controls the console driving device 172 based on the arrangement position of the layer F1X with respect to the bonding head 120 and the arrangement position of the optical display unit P with respect to the bonding table 171. The control device 190 uses the pedestal driving device 172 to horizontally move the bonding table 171 on a horizontal plane, or to rotate the bonding table 171 on a horizontal plane. Thereby, the relative bonding position of the optical display element P held by the bonding table 171 and the layer F1X held by the bonding head 120 can be adjusted.

As shown in FIG. 4B, after adjusting the relative bonding position of the optical display element P and the layer F1X, the bonding head 120 is lowered to a height that can contact the optical display element P by the bonding head lifting device 140. The bonding head 120 is inclined, and the upstream end portion in the rotation direction is below the downstream end portion in the rotation direction. By lowering the bonding head 120, the end of the bonding head 120 on the upstream side in the rotation direction of the layer F1X is pressed against the upper surface of the stopper plate 173 on the upstream side in the rotation direction of the optical display unit P.

Next, as shown in FIG. 4C, by synchronously driving the rotary driving part 136 and the bonding head moving device 160, the bonding head 120 is rotated from the upper side of the blocking plate 173 toward the upper side of the optical display module P. As the bonding head 120 rotates, the layer F1X held on the holding surface 122a slowly abuts the upper side of the optical display device P.

Before starting the bonding apparatus 100, the level of the bonding table 171 is adjusted in advance. Before starting the bonding apparatus 100, pressure sensitive paper or the like may be used in advance to measure the load distribution in the width direction of the head of the bonding head 120. The amount of gas supplied to the first pneumatic cylinder body 131a and the amount of gas supplied to the second pneumatic cylinder body 131b are adjusted so that the load distribution in the width direction of the head can be made uniform. The first load adjustment part 139a and the second load adjustment part 139b abut the bonding head 120 to the optical display component P placed on the bonding table 171 with the adjusted load.

The bonding head 120 has, for example, a weaker adhesive force than the bonding surface of the layer F1X (the adhesive layer F2a shown in FIG. 5), and can repeatedly adhere and peel off the surface protection film F4a of the layer F1X. Therefore, the layer sheet F1X pressed against the optical display module P by the adhesive layer F2a is peeled off from the holding surface 122a and attached to the upper side of the optical display module P. With the above, the lamination processing of the layer sheet F1X to the optical display module P is completed.

FIG. 4 illustrates an example of the process of transferring the non-defective good-quality layer F1X from the bonding head 120 to the optical display module P. However, the defective layer F1X having defects in the layer surface is bonded to The same applies to the case of discarded sheets placed at the discarding position. In this case, even It is also possible that the load distribution in the head width direction is uneven, so there is no need to adjust the load at both ends of the head width direction.

As described above, in the bonding apparatus 100 of the present embodiment, the first load adjustment section 139a and the second load adjustment section 139b are used at both ends in the width direction of the head of the bonding head 120 to adjust the application to the optical display Load of the layer F1X on the component P. Therefore, the load in the width direction of the head can be made uniform, and the generation of bubbles or bonding defects accompanying the unevenness of the load can be suppressed.

6 is a schematic diagram of a production system 1000 of an optical display device according to the first embodiment of the present invention. The optical display device is constituted by bonding the optical component to the optical display component P. The size of the optical component is set according to the specifications of the optical display device. As a bonding apparatus for bonding the layered sheet having the optical component to the optical display module P, the production system 1000 is provided with the bonding apparatus 100 described above.

The production system 1000 of this embodiment includes a cleaning device 1001, a first bonding device 1002, a second bonding device 1003, a peeling device 1004, a third bonding device 1005, and an inspection device 1006. The first bonding device 1002, the second bonding device 1003, and the third bonding device 1005 have the structure of the bonding device 100 described above. The cleaning device 1001, the first bonding device 1002, the second bonding device 1003, the peeling device 1004, the third bonding device 1005, and the inspection device 1006 are disposed on a series of conveyor lines that transport the optical display module P.

The cleaning device 1001 cleans the optical display module P carried in from the loader omitted in the figure, and removes foreign materials adhering to the optical display module P. The washing device 1001 may be, for example, a water washing type washing, and the first side (for example, the side on the screen side where the display area is visible) and the second side (for example, the one displayed in the display area may be seen) of the optical display assembly P The side opposite to the screen side) is scrubbed and washed with water, and thereafter, the liquid on the first side and the second side of the optical display unit P is removed. The cleaning device 1001 may also be dry cleaning, which eliminates static electricity and collects dust on the front/rear sides of the optical display component P. The optical display module P is, for example, a liquid crystal panel.

The first bonding device 1002 bonds the first layer to the first surface of the optical display component P. The first bonding device 1002 is the same as the above bonding device 100, and the head width of the bonding head can be adjusted. Load to both ends. Therefore, the load in the width direction of the head can be made uniform, so that the generation of air bubbles and bonding defects can be suppressed.

The first layer sheet is, for example, cut into a monolithic polarizing plate having a size corresponding to the external dimensions of the optical display device P. The aforementioned "size corresponding to the external dimensions of the optical display component P" refers to the size of the remaining portion that is not enough to cause practical problems when attached to the optical display component P. The first layer sheet has the same structure as the layer sheet F1X shown in FIG. 5.

For example, at the central portion of the optical display module P, a display area for displaying a screen is provided, and at the end of the optical display module P, electronic components mounted with a plurality of terminals connected to a semiconductor wafer or flexible printed circuit board wiring are installed unit. In this case, the first layer sheet refers to the use of, for example, an area having a display area larger than the size of the display area of the optical display component P and a size smaller than the outer shape (outline outline in plan view) of the optical display element P, and to avoid optical The layer of the size of the area of the functional part such as the electronic component mounting portion at the display module P.

The second bonding device 1003 bonds the second layer to the second surface of the optical display component P. The second bonding device 1003 is the same as the bonding device 100 described above, and can adjust the load on both ends of the bonding head in the width direction. Therefore, the load in the width direction of the head can be made uniform, so that the generation of air bubbles and bonding defects can be suppressed.

The second layer sheet is, for example, cut into a monolithic polarizing plate having a size corresponding to the external dimensions of the optical display device P. The second layer sheet has the same structure as the layer sheet F1X shown in FIG. 5. The transmission axis of the second layer bonded to the second surface of the optical display device P is perpendicular to the transmission axis of the first layer bonded to the first surface of the optical display device P.

On the conveying line of the optical display module P between the first bonding apparatus 1002 and the second bonding apparatus 1003, for example, a reversing device (omitted in the illustration) for reversing the front/rear sides of the optical display module P is provided ). The optical display device P that bonds the first layer sheet to the first surface is supplied to the second bonding device 1002 in a state where the front/rear surfaces are reversed.

The peeling device 1004 peels the surface protection film from the second layer sheet bonded to the second surface of the optical display module P.

The third bonding device 1005 bonds the third layer sheet to the surface of the second layer sheet from which the surface protection film is peeled off by the peeling device 1004. The third bonding device 1005 is the same as the bonding device 100 described above, and can adjust the load on both ends of the bonding head in the width direction. Therefore, the load in the width direction of the head can be made uniform, so that the generation of air bubbles and bonding defects can be suppressed.

The third layer sheet is, for example, cut into a monolithic brightness-increasing film having a size corresponding to the external dimensions of the optical display device P. The brightness increasing film is a reflective polarizing plate that can reflect linear polarized light perpendicular to the transmission axis. The third layer sheet has the same structure as the layer sheet F1X shown in FIG. 5. The transmission axis of the second layer attached to the second surface of the optical display device P is parallel to the transmission axis of the third layer attached to the second layer.

The inspection device 1006 performs inspections on whether the positions of the first layer, the second layer, and the third layer are appropriate (whether the positional deviation is within the tolerance range) with respect to the optical display assembly P. With respect to the optical display module P, for example, the position of the first layer sheet, the second layer sheet, or the third layer sheet is determined to be an inappropriate position, and then it is sent out of the system through an exclusion part not shown in the figure.

The optical display device to which the first layer sheet, the second layer sheet and the third layer sheet are bonded is subjected to additional processing such as defect inspection (foreign object inspection, etc.) or mounting of electronic components as required, and becomes an optical display device DP and ship.

In the production system 1000 described above, a bonding apparatus having the same structure as the bonding apparatus 100 described above is used as the first bonding apparatus 1002, the second bonding apparatus 1003, and the third bonding apparatus 1005. Therefore, it is possible to provide an optical display device IDP that suppresses the generation of air bubbles, bonding defects, and the like.

[Second Embodiment]

Hereinafter, a production system of a bonding apparatus and an optical display device according to a second embodiment of the present invention will be described using FIGS. 7 to 9.

FIG. 7 is a schematic diagram of the cutting process of the ply FXm in the production system of this embodiment.

In this embodiment, the difference from the first embodiment is that the layer FXm bonded to the optical display module P by the bonding head is larger than the target size (larger than the size set according to the specifications of the optical display device) (Small) the optical component FO is slightly larger, and after the layer FXm is attached to the optical display component P, the remaining part of the layer FXm is cut by the cutting device 184. Therefore, in the following description, the cutting process of the layer FXm will be mainly described. In addition, those having the same structure as the first embodiment are given the same element reference numerals and detailed description is omitted.

The cross-sectional structure of the layer FXm is the same as the layer F1X shown in FIG. 5. The long-layer optical component layer FX shown in FIG. 1 is cut to a specific size to obtain a layer FXm. The layer FXm is, for example, slightly larger than the size (the size of the first area FB) corresponding to the external dimensions of the optical display device P. The aforementioned "size corresponding to the external dimensions of the optical display component P" refers to the remaining portion that does not cause a problem in actual use when attached to the optical display component P. Because the layer FXm is larger than the size corresponding to the outer dimensions of the optical display module P, the remaining part (second area FS) that is actually in use is cut by the cutting device 184.

The bonding apparatus for bonding the layer sheet FXm to the optical display module P is the same as the bonding apparatus 100 described in the first embodiment. In this embodiment, a detection device 189 and a cutting device 184 are provided on the conveying line downstream of the bonding device.

The detection device 189 includes a photographing device 183 that photographs the optical display unit P to which the layer FXm is attached. The detection device 189 detects the cutting line WCL of the layer FXm (the position where the layer FXm should be cut) based on the photography data of the photography device 183.

The photographing device 183 photographs the optical display unit P as it passes through the layer FXm, for example, from above the optical display unit P placed on the cutting pedestal 185. The photographing device 183 is, for example, shooting a four-corner screen of the substrate (for example, color filter substrate) of the optical display unit P to which the layer FXm is attached. The detection device 189, for example, performs image processing on the photographic data, detects the position of the outer periphery of the substrate, and detects the position of the outer periphery as the cutting line WCL of the layer FXm.

The cut-off line WCL data detected by the detection device 189 is transmitted to the control device 190. The control device 190 controls the cutting device 184 based on the cutting line WCL data transmitted from the detection device 189 and cuts the layer FXm along the cutting line WCL. By this, the display area with the layer FXm The opposing first area FB and the second area FS outside the first area FB are cut and separated to cut out the optical component FO of the target size from the layer FXm.

The cut line WCL of the layer FXm is detected for the optical display unit P transported on each transport line. Therefore, even if the size of each optical display component P is different, the optical component FO corresponding to the size of the external dimensions of the optical display component P can be surely cut out from the layer FXm.

In the specification of the present invention, after laminating the layer FXm larger than the optical unit FO of the target size to the optical display unit P, according to the photographic data of the optical display unit P, the remaining part of the layer FXm is cut off. It is called "window cut method". In this embodiment, since the window-type cutting method is adopted, the optical component FO of a desired size can be bonded to the desired position of the optical display component P. By adopting the window type cutting method, the following effects can be obtained.

(i) In the case of bonding the optical component to the optical display component P, consideration is given to the size deviation of the optical display component P and the optical component FO, and the deviation (positional deviation) of the optical component FO relative to the optical display component P And the like, and the optical component FO, which is slightly larger in size than originally required, is attached to the optical display component P. However, in this method, an extra area (frame area) that is not helpful for display is formed in the peripheral portion of the display area of the optical display module P, hindering the miniaturization of the device. In the case of the window type cutting method, the optical display unit P after the layer FXm is attached is photographed, and the layer FXm is cut according to its photographic data, so that the target size optical can be surely arranged at the target position Component FO.

(ii) The optical axis direction of the layer FXm may deviate from the original design direction due to manufacturing errors. In this case, it is preferable to measure the optical axis direction of the layer FXm (optical component layer FX) in advance, and adjust the relative bonding position of the layer FXm and the optical display component P according to the measurement result, but if the layer FXm size When the FO size of the target optical component is the same, it can no longer be adjusted. In the window type cutting method, since the layer FXm larger than the optical unit FO is attached to the optical display unit P, and then the remaining part of the layer FXm is cut, this adjustment can be performed.

For example, the bonding position (relative bonding position) of the layer FXm of the optical display device P can be determined according to the following description.

First, as shown in FIG. 8A, a plurality of inspection points CP are set in the width direction of the optical component layer FX, and the optical axis direction of the optical component layer FX is detected at each inspection point CP. The timing of detecting the optical axis may be when the roll drum RX (referenced in FIG. 1) is manufactured, or it may be a period from when the roll drum RX winds out the optical component layer FX to before half-cutting. The data of the optical component layer FX in the direction of the optical axis is stored in a memory device omitted in the figure in the same way as the data of the position of the optical component layer FX in the longitudinal direction and the width direction.

The control device 190 obtains the optical axis data (inspection data distributed in the optical axis plane) of each inspection point CP from the memory device to detect the optical component layer FX (divided by the cross line CL) of the portion where the layer FXm is cut out Area) average optical axis direction.

For example, as shown in FIG. 8B, each time an angle (offset angle) between the optical axis direction and the edge line EL of the layer FXm is detected at the inspection point CP, the maximum angle (maximum offset angle) among the offset angles is taken as θmax When the minimum angle (minimum offset angle) is θmin, the average value θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Furthermore, the direction of the average offset angle θmid relative to the edge line EL of the layer FXm is detected as the direction of the average optical axis of the layer FXm. In addition, the offset angle is calculated by, for example, a positive angle in the counterclockwise direction and a negative angle in the clockwise direction with respect to the edge line EL of the layer FXm.

Moreover, the average optical axis direction of the optical element layer FX detected by the above method is at a desired angle with respect to one side of the display area P4 of the optical display element P, and determines the bonding position (relative to the layer FXm of the liquid crystal panel P) Fitting position). For example, in the case where the optical axis direction of the optical component is set at 90° with respect to the side of the display area P4 according to design specifications, the average optical axis direction of the optical component layer FX is like 90° to the side of the display area P4, The layer FXm is attached to the liquid crystal panel P.

Thereafter, the cutting line WCL of the layer FXm is detected by the detection device 189 shown in FIG. 7(a), and along the cutting line by the cutting device 184 shown in FIG. 7(b) WCL cuts the layer FXm. In this way, the optical component FO that has been precisely controlled in the direction of the optical axis is arranged to a desired size and desired position. Therefore, it is possible to provide an optical display device DP with a reduced frame having excellent display quality.

9 is a schematic diagram of a production system 2000 of an optical display device according to a second embodiment of the present invention. The production system 2000 is a production system that uses a window cut-off method. The production system 2000 is a bonding apparatus for bonding a larger layer than the optical component to the optical display component P, and includes the bonding apparatus 100 described in the first embodiment.

The production system 2000 of this embodiment includes a cleaning device 2001, a first bonding device 2002, a first cutting device 2003, a second bonding device 2004, a second cutting device 2005, a peeling device 2006, and a third bonding device The closing device 2007, the third cutting device 2008, and the inspection device 2009. Washing device 2001, first bonding device 2002, first cutting device 2003, second bonding device 2004, second cutting device 2005, peeling device 2006, third bonding device 2007, third cutting device 2008 The inspection device 2009 is arranged on a series of conveying lines that transport the optical display module P.

The cleaning device 2001, the first bonding device 2002, the second bonding device 2004, the peeling device 2006, the third bonding device 2007, and the inspection device 2009 each have the cleaning device 1001 of the first embodiment, and the first bonding The bonding device 1002, the second bonding device 1003, the peeling device 1004, the third bonding device 1005, and the inspection device 1006 have the same structure. However, in the first bonding device 2002, the second bonding device 2004, and the third bonding device 2007, a layer that is slightly larger than the optical component of the target size is bonded to the optical display component P.

The first cutting device 2003, the second cutting device 2005, and the third cutting device 2008 have the same structure as the cutting device 184 and the detection device 189 described above. That is, in the first cutting device 2003, the second cutting device 2005, and the third cutting device 2008, the optical display module P to which a layer FXm having a larger size than the optical module of the target size is attached is photographed by the imaging device, According to its photographic data, a window-cutting method for cutting the remaining part of the ply is used. Therefore, it is possible to provide an optical display device DP with a reduced frame having excellent display quality.

In the above, although a suitable embodiment of the present invention has been described with reference to the attached drawings, of course, the examples of the present invention are not limited thereto. The various shapes or combinations of the structural components shown in the above examples are examples, and various changes according to design requirements and the like are possible without departing from the gist of the present invention. For example, in the above embodiment, although the arc-shaped holding surface 122a is used The device serves as the bonding head 120, but the structure of the bonding head 120 is not limited to this. The bonding head 120 also has a holding surface with a curved shape other than a circular arc, and may also have a cylindrical holding surface.

[Industry availability]

According to the bonding device, bonding method, optical display device production system and optical display device production method of the present invention, it is possible to provide a bonding device, bonding method, optical device for suppressing bubbles or bonding defects when transferring layers Production system of display equipment and production method of optical display equipment.

100: Laminating device

110: Layer conveying device

111: Unwind

112: take-up department

113: nip roller section

113a: the first nip roller

113b: second nip roller

114: Layer table

115: Cut off section

120: fitting head

121: Fitting head body

122: Adhesive layer

122a: keep the surface

130: Fitting head drive device

131: Air cylinder body part

132: Cylinder rod

135: bottom plate

136: Swing drive

136a: Rotary support shaft

137: Rod

139: Load adjustment section

140: Fitting head lifting device

141: Lifting drive

142: Rod

150: Fitting head unit

160: mobile device with fitting head

161: Rail

162: Slider

170: Pedestal unit

171: Laminating table

172: pedestal drive

173: Stopper

190: control device

AFD: direction of rotation

F1X: slice

F3a: Separate layers

FX: optical component layer

RX: material roller

Claims (8)

A laminating device for laminating a layer to an optical display component, which comprises: a laminating table on which the optical display component is placed; a bonding head, which holds the layer on a curved holding surface and holds The layer of the holding surface abuts to the optical display component placed on the bonding table, and rotates along the bending of the holding surface, thereby bonding the layer to the optical display component; the first load adjustment Part, at the first end of the head width direction perpendicular to the rotation direction of the bonding head, adjust the load applied to the layer on the optical display assembly; the second load adjustment part, at the bonding head At the second end in the width direction of the head, adjust the load applied to the layer on the optical display assembly; the roll-out section rolls out the optical assembly layer and the separation layer from the roll drum; cut off The part is to cut the optical component layer like the separation layer to form the layer; the layer stage is to support the layer from the separation layer side; the winding part is to use the bonding head from After the separation layer is peeled off, the separation layer left alone and the nip roller portion are wound up, which is composed of a first nip roller and a second nip roller, the first nip roller and the second nip roller The pinch rollers are arranged parallel to each other in the direction of the rotation axis, and rotate synchronously with each other. In the past, the winding direction of the winding unit or the unwinding direction from the winding unit is used to transport the separation layer. , Wherein, the first load adjustment part is a first pneumatic cylinder, which is connected to the first end of the bonding head, and abuts the bonding head toward the optical display component placed on the bonding table; The second load adjustment part is a second pneumatic cylinder, which is connected to the second end of the bonding head, and presses the bonding head toward the optical display component placed on the bonding table; The closing head abuts the holding surface against the layer resting on the layer table, and rotates along the bending of the holding surface, so that the layer is peeled off from the separation layer and held on the holding surface, And the winding part rotates synchronously with the nip roller part, so that when the bonding head abuts the holding surface against the ply and starts to rotate, toward the unwinding of the separated ply Direction rotation; in the second period after the first period ends to the end of the rotation, it turns in the direction of winding up the separation layer. The bonding device according to claim 1, wherein a blocking plate adjacent to the optical display component is provided on the bonding table; and the bonding head makes the holding surface abut against the blocking block After the upper side of the board, it continuously rotates along the upper side of the blocking plate and the upper side of the optical display component, so as to attach the layer held on the holding surface to the optical display component. A production system of an optical display device is to bond an optical component to an optical display component to make an optical display device, which includes a bonding device for bonding a layer as the optical component to the optical display component; wherein, the The bonding device is the bonding device described in claim 1 or 2. A production system of an optical display device is to attach an optical component to the optical display component to make an optical display device, which comprises: a bonding device, which is to attach a layer larger than the optical component to the optical display component ; The detection device is to photograph the optical display component to which the ply is attached, and detects the cutting line of the ply based on its photographic data; and the cutting device is to stick to the cutting line along the cutting line The layer of the optical display component is cut to cut the optical component from the layer; wherein the bonding device is the bonding device described in claim 1 or 2. A laminating method, which is to laminate a layer to an optical display component, including: a placing step, which is to place the optical display component on a laminating station; and a laminating step, to hold the layer at the laminating head The curved holding surface, the layer held on the holding surface is pressed against the optical display component placed on the bonding table, and the bonding head is rotated along the bending of the holding surface The layer is attached to the optical display component; the first load adjustment step is to adjust the layer applied to the optical display component at the first end of the head width direction perpendicular to the rotation direction of the bonding head Load; second load adjustment step, at the second end of the head in the width direction of the bonding head, adjust the load applied to the layer on the optical display assembly; the unwinding step is from the material roll roller Roll out the optical component layer together with the separation layer; The cutting step is to cut the optical component layer like the separation layer to form the layer; the supporting step is to support the layer from the separation layer side by the layer stage; and the winding step is to After the layer is peeled off from the separation layer by the bonding head, the separation layer left alone is formed by the nip roller portion formed by the first nip roller and the second nip roller that rotate in synchronization with each other To carry, and take up by the take-up section, the first load adjustment step is to place the attachment head toward the placement by the first pneumatic cylinder connected to the first end of the attachment head The optical display assembly of the bonding table is pressed against; the second load adjustment step is to place the bonding head toward the mounting by the second pneumatic cylinder connected to the second end of the bonding head The optical display component of the bonding table is pressed against; the step of bonding is to press the holding surface of the bonding head against the layer resting on the layer table, and make the bonding head hold along the The surface is bent and rotated, so that the ply is peeled off from the separation ply and held on the holding surface, and in the winding step, when the bonding head abuts the holding surface against the ply and starts to rotate During the first period of time, the winding part rotates synchronously with the nip roller part while rotating in the direction of unwinding the separated layer; after the first period passes to the second period after the rotation ends, the The winding unit rotates in the direction of winding the separation layer while rotating in synchronization with the nip roller unit. The bonding method according to claim 5, wherein a blocking plate adjacent to the optical display component is provided on the bonding table; and In the bonding step, after the holding surface of the bonding head is pressed against the upper side of the baffle plate, the bonding head is made to follow the upper side of the baffle plate and the upper side of the optical display component Continuous rotation, so as to attach the layer held on the holding surface to the optical display assembly. A production method of an optical display device is to attach an optical component to an optical display component to make an optical display device, which comprises: a bonding step of attaching a layer as the optical component to the optical display component; wherein, This bonding step implements the bonding method described in claim 5 or 6. A production method of an optical display device is to attach an optical component to the optical display component to make an optical display device, which comprises: a bonding step, which is to attach a layer larger than the optical component to the optical display component The detection step is to photograph the optical display component with which the ply is attached, and to detect the cutting line of the ply based on its photographic data; and the cutting step is to stick to the line along the cutting line The ply of the optical display component is cut to cut the optical component from the ply; wherein the bonding step is to implement the bonding method described in claim 5 or 6.

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