TWI685896B - Method of manufacturing chemical mechanical polishing pad with internal channels - Google Patents

Abstract

A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.

Description

Manufacturing method of chemical mechanical polishing pad with internal channel

The embodiments disclosed in this case generally relate to the manufacture of abrasive articles used in chemical mechanical polishing (CMP) processes. More specifically, the embodiments disclosed in this case relate to polishing pads used in CMP processes, and methods of manufacturing polishing pads using additive manufacturing techniques.

Chemical mechanical polishing (CMP) is a process used to provide a flat surface on an integrated circuit device in the semiconductor manufacturing industry. This process is also called chemical mechanical planarization. Please refer to FIG. 1, which illustrates a side cross-sectional view of a typical CMP system 100. The CMP system 100 as shown shows the substrate 104 disposed in the polishing head 102. The polishing head 102 rotates the substrate 104 and presses the substrate 104 against the polishing surface 152 of the polishing pad 150. The polishing pad 150 is supported on a platform 106 that rotates the polishing pad 150 relative to the substrate 104. The polishing liquid or slurry is transported from the slurry transport source 110 to the polishing pad 150. The slurry affects the removal of the film or other materials from the substrate 104. This type of grinding is often used to planarize insulating layers such as silicon oxide and/or metal layers such as tungsten, aluminum, or copper, which have been deposited on the substrate 104.

During processing, environmental control of the conditions (such as pressure, temperature, and chemical action) between the polishing pad and the substrate results in consistent and uniform polishing results. The pressure during polishing is often controlled by changing the amount of downward pressure that the polishing head exerts on the substrate against the polishing pad. Although this pressure can be changed, it is often difficult to change the pressure on different parts of the substrate. The temperature during grinding is often controlled by controlling the temperature of the surrounding air or by supplying coolant through the platform to try to cool the substrate being polished. These indirect methods are often not sufficient for precise temperature control of the polished surface in the substrate. Chemicals such as abrasive slurry are frequently supplied to the top of the polishing pad, as shown in Figure 1. The grooves in the polishing pad can be used to transport the slurry to the underside of the substrate being polished. Although some paste does reach the underside of the substrate, a large amount of paste is usually wasted because the same amount of paste never reaches the underside of the substrate.

Therefore, there is a need for improved polishing pads to allow more effective and precise control of the temperature, pressure, and chemical interactions between the polishing pad and the substrate being polished.

In one embodiment, a polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a support surface. The polishing pad further includes a plurality of polishing features that form a polishing surface opposite the support surface. The polishing pad further includes one or more channels formed in an inner region of the polishing pad, the one or more channels extending at least partially around the center of the polishing pad, wherein each channel is fluidly coupled to at least one port.

In another embodiment, a polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a support surface. The polishing pad further includes a plurality of polishing features that form a polishing surface opposite the support surface. The polishing pad further includes an air chamber formed in the inner region of the polishing pad and fluidly coupled to the at least one port.

In another embodiment, a grinding device for chemical mechanical grinding is provided. The grinding device includes a platform, a grinding pad and a seal. The platform includes a shaft and a platform plate supported by the shaft. The platform board includes a mounting surface for supporting the polishing pad. The platform further includes one or more conduits disposed through the shaft and platform plate. The polishing pad includes a base area having a support surface for contacting the mounting surface of the platform. The polishing pad further includes a plurality of polishing features that form a polishing surface opposite the support surface. The polishing pad further includes one or more channels formed in the inner region of the polishing pad and extending at least 15 degrees around the center of the polishing pad. The seal creates a sealed connection between one or more conduits of the platform and one or more channels of the polishing pad.

The embodiments of the present disclosure may further provide a polishing pad including a composite pad body. The composite gasket body includes one or more first features formed from a first material or a first material composition, and one or more second features formed from a second material or a second material composition, one of which The one or more first features and the one or more second features are formed by depositing a plurality of layers including the first material or the first material composition and the second material or the second material composition .

The general system of the present disclosure relates to the manufacture of abrasive products used in chemical mechanical polishing (CMP) processes. More specifically, the embodiments disclosed in this case relate to polishing pads used in CMP processes and methods of manufacturing polishing pads by using additive manufacturing techniques such as 3D printing. FIGS. 2-8B describe different embodiments of polishing pads that can be formed using a 3D printing process, which is described by referring to FIGS. 10 and 11.

FIG. 2 is a side sectional view of the polishing apparatus 200 according to an embodiment. The polishing device 200 includes a platform 210 and a polishing pad 250. The platform 210 includes a shaft 214 and a platform plate 216 supported by the shaft 214. The platform plate 216 includes a mounting surface 218 for supporting the polishing pad 250. The platform 210 further includes a first conduit 211 and a second conduit 212 for transporting fluid to and/or from the polishing pad 250. Each conduit 211, 212 is distributed through the shaft 214 and the platform plate 216. In some embodiments, one or more catheters may be distributed through the shaft and platform plate. Different conduits can transport the same fluid or different fluids, such as abrasive slurry, surfactants, deionized water, solvents, mixtures, or other fluids. The ducts 211, 212 may be distributed through each opening 221, 222 of the sealing surface 232, or another surface of the platform 210, such as the other surface facing the polishing pad 250, such as the mounting surface 218.

The polishing pad 250 includes a base area 260 having a support surface 254 that contacts the mounting surface 218 of the platform 210. The polishing pad 250 further includes a polishing area that includes a plurality of polishing features 271 that form the polishing surface 274. The abrasive surface 274 is opposite to the support surface 254.

The polishing pad 250 and other polishing pads discussed below may be formed of polymers, such as polyurethane, polyurethane-acrylate, epoxy resin, acrylonitrile butadiene styrene (ABS) , Polyetheramide, polyester, nylon, polyphenylsulfone (PPS), polyetherketone (PEEK), polyvinyl alcohol, polyvinyl acetate, polyvinyl chloride, polycarbonate, polyamide , Or copolymers and blends of the above, and photopolymer acrylate monomers and oligomers, such as polyurethane acrylate, polyester acrylate, and epoxy acetate. The base region 260 and the polishing region 270 may be formed of the same or different materials. For example, in some embodiments, the base region 260 may be formed of polysilicon, and the polishing region 270 may be formed of polyurethane. The abrasive area may have a hardness between about 40 Shore A grade and about 90 Shore D grade, such as about 50 Shore D grade hardness. The abrasive region 270 may have a thickness between about 15 mils and about 80 mils, such as about 50 mils. The abrasive feature 271 may have a size between about 50 microns and about 5000 microns in a plane parallel to the abrasive surface, such as about 150 microns. The abrasive features may have a textured abrasive surface with rough features, the features having a size between about 1 micron and about 10 microns, such as about 2 microns. The abrasive feature 271 may cover an area between about 15% and about 90% of the total horizontal surface area of the abrasive pad 250. The gap 277 between the abrasive features may be between about 2.5 mm and down to about 100 microns, such as 300 microns. The height of the abrasive feature 271 may be between about 0.1 mm and about 1.5 mm, such as about 0.5 mm. The base region 260 may be softer or harder than the grinding region 270. The thickness of the base region 260 may be thicker, thinner, or the same thickness than the thickness of the polishing region 270. Unless otherwise specified, the dimensions and characteristics of the polishing pad 250 discussed in this paragraph apply to all polishing pads discussed below.

The polishing pad 250 further includes a first channel 251 and a second channel 252 formed in the inner region of the polishing pad 250. The first channel 251 and the second channel 252 may at least partially extend around the center 257 of the polishing pad 250. For example, in some embodiments, the first channel 251 and the second channel 252 may extend at least 15 degrees around the center 257 of the polishing pad 250. In some embodiments, the first channel 251 and the second channel 252 may fully extend around the center 257 of the polishing pad 250 (that is, 360 degrees). The channels 251 and 252 terminate at the ports 241 and 242. The ports 241 and 242 may be formed in the supporting surface 254 of the polishing pad 250 or another surface, such as the other surface facing the platform 210. In some embodiments, the polishing pad may include one or more ports on one side of the polishing pad, such as a side perpendicular to the support surface 254.

In some embodiments, the polishing pad may include one or more channels (eg, 100 channels) formed in the inner region of the polishing pad, each of the one or more channels may surround at least the center of the polishing pad Partially extended. Each of the one or more channels may be fluidly coupled to at least one port.

The grinding device 200 further includes a seal 230 that creates a sealed connection between the first conduit 211 and the first channel 251 and a sealed connection between the second conduit 212 and the second channel 252. The sealing member 230 can interface with each opening 221 and 222 on the platform 210 and each port 241 and 242 of the polishing pad 250. In some embodiments, the seal 230 may create a sealed connection between one or more conduits of the platform and one or more channels of the polishing pad.

The following embodiments provide examples of how a polishing pad with internal channels can be used to improve the results of the polishing process, improve the cost of ownership, and reduce the cost that can be consumed by the polishing process. Abrasive pads with internal channels can be manufactured using additive manufacturing techniques such as 3D printing. Figures 10 and 11 below describe the process of using 3D printing to manufacture polishing pads with internal channels.

FIG. 3A is a top plan view illustrating the internal channel layout of the polishing pad 350 according to an embodiment. FIG. 3B is a side cross-sectional view of the polishing apparatus 300, which includes the polishing pad 350 of FIG. 3A. The grinding device 300 further includes a platform 310 and a seal 330. The polishing pad 350 includes an air chamber 355, an internal channel 351, and an external channel 352, each of which may be connected to a different conduit formed in the platform 310, this configuration will be discussed in further detail below. These independent connections may be coupled to a high-pressure source 380, such as a compressed air source, to allow individual control of the pressure inside the gas chamber 355, the internal passage 351, and the external passage 352.

The air chamber 355 is formed in the inner area of the polishing pad 350. The gas chamber 355 is fluidly coupled to the port 345, which allows fluid connection with the conduit 315 of the platform 310 through the seal 330. The internal channel 351 is fluidly coupled to the port 341 which allows fluid connection with the conduit 311 of the platform 310 through the seal 330. The external channel 352 is fluidly coupled to the port 342, thereby allowing fluid connection with the conduit 312 of the platform 310 through the seal 330. The air chamber 355 is generally surrounded by the internal passage 351. The inner channel 351 is generally surrounded by the outer channel 352. In some embodiments, each channel 351, 352 may extend at least partially around (eg, 15 degrees) the center 357 of the polishing pad 350. At least two of the channels 351 and 352 are fluidly coupled to separate ports, such as ports 341 and 342, respectively. At least two of the channels 351, 352 are fluidly coupled to a single one of the conduits 311, 312. Although FIG. 3A illustrates a narrow line that separates the channels 351 and 352 and separates the gas chamber 355 from the channels 351, 352, in some embodiments, the channels 351, 352 are separated from each other and The separation between the chambers 355 may be greater than the width of the channels 351,352.

The air chamber 355 may be disposed adjacent to the air chamber grinding feature 375, such as below the air chamber grinding feature 375. The internal channel 351 may be disposed adjacent to the internal abrasive feature 371, such as below the internal abrasive feature 371. The outer channel 352 may be disposed adjacent to the outer abrasive feature 372, such as below the outer abrasive feature 372. During operation, the air chamber 355, the internal passage 351, and the external passage 352 may be pressurized at different pressures, such as using different fluid pressures (eg, air pressure). Applying more or less pressure to the gas chamber 355 and the channels 351, 352 relative to each other may provide advantages, such as reducing center-to-edge unevenness during the CMP process and adjusting the long and short distance planarization of the polished surface in the substrate . In some configurations, the pressure and/or fluid type provided to one or more of the gas chamber and the channel can be used to adjust the dynamic characteristics of the polishing pad, and thereby affect the results of the polishing process. The two common dynamic characteristics of CMP pads that can be adjusted are loss modulus and storage modulus. In conventional applications, the dynamic characteristics of the CMP pad can only be modified by adjusting the material composition and/or pad formation process variables to change the material characteristics of the formed pad. The storage modulus characteristic of the CMP pad indicates the modulus of the elastic part in the material. Therefore, the storage modulus is a measure of the energy stored in the material and is recovered every cycle when the pad passes under the substrate being polished. Conversely, the loss modulus relates to the gasket material or, in this case, the viscous nature or characteristics of the gasket stack. The loss modulus is a measure of the energy dissipated with heat due to the periodic deformation of the pad during grinding. The ratio of the loss modulus to the storage modulus is defined as the loss tangent (δ) and represents the ability of the material to dissipate energy. Adjusting the storage modulus and loss modulus characteristics of the pad stack will affect the long and short distance planarization of the polished surface of the substrate. As will be discussed further below, by adjusting the pressure and/or the materials disposed in the gas chamber and the channel, the dynamic characteristics of the polishing pad 350, and thus the planarization ability of the polishing pad 350, can be adjusted.

Although three pressure zones (ie, gas chamber 355 and channels 351, 352) are shown in Figures 3A-3B, other embodiments may include two or more zones, such as ten zones. In some embodiments, the material surrounding the gas chamber 355 and the channels 351, 352 may be a different material than the polishing area or base area of the polishing pad 350, such as a softer and/or more flexible material. For example, in some embodiments, the different parts of the polishing pad 350 may be formed entirely of polyurethane, but the material surrounding the air chamber 355 and the channels 351, 352 may be softer than the material containing the remaining part of the polishing pad 350 It is made of materials to provide greater flexibility around the gas chamber 355 and the channels 351 and 352, and/or to adjust the dynamic characteristics of the polishing pad stack. In other embodiments, the polishing pad 350 may all be formed of the same material.

The polishing pad 350 may also include one or more sensors, such as one or more pressure sensors or temperature sensors. For example, the polishing pad 350 may include an air chamber pressure sensor 365, an internal channel pressure sensor 361, and an external channel pressure sensor 362. In one example, the pressure sensor may include a strain gauge type device that provides a signal to determine the applied pressure value. The air chamber pressure sensor 365 may have a sensing surface positioned in the air chamber 355 to measure the pressure inside the air chamber 355. The internal channel pressure sensor 361 may have a sensing surface positioned in the internal channel 351 to measure the pressure inside the internal channel 351. The external channel pressure sensor 362 may have a sensing surface positioned in the external channel 352 to measure the pressure inside the external channel 352. Each of the pressure sensors 365, 361, 362 can communicate the measured pressure to the controller 25 via a wired or wireless connection. The controller 25 may be any controller capable of monitoring input and/or controlling output, such as any microprocessor, microcomputer, or programmable logic controller.

A pressure regulating device such as a control valve may be placed between the high-pressure source 380 and the gas chamber 355 and each of the channels 351, 352. The control valve 385 can be placed between the high-pressure source 380 and the gas chamber 355. The control valves 381, 382 may be placed between the high-pressure source 380 and the internal channel 351 and between the high-pressure source 380 and the external channel 352, respectively. The control valves 385, 381, 382 may be placed away from the platform 310. The controller 25 can control the pressure inside the gas chamber 355 and the channels 351 and 352 by adjusting the position of the control valve. In one embodiment, the controller 25 performs a separate feedback loop, such as a PID loop, for each pair of pressure sensors and control valves for the gas chamber 355 and the channels 351, 352. In some embodiments, additional pressure sensors may be placed at other locations in the polishing pad 350, such as closer to the seal 330, to provide more information on the pressure inside the polishing pad 350.

In some embodiments, the high-pressure source 380 is a source of compressed air, but other fluids such as DI water or another useful fluid can also be used. For example, in some embodiments, compressed inert gas is used as the fluid for the high-pressure source.

In other embodiments, non-Newtonian fluids can be used as the fluid for the high-pressure source. Examples of non-Newtonian fluids that can be used include polysaccharide solutions and polyethylene glycol solutions, both of which can also include ceramic particles. Filling the air chamber 355 and the channels 351, 352 of the polishing pad 350 with non-Newtonian fluid allows the elasticity and damping characteristics of the polishing pad 350 to be adjusted. The elasticity and damping characteristics of the polishing pad determine how the polishing pad responds to stress during polishing. For example, an excessively elastic polishing pad may cause "dents" or areas where too much material is removed from the surface being polished. This improper depression leads to non-planar grinding and may cause poor performance of the produced device. A polishing pad with extremely low elasticity may also be too rigid to conform to the variation of the surface to be polished, resulting in poor polishing results. In one example, smaller features formed on the surface of the semiconductor substrate (such as closely spaced 32-nanometer linear features compared to wider-sized and wider-spaced trenches) can have completely different abrasive characteristics. Therefore, the damping characteristics of the non-Newtonian fluid will enable the supplied fluid to absorb energy and stress during polishing, thereby preventing excessive vibration between the polishing pad and the substrate. The stress and shear thickening properties of non-Newtonian fluids cause fluids to harden and absorb energy in response to stress. On the other hand, Newtonian fluids do not have such stress and shear thickening properties, thereby making Newtonian fluids less efficient in absorbing energy and stresses generated during grinding.

The elasticity and damping characteristics of the polishing pad 350 (such as the dynamic characteristics of the polishing pad) can be adjusted by changing the type of fluid (such as non-Newtonian fluid) and the pressure of the fluid supplied to the gas chamber 355 and the channels 351, 352. Previously, in order to achieve different elasticity and damping characteristics, different polishing pads were used, but at present, different fluids can be used to fill a pad to obtain different elasticity and damping characteristics. Furthermore, in some embodiments, different fluids, such as different non-Newtonian fluids, can be supplied to the air chamber 355 or one or more of the channels 351, 352, thereby imparting elasticity and damping to different areas of the polishing pad The characteristics are adjusted, such as different radial areas of the polishing pad.

FIG. 4A is a top plan view illustrating the internal channel layout of the polishing pad 450 according to an embodiment. FIG. 4B is a partial side sectional view of the polishing pad 450 in FIG. 4A. The polishing pad 450 includes a first polishing channel 451, a second polishing channel 452, and a third polishing channel 453. The channels 451-453 are each fluidly coupled to the supply channel 461. The channels 451-453 may extend substantially around the center 457 of the polishing pad 450, such as 360 degrees around the center 457 of the polishing pad 450.

The polishing pad 450 further includes a plurality of polishing features including adjustable polishing features 471 and fixed polishing features 472. The adjustable grinding feature 471 can be moved relative to the fixed grinding feature 472 so that when pressure such as air pressure is applied to the channels 451-453, the adjustable grinding feature 471 can extend past the fixed grinding feature 472 to grind the substrate. When the pressure is removed, the adjustable grinding feature 471 can return to the recessed position relative to the fixed grinding feature 472 so that the fixed grinding feature 472 can grind the substrate. The adjustable abrasive feature 471 may include a first abrasive surface 481, and the fixed abrasive feature may include a second abrasive surface 482. The first abrasive surface 481 may have different characteristics than the second abrasive surface 482, such as having different hardness or texture. Each of the channels 451-453 may be positioned adjacent to at least some of the adjustable abrasive features 471, such as below the adjustable abrasive features 471. For example, the adjustable abrasive feature 471 may be placed above the channels 451-453 along concentric rings. The fixed abrasive feature 472 may be positioned along the area of the polishing pad that is not occupied by a concentric ring, which is positioned above the channels 451-453.

Adjustable abrasive feature 471 can move in response to pressure changes in channels 451-453, such as extending past fixed abrasive feature 472 when the pressure in channels 451-453 rises above a certain level. The adjustable abrasive feature 471 may have different characteristics than the fixed abrasive feature 472, such as different shapes, sizes, hardness, composition. When the channels 451-453 are not pressurized, the adjustable grinding feature 471 may be recessed relative to the fixed grinding feature 472. When the channels 451-453 are pressurized, the adjustable grinding feature 471 can extend past the fixed grinding feature 472. During operation, air pressure can be supplied to the polishing pad 450 from a source, such as via a platform conduit (not shown) to pressurize the supply channels 461 and channels 451-453, thereby allowing the adjustable grinding feature 471 to extend past the fixed Grinding features 472.

The polishing pad 450 enables one polishing pad to polish substrates with different polishing characteristics at different times. For example, if the fixed abrasive feature 472 is harder than the adjustable abrasive feature 471, or has a rougher texture, the fixed abrasive feature 472 can be used for rougher polishing first, and then the channels 451-453 can be pressurized to allow The adjustable grinding feature 471 is used for finer grinding. In one embodiment, the adjustable abrasive feature 471 can have a Shore D hardness of between about 15 to about 25 (eg, about 20 Shore D hardness), and the fixed abrasive feature 472 can have about 50 to about 70 Between Shore D hardness (for example, about 60 Shore D hardness). Although only three channels 451-453 extending around the center 457 of the polishing pad 450 are shown in the figure, two or more channels may be included. Although only one supply channel 461 is shown in the figure, some embodiments may include multiple supply channels to allow different polishing pad channels to receive different pressures in a manner similar to the channels 351, 352 of the polishing pad 350 that may receive different Way of stress. Independent supply channels can also be used in embodiments with more than one set of adjustable grinding characteristics. For example, the polishing pad may include a first set of adjustable polishing features for applying medium polishing, and a second set of adjustable polishing features for applying finer polishing, and a fixed polishing feature for applying coarser polishing Of grinding. In some embodiments, the polishing pad 450 may include one or more pressure sensors (not shown), such as those included in the polishing pad 350. For example, the polishing pad may include a pressure sensor in one or more of the channels 451-453.

In some embodiments, the supply channel 461 can be directed to an air chamber that can pressurize all adjustable grinding features instead of using separate channels, such as channels 451-453. The gas chamber may be adjacent to substantially all adjustable grinding features 471 and fixed grinding features 472. A polishing pad with an air chamber can prevent the fixed feature 472 from moving relative to the adjustable abrasive feature 471 in response to changes in air pressure by using additional or different materials between the air chamber and the fixed feature 472. For example, a more flexible material may be placed between the adjustable grinding feature 471 and the air chamber instead of between the fixed grinding feature 472 and the air chamber.

FIG. 5A is a top plan view illustrating the internal channel layout of the polishing pad 550 according to one embodiment. FIG. 5B is a side cross-sectional view of the polishing apparatus 500, which includes the polishing pad 550 of FIG. 5A. The polishing device 500 includes a polishing pad 550, a platform 510, and a seal 530, which provides a sealed connection between the polishing pad 550 and the platform 510. The platform 510 includes a supply duct 511 and a return duct 512. The supply duct 511 and the return duct 512 can be used to flow fluid through the polishing pad 550. For example, the conduits 511 and 512 can be used to flow heating or cooling fluid through the polishing pad 550 to adjust the polishing process temperature, thereby adjusting the activity of slurry chemicals and/or adjusting the dynamic characteristics of the polishing pad.

The polishing pad 550 includes a plurality of channels 551-556. Although FIG. 5A illustrates a narrow line that separates the channels 551-556, in some embodiments, the distance between the channels 551-556 may be greater than the width of the channel. Each channel 551-556 may substantially surround the center 557 of the polishing pad 550, such as about 360 degrees around the center 557 of the polishing pad 550. Each channel 551-556 is adjacent to the polishing feature 571 of the polishing pad 550. The outwardly facing surface of the polishing feature 571 forms the polishing surface 574 of the polishing pad 550. Each channel 551-556 is fluidly coupled to the supply channel 561 and the supply port 541, and each channel 551-556 is also fluidly coupled to the return channel 562 and the return port 542. In some embodiments, an outer ring 559 that does not include a channel may be included in the polishing pad 550 to provide additional structural support for the polishing pad 550.

The supply channel 561 and the return channel 562 may extend substantially from the center 557 of the polishing pad 550 to the outer edge of the outermost channel 556. The supply channel 561 and the return channel 562 may be arranged adjacent to each other. The supply channel 561 and the return channel 562 may be disposed adjacent to the channels 551-556, such as being coupled to the channels 551-556 from below the channels 551-556. The supply channels 561, the return channels 562, and the channels 551-556 are arranged in this arrangement, allowing fluid to flow through the channels 551-556 to form a generally closed loop around the center 557 of the polishing pad 550. The barrier layer 591 may be used to ensure that fluid flows around the innermost channel 551 before leaving via the return channel 562.

The seal 530 provides a sealed connection between the supply duct 511 and the supply channel 561 and couples the return duct 512 to the return channel 562. The sealing member 530 can be docked with each opening 521 and 522 on the platform 510 and each port 541 and 542 of the polishing pad 550. Each channel 551-556 is fluidly coupled through the seal 530 to the two conduits 511, 512 of the platform 510.

As described above, during operation, heating or cooling fluid such as cooling water may flow through the channels 551-556 to provide temperature control of the polishing pad 550 and the polishing surface 574. In some embodiments, the heating fluid is first circulated in the polishing pad to bring the polishing pad to a prescribed temperature, and then, during polishing, the coolant can be circulated in the polishing pad. The flow rate or temperature of the coolant can be adjusted to provide more or less cooling.

Although six channels 551-556 are shown in the figure, more or fewer channels may be included. In some embodiments, additional structures such as fin structures can be placed in the channels 551-556 to provide additional surface area for heat transfer between the polishing pad 550 and the coolant. The fin structure may protrude from one or more of the side walls of the channels 551-556. In some embodiments, other channel arrangements may be used for heat transfer. For example, in one embodiment, the channels may form one or more loops around the center of the polishing pad, the loops spiraling toward or away from the center of the polishing pad. In other embodiments, the channel may form an incomplete loop around the center of the polishing pad.

Compared to indirect methods (such as cooling platforms), flowing coolant directly through the polishing pad provides better temperature control of the polishing surface 574. The improved temperature control enables improved grinding, such as more uniform grinding and more consistent grinding rate.

FIG. 6A is a top plan view illustrating the internal channel layout of the polishing pad 650 according to one embodiment. FIG. 6B is a partial side cross-sectional view of the polishing device 600, which includes the polishing pad 650 of FIG. 6A. The polishing device 600 includes a polishing pad 650 and a platform 610. The platform 610 may include a supply duct (not visible in the cross-section of FIG. 6B) and a plurality of return ducts 621-626. The supply duct may be located directly below the main supply channel 641M shown in FIG. 6A. Supply and return conduits 621-626 can be used to flow fluid through the polishing pad 650. For example, supply conduits and return conduits 621-626 may be used to flow heating or cooling fluid, such as cooling water, through the polishing pad 650. Multiple return conduits 621-626 allow independent temperature control of different areas of the polishing pad 650.

The polishing pad 650 includes a plurality of channels 651-656. Although FIG. 6A illustrates a narrow line that separates the channels 651-656, in some embodiments, the distance between the channels 651-656 may be greater than the channel width. Each channel 651-656 may substantially surround the center 657 of the polishing pad 650, such as about 360 degrees around the center 657 of the polishing pad 650. Each channel 651-656 is adjacent to the polishing feature 671 of the polishing pad 650. The outward-facing surface of the polishing feature 671 forms the polishing surface 674 of the polishing pad 650. Each of the channels 651-656 is fluidly coupled to a common supply channel 641 and individual return channels 651R-656R. The supply channel 641 is fluidly coupled to the main supply channel 641M and the port (not shown). The return channels 651R-656R are fluidly coupled to each port 651P-656P. Each channel 651-656 is fluidly coupled to respective independent conduits 621-626 via respective return channels 651R-656R, ports 651P-656P and through seals 631-636. In some embodiments, an outer ring 659 that does not include a channel may be included in the polishing pad 650 to provide additional structural support for the polishing pad 650.

The supply channel 641 and the return channel 651R-656R array may extend substantially from the center 657 of the polishing pad 650 to the outer edge of the outermost channel 656. The supply channel 641 and the return channels 651R-656R may be disposed adjacent to each other. The array of supply channels 641 and return channels 651R-656R may be placed adjacent to the channels 651-656, such as below the channels 651-656. In this arrangement, the supply channels 641, the return channels 651R-656R, and the channels 651-656 allow fluid to flow through the channels 651-656 to form a generally closed loop around the center 657 of the polishing pad 650. The barrier layer 691 may be used to ensure that fluid flows around the innermost channel 651 before leaving via the return channel 651R.

During operation, the coolant from the coolant supply 680 may flow through the channels 651-656 using one or more pumps (not shown) to provide temperature control of the polishing pad 650 and the polishing surface 674. Coupling the individual return channels 651R-656R through the seals 631-636 to the individual return conduits 621-626 allows separate temperature control of different areas of the abrasive surface 674. For example, individual control valves 681-686 can be placed downstream of the respective return conduits 621-626 and away from the platform 610 to enable individual temperature control of each channel 651-656. The flow or temperature of the coolant can be adjusted to provide more or less cooling to each channel 651-656.

The polishing pad 650 may also include one or more sensors, such as one or more temperature sensors. For example, the polishing pad 650 may include temperature sensors 661-666 that are positioned in each of the various channels 651-656 to measure the temperature of the channels 651-656. In another example, one or more of the temperature sensors 661-666 may be positioned at or near the polishing surface of the polishing pad 350 (eg, the exposed surface of the pad) so that the polishing pad can be measured during the polishing process And the surface temperature of the substrate. The temperature sensors 661-666 may include thermocouples, RTDs, or similar types of temperature measuring devices. Each of the temperature sensors 661-666 can communicate the measured temperature to the controller, as described above by referring to the controller 25 of FIGS. 3A and 3B. The communication between the temperature sensors 661-666 and the controller 25 may be wired or wireless. The controller 25 can control the temperature inside the channels 651-656 by adjusting the positions of the control valves 681-686. In one embodiment, the controller 25 performs a separate feedback loop such as a PID loop for each pair of temperature sensors and control valves for different channels 651-656. In some embodiments, additional temperature sensors may be placed at other locations in the polishing pad 650, such as the main supply channel 641M, to provide more information about the temperature inside the polishing pad 650.

The supply control valve 690 can also be placed between the coolant supply 680 and the main supply channel 641M to control the overall flow of coolant to the polishing pad. In some embodiments, each channel 651-656 has a separate supply conduit and a separate return conduit so that adjustments to the control valve coupled to the first channel of, for example, the polishing pad do not affect the flow of heating or cooling fluid to the polishing pad 650 One or more of the other channels. Compared with indirect methods (such as cooling platforms), flowing coolant directly through the polishing pad provides better temperature control of the polishing surface. The improved temperature control enables improved grinding, such as more uniform grinding and more consistent grinding rate. Although not discussed above with reference to FIGS. 5A and 5B, the polishing pad 550 may also include one or more temperature sensors to enable temperature control of the polishing pad 550 in a manner similar to polishing Temperature control of pad 650.

In some embodiments, additional structures such as fin structures can be placed in the channels 651-656 to provide additional surface area for heat transfer between the polishing pad 650 and the coolant. The fin-like structure may protrude from one or more of the side walls of the channels 651-656. In some embodiments, other channel arrangements may be used for heat transfer. For example, in one embodiment, the channels may form one or more loops around the center of the polishing pad, the loops spiraling toward or away from the center of the polishing pad. In other embodiments, the channel may extend around the center of the polishing pad to less than a closed loop.

7 is a partial side cross-sectional view of the polishing pad 750 according to an embodiment. The polishing pad 750 may have a generally ring shape that is similar to another polishing pad discussed above. The polishing pad 750 includes a supply channel 761 and an air chamber 765. The gas chamber 765 may be disposed adjacent to the grinding surface 774, such as below the grinding surface 774. The polishing pad 750 further includes abrasive features 771. Each abrasive feature 771 may include abrasive feature channels 775. The grinding feature channel 775 can be used with the supply channel 761 and the air chamber 765 to deliver fluid to the orifice 776 in the grinding surface 774.

The fluid delivered to the abrasive surface 774 via the abrasive feature channel 775 may include fluids such as slurry, surfactant, deionized water, and other fluids. The fluid can be delivered via one or more platform conduits (not shown). In some embodiments, the slurry may be transported via the supply channel 761, and other fluids such as surfactants and deionized water may be transported via an auxiliary channel (not shown). The supply channel 761 and the auxiliary channel may have ports on the surface of the polishing pad 750, such as the bottom surface of the polishing pad 750. Direct delivery of fluid from the polishing feature ensures that fluid is provided between the substrate being polished and the polishing pad.

FIG. 8A is a top plan view illustrating the internal channel layout of the polishing pad 850 according to one embodiment. FIG. 8B is a partial side sectional view of the polishing pad 850 in FIG. 8A. The polishing pad 850 includes a first polishing channel 851, a second polishing channel 852, and a third polishing channel 853. The channels 851-853 may extend generally around the center 857 of the polishing pad 850, such as 360 degrees around the center 857 of the polishing pad 850. The channels 851-853 are each fluidly coupled to a common supply channel 861.

The polishing pad 850 further includes a plurality of polishing features. The polishing features include a first polishing feature 871 and a second polishing feature 872. Each first grinding feature 871 may include a grinding feature channel 875. Each grinding feature channel 875 can be used with the supply channel 861 to deliver fluid through the grinding surface 874 to the orifice 876 at the end of the first grinding feature 871. The first abrasive features 871 each have an aperture 876 through the abrasive surface 874, and the second batch of abrasive features 872 each do not have an aperture through the abrasive surface 874. Each of the channels 851-853 may be disposed adjacent to at least some of the first abrasive features 871, such as below the first abrasive feature 871. The second batch of grinding features 872 may be positioned between the channels 851-853 so that the ring of the first grinding feature 871 may surround the ring of the second batch of grinding features 872.

The first abrasive feature 871 can be used to deliver fluids to the abrasive surface 874, such fluids as slurry, surfactant, and deionized water. The fluid can be delivered via one or more platform conduits (not shown). In some embodiments, the slurry may be delivered via the supply channel 861, and other fluids such as surfactants and deionized water may be delivered via an auxiliary channel (not shown). The supply channel 861 and the auxiliary channel may have ports on the surface of the polishing pad 850, such as the bottom surface of the polishing pad 850.

Direct delivery of fluid from the polishing feature ensures that fluid is provided between the substrate being polished and the polishing pad. Although the polishing pad 850 has alternating rings of first polishing features 871 that transport fluid and second batches of polishing features 872 that do not transport fluid, other arrangements may be used. For example, there may be more or less first grinding features 871 than the second batch of grinding features 872. There may also be a first grinding feature 871 and a second batch of grinding features 872 contained in the same ring that surrounds the center 857 of the polishing pad 850. In some embodiments, different channels may be fluidly coupled to different conduits of the platform so that different areas of the polishing pad can receive different amounts of fluid. For example, if the substrate is significantly smaller than the polishing pad and the substrate is being polished near the edge of the polishing pad, most or all of the fluid may be provided to the edge of the polishing pad 850, and little or no fluid may not be provided to the center of the polishing pad. This design can save material costs by using less fluid, such as slurry used during CMP.

Figures 9A-9H illustrate top and side views of some different shapes that the abrasive features discussed above may have. In some embodiments, the abrasive features discussed above can take the shape of a cylinder. FIG. 9A illustrates a top view of an abrasive feature 910 having a cylindrical shape. FIG. 9B illustrates a side view of the polishing feature 910 having a first side 911 connected to a polishing pad (not shown) and a second side 912 forming part of the polishing surface of the polishing pad. In other embodiments, the abrasive features discussed above may take the shape of prisms having any polygonal cross-section, such as triangles, squares, rectangles, pentagons, hexagons, and so on. FIG. 9C illustrates a top view of an abrasive feature 920 having a rectangular prism shape. FIG. 9D illustrates a side view of the polishing feature 920 having a first side 921 connected to a polishing pad (not shown) and a second side 922 that forms part of the polishing surface of the polishing pad.

In other embodiments, the abrasive features discussed above may assume a fin shape. In some of these embodiments, the fin may take the shape of a rectangular prism, in which case one dimension of the cross section is greater than twice the length in the other direction. In other embodiments, the fins may include other shapes, such as curved features that allow the fins to follow the curvature of a circular polishing pad. FIG. 9E illustrates a top view of the abrasive feature 930 having a fin shape with a rectangular prismatic form. In this case, the first dimension 936 is greater than twice the length of the second dimension 937. FIG. 9F illustrates a side view of the polishing feature 930 having a first side 931 connected to a polishing pad (not shown) and a second side 932 that forms part of the polishing surface of the polishing pad.

In other embodiments, the abrasive features discussed above may take the shape of cones or pyramids, such as truncated cones or pyramids. Figure 9G illustrates a top view of a grinding feature 940 having a truncated cone shape. FIG. 9H illustrates a side view of the polishing feature 940 having a first side 941 connected to a polishing pad (not shown) and a second side 942 forming part of the polishing surface of the polishing pad.

The use of abrasive surfaces formed from individual abrasive features (such as those discussed by reference to Figures 9A through 9H) provides numerous benefits. Grinding pads that do not use individual grinding features have typically used grooves, such as grooves that form concentric rings. These grooves have generally been formed by removing material from the surface of the polishing pad. Although the grooves may allow sufficient fluid to pass within the grooves, the walls between the grooves hinder fluid transmission between the grooves. On the other hand, when individual abrasive features are used, fluid can flow around the individual features, and there are no large structures such as walls between the grooves to inhibit fluid transport in any direction on the surface of the abrasive pad. When the polishing head and the polishing pad area under the substrate cannot be supplied with sufficient fluid such as slurry, fluid such as slurry may be wasted. Waste slurry can reduce the efficiency of the grinding process and increase costs. Individual features can facilitate the transfer of fluids such as slurry to the polishing head and the polishing pad area under the substrate, thereby reducing waste and increasing efficiency.

Individual grinding features also allow designs with multiple types of grinding features, in which case different types of grinding features can perform different functions. For example, the polishing pad 450 discussed above allows for grinding with adjustable grinding features 471 or fixed grinding features 472, thereby enabling one grinding pad to obtain two or more types of grinding results, such as rough grinding followed by fine grinding Grind. Additional manufacturing techniques such as 3D printing can be used to form individual features.

Figure 10 is a process flow diagram that outlines a process 1000 for forming a polishing pad with one or more internal channels by using a 3D printer. FIG. 11 illustrates a 3D printer 50 that can be used to perform a process 1000 to form a polishing pad, such as the polishing pad 250 discussed above with reference to FIG. 2 and shown again in FIG. 11. Although process 1000 is described below by using polishing pad 250 as an exemplary polishing pad that can be manufactured using process 1000, any polishing pad discussed above with reference to FIGS. 2-8B and polishing in FIGS. 9A-9H Features can be formed using process 1000.

The 3D printer 50 may use a jet photopolymer process to deposit photopolymer droplets, and then use ultraviolet curing to form the structure of the polishing pad 250. The 3D printer 50 can print a continuous layer of photopolymer material and one or more other materials to form the polishing pad 250. The 3D printer 50 can use one or more print heads to deposit the constituent materials and supports material. The material used to form the polishing pad 250 may be a photopolymer, such as acrylic-terminated polyurethane or any polymer, such as polyester, nylon, polyphenylsulfone (PPS), and polyetherketone (PEEK) ) Polyvinyl alcohol, polyvinyl acetate, polyvinyl chloride, polycarbonate, or polyamide and copolymers and blends of the above. The constituent materials may also include acrylic photopolymer monomers and oligomers, such as polyurethane acrylate, polyester acrylate, and epoxy acrylate. Other materials that can be used to form the polishing pad 250 include polyurethane acrylate, epoxy resin, acrylonitrile butadiene styrene (ABS), polyether amide imide, or poly amide. The support material may also be a photopolymer, or the support material may be a different material, such as another polymer, wax, or water-soluble material. The support material is used to fill any voids and support any overhangs of the polishing pad 250 during the printing process. After the polishing pad 250 is formed, the support material may be selectively removed from the polishing pad 250 using processes such as phase change, dissolution, chemical reaction, or mechanical processes. Although process 1000 describes a jet photopolymer 3D printing process, other 3D printing processes can also be used, such as stereolithography (SLA), selective laser sintering (SLS), or melting Filament manufacturing (fused filament fabrication; FFF).

At block 1002, the 3D model of the polishing pad 250 is loaded into the 3D printer 50 in a format that enables 3D printing, such as STL. In block 1004, 3D printer initial base layer 50 by depositing on the platform 260 _i 70 starts printing. The platform 70 may be metal, plastic, or ceramic material, such as aluminum, titanium, iron, stainless steel, aluminum oxide (Al ₂ O ₃ ), silicon, silicon dioxide, or silicon carbide. If the platform 70 is formed of a metal material, the metal can be plated or anodized to improve the release characteristics. The platform 70 may be coated with a non-adhesive material, such as polytetrafluoroethylene. The initial base layer 260 _i includes constituent materials and supporting materials. The 3D printer deposits the constituent materials to form the structure of the polishing pad 250. The 3D printer 50 deposits support material (not shown) to fill any voids or gaps between the areas that make up the material, such as ports 241, 242. The support material can also be deposited around the periphery of the polishing pad 250. Ports 241, 242 can be used to fluidly couple the polishing pad 250 to a fluid from a platform or another source. After the initial deposition of the base layer 260 _i or when the initial ultraviolet cured base layer can be composed of material 260 _i. The support material also solidifies through curing, phase change, or another process.

At block 1006, additional 3D printer base layer 50 is deposited over the initial base layer to form a base region 260 _i 260.3D printer constituent material deposited additional layer to form the polishing pad structure 250, and the deposition support The material fills any voids or gaps in the polishing pad 250, such as the channels 251, 252. Before the next layer is deposited, each component material is cured using ultraviolet light. Support material may continue to be deposited around the periphery of the polishing pad 250 to provide additional support. In some embodiments, the process 1000 may be suspended during block 1006 to install one or more sensors, such as the sense of pressure discussed above with reference to FIGS. 3A, 3B, 6A, and 6B Sensor and temperature sensor. In some embodiments, the 3D printer 50 may form a groove in which the sensor is placed, and then the 3D printer 50 may form a continuous layer around the sensor to secure the sensor in place. In other embodiments, the 3D printer 50 may deposit a constituent material, which will then be removed to form one or more ports from one side of the polishing pad to one of the channels inside the polishing pad. For example, one or more ports may be formed in the polishing pad on the side facing the platform during polishing. By using ports that can be accessed from the outside for the polishing pad channel, the sensor can be more easily removed from the polishing pad. In addition to removing the sensor for use with another polishing pad, if the sensor fails and needs to be replaced, removing the sensor can be very useful, for example, when the life of the polishing pad has ended.

At block 1008, the 3D printer 50 deposits an abrasive layer over the base region 260 to form an abrasive region 270. In some embodiments, the base region 260 and the polishing region 270 are formed of the same material, such as polyurethane. In other embodiments, the base region 260 and the polishing region 270 may be formed of different materials. The 3D printer 50 can form a grinding region 270 and a grinding feature 271 having constituent materials. The 3D printer 50 can deposit a supporting material (not shown) between the grinding features 271. In embodiments such as abrasive pad 750 or abrasive pad 850, 3D printer 50 may deposit support material to form channels through abrasive features, such as abrasive feature channels 775, 875.

At block 1010, the support material is removed from the polishing pad 250. Depending on the type of support material used, the support material can be removed via phase change, dissolution, chemical reaction, or other processes. For example, when a water-soluble support material is used, the polishing pad 250 may be immersed in a water bath to remove the support material.

In another embodiment, the 3D printer 50 can be used to form an abrasive pad with a composite pad body. The composite cushion body includes discrete features formed from at least two different materials. The polishing pad can be produced by a three-dimensional (3D) printing process similar to the process 1000. For example, the composite liner body may be formed by continuously depositing multiple layers using the 3D printer 50, each layer including a different material or a region composed of different materials. Then, the plurality of layers can be solidified by curing. Different materials or different material compositions can be used simultaneously to form discrete features in the composite cushion body. The deposition and curing process of 3D printing allows discrete features to be firmly joined together. The geometry of discrete features can be easily controlled by using a 3D printing process. By selecting different materials or different materials, the discrete features can have different mechanical, physical, chemical, and geometric characteristics to obtain the specified pad characteristics. In one embodiment, the composite body may be formed from viscoelastic materials with different mechanical properties. For example, the composite body may be formed of viscoelastic materials with different storage modulus and different loss modes. Therefore, the composite cushion body may include some elastic features formed by the first material or the first material, and some hard features formed by the second material or the second material, and the second material or the second material One material or the first material composition is more rigid.

In addition, different mechanical properties can be selected for elastic and hard features to achieve uniform grinding. The mechanical properties can be changed by selecting different materials and/or selecting different curing processes. In one embodiment, the elastic features may have lower hardness values and lower Young's modulus values, while the hard features may have higher hardness values and higher Young's modulus values. In another embodiment, dynamic mechanical properties such as storage modulus and loss modulus can be used to design elastic and rigid features.

The stiff features can be formed from polymer materials. Rigid features can be formed from a single polymer material or a mixture of two or more polymers to achieve the desired characteristics. In one embodiment, the rigid feature may be formed from one or more thermoplastic polymers, such as polyurethane, polypropylene, polystyrene, polyacrylonitrile, polymethyl methacrylate, polychlorotrifluoroethylene, Polytetrafluoroethylene, polyoxymethylene, polycarbonate, polyimide, polyether ether ketone, polyphenylene sulfide, polyether ash, acrylonitrile butadiene styrene (ABS), polyether amide imine , Polyamide, melamine, polyester, polystyrene, polyvinyl acetate, fluorinated hydrocarbons, etc., and mixtures, copolymers and grafts of the above. In another embodiment, the hard features may include one or more thermosetting polymers, such as epoxy resins, phenolic resins, amines, polyesters, carbamates, silicon, and mixtures, copolymerizations of the above Thing, and graft. Additionally, in one embodiment, abrasive particles can be embedded in the hard features to enhance grinding. The material including abrasive particles may be metal oxide (such as cerium oxide, aluminum oxide, silicon oxide, or a combination of the foregoing), polymer, intermetallic compound, or ceramic.

The elastic feature may be formed from one or more polymer materials. The elastic feature can be formed from a single polymer material or a mixture of two or more polymers to achieve the desired characteristics. In one embodiment, the elastic features may be formed from one or more thermoplastic polymers. For example, elastic features can be formed from thermoplastic polymers such as polyurethane, polypropylene, polystyrene, polyacrylonitrile, polymethyl methacrylate, polychlorotrifluoroethylene, polytetrafluoroethylene, polyoxymethylene, poly Carbonate, polyimide, polyetheretherketone, polyphenylene sulfide, polyether sulfone, acrylonitrile butadiene styrene (ABS), polyetherimide, polyamide, melamine, polyester , Polystyrene, polyvinyl acetate, fluorinated hydrocarbons, etc., and mixtures, copolymers and grafts of the above. The elastic feature 206 may be formed from a thermoplastic elastomer. In one embodiment, the elastic feature may be formed from a rubber-like 3D printing material.

Hard features are generally harder and more rigid than elastic features, while elastic features are softer and more flexible than hard features. The materials, patterns, and relative amounts of hard and elastic features can be selected to obtain the "tuned" monolithic material of the polishing pad. Polishing pads formed from this "tuned" monolithic material have various benefits, such as improved polishing results, reduced manufacturing costs, and extended pad life. In one embodiment, the "tuned" monolithic material or polishing pad as a whole may have a hardness between about 65 Shore A to about 75 Shore D. The tensile strength of the polishing pad can be between 5 MPa and about 75 MPa. The polishing pad may have a pad extension of about 5% to about 350%. The polishing pad may have a shear strength of about 10m Pa or more. The polishing pad may have a storage modulus between about 5 MPa and about 2000 MPa. The polishing pad may have a stable storage modulus in the temperature range of 25°C to 90°C, so that the storage modulus of E30/E90 is in the range of about 6 to about 30, where E30 is the storage modulus at 30°C, And E90 is the storage modulus at 90°C. The hard and elastic features can be used throughout the polishing pad body and/or the polishing layer of the polishing pad. The above-mentioned polishing pad 450 is an example of a polishing pad that can combine hard and elastic features. For example, the adjustable abrasive feature 471 can be an elastic feature that can extend past the fixed abrasive feature 472, and the fixed abrasive feature can be a hard feature.

FIG. 12A is a top cross-sectional view of a polishing pad 1250 according to an embodiment. Figure 12B is a side cross-sectional view of the polishing pad 1250, which is taken along line 12B of Figure 12A. Referring to FIGS. 12A and 12B, the polishing pad 1250 is similar to the polishing pad 750 of FIG. 7 except that the polishing pad 1250 includes a plurality of sections 1210 disposed around the center 1257 of the polishing pad 1250. The polishing pad 1250 is shown to include four sections 1210, but may include more or fewer sections. The polishing pad 1250 includes a plurality of separators 1214 to separate adjacent sections. Different sections 1210 can be used to control fluid delivery that flows through different angular areas around the center 1257 of the polishing pad 1250 in the X-Y plane. In some embodiments, the sections 1210 are arranged symmetrically around the center 1257 of the polishing pad 1250. For example, the polishing pad 1250 illustrates four symmetrical sections 1210, each of which covers an angular area of about 90 degrees in the polishing pad 1250 in the X-Y plane.

In some embodiments, the polishing pad 1250 may generally have a generally annular shape that is similar to other polishing pads discussed above. Each section 1210 of the polishing pad 1250 includes an air chamber 1215 (also referred to as a channel) and a supply line 1216. Each plenum 1215 may extend around most of the angular area of the section, such as at least 75% or at least 90% of the angular area of the section. Each gas chamber 1215 may be disposed adjacent to the grinding surface 1274 of a given section 1210, such as below the grinding surface 1274 of the section 1210. Each section 1210 of the polishing pad 1250 further includes polishing features 1271. Each grinding feature 1271 can include a grinding feature channel 1275. The grinding feature channel 1275 can be used with the supply channel 1261 and the gas chamber 1265 to deliver fluid to the orifice 1276 passing through the grinding surface 1274.

The supply air chamber 1215 connects the supply line 1216 of a given section 1210 to the grinding feature channel 1275 of the section 1210 so that fluid can be delivered to the grinding surface 1274 of the section 1210. The fluid delivered to the abrasive surface 1274 through the abrasive feature channel 1275 may include fluids such as slurry, surfactants, pad cleaning chemicals, deionized water, and other fluids. Fluid can be delivered via one or more conduits (not shown) of the platform. Each of the supply lines 1216 can be connected to a different port 1218 on the surface of the polishing pad 1250, such as the bottom surface of the polishing pad 1250. Direct delivery of fluid from the polishing channel feature ensures that fluid is provided between the substrate being polished and the polishing pad.

Different sections 1210 can be used to control fluid transport that flows through different angular areas of the polishing surface 1274 of the polishing pad 1250. For example, as the polishing pad 1250 rotates during polishing, fluids such as slurry may pulse through different sections 1210 so that when the polished substrate is in contact with the grinding features 1271 of the section 1210, via the given section 1210 Transport more fluid. In one embodiment, each supply line 1216 is connected to a partition valve 1281-1284, in which case each valve 1281-1284 is connected to a slurry supply and one or more pumps as needed. A controller such as controller 25 described above can be used to open and close valves 1281-1284. The opening and closing of the valves 1281-1284 can be synchronized with the rotation of the polishing pad 1250 on a platform (not shown) so that when the substrate being polished is in contact with the polishing feature 1271 of the section 1210, a fluid such as slurry flows through the pulse After a given section. In some embodiments, sometimes, at least two valves (eg, valves 1281, 1282) of adjacent sections 1210 are opened during grinding, so that the next section 1210 that will contact the substrate will The material fluid is supplied to the grinding surface 1274 of the next section 1210.

By synchronizing the transport of slurry or other fluid to the substrate location during grinding, a large amount of slurry or other fluid can be saved. These savings can reduce the production cost of devices manufactured using chemical mechanical grinding.

The many different features of the polishing pad discussed above can be combined with the features of other polishing pads to produce polishing pads with greater functionality. For example, a polishing pad may include features such as pressurizable channels (eg, channels 451-453), temperature control channels (eg, channels 651-656), and slurry delivery channels (eg, channels 851-853 and 875). In some embodiments, one channel can serve two purposes. For example, pressurized cooling water can be used to control the pressure and temperature in a channel.

In some embodiments, the design discussed above may be modified to produce a more symmetrical design to provide better force balance when the polishing pad is rotated by the platform during polishing. For example, the channels 461 of the polishing pad 450 as shown in FIG. 4A may extend radially in two or more directions to pressurize the channels 451-453 and make the polishing pad 450 more symmetrical.

Although many features of the polishing pad and polishing pad (such as internal channels (eg, internal channel 351)) have been described as having a ring-shaped geometry, the characteristics of the polishing pad and polishing pad may take other shapes, such as polygonal or irregular shapes. For example, the polishing pad may have a polygonal shape, such as a rectangular shape. As another example, the air chamber 355, the inner channel 351, and the outer channel 352 may all be formed in a rectangle or other shapes. As another example, the internal channels of some polishing pads may adopt a spiral shape. For example, the polishing pad 550 may be redesigned such that one channel spirals from the center of the polishing pad to the edge of the polishing pad so that heating or cooling fluid enters the center and exits around the edge of the polishing pad.

In addition, sensors other than the above-mentioned pressure and temperature sensors may be installed in the polishing pad. In one embodiment, the differential pressure sensor arrangement may be included in one of the polishing pads for liquid delivery, such as polishing pad 850. The differential pressure between the common supply channel 861 and each channel 851-853 can be measured. For example, a higher differential pressure measurement may indicate that one of the channels 851-853 is blocked or needs cleaning.

Although the foregoing is directed to the embodiments of the present disclosure, other and more embodiments of the design of the present disclosure can be proposed without departing from the basic scope of the present disclosure, and the scope of the present disclosure is covered by the following patent applications Decide.

25‧‧‧Controller 100‧‧‧CMP system 102‧‧‧Grinding head 104‧‧‧ substrate 106‧‧‧Platform 110‧‧‧Slurry transport source 150‧‧‧Abrasive pad 152‧‧‧Abrasive surface 200‧‧‧Grinding device 210‧‧‧platform 211‧‧‧The first catheter 212‧‧‧Second catheter 214‧‧‧axis 216‧‧‧Platform board 218‧‧‧Installation surface 221‧‧‧ opening 222‧‧‧ opening 230‧‧‧Seal 232‧‧‧Seal surface 241‧‧‧ port 242‧‧‧ port 250‧‧‧Grinding pad 251‧‧‧channel 252‧‧‧channel 254‧‧‧Support surface 257‧‧‧ Center 260‧‧‧Base area 260i‧‧‧Initial base layer 270‧‧‧Abrasive area 271‧‧‧Grinding characteristics 274‧‧‧Abrasive surface 277‧‧‧ gap 300‧‧‧Grinding device 310‧‧‧platform 311‧‧‧Catheter 312‧‧‧Catheter 315‧‧‧Catheter 330‧‧‧Seal 341‧‧‧ port 342‧‧‧ port 345‧‧‧ port 350‧‧‧Grinding pad 351‧‧‧Internal passage 352‧‧‧External channel 355‧‧‧air chamber 357‧‧‧ Center 361‧‧‧Internal channel pressure sensor 362‧‧‧External channel pressure sensor 365‧‧‧Air chamber pressure sensor 371‧‧‧Internal grinding characteristics 372‧‧‧External grinding characteristics 375‧‧‧Air chamber grinding characteristics 380‧‧‧High voltage source 381‧‧‧Control valve 382‧‧‧Control valve 385‧‧‧Control valve 450‧‧‧Abrasive pad 451‧‧‧First grinding channel 452‧‧‧Second grinding channel 453‧‧‧The third grinding channel 457‧‧‧ Center 461‧‧‧Supply channel 471‧‧‧Adjustable grinding characteristics 472‧‧‧Fixed grinding characteristics 481‧‧‧First grinding surface 482‧‧‧Second grinding surface 500‧‧‧Grinding device 510‧‧‧platform 511‧‧‧Supply catheter 512‧‧‧Return catheter 521‧‧‧ opening 522‧‧‧ opening 530‧‧‧Seal 541‧‧‧ Supply port 550‧‧‧Abrasive pad 551‧‧‧channel 552‧‧‧channel 553‧‧‧channel 554‧‧‧channel 555‧‧‧channel 556‧‧‧channel 557‧‧‧ Center 559‧‧‧Outer ring 561‧‧‧Supply channel 562‧‧‧Return channel 571‧‧‧ grinding characteristics 574‧‧‧Abrasive surface 591‧‧‧ barrier layer 610‧‧‧platform 621‧‧‧Return catheter 622‧‧‧Return catheter 623‧‧‧Return catheter 624‧‧‧Return catheter 625‧‧‧Return catheter 626‧‧‧Return catheter 631‧‧‧Seal 632‧‧‧Seal 633‧‧‧Seal 634‧‧‧Seal 635‧‧‧Seal 636‧‧‧Seal 641‧‧‧Supply channel 641M‧‧‧Main supply channel 650‧‧‧Abrasive pad 651‧‧‧channel 651P‧‧‧port 651R‧‧‧Return channel 652‧‧‧channel 652P‧‧‧port 652R‧‧‧Return channel 653‧‧‧channel 653P‧‧‧port 653R‧‧‧Return channel 654‧‧‧channel 654P‧‧‧port 654R‧‧‧Return channel 655‧‧‧channel 655P‧‧‧port 655R‧‧‧Return channel 656‧‧‧ Outermost channel 656P‧‧‧port 656R‧‧‧Return channel 657‧‧‧ Center 659‧‧‧Outer ring 661‧‧‧Temperature sensor 662‧‧‧Temperature sensor 663‧‧‧Temperature sensor 664‧‧‧Temperature sensor 665‧‧‧Temperature sensor 666‧‧‧Temperature sensor 671‧‧‧Grinding characteristics 674‧‧‧Abrasive surface 680‧‧‧Coolant supply 681‧‧‧Control valve 682‧‧‧Control valve 683‧‧‧Control valve 684‧‧‧Control valve 685‧‧‧Control valve 686‧‧‧Control valve 690‧‧‧Control valve 691‧‧‧ barrier layer 750‧‧‧Abrasive pad 761‧‧‧Supply channel 765‧‧‧air chamber 771‧‧‧Grinding characteristics 774‧‧‧Abrasive surface 775‧‧‧Grinding feature channel 776‧‧‧ Orifice 850‧‧‧Abrasive pad 851‧‧‧First grinding channel 852‧‧‧Second grinding channel 853‧‧‧The third grinding channel 857‧‧‧Center 861‧‧‧ shared supply channel 871‧‧‧First grinding feature 872‧‧‧Second grinding characteristics 874‧‧‧Abrasive surface 875‧‧‧Grinding feature channel 876‧‧‧ Orifice 910‧‧‧Grinding characteristics 911‧‧‧ First side 912‧‧‧Second side 920‧‧‧ grinding characteristics 921‧‧‧ First side 922‧‧‧Second side 930‧‧‧Grinding characteristics 931‧‧‧ First side 932‧‧‧Second side 936‧‧‧ First size 937‧‧‧Second size 940‧‧‧Grinding characteristics 941‧‧‧ First side 942‧‧‧Second side 1000‧‧‧Process 1002‧‧‧ block 1004‧‧‧ block 1006‧‧‧ block 1008‧‧‧ block 1010‧‧‧ block 1210‧‧‧ section 1214‧‧‧separator 1215‧‧‧air chamber 1216‧‧‧Supply line 1218‧‧‧ port 1250‧‧‧Abrasive pad 1257‧‧‧ Center 1261‧‧‧Supply channel 1265‧‧‧air chamber 1271‧‧‧Grinding characteristics 1274‧‧‧Abrasive surface 1276‧‧‧ Orifice 1281‧‧‧Valve 1282‧‧‧Valve 1283‧‧‧Valve 1284‧‧‧Valve

In order to understand the above features of the present disclosure in detail, the present disclosure briefly summarized above can be described more specifically by referring to the embodiments, some of which are illustrated in the drawings. However, it will be noted that the drawings only illustrate typical embodiments of the present disclosure, and therefore will not be considered as limiting the scope of the present disclosure, because the present disclosure may recognize other equally effective embodiments.

Figure 1 is a side cross-sectional view of the CMP system.

Fig. 2 is a side cross-sectional view of a polishing device according to an embodiment.

FIG. 3A is a top plan view of a polishing pad according to an embodiment.

Figure 3B is a side cross-sectional view of the polishing pad of Figure 3A.

FIG. 4A is a top plan view of a polishing pad according to an embodiment.

Figure 4B is a side cross-sectional view of the polishing pad of Figure 4A.

FIG. 5A is a top plan view of a polishing pad according to an embodiment.

FIG. 5B is a side cross-sectional view of a polishing apparatus including the polishing pad of FIG. 5A according to an embodiment.

FIG. 6A is a top plan view illustrating the layout of internal channels of the polishing pad according to one embodiment. FIG. 6B is a partial side sectional view of the polishing apparatus including the polishing pad of FIG. 6A according to an embodiment.

Figure 7 is a side cross-sectional view of a polishing pad according to an embodiment.

Figure 8A is a top plan view of a polishing pad according to an embodiment.

Figure 8B is a side cross-sectional view of the polishing pad of Figure 8A.

Figures 9A-9H illustrate top and side views of polishing features that can be incorporated into different embodiments of polishing pads.

Figure 10 is a process flow diagram according to an embodiment.

Figure 11 is an exemplary polishing pad formed using the process of Figure 10.

FIG. 12A is a top cross-sectional view of a polishing pad according to an embodiment.

Figure 12B is a side cross-sectional view of the polishing pad of Figure 12A.

For ease of understanding, common words have been used when possible to designate the same elements shared in the drawings. It is envisaged that elements disclosed in one embodiment can be advantageously used in other embodiments without specific details.

Domestic storage information (please note in order of storage institution, date, number) no

Overseas hosting information (please note in order of hosting country, institution, date, number) no

200‧‧‧Grinding device

210‧‧‧platform

212‧‧‧Second catheter

214‧‧‧axis

216‧‧‧Platform board

218‧‧‧Installation surface

221‧‧‧ opening

222‧‧‧ opening

230‧‧‧Seal

241‧‧‧ port

242‧‧‧ port

250‧‧‧Grinding pad

251‧‧‧channel

252‧‧‧channel

254‧‧‧Support surface

257‧‧‧ Center

260‧‧‧Base area

270‧‧‧Abrasive area

271‧‧‧Grinding characteristics

274‧‧‧Abrasive surface

277‧‧‧ gap

Claims (19)

A method of forming a polishing pad, comprising the steps of: using an additive manufacturing system to form a substrate region of the polishing pad, the step of forming the substrate region includes continuously forming a plurality of substrate layers, wherein the plurality of substrate layers are formed The one or more substrate layers include depositing a first component material, depositing a support material, and curing at least the first component material, and the corresponding print heads of the plurality of print heads are used to deposit the first component material And the drip of the support material; and removing the support material from the abrasive pad to form one or more channels in an inner area thereof. A method of forming a polishing pad, comprising the steps of: using an additive manufacturing system to form a substrate region of the polishing pad, the step of forming the substrate region includes continuously forming a plurality of substrate layers, wherein the plurality of substrate layers are formed The one or more base layers include depositing a first component material, depositing a support material, and curing at least the first component material; and removing the support material from the polishing pad to form one or more in an inner region thereof Channels, wherein the support material is removed from the inner region of the polishing pad to further form one or more ports for fluidly coupling the one or more channels to a fluid source. The method of claim 1, wherein the support material comprises a polymer, a wax, a water-soluble material, or a combination thereof. A method of forming a polishing pad, comprising the steps of: using an additive manufacturing system to form a substrate region of the polishing pad, the step of forming the substrate region includes continuously forming a plurality of substrate layers, wherein the plurality of substrate layers are formed The one or more substrate layers include depositing a first component material, depositing a support material, and curing at least the first component material; removing the support material from the polishing pad to form one or more in an inner region thereof A channel; and using the additive manufacturing system to form a polishing area on the substrate area, the step of forming the polishing area includes continuously forming a plurality of polishing layers, wherein forming one or more polishing layers of the plurality of polishing layers includes Depositing a second component material on the first component material, and curing the second component material. The method according to claim 4, wherein the first component material and the second component material are the same. The method according to claim 4, wherein the first component material and the second component material are different. The method of claim 4, wherein one or both of the first component material and the second component material include an acrylate monomer, an acrylate oligomer, or a combination thereof. The method of claim 4, wherein forming the polishing region includes forming a plurality of polishing features, the one or more channels extend at least partially around a center of the polishing pad, each channel is fluidly coupled to a port, And at least some of the plurality of grinding features include a grinding feature channel that fluidly couples one of the one or more channels to a channel disposed through a grinding surface of the polishing pad Orifice. The method of claim 4, wherein forming the polishing region includes forming a plurality of polishing features, the plurality of polishing features including a fixed polishing feature and an adjustable polishing feature, and wherein one or more of the channels and At least some of the adjustable abrasive features are adjacently arranged. The method according to claim 9, wherein when the polishing pad When placed on a grinding platform, the adjustable grinding features are formed to move in response to pressure changes in the one or more channels. The method of claim 10, wherein when the one or more channels are not pressurized, the adjustable abrasive features are formed to be recessed relative to the fixed abrasive features. A method for forming a polishing pad, comprising the steps of: using an additive manufacturing system to form a base region of the polishing pad, the step of forming the base region includes continuously forming a plurality of base layers, wherein the plurality of base layers are formed The one or more base layers include depositing a first component material, depositing a support material, and curing at least the first component material; and removing the support material from the polishing pad to form one or more in an inner region thereof Channels in which removing the support material from the inner region of the polishing pad further forms one or more ports that extend from a corresponding opening in a support surface of the polishing pad to the one or Corresponding one of the multiple channels. The method of claim 12, wherein the one or more channels include a plurality of channels, each channel is fluidly coupled to a plurality of ports A corresponding port. A method for forming a polishing pad, comprising the steps of: using an additive manufacturing system to form a base region of the polishing pad, the step of forming the base region includes continuously forming a plurality of base layers, wherein the plurality of base layers are formed The one or more substrate layers include depositing a first component material, depositing a support material, and curing at least the first component material; removing the support material from the polishing pad to form one or more in an inner region thereof A channel; and using the additive manufacturing system to form a polishing region on the substrate region, the step of forming the polishing region includes continuously forming a plurality of polishing layers, wherein forming one or more polishing layers of the plurality of polishing layers includes A plurality of first grinding features and a plurality of second grinding features are formed, and a material composition used to form the first grinding features is different from a material composition used to form the second grinding features. The method of claim 14, wherein one or more of the channels are disposed adjacent to at least some of the first abrasive features such that when applied to the one or more channels Under pressure, at least some of the first abrasive features will extend More than this plurality of second grinding features. The method of claim 14, wherein the corresponding print heads of the plurality of print heads are used to deposit droplets composed of the materials used to form the corresponding first abrasive features and the second abrasive features. A method for forming a polishing pad, comprising the steps of: using an additive manufacturing system to form a base region of the polishing pad, the step of forming the base region includes continuously forming a plurality of base layers, wherein the plurality of base layers are formed The one or more substrate layers include depositing a first component material, depositing a support material, and curing at least the first component material; using the additive manufacturing system to form a polishing region on the substrate region, forming the polishing region The steps include continuously forming a plurality of abrasive layers, wherein forming one or more abrasive layers of the plurality of abrasive layers includes depositing a second component material and curing the second component material; and removing the support material from the abrasive pad To form one or more channels in one of its internal regions. The method of claim 17, wherein one or both of the first component material and the second component material include an acrylate monomer , Acrylate oligomer, or a combination thereof. The method according to claim 18, wherein the corresponding print heads of the plurality of print heads are used to deposit the drip of the constituent materials and the support material.

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