TWI686266B - Dresser with porous structure - Google Patents

Abstract

The invention relates to a dresser with a porous structure, which includes a bottom base and an abrasive layer, the bottom base has a dressing surface on one side of the bottom base, and a forming surface formed in the bottom base and penetrating the bottom base The porous structure of the trimming surface can allow a fluid to flow between the porous structures. Therefore, the trimmer of the present invention will no longer be confined to the arrangement of the pipeline for transporting fluid when used, but will be more flexible in use.

Description

Dresser with porous structure

The invention relates to a dresser, in particular to a dresser with a porous structure used in a chemical mechanical planarization process.

The chemical mechanical planarization process is one of the common wafer planarization technologies in the current semiconductor manufacturing process because it can achieve the goal of large-scale planarization of the workpiece. In this process, the polishing pad is used to contact the wafer, and the polishing liquid is used to remove impurities or uneven structures on the surface of the wafer, which can also be called a polishing process.

However, after using the polishing pad for a period of time, the abrasive debris accumulated during the polishing process will remain on the surface of the polishing pad, making the polishing effect poor. Therefore, the conventional technology uses a dresser to dress the surface of the polishing pad, so that the surface of the polishing pad is roughened again, and the workpiece including the wafer can be polished.

In the conventional technology, for example, Korean Patent Publication No. KR20000019355 teaches a dresser and a method of dressing to avoid scratches on the wafer during the grinding process. The dresser includes a polishing table having a polishing pad, a supply unit for supplying a polishing liquid to the polishing pad, a polishing head for polishing a wafer, a dresser for dressing the polishing pad, and a dresser formed on the side of the polishing table The dresser parking slot for placing the dresser includes a deionized water supply line and a chemical supply line, through which liquid can be supplied to the surface of the polishing pad. Another example is U.S. Patent Publication No. US5876508, which teaches a method of cleaning slurry residue after completing chemical mechanical grinding. After preparing the cleaning agent, the cleaning agent is then directed to the nozzle formed in the dresser, and the cleaning agent can be sprayed to the grinding On the pad, to achieve the effect of cleaning the polishing pad.

Looking at the products of the current dresser, the main material is stainless steel or metal material. The liquid supply method is to directly supply liquid to the surface of the polishing pad, to supply liquid from the tool of the dresser, to supply liquid from the outer ring of the dresser, and from dressing A hole is made in the center of the device and four kinds of liquid are supplied through the hole. However, the above four methods all require additional liquid supply devices or fluid channels, and the fluid distribution is not good.

For issues such as the above, the applicant of the present invention has provided a grinding wheel with an internal fluid supply structure. Please refer to Republic of China Patent Publication No. I577505. The grinding wheel is installed on a drive shaft with a liquid supply hole, including a permeable layer and a porous wheel body , Porous grinding layer, first water-impermeable layer and second water-impermeable layer. Therefore, when the liquid is introduced through the liquid supply hole of the drive shaft, it will be centrifugal force through the water-permeable layer, the porous wheel body to the porous grinding layer, effectively improving the fluid distribution. However, the previous case is the application of grinding wheels. At present, there is still no better way to improve the problem that the dresser must be additionally provided with a liquid supply device or a fluid channel and the distribution of the fluid is not good.

One of the objects of the present invention is to solve the conventional chemical mechanical planarization process, because it has to rely on the additional provision of liquid supply pipelines to supply liquids, or to provide gas passages for gas to pass, so the dresser is designed to match the pipeline settings. Disadvantages of limited use of dressers.

Another object of the present invention is to improve fluid distribution in a chemical mechanical planarization process.

In order to achieve the above object, in one embodiment of the present invention, a dresser having a porous structure is provided. The dresser having a porous structure includes: a bottom base having a side located on the side of the bottom base A trimming surface and a porous structure formed in the bottom base and penetrating the trimming surface; and an abrasive layer formed on the trimming surface.

In an embodiment of the invention, one of the bottom bases has a porosity between 5% and 80%.

In an embodiment of the invention, the pore size of the bottom base is between 100 nm and 50 mm.

In an embodiment of the invention, the flow system is a liquid, a gas, or a combination thereof.

In an embodiment of the invention, the material of the bottom base is a ceramic material.

In an embodiment of the invention, the material of the bottom base includes at least one oxide of manganese, iron, copper, cobalt, chromium, silicon, magnesium, or aluminum.

In an embodiment of the invention, the abrasive layer includes a bonding layer and a plurality of abrasive particles disposed on the bonding layer.

In an embodiment of the invention, the polishing layer includes a plurality of through holes and a plurality of polishing walls interposed between the through holes.

In an embodiment of the invention, the bonding layer is a metal material, a brazing material, a resin material, or a ceramic material.

In an embodiment of the invention, the abrasive particles are diamond, alumina, silicon carbide, cubic boron nitride, or a combination thereof.

In an embodiment of the invention, the polishing layer is a diamond coating formed by chemical vapor deposition, and the diamond coating has a plurality of polishing protrusions.

In an embodiment of the invention, at least one sub-substrate is further interposed between the bottom base and the polishing layer.

In an embodiment of the invention, the polishing layer is disposed on a side of the sub-substrate away from the bottom base.

In an embodiment of the invention, an adhesive layer is further interposed between the bottom base and the sub-substrate.

In one embodiment of the present invention, the adhesive layer is a resin material. In a preferred embodiment, the resin material may be epoxy resin, phenol resin, acrylic resin, or the like.

In an embodiment of the invention, the sub-substrate has a plurality of sub-substrate protrusions, and the sub-substrate protrusions extend radially along a center of the sub-substrate.

Therefore, the effects achieved by the present invention compared to the conventional technology are:

At present, the main materials of the products related to the trimmer are mostly stainless steel materials or metal materials, and additional liquid supply devices or fluid channels are required, and the distribution of the fluid is not good; even as used in the cushion trimming as disclosed in US Patent Publication No. US20130344779 The material of the substrate and grinding tip of the substrate is not a conventional stainless steel material or metal material, but a carbide material, a ceramic material, or a composite ceramic material. However, it is not given that such a substrate has a porous structure for fluid The technical instruction circulating in it. In contrast, the dresser of the present invention has a porous structure. When in use, these porous structures can be used as channels for liquids such as grinding fluid, cooling water, etc., without the need to rely on additional piping to provide continuous The liquid makes the use of the dresser no longer restricted by the pipeline and more flexible.

The dresser of the present invention can supply gas through the porous structure, so that the auxiliary workpiece can be combined with or separated from the dresser by the supply of gas or not, and the surface scraps of the dresser can be removed by supplying gas. Improve the chip removal function of the dresser.

The detailed description and technical content of the present invention are described below in conjunction with the drawings:

First embodiment

"Figure 1" is a schematic diagram of a dresser with a porous structure according to a first embodiment of the present invention, which is a standard chemical mechanical polishing pad dresser (ie, standard diamond) mainly including a bottom base 10 and a polishing layer 20 dish).

In this embodiment, one side of the bottom base 10 is a trimming surface 11, and the bottom base 10 has a porous structure 12 a formed in the bottom base 10 and penetrating the trimming surface 11.

In this embodiment, the material of the bottom base 10 may be a ceramic material. Moreover, in a preferred embodiment, the bottom base 10 includes at least one ceramic material selected from oxides of manganese, iron, copper, cobalt, chromium, silicon, magnesium, or aluminum, for example, Fe _x O _y , Mn _x O _y , SiO ₂ , CaCO ₃ and/or MgCO ₃ ceramic materials can produce the porous structure 12a after firing. In order to ensure that fluids such as liquid and/or gas can flow between the porous structures, in this embodiment, the porosity of the bottom base 10 may be between 5% and 80%, preferably between 30% and 50 %; as defined by the pore size, in this embodiment, the pore size of the bottom base 10 may be between 100 nm and 50 mm, preferably between 5 mm and 20 mm.

The polishing layer 20 is formed on the trimming surface 11 of the bottom base 10. In this embodiment, the polishing layer 20 also has a porous structure 12 b, and the material forming the polishing layer 20 and the bottom base 10 are formed The materials may be the same as or different from each other. Specifically, the polishing layer 20 of this embodiment includes a bonding layer 24 and a plurality of abrasive particles 23 dispersed in the bonding layer 24. The bonding layer 24 may be brazed Material, metal sintered material, metal plating material, ceramic material, or resin material, when ceramic material is selected as the bonding layer 24, the bonding layer 24 and the material forming the bottom base 10 may be the same; When a solder material, a metal sintered material, a metal plating material, or a resin material is used as the bonding layer 24, the bonding layer 24 is different from the material forming the bottom base 10. The abrasive layer 20 includes a bonding layer 24 and a plurality of abrasive particles 23 disposed on the bonding layer 24, and the abrasive particles 23 partially expose the bonding layer 24 to provide an abrasive effect.

Since the polishing layer 20 needs to be hardened by brazing or sintering, the polishing layer 20 is fixedly bonded to the bottom base 10. Therefore, in this embodiment, the bonding layer 24 can be made of a metal material, A brazing material, a resin material, or a ceramic material is selected; and the abrasive particles 23 may be selected from diamond, alumina, silicon carbide, cubic boron nitride, or a combination thereof, the present invention does not have any special limit.

Second embodiment

For a dresser having a porous structure according to the second embodiment of the present invention, please refer to "Figure 2A" to "Figure 2C", which is a honeycomb type chemical mechanical polishing pad dresser (ie, a honeycomb type diamond disc).

Among them, "Figure 2A" is a schematic diagram of a dresser of this embodiment; "Figure 2B" is an enlarged schematic diagram of the polishing layer 20 of "Figure 2A"; "Figure 2C" is also an enlarged schematic diagram of "Figure 2B".

Similar to the first embodiment, the dresser of this embodiment mainly includes the bottom pedestal 10 and the abrasive layer 20, and the bottom pedestal 10 has the same through the dressing surface 11 as the first embodiment described above The porous structure 12 is not repeated here, but the difference lies in the structure of the polishing layer 20.

In this embodiment, the polishing layer 20 includes a plurality of through holes 21 and a plurality of polishing walls 22 interposed between the through holes 21, the through holes 21 are closely and regularly arranged with each other, and each of the polishing walls 22 It is between the through holes 21. The abrasive wall 22 may include a bonding layer 24 and a plurality of abrasive particles 23, and the abrasive particles 23 also partially expose the bonding layer 24. In order to obtain the above-mentioned structure, a structure including the bonding layer 24 may be first formed during manufacturing After the body, the abrasive particles 23 are provided on the bonding layer 24 to obtain the abrasive wall 22; or the material forming the bonding layer 24 is directly mixed with the abrasive particles 23 to form the abrasive wall 22. The grinding wall 22 may have a single-layer structure, but it may also have a multi-layer structure, which can be adjusted according to requirements without particular restrictions. In addition, since the through holes 21 of the polishing layer 20 can be used as channels for supplying liquid or gas, the polishing layer 20 in this embodiment can be arbitrarily selected as a porous structure or a non-porous structure.

Here, various manufacturing methods of the polishing layer 20 including the through holes 21 are further provided for explanation, please refer to "Figure 2D" to "Figure 2F". The polishing layer 20 of "FIG. 2D" has a double-layer structure; the polishing layer 20 of "FIG. 2E" has a three-layer structure; the polishing layer 20 of "FIG. 2F" has a single-layer structure.

In one embodiment, a honeycomb net made of aluminum can be used, and a carrier wall 221 is provided between the holes of the honeycomb net. After a bonding layer 24 is formed on the carrier wall 221 by electroplating or other suitable methods, the abrasive particles 23 are fixed to the carrier wall 221 through the bonding layer 24 and exposed as the polishing wall 22. At this time, the polishing The layer 20 may be a double layer having "the abrasive wall 22 (the bonding layer 24 containing the abrasive particles 23)/the carrier wall 221" or "the abrasive wall 22 (the bonding layer 24 containing the abrasive particles 23)/ The three-layer structure of the carrier wall 221/the abrasive wall 22 (the bonding layer 24 containing the abrasive particles 23), and the material of the bonding layer 24 may be the same as or different from the carrier wall 221 of aluminum; or, An adhesive layer can be disposed on a titanium substrate as a temporary substrate. The adhesive layer can be an adhesive layer with through holes, and then an electroplating method is used to form a plating layer in the die hole in the adhesive layer, and the As the bonding layer 24, an electroplating layer partially covers the abrasive particles 23 pre-arranged in the adhesive layer, and after completion, the adhesive layer and the titanium substrate as a temporary substrate are removed directly from the electroplating layer The through hole (not shown) and the polishing wall 22 are formed into the polishing layer 20. At this time, the polishing layer 20 is a single-layer structure including only the polishing wall 22; or, first, a plurality of The template of regularly arranged regular hexagonal slits forms a fixing material and the abrasive particles 23 in the polygonal slit, so that when the template is removed, the fixing material forms the bonding layer 24, Moreover, the abrasive particles 23 are attached to both sides of the bonding layer 24 as the abrasive wall 22. At this time, the abrasive layer 20 is a single-layer structure including only the abrasive wall 22.

Incidentally, in this embodiment, a regular hexagonal honeycomb structure is taken as an example. However, in addition to the regular hexagonal honeycomb structure described above, the cross section of the through hole 21 can also be selected according to requirements It is a triangle, a quadrilateral, a pentagon, a circle, an ellipse, or any combination of the above shapes.

Third embodiment

The third embodiment of the present invention is a combined chemical mechanical polishing pad dresser. Similar to the first and second embodiments, the dresser of this embodiment mainly includes the bottom base 10 and the polishing layer 20. In addition, the bottom base 10 has the porous structure 12 penetrating the trimming surface 11 in the same way as the aforementioned first embodiment, which is not described here again, but the difference lies in the structure of the polishing layer 20.

Please refer to "Figure 3A" to "Figure 3E". In the third embodiment, a sub-substrate 40 is further included between the polishing layer 20 and the bottom base 10. In this embodiment, an adhesive layer 30 can be used between the sub-substrate 40 and the bottom base 10 to securely set the sub-substrate 40 on the bottom base 10. The adhesive layer 30 can be a resin material For example, epoxy resin, phenolic resin, acrylic resin, or the like.

In addition, since the sub-substrate 40 is arranged and arranged in a partial area (not shown, referred to as a "covering area") of the bottom base 10 in a manner such as a ring or an array, the bottom base of the sub-substrate 40 is not covered 10 (not shown, called "uncovered area") can be used as a channel for supplying liquid or gas, or as an outlet for supplying liquid or gas. Therefore, the polishing layer 20 or the sub-substrate 40 in this embodiment can Arbitrarily selected as porous structure or non-porous structure.

"FIG. 3A" is the first aspect of the third embodiment, which includes a plurality of sub-substrates 40, and the polishing layer 20 is disposed on each side of the sub-substrate 40 away from the bottom base 10. The sub-substrates 40 may be formed to have a porous structure (not shown) or a non-porous structure (not shown), and when the sub-substrates 40 have a porous structure, the sub-substrates 40 The material of the substrate 40 may be the same as the material of the bottom base 10, that is, the sub-substrates 40 and the bottom base 10 are both a ceramic material; however, in other embodiments, the material of the sub-substrates 40 may be the same as the The materials of the bottom base 10 are different. For example, the sub-substrate 40 is a stainless steel material, and the bottom base 10 is a ceramic material.

In this embodiment, the sub-substrates 40 may be quadrilateral planar substrates, which are arranged on the bottom base 10 in a matrix manner; but in other aspects, such as "FIG. 3B", they may also be circular A planar substrate, the sub-substrates 40 are rounded and arranged on the bottom base 10, and the adhesive layer (not shown) may be further formed between the sub-substrates 40 and the bottom base 10 to strengthen the The combination of the sub-substrates 40 and the bottom base 10; in other embodiments, the shapes of the sub-substrates 40 can also be polygons such as triangles, pentagons, etc., and the arrangement can also be adjusted according to requirements. There are no special restrictions.

The polishing layer 20 is formed on the sub-substrates 40, and the method for forming the polishing layer 20 is not particularly limited. For example, a chemical vapor deposition method may be used to form a diamond coating film with a plurality of polishing protrusions 25 on the sub-substrates 40 as the polishing layer 20; or the abrasive particles 23 may be arranged on the sub-substrates first After 40, it is bonded to the bottom base 10 by brazing.

"FIG. 3C", "FIG. 3D", and "FIG. 3E" are another aspect of this embodiment. This aspect uses the adhesive layer 30 to securely mount a sub-substrate 40 on the bottom base 10. The The sub-substrate 40 is a non-planar substrate. In detail, the sub-substrate 40 may have a central region 40a and an outer ring region 40b surrounding the central region 40a, and there are a plurality of sub-substrate protrusions 41 in the outer ring region 40b, the sub-substrate protrusions 41 are along One center of the sub-substrate 40 extends radially and has an arc, and a chip discharge channel is formed between the two sub-substrate protrusions 41. Similar to the other aspects described above, the sub-substrate 40 may be a substrate with a non-porous structure 12, such as "Figure 3D"; it may also be a substrate with a porous structure 12, such as "Figure 3E". Therefore, when a diamond coating is formed on the sub-substrates 40 by chemical vapor deposition, the diamond coating will form a plurality of polishing protrusions 25 as the polishing layer 20 following the sub-substrate protrusions 41.

In particular, the invention can be designed to have the adhesive layer 30 only at the bottom of the sub-substrate 40, and the area that does not cover the sub-substrate 40 does not require the adhesive layer 30, so that the fluid can penetrate the bottom base 10 The porous structure 12 reaches the trimming surface 11 without hindrance, and achieves the purpose of being evenly distributed in the trimmer.

The present invention takes the first embodiment to the third embodiment as examples to illustrate the application of the bottom base 10 with a porous structure to various dressers of different specifications. Because the bottom base 10 has the porous structure 12, during the dressing process, the liquid including the grinding liquid and the cooling water can be uniformly distributed in the dressing through the porous structure as a channel In the device, it is not necessary to rely on the additional piping to continuously provide liquid as the conventional trimmer, which is more flexible when used and is also beneficial for industrial applications.

Furthermore, when the dresser of the present invention is further used to connect a device capable of inhaling or blowing the dresser to the bottom substrate 10 when in use, because the bottom base 10 of the dresser has the porous Because of the structure 12, the gas can flow smoothly in it, which not only can simply and quickly achieve the effect of adsorbing or separating the work pieces, but also facilitates the chip removal of the dresser when blowing.

The present invention has been described in detail above, but the above is only a preferred embodiment of the present invention, which should not limit the scope of the present invention. That is, all changes and modifications made within the scope of the application of the present invention should still fall within the scope of the patent of the present invention.

The bottom surface 10 of the base 11 trimming 12,12a, 12b of the porous structure 20 through hole 22 abrasive polishing layer 21 of abrasive particles 24 wall 23 binding protrusions 30 of the polishing layer 25 adhesive layer 40 the central region 40a of the substrate sub-region 40b of the outer ring 41 submount Raised AA section line

"Figure 1" is a schematic diagram of a dresser having a porous structure according to a first embodiment of the present invention. "Figure 2A" is a schematic diagram of a dresser having a porous structure according to a second embodiment of the present invention. "Figure 2B" is an enlarged schematic view of the abrasive layer of "Figure 2A". "Figure 2C" is an enlarged schematic view of "Figure 2B". [FIG. 2D] is a partially enlarged schematic view of [FIG. 2C] in an embodiment of the present invention, and the polishing layer has a double-layer structure. [FIG. 2E] is a partially enlarged schematic view of [FIG. 2C] in another embodiment of the present invention, and the polishing layer has a three-layer structure. [FIG. 2F] is a partially enlarged schematic view of [FIG. 2C] in another embodiment of the present invention, and the polishing layer has a single-layer structure. "Figure 3A" is a cross-sectional view of a trimmer having a porous structure in an aspect of the third embodiment of the present invention. "Figure 3B" is a cross-sectional view of a dresser having a porous structure in another aspect of the third embodiment of the present invention. "Figure 3C" is a schematic diagram of a dresser having a porous structure in another aspect of the third embodiment of the present invention. "Figure 3D" is a schematic diagram of the A-A cross-sectional view of an implementation form of "Figure 3C". [FIG. 3E] is a schematic diagram of A-A cross-sectional view of another embodiment of [FIG. 3C].

10 Bottom base 11 Finishing surface 12a, 12b porous structure 20 Abrasive layer 23 Abrasive particles 24 Bonding layer

Claims (10)

A dresser with a porous structure includes: a bottom base having a dressing surface and a porous structure formed in the bottom base and penetrating the dressing surface for a fluid to flow through, The flow system is a liquid, a gas, or a combination thereof, and a porosity of the bottom pedestal is between 5% and 80%, and a pore size of the bottom pedestal is between 100 nm and 50 μm; and a An abrasive layer formed on the trimming surface, the abrasive layer is a porous structure, including a bonding layer and a plurality of abrasive particles disposed on the bonding layer, the bonding layer is a metal material, a brazing material, a resin material , Or a ceramic material. The trimmer with a porous structure as described in item 1 of the patent application scope, wherein the material of the bottom base is a ceramic material. The finisher having a porous structure as described in item 2 of the patent application scope, wherein the material of the bottom base includes at least one oxide of manganese, iron, copper, cobalt, chromium, silicon, magnesium, or aluminum. The dresser with a porous structure as described in item 1 of the patent application scope, wherein the polishing layer includes a plurality of through holes and a plurality of polishing walls interposed between the through holes. The dresser having a porous structure as described in item 1 of the patent application scope, wherein the abrasive particles are diamond, alumina, silicon carbide, cubic boron nitride, or a combination thereof. The dresser having a porous structure as described in item 1 of the patent application scope, wherein at least one sub-substrate is further interposed between the bottom base and the polishing layer. The dresser with a porous structure as described in item 6 of the patent application scope, wherein the polishing layer is disposed on a side of the sub-substrate away from the bottom base. The finisher with a porous structure as described in item 6 of the patent application scope, wherein an adhesive layer is further interposed between the bottom base and the sub-substrate. The finisher having a porous structure as described in item 8 of the patent application scope, wherein the adhesive layer is a resin material. The finisher having a porous structure as described in Item 6 of the patent application range, wherein the sub-substrate has a plurality of sub-substrate protrusions, and the sub-substrate protrusions extend radially along a center of the sub-substrate.

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