TWI680999B - Expanded particle molded body and panel packaging container - Google Patents

Expanded particle molded body and panel packaging container Download PDF

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TWI680999B
TWI680999B TW105103594A TW105103594A TWI680999B TW I680999 B TWI680999 B TW I680999B TW 105103594 A TW105103594 A TW 105103594A TW 105103594 A TW105103594 A TW 105103594A TW I680999 B TWI680999 B TW I680999B
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molded body
expanded particle
particle molded
resin
styrene
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TW201641543A (en
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及川政春
西島浩気
島昌臣
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日商Jsp股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02Homopolymers or copolymers of hydrocarbons
    • C08L25/04Homopolymers or copolymers of styrene
    • C08L25/08Copolymers of styrene
    • C08L25/14Copolymers of styrene with unsaturated esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02Monomers containing only one unsaturated aliphatic radical
    • C08F212/04Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06Hydrocarbons
    • C08F212/08Styrene
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/12Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
    • C08J9/122Hydrogen, oxygen, CO2, nitrogen or noble gases
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2325/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
    • C08J2325/02Homopolymers or copolymers of hydrocarbons
    • C08J2325/04Homopolymers or copolymers of styrene
    • C08J2325/08Copolymers of styrene
    • C08J2325/14Copolymers of styrene with unsaturated esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/04Homopolymers or copolymers of ethene
    • C08J2423/06Polyethene

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
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Abstract

本發明之課題為提供壓縮剛性及撓曲耐性優異,並且可防止因變形所導致的破壞之發泡粒子成形體及面板梱包容器。 An object of the present invention is to provide a foamed particle molded body and a panel wrapping container which are excellent in compression rigidity and bending resistance and can prevent damage due to deformation.

本發明之解決手段為一種將複合樹脂發泡粒子進行模內成形而成之發泡粒子成形體及由此發泡粒子成形體所構成之面板梱包容器(1)。構成發泡粒子成形體之複合樹脂係將對於乙烯系樹脂100質量份而言為400~900質量份之苯乙烯系單體進行含浸聚合而成,且特定之膨潤度為1.25以上。 The solution of the present invention is an expanded particle molded body formed by in-mold molding of composite resin expanded particles, and a panel wrapping container (1) composed of the expanded particle molded body. The composite resin constituting the expanded particle molded body is obtained by impregnating and polymerizing styrene-based monomers of 400 to 900 parts by mass with respect to 100 parts by mass of the ethylene-based resin, and the specific swelling degree is 1.25 or more.

Description

發泡粒子成形體及面板捆包容器 Expanded particle molded body and panel packaging container

本發明係關於一種將複合樹脂發泡粒子進行模內成形而成之發泡粒子成形體及由該發泡粒子成形體所構成之面板梱包容器。 The present invention relates to a foamed particle molded body formed by in-mold molding of composite resin foamed particles and a panel wrapping container formed of the foamed particle molded body.

以往,於液晶面板、太陽光發電面板等之板狀製品的梱包中,基於不發生擦傷或摩擦導致之磨耗、破裂、缺損而可複數次使用等之理由,而使用由丙烯系樹脂之發泡粒子成形體所構成的容器。近年來,梱包重量係伴隨著面板尺寸的擴大而變大。其結果,於由丙烯系樹脂之發泡粒子成形體所構成的容器,產生了梱包狀態下之撓曲量增大的問題。若梱包時之撓曲量大,則有在利用搬運機等支撐梱包狀態之容器的兩端來舉起時脫落之虞,或因彎曲而導致液晶面板破損之虞。 In the past, in the packing of plate-like products such as liquid crystal panels, photovoltaic power generation panels, etc., foams made of acrylic resins have been used for reasons such as abrasion, cracks, and defects due to scratches or friction, which can be used multiple times, etc. A container made of shaped particles. In recent years, the weight of the bag has increased with the increase in the size of the panel. As a result, in a container formed of a foamed particle molded body of a propylene-based resin, there arises a problem that the amount of deflection in the packed state increases. If the amount of deflection during packing is large, there is a possibility that the container may be detached when lifted by both ends of the container in a packed state, or the liquid crystal panel may be damaged due to bending.

相對於此,乙烯系樹脂與苯乙烯系樹脂之複合樹脂的發泡粒子成形體係藉由提高苯乙烯系樹脂成分量,而可提昇發泡粒子成形體之剛性(例如,參照專利文獻1~3)。因此,於如此之複合樹脂發泡粒子成形體中 係可縮小撓曲量而提昇撓曲耐性,可使搬運性成為良好。又,由於成為可一面保有撓曲耐性一面提高發泡倍率,因此於複合樹脂發泡粒子成形體中係有著可削減梱包材本身的重量等之優點。 In contrast, the expanded particle molding system of a composite resin of a vinyl resin and a styrene resin can increase the rigidity of the expanded particle molded body by increasing the amount of the styrene resin component (for example, refer to Patent Documents 1 to 3 ). Therefore, in such a composite resin expanded particle molded body The system can reduce the amount of deflection and improve the deflection resistance, which can improve the transportability. In addition, since it is possible to increase the expansion ratio while maintaining the bending resistance, the composite resin expanded particle molded body has the advantages of reducing the weight of the wrapping material itself.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2014-196441號公報 [Patent Document 1] Japanese Patent Application Publication No. 2014-196441

[專利文獻2]日本特開2014-196444號公報 [Patent Document 2] Japanese Laid-Open Patent Publication No. 2014-196444

[專利文獻3]日本專利第5058866號公報 [Patent Document 3] Japanese Patent No. 5058866

然而,相較於丙烯系樹脂發泡成形體,複合樹脂發泡粒子成形體係彎曲破斷能量較小。尤其,若為了提高剛性而提高複合樹脂中之苯乙烯系樹脂成分的比例,則即使發泡粒子彼此強固地熔接,黏性強度亦不足,若以梱包狀態作堆積,或於梱包狀態下之移動中發生急劇的荷重變化,則恐有發生破裂之虞。 However, compared with the propylene resin foam molded body, the composite resin foamed particle molding system has a smaller bending breaking energy. In particular, if the ratio of the styrene-based resin component in the composite resin is increased in order to increase the rigidity, even if the foamed particles are strongly welded to each other, the adhesive strength is insufficient. If they are piled up in the wrapped state or moved in the wrapped state If there is a sudden load change in the middle, there is a fear of rupture.

本發明係鑑於該背景而完成者,其係提供壓縮剛性及撓曲耐性優異,並且可防止因變形所導致的破壞之發泡粒子成形體及面板梱包容器。 The present invention has been completed in view of this background, and it provides an expanded particle molded body and a panel wrapping container which are excellent in compression rigidity and flex resistance, and can prevent damage due to deformation.

本發明之一樣態係一種發泡粒子成形體,其係將複合樹脂發泡粒子進行模內成形而成之發泡粒子成形體,其特徵為,構成該發泡粒子成形體之複合樹脂係將對於乙烯系樹脂100質量份而言為400~900質量份之苯乙烯系單體進行含浸聚合而成,將上述複合樹脂藉由二甲苯進行索氏萃取時之二甲苯不溶物質與上述索氏萃取後之二甲苯溶液中所含之丙酮不溶物質的混合不溶物質之於溫度23℃之甲基乙基酮中的膨潤度為1.25以上。 The same aspect of the present invention is an expanded particle molded body, which is an expanded particle molded body formed by in-mold molding of composite resin expanded particles, characterized in that the composite resin constituting the expanded particle molded body is For 100 parts by mass of ethylene-based resin, 400 to 900 parts by mass of styrene monomer is impregnated and polymerized. The xylene-insoluble matter and the above-mentioned Soxhlet extraction when the above composite resin is subjected to Soxhlet extraction by xylene The swelling degree of the mixed insoluble matter of the acetone insoluble matter contained in the xylene solution in methyl ethyl ketone at a temperature of 23°C is 1.25 or more.

本發明之另一樣態係一種面板梱包容器,其係由上述發泡粒子成形體所構成之面板梱包容器,其特徵為,具有將複數個面板以在板厚方向上層積的狀態進行收容之收容部。 Another aspect of the present invention is a panel packing container, which is a panel packing container composed of the above-mentioned expanded particle molded body, and is characterized by having a plurality of panels accommodated in a state of being stacked in the thickness direction unit.

上述發泡粒子成形體係由於乙烯系樹脂中含浸聚合特定比例之苯乙烯系單體而成之複合樹脂所構成。因此,上述發泡粒子成形體係壓縮強度高,且彎曲彈性率高。是故,上述發泡粒子成形體係撓曲耐性優異。再者,上述複合樹脂係上述之膨潤度為1.25以上。因此,上述發泡粒子成形體係如上述般發揮優異的撓曲耐性,並且顯示高壓縮剛性,進而顯示高彎曲彈性能量,因此,可充分 防止因變形導致之破壞。 The above-mentioned expanded particle molding system is composed of a composite resin formed by impregnating and polymerizing a certain proportion of styrene monomer in an ethylene resin. Therefore, the above-mentioned expanded particle molding system has high compressive strength and high bending elastic modulus. Therefore, the above-mentioned expanded particle molding system is excellent in bending resistance. In addition, the swelling degree of the composite resin is 1.25 or more. Therefore, the above-mentioned expanded particle molding system exhibits excellent flex resistance as described above, and exhibits high compression rigidity, and further exhibits high bending elastic energy. Prevent damage due to deformation.

上述面板梱包容器係由上述之發泡粒子成形體所構成,且具有將複數個面板以在板厚方向上層積的狀態進行收容之收容部。因此,即使於上述收容部中收容複數個面板,面板梱包容器亦不易因面板重量而撓曲,進而不易因變形而破壞。因而,面板梱包容器即使以梱包狀態作堆積,或於梱包狀態下之移動中發生急劇的荷重變化,也可防止破裂發生。 The panel packing container is composed of the above-mentioned expanded particle molded body, and has an accommodating portion for accommodating a plurality of panels in a state of being stacked in the plate thickness direction. Therefore, even if a plurality of panels are accommodated in the accommodating portion, the panel packing container is less likely to deflect due to the weight of the panel, and thus is less likely to be damaged due to deformation. Therefore, even if the panel clad container is piled up in a clamshell state, or a sudden load change occurs during movement in the clamshell state, cracking can be prevented.

1‧‧‧面板梱包容器 1‧‧‧Panel container

10‧‧‧收容部 10‧‧‧ Containment Department

2‧‧‧容器主體 2‧‧‧Container body

3‧‧‧蓋體 3‧‧‧cover

[第1圖]係實施例4之面板梱包容器的立體圖。 [Figure 1] is a perspective view of a panel bag container of Example 4.

[第2圖]係實施例4之面板梱包容器的剖面圖(具體而言係II-II線剖面圖)。 [Figure 2] is a cross-sectional view of a panel bag container of Example 4 (specifically, a cross-sectional view taken along line II-II).

[第3圖]係實施例4之面板梱包容器的展開圖。 [Figure 3] is a development view of a panel bag container of Example 4.

[第4圖]係顯示將實施例4之面板梱包容器抓持長邊方向之兩端來舉起的樣子的說明圖。 [FIG. 4] It is explanatory drawing which shows the state which lifted the panel bag container of Example 4 by holding both ends of the longitudinal direction.

[第5圖]係顯示將實施例4之面板梱包容器抓持短邊方向之兩端來舉起的樣子的說明圖。 [Fig. 5] It is an explanatory view showing a state in which the panel bag container of Example 4 is lifted by holding both ends in the short-side direction.

[第6圖]係顯示將實施例5之面板梱包容器抓持長邊方向之兩端來舉起的樣子的說明圖。 [Fig. 6] It is an explanatory view showing a state in which the panel bag container of Example 5 is lifted by holding both ends in the longitudinal direction.

[第7圖]係顯示將實施例5之面板梱包容器抓持短邊方向之兩端來舉起的樣子的說明圖。 [FIG. 7] It is explanatory drawing which shows the state which lifted up the panel bag container of Example 5 by holding both ends of the short side direction.

接著,針對上述發泡粒子成形體及面板梱包容器之實施形態進行說明。 Next, an embodiment of the above-mentioned expanded particle molded body and panel wrapping container will be described.

發泡粒子成形體係將複合樹脂發泡粒子(以下,亦適宜稱為「發泡粒子」)進行模內成形而成,複合樹脂發泡粒子係使藉由將苯乙烯系單體含浸於乙烯系樹脂粒子並聚合所得到的複合樹脂(具體而言係複合樹脂粒子)進行發泡而成。相對於乙烯系樹脂100質量份,苯乙烯系單體之摻合量為400~900質量份。在苯乙烯系單體為未達400質量份的情況,剛性會降低,而恐有撓曲耐性成為不充分之虞。基於相同的觀點,相對於乙烯系樹脂100質量份,苯乙烯系單體之摻合量較佳為超過450質量份,更佳為500質量份以上。另一方面,在苯乙烯系單體為超過900質量份的情況,發泡粒子成形體容易破裂且變脆。基於相同的觀點,相對於乙烯系樹脂100質量份,苯乙烯系單體之摻合量較佳為800質量份以下,更佳為700質量份以下,再更佳為600質量份以下。 Expanded particle forming system is formed by in-mold molding of composite resin expanded particles (hereinafter, also suitably referred to as "expanded particles"). The composite resin expanded particles are obtained by impregnating vinyl resin with styrene monomer The composite resin (specifically, composite resin particles) obtained by polymerizing the resin particles is expanded by foaming. The blending amount of the styrene monomer is 400 to 900 parts by mass relative to 100 parts by mass of the vinyl resin. When the styrene-based monomer is less than 400 parts by mass, the rigidity is reduced, and there is a fear that the flex resistance may be insufficient. From the same viewpoint, the blending amount of the styrene-based monomer is preferably more than 450 parts by mass, and more preferably 500 parts by mass or more with respect to 100 parts by mass of the vinyl resin. On the other hand, in the case where the styrene-based monomer exceeds 900 parts by mass, the expanded particle molded body is easily broken and becomes brittle. From the same viewpoint, the blending amount of the styrene-based monomer is preferably 800 parts by mass or less, more preferably 700 parts by mass or less, and even more preferably 600 parts by mass or less with respect to 100 parts by mass of the vinyl resin.

作為乙烯系樹脂,例如,可使用直鏈狀低密度聚乙烯、分支狀低密度聚乙烯、高密度聚乙烯、乙烯-丙烯酸系共聚物、乙烯-丙烯酸烷基酯共聚物、乙烯-甲基丙烯酸烷基酯共聚物等。作為乙烯系樹脂雖可為1種聚合物,但亦可使用2種以上之聚合物的混合物。 As the ethylene-based resin, for example, linear low-density polyethylene, branched low-density polyethylene, high-density polyethylene, ethylene-acrylic copolymer, ethylene-alkyl acrylate copolymer, ethylene-methacrylic acid can be used Alkyl ester copolymers, etc. Although the vinyl resin may be one kind of polymer, a mixture of two or more kinds of polymers may also be used.

較佳為乙烯系樹脂係以將直鏈狀低密度聚乙烯作為主成分為佳。直鏈狀低密度聚乙烯較佳係以具有分 支構造者為佳,該分支構造係具有直鏈之聚乙烯鏈與碳數2~6之短鏈狀之分支鏈。具體而言,可列舉例如乙烯-丁烯共聚物、乙烯-己烯共聚物、乙烯-辛烯共聚物等。尤其,乙烯系樹脂較佳係使用茂金屬系聚合觸媒進行聚合而成之熔點105℃以下之直鏈狀低密度聚乙烯。於此情況中,乙烯系樹脂與苯乙烯系樹脂之親和性會更提昇,而可提高複合樹脂之韌性。又,由於可減少低分子量成分,提高成形時之發泡粒子間的熔接強度,因此可使發泡粒子成形體不易破裂。進而,成為可得到以更高水準兼具苯乙烯系樹脂之優異的剛性與乙烯系樹脂之優異的黏性強度之發泡粒子成形體。 Preferably, the vinyl-based resin system has linear low-density polyethylene as the main component. Straight-chain low-density polyethylene is preferably The branch structure is better. The branch structure is a linear polyethylene chain and a short-chain branch chain with a carbon number of 2-6. Specific examples include ethylene-butene copolymer, ethylene-hexene copolymer, and ethylene-octene copolymer. In particular, the ethylene-based resin is preferably a linear low-density polyethylene having a melting point of 105° C. or lower and polymerized by a metallocene-based polymerization catalyst. In this case, the affinity of the vinyl resin and the styrene resin will be more improved, and the toughness of the composite resin can be improved. In addition, since the low molecular weight component can be reduced and the fusion strength between the foamed particles during molding can be improved, the foamed particle molded body is less likely to break. Furthermore, it becomes a foamed particle molded body which can obtain both the excellent rigidity of the styrene resin and the excellent adhesive strength of the vinyl resin at a higher level.

又,乙烯系樹脂之熔點Tm較佳為95~105℃。於此情況中,在複合樹脂發泡粒子之製造時,可使苯乙烯系單體充分含浸於乙烯系樹脂中,而可防止在聚合時懸浮系不安定化一事。其結果,成為可得到以更高水準兼具苯乙烯系樹脂之優異的剛性與乙烯系樹脂之優異的黏性強度之發泡粒子成形體。更佳為乙烯系樹脂之熔點Tm係以100~105℃為佳。另外,熔點Tm係可根據JIS K7121-1987年,以示差掃描熱量測定(以下,亦適宜稱為「DSC」)進行測定。 In addition, the melting point Tm of the vinyl resin is preferably 95 to 105°C. In this case, the styrene-based monomer can be sufficiently impregnated with the vinyl-based resin during the production of the expanded composite resin particles, and the suspension system can be prevented from becoming unstable during polymerization. As a result, it is possible to obtain a foamed particle molded body having a higher level of excellent rigidity of styrene-based resin and excellent adhesive strength of ethylene-based resin. More preferably, the melting point Tm of the vinyl resin is preferably 100 to 105°C. In addition, the melting point Tm can be measured by differential scanning calorimetry (hereinafter, also suitably referred to as "DSC") according to JIS K7121-1987.

乙烯系樹脂較佳係由熔點Tm(單位:℃)與維卡軟化點Tv(單位:℃)為滿足Tm-Tv≦20之關係的直鏈狀低密度聚乙烯所構成。如此之乙烯系樹脂係顯示均勻的分子構造,而可推測以交聯所致之網狀構造會更均勻 地分布於乙烯系樹脂中。因而,於此情況中,可更提昇發泡粒子成形體之強度及黏性強度。基於相同的觀點,直鏈狀低密度聚乙烯更佳係滿足Tm-Tv≦15,再更佳係滿足Tm-Tv≦10。通常,熔點Tm係比維卡軟化點Tv更高。另外,維卡軟化點Tv係可根據JIS K 7206-1999年進行測定。 The vinyl resin is preferably composed of a linear low-density polyethylene having a melting point Tm (unit: °C) and a Vicat softening point Tv (unit: °C) satisfying the relationship of Tm-Tv≦20. Such a vinyl resin system shows a uniform molecular structure, and it can be speculated that the network structure due to cross-linking will be more uniform Distributed in vinyl resin. Therefore, in this case, the strength and viscosity strength of the expanded particle molded body can be further improved. Based on the same viewpoint, the linear low-density polyethylene preferably satisfies Tm-Tv≦15, and even more preferably satisfies Tm-Tv≦10. Generally, the melting point Tm is higher than the Vicat softening point Tv. In addition, Vicat softening point Tv system can be measured according to JIS K 7206-1999.

於溫度190℃、荷重2.16kg之條件下的乙烯系樹脂之熔體質量流動速率(以下,亦適宜稱為「MFR」),就發泡性的觀點而言,較佳為0.5~4.0g/10分,更佳為1.0~3.0g/10分。於溫度190℃、荷重2.16kg之條件下的乙烯系樹脂之MFR係根據JIS K7210-1999年,以條件代碼D所測定之值。另外,作為測定裝置係可使用MELT INDEXER(例如寶工業(股)製之型式L203等)。 The melt flow rate of the ethylene-based resin at a temperature of 190°C and a load of 2.16 kg (hereinafter, also suitably referred to as "MFR") is preferably 0.5 to 4.0 g/ from the viewpoint of foamability. 10 points, preferably 1.0 to 3.0 g/10 points. The MFR of an ethylene-based resin at a temperature of 190°C and a load of 2.16 kg is a value measured under condition code D according to JIS K7210-1999. In addition, as the measuring device, MELT INDEXER (for example, Model L203 manufactured by Takara Industrial Co., Ltd.) can be used.

上述苯乙烯系樹脂係指樹脂中之苯乙烯成分單位為50質量%以上者。於苯乙烯系樹脂中之苯乙烯成分單位較佳為80質量%以上,更佳為90質量%以上。另外,於本說明書中係將構成苯乙烯系樹脂之苯乙烯、可與因應需要所添加之苯乙烯共聚合的單體併稱為苯乙烯系單體。作為可與苯乙烯共聚合的單體,例如有下述之苯乙烯衍生物,其他之乙烯基單體等。 The styrene-based resin refers to a unit in which the styrene component in the resin is 50% by mass or more. The styrene component unit in the styrene-based resin is preferably 80% by mass or more, and more preferably 90% by mass or more. In addition, in this specification, the monomer which can copolymerize the styrene which comprises a styrene resin and the styrene added as needed is also called a styrene monomer. Examples of monomers copolymerizable with styrene include the following styrene derivatives and other vinyl monomers.

作為苯乙烯衍生物係可列舉:α-甲基苯乙烯、o-甲基苯乙烯、m-甲基苯乙烯、p-甲基苯乙烯、p-乙基苯乙烯、2,4-二甲基苯乙烯、p-甲氧基苯乙烯、p-n-丁 基苯乙烯、p-t-丁基苯乙烯、o-氯苯乙烯、m-氯苯乙烯、p-氯苯乙烯、2,4,6-三溴苯乙烯、二乙烯苯、苯乙烯磺酸、苯乙烯磺酸鈉等。此等係可單獨或使用混合2種類以上者。 Examples of the styrene derivative system include: α-methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, p-ethylstyrene, 2,4-dimethyl Styrene, p-methoxystyrene, pn-butyl Styrene, pt-butylstyrene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, 2,4,6-tribromostyrene, divinylbenzene, styrenesulfonic acid, benzene Sodium ethylene sulfonate, etc. These systems can be used alone or in combination of two or more types.

又,作為其他之乙烯基單體係可列舉:丙烯酸酯、甲基丙烯酸酯、丙烯酸、甲基丙烯酸、含有羥基之乙烯化合物、含有腈基之乙烯化合物、有機酸乙烯化合物、烯烴化合物、二烯化合物、鹵化乙烯化合物、鹵化亞乙烯化合物、馬來醯亞胺化合物等。 In addition, examples of other vinyl monosystems include acrylates, methacrylates, acrylic acid, methacrylic acid, hydroxyl-containing vinyl compounds, nitrile-containing vinyl compounds, organic acid vinyl compounds, olefin compounds, and dienes. Compounds, halogenated vinyl compounds, halogenated vinylidene compounds, maleimide compounds, etc.

作為丙烯酸酯係有例如:丙烯酸甲酯、丙烯酸乙酯、丙烯酸丙酯、丙烯酸丁酯、丙烯酸2-乙基己酯等。 Examples of the acrylate system include methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate.

作為甲基丙烯酸酯係有例如:甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯、甲基丙烯酸丁酯、甲基丙烯酸2-乙基己酯等。 Examples of the methacrylate system include methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, and 2-ethylhexyl methacrylate.

作為含有羥基之乙烯化合物係有例如:羥乙基丙烯酸酯、羥丙基丙烯酸酯、羥乙基甲基丙烯酸酯、羥丙基甲基丙烯酸酯等。 Examples of the hydroxy-containing vinyl compound include hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, and hydroxypropyl methacrylate.

作為含有腈基之乙烯化合物係有例如:丙烯腈、甲基丙烯腈等。 Examples of vinyl compounds containing nitrile groups include acrylonitrile and methacrylonitrile.

作為有機酸乙烯化合物係有例如:乙酸乙烯酯、丙酸乙烯酯等。 Examples of the organic acid vinyl compound system include vinyl acetate and vinyl propionate.

作為烯烴化合物係有例如:乙烯、丙烯、1-丁烯、2-丁烯等。 Examples of the olefin compound system include ethylene, propylene, 1-butene, and 2-butene.

作為二烯化合物係有例如:丁二烯、異戊二烯、氯丁 二烯等。 Examples of the diene compound system include: butadiene, isoprene, and chloroprene Diene, etc.

作為鹵化乙烯化合物係有例如:氯乙烯、溴乙烯等。 Examples of vinyl halide compounds include vinyl chloride and vinyl bromide.

作為鹵化亞乙烯化合物係有例如:二氯亞乙烯等。 Examples of halogenated vinylidene compounds include vinylidene chloride.

作為馬來醯亞胺化合物係有例如:N-苯基馬來醯亞胺、N-甲基馬來醯亞胺等。 Examples of the maleimide compound system include N-phenylmaleimide, N-methylmaleimide, and the like.

此等之乙烯基單體係可單獨或使用混合2種類以上者。 These vinyl single systems can be used alone or in combination of two or more types.

作為苯乙烯系樹脂,就提高發泡性的觀點而言,較佳為聚苯乙烯、苯乙烯與丙烯酸系單體之共聚物。就進一步提高發泡性的觀點而言,如後述之實施例所示般,作為構成苯乙烯系樹脂的單體較佳係使用苯乙烯與丙烯酸丁酯。於此情況中,複合樹脂中之丙烯酸丁酯成分的含量較佳係對於複合樹脂全體而言為0.5~10質量%,更佳係1~8質量%,再更佳為2~5質量%。 As the styrene-based resin, from the viewpoint of improving foamability, polystyrene, a copolymer of styrene and an acrylic monomer is preferred. From the viewpoint of further improving foamability, as shown in the examples described later, it is preferable to use styrene and butyl acrylate as monomers constituting the styrene-based resin. In this case, the content of the butyl acrylate component in the composite resin is preferably 0.5 to 10% by mass for the entire composite resin, more preferably 1 to 8% by mass, and even more preferably 2 to 5% by mass.

於發泡粒子成形體中,在將構成該發泡粒子成形體之複合樹脂藉由二甲苯進行索氏萃取時之二甲苯不溶物質與上述索氏萃取後之二甲苯溶液中所含之丙酮不溶物質的混合不溶物質之於溫度23℃之甲基乙基酮中的膨潤度(以下,簡稱為「膨潤度」)過低的情況,恐有發泡樹脂成形體之彎曲破斷能量小,黏性強度變得不充分之虞。因而,複合樹脂之膨潤度係如上述般較佳為1.25以上,更佳為1.5以上,再更佳為2以上。又,就抑制發泡粒子成形體之收縮的觀點而言,複合樹脂之膨潤度較佳為10以下,更佳為5以下。 In the expanded particle molded body, the xylene-insoluble substance when the composite resin constituting the expanded particle molded body is subjected to Soxhlet extraction by xylene is insoluble with the acetone contained in the xylene solution after the Soxhlet extraction. If the swelling degree of the insoluble substance in methyl ethyl ketone at a temperature of 23°C (hereinafter, abbreviated as "swelling degree") is too low, there is a fear that the foamed resin molded body has low bending breaking energy and stickiness. The sexual strength may become insufficient. Therefore, the swelling degree of the composite resin is preferably 1.25 or more as described above, more preferably 1.5 or more, and even more preferably 2 or more. In addition, from the viewpoint of suppressing shrinkage of the expanded particle molded body, the swelling degree of the composite resin is preferably 10 or less, and more preferably 5 or less.

在膨潤度為上述特定值以上的情況,如後述般,針對剛性與黏性強度為優異的理由係可如下述般地推測。使交聯乙烯系樹脂浸漬於有機溶劑時之膨潤度(亦即,膨潤之程度)係與樹脂之立體網狀構造等之交聯構造具有相關性,由於網絡越細有機溶劑之吸收量越低,因此膨潤度會降低。另一方面,非交聯之乙烯系樹脂在溫度23℃之甲基乙基酮中幾乎不會膨潤。亦即,意味著:在如上述般複合樹脂之二甲苯不溶物質(具體而言係經交聯之乙烯系樹脂成分)與二甲苯可溶物質中之丙酮不溶物質(具體而言係通過篩孔之經交聯之乙烯系樹脂成分及未經交聯之乙烯系樹脂成分的合計)之混合不溶物質之膨潤度為大的情況,相較於膨潤度為小的情況,於構成複合樹脂之乙烯系樹脂中包含較多經交聯之立體網狀構造之網絡為粗的乙烯系樹脂成分。 When the degree of swelling is equal to or greater than the above-mentioned specific value, as will be described later, the reason why the rigidity and the adhesive strength are excellent can be estimated as follows. The degree of swelling (that is, the degree of swelling) when the cross-linked vinyl resin is immersed in an organic solvent is related to the cross-linked structure such as the three-dimensional network structure of the resin, because the finer the network, the lower the absorption of the organic solvent , So the swelling will be reduced. On the other hand, non-crosslinked vinyl resins hardly swell in methyl ethyl ketone at a temperature of 23°C. In other words, it means that the xylene-insoluble matter in the composite resin (specifically, the cross-linked vinyl resin component) and the acetone-insoluble matter in the xylene soluble matter (specifically, through the mesh) The total swelling degree of the mixed insoluble matter of the cross-linked ethylene-based resin component and the uncross-linked ethylene-based resin component is greater than that of the case where the swelling degree is small. The resin contains many vinyl resin components with a cross-linked three-dimensional network structure.

因此,經交聯之立體網狀構造之網絡為粗的乙烯系樹脂成分係在發泡時雖具有強度但也容易適度地延伸,因此推測可形成具有高強度的氣泡膜。進而,於複合樹脂發泡粒子中,在受到壓縮時,由於複合樹脂中之乙烯系樹脂為柔軟且可充分地變形,因此可推測即使在複合樹脂中之苯乙烯系樹脂之比率為高的情況,發泡粒子之氣泡膜也不會破裂而可維持獨立氣泡構造。亦即,在膨潤度為特定範圍的情況,以高水準兼具剛性及黏性強度,而可得到彎曲破斷能量大的發泡粒子成形體。 Therefore, although the network of the cross-linked three-dimensional network structure is thick, the ethylene-based resin component system has strength when foamed, but it is also easy to extend moderately. Therefore, it is presumed that a bubble film with high strength can be formed. Furthermore, in the composite resin expanded particles, when compressed, the vinyl resin in the composite resin is soft and can be sufficiently deformed, so it can be speculated that even if the ratio of the styrene resin in the composite resin is high In addition, the bubble film of the expanded particles will not be broken and the independent bubble structure can be maintained. That is, when the degree of swelling is within a specific range, a high level of both rigidity and viscous strength can be obtained, and a foamed particle molded body having a large bending breaking energy can be obtained.

例如,在乙烯系樹脂核粒子與第1單體(具 體而言係後述之苯乙烯系單體)之摻合比率為大的條件、使第1單體含浸於乙烯系樹脂核粒子之溫度為高的條件、抽氫反應能為高的聚合起始劑之使用的條件等之以往探討過的製造條件中,可推測於聚合初期,在乙烯系樹脂中苯乙烯系單體進行聚合而作為苯乙烯系樹脂析出的速度會變快,而乙烯系樹脂之經交聯的立體網狀構造之網絡會變細。另一方面,藉由調整聚合起始劑之種類或添加量、聚合溫度、乙烯系樹脂核粒子與第1單體之摻合比率,而可減緩於聚合初期苯乙烯系樹脂成分析出的速度,而將經交聯之立體網狀構造的網絡為細之乙烯系樹脂成分的量控制得較少。 For example, the vinyl resin core particles and the first monomer (with Generally speaking, it is a condition that the blending ratio of the styrene monomer described later is large, the temperature at which the first monomer is impregnated with the vinyl resin core particles is high, and the hydrogen extraction reaction energy is high. In the previously discussed manufacturing conditions such as the conditions for the use of the agent, it is presumed that at the initial stage of polymerization, the styrene-based monomer is polymerized in the vinyl-based resin to precipitate as a styrene-based resin, and the vinyl-based resin The network of the cross-linked three-dimensional mesh structure will become thinner. On the other hand, by adjusting the type or amount of the polymerization initiator, the polymerization temperature, and the blending ratio of the vinyl resin core particles and the first monomer, it is possible to slow down the analysis rate of the styrene resin at the initial stage of polymerization However, the amount of the vinyl resin component whose cross-linked three-dimensional network structure is fine is controlled to be small.

又,於複合樹脂中,較佳係以索氏萃取所致之上述二甲苯不溶物質的重量比例為40%以下(但,包含0)。於此情況中係可更提昇發泡性。又,二甲苯不溶物質之重量比例更佳為35%以下(但,包含0),再更佳為30%以下(但,包含0)。又,二甲苯不溶物質之重量比例更佳為5%以上。於此情況中,可更提昇發泡粒子成形體之剛性及黏性強度。 In addition, in the composite resin, it is preferable that the weight ratio of the xylene-insoluble substance by Soxhlet extraction is 40% or less (however, 0 is included). In this case, the foamability can be further improved. In addition, the weight ratio of xylene-insoluble matter is more preferably 35% or less (including 0), and even more preferably 30% or less (including 0). Moreover, the weight ratio of xylene insoluble matter is more preferably 5% or more. In this case, the rigidity and viscous strength of the expanded particle molded body can be further improved.

發泡粒子成形體之表觀密度較佳為30~100kg/m3。若為此範圍則可一面保有輕量性、緩衝性能,一面得到高彎曲剛性與壓縮恢復性。發泡粒子成形體之表觀密度更佳為30~65kg/m3。在面板梱包容器由上述發泡粒子成形體所構成的情況,發泡粒子成形體之表觀密度更佳為40~100kg/m3The apparent density of the expanded particle molded body is preferably 30 to 100 kg/m 3 . Within this range, light weight and cushioning performance can be maintained, while high bending rigidity and compression recovery can be obtained. The apparent density of the expanded particle molded body is more preferably 30 to 65 kg/m 3 . In the case where the panel packing container is composed of the above-mentioned expanded particle molded body, the apparent density of the expanded particle molded body is more preferably 40 to 100 kg/m 3 .

發泡粒子成形體係將複合樹脂發泡粒子進行模內成形而得到,複合樹脂發泡粒子係例如以下述方式製造。 The expanded particle molding system is obtained by in-mold molding of a composite resin expanded particle. The composite resin expanded particle is produced, for example, as follows.

首先,使以乙烯系樹脂作為主成分之核粒子懸浮於水性介質中來製作懸浮液。接著,於懸浮液中添加苯乙烯系單體。接著,使苯乙烯系單體含浸於核粒子,並進行聚合。然後,藉由使聚合後之複合樹脂粒子進行發泡,而可製造複合樹脂發泡粒子。 First, suspension particles are prepared by suspending core particles containing ethylene-based resin as a main component in an aqueous medium. Next, styrene monomer is added to the suspension. Next, the styrene-based monomer is impregnated with the core particles and polymerized. Then, by expanding the polymerized composite resin particles, composite resin expanded particles can be produced.

於使苯乙烯系單體含浸於核粒子並進行聚合中,雖亦可將使用量之全量的苯乙烯系單體一起添加,但亦可如後述之分散步驟及改質步驟般,將苯乙烯系單體之使用量分割成例如第1單體及第2單體,將此等單體在不同的時機進行添加。如後者般,藉由將苯乙烯系單體進行分割來添加,而可抑制聚合時之樹脂粒子彼此的凝結。 In order to impregnate the styrene-based monomer with the core particles and perform polymerization, although the entire amount of the styrene-based monomer used can also be added together, the styrene can also be added as described later in the dispersion step and the modification step The usage amount of the monomer is divided into, for example, the first monomer and the second monomer, and these monomers are added at different timings. As in the latter case, by dividing and adding the styrene-based monomer, the aggregation of the resin particles during polymerization can be suppressed.

具體而言,複合樹脂發泡粒子,例如,可藉由進行下述之分散步驟、改質步驟、及發泡步驟進行製造。於分散步驟中係在使以乙烯系樹脂作為主成分之核粒子懸浮於水性介質中之懸浮液中添加第1單體(亦即,苯乙烯系單體)與聚合起始劑,使第1單體分散於懸浮液中。 Specifically, the composite resin expanded particles can be produced by performing the following dispersion step, modification step, and expansion step, for example. In the dispersion step, the first monomer (that is, the styrene-based monomer) and the polymerization initiator are added to the suspension in which the core particles of the vinyl resin as the main component are suspended in the aqueous medium, so that the first The monomer is dispersed in the suspension.

於改質步驟中,將上述懸浮液進行加熱,當將核粒子之乙烯系樹脂的熔點設為Tm時,以(Tm-10)~(Tm+30)℃之溫度,將第2單體(亦即,苯乙烯系單體)花費特定的添加時間連續地添加於上述懸浮液中,使 苯乙烯系單體含浸於上述核粒子中並進行聚合。 In the modification step, the above suspension is heated, and when the melting point of the ethylene-based resin of the core particles is set to Tm, the second monomer ((Tm-10) to (Tm+30) °C That is, the styrene-based monomer) is continuously added to the above-mentioned suspension with a specific addition time, so that The styrene-based monomer is impregnated in the above-mentioned core particles and polymerized.

另外,在相對於核粒子之第1單體(亦即,苯乙烯系單體)的重量比之種晶比(seed ratio)過低的情況,係恐有複合樹脂粒子成為扁平之虞。因而,第1單體之種晶比較佳為0.5以上,更佳為0.7以上,再更佳為0.8以上。另一方面,在種晶比過高的情況係有導致苯乙烯系單體在充分含浸於核粒子之前進行聚合之虞。其結果,有變得無法得到剛性或黏性強度為良好的成形品之虞或使懸浮、安定化一事變得困難,而發生樹脂之塊狀物之虞。因而,第1單體之種晶比較佳為1.5以下,更佳為1.3以下,再更佳為1.2以下。 In addition, when the seed ratio with respect to the weight ratio of the first monomer of the core particles (that is, the styrene-based monomer) is too low, the composite resin particles may be flat. Therefore, the seed crystal of the first monomer is preferably 0.5 or more, more preferably 0.7 or more, and still more preferably 0.8 or more. On the other hand, if the seed ratio is too high, the styrene-based monomer may be polymerized before the core particles are sufficiently impregnated. As a result, there is a possibility that a molded product with good rigidity or viscous strength may not be obtained, or it may be difficult to suspend and stabilize, and agglomerates of resin may occur. Therefore, the seed crystal of the first monomer is preferably 1.5 or less, more preferably 1.3 or less, and even more preferably 1.2 or less.

於發泡步驟中,藉由使聚合後之複合樹脂粒子進行發泡,而可製造複合樹脂發泡粒子。 In the foaming step, the composite resin foamed particles can be produced by foaming the composite resin particles after polymerization.

以下,針對各步驟進一步詳細地說明。 Hereinafter, each step will be described in further detail.

於分散步驟中,例如,可使核粒子懸浮於包含懸浮劑、界面活性劑、水溶性聚合抑制劑等之水性介質中,而製作懸浮液。又,於分散步驟中係可將聚合起始劑與第1單體一起添加於懸浮液中。 In the dispersion step, for example, the core particles can be suspended in an aqueous medium containing a suspending agent, a surfactant, a water-soluble polymerization inhibitor, etc. to prepare a suspension. In addition, in the dispersion step, the polymerization initiator may be added to the suspension together with the first monomer.

核粒子係可含有氣泡調整劑、著色劑、滑材等之添加劑。核粒子係可藉由於乙烯系樹脂中摻合因應需要所添加之添加劑,在將摻合物熔融混練之後進行細粒化而製造。熔融混練係可藉由擠壓機進行。此時,為了進行均勻的混練,較佳係在將樹脂成分預先混合之後進行擠壓。樹脂成分之混合,例如,可使用亨舍爾混合機、螺旋 帶式混合機、V型混合機、Lodige攪拌機等之混合機來進行。熔融混練較佳係使用例如杜爾麥基式(Dulmage type)、馬多克式(Maddock type)、Unimelt型等之高分散型之螺槳或雙軸擠壓機來進行。 The core particle system may contain additives such as a bubble regulator, a coloring agent, and a sliding material. The core particles can be produced by blending the ethylene-based resin with additives that are added as needed, after the blend is melted and kneaded, and then refined. The melt-kneading system can be performed by an extruder. At this time, in order to perform uniform kneading, it is preferable to squeeze the resin components before mixing. Mixing of resin components, for example, Henschel mixer, screw It is carried out by mixers such as belt mixer, V-type mixer, Lodige mixer, etc. The melt-kneading is preferably carried out using a high-dispersion propeller such as Dulmage type, Maddock type, Unimelt type or a twin-shaft extruder.

核粒子之微細化係藉由將利用擠壓機等熔融混練後的摻合物進行切斷而進行。微細化係可藉由例如鋼絞線切割(strand cutting)、水下切割、熱切割而進行。 Refinement of the core particles is performed by cutting the blend after melt-kneading with an extruder or the like. The miniaturization can be performed by, for example, strand cutting, underwater cutting, and thermal cutting.

核粒子較佳係與懸浮劑一起分散於水性介質中。 The core particles are preferably dispersed in the aqueous medium together with the suspending agent.

作為懸浮劑,例如,可使用磷酸三鈣、氫氧磷灰石、焦磷酸鎂、磷酸鎂、氫氧化鋁、氫氧化鐵、氫氧化鈦、氫氧化鎂、磷酸鋇、碳酸鈣、碳酸鎂、碳酸鋇、硫酸鈣、硫酸鋇、滑石、高嶺土、膨土等之微粒子狀的無機懸浮劑。又,例如,亦可使用聚乙烯吡咯啶酮、聚乙烯醇、乙基纖維素、羥丙基甲基纖維素等之有機懸浮劑。較佳係磷酸三鈣、氫氧磷灰石、焦磷酸鎂。此等之懸浮劑係可單獨,或者將2種以上組合使用。 As the suspending agent, for example, tricalcium phosphate, hydroxide apatite, magnesium pyrophosphate, magnesium phosphate, aluminum hydroxide, iron hydroxide, titanium hydroxide, magnesium hydroxide, barium phosphate, calcium carbonate, magnesium carbonate, Particulate inorganic suspending agent for barium carbonate, calcium sulfate, barium sulfate, talc, kaolin, bentonite, etc. In addition, for example, organic suspending agents such as polyvinylpyrrolidone, polyvinyl alcohol, ethyl cellulose, and hydroxypropyl methyl cellulose can also be used. Preferred are tricalcium phosphate, hydroxyapatite, and magnesium pyrophosphate. These suspending agents can be used alone or in combination of two or more.

相對於懸浮聚合系之水性介質(具體而言係包含含反應生成物之漿體等的水之反應系內之所有的水)100質量份,懸浮劑之使用量較佳係以固體成分量計為0.05~10質量份。更佳係0.3~5質量份。在懸浮劑之量偏離上述範圍內而過少的情況,係有使苯乙烯系單體懸浮並安定化一事會成為困難,而發生樹脂之塊狀物之虞。另一方面,在懸浮劑之量偏離上述範圍內而過多的情況,不 僅會導致製造成本增大,亦恐有導致粒徑分布擴大之虞。 The amount of the suspending agent is preferably based on the amount of solid content relative to 100 parts by mass of the aqueous medium of the suspension polymerization system (specifically, all water in the reaction system containing water such as slurry containing the reaction product) 0.05 to 10 parts by mass. More preferably, it is 0.3~5 parts by mass. When the amount of the suspending agent deviates from the above range and is too small, it may become difficult to suspend and stabilize the styrene-based monomer, and agglomeration of the resin may occur. On the other hand, when the amount of suspending agent deviates from the above range and is too large, it is not It only leads to an increase in manufacturing costs, and there is a fear that the particle size distribution may be enlarged.

又,於懸浮液中係可添加界面活性劑。作為界面活性劑係可使用例如:陰離子系界面活性劑、非離子系界面活性劑、陽離子系界面活性劑、兩性界面活性劑等。 In addition, a surfactant can be added to the suspension. As the surfactant system, for example, an anionic surfactant, a nonionic surfactant, a cationic surfactant, an amphoteric surfactant, or the like can be used.

作為陰離子系界面活性劑係可使用例如:烷基磺酸鈉、烷基苯磺酸鈉、月桂基硫酸鈉、α-烯烴磺酸鈉、十二烷基二苯基醚二磺酸鈉等。 As the anionic surfactant system, for example, sodium alkylsulfonate, sodium alkylbenzenesulfonate, sodium lauryl sulfate, sodium α-olefin sulfonate, sodium dodecyl diphenyl ether disulfonate, and the like can be used.

作為非離子系界面活性劑係可使用例如:聚氧乙烯十二烷基醚、聚氧乙烯壬基苯基醚、聚氧乙烯月桂基醚等。 As the nonionic surfactant system, for example, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene lauryl ether and the like can be used.

作為陽離子系界面活性劑係可使用例如:椰油烷基胺乙酸鹽、硬脂基胺乙酸鹽等之烷基胺鹽。又,亦可使用月桂基三甲基銨氯化物、硬脂基三甲基銨氯化物等之四級銨等。 As the cationic surfactant system, for example, alkylamine salts such as coconut oil alkylamine acetate and stearylamine acetate can be used. In addition, quaternary ammonium such as lauryl trimethyl ammonium chloride and stearyl trimethyl ammonium chloride can also be used.

作為兩性界面劑係可使用月桂基甜菜鹼、硬脂基甜菜鹼等之烷基甜菜鹼。又,亦可使用月桂基二甲基胺氧化物等之烷基胺氧化物。 As the amphoteric interface agent, alkyl betaines such as lauryl betaine and stearyl betaine can be used. In addition, alkylamine oxides such as lauryl dimethylamine oxide can also be used.

此等之界面活性劑係可單獨或者複數組合使用。 These surfactants can be used alone or in combination.

較佳係使用陰離子系界面活性劑作為界面活性劑。更佳係碳數8~20之烷基磺酸鹼金屬鹽,再更佳係鈉鹽。藉此可使懸浮充分地安定化。 Preferably, an anionic surfactant is used as the surfactant. More preferably, it is an alkali metal salt of an alkylsulfonic acid having 8 to 20 carbon atoms, and even more preferably a sodium salt. This allows the suspension to be fully stabilized.

又,於懸浮液中亦可因應需要而添加例如氯化鋰、氯化鉀、氯化鈉、硫酸鈉、硝酸鈉、碳酸鈉、重碳酸鈉等之由無機鹽類所構成的電解質。 Furthermore, an electrolyte composed of inorganic salts such as lithium chloride, potassium chloride, sodium chloride, sodium sulfate, sodium nitrate, sodium carbonate, and sodium bicarbonate may be added to the suspension as needed.

又,為了得到韌性、機械性強度優異的發泡粒子成形體,較佳係於懸浮液中添加水溶性聚合抑制劑。 In addition, in order to obtain an expanded particle molded body excellent in toughness and mechanical strength, it is preferable to add a water-soluble polymerization inhibitor to the suspension.

作為水溶性聚合抑制劑係可使用例如:亞硝酸鈉、亞硝酸鉀、亞硝酸銨、L-抗壞血酸、檸檬酸等。 As the water-soluble polymerization inhibitor system, for example, sodium nitrite, potassium nitrite, ammonium nitrite, L-ascorbic acid, citric acid and the like can be used.

水溶性聚合抑制劑係難以含浸於核粒子內,而會溶解於水性介質中。因而,含浸於核粒子之苯乙烯系單體的聚合雖被進行,但可抑制未含浸於核粒子之水性介質中的苯乙烯系單體之微小液滴的聚合、及逐漸被吸收於核粒子之核粒子表面附近的苯乙烯系單體的聚合。其結果,可將複合樹脂粒子之表面的苯乙烯系樹脂之量抑制得較少,可推測所得到的發泡粒子成形體之韌性會提昇。 The water-soluble polymerization inhibitor system is difficult to impregnate into the core particles, but will dissolve in the aqueous medium. Therefore, although the polymerization of the styrene-based monomer impregnated with the core particles is carried out, the polymerization of the minute droplets of the styrene-based monomer that is not impregnated in the aqueous medium of the core particles can be suppressed and gradually absorbed by the core particles The polymerization of styrene monomer near the surface of the core particles. As a result, the amount of styrene resin on the surface of the composite resin particles can be suppressed to a small amount, and it is presumed that the toughness of the obtained expanded particle molded body is improved.

相對於水性介質(具體而言係包含含反應生成物之漿體等的水之反應系內之所有的水)100質量份,水溶性聚合抑制劑之添加量較佳為0.001~0.1質量份,更佳為0.005~0.06質量份。 The addition amount of the water-soluble polymerization inhibitor is preferably 0.001 to 0.1 parts by mass relative to 100 parts by mass of the aqueous medium (specifically, all water in the reaction system containing water such as slurry containing the reaction product). More preferably, it is 0.005 to 0.06 parts by mass.

又,為了在核粒子內使苯乙烯系單體均勻地聚合,而使苯乙烯系單體含浸於核粒子並進行聚合。於此情況中,有時會與苯乙烯系單體之聚合一起產生乙烯系樹脂之交聯。於苯乙烯系單體之聚合中雖使用聚合起始劑,但可因應需要而併用交聯劑。又,在使用聚合起始劑及/或交聯劑時,較佳係預先將聚合起始劑及/或交聯劑溶解於苯乙烯系單體。 In addition, in order to uniformly polymerize the styrene-based monomer in the core particles, the styrene-based monomer is impregnated with the core particles and polymerized. In this case, the vinyl resin may be cross-linked together with the polymerization of the styrene-based monomer. Although a polymerization initiator is used in the polymerization of styrene-based monomers, a crosslinking agent can be used in combination as needed. In addition, when a polymerization initiator and/or crosslinking agent is used, it is preferable to dissolve the polymerization initiator and/or crosslinking agent in the styrene-based monomer in advance.

作為聚合起始劑係可使用在苯乙烯系單體之懸浮聚合法中所使用者,例如,可溶於乙烯基單體且10 小時半衰期溫度為50~120℃之聚合起始劑。具體而言係可使用例如:枯烯氫過氧化物(cumene hydroperoxide)、二異丙苯過氧化物、t-丁基過氧-2-乙基己酸酯、t-丁基過氧苯甲酸酯、苯甲醯過氧化物、t-丁基過氧異丙基碳酸酯、t-戊基過氧-2-乙基己基碳酸酯、己基過氧-2-乙基己基碳酸酯、月桂醯基過氧化物等之有機過氧化物。又,作為聚合起始劑亦可使用偶氮二異丁腈等之偶氮化合物等。此等之聚合起始劑係可1種,或者將2種以上組合使用。又,就容易調整上述之複合樹脂的膨潤度、容易減低殘留單體的觀點而言,作為聚合起始劑較佳係t-丁基過氧-2-乙基己酸酯。 As the polymerization initiator, it can be used in the suspension polymerization method of styrene monomer, for example, it can be dissolved in vinyl monomer and 10 Polymerization initiator with hour half-life temperature of 50~120℃. Specifically, for example, cumene hydroperoxide, dicumyl peroxide, t-butylperoxy-2-ethylhexanoate, t-butylperoxybenzone Ester, benzoyl peroxide, t-butyl peroxyisopropyl carbonate, t-pentyl peroxy-2-ethylhexyl carbonate, hexyl peroxy-2-ethylhexyl carbonate, laurel Organic peroxides such as acetyl peroxides. In addition, as the polymerization initiator, an azo compound such as azobisisobutyronitrile can also be used. These polymerization initiators can be used alone or in combination of two or more. In addition, from the viewpoint of easily adjusting the swelling degree of the composite resin described above and easily reducing residual monomers, t-butylperoxy-2-ethylhexanoate is preferably used as a polymerization initiator.

聚合起始劑亦可溶解、添加於溶劑中而含浸於核粒子。 The polymerization initiator may also be dissolved, added to a solvent, and impregnated into the core particles.

作為溶解聚合起始劑的溶劑係可使用芳香族烴、脂肪族烴等。作為芳香族烴係有例如:乙基苯、甲苯等。作為脂肪族烴係有例如:庚烷、辛烷等。相對於苯乙烯系單體100質量份,聚合起始劑較佳係使用0.01~3質量份之範圍。 As the solvent system for dissolving the polymerization initiator, aromatic hydrocarbons, aliphatic hydrocarbons and the like can be used. Examples of aromatic hydrocarbons include ethylbenzene and toluene. Examples of the aliphatic hydrocarbon system include heptane and octane. The polymerization initiator is preferably used in the range of 0.01 to 3 parts by mass relative to 100 parts by mass of the styrene-based monomer.

又,作為交聯劑較佳係使用在聚合溫度下不分解,而在交聯溫度下分解之10小時半衰期溫度為比聚合溫度更高5~50℃者。具體而言係可使用例如:二異丙苯過氧化物、2,5-t-丁基過氧苯甲酸酯、1,1-雙-t-丁基過氧環己烷等之過氧化物。作為交聯劑係可此等當中單獨或者2種以上合併使用。相對於苯乙烯系單體100質量份,交 聯劑之摻合量較佳係0.1~5質量份。 In addition, as the crosslinking agent, it is preferable to use one that does not decompose at the polymerization temperature, but the 10-hour half-life temperature decomposed at the crosslinking temperature is 5 to 50°C higher than the polymerization temperature. Specifically, peroxides such as dicumyl peroxide, 2,5-t-butyl peroxybenzoate, 1,1-bis-t-butyl peroxycyclohexane, etc. can be used Thing. As the crosslinking agent system, these can be used alone or in combination of two or more. Based on 100 parts by mass of styrene monomer, the The blending amount of the coupling agent is preferably 0.1 to 5 parts by mass.

另外,作為聚合起始劑及交聯劑亦可採用相同化合物。 In addition, the same compound can also be used as a polymerization initiator and a crosslinking agent.

又,於苯乙烯系單體中係可添加氣泡調整劑。又,亦可於製作核粒子時,藉由將氣泡調整劑與乙烯系樹脂一起進行混練而於核粒子中添加氣泡調整劑。較佳係將複合樹脂中之氣泡調整劑的含量調整成對於複合樹脂100質量份而言為0.01~2質量份。 In addition, a bubble regulator can be added to the styrene monomer. In addition, when the core particles are produced, the bubble regulator may be added to the core particles by kneading the bubble regulator with the vinyl resin. Preferably, the content of the bubble adjuster in the composite resin is adjusted to 0.01 to 2 parts by mass for 100 parts by mass of the composite resin.

作為氣泡調整劑係可使用例如:脂肪酸一醯胺、脂肪酸雙醯胺、滑石、二氧化矽、聚乙烯蠟、亞甲基雙硬脂酸、甲基丙烯酸甲酯系共聚物、矽酮、滑石、硼酸鋅、硫酸鋁、明礬、聚四氟乙烯等。作為脂肪酸一醯胺係可使用例如:油酸醯胺、硬脂酸醯胺、月桂酸醯胺、芥酸醯胺、萮樹酸醯胺等。作為脂肪酸雙醯胺係可使用例如:乙烯雙硬脂酸醯胺等。 As the bubble adjuster system, for example, fatty acid monoamide, fatty acid bisamide, talc, silica, polyethylene wax, methylene bisstearic acid, methyl methacrylate copolymer, silicone, talc can be used , Zinc borate, aluminum sulfate, alum, polytetrafluoroethylene, etc. As the fatty acid monoamide system, for example, amide oleate, amide stearate, amide laurate, amide erucate, and amide benzoate can be used. As the fatty acid bisamide system, for example, ethylenebisstearic acid amide can be used.

又,於苯乙烯系單體中係可因應需要而添加可塑劑、油溶性聚合抑制劑、難燃劑、染料等。 In addition, plasticizers, oil-soluble polymerization inhibitors, flame retardants, dyes and the like can be added to the styrene-based monomers as needed.

作為可塑劑係可使用例如:脂肪酸酯、乙醯化單甘油酯、油脂類、烴化合物等。作為脂肪酸酯係可使用例如:甘油三硬脂酸酯、甘油三辛酸酯、甘油三月桂酸酯、山梨醇酐三硬脂酸酯、山梨醇酐單硬脂酸酯、丁基硬脂酸酯等。又,作為乙醯化單甘油酯係可使用例如:甘油二乙醯單月桂酸酯等。作為油脂類係可使用例如:硬化牛脂、硬化蓖麻油等。作為烴化合物係可使用例如:環己烷、流動 石蠟等。 As the plasticizer system, for example, fatty acid esters, acetylated monoglycerides, oils, and hydrocarbon compounds can be used. As the fatty acid ester system, for example, glycerin tristearate, glycerin tricaprylate, glycerin trilaurate, sorbitan tristearate, sorbitan monostearate, butyl stearate can be used Ester and so on. In addition, as the acetylated monoglyceride system, for example, glycerol diethyl monolaurate and the like can be used. Examples of oils and fats that can be used include hardened tallow and hardened castor oil. As the hydrocarbon compound system, for example, cyclohexane, flow Paraffin, etc.

又,作為油溶性聚合抑制劑係可使用例如:對-t-丁基鄰苯二酚、對苯二酚、苯醌等。 In addition, as the oil-soluble polymerization inhibitor system, for example, p-t-butylcatechol, hydroquinone, benzoquinone and the like can be used.

接著,於上述改質步驟中,開始分散步驟後之懸浮液的加熱。且,較佳係當將核粒子之乙烯系樹脂的熔點設為Tm時,以(Tm-10)~(Tm+30)℃之溫度,將第2單體(亦即,苯乙烯系單體)花費特定的添加時間連續地添加於懸浮液中。藉此,可使苯乙烯系單體含浸於核粒子,並進行聚合。在添加第2單體的溫度偏離(Tm-10)~(Tm+30)℃之溫度的情況,恐有懸浮系會不安定化,而發生樹脂之塊狀物之虞。添加第2單體之溫度更佳係(Tm-5)~(Tm+10)℃。 Next, in the above modification step, the heating of the suspension after the dispersion step is started. Furthermore, when the melting point of the vinyl resin of the core particles is set to Tm, the second monomer (that is, the styrene monomer) is preferably used at a temperature of (Tm-10) to (Tm+30)°C ) It takes a specific addition time to continuously add to the suspension. By this, the styrene-based monomer can be impregnated into the core particles and polymerized. When the temperature at which the second monomer is added deviates from (Tm-10) to (Tm+30)°C, there is a fear that the suspension system will become unstable and block the resin. The temperature at which the second monomer is added is more preferably (Tm-5)~(Tm+10)°C.

又,改質步驟中之聚合溫度雖依據所使用之聚合起始劑的種類而異,但較佳為60~105℃。又,交聯溫度雖依據所使用之交聯劑的種類而異,但較佳為100~150℃。 In addition, although the polymerization temperature in the modification step varies depending on the type of polymerization initiator used, it is preferably 60 to 105°C. Moreover, although the crosslinking temperature varies depending on the type of crosslinking agent used, it is preferably 100 to 150°C.

膨潤度成為上述特定之範圍的發泡粒子成形體係如下述般,藉由採用(1)~(3)所示之製造條件而得到。 The expanded particle forming system whose swelling degree falls within the above-specified range is obtained by using the production conditions shown in (1) to (3) as follows.

(1)將含浸於包含乙烯系樹脂的核粒子之苯乙烯系單體分成複數次進行含浸,其中,將最初含浸的苯乙烯系單體(亦即,第1單體)之添加比例設得較多,將聚合起始劑相對於第1單體的比例設得較少來將第1單體進行聚合的製造條件。 (1) Divide the styrene monomer impregnated into the core particles containing the vinyl resin into plural times for impregnation, in which the addition ratio of the styrene monomer initially impregnated (ie, the first monomer) is set as In many cases, the production conditions for polymerizing the first monomer by setting the ratio of the polymerization initiator to the first monomer to be small.

(2)作為聚合起始劑係使用t-丁基過氧-2-乙基己基單碳酸酯或t-己基過氧苯甲酸酯等之抽氫反應能比二異丙苯過氧化物更低之起始劑的製造條件。 (2) Using t-butylperoxy-2-ethylhexyl monocarbonate or t-hexylperoxybenzoate as the polymerization initiator is more efficient than dicumyl peroxide Low manufacturing conditions for the starter.

(3)藉由使聚合起始劑僅溶解於第1單體來進行聚合,而控制在含浸聚合中之初期階段下的苯乙烯系單體之聚合狀態的製造條件。 (3) Manufacturing conditions in which the polymerization state of the styrene-based monomer in the initial stage of impregnation polymerization is controlled by dissolving the polymerization initiator only in the first monomer to perform polymerization.

藉由此等製造條件,乙烯系樹脂內之交聯密度不易提高,成為可製造膨潤度為上述特定之範圍內的發泡粒子成形體。於以往所探討之製造條件中,由於含浸於包含乙烯系樹脂之核粒子的苯乙烯系單體(具體而言為第1單體)之比率小,且使用抽氫反應能高的二異丙苯過氧化物作為聚合起始劑,將聚合起始劑按比例添加於第1單體與第2單體,因此可推測乙烯系樹脂內之交聯密度會過高,而膨潤度降低。 Under these production conditions, the cross-linking density in the ethylene-based resin is not easily improved, and it becomes possible to produce an expanded particle molded body having a swelling degree within the above-specified range. In the manufacturing conditions discussed in the past, the ratio of styrene-based monomers (specifically, the first monomer) impregnated with the core particles containing vinyl resin is small, and the use of diisopropyl with high hydrogen extraction reaction energy Benzene peroxide is used as a polymerization initiator, and the polymerization initiator is added in proportion to the first monomer and the second monomer. Therefore, it is presumed that the crosslink density in the vinyl resin is too high, and the degree of swelling decreases.

於複合樹脂粒子之發泡中,可採用使揮發性發泡劑預先含浸於複合樹脂粒子中後以蒸汽或溫水或溫風進行加熱的預備發泡方法,或在壓力容器內與揮發性發泡劑一起加熱後,進行低壓化釋放來發泡的直接發泡方法。作為所使用的發泡劑亦可使用丁烷、戊烷、丙烷等之有機系發泡劑,亦可使用二氧化碳、空氣、氮等之無機系發泡劑。較佳為無機系發泡劑。有機系發泡劑係在複合樹脂粒子之發泡後亦會留在發泡粒子中,由於成形時將氣泡內的內壓提高,因此有冷卻時間增長的傾向。相對於此,由於若使用無機系發泡劑則發泡粒子內不會殘留氣體,因此成 形時不會發生粒子內壓之上昇,而成為能夠以短時間完成成形體之冷卻,並從成形模取出。 In the foaming of composite resin particles, a preliminary foaming method in which a volatile foaming agent is pre-impregnated in the composite resin particles and then heated with steam or warm water or warm air, or in a pressure vessel can be used After the foaming agent is heated together, a direct foaming method of releasing at low pressure to foam is performed. As the foaming agent used, organic foaming agents such as butane, pentane, and propane may be used, and inorganic foaming agents such as carbon dioxide, air, and nitrogen may also be used. It is preferably an inorganic foaming agent. The organic foaming agent system remains in the foamed particles after the foaming of the composite resin particles. Since the internal pressure in the bubbles is increased during molding, the cooling time tends to increase. In contrast, if an inorganic foaming agent is used, no gas remains in the foamed particles. During the shaping, the internal pressure of the particles does not rise, and the cooling of the molded body can be completed in a short time and taken out from the molding die.

發泡粒子成形體係可藉由以周知之蒸汽加熱所致之模內成形方法而製造。亦即,藉由將多數之複合樹脂發泡粒子填充於模具等之成形模內,於該成形模內導入蒸汽使複合樹脂發泡粒子彼此熔接,而可得到發泡粒子成形體。 The expanded particle forming system can be manufactured by a well-known in-mold forming method by steam heating. That is, by filling a plurality of composite resin expanded particles in a molding die such as a mold, and introducing steam into the molding die to fuse the composite resin expanded particles to each other, an expanded particle molded body can be obtained.

發泡粒子成形體之彎曲彈性率較佳為18MPa以上,更佳為19MPa以上,再更佳為20MPa以上。就發泡粒子成形體之彎曲剛性的觀點而言,其彎曲彈性率之上限雖無特別限定,但其上限為約30MPa左右。 The bending elastic modulus of the expanded particle molded body is preferably 18 MPa or more, more preferably 19 MPa or more, and still more preferably 20 MPa or more. From the viewpoint of the bending rigidity of the expanded particle molded body, the upper limit of the bending elastic modulus is not particularly limited, but the upper limit is about 30 MPa.

發泡粒子成形體之彎曲破斷能量較佳為150kJ/cm2以上,更佳為200kJ/cm2以上,再更佳為250kJ/cm2以上。就發泡粒子成形體之韌性的觀點而言,其彎曲破斷能量之上限雖無特別限定,最好為無破斷,但其上限為約400kJ/cm2左右。 The PP bead molding is preferably curved rupture energy 150kJ / cm 2 or more, more preferably 200kJ / cm 2 or more, still more preferably 250kJ / cm 2 or more. From the viewpoint of the toughness of the expanded particle molded body, although the upper limit of bending breaking energy is not particularly limited, it is preferably not broken, but the upper limit is about 400 kJ/cm 2 .

上述彎曲彈性率係根據JIS K7221-1999年所測定之值。上述彎曲破斷能量係依據藉由至前述彎曲試驗時所得到的破斷點為止之撓曲量-荷重曲線與表示撓曲量之橫軸包圍的面積所算出之值。 The above-mentioned bending elastic modulus is a value measured according to JIS K7221-1999. The above-mentioned bending breaking energy is calculated based on the value of the deflection-load curve up to the breaking point obtained in the bending test and the area surrounded by the horizontal axis representing the deflection.

發泡粒子成形體之50%壓縮應力較佳為400kPa以上,更佳為450kPa以上,再更佳為500kPa以上。就發泡粒子成形體之壓縮剛性的觀點而言,其50%壓縮應力之上限雖無特別限定,但其上限為約700kPa左 右。 The 50% compressive stress of the expanded particle molded body is preferably 400 kPa or more, more preferably 450 kPa or more, and even more preferably 500 kPa or more. From the viewpoint of the compressive rigidity of the expanded particle molded body, although the upper limit of the 50% compressive stress is not particularly limited, the upper limit is about 700 kPa right.

上述50%壓縮應力係意味著根據JIS K 6767-1999年所測定之50%應變時的壓縮荷重。 The above 50% compression stress means the compressive load at 50% strain measured in accordance with JIS K 6767-1999.

上述發泡粒子成形體係適於面板梱包容器。面板梱包容器係由發泡粒子成形體所構成,且具有以將複數個面板以在板厚方向上層積的狀態進行收容的方式構成之收容部。作為面板係除了玻璃板等以外,尤其是電視或監視器等之液晶面板、太陽光發電面板等,上述發泡粒子成形體係適合作為此等之面板的梱包容器。液晶面板係伴隨著近年來之製品尺寸的擴大而重量亦增大。太陽光發電面板亦重量為大。藉由採用由上述發泡粒子成形體所構成的面板梱包容器作為如此之重量大的面板之梱包用,而壓縮剛性及撓曲耐性優異,可充分發揮可防止因變形導致之破壞的上述效果。 The above-mentioned expanded particle forming system is suitable for a panel-wrapped container. The panel packing container is composed of a foamed particle molded body, and has an accommodating portion configured to accommodate a plurality of panels in a state of being stacked in the plate thickness direction. As the panel system, in addition to glass plates, etc., especially liquid crystal panels for televisions, monitors, etc., photovoltaic power generation panels, etc., the above-mentioned expanded particle molding system is suitable as a wrapping container for such panels. The liquid crystal panel has increased in weight with the increase in product size in recent years. The photovoltaic power generation panel is also heavy. By using a panel packing container composed of the above-mentioned expanded particle molded body as a packing for such a heavy panel, it is excellent in compression rigidity and bending resistance, and can fully exert the above-mentioned effect that can prevent damage due to deformation.

作為如此之梱包容器,具體而言係具有將複數個面板以朝向水平方向在板厚方向上層積的狀態進行收容之收容部的面板梱包容器,該面板梱包容器係由將複合樹脂發泡粒子進行模內成形而成之表觀密度為40~100kg/m3的發泡粒子成形體所構成,構成該發泡粒子成形體之複合樹脂係將對於乙烯系樹脂100質量份而言為400~900質量份之苯乙烯系單體進行含浸聚合而成,將上述複合樹脂藉由二甲苯進行索氏萃取時之二甲苯 不溶物質與上述索氏萃取後之二甲苯溶液中所含之丙酮不溶物質的混合不溶物質之於溫度23℃之甲基乙基酮中的膨潤度為1.25以上。 As such a wrap-around container, specifically, a panel wrap-around container having an accommodating portion for storing a plurality of panels stacked in a horizontal direction in the thickness direction, the panel wrap-around container is formed by foaming composite resin particles The expanded particle molded body having an apparent density of 40 to 100 kg/m 3 formed in the mold, and the composite resin constituting the expanded particle molded body will be 400 to 900 for 100 parts by mass of the vinyl resin Mass parts of styrene-based monomers are impregnated and polymerized. The xylene-insoluble matter in the Soxhlet extraction of the above composite resin with xylene and the acetone-insoluble matter contained in the xylene solution after the Soxhlet extraction The swelling degree of the mixed insoluble substance in methyl ethyl ketone at a temperature of 23°C is 1.25 or more.

面板梱包容器係具有:具有上述收容部之容器主體,與將該容器主體的開口部堵塞之蓋體,上述容器主體及上述蓋體較佳係由上述發泡粒子成形體所構成。於此情況中,由於成為可將收容部之內部密閉,因此可防止異物之混入等。又,不僅於容器主體部側,即便於蓋體側亦可形成上述收容部。 The panel packing container includes a container body having the accommodating portion, and a lid body that closes the opening of the container body. The container body and the lid body are preferably formed of the expanded particle molded body. In this case, since it becomes possible to seal the inside of the accommodating portion, it is possible to prevent the mixing of foreign matter and the like. In addition, not only on the side of the container body, but also on the side of the lid, the above-mentioned housing portion can be formed.

於面板梱包容器中,較佳係於發泡粒子成形體之至少表面存在抗靜電劑,上述發泡粒子成形體之表面電阻率為1×108~1×1013Ω。於此情況中,面板梱包容器係顯示充分的抗靜電性能,而更適於液晶面板或太陽光發電面板等。另外,發泡粒子成形體之表面電阻率係根據JIS C2170-2004年,在23℃、相對濕度50%之環境下所測定之值。 In the panel packing container, it is preferable that an antistatic agent is present on at least the surface of the expanded particle molded body, and the surface resistivity of the expanded particle molded body is 1×10 8 to 1×10 13 Ω. In this case, the panel packing container exhibits sufficient antistatic performance, and is more suitable for liquid crystal panels or photovoltaic power generation panels. In addition, the surface resistivity of the expanded particle molded body is a value measured under an environment of 23° C. and a relative humidity of 50% in accordance with JIS C2170-2004.

抗靜電劑係可藉由以下之任一種方法或此等之組合而包含於發泡粒子成形體中。具體而言係有將抗靜電劑於核粒子之造粒時混入乙烯系樹脂中的方法、將抗靜電劑於聚合時進行添加的方法、將抗靜電劑於複合樹脂粒子之發泡時進行添加,而含浸於發泡粒子中的方法、將抗靜電劑塗佈於發泡粒子的方法、將抗靜電劑塗佈於發泡粒子成形體的方法等。 The antistatic agent can be contained in the expanded particle molded body by any one of the following methods or a combination of these. Specifically, there are a method of mixing the antistatic agent into the vinyl resin during granulation of the core particles, a method of adding the antistatic agent during polymerization, and a method of adding the antistatic agent when foaming the composite resin particles The method of impregnating the expanded particles, the method of applying the antistatic agent to the expanded particles, the method of applying the antistatic agent to the expanded particle molded body, etc.

作為抗靜電劑係可使用由陽離子系界面活性劑、陰離 子系界面活性劑、兩性界面活性劑、及非離子系界面活性劑中選出的至少1種。較佳係併用陽離子系界面活性劑與陰離子系界面活性劑作為抗靜電劑。 As an antistatic agent system, a cationic surfactant, anionic At least one selected from the group of surfactants, amphoteric surfactants, and nonionic surfactants. Preferably, a cationic surfactant and an anionic surfactant are used in combination as an antistatic agent.

[實施例] [Example] (實施例1) (Example 1)

以下,針對發泡粒子成形體之實施例進行說明。於本例中,如以下方式,由核粒子製造複合樹脂發泡粒子,並使用複合樹脂發泡粒子來製造發泡粒子成形體。 Hereinafter, examples of the expanded particle molded body will be described. In this example, the composite resin expanded particles are produced from the core particles as follows, and the expanded resin molded particles are produced using the composite resin expanded particles.

(1)核粒子之製作 (1) Production of nuclear particles

作為乙烯系樹脂係準備有使用茂金屬聚合觸媒進行聚合而成之直鏈狀低密度聚乙烯(具體而言係TOSOH公司製「Nipolon Z HF210K」)。以下將本例之乙烯系樹脂適宜稱為「PE-1」。將PE-1之溫度190℃、荷重2.16kg之條件下的MFR(單位:g/10min)、密度(單位:kg/m3)、拉伸彈性率(單位:MPa)、熔點(單位:℃)顯示於後述之表1。於PE-1之溫度190℃、荷重2.16kg之條件下的MFR係根據JIS K7210-1999年,以條件代碼D所測定之值。另外,作為測定裝置係使用MELT INDEXER(具體而言係寶工業(股)製之型式L203等)。又,PE-1之拉伸彈性率係根據JIS K6922-2-2010年所測定之值。PE-1之熔點係使用PE-1之原料錠約5mg,根據JIS K7121-1987年,藉由熱通量示差掃描熱量 測定(亦即,DSC)進行測定。另外,於JIS K7121-1987年之規定中,作為試驗片之狀態調節係採用『(2)在進行一定之熱處理之後,測定熔解溫度的情況』,將加熱速度及冷卻速度皆設為10℃/分所測定之熔解峰值溫度為熔點。 As the ethylene-based resin system, there is prepared a linear low-density polyethylene polymerized using a metallocene polymerization catalyst (specifically, "Nipolon Z HF210K" manufactured by TOSOH Corporation). Hereinafter, the vinyl resin of this example is appropriately referred to as "PE-1". Under the conditions of PE-1 at a temperature of 190°C and a load of 2.16 kg, MFR (unit: g/10min), density (unit: kg/m 3 ), tensile modulus of elasticity (unit: MPa), melting point (unit: ℃) ) Is shown in Table 1 described later. The MFR under the condition of PE-1 at a temperature of 190°C and a load of 2.16 kg is a value measured under condition code D according to JIS K7210-1999. In addition, MELT INDEXER (specifically, Model L203 manufactured by Takara Industrial Co., Ltd., etc.) is used as the measuring device. In addition, the tensile elastic modulus of PE-1 is the value measured based on JIS K6922-2-2010. The melting point of PE-1 is about 5 mg of the raw material ingot of PE-1, which is measured by heat flux differential scanning calorimetry (ie, DSC) according to JIS K7121-1987. In addition, in the regulation of JIS K7121-1987, as the condition adjustment of the test piece, "(2) After a certain heat treatment, the melting temperature is measured", the heating rate and the cooling rate are both set to 10°C/ The melting peak temperature measured by the minute is the melting point.

又,作為氣泡調整劑母料係準備(具體而言係POLYCOL(股)製「CE-7335」)。另外,POLYCOL(股)製「CE-7335」係由硼酸鋅所構成之氣泡調整劑的含量為10質量%、直鏈狀低密度聚乙烯(具體而言係TOSOH公司製「Nipolon Z HF210K」)的含量為90質量%。 In addition, it is prepared as a masterbatch system for the bubble adjuster (specifically, "CE-7335" manufactured by POLYCOL Co., Ltd.). In addition, the "CE-7335" made by POLYCOL Co., Ltd. is a linear low-density polyethylene containing 10% by mass of a bubble adjuster composed of zinc borate (specifically, "Nipolon Z HF210K" made by TOSOH) The content is 90% by mass.

將乙烯系樹脂(具體而言為PE-1)8.65kg,與氣泡調整劑母料1.35kg投入亨舍爾混合機中,進行混合5分鐘,而得到樹脂混合物。接著,使用50mm φ之單軸擠壓機,將樹脂混合物以擠壓機最高設定溫度250℃進行熔融混練,藉由水中切割方式切斷成平均0.5mg/個,藉此而得到核粒子(亦即,乙烯系樹脂核粒子)。 8.65 kg of a vinyl resin (specifically, PE-1) and 1.35 kg of a masterbatch of a bubble adjuster were put into a Henschel mixer and mixed for 5 minutes to obtain a resin mixture. Next, using a 50 mm φ uniaxial extruder, the resin mixture was melted and kneaded at the maximum set temperature of the extruder at 250° C., and was cut into an average of 0.5 mg/piece by water cutting, thereby obtaining core particles (also That is, vinyl resin core particles).

(2)複合樹脂粒子之製作 (2) Fabrication of composite resin particles

於附有攪拌裝置之內容積3L之高壓釜中裝入脫離子水1000g,進一步添加焦磷酸鈉6.0g。其後,添加粉末狀之硝酸鎂‧6水合物12.9g,在室溫下攪拌30分鐘。藉此,製作出作為懸浮劑之焦磷酸鎂漿體。接著,於此懸浮劑中投入作為界面活性劑之濃度10質量%之月桂基磺酸 鈉水溶液2.0g、作為水溶性聚合抑制劑之亞硝酸鈉0.2g、及核粒子75g。此為分散步驟。 Into an autoclave with an internal volume of 3 L equipped with a stirring device was charged with 1000 g of deionized water, and 6.0 g of sodium pyrophosphate was further added. Thereafter, 12.9 g of powdered magnesium nitrate‧6 hydrate was added, and the mixture was stirred at room temperature for 30 minutes. In this way, a magnesium pyrophosphate slurry as a suspending agent was produced. Next, lauryl sulfonic acid with a concentration of 10% by mass as a surfactant was put into this suspending agent 2.0 g of an aqueous sodium solution, 0.2 g of sodium nitrite as a water-soluble polymerization inhibitor, and 75 g of core particles. This is a dispersing step.

接著,使作為聚合起始劑A之t-丁基過氧-2-乙基己基單碳酸酯1.72g(具體而言係日油公司製「PERBUTYL E」)、作為聚合起始劑B之t-丁基過氧苯甲酸酯0.86g(具體而言係日油公司製「PERHEXYL Z」)、以及作為鏈轉移劑之α甲基苯乙烯二聚物(具體而言係日油公司製「Nofmer MSD」)0.63g溶解於第1單體(具體而言係苯乙烯系單體)中。然後,將溶解物一邊以攪拌速度500rpm進行攪拌一邊投入高壓釜內之懸浮劑中。另外,作為第1單體係使用苯乙烯70g與丙烯酸丁酯15g之混合單體。 Next, 1.72 g of t-butylperoxy-2-ethylhexyl monocarbonate as a polymerization initiator A (specifically, "PERBUTYL E" manufactured by NOF Corporation) and t as a polymerization initiator B -0.86 g of butyl peroxybenzoate (specifically, "PERHEXYL Z" manufactured by NOF Corporation), and α-methylstyrene dimer as a chain transfer agent (specifically, "made by NOF Corporation" Nofmer MSD") 0.63 g was dissolved in the first monomer (specifically, styrenic monomer). Then, the dissolved substance was poured into the suspending agent in the autoclave while stirring at a stirring speed of 500 rpm. In addition, as the first monomer system, a mixed monomer of 70 g of styrene and 15 g of butyl acrylate was used.

接著,在將高壓釜內的空氣以氮作置換之後,開始昇溫,花費1小時30分鐘昇溫至溫度100℃。昇溫後,在此溫度100℃保持1小時。其後,使攪拌速度下降至450rpm,在溫度100℃保持7.5小時。此為改質步驟。另外,在到達溫度100℃後經過1小時的時候,將作為第2單體(具體而言係苯乙烯系單體)之苯乙烯350g花費5小時添加於高壓釜內。 Next, after replacing the air in the autoclave with nitrogen, the temperature was started, and the temperature was raised to a temperature of 100°C in 1 hour and 30 minutes. After raising the temperature, the temperature was kept at 100°C for 1 hour. Thereafter, the stirring speed was decreased to 450 rpm, and the temperature was maintained at 100°C for 7.5 hours. This is a modification step. In addition, when one hour passed after reaching the temperature of 100° C., 350 g of styrene as the second monomer (specifically, a styrene-based monomer) was added to the autoclave over 5 hours.

接著,花費2小時昇溫至溫度125℃,直接在此溫度125℃下保持5小時。其後,使高壓釜內冷卻,並取出內容物(具體而言係複合樹脂粒子)。添加硝酸,使附著於複合樹脂粒子之表面的焦磷酸鎂溶解。其後,藉由離心分離機進行脫水及洗淨,以氣流乾燥裝置去除附著於 表面的水分,藉此而得到由苯乙烯系單體與乙烯系樹脂之質量比所求出的苯乙烯系樹脂與乙烯系樹脂之質量比為85:15的複合樹脂粒子。 Next, it took 2 hours to raise the temperature to 125°C, and directly held at this temperature for 125 hours. Thereafter, the inside of the autoclave was cooled, and the contents (specifically, composite resin particles) were taken out. Nitric acid is added to dissolve the magnesium pyrophosphate attached to the surface of the composite resin particles. After that, dehydration and washing are carried out by a centrifugal separator, and the adhesion to the air dryer is removed. Moisture on the surface thereby obtained composite resin particles having a mass ratio of styrene-based resin to vinyl-based resin of 85:15 determined from the mass ratio of styrene-based monomer to vinyl-based resin.

(3)複合樹脂發泡粒子之製作 (3) Production of composite resin expanded particles

接著,將複合樹脂粒子500g與分散介質(具體而言為水)一起裝入具備有攪拌機之5L的壓力容器內,於分散介質中進一步添加作為分散劑之高嶺土5g、以及作為界面活性劑之烷基苯磺酸鈉0.5g。接著,一邊以旋轉速度300rpm在壓力容器內進行攪拌一邊昇溫至發泡溫度165℃。然後,以使壓力容器內的表壓成為3.2MPa的方式,於壓力容器內壓入作為無機系發泡劑之二氧化碳,在同溫度(亦即,165℃)保持15分鐘,藉此而使二氧化碳含浸於複合樹脂粒子中,得到發泡性複合樹脂粒子。接著,藉由將發泡性複合樹脂粒子與分散介質一起從壓力容器中暴露於大氣壓下,而得到容積密度為48kg/m3之複合樹脂發泡粒子(亦即,一次發泡粒子)。 Next, 500 g of composite resin particles were put into a 5 L pressure vessel equipped with a stirrer together with a dispersion medium (specifically, water), and 5 g of kaolin as a dispersant and alkane as a surfactant were further added to the dispersion medium Sodium benzene sulfonate 0.5g. Next, while stirring in a pressure vessel at a rotation speed of 300 rpm, the temperature was raised to a foaming temperature of 165°C. Then, carbon dioxide, which is an inorganic blowing agent, is pressed into the pressure vessel so that the gauge pressure in the pressure vessel becomes 3.2 MPa, and the carbon dioxide is kept at the same temperature (that is, 165°C) for 15 minutes. Impregnated with composite resin particles to obtain expandable composite resin particles. Next, by exposing the expandable composite resin particles together with the dispersion medium to the atmospheric pressure from the pressure vessel, composite resin expanded particles having a bulk density of 48 kg/m 3 (that is, primary expanded particles) were obtained.

接著,將以上述方式得到的複合樹脂發泡粒子100質量份、抗靜電劑(具體而言係第一工業製藥(股)製之陽離子系界面活性劑「CATIOGEN ES-O」)2質量份、以及非離子系抗靜電劑(具體而言係甘油單硬脂酸酯)1質量份裝入聚乙烯袋中,充分振動混合之後,將複合樹脂發泡粒子在溫度40℃之烘箱內進行乾燥12小時。 Next, 100 parts by mass of the composite resin expanded particles obtained as described above and 2 parts by mass of an antistatic agent (specifically, the cationic surfactant "CATIOGEN ES-O" manufactured by First Industrial Pharmaceutical Co., Ltd.), And 1 part by mass of non-ionic antistatic agent (specifically, glycerol monostearate) is packed in a polyethylene bag, and after sufficient vibration mixing, the composite resin expanded particles are dried in an oven at a temperature of 40°C. 12 hour.

(5)泡粒子成形體之製造 (5) Manufacture of shaped foam particles

將以上述方式得到的複合樹脂發泡粒子填充於具有縱250mm、橫200mm、厚度50mm之平板形狀的模穴之模具內。接著,藉由於模具內導入水蒸氣,而將複合樹脂發泡粒子進行加熱來使其相互熔接。其後,將模具內藉由水冷進行冷卻之後,從模具取出發泡粒子成形體。進而,藉由將發泡粒子成形體載置於調整成溫度60℃的烘箱內12小時,而進行乾燥及硬化處理(curing)。以上述方式來製造發泡粒子成形體。 The composite resin expanded particles obtained in the above manner were filled in a mold having a cavity having a flat plate shape having a length of 250 mm, a width of 200 mm, and a thickness of 50 mm. Next, by introducing water vapor into the mold, the composite resin expanded particles are heated to be welded to each other. Thereafter, after cooling the inside of the mold by water cooling, the expanded particle molded body is taken out from the mold. Furthermore, by placing the expanded particle molded body in an oven adjusted to a temperature of 60° C. for 12 hours, drying and curing treatment was performed. The expanded particle shaped body is manufactured in the above manner.

針對所得到的發泡粒子成形體,將由摻合組成算出的複合樹脂中之苯乙烯系樹脂與乙烯系樹脂的質量比(亦即,苯乙烯系樹脂/乙烯系樹脂)、複合樹脂中之丙烯酸丁酯的含量(單位:質量%)顯示於後述之表2。又,作為成形條件而將成形時之成形壓(單位:MPa)、水冷時間(單位:秒)顯示於後述之表2。進而,針對發泡粒子成形體,以下述方式來測定出膨潤度、二甲苯不溶物質之比例(單位:%)、苯乙烯系樹脂之重量平均分子量Mw、表觀密度(單位:kg/m2)、彎曲彈性率(單位:MPa)、彎曲彈性能量(單位:kJ/cm2)、壓縮強度(單位:kPa)、表面電阻率(單位:Ω)。將其結果顯示於後述之表2。 For the obtained expanded particle molded body, the mass ratio of the styrene resin and the vinyl resin in the composite resin calculated from the blending composition (that is, styrene resin/vinyl resin), and the acrylic acid in the composite resin The content of butyl ester (unit: mass%) is shown in Table 2 described later. The molding pressure (unit: MPa) and water cooling time (unit: second) during molding are shown in Table 2 described later as molding conditions. Furthermore, for the expanded particle molded body, the swelling degree, the ratio of xylene-insoluble matter (unit: %), the weight average molecular weight Mw of the styrene-based resin, and the apparent density (unit: kg/m 2) were measured as follows. ), bending elastic modulus (unit: MPa), bending elastic energy (unit: kJ/cm 2 ), compressive strength (unit: kPa), surface resistivity (unit: Ω). The results are shown in Table 2 described later.

「膨潤度」 "Swelling"

首先,從發泡粒子成形體切出約1g之試驗片,計量其重量W0至小述第4位。接著,將試驗片裝入150網目之鐵絲網袋中。接著,於容量200ml之圓型燒瓶中裝入約200ml之二甲苯,將裝入上述鐵絲網袋的樣品設置於索氏萃取管。以加熱套(mantle heater)將燒瓶進行加熱8小時,藉此而進行索氏萃取。萃取結束後,藉由氣冷進行冷卻。冷卻後,從萃取管取出鐵絲網,藉由約600ml之丙酮將每個鐵絲網樣品加以洗淨。接著,使丙酮揮發後以溫度120℃進行乾燥。於此乾燥後,從鐵絲網內所回收的樣品為「二甲苯不溶物質」。 First, a test piece of about 1 g was cut out of the expanded particle molded body, and its weight W 0 was measured to the fourth place in the summary. Next, the test piece was placed in a 150-mesh wire mesh bag. Next, about 200 ml of xylene was placed in a round flask with a capacity of 200 ml, and the sample placed in the wire mesh bag was set in a Soxhlet extraction tube. The flask was heated with a mantle heater for 8 hours, thereby performing Soxhlet extraction. After the extraction is completed, it is cooled by air cooling. After cooling, remove the wire mesh from the extraction tube and wash each wire mesh sample with about 600 ml of acetone. Next, after volatilizing acetone, it was dried at a temperature of 120°C. After drying here, the sample recovered from the barbed wire is "xylene insoluble material".

又,將上述索氏萃取後之二甲苯溶液投入600ml之丙酮中。接著,將不溶解於丙酮的成分使用JIS P3801所規定之5種A濾紙進行過濾並予以分離回收,使回收物在減壓下進行蒸發乾涸。所得到的固形物為「丙酮不溶物質」。 Furthermore, the xylene solution after the Soxhlet extraction was put into 600 ml of acetone. Next, the components insoluble in acetone were filtered using five types of A filter papers prescribed in JIS P3801, separated and recovered, and the recovered material was evaporated to dryness under reduced pressure. The obtained solid substance is "acetone-insoluble substance".

計量藉由此等之操作得到之「二甲苯不溶物質」與「丙酮不溶物質」的混合不溶物質之重量Wa至小數點第4位。另外,於其他實施例中,在混合不溶物質之重量未滿0.2g的情況,為了得到充分量的混合不溶物質,重複進行上述操作而得到0.2g以上之混合不溶物質。於其他的實施例中亦相同。 Mixing the insoluble matter obtained in the measurement by the sum of these "xylene-insoluble matter" and "acetone-insoluble" W a weight to 4 decimal places. In addition, in other examples, when the weight of the mixed insoluble material is less than 0.2 g, in order to obtain a sufficient amount of mixed insoluble material, the above operation is repeated to obtain 0.2 g or more of mixed insoluble material. It is the same in other embodiments.

接著,將混合不溶物質浸漬於50ml之甲基乙基酮中,在溫度23℃放置24小時。其後,從甲基乙基酮中取出混合不溶物質,以濾紙輕拭之後,計量混合不溶物質之 重量Wb至小數點第4位。接著,根據甲基乙基酮浸漬前後之混合不溶物質的重量Wa、Wb,藉由下述之式(1)求出膨潤度S。 Next, the mixed insoluble material was immersed in 50 ml of methyl ethyl ketone and left at a temperature of 23°C for 24 hours. Thereafter, the mixed insoluble matter was taken out from the methyl ethyl ketone and wiped lightly with filter paper, and the weight W b of the mixed insoluble matter was measured to the fourth decimal place. Next, based on the weights W a and W b of the mixed insoluble matter before and after the immersion of methyl ethyl ketone, the swelling degree S was determined by the following formula (1).

S=Wb/Wa...(1) S=Wb/Wa. . . (1)

「二甲苯不溶物質之比例」 "Proportion of insoluble xylene"

二甲苯不溶物質之比例係以上述膨潤度之測定所得到的二甲苯不溶物質之重量W1相對於在上述膨潤度計量出的試驗片之重量W0的比例(具體而言為百分率)。亦即,二甲苯不溶物質之比例(單位:%)係由W1/W0×100算出。另外,二甲苯不溶物質之比例在表中係作為「XY凝膠量」來表示。 The ratio of the xylene-insoluble substance is the ratio (specifically, percentage) of the weight W 1 of the xylene-insoluble substance obtained by the measurement of the swelling degree to the weight W 0 of the test piece measured at the swelling degree. That is, the ratio (unit: %) of xylene-insoluble substances is calculated from W 1 /W 0 ×100. In addition, the ratio of xylene-insoluble substances is shown as "XY gel amount" in the table.

「苯乙烯系樹脂之重量平均分子量(亦即,Mw)」 "Weight average molecular weight of styrene resin (ie, Mw)"

首先,以與上述方法相同方式進行索氏萃取。接著,將萃取後的二甲苯溶液投下至丙酮600ml,進行傾析、減壓蒸發乾凅。其結果,得到苯乙烯系樹脂作為丙酮可溶物質。接著,苯乙烯系樹脂之重量平均分子量係藉由將聚苯乙烯作為標準物質之凝膠滲透層析法(亦即,GPC法)進行測定。於測定中係使用高分子測定用混合凝膠管柱。具體而言係使用TOSOH(股)製之測定裝置「HLC-8320GPC EcoSEC」,在溶析液:四氫呋喃(亦即, THF)、流量:0.6ml/分、試料濃度:0.1wt%、管柱:將TSKguardcolumn SuperH-H×1根、TSK-GEL SuperHM-H×2根串聯連接的測定條件下進行測定。亦即,重量平均分子量係使苯乙烯系樹脂溶解於四氫呋喃中,以GPC法進行測定,並以標準聚苯乙烯進行校正來求出。 First, Soxhlet extraction is performed in the same manner as the above method. Next, the extracted xylene solution was dropped into 600 ml of acetone, decanted, and evaporated to dryness under reduced pressure. As a result, styrene-based resin is obtained as an acetone-soluble substance. Next, the weight average molecular weight of the styrene-based resin was measured by gel permeation chromatography (that is, GPC method) using polystyrene as a standard substance. In the measurement, a mixed gel column for polymer measurement was used. Specifically, it uses the measurement device "HLC-8320GPC EcoSEC" made by TOSOH (share), in the eluent: tetrahydrofuran (that is, THF), flow rate: 0.6 ml/min, sample concentration: 0.1 wt%, column: TSKguardcolumn SuperH-H×1, TSK-GEL SuperHM-H×2 connected in series under measurement conditions. That is, the weight average molecular weight system is obtained by dissolving styrene resin in tetrahydrofuran, measuring by GPC method, and correcting with standard polystyrene.

「表觀密度」 "Apparent density"

表觀密度係藉由將發泡粒子成形體之質量除以其體積而算出。 The apparent density is calculated by dividing the mass of the expanded particle molded body by its volume.

「彎曲彈性率」 "Bending Elasticity"

彎曲彈性率係遵照JIS K 7221-1999年所記載之3點彎曲試驗方法進行測定。該彎曲彈性率係以使全面成為切削面的方式從複合樹脂發泡粒子成形體切出厚度20mm×寬25mm×長度120mm之試驗片,於室溫23℃、濕度50%之恆溫恆濕室內放置24小時以上後,在支點間距離100mm、壓頭之半徑R15.0mm、支撐台之半徑R15.0mm、試驗速度20mm/min、室溫23℃、濕度50%之條件下,藉由島津製作所製之試驗機「自動立體測圖儀(autograph)AGS-10kNG」進行測定,並採用了所算出之5點之值的加總平均值。 The bending elastic modulus is measured in accordance with the three-point bending test method described in JIS K 7221-1999. The bending modulus of elasticity is such that a test piece with a thickness of 20 mm×width 25 mm×length 120 mm is cut from the composite resin expanded particle molded body so that the entire surface becomes a cutting surface, and placed in a constant temperature and humidity room at a room temperature of 23° C. and a humidity of 50% After 24 hours or more, under the conditions of a distance of 100 mm between the fulcrums, a radius R15.0 mm of the indenter, a radius R15.0 mm of the support table, a test speed of 20 mm/min, a room temperature of 23° C., and a humidity of 50%, manufactured by Shimadzu Corporation The test machine "autograph AGS-10kNG" was used for measurement, and the calculated average value of 5 points was used.

「彎曲破斷能量」 "Bending Breaking Energy"

與上述之彎曲彈性率之測定相同地進行3點彎曲試 驗,由撓曲量(單位:mm)與荷重(單位:kN)之關係求出至破斷點之能量(單位:kJ)。能量係由藉由至破斷點之撓曲量-荷重曲線與表示撓曲量之橫軸包圍的面積所算出。接著,藉由將至破斷點之能量(單位:kJ)除以試驗片之剖面積(單位:cm2),而算出每單位剖面積之彎曲破斷能量(單位:kJ/cm2)。 The 3-point bending test was carried out in the same manner as the above-mentioned measurement of the bending elastic modulus, and the energy (unit: kJ) to the breaking point was obtained from the relationship between the amount of deflection (unit: mm) and the load (unit: kN). The energy is calculated from the area surrounded by the deflection-load curve to the breaking point and the horizontal axis representing the deflection. Next, by dividing the energy (unit: kJ) to the breaking point by the cross-sectional area (unit: cm 2 ) of the test piece, the bending breaking energy (unit: kJ/cm 2 ) per unit cross-sectional area was calculated.

「壓縮強度」 "Compression Strength"

從發泡粒子成形體之中央部分切出縱50mm、橫50mm、厚度25mm之直方體狀的試驗片。接著,對於此試驗片,遵照JIS K 6767-1999年,而求出50%應變時的壓縮荷重。藉由將此壓縮荷重除以試驗片之受壓面積,而算出壓縮應力(具體而言係50%壓縮應力)。於本說明書中亦將此壓縮應力稱為壓縮強度。 A cuboid test piece having a length of 50 mm, a width of 50 mm, and a thickness of 25 mm was cut from the central portion of the expanded particle molded body. Next, for this test piece, in accordance with JIS K 6767-1999, the compression load at 50% strain was obtained. The compressive stress (specifically 50% compressive stress) was calculated by dividing this compressive load by the compression area of the test piece. In this specification, this compressive stress is also called compressive strength.

「表面電阻率」 "Surface Resistivity"

以下述方式測定發泡粒子成形體之表面電阻率。 The surface resistivity of the expanded particle molded body was measured in the following manner.

將發泡粒子成形體在23℃、50%RH之條件下剛製造後經1日硬化處理之後,藉由遵照JIS C2170-2004年之以下的方法,在23℃、50%RH之條件下進行測定。首先,從發泡粒子成形體之中央部附近切出縱:100mm、橫:100mm、厚度:成形體之厚度(亦即,50mm)狀態之直方體狀的測定試驗片。測定試驗片係準備5個。使用三菱化學公司製「Hiresta MCP-HT450」作為測定裝置,測定 各試驗片之成形表面的表面電阻率(單位:Ω)。採用將由5個測定試驗片所分別得到的表面電阻率之值加以幾何平均(geometric mean)後的值。 Immediately after manufacturing the expanded particle molded body under the conditions of 23°C and 50% RH and then curing it for 1 day, the method is performed under the conditions of 23°C and 50% RH by following the method of JIS C2170-2004 Determination. First, a cuboid measuring test piece in a state of longitudinal: 100 mm, lateral: 100 mm, thickness: thickness of the molded body (that is, 50 mm) was cut out from the vicinity of the center of the expanded particle molded body. Five measurement test pieces were prepared. Using "Hiresta MCP-HT450" manufactured by Mitsubishi Chemical Corporation as the measuring device, measuring The surface resistivity (unit: Ω) of the forming surface of each test piece. The value obtained by adding the geometric mean to the surface resistivity values obtained from each of the five measurement test pieces was used.

(實施例2) (Example 2)

於本例中,首先,將乙烯系樹脂(亦即,PE-1)之量從8.65kg變更成9kg,將氣泡調整劑母料之量從1.35kg變更成1kg,除此之外,以與實施例1相同方式製作核粒子。接著,使用此核粒子100g,使用苯乙烯85g與丙烯酸丁酯15g之混合單體作為第1單體,使用苯乙烯300g作為第2單體,除此之外,以與實施例1相同方式製作複合樹脂粒子。然後,使用此複合樹脂粒子以與實施例1相同方式製作發泡粒子成形體。 In this example, first, the amount of vinyl resin (ie, PE-1) was changed from 8.65 kg to 9 kg, and the amount of the masterbatch of the bubble adjuster was changed from 1.35 kg to 1 kg. In the same manner as in Example 1, core particles were produced. Next, using 100 g of the core particles, using a mixed monomer of 85 g of styrene and 15 g of butyl acrylate as the first monomer, and using 300 g of styrene as the second monomer, it was produced in the same manner as in Example 1. Composite resin particles. Then, using this composite resin particle, an expanded particle molded body was produced in the same manner as in Example 1.

(實施例3) (Example 3)

於本例中,首先,將乙烯系樹脂(亦即,PE-1)之量從8.65kg變更成8kg,將氣泡調整劑母料之量從1.35kg變更成2kg,除此之外,以與實施例1相同方式製作核粒子。接著,使用此核粒子53g,使用苯乙烯38g與丙烯酸丁酯15g之混合單體作為第1單體,使用苯乙烯394g作為第2單體,除此之外,以與實施例1相同方式製作複合樹脂粒子。然後,使用此複合樹脂粒子以與實施例1相同方式製作發泡粒子成形體。 In this example, first, the amount of the vinyl resin (ie, PE-1) was changed from 8.65 kg to 8 kg, and the amount of the masterbatch of the bubble adjuster was changed from 1.35 kg to 2 kg. In the same manner as in Example 1, core particles were produced. Next, using 53 g of the core particles, a mixed monomer of 38 g of styrene and 15 g of butyl acrylate as the first monomer, and 394 g of styrene as the second monomer, except that it was produced in the same manner as in Example 1. Composite resin particles. Then, using this composite resin particle, an expanded particle molded body was produced in the same manner as in Example 1.

(比較例1) (Comparative example 1)

作為乙烯系樹脂係準備乙烯-乙酸乙烯酯共聚物(亦即,EVA)。具體而言係使用日本UNICAR公司製「NUC-3221」作為EVA。本例之乙烯系樹脂以下適宜稱為「PE-2」。將PE-2之溫度190℃、荷重2.16kg之條件下之MFR(單位:g/10min)、密度(單位:kg/m3)、拉伸彈性率(單位:MPa)、熔點(單位:℃)顯示於後述之表1。此等係以與上述之實施例1相同方式所測定之值。於本例中,取代於實施例1中在核粒子之製作時作為乙烯系樹脂所使用的8.65kg之PE-1,而使用10kg之PE-2,將氣泡調整劑母料之量從1.35kg變更成0kg,除此之外,以與實施例1相同方式製作核粒子。 An ethylene-vinyl acetate copolymer (that is, EVA) is prepared as an ethylene-based resin system. Specifically, "NUC-3221" manufactured by Japan Unicar Corporation was used as the EVA. The vinyl resin in this example is hereinafter referred to as "PE-2" as appropriate. The MFR (unit: g/10min), density (unit: kg/m 3 ), tensile modulus of elasticity (unit: MPa), melting point (unit: ℃) of PE-2 at a temperature of 190°C and a load of 2.16 kg ) Is shown in Table 1 described later. These are the values measured in the same manner as in Example 1 above. In this example, instead of 8.65 kg of PE-1 used as the ethylene-based resin in the production of the core particles in Example 1, 10 kg of PE-2 was used, and the amount of the masterbatch of the bubble regulator was from 1.35 kg Other than changing to 0 kg, the core particles were produced in the same manner as in Example 1.

接著,以與實施例1相同方式調製出懸浮劑(具體而言係焦磷酸鎂漿體)之後,於此懸浮劑中投入作為界面活性劑之濃度10質量%之月桂基磺酸鈉水溶液2.0g、作為水溶性聚合抑制劑之亞硝酸鈉0.2g、及上述之核粒子150g。接著,使作為聚合起始劑A之過氧化苯甲醯(具體而言係日油公司製「NYPER BW」,水稀釋粉體品)1.29g、作為聚合起始劑B之t-丁基過氧-2-乙基己基單碳酸酯(具體而言係日油公司製「PERBUTYL E」)2.58g、及作為聚合起始劑C之二異丙苯過氧化物(具體而言係日油公司製「PERCUMYL D」)0.86g溶解於第1單體(具體而言係苯乙烯系單體)中。然後,將溶解物一邊以攪拌速度500rpm進行攪拌一邊投入高壓釜內之懸浮 劑中。另外,作為第1單體係使用苯乙烯150g。 Next, after preparing a suspending agent (specifically, magnesium pyrophosphate slurry) in the same manner as in Example 1, 2.0 g of an aqueous solution of sodium lauryl sulfonate having a concentration of 10% by mass as a surfactant was added to the suspending agent. , 0.2 g of sodium nitrite as a water-soluble polymerization inhibitor, and 150 g of the above-mentioned core particles. Next, 1.29 g of benzoyl peroxide as a polymerization initiator A (specifically, "NYPER BW" manufactured by NOF Corporation, water-diluted powder product) and t-butyl as a polymerization initiator B Oxy-2-ethylhexyl monocarbonate (specifically, "PERBUTYL E" manufactured by NOF Corporation) 2.58 g, and dicumyl peroxide as a polymerization initiator C (specifically, NOF Corporation) ("PERCUMYL D") 0.86 g was dissolved in the first monomer (specifically, a styrene-based monomer). Then, the dissolved substance was put into the suspension in the autoclave while stirring at a stirring speed of 500 rpm. In the agent. In addition, 150 g of styrene was used as the first system.

接著,在將高壓釜內的空氣以氮作置換之後,開始昇溫,花費1小時30分鐘昇溫至溫度88℃。昇溫後,在此溫度88℃保持30分鐘。其後,使攪拌速度下降至450rpm,花費30分鐘從88℃冷卻至80℃。接著,在此聚合溫度80℃保持8小時。另外,在到達溫度80℃時,將作為第2單體(具體而言係苯乙烯系單體)之苯乙烯200g花費5小時添加於高壓釜內。 Next, after replacing the air in the autoclave with nitrogen, the temperature was started, and the temperature was raised to 88°C in 1 hour and 30 minutes. After raising the temperature, the temperature was kept at 88°C for 30 minutes. Thereafter, the stirring speed was reduced to 450 rpm, and it took 30 minutes to cool from 88°C to 80°C. Next, the polymerization temperature was kept at 80°C for 8 hours. In addition, when the temperature reached 80° C., 200 g of styrene as a second monomer (specifically, a styrene-based monomer) was added to the autoclave over 5 hours.

接著,花費4小時昇溫至溫度125℃,直接在此溫度125℃下保持2小時30分鐘。其後,花費1小時冷卻至90℃,使攪拌速度下降至400rpm,直接在此溫度90℃下保持3小時。而,在到達溫度90℃時,將作為發泡劑之環己烷20g與丁烷65g花費1小時添加於高壓釜內。丁烷係正丁烷約20體積%、異丁烷約80體積%之混合物。進而,花費2小時昇溫至溫度105℃,在此溫度105℃保持5小時之後,花費約6小時冷卻至溫度30℃。冷卻後,取出內容物,添加硝酸,使附著於樹脂粒子之表面的焦磷酸鎂溶解。其後,以離心分離機進行脫水、洗淨,利用氣流乾燥裝置去除附著於表面的水分,得到發泡性複合樹脂粒子。接著,於發泡性複合樹脂粒子中添加抗靜電劑(具體而言係N,N-雙(2-羥乙基)烷基胺),進而,以硬脂酸鋅、甘油單硬脂酸酯、及甘油二硬脂酸酯之混合物進行被覆。以上述方式來製作發泡性複合樹脂粒子。 Next, it took 4 hours to increase the temperature to 125°C, and it was kept at this temperature for 125 hours for 2 hours and 30 minutes. After that, it took 1 hour to cool to 90°C, the stirring speed was reduced to 400 rpm, and the temperature was directly maintained at 90°C for 3 hours. On the other hand, when the temperature reached 90°C, 20 g of cyclohexane as a blowing agent and 65 g of butane were added to the autoclave in 1 hour. Butane is a mixture of about 20% by volume of normal butane and about 80% by volume of isobutane. Furthermore, it took 2 hours to raise the temperature to 105°C, and after maintaining the temperature at 105°C for 5 hours, it took about 6 hours to cool to a temperature of 30°C. After cooling, the contents were taken out, and nitric acid was added to dissolve the magnesium pyrophosphate adhered to the surface of the resin particles. After that, it was dehydrated and washed with a centrifugal separator, and the water attached to the surface was removed by an airflow drying device to obtain foamable composite resin particles. Next, an antistatic agent (specifically, N,N-bis(2-hydroxyethyl)alkylamine) is added to the expandable composite resin particles, and further, zinc stearate and glycerol monostearate , And a mixture of glyceryl distearate is coated. The expandable composite resin particles were produced in the above manner.

接著,將以上述方式得到的發泡性複合樹脂粒子裝入容積30L之常壓分批式發泡機內,於此發泡機內供給蒸汽。藉此,製作容積密度為48kg/m3之複合樹脂發泡粒子(亦即,一次發泡粒子)之發泡性複合樹脂粒子。然後,使用此複合樹脂發泡粒子以與實施例1相同方式製作發泡粒子成形體。 Next, the expandable composite resin particles obtained in the above manner were charged into an atmospheric pressure batch type foaming machine with a volume of 30 L, and steam was supplied into the foaming machine. In this way, expandable composite resin particles of composite resin expanded particles (that is, primary expanded particles) having a bulk density of 48 kg/m 3 were produced. Then, using this composite resin expanded particle, an expanded particle molded body was produced in the same manner as in Example 1.

(比較例2) (Comparative example 2)

於附有攪拌裝置之內容積3L之高壓釜中裝入脫離子水1100g,進一步添加焦磷酸鈉6.6g。其後,添加粉末狀之硝酸鎂‧6水合物14.2g,在室溫下攪拌30分鐘。藉此,製作出作為懸浮劑之焦磷酸鎂漿體。接著,於此懸浮劑中投入作為界面活性劑之濃度10質量%之月桂基磺酸鈉水溶液2.2g、作為水溶性聚合抑制劑之亞硝酸鈉0.22g、及與實施例1相同之核粒子56g。 Into an autoclave with an internal volume of 3 L equipped with a stirring device was charged with 1100 g of deionized water, and 6.6 g of sodium pyrophosphate was further added. Thereafter, 14.2 g of powdered magnesium nitrate‧6 hydrate was added, and the mixture was stirred at room temperature for 30 minutes. In this way, a magnesium pyrophosphate slurry as a suspending agent was produced. Next, 2.2 g of a 10% by mass aqueous solution of sodium lauryl sulfonate as a surfactant, 0.22 g of sodium nitrite as a water-soluble polymerization inhibitor, and 56 g of the same core particles as in Example 1 were put into this suspending agent. .

接著,使作為聚合起始劑A之過氧化苯甲醯(具體而言係日油公司製「NYPER BW」,水稀釋粉體品)1.29g、作為聚合起始劑B之t-丁基過氧-2-乙基己基單碳酸酯(具體而言係日油公司製「PERBUTYL E」)2.58g、及作為交聯劑之二異丙苯過氧化物(具體而言係日油公司製「PERCUMYL D」)0.86g溶解於第1單體(具體而言係苯乙烯系單體)中。然後,將溶解物一邊以攪拌速度500rpm進行攪拌一邊投入高壓釜內之懸浮劑中。另外,作為第1單體係使用苯乙烯100g與丙烯酸丁 酯12g之混合單體。 Next, 1.29 g of benzoyl peroxide as a polymerization initiator A (specifically, "NYPER BW" manufactured by NOF Corporation, water-diluted powder product) and t-butyl as a polymerization initiator B Oxy-2-ethylhexyl monocarbonate (specifically, "PERBUTYL E" manufactured by NOF Corporation) 2.58 g, and dicumyl peroxide (specifically, manufactured by NOF Corporation) PERCUMYL D") 0.86 g was dissolved in the first monomer (specifically, a styrene monomer). Then, the dissolved substance was poured into the suspending agent in the autoclave while stirring at a stirring speed of 500 rpm. In addition, 100g of styrene and butyl acrylate were used as the first single system Mixed monomer of 12g of ester.

接著,在將高壓釜內的空氣以氮作置換之後,開始昇溫,花費1小時30分鐘昇溫至溫度88℃。昇溫後,在此溫度88℃保持30分鐘。其後,使攪拌速度下降至450rpm,花費30分鐘從88℃冷卻至80℃。接著,在此聚合溫度80℃保持8小時。另外,在到達溫度80℃時,將作為第2單體(具體而言係苯乙烯系單體)之苯乙烯231g花費5小時添加於高壓釜內。 Next, after replacing the air in the autoclave with nitrogen, the temperature was started, and the temperature was raised to 88°C in 1 hour and 30 minutes. After raising the temperature, the temperature was kept at 88°C for 30 minutes. Thereafter, the stirring speed was reduced to 450 rpm, and it took 30 minutes to cool from 88°C to 80°C. Next, the polymerization temperature was kept at 80°C for 8 hours. In addition, when the temperature reached 80° C., 231 g of styrene as a second monomer (specifically, a styrene-based monomer) was added to the autoclave over 5 hours.

接著,花費4小時昇溫至溫度125℃,直接在此溫度125℃下保持2小時30分鐘。其後,花費約6小時冷卻至溫度30℃而製作複合樹脂粒子。然後,使用此複合樹脂粒子以與實施例1相同方式製作發泡粒子成形體。 Next, it took 4 hours to increase the temperature to 125°C, and it was kept at this temperature for 125 hours for 2 hours and 30 minutes. Thereafter, it took about 6 hours to cool to a temperature of 30°C to produce composite resin particles. Then, using this composite resin particle, an expanded particle molded body was produced in the same manner as in Example 1.

(比較例3) (Comparative example 3)

於本例中,首先,將乙烯系樹脂(具體而言係PE-1)之量從8.65kg變更成9.35kg,將氣泡調整劑母料之量從1.35kg變更成0.65kg,除此之外,以與實施例1相同方式製作核粒子。接著,使用此核粒子150g,使用苯乙烯135g與丙烯酸丁酯15g之混合單體作為第1單體,使用苯乙烯200g作為第2單體,除此之外,以與實施例1相同方式製作複合樹脂粒子。然後,使用此複合樹脂粒子以與實施例1相同方式製作發泡粒子成形體。 In this example, first, the amount of vinyl resin (specifically, PE-1) was changed from 8.65 kg to 9.35 kg, and the amount of the masterbatch of the bubble regulator was changed from 1.35 kg to 0.65 kg. In the same manner as in Example 1, core particles were produced. Next, using 150 g of the core particles, using a mixed monomer of 135 g of styrene and 15 g of butyl acrylate as the first monomer, and using 200 g of styrene as the second monomer, it was produced in the same manner as in Example 1. Composite resin particles. Then, using this composite resin particle, an expanded particle molded body was produced in the same manner as in Example 1.

(實施例及比較例之結果) (Results of Examples and Comparative Examples)

針對於實施例2~3及比較例1~3中所製作之發泡粒子成形體,將與實施例1相同之評估結果顯示於表1及表2。 For the expanded particle molded bodies produced in Examples 2 to 3 and Comparative Examples 1 to 3, the same evaluation results as in Example 1 are shown in Table 1 and Table 2.

Figure 105103594-A0202-12-0038-1
Figure 105103594-A0202-12-0038-1

Figure 105103594-A0202-12-0039-2
Figure 105103594-A0202-12-0039-2

如由表2所得知般,由將對於乙烯系樹脂100質量份而言為400~900質量份之苯乙烯系單體進行含浸聚合而成,且膨潤度為1.25以上之複合樹脂所構成的實施例1~3之發泡粒子成形體係彎曲彈性率為高,進而,彎曲破斷能量亦高。因此,上述發泡粒子成形體係撓曲耐性優異,並且可防止因變形導致的破壞。再者,實施例1~3之面板梱包容器用之發泡粒子成形體係即使壓縮強度高,壓縮恢復性亦優異。 As is known from Table 2, it is implemented by impregnating and polymerizing styrene-based monomers of 400 to 900 parts by mass for 100 parts by mass of vinyl resin, and having a swelling degree of 1.25 or more. The foamed particle forming systems of Examples 1 to 3 have a high bending elastic modulus, and further, the bending breaking energy is also high. Therefore, the above-mentioned expanded particle molding system is excellent in bending resistance, and can prevent damage due to deformation. Furthermore, the expanded particle forming system for the panel packing container of Examples 1 to 3 is excellent in compression recovery even if the compression strength is high.

相對於此,比較例1係由於具有乙烯-乙酸乙烯酯共聚物作為乙烯系樹脂且於聚合起始劑使用抽氫反應能為高之二異丙苯過氧化物,因此乙烯系樹脂內之交聯密度容易提高,而膨潤度過低。因此,彎曲破斷能量會不充分,而有著容易引起因變形所導致的破壞。再者,由於複合樹脂中之苯乙烯系樹脂量過少,因此有著壓縮強度或彎曲彈性率為低的問題。又,由於使用丁烷等之有機系發泡劑作為發泡劑,因此有機系發泡劑會殘留於複合樹脂發泡粒子中,而成形水冷時間會比使用二氧化碳作為發泡劑的情況更增長。 On the other hand, in Comparative Example 1, since it has ethylene-vinyl acetate copolymer as the ethylene-based resin and the hydrogenation reaction energy used in the polymerization initiator is dicumyl peroxide, the cross-linkage in the ethylene-based resin The link density is easy to increase, while the swelling degree is too low. Therefore, the bending breaking energy is insufficient, and it is easy to cause damage due to deformation. Furthermore, since the amount of styrene-based resin in the composite resin is too small, there is a problem that the compressive strength or bending elastic modulus is low. In addition, since an organic foaming agent such as butane is used as the foaming agent, the organic foaming agent will remain in the composite resin foamed particles, and the forming water cooling time will be longer than that when carbon dioxide is used as the foaming agent. .

比較例2係由於若相較於比較例1,則複合樹脂中之苯乙烯系樹脂量較多,因此壓縮強度或彎曲彈性率係高達可與實施例相匹敵的程度。但,於比較例2中,由於在複合樹脂粒子之製造時,最初含浸於核粒子之苯乙烯系單體(亦即,第1單體)的添加比例過多,且使用抽氫反應能為高之二異丙苯過氧化物作為聚合起始劑,因此膨 潤度過低。因此,彎曲破斷能量會不充分,而有著容易引起因變形所導致的破壞。 In Comparative Example 2, if compared with Comparative Example 1, the amount of styrene resin in the composite resin is large, so the compressive strength or bending elastic modulus is as high as comparable to the Examples. However, in Comparative Example 2, the production ratio of the styrene-based monomer (that is, the first monomer) initially impregnated into the core particles during the production of the composite resin particles was too large, and the reaction energy using hydrogen extraction was high No. 2 Cumene peroxide is used as a polymerization initiator Moisture is too low. Therefore, the bending breaking energy is insufficient, and it is easy to cause damage due to deformation.

比較例3係含浸於核粒子並進行聚合之苯乙烯系單體的量為少的例子,發泡粒子成形體之剛性為低。因此,有著壓縮強度或彎曲彈性率為低,而容易變形的問題。 Comparative Example 3 is an example in which the amount of styrene monomer impregnated and polymerized in the core particles is small, and the rigidity of the expanded particle molded body is low. Therefore, there is a problem that the compressive strength or bending elastic modulus is low, and it is easily deformed.

(實施例4) (Example 4)

本例係由發泡粒子成形體所構成之面板梱包容器的例子。 This example is an example of a panel packing container composed of a molded product of expanded particles.

如第1圖~第3圖所示般,本例之面板梱包容器1係由發泡粒子成形體所構成,且具有將複數個面板4以在板厚方向上層積的狀態進行收容之收容部10。面板梱包容器1係具有容器主體2,與將該容器主體2的開口部21堵塞之蓋體3,容器主體2及蓋體3之任一者皆由發泡粒子成形體所構成。面板梱包容器1,例如,可使用於液晶面板等之面板4的收容。作為發泡粒子成形體係可使用與上述之實施例1~3相同的成形體。 As shown in FIGS. 1 to 3, the panel packing container 1 of this example is composed of a foamed particle molded body, and has an accommodating portion for accommodating a plurality of panels 4 in a state of being stacked in the plate thickness direction 10. The panel packing container 1 includes a container body 2 and a lid body 3 that closes the opening 21 of the container body 2. Any one of the container body 2 and the lid body 3 is formed of a molded foamed body. The panel packing container 1 can be used to house a panel 4 such as a liquid crystal panel, for example. As the expanded particle molding system, the same molded bodies as in Examples 1 to 3 described above can be used.

以下,針對面板梱包容器1進一步詳細說明。 Hereinafter, the panel bag container 1 will be described in further detail.

如第3圖所示般,容器主體2係具有將複數個面板4以在板厚方向上層積的狀態進行收容之收容部20,且於上面具有開口部21的箱狀。具體而言,容器主體2係由底板部22、與由此底板部22之周緣垂直豎立的側壁部23 所構成。又,蓋體3係具有將被層積之面板4從上方進行收容的收容部30,且於下面具有開口部31的箱狀。具體而言,蓋體3係由上板部32、與由此上板部32之周緣垂直延伸的側壁部33所構成。於容器主體2之側壁23與蓋體3之側壁33係以兩者相嵌合的位置及形狀形成有凸部231、凹部331。 As shown in FIG. 3, the container body 2 has a storage portion 20 that stores a plurality of panels 4 in a stacked state in the plate thickness direction, and has a box shape with an opening 21 on the upper surface. Specifically, the container body 2 is composed of a bottom plate portion 22 and a side wall portion 23 standing perpendicular to the peripheral edge of the bottom plate portion 22 Posed. In addition, the lid body 3 has a box-like shape in which the stacked panel 4 is housed from above and has an opening 31 at the bottom. Specifically, the lid 3 is composed of the upper plate portion 32 and the side wall portion 33 extending perpendicularly to the peripheral edge of the upper plate portion 32. The side wall 23 of the container body 2 and the side wall 33 of the lid body 3 are formed with convex portions 231 and concave portions 331 at positions and shapes where the two fit.

如第2圖及第3圖所示般,於本例之面板梱包容器1中,容器主體2及蓋體3兩者係各自具有收容部20、30。且,藉由此等之收容部20與收容部30而形成面板梱包容器1內之收容部10,而將複數個面板4以層積狀態收容於收容部10內。 As shown in FIGS. 2 and 3, in the panel bag container 1 of this example, both the container body 2 and the lid body 3 have the accommodating portions 20 and 30. Furthermore, the storage unit 10 in the panel packing container 1 is formed by the storage unit 20 and the storage unit 30, and a plurality of panels 4 are stored in the storage unit 10 in a stacked state.

本例之面板梱包容器1係由上述之實施例1~3之發泡粒子成形體所構成。因此,即使於收容部10中收容重量大之複數個面板4,面板梱包容器1也不易因面板4之重量而撓曲,進而不易因變形而損壞。因而,面板梱包容器1係即使以梱包狀態作堆積,或於梱包狀態下之移動中發生急劇的荷重變化,也可防止破裂之發生。於第4圖中係顯示抓持本例之面板梱包容器1的長邊方向之兩端,將面板梱包容器1舉起的樣子。如同圖所示般,面板梱包容器1係藉由被收容於收容部10的面板4之重量而彎曲。本例之面板梱包容器1係如上述之實施例1~3般,由於是由將對於乙烯系樹脂100質量份而言為400~900質量份之苯乙烯系單體進行含浸聚合而成,且膨潤度為1.25以上之複合樹脂所成的發泡粒子成形體所構成, 因此如第4圖所示般,撓曲量為小。又,於第5圖中係顯示抓持本例之面板梱包容器1的短邊方向之兩端,將面板梱包容器1舉起的樣子,於此情況中撓曲量亦為小。另外,於上述之第4圖及第5圖、後述之第6圖及第7圖中,雖為了製圖方便,而省略面板梱包容器1內之面板的圖示,但實際上係有複數個面板被收容於內部。 The panel packing container 1 of this example is constituted by the expanded particle shaped bodies of the above examples 1 to 3. Therefore, even if a plurality of panels 4 with a large weight are accommodated in the accommodating portion 10, the panel packing container 1 is less likely to be flexed due to the weight of the panel 4, and thus not easily damaged due to deformation. Therefore, even if the panel pack container 1 is stacked in the pack state, or a sudden load change occurs during movement in the pack state, the occurrence of breakage can be prevented. FIG. 4 shows a state in which the panel bundling container 1 of this example is gripped at both ends in the longitudinal direction, and the panel bundling container 1 is lifted. As shown in the figure, the panel packing container 1 is bent by the weight of the panel 4 accommodated in the accommodating portion 10. The panel packing container 1 of this example is the same as the above Examples 1 to 3, because it is made by impregnating and polymerizing styrene-based monomers of 400 to 900 parts by mass for 100 parts by mass of the vinyl resin, and It is composed of a molded body of expanded particles made of a composite resin with a swelling degree of 1.25 or more, Therefore, as shown in Fig. 4, the amount of deflection is small. In addition, FIG. 5 shows a state in which the panel bundling container 1 of this example is gripped at both ends in the short-side direction and the panel bundling container 1 is lifted, and in this case, the amount of deflection is also small. In addition, in FIG. 4 and FIG. 5 described above, and FIG. 6 and FIG. 7 described later, although the illustration of the panel in the panel packing container 1 is omitted for the convenience of drawing, there are actually a plurality of panels Be contained inside.

於上述之例子中,雖容器主體2與蓋體3之任一者皆具有面板4之收容部20、30,但亦可變更成容器主體2為具有收容部,蓋體3係不具有收容部3的構造。於此情況中,雖將圖示省略但蓋體3係成為板狀。 In the above example, although either the container body 2 or the lid 3 has the storage portions 20, 30 of the panel 4, the container body 2 may be changed to have the storage portion, and the cover 3 does not have the storage portion 3. Construction. In this case, although the illustration is omitted, the lid 3 is formed into a plate shape.

(比較例5) (Comparative example 5)

本例係與上述之實施例4相同形狀,但由上述比較例3之發泡粒子成形體所構成之面板梱包容器的例子。本例之面板梱包容器9係由比較例3之發泡粒子成形體所構成,除此之外,具有與上述之實施例4相同的形狀,且由容器主體91與蓋體92所構成。本例之面板梱包容器9係由彎曲彈性率為不充分之比較例3之發泡粒子成形體所構成。因此,如第6圖及第7圖所示般,面板梱包容器9係藉由被收容於收容部10的面板4之重量而大幅彎曲。因此,當將面板梱包容器9舉起時,恐有引起掉落或面板之破損的疑慮。另外,雖將圖示省略,但面板梱包容器9係如上述之比較例1及比較例2所示般,在由彎曲破斷能量小的發泡粒子成形體所構成的情況,因彎曲而變形的面板 梱包容器9容易損壞。 This example is an example of a panel wrapping container formed in the same shape as in Example 4 described above, but composed of the expanded particle molded body of Comparative Example 3 described above. The panel packing container 9 of this example is composed of the expanded particle molded body of Comparative Example 3, and has the same shape as that of Example 4 described above, and is composed of the container body 91 and the lid 92. The panel packing container 9 of this example is composed of the expanded particle molded body of Comparative Example 3 in which the bending elastic modulus is insufficient. Therefore, as shown in FIG. 6 and FIG. 7, the panel packing container 9 is greatly bent by the weight of the panel 4 accommodated in the accommodating portion 10. Therefore, when the panel packing container 9 is lifted, there is a possibility that the panel may fall or the panel may be damaged. In addition, although the illustration is omitted, the panel packing container 9 is as shown in the above Comparative Example 1 and Comparative Example 2, and is deformed by bending when it is formed of a foamed particle molded body having a small bending breaking energy Panel The bag container 9 is easily damaged.

以上,雖針對本發明之實施例詳細地說明,但本發明並不限定於上述實施例,在不損及本發明之趣旨的範圍內可進行種種的變更。 Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-mentioned embodiments, and various changes can be made within the scope not detracting from the interest of the present invention.

1‧‧‧面板梱包容器 1‧‧‧Panel container

2‧‧‧容器主體 2‧‧‧Container body

3‧‧‧蓋體 3‧‧‧cover

23‧‧‧側壁部 23‧‧‧Wall part

32‧‧‧上板部 32‧‧‧ Upper Board Department

33‧‧‧側壁部 33‧‧‧Side wall

231‧‧‧凸部 231‧‧‧Convex

331‧‧‧凹部 331‧‧‧recess

Claims (6)

一種發泡粒子成形體,其係將複合樹脂發泡粒子進行模內成形而成之發泡粒子成形體,構成該發泡粒子成形體之複合樹脂係將對於乙烯系樹脂100質量份而言為400~900質量份之苯乙烯系單體進行含浸聚合而成,上述乙烯系樹脂為直鏈低密度聚乙烯,將上述複合樹脂藉由二甲苯進行索氏萃取時之二甲苯不溶物質與上述索氏萃取後之二甲苯溶液中所含之丙酮不溶物質的混合不溶物質之於溫度23℃之甲基乙基酮中的膨潤度為1.25以上。 An expanded particle molded body is an expanded particle molded body formed by in-mold molding of a composite resin expanded particle. The composite resin constituting the expanded particle molded body is 100 parts by mass of ethylene-based resin as 400~900 parts by mass of styrene monomer is impregnated and polymerized. The above-mentioned vinyl resin is linear low-density polyethylene. The xylene-insoluble substance and the above-mentioned resin when the composite resin is subjected to Soxhlet extraction by xylene The swelling degree of the mixed insoluble matter of the acetone insoluble matter contained in the xylene solution after the extraction in the methyl ethyl ketone at a temperature of 23°C is 1.25 or more. 如請求項1之發泡粒子成形體,其中,上述乙烯系樹脂係使用茂金屬系聚合觸媒進行聚合而成之熔點105℃以下之直鏈狀低密度聚乙烯。 The expanded particle molded body according to claim 1, wherein the above-mentioned ethylene-based resin is a linear low-density polyethylene having a melting point of 105° C. or less, which is polymerized using a metallocene-based polymerization catalyst. 如請求項1或2之發泡粒子成形體,其中,上述複合樹脂係將對於乙烯系樹脂100質量份而言為超過450質量份且900質量份以下之苯乙烯系單體進行含浸聚合而成。 The expanded particle molded body according to claim 1 or 2, wherein the above-mentioned composite resin is obtained by impregnating and polymerizing a styrene-based monomer that is more than 450 parts by mass and less than 900 parts by mass for 100 parts by mass of the ethylene-based resin. . 如請求項1或2之發泡粒子成形體,其中,上述發泡粒子成形體之表觀密度為30~100kg/m3The expanded particle molded body according to claim 1 or 2, wherein the apparent density of the expanded particle molded body is 30 to 100 kg/m 3 . 一種面板梱包容器,其係由如請求項1~4中任一項之發泡粒子成形體所構成之面板梱包容器,其係具有將複數個面板以在板厚方向上層積的狀態進行收容之收容部。 A panel bundling container, which is a panel bundling container composed of the expanded particle shaped body according to any one of claims 1 to 4, which has a plurality of panels stacked in a state of being stacked in the thickness direction Containment Department. 如請求項5之面板梱包容器,其中,於上述發泡粒子成形體之至少表面存在抗靜電劑,上述發泡粒子成形體之表面電阻率為1×108~1×1013Ω。 The panel packing container according to claim 5, wherein an antistatic agent is present on at least the surface of the expanded particle molded body, and the surface resistivity of the expanded particle molded body is 1×10 8 to 1×10 13 Ω.
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