TWI668710B - Method for forming electric conductor and electric conductor - Google Patents

Abstract

The present invention provides that even if a curved surface portion having a small radius of curvature is formed, A method of forming a conductor and a conductor for preventing peeling between the support and the conductive film. The surface of the laminated body which is the curved surface portion is heated by the heater, and the laminated body is bent to apply the tensile force to the laminated body, and the laminated body is bent to form the curved surface portion. When the thickness of the conductive film is B1, the thickness of the adhesive is C1, and the radius of curvature of the inner side surface of the conductive film in the curved portion is R, the thickness A2 of the support in the curved portion is relative to The ratio A2/A1 of the thickness A1 of the support in the flat portion is set to a minimum value (R+B1/2)/((R+B1+C1+A2/2)×1.45) or more and a maximum value (R+B1/ 2) / ((R + B1 + C1 + A2 / 2) × 0.9) or less.

Description

Method for forming electric conductor and electric conductor

The present invention relates to a method of forming an electrical conductor, and more particularly to a method of forming an electrical conductor for obtaining a three-dimensional shape.

Moreover, the present invention is also directed to an electrical conductor of a three-dimensional shape.

In recent years, the popularity of touch panels is being promoted in various electronic devices including mobile information devices. The touch panels are used in combination with display devices such as liquid crystal display devices, and are used for electronic devices by contacting the screens. Enter the action.

In addition, in the process of pursuing the improvement of the portability and operability of the electronic device, even if it is required to be thin and can cope with a three-dimensional shape in the touch panel, the conduction of the detecting electrode on the flexible and transparent insulating substrate is being promoted. Development of membranes.

When the touch panel of the three-dimensional shape is manufactured, there is a method in which the conductive film and the support are deformed together into a three-dimensional shape, and they are attached to each other, but the deformation and fit of the deformed shape of the conductive film and the support are obtained. When the position is deviated, it is difficult to obtain a high-quality touch panel, and the manufacturing becomes complicated.

In addition, there is a method in which a conductive film is placed in a mold and a support is formed by injection molding to form a three-dimensional touch panel. However, in the injection molding, there is a problem that it is difficult to form a support thinly.

Thus, for example, in Patent Document 1, the following method is studied, that is, After the conductive film is bonded to the flat support, the conductive film and the support are uniformly formed into a three-dimensional electric conductor, but it is known that the adhesive is large in a portion where the strain is large, especially in a high-temperature and high-humidity environment. When melted and the adhesive force is lowered, the conductive film is peeled off from the support.

In addition, in the case of a heat-generating body having a three-dimensional shape, an electromagnetic shield having a three-dimensional shape from a noise-protecting electronic device, and the like, in the same manner, in the case where the conductive film and the support are uniformly formed into a three-dimensional shape, In the case of the conductive film, the conductive film may be peeled off from the support. In the case of the bending process, when the laminate is heated and irradiated from both surfaces, the conductor having a heating width of the bent portion is selected so that the warpage and the peeling are less likely to occur. In the production method, the laminate has a support made of polycarbonate adhered to one side or both sides of the conductive film serving as the electromagnetic shielding layer.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-257796

Patent Document 2 Japanese Patent Laid-Open Publication No. 2010-272661

However, if the radius of curvature of the bent portion is small, as shown in Fig. 7, the difference between the length of the inner side surface of the laminated body 12 and the length along the outer side surface in the bent portion 11 is large, so only the selection is based on The heating width of the heater 13 causes a problem that peeling easily occurs between the conductive film 14 and the support 15. For example, since the conductive film 14 located inside the bent portion 11 is excessive, the compressive force acts to cause conduction. The film 14 is buckling to cause the aforementioned peeling.

The present invention has been made to solve such conventional problems, and an object of the invention is to provide a method of forming a conductor which can prevent peeling between a support and a conductive film even if a curved surface portion having a small radius of curvature is formed.

Further, an object of the present invention is to provide a three-dimensional electric conductor in which a support body and a conductive film are not peeled off.

In the method for molding a conductor according to the present invention, a method of forming a conductor having a three-dimensional shape of a flat portion and a curved portion is formed by forming a curved surface portion on the laminated body, and the laminated body has an insulating support having a flat plate shape. On the surface of the body, a conductive film having a metal mesh is bonded to the surface of the body, and at the time of the molding process, only the portion of the laminate that is the curved surface portion is heated, and at least the portion that becomes the curved portion is subjected to a tensile force. The laminate is subjected to bending processing so that the support is outside and the conductive film is inside, and the curved portion is formed. The thickness of the support in the flat portion is A1, the thickness of the conductive film is B1, and the thickness of the adhesive is set. In the case where the thickness of the support in the curved surface portion produced by C1 is A2, and the radius of curvature of the inner surface of the curved surface portion is R, A2/A1 is (R+B1/2)/((R+B1+C1) +A2/2)×1.45) or more and (R+B1/2)/((R+B1+C1+A2/2)×0.9) or less.

When the bending angle of the curved surface portion is X°, the elongation E of the laminate in the curved surface portion is π × (A 2 + B1 + 2‧ C1) × (X / 360) × 0.9 or more and π × (A2+B1+2‧C1)×(X/360)×1.45 or less

In this manner, it is preferable to apply a bending force to the laminated body while performing a bending process on the laminated body to form a curved surface portion.

In the state in which the portion of the laminate which is the curved surface portion is heated to a temperature higher than the glass transition temperature of the support, and the portion of the flat portion is maintained at a temperature lower than the glass transition temperature of the support, the laminate is laminated. It is preferable to carry out bending processing to produce a curved surface portion.

The portion of the laminate which is the curved surface portion can be heated from the support side.

Further, it is also possible to form a curved surface portion by performing a bending process on the laminate only by applying a tensile force to the support in the laminate.

The support is made of an insulating transparent resin, and the conductive film is a transparent conductive film in which a metal mesh is placed on the surface of the flexible insulating substrate, and a transparent laminate can be used as the adhesive.

The conductor can be used as a touch panel, an electromagnetic wave shield, or a heat generating body.

The conductor of the present invention is a conductor having a three-dimensional shape in which a conductive film having a metal mesh is bonded to a surface of an insulating support via an adhesive, wherein the conductor has a flat portion and a curved portion, and in the planar portion When the thickness of the support is A1, the thickness of the conductive film is B1, the thickness of the adhesive is C1, the thickness of the support in the curved portion is A2, and the radius of curvature of the inner surface of the curved portion is R, A2/ A1 is (R+B1/2)/((R+B1+C1+A2/2)×1.45) or more and (R+B1/2)/((R+B1+C1+A2/2)×0.9) the following.

The support is made of an insulating transparent resin, and the conductive film is a transparent conductive film in which a metal mesh is disposed on the surface of the flexible insulating substrate, and the adhesive can be configured to be transparent.

The conductor can be used as a touch panel, an electromagnetic wave shield, or a heat generating body.

According to the present invention, only the portion which is the curved surface portion of the laminate is heated during the forming process, and the tensile force is applied to at least the portion which becomes the curved surface portion, and the support is placed outside and the conductive film is inside. Since the curved portion is formed by the bending process, the curved portion is formed. Therefore, even if a curved portion having a small radius of curvature is formed, peeling between the support and the conductive film can be prevented.

1‧‧‧ laminated body

2‧‧‧Support

3‧‧‧Electrical film

4‧‧‧Binder

5‧‧‧heater

6‧‧‧Surface

7‧‧‧Touch panel

11‧‧‧Bending processing department

12‧‧‧Laminated body

13‧‧‧heater

14‧‧‧Electrical film

15‧‧‧Support

31‧‧‧Insert substrate

32‧‧‧Electrical components

33‧‧‧Protective layer

34‧‧‧1st detection electrode

34a, 36a‧‧‧Metal thin wires

35‧‧‧1st perimeter wiring

36‧‧‧2nd detection electrode

37‧‧‧2nd perimeter wiring

S1‧‧‧Sensing area

Surrounding area of S2‧‧

D1‧‧‧1st direction

D2‧‧‧2nd direction

C‧‧‧ becomes part of the curved surface

F‧‧‧Stretching force

P‧‧‧ became part of the plane

A1‧‧‧ Thickness of the support in the flat section

A2‧‧‧Thickness of the support in the curved surface

B1‧‧‧Thickness of conductive film

C1‧‧‧Binder thickness

X‧‧‧Bending angle of curved surface

R‧‧‧The radius of curvature of the inner side of the conductive film in the curved surface

Fig. 1 is a partial cross-sectional view showing a laminate used in a method of molding a conductor according to a first embodiment of the present invention.

Fig. 2 is a plan view showing a conductive film used in a laminate.

Fig. 3 is a partial plan view showing the detecting electrode of the electroconductive film.

Fig. 4 is a partial cross-sectional view showing a laminate which is formed by the molding method of the conductor of the first embodiment.

Fig. 5 is a perspective view showing a conductor formed by the molding method of the conductor of the first embodiment.

Fig. 6 is a partial cross-sectional view showing a laminate which is formed by the molding method of the conductor of the second embodiment.

Fig. 7 is a partial cross-sectional view showing a problem in a conventional method of forming a conductor.

The method for forming a conductor of the present invention can be applied to the formation of a touch panel in which a plurality of detecting electrodes are formed on the surface of a transparent support, and can also be applied to a surface of a conductive film for generating heat bonded to a support. The upper heating element, the conductive film for blocking electromagnetic waves, and the conductive body such as an electromagnetic wave shield bonded to the surface of the support are formed.

Here, the following embodiments will be described by taking a shape of a touch panel as an example.

Embodiment 1

Fig. 1 shows the configuration of the laminated body 1 used in the method for molding a conductor according to the first embodiment. The laminated body 1 is a touch panel for manufacturing a square tube shape (box shape) by performing three-dimensional processing including bending processing, and the transparent conductive film 3 is bonded to have a flat plate shape by a transparent adhesive 4 On the surface of the transparent insulating support 2. In the conductive film 3, the conductive member 32 is formed separately on both surfaces of the flexible transparent insulating substrate 31, and a transparent protective layer 33 is formed on both surfaces of the insulating substrate 31 so as to cover the conductive member 32.

As shown in FIG. 2, the sensing region S1 is divided on the conductive film 3, and the peripheral region S2 is defined outside the sensing region S1. On the surface of the insulating substrate 31, formed in the sensing region S1, individually extending along the first direction D1 and orthogonal to the first The plurality of first detecting electrodes 34 arranged side by side in the second direction D2 of the one direction D1 are arranged in the peripheral region S2 so that the plurality of first peripheral wirings 35 connected to the plurality of first detecting electrodes 34 are close to each other.

Similarly, on the back surface of the insulating substrate 31, a plurality of second detecting electrodes 36 which are individually extended in the second direction D2 and arranged in parallel in the first direction D1 are formed in the sensing region S1, and in the peripheral region S2, The plurality of second peripheral wires 37 connected to the plurality of second detecting electrodes 36 are arranged close to each other.

Further, as shown in FIG. 3, the first detecting electrode 34 disposed on the surface of the insulating substrate 31 is formed by a mesh pattern composed of the thin metal wires 34a, and the second detecting electrode is disposed on the back surface of the insulating substrate 31. 36 is also formed by a grid pattern composed of thin metal wires 36a.

The conductive member 32 including the first detecting electrode 34 and the first peripheral wiring 35 is formed on the surface of the insulating substrate 31, and the conductive layer including the second detecting electrode 36 and the second peripheral wiring 37 is formed on the back surface of the insulating substrate 31. The member 32 is formed with a transparent protective layer 33 on both sides of the insulating substrate 31 so as to cover the conductive members 32, thereby manufacturing the conductive film 3.

The method of forming the conductive members 32 is not particularly limited. For example, as described in <0067> to <0083> of Japanese Patent Laid-Open Publication No. 2012-185813, it is possible to expose a photosensitive material having an emulsion layer containing a photosensitive silver halide salt and perform development processing. A conductive member 36 is formed.

Further, a metal foil is individually formed on the front surface and the back surface of the insulating substrate 31, and the resist is printed on the metal foil in a pattern or coated on the entire surface. The resist is exposed and patterned by development to etch the metal of the opening, whereby the conductive members 32 can be formed. Further, as another method, a method in which a slurry containing fine particles of a material constituting the conductive member 32 is printed on the front and back surfaces of the insulating substrate 31 to perform metal plating on the slurry, and a method of using the ink can be used. In the inkjet method, the ink includes fine particles constituting a material of the conductive member 32; a method of forming an ink by screen printing, the ink includes fine particles constituting a material of the conductive member 32; a groove is formed in the insulating substrate 31, and A method in which a groove is coated with a conductive ink; and a method of microcontact printing patterning.

Here, as an example, a method of exposing a photosensitive material having an emulsion layer containing a photosensitive silver halide salt to a conductive film for a touch panel by performing development processing will be described.

(Preparation of silver halide emulsion)

In the following 1 solution which was maintained at 38 ° C and pH 4.5, the following 2 solutions and 3 solutions were each stirred in an amount of 90%, and added simultaneously for 20 minutes to form core particles of 0.16 μm. Next, the following 4 solutions and 5 solutions were added over 8 minutes, and the remaining 10% of the following 2 solutions and 3 solutions were added over 2 minutes to grow to 0.21 μm. Further, 0.15 g of potassium iodide was added, and the mixture was aged for 5 minutes to complete the formation of particles.

1 solution:

Water 750ml

2 solution:

3 solution:

4 solution:

5 solution:

Then, water washing was carried out by a conventional method and by a flocculation method. Specifically, the temperature was lowered to 35 ° C, and the pH was lowered using sulfuric acid (pH 3.6 ± 0.2 range) to settle silver halide. Next, about 3 liters of supernatant (first water wash) was removed. Further, after adding 3 liters of distilled water, sulfuric acid was added to settle the silver halide. Three liters of supernatant (second water wash) was removed again. Further, the same operation as the second water washing (third water washing) was repeated once, and the water washing and desalination process was completed. The washed and desalted emulsion was adjusted to pH 6.4, pAg7.5, and gelatin 3.9 g, sodium phenylthiosulfonate 10 mg, sodium phenylthiosulfinate 3 mg, sodium thiosulfate 15 mg, and chloroauric acid 10 mg were added. Chemical sensitization was carried out at 55 ° C for optimum sensitivity, and 1,3,3a,7-tetrazine 100 mg was added as a stabilizer, and PROXEL (trade name, ICI Co., Ltd.) was added as a preservative. Made) 100mg. The finally obtained emulsion is iochlorobromide containing 0.08 mol% of silver iodide, silver chlorobromide ratio of 70 mol% of silver chloride, 30 mol% of silver bromide, average particle diameter of 0.22 μm and coefficient of variation of 9%. Silver cube granule emulsion.

(Preparation of Composition for Photosensitive Layer Formation)

Adding 1,3,3a,7-tetrazinium 1.2×10 ^-4 mol/mol Ag to the above emulsion, hydroquinone 1.2×10 ^-2 mol/mol Ag, citric acid 3.0×10 ^{- 4} mol/mol Ag, 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt 0.90 g/mol Ag, and the pH of the coating liquid was adjusted to 5.6 using citric acid, thereby A composition for forming a photosensitive layer was obtained.

(Photosensitive layer forming process)

After the corona discharge treatment is performed on the insulating substrate, a gelatin layer having a thickness of 0.1 μm as an undercoat layer is provided on both surfaces of the insulating substrate, and an optical density of about 1.0 is provided on the undercoat layer and is contained by the developer. An antihalation layer of an alkaline, decolorized dye. The photosensitive layer-forming composition was applied onto the antihalation layer, and a gelatin layer having a thickness of 0.15 μm was further provided to obtain an insulating substrate having a photosensitive layer formed on both surfaces thereof. The insulating substrate on which the photosensitive layer is formed on both sides is referred to as a film A. The amount of silver in the photosensitive layer formed was 6.0 g/m ² and the amount of gelatin was 1.0 g/m ² .

(exposure development process)

On both sides of the above-mentioned film A, exposure was performed via a photomask corresponding to the pattern of the conductive member 36, and parallel light using a high-pressure mercury lamp as a light source. After the exposure, development was carried out by the following developer, and development treatment was carried out using a fixing solution (trade name: N3X-R for CN16X, manufactured by FUJI FILM CO., LTD.). Further, by rinsing with pure water and drying, an insulating substrate having conductive members 36 and a gelatin layer composed of Ag wires on both sides was obtained. The gelatin layer is formed between the Ag lines. The obtained film was designated as film B.

(composition of developer)

The following compound was contained in 1 liter (L) of the developer.

(heating process)

The film B was subjected to heat treatment by standing in a superheated steam bath at 120 ° C for 130 seconds. The heat-treated film was designated as film C.

(gelatin decomposition treatment)

The film C was immersed in an aqueous solution (concentration of a proteolytic enzyme: 0.5% by mass, liquid temperature: 40 ° C) of a proteolytic enzyme (Biopase AL-15FG manufactured by NAGASE CHEMTEX CORPORATION) for 120 seconds. The film C was taken out from the aqueous solution, and immersed in warm water (liquid temperature: 50 ° C) for 120 seconds and washed. The film after the gelatin decomposition treatment was used as the film D. This film D is a conductive film for a touch panel.

The conductive film 3 thus produced is bonded to the surface of the support 2 using a transparent adhesive 4, whereby a laminated body 1 for a touch panel is produced.

As a material for forming the support 2, polycarbonate (PC), cycloolefin polymer (COP), acrylic resin, or the like can be used.

Next, a method of forming a curved surface portion by bending the laminated body 1 will be described.

First, the laminated body 1 is placed on a processing machine (not shown), and both ends of the laminated body 1 are clamped. In addition, as a processing machine, a general-purpose processing machine is used, and the laminated body 1 is locally heated, and the laminated body 1 is subjected to bending processing while applying a tensile force to the laminated body 1. Formed into three Dimensional shape.

Here, the bending process is, for example, an operation of bending and deforming the flat-plate-shaped laminated body 1 to a predetermined angle, and when the laminated body 1 is deformed into an arc shape having a predetermined center, the laminated body 1 of the circular arc is drawn. The surface is referred to as a curved surface portion, and the distance from the predetermined center to the laminated body 1 is referred to as a radius of curvature, and the circumferential angle corresponding to the curved surface portion is referred to as a bending angle, and the laminated body 1 having a flat plate shape is not deformed into an arc shape. Part is called a plane.

Then, as shown in Fig. 4, the heater 5 serving as a heating element is disposed at a position facing the conductive film 3 of the laminated body 1 in the vicinity of the portion C of the laminated body 1 which is the curved surface portion by processing. The part C which is the curved surface portion is heated, and in this state, the tensile force F is applied to the laminated body 1 including at least the portion C which is the curved surface portion, and the support 2 is placed outside and the conductive film 3 is inside. The laminated body 1 is subjected to bending processing to produce the curved surface portion 6.

In addition, the amount of heat generated from the heater 5 is not limited to the part C which is the curved surface portion, and the heat of the portion C which becomes the curved portion is heated. The portion C of the curved surface portion is heated to a temperature higher than the glass transition temperature of the material constituting the support 2, and the portion of the flat portion P is maintained at a temperature lower than the glass transition temperature of the material constituting the support 2.

For example, when polycarbonate is used as the material for forming the support 2, since the glass transition temperature of the polycarbonate is about 150 ° C, it is preferable to heat the portion C which becomes the curved surface portion to a temperature of about 160 °C.

In this case, the insulating substrate 31 of the conductive film 3 is preferably formed of a high melting point material such as biaxially stretched polyethylene terephthalate (PET) having a melting temperature of 260 ° C or higher.

Further, the adhesive 4 for bonding the support 2 and the conductive film 3 can be melted by heating at a temperature at which the portion C of the curved portion is heated, and the adhesive force can be lowered. For example, an optical transparent adhesive sheet manufactured by 3M can be used. OCA).

Further, the thickness of the support 2 in the flat plate-shaped laminate 1 before the bending process is A1, the thickness of the conductive film 3 is B1, the thickness of the adhesive 4 is C1, and the curved surface is formed by bending. When the bending angle of the portion 6 is X°, the elongation E of the laminated body 1 in the curved surface portion 6 is the minimum value Emin=π×(A2+B1+2.C1)×(X/360)×0.9 or more. And the maximum value Emax=π×(A2+B1+2.C1)×(X/360)×1.45 or less

In the embodiment, the laminate 1 is subjected to a bending process while applying a tensile force to the laminate 1, and the curved portion 6 is preferably formed.

Here, the amount π×(A2+B1+2.C1)×(X/360) described in each of the minimum value Emin and the maximum value Emax represents when the bending angle of the curved surface portion 6 is X°. The difference between the length of the arc along the central portion in the thickness direction of the support 2 and the length of the arc along the central portion in the thickness direction of the conductive film 3.

When the elongation E of the laminated body 1 in the curved surface portion 6 is smaller than the minimum value Emin, the conductive film 3 located inside the curved surface portion 6 is excessively larger than the support 2 located outside the curved surface portion 6, and a compressive force acts on the conductive film 3, The adhesive 4 is lowered in adhesion by heating, and thus it is possible to cause the conductive film 3 to be peeled off from the support 2 .

On the other hand, if the elongation E of the laminated body 1 in the curved surface portion 6 is larger than the maximum value Emax, in this case, there is a possibility that the conductive member 32 of the conductive film 3, particularly the mesh composed of the metal thin wires 34a and 36a. A broken line is caused in the pattern.

Therefore, the elongation E of the laminate 1 in the curved surface portion 6 is set to be equal to or smaller than the minimum value Emin and the maximum value Emax or less, and the laminate 1 is subjected to bending processing, whereby the conductive film 3 can be prevented from being peeled off from the support 2 and the conductive film The disconnection of the conductive member 32 of 3 can produce the curved surface portion 6.

Further, the thickness A1 of the support 2, the thickness B1 of the conductive film 3, and the thickness C1 of the adhesive 4 in the flat laminated body 1 before the bending process are performed in the flat portion P after the bending of the laminated body 1 is performed. The thickness of the support 2, the thickness of the conductive film 3, and the thickness of the adhesive 4 are the same.

When the portion C which is the curved surface portion is heated to a temperature higher than the glass transition temperature of the constituent material of the support 2, a tensile force is applied to the laminated body 1 to impart elongation to the laminated body 1 in the curved surface portion 6. E, therefore, as shown in Fig. 4, the thickness A2 of the support 2 in the curved surface portion 6 after the bending process is performed is smaller than the thickness A1 of the support 2 in the flat portion P. That is, the support 2 in the curved portion 6 is thinner than the support 2 in the planar portion P. The thickness A2 of the support 2 in the curved surface portion 6 after the processing changes according to the elongation E of the laminated body 1, and when the elongation E of the laminated body 1 in the curved surface portion 6 is the smallest, the curved surface portion after the processing The thickness A2 of the support 2 in 6 is the largest, and when the elongation E of the laminated body 1 in the curved surface portion 6 is the largest, the thickness A2 of the support 2 in the curved surface portion 6 after the processing is the smallest.

Here, the value of the thickness A1 of the support 2 in the plane portion P is bent. The front and back do not change, so considering the ratio A2/A1 of the thickness A2 of the support 2 in the curved portion 6 to the thickness A1 of the support 2 in the planar portion P, the support 2 in the curved portion 6 Similarly, in the thickness A2, the value of A2/A1 also changes according to the elongation E of the laminated body 1. When the elongation E of the laminated body 1 in the curved surface portion 6 is the minimum value Emin, the value of A2/A1 is When the elongation E of the laminated body 1 in the curved surface portion 6 is the maximum value Emax, the value of A2/A1 is the smallest.

Specifically, when the elongation E of the laminated body 1 in the curved surface portion 6 is the minimum value Emin=π×(A2+B1+2.C1)×(X/360)×0.9, in the case of FIG. 4 In the direction perpendicular to the plane of the paper, the constituent material of the support 2 is not moved, and the radius of curvature of the inner side surface of the conductive film 3 in the curved surface portion 6 is R, and the thickness A2 of the support 2 in the curved surface portion 6 The ratio A2/A1 with respect to the thickness A1 of the support 2 in the planar portion P is the maximum value (A2/A1)max shown in this case can be expressed as (A2/A1)max=(R+B1/2) /((R+B1+C1+A2/2)×0.9). . . (1).

On the other hand, when the elongation E of the laminated body 1 in the curved surface portion 6 is the maximum value Emax=π×(A2+B1+2‧C1)×(X/360)×1.45, the curved surface portion is similarly obtained. The ratio A2/A1 of the thickness A2 of the support 2 in the support 2 to the thickness A1 of the support 2 in the plane portion P can be expressed as (A2/A1) in the minimum value (A2/A1) min shown in this case. Min=(R+B1/2)/((R+B1+C1+A2/2)×1.45). . . (2).

Therefore, in order to make the ratio A2/A1 of the thickness A2 of the support 2 in the curved surface portion 6 to the thickness A1 of the support 2 in the planar portion P satisfy the minimum value (A2/A1) min or more and the maximum value (A2/A1) Under the condition of max or less, if the laminated body 1 is implemented In the bending process, the curved surface portion 6 can be produced while preventing the conductive film 3 from being peeled off from the support 2 and the conductive member 32 of the conductive film 3 from being broken.

In this manner, after the curved surface portion 6 is produced, the clamping of the processing machine is released, and the laminated body 1 is taken out from the processing machine.

In the same manner, by manufacturing the plurality of curved surface portions 6 required for the laminated body 1, it is possible to manufacture, for example, the touch panel 7 having the rectangular tube shape (box shape) of the rectangular upper surface as shown in FIG. Since the touch panel 7 can prevent the conductive film 3 in the curved surface portion 6 from being peeled off from the support 2, it has a good appearance and can perform a highly reliable operation without causing disconnection of the conductive member 32 of the conductive film 3.

Embodiment 2

In the first embodiment, the heater 5 is disposed in the vicinity of the portion C of the laminated body 1 which is the curved surface portion 6 and is opposed to the conductive film 3 of the laminated body 1 by the processing. However, the heater 5 is not limited thereto. As shown in FIG. 6, the heater 5 may be disposed in the vicinity of the portion C of the laminated body 1 which is the curved surface portion 6, and at a position opposed to the support 2 of the laminated body 1.

The material constituting the support 2 in the portion C of the curved surface portion 6 is heated to a temperature higher than the glass transition temperature by the heat from the heater 5, so that the heater 5 is disposed opposite the support 2 The position, that is, when the curved surface portion 6 is formed, is disposed at a position outside the curved surface portion 6, and the curved surface portion 6 can be efficiently produced.

Further, in the above-described first and second embodiments, the heater 5 serving as a heating element is used to heat the portion C which becomes the curved surface portion 6, but it is also possible to use radiation Heat and other means to heat.

Further, in the above-described first and second embodiments, the laminated body 1 is subjected to bending processing while applying the tensile force F to the laminated body 1. However, since the supporting body 2 needs to be elongated, it is possible to laminate only one side. The support body 2 in the body 1 is subjected to a bending force F, and the curved body portion 6 can be produced by performing bending processing on the laminated body 1. In the case where the conductive film 3 is not disposed on the entire surface of the support 2, but the end portion of the support 2 is formed with a region where the conductive film 3 is not present, the end portion of the support 2 is clamped by The processing machine can apply the tensile force F only to the support 2 .

In the first and second embodiments, the conductive film 3 has a plurality of first detecting electrodes 34 and a plurality of first peripheral wirings 35 disposed on the surface of the insulating substrate 31, and a plurality of second portions disposed on the back surface of the insulating substrate 31. The detection electrode 36 and the plurality of second peripheral wires 37 are not limited thereto.

For example, the plurality of first detecting electrodes 34 and the plurality of second detecting electrodes 36 may be disposed on one surface side of the insulating substrate 31 via the interlayer insulating film, and the plurality of first peripheral wirings 35 and the plurality of second portions The peripheral wiring 37 is disposed on the same surface side as the insulating substrate 31.

Further, in the above-described first and second embodiments, the touch panel 7 having the rectangular tube shape having a rectangular upper surface is produced. However, the present invention is not limited thereto, and a polygonal shape having a triangular shape or a pentagon shape or more can be produced in the same manner. A touch panel of a rectangular tube shape, a cylindrical shape or an elliptical touch panel. Further, in addition, the touch panel having various three-dimensional shapes of the curved surface portion can be produced in the same manner.

Moreover, in addition to the touch panel, it is possible to produce heat in the same manner. A conductor having a three-dimensional shape of a curved surface portion, such as a body or an electromagnetic wave shield.

[Examples]

Example 1

The laminate 1 of the conductive film 3 bonded to the surface of the support 2 by the transparent adhesive 4 is subjected to a tensile force, and while the portion to be the curved portion 6 is heated, the support 2 is placed outside. The curved surface portion 6 is produced by performing bending processing so that the conductive film 3 is inside.

Polycarbonate (PC) having a thickness of A1 = 0.5 mm was used as the support 2, and a transparent substrate having a thickness of B1 = 0.1 mm made of biaxially stretched polyethylene terephthalate (PET) was used. Conductive film As the conductive film 3, an optical transparent adhesive sheet (OCA) 8172CL manufactured by 3M Company having a thickness of C1 = 0.05 mm was used as the adhesive 4.

Further, the heating temperature of the portion C which is the curved surface portion 6 is 160 ° C, and the radius of curvature R of the inner side surface of the conductive film 3 in the curved surface portion 6 after the processing is set to 1 mm, and the support 2 in the curved surface portion 6 after the processing The thickness A2 is set to 0.3 mm.

Example 2

The radius of curvature R of the inner side surface of the conductive film 3 in the processed face portion 6 was set to 2 mm, and the thickness A2 of the support body 2 in the curved surface portion 6 after the processing was set to 0.34 mm, and other examples were given. In the same manner, the curved surface portion 6 is produced.

Example 3

The radius of curvature R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 is 2 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing is set to The curved surface portion 6 was produced in the same manner as in the first embodiment except for 0.43 mm.

Example 4

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 is set to 3 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing is set to 0.33 mm, and In the same manner as in Example 1, the curved surface portion 6 was produced.

Example 5

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 was set to 3 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing was set to 0.42 mm, and In the same manner as in Example 1, the curved surface portion 6 was produced.

Example 6

The curvature radius R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 was set to 3 mm, and the thickness A2 of the support body 2 in the curved surface portion 6 after the processing was set to 0.48 mm, and In the same manner as in Example 1, the curved surface portion 6 was produced.

Example 7

A laminate 1 using polycarbonate (PC) having a thickness of A1 = 1.0 mm was used as the support 2, and the radius of curvature R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 was set to 1 mm. The curved surface portion 6 was produced in the same manner as in the first embodiment except that the thickness A2 of the support 2 in the curved surface portion 6 after the processing was 0.66 mm.

Example 8

The radius of curvature R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 is 2 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing is set to A curved surface portion 6 was produced in the same manner as in Example 7 except for 0.62 mm.

Example 9

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 was set to 2 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing was set to 0.74 mm, and In the same manner as in Example 7, the curved surface portion 6 was produced.

Example 10

The curvature radius R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 was set to 3 mm, and the thickness A2 of the support body 2 in the curved surface portion 6 after the processing was set to 0.76 mm, and In the same manner as in Example 7, the curved surface portion 6 was produced.

Example 11

The curvature radius R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 was set to 3 mm, and the thickness A2 of the support body 2 in the curved surface portion 6 after the processing was set to 0.92 mm, and In the same manner as in Example 7, the curved surface portion 6 was produced.

Comparative example 1

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 was set to 1 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing was set to 0.2 mm, and In the same manner as in Example 1, the curved surface portion 6 was produced.

Comparative example 2

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 is set to 1 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing is set to 0.44 mm, and In the same manner as in Example 1, the curved surface portion 6 was produced.

Comparative example 3

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 is set to 1 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing is set to 0.49 mm, and In the same manner as in Example 1, the curved surface portion 6 was produced.

Comparative example 4

The curvature radius R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 was set to 2 mm, and the thickness A2 of the support body 2 in the curved surface portion 6 after the processing was set to 0.22 mm, and In the same manner as in Example 1, the curved surface portion 6 was produced.

Comparative Example 5

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 is 2 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing is set to 0.49 mm, and In the same manner as in Example 1, the curved surface portion 6 was produced.

Comparative Example 6

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 was set to 3 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing was set to 0.26 mm, and In the same manner as in Example 1, the curved surface portion 6 was produced.

Comparative Example 7

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 was set to 1 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing was set to 0.38 mm, and In the same manner as in Example 7, the curved surface portion 6 was produced.

Comparative Example 8

The radius of curvature R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 is set to 1 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing is set to A curved surface portion 6 was produced in the same manner as in Example 7 except that 0.50 mm was used.

Comparative Example 9

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 was set to 1 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing was set to 0.90 mm, and In the same manner as in Example 7, the curved surface portion 6 was produced.

Comparative Example 10

The curvature radius R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 was set to 2 mm, and the thickness A2 of the support body 2 in the curved surface portion 6 after the processing was set to 0.4 mm, and In the same manner as in Example 7, the curved surface portion 6 was produced.

Comparative Example 11

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 was set to 2 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing was set to 0.92 mm, and In the same manner as in Example 7, the curved surface portion 6 was produced.

Comparative Example 12

The curvature radius R of the inner side surface of the conductive film 3 in the processed curved surface portion 6 was set to 3 mm, and the thickness A2 of the support body 2 in the curved surface portion 6 after the processing was set to 0.44 mm, and In the same manner as in Example 7, the curved surface portion 6 was produced.

Comparative Example 13

The curvature radius R of the inner surface of the conductive film 3 in the processed curved surface portion 6 was set to 3 mm, and the thickness A2 of the support 2 in the curved surface portion 6 after the processing was set to 0.56 mm, and In the same manner as in Example 7, the curved surface portion 6 was produced.

In the first to eleventh and the comparative examples 1 to 13, the thickness of the use was Polycarbonate (PC) having A1 = 0.5 mm was used as the support 2, and each of Example 1 and Comparative Examples 1 to 3 in which the radius of curvature R of the inner surface of the conductive film 3 in the curved surface portion 6 was set to 1 mm was individually produced. The curved surface portion was visually evaluated for the presence or absence of peeling between the support 2 and the conductive film 3, and the conductive member 32 in the conductive film 3 in the curved portion was subjected to conduction inspection to evaluate the presence or absence of the disconnection of the conductive member 32. At the time, the results as shown in Table 1 were obtained. Further, in Table 1, the thickness A2 of the support 2 and the thickness of the conductive film 3 in the curved surface portions 6 of the first embodiment and the comparative examples 1 to 3 are substituted in the above formulas (1) and (2). B1, the maximum thickness (A2/A1)max and the minimum value (A2/A1) min of the ratio A2/A1 of the thickness of the support 2 calculated by the thickness C1 of the adhesive 4 and the radius of curvature R.

In the evaluation results of Table 1, A indicates that no peeling occurred between the support 2 and the conductive film 3, and it was not confirmed that the conductive member 32 in the conductive film 3 was broken, and B indicates that the conductive film 3 was not confirmed. The inner conductive member 32 was broken, but it was confirmed that peeling occurred between the support 2 and the conductive film 3, and C indicates that peeling occurred between the support 2 and the conductive film 3 was not confirmed, but it was confirmed that the conductive film 3 was present. The conductive member 32 inside is broken.

The ratio A2/A1=0.6 in Example 1 satisfies the minimum value (A2/A1) min to The condition of the upper limit and the maximum value (A2/A1) max or less does not cause peeling between the support 2 and the conductive film 3, and the disconnection of the conductive member 32 in the conductive film 3 does not occur.

On the other hand, since the ratio A2/A1=0.4 in Comparative Example 1 is smaller than the minimum value (A2/A1) min, and the laminated body 1 in the curved surface portion 6 is excessively elongated, it is considered that the conductive member 32 in the conductive film 3 is broken. Line player.

On the other hand, since the ratio A2/A1=0.88 in Comparative Example 2 and the ratio A2/A1=0.98 in Comparative Example 3 are larger than the maximum value (A2/A1)max, and the elongation of the laminated body 1 in the curved surface portion 6 Since the amount E is insufficient, it is considered that the conductive film 3 is buckling and peeled off from the support 2 .

In Examples 1 to 12 and Comparative Examples 1 to 12, polycarbonate (PC) having a thickness of A1 = 0.5 mm was used as the support 2, and the radius of curvature R of the inner side surface of the conductive film 3 in the curved surface portion 6 was used. The curved surface portions which were individually formed in Examples 2 to 3 and Comparative Examples 4 to 5 of 2 mm were evaluated by visual inspection for the occurrence of peeling between the support 2 and the conductive film 3, and the conductive film in the curved surface portion. When the conductive member 32 in 3 was subjected to the conduction inspection to evaluate the presence or absence of the disconnection of the conductive member 32, the results as shown in Table 2 were obtained. Further, in Table 2, the thickness A2 of the support 2 in each of the curved surface portions 6 of Examples 2 to 3 and Comparative Examples 4 to 5 is substituted in the above formulas (1) and (2). The maximum value (A2/A1)max and the minimum value (A2/A1) min of the ratio A2/A1 of the thickness of the support 2 calculated from the thickness B1 of the conductive film 3, the thickness C1 of the adhesive 4, and the radius of curvature R.

Among the evaluation results of Table 2, A, B, and C are the same as those shown in Table 1.

The ratio of the ratio A2/A1=0.68 in the second embodiment and the ratio A2/A1=0.86 in the third embodiment satisfy the minimum value (A2/A1) min or more and the maximum value (A2/A1)max or less, not only not generated. The peeling between the support 2 and the conductive film 3 does not cause disconnection of the conductive member 32 in the conductive film 3.

On the other hand, since the ratio A2/A1=0.44 in Comparative Example 4 is smaller than the minimum value (A2/A1) min, and the laminated body 1 in the curved surface portion 6 is excessively elongated, it is considered that the conductive member 32 in the conductive film 3 is broken. Line player.

On the other hand, since the ratio A2/A1=0.98 in Comparative Example 5 exceeds the maximum value (A2/A1)max, and the elongation E of the laminated body 1 in the curved surface portion 6 is insufficient, it is considered that the pressure is generated in the conductive film 3. The person who peeled off from the support 2 is bent.

In Examples 1 to 12 and Comparative Examples 1 to 12, polycarbonate (PC) having a thickness of A1 = 0.5 mm was used as the support 2, and the radius of curvature R of the inner side surface of the conductive film 3 in the curved surface portion 6 was used. The curved surface portions which were individually formed in Examples 4 to 6 and Comparative Example 6 of 3 mm were evaluated by visual observation for the occurrence of peeling between the support 2 and the conductive film 3, and in the conductive film 3 in the curved surface portion. When the conductive member 32 was subjected to the conduction inspection to evaluate the presence or absence of the disconnection of the conductive member 32, the results as shown in Table 3 were obtained. Further, in Table 3, the above formulas (1) and (2) are described. The support body is calculated by substituting the thickness A2 of the support 2, the thickness B1 of the conductive film 3, the thickness C1 of the adhesive 4, and the radius of curvature R in the curved surface portion 6 of each of the fourth to sixth embodiments and the comparative example 6 The ratio of the thickness of 2 is the maximum value (A2/A1)max and the minimum value (A2/A1) min of A2/A1.

Among the evaluation results of Table 3, A and C are the same as those shown in Table 1.

The ratio A2/A1=0.66 in Example 4, the ratio A2/A1=0.84 in Example 5, and the ratio A2/A1=0.96 in Example 6 satisfy the minimum value (A2/A1) min or more and the maximum value ( The condition of A2/A1)max or less not only causes peeling between the support 2 and the conductive film 3, but also does not cause disconnection of the conductive member 32 in the conductive film 3.

On the other hand, since the ratio A2/A1=0.52 in Comparative Example 6 is smaller than the minimum value (A2/A1) min, and the laminated body 1 in the curved surface portion 6 is excessively elongated, it is considered that the conductive member 32 in the conductive film 3 is broken. Line player.

In Examples 1 to 12 and Comparative Examples 1 to 12, polycarbonate (PC) having a thickness of A1 = 1.0 mm was used as the support 2, and the radius of curvature R of the inner side surface of the conductive film 3 in the curved surface portion 6 was used. The curved surface portions which were individually produced in Example 7 and Comparative Examples 7 to 9 which were set to 1 mm were visually evaluated for the presence or absence of peeling between the support 2 and the conductive film 3, and in the conductive film 3 in the curved surface portion. When the conductive member 32 performs a conduction check and evaluates whether or not the disconnection of the conductive member 32 occurs, the obtained The results shown in Table 4. Further, in Table 4, the thickness A2 of the support 2 in the curved surface portion 6 of each of the seventh embodiment and the comparative examples 7 to 9 is substituted in the above formulas (1) and (2), and the conductive film 3 is described. The thickness B1, the thickness C1 of the adhesive 4, and the radius of curvature R are calculated as the maximum value (A2/A1)max and the minimum value (A2/A1) min of the ratio A2/A1 of the thickness of the support 2.

Among the evaluation results of Table 4, A, B, and C are the same as those shown in Table 1.

In the case where the ratio A2/A1=0.66 in the seventh embodiment satisfies the minimum value (A2/A1) min or more and the maximum value (A2/A1)max or less, not only the peeling between the support 2 and the conductive film 3 but also the peeling between the support 2 and the conductive film 3 is not caused. Broken wires of the conductive member 32 in the conductive film 3 are also not generated.

On the other hand, since the ratio A2/A1=0.38 in Comparative Example 7 and the ratio A2/A1=0.5 in Comparative Example 8 are both smaller than the minimum value (A2/A1) min, and the laminated body 1 in the curved surface portion 6 is excessively elongated. Therefore, it is considered that the conductive member 32 in the conductive film 3 is broken.

On the other hand, since the ratio A2/A1=0.9 in Comparative Example 9 exceeds the maximum value (A2/A1)max, and the elongation E of the laminate 1 in the curved surface portion 6 is insufficient, it is considered that the pressure is generated in the conductive film 3. The person who peeled off from the support 2 is bent.

In Examples 1 to 12 and Comparative Examples 1 to 12, the thickness used was Polycarbonate (PC) having A1 = 1.0 mm is used as the support 2, and the curvature radius R of the inner side surface of the conductive film 3 in the curved surface portion 6 is set to 2 mm, and individual examples 8 to 9 and comparative examples 10 to 11 are individually The surface portion to be produced was evaluated for the presence or absence of peeling between the support 2 and the conductive film 3 by visual inspection, and the conductive member 32 in the conductive film 3 in the curved portion was subjected to conduction inspection to evaluate the presence or absence of the conductive member 32. When the line is broken, the results as shown in Table 5 are obtained. Further, in Table 5, the thickness A2 of the support 2 and the conductive film 3 in the curved surface portions 6 of the respective Examples 8 to 9 and Comparative Examples 10 to 11 are substituted in the above formulas (1) and (2). The thickness B1, the thickness C1 of the adhesive 4, and the radius of curvature R are calculated as the maximum value (A2/A1)max and the minimum value (A2/A1) min of the ratio A2/A1 of the thickness of the support 2.

The A, B, and C lines in the evaluation results of Table 5 are the same as those shown in Table 1.

The ratio of the ratio A2/A1=0.62 in the eighth embodiment and the ratio A2/A1=0.74 in the example 9 satisfy the minimum value (A2/A1) min or more and the maximum value (A2/A1)max or less, not only not generated. The peeling between the support 2 and the conductive film 3 does not cause disconnection of the conductive member 32 in the conductive film 3.

On the other hand, since the ratio A2/A1=0.4 in Comparative Example 10 is smaller than the minimum value (A2/A1) min, and the laminated body 1 in the curved surface portion 6 is excessively elongated, it is considered that the conductive member 32 in the conductive film 3 is broken. Line player.

On the other hand, since the ratio A2/A1=0.92 in Comparative Example 11 exceeds the maximum value (A2/A1)max, and the elongation E of the laminated body 1 in the curved surface portion 6 is insufficient, it is considered that the pressure is generated in the conductive film 3. The person who peeled off from the support 2 is bent.

In Examples 1 to 12 and Comparative Examples 1 to 12, polycarbonate (PC) having a thickness of A1 = 1.0 mm was used as the support 2, and the radius of curvature R of the inner side surface of the conductive film 3 in the curved surface portion 6 was used. The curved surface portions which were individually produced in Examples 10 to 11 and Comparative Examples 12 to 13 of 3 mm were visually evaluated for the presence or absence of peeling between the support 2 and the conductive film 3, and the conductive film in the curved surface portion. When the conductive member 32 in 3 was subjected to the conduction inspection and the presence or absence of the disconnection of the conductive member 32 was evaluated, the results as shown in Table 6 were obtained. Further, in Table 6, the thickness A2 of the support 2 and the conductive film 3 in the curved surface portions 6 of the respective examples 10 to 11 and the comparative examples 12 to 13 are substituted in the above formulas (1) and (2). The thickness B1, the thickness C1 of the adhesive 4, and the radius of curvature R are calculated as the maximum value (A2/A1)max and the minimum value (A2/A1) min of the ratio A2/A1 of the thickness of the support 2.

Among the evaluation results of Table 6, A and C are the same as those shown in Table 1.

The ratio of the ratio A2/A1=0.76 in the tenth embodiment and the ratio A2/A1=0.92 in the example 11 satisfying the minimum value (A2/A1) min or more and the maximum value (A2/A1)max or less are not produced. The peeling between the support 2 and the conductive film 3 does not cause disconnection of the conductive member 32 in the conductive film 3.

On the other hand, since the ratio A2/A1=0.44 in Comparative Example 12 and the ratio A2/A1=0.56 in Comparative Example 13 are smaller than the minimum value (A2/A1) min, and the laminated body 1 in the curved surface portion 6 is excessively elongated, Therefore, it is considered that the conductive member 32 in the conductive film 3 is broken.

Claims (10)

A method of forming a conductor, which is a method of forming a conductor having a planar portion and a three-dimensional shape of a curved portion formed on a laminate, wherein the laminate has an insulating support having a flat shape A conductive film having a metal mesh is bonded to the surface of the body via a bonding agent, and the method of molding the conductive body is characterized in that at least the portion which becomes the curved surface portion of the laminated body is heated at the time of forming A part of the portion is subjected to a tensile force, and the laminate is subjected to a bending process so that the support is outside and the conductive film is inside. The curved portion is formed, and the thickness of the support in the flat portion is set. In the case of A1, the thickness of the conductive film is B1, the thickness of the adhesive is C1, the thickness of the support in the curved surface portion produced is A2, and the radius of curvature of the inner surface of the curved surface portion is R. In the case, A2/A1 is (R+B1/2)/((R+B1+C1+A2/2)×1.45) or more and (R+B1/2)/((R+B1+C1+A2) /2) × 0.9) below. In the method of forming a conductor according to the first aspect of the invention, in the case where the bending angle of the curved surface portion is X°, the elongation E of the laminate in the curved surface portion is π × (A2+B1+2‧C1)×(X/360)×0.9 or more and π×(A2+B1+2‧C1)×(X/360)×1.45 or less, while stretching the laminate The above-mentioned laminated body is subjected to bending processing to produce the curved surface portion. The method of forming a conductor according to the first or second aspect of the invention, wherein the portion of the laminate that is the curved surface portion is heated to a temperature higher than a glass transition temperature of the support, and is In a state in which the portion of the flat portion is maintained at a temperature lower than the glass transition temperature of the support, the laminate is subjected to a bending process to produce the curved surface portion. The method of forming a conductor according to the first or second aspect of the invention, wherein the portion of the laminate that is the curved surface portion is heated from the support side. The method of forming a conductor according to the first or second aspect of the invention, wherein the laminate is subjected to a bending process only by applying a tensile force to the support in the laminate, thereby producing the curved portion. . The method of forming a conductor according to the first or second aspect of the invention, wherein the support is made of an insulating transparent resin, and the conductive film is provided with the metal on a surface of the flexible insulating substrate. The transparent conductive film of the mesh, wherein the adhesive is transparent. The method of forming a conductor according to the first or second aspect of the invention, wherein the conductor is used as a touch panel, an electromagnetic wave shield or a heat generating body. An electric conductor in which a three-dimensional shape having a conductive film having a metal mesh is bonded to a surface of an insulating support via an adhesive, the conductive body having a flat portion and a curved surface portion, The thickness of the support in the flat portion is A1, the thickness of the conductive film is B1, the thickness of the adhesive is C1, and the thickness of the support in the curved portion is A2, and the inner surface of the curved surface is When the radius of curvature is set to R, A2/A1 is (R+B1/2)/((R+B1+C1+A2/2)×1.45) and (R+B1/2)/((R+ B1 + C1 + A2 / 2) × 0.9) Hereinafter, the radius of curvature R of the inner surface of the curved surface portion is 1 mm or more and 3 mm or less. The conductor according to claim 8, wherein the support is made of an insulating transparent resin, and the conductive film is a transparent conductive film in which the metal mesh is disposed on a surface of a flexible insulating substrate. The aforementioned adhesive is transparent. The electric conductor according to claim 8 or 9, which is used as a touch panel, an electromagnetic wave shield or a heat generating body.