TWI812660B - Manufacturing method of article using adhesive tape - Google Patents

Manufacturing method of article using adhesive tape Download PDF

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Publication number
TWI812660B
TWI812660B TW107144655A TW107144655A TWI812660B TW I812660 B TWI812660 B TW I812660B TW 107144655 A TW107144655 A TW 107144655A TW 107144655 A TW107144655 A TW 107144655A TW I812660 B TWI812660 B TW I812660B
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Taiwan
Prior art keywords
adhesive layer
adhesive tape
expandable
adhesive
adherend
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TW107144655A
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Chinese (zh)
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TW201930507A (en
Inventor
唐沢久美子
森野彰規
秋山誠二
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日商Dic股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated

Abstract

本發明所欲解決之課題在於提供一種物品的製造方法,於將黏著帶貼附於平面、曲面、3D形狀等各種形狀的構件時,防止產生褶皺或間隙以確保高的防水性。本發明是有關於一種物品的製造方法,其是經由接著帶的膨脹物來進行接著的物品的製造方法,所述物品的製造方法的特徵在於包括:步驟[1],使具有膨脹性接著劑層(A)的兩個以上的接著帶的端部彼此接近來配置,將所述接著帶的其中一個面側貼附於構成被接著體(C1)的部位(c1-1);步驟[2],將所述接著帶的另一個面側貼附於另一個被接著體(C2);步驟[3],對所述膨脹性接著劑層(A)給予刺激;以及步驟[4],因所述刺激,所述膨脹性接著劑層(A)膨脹,而形成膨脹接著劑層(A1)。The problem to be solved by the present invention is to provide a manufacturing method of an article that prevents wrinkles or gaps from occurring when attaching an adhesive tape to components of various shapes such as flat surfaces, curved surfaces, and 3D shapes to ensure high waterproofness. The present invention relates to a method of manufacturing an article, which is a method of manufacturing an article that is adhered through an expansion material of an adhesive tape. The method of manufacturing an article is characterized by including: step [1], making an adhesive with expandability The ends of two or more adhesive tapes of layer (A) are arranged close to each other, and one surface side of the adhesive tape is attached to the portion (c1-1) constituting the adherend (C1); step [2 ], attach the other side of the adhesive tape to another adherend (C2); step [3], provide stimulation to the expandable adhesive layer (A); and step [4], because The swelling adhesive layer (A) expands due to the stimulation to form the swelling adhesive layer (A1).

Description

使用了黏著帶的物品的製造方法Method of manufacturing articles using adhesive tape

本發明是有關於一種能夠於例如以電子設備為代表的各種物品的製造情形中使用的物品的製造方法。 The present invention relates to an article manufacturing method that can be used in the production of various articles represented by, for example, electronic equipment.

黏著帶一般而言可於將一個被接著體例如固定於另一個被接著體的平面部分或曲面部分等時較佳地使用,例如於以汽車用構件或電氣設備等為代表的各種產品的製造情形中廣泛使用。例如關於電子設備,於智慧型手機、行動電話、個人手持電話系統(personal handyphone system,PHS)、數位相機、音樂播放器、電子書籍、筆記本型個人電腦等行動電子設備中,以資訊顯示部即顯示器面板與框體的貼合為代表,於各種構件或模組的固定中使用著黏著帶。於對顯示器面板與框體進行接合時,是將黏著帶切斷為沿著顯示器面板的周緣部的窗框狀,並將所述窗框狀的黏著帶貼附於顯示器面板或框體的周緣部,之後,使顯示器面板與框體合在一起而固定。作為此時所使用的黏著帶,為了確保對框體的接合面的追隨性、顯示器面板與框體之間的防水性,並於掉落時等吸收衝擊,使用了於發泡體基材的兩面設有黏著層的兩面黏著帶(專利文獻1)。 In general, adhesive tapes are preferably used when fixing one adherend to a flat or curved surface of another adherent, for example, in the manufacture of various products such as automotive components or electrical equipment. widely used in situations. For example, regarding electronic equipment, in mobile electronic equipment such as smartphones, mobile phones, personal handyphone systems (PHS), digital cameras, music players, e-books, notebook personal computers, etc., the information display unit is The bonding between the display panel and the frame is represented by the use of adhesive tapes in the fixation of various components or modules. When joining the display panel and the frame, the adhesive tape is cut into a window frame shape along the peripheral edge of the display panel, and the window frame-shaped adhesive tape is attached to the peripheral edge of the display panel or the frame. After that, the display panel and the frame are brought together and fixed. As the adhesive tape used at this time, in order to ensure followability to the joint surface of the frame, waterproofness between the display panel and the frame, and to absorb impact when dropped, etc., a foam base material was used. A double-sided adhesive tape with adhesive layers on both sides (Patent Document 1).

另一方面,近年來,汽車構件或電子設備等中,曲面或三維 (three-dimensional,3D)形狀者增加,所述切斷為窗框狀的黏著帶難以貼附於曲面或3D形狀的構件,或會於貼附時產生褶皺或間隙,因此變得難以確保所述性能。 On the other hand, in recent years, in automobile parts, electronic equipment, etc., curved surfaces or three-dimensional (three-dimensional, 3D) shapes are increasing, and the adhesive tape cut into a window frame shape is difficult to adhere to curved surfaces or 3D-shaped components, or wrinkles or gaps may occur during attachment, so it becomes difficult to ensure that the Described performance.

[現有技術文獻] [Prior art documents]

[專利文獻] [Patent Document]

[專利文獻1]日本專利特開2009-108314號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-108314

本發明所欲解決之課題在於提供一種物品的製造方法,於將黏著帶貼附於平面、曲面、3D形狀等各種形狀的構件時,防止產生褶皺或間隙並確保高的防水性。 The problem to be solved by the present invention is to provide a manufacturing method of an article that prevents wrinkles or gaps and ensures high waterproofness when attaching an adhesive tape to components of various shapes such as flat surfaces, curved surfaces, and 3D shapes.

本發明是有關於一種物品的製造方法,其是具有對被接著體貼附有接著帶的構成的物品的製造方法,所述物品的製造方法的特徵在於經由:步驟[1],使具有膨脹性接著劑層(A)的兩個以上的接著帶的端部彼此接近來配置,將所述接著帶的其中一個面側貼附於構成被接著體(C1)的部位(c1-1);步驟[2],將所述接著帶的另一個面側貼附於另一個被接著體(C2);步驟[3],對所述膨脹性接著劑層(A)給予刺激;以及步驟[4],因所述刺激,所述膨脹性接著劑層(A)膨脹,而形成膨脹接著劑層(A1)。 The present invention relates to a method of manufacturing an article having a structure in which an adhesive tape is attached to a body to be adhered. The method of manufacturing the article is characterized by: step [1], making the article have expandability. The ends of two or more adhesive tapes of the adhesive layer (A) are arranged close to each other, and one surface side of the adhesive tape is attached to the portion constituting the adherend (C1) (c1-1); step [2], attach the other side of the adhesive tape to another adherend (C2); step [3], stimulate the expandable adhesive layer (A); and step [4] , due to the stimulation, the expandable adhesive layer (A) expands to form an expandable adhesive layer (A1).

若為本發明的物品的製造方法,則可於將黏著帶貼附於 平面、曲面、3D形狀等各種形狀的構件時,防止產生褶皺或間隙而確保高的防水性。 According to the manufacturing method of the article of the present invention, the adhesive tape can be attached to It prevents wrinkles and gaps from forming on components of various shapes such as flat surfaces, curved surfaces, and 3D shapes to ensure high waterproofness.

1:接著帶A 1: Then bring A

2:接著帶B 2: Then bring B

3:被接著體 3: The connected body

4:聚碳酸酯板1 4: Polycarbonate board 1

5:聚碳酸酯板2 5: Polycarbonate board 2

6:接著帶1 6: Then bring 1

7:接著帶2 7: Then bring 2

8:聚碳酸酯板3 8: Polycarbonate board 3

9:階差部 9: Step difference part

圖1是於本發明的步驟[1]中,於被接著體上,以具有膨脹性接著劑層(A)的兩個接著帶(A及B)的端部彼此相接的方式進行配置的剖面圖。 Figure 1 is a diagram of two bonding tapes (A and B) having an expandable adhesive layer (A) arranged on the body to be bonded in step [1] of the present invention so that their ends are in contact with each other. Sectional view.

圖2是於本發明的步驟[1]中,於被接著體上,使具有膨脹性接著劑層(A)的兩個接著帶(A及B)的端部彼此重合來配置的剖面圖。 2 is a cross-sectional view of the two bonding tapes (A and B) having the expandable adhesive layer (A) so that their ends overlap with each other on the adherend in step [1] of the present invention.

圖3是自上方對所述圖1及圖2進行觀察的圖。 FIG. 3 is a view of FIG. 1 and FIG. 2 viewed from above.

圖4是與實施例1的本發明的製造方法相關的物品在膨脹前的剖面圖。 4 is a cross-sectional view of an article before expansion related to the manufacturing method of the present invention in Example 1.

圖5是與實施例4的本發明的製造方法相關的物品在膨脹前的剖面圖。 5 is a cross-sectional view of an article before expansion related to the manufacturing method of the present invention in Example 4.

本發明的物品的製造方法是具有對被接著體貼附有接著帶的構成的物品的製造方法,所述物品的製造方法的特徵在於經由:步驟[1],使具有膨脹性接著劑層(A)的兩個以上的接著帶的端部彼此接近來配置,將所述接著帶的其中一個面側貼附於構成被接著體(C1)的部位(c1-1);步驟[2],將所述接著帶的另一個面側貼附於另一個被接著體(C2);步驟[3],對所述膨脹性 接著劑層(A)給予刺激;以及步驟[4],因所述刺激,所述膨脹性接著劑層(A)膨脹,而形成膨脹接著劑層(A1)。 The manufacturing method of an article of the present invention is a manufacturing method of an article having a structure in which an adhesive tape is attached to a body to be adhered. The manufacturing method of the article is characterized by: step [1], applying an expandable adhesive layer (A ), the ends of two or more bonding tapes are arranged close to each other, and one surface side of the bonding tape is attached to the portion (c1-1) constituting the adherend (C1); step [2], The other side of the bonding tape is attached to another adherend (C2); step [3], adjust the expandability The adhesive layer (A) is stimulated; and step [4] causes the expandable adhesive layer (A) to expand due to the stimulation to form an expanded adhesive layer (A1).

所述步驟[1]是對被接著體貼附接著帶的步驟。具體而言,所述步驟[1]是使具有膨脹性接著劑層(A)的兩個以上的接著帶的端部彼此重疊或接近來配置,將所述接著帶的其中一個面側貼附於構成被接著體(C1)的部位(c1-1)的步驟。 The step [1] is a step of attaching the tape carefully to the person being attached. Specifically, the step [1] is to arrange the ends of two or more adhesive tapes having the expandable adhesive layer (A) to overlap or be close to each other, and attach one of the surface sides of the adhesive tapes. The step is performed on the part (c1-1) constituting the body to be adhered (C1).

於所述步驟[1]的使具有膨脹性接著劑層(A)的兩個以上的接著帶的端部彼此接近來配置,將所述接著帶的其中一個面側貼附於構成被接著體(C1)的部位(c1-1)的步驟中,於使其端部彼此接近來配置兩個以上的所述接著帶時,較佳為不存在空隙,但亦較佳為端部彼此的空隙為100μm以下,較佳為75μm以下,若為50μm以下,則於所述步驟[4]中,所述膨脹性接著劑層(A)膨脹而形成膨脹接著劑層(A1)時,可填埋所述接著帶的端部彼此的間隙來進行固定,所以更佳。 In the step [1], the ends of two or more adhesive tapes having the expandable adhesive layer (A) are arranged close to each other, and one of the surface sides of the adhesive tapes is attached to the body constituting the adherend. In the step of (c1-1) of (C1), when two or more bonding tapes are arranged so that their ends are close to each other, it is preferable that there is no gap, but it is also preferable that there is a gap between the ends. It is 100 μm or less, preferably 75 μm or less. If it is 50 μm or less, in the step [4], when the expandable adhesive layer (A) expands to form the expandable adhesive layer (A1), it can be buried The above-mentioned fixation is performed by leaving a gap between the ends of the tape, so it is more preferable.

作為於所述步驟[1]中貼附於被接著體的接著帶的面,並無特別規定,例如於使用在其中一個面側具有所述膨脹性接著劑層(A),在另一個面具有後述接著劑層(B)的接著帶的情況下,若將所述接著劑層(A)在所述步驟[1]中貼附於被接著體,則將所述接著帶的另一個面側更牢固地接著於其他被接著體(C2),所以較佳。 The surface of the adhesive tape to be attached to the object to be adhered in step [1] is not particularly specified. For example, if the tape has the expandable adhesive layer (A) on one side and the other side, In the case of an adhesive tape having an adhesive layer (B) described later, when the adhesive layer (A) is attached to the adherend in the step [1], the other side of the adhesive tape It is better because the other side is more firmly bonded to other bonded objects (C2).

較佳為於所述步驟[1]中,對構成被接著體(C1)的部位(c1-1),以0.1N/cm2以上的負載壓接接著帶的其中一個面側, 更佳為以0.5N/cm2以上的負載進行壓接,若以1N/cm2以上的負載進行壓接,則所述接著帶向構成被接著體(C1)的部位(c1-1)的接著力提高,可抑制接著帶與被接著體(C1)的偏移,所以較佳。 Preferably, in the step [1], one of the surface sides of the bonding tape is press-bonded to the portion (c1-1) constituting the adherend (C1) with a load of 0.1 N/cm 2 or more, and more preferably When pressure bonding is performed with a load of 0.5 N/cm 2 or more, and if pressure bonding is performed with a load of 1 N/cm 2 or more, the bonding force of the bonding tape to the portion (c1-1) constituting the adherend (C1) is improved. , it is preferable because it can suppress the deviation between the bonding tape and the adhered body (C1).

於對構成所述被接著體(C1)的部位(c1-1)壓接所述接著帶的其中一個面側時,既可視需要使用衝壓機、輥等設備,亦可利用手指對它們進行按壓。 When crimping one of the surface sides of the adhesive tape to the portion (c1-1) constituting the adherend (C1), you can use equipment such as a punch or a roller if necessary, or you can press them with your fingers. .

所述步驟[2]是將在所述步驟[1]中貼附於構成所述被接著體(C1)的部位(c1-1)的所述接著帶的另一個面側貼附於其他被接著體(C2)的步驟。於將所述接著帶的另一個面側貼附於其他被接著體(C2)的情況下,可經由所述被接著體(C2)對所述被接著體(C2)與所述接著帶的界面施加負載,而且亦可任意地進行壓接。 The step [2] is to attach the other surface side of the adhesive tape attached to the portion (c1-1) constituting the adherend (C1) in the step [1] to another adherent. Follow the steps of body (C2). When the other side of the adhesive tape is attached to another adherent body (C2), the connection between the adherend body (C2) and the adhesive tape can be made through the adherend body (C2). A load is applied to the interface, and pressure bonding can be performed optionally.

所述步驟[3]是對膨脹性接著劑層(A)給予刺激的步驟。作為所述刺激,例如可列舉熱或光。作為所述刺激,就亦可應用於不透光的構件的方面而言,較佳為加熱。另外,作為加熱溫度,較佳為60℃~145℃的溫度下,若為70℃~140℃的溫度下,則保管時的穩定性優異,且可不會損傷耐熱性低的被接著體而使所述接著帶充分地膨脹,並可於膨脹後獲得優異的接著力,所以較佳。 The step [3] is a step of stimulating the expandable adhesive layer (A). Examples of the stimulus include heat or light. As the stimulus, in terms of being applicable to light-impermeable members, heating is preferred. In addition, the heating temperature is preferably 60°C to 145°C. If it is 70°C to 140°C, the stability during storage is excellent and the adherend with low heat resistance can be used without damaging it. The adhesive tape is preferably fully expanded and can obtain excellent adhesive force after expansion.

作為所述加熱方法,例如可列舉將物品投入至烘箱或加熱爐等加熱裝置中,對物品整體進行加熱的方法,或藉由使熱源接觸 或接近所述膨脹性接著劑層(A)或所述接著帶或所述被接著體來對所述膨脹性接著劑層(A)進行加熱的方法。 Examples of the heating method include a method in which the article is put into a heating device such as an oven or a heating furnace and the entire article is heated, or a method in which a heat source is brought into contact with the article. Or a method of heating the expandable adhesive layer (A) close to the expandable adhesive layer (A), the adhesive tape, or the adherend.

作為所述熱源,例如可使用鹵素燈、雷射照射裝置、電磁感應加熱裝置、加熱印(hot stamp)、加熱板(hot plate)、焊接烙鐵(soldering iron)等。作為加熱方法,可根據物品的大小來選擇。 As the heat source, for example, a halogen lamp, a laser irradiation device, an electromagnetic induction heating device, a hot stamp, a hot plate, a soldering iron, etc. can be used. As a heating method, you can choose it according to the size of the item.

所述步驟[4]是所述膨脹性接著劑層(A)形成所述膨脹接著劑層(A1)的步驟。 The step [4] is a step in which the expandable adhesive layer (A) forms the expandable adhesive layer (A1).

於所述步驟[3]及步驟[4]中,較佳為於對所述接著帶給予刺激,使膨脹性接著劑層(A)膨脹而形成膨脹接著劑層(A1)的過程中,對所述接著帶施加50N/cm2以下的負載,較佳為施加25N/cm2以下的負載,若施加10N/cm2以下的負載,則可較佳地填埋使兩個以上的具有所述膨脹性接著劑層(A)的接著帶的端部彼此接近時所產生的間隙,所以較佳。 In the steps [3] and [4], it is preferable that in the process of stimulating the adhesive tape to expand the expandable adhesive layer (A) to form the expandable adhesive layer (A1), The adhesive tape applies a load of 50 N/cm 2 or less, preferably 25 N/cm 2 or less. If a load of 10 N/cm 2 or less is applied, it can be preferably buried so that two or more adhesive tapes having the above-mentioned It is preferable because the gap is created when the ends of the adhesive tape of the expandable adhesive layer (A) are close to each other.

作為所述物品的製造方法,若以所述步驟[1]、步驟[2]、步驟[3]及步驟[4]的順序來進行,則於給予刺激而形成膨脹接著劑層(A1)前具有優異的接著力,藉由刺激能夠膨脹,且於膨脹後亦呈現優異的接著力的方面較佳。尤其是於被接著體(C1)或被接著體(C2)的表面為粗糙面的情況下,於呈現良好的接著力方面是有效的。 As a method of manufacturing the article, if the steps [1], [2], [3] and [4] are performed in this order, before stimulation is given to form the expanded adhesive layer (A1) It is preferred that it has excellent adhesion, can expand by stimulation, and also exhibits excellent adhesion after expansion. Especially when the surface of the adherend (C1) or the adherend (C2) is a rough surface, it is effective in exhibiting good adhesive force.

於本發明中,藉由使所述膨脹性接著劑層(A)膨脹而產生的力,將所述接著劑層(A1)或所述接著劑層(B)與構成所述被接著體(C1)的其他部位(c1-2)或其他被接著體(C2)壓 接。因此,例如於被接著體(C1)具有空隙或於被接著體(C1)與被接著體(C2)之間具有空隙的情況下,無需使用例如衝壓機等來施加壓力。而且,接著帶與被接著體藉由因所述膨脹而產生的力而密接,因此,即便於使用了表面具有凹凸者(具有粗糙面者)作為被接著體的情況下,亦不易於接著帶與被接著體之間形成間隙。 In the present invention, by the force generated by expanding the expandable adhesive layer (A), the adhesive layer (A1) or the adhesive layer (B) and the adherend ( C1) other parts (c1-2) or other connected body (C2) press catch. Therefore, for example, when the adherend (C1) has a gap or there is a gap between the adherend (C1) and the adherend (C2), there is no need to use a punch or the like to apply pressure. Furthermore, the adhesive tape and the adherend are in close contact with each other due to the force generated by the expansion. Therefore, even if a person with an uneven surface (a rough surface) is used as the adherend, the tape will not be easily adhered. A gap is formed between the bonded body and the bonded body.

作為所述被接著體(C1)及被接著體(C2),例如可列舉玻璃、鋁等金屬、包括丙烯酸、聚碳酸酯等樹脂的塑膠等。作為所述被接著體(C1)及被接著體(C2),既可使用包括相同的材質或形狀者,亦可使用不同的材質或形狀者。 Examples of the adherend (C1) and the adherend (C2) include glass, metals such as aluminum, and plastics including resins such as acrylic and polycarbonate. As the adherend body (C1) and the adherend body (C2), those having the same material or shape may be used, or those having different materials or shapes may be used.

作為所述被接著體(C1)及被接著體(C2),所述膨脹性接著劑層(A)或所述接著劑層(B)所接觸的表面可為粗糙面。 As the adherend (C1) and the adherend (C2), the surface in contact with the expandable adhesive layer (A) or the adhesive layer (B) may be a rough surface.

作為所述被接著體(C1)及所述被接著體(C2)的形狀,並無特別規定,例如可列舉:二維形狀、三維形狀(曲面等)、具有表面凹凸的形狀、嵌合的形狀等。亦可為所述形狀的組合。 The shapes of the adherends (C1) and the adherends (C2) are not particularly limited. Examples thereof include: two-dimensional shapes, three-dimensional shapes (curved surfaces, etc.), shapes with surface irregularities, and fitting shapes. shape etc. A combination of the above shapes is also possible.

作為所述被接著體,例如可於被接著體表面具有1μm以下的微小的凹凸、或者壓花(emboss)加工或印刷階差般1μm以上的凹凸、或於被接著體自身具有翹曲或形變。作為所述凹凸,較佳為500μm以下,更佳為400μm以下,進而佳為300μm以下,作為所述被接著體的翹曲或形變,較佳為針對對所述被接著體接著所述接著帶的部位,高度最高的點與最低的點之差為500μm以下者,更佳為400μm以下,若為300μm以下,則即便於使所述 接著帶的端部彼此接近來配置時具有空隙,或被接著體(C1)具有空隙,或者於被接著體(C1)與被接著體(C2)之間具有空隙,而所述空隙的高度(厚度)大的情況下,亦可於對所述接著帶給予刺激使其膨脹時充分地接著,所以進而佳。 The adherend may have, for example, minute irregularities of 1 μm or less on the surface of the adherend, or irregularities of 1 μm or more such as embossing or printing steps, or the adherend itself may have warping or deformation. . The unevenness is preferably 500 μm or less, more preferably 400 μm or less, and still more preferably 300 μm or less. The warpage or deformation of the adherend is preferably for bonding the adhesive tape to the adherend. If the difference between the highest point and the lowest point is 500 μm or less, it is more preferably 400 μm or less. If it is 300 μm or less, it is easy to make the above Then there is a gap when the ends of the tape are arranged close to each other, or the adherend (C1) has a gap, or there is a gap between the adherend (C1) and the adherend (C2), and the height of the gap ( When the adhesive tape is thicker, it is more preferable because it can be fully adhered when the adhesive tape is stimulated to expand.

而且,作為所述被接著體,可為曲面彼此的組合,作為所述曲面,既可為曲率半徑相同者彼此,亦可為曲率半徑不同者彼此。作為所述曲率半徑,若為0.1mm~10mm的範圍,則可於經由所述接著帶所接觸的一個或兩個的被接著體對所述接著帶施加50N/cm2以下的負載並使其膨脹時,獲得良好的接著性。另外,於所述被接著體彼此的曲率半徑不同的情況下,較佳為貼附有所述接著帶的被接著體的、自所述接著帶表面向另一個被接著體的間隙(gap)為500μm以下,更佳為400μm以下者,若為300μm以下,則即便於使所述接著帶的端部彼此接近來配置時具有空隙,或被接著體(C1)具有空隙,或者於被接著體(C1)與被接著體(C2)之間具有空隙,而所述空隙的高度(厚度)大的情況下,亦可於對所述接著帶給予刺激使其膨脹時充分地接著,所以進而佳。 Furthermore, the adherend may be a combination of curved surfaces, and the curved surfaces may have the same curvature radius or may have different curvature radii. If the curvature radius is in the range of 0.1 mm to 10 mm, a load of 50 N/cm 2 or less can be applied to the bonding tape on one or two adherends that are in contact with the bonding tape. When expanded, good adhesion is obtained. In addition, when the curvature radii of the adherends are different from each other, it is preferably a gap from the surface of the adhesive tape to the other adherend of the adherend to which the adhesive tape is attached. It is 500 μm or less, more preferably 400 μm or less. If it is 300 μm or less, there is a gap even when the ends of the bonding tape are arranged close to each other, or the adherend (C1) has a gap, or there is a gap in the adherend. When there is a gap between (C1) and the adherend (C2), and the height (thickness) of the gap is large, sufficient adhesion can be achieved when the adhesive tape is stimulated to expand, so it is further preferable. .

本發明中所使用的接著帶可藉由對所述熱塑性熱膨脹性接著劑層(A)或所述接著帶整體給予熱而使其膨脹。 The adhesive tape used in the present invention can be expanded by applying heat to the thermoplastic heat-expandable adhesive layer (A) or the entire adhesive tape.

本發明中所使用的接著帶具有因刺激而進行膨脹的膨脹性接著劑層(A),所述膨脹性接著劑層(A)既可為一種或兩種以上,亦可為單層或兩層以上。而且,作為所述接著帶,既可僅包括所 述膨脹性接著劑層(A),亦可包括所述膨脹性接著劑層(A)及不易膨脹的接著劑層(例如後述的接著劑層(B)等),若為包括所述膨脹性接著劑層(A)及不易膨脹的接著劑層的接著帶,則於藉由所述接著帶的膨脹物來對被接著體(C1)所具有的空隙或被接著體(C1)與被接著體(C2)之間的空隙進行填充且牢固地進行接著方面較佳。 The adhesive tape used in the present invention has an expandable adhesive layer (A) that expands due to stimulation. The expandable adhesive layer (A) may be one type or two or more types, or may be a single layer or two layers. layer or above. Furthermore, the adhesive tape may include only the The expandable adhesive layer (A) may also include the expandable adhesive layer (A) and an adhesive layer that is not easily expanded (such as the adhesive layer (B) described below). If it includes the expandable adhesive layer (A), The adhesive layer (A) and the adhesive tape of the adhesive layer that is not easily expanded are used to create gaps between the adherend (C1) or the adherend (C1) and the adherend by the expansion of the adhesive tape. It is preferred that the gaps between the bodies (C2) are filled and firmly bonded.

作為包括所述膨脹性接著劑層(A)與不易膨脹的接著劑層的接著帶,具體而言,較佳為使用於所述膨脹性接著劑層(A)的至少一個面上具有後述接著劑層(B)者。作為所述接著帶,若將所述膨脹性接著劑層(A)於所述膨脹前預先貼附於被接著體,則於維持所述膨脹後的所述膨脹接著劑層(A1)與所述被接著體之間的優異的密接性方面較佳。 As an adhesive tape including the expandable adhesive layer (A) and an adhesive layer that is not easily expanded, specifically, it is preferable to use an adhesive tape having an adhesive layer described below on at least one side of the expandable adhesive layer (A). Agent layer (B). As the adhesive tape, if the expandable adhesive layer (A) is attached to the adherend in advance before the expansion, the expanded adhesive layer (A1) after maintaining the expansion will be It is preferable in terms of excellent adhesion between the adherends.

(膨脹性接著劑層(A)) (Expansive adhesive layer (A))

所述膨脹性接著劑層(A)是能夠因刺激而膨脹的層。作為所述刺激,可列舉熱及/或光,較佳為熱。作為所述膨脹性接著劑層(A),較佳為使用膨脹性接著劑層(A)的厚度方向的膨脹率〔加熱後的所述放置後的膨脹性接著劑層(A)的厚度/所述放置前的膨脹性接著劑層(A)的厚度〕×100成為120%以上者。所述膨脹率較佳為150%以上,更佳為200%~1000%。若為所述接著帶,則即便於使所述接著帶的端部彼此接近來配置時具有空隙,或被接著體(C1)具有空隙,或者於被接著體(C1)與被接著體(C2)之間具有空隙,而所述空隙的高度(厚度)大的情況下, 亦可藉由使所述接著帶膨脹而在所述空隙內對另一個被接著體較佳地進行固定或在所述空隙內填充所述接著帶。而且,若為所述接著帶,則即便於被接著體的表面為粗糙面的情況下,亦可對所述粗糙面較佳地固定另一個被接著體。 The expandable adhesive layer (A) is a layer capable of expanding due to stimulation. Examples of the stimulus include heat and/or light, and heat is preferred. As the expandable adhesive layer (A), it is preferable to use the expansion ratio in the thickness direction of the expandable adhesive layer (A) [thickness of the expandable adhesive layer (A) after heating and standing/ The thickness of the expandable adhesive layer (A) before standing is 120% or more × 100. The expansion rate is preferably above 150%, and more preferably between 200% and 1000%. In the case of the bonding tape, even when the ends of the bonding tape are arranged close to each other, there is a gap, or the body to be adhered (C1) has a gap, or there is a gap between the body to be bonded (C1) and the body to be bonded (C2). ), and the height (thickness) of the gap is large, By expanding the adhesive tape, another adherend can be preferably fixed in the gap or the adhesive tape can be filled in the gap. Moreover, with the adhesive tape, even if the surface of the adherend is a rough surface, another adherend can be preferably fixed to the rough surface.

另外,所述膨脹率是指於將所述接著帶於50℃~150℃的溫度下放置了30分鐘的情況下,膨脹性接著劑層(A)因所述放置而膨脹從而所形成的膨脹接著劑層(A1)的厚度相對於所述放置前(膨脹前)的膨脹性接著劑層(A)的厚度的比例,較佳為60℃~145℃的溫度下,更佳為70℃~140℃的溫度下。 In addition, the expansion rate refers to the expansion caused by the expansion of the expandable adhesive layer (A) due to the expansion of the adhesive tape at a temperature of 50°C to 150°C for 30 minutes. The ratio of the thickness of the adhesive layer (A1) to the thickness of the expandable adhesive layer (A) before being left (before expansion) is preferably between 60°C and 145°C, more preferably between 70°C and 145°C. at a temperature of 140°C.

作為所述膨脹性接著劑層(A),就賦予加熱前亦能夠暫時貼附於被接著體的水準的接著性的方面而言,較佳為使用沿180度方向以300mm/分鐘的速度進行剝離時的接著力為0.5N/20mm以上者,更佳為使用1N/20mm以上者,更佳為使用2N/20mm以上者,若使用3N/20mm以上者,則於防止所述接著帶自被接著體的剝離或位置偏移方面進而佳。 As the expandable adhesive layer (A), in terms of imparting a level of adhesiveness that can be temporarily attached to the adherend even before heating, it is preferable to use an adhesive layer in a 180-degree direction at a speed of 300 mm/minute. The adhesive force during peeling is 0.5N/20mm or more, more preferably 1N/20mm or more, more preferably 2N/20mm or more, and if 3N/20mm or more is used, it will prevent the adhesive tape from being It is further advantageous in terms of peeling off or positional deviation of the subsequent body.

膨脹前的所述膨脹性接著劑層(A)的厚度較佳為10μm~300μm的範圍,更佳為20μm~250μm的範圍,若為30μm~200μm的範圍,則即便於使所述接著帶的端部彼此接近來配置時具有空隙,或被接著體(C1)具有空隙,或者於被接著體(C1)與被接著體(C2)之間具有空隙,而所述空隙的高度(厚度)大的情況下,亦可藉由使所述接著帶膨脹而在所述空隙內對另一個被接著體較佳地進行固定或在所述空隙內填充所述接著帶,所以 較佳。 The thickness of the expandable adhesive layer (A) before expansion is preferably in the range of 10 μm to 300 μm, more preferably in the range of 20 μm to 250 μm. If it is in the range of 30 μm to 200 μm, it is easy to make the adhesive tape There is a gap when the ends are arranged close to each other, or the body to be connected (C1) has a gap, or there is a gap between the body to be connected (C1) and the body to be connected (C2), and the height (thickness) of the gap is large In the case of , it is also possible to better fix another adherend in the gap by expanding the adhesive tape or to fill the gap with the adhesive tape, so Better.

另一方面,藉由所述膨脹性接著劑層(A)膨脹而形成的膨脹接著劑層(A1)的厚度,較佳為20μm~3000μm的範圍,若為40μm~2500μm的範圍,則於獲得更優異的接著力的方面較佳。而且,所述膨脹接著劑層(A1)較佳為具有多孔結構者。 On the other hand, the thickness of the expanded adhesive layer (A1) formed by expansion of the expandable adhesive layer (A) is preferably in the range of 20 μm to 3000 μm. If it is in the range of 40 μm to 2500 μm, then the thickness of the expanded adhesive layer (A1) is obtained. It is better in terms of better adhesion. Furthermore, the expanded adhesive layer (A1) preferably has a porous structure.

而且,作為所述接著帶,較佳為使用所述膨脹性接著劑層(A)的厚度相對於所述接著帶的總厚度而為10%以上者,若使用30%以上者,則容易較佳地將另一個被接著體固定於所述空隙內或在所述空隙內填充所述接著帶,所以更佳。 Furthermore, as the adhesive tape, it is preferable to use one whose thickness of the expandable adhesive layer (A) is 10% or more relative to the total thickness of the adhesive tape. If it is 30% or more, it is easier to use the adhesive tape. It is better to fix another adherend in the gap or to fill the gap with the bonding tape.

作為所述膨脹性接著劑層(A),使用如前所述具有可預先接著於被接著體的程度的接著力,並且可藉由所述膨脹性接著劑層(A)膨脹而產生的加壓力來對被接著體(C1)所具有的空隙或被接著體(C1)與被接著體(C2)之間的空隙進行填充及接著者。 As the expandable adhesive layer (A), an adhesive force capable of being adhered to the object to be adhered in advance as described above and an adhesive force that can be generated by expansion of the expandable adhesive layer (A) is used. Pressure is used to fill and connect the gaps in the adherend (C1) or the gaps between the adherend (C1) and the adherend (C2).

作為所述膨脹性接著劑層(A),可藉由將後述接著劑組成物(a)塗覆於例如離型襯裡(liner)或黏著帶的支撐體上並進行乾燥等來製造。 The expandable adhesive layer (A) can be produced by applying an adhesive composition (a) described below on a support such as a release liner or an adhesive tape and drying it.

所述膨脹性接著劑層(A)例如可使用含有熱塑性樹脂的接著劑組成物(a)來形成。所述熱塑性樹脂的含量較佳為相對於接著劑組成物(a)的總固體成分而為50質量%以上,更佳為75質量%以上,進而佳為90質量%以上。 The expandable adhesive layer (A) can be formed using an adhesive composition (a) containing a thermoplastic resin, for example. The content of the thermoplastic resin is preferably 50 mass% or more, more preferably 75 mass% or more, and still more preferably 90 mass% or more with respect to the total solid content of the adhesive composition (a).

作為所述熱塑性樹脂,可使用能夠容易因加熱而膨脹者。 As the thermoplastic resin, one that can easily expand by heating can be used.

作為所述熱塑性樹脂,較佳為使用利用1Hz及23℃下的動態黏彈性譜(spectrum)測定的儲存彈性模數G23為1.0×103Pa~5.0×107Pa的範圍者,並且,較佳為使用利用1Hz及70℃下的動態黏彈性譜測定的儲存彈性模數G70為1.0×102Pa~1.0×107Pa的範圍者,並且,若使用利用1Hz及120℃下的動態黏彈性譜測定的儲存彈性模數G120為1.0×102Pa~1.0×106Pa的範圍者,則於獲得即便於加熱前亦可防止所述接著帶自被接著體剝離或位置偏移,並且,能夠膨脹至能夠充分地填充所述空隙的水準的接著帶方面尤佳。 The thermoplastic resin preferably has a storage elastic modulus G23 in the range of 1.0×10 3 Pa to 5.0×10 7 Pa measured by a dynamic viscoelastic spectrum (spectrum) at 1 Hz and 23° C., and is relatively It is preferable to use a storage elastic modulus G70 in the range of 1.0×10 2 Pa to 1.0×10 7 Pa measured by dynamic viscoelasticity spectroscopy at 1 Hz and 70°C, and if using dynamic viscoelasticity at 1 Hz and 120°C, If the storage elastic modulus G120 measured by the elastic spectrum is in the range of 1.0×10 2 Pa to 1.0×10 6 Pa, the adhesive tape can be prevented from peeling off or positional deviation from the adherend even before heating, and , it is particularly preferable to use an adhesive tape that can expand to a level that can fully fill the gaps.

使所述熱塑性熱膨脹性接著劑層(A)膨脹前的狀態的接著帶就即便於加熱前亦可防止所述接著帶自被接著體剝離或位置偏移並且於膨脹後於常溫環境下抑制收縮等方面而言,可使用含有利用1Hz及23℃下的動態黏彈性譜測定的儲存彈性模數G23較佳為1.0×103Pa~5.0×107Pa,更佳為5.0×103Pa~1.0×107Pa,尤佳為5.0×103Pa~5.0×106Pa的熱塑性樹脂者。 The adhesive tape in the state before expansion of the thermoplastic heat-expandable adhesive layer (A) can prevent the adhesive tape from peeling off or positional deviation from the adherend even before heating, and can suppress shrinkage in a normal temperature environment after expansion. In terms of other aspects, the storage elastic modulus G23 measured by dynamic viscoelastic spectrum at 1 Hz and 23°C can be used. The storage elastic modulus G23 is preferably 1.0×10 3 Pa~5.0×10 7 Pa, and more preferably 5.0×10 3 Pa~ 1.0×10 7 Pa, preferably a thermoplastic resin of 5.0×10 3 Pa to 5.0×10 6 Pa.

而且,作為所述熱塑性樹脂,就抑制向黏著帶的平面方向(流動方向或寬度方向)的膨脹,使之向其厚度方向膨脹方面而言,較佳為使用具有所述範圍內的利用1Hz及23℃下的動態黏彈性譜測定的儲存彈性模數G23並且70℃~120℃的範圍的利用1Hz下的動態黏彈性譜測定的儲存彈性模數為1.0×102Pa~1.0×107Pa的範圍者。 Furthermore, in terms of suppressing expansion in the planar direction (flow direction or width direction) of the adhesive tape and allowing expansion in the thickness direction of the adhesive tape, it is preferable to use a thermoplastic resin having a temperature range of 1 Hz and 1 Hz within the above range. The storage elastic modulus measured by the dynamic viscoelastic spectrum at 23°C is G23 and the storage elastic modulus measured by the dynamic viscoelastic spectrum at 1 Hz in the range of 70°C to 120°C is 1.0×10 2 Pa to 1.0×10 7 Pa. range person.

作為所述熱塑性樹脂,可使用利用1Hz及70℃下的動態黏 彈性譜測定的儲存彈性模數G70較佳為1.0×102Pa~1.0×107Pa,更佳為5.0×102Pa~5.0×106Pa,尤佳為5.0×102Pa~1.0×106Pa者。 As the thermoplastic resin, the storage elastic modulus G70 measured by dynamic viscoelasticity spectrum at 1 Hz and 70° C. is preferably 1.0×10 2 Pa to 1.0×10 7 Pa, more preferably 5.0×10 2 Pa to 5.0×10 6 Pa, preferably 5.0×10 2 Pa~1.0×10 6 Pa.

而且,作為所述熱塑性樹脂,可使用利用1Hz及70℃下的動態黏彈性譜測定的儲存彈性模數G70較佳為1.0×102Pa~1.0×107Pa,更佳為5.0×102Pa~5.0×106Pa,尤佳為5.0×102Pa~1.0×106Pa者。 Furthermore, as the thermoplastic resin, the storage elastic modulus G70 measured by dynamic viscoelasticity spectrum at 1 Hz and 70° C. is preferably 1.0×10 2 Pa to 1.0×10 7 Pa, more preferably 5.0×10 2 Pa~5.0×10 6 Pa, preferably 5.0×10 2 Pa~1.0×10 6 Pa.

而且,所述熱塑性樹脂的利用1Hz及120℃下的動態黏彈性譜測定的儲存彈性模數G120較佳為1.0×102Pa~1.0×106Pa,更佳為5.0×102Pa~5.0×106Pa,進而佳為5.0×102Pa~2.0×105Pa。 Moreover, the storage elastic modulus G120 of the thermoplastic resin measured using the dynamic viscoelastic spectrum at 1 Hz and 120°C is preferably 1.0×10 2 Pa~1.0×10 6 Pa, and more preferably 5.0×10 2 Pa~5.0 ×10 6 Pa, more preferably 5.0×10 2 Pa to 2.0×10 5 Pa.

所述熱塑性樹脂的所述儲存彈性模數G120較佳為小於所述儲存彈性模數G70,所述儲存彈性模數G70較佳為小於所述儲存彈性模數G23。 The storage elastic modulus G120 of the thermoplastic resin is preferably smaller than the storage elastic modulus G70, and the storage elastic modulus G70 is preferably smaller than the storage elastic modulus G23.

另外,所述儲存彈性模數G23、儲存彈性模數G70及儲存彈性模數G120的測定是使用市售的黏彈性試驗機利用後述實施例所記載的方法進行測定。作為所述測定的試驗片,使用藉由將熱塑性熱膨脹性接著劑層(A)中所含的熱塑性樹脂(不含膨脹劑)加熱,並將其塗佈於離型襯裡上進行冷卻而獲得的厚度2mm的試驗片。 In addition, the storage elastic modulus G23, the storage elastic modulus G70, and the storage elastic modulus G120 were measured using a commercially available viscoelasticity testing machine using the method described in the Examples described below. As a test piece for the measurement, one obtained by heating the thermoplastic resin (expanding agent-free) contained in the thermoplastic heat-expandable adhesive layer (A), applying it to a release liner, and cooling it was used. A test piece with a thickness of 2 mm.

作為所述熱塑性樹脂,例如較佳為使用膨脹前具有優異的接著力,於膨脹劑的膨脹開始溫度進行軟化,膨脹劑容易膨脹,膨脹後亦可呈現優異的接著力者。 As the thermoplastic resin, for example, it is preferable to use one that has excellent adhesion before expansion, softens at the expansion start temperature of the expansion agent, makes the expansion agent easy to expand, and exhibits excellent adhesion after expansion.

作為所述熱塑性樹脂例如可列舉:聚胺基甲酸酯 (polyurethane,PU)、熱塑性聚胺基甲酸酯(Thermoplastic Polyurethane,TPU)等胺基甲酸酯系樹脂;聚碳酸酯(polycarbonate,PC);聚氯乙烯(polyvinyl chloride,PVC)、氯乙烯-乙酸乙烯酯共聚樹脂等氯乙烯系樹脂;聚丙烯酸、聚甲基丙烯酸、聚丙烯酸甲酯、聚甲基丙烯酸甲酯(Poly(methyl methacrylate),PMMA)、聚甲基丙烯酸乙酯等丙烯酸系樹脂;聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚對苯二甲酸丁二酯、聚對苯二甲酸丙二醇酯(polytrimethylene terephthalate)、聚萘二甲酸乙二醇酯、聚萘二甲酸丁二醇酯等聚酯系樹脂;尼龍(註冊商標)等聚醯胺系樹脂;聚苯乙烯(polystyrene,PS)、醯亞胺改質聚苯乙烯、丙烯腈.丁二烯.苯乙烯(Acrylonitrile Butadiene Styrene,ABS)樹脂、醯亞胺改質ABS樹脂、苯乙烯.丙烯腈共聚(Styrene Acrylonitrile,SAN)樹脂、丙烯腈.乙烯-丙烯-二烯.苯乙烯(acrylonitrile.ethylene-propylene-diene.styrene,AES)樹脂等聚苯乙烯樹脂、聚乙烯(polyethelyne,PE)樹脂、聚丙烯(polypropylene,PP)樹脂、環烯烴樹脂等烯烴系樹脂;硝酸纖維素(nitrocellulose)、乙酸纖維素等纖維素系樹脂;矽酮系樹脂;氟系樹脂等熱塑性樹脂、苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體、氯乙烯系熱塑性彈性體、胺基甲酸酯系熱塑性彈性體、酯系熱塑性彈性體、醯胺系熱塑性彈性體等熱塑性彈性體。 Examples of the thermoplastic resin include polyurethane Urethane resins such as (polyurethane, PU) and thermoplastic polyurethane (TPU); polycarbonate (PC); polyvinyl chloride (PVC), vinyl chloride- Vinyl chloride resins such as vinyl acetate copolymer resin; acrylic resins such as polyacrylic acid, polymethacrylic acid, polymethyl acrylate, poly(methyl methacrylate) (PMMA), polyethyl methacrylate, etc. ; Polyethylene terephthalate (PET), polybutylene terephthalate, polytrimethylene terephthalate (polytrimethylene terephthalate), polyethylene naphthalate, polynaphthalate Polyester resins such as butylene glycol ester; polyamide resins such as nylon (registered trademark); polystyrene (PS), imide modified polystyrene, and acrylonitrile. Butadiene. Styrene (Acrylonitrile Butadiene Styrene, ABS) resin, imide modified ABS resin, styrene. Acrylonitrile copolymer (Styrene Acrylonitrile, SAN) resin, acrylonitrile. Ethylene-propylene-diene. Polystyrene resins such as styrene (acrylonitrile.ethylene-propylene-diene.styrene, AES) resin, polyethylene (polythelyne, PE) resin, polypropylene (polypropylene, PP) resin, cyclic olefin resin and other olefin resins; nitrocellulose Cellulose-based resins such as nitrocellulose and cellulose acetate; silicone-based resins; thermoplastic resins such as fluorine-based resins, styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, vinyl chloride-based thermoplastic elastomers, and urethane Thermoplastic elastomers such as ester thermoplastic elastomer, ester thermoplastic elastomer, and amide thermoplastic elastomer.

作為熱塑性樹脂,該些之中,尤其是較佳為使用苯乙烯系熱 塑性彈性體、烯烴系熱塑性彈性體、氯乙烯系熱塑性彈性體、酯系熱塑性彈性體、胺基甲酸酯系熱塑性彈性體、醯胺系熱塑性彈性體或丙烯酸系樹脂等,尤佳為使用苯乙烯系熱塑性彈性體或丙烯酸系樹脂。 As the thermoplastic resin, among these, styrenic thermoplastic resin is particularly preferred. Plastic elastomers, olefin-based thermoplastic elastomers, vinyl chloride-based thermoplastic elastomers, ester-based thermoplastic elastomers, urethane-based thermoplastic elastomers, amide-based thermoplastic elastomers, or acrylic resins, etc., especially those using benzene Ethylene thermoplastic elastomer or acrylic resin.

作為苯乙烯系熱塑性彈性體,例如可列舉:苯乙烯-乙烯-丁烯共聚物(styrene-ethylene-butylene,SEB)等苯乙烯系AB型二嵌段(diblock)共聚物;苯乙烯-丁二烯-苯乙烯共聚物(styrene-butylene-styrene,SBS)、SBS的氫化產物(苯乙烯-乙烯-丁烯-苯乙烯共聚物(styrene-ethylene-butylene-styrene,SEBS))、苯乙烯-異戊二烯-苯乙烯共聚物(styrene-isoprene-styrene,SIS)、SIS的氫化產物(苯乙烯-乙烯-丙烯-苯乙烯共聚物(styrene-ethylene-propylene-styrene,SEPS))、苯乙烯-異丁烯-苯乙烯共聚物(styrene-isbutylene-styrene,SIBS)等苯乙烯系ABA型三嵌段共聚物;苯乙烯-丁二烯-苯乙烯-丁二烯(styrene-butadiene-styrene-butadiene,SBSB)等苯乙烯系ABAB型四嵌段共聚物;苯乙烯-丁二烯-苯乙烯-丁二烯-苯乙烯(styrene-butadiene-styrene-butadiene-styrene,SBSBS)等苯乙烯系ABABA型五嵌段共聚物;具有該些以上的AB重複單元的苯乙烯系多嵌段共聚物;對苯乙烯-丁二烯橡膠(styrene-butadiene rubber,SBR)等苯乙烯系隨機共聚物的乙烯性雙鍵進行氫化而得的氫化產物等。苯乙烯系熱塑性彈性體可使用市售品。 Examples of the styrenic thermoplastic elastomer include styrene-based AB diblock copolymers such as styrene-ethylene-butylene (SEB); styrene-butylene Ethylene-styrene copolymer (styrene-butylene-styrene, SBS), hydrogenation product of SBS (styrene-ethylene-butylene-styrene copolymer (styrene-ethylene-butylene-styrene, SEBS)), styrene-iso- Pentadiene-styrene copolymer (styrene-isoprene-styrene, SIS), hydrogenation product of SIS (styrene-ethylene-propylene-styrene copolymer (SEPS)), styrene- Styrene-based ABA-type triblock copolymers such as isobutylene-styrene copolymer (styrene-isbutylene-styrene, SIBS); styrene-butadiene-styrene-butadiene (SBSB) ) and other styrene-based ABAB-type tetrablock copolymers; styrene-based ABABA-type pentablock copolymers such as styrene-butadiene-styrene-butadiene-styrene (styrene-butadiene-styrene-butadiene-styrene, SBSBS) Segment copolymer; styrenic multi-block copolymer having these or more AB repeating units; ethylenic double bonds of styrene-based random copolymers such as styrene-butadiene rubber (SBR) Hydrogenation products obtained by hydrogenation, etc. As the styrenic thermoplastic elastomer, commercially available products can be used.

作為所述丙烯酸系樹脂,例如可使用將含有(甲基)丙烯酸烷基酯的單體聚合而得者。 As the acrylic resin, for example, one obtained by polymerizing a monomer containing alkyl (meth)acrylate can be used.

作為所述(甲基)丙烯酸烷基酯,較佳為使用具有碳原子數4~12的烷基的(甲基)丙烯酸酯,具體而言,較佳為使用(甲基)丙烯酸丁酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯等,更佳為單獨或組合使用丙烯酸丁酯及丙烯酸2-乙基己酯。 As the (meth)acrylic acid alkyl ester, it is preferable to use a (meth)acrylate having an alkyl group having 4 to 12 carbon atoms. Specifically, it is preferable to use butyl (meth)acrylate, Isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, etc., more preferably, butyl acrylate and 2-ethylhexyl acrylate are used alone or in combination.

而且,作為所述單體,除所述單體之外,亦可使用丙烯腈、(甲基)丙烯酸、馬來酸酐、丙烯醯胺、衣康酸、苯乙烯、乙酸乙烯酯等。 Furthermore, as the monomer, in addition to the above-mentioned monomers, acrylonitrile, (meth)acrylic acid, maleic anhydride, acrylamide, itaconic acid, styrene, vinyl acetate, etc. can also be used.

而且,所述膨脹性接著劑層(A)例如可使用含有熱硬化性樹脂的接著劑組成物(a)而形成。所述熱硬化性樹脂的含量較佳為相對於接著劑組成物(a)的總固體成分而為50質量%以上,更佳為75質量%以上,進而佳為90質量%以上。 Moreover, the said expandable adhesive layer (A) can be formed using the adhesive composition (a) containing a thermosetting resin, for example. The content of the thermosetting resin is preferably 50 mass% or more, more preferably 75 mass% or more, and still more preferably 90 mass% or more with respect to the total solid content of the adhesive composition (a).

作為所述熱硬化性樹脂,可使用胺基甲酸酯樹脂、酚樹脂、不飽和聚酯樹脂、環氧樹脂、丙烯酸樹脂等。其中,例如可單獨或組合使用兩種以上的雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、乙內醯脲(hydantoin)型環氧樹脂、聯苯型環氧樹脂、脂環式環氧樹脂、三苯甲烷型環氧樹脂、苯酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂、萘酚酚醛清漆型環氧樹脂、二環戊二烯/苯酚環氧樹脂、脂環式胺環氧樹脂、脂肪族胺環氧樹脂、及經CTBN改質(端羧基丁二烯腈(carboxyl-terminated butadiene nitrile)改質)或鹵素改質的環氧 樹脂等。 As the thermosetting resin, urethane resin, phenol resin, unsaturated polyester resin, epoxy resin, acrylic resin, etc. can be used. Among them, for example, two or more bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, hydantoin-type epoxy resins, and biphenyl can be used alone or in combination. type epoxy resin, alicyclic epoxy resin, triphenylmethane type epoxy resin, phenol novolak type epoxy resin, cresol novolac type epoxy resin, naphthol novolac type epoxy resin, dicyclopentadienyl Olefin/phenol epoxy resin, alicyclic amine epoxy resin, aliphatic amine epoxy resin, and CTBN modified (carboxyl-terminated butadiene nitrile (carboxyl-terminated butadiene nitrile) modified) or halogen modified epoxy resin oxygen Resin etc.

所述接著劑組成物(a)亦可含有膨脹劑。作為膨脹劑較佳為使用可形成多孔結構作為所述膨脹後的熱塑性熱膨脹接著劑層(A1)者,例如可使用碳酸銨、碳酸氫銨、亞硝酸銨、硼氫化銨、疊氮化物等無機化合物、三氯氟甲烷等氟化烷烴、偶氮雙異丁腈等偶氮化合物、對甲苯磺醯阱(p-Toluenesulfonyl Hydrazide)等肼化合物、對甲苯磺醯半卡阱(p-Toluenesulfonyl Semicarbazide)等半卡阱化合物、5-嗎啉基-1,2,3,4-噻三唑等三唑化合物、N,N'-二亞硝基對苯二甲醯胺等N-亞硝基化合物。 The adhesive composition (a) may contain a swelling agent. As the expansion agent, it is preferable to use one that can form a porous structure as the expanded thermoplastic thermal expansion adhesive layer (A1). For example, inorganic compounds such as ammonium carbonate, ammonium bicarbonate, ammonium nitrite, ammonium borohydride, and azide can be used. Compounds, fluorinated alkanes such as trichlorofluoromethane, azo compounds such as azobisisobutyronitrile, hydrazine compounds such as p-Toluenesulfonyl Hydrazide, p-Toluenesulfonyl Semicarbazide and other semi-trap compounds, triazole compounds such as 5-morpholino-1,2,3,4-thitriazole, N-nitroso compounds such as N,N'-dinitrosoterephthalamide and other .

而且,作為所述膨脹劑,較佳為藉由熱而進行膨脹的熱膨脹劑,例如可使用將烴系溶劑微膠囊化而成的熱膨脹性膠囊等膨脹性膠囊。作為所述熱膨脹劑,較佳為使用能夠於所述熱塑性樹脂或所述熱硬化性樹脂的軟化點前後的溫度下產生氣體並膨脹者。作為所述熱膨脹劑的膨脹開始溫度,較佳為50℃以上,更佳為60℃以上,若為70℃以上,則保管時的穩定性優異,且可不會損傷耐熱性低的被接著體而使所述接著帶充分地膨脹,並可於膨脹後獲得優異的接著力,所以較佳。 Furthermore, the expansion agent is preferably a thermal expansion agent that expands by heat, and for example, expandable capsules such as thermally expandable capsules obtained by microencapsulating a hydrocarbon solvent can be used. As the thermal expansion agent, one capable of generating gas and expanding at temperatures around the softening point of the thermoplastic resin or the thermosetting resin is preferably used. The expansion start temperature of the thermal expansion agent is preferably 50°C or higher, more preferably 60°C or higher. If it is 70°C or higher, the stability during storage will be excellent and the adherend with low heat resistance will not be damaged. It is preferable to fully expand the adhesive tape so that excellent adhesive force can be obtained after expansion.

作為所述膨脹劑,在前述之中,若使用將烴系溶劑微膠囊化而成的熱膨脹性膠囊,則於防止例如因熱等的影響而引起的膨脹性接著劑層(A)的劣化等方面更佳。作為前述膨脹劑,可單獨或組合兩種以上來使用。 As the expansion agent, among the above, if a thermally expandable capsule obtained by microencapsulating a hydrocarbon solvent is used, it is useful in preventing, for example, deterioration of the expandable adhesive layer (A) due to the influence of heat, etc. Even better. The expansion agent may be used alone or in combination of two or more.

作為所述熱膨脹性膠囊的市售品,例如可列舉埃克斯帕 塞爾(Expancel)(日本菲萊特(fillite)股份有限公司製造)、松本微球(Matsumoto microsphere)(松本油脂製藥股份有限公司)、微球(吳雨(kureha)股份有限公司製造)等。 Examples of commercially available heat-expandable capsules include Expa Expancel (manufactured by Japan Fillite Co., Ltd.), Matsumoto microsphere (Matsumoto Oils and Fats Pharmaceutical Co., Ltd.), microspheres (manufactured by Kureha Co., Ltd.), etc.

作為所述熱膨脹性膠囊,若使用松本油脂製藥股份有限公司製造的松本微球(Matsumoto microsphere)F-30、F-36、F-36D、F-36LV、F-48、F-48D、F-50、FN-80GS、F-65;日本菲萊特(fillite)股份有限公司製造的埃克斯帕塞爾(Expancel)053-40、007-40、031-40等,則因在熱塑性樹脂的軟化溫度前後進行膨脹,所以抑制向黏著帶的平面方向(流動方向或寬度方向)的膨脹,而可更有效果地向其厚度方向膨脹,所以較佳。 As the heat-expandable capsule, Matsumoto microspheres F-30, F-36, F-36D, F-36LV, F-48, F-48D, F- manufactured by Matsumoto Oils & Fats Pharmaceutical Co., Ltd. 50. FN-80GS, F-65; Expancel 053-40, 007-40, 031-40, etc. manufactured by Japan Fillite Co., Ltd., due to the softening of the thermoplastic resin It expands before and after temperature, so it is preferable to suppress the expansion in the plane direction (flow direction or width direction) of the adhesive tape and to more effectively expand in the thickness direction.

作為所述熱膨脹性膠囊,較佳為使用相對於膨脹前的所述膠囊的體積,膨脹後的體積(體積膨脹率)為8倍~60倍者。 As the thermally expandable capsule, it is preferable to use one whose volume after expansion (volume expansion rate) is 8 to 60 times the volume of the capsule before expansion.

所述膨脹劑的使用量,較佳為所述熱膨脹性膠囊的使用量較佳為相對於所述層(A)的總成分的固體成分100質量份而為0.3質量份~30質量份的範圍,更佳為1質量份~20質量份的範圍,進而佳為3質量份~17質量份的範圍,若為5質量份~15質量份的範圍,則可充分地膨脹以對被接著體所具有的空隙進行填充等,且獲得更優異的接著力,所以進而佳。 The usage amount of the expansion agent is preferably in the range of 0.3 to 30 parts by mass relative to 100 parts by mass of the solid content of the total component of the layer (A). , more preferably in the range of 1 to 20 parts by mass, and even more preferably in the range of 3 to 17 parts by mass. If it is in the range of 5 to 15 parts by mass, it can fully expand to the adherend. It is better because it can fill the gaps it has and obtain better adhesion.

作為所述接著劑組成物(a),除所述者之外亦可視需要使用含有增黏劑、交聯劑、硬化劑、硬化促進劑等者。 As the adhesive composition (a), in addition to the ones described above, those containing a tackifier, a cross-linking agent, a hardener, a hardening accelerator, etc. may be used as needed.

(接著劑層(B)) (Adhesive layer (B))

而且,作為本發明中所使用的接著帶,如前所述,較佳為使 用具有接著劑層(B)者。 Furthermore, as the adhesive tape used in the present invention, as mentioned above, it is preferable to use Use the one with adhesive layer (B).

作為構成所述接著帶的接著劑層(B),可使用能夠形成具有黏著性或接著性的層的接著劑組成物(b)來形成。 The adhesive layer (B) constituting the adhesive tape can be formed using an adhesive composition (b) capable of forming a layer having adhesiveness or adhesiveness.

作為所述接著劑層(B),可使用所述接著劑層(B)的厚度方向的膨脹率〔加熱後的所述放置後的接著劑層(B)的厚度/所述放置前的接著劑層(B)的厚度〕×100為120%以下者。所述接著劑層(B)的膨脹率較佳為115%以下,更佳為110%以下。若為所述接著帶,則即便於所述膨脹性接著劑層(A)膨脹後,亦可維持對被接著體的優異的接著力。另外,所述接著劑層(B)的膨脹率是指於將所述接著帶於100℃的環境下放置了30分鐘的情況下,所述放置後的接著劑層的厚度相對於所述放置前的所述接著劑層(B)的厚度的比例。 As the adhesive layer (B), the expansion coefficient in the thickness direction of the adhesive layer (B) [thickness of the adhesive layer (B) after heating/the thickness of the adhesive layer (B) after being left) can be used. The thickness of the agent layer (B)×100 is 120% or less. The expansion ratio of the adhesive layer (B) is preferably 115% or less, more preferably 110% or less. The adhesive tape described above can maintain excellent adhesive force to the adherend even after the expandable adhesive layer (A) expands. In addition, the expansion rate of the adhesive layer (B) refers to the thickness of the adhesive layer after the adhesive tape is left in an environment of 100° C. for 30 minutes relative to the thickness of the adhesive layer after the adhesive tape is left. The ratio of the thickness of the previous adhesive layer (B).

所述接著劑層(B)的厚度較佳為1μm~300μm的範圍,若為5μm~200μm的範圍,則構成所述接著帶的膨脹性接著劑層(A)膨脹,對被接著體(C1)所具有的空隙或被接著體(C1)與被接著體(C2)之間的間隙進行填充,可在將所述接著劑層(B)貼附於被接著體(C2)時呈現優異的接著力,所以更佳。 The thickness of the adhesive layer (B) is preferably in the range of 1 μm to 300 μm. If it is in the range of 5 μm to 200 μm, the expandable adhesive layer (A) constituting the adhesive tape will expand and damage the adherend (C1). ) or the gap between the adherend (C1) and the adherend (C2), it can exhibit excellent performance when the adhesive layer (B) is attached to the adherend (C2). It has great staying power, so it’s better.

所述接著劑層(B)如前所述較佳為膨脹率低,所以較佳為實質上不含有作為形成所述膨脹性接著劑層(A)時能夠使用者而例示的膨脹劑者。 As mentioned above, the adhesive layer (B) preferably has a low expansion coefficient and therefore preferably does not substantially contain the expansion agent exemplified as one that can be used when forming the expandable adhesive layer (A).

作為所述接著劑層(B),可較佳地使用含有例如熱硬化性樹脂或熱塑性樹脂等樹脂,並且所述膨脹劑的含量少或不含有所 述膨脹劑的接著劑組成物(b)。 As the adhesive layer (B), it is preferable to use a resin containing, for example, a thermosetting resin or a thermoplastic resin, and the content of the expansion agent is small or free. The adhesive composition (b) of the expansion agent.

作為能夠使用於所述接著劑組成物(b)中的樹脂,可選擇先前已知的樹脂來使用。其中,作為所述樹脂,就提升本發明的接著帶的生產效率的方面而言,例如較佳為使用與作為能夠於所述膨脹性接著劑層(A)的形成中使用的接著劑組成物(a)所含有的熱塑性樹脂或熱硬化性樹脂而例示者相同者。 As the resin that can be used in the adhesive composition (b), a conventionally known resin can be selected and used. Among them, as the resin, in terms of improving the production efficiency of the adhesive tape of the present invention, it is preferable to use, for example, an adhesive composition that can be used in the formation of the expandable adhesive layer (A). (a) The thermoplastic resin or thermosetting resin contained in (a) is the same as that shown in the examples.

作為所述接著劑組成物(b),例如可使用含有所述熱塑性樹脂等樹脂及視需要的增黏樹脂、交聯劑、其他添加劑等者。 As the adhesive composition (b), for example, one containing a resin such as the thermoplastic resin and optional tackifier resin, a cross-linking agent, other additives, etc. can be used.

作為所述增黏樹脂,以調整接著劑層(B)的強接著性為目的,例如可使用松香系增黏樹脂、聚合松香系增黏樹脂、聚合松香酯系增黏樹脂、松香酚系增黏樹脂、穩定化松香酯系增黏樹脂、歧化松香酯系增黏樹脂、萜烯系增黏樹脂、萜烯酚系增黏樹脂、石油樹脂系增黏樹脂等。 As the tackifying resin, for the purpose of adjusting the strong adhesiveness of the adhesive layer (B), for example, rosin-based tackifying resin, polymerized rosin-based tackifying resin, polymerized rosin ester-based tackifying resin, rosin phenol-based tackifying resin can be used. Tackifying resin, stabilized rosin ester-based tackifying resin, disproportionated rosin ester-based tackifying resin, terpene-based tackifying resin, terpene phenol-based tackifying resin, petroleum resin-based tackifying resin, etc.

作為所述交聯劑,以提升接著劑層(B)的凝聚力為目的,可使用公知的異氰酸酯系交聯劑、環氧系交聯劑、氮雜環丙烷系交聯劑、多價金屬鹽系交聯劑、金屬螯合物系交聯劑、酮.醯肼系交聯劑、噁唑啉系交聯劑、碳二亞胺系交聯劑、矽烷系交聯劑、縮水甘油基(烷氧基)環氧矽烷系交聯劑等。 As the cross-linking agent, for the purpose of improving the cohesion of the adhesive layer (B), known isocyanate-based cross-linking agents, epoxy-based cross-linking agents, aziridine-based cross-linking agents, and polyvalent metal salts can be used. Cross-linking agent, metal chelate cross-linking agent, ketone. Hydrazine cross-linking agents, oxazoline cross-linking agents, carbodiimide cross-linking agents, silane cross-linking agents, glycidyl (alkoxy) epoxy silane cross-linking agents, etc.

作為所述添加劑,可視需要於不妨礙本發明的期望的效果的範圍內使用用以調整pH的鹼(氨水等)或酸、發泡劑、塑化劑、軟化劑、抗氧化劑、玻璃或塑膠製的纖維狀、氣球(balloon)狀、珠粒(beads)狀、金屬粉末狀的填充劑、顏料、染料等著色 劑、pH調整劑、皮膜形成輔助劑、調平劑、增稠劑、撥水劑、消泡劑等公知者。 As the additives, alkali (ammonia, etc.) or acid for adjusting pH, foaming agent, plasticizer, softener, antioxidant, glass or plastic may be used as necessary within the range that does not hinder the desired effect of the present invention. Fillers, pigments, dyes, etc. in the form of fibers, balloons, beads, metal powders, etc. Agents, pH adjusters, film-forming auxiliaries, leveling agents, thickeners, water-repellent agents, defoaming agents and the like are well known.

作為所述接著劑組成物(b),就維持良好的塗覆作業性等方面而言,可使用含有溶媒者。作為所述溶媒,例如可使用甲苯、二甲苯、乙酸乙酯、乙酸丁酯、丙酮、甲基乙基酮、己烷等。而且,於使用水系接著劑組成物作為所述接著劑組成物(b)的情況下,可使用水或以水為主體的水性溶媒作為所述溶媒。 As the adhesive composition (b), one containing a solvent can be used from the viewpoint of maintaining good coating workability and the like. As the solvent, for example, toluene, xylene, ethyl acetate, butyl acetate, acetone, methyl ethyl ketone, hexane, etc. can be used. Moreover, when a water-based adhesive composition is used as the adhesive composition (b), water or an aqueous solvent containing water as the main component can be used as the solvent.

本發明中所使用的接著帶例如可藉由經由步驟[I]來製造,所述步驟[I]是藉由將所述接著劑組成物(a)塗佈於離型襯裡上並進行乾燥而形成膨脹性接著劑層(A)的步驟。 The adhesive tape used in the present invention can be produced by, for example, step [I] of applying the adhesive composition (a) on a release liner and drying it. The step of forming the expandable adhesive layer (A).

本發明中所使用的接著帶中,由所述膨脹性接著劑層(A)及所述接著劑層(B)構成的接著帶可藉由經由所述步驟[I]、步驟[Ⅱ]及步驟[Ⅲ]來製造,所述步驟[Ⅱ]與所述步驟[I]不同,是藉由將所述接著劑組成物(b)塗佈於離型襯裡上並進行乾燥等而形成接著劑層(B)的步驟,所述步驟[Ⅲ]是對所述膨脹性接著劑層(A)的單面轉印所述接著劑層(B),並對它們進行壓接等的步驟。 In the adhesive tape used in the present invention, the adhesive tape composed of the expandable adhesive layer (A) and the adhesive layer (B) can be formed by passing through the steps [I], [II] and The step [II] is different from the step [I] in that the adhesive composition (b) is applied to the release liner and dried to form an adhesive. layer (B), the step [III] is a step of transferring the adhesive layer (B) to one side of the expandable adhesive layer (A) and pressing them together.

另外,所述膨脹性接著劑層(A)較佳為於製造所述接著帶的過程中實質上不膨脹。 In addition, it is preferable that the expandable adhesive layer (A) does not substantially expand during the manufacturing process of the adhesive tape.

而且,作為本發明中所使用的接著帶,視需要,可使用於所述膨脹性接著劑層(A)與接著劑層(B)之間具有包括不織布層或樹脂膜層或金屬的層(Z)者。所述接著帶具有良好的剛性, 所以貼附作業性優異。 Furthermore, as the adhesive tape used in the present invention, if necessary, a layer including a nonwoven fabric layer, a resin film layer, or a metal may be used between the expandable adhesive layer (A) and the adhesive layer (B). Z). The adhesive tape has good rigidity, Therefore, the attaching workability is excellent.

作為所述層(Z),例如若為不織布,則材質較佳為包括紙漿(pulp)、嫘縈(rayon)、馬尼拉麻(Musa textilis)、丙烯腈(acrylonitrile)、尼龍、聚酯等,為了滿足不織布的拉伸強度,亦可視需要而進行於抄紙步驟中添加聚醯胺,並於乾燥後進行塗佈(coating)的1步驟浸漬處理、或者將黏膠(viscose)或熱塑性樹脂製成黏合劑(binder)的2步驟浸漬處理等。作為樹脂膜,可列舉使用聚酯膜、聚乙烯膜、聚丙烯膜、聚氯乙烯膜、聚醯亞胺膜等塑膠膜等而形成的樹脂膜層,作為包括金屬的層,可列舉鋁、銅等金屬層。 As the layer (Z), for example, if it is a non-woven fabric, the material preferably includes pulp, rayon, Musa textilis, acrylonitrile, nylon, polyester, etc., in order to To meet the tensile strength of non-woven fabrics, polyamide can also be added in the papermaking step as needed, and then a one-step impregnation treatment of coating can be performed after drying, or viscose or thermoplastic resin can be used for bonding. 2-step impregnation treatment of binder, etc. Examples of the resin film include resin film layers formed using plastic films such as polyester films, polyethylene films, polypropylene films, polyvinyl chloride films, and polyimide films. Examples of the layer containing metal include aluminum, Copper and other metal layers.

作為所述層(Z),較佳為使用具有1μm~200μm的厚度者。 As the layer (Z), it is preferable to use one having a thickness of 1 μm to 200 μm.

具有所述層(Z)的接著帶例如可藉由經由步驟[I]、步驟[Ⅱ]、步驟[Ⅳ]及步驟[V]來製造,所述步驟[I]是藉由將所述接著劑組成物(a)塗佈於離型襯裡上並進行乾燥而形成膨脹性接著劑層(A)的步驟,所述步驟[Ⅱ]與所述步驟[I]不同,是藉由將所述接著劑組成物(b)塗佈於離型襯裡上並進行乾燥等而形成接著劑層(B)的步驟,所述步驟[Ⅳ]是對所述膨脹性接著劑層(A)的單面積層所述層(Z)的步驟,所述步驟(V)是對包括所述層(Z)的面轉印所述接著劑層(B)並對它們進行壓接的步驟。 The adhesive tape having the layer (Z) can be manufactured, for example, by passing through steps [I], step [II], step [IV] and step [V]. The step [I] is by combining the adhesive tape. The step [II] is different from the step [I] in that the agent composition (a) is coated on the release liner and dried to form an expandable adhesive layer (A). The adhesive composition (b) is coated on the release liner and dried to form the adhesive layer (B). The step [IV] is to apply the adhesive composition (b) to one side of the expandable adhesive layer (A). The step of laminating the layer (Z), and the step (V) is a step of transferring the adhesive layer (B) to the surface including the layer (Z) and press-bonding them.

[實施例] [Example]

(製備例1) (Preparation Example 1)

<接著劑組成物(a-1)的製備> <Preparation of adhesive composition (a-1)>

藉由將混合100質量份的重量平均分子量30萬的苯乙烯-丁二烯嵌段共聚物S(三嵌段共聚物與二嵌段共聚物的混合物;相對於所述混合物的總量,所述二嵌段共聚物所占的比例為50質量%。於所述苯乙烯-丁二烯嵌段共聚物的整體中,聚乙烯單元所占的質量比例為30質量%,聚丁二烯單元所占的質量比例為70質量%)與100質量份的萜烯酚系增黏樹脂(軟化點115℃、分子量1000)而成者溶解至甲苯中,獲得了接著劑組成物(a-1)。 By mixing 100 parts by mass of the styrene-butadiene block copolymer S (a mixture of a triblock copolymer and a diblock copolymer) with a weight average molecular weight of 300,000; relative to the total amount of the mixture, The diblock copolymer accounts for 50% by mass. In the entire styrene-butadiene block copolymer, the polyethylene unit accounts for 30% by mass, and the polybutadiene unit accounts for 30% by mass. The mass ratio of 70% by mass) and 100 parts by mass of terpene phenol-based tackifying resin (softening point 115°C, molecular weight 1000) was dissolved in toluene to obtain adhesive composition (a-1) .

(製備例2) (Preparation Example 2)

<接著劑組成物(a-2)的製備> <Preparation of adhesive composition (a-2)>

將製備例1中使用的萜烯酚系增黏樹脂(軟化點115℃、分子量1000)的使用量自100質量份變更為65質量份,除此之外,以與製備例1相同的方法獲得了接著劑組成物(a-2)。 Obtained by the same method as Preparation Example 1 except that the usage amount of the terpene phenol-based thickening resin (softening point 115° C., molecular weight 1000) used in Preparation Example 1 was changed from 100 parts by mass to 65 parts by mass. The adhesive composition (a-2) was obtained.

(製備例3) (Preparation Example 3)

<接著劑組成物(a-3)的製備> <Preparation of adhesive composition (a-3)>

在具有攪拌器、回流冷卻器、溫度計、滴加漏斗及氮氣導入口的反應容器中,將丙烯酸丁酯44.9質量份、2-乙基己基丙烯酸酯50質量份、丙烯酸2質量份、乙酸乙烯酯3質量份、4-羥基丁基丙烯酸酯0.1質量份、作為聚合起始劑的2,2'-偶氮雙異丁腈0.1質量份溶解至乙酸乙酯100質量份中,以70℃進行10小時聚合,藉此獲得了重量平均分子量80萬的丙烯酸系共聚物Z溶液。 In a reaction vessel equipped with a stirrer, a reflux cooler, a thermometer, a dropping funnel, and a nitrogen inlet, 44.9 parts by mass of butyl acrylate, 50 parts by mass of 2-ethylhexyl acrylate, 2 parts by mass of acrylic acid, and vinyl acetate 3 parts by mass, 0.1 part by mass of 4-hydroxybutylacrylate, and 0.1 part by mass of 2,2'-azobisisobutyronitrile as a polymerization initiator were dissolved in 100 parts by mass of ethyl acetate, and the process was carried out at 70°C for 10 By polymerizing for 1 hour, an acrylic copolymer Z solution with a weight average molecular weight of 800,000 was obtained.

其次,相對於100質量份的丙烯酸系共聚物Z,添加聚 合松香酯系增黏樹脂D-135(荒川化學工業股份有限公司製造)30質量份,並加入乙酸乙酯進行混合,之後添加日本聚胺基甲酸酯工業(股)製造的「考勞奈特(Coronate)L-45」(異氰酸酯系交聯劑,固體成分45質量%)1.1質量份,並攪拌15分鐘,獲得了接著劑(a-2)。 Next, with respect to 100 parts by mass of acrylic copolymer Z, poly 30 parts by mass of synthetic rosin ester-based tackifying resin D-135 (manufactured by Arakawa Chemical Industry Co., Ltd.) was added to ethyl acetate and mixed, and then "Coronaline" manufactured by Nippon Polyurethane Industry Co., Ltd. 1.1 parts by mass of "Coronate" L-45" (isocyanate cross-linking agent, solid content 45% by mass), and stirred for 15 minutes to obtain an adhesive (a-2).

<接著帶的製作> <Preparation of next tape>

(作成例1) (Creation example 1)

使用棒狀的金屬敷料器(applicator)將相對於接著劑組成物(a-1)的總固體成分100質量份而混合10質量份的膨脹劑F-36D(松本油脂製藥股份有限公司製造、熱膨脹性微型膠囊、初始粒徑10μm~16μm、膨脹開始溫度70℃~80℃)並攪拌10分鐘而成者以乾燥後的厚度成為90μm的方式塗覆至於上等紙的兩面具有聚乙烯層,並於聚乙烯層的單面具有矽酮系離型處理劑層的厚度130μm的離型紙的表面,並利用設定為65℃的乾燥機進行10分鐘的乾燥,藉此製作了膨脹性接著劑層(A-1)。將所述膨脹性接著劑層(A-1)積層於與上述離型紙不同的離型紙上,並使用2kg的手輥(hand roller)使其於所述貼附物的上表面上進行一次往復,藉此獲得了包括所述膨脹性接著劑層(A-1)的接著帶。 Using a rod-shaped metal applicator, 10 parts by mass of expansion agent F-36D (manufactured by Matsumoto Oils & Fats Pharmaceutical Co., Ltd., thermal expansion agent) was mixed with respect to 100 parts by mass of the total solid content of the adhesive composition (a-1). The microcapsules (initial particle size 10 μm ~ 16 μm, expansion start temperature 70°C ~ 80°C) and stirred for 10 minutes are coated so that the thickness after drying becomes 90 μm. Both sides of the high-quality paper have polyethylene layers, and An expandable adhesive layer ( A-1). The expandable adhesive layer (A-1) was laminated on a release paper different from the above-mentioned release paper, and a 2kg hand roller was used to reciprocate once on the upper surface of the sticker. , thereby obtaining an adhesive tape including the expandable adhesive layer (A-1).

其次,使用棒狀的金屬敷料器將所述接著劑組成物(a-1)以乾燥後的厚度成為90μm的方式塗覆至於上等紙的兩面具有聚乙烯層,並於聚乙烯層的單面具有矽酮系離型處理劑層的厚度130μm的離型紙的表面,並利用設定為65℃的乾燥機進行10分鐘的 乾燥,藉此製作了接著劑層(B-1)。 Next, use a rod-shaped metal applicator to apply the adhesive composition (a-1) so that the thickness after drying becomes 90 μm, so that both sides of the fine paper have polyethylene layers, and one side of the polyethylene layer is Cover the surface of a release paper with a silicone-based release treatment agent layer with a thickness of 130 μm, and use a dryer set at 65°C for 10 minutes. By drying, an adhesive layer (B-1) was produced.

將所述膨脹性接著劑層(A-1)貼附於前述所得的接著劑層(B-1),之後,以4kgf/cm2進行加壓積層,藉此獲得了積層有膨脹性接著劑層(A-1)及接著劑層(B-1)的接著帶1。 The expandable adhesive layer (A-1) was attached to the adhesive layer (B-1) obtained above, and then laminated under pressure at 4 kgf/cm 2 to obtain a laminated expandable adhesive layer. Adhesion tape 1 of layer (A-1) and adhesive layer (B-1).

(作成例2) (Creation example 2)

以與實施例1相同的方法製作膨脹性接著劑層(A-1)及接著劑層(B-1),將所述膨脹性接著劑層(A-1)貼附於厚度35μm的不織布的單面,並於另一個面貼附前述所得的接著劑層(B-1),之後,以80℃、4kgf/cm2進行加壓積層,藉此獲得了於不織布上積層有膨脹性接著劑層(A-1)及接著劑層(B-1)的接著帶2。 An expandable adhesive layer (A-1) and an adhesive layer (B-1) were produced in the same manner as in Example 1, and the expandable adhesive layer (A-1) was attached to a nonwoven fabric with a thickness of 35 μm. One side, and the adhesive layer (B-1) obtained above was attached to the other side, and then lamination was performed under pressure at 80°C and 4kgf/ cm2 , thereby obtaining an expandable adhesive layered on the nonwoven fabric. Adhesive tape 2 for layer (A-1) and adhesive layer (B-1).

(作成例3) (Creation example 3)

使用接著劑組成物(a-2)來代替接著劑組成物(a-1),除此之外,以與實施例1相同的方法,獲得了包括膨脹性接著劑層(A-2)及接著劑層(B-2)的接著帶。將所述膨脹性接著劑層(A-1)貼附於厚度35μm的不織布的單面,並於另一個面貼附前述所得的接著劑層(B-1),之後,以80℃、4kgf/cm2進行加壓積層,藉此獲得了於不織布上積層有膨脹性接著劑層(A-1)及接著劑層(B-1)的接著帶3。 Except using the adhesive composition (a-2) instead of the adhesive composition (a-1), in the same manner as in Example 1, an expandable adhesive layer (A-2) and a Adhesive tape for the adhesive layer (B-2). The expandable adhesive layer (A-1) is attached to one side of a non-woven fabric with a thickness of 35 μm, and the adhesive layer (B-1) obtained above is attached to the other side. /cm 2 to obtain an adhesive tape 3 in which the expandable adhesive layer (A-1) and the adhesive layer (B-1) were laminated on the nonwoven fabric by pressure lamination.

(作成例4) (Creation Example 4)

以與實施例1相同的方法作成接著劑層(B-1),將所述接著劑層(B-1)貼附於厚度35μm的不織布的單面,並於另一個面貼附前述所得的接著劑層(B-1),之後,以80℃、4kgf/cm2進行 加壓積層,藉此獲得了於不織布上積層有接著劑層(B-1)的接著帶4。 The adhesive layer (B-1) was prepared in the same manner as in Example 1, and the adhesive layer (B-1) was attached to one side of a non-woven fabric with a thickness of 35 μm, and the aforementioned obtained layer was attached to the other side. The adhesive layer (B-1) was then pressurized and laminated at 80° C. and 4 kgf/cm 2 to obtain an adhesive tape 4 in which the adhesive layer (B-1) was laminated on the nonwoven fabric.

(作成例5) (Creation Example 5)

使用接著劑組成物(a-3)來代替接著劑組成物(a-1),除此之外,以與實施例1相同的方法,作成了兩枚包括接著劑層(B-3)的接著帶。將所述接著劑層(B-3)貼附於厚度100μm的聚乙烯系發泡體基材的單面,並於另一個面貼附前述所得的接著劑層(B-3),之後,以4kgf/cm2進行加壓積層,藉此獲得了於發泡體上積層有接著劑層(B-3)的接著帶5。 Except that the adhesive composition (a-3) was used instead of the adhesive composition (a-1), two pieces including the adhesive layer (B-3) were produced in the same manner as in Example 1. Then take it. The adhesive layer (B-3) is attached to one side of a polyethylene foam base material with a thickness of 100 μm, and the adhesive layer (B-3) obtained above is attached to the other side, and then, The adhesive tape 5 in which the adhesive layer (B-3) was laminated|stacked on the foam was obtained by performing pressure lamination at 4kgf/ cm2 .

[物品的製造] [Manufacturing of items]

(實施例1) (Example 1)

將接著帶1裁斷為長度64mm×寬度1mm及長度43mm×寬度1mm的帶狀。將構成所述黏著帶的(A-1)的面側貼附於長邊65mm×短邊45mm×厚度2mm的聚碳酸酯板1。此時,在自聚碳酸酯板1的外側空開1mm的部位,對長邊貼附裁斷為長度64mm的黏著帶,對短邊貼附裁斷為長度43mm的黏著帶,以形成框狀。而且,以裁斷為帶狀的接著帶的端部彼此重疊的方式進行貼附。將具有所述接著帶的聚碳酸酯板1與長邊65mm×短邊45mm×厚度2mm的聚碳酸酯板2予以積層,製作了所述聚碳酸酯板1與聚碳酸酯板2藉由所述框狀的試驗帶接合的試驗片(圖4)。其次,對貼附於試驗片的接著帶整個面以與所述聚碳酸酯板1的重量合計成為210g的方式放置重物,在對所述接著帶上施加有1N/cm2 的負載的狀態下,以100℃的加熱爐加熱30分鐘,使(A-1)膨脹,之後進行放置冷卻直至試驗片冷卻至室溫,獲得了物品。 The adhesive tape 1 was cut into a strip shape with a length of 64 mm and a width of 1 mm and a length of 43 mm and a width of 1 mm. The surface side of (A-1) constituting the adhesive tape was attached to a polycarbonate plate 1 having a long side of 65 mm, a short side of 45 mm, and a thickness of 2 mm. At this time, an adhesive tape cut to a length of 64 mm was attached to the long side at a position 1 mm away from the outside of the polycarbonate plate 1, and an adhesive tape cut to a length of 43 mm was attached to the short side to form a frame shape. Then, the adhesive tape cut into a strip shape is attached so that the ends thereof overlap each other. The polycarbonate plate 1 having the adhesive tape and the polycarbonate plate 2 having a long side of 65 mm x a short side of 45 mm x a thickness of 2 mm were laminated, and the polycarbonate plate 1 and the polycarbonate plate 2 were produced by The above frame-shaped test strip is connected to the test piece (Fig. 4). Next, a weight was placed on the entire surface of the adhesive tape attached to the test piece so that the total weight of the polycarbonate plate 1 became 210 g, and a load of 1 N/cm 2 was applied to the adhesive tape. , heated in a heating furnace at 100° C. for 30 minutes to expand (A-1), and then left to cool until the test piece cooled to room temperature, thereby obtaining an article.

(實施例2) (Example 2)

使用接著帶2來代替接著帶1,除此之外,以與實施例1相同的方法獲得了物品。 An article was obtained in the same manner as in Example 1 except that the adhesive tape 2 was used instead of the adhesive tape 1 .

(實施例3) (Example 3)

使用接著帶3來代替接著帶1,除此之外,以與實施例1相同的方法獲得了物品。 An article was obtained in the same manner as in Example 1 except that the adhesive tape 3 was used instead of the adhesive tape 1 .

(實施例4) (Example 4)

將接著帶2裁斷為長度64mm×寬度1mm及長度43mm×寬度1mm的帶狀。將構成所述黏著帶的(A-1)的面側貼附於長邊65mm×短邊45mm×厚度2mm的聚碳酸酯板1。此時,在自聚碳酸酯板1的外側空開1mm的部位,對長邊貼附裁斷為長度64mm的黏著帶,對短邊貼附裁斷為長度43mm的黏著帶,以形成框狀。而且,以裁斷為帶狀的接著帶的端部彼此重疊的方式進行貼附。 The adhesive tape 2 was cut into a strip shape with a length of 64 mm and a width of 1 mm and a length of 43 mm and a width of 1 mm. The surface side of (A-1) constituting the adhesive tape was attached to a polycarbonate plate 1 having a long side of 65 mm, a short side of 45 mm, and a thickness of 2 mm. At this time, an adhesive tape cut to a length of 64 mm was attached to the long side at a position 1 mm away from the outside of the polycarbonate plate 1, and an adhesive tape cut to a length of 43 mm was attached to the short side to form a frame shape. Then, the adhesive tape cut into a strip shape is attached so that the ends thereof overlap each other.

其次,準備縱65mm×橫45mm×厚度2mm的大小,於表面具有兩處縱65mm×橫5mm且深30μm的楔形的凹部(階差部)的聚碳酸酯板3。以所述兩處的凹部與貼附於所述聚碳酸酯板1的所述接著帶的框部重疊的方式將具有所述試驗帶的聚碳酸酯板1與所述聚碳酸酯板3予以積層,製作了所述聚碳酸酯板1與聚碳酸酯板3藉由所述框狀的試驗帶接合的試驗片(圖5)。其次,對貼附於試驗片的接著帶整個面以與所述聚碳酸酯板1的重量合計 成為210g的方式放置重物,在對所述接著帶的單位面積施加有1N的負載的狀態下,以100℃的加熱爐加熱30分鐘,使(A-1)膨脹,之後進行放置冷卻直至試驗片冷卻至室溫,獲得了物品。 Next, a polycarbonate plate 3 having a size of 65 mm in length x 45 mm in width x 2 mm in thickness and having two wedge-shaped recessed portions (step portions) of 65 mm in length x 5 mm in width and 30 μm in depth on the surface was prepared. The polycarbonate plate 1 and the polycarbonate plate 3 having the test tape are attached so that the two recessed portions overlap the frame of the adhesive tape attached to the polycarbonate plate 1 The polycarbonate plate 1 and the polycarbonate plate 3 were laminated and joined together via the frame-shaped test strip to produce a test piece (Fig. 5). Next, the entire surface of the adhesive tape attached to the test piece is weighed by the total weight of the polycarbonate plate 1. Place a weight so that it becomes 210g, and with a load of 1N applied to the unit area of the adhesive tape, heat it in a heating furnace at 100° C. for 30 minutes to expand (A-1), and then leave it to cool until the test. The piece was cooled to room temperature and the item was obtained.

(比較例1) (Comparative example 1)

使用接著帶4來代替接著帶1,除此之外,以與實施例1相同的方法獲得了物品。 An article was obtained in the same manner as in Example 1 except that the adhesive tape 4 was used instead of the adhesive tape 1 .

(比較例2) (Comparative example 2)

使用接著帶5來代替接著帶1,除此之外,以與實施例1相同的方法獲得了物品。 An article was obtained in the same manner as in Example 1 except that the adhesive tape 5 was used instead of the adhesive tape 1 .

(比較例4) (Comparative example 4)

使用接著帶5來代替接著帶1,除此之外,以與實施例5相同的方法獲得了物品。 An article was obtained in the same manner as in Example 5 except that the adhesive tape 5 was used instead of the adhesive tape 1 .

[防水性的評價] [Evaluation of waterproofness]

將實施例及比較例中所獲得的物品於水深1m中靜置了30分鐘(遵照JISC0920的IPX7)。於所述靜置後,以目視觀察所述試驗片,並依據以下評價基準進行了評價。 The articles obtained in the Examples and Comparative Examples were left to stand still in a water depth of 1 m for 30 minutes (in compliance with IPX7 of JISC0920). After leaving to stand, the test piece was visually observed and evaluated based on the following evaluation criteria.

○:水未滲入至構成所述試驗片的、藉由框狀的帶而圍成的內部(試驗片的中央部)。 ○: Water has not penetrated into the inside of the test piece and surrounded by the frame-shaped band (the center part of the test piece).

×:水滲入至構成所述試驗片的、藉由框狀的帶而圍成的內部(試驗片的中央部)。 ×: Water penetrated into the inside of the test piece and surrounded by the frame-shaped band (the center part of the test piece).

[表1]

Figure 107144655-A0305-02-0031-1
[Table 1]
Figure 107144655-A0305-02-0031-1

Figure 107144655-A0305-02-0031-2
Figure 107144655-A0305-02-0031-2

Figure 107144655-A0305-02-0031-3
Figure 107144655-A0305-02-0031-3

1‧‧‧接著帶A 1‧‧‧Then bring A

2‧‧‧接著帶B 2‧‧‧Then bring B

3‧‧‧被接著體 3‧‧‧The body to be connected

Claims (7)

一種物品的製造方法,其是經由接著帶的膨脹物而進行接著的物品的製造方法,所述物品的製造方法的特徵在於包括:步驟[1],使具有膨脹性接著劑層(A)的兩個以上的接著帶的端部彼此重疊或接近來配置,將所述接著帶的其中一個面側貼附於構成被接著體(C1)的部位(c1-1);步驟[2],將所述接著帶的另一個面側貼附於另一個被接著體(C2);步驟[3],對所述膨脹性接著劑層(A)給予刺激;以及步驟[4],因所述刺激,所述膨脹性接著劑層(A)膨脹,而形成膨脹接著劑層(A1),於所述步驟[3]及所述步驟[4]中,於對所述接著帶給予刺激,使所述膨脹性接著劑層(A)膨脹而形成所述膨脹接著劑層(A1)的過程中,對所述接著帶施加1N/cm2以上且50N/cm2以下的負載,所述膨脹性接著劑層(A)含有熱塑性樹脂,所述熱塑性樹脂的70℃~120℃的範圍的、利用1Hz下的動態黏彈性譜測定的儲存彈性模數為1.0×102Pa~1.0×107Pa的範圍。 A method of manufacturing an article that is adhered via an expansion material of an adhesive tape, the method of manufacturing an article being characterized by including: step [1] of making an adhesive layer having an expandable adhesive layer (A) The ends of two or more bonding tapes are arranged to overlap or be close to each other, and one of the surface sides of the bonding tapes is attached to the portion (c1-1) constituting the adherend (C1); step [2], The other side of the adhesive tape is attached to another adherend (C2); step [3], stimulating the expandable adhesive layer (A); and step [4], due to the stimulation , the expandable adhesive layer (A) expands to form the expandable adhesive layer (A1). In the step [3] and the step [4], stimulation is given to the adhesive tape, so that the adhesive tape is When the expandable adhesive layer (A) expands to form the expandable adhesive layer (A1), a load of 1 N/cm 2 or more and 50 N/cm 2 or less is applied to the adhesive tape. The agent layer (A) contains a thermoplastic resin having a storage elastic modulus of 1.0×10 2 Pa to 1.0×10 7 Pa measured by dynamic viscoelasticity spectroscopy at 1 Hz in the range of 70°C to 120°C. Scope. 如申請專利範圍第1項所述的物品的製造方法,其中所述膨脹性接著劑層(A)的厚度方向的膨脹率〔加熱後的熱塑性熱膨脹性接著劑層(A1)的厚度/加熱前的熱塑性熱膨脹性接著劑層(A)的厚度〕×100為150%以上。 The method for manufacturing an article as described in claim 1, wherein the expansion ratio in the thickness direction of the expandable adhesive layer (A) [thickness of the thermoplastic thermally expandable adhesive layer (A1) after heating/before heating The thickness of the thermoplastic heat-expandable adhesive layer (A) × 100 is 150% or more. 如申請專利範圍第1項或第2項所述的物品的製造方法,其中於所述膨脹性接著劑層(A)的至少其中一個面側具有接 著劑層(B),所述接著劑層(B)的厚度方向的膨脹率〔加熱後的接著劑層(B1)的厚度/加熱前的接著劑層(B)的厚度〕×100為120%以下。 The method for manufacturing an article as described in Item 1 or Item 2 of the patent application, wherein at least one of the face sides of the expandable adhesive layer (A) has a contact For the adhesive layer (B), the expansion coefficient in the thickness direction of the adhesive layer (B) [thickness of the adhesive layer (B1) after heating/thickness of the adhesive layer (B) before heating] × 100 is 120 %the following. 如申請專利範圍第1項或第2項所述的物品的製造方法,其中,所述膨脹性接著劑層(A)具有0.5N/20mm以上的接著力。 The method for manufacturing an article according to claim 1 or 2, wherein the expandable adhesive layer (A) has an adhesive force of 0.5N/20mm or more. 如申請專利範圍第1項或第2項所述的物品的製造方法,其中,所述步驟[3]中的刺激為熱。 The method for manufacturing an article as described in Item 1 or Item 2 of the patent application, wherein the stimulus in step [3] is heat. 如申請專利範圍第1項或第2項所述的物品的製造方法,其中,所述膨脹性接著劑層(A)為含有所述熱塑性樹脂及膨脹開始溫度為70℃~120℃的範圍的熱膨脹膠囊的層。 The manufacturing method of articles described in Item 1 or 2 of the patent application, wherein the expandable adhesive layer (A) contains the thermoplastic resin and the expansion start temperature is in the range of 70°C to 120°C. Layers of thermally expandable capsules. 如申請專利範圍第1項或第2項所述的物品的製造方法,其中,所述步驟[1]包括對構成被接著體(C1)的部位(c1-1),以0.1N/cm2以上的力壓接所述接著帶的膨脹性接著劑層(A)的步驟。 The method for manufacturing an article as described in Item 1 or Item 2 of the patent application, wherein the step [1] includes applying 0.1N/cm 2 to the part (c1-1) constituting the adherend (C1). A step of press-bonding the expandable adhesive layer (A) of the adhesive tape with the above force.
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