TWI668455B - 電子零件搬送裝置及電子零件檢查裝置 - Google Patents
電子零件搬送裝置及電子零件檢查裝置 Download PDFInfo
- Publication number
- TWI668455B TWI668455B TW107105615A TW107105615A TWI668455B TW I668455 B TWI668455 B TW I668455B TW 107105615 A TW107105615 A TW 107105615A TW 107105615 A TW107105615 A TW 107105615A TW I668455 B TWI668455 B TW I668455B
- Authority
- TW
- Taiwan
- Prior art keywords
- inspection
- electronic component
- electronic
- holding portion
- fingerprint identification
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 298
- 238000012546 transfer Methods 0.000 title claims abstract description 58
- 230000000704 physical effect Effects 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 7
- 230000032258 transport Effects 0.000 claims description 6
- 238000012545 processing Methods 0.000 abstract description 4
- 238000003825 pressing Methods 0.000 description 96
- 238000005259 measurement Methods 0.000 description 69
- 238000001514 detection method Methods 0.000 description 33
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000011084 recovery Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000009530 blood pressure measurement Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-031827 | 2017-02-23 | ||
| JP2017031827A JP2018136239A (ja) | 2017-02-23 | 2017-02-23 | 電子部品搬送装置及び電子部品検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201831913A TW201831913A (zh) | 2018-09-01 |
| TWI668455B true TWI668455B (zh) | 2019-08-11 |
Family
ID=63365484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107105615A TWI668455B (zh) | 2017-02-23 | 2018-02-14 | 電子零件搬送裝置及電子零件檢查裝置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2018136239A (enrdf_load_stackoverflow) |
| CN (1) | CN108499906A (enrdf_load_stackoverflow) |
| TW (1) | TWI668455B (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020051944A (ja) * | 2018-09-27 | 2020-04-02 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090139077A1 (en) * | 2007-11-29 | 2009-06-04 | Chan-Yong Lee | Method of manufacturing wafer carrier |
| KR20100036435A (ko) * | 2008-09-30 | 2010-04-08 | (주)테크윙 | 전자부품 테스트 시스템 |
| TW201317590A (zh) * | 2011-10-25 | 2013-05-01 | Chroma Ate Inc | 觸控板檢測機台 |
| CN105938169A (zh) * | 2016-03-25 | 2016-09-14 | 江苏凯尔生物识别科技有限公司 | 指纹模组金属环组装吸附冶具 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0514951U (ja) * | 1991-08-14 | 1993-02-26 | 横河電機株式会社 | 半導体テスト装置 |
| TW369692B (en) * | 1997-12-26 | 1999-09-11 | Samsung Electronics Co Ltd | Test and burn-in apparatus, in-line system using the apparatus, and test method using the system |
| EP2241520A3 (en) * | 2009-04-13 | 2013-05-29 | Ackley Machine Corp. | Ejection System |
| JP5621313B2 (ja) * | 2010-05-14 | 2014-11-12 | セイコーエプソン株式会社 | 電子部品検査装置及び電子部品搬送方法 |
| JP6083140B2 (ja) * | 2012-07-20 | 2017-02-22 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
| JP5996983B2 (ja) * | 2012-09-19 | 2016-09-21 | ヤマハ発動機株式会社 | 電子部品装着装置 |
| CN106269581B (zh) * | 2015-06-10 | 2019-10-18 | 鸿劲科技股份有限公司 | 指纹辨识电子元件作业装置及其应用的测试分类设备 |
| CN106180004B (zh) * | 2016-08-08 | 2022-10-28 | 深圳市华力宇电子科技有限公司 | 指纹分选机的控制系统及控制方法 |
-
2017
- 2017-02-23 JP JP2017031827A patent/JP2018136239A/ja active Pending
-
2018
- 2018-02-12 CN CN201810144864.9A patent/CN108499906A/zh active Pending
- 2018-02-14 TW TW107105615A patent/TWI668455B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090139077A1 (en) * | 2007-11-29 | 2009-06-04 | Chan-Yong Lee | Method of manufacturing wafer carrier |
| KR20100036435A (ko) * | 2008-09-30 | 2010-04-08 | (주)테크윙 | 전자부품 테스트 시스템 |
| TW201317590A (zh) * | 2011-10-25 | 2013-05-01 | Chroma Ate Inc | 觸控板檢測機台 |
| CN105938169A (zh) * | 2016-03-25 | 2016-09-14 | 江苏凯尔生物识别科技有限公司 | 指纹模组金属环组装吸附冶具 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201831913A (zh) | 2018-09-01 |
| JP2018136239A (ja) | 2018-08-30 |
| CN108499906A (zh) | 2018-09-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |