TWI685639B - Shape measuring device and coating device equipped with the device - Google Patents
Shape measuring device and coating device equipped with the device Download PDFInfo
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Abstract
形狀測量裝置之控制裝置6係控制壓電工作台5及攝像裝置4,一面使干涉計3在光軸方向移動,一面在複數個位置h拍攝各個的影像,對各影像之像素的亮度分布圖,根據判別分析法求得分離度R,再將壓電工作台5配置於與複數個影像中之分離度R成為最大值Rmax的影像對應的位置hf,藉此,將干涉計3之焦點P1配置於對象物7之表面。因此,可將干涉計3的焦點P1易於對準於對象物7之表面。 The control device 6 of the shape measuring device controls the piezoelectric table 5 and the imaging device 4, while moving the interferometer 3 in the optical axis direction, while taking various images at a plurality of positions h, the brightness distribution of the pixels of each image , The degree of separation R is obtained according to the discriminant analysis method, and then the piezoelectric table 5 is arranged at a position hf corresponding to the image in which the degree of separation R in the plurality of images becomes the maximum value Rmax, whereby the focus P1 of the interferometer 3 Arranged on the surface of the object 7. Therefore, the focus P1 of the interferometer 3 can be easily aligned with the surface of the object 7.
Description
本發明係有關於一種形狀測量裝置及搭載該裝置之塗佈裝置,尤其係有關於一種使用干涉計來測量對象物之表面形狀的形狀測量裝置。更特定而言,係有關於一種形狀測量裝置,該形狀測量裝置係測量金屬、樹脂、那些之加工品等之表面形狀,或測量半導體裝置、電子電路、平板顯示器等之基板的表面形狀。 The present invention relates to a shape measuring device and a coating device equipped with the device, and particularly relates to a shape measuring device that uses an interferometer to measure the surface shape of an object. More specifically, it relates to a shape measuring device that measures the surface shape of metals, resins, those processed products, etc., or the surface shape of substrates of semiconductor devices, electronic circuits, flat panel displays, and the like.
在日本特開2000-56210號公報(專利文獻1),揭示一種自動對焦裝置,該自動對焦裝置係一面藉Z工作台使CCD相機對對象物移動,一面在複數個位置拍攝各個的影像,再算出各影像所含的複數個像素之亮度的微分值(以下,有簡稱為影像之微分值的情況),並將CCD相機配置於與微分值成為最大之影像對應的位置,藉此,將CCD相機之焦點對準於對象物。 Japanese Unexamined Patent Publication No. 2000-56210 (Patent Document 1) discloses an autofocus device that uses a Z stage to move a CCD camera to an object, and at the same time shoots various images at a plurality of positions, and then Calculate the differential value of the brightness of a plurality of pixels included in each image (hereinafter, sometimes referred to as the differential value of the image), and arrange the CCD camera at the position corresponding to the image whose differential value becomes the largest, by which the CCD The focus of the camera is on the object.
[專利文獻1]日本特開2000-56210號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2000-56210
影像之微分值係在例如如對象物與背景之邊界般明暗圖案急速地變化處成為大的值。在對焦之狀態所拍攝的影像,與在未對焦之狀態所拍攝的影像相比,對象物與背景之邊界清晰,而影像之微分值變大。因此,藉由將CCD相機配置於影像之微分值變成最大的位置,可將CCD相機之焦點對準於對象物。 The differential value of the image becomes a large value where, for example, the light and dark patterns change rapidly as the boundary between the object and the background. Compared with the image taken in the unfocused state, the image captured in the focused state has a clear boundary between the object and the background, and the differential value of the image becomes larger. Therefore, by arranging the CCD camera at the position where the differential value of the image becomes the maximum, the focus of the CCD camera can be focused on the object.
可是,在使用干涉計來測量對象物之表面形狀的形狀測量裝置,一般在將干涉計的焦點對準於對象物之表面後開始測量。作為對象物之基準面,常選擇如對象物之上端面的平面部、或球面的頂點部。在這種基準面,形狀及明暗圖案之變化係緩和,而干涉條紋之明暗的變化亦緩和,干涉條紋之影像的微分值係小。因此,如專利文獻1所示,僅使用干涉條紋之影像的微分值,難將干涉計的焦點對準於基準面。又,在以往之技術(專利文獻1),為了對焦,需要成為目標的圖案,若無目標,在對焦作業可能發生不良。
However, in a shape measuring device that uses an interferometer to measure the surface shape of an object, the measurement is generally started after focusing the interferometer on the surface of the object. As the reference surface of the object, a flat portion such as the upper end surface of the object or a vertex portion of the spherical surface is often selected. On this reference plane, the changes in shape and light-dark pattern are alleviated, and the changes in light and dark of interference fringes are also alleviated, and the differential value of the image of interference fringes is small. Therefore, as shown in
因此,本發明之主要的目的在於提供一種可將干涉計的焦點易於對準於對象物之表面的形狀測量裝置。 Therefore, the main object of the present invention is to provide a shape measuring device that can easily align the focus of the interferometer to the surface of the object.
本發明之形狀測量裝置係測量對象物之表面形狀的形狀測量裝置,其包括:干涉計,係將從照明裝置所射出之白色光分離成第1及第2光束,並將第1光束照射於對象物之表面且將第2光束照射於參照面,再將來自對象物之表面的反射光與來自參照面的反射光合成,產生與對象物之表面形狀對應的干涉條紋;觀察光學系統,係用以觀察干涉條紋;攝像裝 置,係經由觀察光學系統拍攝干涉條紋的影像;第1定位裝置,係使對象物及干涉計在光軸方向相對地移動;以及控制裝置,係控制攝像裝置及第1定位裝置,執行將干涉計之焦點對準於對象物之表面的第1自動對焦動作。控制裝置係在第1自動對焦動作,一面使對象物及干涉計在光軸方向相對地移動,一面在複數個相對位置拍攝各個的影像,在各影像對該影像所含之複數個像素的亮度分布圖,根據判別分析法求得分離度,再將對象物及該干涉計配置於與複數個影像中之分離度成為最大的影像對應的相對位置。 The shape measuring device of the present invention is a shape measuring device for measuring the surface shape of an object, which includes an interferometer, which separates the white light emitted from the lighting device into first and second light beams, and irradiates the first light beam onto the The surface of the object and the second beam is irradiated to the reference surface, and then the reflected light from the surface of the object is combined with the reflected light from the reference surface to produce interference fringes corresponding to the surface shape of the object; the observation optical system is used To observe interference fringes; camera equipment The first positioning device is to relatively move the object and the interferometer in the optical axis direction; and the control device is to control the imaging device and the first positioning device to perform interference. The focus of the meter is on the first autofocusing action on the surface of the object. The control device moves the object and the interferometer relative to each other in the optical axis direction during the first auto-focusing operation, while shooting each image at a plurality of relative positions, and the brightness of the plurality of pixels included in the image in each image In the distribution map, the degree of separation is determined according to the discriminant analysis method, and then the object and the interferometer are arranged at relative positions corresponding to the images having the largest degree of separation among the plurality of images.
在本發明之形狀測量裝置,在各影像對該影像所含之複數個像素的亮度分布圖,根據判別分析法求得分離度,再將對象物及該干涉計配置於與複數個影像中之分離度成為最大的影像對應的相對位置,藉此,將干涉計之焦點對準於對象物之表面。因此,可將干涉計的焦點易於對準於對象物之表面。又,因為可將干涉計的焦點容易且確實地對準於對象物之表面,所以不會發生在焦點對準後所進行之作業的不良,而可提高作業效率。進而,可縮短包含本發明之處理的總作業時間,而可降低製品的製造費用。 In the shape measuring device of the present invention, the brightness distribution of a plurality of pixels included in the image in each image is determined according to the discriminant analysis method, and then the object and the interferometer are arranged in the plurality of images The degree of separation becomes the relative position corresponding to the image, whereby the focus of the interferometer is aligned with the surface of the object. Therefore, the focus of the interferometer can be easily aligned with the surface of the object. In addition, since the focus of the interferometer can be easily and surely aligned on the surface of the object, the defect of the work performed after the focus is achieved does not occur, and the work efficiency can be improved. Furthermore, the total working time including the processing of the present invention can be shortened, and the manufacturing cost of the product can be reduced.
1‧‧‧照明裝置 1‧‧‧Lighting
2‧‧‧觀察光學系統 2‧‧‧Observation optical system
2a‧‧‧觀察鏡筒 2a‧‧‧ Observation tube
3‧‧‧米勞(Mirau)干涉計 3‧‧‧Mirau interferometer
4‧‧‧攝像裝置 4‧‧‧Camera device
5‧‧‧壓電工作台 5‧‧‧ Piezo worktable
6‧‧‧控制裝置 6‧‧‧Control device
7‧‧‧對象物、 7‧‧‧Object,
8‧‧‧切割用雷射裝置 8‧‧‧Laser device for cutting
9‧‧‧基板 9‧‧‧ substrate
10‧‧‧頭部 10‧‧‧Head
11‧‧‧白色光源 11‧‧‧White light source
12‧‧‧濾光器 12‧‧‧ filter
15‧‧‧可動板 15‧‧‧movable plate
15a‧‧‧貫穿孔 15a‧‧‧Through hole
17‧‧‧塗佈單元 17‧‧‧Coating unit
19、31‧‧‧物鏡 19.31‧‧‧Objective
20‧‧‧墨水硬化用光源 20‧‧‧Light source for ink hardening
21‧‧‧聚光鏡 21‧‧‧Condenser
22‧‧‧半反射鏡 22‧‧‧Half mirror
23‧‧‧成像透鏡 23‧‧‧Imaging lens
32‧‧‧反射鏡 32‧‧‧Reflecting mirror
33‧‧‧半透射鏡 33‧‧‧Semi-transmissive mirror
40‧‧‧Z工作台 40‧‧‧Z Workbench
42‧‧‧X工作台 42‧‧‧X Workbench
44‧‧‧Y工作台 44‧‧‧Y Workbench
50‧‧‧墨水塗佈機構 50‧‧‧Ink coating mechanism
70‧‧‧控制用電腦 70‧‧‧Control computer
72‧‧‧操作面板 72‧‧‧Operation panel
74‧‧‧監視器 74‧‧‧Monitor
91‧‧‧金屬薄膜 91‧‧‧Metal film
92‧‧‧塗佈部 92‧‧‧Coating Department
94‧‧‧墨水 94‧‧‧Ink
100‧‧‧塗佈裝置 100‧‧‧coating device
170‧‧‧塗佈針 170‧‧‧Coating needle
172‧‧‧墨水槽 172‧‧‧Ink tank
A1~A3‧‧‧光軸 A1~A3‧‧‧ Optical axis
第1圖係表示本發明之第1實施形態的形狀測量裝置之構成的方塊圖。 Fig. 1 is a block diagram showing the configuration of the shape measuring apparatus according to the first embodiment of the present invention.
第2圖係更詳細地表示第1圖所示之形狀測量裝置的構成 的圖。 Figure 2 shows the configuration of the shape measuring device shown in Figure 1 in more detail Figure.
第3圖係表示第2圖所示之米勞干涉計的構成及動作的圖。 FIG. 3 is a diagram showing the configuration and operation of the Milau interferometer shown in FIG. 2.
第4圖係藉第3圖所示之米勞干涉計所產生的干涉條紋之影像的亮度分布圖。 Figure 4 is the brightness distribution of the image of the interference fringe generated by the Milau interferometer shown in Figure 3.
第5圖係表示第1圖所示之壓電工作台之位置與影像的分離度之關係的圖。 FIG. 5 is a diagram showing the relationship between the position of the piezoelectric table shown in FIG. 1 and the degree of image separation.
第6圖係舉例表示第1圖~第5圖所示之形狀測量裝置之自動對焦動作的圖。 FIG. 6 is a diagram illustrating an example of the autofocus operation of the shape measuring device shown in FIGS. 1 to 5.
第7圖係表示本發明之第2實施形態的形狀測量裝置之構成的方塊圖。 Fig. 7 is a block diagram showing the configuration of a shape measuring device according to a second embodiment of the present invention.
第8圖係舉例表示第7圖所示之形狀測量裝置之自動對焦動作的圖。 FIG. 8 is a diagram showing an example of the autofocus operation of the shape measuring device shown in FIG. 7.
第9圖係表示搭載本實施形態之形狀測量裝置的塗佈裝置之整體構成的立體圖。 Fig. 9 is a perspective view showing the overall configuration of a coating device equipped with a shape measuring device according to this embodiment.
第10圖係表示觀察光學系統及墨水塗佈機構之主要部的立體圖。 Fig. 10 is a perspective view showing the main part of the observation optical system and the ink application mechanism.
第11圖係從第10圖之A方向觀察主要部的圖。 FIG. 11 is a view of the main part viewed from the direction A of FIG. 10.
第12圖係用以說明墨水塗佈動作的第1圖。 Fig. 12 is a first diagram for explaining the ink application operation.
第13圖係用以說明墨水塗佈動作的第2圖。 Fig. 13 is a second diagram for explaining the ink application operation.
第14圖係用以說明墨水塗佈動作的第3圖。 Fig. 14 is a third diagram for explaining the ink application operation.
第15圖係用以說明墨水塗佈動作的第4圖。 Fig. 15 is a fourth diagram for explaining the ink application operation.
第16圖係用以說明墨水塗佈動作的第5圖。 Fig. 16 is a fifth diagram for explaining the ink application operation.
第17圖係用以說明膜厚檢查方法的圖。 FIG. 17 is a diagram for explaining the method of inspecting the film thickness.
第18圖係用以說明膜厚檢查處理的流程圖。 FIG. 18 is a flowchart for explaining the film thickness inspection process.
第1圖係表示本發明之第1實施形態的形狀測量裝置之構成的方塊圖。在第1圖,此形狀測量裝置包括:頭部10,係包含照明裝置1、觀察光學系統2、米勞干涉計3、攝像裝置4以及壓電工作台(第1定位裝置)5所構成;及控制裝置6。照明裝置1係輸出白色光。觀察光學系統2係反射從照明裝置1所輸出之白色光並對米勞(Mirau)干涉計3供給,且用以觀察以米勞干涉計3所產生之干涉條紋。
Fig. 1 is a block diagram showing the configuration of the shape measuring apparatus according to the first embodiment of the present invention. In FIG. 1, the shape measuring device includes a
米勞干涉計3係將從照明裝置1經由觀察光學系統2所射入的白色光分離成第1及第2光束,並將第1光束照射於對象物7的表面,且將第2光束照射於參照面,使來自對象物7之表面的反射光與來自參照面的反射光發生干涉,而產生干涉條紋。攝像裝置4係由控制裝置6所控制,並經由觀察光學系統2,拍攝以米勞干涉計3所產生之干涉條紋的影像。藉攝像裝置4所拍攝之各影像被儲存於控制裝置6。壓電工作台5係由控制裝置6所控制,並使米勞干涉計3對對象物7在光軸方向(垂直方向)移動。
The
控制裝置6控制形狀測量裝置整體。尤其控制裝置6係控制攝像裝置4及壓電工作台5,一面使米勞干涉計3對對象物7在光軸方向移動,一面在複數個位置拍攝各個的影像,再根據複數個影像執行將米勞干涉計3的焦點對準於對象物7之表面的自動對焦動作(第1自動對焦動作)。關於自動對
焦動作,將在後面詳細地說明。
The
第2圖係更詳細地表示第1圖所示之形狀測量裝置的構成的圖,第3圖係表示米勞干涉計3之構成及動作的圖。在第2圖及第3圖,照明裝置1係被配置於觀察光學系統2的側面,並包含白色光源11及濾光器12。照明裝置1的光軸A1(即白色光源11的光軸)係在水平方向所配置,並與觀察光學系統2的光軸A2正交。白色光源11射出白色光。濾光器12係被配置於白色光源11與觀察光學系統2之間,並使從白色光源11所射出之白色光中具有既定中心波長λ0及波長範圍△λ的白色光通過。
FIG. 2 is a diagram showing the configuration of the shape measuring device shown in FIG. 1 in more detail, and FIG. 3 is a diagram showing the configuration and operation of the
觀察光學系統2包含聚光鏡21、半反射鏡22以及成像透鏡23。觀察光學系統2的光軸A2(即成像透鏡23的光軸)係在垂直方向所配置。聚光鏡21係被配置於濾光器12及半反射鏡22之間,並將從白色光源11射出並通過濾光器12的白色光變換成平行光。
The observation
半反射鏡22係被配置於2條光軸A1、A2的交叉部,並以對2條光軸A1、A2之各條45度的角度所配置。將米勞干涉計3配置於半反射鏡22的下方,將成像透鏡23及攝像裝置4配置於半反射鏡22的上方。半反射鏡22係使從照明裝置1經由聚光鏡21所射入之白色光反射至下方,且使來自米勞干涉計3的光(即干涉條紋的像)通過至上方。成像透鏡23係使來自米勞干涉計3的光成像於攝像裝置4的光感測器。
The
米勞干涉計3係經由壓電工作台5被設置於觀察光學系統2的下端,並包含物鏡31、反射鏡32以及半透射鏡
33。米勞干涉計3的光軸A3(即物鏡31的光軸)係與觀察光學系統2的光軸A2一致。壓電工作台5係使米勞干涉計3在光軸A3的方向移動。在如第2圖及第3圖,表示對象物7係基板、光軸A3被垂直地配置於基板的表面、米勞干涉計3的焦點P1(即物鏡31的焦點)被配置於基板之表面的狀態。
The
反射鏡32係使其反射面(參照面)朝下,並被固定於物鏡31之下面的中央部。半透射鏡33被配置於反射鏡32的反射面與焦點P1的中間位置。反射鏡32及半透射鏡33的各個係與光軸A3正交。
The
從照明裝置1所射出並經由觀察光學系統2射入米勞干涉計3的白色光L0係如第3圖所示,藉物鏡31折射後往焦點P1。白色光L0的一部分係通過半透射鏡33之一端部,成為第1光束L1,白色光L0之剩下的部分係在半透射鏡33之一端部反射,成為第2光束L2。即,白色光L0係藉半透射鏡33分離成第1及第2光束L1、L2。
The white light L0 emitted from the
第1光束L1係在對象物7之表面被反射,成為第1反射光L1r,並往半透射鏡33的另一端部。第2光束L2係在反射鏡32的反射面被反射,成為第2反射光L2r,並往半透射鏡33的另一端部。第1及第2反射光L1r、L2r係在半透射鏡33的另一端部匯合,彼此發生干涉,成為干涉光L3。
The first light beam L1 is reflected on the surface of the
在2條反射光L1r、L2r之相差是0度的情況,干涉光L3的振幅成為最大,干涉光L3的亮度成為最大。在2條反射光L1r、L2r之相差是180度的情況,干涉光L3的振幅成為最小,干涉光L3的亮度成為最小。以在第1光束L1在焦
點P1反射時反射光L1r、L2r之光路長的差成為0的方式設計米勞干涉計3。
When the phase difference between the two reflected lights L1r and L2r is 0 degrees, the amplitude of the interference light L3 becomes the maximum, and the brightness of the interference light L3 becomes the maximum. When the phase difference between the two reflected lights L1r and L2r is 180 degrees, the amplitude of the interference light L3 becomes the smallest, and the brightness of the interference light L3 becomes the smallest. With the first beam L1 in focus
The
因此,在米勞干涉計3的焦點P1與對象物7之表面一致時(即已對焦時),反射光L1r、L2r的相位差及光路長的差都成為0,而干涉光L3成為最亮,隨著焦點P1與對象物7之表面的距離變長而干涉光L3變暗。在半透射鏡33,出現與對象物7之表面形狀對應的干涉條紋。根據此干涉條紋,可測量對象物7之表面形狀。
Therefore, when the focus P1 of the
為了得到清晰之干涉條紋,需要使米勞干涉計3的焦點P1與對象物7之表面一致。以下,說明使米勞干涉計3的焦點P1與對象物7之表面一致的自動對焦動作。
In order to obtain clear interference fringes, it is necessary to make the focal point P1 of the
控制裝置6係在自動對焦動作時,控制攝像裝置4及壓電工作台5,一面使米勞干涉計3在光軸A3的方向移動,一面在複數個位置拍攝複數個影像。並製作所拍攝之複數個影像之各個的亮度分布圖,藉判別分析法對各亮度分布圖求得分離值R,並將米勞干涉計3配置於分離值R成為最大的位置。
The
第4圖係某干涉條紋之影像的亮度分布圖。影像含有被配置於複數列複數行的複數個像素。各像素顯示複數個階段(例如256階段)的亮度中之其中一個階段的亮度。第4圖之橫軸表示複數個階段之亮度,縱軸表示顯示各亮度之像素的個數。使米勞干涉計3的焦點P1接近對象物7之表面時,如第4圖所示,亮度分布圖表示雙峰性。
Figure 4 is the brightness distribution of the image of an interference fringe. The image contains a plurality of pixels arranged in a plurality of columns and rows. Each pixel displays the brightness of one of a plurality of stages (for example, 256 stages) of luminance. The horizontal axis of Fig. 4 represents the brightness of plural stages, and the vertical axis represents the number of pixels displaying each brightness. When the focal point P1 of the
在判別分析法,以亮度臨限值Lth將影像之亮度分布圖分離成2個等級CL1、CL2。等級CL1係亮度比亮度臨 限值Lth更小之像素的集團。等級CL2係亮度比亮度臨限值Lth更大之像素的集團。亮度臨限值Lth係被設定成等級內分散σW 2成為最小,且等級間分散σB 2成為最大,將等級間分散σB 2與等級內分散σW 2之比σB 2/σW 2作為分離度R。 In the discriminant analysis method, the brightness distribution map of the image is divided into two levels CL1 and CL2 by the brightness threshold Lth. The level CL1 is a group of pixels whose luminance is smaller than the luminance threshold Lth. The level CL2 is a group of pixels whose luminance is greater than the luminance threshold Lth. The brightness threshold Lth is set such that the intra-level dispersion σ W 2 becomes the smallest, and the inter-level dispersion σ B 2 becomes the maximum, and the ratio of the inter-level dispersion σ B 2 to the intra-level dispersion σ W 2 σ B 2 /σ W 2 as the resolution R.
等級內分散σW 2係在等級內之分布圖的擴大程度,等級間分散σB 2係2個等級CL1、CL2之間的擴大程度。等級內分散σW 2及等級間分散σB 2係分別以數學式(1)、(2)表示。 The intra-level dispersion σ W 2 is the degree of expansion of the distribution graph within the level, and the inter-level dispersion σ B 2 is the degree of expansion between the two levels CL1 and CL2. The intra-level dispersion σ W 2 and the inter-level dispersion σ B 2 are expressed by mathematical formulas (1) and (2), respectively.
σW 2=(n1×σ1 2+n2×σ2 2)/(n1+n2)...(1) σ W 2 =(n 1 ×σ 1 2 +n 2 ×σ 2 2 )/(n 1 +n 2 )...(1)
σB 2=(n1(μ1-μ0)2+n2(μ2-μ0)2)/(n1+n2)...(2) σ B 2 = (n 1 (μ 1 -μ 0 ) 2 +n 2 (μ 2 -μ 0 ) 2 )/(n 1 +n 2 )...(2)
其中,σ1 2、σ2 2分別是等級CL1、CL2內之亮度的分散,μ0是全部像素之亮度的平均值,μ1、μ2分別是等級CL1、CL2內之亮度的平均值,n1、n2分別是等級CL1、CL2內之像素個數。 Among them, σ 1 2 and σ 2 2 are the dispersion of brightness in the levels CL1 and CL2 respectively, μ 0 is the average value of the brightness of all pixels, μ 1 and μ 2 are the average value of the brightness in the levels CL1 and CL2, n 1 and n 2 are the number of pixels in levels CL1 and CL2, respectively.
第5圖係舉例表示壓電工作台5之位置h與分離度R之關係的圖。在第5圖,表示一面使壓電工作台5之位置h(壓電工作台5之可動部之高度方向的座標)從0μm變化至20μm,一面拍攝複數個影像,產生各像素的亮度分布圖,並求得各亮度分布圖之分離度R的情況。在第5圖,分離度R係在h≒7.5μm的時間點從0上升,而在h≒9.2μm的時間點成為最大值(約0.105),然後下降,在h≒10.7μm的時間點成為0。藉由將壓電工作台5配置於分離度R成為最大值(約0.105)時的位置(h≒9.2μm),可使米勞干涉計3的焦點P1與對象物7之表面一致。
FIG. 5 is a diagram exemplifying the relationship between the position h of the piezoelectric table 5 and the degree of separation R. FIG. Fig. 5 shows that while changing the position h of the piezoelectric table 5 (coordinates in the height direction of the movable part of the piezoelectric table 5) from 0 μm to 20 μm, multiple images are taken while generating the brightness distribution map of each pixel , And find the degree of separation R of each brightness profile. In Figure 5, the resolution R system rises from 0 at the time point of h≒7.5μm, and becomes the maximum value (about 0.105) at the time point of h≒9.2μm, then decreases, and becomes at the time point of h≒10.7μm. 0. By arranging the piezoelectric table 5 at the position (h≒9.2 μm) when the degree of separation R becomes the maximum value (about 0.105), the focal point P1 of the
其次,具體地說明在此形狀測量裝置之自動對焦
動作。控制裝置6係在自動對焦動作時,控制攝像裝置4及壓電工作台5,一面使米勞干涉計3在光軸A3的方向以固定速度V1移動,一面在複數個位置h拍攝各個的影像。若將攝像裝置4之影像的取入週期當作T1(秒)、將從照明裝置1所射出之白色光的中心波長當作λ0(μm),則將米勞干涉計3之移動速度V1設定成在取入週期T1(秒)之間米勞干涉計3僅移動λ0/8(μm)。米勞干涉計3之最初的移動方向係當作米勞干涉計3接近對象物7之方向與遠離的方向之中的其中一個方向。
Secondly, the auto focus of the shape measuring device will be specifically explained
action. The
在藉壓電工作台5使米勞干涉計3以固定速度V1移動之間,控制裝置6係從攝像裝置4以既定週期T1(秒)取入影像。控制裝置6係每當影像之取入結束,算出影像的分離度R,並求得拍攝到分離度R成為最大的影像時之壓電工作台5的位置hf。最後,控制裝置6係將壓電工作台5的位置h設定於拍攝到分離度R成為最大之影像時的位置hf,而自動對焦動作結束。
Between moving the
詳細說明之,控制裝置6係當壓電工作台5的驅動速度達到固定速度V1時,一面從攝像裝置4以T1(秒)間隔取入影像一面開始計算影像的分離度R,並以與取入影像時之壓電工作台5的位置h賦與關聯的方式將分離度R記憶於記憶體部(未圖示)。
In detail, when the driving speed of the piezoelectric table 5 reaches a fixed speed V1, the
在記憶複數組(例如3組)之分離度R及位置h後,如第6圖(a)、(b)所示,畫橫軸表示位置h、縱軸表示分離度R的圖,並畫連接複數個點的近似直線。在第6圖(a),壓電工作台5係可從位置h1移至位置h2,並表示壓電工作台5在從h2往h1之方向移動的狀態。 After memorizing the separation R and position h of a complex array (for example, 3 groups), as shown in (a) and (b) of FIG. 6, plot the position h and the separation axis R on the vertical axis, and draw Approximate straight line connecting multiple points. In FIG. 6(a), the piezoelectric table 5 can move from the position h1 to the position h2, and shows the state in which the piezoelectric table 5 moves in the direction from h2 to h1.
例如如第6圖(a)所示,在對壓電工作台5之位置h的移動方向分離值R減少的情況,使壓電工作台5一度停止後,如第6圖(b)所示,使壓電工作台5在相反方向移動,一面使壓電工作台5移動至位置h成為h2一面以既定週期T1(秒)取入影像。而在一開始,對壓電工作台5之位置h的移動方向分離值R增加的情況,一面使壓電工作台5移動至位置h成為h1一面以既定週期T1(秒)取入影像。 For example, as shown in FIG. 6(a), when the separation value R in the moving direction of the position h of the piezoelectric table 5 decreases, and the piezoelectric table 5 is once stopped, as shown in FIG. 6(b) , The piezoelectric table 5 is moved in the opposite direction, and the piezoelectric table 5 is moved to the position h to become h2 while taking images at a predetermined period T1 (seconds). At the beginning, when the moving direction separation value R of the position h of the piezoelectric table 5 increases, the image is captured at a predetermined period T1 (second) while moving the piezoelectric table 5 to the position h to be h1.
一面取入影像一面求得影像的分離度R,並求得與分離度R成為最大值Rmax的影像對應之壓電工作台5的位置hf。即,在記憶複數組(例如8組)之分離度R及位置h後,求得複數個分離值R中之最大值Rmax。接著,求得最大值Rmax與最初之組的分離值Rs之差的絕對值△Rs=|Rmax-Rs|、及最大值Rmax與最後之組的分離值Re之差的絕對值△Re=|Rmax-Re|,在△Rs與△Re都比既定臨限值Rth更大時,求得與分離度R成為最大值Rmax的影像對應之壓電工作台5的位置hf,並使壓電工作台5移至該位置hf。在此時,米勞干涉計3之焦點P1的位置與對象物7之表面一致。
While taking in the image, the degree of separation R of the image is obtained, and the position hf of the piezoelectric table 5 corresponding to the image where the degree of separation R becomes the maximum value Rmax is obtained. That is, after memorizing the separation R and the position h of a complex array (for example, 8 groups), the maximum value Rmax of the plurality of separation values R is obtained. Next, the absolute value of the difference between the maximum value Rmax and the separation value Rs of the first group △Rs=|Rmax-Rs|, and the absolute value of the difference between the maximum value Rmax and the separation value Re of the last group △Re=| Rmax-Re|, when both △Rs and △Re are greater than the predetermined threshold Rth, the position hf of the piezoelectric table 5 corresponding to the image where the separation R becomes the maximum value Rmax is obtained, and the piezoelectric is operated The table 5 moves to this position hf. At this time, the position of the focal point P1 of the
在△Rs、△Re中之至少一方比臨限值Rth更小的情況,持續搜索至壓電工作台之位置到達h1或h2。到達h1或h2亦無法檢測出△Rs與△Re都成為比既定臨限值Rth更大的Rmax時,使壓電工作台5回到搜索開始位置,在相反方向持續搜索至壓電工作台之位置到達h1或h2。在h1~h2之間,無法檢測出△Rs與△Re都成為比既定臨限值Rth更大的Rmax時 當作自動對焦動作失敗,並結束。 When at least one of ΔRs and ΔRe is smaller than the threshold Rth, the search is continued until the position of the piezoelectric table reaches h1 or h2. When h1 or h2 cannot be detected and △Rs and △Re both become Rmax greater than the predetermined threshold Rth, the piezoelectric table 5 is returned to the search start position, and the search continues until the piezoelectric table is in the opposite direction The location reaches h1 or h2. Between h1 and h2, when it cannot be detected that both △Rs and △Re become Rmax greater than the predetermined threshold Rth As if the autofocus action failed, and ended.
具體地說明之,在第6圖(a),從N=1的位置開始取入影像,在N=3的位置取入影像後,求得連接3點的近似直線,判定對移動方向近似直線之斜率是負,如第6圖(b)所示,在相反方向開始搜索。在相反方向之搜索,從M=1的位置開始取入影像,在M=8的位置取入影像後,開始進行尖峰值判定,判定M=5之位置的分離度R是最大值Rmax,並判定△Rs與△Re都比臨限值Rth更大,將壓電工作台5配置於與M=5對應之位置hf,而使米勞干涉計3的焦點P1對準於對象物7之表面。
Specifically, in Fig. 6(a), the image is taken from the position of N=1, after the image is taken from the position of N=3, an approximate straight line connecting 3 points is obtained, and the approximate straight line to the moving direction is determined The slope is negative, as shown in Figure 6(b), the search starts in the opposite direction. In the search in the opposite direction, the image is taken from the position of M=1, after the image is taken at the position of M=8, the peak value judgment is started, and the separation R at the position of M=5 is determined to be the maximum value Rmax, and It is judged that both ΔRs and ΔRe are greater than the threshold value Rth, the piezoelectric table 5 is arranged at a position hf corresponding to M=5, and the focus P1 of the
如以上所示,在本第1實施形態,控制壓電工作台5及攝像裝置4,一面使米勞干涉計3在光軸方向移動,一面在複數個位置h拍攝各個的影像,再對各影像之像素的亮度分布圖,藉判別分析法求得分離度R,再將壓電工作台5之位置h配置於與複數個影像之中的分離度R成為最大值Rmax之影像對應的位置hf,藉此,將米勞干涉計3之焦點P1配置於對象物7之表面。因此,可使米勞干涉計3的焦點P1易於對準對象物7之表面,而可提高作業效率。
As described above, in the first embodiment, the piezoelectric table 5 and the
此外,在本第1實施形態,固定對象物7,並藉壓電工作台5使米勞干涉計3移動,但是不限定為此,只要是使對象物7與米勞干涉計3相對地移動者,以任何方法移動都可。例如,亦可將米勞干涉計3固定,並使對象物7移動,亦可使米勞干涉計3與對象物7之雙方在反方向移動。
In addition, in the first embodiment, the
又,在本第1實施形態,說明了使用米勞干涉計3
的情況,但是不限定為此,亦可使用其他的型式的干涉計。例如,亦可使用邁克生(Michelson)干涉計或Linnik式干涉計。
In addition, in the first embodiment, the use of the
第7圖係表示本發明之第2實施形態的形狀測量裝置之構成的方塊圖,係與第1圖對比的圖。參照第7圖,此形狀測量裝置與第1圖之形狀測量裝置的相異點係追加Z工作台(第2定位裝置)40。照明裝置1、觀察光學系統2、米勞干涉計3、攝像裝置4以及壓電工作台5構成一個光學單元,此光學單元係被搭載於Z工作台40。Z工作台40係由控制裝置6所控制,使光學單元在高度方向移動。
Fig. 7 is a block diagram showing the configuration of a shape measuring device according to a second embodiment of the present invention, and is a diagram compared with Fig. 1. Referring to FIG. 7, a Z table (second positioning device) 40 is added to the difference between this shape measuring device and the shape measuring device of FIG. 1. The
Z工作台40的行程係比壓電工作台5的行程更長。在第1實施形態,一面僅藉壓電工作台5使米勞干涉計3移動一面拍攝複數個影像,再根據所拍攝之複數個影像的分離度R對準焦點(第1自動對焦動作),但是在第2實施形態,在執行第1自動對焦動作之前,一面藉Z工作台40使米勞干涉計3移動一面拍攝複數個影像,再根據所拍攝之複數個影像的微分值D,對焦點的位置進行粗調整(第2自動對焦動作)。對在壓電工作台5之行程內無法對準焦點的情況是有效。
The stroke of the Z table 40 is longer than that of the piezoelectric table 5. In the first embodiment, while moving the
其次,具體地說明在本測量之第2自動對焦動作。控制裝置6係在第2自動對焦動作時,控制攝像裝置4及Z工作台40,一面使米勞干涉計3在光軸A3的方向以固定速度V2移動,一面在複數個位置H拍攝各個的影像。Z工作台40之移動速度V2係比壓電工作台5之移動速度V1更快。米勞干涉計3之最初的移動方向係當作米勞干涉計3接近對象物7
之方向與遠離的方向之中的其中一個方向。
Next, the second AF operation in this measurement will be specifically described. The
在藉Z工作台40使米勞干涉計3以固定速度V2移動期間,控制裝置6係從攝像裝置4以既定週期T2(秒)取入影像。控制裝置6係每當影像之取入結束,算出影像的微分值D,並求得拍攝到微分值D成為最大的影像時之Z工作台40的位置Hf(Z工作台40的可動部之高度方向的座標)。最後,控制裝置6係將Z工作台40的位置H設定於拍攝到微分值D成為最大之影像時的位置Hf,而第2自動對焦動作結束。影像的微分值D係以數學式(3)、(4)、(5)表示。
During the movement of the
其中,F表示所取入之影像,(x,y)表示影像F之像素的位置,dx表示水平方向之微分值,dy表示垂直方向之微分值。 Among them, F represents the taken image, (x, y) represents the position of the pixel of the image F, dx represents the differential value in the horizontal direction, and dy represents the differential value in the vertical direction.
詳細說明之,控制裝置6係當Z工作台40的驅動速度達到固定速度V2時,一面從攝像裝置4以T2(秒)間隔取入影像一面開始計算影像的微分值D,並以與取入影像時之Z工作台40的位置H賦與關聯的方式將微分值D記憶於記憶體部(未圖示)。
In detail, when the driving speed of the Z table 40 reaches a fixed speed V2, the
在記憶複數組(例如3組)之微分值D及位置H後,如第8圖(a)、(b)所示,畫橫軸表示位置H、縱軸表示微分值D的圖,並畫連接複數個點的近似直線。在第8圖(a),Z工作台40係可從位置H1移至位置H2,並表示Z工作台40在從H2往H1之方向移動的狀態。 After memorizing the differential value D and position H of a complex array (for example, 3 groups), as shown in (a) and (b) of FIG. 8, plot the horizontal axis to indicate the position H and the vertical axis to indicate the differential value D, and draw Approximate straight line connecting multiple points. In FIG. 8(a), the Z table 40 can move from the position H1 to the position H2, and shows the state in which the Z table 40 moves in the direction from H2 to H1.
例如如第8圖(a)所示,在對Z工作台40之位置H的移動方向微分值D減少的情況,使Z工作台40一度停止後,如第8圖(b)所示,使Z工作台40在相反方向移動,一面使Z工作台40移動至位置H成為H2一面以既定週期T2(秒)取入影像。而在一開始,對Z工作台40之位置H的移動方向微分值D增加的情況,一面使Z工作台40移動至位置H成為H1一面以既定週期T2(秒)取入影像。 For example, as shown in FIG. 8(a), when the differential value D in the moving direction of the position H of the Z table 40 decreases, after stopping the Z table 40 once, as shown in FIG. 8(b), make The Z table 40 is moved in the opposite direction, and the Z table 40 is moved to the position H to become H2 while taking images at a predetermined period T2 (seconds). At the beginning, when the differential value D of the moving direction of the position H of the Z table 40 increases, the image is captured at a predetermined period T2 (second) while moving the Z table 40 to the position H to become H1.
一面取入影像一面求得影像的微分值D,並求得與微分值D成為最大值Dmax的影像對應之Z工作台40的位置Hf。即,在記憶複數組(例如8組)之微分值D及位置H後,求得複數個微分值D中之最大值Dmax。接著,求得最大值Dmax與最初之組的微分值Ds之差的絕對值△Ds=|Dmax-Ds|、及最大值Dmax與最後之組的微分值De之差的絕對值△De=|Dmax-De|,在△Ds與△De都比既定臨限值Dth更大時,求得與微分值D成為最大值Dmax的影像對應之Z工作台40的位置Hf,並使Z工作台40移至該位置Hf。在此時,米勞干涉計3之焦點P1的位置與對象物7之表面大致一致。
While taking in the image, the differential value D of the image is obtained, and the position Hf of the Z table 40 corresponding to the image whose differential value D becomes the maximum value Dmax is obtained. That is, after memorizing the differential value D and the position H of a complex array (for example, 8 sets), the maximum value Dmax among the plurality of differential values D is obtained. Next, the absolute value ΔDs=|Dmax-Ds| of the difference between the maximum value Dmax and the differential value Ds of the first group, and the absolute value ΔDe=| of the difference between the maximum value Dmax and the differential value De of the last group Dmax-De|, when both △Ds and △De are greater than the predetermined threshold Dth, find the position Hf of the Z table 40 corresponding to the image where the differential value D becomes the maximum value Dmax, and make the Z table 40 Move to this position Hf. At this time, the position of the focal point P1 of the
在△Ds、△De中之至少一方比臨限值Dth更小的情況,持續搜索至Z工作台之位置到達H1或H2。到達H1或H2亦無法檢測出△Ds與△De都成為比既定臨限值Dth更大的 Dmax時,使Z工作台40回到搜索開始位置,在相反方向持續搜索至Z工作台之位置到達H1或H2。在H1~H2之間,無法檢測出△Ds與△De都成為比既定臨限值Dth更大的Dmax時當作自動對焦動作失敗,並結束。 When at least one of ΔDs and ΔDe is smaller than the threshold Dth, the search is continued until the position of the Z table reaches H1 or H2. When H1 or H2 is reached, it cannot be detected that both △Ds and △De become larger than the predetermined threshold Dth At Dmax, the Z table 40 is returned to the search start position, and the search is continued in the opposite direction until the position of the Z table reaches H1 or H2. Between H1 and H2, when it is impossible to detect that both △Ds and △De become Dmax greater than the predetermined threshold Dth, it is regarded as the failure of the autofocus operation and ends.
然後,將Z工作台40固定於與微分值D成為最大值Dmax之影像對應的位置Hf,再根據在第1實施形態所說明之方法(第1自動對焦動作)使米勞干涉計3的焦點P1與對象物7之表面精密地一致。
Then, the Z table 40 is fixed to the position Hf corresponding to the image where the differential value D becomes the maximum value Dmax, and then the focus of the
具體地說明之,在第8圖(a),從N=1的位置開始取入影像,在N=3的位置取入影像後,求得連接3點的近似直線,判定對移動方向近似直線之斜率是負,如第8圖(b)所示,在相反方向開始搜索。在相反方向之搜索,從M=1的位置開始取入影像,在M=8的位置取入影像後,開始進行尖峰值判定,判定M=5之位置的微分值D是最大值Dmax,並判定△Ds與△De都比臨限值Dth更大,將Z工作台40配置於與M=5對應之位置Hf,而使米勞干涉計3的焦點P1與對象物7之表面大致一致。
Specifically, in Fig. 8(a), the image is taken from the position of N=1, after the image is taken from the position of N=3, an approximate straight line connecting 3 points is obtained, and the approximate straight line to the moving direction is determined The slope is negative, as shown in Figure 8(b), the search starts in the opposite direction. In the search in the opposite direction, the image is taken from the position of M=1, after the image is taken at the position of M=8, the peak value judgment is started, and the differential value D at the position of M=5 is determined to be the maximum value Dmax, and It is determined that both ΔDs and ΔDe are greater than the threshold value Dth, and the Z table 40 is arranged at a position Hf corresponding to M=5, so that the focal point P1 of the
如以上所示,在本第2實施形態,在根據第1實施形態之方法(第1自動對焦動作)對準焦點之前,控制Z工作台40及攝像裝置4,一面使米勞干涉計3在光軸方向移動,一面在複數個位置H拍攝各個的影像,求得各影像的微分值D,再將Z工作台40配置於與複數個影像之中的微分值D成為最大值Dmax之影像對應的位置Hf,藉此,使米勞干涉計3之焦點P1與對象物7之表面大致一致。因此,在僅藉壓電工作台
5無法對準焦點P1的情況,亦可使米勞干涉計3的焦點P1易於對準對象物7之表面,而可提高作業效率。
As described above, in the second embodiment, before focusing on the method according to the method of the first embodiment (first autofocus operation), the Z table 40 and the
此外,在本第2實施形態,固定對象物7,並藉Z工作台40使米勞干涉計3移動,但是不限定為此,只要是使對象物7與米勞干涉計3相對地移動者,以任何方法移動都可。例如,亦可將米勞干涉計3固定,並使對象物7移動,亦可使米勞干涉計3與對象物7之雙方在反方向移動。
In addition, in the second embodiment, the
又,在本第2實施形態,說明了使用米勞干涉計3的情況,但是不限定為此,亦可使用其他的型式的干涉計。例如,亦可使用邁克生(Michelson)干涉計或Linnik式干涉計。
In addition, in the second embodiment, the case of using the
最後,作為應用根據本實施形態之形狀測量裝置之裝置的一例,說明塗佈裝置的概要。 Finally, as an example of an apparatus to which the shape measuring apparatus according to this embodiment is applied, the outline of the coating apparatus will be described.
第9圖係表示包括根據本實施形態之形狀測量裝置的塗佈裝置100之整體構成的立體圖。塗佈裝置100構成為在複數層可將透明的墨水(液狀材料)塗佈於基板9的主面上。參照第9圖,塗佈裝置100包括:塗佈頭部,係由觀察光學系統2、CCD相機4、切割用雷射裝置8、墨水塗佈機構50、以及墨水硬化用光源20所構成;Z工作台40,係使該塗佈頭部對塗佈對象之基板9在垂直方向(Z軸方向)移動;X工作台42,係搭載Z工作台40並使其在X軸方向移動;Y工作台44,係搭載基板9並使其在Y軸方向移動;控制用電腦70,係控制裝置整體的動作;監視器74,係顯示藉CCD相機4所拍攝之影像等;以及操作面板72,係用以將來自作業員之指令輸入控
制用電腦70。
FIG. 9 is a perspective view showing the overall configuration of the
觀察光學系統2係含有照明用的光源(第1圖之照明裝置1),並觀察基板9的表面狀態、或藉墨水塗佈機構50所塗佈之墨水的狀態。藉觀察光學系統2所觀察之影像係藉CCD相機4變換成電性信號,並顯示於監視器74。切割用雷射裝置8係經由觀察光學系統2,將雷射光照射於基板9上的不要部並除去。
The observation
墨水塗佈機構50係將墨水塗佈於基板9的主面上。墨水硬化用光源20係含有例如CO2雷射,並將雷射光照射於藉墨水塗佈機構50所塗佈之墨水,使其變硬。
The
此外,此裝置構成係一例,例如亦可是被稱為高架式的構成,該構成係將已搭載觀察光學系統2等之Z工作台40搭載於X工作台,再將X工作台搭載於Y工作台,而使Z工作台40在XY方向可移動,只要是可使已搭載觀察光學系統2等之Z工作台40對對象之基板9在XY方向相對地移動的構成,任何構成都可。
In addition, this device configuration is an example, and for example, it may be called an overhead configuration. This configuration is to mount the Z table 40 with the observation
其次,說明使用複數支塗佈針之墨水塗佈機構50的例子。第10圖係表示觀察光學系統2及墨水塗佈機構50之主要部的立體圖。參照第10圖,此塗佈裝置100包括:可動板15;倍率相異之複數個(例如5個)物鏡19;以及複數個(例如5個)塗佈單元17,係用以塗佈由相異之材質所構成的墨水。
Next, an example of the
可動板15係在觀察光學系統2之觀察鏡筒2a的下端與基板9之間被設置成在X軸方向及Y軸方向可移動。又,在可動板15,形成例如5個的貫穿孔15a。
The
物鏡19係在Y軸方向以既定間隔並各自對應於貫穿孔15a的方式被固定於可動板15的下面。5個塗佈單元17係分別被配置成與5個物鏡19鄰接。藉由使可動板15移動,可將所要之塗佈單元17配置於對象之基板9的上方。
The
第11圖(a)~(c)係從第10圖之A方向觀察主要部的圖,係表示墨水塗佈動作的圖。塗佈單元17包含塗佈針170與墨水槽172。又,如第11圖(a)所示,將所要之塗佈單元17的塗佈針170定位於對象之基板9的上方。在此時,塗佈針170的前端部係被浸泡於墨水槽172內的墨水中。
Figures 11 (a) to (c) are views of the main part viewed from the direction A of Figure 10, and are diagrams showing the ink application operation. The
接著,如第11圖(b)所示,使塗佈針170下降,而使塗佈針170的前端部從墨水槽172之底的孔突出。在此時,墨水附著於塗佈針170的前端部。然後,如第11圖(c)所示,使塗佈針170及墨水槽172下降,而使塗佈針170的前端部與基板9接觸,將墨水塗佈於基板9。然後,回到第11圖(a)之狀態。
Next, as shown in FIG. 11( b ), the
使用複數支塗佈針之墨水塗佈機構係因為此外亦已知各種的技術,所以省略詳細的說明。被揭示於例如專利文獻1。塗佈裝置100係藉由將例如第10圖所示之機構用作墨水塗佈機構50,可塗佈複數種墨水中之所要的墨水,又,可使用複數支塗佈針中所要之塗佈徑的塗佈針,塗佈墨水。
The ink coating mechanism using a plurality of coating needles is also known for various techniques, so detailed description is omitted. It is disclosed in
根據本實之形狀測量裝置的頭部10(第1圖)係被設置於例如塗佈裝置100的觀察光學系統2。控制用電腦70係控制墨水塗佈機構50,進行墨水塗佈動作後,使Z工作台40移動,藉此,將頭部10定位於墨水塗佈部的表面之上方的
既定位置。控制用電腦70係更一面使Z工作台40對基板9相對地移動,一面藉CCD相機4拍攝干涉光的影像。控制用電腦70係對各像素檢測出干涉光強度成為尖峰值的Z工作台位置,再使用所檢測出之Z工作台位置,算出墨水塗佈部之膜厚或凹凸部的高度。
The head 10 (FIG. 1) of the shape measuring device according to the present invention is provided in, for example, the observation
其次,使用第12圖~第16圖,說明在塗佈裝置100所執行之墨水塗佈動作的細節。
Next, the details of the ink application operation performed by the
塗佈裝置100係使用Z工作台40使米勞干涉計3對對象物相對地移動,再根據在第1實施形態所示的方法自動地檢測出焦點,並將所檢測出之焦點位置作為基準,進行墨水塗佈動作。
The
在米勞干涉計3所產生之干涉條紋係在焦點對準於作為檢測對象之面時出現。因此,作為塗佈動作之高度方向的基準面,在使用例如玻璃的表面或金屬薄膜、鉻膜等無凹凸之平滑面的情況,在對準焦點時係有效。在電子元件之組裝步驟等使用塗佈裝置100的情況,作為塗佈動作之高度方向的基準面,有的選擇金屬薄膜等之平滑面。
The interference fringes generated by the
又,如第5圖所示,因為分離度之山形波形之山麓的寬度小至數μm而尖峰值明確地出現,所以可高精度地檢測出焦點位置。 Moreover, as shown in FIG. 5, since the width of the foothills of the mountain-shaped waveform of the separation degree is as small as a few μm and sharp peaks clearly appear, the focus position can be detected with high accuracy.
此處,如第12圖所示,將基板9上之金屬薄膜91的表面上之區域AR作為高度方向的基準面,說明將墨水塗佈於塗佈部92的情況之動作的例子。此外,金屬薄膜91與塗佈
部92係當作相同的高度。
Here, as shown in FIG. 12, an example of the operation in the case where the ink is applied to the
預先求得塗佈部92與塗佈針170之前端的偏置量,並儲存於塗佈裝置100之控制用電腦70。偏置量係如以下所示求得。
The offset between the coating
控制用電腦70係如第13圖所示,根據第1實施形態所示之方法,將焦點對準於在是基準面之金屬薄膜91的表面所設定之區域AR。具體而言,對區域AR之像素求得亮度分布圖,再根據該亮度分布圖計算分離度R,並執行自動對焦動作。
As shown in FIG. 13, the
接著,控制用電腦70係使塗佈裝置100之墨水塗佈機構50的可動板15在第10圖之X軸方向或Y軸方向移動,而將塗佈針170移至塗佈部92的上方。然後,如第14圖所示,控制用電腦70係在使Z工作台40僅下降△z後,控制墨水塗佈機構50,執行在第11圖所說明之塗佈動作後,使可動板15回到原來的位置。
Next, the
確認塗佈裝置100的監視器74,在墨水未被塗佈於塗佈部92的情況,變更△z,再執行上述的步驟。重複此操作至墨水被塗佈於塗佈部92,在最初被塗佈時的△z儲存於控制用電腦70。
Confirm that the
在實際的塗佈動作,使用第1實施形態所示的方法,在將焦點對準於是基準面之金屬薄膜91的表面後,使塗佈裝置100之墨水塗佈機構50的可動板15在第10圖之X軸方向或Y軸方向移動,而將塗佈針170移至塗佈部92的上方。然後,在使Z工作台40僅下降△z後,控制墨水塗佈機構50,
執行塗佈動作後,使可動板15回到原來的位置。
In the actual coating operation, using the method shown in the first embodiment, after focusing on the surface of the metal
在以上的說明,金屬薄膜91與塗佈部92係當作相同的高度來說明,但是如第15圖所示,在塗佈部92比金屬薄膜91更高的情況,係使Z工作台40僅移動從△z減去那些段差△d的(△z-△d)。又,如第16圖所示,在塗佈部92比金屬薄膜91更低的情況,係使Z工作台40僅移動對△z加上段差△d的(△z+△d)。此外,此處,將Z工作台40之下降方向當作正。
In the above description, the metal
在上述之方法,將墨水塗佈於塗佈部92後,檢查所塗佈之墨水的膜厚。作為測量膜厚之方法,可使用例如在特開2015-007564號公報所記載之方法來測量表面形狀。如第17圖所示,求得金屬薄膜91與所塗佈之墨水94之頂點部的段差△t。
In the above method, after the ink is applied to the
在求得之段差△t比預先儲存於塗佈裝置100之控制用電腦70的下限值TL更小的情況,再塗佈墨水。在此時,若將已塗佈之墨水的膜厚當作△t,則將Z工作台40的偏置量設定為(△z-△t),塗佈墨水。重複地執行此動作至墨水的膜厚△t超過下限值TL。但,計數塗佈次數i,在i超過所預先指定之最大次數N時中斷塗佈動作。
When the obtained step difference Δt is smaller than the lower limit value TL stored in the
在中斷塗佈動作時,作業員在監視器74確認塗佈部92之狀態,判定是否正確地執行塗佈。
When the coating operation is interrupted, the operator confirms the state of the
第18圖係用以說明在控制用電腦70所執行之膜厚檢查處理的流程圖。
Fig. 18 is a flowchart for explaining the film thickness inspection process executed by the
參照第18圖,開始執行塗佈動作時,控制用電腦70係在步驟(以下將步驟簡稱為S)S100,將焦點對準於如第12圖之金屬薄膜91之預定的基準面(第13圖),根據此時之至基準面的焦點距離、及所預設之物鏡19與塗佈針170之高度方向的偏置,控制用電腦70算出從基準面至塗佈針170之前端的高度△z。
Referring to FIG. 18, when starting to perform the coating operation, the
然後,控制用電腦70係使X工作台42及Y工作台44移動,而塗佈針170移動成位於塗佈部92的上方。
Then, the
接著,控制用電腦70係在S110將表示塗佈次數之計數值i起始化成i=1,並將處理移至S120。在S120,控制用電腦70判定計數值i是否是既定最大次數N以下。
Next, the
在計數值i是否是既定最大次數N以下(i≦N)的情況(在S120為Yes),將處理移至S130,控制用電腦70係使Z工作台40僅下降△z,並對塗佈部92塗佈墨水(第14圖)。
When the count value i is equal to or less than the predetermined maximum number of times N (i≦N) (Yes at S120), the process is moved to S130, and the
然後,控制用電腦70係使Z工作台40僅上升△z,回到起始位置,再定位成物鏡19位於塗佈部92的上方。接著,控制用電腦70係在S140,一面使Z工作台40對基板9在高度方向相對地移動,一面藉CCD相機4拍攝干涉光的影像,並從干涉光強度成為尖峰值之Z工作台40的位置,測量自所塗佈之墨水之頂點部的基準面之高度△t(第17圖)。
Then, the
控制用電腦70係在S150,判定所測量之墨水部的膜厚△t是否是既定下限值TL以上(△t≧TL)。
The
在膜厚△t未滿下限值TL的情況(在S150為NO),因為塗佈量不足,所以控制用電腦70係在S160使計數值i增
加,並使處理回到S120,再執行塗佈動作,在此時,塗佈針170的下降量被修正成(△z-△t)。
In the case where the film thickness Δt is less than the lower limit value TL (NO in S150), since the coating amount is insufficient, the
此外,在重複執行上述之塗佈動作的過程,在計數值i超過所預先指定之最大次數N的情況(i>N)(在S120為NO),控制用電腦70係中斷塗佈動作。
In addition, in the process of repeatedly performing the above coating operation, when the count value i exceeds the predetermined maximum number N (i>N) (NO at S120), the
又,膜厚△t成為下限值TL以上的情況(在S150為YES),當作塗佈結束,控制用電腦70結束塗佈動作。
In addition, when the film thickness Δt is equal to or higher than the lower limit value TL (YES in S150), the
如以上所示,使用根據本實施形態之形狀測量裝置,根據上述之處理控制塗佈裝置100,藉此,因為可高精度且高效率地測量所塗佈之墨水的高度,所以可改善作業效率。
又,藉由首先在將焦點對準基準面後進行塗佈動作,因為塗佈針與塗佈部之位置關係穩定,所以可使附著於塗佈部之墨水量變成穩定。
As described above, using the shape measuring device according to the present embodiment, the
進而,測量塗佈後的膜厚,重複地進行塗佈動作至該膜厚超過既定量,藉此,可減少塗佈量不足所造成之製品的不良。又,因為亦可省略不良品之修正的人力、時間,所以可改善製造週期。 Furthermore, the film thickness after coating is measured, and the coating operation is repeatedly performed until the film thickness exceeds a predetermined amount, thereby reducing the defect of the product caused by the insufficient coating amount. In addition, the manpower and time for correcting defective products can be omitted, so the manufacturing cycle can be improved.
應認為這次所揭示之實施形態係在所有的事項上是舉例表示,不是用以限制者。本發明的範圍係不是上述的說明,而藉申請專利範圍所表示,圖謀包含與申請專利範圍同等之意義及在範圍內之全部的變更。 It should be considered that the embodiment disclosed this time is an example on all matters, not a limitation. The scope of the present invention is not the above description, but is expressed by the scope of patent application, and the plot includes the same meaning as the scope of patent application and all changes within the scope.
1‧‧‧照明裝置 1‧‧‧Lighting
2‧‧‧觀察光學系統 2‧‧‧Observation optical system
3‧‧‧米勞(Mirau)干涉計 3‧‧‧Mirau interferometer
4‧‧‧攝像裝置 4‧‧‧Camera device
5‧‧‧壓電工作台 5‧‧‧ Piezo worktable
6‧‧‧控制裝置 6‧‧‧Control device
7‧‧‧對象物 7‧‧‧Object
10‧‧‧頭部 10‧‧‧Head
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