JPS60177192A - Method for separating and recovering gold and silver from waste stripping liquid of gold plating containing co-existing gold and silver - Google Patents
Method for separating and recovering gold and silver from waste stripping liquid of gold plating containing co-existing gold and silverInfo
- Publication number
- JPS60177192A JPS60177192A JP3390884A JP3390884A JPS60177192A JP S60177192 A JPS60177192 A JP S60177192A JP 3390884 A JP3390884 A JP 3390884A JP 3390884 A JP3390884 A JP 3390884A JP S60177192 A JPS60177192 A JP S60177192A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- silver
- potential
- separating
- electrodeposit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は金および銀が共存する金めつき剥離廃液に伝導
度塩と還元剤とを添加し、3極式の電位規制による電解
で金および銀を分離回収する方法に関するものである。[Detailed Description of the Invention] The present invention is a method of adding a conductivity salt and a reducing agent to a gold plating stripping waste solution in which gold and silver coexist, and separating and recovering gold and silver by electrolysis using three-electrode potential regulation. It is related to.
金と銀とが共存する溶液から、それぞれ金および銀を純
度よく分離することは一般に困難とされている。しかし
ながら半導体装置用部品から金を回収しようとする場合
、金めつきの剥離廃液にかなりの高濃度で金および銀が
共存する場合がある。It is generally considered difficult to separate gold and silver with high purity from a solution in which gold and silver coexist. However, when attempting to recover gold from semiconductor device parts, gold and silver may coexist at a fairly high concentration in gold plating stripping waste liquid.
これは、半導体装置用のセラミックパッケージにおいて
は、本体と端子リードとを銀ろう付を行って接続してい
るものが多く、また最終工程でパンケージの緒特性を満
足させるため、素子付部、端子リード等に金めつきを施
していることに起因している。すなわち、金めつきを施
した後に、不良品となったセラミックパッケージはその
まま廃棄せずに、上記の素子付部、端子リード等からで
きる限り金を回収するべく、アルカリ外音でフリーのシ
アン、酸化剤からなる剥離液にセラミ・ツクパッケージ
を’&d4して金を剥離するのであるが、同時に剥離廃
液中に上記の銀ろう中の銀が混入してきてしまうもので
ある。In ceramic packages for semiconductor devices, the main body and terminal leads are often connected by silver brazing, and in order to satisfy the properties of the pan cage in the final process, the element attachment part and the terminal This is due to the fact that the lead etc. are plated with gold. In other words, in order to recover as much gold as possible from the element attachment parts, terminal leads, etc., without discarding defective ceramic packages after gold plating, we use alkaline sound-free cyanide, The gold is removed by applying a ceramic package to a stripping solution containing an oxidizing agent, but at the same time, the silver in the silver solder is mixed into the stripping waste solution.
従来、このような金と銀とが共存する冷液中から、金お
よび銀を分離回収する方法としては、化学処理および電
解処理が知られている。前者としては種々の薬品を添加
して化学的に分離するものであるが、工程数が約30工
程もあり、薬品代、工数等の経費がかかり、安価かつ迅
速に分離を行えないという難点がある。また後者の電解
処理では、通常の電流規制で電析を行うと、金および銀
が共析して王水等の薬品に対して溶解が困難となるため
、有効な分離が行えないという難点がある。Conventionally, chemical treatment and electrolytic treatment are known as methods for separating and recovering gold and silver from such a cold liquid in which gold and silver coexist. The former involves chemical separation by adding various chemicals, but it involves approximately 30 steps and has the disadvantage of being expensive in terms of chemicals, man-hours, etc., and it is not possible to perform the separation cheaply and quickly. be. In addition, the latter electrolytic treatment has the disadvantage that if electrodeposition is carried out under normal current regulation, gold and silver eutectoid and become difficult to dissolve in chemicals such as aqua regia, making effective separation impossible. be.
本発明は上記の難点に鑑みてなされたもので、その目的
とするところは、工数も少なくかつ短時間に純度よく金
および612を分離しうる、金および銀が共存する金め
つき剥I11を廃液からの金および銀の分離回収方法を
提供するにあり、その特徴は、アルカリ性でフリーのシ
アンおよび酸化剤を含有する、金および銀が共存する金
めつき剥離廃液に、伝導度塩と還元剤とを添加し、まず
陰極の電位を主として銀が析出する電位範囲に規制して
電析せしめ、次いで陰極の電位を主として金が析出する
電位範囲に規制して電析を行うところにある。The present invention has been made in view of the above-mentioned difficulties, and its purpose is to provide gold plating stripping I11 in which gold and silver coexist, which can separate gold and 612 with high purity in a short time and with less man-hours. The purpose of the present invention is to provide a method for separating and recovering gold and silver from waste liquid, and its characteristics are that the gold plating stripping waste liquid, which is alkaline and contains free cyanide and oxidizing agents, and in which gold and silver coexist, is combined with conductivity salt and reduction. First, the potential of the cathode is controlled to a potential range in which silver is precipitated, and then electrodeposition is carried out by regulating the potential of the cathode to a potential range in which mainly gold is deposited.
以下本発明の好適な実施例を詳細に説明する。Preferred embodiments of the present invention will be described in detail below.
金めつきの剥離は通常の剥離液、すなわちアルカリ外音
でフリーのシアンおよび酸化剤を含む剥離液で行う。こ
の剥離液使用後の廃液に、電解処理を可能とするため伝
導度塩と還元剤を添加する。Stripping of gold plating is carried out with a conventional stripping solution, i.e. an alkaline-sound-free stripping solution containing cyanide and an oxidizing agent. A conductivity salt and a reducing agent are added to the waste liquid after using the stripping solution to enable electrolytic treatment.
伝導度塩としては水酸化ナトリウムが、還元剤としては
ポルマリン溶液が好適に用いうる。還元剤は、剥離廃液
中に残存して金の電析を妨害する酸化剤を還元するもの
である。本発明方法においては、まず低電位範囲で銀の
電析を行い、次いで高電位範囲で金の電析を行う。すな
わち銀と金との析出電位の相違を利用する。第1図は、
金3.3g/ffi、銀1.9g/ff、銅1.3g/
j!、ニッケル4.1g/j!を含む金めつき剥離廃液
に伝導度塩として水酸化ナトリウム75g/f、還元剤
として37%ポルマリン溶液35mff/βを添加し、
浴温60℃で電解した場合の電流−電圧曲線を示す。こ
の図より、−0,5Vから主として銀が析出しはじめ、
−〇、9Vから主として金が析出しはじめ、−1,25
Vからは水の分解がはじまることがわかる。しかして−
0,5V付近、例えば−〇、6■の低電圧で電析を行う
ことによって銀の比率の高い(約65%)電析物を得る
ことができる。この電析物は銀の比率が高いので、硝酸
によって銀のみを溶解し、金と分離J゛ることが容易に
行える。次いで−0,9v付近の高電位で電析を行うこ
とによって今度は金の比率の高い(約85%)電析物を
得ることができる。この電析物は金の比率が高いので王
水での溶解が容易となる。上記の陰極電位の設定には参
照電極を用いて管理する。As the conductivity salt, sodium hydroxide can be suitably used, and as the reducing agent, a polymarine solution can be suitably used. The reducing agent reduces the oxidizing agent remaining in the stripping waste solution and interfering with gold electrodeposition. In the method of the present invention, silver is first deposited in a low potential range, and then gold is deposited in a high potential range. In other words, the difference in deposition potential between silver and gold is utilized. Figure 1 shows
Gold 3.3g/ffi, Silver 1.9g/ff, Copper 1.3g/ffi
j! , nickel 4.1g/j! Add 75 g/f of sodium hydroxide as a conductivity salt and 35 mff/β of a 37% Polmarine solution as a reducing agent to the gold plating stripping waste solution containing
The current-voltage curve when electrolyzed at a bath temperature of 60°C is shown. From this figure, silver mainly begins to precipitate from -0.5V,
-〇, from 9V, gold mainly begins to precipitate, -1,25
It can be seen that water decomposition begins from V. However-
By performing electrodeposition at a low voltage of around 0.5V, for example -0.6V, it is possible to obtain a deposit with a high proportion of silver (approximately 65%). Since this deposit has a high proportion of silver, it is easy to dissolve only the silver with nitric acid and separate it from the gold. Next, by carrying out electrodeposition at a high potential around -0.9V, it is possible to obtain an electrodeposit with a high proportion of gold (approximately 85%). Since this deposit has a high gold ratio, it is easily dissolved in aqua regia. The setting of the cathode potential described above is managed using a reference electrode.
以下に実施例を示す。Examples are shown below.
金3.31!/β、銀1.9 g/’ j! 、 !P
I 1.3 g/ p、、ニッケル4.1 g/βを含
む剥離廃液に水酸化ナトリウム75 g/ 1.37%
ポルマリン溶液を35nl/Aの濃度となるようにそれ
ぞれ添加した被処理溶液300m j!をアクリル容器
に入れ、陽極にpt板、陰極にSUS板を用い、陰極の
近傍に参照電極をセットして、陰極電位を一〇、6■に
設定して浴温60℃で定電位電解を行った。電解時間は
浴中の銀量に相当するクーロン数により定められる。陰
極電位を一、0.6Vに設定した際の電流が5On+A
であったのでクーロン数より2.6時間の電解時間にな
るが、若干の電流量が減少することを考慮:こ入れ、3
時間電解を行った。その結果被処理溶液中の銀量の74
%が回収され、金については21%が回収された。Fri 3.31! /β, silver 1.9 g/' j! , ! P
Sodium hydroxide 75 g/1.37% in stripping waste solution containing I 1.3 g/p, nickel 4.1 g/β
300m j! of each treated solution to which Polmarin solution was added at a concentration of 35nl/A! was placed in an acrylic container, a PT plate was used as the anode, a SUS plate was used as the cathode, a reference electrode was set near the cathode, the cathode potential was set to 10, 6■, and constant potential electrolysis was performed at a bath temperature of 60°C. went. The electrolysis time is determined by the number of coulombs corresponding to the amount of silver in the bath. When the cathode potential is set to 1.0.6V, the current is 5On+A
Therefore, the electrolysis time will be 2.6 hours based on the coulomb number, but considering that the amount of current will decrease slightly:
Time electrolysis was performed. As a result, the amount of silver in the solution to be treated was 74
% was recovered and 21% of gold was recovered.
次いで陰極電位を−0,9■に設定して浴温60℃で定
電位電解を行った結果、被処理溶液中の残りの金および
銀はほぼ100%近い回収率で回収された。Next, constant potential electrolysis was carried out at a bath temperature of 60 DEG C. with the cathode potential set at -0.9 .ANG.. As a result, the remaining gold and silver in the solution to be treated were recovered at a recovery rate of nearly 100%.
このようにして陰極電位を一〇、6■に設定して回収し
た箔状の電析物の金及び銀の比率は金が33%、銀が6
5%であった。この箔を硝M (1: 1)で加熱熔解
し、銀を硝酸銀溶液として分δ11することにより金の
みが残り、金および銀を分離回収することができた。ま
た陰極電位を−0,9■に設定して回収した電析物の金
・銀・銅の比率は、金が85.7%、銀が1.9%、銅
が8.7%であった。この箔は通當の王水で熔解し脱硝
操作を行って希釈し銀を塩化銀として分離回収後還元剤
として亜硫酸水を添加して金のみを回収することができ
た。The ratio of gold and silver in the foil-shaped electrodeposit recovered by setting the cathode potential to 10.6■ is 33% gold and 6% silver.
It was 5%. This foil was heated and melted with nitric acid M (1:1), and the silver was dissolved in a silver nitrate solution for δ11 minutes, so that only gold remained, and gold and silver could be separated and recovered. In addition, the ratio of gold, silver, and copper in the deposits recovered by setting the cathode potential to -0.9■ was 85.7% for gold, 1.9% for silver, and 8.7% for copper. Ta. This foil was melted in regular aqua regia, denitrated, diluted, silver was separated and recovered as silver chloride, and sulfite water was added as a reducing agent to recover only the gold.
以上のように本発明によるときは、処理が簡便となり、
迅速に、かつ純度よく金と銀の分離が行え、またコスト
の低減化が図れるという著効を奏する。As described above, according to the present invention, processing is simplified,
It is effective in that gold and silver can be separated quickly and with high purity, and costs can be reduced.
以上本発明につき好適な実施例を挙げて種々説明したが
、本発明はこの実施例に限定されるものではなく、発明
の精神を逸脱しない範囲内で多くの改変を施し得るのは
もちろんのことである。Although the present invention has been variously explained above with reference to preferred embodiments, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. It is.
第1図は金と銀が共存する金めつき剥離廃液の電流−電
圧曲線を示す。FIG. 1 shows a current-voltage curve of a gold plating stripping waste solution in which gold and silver coexist.
Claims (1)
る、金および銀が共存する金めつき剥離廃液に、伝導度
塩と還元剤とを添加し、まず陰極の電位を主として銀が
析出する電位範囲に規制して電析せしめ、次いで陰極の
電位を主として金が析出する電位範囲に規制して電析を
行うことを特徴とする金および銀が共存する金めつき剥
離廃液からの金および銀の分離回収方法。 2、伝導度塩として水酸化ナトリウムを用いた特許請求
の範囲第1項記載の金および銀が共存する金めっき剥M
廃液からの金および銀の分離回収方法。 3、還元剤としてホルマリン溶液を用いた特許請求の範
囲第1項または第2項記載の金および銀が共存する金め
つき剥離廃液からの金および銀の分離回収方法。[Claims] 1. A conductivity salt and a reducing agent are added to a gold plating stripping waste solution that is alkaline and contains free cyanide and an oxidizing agent, and in which gold and silver coexist. A gold plating stripping waste liquid in which gold and silver coexist, characterized in that electrodeposition is carried out by regulating the potential range in which silver is deposited, and then electrodeposition is carried out by regulating the potential of the cathode in a potential range in which gold is mainly deposited. A method for separating and recovering gold and silver from 2. Stripped gold plating M in which gold and silver coexist according to claim 1, using sodium hydroxide as a conductivity salt
A method for separating and recovering gold and silver from waste liquid. 3. A method for separating and recovering gold and silver from a gold plating stripping waste solution in which gold and silver coexist according to claim 1 or 2, using a formalin solution as a reducing agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3390884A JPS60177192A (en) | 1984-02-23 | 1984-02-23 | Method for separating and recovering gold and silver from waste stripping liquid of gold plating containing co-existing gold and silver |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3390884A JPS60177192A (en) | 1984-02-23 | 1984-02-23 | Method for separating and recovering gold and silver from waste stripping liquid of gold plating containing co-existing gold and silver |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60177192A true JPS60177192A (en) | 1985-09-11 |
Family
ID=12399607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3390884A Pending JPS60177192A (en) | 1984-02-23 | 1984-02-23 | Method for separating and recovering gold and silver from waste stripping liquid of gold plating containing co-existing gold and silver |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60177192A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6167254B1 (en) * | 2017-02-15 | 2017-07-19 | 松田産業株式会社 | Method of recovering Au from iodine-based etching waste liquid and regenerating the etching solution |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4934419A (en) * | 1972-07-31 | 1974-03-29 |
-
1984
- 1984-02-23 JP JP3390884A patent/JPS60177192A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4934419A (en) * | 1972-07-31 | 1974-03-29 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6167254B1 (en) * | 2017-02-15 | 2017-07-19 | 松田産業株式会社 | Method of recovering Au from iodine-based etching waste liquid and regenerating the etching solution |
WO2018150811A1 (en) * | 2017-02-15 | 2018-08-23 | 松田産業株式会社 | Method for recovering au from iodine etching waste liquid and regenerating etching solution |
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