TWI664320B - Method for recovering Au from iodine-based etching waste liquid and remaking etching solution - Google Patents

Method for recovering Au from iodine-based etching waste liquid and remaking etching solution Download PDF

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TWI664320B
TWI664320B TW107103638A TW107103638A TWI664320B TW I664320 B TWI664320 B TW I664320B TW 107103638 A TW107103638 A TW 107103638A TW 107103638 A TW107103638 A TW 107103638A TW I664320 B TWI664320 B TW I664320B
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etching solution
iodine
cathode
electrolysis
etching
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TW201837237A (en
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佐藤賢吾
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日商松田產業股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/46Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/30Acidic compositions for etching other metallic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00Electrolytic production of inorganic compounds or non-metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B15/00Operating or servicing cells
    • C25B15/08Supplying or removing reactants or electrolytes; Regeneration of electrolytes
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/20Electrolytic production, recovery or refining of metals by electrolysis of solutions of noble metals

Abstract

本發明係一種自含有Au之使用過的碘類蝕刻溶液電解回收Au並且重製該蝕刻溶液之方法,其特徵在於:將陰極之電位設定為-0.75V~-0.95V(參考電極:Ag/AgCl),將陽極之電流密度相對於陰極之電流密度的比設定為3~50(惟,不包括3)。本發明之課題在於提供一種在不進行嚴密之pH值控制下穩定且有效率地對使用過之碘類蝕刻液加以處理之方法(回收Au並且重製該碘類蝕刻溶液之方法)。 The present invention is a method for electrolytically recovering Au from a used iodine-based etching solution containing Au and remaking the etching solution, characterized in that the potential of the cathode is set to -0.75V ~ -0.95V (reference electrode: Ag / AgCl), the ratio of the current density of the anode to the current density of the cathode is set to 3 to 50 (but excluding 3). An object of the present invention is to provide a method for treating used iodine-based etching solution stably and efficiently without performing strict pH control (a method for recovering Au and remaking the iodine-based etching solution).

Description

自碘類蝕刻廢液回收Au與重製蝕刻溶液之方法    Method for recovering Au from iodine-based etching waste liquid and remaking etching solution   

本發明係關於對各種半導體零件中之Au薄膜進行微細加工時所排出之使用過的碘類蝕刻溶液之處理,且關於可穩定且有效率地進行自該碘類蝕刻廢液回收Au與蝕刻溶液之重製的方法。 The present invention relates to the treatment of used iodine-based etching solutions discharged during the microfabrication of Au films in various semiconductor parts, and to the stable and efficient recovery of Au and etching solutions from this iodine-based etching waste liquid. Method of reproduction.

各種半導體零件之配線係使用Au等導電性高之材料。Au配線係於使用PVD法等進行成膜後,藉由利用濕式蝕刻之微細加工而形成,此時使用過之蝕刻液中包含昂貴之Au。此時之蝕刻溶液多使用碘類蝕刻液,業界使用利用各種還原劑之化學還原、利用金屬粉之置換析出、電解提煉法等而自該碘類之蝕刻溶液回收Au。 Wiring of various semiconductor parts uses highly conductive materials such as Au. The Au wiring is formed by forming a film using a PVD method or the like, and then is formed by microfabrication using wet etching. At this time, the used etching solution contains expensive Au. At this time, an iodine-based etching solution is often used as an etching solution. The industry uses chemical reduction using various reducing agents, replacement precipitation using metal powder, electrolytic refining, and the like to recover Au from the iodine-based etching solution.

另一方面,回收Au後之碘類蝕刻溶液中,具有蝕刻能力之三碘化物離子(I3 -)被還原成碘化物離子(I-),結果蝕刻能力降低,回收Au後之碘類蝕刻溶液變得難以再利用。 On the other hand, the iodine-based etching solution after recovery of Au, having a capacity of triiodide ion etching (I 3 -) is reduced to iodide ion (I -), result of the etching capability is reduced, the recovery of the iodine-based etching Au The solution becomes difficult to reuse.

針對該情況,專利文獻1中進行如下處理:藉由使用有隔膜之電解對使用過之蝕刻液加以處理,藉此回收Au,並且將經還原之碘化物離子(I-)氧化成三碘化物離子(I3 -),從而使其蝕刻能力恢復(蝕刻溶液之重製)。 For this situation, Patent Document 1 performs a process: By using a diaphragm of an electrolytic be addressed through the use of an etching solution, whereby the recovery of Au, and by iodide ion (I -) of reducing oxidized to triiodide ion (I 3 -), the ability to recover so that it is etched (etching solution of reproduction).

然而,專利文獻1之方法存在如下問題:電流密度會隨著處理時間經過而變化,於陰極側,因伴隨電流密度上升之水的電解,導致pH值變高,蝕刻能力降低,另一方面,於陽極側,亦因伴隨電流密度上升之水的電解分解,導致pH值變低,蝕刻能力變得過剩。進而,於陽極側,碘(I2)析出至該 電極上,溶液中之碘化物離子(I-)之濃度降低,而變得難以進行穩定且有效率之蝕刻液的重製。 However, the method of Patent Document 1 has the following problems: the current density changes with the passage of processing time, and on the cathode side, the pH value increases due to the electrolysis of water accompanied by the increase in current density, and the etching ability decreases. On the anode side, the pH is lowered due to the electrolytic decomposition of water accompanied by an increase in current density, and the etching ability becomes excessive. Further, precipitated on the anode side, iodine (I 2) to the upper electrode, an iodide ion (I -) of reducing the concentration of the solution, and it becomes difficult to conduct stably and efficiently manufactured by weight of the etching solution.

先前技術文獻 Prior art literature

專利文獻 Patent literature

專利文獻1:日本專利特開平3-202484號公報 Patent Document 1: Japanese Patent Laid-Open No. 3-202484

專利文獻2:日本專利第5669995號 Patent Document 2: Japanese Patent No. 5669995

於進行自含有Au之使用過的蝕刻溶液回收Au及蝕刻液之重製的情形時,如上所述因電解條件變化而難以穩定且有效率地進行電解。相對於此,引用文獻2中進行如下技術:藉由將電解中之陰極電位與陽極電位維持為一定範圍,而提高Au之回收率並且使蝕刻液之能力恢復。但是,於採用該方法之情形時,為了將處理前後之溶液的pH值嚴密地抑制為±0.5以內,變得需要繁雜之控管,另外,陰極電位低至-0.7V以上,因而存在處理時間增加之問題。 In the case of recovering Au and etching solution from a used etching solution containing Au, it is difficult to perform electrolysis stably and efficiently due to changes in electrolytic conditions as described above. On the other hand, the following technique is cited in Reference 2 to maintain the cathode potential and anode potential in the electrolysis to a certain range, thereby improving the recovery rate of Au and restoring the ability of the etchant. However, in the case of this method, in order to strictly control the pH value of the solution before and after the treatment to within ± 0.5, complicated control tubes are required. In addition, the cathode potential is as low as -0.7V or more, so there is a processing time. Increased problems.

本發明之課題在於解決該等問題,其係關於自含有Au之使用過的碘類蝕刻液回收Au並且重製該碘類蝕刻溶液之方法,尤其提供一種在不進行嚴密之pH值控制下穩定且有效率地將使用過之碘類蝕刻液加以重製之方法。 The problem of the present invention is to solve these problems, and it relates to a method for recovering Au from a used iodine-based etching solution containing Au and remaking the iodine-based etching solution, and particularly to provide a method which is stable without strict pH control. A method for efficiently reusing used iodine-based etching solution.

為了解決上述課題,本發明人經過潛心研究後,結果獲得了如下見解:藉由將陰極之電流密度與陽極之電流密度作適當調整,而可即便不進行嚴密之pH值調整,亦能夠抑制水之電解及碘之析出,藉此能夠進行Au之回收並且穩定且效率良好地重製蝕刻液。本發明人基於該見解而提供下述之發 明。 In order to solve the above-mentioned problems, the inventors have made intensive studies and obtained the following insights: By appropriately adjusting the current density of the cathode and the current density of the anode, water can be suppressed even without strict pH adjustment. The electrolytic solution and the precipitation of iodine can recover the Au, and the etching solution can be reproduced stably and efficiently. The present inventors have provided the following invention based on this knowledge.

1)一種自含有Au之使用過的碘類蝕刻溶液電解回收Au並且重製該蝕刻溶液之方法,其特徵在於:將陰極之電位設定為-0.75V~-0.95V(參考電極:Ag/AgCl),將陽極之電流密度相對於陰極之電流密度的比設定為3~50(惟,不包括3)。 1) A method for electrolytically recovering Au from a used iodine-based etching solution containing Au and remaking the etching solution, characterized in that the potential of the cathode is set to -0.75V to -0.95V (reference electrode: Ag / AgCl ), The ratio of the current density of the anode to the current density of the cathode is set to 3 to 50 (but excluding 3).

根據本發明,具有下述優異效果:於自含有Au之使用過的碘類蝕刻溶液電解回收Au並且重製使用過之蝕刻溶液之方法中,藉由將陰極與陽極之電流密度作適當調整,而能夠抑制水之電解及碘之析出,藉此,可進行Au之回收並且穩定且有效率地重製蝕刻液。 According to the present invention, it has the following excellent effects: In a method of electrolytically recovering Au from a used iodine-based etching solution containing Au and reusing the used etching solution, by appropriately adjusting the current density of the cathode and the anode, On the other hand, it is possible to suppress the electrolysis of water and the precipitation of iodine, thereby enabling the recovery of Au and the stable and efficient reproduction of the etching solution.

圖1係含有Au之使用過的蝕刻溶液的反應製程概略圖。 FIG. 1 is a schematic view of a reaction process of a used etching solution containing Au.

圖2係含有Au之使用過的蝕刻溶液的處理流程概略圖。 FIG. 2 is a schematic diagram of a processing flow of a used etching solution containing Au.

圖3係於電解後之陽極析出有碘的照片(比較例1)。 Fig. 3 is a photograph of iodine deposited on the anode after electrolysis (Comparative Example 1).

將本發明之含有Au之使用過的蝕刻溶液的處理(反應製程)概略圖示於圖1。如圖1所示,電解槽被隔膜(陽離子交換膜)分離成陽極室與陰極室,對陰極室供給含有Au之碘類蝕刻溶液(含有Au之使用過的蝕刻溶液),對陽極室則供給(移動)回收Au後之碘經還原(自I3 -還原為I-)的蝕刻溶液。然後,於陰極室內進行Au之回收,於陽極室內則進行蝕刻溶液之重製。 A schematic diagram of the treatment (reaction process) of the used etching solution containing Au of the present invention is shown in FIG. 1. As shown in FIG. 1, the electrolytic cell is separated into an anode chamber and a cathode chamber by a diaphragm (cation exchange membrane). The cathode chamber is supplied with an iodine-based etching solution containing Au (a used etching solution containing Au), and the anode chamber is supplied with after the (mobile) recovering iodine Au was reduced (from I 3 - reduced to I -) in the etching solution. Then, Au is recovered in the cathode chamber, and the etching solution is reconstituted in the anode chamber.

將含有Au之使用過的蝕刻溶液之處理流程概略圖示於圖2。如 圖2所示,供給至陰極室之含有Au之使用過的蝕刻溶液因電解處理而於陰極析出Au,並將其回收。另一方面,將碘經還原(自I3 -還原為I-)之回收Au後之使用過的蝕刻溶液供給(移動)至陽極室,對其進行電解處理而氧化成具有蝕刻能力之三碘化物離子(I3 -),藉此製成能夠再利用作為蝕刻溶液者。 A schematic diagram of a processing flow of a used etching solution containing Au is shown in FIG. 2. As shown in FIG. 2, the used etching solution containing Au supplied to the cathode chamber was deposited on the cathode by electrolytic treatment and recovered. On the other hand, by the reduction of iodine (from I 3 - reduced to I -) etching solution is supplied (moved) after the recovery of Au used to the anode chamber, subjected to electrolytic oxidation treatment to have a capability of etching triiodo of ions (I 3 -), whereby the user can be re-formed as the etching solution.

然而,於上述電解處理中,若電流密度增大,則會發生水之電解,於陰極側,pH值上升,而存在重製蝕刻溶液之蝕刻能力降低的問題。另外,於陽極室內,發生了下述問題:pH值降低,重製蝕刻溶液之蝕刻能力變得過剩。進而,於陽極室內還發生了下述問題:隨著pH值降低,於電極上會析出碘,重製蝕刻溶液中之碘化物離子的濃度減少。 However, in the above-mentioned electrolytic treatment, if the current density is increased, electrolysis of water occurs, and on the cathode side, the pH value rises, and there is a problem that the etching ability of the reprocessed etching solution is reduced. In addition, in the anode chamber, the following problems occurred: the pH value decreased, and the etching ability of the reprocessed etching solution became excessive. Furthermore, the following problems occurred in the anode chamber: as the pH value decreased, iodine was precipitated on the electrode, and the concentration of iodide ions in the reprocessed etching solution decreased.

因此,本發明人獲得如下見解:以陰極之電位來控制陰極側之電流密度,以與陰極之電流密度比來控制陽極側之電流密度,藉此可於不必如先前般嚴密地管理pH值下有效地抑制上述副反應(水之電解及碘之析出)。基於此種知識見解,本發明之特徵在於:將陰極之電位設定為-0.75V~-0.95V(參考電極:Ag/AgCl),將陽極之電流密度相對於陰極之電流密度的比設定為3~50(惟,不包括3)。 Therefore, the present inventors have obtained the insight that the current density on the cathode side is controlled by the potential of the cathode, and the current density on the anode side is controlled by the ratio of the current density to the cathode, thereby making it possible not to manage the pH value as closely as before The above-mentioned side reactions (electrolysis of water and precipitation of iodine) are effectively suppressed. Based on this knowledge, the present invention is characterized in that the potential of the cathode is set to -0.75V ~ -0.95V (reference electrode: Ag / AgCl), and the ratio of the current density of the anode to the current density of the cathode is set to 3 ~ 50 (except 3).

於本發明中,較佳將陰極之電位設為-0.95V以上且-0.75V以下(參考電極:Ag/AgCl)。其原因在於,若陰極之電位超過-0.75V,則電解之處理時間會變長,生產效率降低,另一方面,若未達-0.95V,則於陰極側明顯可見水之電解。此外,控制陰極電位有如下方法:隨時測量參考電極與陰極之電位差,將其藉由反饋控制而反映至整流器之輸出電壓。 In the present invention, the potential of the cathode is preferably set to be -0.95V or more and -0.75V or less (reference electrode: Ag / AgCl). The reason is that if the potential of the cathode exceeds -0.75V, the treatment time for electrolysis will be longer and the production efficiency will decrease. On the other hand, if it is less than -0.95V, the electrolysis of water will be apparent on the cathode side. In addition, there are methods to control the cathode potential: measure the potential difference between the reference electrode and the cathode at any time, and reflect it to the output voltage of the rectifier through feedback control.

另外,陽極之電流密度相對於陰極之電流密度的比較佳設為3~50(惟,不包括3)之範圍內。若超出該範圍,則會因電流密度增大而發生水之電解,產生伴隨pH值降低之重製蝕刻溶液的蝕刻能力過剩之問題,進而產生碘析出於陽極上之問題。此外,電流密度比之調整可如後述藉由各電極之面積 比(浸漬於電解液之面積之比)進行調整。 In addition, it is preferable that the current density of the anode relative to the current density of the cathode is within a range of 3 to 50 (except 3). If it exceeds this range, electrolysis of water will occur due to an increase in current density, causing a problem of excessive etching capacity of the re-etching solution accompanied by a decrease in pH, and a problem of iodine precipitation on the anode. The adjustment of the current density ratio can be adjusted by the area ratio of each electrode (the ratio of the area immersed in the electrolytic solution) as described later.

另外,即將進行電解處理前之陰極室與陽極室的pH值較佳調整為4~6。若即將進行電解處理前之pH值在4~6之範圍以外,則蝕刻液之重製能力會降低或者變得過剩。藉由將電解直前之pH值設定為上述範圍內,可回收Au並且穩定且效率良好地進行蝕刻液之重製。此外,為了抑制pH值之變化,可對陰極室添加硫酸等酸溶液,對陽極室添加苛性鈉等鹼溶液,來調整pH值。 In addition, the pH of the cathode chamber and the anode chamber immediately before the electrolytic treatment is preferably adjusted to 4-6. If the pH value immediately before the electrolytic treatment is outside the range of 4 to 6, the reprocessing ability of the etchant will be reduced or become excessive. By setting the pH value before the electrolysis to the above range, Au can be recovered and the etching solution can be reconstituted stably and efficiently. In addition, in order to suppress the change in pH, an acid solution such as sulfuric acid may be added to the cathode chamber, and an alkali solution such as caustic soda may be added to the anode chamber to adjust the pH.

實施例 Examples

其次,對本發明之實施例及比較例進行說明。此外,以下之實施例僅是揭示代表性例子,本發明不必受限於該等實施例,應以說明書所記載之技術思想的範圍加以解釋。 Next, examples and comparative examples of the present invention will be described. In addition, the following examples are merely representative examples, and the present invention is not limited to these examples, and should be interpreted within the scope of the technical ideas described in the specification.

(實施例1) (Example 1)

於陰極室與陽極室被陽離子交換膜分離之電解槽中,對上述陰極室供給含有Au之蝕刻溶液500mL。 In an electrolytic cell in which the cathode chamber and the anode chamber were separated by a cation exchange membrane, 500 mL of an etching solution containing Au was supplied to the cathode chamber.

該含有Au之蝕刻溶液係由以下之成分構成。KI(0.25mol/L)+I2(0.14mol/L)+Au(0.03mol/L) The Au-containing etching solution is composed of the following components. KI (0.25mol / L) + I 2 (0.14mol / L) + Au (0.03mol / L)

另一方面,對上述陽極室供給回收Au後(碘還原後)之溶液500mL。 On the other hand, 500 mL of a solution (after iodine reduction) after the recovery of Au was supplied to the anode chamber.

該回收Au後(碘還原後)之溶液係由以下之成分構成。 The solution after recovering Au (after iodine reduction) is composed of the following components.

KI(0.25mol/L) KI (0.25mol / L)

將Ti使用於陰極(相對電極),將Ti上塗佈有IrO2者使用於陽極(工作電極),使參考電極為Ag/AgCl。此時,將Ti電極之浸漬面積設為20cm2,將IrO2電極之浸漬面積設為62cm2,將陰極與陽極之面積比(電流密度比)設為3.1。並且,將陰極電位設為-0.75V,將溶液保持於20℃進行電解處理。然後,於電流值成為5mA以下之時刻結束電解。 Ti was used for the cathode (counter electrode), and those coated with IrO 2 on Ti were used for the anode (working electrode), and the reference electrode was Ag / AgCl. In this case, the Ti electrodes immersed area to 20cm 2, the immersed area of the IrO 2 electrode is set to 62cm 2, the cathode and the anode area ratio (ratio of current density) is set to 3.1. Then, the cathode potential was set to -0.75 V, and the solution was maintained at 20 ° C for electrolytic treatment. Then, the electrolysis was terminated when the current value became 5 mA or less.

藉由以上之電解處理,陰極室內之Au的回收率為95.9%。另 外,調查電解前後之pH值的變化,結果於陽極室內,電解前pH值為5.16,電解後為4.95,於陰極室內,電解前pH值為5.61,電解後為4.88,成功抑制了水之電解。調查重製後之蝕刻液的蝕刻性能,結果相對於液量為2.10L之蝕刻液,Au溶解12.22g(Au濃度為5.82g/L),確認能夠再利用作為Au蝕刻液。 With the above electrolytic treatment, the recovery rate of Au in the cathode chamber was 95.9%. In addition, investigating the change in pH before and after electrolysis, it was found that the pH in the anode room was 5.16 before electrolysis, 4.95 after electrolysis, and the pH in the cathode room was 5.61 before electrolysis, and 4.88 after electrolysis, which successfully suppressed the electrolysis of water. . As a result of investigating the etching performance of the etching solution after re-formation, 12.22 g of Au was dissolved with respect to the etching solution having a liquid amount of 2.10 L (Au concentration was 5.82 g / L), and it was confirmed that it could be reused as an Au etching solution.

(實施例2) (Example 2)

將Ti電極之浸漬面積設為2cm2,將IrO2電極之浸漬面積設為100cm2,將陰極與陽極之面積比(電流密度比)設為50,除此以外,其餘皆以與實施例1相同之條件進行電解處理。 The immersion area of the Ti electrode was set to 2 cm 2 , the immersion area of the IrO 2 electrode was set to 100 cm 2 , and the area ratio (current density ratio) of the cathode to the anode was set to 50. The rest were the same as in Example 1. Electrolytic treatment was performed under the same conditions.

藉由以上之電解處理,陰極室內之Au的回收率為96.3%。另外,調查電解前後之pH值的變化,結果於陽極室內,電解前pH值為5.01,電解後為4.98,於陰極室內,電解前pH值為5.11,電解後為5.13,成功抑制了水之電解。調查重製後之蝕刻液的蝕刻性能,結果相對於液量為2.15L之蝕刻液,Au溶解12.31g(Au濃度為5.73g/L),確認能夠再利用作為Au蝕刻液。 With the above electrolytic treatment, the recovery rate of Au in the cathode chamber was 96.3%. In addition, the pH changes before and after the electrolysis were investigated. As a result, the pH in the anode room was 5.01 before electrolysis, 4.98 after electrolysis, and the pH in the cathode room was 5.11 before electrolysis, and 5.13 after electrolysis. The electrolysis of water was successfully suppressed. . As a result of investigating the etching performance of the re-etched etching solution, Au was dissolved in 12.31 g (Au concentration was 5.73 g / L) with respect to the etching solution having a liquid volume of 2.15 L, and it was confirmed that the etching solution could be reused as the Au etching solution.

(實施例3) (Example 3)

將陰極電位設為-0.95V,除此以外,其餘皆以與實施例1相同之條件進行電解處理。 Except that the cathode potential was set to -0.95V, the rest were subjected to electrolytic treatment under the same conditions as in Example 1.

藉由以上之電解處理,陰極室內之Au的回收率為96.1%。另外,調查電解前後之pH值的變化,結果於陽極室內,電解前pH值為4.99,電解後為4.31,於陰極室內,電解前pH值為4.99,電解後為5.88,成功抑制了水之電解。調查重製後之蝕刻液的蝕刻性能,結果相對於液量為2.08L之蝕刻液,Au溶解11.99g(Au濃度為5.76g/L),確認能夠再利用作為Au蝕刻液。 With the above electrolytic treatment, the recovery rate of Au in the cathode chamber was 96.1%. In addition, investigating the change in pH before and after electrolysis, it was found that the pH in the anode room was 4.99 before electrolysis, 4.31 after electrolysis, and the pH in the cathode room was 4.99 before electrolysis, and 5.88 after electrolysis. The electrolysis of water was successfully suppressed. . As a result of investigating the etching performance of the re-etched etching solution, 11.99 g of Au was dissolved in the etching solution having a liquid volume of 2.08 L (Au concentration was 5.76 g / L), and it was confirmed that the etching solution could be reused as the Au etching solution.

(比較例1) (Comparative example 1)

將Ti電極之浸漬面積設為40cm2,將IrO2電極之浸漬面積設為80cm2,將陽極之浸液面積相對於陰極之浸液面積的面積比設為2,除此以外,其餘皆以與 實施例1相同之方法進行電解處理。 The immersion area of the Ti electrode was set to 40 cm 2 , the immersion area of the IrO 2 electrode was set to 80 cm 2 , and the area ratio of the immersion area of the anode to the immersion area of the cathode was set to 2; An electrolytic treatment was performed in the same manner as in Example 1.

調查電解前後之pH值的變化,結果於陽極室內,電解前pH值為4.55,電解後為1.71,於陰極室內,電解前pH值為5.14,電解後為1.69,pH值因水之電解而上升。另外,氫離子亦移動至陰極室,同樣地pH值上升。進而,如圖3所示,於電解後之陽極析出了碘。 Investigated the change of pH value before and after electrolysis. As a result, the pH value in the anode room was 4.55 before electrolysis and 1.71 after electrolysis. In the cathode room, the pH value was 5.14 before electrolysis and 1.69 after electrolysis. The pH value increased due to the electrolysis of water. . In addition, hydrogen ions also move to the cathode chamber, and similarly, the pH value rises. Furthermore, as shown in FIG. 3, iodine was deposited on the anode after electrolysis.

[產業上之可利用性] [Industrial availability]

本發明之從由隔膜電解處理法產生之含有Au之使用過的碘類蝕刻溶液回收Au之方法及重製該蝕刻溶液之方法,具有下述優異之效果:可穩定且效率良好地進行,並且可大幅度縮短電解時間,可提高生產效率。本發明之方法於電子機器、電子零件、基板及半導體等之材料的再循環領域有用。 The method for recovering Au from the used iodine-based etching solution containing Au produced by the diaphragm electrolytic treatment method and the method for remaking the etching solution have the following excellent effects: they can be performed stably and efficiently, and Can greatly reduce the electrolysis time and improve production efficiency. The method of the present invention is useful in the field of recycling materials such as electronic equipment, electronic parts, substrates, and semiconductors.

Claims (1)

一種自含有Au之使用過的碘類蝕刻溶液電解回收Au並且重製該蝕刻溶液之方法,其特徵在於:將陰極之電位設定為-0.75V~-0.95V(參考電極:Ag/AgCl),將陽極之電流密度相對於陰極之電流密度的比設定為3~50(惟,不包括3)。A method for electrolytically recovering Au from a used iodine-based etching solution containing Au and remaking the etching solution, characterized in that the potential of the cathode is set to -0.75V to -0.95V (reference electrode: Ag / AgCl), The ratio of the current density of the anode to the current density of the cathode is set to 3 to 50 (but excluding 3).
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