TWI688740B - Heat sink and electronic device using same - Google Patents

Abstract

A heat sink includes at least a housing. The housing includes an upper housing and a lower housing. The upper housing and the lower housing being oppositely disposed and sealed to form a cavity. The heat sink further includes a wick structure and a coolant fluid. The wick structure and the coolant fluid are accommodated in the cavity. The area of the upper housing is larger than the area of the lower housing. And the upper housing forms a protrusion with respect to an edge of the lower housing. The present invention also provides an electronic device using the heat sink.

Description

Radiator and electronic device with the same

The invention relates to a radiator and an electronic device with the radiator.

At present, VC (Vapor-Chamber) is widely used in electronic devices to obtain better heat dissipation effect. However, the current assembly of VC is mostly achieved by adding additional components on its own to achieve the purpose of installation on an electronic device. This increases the thickness of the electronic device, which is not in line with the current trend of thinning electronic devices.

In view of this, it is necessary to provide a heat sink that does not affect the thickness of the electronic device itself.

The invention also provides an electronic device with the heat sink.

A radiator includes at least a shell, the shell includes an upper shell and a lower shell, the upper shell and the lower shell are disposed oppositely and sealed to form a cavity, and the radiator further includes capillary Structure and heat dissipation liquid, the capillary structure and the heat dissipation liquid are accommodated in the cavity, the area of the upper case is larger than that of the lower case, and the upper case is opposite to the edge of the lower case Form a protrusion.

An electronic device includes at least a middle frame, the electronic device further includes a heat sink, the heat sink includes a housing, a capillary structure, and a heat dissipating liquid, the housing includes an upper housing and a lower housing, and the upper housing It is arranged opposite to the lower case and sealed to form a cavity, the capillary structure and the heat dissipation liquid are accommodated in the cavity, the area of the upper case is larger than that of the lower case, The upper casing forms a protrusion with respect to the edge of the lower casing, and the middle frame includes a groove, and the groove is used to receive the heat sink.

In summary, the radiator uses a combination of upper and lower shells of different sizes to form a shell. Wherein, the upper shell forms a protrusion with respect to the edge of the lower shell. The protrusion is correspondingly embedded in the stepped structure of the groove, so that the radiator can be assembled to the middle frame without resorting to other fastening components, thereby reducing the assembly of the radiator to the Time for electronic devices, thereby improving production efficiency. At the same time, the heat sink is just accommodated in the groove, so that the thickness of the middle frame remains unchanged, thereby ensuring the thinning requirement of the electronic device.

100: electronic device

10: Middle frame

101: first surface

103: second surface

105: groove

30: radiator

301: Shell

3011: Upper case

3012: protrusion

3013: Lower case

3015: Cavity

303: Coolant

305: Capillary structure

40: back cover

50: circuit board

60: battery

70: display

FIG. 1 is an exploded schematic diagram of an electronic device according to a preferred embodiment of the present invention.

2 is a schematic cross-sectional view of a middle frame and a heat sink in the electronic device shown in FIG. 1.

3 is a schematic cross-sectional view of the heat sink in the electronic device shown in FIG. 1.

The technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons with ordinary knowledge in the technical field without making creative work fall within the protection scope of the present invention.

It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to another component or may be centered at the same time. When a component is considered to be "set on" another component, it may be set directly on another component or there may be a centered component at the same time.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terminology used in the description of the present invention herein is for the purpose of describing specific embodiments, and is not intended to limit the present invention.

Referring to FIG. 1, the present invention provides an electronic device 100. The electronic device 100 may be, but not limited to, a mobile phone, a tablet computer, a watch, or the like. In this embodiment, the electronic device 100 is used as a mobile phone as an example for description.

The electronic device 100 at least includes a back cover 40, a circuit board 50, a battery 60, a middle frame 10, a heat sink 30 and a display screen 70. Wherein, the heat sink 30 is embedded in the middle frame 10. The circuit board 50 and the battery 60 are arranged adjacent to each other. The circuit board 50 and the battery 60 are located between the back cover 40 and the middle frame 10. The circuit board 50 and the battery 60 are located between the back cover 40 and the heat sink 30. The middle frame 10 and the heat sink 30 are located between the circuit board 50 and the display screen 70. The middle frame 10 and the heat sink 30 are located between the battery 60 and the display screen 70.

It can be understood that the electronic device 100 may further include, but is not limited to, an antenna, a camera, and the like that implement its preset function.

Please refer to FIG. 2 together. The middle frame 10 includes a first surface 101 and a second surface 103 opposite to the first surface 101. The surface of the middle frame 10 facing the circuit board 50 is the first surface 101, and the surface of the middle frame 10 facing the display screen 70 is the second surface 103. In this embodiment, the middle frame 10 further includes a groove 105. The groove 105 penetrates the first surface 101 and the second surface 103. Wherein, the groove 105 is used to receive the heat sink 30. Of course, in other embodiments, the groove 105 may only penetrate the first surface 101 or the second surface 103.

It can be understood that the middle frame 10 can also be used to support the display screen 70, provide a ground plane, perform electromagnetic shielding, and improve the structural strength of the electronic device 100.

Please refer to FIG. 3 together. The heat sink 30 at least includes a housing 301, a heat dissipation liquid 303 and a capillary structure 305. The heat sink 30 is used to assist the heat dissipation of heat generating components such as IC (Integrated Circuit, Integrated Circuit) and battery 60 in the electronic device 100, thereby improving the operation performance of the electronic device 100. Wherein, the IC (Integrated Circuit, integrated circuit) may be a CPU (Central Processing Unit, central processing unit), RFIC (Radio Frequency Integrated Circuit, radio frequency integrated circuit), PMIC (Power Management IC, power management integrated circuit) and so on. It can be understood that, in this embodiment, the IC is provided on the circuit board 50, and the IC and the battery 60 are in close contact with the heat sink 30.

The housing 301 may be made of metal material. The housing 301 includes an upper housing 3011 and a lower housing 3013. The upper housing 3011 and the lower housing 3013 are oppositely arranged and sealed to form a cavity 3015. Wherein, the upper casing 3011 and the lower casing 3013 can be connected together by welding, bonding or the like.

In an embodiment, the upper housing 3011 and the lower housing 3013 may be integrally formed to form a housing 301 having a cavity 3015.

In this embodiment, the area of the upper housing 3011 is larger than the area of the lower housing 3013. As such, when the lower case 3013 and the upper case 3011 are connected together, the upper case 3011 forms a protrusion 3012 relative to the edge of the lower case 3013. Wherein, the protruding portion 3012 belongs to a part of the upper housing 3011.

The casing 301 is received in the groove 105 of the middle frame 10.

Specifically, please refer to FIG. 2 again, the cross section of the groove 105 is stepped, and the stepped cross section matches the structure of the housing 301, so that the housing 301 is just accommodated in the recess The groove 105 keeps the thickness of the middle frame 10 unchanged, thereby ensuring the thinning of the electronic device 100. The surface of the upper housing 3011 away from the lower housing 3013 is flush with the first surface 101, and the surface of the lower housing 3013 away from the upper housing 3011 is flush with the second surface 103 level. At the same time, the protrusion 3012 in the housing 301 is correspondingly embedded in the stepped structure of the groove 105, so that the radiator 30 can be assembled to the middle frame 10 by glue, double-sided adhesive or welding Without resorting to other fastening components.

The heat dissipation liquid 303 is accommodated in the cavity 3015. The heat-dissipating liquid 303 can perform mutual conversion between the gas phase and the liquid phase at a certain temperature, so as to realize the heat-dissipating function of the radiator 30. among them, The heat dissipation liquid 303 converts the liquid phase to the gas phase by evaporation to absorb heat, and dissipates heat by the diffusion of the evaporated gas in the cavity 3015.

The capillary structure 305 is accommodated in the cavity 3015 and is disposed on at least one of the upper housing 3011 and the lower housing 3013. The capillary structure 305 is used to guide the heat dissipation liquid 303 after condensing and condensing to return to the cavity 3015 by the capillary phenomenon. Preferably, the capillary structure 305 may be foam.

In summary, the radiator 30 uses the upper shell 3011 and the lower shell 3013 of different sizes to form a shell 301. Wherein, the upper housing 3011 forms a protrusion 3012 relative to the edge of the lower housing 3013. The protrusion 3012 is correspondingly embedded in the stepped structure of the groove 105, so that the heat sink 30 can be assembled to the middle frame 10 by glue, double-sided adhesive or welding without other fastening Components, thereby reducing the assembly time of the heat sink 30 to the electronic device 100, thereby improving production efficiency. At the same time, the heat sink 30 is just received in the groove 105 to keep the thickness of the middle frame 10 unchanged, thereby ensuring the thinning of the electronic device 100.

In summary, the present invention meets the requirements of the invention patent, and the patent application is filed in accordance with the law. However, the above are only preferred embodiments of the present invention. For those who are familiar with the skills of this case, equivalent modifications or changes made in accordance with the spirit of the present invention should be covered by the following patent applications.

30: radiator

301: Shell

3011: Upper case

3012: protrusion

3013: Lower case

3015: Cavity

303: Coolant

305: Capillary structure

Claims (9)

A radiator includes at least a housing, the improvement is that the housing includes an upper housing and a lower housing, the upper housing and the lower housing are disposed oppositely, and sealed to form a cavity, the heat dissipation The device further includes a capillary structure and a heat dissipation liquid. The capillary structure and the heat dissipation liquid are contained in the cavity. The area of the upper housing is larger than that of the lower housing, and the upper housing is opposite to the lower The edge of the casing forms a protrusion, wherein the capillary structure is foam and is arranged above the lower casing. The radiator as described in item 1 of the patent application scope, wherein the housing is made of a metal material. The radiator as described in item 1 of the patent application scope, wherein the protrusion belongs to a part of the upper case. An electronic device includes at least a middle frame. The improvement is that the electronic device further includes a heat sink. The heat sink includes a housing, a capillary structure, and a heat dissipation liquid. The housing includes an upper housing and a lower housing. The upper case and the lower case are oppositely arranged and sealed to form a cavity, the capillary structure and the heat dissipation liquid are accommodated in the cavity, and the area of the upper case is larger than that of the lower case Body, the upper shell forms a protrusion with respect to the edge of the lower shell, the middle frame includes a groove, the groove is used to receive the radiator, wherein the capillary structure is foam and is provided on the Describe above the lower case. The electronic device as described in item 4 of the patent application range, wherein the cross section of the groove is stepped, and the stepped cross section matches the structure of the casing so that the casing is just accommodated in Inside the groove. The electronic device as described in item 5 of the patent application range, wherein the protrusion in the housing is correspondingly embedded in the stepped structure of the groove, so that the housing is assembled to the middle frame. The electronic device as described in item 4 of the patent application range, wherein the middle frame includes a first surface and a second surface opposite to the first surface, and the groove penetrates the first surface and all In the second surface, a surface of the upper casing away from the lower casing is flush with the first surface, and a surface of the lower casing away from the upper casing is flush with the second surface. The electronic device according to item 4 of the patent application scope, wherein the middle frame includes a first surface and a second surface opposite to the first surface, and the groove penetrates the first surface or the first surface Two surfaces. The electronic device as described in item 4 of the patent application scope, wherein the electronic device further includes a back cover, a circuit board, a battery and a display screen, the heat sink is embedded in the middle frame, the circuit board and the The batteries are arranged adjacently, the circuit board and the battery are located between the back cover and the middle frame, the circuit board and the battery are located between the back cover and the heat sink, the middle The frame and the heat sink are located between the circuit board and the display screen, and the middle frame and the heat sink are located between the battery and the display screen.

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