TWI665033B - Method and system for making a multilayer chemical mechanical planarization pad using centrifugal casting - Google Patents
Method and system for making a multilayer chemical mechanical planarization pad using centrifugal casting Download PDFInfo
- Publication number
- TWI665033B TWI665033B TW104117524A TW104117524A TWI665033B TW I665033 B TWI665033 B TW I665033B TW 104117524 A TW104117524 A TW 104117524A TW 104117524 A TW104117524 A TW 104117524A TW I665033 B TWI665033 B TW I665033B
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- window
- polymer
- pad
- polymer mixture
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/04—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould
- B29C41/042—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould by rotating a mould around its axis of symmetry
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
本發明係關於一種用於製備多層抛光墊之方法,其包括使圓筒圍繞中心軸線旋轉。該圓筒在內部空間中圍封單一聚合物混合物,該混合物在離心力作用下相分離。該方法亦包括自在該聚合物混合物已反應之後形成的聚合物中之至少一些形成該抛光墊。該方法包括藉由依序鑄造及膠凝至少兩種不同聚合物在該抛光墊中形成至少兩個相異層。 The present invention relates to a method for preparing a multilayer polishing pad, which includes rotating a cylinder about a central axis. The cylinder encloses a single polymer mixture in the internal space, and the mixture is phase separated by centrifugal force. The method also includes forming the polishing pad from at least some of the polymers formed after the polymer mixture has reacted. The method includes forming at least two distinct layers in the polishing pad by sequentially casting and gelling at least two different polymers.
Description
本發明大體上係關於抛光墊。更具體言之,本發明係關於使用離心鑄造機鑄造聚合物抛光墊之方法及系統。 The present invention relates generally to polishing pads. More specifically, the present invention relates to a method and system for casting polymer polishing pads using a centrifugal casting machine.
抛光(亦稱作平坦化)為通常用於半導體、硬碟驅動器及光學產品之製造中的製程步驟。抛光製程一般由抵靠著聚合物墊摩擦基板組成,或反之亦然。通常含有精細粒子之化學溶液(漿料)存在於基板與聚合物墊之間的界面處。 Polishing (also known as planarization) is a process step commonly used in the manufacture of semiconductors, hard disk drives, and optical products. The polishing process typically consists of rubbing the substrate against a polymer pad, or vice versa. A chemical solution (slurry) containing fine particles usually exists at the interface between the substrate and the polymer pad.
提供一種方法,其包括使模具圍繞軸線旋轉。該模具限制至少包括高密度材料及低密度材料之聚合物混合物。該方法亦包括在離心力之影響下將該聚合物混合物分離成包括該高密度材料之第一層及包括該低密度材料之第二層。該模具包括圓筒,且該軸線為該圓筒之中心軸線。在一些實施例中,該圓筒包括經調適以旋轉之離心鑄造機。該離心鑄造機界定圓筒形內部空間。 A method is provided that includes rotating a mold about an axis. The mold limitation includes at least a polymer mixture of a high density material and a low density material. The method also includes separating the polymer mixture into a first layer including the high density material and a second layer including the low density material under the influence of centrifugal force. The mold includes a cylinder, and the axis is a central axis of the cylinder. In some embodiments, the cylinder includes a centrifugal casting machine adapted to rotate. The centrifugal casting machine defines a cylindrical internal space.
該方法視情況包括在該聚合物混合物已分離且反應之後形成包括至少兩個相異層的多層抛光墊。該第一層經調適以用作該多層抛光墊之抛光墊,且該第二層經調適以用作該多層抛光墊之次墊。該低密度材料包括圍封氣體之微球體。 The method optionally includes forming a multilayer polishing pad including at least two distinct layers after the polymer mixture has been separated and reacted. The first layer is adapted to be used as a polishing pad for the multilayer polishing pad, and the second layer is adapted to be used as a secondary pad for the multilayer polishing pad. The low density material includes microspheres enclosing the gas.
在一些實施例中,該方法包括將第二聚合物混合物引入至該模具中且進一步旋轉該模具。該第二聚合物混合物包括單一密度材料或至少包括第二高密度材料及第二低密度材料。若該第二聚合物混合物為單一密度材料,則其可比第一或第二層中之任一者(個別或組合)硬、軟、厚或薄。由第二聚合物混合物形成之層可充當抛光表面或次墊。在進一步旋轉操作期間,第二聚合物混合物在離心力之影響下分離成包括第二高密度材料之第三層及包括第二低密度材料之第四層。第三層插入於第二層與第四層之間。第二低密度材料包括圍封氣體之微球體。 In some embodiments, the method includes introducing a second polymer mixture into the mold and further rotating the mold. The second polymer mixture includes a single density material or at least a second high density material and a second low density material. If the second polymer mixture is a single density material, it may be harder, softer, thicker, or thinner than either of the first or second layers (individually or in combination). The layer formed from the second polymer mixture can serve as a polishing surface or a sub-pad. During the further rotation operation, the second polymer mixture is separated into a third layer including a second high-density material and a fourth layer including a second low-density material under the influence of centrifugal force. The third layer is interposed between the second and fourth layers. The second low-density material includes microspheres enclosing the gas.
在一些實施例中,該方法包括在將第二聚合物混合物引入至模具中之前將聚酯、紡織物或導電材料之層置放在第二層上以在第二層之頂部上形成額外層。該方法可包括在將第二聚合物混合物引入至模具中之前將液體噴灑至第二層之表面上。該液體為黏著劑及/或導電層。或者,聚酯、紡織物或導電材料之層置放於第二層上。在此步驟之前可將液體施配於第二層之表面上。不添加額外層。 In some embodiments, the method includes placing a layer of polyester, textile, or conductive material on the second layer to form an additional layer on top of the second layer before introducing the second polymer mixture into the mold. . The method may include spraying a liquid onto the surface of the second layer before introducing the second polymer mixture into the mold. The liquid is an adhesive and / or a conductive layer. Alternatively, a layer of polyester, textile or conductive material is placed on the second layer. Prior to this step, the liquid may be dispensed onto the surface of the second layer. No extra layers are added.
施配器經調適以將聚合物混合物引入至離心鑄造機中。該方法視情況包括在旋轉之至少一部分時間期間加熱模具。該方法視情況包括在將聚合物混合物施配至模具中之前使用脫模劑處理模具之表面。 The dispenser is adapted to introduce the polymer mixture into a centrifugal casting machine. The method optionally includes heating the mold during at least a portion of the rotation. The method optionally includes treating the surface of the mold with a release agent before dispensing the polymer mixture into the mold.
在一些實施例中,該方法包括於模具之表面上形成紋理及/或使用襯墊或插件。該襯墊或插件將含有紋理。置放於模具之表面上之襯墊或插件稱作底部襯墊或插件。另外,第二襯墊或插件可在聚合物混合物已施加至模具及/或底部襯墊或插件之後安置於模具中。此第二襯墊或插件稱作頂部襯墊或插件。該等襯墊或插件之紋理經調適以於該多層抛光墊之工作表面上形成凹槽紋理,形成勾劃該多層抛光墊之外緣的穿孔,及/或在與該工作表面相對置之墊表面的背面上形成粗糙化紋理以改良該墊表面與黏著劑及/或次墊之間的黏著力。 In some embodiments, the method includes forming a texture on the surface of the mold and / or using a pad or insert. The pad or plug will contain texture. The pad or insert placed on the surface of the mold is called the bottom pad or insert. In addition, the second pad or insert may be placed in the mold after the polymer mixture has been applied to the mold and / or the bottom pad or insert. This second pad or insert is called a top pad or insert. The textures of the pads or inserts are adapted to form groove textures on the working surface of the multilayer polishing pad, form perforations that delineate the outer edges of the multilayer polishing pad, and / or pads opposite the working surface A roughened texture is formed on the back surface of the surface to improve the adhesion between the surface of the pad and the adhesive and / or sub-pad.
該方法包括在將聚合物混合物引入至模具中之前在模具之表面上安置至少一個窗口。 The method includes placing at least one window on a surface of a mold before introducing the polymer mixture into the mold.
提供用於製造多層抛光墊之系統。該系統包括具有旋轉軸線之模具。模具之底部表面上之實質上所有點在圍繞旋轉軸線旋轉的整個過程中距離該旋轉軸線為實質上等距的。模具經調適以當該模具在旋轉時限制聚合物混合物。該系統進一步包括經調適以將聚合物混合物引入至模具中之施配器。 A system for manufacturing a multilayer polishing pad is provided. The system includes a mold having a rotation axis. Substantially all points on the bottom surface of the mold are substantially equidistant from the axis of rotation during the entire rotation around the axis of rotation. The mold is adapted to limit the polymer mixture while the mold is rotating. The system further includes a dispenser adapted to introduce the polymer mixture into a mold.
視情況,該系統包括可沿著中心軸線插入之心軸,該心軸用於將固體插件安置於內部空間中之聚合物混合物之頂層的表面上。該固體插件為聚酯、紡織物、導電材料及/或頂部襯墊用於賦予聚合物混合物之表面以紋理。 Optionally, the system includes a mandrel that can be inserted along a central axis, the mandrel being used to place a solid insert on the surface of the top layer of the polymer mixture in the interior space. The solid insert is polyester, textile, conductive material, and / or a top pad to impart texture to the surface of the polymer mixture.
該系統包括用於將液體噴灑至模具之內部中的噴霧器。該液體為脫模劑、黏著劑,及/或導電層。 The system includes a sprayer for spraying liquid into the interior of the mold. The liquid is a release agent, an adhesive, and / or a conductive layer.
在一些實施例中,該系統包括加熱器用於在聚合物混合物之旋轉及反應之至少一部分時間期間加熱模具。 In some embodiments, the system includes a heater for heating the mold during at least a portion of the rotation and reaction of the polymer mixture.
100‧‧‧旋轉鑄造系統 100‧‧‧Rotary Casting System
102‧‧‧離心鑄造機 102‧‧‧centrifugal casting machine
104‧‧‧聚合物施配器 104‧‧‧Polymer Dispenser
106‧‧‧聚合物混合物 106‧‧‧ polymer blend
108‧‧‧澆注路徑 108‧‧‧Pouring path
110‧‧‧滾筒 110‧‧‧ roller
112‧‧‧軸線 112‧‧‧ axis
114‧‧‧旋轉方向 114‧‧‧Rotation direction
116‧‧‧聚合物薄片 116‧‧‧Polymer flakes
200‧‧‧軟聚合物層 200‧‧‧ soft polymer layer
202‧‧‧緻密聚合物層 202‧‧‧ dense polymer layer
300‧‧‧插件 300‧‧‧ plugin
400‧‧‧聚合物墊 400‧‧‧ polymer mat
402‧‧‧次墊 402‧‧‧mat
404‧‧‧硬墊 404‧‧‧ hard pad
500‧‧‧內部插件 500‧‧‧Internal plugin
600‧‧‧模具插件 600‧‧‧Mould Insert
700‧‧‧窗口 700‧‧‧ window
800‧‧‧多軸線鑄造系統 800‧‧‧Multi-Axis Casting System
802‧‧‧鑄造模具 802‧‧‧ foundry mold
804‧‧‧頂部模具零件 804‧‧‧Top mold parts
806‧‧‧底部模具零件 806‧‧‧Bottom mold parts
808‧‧‧聚合物混合物 808‧‧‧ polymer blend
810‧‧‧內部空間 810‧‧‧Internal space
812‧‧‧軸線 812‧‧‧ axis
814‧‧‧方向 814‧‧‧direction
816‧‧‧軸線 816‧‧‧ axis
818‧‧‧方向 818‧‧‧direction
900‧‧‧方法 900‧‧‧ Method
902‧‧‧操作 902‧‧‧ operation
904‧‧‧操作 904‧‧‧operation
906‧‧‧操作 906‧‧‧ Operation
908‧‧‧操作 908‧‧‧operation
910‧‧‧操作 910‧‧‧operation
1000‧‧‧方法 1000‧‧‧ Method
1002‧‧‧操作 1002‧‧‧ Operation
1004‧‧‧操作 1004‧‧‧ Operation
1006‧‧‧操作 1006‧‧‧ Operation
1008‧‧‧操作 1008‧‧‧ Operation
1010‧‧‧操作 1010‧‧‧ Operation
1012‧‧‧操作 1012‧‧‧ Operation
圖1為根據一例示性實施例說明離心鑄造系統的截面示意圖。 FIG. 1 is a schematic cross-sectional view illustrating a centrifugal casting system according to an exemplary embodiment.
圖2為根據一例示性實施例說明在例示性聚合物混合物已發生相分離且已形成兩個相異的層之後圖1中所示之離心鑄造機的截面示意圖。 FIG. 2 is a schematic cross-sectional view illustrating the centrifugal casting machine shown in FIG. 1 after the exemplary polymer mixture has undergone phase separation and two distinct layers have been formed, according to an exemplary embodiment.
圖3為根據一例示性實施例說明圖2中所示之例示性離心鑄造機的截面且展示例示性底部襯墊或插件及聚胺基甲酸酯鑄造的示意圖。 FIG. 3 is a schematic diagram illustrating a cross-section of the exemplary centrifugal casting machine shown in FIG. 2 and showing an exemplary bottom pad or insert and polyurethane casting according to an exemplary embodiment.
圖4為根據一例示性實施例說明例示性多層聚合物墊之截面的示意圖。 FIG. 4 is a schematic diagram illustrating a cross-section of an exemplary multilayer polymer pad according to an exemplary embodiment.
圖5為根據一例示性實施例說明例示性離心鑄造機之截面且展示頂部襯墊或插件及聚胺基甲酸酯鑄造的示意圖。 5 is a schematic diagram illustrating a cross-section of an exemplary centrifugal casting machine and showing a top liner or insert and polyurethane casting according to an exemplary embodiment.
圖6為根據一例示性實施例說明具有內襯於例示性離心鑄造機之例示性滾筒之內壁的例示性模具插件(底部襯墊/插件)之離心鑄造系統的截面示意圖。 6 is a schematic cross-sectional view illustrating a centrifugal casting system having an exemplary mold insert (bottom liner / insert) lined with an inner wall of an exemplary drum of an exemplary centrifugal casting machine, according to an exemplary embodiment.
圖7為根據一例示性實施例說明例示性滾筒之截面且展示例示性模具插件及窗口的示意圖。 FIG. 7 is a schematic diagram illustrating a cross section of an exemplary drum and showing an exemplary mold insert and a window according to an exemplary embodiment.
圖8為根據一例示性實施例說明包括例示性離心鑄造機之例示性旋轉鑄造系統的示意圖。 8 is a schematic diagram illustrating an exemplary rotary casting system including an exemplary centrifugal casting machine according to an exemplary embodiment.
圖9為根據一例示性實施例說明用於製備多層抛光墊之例示性方法的流程圖。 FIG. 9 is a flowchart illustrating an exemplary method for preparing a multilayer polishing pad according to an exemplary embodiment.
圖10為根據一例示性實施例說明用於製備多層抛光墊之替代性例示性方法的流程圖。 FIG. 10 is a flowchart illustrating an alternative exemplary method for preparing a multilayer polishing pad according to an exemplary embodiment.
雖然本發明可具有許多不同形式之實施例,但本發明於圖式中展示且本文中將詳細描述若干具體實施例,應瞭解本發明揭示內容應視為本發明原理的例證,且不欲使本發明限於所說明之實施例。根據例示性實施例,本發明技術大體上係關於抛光墊。更具體言之,本發明提供用於製備固體多層聚合物抛光墊之方法。 Although the present invention may have many different forms of embodiments, the present invention is shown in the drawings and several specific embodiments will be described in detail herein. It should be understood that the disclosure of the present invention should be regarded as an illustration of the principle of the present invention and is not intended The invention is limited to the illustrated embodiment. According to an exemplary embodiment, the present technology relates generally to polishing pads. More specifically, the present invention provides a method for preparing a solid multilayer polymer polishing pad.
半導體工業內之抛光稱作化學機械平坦化(CMP)。用於CMP之聚合物抛光墊通常使用閉孔聚胺基甲酸酯材料或發泡聚胺基甲酸酯,而用於CMP之一些抛光墊採用開孔聚胺基甲酸酯材料。另外,可利用浸漬一或多種聚合物與研磨劑之組合的纖維。該等墊之表面可含有微紋理。該微紋理係關係到該墊之抛光效能。微紋理由調節製程維持。此固有微結構中之不一致性導致該墊之抛光效能的偏差。出於此原因,墊製造商已努力優化墊製造製程以減小其產品之偏差。相比而言,固體聚合物抛光墊不含有固有微結構,而是在使用期間依賴於調節製程以賦予該墊表面以微紋理。就與習知調節製程的相容性而言,用於固 體聚合物墊之配方為關鍵的。 Polishing in the semiconductor industry is called chemical mechanical planarization (CMP). Polymer polishing pads for CMP typically use closed-cell polyurethane materials or foamed polyurethane materials, while some polishing pads for CMP use open-cell polyurethane materials. In addition, fibers impregnated with a combination of one or more polymers and abrasives can be utilized. The surfaces of these pads may contain microtexture. The microtexture is related to the polishing performance of the pad. The microtexture is maintained by the adjustment process. The inconsistencies in this inherent microstructure cause deviations in the polishing performance of the pad. For this reason, pad manufacturers have strived to optimize the pad manufacturing process to reduce variations in their products. In contrast, solid polymer polishing pads do not contain inherent microstructures, but rely on adjustment processes during use to impart microtexture to the pad surface. For compatibility with conventional adjustment processes, The formulation of the bulk polymer pad is critical.
聚合物墊通常包括單層固體聚合物材料或堆疊於彼此之上的多層固體聚合物材料。或者,可使用一些非固體層。該等層使用黏著劑彼此黏結。抛光之層稱作抛光層、頂部墊或墊表面。頂部墊材料自身通常基於聚胺基甲酸酯,但如前所述的寬泛範圍之其他抛光墊材料亦為可行的。可於聚合物抛光墊之抛光表面上提供流動通道。此等流動通道具有許多功能,但主要用於改良漿料流動以確保聚合物抛光墊之所有區域上均存在漿料。流動通道亦在抛光製程期間產生較高接觸壓力,該接觸壓力可增加基板之抛光或平坦化的速率。此外,可在抛光步驟已完成之後使用流動通道來促進墊沖洗。此等流動通道可視為於抛光墊上之巨型紋理。通常在使用聚合物抛光墊之前施加巨型紋理。 Polymer mats typically include a single layer of solid polymer material or multiple layers of solid polymer material stacked on top of each other. Alternatively, some non-solid layers may be used. The layers are bonded to each other using an adhesive. The polished layer is called a polishing layer, top pad, or pad surface. The top pad material itself is usually based on polyurethane, but a wide range of other polishing pad materials are also possible as previously described. Flow channels can be provided on the polishing surface of the polymer polishing pad. These flow channels have many functions, but are primarily used to improve slurry flow to ensure that slurry is present on all areas of the polymer polishing pad. The flow channel also generates a higher contact pressure during the polishing process, which can increase the rate of polishing or planarization of the substrate. In addition, flow channels can be used to facilitate pad flushing after the polishing step has been completed. These flow channels can be considered as giant textures on the polishing pad. Giant texture is usually applied before using a polymer polishing pad.
在抛光製程期間,或在基板抛光之間,於聚合物抛光墊之表面上形成微紋理。形成此微紋理之方法通常稱作調節。藉由以此高頻率調節墊表面,聚合物墊表面上維持一致的微紋理為可能的。此對於維持一致的抛光效能至關重要,此係因為微紋理為聚合物墊表面與基板之間的漿料形成微型流動通道。在抛光期間,前面提及之流動通道與微紋理形成共生關係以確保在抛光期間良好的流體動力學。 During the polishing process, or between substrate polishing, microtextures are formed on the surface of the polymer polishing pad. The method of forming this microtexture is often referred to as conditioning. By adjusting the pad surface at this high frequency, it is possible to maintain a consistent microtexture on the surface of the polymer pad. This is critical to maintaining consistent polishing performance because the microtexture forms micro-flow channels for the slurry between the surface of the polymer pad and the substrate. During polishing, the aforementioned flow channels form a symbiotic relationship with the microtexture to ensure good fluid dynamics during polishing.
通常使用金剛石調節器執行聚合物抛光墊之調節。更改金剛石尺寸、形狀、密度及突起程度以產生不同金剛石調節器能力。 Adjustment of a polymer polishing pad is usually performed using a diamond conditioner. Change diamond size, shape, density, and protrusion to produce different diamond regulator capabilities.
習知頂部墊閉孔材料製造製程採用以下製程中之一者:(1)熱塑性射出模製;(2)熱固性射出模製(通常稱作「反應射出模製」或「RIM」);(3)熱塑性或熱固性射出吹塑;(4)壓縮模製;及(5)其中安置且凝固材料之類似製程。該等方法描述為使用封閉式鑄造系統。 The conventional top pad closed-cell material manufacturing process uses one of the following processes: (1) thermoplastic injection molding; (2) thermoset injection molding (commonly known as "reactive injection molding" or "RIM"); (3) ) Thermoplastic or thermoset injection blow molding; (4) compression molding; and (5) a similar process in which the material is placed and solidified. These methods are described as using a closed casting system.
離心鑄造涉及將液體澆注至圍繞其對稱軸旋轉之圓筒形模具中。保持該模具旋轉直至材料已凝固。本發明技術提供用以製造聚合物抛光墊之離心鑄造機的使用。離心鑄造機描述為開放鑄造方法。 Centrifugal casting involves pouring liquid into a cylindrical mold that rotates about its axis of symmetry. Keep the mold rotating until the material has solidified. The technology of the present invention provides the use of a centrifugal casting machine for making polymer polishing pads. Centrifugal casting machines are described as open casting methods.
離心鑄造技術用於製造鐵管、套管、車輪,及具有軸對稱性之其他零件。在金屬之離心鑄造中,當澆注熔融金屬時,永久性模具以高速度圍繞其軸線旋轉(300至3000RPM)。熔融金屬經離心式拋向內部模具壁,在此其在冷卻後凝固。可使用此方法鑄造之典型金屬材料為鐵、鋼、不鏽鋼及鋁、銅及鎳之合金。 Centrifugal casting technology is used to manufacture iron pipes, sleeves, wheels, and other parts with axial symmetry. In centrifugal casting of metals, when molten metal is poured, the permanent mold rotates around its axis at a high speed (300 to 3000 RPM). The molten metal is centrifuged to the inner mold wall, where it solidifies after cooling. Typical metal materials that can be cast using this method are iron, steel, stainless steel, and alloys of aluminum, copper, and nickel.
離心鑄造亦可用於聚合物零件之製造。舉例而言,用於特殊應用之聚胺基甲酸酯同步帶使用離心鑄造生產。該等帶具有特殊塗層及增強以適合特定傳輸應用。該等帶經一體式模製,且使用離心鑄造方法及高效能聚胺基甲酸酯形成。帶具有埋置鋼、Kevlar®、聚酯、不鏽鋼或玻璃纖維增強。帶與線性驅動一起用於如封裝、分選及裝配機之應用中。 Centrifugal casting can also be used in the manufacture of polymer parts. For example, polyurethane timing belts for special applications are produced using centrifugal casting. These tapes are specially coated and reinforced to suit specific transmission applications. The bands are integrally molded and formed using a centrifugal casting method and a high-performance polyurethane. The belt is reinforced with embedded steel, Kevlar®, polyester, stainless steel or fiberglass. Tapes are used with linear drives in applications such as packaging, sorting, and assembly machines.
製造聚合物抛光墊所需之原材料的準備需要有效控制以確保輸入至混合物的原材料比率一致。原材料需要在混合之前各別地加熱。另外,原材料較佳經澈底混合以產生在混合物內之均勻分散。視使用中之混合技術而定,材料在混合時可發泡。可使混合物穿過系統以消除泡沫(但此製程不應與如下文所論述之將發泡體添加至聚合物混合物相混淆)。材料接著需要轉移至模具以用於反應。當混合物之適用期(亦即,直至聚合物凝固之時間)較短時,此製程可進一步複雜化。若超過適用期,則混合物接著將開始膠凝,且可能不再成形為所需之形狀。 The preparation of the raw materials required to make the polymer polishing pads needs to be effectively controlled to ensure a consistent ratio of raw materials input to the mixture. The raw materials need to be individually heated before mixing. In addition, the raw materials are preferably thoroughly mixed to produce a uniform dispersion within the mixture. Depending on the mixing technology in use, the material can foam when mixed. The mixture can be passed through the system to eliminate foam (but this process should not be confused with adding foam to the polymer mixture as discussed below). The material then needs to be transferred to a mold for reaction. This process can be further complicated when the pot life of the mixture (ie, the time until the polymer solidifies) is short. If the pot life is exceeded, the mixture will then begin to gel and may no longer be formed into the desired shape.
反應的聚合化合物在已與反應的引發劑混合之後保持適合於其預期用途期間之時段為「適用期」。膠凝點(或膠凝時間)係指液體開始展現偽彈性特性之階段。在聚胺基甲酸酯已膠凝(亦稱為已反應)之後,材料可充分凝固以自模具或離心機(若存在)移除,但仍保持其形狀。 The period of time during which the reacted polymeric compound, after having been mixed with the reacted initiator, remains suitable for its intended use is the "pot life". The gel point (or gel time) refers to the stage at which a liquid begins to exhibit pseudo-elastic properties. After the polyurethane has gelled (also known as reacted), the material can be sufficiently solidified to be removed from the mold or centrifuge (if present), but still retain its shape.
為了形成固體聚合物抛光墊,此製程具有防止在固體層中形成 孔隙之額外問題。當適用期較短時,此特別地困難。此通常意謂使用習知封閉式鑄造系統來製備此種固體聚合物抛光墊伴隨有許多限制,且在一些情況下不能使用此種封閉式鑄造系統。舉例而言,材料厚度通常需要比允許之抛光墊厚許多以便確保混合物可填充鑄件。此由於增加了廢料而增加了墊製造製程的經濟負擔。模製製程之產量可受到生產之密封窗口的影響,且產量之損失亦增加了墊製造製程的經濟負擔。由於用於生產之密封窗口,亦可見在材料中形成不一致性。 To form a solid polymer polishing pad, this process has the ability to prevent formation in the solid layer Additional problems with pores. This is particularly difficult when the pot life is short. This generally means that the use of conventional closed casting systems to prepare such solid polymer polishing pads comes with many limitations, and in some cases such closed casting systems cannot be used. For example, the material thickness often needs to be much thicker than the polishing pads allowed to ensure that the mixture can fill the casting. This increases the economic burden of the pad manufacturing process due to the increased waste. The output of the molding process can be affected by the sealed window of production, and the loss of output also increases the economic burden of the pad manufacturing process. Due to the sealed windows used in production, inconsistencies can also be seen in the material.
根據本發明技術,固體聚合物抛光墊使用離心鑄造生產。此製程涉及將聚合物混合物(其為液體)引入至大型旋轉滾筒中。離心力推動聚合物混合物抵靠著滾筒之內表面,且當聚合物混合物反應且變為固體時,獲得矩形固體聚合物帶。當將聚合物混合物引入至離心鑄造機之旋轉滾筒中時,聚合物混合物材料成扇形射出且黏附至滾筒之壁。當聚合物混合物已反應且凝固時,在大部分材料截面上實質上不存在孔隙。存在之任何孔隙將被隔離至與滾筒之內壁相對置或相距最遠的薄片表面,且因此容易在形成、準備及/或調節期間消除。 In accordance with the technology of the present invention, solid polymer polishing pads are produced using centrifugal casting. This process involves introducing a polymer mixture, which is a liquid, into a large rotating drum. The centrifugal force pushes the polymer mixture against the inner surface of the drum, and when the polymer mixture reacts and becomes solid, a rectangular solid polymer band is obtained. When the polymer mixture is introduced into the rotating drum of a centrifugal casting machine, the polymer mixture material is ejected in a fan shape and adheres to the wall of the drum. When the polymer mixture has reacted and solidified, voids are essentially absent in most material cross sections. Any pores present will be isolated to the surface of the sheet opposite or farthest from the inner wall of the drum, and will therefore be easily eliminated during formation, preparation and / or conditioning.
製備固體聚合物薄片之離心鑄造能夠製造不含空隙之抛光墊。另外,可調節該製程以確保材料之總厚度偏差(TTV)將為極小的。可視所需之墊特徵及所使用之聚合物混合物類型而更改用於製備抛光墊之離心鑄造機的溫度及速度(轉/分鐘,或RPM)。 Centrifugal casting of solid polymer flakes can produce polishing pads that do not contain voids. In addition, the process can be adjusted to ensure that the total thickness deviation (TTV) of the material will be minimal. The temperature and speed (revolutions per minute, or RPM) of the centrifugal casting machine used to prepare the polishing pad can be changed depending on the characteristics of the pad required and the type of polymer mixture used.
本文中所提供之離心鑄造系統及方法允許形成具有低TTV之固體聚合物薄片。聚合物(例如聚胺基甲酸酯)薄片可容易地轉化成不存在空隙或孔隙之固體聚合物抛光墊。 The centrifugal casting systems and methods provided herein allow the formation of solid polymer flakes with low TTV. Polymer (e.g. polyurethane) flakes can be easily converted into solid polymer polishing pads without voids or pores.
本文中所提供之離心鑄造方法確保使用相分離在離心鑄造系統中形成具有固體層及多孔層(具有經緻密裝填之微球體)之多層抛光墊。當混合物含有填充劑、研磨劑及/或纖維時,可誘發相分離。微球體通常為塑膠且尺寸不同,可膨脹或不可膨脹,具有圍封之氣體或 發泡劑,及/或為實心或中空的。 The centrifugal casting method provided herein ensures the use of phase separation to form a multilayer polishing pad with a solid layer and a porous layer (with densely packed microspheres) in a centrifugal casting system. Phase separation can be induced when the mixture contains fillers, abrasives and / or fibers. Microspheres are usually plastic and of different sizes, are expandable or non-expandable, have enclosed gas or Blowing agents, and / or are solid or hollow.
本發明技術能夠藉由在各層之間添加黏著劑(例如,壓敏性黏著劑)形成具有不同聚合物配方的多層抛光墊。此外,可使用本發明技術在聚合物薄片中誘發預定或所需之各向異性鏈結構。 The technology of the present invention can form a multilayer polishing pad with different polymer formulations by adding an adhesive (eg, a pressure-sensitive adhesive) between the layers. In addition, the technique of the present invention can be used to induce a predetermined or desired anisotropic chain structure in a polymer sheet.
抛光墊(或次墊)之多孔層有利於抛光,此係由於來自經緻密裝填之孔隙的材料壓縮性。另外,閉孔孔隙結構防止製程流體芯吸至次墊中,此可影響抛光效能。 The porous layer of the polishing pad (or sub-pad) facilitates polishing due to the compressibility of the material from the densely packed pores. In addition, the closed-cell pore structure prevents the process fluid from wicking into the secondary pad, which can affect the polishing performance.
鑄造機之內表面為光滑的,或替代地使用紋理對抛光墊之工作表面添加凹槽或通道,及/或以改良用於抛光墊構造中之黏著劑的效能。可在鑄造製程期間或之後對抛光墊添加凹槽,且可於對置鑄造機之壁形成的表面上形成凹槽。凹槽在CMP操作期間之抛光墊使用期間可用於促進漿料之流動。在例示性實施例中,形成具有多個層之墊,接著經由開槽製程於凹槽區域中顯露此等層中之一些或所有。舉例而言,凹槽在凹槽底部處顯露不同結構,該凹槽底部不同於凹槽側面及頂層。在一些情形中,在凹槽之底部處的新曝露之層可能較硬、較軟,及/或具有孔隙以促進漿料流動。利用不同之凹槽截面形狀、凹槽中曝露之不同材料層,及/或不同之凹槽幾何形狀(例如,螺旋形或x-y圖案)以影響漿料之流動及/或以更改抛光墊之移除速率。 The inner surface of the casting machine is smooth, or alternatively, textures are used to add grooves or channels to the working surface of the polishing pad, and / or to improve the effectiveness of the adhesive used in the construction of the polishing pad. Grooves can be added to the polishing pad during or after the casting process, and grooves can be formed on the surface formed by the wall of the opposing casting machine. The grooves can be used to promote slurry flow during use of the polishing pad during the CMP operation. In an exemplary embodiment, a pad having a plurality of layers is formed, and then some or all of these layers are exposed in a groove region through a slotting process. For example, the groove reveals different structures at the bottom of the groove, and the bottom of the groove is different from the side and top of the groove. In some cases, the newly exposed layer at the bottom of the groove may be harder, softer, and / or have porosity to facilitate slurry flow. Utilize different groove cross-sectional shapes, different material layers exposed in the grooves, and / or different groove geometries (e.g., spiral or xy patterns) to affect the flow of the slurry and / or to change the polishing pad movement Divide the rate.
離心鑄造期間之加熱由圍繞或鄰近於鑄造滾筒之加熱元件執行,該等加熱元件加熱滾筒及/或滾筒中之空氣。通常,在引入聚合物混合物之前預加熱滾筒。亦可在鑄造操作期間實施額外製程以改良產品效能。 Heating during centrifugal casting is performed by heating elements surrounding or adjacent to the casting drum, which heating elements heat the drum and / or the air in the drum. Generally, the drum is preheated before the polymer mixture is introduced. Additional processes can also be implemented during the casting operation to improve product performance.
墊材料中微紋理的存在增強抛光墊之抛光效能。此微紋理應在墊材料內為一致的以防止不一致的抛光效能。固體墊依賴於在鑄造或調節期間引入之微紋理。若墊材料中存在孔隙,則此產生增加水準之抛光速率。在一些情形中,此增加水準之抛光速率為不可持續的,此 係因為孔隙並非始終如一地存在於層中。出於此原因,固體抛光墊含有很少或不含有孔隙至關重要。努力製造不具有孔隙之固體聚合物墊在很大程度上為無效的。相比之下,離心鑄造機之使用克服了關於聚合物混合物之問題,同時確保聚合物薄片無空隙,即使在短適用期聚合物混合物的情況下亦如此。離心鑄造機減少或消除聚合物薄片中之孔隙或空隙,此係因為離心力驅使聚合物混合物材料至鑄造機之內壁,而任何孔隙或空隙轉移至對置之表面,此係因為孔隙或空隙比聚合物混合物輕。 The presence of microtexture in the pad material enhances the polishing performance of the polishing pad. This microtexture should be consistent within the pad material to prevent inconsistent polishing performance. Solid mats rely on micro-textures introduced during casting or conditioning. If voids are present in the pad material, this results in an increased level of polishing rate. In some cases, this increased level of polishing rate is unsustainable. This is because the pores do not always exist in the layer. For this reason, it is important that solid polishing pads contain little or no voids. Efforts to make solid polymer mats without voids are largely ineffective. In contrast, the use of centrifugal casting machines overcomes the problems with polymer mixtures while ensuring that polymer flakes are void-free, even in the case of short-life polymer mixtures. Centrifugal casting machines reduce or eliminate pores or voids in polymer flakes because the centrifugal force drives the polymer mixture material to the inner wall of the casting machine, and any pores or voids are transferred to the opposite surface because of the pore or void ratio The polymer mixture is light.
在鑄造期間,氣泡及/或孔隙在聚合物硬化期間轉移至表面,且可在硬化之後保留於表面上。此等氣泡及/或孔隙可藉由帶之內部表面來移除,內部表面用作抛光墊之工作表面。此薄化通常需要移除1/1000吋至4/1000吋,或替代地多達15/1000吋。 During casting, bubbles and / or pores are transferred to the surface during polymer hardening and may remain on the surface after hardening. These bubbles and / or pores can be removed by the inner surface of the belt, which is used as the working surface of the polishing pad. This thinning typically requires removal of 1/1000 inch to 4/1000 inch, or alternatively up to 15/1000 inch.
固體聚合物薄片之離心鑄造提供出人意料之益處:產生格外平坦之聚合物薄片。極度平坦度降低了薄化之要求,且因此避免原料之損失以及薄化之時間及費用。另外,該技術減少或消除聚合物鑄造件中之孔隙,此係因為聚合物混合物因離心力轉移至滾筒表面,而孔隙並不轉移且因此被壓出聚合物混合物。實質上不存在孔隙自最初使用至最終使用提供一致的抛光墊(亦稱作CMP墊,但本發明涵蓋替代性抛光應用)。通常,抛光墊為80/1000吋厚或更薄,且當使用該墊時,歸因於調節製程及在使用期間之磨損,其變得更薄。 Centrifugal casting of solid polymer flakes offers unexpected benefits: producing exceptionally flat polymer flakes. Extreme flatness reduces the requirements for thinning, and therefore avoids loss of raw materials and time and expense of thinning. In addition, this technology reduces or eliminates pores in polymer castings because the polymer mixture is transferred to the surface of the drum due to centrifugal force, while the pores are not transferred and are therefore pressed out of the polymer mixture. The absence of pores substantially provides consistent polishing pads from initial use to end use (also known as CMP pads, but the present invention covers alternative polishing applications). Generally, polishing pads are 80/1000 inches thick or thinner, and when used, they become thinner due to the conditioning process and wear during use.
由離心鑄造形成之聚合物抛光墊實質上或完全不含孔隙或空隙,且實質上厚度均一。聚合物薄片使用短適用期混合物形成,同時亦實質上或完全不含孔隙。因此,利用本發明技術達成高製造產量。 The polymer polishing pad formed by centrifugal casting is substantially or completely free of pores or voids, and is substantially uniform in thickness. The polymer flakes are formed using a short-life mixture, while also being substantially or completely free of pores. Therefore, a high manufacturing yield is achieved using the technology of the present invention.
習知CMP墊製造可包括形成經切片之固體聚合物餅或錠,此需要自頂部至底部實質上均一,該要求為困難的。相比而言,在根據本發明技術之使用離心鑄造的例示性方法中,產生之固體聚合物極其平 坦且僅比墊之最終厚度厚出最小厚度。產生之極大型帶可用於藉由任何合適之方法進行切割或衝壓製備許多頂部墊(或次墊),由此實現高產量及極一致之產品以及實質上不存在之孔隙度。 Conventional CMP pad manufacturing can include forming a sliced solid polymer cake or ingot, which requires substantial uniformity from top to bottom, which is difficult. In contrast, in the exemplary method using centrifugal casting according to the technology of the present invention, the solid polymer produced is extremely flat It is only thicker than the final thickness of the pad. The resulting very large bands can be used to make many top pads (or sub-pads) by cutting or stamping by any suitable method, thereby achieving high yields and a very consistent product with substantially non-existent porosity.
利用本文中所揭示之例示性方法藉由依序鑄造及膠凝兩種或兩種以上不同聚合物混合物來形成兩個或兩個以上分離且相異之層。此實施例在封閉式鑄造系統中為不可行的。 Using the exemplary methods disclosed herein, two or more separate and distinct layers are formed by sequentially casting and gelling a mixture of two or more different polymers. This embodiment is not feasible in a closed casting system.
可使用本發明技術藉由將纖維網狀物置放於部分反應之初始聚合物薄片上且隨後於該網狀物之頂部上形成額外層來形成增強墊。最佳化離心鑄造設置以及聚合物混合物配方允許形成各向異性聚合物薄片。當使用固體聚合物抛光墊時,此提供較一致之鏈結構定向的益處。此可使用墊調節器實現較一致之微紋理形成。此較規則之結構可輔助聚合物薄片之傳輸特性。 The technique of the present invention can be used to form a reinforcing mat by placing a fibrous web on a partially reacted initial polymer sheet and then forming an additional layer on top of the web. Optimized centrifugal casting settings and polymer blend formulations allow the formation of anisotropic polymer flakes. This provides the benefit of more consistent chain structure orientation when using a solid polymer polishing pad. This allows for more consistent microtexture formation using a pad conditioner. This more regular structure assists the transmission characteristics of the polymer sheet.
本發明技術之例示性變化形式藉由使得滾筒內部稍微粗糙而利用黏著劑(壓敏性黏著劑或熱熔性黏著劑)與聚合物墊之間的經改良之黏著力。不良黏著力會導致在抛光期間墊分層。此將導致對抛光機之損害,經抛光之基板廢棄及抛光機之大量停工時間,此將影響效率。 An exemplary variation of the technology of the present invention utilizes an improved adhesion between an adhesive (pressure-sensitive adhesive or hot-melt adhesive) and a polymer pad by making the inside of the drum slightly rough. Poor adhesion can lead to delamination of the pad during polishing. This will result in damage to the polishing machine, discarded polished substrates and substantial downtime of the polishing machine, which will affect efficiency.
圖1為說明包括離心鑄造機102及聚合物施配器104之旋轉鑄造系統100之示意圖。聚合物施配器104含有聚合物混合物106。聚合物施配器104包括混合裝置,且包括護套,具備或不具備具有用於經加熱之流體流過之導管之加熱元件,及/或電加熱元件。聚合物混合物106為將僅在離心力作用下相分離成多個層且在環境非加壓條件下將不發生相分離之聚合物混合物。聚合物混合物106可為其中添加有微球體以改變混合物之密度的一種聚胺基甲酸酯混合物。或者,聚合物混合物106含有一種以上聚合物,且包括藉由在聚合物混合物之間添加發泡體而在離心鑄造機102內產生之聚合物複合物。術語發泡體在抛光墊之背景下意謂聚胺基甲酸酯(亦稱作PU)墊,其具有閉孔或開孔結 構。泡孔可為由PU圍繞之微球體、由PU圍繞之空隙或穿過PU之開放空隙。多孔墊材料稱作發泡墊。不同於藉由添加微球體來製得發泡體產品之兩種方法為:1)將發泡劑添加至聚胺基甲酸酯混合物,及2)將氣體(例如,N2或CO2)引入至混合物中。 FIG. 1 is a schematic diagram illustrating a rotary casting system 100 including a centrifugal casting machine 102 and a polymer dispenser 104. The polymer dispenser 104 contains a polymer mixture 106. The polymer dispenser 104 includes a mixing device and includes a sheath, with or without a heating element having a conduit for a heated fluid to flow through, and / or an electric heating element. The polymer mixture 106 is a polymer mixture that is phase-separated into multiple layers only under the action of centrifugal force and will not undergo phase separation under ambient non-pressurized conditions. The polymer mixture 106 may be a polyurethane mixture to which microspheres are added to change the density of the mixture. Alternatively, the polymer mixture 106 contains more than one polymer and includes a polymer composite produced in the centrifugal casting machine 102 by adding a foam between the polymer mixtures. The term foam in the context of a polishing pad means a polyurethane (also known as PU) pad, which has a closed-cell or open-cell structure. Cells can be microspheres surrounded by PU, voids surrounded by PU, or open voids passing through the PU. The porous pad material is called a foam pad. Two methods that differ from foam products by adding microspheres are: 1) adding a foaming agent to the polyurethane mixture, and 2) adding a gas (eg, N 2 or CO 2 ) Into the mixture.
聚合物混合物106自聚合物施配器104流出至澆注路徑108中,該澆注路徑在滾筒110圍繞軸線112在旋轉方向114上旋轉時將聚合物混合物106導向至離心鑄造機102之滾筒110中。聚合物混合物106因離心力而展開以於滾筒110之內部表面上形成聚合物薄片116。在滾筒110之情形下,聚合物薄片116為圓筒形。滾筒110旋轉且其直徑使得滾筒110無論以何種旋轉速度轉動,聚合物混合物106在引入至滾筒110中之後所經受之離心力足以產生均一厚度之聚合物薄片116,且另外引起相分離。相分離在離心力下發生,且引起聚合物混合物106分離成至少兩個聚合物層,及/或純聚合物層以及灌注有微球體之聚合物層。 The polymer mixture 106 flows from the polymer dispenser 104 into a pouring path 108 that directs the polymer mixture 106 into the drum 110 of the centrifugal casting machine 102 as the drum 110 rotates about the axis 112 in the direction of rotation 114. The polymer mixture 106 is expanded by centrifugal force to form a polymer sheet 116 on the inner surface of the drum 110. In the case of the drum 110, the polymer sheet 116 is cylindrical. The drum 110 rotates and has a diameter such that whatever the rotational speed of the drum 110, the centrifugal force experienced by the polymer mixture 106 after being introduced into the drum 110 is sufficient to produce a polymer sheet 116 of uniform thickness and additionally cause phase separation. Phase separation occurs under centrifugal force and causes the polymer mixture 106 to separate into at least two polymer layers, and / or a pure polymer layer and a polymer layer impregnated with microspheres.
在一些實施例中,加熱滾筒110。滾筒110可具有光滑的內部滾筒面,或替代地滾筒110具有經紋理化之滾筒面,該經紋理化之滾筒面改良抛光墊中所用之黏著劑的效能,為根據該方法製得之抛光墊的表面提供凹槽,及/或促進分離及/或自藉由該方法形成的經反應且經鑄造之聚合物薄片形成抛光墊。 In some embodiments, the drum 110 is heated. The drum 110 may have a smooth inner drum surface, or alternatively, the drum 110 may have a textured drum surface that improves the effectiveness of the adhesive used in the polishing pad, and is a polishing pad made according to the method. The surface provides grooves and / or promotes separation and / or forms a polishing pad from the reacted and cast polymer flakes formed by this method.
圖2為說明離心鑄造機102在聚合物混合物106已發生相分離且已形成兩個相異層之後的示意圖。在滾筒110中經受離心力之後,聚合物混合物106相分離成兩個相異層:軟聚合物層200及緻密聚合物層202。在相分離期間,離心力促使聚合物朝向聚合物薄片116之一側,且引起微球體上升至聚合物薄片116之表面,此係因為其沒有聚合物緻密。此相分離產生較緻密層及多孔層。緻密聚合物層202為較緻密層,且形成抛光墊之硬墊。緻密聚合物層202為固體聚胺基甲酸酯 層。軟聚合物層200為填充有經緻密裝填之微球體的多孔層,且形成抛光墊之次墊。緻密聚合物層202為與滾筒110之內部介接之內層。 FIG. 2 is a schematic diagram illustrating the centrifugal casting machine 102 after the polymer mixture 106 has undergone phase separation and two distinct layers have been formed. After being subjected to centrifugal force in the drum 110, the polymer mixture 106 is phase separated into two distinct layers: a soft polymer layer 200 and a dense polymer layer 202. During phase separation, the centrifugal force forces the polymer toward one side of the polymer sheet 116 and causes the microspheres to rise to the surface of the polymer sheet 116 because it is not as dense as the polymer. This phase separation produces a denser and porous layer. The dense polymer layer 202 is a denser layer and forms a hard pad of a polishing pad. The dense polymer layer 202 is a solid polyurethane Floor. The soft polymer layer 200 is a porous layer filled with densely packed microspheres, and forms a secondary pad of a polishing pad. The dense polymer layer 202 is an inner layer that interfaces with the inside of the drum 110.
聚合物薄片116可在形成聚合物墊的輪廓之前或之後薄化以於聚合物薄片116之表面上形成凹槽圖案。類似地,調節聚合物薄片116之表面以於聚合物墊上形成刮痕圖案。 The polymer sheet 116 may be thinned before or after forming the outline of the polymer pad to form a groove pattern on the surface of the polymer sheet 116. Similarly, the surface of the polymer sheet 116 is adjusted to form a scratch pattern on the polymer pad.
在一實施例中,在聚合物薄片116之緻密聚合物層202及軟聚合物層200已形成之後,於聚合物薄片116之頂部上鑄造相同或不同的聚合物或另一材料之第三層以便製備三層(或三層以上)聚合物墊。必要時如所描述藉由添加相同或不同之聚合物層形成後續層。 In one embodiment, after the dense polymer layer 202 and the soft polymer layer 200 of the polymer sheet 116 have been formed, a third layer of the same or different polymer or another material is cast on top of the polymer sheet 116 In order to prepare three (or more) polymer mats. If necessary, subsequent layers are formed by adding the same or different polymer layers as described.
圖3為說明離心鑄造機102之截面且展示插件300及具有緻密聚合物層202及軟聚合物層200的聚合物薄片116之示意圖。滾筒110圍繞軸線112在旋轉方向114上旋轉。插件300內襯於滾筒110之內壁。在一實施例中,插件300為脫模劑,其為離心鑄造機102中之永久性塗層(例如,Teflon®)、半永久性塗層(例如,Teflon®噴霧)或暫時性塗層,其有助於固體聚合物在鑄造之後脫模。詳言之,在一些情況下,在鑄造一定次數(例如,鑄造20次)之後,在滾筒110之內部表面噴灑Teflon®塗層。或者,插件300為由高密度聚乙烯(HDPE)、熱塑性塑膠、聚四氟乙烯(PTFE)或聚矽氧製得之脫模薄片。在某些情況下,插件300替換不頻繁,(例如)每幾個月一次。 FIG. 3 is a schematic diagram illustrating a cross section of the centrifugal casting machine 102 and showing the insert 300 and the polymer sheet 116 having the dense polymer layer 202 and the soft polymer layer 200. The drum 110 rotates in the rotation direction 114 about the axis 112. The insert 300 is lined on the inner wall of the drum 110. In one embodiment, the insert 300 is a release agent, which is a permanent coating (e.g., Teflon®), a semi-permanent coating (e.g., Teflon® spray), or a temporary coating in the centrifugal casting machine 102, which Helps release the solid polymer after casting. In detail, in some cases, the Teflon® coating is sprayed on the inner surface of the drum 110 after a certain number of castings (for example, 20 castings). Alternatively, the insert 300 is a release sheet made of high-density polyethylene (HDPE), thermoplastic plastic, polytetrafluoroethylene (PTFE), or polysiloxane. In some cases, the plug-in 300 is replaced infrequently, for example, every few months.
在另一實施例中,插件300經開槽以於聚合物薄片116之表面上形成凹槽圖案,該等圖案形成於緻密聚合物層202上。在其他實施例中,出於形成不同類型之抛光墊之目的,插件300具有通道。 In another embodiment, the insert 300 is slotted to form groove patterns on the surface of the polymer sheet 116, and the patterns are formed on the dense polymer layer 202. In other embodiments, the insert 300 has channels for the purpose of forming different types of polishing pads.
圖4為說明聚合物墊400之截面的示意圖。在緻密聚合物層202及軟聚合物層200已形成之後,停止滾筒110,且自滾筒110移除含有兩個層之聚合物薄片116。移除聚合物薄片116包括沿著平行於軸線112之線切割聚合物薄片116,使得聚合物薄片116自圓筒形帶形變成矩 形。或者,可在離心鑄造機外部執行切割製程。自聚合物薄片116切割出或衝壓出聚合物墊400。經移除之聚合物墊400包括次墊402及硬墊404。硬墊404自緻密聚合物層202形成,而次墊402自軟聚合物層200形成。硬墊404及次墊402二者均可用於抛光。儘管固體側(硬墊404)習知用於抛光,但歸因於微球體之緻密裝填,可使用多孔側(次墊402,但對於此用途,其將不為次墊)且提供均一抛光。次墊402具有裝填極緊密之孔隙,從而允許較大壓縮性,且亦防止芯吸。在形成聚合物墊之輪廓之前或之後,薄化聚合物薄片116之表面以在兩個層上產生較均一之厚度及/或移除表面不完美性。另外,在形成輪廓及/或薄化之前或之後,可於此總成中之任一側上添加次墊。 FIG. 4 is a schematic diagram illustrating a cross section of a polymer pad 400. After the dense polymer layer 202 and the soft polymer layer 200 have been formed, the drum 110 is stopped, and the polymer sheet 116 containing the two layers is removed from the drum 110. Removing the polymer sheet 116 includes cutting the polymer sheet 116 along a line parallel to the axis 112 such that the polymer sheet 116 is deformed from a cylindrical band into a moment. shape. Alternatively, the cutting process can be performed outside the centrifugal casting machine. The polymer pad 400 is cut or punched from the polymer sheet 116. The removed polymer pad 400 includes a secondary pad 402 and a hard pad 404. The hard pad 404 is formed from the dense polymer layer 202, and the secondary pad 402 is formed from the soft polymer layer 200. Both the hard pad 404 and the secondary pad 402 can be used for polishing. Although the solid side (hard pad 404) is conventionally used for polishing, due to the dense packing of the microspheres, the porous side (secondary pad 402, but for this purpose, it will not be the second pad) and provide uniform polishing. The secondary pad 402 has extremely tightly packed pores, allowing greater compressibility and also preventing wicking. Before or after forming the outline of the polymer pad, the surface of the polymer sheet 116 is thinned to create a more uniform thickness on both layers and / or remove surface imperfections. In addition, sub-pads can be added on either side of the assembly before or after contouring and / or thinning.
圖5為說明離心鑄造機102之截面且展示內部插件500及具有緻密聚合物層202及軟聚合物層200之聚合物薄片116的示意圖。內部插件500由HDPE、熱塑性塑膠、PTFE或聚矽氧製得之薄片,且具有類似於插件300之凹槽圖案。內部插件500抵靠著聚合物薄片116安置,且用手或藉由使用心軸置放於滾筒110內。使用心軸,將內部插件500纏繞在心軸周圍以便易於置放在滾筒110中。詳言之,將滾筒110減緩至較低之RPM,同時將以與滾筒110相同之RPM旋轉之帶有內部插件500的心軸沿著軸線112插入至滾筒110之中央。滾筒110之RPM增加回初始旋轉速度,由此產生足夠強之離心力,將內部插件500自心軸引向聚合物薄片116。 FIG. 5 is a schematic diagram illustrating a cross section of the centrifugal casting machine 102 and showing an internal insert 500 and a polymer sheet 116 having a dense polymer layer 202 and a soft polymer layer 200. The internal insert 500 is a sheet made of HDPE, thermoplastic, PTFE, or silicone, and has a groove pattern similar to that of the insert 300. The internal insert 500 is placed against the polymer sheet 116 and is placed inside the drum 110 by hand or by using a mandrel. Using a mandrel, the internal insert 500 is wound around the mandrel for easy placement in the drum 110. In detail, the drum 110 is slowed to a lower RPM, and a mandrel with an internal insert 500 rotating at the same RPM as the drum 110 is inserted into the center of the drum 110 along the axis 112. The RPM of the drum 110 is increased back to the initial rotation speed, thereby generating a sufficiently strong centrifugal force to guide the internal insert 500 from the mandrel to the polymer sheet 116.
圖6為說明具有內襯於離心鑄造機102之滾筒110的內壁之模具插件600之旋轉鑄造系統100的示意圖。模具插件600可為由Teflon®、HDPE、熱塑性塑膠、PTFE或聚矽氧製得之內襯於滾筒110之內壁的薄片。模具插件600具有至少一個抛光墊模具,其中模具之數目視滾筒110之尺寸及抛光墊之尺寸而定。模具插件600之模具可為單一模具或複數個模具,該或該等模具為固定的或可移除的,且距軸線112具 有固定或可變之距離以改變在鑄造製程期間聚合物所經受之離心力的量。模具插件600之該或該等模具形成CMP墊之輪廓,且具有如上文關於滾筒110、插件300及/或內部插件500所論述的經紋理化之表面。在一些實施例中,模具插件600在內襯於滾筒110之薄片上具有4個模具,因此可能在一次鑄造中產生4個抛光墊。在此實施例中,聚合物混合物106個別地澆注於各模具中,由此無需自聚合物薄片切割或衝壓出抛光墊。經由此實施例方法,可減少廢料。 FIG. 6 is a schematic diagram illustrating a rotary casting system 100 having a mold insert 600 lined with an inner wall of a drum 110 of a centrifugal casting machine 102. The mold insert 600 may be a sheet made of Teflon®, HDPE, thermoplastic, PTFE, or silicone and lined with the inner wall of the drum 110. The mold insert 600 has at least one polishing pad mold, where the number of molds depends on the size of the drum 110 and the size of the polishing pad. The mold of the mold insert 600 may be a single mold or a plurality of molds, and the molds may be fixed or removable. There is a fixed or variable distance to change the amount of centrifugal force experienced by the polymer during the casting process. The one or more molds of the mold insert 600 form the outline of the CMP pad and have a textured surface as discussed above with respect to the drum 110, the insert 300, and / or the internal insert 500. In some embodiments, the mold insert 600 has four molds on a sheet lined with the drum 110, so it is possible to produce four polishing pads in one casting. In this embodiment, the polymer mixture 106 is individually poured into each mold, thereby eliminating the need to cut or stamp a polishing pad from a polymer sheet. By the method of this embodiment, waste can be reduced.
圖7為說明滾筒110之截面且展示模具插件600及窗口700的示意圖。窗口700為實現光學端點技術之實施的透明材料(例如,胺基甲酸酯)。窗口700在聚合物混合物通入至個別模具中之前置放於模具插件600之模具中。聚合物混合物圍繞窗口700之各側。當自模具移除抛光墊時,窗口700可併入至抛光墊中作為窗口,或可與抛光墊分離以為待插入至抛光墊中之窗口留下空間。 FIG. 7 is a schematic diagram illustrating a cross section of the drum 110 and showing a mold insert 600 and a window 700. The window 700 is a transparent material (eg, a urethane) that enables the implementation of optical endpoint technology. The window 700 is placed in the mold of the mold insert 600 before the polymer mixture is passed into the individual mold. The polymer mixture surrounds each side of the window 700. When the polishing pad is removed from the mold, the window 700 may be incorporated into the polishing pad as a window, or may be separated from the polishing pad to leave space for a window to be inserted into the polishing pad.
圖8為說明包括鑄造模具802之多軸線旋轉鑄造系統800的示意圖。鑄造模具802包括兩個模具部分:頂部模具零件804及底部模具零件806。本文中使用頂部及底部僅出於參考之目的,且不限制例示性實施例。因此,頂部模具零件804可安置於底部區域中,且底部模具零件806可安置於頂部區域中。聚合物混合物808在分離時施配至頂部模具零件804與底部模具零件806中之一或兩者中,且接著頂部模具零件804與底部模具零件806如圖8中所示接合。鑄造模具802之內部空間810可包括氣隙,或替代地經聚合物混合物808完全填充。在鑄造之前將頂部模具零件804與底部模具零件806密封在一起以形成鑄造模具802。鑄造模具802圍繞軸線812在方向814上旋轉且圍繞軸線816在方向818上旋轉。軸線812經展示平分鑄造模具802,但替代地偏移。同樣,軸線816經展示與鑄造模具802偏移,但替代地平分鑄造模具802。一或兩個旋轉最初以較慢之速率進行以便促進鑄造模具802之內 部表面的覆蓋。在其他替代方案中,另外地或替代地使用在一或多個方向上之振動以促進模具表面之潤濕。一或兩個旋轉具有較高旋轉速度以便促進微球體朝向內表面移動及/或促進鑄造模具802之內部表面上的平坦度。鑄造模具形成圓筒形形狀或任何其他合適之形狀。可加熱鑄造模具802,且其具有光滑之內部滾筒面,或替代地具有經紋理化之滾筒面,該經紋理化之滾筒面改良用於抛光墊中之黏著劑的效能,為根據該方法製得之抛光墊的表面提供凹槽,及/或促進分離及/或自由該方法形成之經反應且經鑄造之聚合物薄片形成抛光墊。 FIG. 8 is a schematic diagram illustrating a multi-axis rotary casting system 800 including a casting mold 802. The casting mold 802 includes two mold parts: a top mold part 804 and a bottom mold part 806. The top and bottom are used herein for reference purposes only and do not limit the exemplary embodiments. Accordingly, the top mold part 804 may be disposed in the bottom region, and the bottom mold part 806 may be disposed in the top region. The polymer mixture 808 is dispensed into one or both of the top mold part 804 and the bottom mold part 806 upon separation, and then the top mold part 804 and the bottom mold part 806 are joined as shown in FIG. 8. The internal space 810 of the casting mold 802 may include an air gap, or alternatively be completely filled with the polymer mixture 808. The top mold part 804 and the bottom mold part 806 are sealed together to form a casting mold 802 before casting. The casting mold 802 rotates in the direction 814 about the axis 812 and rotates in the direction 818 about the axis 816. The axis 812 is shown bisecting the casting mold 802, but is offset instead. Likewise, the axis 816 is shown offset from the casting mold 802, but instead bisects the casting mold 802. One or two rotations are initially performed at a slower rate to facilitate the casting within the mold 802 The surface of the outer part. In other alternatives, vibrations in one or more directions are additionally or alternatively used to promote wetting of the mold surface. One or two rotations have a higher rotation speed in order to promote the movement of the microspheres towards the inner surface and / or to promote flatness on the inner surface of the casting mold 802. The casting mold is formed into a cylindrical shape or any other suitable shape. The casting mold 802 can be heated and has a smooth inner roller surface, or alternatively a textured roller surface, which improves the effectiveness of the adhesive used in the polishing pad, and is manufactured according to this method The resulting polishing pad provides grooves on the surface and / or promotes separation and / or freedom from the reacted and cast polymer flakes formed by the method to form a polishing pad.
圖9為展示根據本發明技術使用聚胺基甲酸酯之方法900的處理流程圖。然而,如本文中所論述,該方法亦適用於其他聚合物。如圖9中所示,方法900在操作902開始,該操作指示將微球體混合至聚胺基甲酸酯混合物中以形成雜合混合物。流程自操作902進行至操作904,該操作指示將雜合混合物施配至圓筒之內部空間中。流程自操作904進行至操作906,該操作指示使圓筒圍繞中心軸線旋轉,該圓筒在內部空間中圍封雜合混合物直至混合物相分離成兩個相異之層。流程自操作906進行至操作908,該操作指示在旋轉操作之至少一部分時間期間將圓筒加熱至140至212華氏度之間的溫度。流程自操作908進行至操作910,該操作指示自在雜合混合物已分離成兩個層且已反應之後形成的聚胺基甲酸酯薄片形成抛光墊。處理流程在操作910之後結束。 FIG. 9 is a process flow diagram showing a method 900 using a polyurethane according to the technology of the present invention. However, as discussed herein, this method is also applicable to other polymers. As shown in FIG. 9, method 900 begins at operation 902, which instructs mixing the microspheres into a polyurethane mixture to form a hybrid mixture. The flow proceeds from operation 902 to operation 904, which indicates that the hybrid mixture is dispensed into the inner space of the cylinder. The flow proceeds from operation 904 to operation 906, which instructs to rotate the cylinder about the central axis, and the cylinder encloses the hybrid mixture in the internal space until the mixture phase separates into two distinct layers. The flow proceeds from operation 906 to operation 908, which indicates that the cylinder is heated to a temperature between 140 and 212 degrees Fahrenheit during at least a portion of the time of the rotation operation. The flow proceeds from operation 908 to operation 910, which indicates that a polishing pad is formed from the polyurethane sheet formed after the hybrid mixture has been separated into two layers and has reacted. The processing flow ends after operation 910.
聚合物(例如聚胺基甲酸酯,亦稱作PU)鑄造系統涉及將一種以上聚合物混合在一起而形成聚合物複合物。為形成聚合物複合物,於中間添加發泡體以分離使用離心鑄造機形成之不同聚合物混合物。 Polymer (eg, polyurethane, also known as PU) casting systems involve mixing more than one polymer together to form a polymer composite. To form a polymer composite, a foam is added in the middle to separate different polymer mixtures formed using a centrifugal casting machine.
圖10為展示根據本發明技術使用聚胺基甲酸酯形成多層抛光墊之替代方法1000的處理流程圖。然而,如本文中所論述,該方法亦適用於其他聚合物。如圖10中所示,方法1000可在操作1002開始,該操 作指示將複合物混合物施配至圓筒之內部空間中。流程自操作1002進行至操作1004,該操作指示使圓筒圍繞中心軸線旋轉,該圓筒在內部空間中圍封複合物混合物。流程自操作1004進行至操作1006,該操作指示在旋轉操作之至少一部分時間期間將圓筒加熱至140至212華氏度之間的溫度。流程自操作1006進行至操作1008,該操作指示在複合物混合物已膠凝之後將較硬之聚胺基甲酸酯混合物施配至圓筒之內部空間中。流程自操作1008進行至操作1010,該操作指示旋轉且加熱圓筒直至較硬之聚胺基甲酸酯及複合物混合物已反應形成具有兩個層之聚胺基甲酸酯薄片。隨著複合物混合物凝固成凝膠(亦稱作反應),在施配較硬之聚胺基甲酸酯之前,較硬之聚胺基甲酸酯層將與較軟之聚胺基甲酸酯層化學鍵結而無需壓敏性黏著劑(PSA)來結合兩個層。流程自操作1010進行至操作1012,該操作指示自含有兩個層之聚胺基甲酸酯薄片形成抛光墊。處理流程在操作1012之後結束。 FIG. 10 is a process flow diagram illustrating an alternative method 1000 for forming a multilayer polishing pad using polyurethane according to the technology of the present invention. However, as discussed herein, this method is also applicable to other polymers. As shown in FIG. 10, method 1000 may begin at operation 1002, which The compound mixture is dispensed into the inner space of the cylinder as an instruction. The flow proceeds from operation 1002 to operation 1004, which instructs to rotate the cylinder about the central axis, the cylinder enclosing the composite mixture in the internal space. The flow proceeds from operation 1004 to operation 1006, which instructs to heat the cylinder to a temperature between 140 and 212 degrees Fahrenheit during at least a portion of the time of the rotating operation. The flow proceeds from operation 1006 to operation 1008, which indicates that the harder polyurethane mixture is dispensed into the inner space of the cylinder after the composite mixture has gelled. The flow proceeds from operation 1008 to operation 1010, which instructs rotating and heating the cylinder until the harder polyurethane and composite mixture has reacted to form a polyurethane sheet having two layers. As the composite mixture solidifies into a gel (also known as a reaction), the harder polyurethane layer will interact with the softer polyurethane before the harder polyurethane is dispensed. The ester layer is chemically bonded without the need for a pressure sensitive adhesive (PSA) to bond the two layers. The flow proceeds from operation 1010 to operation 1012, which indicates forming a polishing pad from a polyurethane sheet containing two layers. The processing flow ends after operation 1012.
在另一實施例中,較硬之聚胺基甲酸酯混合物在複合物混合物施配至圓筒中之前施配至圓筒中且膠凝。 In another embodiment, the harder polyurethane mixture is dispensed into the cylinder and gelled before the composite mixture is dispensed into the cylinder.
在其他實施例中,在將複合物混合物澆注至圓筒中之前,於較軟之聚胺基甲酸酯層的表面上安置或形成薄層。薄層由聚酯、紡織物或導電材料製得。或者,聚酯、耐綸、紡織物或導電材料之薄層為編織的或非編織的,且可處於任一側上或可囊封聚胺基甲酸酯薄片。在其他實施例中,導電材料在形成抛光墊之前亦塗佈(例如,液體,噴灑或霧化)聚胺基甲酸酯薄片。在此替代方法中,在單次或多次鑄造中形成多層聚合物墊。 In other embodiments, a thin layer is placed or formed on the surface of the softer polyurethane layer before the composite mixture is poured into the cylinder. The thin layer is made of polyester, textile or conductive material. Alternatively, the thin layer of polyester, nylon, textile, or conductive material is woven or non-woven and can be on either side or can encapsulate a polyurethane sheet. In other embodiments, the conductive material is also coated (eg, liquid, sprayed, or atomized) with a polyurethane sheet before forming a polishing pad. In this alternative method, a multilayer polymer mat is formed in a single or multiple castings.
以上描述為例示性且非限制性的。在審閱本發明後,本發明之許多變化對於熟習此項技術者將變得顯而易見。因此,本發明之範疇不應參考以上描述確定,而應參考所附申請專利範圍以及其等效物之全範疇確定。 The above description is exemplary and non-limiting. After reviewing the invention, many variations of the invention will become apparent to those skilled in the art. Therefore, the scope of the present invention should not be determined with reference to the above description, but should be determined with reference to the scope of the attached application patent and its full scope of equivalents.
Claims (27)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/297,177 | 2014-06-05 | ||
US14/297,177 US10722997B2 (en) | 2012-04-02 | 2014-06-05 | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201607643A TW201607643A (en) | 2016-03-01 |
TWI665033B true TWI665033B (en) | 2019-07-11 |
Family
ID=54767168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104117524A TWI665033B (en) | 2014-06-05 | 2015-05-29 | Method and system for making a multilayer chemical mechanical planarization pad using centrifugal casting |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR102376599B1 (en) |
SG (1) | SG11201610107TA (en) |
TW (1) | TWI665033B (en) |
WO (1) | WO2015187338A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
US11090778B2 (en) | 2012-04-02 | 2021-08-17 | Thomas West, Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
US11219982B2 (en) | 2012-04-02 | 2022-01-11 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI717183B (en) * | 2020-01-03 | 2021-01-21 | 銓科光電材料股份有限公司 | Wafer polishing pad |
DE102022126743A1 (en) * | 2022-10-13 | 2024-04-18 | Ernst-Abbe-Hochschule Jena Körperschaft des öffentlichen Rechts | Tool for material removal and method for its manufacture |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1460055A (en) * | 2000-09-05 | 2003-12-03 | 山内株式会社 | Method for mfg. elastic cylindrical body, method for mfg. elastic roll, elastic cylindrical body and elastic roll |
TW200505635A (en) * | 2003-03-25 | 2005-02-16 | Neopad Inc | Customized polish pads for chemical mechanical planarization |
CN1675063A (en) * | 2002-06-07 | 2005-09-28 | 普莱克斯S.T.技术有限公司 | Controlled penetration subpad |
CN101106905A (en) * | 2004-04-05 | 2008-01-16 | 瑞派技术有限公司 | Polishing pad and method of making same |
TW201121710A (en) * | 2009-12-31 | 2011-07-01 | Iv Technologies Co Ltd | Method of manufacturing polishing pad having detection window and polishing pad having detection window |
TW201402275A (en) * | 2012-04-02 | 2014-01-16 | Thomas West Inc | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7374644B2 (en) * | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US8602851B2 (en) * | 2003-06-09 | 2013-12-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled penetration subpad |
US6752690B1 (en) * | 2002-06-12 | 2004-06-22 | Clinton O. Fruitman | Method of making polishing pad for planarization of semiconductor wafers |
TWI264043B (en) * | 2002-10-01 | 2006-10-11 | Tokyo Electron Ltd | Method and system for analyzing data from a plasma process |
US8864859B2 (en) * | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US7452265B2 (en) * | 2006-12-21 | 2008-11-18 | 3M Innovative Properties Company | Abrasive article and methods of making same |
US20080274674A1 (en) * | 2007-05-03 | 2008-11-06 | Cabot Microelectronics Corporation | Stacked polishing pad for high temperature applications |
KR101021783B1 (en) * | 2009-02-25 | 2011-03-17 | 엠.씨.케이 (주) | Polishing pad manufacturing device and manufacturing process using it |
-
2015
- 2015-05-14 WO PCT/US2015/030903 patent/WO2015187338A1/en active Application Filing
- 2015-05-14 SG SG11201610107TA patent/SG11201610107TA/en unknown
- 2015-05-14 KR KR1020167037075A patent/KR102376599B1/en active IP Right Grant
- 2015-05-29 TW TW104117524A patent/TWI665033B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1460055A (en) * | 2000-09-05 | 2003-12-03 | 山内株式会社 | Method for mfg. elastic cylindrical body, method for mfg. elastic roll, elastic cylindrical body and elastic roll |
CN1675063A (en) * | 2002-06-07 | 2005-09-28 | 普莱克斯S.T.技术有限公司 | Controlled penetration subpad |
TW200505635A (en) * | 2003-03-25 | 2005-02-16 | Neopad Inc | Customized polish pads for chemical mechanical planarization |
CN101106905A (en) * | 2004-04-05 | 2008-01-16 | 瑞派技术有限公司 | Polishing pad and method of making same |
TW201121710A (en) * | 2009-12-31 | 2011-07-01 | Iv Technologies Co Ltd | Method of manufacturing polishing pad having detection window and polishing pad having detection window |
TW201402275A (en) * | 2012-04-02 | 2014-01-16 | Thomas West Inc | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
US11090778B2 (en) | 2012-04-02 | 2021-08-17 | Thomas West, Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
US11219982B2 (en) | 2012-04-02 | 2022-01-11 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
Also Published As
Publication number | Publication date |
---|---|
TW201607643A (en) | 2016-03-01 |
WO2015187338A9 (en) | 2016-11-17 |
KR102376599B1 (en) | 2022-03-21 |
SG11201610107TA (en) | 2017-01-27 |
KR20170018359A (en) | 2017-02-17 |
WO2015187338A1 (en) | 2015-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI665033B (en) | Method and system for making a multilayer chemical mechanical planarization pad using centrifugal casting | |
US4539017A (en) | Elastic grinding element and method for producing it | |
KR20170068534A (en) | Chemical mechanical polishing pad with internal channels | |
US8684794B2 (en) | Chemical mechanical planarization pad with void network | |
KR101825734B1 (en) | Polishing pad with foundation layer and polishing surface layer | |
TWI385050B (en) | Customized polishing pads for cmp and methods of fabrication and use thereof | |
EP2627478B1 (en) | Polishing pad with multi-modal distribution of pore diameters | |
TWI671161B (en) | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods | |
TWI599448B (en) | Polishing pad having porogens with liquid filler | |
KR20080052638A (en) | Method of making a structured abrasive article | |
US10722997B2 (en) | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads | |
JP2003516872A (en) | Method for producing polymer or polymer composite polishing pad | |
TWI647066B (en) | Method and system for controlling light transmittance of polishing pad (polishing pad) material | |
CN102950550B (en) | The method of preparative chemistry machine glazed finish layer | |
JP6434053B2 (en) | Method for casting ceramic parts | |
CA2809208A1 (en) | Composite materials and methods and apparatus for making same | |
TWI685896B (en) | Method of manufacturing chemical mechanical polishing pad with internal channels | |
US20180311791A1 (en) | Method and Systems to Control Optical Transmissivity of a Polish Pad Material | |
JP6411453B2 (en) | Grinding wheel and method for reinforcing the grinding wheel | |
JP2010059391A (en) | Method and device for producing reactive resin-foamed material | |
TWI825534B (en) | Chemical-mechanical polishing subpad having porogens with polymeric shells | |
CN110815038A (en) | Polishing pad and preparation method and application thereof | |
JPS59129111A (en) | Preparation of brake pad | |
JP4362443B2 (en) | Intrusion control subpad | |
WO2010086917A1 (en) | Process and apparatus for producing foam of reactive resin |