TW201607643A - Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads - Google Patents
Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads Download PDFInfo
- Publication number
- TW201607643A TW201607643A TW104117524A TW104117524A TW201607643A TW 201607643 A TW201607643 A TW 201607643A TW 104117524 A TW104117524 A TW 104117524A TW 104117524 A TW104117524 A TW 104117524A TW 201607643 A TW201607643 A TW 201607643A
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- layer
- polymer mixture
- polymer
- pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/04—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould
- B29C41/042—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould by rotating a mould around its axis of symmetry
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
本發明大體上係關於抛光墊。更具體言之,本發明係關於使用離心鑄造機鑄造聚合物抛光墊之方法及系統。 The present invention generally relates to polishing pads. More specifically, the present invention relates to a method and system for casting a polymer polishing pad using a centrifugal casting machine.
抛光(亦稱作平坦化)為通常用於半導體、硬碟驅動器及光學產品之製造中的製程步驟。抛光製程一般由抵靠著聚合物墊摩擦基板組成,或反之亦然。通常含有精細粒子之化學溶液(漿料)存在於基板與聚合物墊之間的界面處。 Polishing (also known as planarization) is a process step commonly used in the manufacture of semiconductors, hard disk drives, and optical products. The polishing process typically consists of rubbing the substrate against a polymer mat, or vice versa. A chemical solution (slurry) usually containing fine particles is present at the interface between the substrate and the polymer mat.
提供一種方法,其包括使模具圍繞軸線旋轉。該模具限制至少包括高密度材料及低密度材料之聚合物混合物。該方法亦包括在離心力之影響下將該聚合物混合物分離成包括該高密度材料之第一層及包括該低密度材料之第二層。該模具包括圓筒,且該軸線為該圓筒之中心軸線。在一些實施例中,該圓筒包括經調適以旋轉之離心鑄造機。該離心鑄造機界定圓筒形內部空間。 A method is provided that includes rotating a mold about an axis. The mold limits at least a polymer mixture comprising a high density material and a low density material. The method also includes separating the polymer mixture into a first layer comprising the high density material and a second layer comprising the low density material under the influence of centrifugal force. The mold includes a cylinder and the axis is the central axis of the cylinder. In some embodiments, the cylinder includes a centrifugal casting machine adapted to rotate. The centrifugal casting machine defines a cylindrical interior space.
該方法視情況包括在該聚合物混合物已分離且反應之後形成包括至少兩個相異層的多層抛光墊。該第一層經調適以用作該多層抛光墊之抛光墊,且該第二層經調適以用作該多層抛光墊之次墊。該低密度材料包括圍封氣體之微球體。 The method optionally includes forming a multilayer polishing pad comprising at least two distinct layers after the polymer mixture has been separated and reacted. The first layer is adapted to serve as a polishing pad for the multilayer polishing pad, and the second layer is adapted to serve as a secondary pad for the multilayer polishing pad. The low density material comprises microspheres enclosing the gas.
在一些實施例中,該方法包括將第二聚合物混合物引入至該模具中且進一步旋轉該模具。該第二聚合物混合物包括單一密度材料或至少包括第二高密度材料及第二低密度材料。若該第二聚合物混合物為單一密度材料,則其可比第一或第二層中之任一者(個別或組合)硬、軟、厚或薄。由第二聚合物混合物形成之層可充當抛光表面或次墊。在進一步旋轉操作期間,第二聚合物混合物在離心力之影響下分離成包括第二高密度材料之第三層及包括第二低密度材料之第四層。 第三層插入於第二層與第四層之間。第二低密度材料包括圍封氣體之微球體。 In some embodiments, the method includes introducing a second polymer mixture into the mold and further rotating the mold. The second polymer mixture comprises a single density material or at least a second high density material and a second low density material. If the second polymer mixture is a single density material, it can be harder, softer, thicker or thinner than any of the first or second layers (individually or in combination). The layer formed from the second polymer mixture can act as a polished surface or secondary mat. During a further spinning operation, the second polymer mixture separates into a third layer comprising a second high density material and a fourth layer comprising a second low density material under the influence of centrifugal force. The third layer is interposed between the second layer and the fourth layer. The second low density material comprises microspheres enclosing the gas.
在一些實施例中,該方法包括在將第二聚合物混合物引入至模具中之前將聚酯、紡織物或導電材料之層置放在第二層上以在第二層之頂部上形成額外層。該方法可包括在將第二聚合物混合物引入至模具中之前將液體噴灑至第二層之表面上。該液體為黏著劑及/或導電層。或者,聚酯、紡織物或導電材料之層置放於第二層上。在此步驟之前可將液體施配於第二層之表面上。不添加額外層。 In some embodiments, the method includes placing a layer of polyester, textile, or conductive material on the second layer to form an additional layer on top of the second layer prior to introducing the second polymer mixture into the mold. . The method can include spraying the liquid onto the surface of the second layer prior to introducing the second polymer mixture into the mold. The liquid is an adhesive and/or a conductive layer. Alternatively, a layer of polyester, woven or electrically conductive material is placed on the second layer. The liquid can be applied to the surface of the second layer prior to this step. Do not add extra layers.
施配器經調適以將聚合物混合物引入至離心鑄造機中。該方法視情況包括在旋轉之至少一部分時間期間加熱模具。該方法視情況包括在將聚合物混合物施配至模具中之前使用脫模劑處理模具之表面。 The dispenser is adapted to introduce the polymer mixture into a centrifugal casting machine. The method optionally includes heating the mold during at least a portion of the time of the rotation. The method optionally includes treating the surface of the mold with a release agent prior to dispensing the polymer mixture into the mold.
在一些實施例中,該方法包括於模具之表面上形成紋理及/或使用襯墊或插件。該襯墊或插件將含有紋理。置放於模具之表面上之襯墊或插件稱作底部襯墊或插件。另外,第二襯墊或插件可在聚合物混合物已施加至模具及/或底部襯墊或插件之後安置於模具中。此第二襯墊或插件稱作頂部襯墊或插件。該等襯墊或插件之紋理經調適以於該多層抛光墊之工作表面上形成凹槽紋理,形成勾劃該多層抛光墊之外緣的穿孔,及/或在與該工作表面相對置之墊表面的背面上形成粗糙化紋理以改良該墊表面與黏著劑及/或次墊之間的黏著力。 In some embodiments, the method includes forming a texture on the surface of the mold and/or using a liner or insert. The pad or insert will contain texture. The liner or insert placed on the surface of the mold is referred to as a bottom liner or insert. Additionally, the second liner or insert can be placed in the mold after the polymer mixture has been applied to the mold and/or the bottom liner or insert. This second liner or insert is referred to as a top liner or insert. The texture of the liner or insert is adapted to form a groove texture on the working surface of the multilayer polishing pad to form a perforation that delineates the outer edge of the multilayer polishing pad, and/or a pad opposite the working surface A roughened texture is formed on the back side of the surface to improve the adhesion between the pad surface and the adhesive and/or secondary pad.
該方法包括在將聚合物混合物引入至模具中之前在模具之表面上安置至少一個窗口。 The method includes positioning at least one window on a surface of the mold prior to introducing the polymer mixture into the mold.
提供用於製造多層抛光墊之系統。該系統包括具有旋轉軸線之模具。模具之底部表面上之實質上所有點在圍繞旋轉軸線旋轉的整個過程中距離該旋轉軸線為實質上等距的。模具經調適以當該模具在旋轉時限制聚合物混合物。該系統進一步包括經調適以將聚合物混合物引入至模具中之施配器。 A system for making a multilayer polishing pad is provided. The system includes a mold having an axis of rotation. Substantially all points on the bottom surface of the mold are substantially equidistant from the axis of rotation throughout the rotation about the axis of rotation. The mold is adapted to limit the polymer mixture as the mold is rotating. The system further includes a dispenser adapted to introduce the polymer mixture into the mold.
視情況,該系統包括可沿著中心軸線插入之心軸,該心軸用於將固體插件安置於內部空間中之聚合物混合物之頂層的表面上。該固體插件為聚酯、紡織物、導電材料及/或頂部襯墊用於賦予聚合物混合物之表面以紋理。 Optionally, the system includes a mandrel insertable along a central axis for positioning the solid insert on the surface of the top layer of the polymer mixture in the interior space. The solid insert is a polyester, woven, electrically conductive material and/or top liner for imparting texture to the surface of the polymer mixture.
該系統包括用於將液體噴灑至模具之內部中的噴霧器。該液體為脫模劑、黏著劑,及/或導電層。 The system includes a sprayer for spraying liquid into the interior of the mold. The liquid is a release agent, an adhesive, and/or a conductive layer.
在一些實施例中,該系統包括加熱器用於在聚合物混合物之旋轉及反應之至少一部分時間期間加熱模具。 In some embodiments, the system includes a heater for heating the mold during at least a portion of the rotation of the polymer mixture and the reaction.
100‧‧‧旋轉鑄造系統 100‧‧‧Rotary casting system
102‧‧‧離心鑄造機 102‧‧‧Centrifugal casting machine
104‧‧‧聚合物施配器 104‧‧‧Polymer dispenser
106‧‧‧聚合物混合物 106‧‧‧ polymer mixture
108‧‧‧澆注路徑 108‧‧‧ pouring path
110‧‧‧滾筒 110‧‧‧Roller
112‧‧‧軸線 112‧‧‧ axis
114‧‧‧旋轉方向 114‧‧‧Rotation direction
116‧‧‧聚合物薄片 116‧‧‧Polymer sheets
200‧‧‧軟聚合物層 200‧‧‧Soft polymer layer
202‧‧‧緻密聚合物層 202‧‧‧Dense polymer layer
300‧‧‧插件 300‧‧‧ plugin
400‧‧‧聚合物墊 400‧‧‧ polymer mat
402‧‧‧次墊 402‧‧‧ times mat
404‧‧‧硬墊 404‧‧‧ Hard mat
500‧‧‧內部插件 500‧‧‧Internal plugin
600‧‧‧模具插件 600‧‧‧Mold inserts
700‧‧‧窗口 700‧‧‧ window
800‧‧‧多軸線鑄造系統 800‧‧‧Multi-axis casting system
802‧‧‧鑄造模具 802‧‧‧ casting mold
804‧‧‧頂部模具零件 804‧‧‧Top mold parts
806‧‧‧底部模具零件 806‧‧‧Bottom mold parts
808‧‧‧聚合物混合物 808‧‧‧ polymer mixture
810‧‧‧內部空間 810‧‧‧Internal space
812‧‧‧軸線 812‧‧‧ axis
814‧‧‧方向 814‧‧‧ Direction
816‧‧‧軸線 816‧‧‧ axis
818‧‧‧方向 818‧‧‧ directions
900‧‧‧方法 900‧‧‧ method
902‧‧‧操作 902‧‧‧ operation
904‧‧‧操作 904‧‧‧ operation
906‧‧‧操作 906‧‧‧ operation
908‧‧‧操作 908‧‧‧ operation
910‧‧‧操作 910‧‧‧ operation
1000‧‧‧方法 1000‧‧‧ method
1002‧‧‧操作 1002‧‧‧ operation
1004‧‧‧操作 1004‧‧‧ operation
1006‧‧‧操作 1006‧‧‧ operation
1008‧‧‧操作 1008‧‧‧ operation
1010‧‧‧操作 1010‧‧‧ operation
1012‧‧‧操作 1012‧‧‧ operation
圖1為根據一例示性實施例說明離心鑄造系統的截面示意圖。 1 is a schematic cross-sectional view illustrating a centrifugal casting system in accordance with an illustrative embodiment.
圖2為根據一例示性實施例說明在例示性聚合物混合物已發生相分離且已形成兩個相異的層之後圖1中所示之離心鑄造機的截面示意圖。 2 is a schematic cross-sectional view of the centrifugal casting machine shown in FIG. 1 after an exemplary polymer mixture has undergone phase separation and two distinct layers have been formed, in accordance with an illustrative embodiment.
圖3為根據一例示性實施例說明圖2中所示之例示性離心鑄造機的截面且展示例示性底部襯墊或插件及聚胺基甲酸酯鑄造的示意圖。 3 is a schematic illustration of a cross section of an exemplary centrifugal casting machine shown in FIG. 2 and showing an exemplary bottom liner or insert and polyurethane casting, in accordance with an illustrative embodiment.
圖4為根據一例示性實施例說明例示性多層聚合物墊之截面的示意圖。 4 is a schematic diagram illustrating a cross section of an exemplary multilayer polymer pad, in accordance with an illustrative embodiment.
圖5為根據一例示性實施例說明例示性離心鑄造機之截面且展示頂部襯墊或插件及聚胺基甲酸酯鑄造的示意圖。 5 is a schematic diagram illustrating a cross section of an exemplary centrifugal casting machine and showing a top liner or insert and polyurethane casting, in accordance with an illustrative embodiment.
圖6為根據一例示性實施例說明具有內襯於例示性離心鑄造機之例示性滾筒之內壁的例示性模具插件(底部襯墊/插件)之離心鑄造系統的截面示意圖。 6 is a cross-sectional view illustrating a centrifugal casting system of an exemplary mold insert (bottom liner/insert) having an inner wall of an exemplary drum lined to an exemplary centrifugal casting machine, in accordance with an illustrative embodiment.
圖7為根據一例示性實施例說明例示性滾筒之截面且展示例示性模具插件及窗口的示意圖。 7 is a schematic diagram illustrating a cross section of an exemplary roller and showing an exemplary mold insert and window, in accordance with an illustrative embodiment.
圖8為根據一例示性實施例說明包括例示性離心鑄造機之例示性旋轉鑄造系統的示意圖。 FIG. 8 is a schematic diagram illustrating an exemplary rotary casting system including an exemplary centrifugal casting machine, in accordance with an illustrative embodiment.
圖9為根據一例示性實施例說明用於製備多層抛光墊之例示性方法的流程圖。 9 is a flow chart illustrating an exemplary method for making a multilayer polishing pad, in accordance with an illustrative embodiment.
圖10為根據一例示性實施例說明用於製備多層抛光墊之替代性例示性方法的流程圖。 FIG. 10 is a flow chart illustrating an alternative exemplary method for making a multilayer polishing pad, in accordance with an illustrative embodiment.
雖然本發明可具有許多不同形式之實施例,但本發明於圖式中展示且本文中將詳細描述若干具體實施例,應瞭解本發明揭示內容應視為本發明原理的例證,且不欲使本發明限於所說明之實施例。根據例示性實施例,本發明技術大體上係關於抛光墊。更具體言之,本發明提供用於製備固體多層聚合物抛光墊之方法。 While the invention may be embodied in a variety of different embodiments, the embodiments of the present invention The invention is limited to the illustrated embodiments. In accordance with an illustrative embodiment, the present technology is generally directed to polishing pads. More specifically, the present invention provides a method for preparing a solid multilayer polymeric polishing pad.
半導體工業內之抛光稱作化學機械平坦化(CMP)。用於CMP之聚合物抛光墊通常使用閉孔聚胺基甲酸酯材料或發泡聚胺基甲酸酯,而用於CMP之一些抛光墊採用開孔聚胺基甲酸酯材料。另外,可利用浸漬一或多種聚合物與研磨劑之組合的纖維。該等墊之表面可含有微紋理。該微紋理係關係到該墊之抛光效能。微紋理由調節製程維持。此固有微結構中之不一致性導致該墊之抛光效能的偏差。出於此原因,墊製造商已努力優化墊製造製程以減小其產品之偏差。相比而言,固體聚合物抛光墊不含有固有微結構,而是在使用期間依賴於調節製程以賦予該墊表面以微紋理。就與習知調節製程的相容性而言,用於固 體聚合物墊之配方為關鍵的。 Polishing in the semiconductor industry is referred to as chemical mechanical planarization (CMP). Polymer polishing pads for CMP typically use closed cell polyurethane materials or foamed polyurethanes, while some polishing pads for CMP use open cell polyurethane materials. Additionally, fibers impregnated with one or more polymers in combination with an abrasive can be utilized. The surface of the pads may contain microtexture. The microtexture is related to the polishing performance of the pad. The microtexture is maintained by the adjustment process. The inconsistency in this intrinsic microstructure results in a deviation in the polishing performance of the pad. For this reason, pad manufacturers have sought to optimize the pad manufacturing process to reduce variations in their products. In contrast, a solid polymer polishing pad does not contain an intrinsic microstructure, but rather relies on an adjustment process during use to impart a microtexture to the pad surface. For compatibility with conventional conditioning processes, for solids The formulation of the bulk polymer mat is critical.
聚合物墊通常包括單層固體聚合物材料或堆疊於彼此之上的多層固體聚合物材料。或者,可使用一些非固體層。該等層使用黏著劑彼此黏結。抛光之層稱作抛光層、頂部墊或墊表面。頂部墊材料自身通常基於聚胺基甲酸酯,但如前所述的寬泛範圍之其他抛光墊材料亦為可行的。可於聚合物抛光墊之抛光表面上提供流動通道。此等流動通道具有許多功能,但主要用於改良漿料流動以確保聚合物抛光墊之所有區域上均存在漿料。流動通道亦在抛光製程期間產生較高接觸壓力,該接觸壓力可增加基板之抛光或平坦化的速率。此外,可在抛光步驟已完成之後使用流動通道來促進墊沖洗。此等流動通道可視為於抛光墊上之巨型紋理。通常在使用聚合物抛光墊之前施加巨型紋理。 Polymer mats typically comprise a single layer of solid polymeric material or a multilayer solid polymeric material stacked on top of one another. Alternatively, some non-solid layers can be used. The layers are bonded to each other using an adhesive. The polished layer is referred to as a polishing layer, a top pad or a pad surface. The top pad material itself is typically based on polyurethanes, but other polishing pad materials in a wide range as previously described are also feasible. A flow channel can be provided on the polished surface of the polymeric polishing pad. These flow channels have many functions, but are primarily used to improve slurry flow to ensure that slurry is present on all areas of the polymer polishing pad. The flow channel also produces a higher contact pressure during the polishing process that increases the rate at which the substrate is polished or planarized. Additionally, flow channels can be used to facilitate pad flushing after the polishing step has been completed. These flow channels can be considered as giant textures on the polishing pad. Giant textures are typically applied prior to the use of a polymeric polishing pad.
在抛光製程期間,或在基板抛光之間,於聚合物抛光墊之表面上形成微紋理。形成此微紋理之方法通常稱作調節。藉由以此高頻率調節墊表面,聚合物墊表面上維持一致的微紋理為可能的。此對於維持一致的抛光效能至關重要,此係因為微紋理為聚合物墊表面與基板之間的漿料形成微型流動通道。在抛光期間,前面提及之流動通道與微紋理形成共生關係以確保在抛光期間良好的流體動力學。 Microtexture is formed on the surface of the polymer polishing pad during the polishing process, or between substrate polishing. The method of forming this microtexture is often referred to as conditioning. By adjusting the pad surface at this high frequency, it is possible to maintain a consistent microtexture on the surface of the polymer pad. This is critical to maintaining consistent polishing performance because the microtexture forms a micro flow channel for the slurry between the polymer mat surface and the substrate. During polishing, the previously mentioned flow channels form a symbiotic relationship with the microtexture to ensure good fluid dynamics during polishing.
通常使用金剛石調節器執行聚合物抛光墊之調節。更改金剛石尺寸、形狀、密度及突起程度以產生不同金剛石調節器能力。 Adjustment of the polymer polishing pad is typically performed using a diamond adjuster. The diamond size, shape, density, and degree of protrusion are varied to produce different diamond regulator capabilities.
習知頂部墊閉孔材料製造製程採用以下製程中之一者:(1)熱塑性射出模製;(2)熱固性射出模製(通常稱作「反應射出模製」或「RIM」);(3)熱塑性或熱固性射出吹塑;(4)壓縮模製;及(5)其中安置且凝固材料之類似製程。該等方法描述為使用封閉式鑄造系統。 The conventional top pad closed cell material manufacturing process employs one of the following processes: (1) thermoplastic injection molding; (2) thermoset injection molding (commonly referred to as "reaction injection molding" or "RIM"); Thermoplastic or thermoset injection blow molding; (4) compression molding; and (5) a similar process in which the material is placed and solidified. These methods are described as using a closed casting system.
離心鑄造涉及將液體澆注至圍繞其對稱軸旋轉之圓筒形模具中。保持該模具旋轉直至材料已凝固。本發明技術提供用以製造聚合物抛光墊之離心鑄造機的使用。離心鑄造機描述為開放鑄造方法。 Centrifugal casting involves pouring a liquid into a cylindrical mold that rotates about its axis of symmetry. Keep the mold rotated until the material has solidified. The present technology provides for the use of a centrifugal casting machine for making polymeric polishing pads. Centrifugal casting machines are described as open casting methods.
離心鑄造技術用於製造鐵管、套管、車輪,及具有軸對稱性之其他零件。在金屬之離心鑄造中,當澆注熔融金屬時,永久性模具以高速度圍繞其軸線旋轉(300至3000RPM)。熔融金屬經離心式拋向內部模具壁,在此其在冷卻後凝固。可使用此方法鑄造之典型金屬材料為鐵、鋼、不鏽鋼及鋁、銅及鎳之合金。 Centrifugal casting technology is used to make iron pipes, bushings, wheels, and other parts with axial symmetry. In centrifugal casting of metal, when casting molten metal, the permanent mold rotates around its axis at a high speed (300 to 3000 RPM). The molten metal is centrifugally thrown toward the inner mold wall where it solidifies upon cooling. Typical metal materials that can be cast using this method are iron, steel, stainless steel, and alloys of aluminum, copper, and nickel.
離心鑄造亦可用於聚合物零件之製造。舉例而言,用於特殊應用之聚胺基甲酸酯同步帶使用離心鑄造生產。該等帶具有特殊塗層及增強以適合特定傳輸應用。該等帶經一體式模製,且使用離心鑄造方法及高效能聚胺基甲酸酯形成。帶具有埋置鋼、Kevlar®、聚酯、不鏽鋼或玻璃纖維增強。帶與線性驅動一起用於如封裝、分選及裝配機之應用中。 Centrifugal casting can also be used in the manufacture of polymer parts. For example, polyurethane caskets for special applications are produced using centrifugal casting. These belts have special coatings and reinforcements to suit specific transmission applications. The belts are integrally molded and formed using a centrifugal casting process and high performance polyurethane. The belt is reinforced with embedded steel, Kevlar®, polyester, stainless steel or fiberglass. The belt is used with linear drives in applications such as packaging, sorting and assembly machines.
製造聚合物抛光墊所需之原材料的準備需要有效控制以確保輸入至混合物的原材料比率一致。原材料需要在混合之前各別地加熱。 另外,原材料較佳經澈底混合以產生在混合物內之均勻分散。視使用中之混合技術而定,材料在混合時可發泡。可使混合物穿過系統以消除泡沫(但此製程不應與如下文所論述之將發泡體添加至聚合物混合物相混淆)。材料接著需要轉移至模具以用於反應。當混合物之適用期(亦即,直至聚合物凝固之時間)較短時,此製程可進一步複雜化。 若超過適用期,則混合物接著將開始膠凝,且可能不再成形為所需之形狀。 The preparation of the raw materials required to make the polymer polishing pad requires effective control to ensure a consistent ratio of raw materials input to the mixture. The raw materials need to be heated separately before mixing. Additionally, the starting materials are preferably mixed at the base to produce a uniform dispersion within the mixture. Depending on the mixing technique in use, the material foams when mixed. The mixture can be passed through the system to eliminate foam (but this process should not be confused with the addition of the foam to the polymer mixture as discussed below). The material then needs to be transferred to a mold for the reaction. This process can be further complicated when the pot life of the mixture (i.e., the time until the polymer solidifies) is short. If the pot life is exceeded, the mixture will then begin to gel and may no longer be formed into the desired shape.
反應的聚合化合物在已與反應的引發劑混合之後保持適合於其預期用途期間之時段為「適用期」。膠凝點(或膠凝時間)係指液體開始展現偽彈性特性之階段。在聚胺基甲酸酯已膠凝(亦稱為已反應)之後,材料可充分凝固以自模具或離心機(若存在)移除,但仍保持其形狀。 The period of time during which the reacted polymeric compound remains in its intended use after it has been mixed with the reacting initiator is a "pot life". The gel point (or gel time) is the stage at which the liquid begins to exhibit pseudoelastic properties. After the polyurethane has gelled (also referred to as reacted), the material can be sufficiently solidified to be removed from the mold or centrifuge (if present), but still retain its shape.
為了形成固體聚合物抛光墊,此製程具有防止在固體層中形成 孔隙之額外問題。當適用期較短時,此特別地困難。此通常意謂使用習知封閉式鑄造系統來製備此種固體聚合物抛光墊伴隨有許多限制,且在一些情況下不能使用此種封閉式鑄造系統。舉例而言,材料厚度通常需要比允許之抛光墊厚許多以便確保混合物可填充鑄件。此由於增加了廢料而增加了墊製造製程的經濟負擔。模製製程之產量可受到生產之密封窗口的影響,且產量之損失亦增加了墊製造製程的經濟負擔。由於用於生產之密封窗口,亦可見在材料中形成不一致性。 To form a solid polymer polishing pad, this process has the effect of preventing formation in a solid layer Additional problems with pores. This is particularly difficult when the pot life is short. This generally means that the use of conventional closed casting systems to make such solid polymer polishing pads is accompanied by a number of limitations, and in some cases such closed casting systems cannot be used. For example, the material thickness typically needs to be much thicker than the allowed polishing pad to ensure that the mixture can fill the casting. This increases the economic burden of the pad manufacturing process due to the increased waste. The throughput of the molding process can be affected by the production of a sealed window, and the loss of production also increases the economic burden of the pad manufacturing process. Due to the sealed window used for production, it is also seen that inconsistencies are formed in the material.
根據本發明技術,固體聚合物抛光墊使用離心鑄造生產。此製程涉及將聚合物混合物(其為液體)引入至大型旋轉滾筒中。離心力推動聚合物混合物抵靠著滾筒之內表面,且當聚合物混合物反應且變為固體時,獲得矩形固體聚合物帶。當將聚合物混合物引入至離心鑄造機之旋轉滾筒中時,聚合物混合物材料成扇形射出且黏附至滾筒之壁。當聚合物混合物已反應且凝固時,在大部分材料截面上實質上不存在孔隙。存在之任何孔隙將被隔離至與滾筒之內壁相對置或相距最遠的薄片表面,且因此容易在形成、準備及/或調節期間消除。 In accordance with the teachings of the present invention, solid polymer polishing pads are produced using centrifugal casting. This process involves introducing a polymer mixture, which is a liquid, into a large rotating drum. The centrifugal force pushes the polymer mixture against the inner surface of the drum, and when the polymer mixture reacts and becomes solid, a rectangular solid polymer band is obtained. When the polymer mixture is introduced into a rotating drum of a centrifugal casting machine, the polymer mixture material is fanned out and adhered to the wall of the drum. When the polymer mixture has reacted and solidified, there is substantially no porosity in the cross section of most of the material. Any voids present will be isolated to the surface of the sheet that is opposite or furthest from the inner wall of the drum and is therefore easily eliminated during formation, preparation and/or conditioning.
製備固體聚合物薄片之離心鑄造能夠製造不含空隙之抛光墊。 另外,可調節該製程以確保材料之總厚度偏差(TTV)將為極小的。可視所需之墊特徵及所使用之聚合物混合物類型而更改用於製備抛光墊之離心鑄造機的溫度及速度(轉/分鐘,或RPM)。 Centrifugal casting to prepare solid polymer sheets enables the production of void-free polishing pads. In addition, the process can be adjusted to ensure that the total thickness deviation (TTV) of the material will be minimal. The temperature and speed (rpm, or RPM) of the centrifugal casting machine used to prepare the polishing pad can be varied depending on the desired pad characteristics and the type of polymer mixture used.
本文中所提供之離心鑄造系統及方法允許形成具有低TTV之固體聚合物薄片。聚合物(例如聚胺基甲酸酯)薄片可容易地轉化成不存在空隙或孔隙之固體聚合物抛光墊。 The centrifugal casting systems and methods provided herein allow for the formation of solid polymer sheets with low TTV. The polymer (e.g., polyurethane) flakes can be readily converted into a solid polymer polishing pad in the absence of voids or voids.
本文中所提供之離心鑄造方法確保使用相分離在離心鑄造系統中形成具有固體層及多孔層(具有經緻密裝填之微球體)之多層抛光墊。當混合物含有填充劑、研磨劑及/或纖維時,可誘發相分離。微球體通常為塑膠且尺寸不同,可膨脹或不可膨脹,具有圍封之氣體或 發泡劑,及/或為實心或中空的。 The centrifugal casting process provided herein ensures the use of phase separation to form a multilayer polishing pad having a solid layer and a porous layer (with densely packed microspheres) in a centrifugal casting system. Phase separation can be induced when the mixture contains fillers, abrasives, and/or fibers. Microspheres are usually plastic and vary in size, swellable or non-swellable, with enclosed gas or A blowing agent, and/or solid or hollow.
本發明技術能夠藉由在各層之間添加黏著劑(例如,壓敏性黏著劑)形成具有不同聚合物配方的多層抛光墊。此外,可使用本發明技術在聚合物薄片中誘發預定或所需之各向異性鏈結構。 The present technology enables the formation of multilayer polishing pads having different polymer formulations by the addition of an adhesive (e.g., a pressure sensitive adhesive) between the layers. In addition, a predetermined or desired anisotropic chain structure can be induced in the polymer sheet using the techniques of the present invention.
抛光墊(或次墊)之多孔層有利於抛光,此係由於來自經緻密裝填之孔隙的材料壓縮性。另外,閉孔孔隙結構防止製程流體芯吸至次墊中,此可影響抛光效能。 The porous layer of the polishing pad (or secondary pad) facilitates polishing due to the compressibility of the material from the densely packed pores. In addition, the closed cell pore structure prevents the process fluid from wicking into the secondary pad, which can affect polishing performance.
鑄造機之內表面為光滑的,或替代地使用紋理對抛光墊之工作表面添加凹槽或通道,及/或以改良用於抛光墊構造中之黏著劑的效能。可在鑄造製程期間或之後對抛光墊添加凹槽,且可於對置鑄造機之壁形成的表面上形成凹槽。凹槽在CMP操作期間之抛光墊使用期間可用於促進漿料之流動。在例示性實施例中,形成具有多個層之墊,接著經由開槽製程於凹槽區域中顯露此等層中之一些或所有。舉例而言,凹槽在凹槽底部處顯露不同結構,該凹槽底部不同於凹槽側面及頂層。在一些情形中,在凹槽之底部處的新曝露之層可能較硬、較軟,及/或具有孔隙以促進漿料流動。利用不同之凹槽截面形狀、凹槽中曝露之不同材料層,及/或不同之凹槽幾何形狀(例如,螺旋形或x-y圖案)以影響漿料之流動及/或以更改抛光墊之移除速率。 The inner surface of the casting machine is smooth, or alternatively a texture is used to add grooves or channels to the working surface of the polishing pad, and/or to improve the effectiveness of the adhesive used in the polishing pad construction. Grooves may be added to the polishing pad during or after the casting process, and grooves may be formed on the surface formed by the walls of the opposing casting machine. The grooves can be used to promote flow of the slurry during use of the polishing pad during CMP operations. In an exemplary embodiment, a pad having a plurality of layers is formed, and then some or all of the layers are exposed in the groove region via a grooving process. For example, the groove reveals a different structure at the bottom of the groove, the bottom of the groove being different from the side and top of the groove. In some cases, the newly exposed layer at the bottom of the groove may be harder, softer, and/or have pores to promote slurry flow. Utilizing different groove cross-sectional shapes, different layers of material exposed in the grooves, and/or different groove geometries (eg, spiral or xy patterns) to affect the flow of the slurry and/or to modify the polishing pad movement In addition to the rate.
離心鑄造期間之加熱由圍繞或鄰近於鑄造滾筒之加熱元件執行,該等加熱元件加熱滾筒及/或滾筒中之空氣。通常,在引入聚合物混合物之前預加熱滾筒。亦可在鑄造操作期間實施額外製程以改良產品效能。 Heating during centrifugal casting is performed by heating elements surrounding or adjacent to the casting drum, which heat the air in the drum and/or drum. Typically, the drum is preheated prior to introduction of the polymer mixture. Additional processes can also be implemented during the casting operation to improve product performance.
墊材料中微紋理的存在增強抛光墊之抛光效能。此微紋理應在墊材料內為一致的以防止不一致的抛光效能。固體墊依賴於在鑄造或調節期間引入之微紋理。若墊材料中存在孔隙,則此產生增加水準之抛光速率。在一些情形中,此增加水準之抛光速率為不可持續的,此 係因為孔隙並非始終如一地存在於層中。出於此原因,固體抛光墊含有很少或不含有孔隙至關重要。努力製造不具有孔隙之固體聚合物墊在很大程度上為無效的。相比之下,離心鑄造機之使用克服了關於聚合物混合物之問題,同時確保聚合物薄片無空隙,即使在短適用期聚合物混合物的情況下亦如此。離心鑄造機減少或消除聚合物薄片中之孔隙或空隙,此係因為離心力驅使聚合物混合物材料至鑄造機之內壁,而任何孔隙或空隙轉移至對置之表面,此係因為孔隙或空隙比聚合物混合物輕。 The presence of microtexture in the mat material enhances the polishing performance of the polishing pad. This microtexture should be uniform within the mat material to prevent inconsistent polishing performance. Solid mats rely on microtextures introduced during casting or conditioning. If there are voids in the mat material, this results in an increased level of polishing rate. In some cases, this increased level of polishing rate is unsustainable, this Because the pores are not always present in the layer. For this reason, solid polishing pads are critical for containing little or no pores. Efforts to fabricate solid polymer mats without voids are largely ineffective. In contrast, the use of centrifugal casting machines overcomes the problems associated with polymer blends while ensuring that the polymer sheets are void-free, even in the case of short pot life polymer blends. The centrifugal casting machine reduces or eliminates voids or voids in the polymer sheet because the centrifugal force drives the polymer mixture material to the inner wall of the casting machine, and any pores or voids are transferred to the opposite surface because of the porosity or void ratio. The polymer mixture is light.
在鑄造期間,氣泡及/或孔隙在聚合物硬化期間轉移至表面,且可在硬化之後保留於表面上。此等氣泡及/或孔隙可藉由帶之內部表面來移除,內部表面用作抛光墊之工作表面。此薄化通常需要移除1/1000吋至4/1000吋,或替代地多達15/1000吋。 During casting, the bubbles and/or pores are transferred to the surface during hardening of the polymer and may remain on the surface after hardening. These bubbles and/or voids may be removed by the inner surface of the belt, which serves as the working surface of the polishing pad. This thinning typically requires removal of 1/1000 inch to 4/1000 inch, or alternatively up to 15/1000 inch.
固體聚合物薄片之離心鑄造提供出人意料之益處:產生格外平坦之聚合物薄片。極度平坦度降低了薄化之要求,且因此避免原料之損失以及薄化之時間及費用。另外,該技術減少或消除聚合物鑄造件中之孔隙,此係因為聚合物混合物因離心力轉移至滾筒表面,而孔隙並不轉移且因此被壓出聚合物混合物。實質上不存在孔隙自最初使用至最終使用提供一致的抛光墊(亦稱作CMP墊,但本發明涵蓋替代性抛光應用)。通常,抛光墊為80/1000吋厚或更薄,且當使用該墊時,歸因於調節製程及在使用期間之磨損,其變得更薄。 Centrifugal casting of solid polymer sheets provides the unexpected benefit of producing an exceptionally flat polymer sheet. Extreme flatness reduces the need for thinning and thus avoids the loss of raw materials and the time and expense of thinning. In addition, this technique reduces or eliminates voids in the polymer casting because the polymer mixture is transferred to the drum surface by centrifugal force, and the pores are not transferred and are thus extruded out of the polymer mixture. Substantially no voids provide a consistent polishing pad (also known as a CMP pad from initial use to end use, but the present invention encompasses alternative polishing applications). Typically, the polishing pad is 80/1000 吋 thick or thinner, and when used, it becomes thinner due to the conditioning process and wear during use.
由離心鑄造形成之聚合物抛光墊實質上或完全不含孔隙或空隙,且實質上厚度均一。聚合物薄片使用短適用期混合物形成,同時亦實質上或完全不含孔隙。因此,利用本發明技術達成高製造產量。 The polymeric polishing pad formed by centrifugal casting is substantially or completely free of voids or voids and is substantially uniform in thickness. The polymer sheets are formed using a short pot life mixture while also being substantially or completely free of voids. Thus, high manufacturing yields are achieved using the techniques of the present invention.
習知CMP墊製造可包括形成經切片之固體聚合物餅或錠,此需要自頂部至底部實質上均一,該要求為困難的。相比而言,在根據本發明技術之使用離心鑄造的例示性方法中,產生之固體聚合物極其平 坦且僅比墊之最終厚度厚出最小厚度。產生之極大型帶可用於藉由任何合適之方法進行切割或衝壓製備許多頂部墊(或次墊),由此實現高產量及極一致之產品以及實質上不存在之孔隙度。 Conventional CMP pad fabrication can include the formation of sliced solid polymer cakes or ingots, which need to be substantially uniform from top to bottom, which is difficult. In contrast, in the exemplary method of centrifugal casting using the technique of the present invention, the solid polymer produced is extremely flat It is only thicker than the final thickness of the mat to a minimum thickness. The resulting extreme tape can be used to cut or stamp a plurality of top pads (or secondary pads) by any suitable method, thereby achieving high throughput and very consistent products and substantially non-existent porosity.
利用本文中所揭示之例示性方法藉由依序鑄造及膠凝兩種或兩種以上不同聚合物混合物來形成兩個或兩個以上分離且相異之層。此實施例在封閉式鑄造系統中為不可行的。 Two or more separate and distinct layers are formed by sequential casting and gelling two or more different polymer mixtures using the exemplary methods disclosed herein. This embodiment is not feasible in a closed casting system.
可使用本發明技術藉由將纖維網狀物置放於部分反應之初始聚合物薄片上且隨後於該網狀物之頂部上形成額外層來形成增強墊。最佳化離心鑄造設置以及聚合物混合物配方允許形成各向異性聚合物薄片。當使用固體聚合物抛光墊時,此提供較一致之鏈結構定向的益處。此可使用墊調節器實現較一致之微紋理形成。此較規則之結構可輔助聚合物薄片之傳輸特性。 The reinforcing mat can be formed using the techniques of the present invention by placing a fibrous web on a partially reacted initial polymer sheet and subsequently forming additional layers on top of the web. Optimized centrifugal casting settings and polymer mixture formulations allow for the formation of anisotropic polymer sheets. This provides the benefit of a more consistent chain structure orientation when using a solid polymer polishing pad. This allows for a more consistent microtexture formation using a pad conditioner. This more regular structure aids in the transport properties of the polymer sheet.
本發明技術之例示性變化形式藉由使得滾筒內部稍微粗糙而利用黏著劑(壓敏性黏著劑或熱熔性黏著劑)與聚合物墊之間的經改良之黏著力。不良黏著力會導致在抛光期間墊分層。此將導致對抛光機之損害,經抛光之基板廢棄及抛光機之大量停工時間,此將影響效率。 An exemplary variation of the present technology utilizes improved adhesion between the adhesive (pressure sensitive adhesive or hot melt adhesive) and the polymeric mat by making the interior of the roll slightly rough. Poor adhesion can cause delamination of the pad during polishing. This will result in damage to the polisher, polished substrate disposal and extensive downtime of the polisher, which will affect efficiency.
圖1為說明包括離心鑄造機102及聚合物施配器104之旋轉鑄造系統100之示意圖。聚合物施配器104含有聚合物混合物106。聚合物施配器104包括混合裝置,且包括護套,具備或不具備具有用於經加熱之流體流過之導管之加熱元件,及/或電加熱元件。聚合物混合物106為將僅在離心力作用下相分離成多個層且在環境非加壓條件下將不發生相分離之聚合物混合物。聚合物混合物106可為其中添加有微球體以改變混合物之密度的一種聚胺基甲酸酯混合物。或者,聚合物混合物106含有一種以上聚合物,且包括藉由在聚合物混合物之間添加發泡體而在離心鑄造機102內產生之聚合物複合物。術語發泡體在抛光墊之背景下意謂聚胺基甲酸酯(亦稱作PU)墊,其具有閉孔或開孔結 構。泡孔可為由PU圍繞之微球體、由PU圍繞之空隙或穿過PU之開放空隙。多孔墊材料稱作發泡墊。不同於藉由添加微球體來製得發泡體產品之兩種方法為:1)將發泡劑添加至聚胺基甲酸酯混合物,及2)將氣體(例如,N2或CO2)引入至混合物中。 FIG. 1 is a schematic diagram illustrating a rotary casting system 100 including a centrifugal casting machine 102 and a polymer dispenser 104. Polymer dispenser 104 contains polymer mixture 106. The polymer dispenser 104 includes a mixing device and includes a jacket with or without a heating element having a conduit for the heated fluid to flow through, and/or an electrical heating element. Polymer mixture 106 is a polymer mixture that will phase separate into multiple layers under centrifugal force and will not phase separate under ambient non-pressurized conditions. Polymer mixture 106 can be a mixture of polyurethanes to which microspheres are added to change the density of the mixture. Alternatively, polymer mixture 106 contains more than one polymer and includes a polymer composite produced in centrifugal casting machine 102 by the addition of a foam between the polymer blends. The term foam in the context of a polishing pad means a polyurethane (also known as PU) pad having a closed cell or open cell structure. The cells may be microspheres surrounded by a PU, voids surrounded by a PU, or open voids passing through a PU. The porous pad material is referred to as a foam pad. Two different methods of making a foam product by adding microspheres are: 1) adding a blowing agent to the polyurethane mixture, and 2) introducing a gas (eg, N 2 or CO 2 ) Introduced into the mixture.
聚合物混合物106自聚合物施配器104流出至澆注路徑108中,該澆注路徑在滾筒110圍繞軸線112在旋轉方向114上旋轉時將聚合物混合物106導向至離心鑄造機102之滾筒110中。聚合物混合物106因離心力而展開以於滾筒110之內部表面上形成聚合物薄片116。在滾筒110之情形下,聚合物薄片116為圓筒形。滾筒110旋轉且其直徑使得滾筒110無論以何種旋轉速度轉動,聚合物混合物106在引入至滾筒110中之後所經受之離心力足以產生均一厚度之聚合物薄片116,且另外引起相分離。相分離在離心力下發生,且引起聚合物混合物106分離成至少兩個聚合物層,及/或純聚合物層以及灌注有微球體之聚合物層。 The polymer mixture 106 flows from the polymer dispenser 104 into a casting path 108 that directs the polymer mixture 106 into the drum 110 of the centrifugal casting machine 102 as the drum 110 rotates about the axis 112 in the direction of rotation 114. The polymer mixture 106 is unfolded by centrifugal force to form a polymer sheet 116 on the inner surface of the drum 110. In the case of the drum 110, the polymer sheet 116 is cylindrical. The drum 110 is rotated and its diameter is such that at any rotational speed of the drum 110, the centrifugal force experienced by the polymer mixture 106 after introduction into the drum 110 is sufficient to produce a uniform thickness of the polymer sheet 116, and additionally causes phase separation. Phase separation occurs under centrifugal force and causes the polymer mixture 106 to separate into at least two polymer layers, and/or a neat polymer layer and a polymer layer impregnated with microspheres.
在一些實施例中,加熱滾筒110。滾筒110可具有光滑的內部滾筒面,或替代地滾筒110具有經紋理化之滾筒面,該經紋理化之滾筒面改良抛光墊中所用之黏著劑的效能,為根據該方法製得之抛光墊的表面提供凹槽,及/或促進分離及/或自藉由該方法形成的經反應且經鑄造之聚合物薄片形成抛光墊。 In some embodiments, the drum 110 is heated. The drum 110 may have a smooth inner drum surface, or alternatively the drum 110 may have a textured roller surface that improves the effectiveness of the adhesive used in the polishing pad, which is a polishing pad made according to the method. The surface provides a groove and/or facilitates separation and/or formation of a polishing pad from the reacted and cast polymer sheet formed by the method.
圖2為說明離心鑄造機102在聚合物混合物106已發生相分離且已形成兩個相異層之後的示意圖。在滾筒110中經受離心力之後,聚合物混合物106相分離成兩個相異層:軟聚合物層200及緻密聚合物層202。在相分離期間,離心力促使聚合物朝向聚合物薄片116之一側,且引起微球體上升至聚合物薄片116之表面,此係因為其沒有聚合物緻密。此相分離產生較緻密層及多孔層。緻密聚合物層202為較緻密層,且形成抛光墊之硬墊。緻密聚合物層202為固體聚胺基甲酸酯 層。軟聚合物層200為填充有經緻密裝填之微球體的多孔層,且形成抛光墊之次墊。緻密聚合物層202為與滾筒110之內部介接之內層。 2 is a schematic diagram illustrating the centrifugal casting machine 102 after phase separation has occurred in the polymer mixture 106 and two distinct layers have been formed. After being subjected to centrifugal force in the drum 110, the polymer mixture 106 is phase separated into two distinct layers: a soft polymer layer 200 and a dense polymer layer 202. During phase separation, the centrifugal force forces the polymer toward one side of the polymer sheet 116 and causes the microspheres to rise to the surface of the polymer sheet 116 because it is not polymer dense. This phase separation produces a denser layer and a porous layer. The dense polymer layer 202 is a relatively dense layer and forms a hard pad for the polishing pad. The dense polymer layer 202 is a solid polyurethane Floor. The soft polymer layer 200 is a porous layer filled with densely packed microspheres and forms a secondary pad of a polishing pad. The dense polymer layer 202 is an inner layer that interfaces with the interior of the drum 110.
聚合物薄片116可在形成聚合物墊的輪廓之前或之後薄化以於聚合物薄片116之表面上形成凹槽圖案。類似地,調節聚合物薄片116之表面以於聚合物墊上形成刮痕圖案。 The polymer sheet 116 may be thinned to form a groove pattern on the surface of the polymer sheet 116 before or after forming the contour of the polymer mat. Similarly, the surface of the polymer sheet 116 is adjusted to form a scratch pattern on the polymer mat.
在一實施例中,在聚合物薄片116之緻密聚合物層202及軟聚合物層200已形成之後,於聚合物薄片116之頂部上鑄造相同或不同的聚合物或另一材料之第三層以便製備三層(或三層以上)聚合物墊。必要時如所描述藉由添加相同或不同之聚合物層形成後續層。 In one embodiment, after the dense polymer layer 202 and the soft polymer layer 200 of the polymer sheet 116 have been formed, the same or different polymer or third layer of another material is cast on top of the polymer sheet 116. In order to prepare three (or more than three) polymer mats. Subsequent layers are formed as necessary by adding the same or different polymer layers as described.
圖3為說明離心鑄造機102之截面且展示插件300及具有緻密聚合物層202及軟聚合物層200的聚合物薄片116之示意圖。滾筒110圍繞軸線112在旋轉方向114上旋轉。插件300內襯於滾筒110之內壁。在一實施例中,插件300為脫模劑,其為離心鑄造機102中之永久性塗層(例如,Teflon®)、半永久性塗層(例如,Teflon®噴霧)或暫時性塗層,其有助於固體聚合物在鑄造之後脫模。詳言之,在一些情況下,在鑄造一定次數(例如,鑄造20次)之後,在滾筒110之內部表面噴灑Teflon®塗層。或者,插件300為由高密度聚乙烯(HDPE)、熱塑性塑膠、聚四氟乙烯(PTFE)或聚矽氧製得之脫模薄片。在某些情況下,插件300替換不頻繁,(例如)每幾個月一次。 3 is a schematic diagram illustrating a cross section of a centrifugal casting machine 102 and showing an insert 300 and a polymer sheet 116 having a dense polymer layer 202 and a soft polymer layer 200. The drum 110 rotates about the axis 112 in the direction of rotation 114. The insert 300 is lined with the inner wall of the drum 110. In one embodiment, the insert 300 is a release agent that is a permanent coating (eg, Teflon®), a semi-permanent coating (eg, a Teflon® spray), or a temporary coating in the centrifugal casting machine 102. Helps the solid polymer to be demolded after casting. In detail, in some cases, a Teflon® coating is sprayed on the inner surface of the drum 110 after casting a certain number of times (for example, casting 20 times). Alternatively, the insert 300 is a release sheet made of high density polyethylene (HDPE), thermoplastic, polytetrafluoroethylene (PTFE) or polyfluorene. In some cases, plug-in 300 is replaced infrequently, for example, every few months.
在另一實施例中,插件300經開槽以於聚合物薄片116之表面上形成凹槽圖案,該等圖案形成於緻密聚合物層202上。在其他實施例中,出於形成不同類型之抛光墊之目的,插件300具有通道。 In another embodiment, the insert 300 is slotted to form a pattern of grooves on the surface of the polymer sheet 116 that are formed on the dense polymer layer 202. In other embodiments, the insert 300 has a channel for the purpose of forming different types of polishing pads.
圖4為說明聚合物墊400之截面的示意圖。在緻密聚合物層202及軟聚合物層200已形成之後,停止滾筒110,且自滾筒110移除含有兩個層之聚合物薄片116。移除聚合物薄片116包括沿著平行於軸線112之線切割聚合物薄片116,使得聚合物薄片116自圓筒形帶形變成矩 形。或者,可在離心鑄造機外部執行切割製程。自聚合物薄片116切割出或衝壓出聚合物墊400。經移除之聚合物墊400包括次墊402及硬墊404。硬墊404自緻密聚合物層202形成,而次墊402自軟聚合物層200形成。硬墊404及次墊402二者均可用於抛光。儘管固體側(硬墊404)習知用於抛光,但歸因於微球體之緻密裝填,可使用多孔側(次墊402,但對於此用途,其將不為次墊)且提供均一抛光。次墊402具有裝填極緊密之孔隙,從而允許較大壓縮性,且亦防止芯吸。在形成聚合物墊之輪廓之前或之後,薄化聚合物薄片116之表面以在兩個層上產生較均一之厚度及/或移除表面不完美性。另外,在形成輪廓及/或薄化之前或之後,可於此總成中之任一側上添加次墊。 4 is a schematic view illustrating a cross section of a polymer mat 400. After the dense polymer layer 202 and the soft polymer layer 200 have been formed, the drum 110 is stopped and the polymer sheet 116 containing the two layers is removed from the drum 110. Removing the polymer sheet 116 includes cutting the polymer sheet 116 along a line parallel to the axis 112 such that the polymer sheet 116 changes from a cylindrical ribbon to a moment shape. Alternatively, the cutting process can be performed outside of the centrifugal casting machine. The polymer mat 400 is cut or stamped from the polymer sheet 116. The removed polymer mat 400 includes a secondary mat 402 and a hard mat 404. The hard pad 404 is formed from the dense polymer layer 202 and the secondary pad 402 is formed from the soft polymer layer 200. Both the hard pad 404 and the secondary pad 402 can be used for polishing. While the solid side (hard pad 404) is conventionally used for polishing, due to the dense packing of the microspheres, the porous side (secondary pad 402, but for this use it will not be a secondary pad) can be used and uniform polishing provided. The secondary pad 402 has a very tightly packed aperture to allow for greater compressibility and also to prevent wicking. The surface of the polymer sheet 116 is thinned to create a more uniform thickness on both layers and/or to remove surface imperfections before or after forming the contour of the polymer mat. Additionally, a secondary pad can be added to either side of the assembly before or after contouring and/or thinning.
圖5為說明離心鑄造機102之截面且展示內部插件500及具有緻密聚合物層202及軟聚合物層200之聚合物薄片116的示意圖。內部插件500由HDPE、熱塑性塑膠、PTFE或聚矽氧製得之薄片,且具有類似於插件300之凹槽圖案。內部插件500抵靠著聚合物薄片116安置,且用手或藉由使用心軸置放於滾筒110內。使用心軸,將內部插件500纏繞在心軸周圍以便易於置放在滾筒110中。詳言之,將滾筒110減緩至較低之RPM,同時將以與滾筒110相同之RPM旋轉之帶有內部插件500的心軸沿著軸線112插入至滾筒110之中央。滾筒110之RPM增加回初始旋轉速度,由此產生足夠強之離心力,將內部插件500自心軸引向聚合物薄片116。 5 is a schematic diagram illustrating a cross section of a centrifugal casting machine 102 and showing an inner insert 500 and a polymer sheet 116 having a dense polymer layer 202 and a soft polymer layer 200. The inner insert 500 is a sheet made of HDPE, thermoplastic, PTFE or polyfluorene, and has a groove pattern similar to the insert 300. The inner insert 500 is placed against the polymer sheet 116 and placed within the drum 110 by hand or by use of a mandrel. Using the mandrel, the inner insert 500 is wrapped around the mandrel for easy placement in the drum 110. In particular, the drum 110 is slowed down to a lower RPM while the mandrel with the inner insert 500 rotated at the same RPM as the drum 110 is inserted along the axis 112 to the center of the drum 110. The RPM of the drum 110 is increased back to the initial rotational speed, thereby creating a sufficiently strong centrifugal force to direct the inner insert 500 from the mandrel to the polymer sheet 116.
圖6為說明具有內襯於離心鑄造機102之滾筒110的內壁之模具插件600之旋轉鑄造系統100的示意圖。模具插件600可為由Teflon®、HDPE、熱塑性塑膠、PTFE或聚矽氧製得之內襯於滾筒110之內壁的薄片。模具插件600具有至少一個抛光墊模具,其中模具之數目視滾筒110之尺寸及抛光墊之尺寸而定。模具插件600之模具可為單一模具或複數個模具,該或該等模具為固定的或可移除的,且距軸線112具 有固定或可變之距離以改變在鑄造製程期間聚合物所經受之離心力的量。模具插件600之該或該等模具形成CMP墊之輪廓,且具有如上文關於滾筒110、插件300及/或內部插件500所論述的經紋理化之表面。 在一些實施例中,模具插件600在內襯於滾筒110之薄片上具有4個模具,因此可能在一次鑄造中產生4個抛光墊。在此實施例中,聚合物混合物106個別地澆注於各模具中,由此無需自聚合物薄片切割或衝壓出抛光墊。經由此實施例方法,可減少廢料。 FIG. 6 is a schematic diagram illustrating a rotary casting system 100 having a mold insert 600 lined to the inner wall of the drum 110 of the centrifugal casting machine 102. The mold insert 600 may be a sheet lining the inner wall of the drum 110 made of Teflon®, HDPE, thermoplastic, PTFE or polyfluorene. The mold insert 600 has at least one polishing pad mold, wherein the number of molds depends on the size of the drum 110 and the size of the polishing pad. The mold of the mold insert 600 may be a single mold or a plurality of molds, the molds being fixed or removable, and having an axis 112 There is a fixed or variable distance to vary the amount of centrifugal force experienced by the polymer during the casting process. The mold or molds of the mold insert 600 form the contour of the CMP pad and have a textured surface as discussed above with respect to the drum 110, the insert 300, and/or the inner insert 500. In some embodiments, the mold insert 600 has four molds on the sheet lining the drum 110, so it is possible to produce four polishing pads in one casting. In this embodiment, the polymer mixture 106 is individually cast into each mold, thereby eliminating the need to cut or stamp the polishing pad from the polymer sheet. By this embodiment method, waste can be reduced.
圖7為說明滾筒110之截面且展示模具插件600及窗口700的示意圖。窗口700為實現光學端點技術之實施的透明材料(例如,胺基甲酸酯)。窗口700在聚合物混合物通入至個別模具中之前置放於模具插件600之模具中。聚合物混合物圍繞窗口700之各側。當自模具移除抛光墊時,窗口700可併入至抛光墊中作為窗口,或可與抛光墊分離以為待插入至抛光墊中之窗口留下空間。 FIG. 7 is a schematic diagram showing the cross section of the drum 110 and showing the mold insert 600 and the window 700. Window 700 is a transparent material (e.g., urethane) that implements optical endpoint technology. Window 700 is placed in a mold of mold insert 600 before the polymer mixture is passed into individual molds. The polymer mixture surrounds each side of the window 700. When the polishing pad is removed from the mold, the window 700 can be incorporated into the polishing pad as a window or can be separated from the polishing pad to leave room for the window to be inserted into the polishing pad.
圖8為說明包括鑄造模具802之多軸線旋轉鑄造系統800的示意圖。鑄造模具802包括兩個模具部分:頂部模具零件804及底部模具零件806。本文中使用頂部及底部僅出於參考之目的,且不限制例示性實施例。因此,頂部模具零件804可安置於底部區域中,且底部模具零件806可安置於頂部區域中。聚合物混合物808在分離時施配至頂部模具零件804與底部模具零件806中之一或兩者中,且接著頂部模具零件804與底部模具零件806如圖8中所示接合。鑄造模具802之內部空間810可包括氣隙,或替代地經聚合物混合物808完全填充。在鑄造之前將頂部模具零件804與底部模具零件806密封在一起以形成鑄造模具802。鑄造模具802圍繞軸線812在方向814上旋轉且圍繞軸線816在方向818上旋轉。軸線812經展示平分鑄造模具802,但替代地偏移。同樣,軸線816經展示與鑄造模具802偏移,但替代地平分鑄造模具802。一或兩個旋轉最初以較慢之速率進行以便促進鑄造模具802之內 部表面的覆蓋。在其他替代方案中,另外地或替代地使用在一或多個方向上之振動以促進模具表面之潤濕。一或兩個旋轉具有較高旋轉速度以便促進微球體朝向內表面移動及/或促進鑄造模具802之內部表面上的平坦度。鑄造模具形成圓筒形形狀或任何其他合適之形狀。可加熱鑄造模具802,且其具有光滑之內部滾筒面,或替代地具有經紋理化之滾筒面,該經紋理化之滾筒面改良用於抛光墊中之黏著劑的效能,為根據該方法製得之抛光墊的表面提供凹槽,及/或促進分離及/或自由該方法形成之經反應且經鑄造之聚合物薄片形成抛光墊。 FIG. 8 is a schematic diagram illustrating a multi-axis rotary casting system 800 including a casting mold 802. Casting mold 802 includes two mold portions: a top mold part 804 and a bottom mold part 806. The top and bottom are used herein for purposes of reference only and are not limiting of the exemplary embodiments. Thus, the top mold part 804 can be disposed in the bottom region and the bottom mold part 806 can be disposed in the top region. The polymer mixture 808 is dispensed into one or both of the top mold part 804 and the bottom mold part 806 upon separation, and then the top mold part 804 and the bottom mold part 806 are joined as shown in FIG. The interior space 810 of the casting mold 802 can include an air gap, or alternatively be completely filled with the polymer mixture 808. The top mold part 804 is sealed with the bottom mold part 806 prior to casting to form a casting mold 802. Casting mold 802 rotates in direction 814 about axis 812 and rotates in direction 818 about axis 816. The axis 812 is shown to bisect the casting mold 802, but is instead offset. Likewise, the axis 816 is shown offset from the casting mold 802, but instead bisects the casting mold 802. One or two rotations are initially performed at a slower rate to facilitate casting mold 802 Coverage of the surface. In other alternatives, vibrations in one or more directions are additionally or alternatively used to promote wetting of the mold surface. One or both rotations have a higher rotational speed to facilitate movement of the microspheres toward the inner surface and/or to promote flatness on the inner surface of the casting mold 802. The casting mold forms a cylindrical shape or any other suitable shape. The casting mold 802 can be heated and has a smooth inner roller surface, or alternatively a textured roller surface that improves the effectiveness of the adhesive used in the polishing pad, according to the method The surface of the resulting polishing pad provides grooves and/or promotes separation and/or free formation of the reaction and formed polymer sheets formed by the method to form a polishing pad.
圖9為展示根據本發明技術使用聚胺基甲酸酯之方法900的處理流程圖。然而,如本文中所論述,該方法亦適用於其他聚合物。如圖9中所示,方法900在操作902開始,該操作指示將微球體混合至聚胺基甲酸酯混合物中以形成雜合混合物。流程自操作902進行至操作904,該操作指示將雜合混合物施配至圓筒之內部空間中。流程自操作904進行至操作906,該操作指示使圓筒圍繞中心軸線旋轉,該圓筒在內部空間中圍封雜合混合物直至混合物相分離成兩個相異之層。流程自操作906進行至操作908,該操作指示在旋轉操作之至少一部分時間期間將圓筒加熱至140至212華氏度之間的溫度。流程自操作908進行至操作910,該操作指示自在雜合混合物已分離成兩個層且已反應之後形成的聚胺基甲酸酯薄片形成抛光墊。處理流程在操作910之後結束。 9 is a process flow diagram showing a method 900 of using a polyurethane in accordance with the teachings of the present invention. However, as discussed herein, the method is also applicable to other polymers. As shown in Figure 9, method 900 begins at operation 902, which indicates mixing microspheres into a polyurethane mixture to form a hybrid mixture. Flow proceeds from operation 902 to operation 904, which indicates that the hybrid mixture is dispensed into the interior space of the cylinder. Flow proceeds from operation 904 to operation 906, which instructs rotation of the cylinder about a central axis that encloses the hybrid mixture in the interior space until the mixture phase separates into two distinct layers. Flow proceeds from operation 906 to operation 908, which indicates that the barrel is heated to a temperature between 140 and 212 degrees Fahrenheit during at least a portion of the time of the rotating operation. Flow proceeds from operation 908 to operation 910 indicating the formation of a polishing pad from the polyurethane sheet formed after the hybrid mixture has been separated into two layers and reacted. The process flow ends after operation 910.
聚合物(例如聚胺基甲酸酯,亦稱作PU)鑄造系統涉及將一種以上聚合物混合在一起而形成聚合物複合物。為形成聚合物複合物,於中間添加發泡體以分離使用離心鑄造機形成之不同聚合物混合物。 Polymeric (e.g., polyurethane, also known as PU) casting systems involve mixing together more than one polymer to form a polymer composite. To form the polymer composite, a foam is added in the middle to separate the different polymer mixtures formed using a centrifugal casting machine.
圖10為展示根據本發明技術使用聚胺基甲酸酯形成多層抛光墊之替代方法1000的處理流程圖。然而,如本文中所論述,該方法亦適用於其他聚合物。如圖10中所示,方法1000可在操作1002開始,該操 作指示將複合物混合物施配至圓筒之內部空間中。流程自操作1002進行至操作1004,該操作指示使圓筒圍繞中心軸線旋轉,該圓筒在內部空間中圍封複合物混合物。流程自操作1004進行至操作1006,該操作指示在旋轉操作之至少一部分時間期間將圓筒加熱至140至212華氏度之間的溫度。流程自操作1006進行至操作1008,該操作指示在複合物混合物已膠凝之後將較硬之聚胺基甲酸酯混合物施配至圓筒之內部空間中。流程自操作1008進行至操作1010,該操作指示旋轉且加熱圓筒直至較硬之聚胺基甲酸酯及複合物混合物已反應形成具有兩個層之聚胺基甲酸酯薄片。隨著複合物混合物凝固成凝膠(亦稱作反應),在施配較硬之聚胺基甲酸酯之前,較硬之聚胺基甲酸酯層將與較軟之聚胺基甲酸酯層化學鍵結而無需壓敏性黏著劑(PSA)來結合兩個層。流程自操作1010進行至操作1012,該操作指示自含有兩個層之聚胺基甲酸酯薄片形成抛光墊。處理流程在操作1012之後結束。 Figure 10 is a process flow diagram showing an alternative method 1000 of forming a multilayer polishing pad using polyurethane in accordance with the teachings of the present invention. However, as discussed herein, the method is also applicable to other polymers. As shown in FIG. 10, method 1000 can begin at operation 1002, the operation An indication is made to dispense the composite mixture into the interior space of the cylinder. Flow proceeds from operation 1002 to operation 1004, which indicates that the cylinder is rotated about a central axis that encloses the composite mixture in the interior space. Flow proceeds from operation 1004 to operation 1006, which indicates that the cylinder is heated to a temperature between 140 and 212 degrees Fahrenheit during at least a portion of the time of the spinning operation. Flow proceeds from operation 1006 to operation 1008, which indicates that the harder polyurethane mixture is dispensed into the interior space of the cylinder after the composite mixture has gelled. Flow proceeds from operation 1008 to operation 1010, which indicates rotation and heating of the barrel until the harder polyurethane and composite mixture has reacted to form a polyurethane sheet having two layers. As the composite mixture solidifies into a gel (also known as a reaction), the harder polyurethane layer will be softer with the polyurethane prior to dispensing the harder polyurethane. The ester layer is chemically bonded without the need for a pressure sensitive adhesive (PSA) to bond the two layers. Flow proceeds from operation 1010 to operation 1012, which indicates the formation of a polishing pad from a polyurethane sheet containing two layers. The process flow ends after operation 1012.
在另一實施例中,較硬之聚胺基甲酸酯混合物在複合物混合物施配至圓筒中之前施配至圓筒中且膠凝。 In another embodiment, the harder polyurethane mixture is dispensed into the cylinder and gelled prior to application of the composite mixture to the cylinder.
在其他實施例中,在將複合物混合物澆注至圓筒中之前,於較軟之聚胺基甲酸酯層的表面上安置或形成薄層。薄層由聚酯、紡織物或導電材料製得。或者,聚酯、耐綸、紡織物或導電材料之薄層為編織的或非編織的,且可處於任一側上或可囊封聚胺基甲酸酯薄片。在其他實施例中,導電材料在形成抛光墊之前亦塗佈(例如,液體,噴灑或霧化)聚胺基甲酸酯薄片。在此替代方法中,在單次或多次鑄造中形成多層聚合物墊。 In other embodiments, a thin layer is placed or formed on the surface of the softer polyurethane layer prior to casting the composite mixture into the cylinder. The thin layer is made of polyester, textile or conductive material. Alternatively, the thin layer of polyester, nylon, woven or electrically conductive material is woven or non-woven and may be on either side or may encapsulate the polyurethane sheet. In other embodiments, the electrically conductive material also coats (eg, liquid, sprays, or atomizes) the polyurethane sheet prior to forming the polishing pad. In this alternative method, a multilayer polymer mat is formed in single or multiple castings.
以上描述為例示性且非限制性的。在審閱本發明後,本發明之許多變化對於熟習此項技術者將變得顯而易見。因此,本發明之範疇不應參考以上描述確定,而應參考所附申請專利範圍以及其等效物之全範疇確定。 The above description is illustrative and not limiting. Many variations of the invention will become apparent to those skilled in the art after reviewing this invention. Therefore, the scope of the invention should not be determined by reference to the above description, but the scope of the appended claims and the equivalents thereof.
100‧‧‧旋轉鑄造系統 100‧‧‧Rotary casting system
102‧‧‧離心鑄造機 102‧‧‧Centrifugal casting machine
104‧‧‧聚合物施配器 104‧‧‧Polymer dispenser
106‧‧‧聚合物混合物 106‧‧‧ polymer mixture
108‧‧‧澆注路徑 108‧‧‧ pouring path
110‧‧‧滾筒 110‧‧‧Roller
112‧‧‧軸線 112‧‧‧ axis
114‧‧‧旋轉方向 114‧‧‧Rotation direction
116‧‧‧聚合物薄片 116‧‧‧Polymer sheets
Claims (28)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/297,177 US10722997B2 (en) | 2012-04-02 | 2014-06-05 | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
US14/297,177 | 2014-06-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201607643A true TW201607643A (en) | 2016-03-01 |
TWI665033B TWI665033B (en) | 2019-07-11 |
Family
ID=54767168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104117524A TWI665033B (en) | 2014-06-05 | 2015-05-29 | Method and system for making a multilayer chemical mechanical planarization pad using centrifugal casting |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR102376599B1 (en) |
SG (1) | SG11201610107TA (en) |
TW (1) | TWI665033B (en) |
WO (1) | WO2015187338A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
US11090778B2 (en) | 2012-04-02 | 2021-08-17 | Thomas West, Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI717183B (en) * | 2020-01-03 | 2021-01-21 | 銓科光電材料股份有限公司 | Wafer polishing pad |
DE102022126743A1 (en) * | 2022-10-13 | 2024-04-18 | Ernst-Abbe-Hochschule Jena Körperschaft des öffentlichen Rechts | Tool for material removal and method for its manufacture |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7374644B2 (en) * | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
JP3377780B2 (en) * | 2000-09-05 | 2003-02-17 | ヤマウチ株式会社 | Method for producing elastic cylinder, method for producing elastic roll, elastic cylinder and elastic roll |
US8602851B2 (en) * | 2003-06-09 | 2013-12-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled penetration subpad |
WO2003103959A1 (en) * | 2002-06-07 | 2003-12-18 | Praxair S.T. Technology, Inc. | Controlled penetration subpad |
US6752690B1 (en) * | 2002-06-12 | 2004-06-22 | Clinton O. Fruitman | Method of making polishing pad for planarization of semiconductor wafers |
TWI264043B (en) * | 2002-10-01 | 2006-10-11 | Tokyo Electron Ltd | Method and system for analyzing data from a plasma process |
US8864859B2 (en) * | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
AU2004225931A1 (en) * | 2003-03-25 | 2004-10-14 | Neopad Technologies Corporation | Chip customized polish pads for chemical mechanical planarization (CMP) |
US6986705B2 (en) * | 2004-04-05 | 2006-01-17 | Rimpad Tech Ltd. | Polishing pad and method of making same |
US7452265B2 (en) | 2006-12-21 | 2008-11-18 | 3M Innovative Properties Company | Abrasive article and methods of making same |
US20080274674A1 (en) * | 2007-05-03 | 2008-11-06 | Cabot Microelectronics Corporation | Stacked polishing pad for high temperature applications |
KR101021783B1 (en) * | 2009-02-25 | 2011-03-17 | 엠.씨.케이 (주) | Polishing pad manufacturing device and manufacturing process using it |
TWI396602B (en) * | 2009-12-31 | 2013-05-21 | Iv Technologies Co Ltd | Method of manufacturing polishing pad having detection window and polishing pad having detection window |
US11090778B2 (en) * | 2012-04-02 | 2021-08-17 | Thomas West, Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
-
2015
- 2015-05-14 KR KR1020167037075A patent/KR102376599B1/en active IP Right Grant
- 2015-05-14 SG SG11201610107TA patent/SG11201610107TA/en unknown
- 2015-05-14 WO PCT/US2015/030903 patent/WO2015187338A1/en active Application Filing
- 2015-05-29 TW TW104117524A patent/TWI665033B/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
US11090778B2 (en) | 2012-04-02 | 2021-08-17 | Thomas West, Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
US11219982B2 (en) | 2012-04-02 | 2022-01-11 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
Also Published As
Publication number | Publication date |
---|---|
WO2015187338A1 (en) | 2015-12-10 |
SG11201610107TA (en) | 2017-01-27 |
TWI665033B (en) | 2019-07-11 |
KR102376599B1 (en) | 2022-03-21 |
WO2015187338A9 (en) | 2016-11-17 |
KR20170018359A (en) | 2017-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI665033B (en) | Method and system for making a multilayer chemical mechanical planarization pad using centrifugal casting | |
US4539017A (en) | Elastic grinding element and method for producing it | |
CN103153540B (en) | There is the polishing pad of multi-modal pore-size distribution | |
KR101300849B1 (en) | Method of making a structured abrasive article | |
KR101825734B1 (en) | Polishing pad with foundation layer and polishing surface layer | |
JP2003516872A (en) | Method for producing polymer or polymer composite polishing pad | |
TWI749315B (en) | Porous polishing pad and process for producing the same | |
TWI671161B (en) | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods | |
CN105408063A (en) | Low density polishing pad | |
US20070122511A1 (en) | Formed mechanical planarization pads made with supercritical fluid | |
KR20170068534A (en) | Chemical mechanical polishing pad with internal channels | |
TW201538274A (en) | Polishing pad with homogeneous body having discrete protrusions thereon | |
CN102950550B (en) | The method of preparative chemistry machine glazed finish layer | |
US10722997B2 (en) | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads | |
JP2010274362A (en) | Method for manufacturing polyurethane foam and method for manufacturing polishing pad | |
TWI647066B (en) | Method and system for controlling light transmittance of polishing pad (polishing pad) material | |
US11219982B2 (en) | Method and systems to control optical transmissivity of a polish pad material | |
JP7231704B2 (en) | Polishing pad, method for manufacturing polishing pad, and method for manufacturing semiconductor device using the same | |
JP7196146B2 (en) | Polishing pad, method for manufacturing same, and method for manufacturing semiconductor device using same | |
TWI825534B (en) | Chemical-mechanical polishing subpad having porogens with polymeric shells | |
TWI556960B (en) | Production Method of EVA Chemical Mechanical Grinding Pad | |
CN110815038A (en) | Polishing pad and preparation method and application thereof | |
JP2017185565A (en) | Method for manufacturing abrasive pad | |
JP2010201905A (en) | Method for manufacturing stringy reactive resin foam molding and apparatus for manufacturing the same |