TWI669373B - Double-sided adhesive tape, article and separation method - Google Patents

Double-sided adhesive tape, article and separation method Download PDF

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TWI669373B
TWI669373B TW104136091A TW104136091A TWI669373B TW I669373 B TWI669373 B TW I669373B TW 104136091 A TW104136091 A TW 104136091A TW 104136091 A TW104136091 A TW 104136091A TW I669373 B TWI669373 B TW I669373B
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double
adhesive tape
layer
sided adhesive
styrene
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TW104136091A
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Chinese (zh)
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TW201623509A (en
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秋山誠二
森野彰規
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日商迪愛生股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明所欲解決之課題係為提供一種雙面黏貼膠帶,該雙面黏貼膠帶可用於向被黏體的貼附、2個以上的被黏體的固定,且於將該2個以上的被黏體分離時可簡單地拆解。本發明係關於一種雙面黏貼膠帶,其特徵在於:於含有黏結劑及熱膨脹性微球之易拆解層之兩面直接或介隔其他層而具有黏貼劑層。 又,本發明係關於一種物品,其特徵在於:具有2個以上之被黏體藉由該雙面黏貼膠帶接著而形成之構造。The problem to be solved by the present invention is to provide a double-sided adhesive tape, which can be used for attaching to an adherend, fixing two or more adherends, and applying the two or more adherends. It can be easily disassembled when the body is separated. The present invention relates to a double-sided adhesive tape, which is characterized in that it has an adhesive layer directly or through other layers on both sides of an easily dismantleable layer containing an adhesive and thermally expandable microspheres. The present invention relates to an article having a structure in which two or more adherends are formed by adhering the double-sided adhesive tape.

Description

雙面黏貼膠帶、物品及分離方法Double-sided adhesive tape, article and separation method

本發明關於一種易拆解性的雙面黏貼膠帶,使用該雙面黏貼膠帶進行向被黏體的貼附、物品間的固定時,經過一定期間後可輕易地解除該貼附、固定;並係關於藉由該雙面黏貼膠帶貼合的2個以上的被黏體的分離方法。The present invention relates to an easily detachable double-sided adhesive tape. When using the double-sided adhesive tape to adhere to an adherend and to fix between articles, the attachment and fixing can be easily released after a certain period of time; and This invention relates to a method for separating two or more adherends bonded by the double-sided adhesive tape.

黏貼膠帶,作為加工性優異且接著可靠性高的接合手段,使用於OA設備、IT設備、家電產品、汽車等各產業領域的零件固定用途、零件的臨時固定用途、顯示產品信息的標籤用途等。近年,以保護地球環境的觀點觀之,該等產業領域中舊產品的回收、再利用的要求不斷增長。進行各種產品的回收、再利用時,將用於零件的固定、標籤的黏貼膠帶剝離的作業成為必要,但由於該黏貼膠帶設置於產品中的各處,期望能藉由簡單的除去步驟降低作業成本。Adhesive tape is used as a bonding means with excellent processability and high reliability, and is used for fixing parts, temporarily fixing parts, and displaying product information in various industrial fields such as OA equipment, IT equipment, home appliances, and automobiles. . In recent years, from the viewpoint of protecting the global environment, the requirements for the recycling and reuse of old products in these industries have been increasing. When recovering and reusing various products, it is necessary to peel off the adhesive tape used for fixing parts and labels. However, since the adhesive tape is installed in various parts of the product, it is expected to reduce the work by simple removal steps. cost.

作為相對容易剝離的黏貼膠帶,例如,有人揭示了具有接著力不同的2層以上的黏貼層的黏貼構件(參照專利文獻1)。該黏貼膠帶係藉由介隔具有重疊結構的黏貼層的黏貼構件中的弱黏貼層而接合處理被黏體,以實現被黏體的牢固的固著、及以該弱黏貼層作為剝離面的容易的拆解的黏貼構件。 但,該黏貼構件以多層黏貼劑層作為必要的構造,因此存在製造成本高的問題。又,該黏貼構件為藉由弱黏貼層而進行與被黏體的接著的構造,因此於接著力的提高上有限制,且於牢固地固定物品的用途上的展開較困難。 【專利文獻】As an adhesive tape that is relatively easy to peel off, for example, an adhesive member having two or more adhesive layers having different adhesive forces has been disclosed (see Patent Document 1). The adhesive tape is used for joining and processing adherends through a weak adhesive layer in an adhesive member having an adhesive layer with an overlapped structure, so as to realize the firm fixing of the adherend and the ease of using the weak adhesive layer as a peeling surface. Disassembled adhesive members. However, since this adhesive member has a multi-layer adhesive layer as a necessary structure, there exists a problem of high manufacturing cost. In addition, the adhesive member has a structure for adhering to an adherend by a weak adhesive layer, and therefore there is a limit in improving the adhesive force, and it is difficult to expand the application for firmly fixing the article. [Patent Literature]

[專利文獻1] 日本特開平10-140093號公報[Patent Document 1] Japanese Patent Laid-Open No. 10-140093

[發明所欲解決之課題][Problems to be Solved by the Invention]

本發明所欲解決之課題為提供一種雙面黏貼膠帶,該雙面黏貼膠帶可用於向被黏體的貼附、2個以上的被黏體的固定,且於將該2個以上的被黏體分離時可簡單地拆解。 [解決課題之手段]The problem to be solved by the present invention is to provide a double-sided adhesive tape, which can be used for attaching to an adherend, fixing two or more adherends, and applying the two or more adherends. It can be easily disassembled when the body is separated. [Means for solving problems]

本發明係關於一種雙面黏貼膠帶,其特徵在於:於含有黏結劑及熱膨脹性微球之易拆解層之兩面直接或介隔其他層而具有黏貼劑層。The present invention relates to a double-sided adhesive tape, which is characterized in that it has an adhesive layer directly or through other layers on both sides of an easily dismantleable layer containing an adhesive and thermally expandable microspheres.

又,本發明係關於一種物品,其特徵在於:具有2個以上之被黏體藉由上述雙面黏貼膠帶接著而形成之構造。The present invention relates to an article having a structure in which two or more adherends are formed by adhering the double-sided adhesive tape.

又,本發明係關於一種分離方法,該分離方法藉由將構成上述物品之上述易拆解層加熱,使上述熱膨脹性微球膨脹,藉此分離構成該物品之2個以上之被黏體。 [發明之效果]The present invention also relates to a separation method for separating the two or more adherends constituting the article by heating the easily dismantleable layer constituting the article to expand the thermally expandable microspheres. [Effect of the invention]

本發明之雙面黏貼膠帶,可貼附至被黏體,且可牢固地貼合2個以上的被黏體,於消除該被黏體彼此的貼合而藉此拆解上述物品時,藉由加熱可簡單地分離該2個以上的被黏體。The double-sided adhesive tape of the present invention can be attached to an adherend, and can firmly adhere more than two adherends. When disassembling the adherends to thereby dismantle the above-mentioned articles, The two or more adherends can be easily separated by heating.

根據本發明之雙面黏貼膠帶之製造方法,可製造本發明之雙面黏貼膠帶。According to the manufacturing method of the double-sided adhesive tape of the present invention, the double-sided adhesive tape of the present invention can be manufactured.

根據本發明之分離方法,可簡單地分離被黏體彼此的貼合。According to the separation method of the present invention, the adherence of the adherends can be easily separated.

《雙面黏貼膠帶》 本發明之雙面黏貼膠帶,其特徵在於:於含有黏結劑及熱膨脹性微球之易拆解層之兩面直接或介隔其他層而具有黏貼劑層。"Double-sided adhesive tape" The double-sided adhesive tape of the present invention is characterized in that it has an adhesive layer on both sides of an easily dismantleable layer containing an adhesive and thermally expandable microspheres or through other layers.

以下,對本發明之雙面黏貼膠帶之實施方式之一例進行說明。Hereinafter, an example of an embodiment of the double-sided adhesive tape of the present invention will be described.

<第1實施方式> 圖1係根據本發明之雙面黏貼膠帶之實施方式之一例。雙面黏貼膠帶1,於含有黏結劑11及熱膨脹性微球12之易拆解層10之兩面側,具有黏貼劑層20,21。於黏貼劑層20,21上,可分別層疊剝離片30,31。<First Embodiment> FIG. 1 is an example of an embodiment of a double-sided adhesive tape according to the present invention. The double-sided adhesive tape 1 has adhesive layers 20 and 21 on both sides of the easily dismantleable layer 10 containing the adhesive 11 and the thermally expandable microspheres 12. On the adhesive layers 20 and 21, peeling sheets 30 and 31 may be laminated, respectively.

以下,對雙面黏貼膠帶之各構造進行說明。 [易拆解層] 易拆解層10,含有黏結劑11及熱膨脹性微球12。易拆解層,係於將藉由雙面黏貼膠帶貼合的2個以上的被黏體分離時,由於將被黏體彼此分離等的剝離應力而破壞的層。Hereinafter, each structure of a double-sided adhesive tape is demonstrated. [Easy disassembling layer] The easily disassembling layer 10 includes a binder 11 and a thermally expandable microsphere 12. The easy-to-disassemble layer is a layer that is broken by peeling stress such as separating the adherends from each other when separating the two or more adherends bonded by the double-sided adhesive tape.

上述黏結劑,可使用因上述熱膨脹性微球膨脹(所產生)的力而可輕易地拆解的物質。又,該黏結劑使用熱塑性者較佳。此處,熱塑性係指該黏結劑之於1Hz及23℃之以動態黏彈性譜測定之儲存彈性模量G23 為1.0×103 ~5.0×107 Pa之範圍,於1Hz及120℃之以動態黏彈性譜測定之儲存彈性模量G120 為1.0×102 ~5.0×106 Pa之範圍。As the binder, a substance that can be easily disassembled by the force of the expansion (generation) of the thermally expandable microspheres can be used. In addition, it is preferable to use thermoplastic as the adhesive. Here, the thermoplastic means the storage elastic modulus G 23 of the adhesive measured by dynamic viscoelasticity spectrum at 1 Hz and 23 ° C. in a range of 1.0 × 10 3 to 5.0 × 10 7 Pa, and between 1 Hz and 120 ° C. The storage elastic modulus G 120 determined by dynamic viscoelasticity spectrum is in a range of 1.0 × 10 2 to 5.0 × 10 6 Pa.

通常狀態下,在藉由本發明之雙面黏貼膠帶使被黏體彼此牢固地接著方面,使用構成易拆解層之黏結劑之於1Hz及23℃之以動態黏彈性譜測定之儲存彈性模量G23 為1.0×103 ~5.0×107 Pa者較佳,使用為5.0×103 ~5.0×106 Pa者更佳,使用為5.0×103 ~1.0×106 Pa者尤佳,使用為1.0×104 ~1.0×106 Pa者特佳。In the normal state, the storage elastic modulus measured by dynamic viscoelasticity spectroscopy at 1 Hz and 23 ° C. using an adhesive constituting an easily dismantleable layer is used to firmly adhere the adherends to each other by the double-sided adhesive tape of the present invention G 23 is preferably 1.0 × 10 3 to 5.0 × 10 7 Pa, more preferably 5.0 × 10 3 to 5.0 × 10 6 Pa, and more preferably 5.0 × 10 3 to 1.0 × 10 6 Pa. It is particularly preferable to be 1.0 × 10 4 to 1.0 × 10 6 Pa.

又,在藉由加熱將被黏體彼此輕易地分離方面,使用構成易拆解層之黏結劑之於1Hz及120℃之以動態黏彈性譜測定之儲存彈性模量G120 為1.0×102 ~5.0×106 Pa者較佳,使用為5.0×102 ~1.0×106 Pa者更佳,使用為5.0×102 ~5.0×105 Pa者尤佳。In addition, in terms of easily separating the adherends from each other by heating, the storage elastic modulus G 120 measured by dynamic viscoelasticity spectrum at 1 Hz and 120 ° C. using a binder constituting an easily dismantleable layer is 1.0 × 10 2 It is preferably from 5.0 to 10 × 10 6 Pa, more preferably from 5.0 × 10 2 to 1.0 × 10 6 Pa, and even more preferably from 5.0 × 10 2 to 5.0 × 10 5 Pa.

易拆解層之黏結劑之上述儲存彈性模量G120 ,宜比上述儲存彈性模量G23 小較佳。The storage elastic modulus G 120 of the adhesive of the easily dismantleable layer should preferably be smaller than the storage elastic modulus G 23 .

上述儲存彈性模量G23 及G120 ,係指對使用構成易拆解層的黏結劑而形成的試驗片進行測定的結果。該試驗片中不含熱膨脹性微球。試驗片的厚度為2mm。試驗片可藉由將易拆解層中所含有的黏結劑塗布於片材上等而得到。The above-mentioned storage elastic moduli G 23 and G 120 refer to the results of measurement on a test piece formed using an adhesive constituting an easily dismantleable layer. This test piece does not contain thermally expandable microspheres. The thickness of the test piece was 2 mm. The test piece can be obtained by applying an adhesive contained in the easily dismantleable layer to a sheet or the like.

儲存彈性模量G23 及G120 ,可使用市售的黏彈性試驗機,利用後述實施例中所記載的方法進行測定。The storage elastic moduli G 23 and G 120 can be measured using a commercially available viscoelasticity testing machine by a method described in Examples described later.

上述易拆解層的厚度為5μm~80μm較佳,5μm~60μm更佳,10μm~50μm尤佳。易拆解層的厚度,係測定在易拆解層的厚度方向隨機選出的5個地方的厚度而得到的平均值。易拆解層的厚度藉由為上述範圍,可成為層的形成容易且易拆解性優異的易拆解層。The thickness of the easily dismantleable layer is preferably 5 μm to 80 μm, more preferably 5 μm to 60 μm, and even more preferably 10 μm to 50 μm. The thickness of the easy-to-disassemble layer is an average value obtained by measuring the thickness of five places randomly selected in the thickness direction of the easy-to-disassemble layer. When the thickness of the easily dismantleable layer is within the above range, the layer can be easily disassembled and the layer can be easily disassembled and has excellent ease of disassembly.

上述易拆解層中所含有的上述黏結劑例如使用熱塑性樹脂時,易因熱而軟化且易拆解故為較佳。When a thermoplastic resin is used for the said adhesive agent contained in the said easy-to-disassemble layer, for example, it is easy to soften by heat and it is easy to disassemble | disassemble.

上述熱塑性樹脂,例如可列舉聚胺脂(PU)、熱塑性聚胺脂(TPU)等胺甲酸乙酯系樹脂;聚碳酸酯(PC);聚氯乙烯(PVC)、氯乙烯-乙酸乙烯酯共聚物樹脂等氯乙烯系樹脂;聚丙烯酸、聚甲基丙烯酸、聚丙烯酸甲酯、聚甲基丙烯酸甲酯(PMMA)、聚甲基丙烯酸乙酯等丙烯酸系樹脂;聚對苯二甲酸乙二醇酯(PET)、聚對苯二甲酸丁二醇酯、聚對苯二甲酸丙二醇酯、聚萘二甲酸乙二醇酯、聚萘二甲酸丁二醇酯等聚酯系樹脂;尼龍(註冊商標)等聚醯胺系樹脂;聚苯乙烯(PS)、醯亞胺改性聚苯乙烯、丙烯腈・丁二烯・苯乙烯(ABS)樹脂、醯亞胺改性ABS樹脂、苯乙烯・丙烯腈共聚物(SAN)樹脂、丙烯腈・乙烯 -丙烯-二烯・苯乙烯(AES)樹脂等聚苯乙烯系樹脂;聚乙烯(PE)樹脂、聚丙烯(PP)樹脂、環烯烴樹脂等烯烴系樹脂;硝化纖維素、乙酸纖維素等纖維素系樹脂;矽氧系樹脂;氟系樹脂等熱塑性樹脂,苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體、氯乙烯系熱塑性彈性體、胺甲酸乙酯系熱塑性彈性體、酯系熱塑性彈性體、醯胺系熱塑性彈性體等熱塑性彈性體。Examples of the thermoplastic resin include urethane-based resins such as polyurethane (PU) and thermoplastic polyurethane (TPU); polycarbonate (PC); polyvinyl chloride (PVC); and vinyl chloride-vinyl acetate copolymerization Resins such as vinyl chloride resins; acrylic resins such as polyacrylic acid, polymethacrylic acid, polymethyl acrylate, polymethyl methacrylate (PMMA), and polyethyl methacrylate; polyethylene terephthalate Polyester resins such as polyester (PET), polybutylene terephthalate, polytrimethylene terephthalate, polyethylene naphthalate, polybutylene naphthalate; nylon (registered trademark) ) And other polyamido-based resins; polystyrene (PS), polyimide-modified polystyrene, acrylonitrile-butadiene-styrene (ABS) resin, polyimide-modified ABS resin, styrene-propylene Polystyrene resins such as nitrile copolymer (SAN) resins, acrylonitrile, ethylene-propylene-diene, and styrene (AES) resins; olefins such as polyethylene (PE) resins, polypropylene (PP) resins, and cycloolefin resins Resins; cellulose resins such as nitrocellulose and cellulose acetate; silicone resins; fluorine resins The thermoplastic resin of the thermoplastic elastomer, a styrene based thermoplastic elastomer, olefin thermoplastic elastomer, vinyl chloride thermoplastic elastomer, an amine-based urethane thermoplastic elastomers, ester-based thermoplastic elastomer, acyl amine-based thermoplastic elastomer.

就熱塑性樹脂而言,上述該等中特別是使用苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體、氯乙烯系熱塑性彈性體、酯系熱塑性彈性體、胺甲酸乙酯系熱塑性彈性體、醯胺系熱塑性彈性體或丙烯酸系樹脂等較佳,使用苯乙烯系熱塑性彈性體或丙烯酸系樹脂特佳。As for the thermoplastic resin, styrene-based thermoplastic elastomer, olefin-based thermoplastic elastomer, vinyl chloride-based thermoplastic elastomer, ester-based thermoplastic elastomer, urethane-based thermoplastic elastomer, and ammonium A thermoplastic elastomer or an acrylic resin is preferred, and a styrene thermoplastic elastomer or an acrylic resin is particularly preferred.

作為苯乙烯系熱塑性彈性體,例如,可列舉苯乙烯-乙烯-丁烯共聚物(SEB)等苯乙烯系二嵌段共聚物;苯乙烯-丁二烯-苯乙烯共聚物(SBS)、SBS的氫化物(苯乙烯-乙烯-丁烯-苯乙烯共聚物(SEBS))、苯乙烯-異戊二烯-苯乙烯共聚物(SIS)、SIS的氫化物(苯乙烯-乙烯-丙烯-苯乙烯共聚物(SEPS))、苯乙烯-異丁烯-苯乙烯共聚物(SIBS)等苯乙烯系三嵌段共聚物;苯乙烯-丁二烯-苯乙烯-丁二烯(SBSB)等苯乙烯系四嵌段共聚物;苯乙烯-丁二烯-苯乙烯-丁二烯-苯乙烯(SBSBS)等苯乙烯系五嵌段共聚物;具有該等以上的重複單元的苯乙烯系多嵌段共聚物;將苯乙烯-丁二烯橡膠(SBR)等苯乙烯系無規共聚物的乙烯性雙鍵氫化後的氫化物等。苯乙烯系熱塑性彈性體亦可使用市售品。Examples of the styrene-based thermoplastic elastomer include styrene-based diblock copolymers such as styrene-ethylene-butene copolymer (SEB); styrene-butadiene-styrene copolymer (SBS), and SBS Hydride (styrene-ethylene-butene-styrene copolymer (SEBS)), styrene-isoprene-styrene copolymer (SIS), SIS hydride (styrene-ethylene-propylene-benzene Styrene-based triblock copolymers such as ethylene copolymer (SEPS)), styrene-isobutylene-styrene copolymer (SIBS); styrene-butadiene-styrene-butadiene (SBSB) Tetrablock copolymer; styrene-butadiene-styrene-butadiene-styrene (SBSBS) and other styrene-based pentablock copolymers; styrene-based multiblock copolymers with such repeating units A hydride obtained by hydrogenating an ethylene-based double bond of a styrene-based random copolymer such as styrene-butadiene rubber (SBR). A commercially available styrene-based thermoplastic elastomer may be used.

就上述苯乙烯系熱塑性彈性體而言,使用上述苯乙烯系三嵌段共聚物及苯乙烯系二嵌段共聚物的混合物的話,具有上述於23℃的儲存彈性模量與上述於120℃的儲存彈性模量、及該於23℃的儲存彈性模量除以於120℃測定的儲存彈性模量的值,其結果為,在得到於約23℃的常溫範圍下2個以上的被黏體可牢固地貼合,且藉由加熱至約120℃可輕易地分離2個以上的被黏體的黏貼膠帶方面較佳,使用相對於該苯乙烯系熱塑性彈性體全體,該苯乙烯系二嵌段共聚物之含量為10質量%~90質量%之範圍者更佳,以15質量%~80質量%之範圍使用尤佳,以20質量%~75質量%之範圍使用特佳。For the styrene-based thermoplastic elastomer, when a mixture of the styrene-based triblock copolymer and the styrene-based diblock copolymer is used, the storage elastic modulus at 23 ° C and the The storage elastic modulus and the value of the storage elastic modulus at 23 ° C. divided by the storage elastic modulus measured at 120 ° C. As a result, two or more adherends were obtained at a normal temperature range of about 23 ° C. Adhesive tape can be firmly adhered, and two or more adherends can be easily separated by heating to about 120 ° C. The styrene-based two-embedded adhesive is used for the entire styrene-based thermoplastic elastomer. The content of the segment copolymer is more preferably in the range of 10% to 90% by mass, particularly preferably in the range of 15% to 80% by mass, and particularly preferably in the range of 20% to 75% by mass.

就上述苯乙烯系熱塑性彈性體而言,在使加熱所致之拆解性更為提高方面,使用具有1萬~80萬之範圍之重量平均分子量者較佳,使用具有5萬~50萬之範圍之重量平均分子量者更佳,使用具有15萬~45萬之範圍之重量平均分子量者尤佳。In terms of the above-mentioned styrene-based thermoplastic elastomer, it is preferable to use a weight average molecular weight having a range of 10,000 to 800,000 in order to further improve the dismantling property by heating, and use a material having a weight average of 50,000 to 500,000. A weight average molecular weight in the range is more preferable, and a weight average molecular weight in the range of 150,000 to 450,000 is used.

上述丙烯酸系樹脂,例如,可使用由含有(甲基)丙烯酸烷基酯的單體聚合而得到的物質。As said acrylic resin, the thing obtained by superposing | polymerizing the monomer containing an alkyl (meth) acrylate can be used, for example.

就上述 (甲基)丙烯酸烷基酯而言,使用具有碳原子數4~12的烷基的(甲基)丙烯酸酯較佳,具體而言,使用(甲基)丙烯酸丁酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯等較佳,丙烯酸丁酯及丙烯酸2-乙基己酯單獨或組合使用更佳。As the alkyl (meth) acrylate, a (meth) acrylate having an alkyl group having 4 to 12 carbon atoms is preferably used, and specifically, butyl (meth) acrylate, (meth) ) Isooctyl acrylate, 2-ethylhexyl (meth) acrylate and the like are preferred, and butyl acrylate and 2-ethylhexyl acrylate are used alone or in combination.

又,上述單體除上述物質以外,可使用丙烯腈、(甲基)丙烯酸、馬來酸酐、丙烯醯胺、衣康酸、苯乙烯、乙酸乙烯酯等。In addition to the aforementioned monomers, acrylonitrile, (meth) acrylic acid, maleic anhydride, acrylamide, itaconic acid, styrene, vinyl acetate, and the like can be used as the monomers.

上述易拆解層中所含有的熱膨脹性微球,係能因熱的影響而膨脹者。具體而言,該熱膨脹性微球宜使用於120℃的熱膨脹率為150%以上者較佳,使用於120℃的熱膨脹率為170%以上者更佳,使用於120℃的熱膨脹率為200%以上者尤佳,使用於120℃的熱膨脹率為220%以上者特佳,使用250%以上者時,可輕易地拆解易拆解層,其結果為可輕易地進行被黏體彼此的分離因而為特佳。又,該膨脹率的上限並無特別限制,為大概5000%較佳。此外,該熱膨脹率係指利用以下的方法算出的值。The thermally expandable microspheres contained in the easily dismantleable layer are those capable of expanding due to the influence of heat. Specifically, the thermally expandable microspheres are preferably used with a thermal expansion coefficient of 150% or higher at 120 ° C, more preferably a thermal expansion coefficient of 170% or higher at 120 ° C, and a thermal expansion coefficient of 200% at 120 ° C. The above is particularly preferable. The thermal expansion coefficient of 120% or higher is particularly preferred. When the temperature is above 250%, the easily dismantleable layer can be easily disassembled. As a result, the adherends can be easily separated from each other. It is therefore particularly good. The upper limit of the expansion ratio is not particularly limited, but is preferably about 5000%. The thermal expansion coefficient is a value calculated by the following method.

首先,將熱膨脹性微球(未膨脹者)1g置於量瓶中,利用水中置換法測定真比重。然後,將該熱膨脹性微球1g置於吉爾式烘箱(geer type oven)中,於120℃下加熱2分鐘使其膨脹。First, 1 g of thermally expandable microspheres (unexpanded ones) was placed in a measuring flask, and the true specific gravity was measured by a water displacement method. Then, 1 g of this heat-expandable microsphere was put in a Geer type oven, and it expanded at 120 degreeC by heating for 2 minutes.

然後,將膨脹後的微球置於量瓶中,利用水中置換法測定真比重。Then, the expanded microspheres were placed in a measuring flask, and the true specific gravity was measured by a water displacement method.

算出膨脹前的熱膨脹性微球的真比重相對於熱膨脹後的微球的真比重的比率,將其乘以100得到的值作為熱膨脹率。The ratio of the true specific gravity of the thermally expandable microspheres before expansion to the true specific gravity of the microspheres after thermal expansion was calculated, and the value obtained by multiplying this by 100 was taken as the thermal expansion coefficient.

上述熱膨脹性微球的膨脹開始溫度並無特別限制,為80℃以上較佳,85℃~120℃更佳,為90℃~120℃時,形成易拆解層時不會發生膨脹,且不會引起2個以上的被黏體的熱損傷,在將該等2個以上的被黏體分離方面尤佳。此外,該「熱膨脹性微球的膨脹開始溫度」,係使用熱分析儀(「TMA/SS6100」、SII・Nanotechnology Inc.製),利用膨脹法(荷重:0.1N、探頭:3mmΦ、升溫速度:5℃/分)對熱膨脹性微球進行評價時的,熱膨脹性微球的膨脹開始時 的溫度。The expansion start temperature of the thermally expandable microspheres is not particularly limited, but is preferably 80 ° C or higher, more preferably 85 ° C to 120 ° C, and when it is 90 ° C to 120 ° C, expansion does not occur when an easily dismantleable layer is formed, and It may cause thermal damage to two or more adherends, and is particularly advantageous in separating the two or more adherends. The "expansion starting temperature of the thermally expandable microspheres" is a thermal analyzer ("TMA / SS6100", manufactured by SII · Nanotechnology Inc.), and the expansion method (load: 0.1N, probe: 3mmΦ, heating rate: 5 ° C / min) The temperature at which the expansion of the thermally expandable microspheres is evaluated when the thermally expandable microspheres are evaluated.

上述熱膨脹性微球的最大膨脹溫度並無特別限制,為90℃以上較佳,90℃~180℃更佳,為100℃以上~150℃時,不會引起2個以上的被黏體的熱損傷,在將該等2個以上的被黏體分離方面尤佳。此外,該「最大膨脹溫度」,係使用熱分析儀(「TMA/SS6100」、SII・Nanotechnology Inc.製),利用膨脹法(荷重:0.1N、探頭:3mmΦ、升溫速度:5℃/分)對熱膨脹性微球進行評價時的,熱膨脹性微球的膨脹為最大時的溫度。此外,加熱至比最大膨脹溫度更高的溫度的熱膨脹性微球,通常會產生收縮且膨脹率降低,因此不要加熱至比上述最大膨脹溫度更高的溫度較佳。The maximum expansion temperature of the thermally expandable microspheres is not particularly limited, but is preferably 90 ° C or higher, more preferably 90 ° C to 180 ° C, and when it is 100 ° C to 150 ° C, it does not cause heat of two or more adherends. Damage is particularly preferable in separating these two or more adherends. The "maximum expansion temperature" is a thermal analyzer ("TMA / SS6100", manufactured by SII · Nanotechnology Inc.), and the expansion method (load: 0.1N, probe: 3mmΦ, heating rate: 5 ° C / min) When the thermally expandable microspheres were evaluated, the temperature at which the expansion of the thermally expandable microspheres was the maximum. In addition, thermally expandable microspheres heated to a temperature higher than the maximum expansion temperature usually shrink and reduce the expansion rate. Therefore, it is better not to heat the microspheres to a temperature higher than the maximum expansion temperature.

此外,製造上述熱膨脹性微球時,其製造中所使用的膠囊的壁厚、氣化物質的含量等難以全部均勻化,因此其膨脹開始溫度及最大膨脹溫度通常具有一定的範圍。In addition, when the thermally expandable microspheres are manufactured, it is difficult to uniformize the wall thickness of the capsules used in the production and the content of the vaporized substance, and thus the expansion start temperature and the maximum expansion temperature usually have a certain range.

上述熱膨脹性微球的粒徑(膨脹前)並無特別限制,在進一步提高加熱後的易拆解層的拆解性,且實現易拆解層及雙面黏貼膠帶的薄型化方面,為1μm~50μm之範圍內較佳,3μm~30μm之範圍內更佳,5μm~20μm之範圍內尤佳。The particle diameter (before expansion) of the thermally expandable microspheres is not particularly limited. The particle size (before expansion) of the heat-expandable microspheres is further increased to 1 μm in order to further improve the disassembly property of the easily dismantleable layer after heating and to realize the thinning of the easily dismantleable layer and the double-sided adhesive tape. The range is preferably from 50 to 50 μm, more preferably from 3 to 30 μm, and even more preferably from 5 to 20 μm.

此外,上述熱膨脹性微球,通常為具有不同粒徑等的微球的集合。因此,測定該熱膨脹性微球的粒徑時,會得到一個分布(粒度分布)。本發明中,該熱膨脹性微球的粒徑(膨脹前),係使用Malvern Instruments製粒度分布測定儀「Mastersizer 2000」利用雷射繞射散射法進行10次測定而得到的基於10個粒度分布之10點之極大值的最大值與最小值以範圍來表示。具體而言,熱膨脹性微球的粒徑(膨脹前),基於使用上述方法進行10次測定而得到之10個粒度分布之10點之極大值的最大值為15μm,其最小值為9μm時,該熱膨脹性微球的粒徑(膨脹前)表示為9μm~15μm。The thermally expandable microspheres are generally a collection of microspheres having different particle sizes and the like. Therefore, when the particle diameter of the thermally expandable microspheres is measured, a distribution (particle size distribution) is obtained. In the present invention, the particle diameter (before expansion) of the thermally expandable microspheres is a particle size distribution based on 10 particle size distributions obtained by measuring 10 times using a laser diffraction scattering method using a particle size distribution measuring instrument "Mastersizer 2000" made by Malvern Instruments. The maximum and minimum values of the maximum value of 10 points are expressed in a range. Specifically, the maximum value of the particle diameter (before expansion) of the thermally expandable microspheres based on the 10 particle size distributions obtained by measuring 10 times using the above method is 15 μm, and when the minimum value is 9 μm, The particle diameter (before expansion) of this thermally expandable microsphere is 9 μm to 15 μm.

上述熱膨脹性微球,例如可使用於具有彈性的膠囊內含有因熱而氣化之物質者。The heat-expandable microspheres can be used, for example, in cases where a capsule having elasticity contains a substance that is vaporized by heat.

上述因熱而氣化之物質,使用藉由加熱至80℃~150℃左右而氣化的物質較佳,具體而言使用丁烷、異丁烷、丙烷、異戊烷、異辛烷等較佳。It is preferable to use a substance that is vaporized by heating to a temperature of about 80 ° C to 150 ° C. Specifically, butane, isobutane, propane, isopentane, isooctane, etc. are used. good.

上述具有彈性的膠囊,例如可使用由藉由加熱至90℃~150℃左右而軟化的物質所構成者,具體而言可列舉由偏二氯乙烯-丙烯腈共聚物、聚乙烯醇、聚乙烯醇縮丁醛、聚甲基丙烯酸甲酯、聚丙烯腈、聚偏二氯乙烯、聚碸等所構成的膠囊狀物。The above-mentioned elastic capsule can be made of, for example, a material which is softened by heating to about 90 ° C to 150 ° C. Specific examples include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, and polyethylene. Capsules made of butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polyfluorene, etc.

上述熱膨脹性微球,例如可使用凝聚法(Coacervation method)、界面聚合法等公知慣用的方法進行製造。The thermally expandable microspheres can be produced by a known and commonly used method such as a Coacervation method and an interfacial polymerization method.

上述熱膨脹性微球,例如,亦可使用「Matsumoto microsphere」(商品名,松本油脂製藥(股)製)、「Microsphere Expancel」(商品名,Japan Fillite co., ltd.製)、「DAIFOAM」(商品名,大日精化工業(股)製)等市售品。For the thermally expandable microspheres, for example, "Matsumoto microsphere" (trade name, manufactured by Matsumoto Oil & Fats Pharmaceutical Co., Ltd.), "Microsphere Expancel" (trade name, manufactured by Japan Fillite co., Ltd.), And "DAIFOAM" ( Trade names such as Daiichi Seika Chemical Industry Co., Ltd.).

上述熱膨脹性微球之含量(調配量),在能兼顧與黏貼劑層的良好的黏著性及易拆解性方面,相對於上述易拆解層中所含有的上述黏結劑100重量份宜為1質量份~100質量份較佳,3質量份~50質量份更佳,5質量份~30質量份尤佳。The content (mixed amount) of the thermally expandable microspheres, in consideration of good adhesion to the adhesive layer and ease of disassembly, is preferably 100 parts by weight with respect to 100 parts by weight of the adhesive contained in the easily dissolvable layer. 1 to 100 parts by mass is preferred, 3 to 50 parts by mass is more preferred, and 5 to 30 parts by mass is particularly preferred.

[黏貼劑層] 黏貼劑層20,21係與被黏體接著的層。構成黏貼劑層20,21的黏貼劑,可使用含有天然橡膠系聚合物、合成橡膠系聚合物、丙烯酸系聚合物、矽氧系聚合物、胺甲酸乙酯系聚合物、乙烯醚系聚合物等的物質。該黏貼劑的形態,可列舉溶劑系;乳液型黏貼劑、水溶性黏貼劑等水系;熱熔型黏貼劑、UV硬化型黏貼劑、EB硬化型黏貼劑等無溶劑系等。[Adhesive agent layer] The adhesive agent layers 20 and 21 are layers adhered to the adherend. As the adhesive constituting the adhesive layers 20 and 21, natural rubber-based polymers, synthetic rubber-based polymers, acrylic polymers, silicone polymers, urethane-based polymers, and vinyl ether-based polymers can be used. And other substances. Examples of the form of the adhesive include solvent-based systems; water-based systems such as emulsion-type adhesives and water-soluble adhesives; solvent-free systems such as hot-melt adhesives, UV-curable adhesives, and EB-curable adhesives.

上述黏貼劑層20,21含有丙烯酸系共聚物較佳。丙烯酸系共聚物,為具有親水性的(甲基)丙烯酸與可與其共聚的其他單體的共聚物,可列舉使(甲基)丙烯酸與乙烯醚反應而得到的(甲基)丙烯酸酯等。It is preferable that the said adhesive layer 20 and 21 contains an acrylic copolymer. The acrylic copolymer is a copolymer of (meth) acrylic acid having hydrophilicity and other monomers copolymerizable therewith, and examples thereof include (meth) acrylic acid esters obtained by reacting (meth) acrylic acid with vinyl ether.

黏貼劑層的厚度為5μm~100μm較佳,10μm~80μm更佳,30μm~70μm尤佳。黏貼劑層的厚度為上述範圍時,層的形成容易,且被黏體彼此的接著性亦優異因而較佳。The thickness of the adhesive layer is preferably 5 μm to 100 μm, more preferably 10 μm to 80 μm, and even more preferably 30 μm to 70 μm. When the thickness of the adhesive layer is in the above range, it is preferable to form the layer easily, and the adherence between the adherends is also excellent.

黏貼劑層20,21,必要時亦可含有增黏樹脂、交聯劑、其他添加劑等。The adhesive agent layers 20 and 21 may contain a tackifier resin, a cross-linking agent, and other additives, if necessary.

上述增黏樹脂,以調節黏貼劑層的強接著性為目的,例如,可例示松香系增黏樹脂、聚合松香系增黏樹脂、聚合松香酯系增黏樹脂、松香酚系增黏樹脂、穩定化松香酯增黏樹脂、歧化松香酯增黏樹脂、萜烯系增黏樹脂、萜烯酚系增黏樹脂、石油樹脂系增黏樹脂等。The tackifying resin is for the purpose of adjusting the strong adhesion of the adhesive layer. For example, rosin-based tackifying resin, polymerized rosin-based tackifying resin, polymerized rosin-ester-based tackifying resin, rosin-phenol-based tackifying resin, and the like Rosin ester tackifying resin, disproportionated rosin ester tackifying resin, terpene based tackifying resin, terpene phenol based tackifying resin, petroleum resin based tackifying resin, etc.

上述交聯劑,以提高黏貼劑層的內聚力為目的,可使用公知的異氰酸酯系交聯劑、環氧系交聯劑、氮丙啶系交聯劑、多價金屬鹽系交聯劑、金屬螯合物系交聯劑、酮・醯肼系交聯劑、噁唑啉系交聯劑、碳二亞胺系交聯劑、矽烷系交聯劑、縮水甘油(烷氧基)環氧矽烷系交聯劑等。The cross-linking agent may be a known isocyanate-based cross-linking agent, epoxy-based cross-linking agent, aziridine-based cross-linking agent, polyvalent metal salt-based cross-linking agent, or metal for the purpose of improving the cohesion of the adhesive layer. Chelate-based cross-linking agent, ketone and hydrazine-based cross-linking agent, oxazoline-based cross-linking agent, carbodiimide-based cross-linking agent, silane-based cross-linking agent, glycidyl (alkoxy) epoxysilane Department of cross-linking agents.

上述添加劑,在不損害本發明所期望的效果的範圍內,必要時可於黏貼劑中任意添加為調節pH的鹼(氨水等)或酸、發泡劑、增塑劑、軟化劑、抗氧化劑、玻璃或塑膠製的纖維・氣球・珠粒・金屬粉末等填充劑、顏料・染料等著色劑、pH調節劑、成膜助劑、流平劑、增稠劑、防水劑、消泡劑等公知的物質。又,亦可添加酸觸媒、產酸劑。The above-mentioned additives can be optionally added to the adhesive to adjust the pH (such as ammonia) or acid, foaming agent, plasticizer, softener, and antioxidant to the extent that the desired effect of the present invention is not impaired. , Glass or plastic fibers, balloons, beads, metal powders and other fillers, pigments and dyes, colorants, pH adjusters, film-forming aids, leveling agents, thickeners, waterproofing agents, defoamers, etc. Well-known substance. Moreover, an acid catalyst and an acid generator may be added.

上述酸觸媒、產酸劑,例如可以藉由光、熱的外部刺激而產生拆解性為目的而使用。該酸觸媒、產酸劑,可使用與作為上述易拆解層中可使用者所例示的物質同樣的物質。The acid catalyst and the acid generator can be used for the purpose of generating disassembly by external stimulus of light and heat, for example. As the acid catalyst and the acid generator, the same substances as those exemplified by the user in the easily dismantleable layer can be used.

於上述黏貼劑層的形成中可使用的上述黏貼劑,在保持良好的塗布加工性等方面,可使用含有溶劑者。該溶劑,例如,可使用甲苯、二甲苯、乙酸乙酯、乙酸丁酯、丙酮、甲乙酮、己烷等。又,使用水系黏貼劑作為該黏貼劑時,可使用水、或以水為主體的水性溶劑作為該溶劑。The said adhesive agent which can be used for formation of the said adhesive agent layer can use the thing containing a solvent in order to maintain favorable coating processability. Examples of the solvent include toluene, xylene, ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, and hexane. When an aqueous adhesive is used as the adhesive, water or an aqueous solvent mainly composed of water can be used as the solvent.

就剝離片30及31而言,例如,可列舉玻璃紙、牛皮紙、黏土塗布紙、將聚乙烯等的膜層壓而形成的紙、塗布聚乙烯醇或丙烯酸酯共聚物等樹脂的紙、於聚酯或聚丙烯等合成樹脂膜等上塗布係剝離劑的氟樹脂或矽氧樹脂等而形成的紙等。Examples of the release sheets 30 and 31 include cellophane, kraft paper, clay-coated paper, paper formed by laminating a film such as polyethylene, paper coated with a resin such as polyvinyl alcohol or an acrylate copolymer, and polymerized paper. Paper made by coating a release agent such as fluororesin or silicone resin on a synthetic resin film such as an ester or polypropylene.

本實施方式之雙面黏貼膠帶所具有的一對黏貼劑層,可分別為相同的構造,亦可分別為不同的構造。The pair of adhesive layers of the double-sided adhesive tape of this embodiment may have the same structure, or may have different structures.

本實施方式之雙面黏貼膠,由於易拆解層中含有熱膨脹性微球,藉由加熱會發生易拆解層中所含有之黏結劑的軟化,及該熱膨脹性微球的膨脹,其結果為,相較於使用不含有熱膨脹性填充物的易拆解層的情況,用較弱的力即可拆解被黏體彼此的接著。Since the double-sided adhesive of this embodiment contains thermally expandable microspheres in the easy-to-disassemble layer, the softening of the adhesive contained in the easy-to-dissolve layer and the expansion of the thermally-expandable microspheres occur by heating. As a result, Because, compared with the case of using an easily dismantleable layer that does not contain a thermally expandable filler, the adhesion of the adherends can be disassembled with a weaker force.

<第2實施方式> 圖2係根據本發明之雙面黏貼膠帶之實施方式之一例。雙面黏貼膠帶2,於含有黏結劑11及熱膨脹性微球12之易拆解層10之兩面側具有黏貼劑層20,21,於該易拆解層與黏貼劑層之間之兩者具有基底膜40,41。於黏貼劑層20,21上,可分別層疊剝離片30,31。<Second Embodiment> Fig. 2 is an example of an embodiment of a double-sided adhesive tape according to the present invention. The double-sided adhesive tape 2 has adhesive layers 20 and 21 on both sides of the easy-to-disassemble layer 10 containing the adhesive 11 and the heat-expandable microspheres 12, and both of the easy-to-remove layer and the adhesive layer have Base film 40,41. On the adhesive layers 20 and 21, peeling sheets 30 and 31 may be laminated, respectively.

第2實施方式之雙面黏貼膠帶,係上述<第1實施方式>之雙面黏貼膠帶於上述易拆解層與上述黏貼劑層之間之兩者進一步具有基底膜40,41者。此外,關於與該<第1實施方式>共同的點,其說明將省略。The double-sided adhesive tape of the second embodiment is one in which the double-sided adhesive tape of the above-mentioned <1st Embodiment> further has a base film 40, 41 between the easily dismantleable layer and the adhesive layer. It should be noted that descriptions of points common to the first embodiment will be omitted.

上述基底膜例如可列舉由聚烯烴(例如,聚丙烯、聚乙烯)、聚酯(例如,聚對苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯)、聚苯乙烯、丙烯腈-丁二烯-苯乙烯樹脂(ABS樹脂)、聚碳酸酯、聚醯亞胺、聚氯乙烯、尼龍、聚乙烯醇等構成的塑膠系膜;使用紙漿、人造絲、馬尼拉麻、丙烯腈、尼龍、聚酯等得到的不織布、紙、布、或金屬箔等。Examples of the base film include polyolefin (for example, polypropylene, polyethylene), polyester (for example, polyethylene terephthalate, polyethylene naphthalate), polystyrene, and acrylonitrile. -Butadiene-styrene resin (ABS resin), polycarbonate, polyimide, polyvinyl chloride, nylon, polyvinyl alcohol, etc .; plastic film; using pulp, rayon, manila hemp, acrylonitrile, Non-woven fabric, paper, cloth, or metal foil obtained from nylon, polyester, or the like.

上述基底膜,於藉由雙面黏貼膠帶貼合的被黏體彼此拆解且易拆解層斷裂後,將雙面黏貼膠帶從被黏體剝離時,可發揮作為支撐體的作用。The base film can serve as a support when the adherends affixed by the double-sided adhesive tape are detached from each other and the easy-to-disassemble layer is broken, and the double-sided adhesive tape is peeled from the adherend.

故,考量易兼顧基底膜與雙面黏貼膠帶的其他層的接著性(本實施方式中,為基底膜40,41與黏貼劑層20,21的接著性)及作為支撐體的強度的方面,塑膠系膜較佳,聚酯膜更佳。Therefore, it is easy to consider the adhesion between the base film and other layers of the double-sided adhesive tape (adhesion between the base films 40 and 41 and the adhesive layers 20 and 21 in this embodiment) and the strength as a support. Plastic film is better, polyester film is better.

又,以提高上述基底膜與黏貼劑層的黏著性為目的,可於基底膜的一面或兩面,施行電暈處理、電漿處理、錨塗層處理等。In addition, for the purpose of improving the adhesion between the base film and the adhesive layer, corona treatment, plasma treatment, anchor coating treatment and the like can be performed on one or both sides of the base film.

本實施方式之雙面黏貼膠帶,藉由加熱造成易拆解層中所含有的黏結劑發生軟化,且上述熱膨脹性微球發生膨脹,上述易拆解層的內聚力顯著降低且可輕易地拆解,因此上述加熱後,幾乎不用施加力即可拆解雙面黏貼膠帶,並將2個以上的被黏體彼此分離。In the double-sided adhesive tape of this embodiment, the adhesive contained in the easy-to-disassemble layer is softened by heating, and the thermally expandable microspheres are expanded. The cohesive force of the easy-to-disassemble layer is significantly reduced and can be easily disassembled. Therefore, after the above heating, the double-sided adhesive tape can be disassembled with almost no force, and two or more adherends can be separated from each other.

又,第2實施方式之雙面黏貼膠帶,進一步於易拆解與黏貼劑層之間具有基底膜。拆除後的雙面黏貼膠帶,有時會有雙面黏貼膠帶的殘渣殘留在被黏體上的情況。特別是於具有如易拆解層的易拆解性的脆弱的層的雙面黏貼膠帶中,有時會有難以除去被黏體上所殘留的雙面黏貼膠帶的殘渣的情況。但,本實施方式之雙面黏貼膠帶,進一步於易拆解與黏貼劑層之間具有基底膜,因此藉由握持基底膜部分並拉扯等,可輕易地將拆解後的雙面黏貼膠帶的殘渣全體從被黏體剝下。In addition, the double-sided adhesive tape of the second embodiment further has a base film between the easily detachable and the adhesive layer. After the removal of the double-sided adhesive tape, the residue of the double-sided adhesive tape may sometimes remain on the adherend. In particular, in a double-sided adhesive tape having a fragile layer such as an easy-to-disassemble layer, it may be difficult to remove the residue of the double-sided adhesive tape remaining on the adherend. However, the double-sided adhesive tape of this embodiment further has a base film between the easy-to-remove and the adhesive layer, so by holding the base film portion and pulling, etc., the disassembled double-sided adhesive tape can be easily The whole residue was peeled from the slime.

此外,本實施方式中,例示了由含有黏結劑11及熱膨脹性微球12的易拆解層10、黏貼劑層20,21、基底膜40,41、及剝離片30,31構成的雙面黏貼膠帶,該等的層構造之外,亦可進一步具有任意的層構造。In addition, in this embodiment, a double-sided surface composed of an easily detachable layer 10 containing an adhesive 11 and thermally expandable microspheres 12, an adhesive layer 20, 21, a base film 40, 41, and a release sheet 30, 31 is exemplified. In addition to such a layer structure, an adhesive tape may further have an arbitrary layer structure.

例如,本發明之雙面黏貼膠帶,可使用於上述基底膜40,41與黏貼劑層20,21之間,或上述基底膜40,41與易拆解層10之間具有發泡體(foam材料)層者。該發泡體層發揮緩衝的作用,可對於具有發泡體層的雙面黏貼膠帶賦予緩衝性。For example, the double-sided adhesive tape of the present invention can be used with a foam (foam) between the above-mentioned base films 40, 41 and the adhesive layer 20, 21, or between the above-mentioned base films 40, 41 and the easily dismantleable layer 10. Material). This foam layer functions as a cushion and can provide cushioning properties to a double-sided adhesive tape having a foam layer.

本發明之雙面黏貼膠帶,例如可適合地使用於作為被黏體的剛體與剛體的接著、剛體與剛體彼此的分離。剛體的被黏體,例如可列舉金屬板、金屬框體、金屬蓋、玻璃板、塑膠板等。藉由本發明之雙面黏貼膠帶接著的2個以上的被黏體,可為相同種類的被黏體,亦可為不同種類的被黏體。又,藉由本發明之雙面黏貼膠帶接著及分離的被黏體彼此可為相同種類的被黏體,亦可為不同種類的被黏體。The double-sided adhesive tape of the present invention can be suitably used, for example, for bonding rigid bodies and rigid bodies as adherends, and for separating rigid bodies and rigid bodies from each other. Examples of rigid bodies to be adhered include metal plates, metal frames, metal covers, glass plates, and plastic plates. The two or more adherends adhered by the double-sided adhesive tape of the present invention may be the same kind of adherends or different kinds of adherends. In addition, the adherends adhered and separated by the double-sided adhesive tape of the present invention may be the same kind of adherends, or may be different kinds of adherends.

本發明之雙面黏貼膠帶,可於再利用、回收時的構件間分離時藉由加熱輕易地進行拆解。因此,可適合地用作進行汽車、建材、OA、家電業界等工業用途中的各種產品的零件間固定的雙面黏貼膠帶。進行再利用、回收時的大量的零件的分離、大量的標籤剝離等時亦具有良好的工作效率。The double-sided adhesive tape of the present invention can be easily disassembled by heating during separation between components during reuse and recycling. Therefore, it can be suitably used as a double-sided adhesive tape for fixing various parts of various products in industrial applications such as the automobile, building materials, OA, and home appliance industries. It also has good working efficiency when recycling, separating a large number of parts during recycling, and peeling a large number of labels.

本發明之雙面黏貼膠帶,亦可藉由較低的加熱溫度實現拆解。因此,特別適合地用作進行擔心因熱而引起零件的劣化的手機、影像顯示設備、電腦等電器產品的零件間固定的雙面黏貼膠帶。The double-sided adhesive tape of the present invention can also be disassembled by a lower heating temperature. Therefore, it is particularly suitable for use as a double-sided adhesive tape that is fixed between parts of an electric product such as a mobile phone, an image display device, and a computer that are likely to be deteriorated by heat.

《雙面黏貼膠帶之製造方法》 本發明之雙面黏貼膠帶之製造方法,係製作含有黏結劑及熱膨脹性微球的易拆解層,於該易拆解層的其中一側貼合其中一黏貼劑層,然後,於該易拆解層的另一側貼合另一黏貼劑層。"Manufacturing method of double-sided adhesive tape" The manufacturing method of the double-sided adhesive tape of the present invention is to produce an easily dismantleable layer containing an adhesive and thermally expandable microspheres, and attach one of them to one side of the easily dismantleable layer. The adhesive layer is then bonded to another adhesive layer on the other side of the easily dismantleable layer.

圖3係根據本發明之雙面黏貼膠帶之製造方法之實施方式之一例。首先,準備構成黏貼劑層的黏貼劑、構成易拆解層的黏結劑及熱膨脹性微球的混合物。然後,如圖3所示,使用塗抹機,於剝離片32,34上塗布黏貼劑而形成黏貼劑層20,21,於剝離片33上塗布黏結劑及熱膨脹性微球的混合物而形成易拆解層10。然後,於易拆解層10的一面貼合黏貼劑層20後,於易拆解層10的另一面貼合黏貼劑層21,得到本發明之雙面黏貼膠帶。FIG. 3 is an example of an embodiment of a method for manufacturing a double-sided adhesive tape according to the present invention. First, a mixture of an adhesive constituting an adhesive layer, an adhesive constituting an easily dismantleable layer, and a thermally expandable microsphere is prepared. Then, as shown in FIG. 3, using an applicator, an adhesive is applied to the release sheets 32, 34 to form an adhesive layer 20, 21, and a mixture of an adhesive and a heat-expandable microsphere is applied to the release sheet 33 to form a detachable sheet.解 层 10。 Layer 10. Then, the adhesive layer 20 is adhered on one side of the easy-to-disassemble layer 10, and then the adhesive layer 21 is adhered on the other side of the easy-to-disassemble layer 10 to obtain the double-sided adhesive tape of the present invention.

上述雙面黏貼膠帶的製造,在抑制上述熱膨脹性微球的膨脹方面,於80℃以下的溫度進行較佳,於40℃~80℃的溫度進行較佳,於50℃~80℃的範圍進行更佳。The production of the double-sided adhesive tape is preferably performed at a temperature of 80 ° C or lower in terms of suppressing the expansion of the thermally expandable microspheres, preferably at a temperature of 40 ° C to 80 ° C, and at a temperature of 50 ° C to 80 ° C. Better.

本實施方式之雙面黏貼膠帶之製造方法中,製造的雙面黏貼膠帶的2層黏貼劑層20,21為相同的構造,因此藉由將易拆解層與黏貼劑層個別成形並貼合,黏貼劑層的成形步驟可為一次,可以良好效率製造雙面黏貼膠帶。In the manufacturing method of the double-sided adhesive tape of this embodiment, the two adhesive layers 20 and 21 of the manufactured double-sided adhesive tape have the same structure. Therefore, the easily dismantleable layer and the adhesive layer are individually formed and bonded together. The forming step of the adhesive layer can be performed once, and the double-sided adhesive tape can be manufactured with good efficiency.

《接著方法・分離方法》 本發明之接著方法係將被黏體彼此藉由本發明之雙面黏貼膠帶進行貼合。<< Adhering method and separating method >> The adhering method of the present invention is to adhere the adherends to each other by the double-sided adhesive tape of the present invention.

又,本發明之分離方法,係將上述易拆解層加熱,並將已藉由本發明之接著方法貼合的上述被黏體彼此分離。In the separation method of the present invention, the easily dismantleable layer is heated, and the adherends that have been attached by the adhesion method of the present invention are separated from each other.

圖4係根據本發明之接著方法之實施方式之一例。如圖4所示,使被黏體50,51接觸雙面黏貼膠帶的兩面的黏貼劑層20,21,使被黏體彼此貼合而接著。FIG. 4 is an example of an embodiment of a bonding method according to the present invention. As shown in FIG. 4, the adherends 50 and 51 are brought into contact with the adhesive layers 20 and 21 on both sides of the double-sided adhesive tape, and the adherends are adhered to each other and then adhered.

圖5係根據本發明之分離方法之實施方式之一例。FIG. 5 is an example of an embodiment of the separation method according to the present invention.

首先,將雙面黏貼膠帶加熱。雙面黏貼膠帶的加熱亦可藉由將已貼合的上述被黏體及雙面黏貼膠帶全體加熱而進行。然後,易拆解層10之黏結劑11因熱而發生軟化,且熱膨脹性微球12發生膨脹。此時藉由沿使被黏體50,51彼此分離的方向對雙面黏貼膠帶施加力,而對雙面黏貼膠帶施加剝離應力。由於本發明之雙面黏貼膠帶之易拆解層中含有熱膨脹性微球,熱膨脹性微球因加熱等而發生膨脹時,能使被黏體彼此輕易地分離。First, heat the double-sided adhesive tape. The heating of the double-sided adhesive tape can also be performed by heating the entire adherend and the double-sided adhesive tape. Then, the adhesive 11 of the easy-to-disassemble layer 10 is softened by heat, and the thermally expandable microspheres 12 are expanded. At this time, by applying a force to the double-sided adhesive tape in a direction separating the adherends 50 and 51 from each other, a peeling stress is applied to the double-sided adhesive tape. Since the easily dismantleable layer of the double-sided adhesive tape of the present invention contains thermally expandable microspheres, when the thermally expandable microspheres expand due to heating or the like, the adherends can be easily separated from each other.

圖6係示意性地表示本發明之分離方法與別種方法中,被黏體的分離的狀態的一例的圖。圖6(a)為本發明之分離方法之一例,表示雙面黏貼膠帶之易拆解層10中含有熱膨脹性微球12的情況。圖6(b)表示雙面黏貼膠帶之易拆解層10中不含有熱膨脹性微球12的情況。FIG. 6 is a diagram schematically showing an example of the state of separation of adherends in the separation method and other methods of the present invention. FIG. 6 (a) is an example of the separation method of the present invention, and shows the case where the thermally expandable microspheres 12 are contained in the easy-to-disassemble layer 10 of the double-sided adhesive tape. FIG. 6 (b) shows a case where the easily removable layer 10 of the double-sided adhesive tape does not contain the thermally expandable microspheres 12.

如圖6(b)所示,易拆解層10中不含有熱膨脹性微球12時,對黏結劑11所施加的應力分散,黏結劑11的層難以拆解。As shown in FIG. 6 (b), when the thermally expansible microspheres 12 are not contained in the easily dismantleable layer 10, the stress applied to the adhesive 11 is dispersed, and the layer of the adhesive 11 is difficult to disassemble.

另一方面,本發明之分離方法中,由於雙面黏貼膠帶之易拆解層10中含有熱膨脹性微球12,藉由熱膨脹性微球12因加熱而發生膨脹,如圖6(a)所示,對黏結劑11所施加的應力集中,相較於易拆解層中不含有熱膨脹性微球12的情況,以較小的力即可拆解易拆解層,其結果為可輕易地分離2個以上的被黏體。On the other hand, in the separation method of the present invention, since the easy-to-remove layer 10 of the double-sided adhesive tape contains thermally expandable microspheres 12, the thermally expandable microspheres 12 expand due to heating, as shown in FIG. 6 (a). It is shown that the stress concentration applied to the adhesive 11 can be disassembled with a smaller force compared with the case where the thermally expansible microsphere 12 is not contained in the easily disassembled layer, and the result is that the layer can be easily disassembled. Separate 2 or more adherends.

上述分離方法中進行的加熱,可因應使用的熱膨脹性微球、作業環境進行適宜選擇,於85℃~150℃較佳,90℃~120℃更佳。本發明之雙面黏貼膠帶,於通常的使用環境(大概80℃以下)下不會發生拆解等,可牢固地接著被黏體彼此,另一方面,於上述以上的溫度加熱時,易拆解層可輕易地拆解,其結果為可輕易地分離被黏體。The heating performed in the above separation method can be appropriately selected according to the thermally expandable microspheres used and the operating environment, and is preferably 85 ° C to 150 ° C, and more preferably 90 ° C to 120 ° C. The double-sided adhesive tape of the present invention does not disassemble under normal use conditions (about 80 ° C or lower), and can be firmly adhered to each other. On the other hand, it is easy to detach when heated at the above temperature The delamination layer can be easily disassembled, and as a result, the adherend can be easily separated.

上述加熱方法,例如可列舉使用乾燥機、鹵素燈直接或間接地加熱上述雙面黏貼膠帶的方法。Examples of the heating method include a method of directly or indirectly heating the double-sided adhesive tape using a dryer or a halogen lamp.

上述加熱時,可使鹵素燈接近或接觸上述雙面黏貼膠帶,亦可藉由使鹵素燈接近或接觸被黏體而間接加熱該黏貼膠帶。例如,該雙面黏貼膠帶的端部比該被黏體的端部還要露出於外側時,可使鹵素燈接近或接觸該雙面黏貼膠帶的端部。During the heating, the halogen lamp can be brought close to or in contact with the double-sided adhesive tape, and the halogen lamp can also be indirectly heated by bringing the halogen lamp close to or contacting the adherend. For example, when the end of the double-sided adhesive tape is exposed to the outside than the end of the adherend, the halogen lamp can be made to approach or contact the end of the double-sided adhesive tape.

於上述加熱步驟,使用裝備有鹵素燈等的加熱裝置,將上述雙面黏貼膠帶的溫度加熱至80℃~130℃較佳,加熱至85℃~125℃更佳,加熱至90℃~120℃尤佳。又,該加熱於20秒以內進行較佳,15秒以內更佳,10秒以內的較短時間尤佳。In the above heating step, using a heating device equipped with a halogen lamp or the like, the temperature of the double-sided adhesive tape is preferably heated to 80 ° C to 130 ° C, more preferably to 85 ° C to 125 ° C, and heated to 90 ° C to 120 ° C. It's better. The heating is preferably performed within 20 seconds, more preferably within 15 seconds, and even more preferably a shorter time within 10 seconds.

具體而言,使用上述鹵素燈、乾燥機的加熱步驟為於20秒以內使上述雙面黏貼膠帶的溫度成為100℃的步驟的話,可提高物品的拆解效率,且可防止被黏體的熱變形等,因此為較佳。Specifically, if the heating step using the halogen lamp and dryer is a step of making the temperature of the double-sided adhesive tape to 100 ° C within 20 seconds, the disassembly efficiency of the article can be improved, and the heat of the adherend can be prevented. Deformation and the like are preferred.

又,裝備有鹵素燈的加熱裝置,例如可使用能於短時間加熱一定面積的“平行光型鹵素燈加熱器”、可局部加熱的集光型鹵素燈等,使用平行光型鹵素燈加熱器時,可一次加熱大範圍,因此可將加熱時間縮短至上述時間。In addition, a heating device equipped with a halogen lamp can be used, for example, a "parallel-type halogen lamp heater" capable of heating a certain area in a short time, a locally-collectable halogen-type halogen lamp, etc., and a parallel-type halogen lamp heater. It can heat a wide range at one time, so the heating time can be shortened to the above time.

上述平行光型鹵素燈加熱器一次可加熱的面積,為10cm2 ~500cm2 左右較佳。又,平行光型鹵素燈加熱器等加熱裝置為可攜帶的大小及重量的話,在提高上述物品的拆解作業的效率方面較佳。該重量為3kg以下較佳,2kg以下更佳,0.1kg~1kg尤佳。The area that the parallel light type halogen lamp heater can heat at one time is preferably about 10 cm 2 to 500 cm 2 . In addition, if the heating device such as a parallel light type halogen lamp heater is portable in size and weight, it is preferable to improve the efficiency of disassembling the article. The weight is preferably 3 kg or less, more preferably 2 kg or less, and more preferably 0.1 kg to 1 kg.

以上述方法加熱的上述物品,即使對構成該物品的2個以上的被黏體幾乎不施加力,或施加較弱的力即可輕易地拆解。The article heated by the method described above can be easily disassembled even if little or no force is applied to the two or more adherends constituting the article.

本發明之雙面黏貼膠帶,於60℃以下的溫度範圍下具有非常優異的接著力,因此例如可使用於構成具備複印功能、掃描功能的複印機、多功能機等電子裝置的透明頂板與其框體的固定。The double-sided adhesive tape of the present invention has very good adhesion in a temperature range of 60 ° C. or lower, and therefore, it can be used, for example, to form a transparent top plate and a housing of an electronic device such as a copier, a multifunction machine and the like having a copy function and a scan function. Fixed.

上述透明頂板,可使用一般的搭載有複印機能、掃描功能的複印機、多功能機中所設置的透明頂板。The transparent top plate may be a transparent top plate provided in a general copier or multifunction machine equipped with a copier function and a scanning function.

上述透明頂板,例如可使用由玻璃或塑膠製成的透明板狀剛體。該塑膠,例如可使用壓克力板、聚碳酸酯板等。As the transparent top plate, for example, a transparent plate-shaped rigid body made of glass or plastic can be used. The plastic may be, for example, an acrylic plate or a polycarbonate plate.

上述透明頂板,可使用與設置有該透明頂板的複印機等的形狀吻合者,通常使用正方形或長方形者較佳。The above-mentioned transparent top plate may be a shape matching a shape of a copier or the like provided with the transparent top plate, and generally a square or rectangular shape is preferred.

上述雙面黏貼膠帶,例如若為長方形的上述透明頂板時,宜沿著相對的兩邊的端部進行貼附較佳。此時,該黏貼膠帶可使用裁切成因應該透明頂板的邊的長度之大小者,例如使用寬度為0.5mm~20mm、長度為0.1mm~2.0mm者較佳。For the double-sided adhesive tape, for example, if the rectangular transparent top plate is rectangular, it is better to stick along the opposite ends. In this case, the adhesive tape may be cut to have a size corresponding to the length of the side of the transparent top plate, and for example, a width of 0.5 mm to 20 mm and a length of 0.1 mm to 2.0 mm are preferred.

又,本發明之雙面黏貼膠帶,可專門使用於構成便攜式電子裝置的構件的固定。該構件例如可列舉構成電子裝置的2個以上的框體或透鏡構件。In addition, the double-sided adhesive tape of the present invention can be used exclusively for fixing members constituting a portable electronic device. Examples of the member include two or more housings or lens members constituting the electronic device.

上述便攜式電子裝置,例如可列舉具有作為上述構件之框體與透鏡構件或其他框體之一者介隔上述雙面黏貼膠帶而接合的結構者。Examples of the portable electronic device include a structure in which the frame body as the member and one of the lens member or another frame body are joined via the double-sided adhesive tape.

上述構件的固定,例如,可列舉將上述框體或透鏡構件之一者與其他框體或透鏡構件介隔上述雙面黏貼膠帶進行層疊後,使其熟化一定期間的方法。The fixing of the member includes, for example, a method of laminating one of the frame body or lens member and the other frame body or lens member with the double-sided adhesive tape interposed therebetween, and then curing the member for a certain period of time.

圖7係根據本發明之分離方法之實施方式之一例。首先,實施上述圖6所示之分離方法。此時於被黏體50,51上,殘留有拆解後的雙面黏貼膠帶的殘渣。然後,將雙面黏貼膠帶冷卻。然後,可藉由拉扯基底膜41的部分,以基底膜與雙面黏貼膠帶的其他層成為一體的狀態,將雙面黏貼膠帶的殘渣全體從被黏體剝下。FIG. 7 is an example of an embodiment of the separation method according to the present invention. First, the separation method shown in FIG. 6 is performed. At this time, residues of the disassembled double-sided adhesive tape remain on the adherends 50 and 51. Then, cool the double-sided adhesive tape. Then, the entire part of the double-sided adhesive tape can be peeled off from the adherend by pulling the part of the base film 41 in a state where the base film and the other layers of the double-sided adhesive tape are integrated.

冷卻只要是適當冷卻至因加熱而軟化的雙面黏貼膠帶的殘渣中的黏結劑的軟化程度降低且易除去處理雙面黏貼膠帶的殘渣的狀態的溫度即可,35℃以下較佳,25℃以下更佳。 【實施例】The cooling may be performed at a temperature appropriately reduced to a state in which the softening degree of the adhesive in the residue of the double-sided adhesive tape softened by heating is reduced and the residue of the double-sided adhesive tape is easily removed. The temperature is preferably 35 ° C or lower, 25 ° C. The following is better. [Example]

[製造例1] 易拆解層(1) 以重量平均分子量為20萬的苯乙烯-異戊二烯嵌段共聚物S(三嵌段共聚物與二嵌段共聚物的混合物。該二嵌段共聚物相對於該混合物之總量的所占比例為52質量%。聚苯乙烯單元相對於該苯乙烯-異戊二烯嵌段共聚物之全體的所占質量比例為15質量%,聚異戊二烯單元的質量比例為85質量%)100質量份、C5石油系增黏樹脂(軟化點100℃、數量平均分子量885)40質量份、聚合松香酯系增黏樹脂(軟化點125℃、數量平均分子量880)30質量份、作為液狀增黏樹脂的HV-100(JX日礦日石(股)公司製,低分子量聚丁烯)5質量份、作為熱膨脹性微球的Matsumoto microsphere F-48 (松本油脂製藥(股)公司製,於120℃的熱膨脹率為370%,膨脹開始溫度為90℃~100℃,最大膨脹溫度為125℃~135℃,粒徑(膨脹前)為9μm~15μm)10質量份的調配比進行混合後溶解於甲苯中,藉此得到合成橡膠溶液。[Production Example 1] The easily dismantleable layer (1) was a styrene-isoprene block copolymer S (a mixture of a triblock copolymer and a diblock copolymer with a weight average molecular weight of 200,000. The proportion of the segment copolymer to the total amount of the mixture is 52% by mass. The proportion of the mass of the polystyrene unit to the entire styrene-isoprene block copolymer is 15% by mass. 100 parts by mass of isoprene units) 100 parts by mass of C5 petroleum-based tackifying resin (softening point 100 ° C, number average molecular weight 885) 40 parts by mass; polymerized rosin ester-based tackifying resin (softening point 125 ° C) , Mass average molecular weight 880) 30 parts by mass, 5 parts by mass of HV-100 (low molecular weight polybutene, manufactured by JX Nippon Nissei Co., Ltd.) as a liquid tackifying resin, and Matsumoto microsphere as a thermally expandable microsphere F-48 (manufactured by Matsumoto Oil & Fats Pharmaceutical Co., Ltd., with a thermal expansion rate of 370% at 120 ° C, an expansion start temperature of 90 ° C to 100 ° C, a maximum expansion temperature of 125 ° C to 135 ° C, and a particle size (before expansion) of (9 μm to 15 μm) 10 parts by mass of the blending ratio are mixed and dissolved in toluene, thereby obtaining a mixture Rubber solution.

以使乾燥後的厚度成為40μm的方式,將上述溶液使用塗抹機塗布於剝離片的表面,藉由於85℃乾燥5分鐘而製造易拆解層(1)。The solution was applied to the surface of a release sheet using an applicator so that the thickness after drying was 40 μm, and dried at 85 ° C. for 5 minutes to produce an easily disassembled layer (1).

[製造例2] 易拆解層(2) 將Matsumoto microsphere F-48替換為Microsphere Expancel 053-40 (Japan Fillite co., ltd.製,於120℃的熱膨脹率為350%,膨脹開始溫度為96℃~103℃,最大膨脹溫度為138℃~146℃,粒徑(膨脹前)為10μm~16μm)10質量份,除此以外,利用與上述製造例1同樣的方法製造易拆解層(2)。[Manufacturing Example 2] Easy-to-disassemble layer (2) Replaced Matsumoto microsphere F-48 with Microsphere Expancel 053-40 (manufactured by Japan Fillite co., Ltd.), With a thermal expansion coefficient of 350% at 120 ° C and an expansion start temperature of 96 Except for ℃ ~ 103 ℃, the maximum expansion temperature is 138 ℃ ~ 146 ℃, and the particle size (before expansion) is 10 parts by mass, 10 parts by mass. Except for this, an easily dismantleable layer (2 ).

[製造例3] 易拆解層(3) 將Matsumoto microsphere F-48替換為Microsphere Expancel 031-40 (Japan Fillite co., ltd.製、於120℃的熱膨脹率為450%,膨脹開始溫度為81℃~95℃,最大膨脹溫度為120℃~135℃,粒徑(膨脹前)為10μm~16μm)10質量份,除此以外,利用與上述製造例1同樣的方法製造易拆解層(3)。[Manufacturing Example 3] Easy-to-disassemble layer (3) Replaced Matsumoto microsphere F-48 with Microsphere Expancel 031-40 (manufactured by Japan Fillite co., Ltd.) With a thermal expansion coefficient of 450% at 120 ° C and an expansion start temperature of 81 Except for a mass of 10 ° C. to 95 ° C., a maximum expansion temperature of 120 ° C. to 135 ° C., and a particle size (before expansion) of 10 μm to 16 μm), an easily dismantleable layer (3 ).

[製造例4] 易拆解層(4) 將Matsumoto microsphere F-48替換為Matsumoto microsphere FN-80GSD (松本油脂製藥(股)公司製,於120℃的熱膨脹率為220%,膨脹開始溫度為100℃~110℃,最大膨脹溫度為125℃~135℃,粒徑(膨脹前)為6μm~10μm)10質量份,除此以外,利用與上述製造例1同樣的方法製造易拆解層(4)。[Manufacturing Example 4] Easy-to-disassemble layer (4) Replaced Matsumoto microsphere F-48 with Matsumoto microsphere FN-80GSD (Matsumoto Oil & Fat Pharmaceutical Co., Ltd.). The thermal expansion coefficient at 120 ° C was 220%, and the expansion start temperature was 100. Except for ℃ ~ 110 ℃, the maximum expansion temperature is 125 ℃ ~ 135 ℃, and the particle size (before expansion) is 6 parts by mass to 10 parts by mass). Except for this, 10 parts by mass are manufactured by the same method as in Production Example 1 above (4 ).

[製造例5] 易拆解層(5) 將苯乙烯-異戊二烯嵌段共聚物S替換為重量平均分子量為30萬的苯乙烯-異戊二烯嵌段共聚物T(三嵌段共聚物與二嵌段共聚物的混合物。該二嵌段共聚物相對於該混合物之總量的所占比例為20質量%。聚苯乙烯單元相對於該苯乙烯-異戊二烯嵌段共聚物之全體的所占質量比例為15質量%,聚異戊二烯單元的質量比例為85質量%),除此以外,利用與製造例1同樣的方法製造易拆解層(5)。[Production Example 5] Easy-to-disassemble layer (5) The styrene-isoprene block copolymer S was replaced with a styrene-isoprene block copolymer T (triblock having a weight average molecular weight of 300,000) A mixture of a copolymer and a diblock copolymer. The proportion of the diblock copolymer to the total amount of the mixture is 20% by mass. The polystyrene unit is copolymerized with respect to the styrene-isoprene block copolymer. Except that the mass ratio of the entire product was 15% by mass and the mass ratio of the polyisoprene unit was 85% by mass), the easily dismantleable layer (5) was produced by the same method as in Production Example 1.

[製造例6] 易拆解層(6) 將Matsumoto microsphere F-48(松本油脂製藥(股)公司製)的使用量由10質量份變更為20質量份,除此以外,利用與製造例1同樣的方法製造易拆解層(6)。[Manufacturing example 6] Easy-to-disassemble layer (6) The usage and manufacturing example 1 was changed from 10 parts by mass to 20 parts by mass of Matsumoto microsphere F-48 (manufactured by Matsumoto Oils and Fats Pharmaceutical Co., Ltd.) The easy-to-disassemble layer (6) is produced in the same method.

[製造例7] 易拆解層(7) 將Matsumoto microsphere F-48(松本油脂製藥(股)公司製)的使用量由10質量份變更為5質量份,除此以外,利用與製造例1同樣的方法製造易拆解層(7)。[Manufacturing Example 7] Easy-to-disassemble layer (7) The usage and manufacturing example 1 was changed from 10 parts by mass to 5 parts by mass of Matsumoto microsphere F-48 (manufactured by Matsumoto Oil and Fat Pharmaceutical Co., Ltd.) The easy-to-disassemble layer (7) is produced in the same method.

[製造例8] 易拆解層(8) 將易拆解層的厚度由40μm變更為20μm,除此以外,利用與製造例1同樣的方法製造易拆解層(8)。[Manufacturing Example 8] The easy-disassembly layer (8) was manufactured by the same method as in Manufacturing Example 1 except that the thickness of the easy-disassembly layer was changed from 40 μm to 20 μm.

[製造例9] 易拆解層(9) 藉由將LA2250(Kurary Co.,LTD.製,丙烯酸系熱塑性彈性體)100質量份、Matsumoto microsphere F-48 (松本油脂製藥(股)公司製,於120℃的熱膨脹率為370%,膨脹開始溫度為90℃~100℃,最大膨脹溫度為125℃~135℃,粒徑(膨脹前)為9μm~15μm)10質量份、與甲苯混合而得到非揮發性成分為40質量%的丙烯酸樹脂組成物。[Manufacturing Example 9] The easily dismantleable layer (9) was obtained by using 100 parts by mass of LA2250 (manufactured by Kurary Co., LTD., An acrylic thermoplastic elastomer) and Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fat Pharmaceutical Co., Ltd. The thermal expansion coefficient at 120 ° C is 370%, the expansion start temperature is 90 ° C to 100 ° C, the maximum expansion temperature is 125 ° C to 135 ° C, and the particle size (before expansion) is 9 μm to 15 μm) 10 parts by mass are mixed with toluene to obtain The non-volatile component is an acrylic resin composition of 40% by mass.

以使乾燥後的厚度成為40μm的方式,將上述丙烯酸樹脂組成物使用塗抹機塗布於剝離片的表面,藉由於85℃乾燥5分鐘而製造易拆解層(9)。The acrylic resin composition was applied to the surface of a release sheet using an applicator so that the thickness after drying was 40 μm, and dried at 85 ° C. for 5 minutes to produce an easily dismantleable layer (9).

[製造例10] 易拆解層(10) 於裝備有攪拌機、回流冷凝器、溫度計、滴液漏斗及氮氣導入口的反應容器內,將丙烯酸丁酯44.9質量份、丙烯酸2-乙基己酯50質量份、丙烯酸2質量份、乙酸乙烯酯3質量份、丙烯酸4-羥基丁酯0.1質量份、及作為聚合引發劑的2,2'-偶氮雙異丁腈0.1質量份,溶解於乙酸乙酯100質量份中,於70℃聚合10小時,以得到重量平均分子量為80萬的丙烯酸系共聚物溶液。然後,相對於該丙烯酸系共聚物100質量份,添加聚合松香酯系增黏樹脂(軟化點為125℃,數量平均分子量為880)30質量份,加入乙酸乙酯並混合,藉此得到非揮發性成分為45質量%的丙烯酸系共聚物組成物(1)。[Manufacturing example 10] The easily dismantleable layer (10) In a reaction vessel equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel, and a nitrogen inlet, 44.9 parts by mass of butyl acrylate and 2-ethylhexyl acrylate 50 parts by mass, 2 parts by mass of acrylic acid, 3 parts by mass of vinyl acetate, 0.1 parts by mass of 4-hydroxybutyl acrylate, and 0.1 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator, dissolved in acetic acid In 100 parts by mass of ethyl ester, polymerization was performed at 70 ° C. for 10 hours to obtain an acrylic copolymer solution having a weight average molecular weight of 800,000. Then, based on 100 parts by mass of the acrylic copolymer, 30 parts by mass of a polymerized rosin ester tackifying resin (softening point: 125 ° C., number average molecular weight: 880) was added, and ethyl acetate was added and mixed to obtain a non-volatile The acrylic component (1) has a sexual component of 45% by mass.

將上述丙烯酸系共聚物組成物(1)100質量份、「CORONATE L-45」(日本聚胺脂工業(股)製,異氰酸酯系交聯劑,固體成分為45質量%)1.1質量份、Matsumoto microsphere F-48(松本油脂製藥(股)公司製,於120℃的熱膨脹率為370%,膨脹開始溫度為90℃~100℃,最大膨脹溫度為125℃~135℃,粒徑(膨脹前)為9μm~15μm)10質量份混合後,以使乾燥後的厚度成為40μm的方式,使用塗抹機塗布於剝離片的表面,於85℃乾燥5分鐘,藉此形成易拆解層(10)。100 parts by mass of the aforementioned acrylic copolymer composition (1), 1.1 parts by mass of "CORONATE L-45" (manufactured by Japan Polyurethane Industries, Ltd., an isocyanate-based cross-linking agent, with a solid content of 45% by mass), and Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fats Pharmaceutical Co., Ltd., with a thermal expansion coefficient of 370% at 120 ° C, an expansion start temperature of 90 ° C to 100 ° C, a maximum expansion temperature of 125 ° C to 135 ° C, particle size (before expansion) (9 μm to 15 μm) 10 parts by mass were mixed, and then the surface of the release sheet was coated with an applicator so that the thickness after drying was 40 μm, and dried at 85 ° C. for 5 minutes to form an easily disassembled layer (10).

[製造例11] 易拆解層(11) 將丙烯酸丁酯44.9質量份、丙烯酸2-乙基己酯50質量份、丙烯酸2質量份、乙酸乙烯酯3質量份與丙烯酸4-羥基丁酯0.1質量份替換為丙烯酸丁酯20質量份及丙烯酸2-乙基己酯74.9質量份,除此以外,利用與製造例10同樣的方法形成易拆解層(11)。[Manufacturing Example 11] The easily dismantleable layer (11) 44.9 parts by mass of butyl acrylate, 50 parts by mass of 2-ethylhexyl acrylate, 2 parts by mass of acrylic acid, 3 parts by mass of vinyl acetate, and 4-hydroxybutyl acrylate 0.1 Except for replacing 20 parts by mass of butyl acrylate and 74.9 parts by mass of 2-ethylhexyl acrylate, the easily disassembled layer (11) was formed by the same method as in Production Example 10.

[比較製造例1] 中芯層(1) 未使用Matsumoto microsphere F-48(松本油脂製藥(股)公司製),除此以外,利用與製造例1同樣的方法製造中芯層(1)。[Comparative Manufacturing Example 1] The core layer (1) was manufactured by the same method as in Manufacturing Example 1 except that Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fat Pharmaceutical Co., Ltd.) was not used.

[比較製造例2] 中芯層(2) 未使用Matsumoto microsphere F-48(松本油脂製藥(股)公司製),除此以外,利用與製造例9同樣的方法製造中芯層(2)。[Comparative Manufacturing Example 2] The core layer (2) was manufactured in the same manner as in Manufacturing Example 9 except that Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fat Pharmaceutical Co., Ltd.) was not used.

[比較製造例3] 中芯層(3) 未使用Matsumoto microsphere F-48(松本油脂製藥(股)公司製),除此以外,利用與製造例10同樣的方法製造中芯層(3)。[Comparative Manufacturing Example 3] The core layer (3) was manufactured in the same manner as in Manufacturing Example 10 except that Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fat Pharmaceutical Co., Ltd.) was not used.

[比較製造例4] 中芯層(4) 未使用Matsumoto microsphere F-48(松本油脂製藥(股)公司製),除此以外,利用與製造例11同樣的方法製造中芯層(4)。[Comparative Manufacturing Example 4] The core layer (4) was manufactured by the same method as in Manufacturing Example 11 except that Matsumoto microsphere F-48 (manufactured by Matsumoto Oil & Fat Pharmaceutical Co., Ltd.) was not used.

[製備例1] 黏貼劑層(1) 於裝備有攪拌機、回流冷凝器、溫度計、滴液漏斗及氮氣導入口的反應容器內,將丙烯酸丁酯44.9質量份、丙烯酸2-乙基己酯50質量份、丙烯酸2質量份、乙酸乙烯酯3質量份、丙烯酸4-羥基丁酯0.1質量份、及作為聚合引發劑的2,2'-偶氮雙異丁腈0.1質量份,溶解於乙酸乙酯100質量份中,於70℃聚合10小時,藉此得到重量平均分子量為80萬的丙烯酸系共聚物溶液。然後,相對於該丙烯酸系共聚物100質量份,添加聚合松香酯系增黏樹脂(軟化點為125℃,數量平均分子量為880)30質量份,加入乙酸乙酯並混合,藉此得到非揮發性成分為45質量%的丙烯酸系共聚物組成物(1)。[Preparation Example 1] Adhesive layer (1) In a reaction vessel equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel, and a nitrogen inlet, 44.9 parts by mass of butyl acrylate and 2-ethylhexyl acrylate 50 Parts by mass, 2 parts by mass of acrylic acid, 3 parts by mass of vinyl acetate, 0.1 parts by mass of 4-hydroxybutyl acrylate, and 0.1 parts by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator, dissolved in ethyl acetate In 100 parts by mass of the ester, an acrylic copolymer solution having a weight average molecular weight of 800,000 was obtained by polymerizing at 70 ° C. for 10 hours. Then, based on 100 parts by mass of the acrylic copolymer, 30 parts by mass of a polymerized rosin ester tackifying resin (softening point: 125 ° C., number average molecular weight: 880) was added, and ethyl acetate was added and mixed to obtain a non-volatile The acrylic component (1) has a sexual component of 45% by mass.

將上述丙烯酸系共聚物組成物(1)100質量份、與「CORONATE L-45」(日本聚胺脂工業(股)製、異氰酸酯系交聯劑、固體成分為45質量%)1.1質量份混合後得到的黏貼劑,以使乾燥後的厚度成為50μm的方式,使用塗抹機塗布於剝離片的表面,於85℃乾燥5分鐘而形成黏貼劑層(1)。100 parts by mass of the above-mentioned acrylic copolymer composition (1) was mixed with 1.1 parts by mass of "CORONATE L-45" (manufactured by Japan Polyurethane Industries, Ltd., an isocyanate-based crosslinking agent, and a solid content of 45% by mass). The obtained adhesive was applied to the surface of the release sheet using an applicator so that the thickness after drying became 50 μm, and dried at 85 ° C. for 5 minutes to form an adhesive layer (1).

(實施例1) 如圖8(a)所示,將上述黏貼劑層(1)22貼合於厚度為16μm的聚對苯二甲酸乙二醇酯膜42上(貼合品)。(Example 1) As shown in FIG. 8 (a), the above-mentioned adhesive layer (1) 22 was bonded to a polyethylene terephthalate film 42 (bonded product) having a thickness of 16 μm.

另一方面,將另一黏貼劑層(1)23與易拆解層(1)15分別貼合於厚度為16μm的聚對苯二甲酸乙二醇酯膜43的兩面。然後,將該易拆解層(1)15表面的剝離片除去,並貼合於預先製作的上述聚對苯二甲酸乙二醇酯膜42及黏貼劑層(1)22的貼合品後,藉由以4kgf/cm2 的壓力進行加壓層疊,製作實施例1的雙面黏貼膠帶。On the other hand, the other adhesive layer (1) 23 and the easy-to-disassemble layer (1) 15 were each adhered to both sides of a polyethylene terephthalate film 43 having a thickness of 16 μm. Then, the release sheet on the surface of the easy-to-disassemble layer (1) 15 is removed, and it is bonded to the previously-produced polyethylene terephthalate film 42 and the bonded product of the adhesive layer (1) 22 The double-sided adhesive tape of Example 1 was produced by laminating under pressure at a pressure of 4 kgf / cm 2 .

(實施例2) 將上述易拆解層(1)替換為上述易拆解層(2),除此以外,利用與上述實施例1同樣的方法製作實施例2的雙面黏貼膠帶。(Example 2) A double-sided adhesive tape of Example 2 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (2).

(實施例3) 將上述易拆解層(1)替換為上述易拆解層(3),除此以外,利用與上述實施例1同樣的方法製作實施例3的雙面黏貼膠帶。(Example 3) A double-sided adhesive tape of Example 3 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (3).

(實施例4) 將上述易拆解層(1)替換為上述易拆解層(4),除此以外,利用與上述實施例1同樣的方法製作實施例4的雙面黏貼膠帶。(Example 4) A double-sided adhesive tape of Example 4 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (4).

(實施例5) 將上述易拆解層(1)替換為上述易拆解層(5),除此以外,利用與上述實施例1同樣的方法製作實施例5的雙面黏貼膠帶。(Example 5) A double-sided adhesive tape of Example 5 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (5).

(實施例6) 將單側的16μm的聚對苯二甲酸乙二醇酯膜替換為厚度為16μm的聚對苯二甲酸乙二醇酯膜與厚度為100μm的聚烯烴系發泡體的疊層體並使發泡體側接觸易拆解層,除此以外,利用與上述實施例1同樣的方法製作實施例6的雙面黏貼膠帶。(Example 6) A 16-m-thick polyethylene terephthalate film was replaced with a 16-m-thick polyethylene terephthalate film and a 100-m-thick polyolefin-based foam. A double-sided adhesive tape of Example 6 was produced by the same method as that of Example 1 except that the layered body was brought into contact with the easily dismantleable layer of the foam side.

(實施例7) 將上述易拆解層(1)替換為上述易拆解層(6),除此以外,利用與上述實施例1同樣的方法製作實施例7的雙面黏貼膠帶。(Example 7) A double-sided adhesive tape of Example 7 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (6).

(實施例8) 將上述易拆解層(1)替換為上述易拆解層(7),除此以外,利用與上述實施例1同樣的方法製作實施例8的雙面黏貼膠帶。(Example 8) A double-sided adhesive tape of Example 8 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (7).

(實施例9) 將上述易拆解層(1)替換為上述易拆解層(8),除此以外,利用與上述實施例1同樣的方法製作實施例9的雙面黏貼膠帶。(Example 9) A double-sided adhesive tape of Example 9 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (8).

(實施例10) 將上述易拆解層(1)替換為上述易拆解層(9),除此以外,利用與上述實施例1同樣的方法製作實施例10的雙面黏貼膠帶。(Example 10) A double-sided adhesive tape of Example 10 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (9).

(實施例11) 將上述易拆解層(1)替換為上述易拆解層(10),除此以外,利用與上述實施例1同樣的方法製作實施例11的雙面黏貼膠帶。(Example 11) A double-sided adhesive tape of Example 11 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (10).

(實施例12) 將上述易拆解層(1)替換為上述易拆解層(11),除此以外,利用與上述實施例1同樣的方法製作實施例12的雙面黏貼膠帶。(Example 12) A double-sided adhesive tape of Example 12 was produced by the same method as that of Example 1 except that the easy-disassembly layer (1) was replaced by the easy-disassembly layer (11).

(比較例1) 將上述易拆解層(1)替換為上述中芯層(1),除此以外,利用與上述實施例1同樣的方法製作比較例1的雙面黏貼膠帶。(Comparative Example 1) A double-sided adhesive tape of Comparative Example 1 was produced in the same manner as in Example 1 except that the easily dismantleable layer (1) was replaced with the core layer (1).

(比較例2) 將上述易拆解層(1)替換為上述中芯層(2),除此以外,利用與上述實施例1同樣的方法製作比較例2的雙面黏貼膠帶。(Comparative Example 2) A double-sided adhesive tape of Comparative Example 2 was produced by the same method as that of Example 1 except that the easily dismantleable layer (1) was replaced by the core layer (2).

(比較例3) 將上述易拆解層(1)替換為上述中芯層(3),除此以外,利用與上述實施例1同樣的方法製作比較例3的雙面黏貼膠帶。(Comparative Example 3) A double-sided adhesive tape of Comparative Example 3 was produced in the same manner as in Example 1 except that the easily dismantleable layer (1) was replaced with the core layer (3).

(比較例4) 將上述易拆解層(1)替換為上述中芯層(4),除此以外,利用與上述實施例1同樣的方法製作比較例4的雙面黏貼膠帶。(Comparative Example 4) A double-sided adhesive tape of Comparative Example 4 was produced by the same method as that of Example 1 except that the easily dismantleable layer (1) was replaced with the core layer (4).

對上述實施例及比較例中得到的雙面黏貼膠帶進行以下的評價。得到的結果如表1、表2所示。The double-sided adhesive tape obtained in the said Example and the comparative example was evaluated as follows. The obtained results are shown in Tables 1 and 2.

<常溫時的180度剝離接著力> 180度剝離接著力根據JIS Z 0237進行測定。<180-degree peeling adhesive force at normal temperature> The 180-degree peeling adhesive force was measured according to JIS Z 0237.

將雙面黏貼膠帶的其中一面的剝離片剝離,將此黏貼劑層以厚度為50μm的鋁箔作為背襯。將該有背襯的黏貼膠帶切為20mm寬度後,將另一面的剝離片剝離,將此黏貼劑層貼合於SUS板的經過脫脂處理的平滑表面,以作為試驗片。The release sheet on one side of the double-sided adhesive tape was peeled off, and this adhesive layer was backed with an aluminum foil having a thickness of 50 μm. This backed adhesive tape was cut to a width of 20 mm, and then the release sheet on the other side was peeled off, and this adhesive layer was bonded to the smooth surface of the SUS board after the degreasing treatment as a test piece.

將上述試驗片於23℃環境下放置30分鐘後,於相同環境下使用TENSILON拉伸試驗機[A&D Co., Ltd. 製,型號:RTM-100],測定將構成該試驗片的雙面黏貼膠帶從SUS板沿180度方向以300mm/分的速度剝離時的接著力。After the test piece was left at 23 ° C for 30 minutes, a TENSILON tensile tester [manufactured by A & D Co., Ltd., model: RTM-100] was used to measure the double-sided adhesion of the test piece in the same environment. Adhesive force when the tape was peeled from the SUS board in a 180 degree direction at a speed of 300 mm / min.

<加熱後的180度剝離接著力> 180度剝離接著力根據JIS Z 0237進行測定。<180-degree peeling adhesive force after heating> The 180-degree peeling adhesive force was measured according to JIS Z 0237.

將雙面黏貼膠帶的其中一面的剝離片剝離,將此黏貼劑層以厚度為50μm的鋁箔作為背襯。將該有背襯的黏貼膠帶切為20mm寬度後,將另一面的剝離片剝離,將此黏貼劑層貼合於SUS板的經過脫脂處理的平滑表面,以作為試驗片。The release sheet on one side of the double-sided adhesive tape was peeled off, and this adhesive layer was backed with an aluminum foil having a thickness of 50 μm. This backed adhesive tape was cut to a width of 20 mm, and then the release sheet on the other side was peeled off, and this adhesive layer was bonded to the smooth surface of the SUS board after the degreasing treatment as a test piece.

將上述試驗片於120℃環境下放置30分鐘後,於相同環境下使用TENSILON拉伸試驗機[A&D Co., Ltd. 製,型號:RTM-100],測定將構成該試驗片的雙面黏貼膠帶從SUS板沿180度方向以300mm/分的速度剝離時的接著力。After the above test piece was left at 120 ° C for 30 minutes, a TENSILON tensile tester [manufactured by A & D Co., Ltd., model: RTM-100] was used to measure the double-sided adhesion of the test piece in the same environment. Adhesive force when the tape was peeled from the SUS board in a 180 degree direction at a speed of 300 mm / min.

<加熱後的拆解性試驗> 圖9係說明拆解性試驗的方法的圖。首先,將實施例及比較例中得到的雙面黏貼膠帶切為一邊(外側)的長度為20mm的正方形狀。將該切斷的雙面黏貼膠帶202貼合於長度為100mm、寬度為30mm及厚度為1mm的SUS板201的經過脫脂處理的平滑表面。<Disassembly test after heating> FIG. 9: is a figure explaining the method of a disassembly test. First, the double-sided adhesive tapes obtained in Examples and Comparative Examples were cut into a square shape with a length of 20 mm on one side (outer side). This cut double-sided adhesive tape 202 was bonded to a smooth surface of a degreased SUS board 201 having a length of 100 mm, a width of 30 mm, and a thickness of 1 mm.

然後,將SUS板201’的經過脫脂處理的平滑表面貼附於和上述雙面黏貼膠帶202與SUS板201貼附的面為相反的面,以5kg荷重輥進行1次來回加壓,以作為試驗片。Then, the degreased smooth surface of the SUS board 201 'was affixed to the side opposite to the side to which the double-sided adhesive tape 202 and the SUS board 201 were attached, and pressed back and forth once with a 5 kg load roller as the Test strip.

將製作的試驗片,於120℃環境下放置30分鐘後,於23℃下取出,對於15秒以內手持SUS板201及201’的兩端,於垂直方向進行剝離時的SUS板的分離容易程度進行評價。The prepared test piece was left to stand at 120 ° C for 30 minutes, and then taken out at 23 ° C. The SUS plate was easily separated when holding both ends of SUS plates 201 and 201 'within 15 seconds and peeling them vertically. Evaluate.

○:雙面黏貼膠帶因易拆解層內斷裂,不用施加任何力,2塊SUS板即被分離。其結果為不用施加任何力即可拆解試驗片。○: Because the double-sided adhesive tape was broken in the easily dismantled layer, the two SUS boards were separated without applying any force. As a result, the test piece can be disassembled without applying any force.

△:2塊SUS板接著,但藉由施加很小的力即可將其分離,並可拆解上述試驗片。(Triangle | delta): Two SUS boards are followed, but they can be separated by applying a small force, and the said test piece can be disassembled.

╳:若不用兩手施加相當的力便不能分離2塊SUS板並拆解上述試驗片。╳: It is impossible to separate the two SUS boards and disassemble the above test pieces without applying considerable force with both hands.

<構成易拆解層及中芯層的黏結劑的動態黏彈性(儲存彈性模量)測定> 將易拆解層及中芯層的製造中所使用的黏結劑溶解於甲苯後,以使乾燥後的厚度成為100μm的方式,使用塗抹機塗布於脫模襯墊的表面,於85℃乾燥5分鐘,藉此形成多片厚度為100μm的黏結劑層。<Dynamic viscoelasticity (storage elastic modulus) measurement of the adhesive constituting the easily dismantleable layer and the core layer> The adhesive used in the manufacture of the easily dismantleable layer and the core layer is dissolved in toluene and dried. After the thickness was 100 μm, the surface of the release liner was coated with an applicator, and dried at 85 ° C. for 5 minutes to form a plurality of 100 μm thick adhesive layers.

然後,藉由將使用相同的黏結劑所得到的黏結劑層重疊,製成由厚度為2mm的黏結劑層構成的試驗片。Then, a test piece composed of an adhesive layer having a thickness of 2 mm was produced by overlapping the adhesive layers obtained using the same adhesive.

於TA Instruments. Japan.製的黏彈性試驗機(ARES 2kSTD)安裝直徑為7.9mm的平行板。將上述試驗片以壓縮荷重50g夾入該平行板,於頻率1Hz、溫度範圍-60~150℃、及升溫速度2℃/min的條件下,對於23℃的儲存彈性模量(G23 )及於120℃的儲存彈性模量(G120 ) 進行測定。A parallel plate having a diameter of 7.9 mm was mounted on a viscoelasticity tester (ARES 2kSTD) manufactured by TA Instruments. Japan. The test piece was sandwiched into the parallel plate with a compressive load of 50 g, and the storage elastic modulus (G 23 ) and The storage elastic modulus (G 120 ) was measured at 120 ° C.

[表1] [Table 1]

[表2] [Table 2]

[表3] [table 3]

1,2‧‧‧雙面黏貼膠帶1, 2‧‧‧ double-sided adhesive tape

10‧‧‧易拆解層 10‧‧‧Easy disassembly layer

11‧‧‧黏結劑 11‧‧‧Binder

12‧‧‧熱膨脹性微球(膨脹前) 12‧‧‧ heat-expandable microspheres (before expansion)

12’‧‧‧熱膨脹性微球(膨脹後) 12’‧‧‧ heat-expandable microspheres (after expansion)

20,21‧‧‧黏貼劑層(1) 20, 21‧‧‧ Adhesive layer (1)

30,31,32,33,34‧‧‧剝離片 30, 31, 32, 33, 34

40,41‧‧‧基底膜 40, 41‧‧‧ basement membrane

50,51‧‧‧被黏體 50, 51‧‧‧ adherent

3,4‧‧‧雙面黏貼膠帶 3, 4‧‧‧ double-sided adhesive tape

14‧‧‧熱膨脹性微球(膨脹前) 14‧‧‧ heat-expandable microspheres (before expansion)

15‧‧‧易拆解層(1) 15‧‧‧Easy disassembly layer (1)

16‧‧‧中芯層(1) 16‧‧‧ core layer (1)

22,23‧‧‧黏貼劑層(1) 22, 23‧‧‧ Adhesive layer (1)

42,43‧‧‧聚對苯二甲酸乙二醇酯膜 42, 43‧‧‧ polyethylene terephthalate film

202‧‧‧雙面黏貼膠帶 202‧‧‧Double-sided adhesive tape

201,201’‧‧‧SUS板 201, 201’‧‧‧SUS board

[圖1] 係表示根據本發明之雙面黏貼膠帶之實施方式之一例的剖面圖。 [圖2] 係表示根據本發明之雙面黏貼膠帶之實施方式之一例的剖面圖。 [圖3] 係說明根據本發明之雙面黏貼膠帶之製造方法之實施方式之一例的圖。 [圖4] 係說明根據本發明之接著方法之實施方式之一例的圖。 [圖5] 係說明根據本發明之分離方法之實施方式之一例的圖。 [圖6] (a)~(b)係示意性地表示被黏體的分離的狀態的圖。 [圖7] 係表示根據本發明之分離方法之實施方式之一例的剖面圖。 [圖8] (a)~(b)係說明實施例1之雙面黏貼膠帶及比較例1之雙面黏貼膠帶之製造方法,與實施例1之雙面黏貼膠帶及比較例1之雙面黏貼膠帶之構造的圖。 [圖9] 係說明實施例中的拆解性試驗的方法的圖。1 is a cross-sectional view showing an example of an embodiment of a double-sided adhesive tape according to the present invention. Fig. 2 is a cross-sectional view showing an example of an embodiment of a double-sided adhesive tape according to the present invention. [FIG. 3] It is a figure explaining an example of embodiment of the manufacturing method of the double-sided adhesive tape according to this invention. 4 is a diagram illustrating an example of an embodiment of a bonding method according to the present invention. [FIG. 5] A diagram illustrating an example of an embodiment of the separation method according to the present invention. [Fig. 6] (a) to (b) are diagrams schematically showing a state of separation of adherends. 7 is a cross-sectional view showing an example of an embodiment of a separation method according to the present invention. [Fig. 8] (a) to (b) explain the manufacturing method of the double-sided adhesive tape of Example 1 and the double-sided adhesive tape of Comparative Example 1, and the double-sided adhesive tape of Example 1 and the double-sided adhesive tape of Comparative Example 1. Diagram of the structure of an adhesive tape. [Fig. 9] Fig. 9 is a diagram illustrating a method of a disassembly test in Examples.

Claims (11)

一種雙面黏貼膠帶,其特徵在於:於含有黏結劑及熱膨脹性微球之易拆解層之兩面側具有黏貼劑層,該黏結劑之於1Hz及23℃之以動態黏彈性譜測定之儲存彈性模量G23為5.0×103~5.0×106Pa之範圍,於1Hz及120℃之以動態黏彈性譜測定之儲存彈性模量G120為5.0×102~1.0×106Pa之範圍,該儲存彈性模量G120小於該儲存彈性模量G23A double-sided adhesive tape, characterized in that an adhesive layer is provided on both sides of an easy-to-disassemble layer containing an adhesive and thermally expandable microspheres, and the adhesive is stored at 1 Hz and 23 ° C by dynamic viscoelasticity spectrum measurement. The elastic modulus G 23 is in a range of 5.0 × 10 3 to 5.0 × 10 6 Pa. The storage elastic modulus G 120 measured at 1 Hz and 120 ° C. by dynamic viscoelasticity spectrum is 5.0 × 10 2 to 1.0 × 10 6 Pa. Range, the storage elastic modulus G 120 is smaller than the storage elastic modulus G 23 . 如申請專利範圍第1項之雙面黏貼膠帶,其中,該黏結劑係熱塑性樹脂。For example, the double-sided adhesive tape of item 1 of the patent application scope, wherein the adhesive is a thermoplastic resin. 如申請專利範圍第1或2項之雙面黏貼膠帶,其中,該黏結劑係苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體或丙烯酸系樹脂。For example, the double-sided adhesive tape of item 1 or 2 of the patent application scope, wherein the adhesive is a styrene-based thermoplastic elastomer, an olefin-based thermoplastic elastomer, or an acrylic resin. 如申請專利範圍第3項之雙面黏貼膠帶,其中,該苯乙烯系熱塑性彈性體含有苯乙烯系二嵌段共聚物及苯乙烯系三嵌段共聚物,且該苯乙烯系二嵌段共聚物之含量相對於該苯乙烯系熱塑性彈性體全體為10質量%~90質量%之範圍。For example, the double-sided adhesive tape according to item 3 of the patent application, wherein the styrene-based thermoplastic elastomer contains a styrene-based diblock copolymer and a styrene-based triblock copolymer, and the styrene-based diblock copolymer is copolymerized. The content of the substance is in a range of 10% by mass to 90% by mass based on the entire styrene-based thermoplastic elastomer. 如申請專利範圍第1或2項之雙面黏貼膠帶,其中,該熱膨脹性微球之於120℃之熱膨脹率為150%以上。For example, the double-sided adhesive tape of item 1 or 2 of the patent application scope, wherein the thermal expansion coefficient of the thermally expandable microspheres at 120 ° C is more than 150%. 如申請專利範圍第1或2項之雙面黏貼膠帶,其中,該熱膨脹性微球係於具有彈性之膠囊內含有因熱而氣化之物質者。For example, the double-sided adhesive tape of item 1 or 2 of the patent application scope, wherein the heat-expandable microspheres are contained in a flexible capsule containing a substance vaporized by heat. 如申請專利範圍第1或2項之雙面黏貼膠帶,其中,於該易拆解層及該黏貼劑層之間之至少一者具有基底膜。For example, the double-sided adhesive tape of item 1 or 2 of the patent application scope, wherein at least one of the easy-to-disassemble layer and the adhesive layer has a base film. 如申請專利範圍第7項之雙面黏貼膠帶,其中,於該易拆解層及該黏貼劑層之間之兩者具有基底膜。For example, the double-sided adhesive tape according to item 7 of the patent application, wherein a base film is provided between the easily dismantleable layer and the adhesive layer. 如申請專利範圍第1或2項之雙面黏貼膠帶,其中,該黏貼劑層之至少一者含有丙烯酸系共聚物。For example, the double-sided adhesive tape of item 1 or 2 of the patent application scope, wherein at least one of the adhesive layers contains an acrylic copolymer. 一種物品,其特徵在於:具有2個以上之被黏體藉由如申請專利範圍第1至9項中任一項之雙面黏貼膠帶接著而形成之構造。An article characterized by having a structure in which two or more adherends are adhered by a double-sided adhesive tape according to any one of items 1 to 9 of the scope of patent application. 一種分離方法,藉由將構成如申請專利範圍第10項之物品之該易拆解層加熱,使該熱膨脹性微球膨脹,藉此分離構成該物品之2個以上之被黏體。A method for separating, by heating the easily dismantleable layer constituting the article as claimed in item 10 of the patent application, to expand the heat-expandable microspheres, thereby separating two or more adherends constituting the article.
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